SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE DETECTION METHOD

Abstract

To provide a technique that makes it possible to make detection with sufficient accuracy even in an environment where liquids are handled.SOLUTION: A substrate processing device includes a conveyance unit for conveying a substrate 9, a liquid processing unit for supplying the substrate 9 that is conveyed by the conveyance unit with liquid, and a sensor unit 4 for detecting the substrate 9 to which the liquid is supplied. The sensor unit 4 includes a sensor part 41 and a droplet removal part 42. The sensor part 41 includes a light-projection portion 411 that projects detection light toward the substrate 9 and a light-receiving portion 412 that receives the detection light projected from the light-emitting portion. The droplet removal part 42 is provided by corresponding to the sensor part 41 and locally removes droplets of an irradiation area K1 irradiated with the detection light projected from the corresponding light-projection portion of the sensor part 41.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present application relates to a substrate processing apparatus and a substrate detection method. [Background technology]

[0002] For example, Patent Document 1 discloses a substrate processing apparatus that cleans a substrate by transporting the substrate using rollers and supplying a cleaning liquid to the substrate being transported. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-160586 Summary of the Invention [Problem to be solved by the invention]

[0004] In many substrate processing apparatuses, sensors are provided at appropriate positions, and various controls are performed based on detection information from the sensors. For example, in the substrate processing apparatus described in Patent Document 1, a sensor provided near a roller detects the presence or absence of a substrate, and controls are performed based on the detection information.

[0005] There are various types of sensors, and an appropriate sensor is selected depending on the usage environment, etc. For example, in a substrate processing apparatus that handles thin substrates, a contact-type sensor that detects the substrate by contacting it may damage the substrate, so it is preferable to use a non-contact-type sensor that detects the substrate without contacting it.

[0006] One type of non-contact sensor is a sensor (so-called photoelectric sensor) that detects an object by emitting detection light from a light-emitting unit toward the object and receiving the reflected light with a light-receiving unit.The use of a photoelectric sensor makes it possible to safely detect even a thin substrate without damaging it.

[0007] However, it has been found that in substrate processing equipment that handles liquids, the probability of false detection by photoelectric sensors increases. The inventors investigated the reason for this and discovered that the false detection is caused by liquid droplets adhering to the substrate. Specifically, if liquid droplets are present at a position on the surface of the substrate where light from the light-emitting unit is irradiated, the liquid droplets cause the light from the light-emitting unit to be diffusely reflected or scattered, and the light-receiving unit does not receive the expected amount of light. As a result, the presence of a substrate that is actually present cannot be detected, resulting in false detection.

[0008] The present application has been made in view of such problems, and its purpose is to provide a technology that can perform detection with a sufficiently high degree of accuracy even in an environment where liquid is handled. [Means for solving the problem]

[0009] A first aspect is a substrate processing apparatus including: a transport unit that transports a substrate; and a liquid processing unit that supplies a liquid to the substrate transported by the transport unit; provided in the liquid processing unit, a sensor unit that detects the substrate to which the liquid is being supplied, Underside of a sensor unit including a light-projecting unit that projects detection light toward a target object and a light-receiving unit that receives the detection light projected from the light-projecting unit; and a droplet removal unit that is provided in correspondence with the sensor unit and that locally removes droplets in an irradiation area that is irradiated with the detection light projected from the light-projecting unit of the corresponding sensor unit. The droplet removal unit includes a discharge unit that discharges a fluid toward the substrate, and removes the droplets from the irradiation area by pushing away the droplets with the fluid discharged from the discharge unit, and the range from which the droplets are removed by the droplet removal unit is not the entirety but a part of the substrate in a direction intersecting the transport direction of the substrate. do.

[0010] A second aspect is the substrate processing apparatus according to the first aspect, wherein the liquid processing section is configured to: The aforementioned Liquid supplied to the bottom do .

[0012] The third aspect is the first or second In the substrate processing apparatus according to the aspect of the present invention, the irradiation area is located at a position shifted from a discharge area on the substrate where the fluid discharged from the discharge unit reaches.

[0013] The fourth aspect is any one of the first to third aspects. In the substrate processing apparatus according to the aspect 1, the discharge unit is disposed upstream of the sensor unit in a transport direction of the substrate, and discharges a fluid from the upstream side to the downstream side in the transport direction.

[0014] The fifth aspect is the first to fourth aspects. A substrate processing apparatus according to any one of the above aspects, wherein the transport unit transports the substrate in an inclined position, and the discharge unit is positioned on the high end side of the inclination direction of the substrate relative to the sensor unit, and discharges a fluid in a direction from the high end side to the low end side of the inclination direction.

[0015] The sixth aspect is the first to fifth aspects. In the substrate processing apparatus according to any one of the above aspects, the fluid discharged from the discharge part is a liquid.

[0016] The seventh aspect is a combination of the first to fifth aspects. In the substrate processing apparatus according to any one of the above aspects, the fluid discharged from the discharge part is a gas.

[0020] No. 8 The embodiment of In the liquid processing section A substrate detection method for detecting a substrate to which a liquid is supplied while being transported, comprising: In the liquid processing section, The substrate Underside of a droplet removal step of locally removing droplets in an irradiation area where the detection light is irradiated; In the liquid processing section, a detection step of detecting the substrate by receiving detection light projected toward the irradiation area. In the droplet removal step, the droplets are removed from the irradiation area by pushing away the droplets with a fluid ejected from an ejection unit that ejects the fluid toward the substrate, and the range from which the droplets are removed in the droplet removal step is not the entirety but a part of the substrate in a direction intersecting the transport direction of the substrate. do. [Effects of the Invention]

[0021] According to the first aspect, the droplets in the irradiation area where the detection light is irradiated are removed by the droplet removal unit, which sufficiently reduces the possibility of false detection, thereby enabling detection with sufficiently high accuracy even in an environment where liquid is handled. Furthermore, the fluid ejected from the ejection portion washes away the droplets, so that the droplets in the irradiated area can be sufficiently removed.

[0022] In the second mode, liquid is supplied to the underside of the substrate being transported, and detection light is projected onto the underside. The liquid supplied to the underside of the substrate is likely to form droplets due to gravity, making false detection particularly likely to occur in such a situation. However, the droplets in the irradiation area where the detection light is irradiated are removed by the droplet removal unit, so false detection is sufficiently avoided.

[0024] Third According to this aspect, the detection light is irradiated at a position shifted from the discharge area. In the discharge area, there is a possibility that the wavefront may be disturbed due to the impact when the fluid discharged from the discharge unit reaches the substrate. By setting the irradiation area where the detection light is irradiated at a position shifted from the discharge area, for example, it is less likely that the disturbance in the wavefront will cause diffuse reflection, which will reduce the detection accuracy of the sensor unit.

[0025] Fourth According to the above aspect, it is possible to prevent a situation in which droplets swept away by the fluid discharged from the discharge portion flow back and re-enter the irradiation area.

[0026] No. 5 According to this aspect, the fluid discharged from the discharge portion flows with sufficient force, so that droplets in the irradiation area can be sufficiently removed.

[0027] No. 6 According to the aspect (3), since the fluid discharged from the discharge portion is a liquid, the droplets can be washed away by the liquid flow and sufficiently removed from the irradiation area.

[0028] Seventh According to this aspect, since the fluid discharged from the discharge portion is a gas, the droplets can be swept away by the air current and sufficiently removed from the irradiation area.

[0032] No. 8 According to this aspect, the droplets in the irradiation area where the detection light is irradiated are removed in the droplet removal step, so the possibility of false detection is sufficiently reduced, and therefore detection can be performed with sufficiently high accuracy even in an environment where liquid is handled. Furthermore, the fluid ejected from the ejection portion washes away the droplets, so that the droplets in the irradiated area can be sufficiently removed. [Brief explanation of the drawings]

[0033] [Figure 1] FIG. 1 is a plan view schematically showing a configuration of a substrate processing system. [Figure 2] FIG. 2 is a block diagram showing the configuration of a control unit. [Figure 3] FIG. 2 is a side view schematically showing the configuration of the cleaning device. [Figure 4] FIG. 2 is a side view schematically illustrating the configuration of the developing device. [Figure 5] FIG. 2 is a diagram illustrating a roller conveyance mechanism. [Figure 6] FIG. 4 is a side view of the sensor unit as seen from one side in the conveying direction. [Figure 7] 1A is a side view of the sensor unit as seen from one side in the width direction, and FIG. 1B is a plan view as seen along the normal direction of the main surface of the substrate being transported. [Figure 8] FIG. 10 is a plan view illustrating variations in the arrangement position of the nozzles. [Figure 9] FIG. 10 is a side view illustrating variations in the arrangement position of the nozzles. [Figure 10] 1A and 1B are a side view of a sensor unit according to a first modified example, as seen from the downstream side in the transport direction, and a perspective view thereof as seen obliquely from above. [Figure 11] 10A and 10B are side views for explaining variations in the arrangement position of the auxiliary obstruction portion. [Figure 12] FIG. 10 is a side view of a sensor unit according to a second modified example, viewed from one side in the transport direction. [Figure 13] FIG. 10 is a side view schematically showing the configuration of a cleaning device provided with a sensor unit according to a modified example. [Figure 14] FIG. 10 is a side view of a sensor unit according to a modified example, viewed from one side in the transport direction. [Figure 15] FIG. 10 is a side view of a sensor unit according to a modified example, viewed from one side in the transport direction. DETAILED DESCRIPTION OF THE INVENTION

[0034] Hereinafter, embodiments will be described with reference to the accompanying drawings. Note that the components described in the embodiments are merely examples and are not intended to limit the scope of the present disclosure. Furthermore, in the drawings, the dimensions or number of each part may be exaggerated or simplified as necessary for ease of understanding.

[0035] Unless otherwise specified, expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only express the exact positional relationship but also express a state of relative displacement in terms of angle or distance within a range that provides tolerance or equivalent functionality. Furthermore, expressions indicating an equal state (e.g., "identical," "equal," "homogeneous," etc.) not only express a state of strict quantitative equality but also express a state of difference that provides tolerance or equivalent functionality, unless otherwise specified. Furthermore, expressions indicating shape (e.g., "circular," "square," "cylindrical," etc.) not only express a strict geometrical shape but also express a shape within a range that provides equivalent functionality, such as irregularities or chamfers, unless otherwise specified. Furthermore, expressions such as "comprise," "include," "have," "include," and "have" regarding components are not exclusive expressions that exclude the presence of other components. Furthermore, the expression "at least one of A, B, and C" includes "A only," "B only," "C only," "any two of A, B, and C," and "all of A, B, and C."

[0036] <1. Overall configuration of the substrate processing system> The overall configuration of the substrate processing system 1 will be described with reference to Fig. 1. Fig. 1 is a plan view schematically showing an example of the overall configuration of the substrate processing system 1.

[0037] The substrate processing system 1 is a system (coater-developer system) that performs coating and developing processes on a substrate. The substrate to be processed is, for example, a rectangular glass substrate used in a liquid crystal display device, but is not limited to this.

[0038] The substrate processing system 1 includes a plurality of substrate processing apparatuses (specifically, a cleaning apparatus 11, a dehydration bake apparatus 12, a coating-related apparatus 13, a pre-bake apparatus 14, a developing apparatus 15, a post-bake apparatus 16, etc.). The substrate processing system 1 also includes an indexer unit 101 connected to one side of the plurality of substrate processing apparatuses 11-16, and an exposure apparatus 102 connected to the other side of the plurality of substrate processing apparatuses 11-16 via an interface unit (not shown).

[0039] The indexer section 101 is provided with, for example, a plurality of placement units, and a substrate storage container (cassette) for storing a plurality of substrates is placed on each placement unit. The indexer section 101 also has an indexer robot as a substrate transport means. The indexer robot takes out unprocessed substrates from the cassettes placed on the placement units and transports them to a predetermined substrate processing apparatus (here, cleaning apparatus 11). The indexer robot also takes out processed substrates from a predetermined substrate processing apparatus (here, post-bake apparatus 16) and stores them in a cassette.

[0040] The outbound line from the indexer unit 101 to the exposure device 102 is arranged in this order: a cleaning device 11 that performs a cleaning process on substrates; a dehydration bake device 12 that heats and dehydrates substrates (dehydration bake process); a coating-related device 13 that performs various processes (coating-related processes) including a resist coating process; and a pre-bake device 14 that heats substrates. On this outbound line, first, at the indexer unit 101, an indexer robot takes out a substrate stored in a cassette and transports it to the cleaning device 11. The substrate 9 transported into the cleaning device 11 undergoes a cleaning process. The substrate that has undergone the cleaning process is then transported to the dehydration bake device 12, where it undergoes a dehydration bake process. The substrate that has undergone the dehydration bake process is then transported to the coating-related device 13, where it undergoes a coating-related process. The substrate that has undergone the coating-related process is then transported to the pre-bake device 14, where it undergoes a heating process. The substrate that has been subjected to the heat treatment is then carried into the exposure device 102, where it is subjected to exposure treatment.

[0041] On the other hand, on the return line from the exposure tool 102 to the indexer unit 101, a developing tool 15 that performs a development process on the substrate, a post-bake tool 16 that performs a heat process on the substrate, and so on are arranged in this order. On this return line, the substrate that has been subjected to the exposure process in the exposure tool 102 is transported to the developing tool 15, where it is subjected to a development process. The substrate that has been subjected to the development process is then transported to the post-bake tool 16, where it is subjected to a heat process. The substrate that has been subjected to the heat process is taken out by the indexer robot of the indexer unit 101 and stored in a cassette.

[0042] The multiple substrate processing apparatuses 11-16 included in the substrate processing system 1 can be divided into two types. The first type is a substrate processing apparatus (flat flow processing apparatus) that processes substrates one by one while transporting them in one direction. For example, the cleaning apparatus 11 and the developing apparatus 15 correspond to this type of substrate processing apparatus. The second type is a substrate processing apparatus (simultaneous processing apparatus) that processes multiple substrates simultaneously. For example, the dehydration bake apparatus 12, the coating-related apparatus 13, the pre-bake apparatus 14, and the post-bake apparatus 16 correspond to this type of substrate processing apparatus. Note that "simultaneous processing" as used here does not only refer to cases where the processing periods for the processing of multiple substrates are completely the same, but also includes cases where the processing periods for each substrate overlap at least partially.

[0043] The substrate processing system 1 includes a control unit 17 that controls various operations performed therein (such as processing operations performed in the substrate processing apparatuses 11-16 and substrate transport operations between the substrate processing apparatuses 11-16). The control unit 17 is configured, for example, by a general computer having electric circuits. Specifically, as shown in FIG. 2, the control unit 17 includes a CPU (Central Processor Unit) 171 as a central processing unit responsible for data processing, a ROM (Read Only Memory) 172 in which basic programs and the like are stored, a RAM (Random Access Memory) 173 used as a working area when the CPU 171 performs predetermined processing (data processing), a storage device 174 configured by a nonvolatile storage device such as a flash memory or a hard disk drive, and a bus line 175 that interconnects these components.

[0044] The storage device 174 stores a program P that defines the processing to be executed by the control unit 17. When the CPU 171 executes this program P, various functional units are realized in the control unit 17, and the control unit 17 can execute the processing defined by the program P. The program P may be stored in a recording medium, or may be installed in the control unit 17 (specifically, the computer that constitutes the control unit 17) using the recording medium. However, some or all of the functional units realized in the control unit 17 may be realized by hardware such as a dedicated logic circuit.

[0045] An input unit 176, a display unit 177, a communication unit 178, and the like may be further connected to the bus line 175 of the control unit 17. The input unit 176 is composed of various switches, a touch panel, and the like, and receives various input instructions from an operator. The display unit 177 is composed of a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 171. The communication unit 178 realizes data communication via, for example, a LAN (Local Area Network) or the like.

[0046] The control unit 17 may be configured such that a main control unit that controls the overall operation of the substrate processing system 1 is communicably connected to a plurality of local control units. In this case, at least one local control unit may be associated with each of the substrate processing apparatuses 11 to 16, and the local control unit may control the operation of the corresponding substrate processing apparatus based on instructions from the main control unit. Furthermore, when such a configuration is adopted, the main control unit and each local control unit may each individually include some or all of the above-mentioned units 171 to 178.

[0047] 2. Configuration of the flat flow treatment device and the location of the sensor unit At least one of the substrate processing apparatuses 11 to 16 included in the substrate processing system 1 is provided with a sensor unit 4. Specifically, the sensor unit 4 is used to detect the substrate 9 being transported in, for example, a flat flow processing apparatus. Before describing the specific configuration of the sensor unit 4, examples of the configuration of the cleaning apparatus 11 and the developing apparatus 15, which are one embodiment of the flat flow processing apparatus, will be described to explain the preferred installation position of the sensor unit 4.

[0048] <2-1. Cleaning device 11> (a) Equipment configuration First, an example of the configuration of the cleaning device 11 will be described with reference to Fig. 3 and Fig. 5. Fig. 3 is a diagram schematically showing an example of the configuration of the cleaning device 11. Fig. 5 is a diagram for explaining the roller conveyance mechanism 21.

[0049] Cleaning apparatus 11 is a substrate processing apparatus that cleans substrates 9, and includes a substrate inlet section 2a, a first liquid processing section 2b, a second liquid processing section 2c, a liquid drainer section 2d, and a substrate outlet section 2e, arranged in this order along transfer direction D1. Each of these sections 2a to 2e is provided with a housing, and adjacent housings are connected via a transfer port (not shown) for passing substrates 9 through.

[0050] (Substrate introduction section 2a) The substrate introduction section 2a receives the substrate 9 from the indexer robot provided in the indexer section 101, and transports the substrate 9 to the first liquid processing section 2b.

[0051] A roller transport mechanism 21, which is a transport section for transporting the substrate 9, is provided in the substrate introduction section 2a.

[0052] Specifically, the roller conveyance mechanism 21 includes, for example, a plurality of roller shafts 211 arranged in the conveyance direction D1 and a plurality of rollers 212 fixed to each roller shaft 211. Each roller 212 is, for example, disk-shaped, and its center is fixed to the roller shaft 211. The plurality of roller shafts 211 are oriented so as to extend in a direction (width direction) D2 perpendicular to the conveyance direction D1, and are arranged in a line along the conveyance direction D1 at intervals. The plurality of roller shafts 211 may be arranged in any manner in such positions and orientations. For example, the plurality of roller shafts 211 may be installed between a pair of support plates 213 so as to be rotatable about their axes. Note that, when the plurality of roller shafts 211 are arranged in a line, it is also preferable to adjust the mounting positions of the rollers 212 so that the rollers 212 provided on each roller shaft 211 are arranged in a staggered pattern. The roller transport mechanism 21 also includes a drive unit (not shown) connected to each roller shaft 211. The drive unit includes, for example, a motor. When the drive unit rotates the multiple roller shafts 211 around their respective axes in the same direction at the same rotational speed (synchronous rotation), the rollers 212 fixed to each roller shaft 211 rotate, and the substrate 9 supported on the rollers 212 is transported in the arrangement direction of the roller shafts 211 (i.e., transport direction D1).

[0053] (First liquid processing section 2b) The first liquid processing section 2b cleans the substrate 9 (chemical cleaning) by supplying a chemical liquid to the substrate 9 while transporting the substrate 9.

[0054] The first liquid processing section 2b is provided with a roller transport mechanism 21 which is a transport section for transporting the substrate 9. The configuration of the roller transport mechanism 21 is similar to that of the roller transport mechanism 21 provided in the substrate introduction section 2a.

[0055] First liquid processing section 2b is provided with nozzle 22 that discharges a cleaning chemical liquid toward the upper surface of substrate 9 transported by roller transport mechanism 21. Nozzle 22 is connected to chemical liquid tank T1 that stores the chemical liquid, for example, via supply pipe 222 having pump 221 and the like inserted therein. In this configuration, when pump 221 is driven, the chemical liquid stored in chemical liquid tank T1 is supplied to nozzle 22 through supply pipe 222, and the chemical liquid is discharged from there toward the upper surface of substrate 9.

[0056] (Second liquid processing section 2c) The second liquid processing section 2c cleans the substrate 9 by supplying a cleaning liquid (for example, pure water as a cleaning liquid) to the substrate 9 while transporting the substrate 9.

[0057] The second liquid processing section 2c is provided with a roller transport mechanism 21 which is a transport section for transporting the substrate 9. The configuration of the roller transport mechanism 21 is similar to that of the roller transport mechanism 21 provided in the substrate introduction section 2a.

[0058] In second liquid processing section 2c, first section P1, which is arranged on the most upstream side in transport direction D1, is provided with nozzle 23a that ejects pure water as a cleaning liquid toward the upper main surface (upper surface) of substrate 9 transported by roller transport mechanism 21, and nozzle 23b that ejects the cleaning liquid toward the lower main surface (lower surface) of substrate 9. Each nozzle 23a, 23b is connected to cleaning liquid tank T2 that stores the cleaning liquid via supply pipe 232 in which low-pressure pump 231 or the like is inserted. In this configuration, when low-pressure pump 231 is driven, the cleaning liquid stored in cleaning liquid tank T2 is supplied to each nozzle 23a, 23b through supply pipe 232, and the cleaning liquid is ejected at low pressure from each nozzle 23a, 23b toward the upper or lower surface of substrate 9.

[0059] A nozzle 24 is provided in the second section P2, which is located downstream of the first section P1, and which ejects pure water as a cleaning liquid toward the upper surface of the substrate 9 being transported by the roller transport mechanism 21. The nozzle 24 is connected to the cleaning liquid tank T2 via a supply pipe 242 having a high-pressure pump 241 or the like inserted therein. In this configuration, when the high-pressure pump 241 is driven, the cleaning liquid stored in the cleaning liquid tank T2 is supplied to the nozzle 24 through the supply pipe 242, and the cleaning liquid is ejected from the nozzle 24 at high pressure toward the upper surface of the substrate 9.

[0060] A third section P3, which is disposed downstream of the second section P2, is provided with a nozzle 25 that applies ultrasonic vibrations to pure water as a cleaning liquid and discharges the liquid toward the upper surface of the substrate 9 being transported by the roller transport mechanism 21. The nozzle 25 is provided with an ultrasonic vibrator that applies the ultrasonic vibrations. The nozzle 25 is also connected to a pure water supply line L1 via a supply pipe 252 having a pump 251 or the like inserted therein. In this configuration, when the pump 251 is driven, pure water is supplied to the nozzle 25 through the supply pipe 252, and the cleaning liquid (ultrasonic cleaning liquid) to which the ultrasonic vibrations have been applied is discharged toward the upper surface of the substrate 9.

[0061] A fourth section P4, which is disposed downstream of the third section P3, is provided with a nozzle 26a that ejects pure water as a cleaning liquid toward the upper surface of the substrate 9 transported by the roller transport mechanism 21, and a nozzle 26b that ejects the cleaning liquid toward the lower surface of the substrate 9. Each of the nozzles 26a, 26b is connected to a pure water supply line L1 via, for example, a supply pipe 262 having a pump 261 or the like inserted therein. In this configuration, when the pump 261 is driven, pure water is supplied to each of the nozzles 26a, 26b through the supply pipe 262, and the cleaning liquid is ejected from each of the nozzles 26a, 26b toward the upper or lower surface of the substrate 9.

[0062] (Draining section 2d) Liquid drainer 2d removes (drains) the liquid adhering to substrate 9 that has been liquid-treated by second liquid processing section 2c.

[0063] The drainer 2d is provided with a roller transport mechanism 21, which is a transport unit that transports the substrate 9. The configuration of the roller transport mechanism 21 is similar to that of the roller transport mechanism 21 provided in the substrate introduction unit 2a.

[0064] The drainer 2d is provided with gas knives 27 that spray a predetermined gas (e.g., dry air, clean air, nitrogen gas, etc.) at high pressure toward the upper and lower surfaces of the substrate 9 transported by the roller transport mechanism 21. Each gas knife 27 is connected to a supply line L2 for the predetermined gas via, for example, a supply pipe 272 having a valve 271 or the like inserted therein. In this configuration, when the valve 271 is opened, the predetermined gas is supplied to each gas knife 27 through the supply pipe 272, and the predetermined gas is sprayed at high pressure from each gas knife 27 toward the upper or lower surface of the substrate 9. This blows away the cleaning liquid adhering to the surface of the substrate 9, and the surface of the substrate 9 is dried.

[0065] (Board lead-out part 2e) The substrate delivery section 2e receives the substrate 9 from the drainer section 2d and transports the substrate 9 to a subsequent substrate processing apparatus (here, a dehydration bake apparatus 12).

[0066] The substrate discharge section 2e is provided with a roller conveyance mechanism 21, which is a conveyance section that conveys the substrate 9. The configuration of the roller conveyance mechanism 21 is similar to that of the roller conveyance mechanism 21 provided in the substrate introduction section 2a.

[0067] Note that the substrate 9 may be transported in an inclined position in at least a part of the cleaning apparatus 11. That is, a transport section provided in at least one of the multiple sections 2a to 2e of the cleaning apparatus 11 may be an inclined roller transport mechanism 21d that transports the substrate 9 in an inclined position. The configuration of the inclined roller transport mechanism 21d is almost the same as that of the roller transport mechanism 21. That is, the inclined roller transport mechanism 21d includes a plurality of roller shafts 211 arranged in the transport direction D1, a plurality of rollers 212 fixed to each roller shaft 211, and a drive section (not shown) connected to each roller shaft 211. However, in the inclined roller transport mechanism 21d, for example, a pair of support plates 213, 213 on which the multiple roller shafts 211 are mounted are arranged at different heights, so that the multiple roller shafts 211 are inclined in the width direction D2, and when the multiple roller shafts 211 (and thus the rollers 212 fixed to each roller shaft 211) are rotated, the substrate 9 supported on the rollers 212 is transported in the transport direction D1 in an inclined position. For example, if the transport units provided in the first liquid processing unit 2b and the second liquid processing unit 2c are each inclined roller transport mechanism 21d, the cleaning liquid is supplied to the substrate 9 while it is transported in an inclined position. With this configuration, the cleaning liquid supplied to the substrate 9 does not stagnate on the main surface of the substrate 9 but efficiently flows down along the main surface, thereby efficiently proceeding with cleaning.

[0068] (b) Location of sensor unit 4 Sensor unit 4 is provided, for example, in second liquid processing section 2c. Specifically, sensor unit 4 is provided, for example, at a dispensing point of substrate 9 in second liquid processing section 2c, and detects the dispensed substrate 9. As will be apparent later, sensor unit 4 can perform detection with sufficiently high accuracy even in an environment where liquid is handled, such as second liquid processing section 2c.

[0069] In particular, in second liquid processing section 2c, liquid is supplied to the underside of substrate 9 being transported. As will be apparent later, sensor unit 4 projects detection light toward the underside of substrate 9 being transported, and in second liquid processing section 2c, the liquid supplied to the underside of substrate 9 is likely to form droplets due to gravity, making false detection particularly likely to occur. As will be apparent later, sensor unit 4 is unlikely to cause false detection even when used in such an environment.

[0070] <2-2. Developing device 15> (a) Equipment configuration Next, an example of the configuration of the developing device 15 will be described with reference to Figs. 4 and 5. Fig. 4 is a diagram schematically showing an example of the configuration of the developing device 15. Fig. 5 is a diagram for explaining the roller conveyance mechanism 31 and the tilting mechanism 33.

[0071] Developing device 15 is a substrate processing apparatus that performs a developing process on substrates 9, and includes a first liquid processing unit 3a, a position changing unit 3b, a second liquid processing unit 3c, a third liquid processing unit 3d, a liquid draining unit 3e, and a position restoring unit 3f, arranged in this order along transport direction D1. Each of these units 3a to 3f is provided with a housing, and adjacent housings are connected via a transfer port (not shown) for passing substrates 9. As with cleaning device 11, developing device 15 may also have a substrate inlet unit provided upstream of first liquid processing unit 3a in transport direction D1, and a substrate outlet unit provided downstream of position restoring unit 3f in transport direction D1.

[0072] (First liquid processing section 3a) The first liquid processing section 3a transports the substrate 9 while supplying the developing liquid to the transported substrate 9, thereby causing the development process to proceed.

[0073] The first liquid processing section 3a is provided with a roller transport mechanism 31, which is a transport section that transports the substrate 9. The configuration of the roller transport mechanism 31 is similar to that of the roller transport mechanism 21 described in the cleaning device 11. That is, the roller transport mechanism 31 includes a plurality of roller shafts 311 arranged in the transport direction D1, a plurality of rollers 312 fixed to each roller shaft 311, and a drive section (not shown) connected to each roller shaft 311.

[0074] The first liquid processing section 3a is provided with a nozzle 32 that supplies developer to the upper surface of the substrate 9 transported by the roller transport mechanism 31, forming a liquid layer of developer on the upper surface. Specifically, the nozzle 32 is, for example, a long slit nozzle extending in a direction (width direction) D2 perpendicular to the transport direction D1, and supplies developer in a curtain-like manner across the entire width direction D2 of the transported substrate 9. The nozzle 32 is connected to a developer storage section T3 that stores developer via a supply pipe 322 having a pump 321 or the like inserted therein. In this configuration, when the pump 321 is driven, the developer stored in the developer storage section T3 is supplied to the nozzle 32 through the supply pipe 322, and the developer is supplied from there to the upper surface of the substrate 9. As a result, a liquid layer of developer is formed on the upper surface of the substrate 9. Thereafter, a development process progresses on the upper surface of the substrate 9 while the substrate 9 is transported by the roller transport mechanism 31.

[0075] (Posture change unit 3b) The attitude changing unit 3b changes the attitude of the substrate 9, which has received the supply of the developing solution in the first liquid processing unit 3a, from a horizontal attitude to an inclined attitude.

[0076] The attitude changing section 3b is provided with a roller transport mechanism 31 which is a transport section that transports the substrate 9. The configuration of the roller transport mechanism 31 is similar to that of the roller transport mechanism 31 provided in the first liquid processing section 3a.

[0077] The roller conveyance mechanism 31 of the attitude changing unit 3b is provided with a tilting mechanism 33 that tilts the roller conveyance mechanism 31. The tilting mechanism 33 is a mechanism that tilts the roller conveyance mechanism 31 to switch the attitude of the substrate 9 supported on the rollers 312 between a horizontal attitude and an inclined attitude.

[0078] Specifically, the tilting mechanism 33 includes a rotating shaft 331 disposed in the roller conveying mechanism 31 in a position extending along the conveying direction D1. Specifically, the rotating shaft 331 is fixed, via a fixing member 332, to one of a pair of support plates 313, 313 on which the plurality of roller shafts 311 are mounted. The tilting mechanism 33 also includes a lifting jig 333 fixed to the support plate 313 on the side where the rotating shaft 331 is not disposed, and a driving unit 334 that raises and lowers the lifting jig 333. The driving unit 334 includes, for example, an air cylinder. In this configuration, when the lifting jig 333 is disposed in a predetermined lowered position, the pair of support plates 313, 313 are disposed at the same height. At this time, the plurality of roller shafts 311 are horizontal in the width direction D2. Therefore, the substrate 9 supported on the rollers 312 is also horizontal. On the other hand, when the drive unit 334 raises the lifting jig 333 to a predetermined raised position, the support plate 313 to which it is fixed rises. As a result, the plurality of roller shafts 311 rotate around the rotation shaft unit 331, and the plurality of roller shafts 311 assume an inclined posture inclined in the width direction D2. Therefore, the substrate 9 supported on the rollers 312 also assumes an inclined posture. In this way, in the tilting mechanism 33, the drive unit 334 switches the position of the lifting jig 333, so that the posture of the substrate 9 supported on the rollers 312 is switched between an inclined posture and a horizontal posture.

[0079] In the attitude changer 3b, the attitude of the substrate 9 is switched from a horizontal attitude to an inclined attitude. That is, the substrate 9 that is carried in the horizontal attitude from the first liquid processor 3a is changed to an inclined attitude in the attitude changer 3b and then carried into the second liquid processor 3c.

[0080] (Second liquid processing section 3c) The second liquid processing section 3c supplies a cleaning liquid to the substrate 9 while transporting the substrate 9, thereby replacing the developing liquid supplied to the substrate 9 with the cleaning liquid.

[0081] The second liquid processing section 3c is provided with an inclined roller transport mechanism 31d, which is a transport unit that transports the substrate 9 in an inclined position. The configuration of the inclined roller transport mechanism 31d is similar to that of the inclined roller transport mechanism 21d described in the cleaning apparatus 11. That is, the inclined roller transport mechanism 31d includes multiple roller shafts 311 arranged in the transport direction D1, multiple rollers 312 fixed to each roller shaft 311, and a drive unit (not shown) connected to each roller shaft 311. However, in the inclined roller transport mechanism 31d, for example, a pair of support plates 313, 313 on which the multiple roller shafts 311 are mounted are arranged at different heights, so that the multiple roller shafts 311 are in an inclined position inclined in the width direction D2. The inclined roller transport mechanism 31d may be realized by including a roller transport mechanism 31 and a tilting mechanism 33 connected thereto.

[0082] The second liquid processing section 3c is provided with a nozzle 34a that dispenses a cleaning liquid (e.g., pure water as the cleaning liquid) toward the upper surface of the substrate 9 transported in an inclined position by the inclined roller transport mechanism 31d, and a nozzle 34b that dispenses the cleaning liquid toward the lower surface of the substrate 9. Each of the nozzles 34a, 34b is connected to a cleaning liquid tank T4 that stores the cleaning liquid via a supply pipe 342 having a pump 341 or the like inserted therein. In this configuration, when the pump 341 is driven, the cleaning liquid stored in the cleaning liquid tank T4 is supplied to each of the nozzles 34a, 34b through the supply pipe 342, and the cleaning liquid is dispensed from each of the nozzles 34a, 34b toward the upper or lower surface of the substrate 9. As a result, the developing liquid present on the substrate 9 is replaced with the cleaning liquid, and the development process stops. In particular, since the cleaning liquid is supplied to the substrate 9 while it is transported in an inclined position, the replacement with the cleaning liquid proceeds efficiently.

[0083] (Third liquid processing section 3d) The third liquid processing section 3d cleans the substrate 9 by supplying a cleaning liquid to the substrate 9 while transporting the substrate 9.

[0084] The third liquid processing section 3d is provided with an inclined roller transport mechanism 31d, which is a transport section that transports the substrate 9 in an inclined position. The configuration of the inclined roller transport mechanism 31d is similar to that of the inclined roller transport mechanism 31d provided in the second liquid processing section 3c.

[0085] The third liquid processing section 3d is provided with a nozzle 35a that ejects a cleaning liquid (e.g., pure water as the cleaning liquid) toward the upper surface of the substrate 9 transported in an inclined position by the inclined roller transport mechanism 31d, and a nozzle 35b that ejects the cleaning liquid toward the lower surface of the substrate 9. Of the nozzles 35a and 35b, the one arranged relatively upstream is connected to a cleaning liquid tank T4 that stores the cleaning liquid via, for example, a supply pipe 352 having a pump 351 or the like inserted therein. Furthermore, of the nozzles 35a and 35b, the one arranged relatively downstream is connected to a pure water supply line L1 via, for example, a supply pipe 354 having a pump 353 or the like inserted therein. In this configuration, when the pumps 351, 353 are driven, the cleaning liquid stored in the cleaning liquid tank T4 or the pure water supplied from the pure water supply line L1 is supplied to the nozzles 35a, 35b through the supply pipes 352, 354, and the cleaning liquid is ejected from the nozzles 35a, 35b toward the upper or lower surface of the substrate 9. This cleans the substrate 9. Here too, the cleaning liquid is supplied to the substrate 9 while it is being transported in an inclined position, so cleaning proceeds efficiently.

[0086] (Draining section 3e) The liquid draining section 3e removes (drains) the liquid adhering to the substrate 9 that has been liquid-treated by the third liquid processing section 3d.

[0087] The liquid draining section 3e is provided with an inclined roller transport mechanism 31d, which is a transport section that transports the substrate 9 in an inclined position. The configuration of the inclined roller transport mechanism 31d is similar to that of the inclined roller transport mechanism 31d provided in the second liquid processing section 3c.

[0088] The drainer 3e is provided with gas knives 36 that spray a predetermined gas (e.g., dry air, clean air, nitrogen gas, etc.) at high pressure toward the upper and lower surfaces of the substrate 9 transported in an inclined position by the inclined roller transport mechanism 31d. Each gas knife 36 is connected to a supply line L2 for the predetermined gas via, for example, a supply pipe 362 having a valve 361 or the like inserted therein. In this configuration, when the valve 361 is opened, the predetermined gas is supplied to each gas knife 36 through the supply pipe 362, and the predetermined gas is sprayed at high pressure from each gas knife 36 toward the upper or lower surface of the substrate 9. This blows away the cleaning liquid adhering to the surface of the substrate 9, and the surface of the substrate 9 is dried.

[0089] (Posture recovery section 3f) The attitude restoring unit 3f changes the attitude of the substrate 9, from which the liquid has been drained by the drainer 3e, from an inclined attitude to a horizontal attitude.

[0090] The orientation recovery unit 3f is provided with a roller transport mechanism 31, which is a transport unit that transports the substrate 9. The roller transport mechanism 31 is also provided with a tilting mechanism 33. The configuration of the roller transport mechanism 31 is the same as that of the roller transport mechanism 31 provided in the first liquid processing unit 3a, and the configuration of the tilting mechanism 33 is the same as that of the tilting mechanism 33 provided in the orientation changing unit 3b.

[0091] In the attitude restoring section 3f, the attitude of the substrate 9 is switched from an inclined attitude to a horizontal attitude. That is, the substrate 9, which has been carried in an inclined attitude from the liquid draining section 3e, is brought to a horizontal attitude in the attitude restoring section 3f and then carried into the post-bake unit 16.

[0092] (b) Location of sensor unit 4 The sensor unit 4 is provided in, for example, each of the liquid processing sections 3a, 3c, and 3d. Specifically, for example, the sensor unit 4 is provided in the first liquid processing section 3a at a dispensing point for the substrate 9 to detect the dispensed substrate 9. The sensor unit 4 is provided in the second liquid processing section 3c at the loading point for the substrate 9, at a midpoint on the transport path for the substrate 9, and at the dispensing point for the substrate 9 to detect the substrate 9 at each point. The sensor unit 4 is provided in the third liquid processing section 3d at a midpoint on the transport path for the substrate 9 and at the dispensing point for the substrate 9 to detect the substrate 9 at each point. As will be apparent later, the sensor unit 4 can perform detection with sufficiently high accuracy even in an environment where liquid is handled, such as in the liquid processing sections 3a, 3c, and 3d.

[0093] In particular, in second liquid processing section 3c and third liquid processing section 3d, liquid is supplied to the underside of substrate 9 being transported. As will be apparent later, sensor unit 4 projects detection light toward the underside of substrate 9 being transported, and in these liquid processing sections 3c and 3d, the liquid supplied to the underside of substrate 9 is likely to form droplets due to gravity, making false detection particularly likely to occur. As will be apparent later, sensor unit 4 is unlikely to cause false detection even when used in such an environment.

[0094] On the other hand, in first liquid processing section 3a, liquid is not supplied to the underside of substrate 9 being transported. However, in position changer 3b, which is provided next to the dispensing point of substrate 9 in first liquid processing section 3a, substrate 9 is changed from a horizontal position to an inclined position, and at that time, the liquid supplied to the upper surface of substrate 9 may flow around to the underside and drip down, which may cause erroneous detection at the dispensing point of substrate 9 in first liquid processing section 3a. As will be apparent later, sensor unit 4 is unlikely to cause erroneous detection even when used in such an environment.

[0095] <3. Configuration of Sensor Unit 4> The specific configuration of the sensor unit 4 will be described with reference to Figs. 3 and 4 as well as Figs. 6 to 9. Fig. 6 is a side view of the sensor section 41 as seen from one side in the transport direction D1. Fig. 7 is a side view (Fig. 7(a)) of the sensor unit 4 as seen from one side in the width direction D2, and Fig. 7(b) is a plan view (Fig. 7(b)) as seen along the normal direction to the main surface of the substrate 9 being transported. Fig. 8 is a plan view for explaining variations in the arrangement position of the nozzle 421. Fig. 9 is a side view for explaining variations in the arrangement position of the nozzle 421.

[0096] The sensor unit 4 detects the substrate 9 to which liquid is being supplied. Specifically, for example, the sensor unit 4 detects the substrate 9 being transported in a liquid processing section (for example, the second liquid processing section 2c of the cleaning device 11 and the liquid processing sections 3a, 3c, and 3d of the developing device 15) where liquid processing is performed to supply liquid to the substrate 9 being transported.

[0097] The sensor unit 4 includes a sensor section 41 and a droplet removal section .

[0098] (Sensor unit 41) The sensor unit 41 is a photoelectric sensor that detects a detection target using light, and includes a light-projecting unit 411 and a light-receiving unit 412. The light-projecting unit 411 is an element that projects detection light toward the detection target, and specifically includes, for example, a light-emitting element. The light-receiving unit 412 is an element that receives the detection light projected from the light-projecting unit 411 and detects the amount of light, and specifically includes, for example, a light-receiving element. The sensor unit 41 is, for example, a reflective sensor, and in this case, the light-projecting unit 411 and the light-receiving unit 412 are disposed on the same side of the detection target, and the light projected from the light-projecting unit 411 and reflected by the detection target (reflected light) is received by the light-receiving unit 412. The detection light projected from the light-projecting unit 411 may be any light, and for example, laser light can be used.

[0099] Here, the object to be detected by sensor unit 41 is substrate 9 being transported, and light projecting unit 411 is disposed at a position lower than the transport surface along which substrate 9 is transported (specifically, the support surface of substrate 9 by rollers 212, 312), and projects detection light toward the underside of substrate 9. Hereinafter, the area on the underside of substrate 9 onto which the detection light is irradiated is also referred to as "irradiation area K1." Irradiation area K1 may be spot-shaped (point-shaped) or area-shaped.

[0100] When a substrate 9 is present on the rollers 212, 312, the detection light emitted from the light-emitting unit 411 is irradiated onto the underside of the substrate 9 and reflected therefrom, and the reflected light is received by the light-receiving unit 412. On the other hand, when a substrate 9 is not present on the rollers 212, 312, the detection light emitted from the light-emitting unit 411 travels straight and is not received by the light-receiving unit 412. The sensor unit 41 sends, for example, an output signal according to the amount of light received by the light-receiving unit 412 to the control unit 17 as detection information. The control unit 17 determines the presence or absence of the substrate 9 based on the detection information acquired from the sensor unit 41, and controls each unit according to the determination result.

[0101] (Droplet removal section 42) The droplet removal unit 42 is provided in correspondence with the sensor unit 41, and locally removes droplets in an area (irradiation area K1) irradiated with detection light projected from the light projecting unit 411 of the corresponding sensor unit 41. In other words, the droplet removal unit 42 is not provided for the overall removal of droplets present on the main surface of the substrate 9, but is provided for the removal of droplets from a local area including at least the irradiation area K1 of the corresponding sensor unit 41.

[0102] However, the droplets to be removed by droplet removal unit 42 are droplets large enough to cause false detection in sensor unit 41. In other words, droplet removal unit 42 does not need to be able to completely remove even minute droplets that are unlikely to cause false detection in sensor unit 41, or liquid that adheres to substrate 9 with a sufficiently small contact angle (i.e., to create a state in which the liquid has been completely removed).

[0103] The droplet removal unit 42 of this embodiment is equipped with a discharge unit D that discharges a predetermined fluid toward the substrate 9, and removes the droplets from the irradiation area K1 by pushing away the droplets with the fluid discharged from the discharge unit D.

[0104] Specifically, the discharge section D includes, for example, a nozzle 421 that discharges a fluid, and a fluid supply section 422 that supplies the fluid to the nozzle 421.

[0105] The fluid discharged from the nozzle 421 may be a liquid, a gas, or both a liquid and a gas (two fluids). For example, when the fluid discharged from the nozzle 421 is pure water, the fluid supply unit 422 includes a supply pipe 4221 connecting the nozzle 421 and the pure water supply line L1, a valve 4222 inserted in the supply pipe 4221, and the like (FIGS. 3 and 4). In this configuration, when the valve 4222 is opened, pure water is supplied to the nozzle 421 through the supply pipe 4221, and the pure water is discharged from the nozzle 421.

[0106] Nozzle 421 is disposed on the same side as sensor unit 41 (i.e., at a position lower than the transport surface along which substrate 9 is transported) with respect to substrate 9 (transported substrate 9), which is the object to be detected by sensor unit 41, and ejects a fluid (e.g., pure water) toward the lower surface of substrate 9. The ejected fluid reaches the lower surface of substrate 9 and flows along the lower surface.

[0107] If we call the range in which the fluid discharged from the nozzle 421 and reaching the substrate 9 flows with enough force to wash away droplets present on the underside of the substrate 9, that is, the range in which the discharged fluid effectively removes droplets, the "effective removal range K2," then the positional relationship between the nozzle 421 and the sensor unit 41, etc., is adjusted so that the irradiation area K1 is located within the effective removal range K2. By making such adjustments, the droplets present in the irradiation area K1 are washed away by the fluid discharged from the nozzle 421 and removed from the irradiation area K1.

[0108] The nozzle 421 may have any specific configuration. When the fluid to be ejected is a liquid, the nozzle 421 may be a spray nozzle that sprays the liquid in a mist (spray). The nozzle 421 may also eject the fluid in any shape. For example, as shown in FIG. 7, the nozzle 421 may be a nozzle that ejects the fluid in a fan shape (a so-called fan-shaped nozzle or fan-shaped spray). In this case, the fluid can be made to flow with sufficient force over a relatively wide area within the main surface of the substrate 9, so that droplets can be sufficiently removed from a relatively wide area. As shown in FIG. 8(a), the nozzle 421 may be a nozzle that ejects the fluid in a conical shape. In this case, the fluid can be made to flow over a sufficiently wide area within the main surface of the substrate 9, so that droplets can be removed from a relatively wide area. As shown in FIG. 8(b), the nozzle 421 may be a nozzle that ejects the fluid in a straight (linear) shape (a so-called straight nozzle). In this case, the fluid can be made to flow in a pinpoint area with a relatively strong force, so that droplets on the main surface of the substrate 9 can be removed with a sufficiently strong removal force.

[0109] 7 to 9, as long as the irradiation area K1 is positioned within the effective removal range K2, the nozzle 421 may be positioned anywhere around the sensor unit 41, and the attitude of the nozzle 421 may also be determined appropriately. Needless to say, the combinations of the nozzle 421 placement position and nozzle 421 shape (fluid discharge shape) exemplified in Figures 7 to 9 are merely examples, and these may be combined in any way.

[0110] For example, the nozzle 421 may be disposed at a position shifted from directly below the irradiation region K1 and may be tilted upward to approach the irradiation region K1 (FIGS. 7 to 9). With this configuration, the fluid ejected from the nozzle 421 flows with sufficient force in the irradiation region K1, making it possible to sufficiently remove the liquid in the irradiation region K1.

[0111] Furthermore, if the area on the underside of the substrate 9 where the fluid discharged from the nozzle 421 reaches (the landing area where the discharged fluid lands, if the discharged fluid is liquid) is referred to as the "discharge area K20," the positional relationship between the nozzle 421 and the sensor unit 41 may be specified so that the irradiation area K1 is positioned offset from this discharge area K20 (FIGS. 7 to 9). In the discharge area K20, the wavefront may be disturbed by the impact of the fluid discharged from the nozzle 421 when it reaches the substrate 9. By positioning the irradiation area K1 offset from the discharge area K20, it is less likely that the wavefront disturbance will reduce the detection accuracy of the sensor unit 41. However, the "offset position" here means that at least a portion of the irradiation area K1 is outside the discharge area K20. For example, when an area-shaped irradiation area K1 is formed, the irradiation area K1 and the discharge area K20 may be positioned offset from each other while partially overlapping each other.

[0112] Furthermore, the nozzle 421 may be disposed upstream of the sensor unit 41 in the transport direction D1, and may eject the fluid from the upstream side toward the downstream side in the transport direction D1. In this case, the ejection direction of the fluid may be along the transport direction D1 (FIG. 7) or may be a direction intersecting the transport direction D1 (FIG. 8(a)). This configuration prevents droplets swept away by the fluid ejected from the nozzle 421 from flowing back and re-entering the irradiation region K1.

[0113] Alternatively, the nozzle 421 may be disposed at the same position as the sensor unit 41 in the transport direction D1, that is, to the side of the sensor unit 41 in the width direction D2 (FIG. 8(b)). With this configuration, the distance between the sensor unit 41 and the nozzle 421, the inclination angle of the nozzle 421, and the like can be specified without being restricted by the arrangement pitch of the roller shafts 211, 311, thereby increasing the degree of freedom in design. In addition, it is relatively unlikely that droplets swept away by the fluid ejected from the nozzle 421 will flow back and re-enter the irradiation area K1.

[0114] Furthermore, when the substrate 9 is transported in an inclined position, the nozzle 421 may be disposed on the higher end side of the substrate 9 relative to the sensor unit 41 in the inclined direction, and may eject the fluid in a direction from the higher end side to the lower end side in the inclined direction. For example, when the substrate 9 is transported in an inclined position by the inclined roller transport mechanism 21d, 31d, the substrate 9 is transported in an inclined position inclined in the width direction D2. If the edge of the substrate 9 that is relatively higher in the width direction D2 is defined as the "high edge Q1" and the edge that is relatively lower in the width direction D2 is defined as the "low edge Q2" (see FIG. 12), the nozzle 421 may be disposed on the higher edge Q1 side relative to the sensor unit 41 in the width direction D2, and may be inclined in a direction approaching the lower edge Q2 as it extends upward, and may eject the fluid from the higher edge Q1 side to the lower edge Q2 side (FIG. 9). In this case, the fluid may be ejected in a direction along the width direction D2 (FIG. 8(b)), or in a direction intersecting the width direction D2 (FIG. 8(a)). With this configuration, the fluid ejected from the nozzle 421 flows with sufficient force, so that droplets in the irradiation area K1 can be sufficiently removed.

[0115] <4. Detection method> Next, the operation of the sensor unit 4 to detect the substrate 9 will be described with continued reference to FIGS.

[0116] In the sensor unit 4, a droplet removal step of removing droplets from the irradiation area K1 and a detection step of detecting the substrate 9 by irradiating the irradiation area K1 with light are carried out in parallel.

[0117] (Droplet removal process) In the droplet removal step, a fluid (e.g., pure water) is discharged from a discharge unit D (specifically, a nozzle 421) of the droplet removal unit 42 toward the lower surface of the substrate 9 being transported. The fluid discharged from the discharge unit D reaches the lower surface of the substrate 9, flows along the lower surface, and washes away the droplets in the irradiation region K1, thereby removing the droplets from the irradiation region K1.

[0118] (Detection process) In the detection process, the light-projecting unit 411 projects detection light, and the light-receiving unit 412 detects the amount of light received (amount of received light) and sends an output signal corresponding to the amount of received light as detection information to the control unit 17. If a substrate 9 to be transported is present, the detection light projected from the light-projecting unit 411 is irradiated onto the underside of the substrate 9 to be transported. Here, a droplet removal process is performed in parallel with the detection process, so that the irradiation area K1 onto which the detection light is irradiated is maintained in a state where no droplets are present. Therefore, the detection light is appropriately reflected without being affected by droplets. Therefore, a sufficient amount of light is detected by the light-receiving unit 412, and the occurrence of false detection due to droplets is sufficiently suppressed.

[0119] The control unit 17 determines the presence or absence of the substrate 9 based on the acquired detection information, and controls each unit according to the determination result. Specifically, for example, the control unit 17 controls the drive units of the roller conveyance mechanisms 21 and 31 according to the determination result. Also, for example, the control unit 17 controls the ejection timing of the cleaning liquid according to the determination result.

[0120] <5. Effects> The substrate processing apparatus (cleaning apparatus 11, developing apparatus 15) according to the above-described embodiment includes a transport unit (e.g., roller transport mechanisms 21, 31) that transports substrate 9, liquid processing units (e.g., second liquid processing unit 2c, first liquid processing unit 3a, second liquid processing unit 3c, third liquid processing unit 3d) that supply liquid to substrate 9 transported by the transport unit, and a sensor unit 4 that detects substrate 9 to which liquid has been supplied. Sensor unit 4 includes a sensor unit 41 that includes a light-projecting unit 411 that projects detection light toward substrate 9 and a light-receiving unit 412 that receives the detection light projected from light-projecting unit 411, and a droplet removal unit 42 that is associated with sensor unit 41 and locally removes droplets in irradiation area K1 irradiated with the detection light projected from the light-projecting unit 411 of the corresponding sensor unit 41. With this configuration, droplets in irradiation area K1 irradiated with the detection light are removed by droplet removal unit 42, sufficiently reducing the possibility of erroneous detection. Therefore, detection can be performed with a sufficiently high degree of accuracy even in an environment where liquid is handled.

[0121] Furthermore, in the above embodiment, the liquid processing units (e.g., second liquid processing unit 2c, second liquid processing unit 3c, third liquid processing unit 3d) supply liquid to the underside of substrate 9 being transported by the transport unit, and light projector 411 projects detection light toward the underside. Since the liquid supplied to the underside of substrate 9 is likely to form droplets due to gravity, false detection is particularly likely to occur in such a situation. However, since the droplets in irradiation area K1 irradiated with the detection light are removed by droplet remover 42, false detection is sufficiently avoided.

[0122] Furthermore, the droplet removal unit 42 according to the above embodiment includes a discharge unit D that discharges a fluid toward the substrate 9, and removes droplets from the irradiation area K1 by pushing away the droplets with the fluid discharged from the discharge unit D (specifically, the nozzle 421). With this configuration, the droplets are pushed away with the fluid discharged from the discharge unit D, so that the droplets in the irradiation area K1 can be sufficiently removed.

[0123] In particular, the irradiation area K1 may be positioned at a position displaced from the discharge area K20 on the substrate 9, where the fluid discharged from the discharge unit D reaches. In the discharge area K20, there is a possibility that the wavefront may be disturbed by the impact of the fluid discharged from the discharge unit D when it reaches the substrate 9. By positioning the irradiation area K1, on which the detection light is irradiated, at a position displaced from the discharge area D20, it is possible to prevent a situation in which, for example, diffuse reflection occurs due to the disturbance of the wavefront, thereby reducing the detection accuracy of the sensor unit 41.

[0124] Furthermore, the discharge unit D may be disposed upstream of the sensor unit 41 in the transport direction D1 of the substrate 9, and may discharge the fluid from the upstream side to the downstream side in the transport direction D1. This configuration prevents droplets swept away by the fluid discharged from the discharge unit D from flowing back and re-entering the irradiation region K1.

[0125] Furthermore, when the transport unit transports the substrate 9 in an inclined position (for example, when the substrate 9 is transported by the inclined roller transport mechanisms 21d and 31d), the discharge unit D may be disposed on the higher end side of the inclined direction of the substrate 9 relative to the sensor unit 41, and may discharge the fluid in a direction from the higher end side to the lower end side of the inclined direction. With this configuration, the fluid discharged from the discharge unit D flows with sufficient force, so that the droplets in the irradiation area K1 can be sufficiently removed.

[0126] Furthermore, the fluid discharged from the discharge unit D may be a liquid or a gas. When the discharged fluid is a liquid, the droplets can be swept away by a liquid flow and sufficiently removed from the irradiation area K1. When the discharged fluid is a gas, the droplets can be swept away by a gas flow and sufficiently removed from the irradiation area K1.

[0127] <6. First Modified Example> A sensor unit 4a according to a first modified example will be described with reference to FIGS. 10 and 11. FIG. 10 is a side view (FIG. 10(a)) of the sensor unit 4a as seen from the downstream side in the conveying direction D1, and a perspective view (FIG. 10(b)) as seen from diagonally above. FIG. 11 is a side view for explaining variations in the arrangement position of the auxiliary inhibition section Es. Below, differences from the above embodiment will be described, and explanations of non-differences will be omitted. Furthermore, elements that are the same as those in the above embodiment will be denoted by the same reference numerals.

[0128] Like the sensor unit 4 according to the above embodiment, the sensor unit 4a is a unit for detecting the transported substrate 9, and includes a sensor section 41 and a droplet removal section 42a. The configuration of the sensor section 41 is as described in the above embodiment.

[0129] (Droplet removal section 42a) Like the droplet removal unit 42 in the above embodiment, the droplet removal unit 42a is provided in correspondence with the sensor unit 41 and locally removes droplets in the area (irradiation area K1) irradiated with the detection light emitted from the light-emitting unit 411 of the corresponding sensor unit 41.

[0130] The droplet removal section 42a of this embodiment is equipped with a passage-blocking section E that is positioned upstream of the irradiation area K1 in the transport direction D1, close to the underside of the substrate 9, and removes droplets from the irradiation area K1 by blocking the passage of droplets present on the underside of the substrate 9.

[0131] Specifically, the passage inhibition unit E includes, for example, a cylindrical main body member 423 and a support member 424 that supports the main body member 423. The main body member 423 is disposed upstream of the irradiation region K1 in the conveyance direction D1. The main body member 423 is disposed at a distance between the main body member 423 and the lower surface of the substrate 9 being conveyed that is smaller than the droplets (droplets to be removed). Preferably, the main body member 423 is disposed so as not to come into contact with the lower surface of the substrate 9. However, if the material of the main body member 423 is appropriately selected so as not to damage the substrate 9 even if it comes into contact with the substrate 9, the main body member 423 may be disposed so as to come into contact with the lower surface of the substrate 9. Preferably, the main body member 423 is supported in such a position that its axial direction is aligned with the width direction D2 and parallel to the lower surface of the substrate 9 being conveyed. However, the shape of the main body member 423 is not limited to a cylindrical shape and may be, for example, a rectangular prism, a triangular prism, an elliptical prism, a long plate, or the like. Furthermore, when the body member 423 is cylindrical, the body member 423 may be supported so as to be rotatable around the shaft portion.

[0132] In this configuration, when the substrate 9 supported on the rollers 212, 312 is transported in the transport direction D1, the main body member 423 moves relative to the substrate 9. At this time, droplets present on the underside of the substrate 9 are crushed by the main body member 423 or swept outward in the width direction D2, and therefore cannot reach downstream of the main body member 423 in the transport direction D1. In other words, the passage of droplets is obstructed by the passage obstruction portion E. Therefore, droplets cannot enter the irradiation region K1 located downstream of the main body member 423, and the irradiation region K1 is maintained in a state where no droplets are present.

[0133] Auxiliary inhibition portions Es may be further provided near the passage inhibition portions E. The auxiliary inhibition portions Es have the same configuration as the passage inhibition portions E. That is, the auxiliary inhibition portions Es are configured to include a cylindrical main body member 423s and a support member 424s that supports the main body member 423s. The main body member 423s is also disposed with a distance between it and the underside of the substrate 9 being transported that is smaller than the distance of a droplet. However, the main body member 423s of the auxiliary inhibition portion Es is disposed to the side of the irradiation region K1 in the width direction D2. In the example shown in the figure, auxiliary inhibition portions Es are provided on both sides of the irradiation region K1 in the width direction D2.

[0134] With this configuration, droplets and the like pushed outward in the width direction D2 by the main body member 423 of the passage inhibition unit E are crushed by the main body member 423s of the auxiliary inhibition unit Es, or are pushed further outward in the width direction D2. That is, the auxiliary inhibition unit Es inhibits the passage of droplets pushed in the width direction D2 by the passage inhibition unit E. Therefore, droplets and the like pushed outward in the width direction D2 by the main body member 423 of the passage inhibition unit E cannot flow around from the width direction D2 and into the irradiation region K1, sufficiently reducing the possibility of droplets being present in the irradiation region K1.

[0135] When the substrate 9 is transported in an inclined position, the auxiliary inhibition portion Es is preferably disposed at least on the side of the high end of the substrate 9 in the inclination direction (on the side of the high edge Q1) relative to the irradiation region K1 (FIG. 11). With this configuration, the auxiliary inhibition portion Es inhibits the passage of droplets that flow down along the incline toward the irradiation region K1, effectively reducing the possibility of droplets being present in the irradiation region K1.

[0136] As described above, the droplet removal unit 42a according to this modified example includes a passage inhibition unit E that is disposed upstream of the irradiation region K1 in the transport direction D1 of the substrate 9, with a distance between the substrate 9 and the passage inhibition unit E that is smaller than the distance of the droplets, and the passage inhibition unit E inhibits the passage of the droplets, thereby removing the droplets from the irradiation region K1. With this configuration, for example, a piping system for supplying a fluid is not required, and therefore the droplets can be removed from the irradiation region K1 with a simple configuration.

[0137] <7. Second Modification> A sensor unit 4b according to a second modified example will be described with reference to Fig. 12. Fig. 12 is a side view of the sensor unit 4b as seen from one side in the transport direction D1.

[0138] Like the sensor unit 4 according to the above embodiment, the sensor unit 4b is a unit for detecting the transported substrate 9, and includes a sensor section 41 and a droplet removal section 42b. The configuration of the sensor section 41 is as described in the above embodiment.

[0139] (Droplet removal section 42b) Like the droplet removal unit 42 in the above embodiment, the droplet removal unit 42b is provided in correspondence with the sensor unit 41 and locally removes droplets in the area (irradiation area K1) irradiated with the detection light emitted from the light-emitting unit 411 of the corresponding sensor unit 41.

[0140] The droplet removal unit 42b according to this embodiment includes a tilt forming unit F that tilts the substrate 9, and removes the droplets from the irradiation area K1 by causing the droplets to flow due to this tilt.

[0141] Specifically, for example, the inclined roller conveyance mechanisms 21d and 31d that convey the substrate 9 in an inclined posture can be used as the inclination forming unit F. Alternatively, the roller conveyance mechanisms 21 and 31 provided with the inclination mechanism 33 can also be used as the inclination forming unit F. That is, the inclined roller conveyance mechanisms 21d and 31d, or the roller conveyance mechanisms 21 and 31 provided with the inclination mechanism 33, can both set the multiple roller shafts 211 and 311 (and thus the substrate 9 supported on the rollers 212 and 312) to an inclined posture inclined in the width direction D2, and these can be used as the inclination forming unit F.

[0142] When the substrate 9 is tilted in the width direction D2, droplets present on the underside of the substrate 9 flow down across the substrate 9 along the width direction D2 from an edge (high edge) Q1 that is relatively higher in the width direction D2 to an edge (low edge) Q2 that is relatively lower. The droplet removal unit 42b uses this flow of droplets to remove the droplets from the irradiation region K1. That is, the droplet removal unit 42b removes the droplets from the irradiation region K1 by causing the droplets to flow to a relatively lower position due to the tilt of the substrate 9.

[0143] Naturally, the droplet removal effect of this droplet removal unit 42b increases toward the higher end of the slope formed by the slope forming unit F (i.e., closer to the high edge Q1). Therefore, the closer the sensor unit 41 associated with this droplet removal unit 42b is to be located, the more preferable it is. To obtain a sufficient droplet removal effect, the sensor unit 41 is preferably located closer to the high edge Q1 than the center of the substrate 9 in the width direction D2, and particularly preferably within the divided region closest to the high edge Q1 when the substrate 9 is divided into three equal parts in the width direction D2.

[0144] For example, in the above embodiment, if the second liquid processing section 2c of the cleaning device 11 is provided with an inclined roller transport mechanism 21d as a transport section, the inclined roller transport mechanism 21d can be used as the inclination forming section F to realize the droplet removal section 42b. Similarly, the inclined roller transport mechanisms 31d provided in the second liquid processing section 3c and the third liquid processing section 3d of the developing device 15 can be used as the inclination forming section F to realize the droplet removal section 42b. In these cases, the inclined roller transport mechanisms 21d and 31d serve to increase the processing efficiency of the liquid processing and to remove droplets from the irradiation area K1 of the sensor section 41.

[0145] As described above, the droplet removal unit 42b according to this modified example includes the inclination forming unit F that tilts the substrate 9, and removes droplets from the irradiation area K1 by causing the droplets to flow due to the tilt. With this configuration, the droplets are removed using the tilt, so large droplets can be removed evenly.

[0146] <8. Other variations> In the above embodiment, the fluid discharged from the discharge unit D (specifically, the nozzle 421) of the droplet removal unit 42 may be a liquid, a gas, or both a liquid and a gas. For example, when the fluid discharged from the nozzle 421 is a predetermined gas (e.g., dry air, clean air, nitrogen gas, etc.), the fluid supply unit 422c includes a supply pipe 4221c connecting the nozzle 421 to a supply line L2 of the predetermined gas, a valve 4222c inserted in the supply pipe 4221c, etc., as shown in FIG. 13. In this configuration, when the valve 4222c is opened, the predetermined gas is supplied to the nozzle 421 through the supply pipe 4221c, and the predetermined gas is discharged from the nozzle 421.

[0147] It is preferable that the fluid discharged from the discharge unit D is one that is unlikely to affect the processing being performed on the substrate 9 at the location where the sensor unit 4 is provided. For example, if the fluid discharged from the discharge unit D is a liquid, it is preferable that the same type of liquid be discharged as the liquid used in the processing being performed at the location where the sensor unit 4 is provided (or immediately upstream thereof). For example, in the case of the sensor unit 4 provided in the second liquid processing unit 2c of the cleaning apparatus 11 and the sensor units 4 provided in the second liquid processing unit 3c and the third liquid processing unit 3d of the developing apparatus 15, the liquid used in the processing being performed in each of the liquid processing units 2b, 3c, and 3d is pure water, so it is preferable that the fluid discharged from the discharge unit D is also pure water. Furthermore, if the fluid discharged from the discharge unit D is a gas, it is preferable that the gas be one that is unlikely to affect the processing (for example, clean air, dry air, an inert gas such as nitrogen, etc.).

[0148] However, for example, in the cleaning apparatus 11, other supply pipes (e.g., supply pipe 252 for supplying pure water as a cleaning liquid to nozzles 26a, 26b of second liquid processing unit 2c) are also connected to the pure water supply line L1 in addition to supply pipe 4221. Here, the time period when pure water is supplied to nozzles connected to other supply pipes (e.g., nozzles 26a, 26b of second liquid processing unit 2c) does not necessarily coincide with the time period when pure water is supplied to nozzle 421 of droplet removal unit 42 (i.e., the time period when the transported substrate 9 is to be detected). Therefore, it is preferable that supply pipe 4221 to which nozzle 421 of droplet removal unit 42 is connected be configured as a piping system independent of other supply pipes. The same applies to the developing apparatus 15. The same applies to supply pipe 4221c connected to supply line L2 for a predetermined gas.

[0149] Furthermore, the fluid discharged from the discharge unit D may be temperature-adjusted so that its temperature is approximately the same as the temperature of the substrate 9. Specifically, for example, a temperature adjustment unit (a heating unit or a cooling unit) may be inserted in the supply pipes 4221, 4221c that are connected to the discharge unit D and supply the fluid thereto, and the temperature of the fluid flowing through the supply pipes 4221, 4221c may be adjusted (heated or cooled) so that the fluid whose temperature is adjusted to approximately the same as that of the substrate 9 is discharged onto the substrate 9. With this configuration, it is possible to prevent the temperature of the substrate 9 from becoming locally higher (or lower) due to the supply of the fluid (i.e., the temperature uniformity across the surface of the substrate 9 is impaired).

[0150] In the above embodiment, it is not an essential requirement that the irradiation area K1 be positioned at a position displaced from the discharge area K20. As described above, there is a possibility that disturbances may occur in the wavefront in the discharge area K20, but the magnitude (amplitude) of this disturbance is significantly smaller than the size of the droplets, and therefore, by at least removing the droplets, the possibility of false detection by the sensor unit 41 is reduced.

[0151] The above-described embodiments and modifications may be combined with each other.

[0152] 14 shows a sensor unit 4d including a droplet removal unit 42d that combines the droplet removal unit 42 according to the above embodiment with the droplet removal unit 42b according to the second modified example. That is, the droplet removal unit 42d includes a tilt forming unit F that tilts the substrate 9 (in the illustrated example, the tilt forming unit F is configured using the tilted roller transport mechanisms 21d and 31d), and a discharge unit D that discharges a predetermined fluid toward the tilted substrate 9.

[0153] In this case, the closer the sensor unit 41 is positioned to the high edge Q1, the more preferable. Specifically, the sensor unit 41 is preferably positioned closer to the high edge Q1 than to the center of the substrate 9 in the width direction D2, and is particularly preferably positioned within the divided region closest to the high edge Q1 when the substrate 9 is divided into three equal parts in the width direction D2. In this case, the nozzle 421 of the discharge unit D is preferably positioned on the high edge side (the high edge Q1 side) of the inclination direction of the substrate 9 relative to the sensor unit 41, and discharges the fluid in a direction from the high edge side to the low edge side in the inclination direction.

[0154] According to this droplet removal unit 42d, droplets can be removed from the irradiation area K1 by the flow of droplets formed by the inclination formed by the inclination forming unit F, and also by washing away the droplets with the fluid ejected from the ejection unit D. In this way, by removing droplets by two different measures, the possibility of droplets remaining in the irradiation area K1 (and thus the possibility of false detection by the sensor unit 41) can be made sufficiently low.

[0155] 15 shows a sensor unit 4e including a droplet removal unit 42e that combines a droplet removal unit 42a according to the first modified example and a droplet removal unit 42b according to the second modified example. That is, this droplet removal unit 42e includes a slope forming unit F that tilts the substrate 9 (in the illustrated example, the slope forming unit F is configured using the sloped roller transport mechanisms 21d and 31d), and a passage obstruction unit E that obstructs the passage of droplets present on the underside of the substrate 9.

[0156] In this case, the closer to the high edge Q1 the sensor unit 41 is located, the more preferable. Specifically, the sensor unit 41 is preferably located closer to the high edge Q1 than to the center of the substrate 9 in the width direction D2, and is particularly preferably located within the divided region closest to the high edge Q1 when the substrate 9 is divided into three equal parts in the width direction D2.

[0157] According to this droplet removal unit 42e, droplets can be removed from the irradiation area K1 by the flow of droplets formed by the slope formed by the slope forming unit F, and by blocking the passage of droplets present on the underside of the substrate 9 by the passage blocking unit E. Here again, by removing droplets by two different measures, the possibility of droplets remaining in the irradiation area K1 (and thus the possibility of false detection by the sensor unit 41) can be made sufficiently low.

[0158] Even in such a configuration, an auxiliary inhibiting portion Es may be provided near the passage inhibiting portion E. The auxiliary inhibiting portion Es may be provided on both sides of the irradiation region K1 in the width direction D2, or on only one side. For example, as illustrated in FIG. 15, if the sensor unit 41 is positioned sufficiently close to the high edge Q1 and one end of the passage inhibiting portion E in the width direction D2 is sufficiently close to the high edge Q1, the auxiliary inhibiting portion Es may be provided laterally on the side of the irradiation region K1 closer to the low edge Q2 in the width direction D2. However, the auxiliary inhibiting portion Es is not essential and may be omitted.

[0159] The positions where the sensor units 4 are installed in the above-described embodiments are merely examples, and it is not necessary to install the sensor units 4 at all of the positions exemplified in the above-described embodiments. Furthermore, the sensor units 4 may be installed at positions other than the positions exemplified in the above-described embodiments.

[0160] In the above embodiment, the control unit 10 determines whether or not the substrate 9 is present based on the output signal sent from the sensor unit 41, but the output signal sent from the sensor unit 41 may be used in any way by the control unit 10.

[0161] In the above embodiment, the sensor unit 41 is a reflective sensor in which the light-projecting unit 411 and the light-receiving unit 412 are arranged on the same side of the substrate 9, which is the object to be detected, and performs detection based on reflected light. However, the sensor unit 41 may be a transmissive sensor in which the light-projecting unit 411 and the light-receiving unit 412 are arranged on different sides of the substrate 9, which is the object to be detected, and perform detection based on transmitted light. Although the transmissive sensor has a lower probability of false detection caused by droplets than a reflective sensor, the probability is not zero. Therefore, even when the sensor unit 41 is configured as a transmissive sensor, it is effective to remove droplets from the irradiation area K1 using the droplet removal unit 42.

[0162] In the above-described embodiment, the roller conveyance mechanisms 21, 31 are configured such that a plurality of disk-shaped rollers 212, 312 are fixed to the roller shafts 211, 311, but the configuration of the roller conveyance mechanisms 21, 31 is not limited to this. For example, the roller conveyance mechanisms 21, 31 may be configured such that one or more cylindrical rollers are fixed to the roller shafts 211, 311. Alternatively, for example, the roller shafts 211, 311 may be fixed so as not to rotate, and the rollers 212, 312 may be rotationally driven relative to the roller shafts 211, 311.

[0163] In the above-described embodiment, the substrate 9 to be processed may be any of various glass substrates (e.g., a glass substrate for a liquid crystal display (LCD), a glass substrate for a plasma display (PDP), a glass substrate for an organic light-emitting diode (OLED), a glass substrate for a field emission display (FED), a glass substrate for a solar cell panel, a glass substrate for an optical disk, a glass substrate for a magnetic disk, a glass substrate for a photomask, etc.). The substrate to be processed may also be any of various ceramic substrates (e.g., a ceramic substrate for a magnetic / optical disk), a semiconductor substrate (semiconductor wafer), an electronic device substrate, a printing plate for printing, etc.

[0164] The sensor unit 4 according to the above embodiment can be mounted as a sensor for detecting the substrate 9 in various substrate processing apparatuses that process the substrate 9 by supplying various liquids (for example, cleaning liquid, etching liquid, developing liquid, stripping liquid for stripping resist or the like, rinsing liquid, etc.) to the substrate 9. Furthermore, it can also be widely used as a sensor for non-contact detection of an object to which liquid may adhere.

[0165] Although the substrate processing apparatus and the substrate detection method have been described in detail above, the above description is merely an example in all respects, and the substrate processing apparatus and the substrate detection method are not limited thereto. It is understood that countless variations not illustrated can be envisioned without departing from the scope of this disclosure. The configurations described in the above embodiments and variations can be combined or omitted as appropriate, as long as they are not mutually inconsistent. [Explanation of symbols]

[0166] 1. Substrate Processing System 11 Cleaning equipment 2c Second liquid processing section 21 Roller conveying mechanism 21d Inclined roller transport mechanism 15 Developing device 3a First liquid processing section 3c Second liquid processing section 3d Third liquid processing section a 31 Roller conveyance mechanism 31d Inclined roller transport mechanism 4 Sensor Unit 41 Detection unit 411 Light projector 412 Light receiving part 42,42a,42b,42c,42d,42e Droplet removal section D Discharge part 421 Nozzle 422 Fluid supply section E. Passage obstruction part 423 Main body parts 424 Support member Es auxiliary inhibitor F Inclined Forming Section D1 conveying direction D2 Aspect Direction

Claims

1. a transport unit that transports the substrate; a liquid processing unit that supplies a liquid to the substrate transported by the transport unit; a sensor unit provided in the liquid processing unit and configured to detect the substrate to which the liquid is being supplied; Equipped with The sensor unit a sensor unit including a light-projecting unit that projects detection light toward the underside of the substrate and a light-receiving unit that receives the detection light projected from the light-projecting unit; a droplet removal unit provided in correspondence with the sensor unit, the droplet removal unit locally removing droplets in an irradiation area irradiated with the detection light projected from the light projecting unit of the corresponding sensor unit; Equipped with the droplet removal unit includes a discharge unit that discharges a fluid toward the substrate, and removes the droplets from the irradiation area by pushing away the droplets with the fluid discharged from the discharge unit; the range in which droplets are removed by the droplet removal unit is not the entirety but a part of the substrate in a direction intersecting the transport direction of the substrate; Substrate processing equipment.

2. The substrate processing apparatus according to claim 1 , the liquid processing unit supplies a liquid to the lower surface of the substrate transported by the transport unit. Substrate processing equipment.

3. A substrate processing apparatus according to claim 1 or 2, the irradiation region is a position shifted from a discharge region on the substrate where the fluid discharged from the discharge unit reaches; Substrate processing equipment.

4. A substrate processing apparatus according to any one of claims 1 to 3, The discharge portion is the sensor unit is disposed upstream of the sensor unit in the substrate transport direction, and discharges a fluid from the upstream side to the downstream side in the substrate transport direction; Substrate processing equipment.

5. A substrate processing apparatus according to any one of claims 1 to 4, the transport unit transports the substrate in an inclined position, the ejection unit is disposed on a higher end side of the substrate in a tilt direction relative to the sensor unit, and ejects fluid in a direction from the higher end side to the lower end side in the tilt direction. Substrate processing equipment.

6. A substrate processing apparatus according to any one of claims 1 to 5, The fluid discharged from the discharge portion is a liquid. Substrate processing equipment.

7. A substrate processing apparatus according to claim 1, comprising: The fluid discharged from the discharge portion is a gas. Substrate processing equipment.

8. A substrate detection method for detecting a substrate to which a liquid is supplied while being transported in a liquid processing section, comprising: a droplet removal step of locally removing droplets in an irradiation area on the lower surface of the substrate, the irradiation area being irradiated with the detection light, in the liquid processing unit; a detection step of detecting the substrate in the liquid processing unit by receiving detection light projected toward the irradiation area; Equipped with In the droplet removal step, the droplets are removed from the irradiation region by flushing away the droplets with a fluid ejected from an ejection unit that ejects the fluid toward the substrate; the range in which the droplets are removed in the droplet removal step is not the entirety but a part of the substrate in a direction intersecting the transport direction of the substrate; Substrate detection method.

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