Mounting board and method of manufacturing the same

Abstract

To provide a mounting board and a method for manufacturing a mounting board that suppresses the position of an element covered by a resin material from being displaced on a carrier due to expansion or contraction of the resin material.SOLUTION: A mounting board 1 comprises: a housing substrate 10 including a first side 11 and a second side 12 located on the opposite side of the first side, having a recess 13 on the first side and an organic material; an element 50 located in the recess of the housing substrate and having a terminal 51; an insulating layer 20 that at least partially covers the housing substrate and the element on the first side and is located at least partially in the gap between the wall surface of the recess in the housing substrate and the element; and a conductive layer 25 having a first portion 26 located on the insulating layer and a second portion 27 that penetrates the insulating layer and electrically connects the first portion to the terminal of the element.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] TECHNICAL FIELD An embodiment of the present disclosure relates to a mounting substrate and a method for manufacturing the mounting substrate. [Background technology]

[0002] Wafer-Level-Packaging (WLP) is known as a technology for packaging elements such as chips. Wafer-Level-Packaging is a technology in which the process of packaging elements is performed in wafer form. For example, Patent Document 1 discloses a technology for improving Fan-Out Wafer-Level-Packaging (FOWLP). Fan-Out Wafer-Level-Packaging is a technology in which a redistribution layer is formed over an area beyond the area of ​​the elements in the process of packaging elements in wafer form. In this specification, the redistribution layer is also simply referred to as a wiring layer.

[0003] In conventional fan-out wafer-level packaging, first, multiple elements are prepared, and then the multiple elements are placed on a carrier. After that, a resin material is supplied to cover the carrier and elements, and the resin material is cured to encapsulate each element with resin. Next, the resin encapsulation member containing the multiple elements encapsulated with resin is removed from the carrier. Next, the resin encapsulation member is turned over, and a wiring layer is formed on the resin encapsulation member. The resin encapsulation member and wiring layer are then cut into sections containing one element to obtain an electronic device with packaged elements. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-58520 Summary of the Invention [Problem to be solved by the invention]

[0005] Resin materials expand and contract in response to temperature changes. Furthermore, when the resin material hardens, it shrinks. Therefore, the position of the element covered with the resin material may shift on the carrier due to the expansion and contraction of the resin material.

[0006] An object of the embodiments of the present disclosure is to provide a mounting board that can effectively solve such problems. [Means for solving the problem]

[0007] One embodiment of the present disclosure is a mounting board comprising: a receiving substrate including a first surface and a second surface located opposite the first surface, with a recess provided on the first surface side and made of an organic material; an element located in the recess of the receiving substrate and having a terminal; an insulating layer at least partially covering the receiving substrate and the element on the first surface side and located at least partially in a gap between the element and a wall surface of the recess of the receiving substrate; and a conductive layer having a first portion located on the insulating layer and a second portion that penetrates the insulating layer and electrically connects the first portion to the terminal of the element.

[0008] The mounting substrate according to an embodiment of the present disclosure may further include a support substrate that is located on the second surface side of the receiving substrate and that includes an inorganic material.

[0009] In the mounting board according to an embodiment of the present disclosure, the conductive layer may further include a third portion connected to the first portion and penetrating the insulating layer and the receiving substrate.

[0010] In a mounting substrate according to one embodiment of the present disclosure, the recess of the receiving substrate may have a step portion that supports the surface of the element that is located on the second surface side of the receiving substrate, and a through portion that penetrates the receiving substrate between the surface of the element and the second surface of the receiving substrate.

[0011] In the mounting board according to the embodiment of the present disclosure, a sensor portion may be formed on one of the surfaces of the element that is located on the second surface side of the receiving substrate.

[0012] One embodiment of the present disclosure is a mounting board comprising: a receiving substrate including a first surface and a second surface located opposite the first surface, with a recess provided on the first surface side and made of an organic material; an element located in the recess of the receiving substrate and having a terminal; an insulating layer at least partially covering the receiving substrate and the element on the first surface side and located at least partially in a gap between the element and a wall surface of the recess of the receiving substrate; a substrate located on the first surface side of the receiving substrate; and a through electrode substrate having a through electrode that penetrates the substrate and the insulating layer and is electrically connected to the terminal of the element.

[0013] In a mounting substrate according to one embodiment of the present disclosure, a recess may be formed on the surface of the insulating layer in a portion that overlaps with the gap between the wall surface of the recess and the element when viewed along the normal direction of the first surface of the receiving substrate.

[0014] In the mounting board according to the embodiment of the present disclosure, the organic material of the receiving substrate may include polyimide resin, epoxy resin, polyphenylene ether resin, or fluorine resin.

[0015] In the mounting board according to the embodiment of the present disclosure, the material constituting the insulating layer may include a polyimide resin, an epoxy resin, or an acrylic resin.

[0016] One embodiment of the present disclosure is a method for manufacturing a mounting substrate, comprising: a step of preparing a support substrate having an inorganic material; a step of forming a receiving substrate on the support substrate, the receiving substrate including a first surface located away from the support substrate and a second surface located toward the support substrate, the receiving substrate having a recess on the first surface side and made of an organic material; a step of arranging an element having a terminal in the recess of the receiving substrate; an insulating layer forming step of forming an insulating layer that at least partially covers the receiving substrate and the element on the first surface side and is at least partially located in a gap between the element and a wall surface of the recess of the receiving substrate; and a conductive layer forming step of forming a conductive layer having a first portion located on the insulating layer and a second portion that penetrates the insulating layer and electrically connects the first portion to the terminal of the element.

[0017] The method for manufacturing a mounting substrate according to an embodiment of the present disclosure may further include a step of separating the support substrate from the receiving substrate.

[0018] In a method for manufacturing a mounting substrate according to one embodiment of the present disclosure, the support substrate may be provided with an electrode that penetrates the support substrate, and the conductive layer forming process may include a process for forming a third portion that penetrates the insulating layer and the receiving substrate and electrically connects the first portion to the electrode of the support substrate.

[0019] In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the support substrate may include glass.

[0020] One embodiment of the present disclosure is a method for manufacturing a mounting substrate, comprising: a step of preparing a support substrate having an inorganic material; a step of forming a receiving substrate on the support substrate, the receiving substrate including a first surface located away from the support substrate and a second surface located toward the support substrate, the receiving substrate having a recess on the first surface side and made of an organic material; a step of arranging an element having a terminal in the recess of the receiving substrate; a step of forming an insulating layer that at least partially covers the receiving substrate and the element on the first surface side and is at least partially located in a gap between the element and a wall surface of the recess of the receiving substrate; and a step of preparing a through electrode substrate that has a substrate located on the first surface side of the receiving substrate and a through electrode that penetrates the substrate, and arranging the through electrode substrate on the insulating layer so that the through electrode of the through electrode substrate contacts the terminal of the element.

[0021] In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the insulating layer forming step may include a step of sucking the insulating layer into a gap between a wall surface of the recess of the receiving substrate and the element. [Effects of the Invention]

[0022] According to the embodiments of the present disclosure, it is possible to suppress the occurrence of positional deviation of elements. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 2 is a cross-sectional view showing a mounting substrate according to an embodiment. [Figure 2] 2 is an enlarged cross-sectional view showing a recess in a receiving substrate of the mounting substrate shown in FIG. 1. FIG. [Figure 3] 10A to 10C are diagrams illustrating a step of preparing a receiving substrate provided with a recess. [Figure 4] 10A to 10C are diagrams showing a process of placing an element in a recess of a receiving substrate. [Figure 5] 10A to 10C are diagrams illustrating a step of forming an insulating layer on a receiving substrate. [Figure 6] FIG. 10 is a cross-sectional view showing a modified example of the mounting substrate. [Figure 7]FIG. 10 is a cross-sectional view showing a modified example of the mounting substrate. [Figure 8] FIG. 10 is a cross-sectional view showing a modified example of the mounting substrate. [Figure 9] FIG. 10 is a cross-sectional view showing a modified example of the mounting substrate. [Figure 10] 10A to 10C are diagrams illustrating a manufacturing process of the mounting board shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0024] The configuration of a mounting substrate and a manufacturing method thereof according to one embodiment will be described in detail below with reference to the drawings. The following embodiments are merely examples of embodiments of the present disclosure, and the present disclosure should not be construed as being limited to these embodiments. Furthermore, in this specification, terms such as "substrate," "base material," "sheet," and "film" are not distinguished from one another solely based on differences in nomenclature. For example, "substrate" and "base material" are concepts that also include components that may be called sheets or films. Furthermore, terms used in this specification that specify shapes, geometric conditions, and their degrees, such as "parallel" and "orthogonal," as well as values ​​of length and angle, are not limited to their strict meanings but are interpreted to include the extent to which similar functions can be expected. In the drawings referenced in this embodiment, identical or similar symbols are used to designate identical or similarly functional parts, and repeated explanations may be omitted. For convenience of explanation, the dimensional ratios in the drawings may differ from the actual ratios, and some components may be omitted from the drawings.

[0025] [Mounting board] First, the configuration of a mounting substrate 1 according to one embodiment will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view showing the mounting substrate 1 according to this embodiment.

[0026] 1, the mounting substrate 1 includes a receiving substrate 10, an element 50, an insulating layer 20, a conductive layer 25, and a support substrate 30. Each of the components of the mounting substrate 1 will be described below.

[0027] (Housing board) The receiving substrate 10 includes a first surface 11 located farther from the support substrate 30, and a second surface 12 located on the opposite side of the first surface 11, i.e., on the support substrate 30 side. A recess 13 is provided on the first surface 11 side of the receiving substrate 10. The recess 13 includes a bottom surface 131 and a wall surface 132 that extends from the bottom surface 131 to the first surface 11. The receiving substrate 10 has a thickness t1 of, for example, 50 μm or more and, for example, 700 μm or less.

[0028] The recess 13 defines a space for accommodating the element 50. The depth d of the recess 13 is, for example, 30 μm or more and, for example, 400 μm or less. The width w of the recess 13 is, for example, 300 μm or more and, for example, 20,000 μm or less.

[0029] The receiving substrate 10 provided with the recess 13 is produced by molding an organic material. Examples of organic materials that can be used to form the receiving substrate 10 include fluorine-based resins such as polyimide resin, epoxy resin, polyphenylene ether resin, and polytetrafluoroethylene resin. In order to improve the insulating properties and mechanical strength of the receiving substrate 10, the receiving substrate 10 may further contain fibers such as glass fiber or inorganic filler.

[0030] (element) The element 50 includes, for example, device chips such as LSI (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), and discrete components. MEMS is an electronic device in which mechanical components, sensors, actuators, electronic circuits, etc. are integrated on a single substrate. The element 50 may also include a power amplifier, a surface acoustic wave filter, a switch, an imaging element, etc.

[0031] As shown in FIG. 1, the element 50 is located inside the recess 13 of the receiving substrate 10. The element 50 also has terminals 51. In the example shown in FIG. 1, the element 50 is arranged in the recess 13 so that the terminals 51 are located on the first surface 11 side. Although not shown, the element 50 may also be arranged so that the terminals 51 are located on the second surface 12 side. The element 50 may be adhered to the bottom surface 131 of the recess 13 by an adhesive material (not shown), such as a die attachment material.

[0032] 1, the surface of the element 50 on the first surface 11 side is located on the same plane as the first surface 11. However, this is not limited to this, and the surface of the element 50 on the first surface 11 side may be located closer to the second surface 12 than the first surface 11, i.e., closer to the inside, or conversely, may be located closer to the outside than the first surface 11.

[0033] (insulating layer) The insulating layer 20 is an insulating layer that at least partially covers the receiving substrate 10 and the element 50 on the first surface 11 side of the receiving substrate 10. In the example shown in Fig. 1, the insulating layer 20 is located on the first surface 11 and the element 50 so as to cover the entire area of ​​the element 50 from the first surface 11 side. The thickness t2 of the insulating layer 20 is, for example, 5 µm or more and, for example, 50 µm or less.

[0034] 2 is an enlarged cross-sectional view of the recess 13 of the receiving substrate 10 of the mounting substrate 1 shown in FIG. 2. As shown in FIG. 2, the insulating layer 20 is located not only on the element 50 but also at least partially in the gap between the element 50 and the wall surface 132 of the recess 13. This makes it possible to prevent the element 50 from shifting position inside the recess 13. It also makes it possible to prevent liquid, foreign matter, etc. from entering the gap of the recess 13. The dimension s of the gap of the recess 13 is, for example, 5 μm or more and, for example, 100 μm or less.

[0035] The material for the insulating layer 20 is one that has sufficient fluidity and flexibility to fill the gap between the wall surface 132 of the recess 13 and the element 50. Examples of the material for the insulating layer 20 that can be used include fluorine-based resins such as polyimide resin, epoxy-based resin, polyphenylene ether-based resin, and polytetrafluoroethylene resin.

[0036] (Conductive layer) The conductive layer 25 is a conductive layer that is electrically connected to the terminal 51 of the element 50 . The conductive layer 25 has at least a first portion 26 located on the insulating layer 20 and a second portion 27 that penetrates the insulating layer 20 and electrically connects the first portion 26 to a terminal 51 of the element 50. In the example shown in FIGS. 1 and 2, the second portion 27 of the conductive layer 25 is physically connected to a terminal 51 of the element 50 .

[0037] The configuration of conductive layer 25 is not particularly limited as long as conductive layer 25 is conductive. For example, conductive layer 25 may be composed of a single conductive layer or multiple conductive layers. For example, conductive layer 25 may have a first conductive layer and a second conductive layer formed on the first layer by electroplating. In this case, the first conductive layer functions as a seed layer for growing the second conductive layer.

[0038] When the conductive layer 25 includes the first and second layers described above, the material of the first layer may be the same as or different from the material of the second layer. For example, the first layer may be a laminate film in which titanium and copper are sequentially stacked, or may be chromium. The first layer may be formed by, for example, sputtering, vapor deposition, electroless plating, or a sol-gel method. The second layer may contain, for example, copper. The second layer may contain, for example, copper as a main component, more specifically, 80 mass% or more of copper. The second layer may also contain a metal such as gold, silver, platinum, rhodium, tin, aluminum, nickel, or chromium, or an alloy using any of these metals.

[0039] (support substrate) The support substrate 30 is a substrate located on the second surface 12 side of the receiving substrate 10. In the example shown in Fig. 1 and Fig. 2, the support substrate 30 is in contact with the second surface 12 of the receiving substrate 10. Providing the support substrate 30 in the mounting substrate 1 can increase the rigidity of the entire mounting substrate 1. The thickness of the support substrate 30 is, for example, 0.05 mm or more and, for example, 0.7 mm or less.

[0040] The support substrate 30 includes an inorganic material having a certain level of insulating properties. For example, the support substrate 30 is a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al2O3) substrate, an aluminum nitride (AlN) substrate, a zirconia oxide (ZrO2) substrate, a lithium niobate substrate, a tantalum niobate substrate, or a laminate of these substrates. The support substrate 30 may partially include a substrate made of a conductive material, such as an aluminum substrate or a stainless steel substrate.

[0041] An example of the glass used for the support substrate 30 is alkali-free glass. Alkali-free glass is glass that does not contain alkali components such as sodium or potassium. Alkali-free glass contains, for example, boric acid instead of an alkali component. Alkali-free glass also contains, for example, an alkaline earth metal oxide such as calcium oxide or barium oxide. Examples of alkali-free glass include EN-A1 manufactured by Asahi Glass Co., Ltd. and Eagle XG manufactured by Corning Co., Ltd.

[0042] [Method for manufacturing a mounting substrate] An example of a method for manufacturing the mounting substrate 1 will be described below with reference to FIGS.

[0043] (Process for forming the receiving substrate) First, a support substrate 30 is prepared. Next, a resin layer containing an organic material is provided on the support substrate 30. Methods that can be used to provide the resin layer include dry lamination and printing. Next, the resin layer is molded to form recesses on the surface of the resin layer. As a result, as shown in FIG. 3, a receiving substrate 10 having recesses 13 on the first surface 11 side can be formed on the support substrate 30. As a method for forming the resin layer to produce the receiving substrate 10, for example, a method of pressing a mold against the resin layer can be used. Furthermore, if the organic material is photosensitive, the resin layer may be molded by performing exposure processing and development processing.

[0044] Alternatively, a 3D printer or the like may be used to provide a resin layer on areas other than the areas that will become the recesses 13, thereby forming the receiving substrate 10 on the support substrate 30 with the recesses 13 on the first surface 11 side.

[0045] (Element placement process) 4, the element 50 is placed in the recess 13 of the receiving substrate 10. For example, the element 50 is placed so that the terminals 51 of the element 50 are located on the first surface 11 side. The element 50 may be adhered to the bottom surface 131 of the recess 13 with an adhesive material (not shown), such as a die attachment material.

[0046] (Insulating layer formation process) Next, an insulating layer 20 is formed on the first surface 11 of the receiving substrate 10 and on the elements 50. For example, a resin film (not shown) including a support base and the insulating layer 20 is attached to the first surface 11 of the receiving substrate 10 and the elements 50. The insulating layer 20 is then sucked into the gap between the wall surface 132 of the recess 13 of the receiving substrate 10 and the elements 50. For example, the insulating layer 20 can be attached and sucked into the gap of the recess 13 by using a vacuum laminator to provide the insulating layer 20 on the first surface 11 of the receiving substrate 10 and the elements 50. In this way, as shown in FIG. 5, the insulating layer 20 can be formed so as to be positioned in the gap of the recess 13 and cover the first surface 11 and the elements 50.

[0047] Alternatively, the insulating layer 20 may be formed using a curable resin. For example, when a thermosetting resin is used, a resin film (not shown) including a support substrate and a thermosetting resin layer is attached to the first surface 11 of the receiving substrate 10 and the elements 50. For example, by using a vacuum laminator to provide a thermosetting resin layer on the first surface 11 of the receiving substrate 10 and the elements 50, attachment and suction into the gaps of the recesses 13 can be achieved. The thermosetting resin layer is then heated to form the insulating layer 20. When a photocurable resin is used, the process is similar to that when a thermosetting resin is used, except that the insulating layer 20 is formed by irradiating the photocurable resin with light such as ultraviolet light or an electron beam.

[0048] In addition, a processing step may be performed to form a through-hole in which the second portion 27 of the conductive layer 25 is provided in the insulating layer 20. For example, if the insulating layer 20 is photosensitive, the through-hole can be formed by subjecting the insulating layer 20 to an exposure process and a development process.

[0049] When the insulating layer 20 is drawn into the gap between the wall surface 132 of the recess 13 of the receiving substrate 10 and the element 50 by suction as described above, it is conceivable that the thickness of the insulating layer 20 will be smaller near the gap of the recess 13 than in other portions. For example, as shown in FIG. 2 , a depression 21 may be formed in a portion of the surface of the insulating layer 20 that overlaps with the gap between the wall surface 132 of the recess 13 and the element 50 when viewed along the normal direction of the first surface 11 of the receiving substrate 10. The depth of the depression 21 is, for example, 5 μm or more and, for example, 10 μm or less. The formation of the depression can prevent stress concentration.

[0050] (Conductive layer forming process) Next, a conductive layer 25 is formed, which has a first portion 26 located on the insulating layer 20 and a second portion 27 that penetrates the insulating layer 20 and electrically connects the first portion 26 to the terminal 51 of the element 50. This allows the mounting substrate 1 shown in FIG.

[0051] In this embodiment, as described above, the element 50 is disposed in the recess 13 of the receiving substrate 10. Therefore, even if the insulating layer 20 covering the element 50 expands or contracts, the range of positional displacement of the element 50 can be limited to the inside of the recess 13. This makes it possible to prevent the positional displacement of the element 50 from exceeding the allowable range during the manufacturing process of the mounting substrate 1.

[0052] It should be noted that various modifications can be made to the above-described embodiment. Below, modifications will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, parts that can be configured similarly to the above-described embodiment will be designated by the same reference numerals as those used for the corresponding parts in the above-described embodiment, and duplicated explanations will be omitted. Furthermore, if it is clear that the effects obtained in the above-described embodiment can also be obtained in the modified embodiment, the explanations thereof may be omitted.

[0053] (First Modification) In the above-described embodiment, an example has been shown in which the mounting substrate 1 includes a support substrate 30 that supports the insulating layer 20 from the second surface 12 side. However, this is not limited to this, and the mounting substrate 1 does not need to include the support substrate 30, as shown in Fig. 6. Such a mounting substrate 1 can be obtained, for example, by manufacturing the mounting substrate 1 shown in Fig. 1 described above, and then further performing a step of separating the support substrate 30 from the second surface 12 of the receiving substrate 10.

[0054] (Second Modification) 7, the support substrate 30 that supports the insulating layer 20 from the second surface 12 side may be provided with an electrode 35 that penetrates the support substrate 30. In this case, as shown in FIG. 7, the conductive layer 25 may further have, in addition to the first portion 26 and the second portion 27, a third portion 28 that penetrates the insulating layer 20 and the receiving substrate 10 and electrically connects the first portion 26 to the electrode 35 of the support substrate 30. This allows electrical connection between the terminal 51 of the element 50 and the electrode 35 of the support substrate 30. Other electronic components that transmit and receive electrical signals to and from the element 50 are electrically connected to the electrode 35 of the support substrate 30.

[0055] The through-hole of the receiving substrate 10 in which the third portion 28 of the conductive layer 25 is provided may be formed in the process of forming the recess 13 in the receiving substrate 10. Alternatively, the through-hole of the receiving substrate 10 may be formed after the recess 13 is formed in the receiving substrate 10.

[0056] (Third Modification) 8, the recess 13 of the receiving substrate 10 may have a step portion 133 that supports a surface 52 of the element 50 that is located on the second surface 12 side of the receiving substrate 10, and a through portion 134 that penetrates the insulating layer 20 between the surface 52 of the element 50 and the support substrate 30. In the example shown in FIG. 8, the step portion 133 is formed by forming a through portion 134 that penetrates to the support substrate 30 side in a part of the bottom surface 131 of the recess 13. In this modification, the element 50 has a sensor portion 53 formed on the surface 52 that is located on the second surface 12 side. For example, the element 50 includes an imaging element, and the sensor portion 53 is a light detection portion that detects light.

[0057] In this modification, at least a part of the surface 52 of the element 50 does not come into contact with the receiving substrate 10. In this case, it is preferable to provide the sensor unit 53 on the part of the surface 52 of the element 50 that does not come into contact with the receiving substrate 10. This makes it possible to prevent the accuracy of the sensor unit 53 from decreasing due to contact with the receiving substrate 10.

[0058] (Fourth Modification) In the above-described embodiment and each modified example, an example has been shown in which the conductive layer 25 provided on the insulating layer 20 is electrically connected to the terminal 51 of the element 50. In this modified example, an example will be described in which the through electrodes 45 of the through electrode substrate 40 located on the first surface 11 side of the receiving substrate 10 are electrically connected to the terminal 51 of the element 50.

[0059] 9 is a cross-sectional view showing the mounting substrate 1 according to this modification. As shown in FIG. 9, the mounting substrate 1 includes a receiving substrate 10, an element 50, an insulating layer 20, and a through electrode substrate 40.

[0060] The through electrode substrate 40 has a substrate 41 located on the first surface 11 side of the receiving substrate 10, and a through electrode 45 that penetrates the substrate 41 and protrudes from the surface of the substrate 41 toward the receiving substrate 10. As shown in Fig. 9, the through electrode 45 penetrates the insulating layer 20 so as to be electrically connected to a terminal 51 of the element 50. In the example shown in Fig. 9, the tip of the conductive layer 25 contacts the terminal 51 of the element 50.

[0061] The substrate 41 includes an inorganic material having a certain level of insulating properties. For example, like the support substrate 30, the substrate 41 may be a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al2O3) substrate, an aluminum nitride (AlN) substrate, a zirconia oxide (ZrO2) substrate, a lithium niobate substrate, a tantalum niobate substrate, or a laminate of these substrates. The support substrate 30 may partially include a substrate made of a conductive material, such as an aluminum substrate or a stainless steel substrate. As with the support substrate 30, an example of glass used for the substrate 41 is alkali-free glass. The thickness of the substrate 41 is, for example, 0.05 mm or more and, for example, 0.5 mm or less.

[0062] The configuration of the through electrode 45 is not particularly limited as long as the through electrode 45 is conductive. For example, the through electrode 45 may be composed of a single conductive layer, similar to the above-mentioned conductive layer 25, or may be composed of multiple conductive layers. The material of the through electrode 45 may be the same metal material as that of the conductive layer 25.

[0063] An example of a method for manufacturing the mounting substrate 1 shown in FIG. 9 will be described below with reference to FIG.

[0064] First, as in the case of the above-described embodiment, a receiving substrate 10 having a recess 13 is formed on a support substrate 30, an element 50 is placed in the recess 13, and the element 50 is covered with an insulating layer 20. For example, an adhesive, specifically, a polyimide resin, an epoxy resin, an acrylic resin, or the like, can be used as the insulating layer 20. Furthermore, as shown in FIG. 10 , a through electrode substrate 40 having through electrodes 45 protruding toward the receiving substrate 10 is prepared. Next, the through electrode substrate 40 is placed on the insulating layer 20 so that the through electrodes 45 of the through electrode substrate 40 contact the terminals 51 of the element 50. For example, the through electrode substrate 40 is pressed toward the insulating layer 20 so that the through electrodes 45 of the through electrode substrate 40 penetrate the insulating layer 20 and contact the terminals 51 of the element 50. In this manner, the mounting substrate 1 shown in FIG. 9 can be obtained.

[0065] Although several modifications of the above-described embodiment have been described, it is of course possible to combine a plurality of modifications as appropriate. [Explanation of symbols]

[0066] 1 Mounting board 10. Receiving board 11 Page 1 12 Side 2 13 Recess 131 bottom 132 Wall 133 Stepped section 134 Penetration 20 insulating layer 21. Depression 25 Conductive layer 26 Part 1 27 Part 2 28 Part 3 30 Support substrate 35 electrodes 40 Through-hole electrode substrate 41 PCB 45 Through electrode 50 elements 51 terminals 53 Sensor section

Claims

[Claim 1] a receiving substrate including a first surface and a second surface located opposite to the first surface, a recess provided on the first surface side, and made of an organic material; an element located in the recess of the receiving substrate and having a terminal; an insulating layer that at least partially covers the receiving substrate and the element on the first surface side and is at least partially located in a gap between a wall surface of the recess of the receiving substrate and the element; a conductive layer having a first portion located on the insulating layer and a second portion penetrating the insulating layer and electrically connecting the first portion to the terminal of the element; the conductive layer further includes a third portion connected to the first portion and penetrating the insulating layer and the receiving substrate; a surface of the insulating layer including a recess that overlaps a gap between a wall surface of the recess and the element when viewed along a normal direction of the first surface of the receiving substrate.

Images