Die bonding method for adapting die fixing device to substrate angle

Abstract

A die bonding method is provided that allows the die fixing device to adapt to the angle of the substrate. The die bonding method includes the steps of: placing a die fixing device in a chamber of a movable mounting device; abutting the side of the top of the die fixing device on the bottom of the movable mounting device; and adsorbing the die to the bottom of the die fixing device by negative pressure passing through an opening in the bottom of the movable mounting device, and providing positive pressure from the movable mounting device to the top of the die fixing device; moving the movable mounting device above the substrate and aligning the die with the die mounting area; moving the movable mounting device downward to bring the die into contact with the die mounting area, and applying a reaction force provided by the substrate to the die fixing device through the die; In a positive pressure environment, the reaction force causes the die fixture to float into the chamber and the opening, adapting to the angle of the substrate until the die is fully attached to the die mounting area.

Description

[Technical Field]

[0001] The present invention relates to a die bonding method, and more particularly to a die bonding method that adapts a die fixing device to the angle of a substrate. [Background technology]

[0002] Integrated circuits are fabricated on semiconductor wafers through multiple processes in batch production, and the wafers are then cut into multiple dies. In other words, a die is a small, unencapsulated integrated circuit body made of semiconductor material. The cut dies are then neatly attached to a carrier device, and a die fixing device transfers the dies sequentially onto a substrate for subsequent processing.

[0003] However, in conventional die bonding methods, the die fixing device is moved using a connecting rod, and the quality of die bonding is easily affected by the trajectory accuracy (rigidity) of the connecting rod. In addition, when the die fixing device applies pressure, a lateral component force is generated and applied to the die, which can result in deviations in the angle and position at which the die is fixed to the die mounting area of ​​the substrate.

[0004] Furthermore, since some substrates are inclined relative to the die, and the angle of the die fixing device is limited by the moving mount device, the die fixing device cannot apply a uniform force to the die and the die mounting area. Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION The main object of the present invention is to provide a die bonding method in which the angle and position at which the die is fixed to the die mounting area are highly accurate, and the die fixing device can adapt to the angle of the substrate.

[0006] Another object of the present invention is to provide a die bonding method in which the die fixture adapts to the angle of the substrate, providing a more uniform force to the die and die mounting area. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, the present invention provides a method for manufacturing a substrate, the method comprising the steps of: (a) using a first image capture unit to capture an image of at least one first positioning tag in a die mounting area of ​​a substrate; (b) installing a die fixing device in a chamber of a mobile mounting device, the side of the top of the die fixing device abutting the bottom of the mobile mounting device, the height of the chamber being greater than the thickness of the top of the die fixing device, the width of the chamber being greater than the width of the top of the die fixing device, the bottom of the die fixing device adsorbing the die by negative pressure through an opening in the bottom of the mobile mounting device, the hole diameter of the opening being greater than the width of the bottom of the mobile mounting device, and the mobile mounting device providing positive pressure to the top of the die fixing device; (c) using a second image capture unit to capture an image of at least one second positioning tag of the die; (d) using a control unit to move the movable mounting device above the substrate and align the die with the die mounting area based on an image of at least one first positioning tag on the die mounting area and an image of at least one second positioning tag on the die; (e) moving the movable mounting device downward to bring the die into contact with the die mounting area, such that an angle between the die and the substrate is greater than or equal to 0 degrees and less than 90 degrees, and a reaction force provided by the substrate is applied to the die fixing device through the die; and (f) in the positive pressure environment, the reaction force causes the die fixing device to float within the chamber and the opening, and the die is adapted to the angle of the substrate until it is completely attached to the die mounting area.

[0008] In step (b), the through-hole of the moving mounting device communicates with the chamber and the external space.

[0009] The through-holes may be provided on the top of the moving stage device, or on the top and side of the moving stage device.

[0010] In step (b), the negative pressure is provided by an exhaust pipe of the moving mount device that passes through the top of the moving mount device and the top and bottom of the die fixing device.

[0011] In step (b), a through hole at the top of the moving mounting device communicates with the chamber and the external space, the exhaust pipe passes through the through hole, and the hole diameter of the through hole is larger than the outer diameter of the exhaust pipe.

[0012] In step (b), the positive pressure is provided by connecting a plurality of intake pipes of the moving mount device through the top of the moving mount device to the chamber and aligning them with the top of the die fixing device.

[0013] In addition, step (b) generates the positive pressure by supplying gas to the chamber through the plurality of intake pipes using a gas supply device.

[0014] In step (b), the plurality of intake pipes are installed around the top of the moving mounting device.

[0015] In step (b), the film is fixed to the moving mounting device and brought into contact with the top surface of the top part of the die fixing device.

[0016] In step (b), an exhaust pipe of the moving mount device passes through the top of the moving mount device, the film, and the top and bottom of the die fixing device, and the negative pressure is provided from the exhaust pipe. [Effects of the Invention]

[0017] The advantages of the present invention are that the movable mounting device can apply positive pressure to the die fixing device, and the chamber and opening provide sufficient space for the die fixing device. In the positive pressure environment, the reaction force provided by the substrate allows the die fixing device to float within the chamber and opening, and to rotate or stick flat to adapt to the angle of the substrate, so that the angle and position at which the die is fixed on the die mounting area are very precise and no deviation occurs.

[0018] Furthermore, even if the substrate is tilted relative to the crystal grains (i.e., the angle is greater than 0 degrees and less than 90 degrees), the angle of the die fixing device is not limited by the moving mounting device, so the die fixing device can apply force more evenly to the die and the die mounting area. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a flowchart of a method according to the present invention. [Figure 2] FIG. 2 is a schematic diagram of step S10 of the first embodiment of the method according to the present invention. [Figure 3] FIG. 2 is a schematic diagram of steps S20 and S30 of a first embodiment of the method according to the present invention. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. [Figure 5] 2 is a schematic diagram showing the connection relationship between the moving mounting device, the vacuum device, and the gas supply device of the present invention. FIG. [Figure 6] 2 is a schematic diagram of the connection relationship between the first image capture unit, the second image capture unit and the control unit of the present invention; FIG. [Figure 7] FIG. 2 is a schematic diagram of step S40 of a first embodiment of the method according to the present invention. [Figure 8] FIG. 2 is a schematic diagram of step S40 of a first embodiment of the method according to the present invention. [Figure 9] 2 is a schematic diagram of steps S50 and S60 of a first embodiment of the method according to the present invention. [Figure 10] 2 is a schematic diagram of steps S50 and S60 of a first embodiment of the method according to the present invention. [Figure 11] FIG. 2 is a schematic diagram of step S10 of a second embodiment of the method according to the present invention. [Figure 12] 5 is a schematic diagram of steps S20 and S30 of a second embodiment of the method according to the present invention. [Figure 13] FIG. 4 is a schematic diagram of step S40 of a second embodiment of the method according to the present invention. [Figure 14] FIG. 4 is a schematic diagram of step S40 of a second embodiment of the method according to the present invention. [Figure 15] 5 is a schematic diagram of steps S50 and S60 of a second embodiment of the method according to the present invention. [Figure 16] 5 is a schematic diagram of steps S50 and S60 of a second embodiment of the method according to the present invention. [Figure 17] 5 is a schematic diagram of steps S20 and S30 of a third embodiment of the method according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the embodiments of the present invention will be described in more detail with reference to the drawings and reference numerals, so that those skilled in the art can practice the present invention after reading the specification.

[0021] FIG. 1 is a flowchart of the method according to the present invention. FIG. 2 is a schematic diagram of step S10 of a first embodiment of the method according to the present invention. FIG. 3 is a schematic diagram of steps S20 and S30 of a first embodiment of the method according to the present invention. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 5 is a schematic diagram of the connection between the moving and mounting device 40, the vacuum device, and the gas supply device according to the present invention. FIG. 6 is a schematic diagram of the connection between the first image capturing unit 10, the second image capturing unit 60, and the control unit 70 according to the present invention.

[0022] 7 and 8 are schematic diagrams of step S40 of a first embodiment of the method according to the present invention. Figures 9 and 10 are schematic diagrams of steps S50 and S60 of a first embodiment of the method according to the present invention. The present invention provides a die bonding method in which a die fixing device is adapted to the angle of a substrate, and includes the following steps:

[0023] Step S10: As shown in FIG. 1 and FIG. 2, the first image capturing unit 10 captures images of the two first positioning tags 211 on the die-mounting area 21 of the substrate 20.

[0024] Step S20: As shown in Figures 1, 3, 4 and 5, the die fixing device 30 is placed in the chamber 43 of the movable mounting device 40, the side of the top 31 of the die fixing device 30 abuts against the bottom 42 of the movable mounting device 40, the height of the chamber 43 is greater than the thickness of the top 31 of the die fixing device 30, the width of the chamber 43 is greater than the width of the top 31 of the die fixing device 30, the bottom 32 of the die fixing device 30 passes through the opening 421 of the bottom 42 of the movable mounting device 40 and adsorbs the die 50 by negative pressure 441, the hole diameter of the opening 421 is greater than the width of the bottom 42 of the movable mounting device 40, and the movable mounting device 40 provides positive pressure 451 to be applied to the top surface of the top 31 of the die fixing device 30.

[0025] Step S30: As shown in FIG. 1 and FIG. 3, the second image capturing unit 60 captures images of the two second positioning tags 51 of the die 50.

[0026] Step S40: As shown in Figures 1, 6, 7 and 8, the control unit 70 moves the moving mounting device 40 above the substrate 20 based on the images of the plurality of first positioning tags 211 in the die mounting area 21 and the images of the plurality of second positioning tags 51 on the die 50, and aligns the die 50 with the die mounting area 21.

[0027] Step S50: As shown in Figures 1 and 9, the movable mounting device 40 is moved downward, and one side of the die 50 contacts one side of the die mounting area 21, so that there is an angle θ between the die 50 and the substrate 20 that is greater than 0 degrees and less than 90 degrees, and the reaction force F provided by the substrate 20 is applied to the die fixing device 30 through the die 50.

[0028] Step S60: As shown in Figures 1, 9 and 10, in the environment of positive pressure 451, the reaction force F causes the die fixing device 30 to float and rotate within the chamber 43 and opening 421, adapting to the angle of the substrate 20 until the die is completely attached to the die mounting area.

[0029] Therein, in step S40, the angle θ is equal to 0 degrees, in step S50, the bottom surface of the die 50 contacts the surface of the die placement area 21, and in step S60, in an environment of positive pressure 451, the reaction force F causes the die fixing device 30 to float and stick flat in the chamber 43 and opening 421 to adapt to the angle of the substrate.

[0030] Therefore, in the present invention, the movable mounting device 40 can apply positive pressure 451 to the die clamping device 30, and the chamber 43 and opening 421 provide sufficient space for the die clamping device 30. In the positive pressure 451 environment, the reaction force F provided by the substrate 20 can cause the die clamping device 30 to float within the chamber 43 and opening 421, rotate or stick flat to adapt to the angle of the substrate 20, so that the angle and position of the die 50 fixed on the die mounting area 21 are very precise and no deviation occurs.

[0031] Furthermore, even if the substrate 20 is tilted relative to the die 50 (i.e., the angle θ is greater than 0 degrees and less than 90 degrees), the moving mounting device 40 does not limit the angle of the die fixing device 30, so the die fixing device 30 can apply force more evenly to the die 50 and the die mounting area 21.

[0032] In addition, during the process of moving the movable mounting device 40, the present invention applies a positive pressure 451 from the movable mounting device 40 to the top 31 of the die fixing device 30, thereby preventing the die fixing device 30 from shaking; furthermore, the present invention uses a negative pressure 441 to adsorb the die 50, thereby preventing the die 50 from separating from the die fixing device 30.

[0033] In the first embodiment, in step S20, as shown in FIGS. 3 and 4, the through-hole 411 in the top 41 of the mobile mounting device 40 communicates with the chamber 43 and the outside space. Specifically, the chamber 43 is not sealed. Furthermore, the positive pressure 451 in the mobile mounting device 40 is generated by gas constantly entering the chamber 43. If the chamber 43 were sealed, the chamber 43 would be at risk of exploding due to excessive pressure. If the chamber 43 were not sealed, the gas in the chamber 43 could escape to the outside space through the through-hole 411, maintaining a constant pressure in the chamber 43 without causing an explosion due to excessive pressure.

[0034] In the first embodiment, in step S20, as shown in Figures 3 and 4, a negative pressure 441 is provided by an exhaust pipe 44 of the moving mounting device 40, which penetrates the top 41 of the moving mounting device 40 and the top 31 and bottom 32 of the die fixing device 30. Specifically, as shown in Figure 5, a vacuum device 80 bleeds air through the exhaust pipe 44 to generate a vacuum, thereby providing the negative pressure 441. As shown in Figure 10, the exhaust pipe 44 is a deformable hose. However, the exhaust pipe 44 may also be a non-deformable rigid pipe.

[0035] 3 and 4, in step S20, the exhaust pipe 44 passes through the through hole 411, and the diameter of the through hole 411 is larger than the outer diameter of the exhaust pipe 44. This reduces the cost of drilling another hole in the moving mounting device 40 to pass the exhaust pipe 44. Furthermore, the exhaust pipe 44 does not affect the gas in the chamber 43 from flowing out to the outside space through the through hole 411.

[0036] In the first embodiment, in step S20, as shown in FIGS. 3 and 4, the plurality of intake pipes 45 of the movable mounting device 40 penetrate the top 41 of the movable mounting device 40 to communicate with the chamber 43 and align with the top of the die fixing device 30, thereby providing a positive pressure 451. Specifically, as shown in FIG. 5, a gas supply device 90 supplies gas to the chamber 43 through the plurality of intake pipes 45 to generate a positive pressure 451. The plurality of intake pipes 45 are deformable hoses. However, the plurality of intake pipes 45 may also be non-deformable rigid pipes. This allows the positive pressure 451 provided by the plurality of intake pipes 45 to be applied evenly to the top 31 of the die fixing device 30, thereby more evenly applying force to the die 50 and the die mounting area 21.

[0037] Preferably, in step S20, the plurality of intake pipes 45 are installed around the top 41 of the movable mounting device 40, as shown in Figures 3 and 4. This allows the positive pressure 451 provided by the plurality of intake pipes 45 to be applied more evenly to the top 31 of the die fixing device 30, and to apply a more even force to the die 50 and the die mounting area 21.

[0038] Figure 11 is a schematic diagram of step S10 of the second embodiment of the method according to the present invention. Figure 12 is a schematic diagram of steps S20 and S30 of the second embodiment of the method according to the present invention. Figures 13 and 14 are schematic diagrams of step S40 of the second embodiment of the method according to the present invention. Figures 15 and 16 are schematic diagrams of steps S50 and S60 of the second embodiment of the method according to the present invention.

[0039] 11 to 16, the second embodiment differs from the first embodiment in that in step S20, film 100 is fixed to movable mounting device 40 and contacts the top surface of top portion 31 of die fixing device 30, and exhaust pipe 44 passes through film 100. Compared to the first embodiment, because film 100 contacts the top surface of top portion 31 of die fixing device 30, positive pressure 451 can be applied more evenly by film 100 to top portion 31 of die fixing device 30, and force can be applied more evenly to die 50 and die mounting area 21.

[0040] 17 is a schematic diagram of steps S20 and S30 of a third embodiment of the method according to the present invention. As shown in FIG. 17, the third embodiment differs from the first embodiment in that a plurality of through-holes 411 are provided on the top 41 and the side of the mobile mounting device 40, respectively, and the through-holes 411 on the side of the mobile mounting device 40 can also make the chamber 43 unsealed, thereby achieving the same effect.

[0041] The above are preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. That is, all equivalent changes and modifications within the scope of the claims of the present invention are included in the scope of the claims of the present invention. [Explanation of symbols]

[0042] 10. First image capture unit 20 Substrate 21 Die placement area 211 First Positioning Tag 30 Die fixing device 31 Top 32 Bottom 40 Moving and placing device 41 Top 411 through hole 42 Bottom 421 Aperture 43 Chamber 44 Exhaust pipe 441 Negative Pressure 45 Intake pipe 451 positive pressure 50 Die 51 Second positioning tag 60 Second Image Capture Unit 70 Control Unit 80 Vacuum equipment 90 Gas supply equipment 100 Film F reaction force S10~S60 process θ angle

Claims

1. (a) capturing an image of at least one first alignment tag in a die mounting area of ​​a substrate by a first image capturing unit; (b) placing a die fixing device in the chamber of a mobile mounting device, the side of the top of the die fixing device abutting against the bottom of the mobile mounting device, the height of the chamber being greater than the thickness of the top of the die fixing device, the width of the chamber being greater than the width of the top of the die fixing device, the bottom of the die fixing device adsorbing the die by negative pressure through an opening in the bottom of the mobile mounting device, the hole diameter of the opening being greater than the width of the bottom of the mobile mounting device, and a positive pressure being provided by the mobile mounting device to the top of the die fixing device; (c) capturing an image of at least one second positioning tag of the die by a second image capturing unit; (d) moving the moving mount device above the substrate and aligning the die with the die mounting area according to an image of at least one first positioning tag on the die mounting area and an image of at least one second positioning tag on the die by a control unit; (e) moving the movable mounting device downward, and bringing the die into contact with the die mounting area, such that an angle between the die and the substrate is greater than or equal to 0 degrees and less than 90 degrees, and a reaction force provided by the substrate is applied to the die fixing device through the die; (f) in the positive pressure environment, causing the reaction force to float the die fixture into the chamber and the opening and accommodate the angle of the substrate until the die is fully attached to the die mounting area; Including, A die bonding method that adapts the die fixture to the angle of the substrate.

2. In step (b), a through hole of the moving mounting device communicating with the chamber and an external space; A die bonding method for adapting the die fixing device of claim 1 to an angle of a substrate.

3. The through-hole is provided on the top of the mobile mounting device, or the through-hole is provided on the top and side of the mobile mounting device. A die bonding method for adapting the die fixing device of claim 2 to the angle of the substrate.

4. In step (b), the negative pressure is provided by an exhaust pipe of the moving mount device, which passes through the top of the moving mount device and the top and bottom of the die fixing device; A die bonding method for adapting the die fixing device of claim 1 to an angle of a substrate.

5. In step (b), a through-hole at the top of the moving mounting device communicates with the chamber and an external space, the exhaust pipe passes through the through-hole, and the hole diameter of the through-hole is larger than the outer diameter of the exhaust pipe; A die bonding method for adapting the die fixing device according to claim 4 to the angle of the substrate.

6. In step (b), a plurality of intake pipes of the moving mount device pass through the top of the moving mount device to communicate with the chamber and align with the top of the die fixing device to provide the positive pressure; A die bonding method for adapting the die fixing device of claim 1 to an angle of a substrate.

7. In step (b), a gas supply device providing gas to the chamber through the plurality of intake pipes to generate the positive pressure; A die bonding method for adapting the die fixing device according to claim 6 to the angle of the substrate.

8. In step (b), The plurality of intake pipes are installed around the top of the moving mounting device. A die bonding method for adapting the die fixing device according to claim 6 to the angle of the substrate.

9. In step (b), a film is fixed to the moving mounting device and brought into contact with the top surface of the top of the die fixing device; A die bonding method for adapting the die fixing device of claim 1 to an angle of a substrate.

10. In step (b), an exhaust pipe of the moving mounting device passes through the top of the moving mounting device, the film, and the top and bottom of the die fixing device, and the negative pressure is provided through the exhaust pipe; A die bonding method for adapting the die fixing device of claim 9 to an angle of a substrate.

Images