Inspection method, inspection device, and production system

Abstract

To provide an inspection method, an inspection device, and a production system capable of inspecting a state of soldering of components to a substrate after reflow processing with high accuracy.SOLUTION: In this invention, position information related to an actual measured position of a lead tip in the component is obtained from the component image acquired before the reflow process, and the inspection area is set on the basis of the position information. In other words, the inspection area is moved according to the position information, and the partial image always includes an image of the lead tip and a surrounding image of the lead tip. As a result, it is possible to inspect a state of soldering of the component to the substrate from the partial image with high accuracy.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an inspection technique for inspecting the condition of soldering of components to a board after reflow processing. [Background technology]

[0002] Patent Document 1 describes a production system equipped with a printing device, a component mounting device, and a reflow device. The printing device prints solder paste onto a board (printing process). The component mounting device receives the printed board from the printing device and mounts components on the board (component mounting procedure). The reflow device receives the board with components mounted from the component mounting device and performs the reflow process. By combining these devices, the production of boards with mounted components is carried out.

[0003] In a production system, to ensure that board production is performed properly, an inspection device may be installed between a printing device and a component mounting device, between a component mounting device and a reflow device, or downstream of the reflow device. In particular, an inspection device installed downstream of the reflow device uses a camera to capture images of a board that has undergone all of the printing, component mounting, and reflow processes while illuminating the board with light from an illumination unit. Various inspections are then performed based on the captured images. One such inspection is the quality inspection of the solder joints to the component lead tips. In this inspection, whether the lead tips and the board are joined with the appropriate amount and shape of solder is determined based on the image of the lead tip periphery (i.e., the image within the inspection area including the lead tips and their surroundings) captured by the camera (hereinafter referred to as the "inspection image"). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-88876 Summary of the Invention [Problem to be solved by the invention]

[0005] To improve the inspection accuracy, it is desirable to accurately capture the image of the lead tip periphery from the inspection image. However, the following circumstances make it difficult to satisfy this requirement. The shape and dimensions of components are determined in advance by specifications, but these specifications include certain tolerances. Furthermore, lead length is not determined, or even if specified, it includes a relatively large tolerance. Therefore, lead length varies from component to component, or even from lead to lead, even within the same component. Therefore, conventional techniques, which uniquely determine the inspection area based on the component specifications, were unable to address individual differences in lead length. That is, even though the inspection area needs to be shifted to accommodate individual differences in lead length, the design frame determined by the component specifications was used as the inspection area for inspection. This was one of the obstacles to improving inspection accuracy.

[0006] If an image of the lead tip could be extracted from the inspection image, it would be possible to correct the position of the inspection area based on that image. However, after the reflow process, the lead tip is buried in the solder. Therefore, such correction was difficult. For these reasons, it was difficult with conventional technology to improve the accuracy of inspecting the soldering condition of components on a board after the reflow process.

[0007] The present invention has been made in consideration of the above-mentioned problems, and aims to provide an inspection method, an inspection device, and a production system that can inspect with high precision the condition of soldering of components to a substrate after reflow processing. [Means for solving the problem]

[0008] A first aspect of the present invention is an inspection method for inspecting a substrate to which component lead tips have been soldered as a result of a reflow process, comprising the steps of: (a) acquiring position information relating to the actual positions of the component lead tips from a component image obtained by imaging the component before the reflow process; (b) acquiring an inspection image by imaging the substrate after the reflow process; (c) setting an inspection area in the inspection image that includes the lead tips and the areas surrounding the lead tips based on the position information; and (d) inspecting the quality of the soldering of the lead tips to the substrate from a partial image of the inspection image that is included in the inspection area set in step (c).

[0009] In addition, a second aspect of the present invention is an inspection device that inspects a board to which the lead tips of components have been soldered as a result of undergoing a reflow process, and is characterized by comprising: a communication unit that receives position information related to the actual positions of the lead tips of the component, obtained from a component image obtained by imaging the component before the reflow process; an inspection imaging unit that images the board to obtain an inspection image; an inspection area setting unit that sets an inspection area in the inspection image that includes the lead tips and the areas surrounding the lead tips based on the position information; and an inspection execution unit that inspects the quality of the soldering of the lead tips to the board from a partial image of the inspection image that is included in the inspection area set by the inspection area setting unit.

[0010] Furthermore, a third aspect of the present invention is a production system that inspects a board after the lead tips of a component have been soldered to the board by a reflow process, and is characterized by comprising: a pre-reflow imaging unit that images the component before the reflow process to obtain a component image; a position information acquisition unit that acquires position information related to the actual measured positions of the lead tips of the component from the component image; an inspection imaging unit that images the board to obtain an inspection image; an inspection area setting unit that sets an inspection area in the inspection image that includes the lead tips and the areas surrounding the lead tips based on the position information; and an inspection execution unit that inspects the quality of the soldering of the lead tips to the board from a partial image of the inspection image that is included in the inspection area set by the inspection area setting unit.

[0011] In the invention configured as described above, the quality of the soldering of the lead tips to the board is inspected after the reflow process from a partial image included in the inspection area of ​​the inspection image acquired by capturing an image of the board. If this inspection area is fixed, it would be impossible to accommodate changes in the position of the lead tips due to lead length and individual differences between components, as described above. Therefore, in the present invention, position information related to the actual measured positions of the lead tips of the component is acquired from a component image acquired before the reflow process, and the inspection area is set based on that position information. In other words, the inspection area is moved according to the position information, and the partial image always includes images of the lead tips and their surroundings. As a result, it is possible to inspect the quality of the soldering of the component to the board with high accuracy from the partial image.

[0012] Here, the position information is the design position of the lead tip of the component determined from the component specifications. A correction value required to correct the inspection area in consideration of the deviation of the actual measured position from the design position may be used as the position information. In this case, the design area including the lead tip located at the design position and the periphery of the lead tip is moved by the correction value within the inspection image. As a result, an inspection area appropriate for inspection can be obtained, and inspection accuracy can be improved.

[0013] Furthermore, when a component has multiple leads, a correction value can be acquired for each lead, and a correction file can be created that associates the correction value with a pin number for identifying the lead. Then, by reading the correction value corresponding to each lead from the correction file and setting the inspection area for each lead, an inspection area appropriate for inspection can be obtained for each lead, even if there are individual differences between the leads. As a result, inspection accuracy can be improved regardless of the number of leads.

[0014] Alternatively, the actual measured position may be used as the position information. In this case, a correction value required to correct the design position of the lead tip to the actual measured position is calculated from the design position and the actual measured position in the inspection device. Then, in the inspection image, the lead tip located at the design position and the design area including the periphery of the lead tip are moved by the correction value. As a result, an inspection area appropriate for inspection can be obtained, and inspection accuracy can be improved.

[0015] Furthermore, when a component has multiple leads, a position information file may be created that associates the pin number for identifying the lead with the actual measured position by acquiring the actual measured position for each lead. Then, by reading the actual measured position corresponding to each lead from the position information file and setting the inspection area by calculating the correction amount and shifting the correction amount in the design area, an inspection area appropriate for inspection can be obtained for each lead, even if there are individual differences between the leads. As a result, inspection accuracy can be improved regardless of the number of leads.

[0016] Alternatively, the design area may be moved by the correction amount, or the inspection area may be set so that the lead tip is positioned at the center of the inspection area. By doing so, the image of the lead tip and the image of the solder soldered to the lead tip are included in the inspection area in the inspection image. As a result, the soldering condition can be inspected reliably.

[0017] Furthermore, in order to capture component images before the reflow process, a pre-reflow imaging unit that captures images of components before the reflow process must be provided in addition to the reflow device and inspection device. However, if the component mounting device that mounts components has a first camera that captures images of components and mounts the components on the board by placing the lead tips on the solder printed on the top surface of the board based on the image captured by capturing the component with the first camera, the first camera may function as the pre-reflow imaging unit. This eliminates the need for a dedicated pre-reflow imaging unit for acquiring position information in the production system, thereby reducing system costs.

[0018] Furthermore, when multiple component mounting devices are arranged in series along a transport path along which boards are transported before reflow processing, the first camera of the component mounting device arranged furthest downstream on the transport path among the multiple component mounting devices may be configured to function as a pre-reflow imaging unit, and the image captured by the first camera may be provided as a component image. This allows components to be imaged in a state closest to the state of soldering inspection, thereby improving inspection accuracy.

[0019] Furthermore, if the production system is provided with a pre-reflow inspection device that has a second camera that captures an image of the board with the lead tips of components placed on the solder printed on the top surface thereof and inspects the board before the reflow process based on the image captured by the second camera, the second camera may function as a pre-reflow imaging unit, and the image captured by the second camera may be provided as a component image. This eliminates the need to provide a dedicated pre-reflow imaging unit for acquiring position information in the production system, making it possible to reduce system costs. [Effects of the Invention]

[0020] According to the present invention, the condition of soldering of components to a board after reflow processing can be inspected with high precision. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a block diagram schematically showing the configuration of a production system to which a first embodiment of an inspection method according to the present invention can be applied. [Figure 2] 2 is a diagram showing an example of the configuration of a component mounting device provided in the production system shown in FIG. 1. [Figure 3] 3 is a diagram showing an example of a component mounted on a board by the component mounting apparatus of FIG. 2. FIG. [Figure 4] FIG. 3 is a diagram showing an example of a correction file that functions as a supply source of position information of the present invention in the first embodiment. [Figure 5] 2 is a block diagram schematically illustrating an example of an inspection device provided in the production system shown in FIG. 1. [Figure 6] 6 is a partial side view showing an example of an inspection head provided in the inspection device of FIG. 5. [Figure 7] 2 is a flowchart showing the operation of each unit in the production system shown in FIG. [Figure 8] FIG. 10 is a diagram schematically illustrating an example of a display screen displayed on a display / operation unit of the inspection device during an inspection process after a reflow process. [Figure 9] FIG. 2 is a diagram illustrating the operation of the inspection device. [Figure 10] 6 is a flowchart showing the operation of each unit in a production system to which a second embodiment of an inspection method according to the present invention can be applied. [Figure 11] FIG. 11 is a diagram showing an example of a location information file that functions as location information of the present invention in the third embodiment. [Figure 12] 10 is a flowchart showing the operation of each unit in the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0022] 1 is a block diagram showing a schematic configuration of a production system to which a first embodiment of an inspection method according to the present invention can be applied. The production system 1 includes a printing device 100, a component mounting device 200, a reflow device 300, and an inspection device 400, all of which are arranged in series along a transport path extending in the X direction (the horizontal direction in FIG. 1), which is the direction in which the boards are transported. These devices are comprehensively controlled by a server 500 to produce boards on which components are mounted. The server 500 includes a processor 501 implemented by a computer having a CPU (Central Processing Unit), RAM (Random Access Memory), and the like, as well as a storage device 502 such as a hard disk drive, a display 530 that displays various information to notify the operator, and an input device 540 such as a keyboard and mouse.

[0023] The server 500 also includes a reading unit 520 that accesses a computer-readable, non-transitory recording medium RMa, such as a CD (Compact Disc), a DVD (Digital Versatile Disc), or a USB (Universal Serial Bus) memory, and reads a program from the recording medium RMa. The server 500 then exchanges various information and commands with the control units 110, 210, 310, and 410 of the printing apparatus 100, component mounting apparatus 200, reflow apparatus 300, and inspection apparatus 400, respectively, in accordance with the read program. In particular, in the first embodiment, before the reflow process by the reflow apparatus 300, the component mounting apparatus 200 captures an image of the component and acquires positional information (in this embodiment, a correction file shown in FIG. 4, which will be described later) related to the actual measured positions of the lead tips of the component. Furthermore, the inspection apparatus 400 improves the accuracy of soldering quality inspections by correcting the inspection area using the positional information. In this manner, in this embodiment, the component mounting apparatus 200 and the inspection apparatus 400 are closely related to the inspection method according to the present invention. Therefore, hereinafter, an example of the configuration of the component mounting apparatus 200 and the inspection apparatus 400 will be described first, and then the inspection method will be described in detail.

[0024] Fig. 2 is a diagram showing an example of the configuration of a component mounting apparatus provided in the production system shown in Fig. 1. Fig. 3 is a diagram showing an example of a component mounted on a board by the component mounting apparatus of Fig. 2. The component mounting apparatus 200 has a function of mounting a lead tip LDa (see Fig. 3(c)) of a component on solder printed on the top surface of the board B by the printing apparatus 100 by controlling each unit of the apparatus configured as follows using a control unit 210. As shown in Fig. 2, the control unit 210 is a computer having an arithmetic processing unit 211 which is a processor configured with a CPU (Central Processing Unit) and RAM (Random Access Memory), and a storage unit 212 configured with an HDD (Hard Disk Drive) and the like. Furthermore, the control unit 210 has a drive control unit 213 that controls the drive system of the component mounting device 200, an imaging control unit 214 that controls the imaging system of the component mounting device 200, a communication unit 215 that has the function of sending and receiving various information and commands to and from the server 500, and a display / operation unit 216 that displays the status of the component mounting device 200 and accepts instructions from the user.

[0025] The component mounting apparatus 200 includes a pair of conveyors 202, 202 provided on a base 201. The component mounting apparatus 200 mounts components on a board B that has been carried in by the conveyor 202 from the upstream side in the X direction (board transport direction) to a mounting processing position (the position of board B in FIG. 2), and then carries out the board B, on which component mounting has been completed, from the mounting processing position to the downstream side in the X direction by the conveyor 202.

[0026] Component mounting device 200 is provided with a pair of Y-axis rails 221, 221 extending in the Y direction, a Y-axis ball screw 222 extending in the Y direction, and a Y-axis motor My (servo motor) that rotates and drives Y-axis ball screw 222, and an X-axis rail 223 is supported by the pair of Y-axis rails 221, 221 so as to be movable in the Y direction, and is fixed to the nut of Y-axis ball screw 222. An X-axis ball screw 224 extending in the X direction and an X-axis motor Mx (servo motor) that rotates and drives X-axis ball screw 224 are attached to X-axis rail 223, and head unit 230 is supported by X-axis rail 223 so as to be movable in the X direction, and is fixed to the nut of X-axis ball screw 224. Therefore, the drive control section 213 of the control unit 210 can rotate the Y-axis ball screw 222 using the Y-axis motor My to move the head unit 230 in the Y direction, or rotate the X-axis ball screw 224 using the X-axis motor Mx to move the head unit 230 in the X direction.

[0027] Two component supply units 240 are lined up in the X direction on each side of the pair of conveyors 202, 202 in the Y direction. A plurality of tape feeders 241 are lined up in the X direction and detachably attached to each component supply unit 240. The tape feeders 241 extend in the Y direction and have component supply points 242 at their tips on the head unit 230 side in the Y direction. Tapes containing small piece-like components such as integrated circuits, transistors, and capacitors at predetermined intervals are loaded into the tape feeders 241. Each tape feeder 241 intermittently feeds the tape in the Y direction toward the head unit 230. As a result, the components on the tape are fed in the Y direction (feed direction) and supplied in order to the component supply points 242 of each tape feeder 241.

[0028] The head unit 230 has a plurality of mounting heads 231 arranged in a row at equal pitches in the X direction. Nozzles 232 are detachably attached to the lower ends of the mounting heads 231, and the mounting heads 231 use the nozzles 232 to pick up and mount components. That is, the mounting head 231 moves the nozzles 232 to above a component supply location 242 of the tape feeder 241, and then uses the nozzles 232 to pick up the components supplied to the component supply location 242. Furthermore, with the components held by the nozzles 232, the mounting head 231 moves to above the board B at the mounting processing position and mounts the components on the board B.

[0029] Furthermore, the component mounting apparatus 200 includes a component recognition camera 250 attached to the base 201 facing upward and between two component supply units 240 lined up in the X direction. After picking up a component from the component supply unit 240, the mounting head 231 moves above the component recognition camera 250 that is closer to it, and passes above the component recognition camera 250 while still holding the component. In response to this, the component recognition camera 250 captures an image of the component passing above it from below, thereby acquiring a component image. The calculation processing unit 211 then determines the state of the component picked up by the nozzle 232 based on the image capture result of the component recognition camera 250 acquired via the image capture control unit 214.

[0030] In this first embodiment, the arithmetic processing unit 211 has not only the function of calculating the component state but also the function of calculating the actual position of each lead tip LDa and the function of calculating the correction amount. These functions will be described with reference to FIGS. 3 and 4.

[0031] For example, as shown in FIG. 3(a), many components C mounted on a board B have multiple leads (sometimes called lead terminals or lead pins) LD. The position of each lead LD, i.e., the lead tip LDa (corresponding to the "step center" in FIG. 3(a)), is determined by the component specifications. This position is referred to herein as the "design position of the lead tip" and is expressed as the XY coordinates of each lead tip LDa relative to the center coordinates (0,0) of the component C in the horizontal plane. However, individual components C vary, and the actual position of the lead tip LDa may differ from the design position, as shown in FIG. 3(b). Therefore, in this embodiment, the arithmetic processing unit 211 measures the position of each lead tip LDa from the component image captured by the component recognition camera 250 and expresses the position as the XY coordinates of each lead tip LDa relative to the center coordinates (0,0) of the component C in the horizontal plane. This position of the lead tip LDa is referred to herein as the "measured position of the lead tip." Furthermore, the arithmetic processing unit 211 calculates the X-direction distance and the Y-direction distance as correction amounts for correcting the inspection area in consideration of the deviation of the actual measurement position from the design position, associates them with pin numbers for identifying each lead, and transmits them to the server 500 via the communication unit 215. Upon receiving this, the server 500 writes it into a correction file CF having the data structure shown in FIG.

[0032] FIG. 4 shows an example of a correction file that functions as a source of position information in the first embodiment of the present invention. In the figure, "Board ID" is board identification information identifying the board on which component C is mounted, "Ref Name" is a name arbitrarily set by the user, and "Block Number" is a number identifying component C mounted on the board B. For example, in FIG. 3(c), the step center (XG18, YG18) indicating the actual position of the lead tip LDa for pin number "8" is measured, and the X-direction difference x18 and the Y-direction difference y18 from the step center (X18, Y18) indicating the designed position of the lead tip LDa are calculated as correction amounts. The correction amounts (x18, y18) are then transmitted from the component mounting apparatus 200 to the server 500 and written into the dotted columns in the correction file CF shown in FIG. 4 (note that the dots in the columns are added for illustrative purposes). In this way, correction amounts are calculated for all components C mounted on board B before the reflow process and saved in the form of a correction file CF in the server 500. This correction file CF is referred to by the inspection device 400 as needed, and contributes to improving the accuracy of inspection by the inspection device 400 to determine whether the soldering condition of the lead tip LDa to the board B is good or bad. This point will be described in detail later.

[0033] Fig. 5 is a block diagram showing a schematic example of an inspection device provided in the production system shown in Fig. 1. In addition to a control unit 410, this inspection device 400 has an inspection head 420, a transport conveyor 430, and a drive mechanism 450. The control unit 410 controls the inspection head 420, the transport conveyor 430, and the drive mechanism 450, so that the board B (a printed circuit board on which components C are mounted) that has undergone the reflow process by the reflow device 300 is inspected overall for preset inspection details (such as "insufficient solder" and "bridge" in Fig. 8, which will be described later).

[0034] The transport conveyor 430 transports the substrate B along a predetermined transport path. Specifically, the transport conveyor 430 transports the substrate B before inspection, i.e., the substrate B after reflow processing, to the inspection position PB (position shown in FIG. 5) set directly below the inspection head 420 and holds the substrate B horizontally at the inspection position PB. With the substrate B held at the inspection position PB in this manner, the upper surface Ba of the substrate B becomes horizontal, and the normal to the upper surface Ba of the substrate B is parallel to the vertical direction Z. Here, the normal to the upper surface Ba of the substrate B corresponds to the normal to the exposed plane of the upper surface Ba of the substrate B, i.e., the normal to the plane on which no attachments such as components or solder are present. Then, when the inspection of the substrate B at the inspection position PB is completed, the transport conveyor 430 transports the inspected substrate B from the inspection position PB to the outside of the inspection device 400.

[0035] The inspection head 420 integrally includes a single front-facing camera 421 that captures an image of the imaging range R from above, multiple inclined cameras 422, and an illumination unit 423 that illuminates the imaging range R from above. The front-facing camera 421 faces the imaging range R from a direction parallel to the vertical direction Z, and the inclined cameras 422 face the imaging range R from a direction inclined with respect to the vertical direction Z. With the inspection area of ​​the substrate B loaded into the inspection position PB within the imaging range R, the front-facing camera 421 and the inclined cameras 422 capture images while irradiating light from the illumination unit 423 onto the imaging range R. The inspection head 420 can capture images of the inspection target portion of the substrate B from different angles using the front-facing camera 421 and the inclined cameras 422, which contributes to improving inspection accuracy. Incidentally, the inspection head 420 includes four inclined cameras 422, but for simplicity of illustration, only two inclined cameras 422 are shown in FIG. 5.

[0036] Fig. 6 is a partial side view showing an example of an inspection head provided in the inspection device of Fig. 5. The inspection head 420 has a holding frame 424 that integrally supports a front-facing camera 421, an inclined camera 422, and an illumination unit 423. The holding frame 424 has a shape that is rotationally symmetrical with respect to a center line C4 that is parallel to the vertical direction Z, and is composed of a camera support unit 42 above the vertical direction Z and an illumination support unit 426 below the vertical direction Z.

[0037] The camera support part 425 has a substantially cylindrical shape and supports the front-facing camera 421 disposed so as to penetrate its top surface and the four inclined cameras 422 disposed circumferentially around its side surface. The optical axis A1 of the front-facing camera 421 (the optical axis of the objective lens of the front-facing camera 421) is parallel to the center line C4, or in other words, parallel to the normal to the top surface Ba of the substrate B. Thus, the front-facing camera 421 faces the imaging range R from the direction of the center line C4. The four inclined cameras 422 are arranged circumferentially at equal angular intervals (90-degree intervals) around the center line C4. The optical axis A1 of each inclined camera 422 (the optical axis of the objective lens of each inclined camera 422) is inclined with respect to the center line C4, or in other words, inclined with respect to the normal to the top surface Ba of the substrate B. Thus, each inclined camera 422 faces the imaging range R from a direction inclined with respect to the center line C4.

[0038] Illumination support part 426 has a substantially dome shape, and its top is attached to the bottom of camera support part 425, to which illumination part 423 is attached. Illumination support part 426 is located between camera support part 425 and imaging range R, and front-facing camera 421 and inclined camera 422 each face imaging range R through an opening provided in illumination support part 426. Thus, when viewed from vertical direction Z as shown in FIG. 6 , in illumination support part 426, the opening provided for front-facing camera 421 is located in the center, and the openings provided for each inclined camera 422 are located around the opening for front-facing camera 421.

[0039] The illumination unit 423 has an annular shape centered on a center line C4. Specifically, the illumination unit 423 is configured with a large number of point light sources (e.g., light emitting diodes) located directly above a flat, annular plate having an annular shape centered on the center line C4. Most of the light emitted from the point light sources is irradiated onto the imaging range R from a direction inclined with respect to the vertical direction Z, while the remainder is partially diffused by the annular plate and irradiated onto the imaging range R. The illumination unit 423 is capable of changing the exposure time in response to a control command from the control unit 410.

[0040] In the imaging range R illuminated in this manner, the illumination light is reflected by the board B. The reflected light is then received by the front-facing camera 421 and the inclined camera 422, thereby capturing an image of the board B within the imaging range R. The inspection head 420 configured in this manner is capable of changing the imaging range R in response to a control command from the control unit 410.

[0041] The drive mechanism 450 supports the inspection head 420 and drives the inspection head 420 in the horizontal direction and the vertical direction Z using a motor (not shown). In other words, the drive mechanism 450 can move the inspection head 420 above the inspection target portion of the substrate B, and can also move the inspection head 420 in the vertical direction relative to the inspection target portion of the substrate B.

[0042] The control unit 410 has an arithmetic processing unit 411 configured by a computer having a CPU, RAM, etc. The arithmetic processing unit 411 controls the various components of the inspection apparatus, thereby performing the inspection. The control unit 410 has an illumination control unit 412 that controls the illumination unit 423, an imaging control unit 413 that controls the cameras 421 and 422, and a drive control unit 414 that controls the drive mechanism 450. When the transport conveyor 430 carries the board B to the inspection position PB, the arithmetic processing unit 411 controls the drive mechanism 450 via the drive control unit 414 to move the inspection head 420 above the inspection target portion of the board B. This brings the inspection area within the imaging range R of the front-facing camera 421 and the inclined camera 422. Next, the control unit 410 controls the illumination unit 423 via the illumination control unit 412, causing the illumination unit 423 to irradiate the imaging range R with light of a predetermined illuminance. With imaging range R illuminated in this manner, control unit 410 controls the exposure times of front-facing camera 421 and inclined camera 422 using imaging control section 413, and captures images using each of front-facing camera 421 and inclined camera 422. In this way, an image of the inspection area of ​​board B within imaging range R is captured.

[0043] The control unit 410 further includes an image processing unit 415, a storage unit 416, a communication unit 417, and a display / operation unit 418. The image processing unit 415 performs appropriate image processing on images captured by the front camera 421 and the inclined camera 422. The storage unit 416 is configured with a hard disk drive or the like, and stores preset inspection details, images that have been image-processed by the image processing unit 415, and an inspection program for controlling each unit of the inspection device to perform a full inspection of the board B. The communication unit 417 has a function of transmitting and receiving various information and commands to and from the server 500. The display / operation unit 418 displays the inspection status of the inspection device 400, for example, as shown in FIG. 8, which will be described later, and receives instructions from the user.

[0044] In the inspection device 400 configured in this manner, the arithmetic processing unit 411 controls each unit of the device in accordance with an inspection program stored in the storage unit 416, thereby executing preset inspection contents (a portion of which is shown in FIG. 8, for example). In this way, a total inspection of the board B is performed. Here, the operation of each unit of the production system 1 (printing device 100, component mounting device 200, reflow device 300, inspection device 400, server 500) will be described based on FIG. 7, using as an example an inspection of the part with block number 1 (part C in FIG. 3) mounted on the board ID of "XXX1" to see if the soldering condition of the lead tip LDa of pin number 8 on board B is good or bad (see FIGS. 3 and 8).

[0045] Fig. 7 is a flowchart showing the operation of each unit in the production system shown in Fig. 1, and shows the flow of various processes for boards with board IDs "XXX1" and "XXX2." Fig. 8 is a diagram showing an example of a display screen displayed on the display / operation unit 418 of the inspection device during inspection processing after reflow processing. In this production system 1, the printing device 100, component mounting device 200, reflow device 300, and inspection device 400 are collectively controlled by the server 500, and the following processes are performed for one board B.

[0046] When a board with "board ID: XXX1" (hereinafter referred to as "board B1") is carried into the printing device 100 located at the most upstream side of the production system 1, the printing device 100 prints solder paste on the board B1 (step S101: printing process). Then, the board B1 that has undergone the printing process is transported from the printing device 100 to the component mounting device 200.

[0047] In the component mounting apparatus 200, the mounting head 231 moves the nozzle 232 above the component supply location 242 of the tape feeder 241, and the nozzle 232 picks up the component supplied to the component supply location 242 (step S201). Subsequently, the mounting head 231, with the component held by the nozzle 232, moves above the component recognition camera 250 to above the board B1, which is the mounting processing position. During this movement, the component recognition camera 250 captures an image of the component and acquires a component image (step S202). Then, the mounting head 231, which has moved above the board B1, mounts the component on the solder paste printed on the top surface of the board B1 (step S203). In parallel with this component mounting, the arithmetic processing unit 211 calculates a correction amount from the component image (step S204). As described above, the process in step S204 measures the mounting position (step center) of each lead tip LDa, and calculates the difference between the measured position and the design position as the correction amount. For example, in FIG. 3, the X-direction difference x18 and the Y-direction difference y18 are calculated as the correction values ​​for pin number 8 of the component (block number 1) that is mounted first on board B1. These correction values ​​are sent to server 500 and written into the correction file as indicated by the dots in FIG. 4 (step S501).

[0048] This series of steps (steps S201 to S204) is performed for each component held by the mounting head 231, and is repeated until it is confirmed that all components to be mounted on the board B1 have been mounted (step S205 returns "YES"). On the other hand, if step S205 returns "YES," the board B1 on which all components have been mounted is transported from the component mounting apparatus 200 to the reflow apparatus 300. At this time, in the correction file CF stored in the server 500, the setting of the correction amounts for all lead tips LDa has been completed, as shown in FIG. 4, for example.

[0049] The reflow apparatus 300 receives the board B1 and performs a reflow process on the board B1 (step S301). After the reflow process is completed, the reflow processed board B1 is transported from the reflow apparatus 300 to the inspection apparatus 400.

[0050] In this inspection device 400, before the first substrate B1 is transported, initial settings for the inspection process are made, and as part of the initial settings, setting of an inspection frame is executed (step S401). Here, before describing the inspection process, the inspection frame will be described with reference to FIG.

[0051] FIG. 9 is a diagram showing a schematic diagram of the operation of the inspection device. The figure shows an inspection image captured by the inspection head 420 and an inspection frame F. This "inspection frame F" is a frame that encloses an area (hatched area in the figure) where the soldering condition of the lead tip LDa to the substrate B is inspected. The area enclosed by the inspection frame F corresponds to an example of the "inspection area" of the present invention. In addition, in the figure, the image of the solder after the reflow process has been removed from the inspection image to clarify the positional relationship between the inspection frame F and the lead tip LDa. Furthermore, the symbol IL denotes the image of the lead tip LDa reflected in the inspection image, and the symbol IE denotes the image of the electrode portion, such as a land or pad, printed on the substrate B reflected in the inspection image.

[0052] When inspecting the soldering condition of each lead LD, conventionally, the inspection area is determined to be the area including the lead tip LDa and the area around the lead tip LDa based on the specifications of component C, and an inspection frame F is set as shown in Figure 9(a) in order to define this inspection area. In this specification, the inspection frame F corresponding to the specifications of component C is referred to as the "design frame F0." The area surrounded by this design frame F0 corresponds to an example of the "design area" of the present invention.

[0053] In conventional technology, the design frame F0 is always used as the inspection frame F. However, as mentioned above, there are individual differences in lead length. For this reason, when the lead tip deviates relatively significantly from the component specifications, the image IL of the lead tip LDa is shifted from the center of the design frame F0, as shown in the partially enlarged view of Figure 9(b), for example. This can make it difficult to accurately inspect the soldering condition, for example, whether the amount of solder is low (inspection item: "low solder"), from the partial image in the design area surrounded by the design frame F0.

[0054] Therefore, in this embodiment, as shown in Fig. 7, not only is a design frame F0 set (step S401), but steps S402 to S404 are also executed. As a result, as shown in Fig. 9(c), the inspection area is corrected so that the image IL of the lead tip LDa is always positioned at the center of the inspection frame F, despite the existence of individual differences between leads LD. Then, the quality of the soldering is inspected in the corrected inspection area. Below, we will return to Fig. 7 and continue the explanation.

[0055] In the inspection equipment 400, a design frame F0 is set based on the specifications of the components to be mounted on the board B at an appropriate timing (e.g., when the inspection equipment 400 is powered on or when the board to be produced is changed) before the first board B1 is transported from the reflow equipment 300 (step S401). Then, when the reflow-processed board B1 is transported from the reflow equipment 300 to the inspection equipment 400, the arithmetic processing unit 411 in the inspection equipment 400 searches for a correction file CF corresponding to the board B1 (step S402). If the correction file CF exists in the server 500 ("YES" in step S403), the arithmetic processing unit 411 receives the correction file CF from the server 500 and corrects the inspection frame F (inspection area) for each lead LD (step S404). That is, the arithmetic processing unit 411 moves the design frame F0 indicated by the dashed line by the correction amount (x18, y18), for example, as shown in FIG. 9(c). Then, the arithmetic processing unit 411 inspects the soldering condition based on the partial image included in the moved inspection frame F (the image of the hatched area in FIG. 8(c)) (step S405). More specifically, in step S405, after capturing an image of the substrate B1 after the reflow process to obtain an inspection image (for example, the image displayed in the "Inspection Image" column in FIG. 8), the quality of the soldering condition of the lead tip portion LDa to the substrate B1 is inspected based on the partial image PI (= image IL of the lead tip portion LDa + image IE of the electrode portion + image of the solder (area marked with dots)) of the inspection area surrounded by the inspection frame F in the inspection image.

[0056] In Figure 8, "low solder" is selected as the inspection item for soldering condition, and the connection state with the electrode part of board B is inspected, but the inspection content may change partially each time the inspection item is switched. Therefore, it is possible to configure the inspection frame F so that not only its position but also its size and shape are corrected according to the inspection item. This allows for appropriate and highly accurate inspection of each inspection item.

[0057] On the other hand, if the determination in step S403 is "NO," that is, if it is confirmed that there is no correction file CF corresponding to the board B1, the arithmetic processing unit 411 performs inspection (step S405) without correcting the inspection frame F (step S404). In other words, the arithmetic processing unit 411 inspects the soldering condition based on the partial image included in the design frame F0 corresponding to the component specifications.

[0058] Step S405 is executed for all the lead LDs. Then, when the inspection for all the lead LDs is completed, the arithmetic processing unit 411 reports this to the server 500 and deletes the correction file CF for the board B1 (step S406).

[0059] When the series of processes (=printing process+component mounting process+reflow process+inspection process) on the board B1 is completed in this way, the board B1 is carried out from the inspection device 400.

[0060] 7, while component mounting, reflow or inspection is being performed on board B1 in production system 1, a board with "board ID: XXX2" (hereinafter referred to as "board B2") is carried into printing device 100, and printing, component mounting, reflow and inspection are performed on board B2 in parallel with board B1. This improves the throughput of production system 1.

[0061] As described above, according to the first embodiment, a correction amount corresponding to individual differences in the leads LD is calculated before the reflow process, and the inspection frame F is corrected by the correction amount for each lead LD in the inspection process after the reflow process. Therefore, as shown in the "inspection image" in FIG. 8, for example, although the position of the lead tip LDa is unclear due to the presence of solder after the reflow process (the portion marked with dots in the inspection image), the image of the lead tip LDa is always included in the partial image PI within the inspection frame F. Furthermore, as shown in the enlarged partial view in FIG. 9(c), for example, the partial image included in the inspection frame F has the actual measured position (step center) of the lead tip LDa at its center, and the peripheral image of the lead tip LDa is present around it. Therefore, the partial image (e.g., symbol PI in FIG. 8) in the inspection area surrounded by the inspection frame F reflects the entire lead tip LDa, the electrode portion, and the solder formed overlying them. As a result, it is possible to accurately inspect the quality of the soldering of the lead tip LDa to the board B based on the partial image.

[0062] In the first embodiment, the component recognition camera 250 of the component mounting apparatus 200 corresponds to an example of the "first camera" of the present invention, and also functions as the "pre-reflow imaging unit" of the present invention. Therefore, it is no longer necessary to provide a dedicated pre-reflow imaging unit for acquiring component images in the production system 1, which makes it possible to reduce system costs.

[0063] As described above, in the first embodiment, the correction amount in the correction file CF corresponds to an example of the "position information" of the present invention. Also, step S204 in FIG. 7 corresponds to an example of the "step (a)" of the present invention, step S405 corresponds to the "steps (b)" and "step (d)" of the present invention, and step S404 corresponds to an example of the "step (c)" of the present invention. Also, the front-facing camera 421 and the inclined camera 422 correspond to an example of the "inspection imaging unit" of the present invention. Also, the arithmetic processing unit 411 of the inspection device 400 functions as the "inspection area setting unit" and the "inspection execution unit" of the present invention. Also, the component recognition camera 250 of the component mounting device 200 functions as the "pre-reflow imaging unit" and the "first camera" of the present invention.

[0064] Incidentally, in the first embodiment, the arithmetic processing unit 211 of the component mounting device 200 functions as the "position information acquisition unit" of the present invention, but the production system 1 may also be configured so that the arithmetic processing unit 501 of the server 500 functions as the "position information acquisition unit" of the present invention (second embodiment).

[0065] 10 is a flowchart showing the operation of each unit in a production system to which a second embodiment of the inspection method according to the present invention can be applied. The second embodiment differs significantly from the first embodiment in that the calculation of the correction amount is shifted from the component mounting apparatus 200 to the server 500, but the other configurations and operations are basically the same as those of the first embodiment. Therefore, the following description will focus on the differences, and the same configurations and operations will be denoted by the same reference numerals and will not be described again.

[0066] In the second embodiment, as shown in FIG. 10, the component mounting apparatus 200 does not calculate the correction amount, but instead transmits the component image acquired in step S202 to the server 500 (step S206). Meanwhile, in the server 500 that receives the component image, the arithmetic processing unit 501 calculates the correction amount from the component image (step S504) and adds it to the correction file CF (step S501). Also in the second embodiment, the inspection frame F is corrected by the above-mentioned correction amount for each lead LD in the inspection process after the reflow process. Therefore, as in the first embodiment, it is possible to accurately inspect the quality of the soldering of the lead tip LDa to the board B based on the partial image (e.g., symbol PI in FIG. 8) present in the inspection area surrounded by the inspection frame F.

[0067] As described above, in the second embodiment, step S502 in FIG. 10 corresponds to an example of "step (a)" of the present invention, and the arithmetic processing unit 501 of the server 500 functions as the "location information acquisition unit" of the present invention.

[0068] The present invention is not limited to the above-described embodiments, and various modifications other than those described above are possible without departing from the spirit of the present invention. For example, in the first and second embodiments, the correction amount is defined as the "position information" of the present invention, and the correction amount for each lead LD is stored in the correction file CF, but the "position information" is not limited to this. For example, the actual measured position of the lead tip LDa may be defined as the "position information" of the present invention, and a position information file may be created in which the actual measured position of the lead tip LDa for each lead LD is compiled in table format (third embodiment).

[0069] FIG. 11 is a diagram showing an example of a position information file that functions as the position information of the present invention in the third embodiment. This position information file PF differs from the correction file CF shown in FIG. 4 in that, instead of the correction amount, the actual measured position of the lead tip LDa (= step center XG + step center YG) is stored for each lead LD. For example, in FIG. 3, the actual measured position of the lead tip LDa of pin number 8 of the component (block number 1) to be first mounted on board B1, i.e., the step center (XG18, YG18), is obtained. Then, the step center (XG18, YG18) is transmitted to the server 500 and written into the dotted column in the position information file PF shown in FIG. 11 (note that the dots in the column are added for explanatory purposes). In this way, the actual measured positions of the lead tip LDa for all components C to be mounted on board B are determined before the reflow process and saved in the form of a position information file PF in the server 500.

[0070] Next, the operation of each unit in the third embodiment will be described. Fig. 12 is a flowchart showing the operation of each unit in the third embodiment, illustrating the flow of various processes for boards with board IDs "XXX1" and "XXX2". The third embodiment differs significantly from the first embodiment in the following two points, with the other configurations and operations being basically the same as those of the first embodiment. Therefore, the following description will focus on the differences, and the same configurations and operations will be denoted by the same reference numerals and will not be described again.

[0071] The first difference is that the actual measured position of the lead tip portion LDa (=step center XG+step center YG) is used as the position information. That is, in the third embodiment, as shown in Fig. 12, the component mounting apparatus 200 does not calculate the correction amount, but instead acquires the actual measured position of the lead tip portion LDa from the component image acquired in step S202 and transmits it to the server 500 (step S207). Meanwhile, the server 500, which has received the actual measured position, adds the actual measured position (=step center XG+step center YG) to the position information file PF (step S503).

[0072] The second difference is that the inspection frame F is corrected based on the position information file PF instead of the correction file CF. That is, as shown in FIG. 12, the arithmetic processing unit 411 of the inspection device 400 searches for the position information file PF corresponding to the board B1 (step S407). If the position information file PF exists in the server 500 ("YES" in step S408), the arithmetic processing unit 411 receives the position information file PF from the server 500 and calculates the correction amount (step S409). That is, as shown in FIG. 3, the difference between the design position (step center (X, Y)) determined by the component specifications and the actual position (step center (XG, YG)) read from the position information file PF is calculated as the correction value. Subsequently, the arithmetic processing unit 411 corrects the inspection frame F for each lead LD (step S404), as in the first embodiment, and inspects the soldering condition based on the partial image included in the corrected inspection frame F (step S405). On the other hand, if the determination in step S408 is "NO," that is, if it is confirmed that the position information file PF corresponding to the board B1 does not exist, the arithmetic processing unit 411 performs inspection (step S405) without calculating the correction amount (step S409) or correcting the inspection frame F (step S404). In other words, the arithmetic processing unit 411 inspects the soldering condition based on the partial image included in the design frame F0 corresponding to the component specifications.

[0073] Step S405 is executed for all the lead LDs. Then, when the inspection for all the lead LDs is completed, the arithmetic processing unit 411 reports this to the server 500 and deletes the position information file PF for the board B1 (step S410).

[0074] When the series of processes (=printing process+component mounting process+reflow process+inspection process) on the board B1 is completed in this way, the board B1 is carried out from the inspection device 400.

[0075] As described above, in the third embodiment, as in the first and second embodiments, the inspection frame F is corrected by the above correction amount for each lead LD in the inspection process after the reflow process. Therefore, it is possible to accurately inspect the quality of the soldering of the lead tip LDa to the board B based on the partial image (for example, symbol PI in FIG. 8) present in the inspection area surrounded by the inspection frame F.

[0076] In the above embodiment, the component recognition camera 250 of the component mounting apparatus 200 is used as the "pre-reflow imaging unit" and "first camera" of the present invention. However, a separate camera, a so-called board recognition camera, provided on the component mounting apparatus 200 may also be used. While the present invention is applied to a production system 1 equipped with only one component mounting apparatus 200, the present invention can also be applied to a production system 1 equipped with multiple component mounting apparatuses arranged in series from the printing apparatus 100 toward the reflow apparatus 300. In this case, the camera provided on the component mounting apparatus located closest to the reflow apparatus 300 may function as the "pre-reflow imaging unit" of the present invention, and the image captured by that camera may be provided as the component image. This allows components to be imaged under conditions closest to the soldering condition inspection. As a result, inspection accuracy can be improved.

[0077] The present invention can also be applied to a production system equipped with a mounting inspection device, as described in Patent Document 1. The mounting inspection device is provided with a camera that captures an image of a board on which component lead tips are placed in solder printed on the top surface of the board, and inspects the board before the reflow process based on the image captured by the camera. Therefore, the mounting inspection device may be configured to calculate correction amounts, acquire mounting positions, and send component images to server 500, similar to component mounting device 200 in the above embodiment (fourth embodiment). This eliminates the need for a dedicated pre-reflow imaging unit in the production system, thereby reducing system costs. In this way, in the fourth embodiment, the mounting inspection device and the camera correspond to examples of the "pre-reflow inspection device" and "second camera" of the present invention, respectively. [Industrial Applicability]

[0078] The present invention can be applied to all inspection techniques for inspecting the soldering condition of components on a board after reflow processing. [Explanation of symbols]

[0079] 1. Production system 100...Printing device 200...Component mounting device 250...Component recognition camera (pre-reflow imaging unit, first camera) 300...Reflow equipment 400...Inspection equipment 417…Communications Department 421...Front camera (inspection imaging unit) 422...Inclined camera (inspection imaging unit) B,B1,B2…board Ba...(substrate) surface C…Parts CF...Correction file F...Inspection frame F0...Design frame IL...(Lead tip) image LD…Lead LDa: Lead tip PB: Inspection position PF...location information file PI...partial image (of an inspection image) x18…X direction difference (correction amount) y18…Y direction difference (correction amount)

Claims

1. An inspection method for inspecting a substrate to which the tip ends of component leads have been soldered due to a reflow process. (a) acquiring, before the reflow process, position information relating to the actual measured positions of the lead tips of the component from a component image obtained by photographing the component; (b) taking an image of the substrate after the reflow process to obtain an inspection image; (c) setting an inspection area including the lead tip and the periphery of the lead tip in the inspection image based on the position information; (d) inspecting the quality of the soldering of the lead tip portions to the substrate from a partial image included in the inspection area set in the step (c) of the inspection image; Equipped with the step (a) includes a step of acquiring, as the position information, a correction value required to correct the inspection area in consideration of a deviation of the actual measured position of the lead tip of the component from a design position determined from the specifications of the component; the step (c) includes a step of setting the inspection area by moving, within the inspection image, a design area including the lead tip portion located at the design position and a periphery of the lead tip portion by the correction value; When the component has multiple leads, the step (a) includes a step of acquiring the correction value for each lead, and creating a correction file in which pin numbers for identifying the leads are associated with the correction values; the step (c) includes a step of setting the inspection area by reading out the correction value corresponding to each lead from the correction file for each lead; Testing method.

2. An inspection method for inspecting a substrate to which the tip ends of component leads have been soldered due to a reflow process. (a) acquiring, before the reflow process, position information relating to the actual measured positions of the lead tips of the component from a component image obtained by photographing the component; (b) taking an image of the substrate after the reflow process to obtain an inspection image; (c) setting an inspection area including the lead tip and the periphery of the lead tip in the inspection image based on the position information; (d) inspecting the quality of the soldering of the lead tip portions to the substrate from a partial image included in the inspection area set in the step (c) of the inspection image; Equipped with The step (a) includes a step of acquiring the measured position as the position information, The step (c) (c-1) acquiring a correction value required to correct the design position of the lead tip of the component, which is determined from the component specifications, to the actual measured position; (c-2) setting the inspection area by moving, within the inspection image, a design area including the lead tip portion located at the design position and the periphery of the lead tip portion by the correction value; When the component has multiple leads, The step (a) includes a step of acquiring the actual measured position for each of the leads, and creating a position information file in which a pin number for identifying the lead is associated with the actual measured position, the step (c-1) includes a step of reading out the measured position from the position information file for each of the leads and acquiring a difference between the measured position and the designed position as the correction value; The step (c-2) includes a step of moving the design space by the correction value acquired in the step (c-1) for each lead. Testing method.

3. The inspection method according to any one of claims 1 to 2, The step (c) is a step of setting the inspection area in the inspection image so that an image of the lead tip and an image of the solder soldered to the lead tip are included in the inspection area. Testing method.

4. The inspection method according to any one of claims 1 to 2, The step (d) includes a step of inspecting the soldering condition for each of a plurality of different inspection items, The step (c) changes the shape or size of the inspection area depending on the inspection item. Testing method.

5. The inspection method according to any one of claims 1 to 2, The step (c) sets the inspection area so that the tip end of the lead is positioned in the center of the inspection area. Testing method.

6. An inspection device for inspecting a substrate to which the tip ends of leads of components have been soldered due to a reflow process, a communication unit that receives a correction file from a server that acquires position information related to the actual measured positions of the lead tips of the component, the position information being acquired from a component image obtained by capturing an image of the component before the reflow process; an inspection imaging unit that images the substrate and acquires an inspection image; an inspection area setting unit that sets an inspection area including the lead tip and a periphery of the lead tip in the inspection image based on the correction file; an inspection execution unit that inspects whether or not the soldering of the lead tip portions to the board is good from a partial image included in the inspection area set by the inspection area setting unit of the inspection image; Equipped with the server acquires, as the position information, a correction value required to correct the inspection area in consideration of a deviation of the actual measured position of the lead tip of the component from a design position determined from the component specifications; the inspection area setting unit sets the inspection area by moving, within the inspection image, a design area including the lead tip portion located at the design position and the periphery of the lead tip portion by the correction value; When the component has multiple leads, the server acquires the correction value for each lead, and creates the correction file in which a pin number for identifying the lead is associated with the correction value; The inspection apparatus according to claim 1, wherein the inspection area setting unit reads out the correction value corresponding to each lead from the correction file and sets the inspection area.

7. An inspection device for inspecting a substrate to which the tip ends of leads of components have been soldered due to a reflow process, a communication unit that receives a position information file from a server that acquires position information related to the actual measured positions of the lead tips of the component, the position information being acquired from a component image obtained by capturing an image of the component before the reflow process; an inspection imaging unit that images the substrate and acquires an inspection image; an inspection area setting unit that sets an inspection area including the lead tip and a periphery of the lead tip in the inspection image based on the position information file; an inspection execution unit that inspects whether or not the soldering of the lead tip portions to the board is good from a partial image included in the inspection area set by the inspection area setting unit of the inspection image; Equipped with The server acquires the measured position as the position information, the inspection area setting unit acquires a correction value required to correct a design position of the lead tip of the component, which is determined from the specifications of the component, to the actual measured position, and sets the inspection area by moving, within the inspection image, the lead tip located at the design position and a design area including the periphery of the lead tip by the correction value; When the component has multiple leads, the server acquires the actual measured position for each lead, and creates the position information file in which a pin number for identifying the lead is associated with the actual measured position; the inspection area setting unit reads out the actual measured position from the position information file for each lead, acquires a difference from the design position as the correction value, and moves the design area by the acquired correction value for each lead.

8. 1. A production system for inspecting a substrate after soldering lead tips of components to the substrate by reflow processing, comprising: a pre-reflow imaging unit that captures an image of the component before the reflow process to acquire a component image; a position information acquiring unit that acquires position information related to the actual measured positions of the lead tips of the component from the component image; an inspection imaging unit that images the substrate and acquires an inspection image; an inspection area setting unit that sets an inspection area including the lead tip and a periphery of the lead tip in the inspection image based on the position information; an inspection execution unit that inspects whether or not the soldering of the lead tip portions to the board is good from a partial image included in the inspection area set by the inspection area setting unit of the inspection image; Equipped with the position information acquisition unit acquires, as the position information, a correction value required to correct the inspection area in consideration of a deviation of the actual measured position of the lead tip of the component from a design position determined from a specification of the component; the inspection area setting unit sets the inspection area by moving, within the inspection image, a design area including the lead tip portion located at the design position and the periphery of the lead tip portion by the correction value; When the component has multiple leads, the position information acquisition unit acquires the correction value for each lead, and creates a correction file in which a pin number for identifying the lead is associated with the correction value; The production system is characterized in that the inspection area setting unit reads out the correction value corresponding to each lead from the correction file and sets the inspection area for each lead.

9. 1. A production system for inspecting a substrate after soldering lead tips of components to the substrate by reflow processing, comprising: a pre-reflow imaging unit that captures an image of the component before the reflow process to acquire a component image; a position information acquiring unit that acquires position information related to the actual measured positions of the lead tips of the component from the component image; an inspection imaging unit that images the substrate and acquires an inspection image; an inspection area setting unit that sets an inspection area including the lead tip and a periphery of the lead tip in the inspection image based on the position information; an inspection execution unit that inspects whether or not the soldering of the lead tip portions to the board is good from a partial image included in the inspection area set by the inspection area setting unit of the inspection image; Equipped with the location information acquisition unit acquires the measured location as the location information, the inspection area setting unit acquires a correction value required to correct a design position of the lead tip of the component, which is determined from the specifications of the component, to the actual measured position, and sets the inspection area by moving, within the inspection image, the lead tip located at the design position and a design area including the periphery of the lead tip by the correction value; When the component has multiple leads, the position information acquisition unit acquires the actual measured position for each of the leads, and creates a position information file in which a pin number for identifying the lead is associated with the actual measured position; the inspection area setting unit reads out the actual measured position from the position information file for each lead, acquires a difference from the design position as the correction value, and moves the design area by the acquired correction value for each lead.

10. The production system according to claim 8 or 9, a component mounting device having a first camera for capturing an image of the component, and mounting the component on the board by placing the lead tip on the solder printed on the top surface of the board based on the image captured by capturing the image of the component with the first camera; The first camera functions as the pre-reflow imaging unit, and an image captured by the first camera is provided as the component image. Production system.

11. The production system according to claim 10, When a plurality of the component mounting apparatuses are arranged in series along a transport path along which the substrate is transported before the reflow process, the first camera of the component mounting apparatus arranged at the most downstream side in the transport path among the plurality of component mounting apparatuses functions as the pre-reflow imaging unit, and an image captured by the first camera is provided as the component image. Production system.

12. The production system according to claim 8 or 9, a pre-reflow inspection device that has a second camera that captures an image of the board with the lead tip of the component placed on the solder printed on the upper surface of the board, and that inspects the board before the reflow process based on the image captured by the second camera; The second camera functions as the pre-reflow imaging unit, and an image captured by the second camera is provided as the component image. Production system.

Images