Substrate Processing Equipment

Abstract

To provide a substrate treating apparatus in which a sheet substrate transport mechanism can easily access a plurality of substrates which a posture turning unit receives from a batch substrate transport mechanism and whose posture is turned horizontal by the posture turning unit.SOLUTION: In the substrate treating apparatus 1, a pusher 65 is provided at a position accessible by a first transport mechanism WTR1, and a posture turning unit 63 is provided at a position accessible by a center robot CR. A second transport mechanism WTR2 receives substrates W in a vertical posture held by the pusher 65, and delivers the substrates W to the posture turning unit 63. The second transport mechanism WTR2 includes two horizontal chucks configured to hold the substrates W in the vertical posture while radially clamp-supporting two side portions of each of the substrates W. The posture turning unit 63 includes: an upper and lower chucks for radially clamp-supporting an upper portion and a lower portion of each of the substrates W in the vertical posture held by the two horizontal chucks to receive the substrates W in the vertical posture from the two horizontal chucks; and an upper and lower chuck rotation unit for rotating the upper and lower chucks around a horizontal axis.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] Conventional substrate processing apparatuses include hybrid substrate processing apparatuses that include a batch processing module (batch processing section) that processes multiple substrates at once, and a single-wafer processing module (single-wafer processing section) that processes the substrates processed in the batch processing module one by one (see, for example, Patent Documents 1 and 2).

[0003] The batch processing module processes multiple substrates in a vertical position all at once, while the single-wafer processing module processes substrates in a horizontal position one by one. Therefore, in order for the single-wafer processing module to process the substrates that have been processed in the batch processing module, the substrate processing apparatus further includes a rotation mechanism that converts the substrates from a vertical position to a horizontal position.

[0004] The rotation mechanism (attitude conversion mechanism) in Patent Document 1 includes a pedestal and two side walls to surround the outer edge of the substrate. The pedestal has multiple grooves for vertically placing the substrate. Each of the two side walls has a group of support parts that protrude inward.

[0005] When the rotation mechanism receives multiple vertically oriented substrates from the vertical substrate transfer robot (batch substrate transfer mechanism), the two side walls open. The vertical substrate transfer robot then places the substrates vertically in the grooves of the pedestal. The two side walls then fold to hold the substrates in place. The pedestal is then rotated 90 degrees around a horizontal axis perpendicular to the direction in which the vertically oriented substrates are arranged. This positions the substrates horizontally within the rotation mechanism and supports them on the supports of the two side walls.

[0006] The substrate processing apparatus of Patent Document 2 includes a main transport mechanism (batch substrate transport mechanism), a pusher, and a posture changing mechanism (posture changing unit).The substrate processing apparatus of Patent Document 3 includes a posture changing mechanism. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Special Publication No. 2016-502275 [Patent Document 2] Patent Publication No. 2021-064652 [Patent Document 3] Japanese Patent Application Publication No. 2018-056341 Summary of the Invention [Problem to be solved by the invention]

[0008] The rotation mechanism of Patent Document 1 places the substrates in a horizontal position by rotating the base by 90 degrees around a horizontal rotation axis that is perpendicular to the direction in which the vertically oriented substrates are lined up. Then, to transport the substrates to a single-wafer module, a horizontal substrate transfer robot (single-wafer substrate transfer mechanism) removes the substrates from between the two side walls. In this case, if the position where the rotation mechanism receives multiple vertically oriented substrates from the vertical substrate transfer robot (batch substrate transfer mechanism) is far away from the horizontal substrate transfer robot, it may be difficult for the horizontal substrate transfer robot to receive the horizontally oriented substrates.

[0009] Furthermore, the attitude changing mechanism (attitude changing unit) in Patent Document 2 receives the substrate from the main transport mechanism (batch substrate transport mechanism) via a pusher. In this regard, there are cases where it is desirable for the attitude changing mechanism to receive the substrate directly from the main transport mechanism.

[0010] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus in which a single substrate transport mechanism can easily access multiple substrates that have been received by an attitude conversion unit from a batch substrate transport mechanism and converted to a horizontal attitude. [Means for solving the problem]

[0011] In order to achieve the above object, the present invention has the following configuration: A substrate processing apparatus that successively performs batch processing for processing a plurality of substrates collectively and single wafer processing for processing substrates one by one, comprising a batch processing tank for processing a plurality of substrates collectively, a first batch transfer mechanism for transferring the plurality of substrates in a vertical orientation relative to the batch processing tank, a single wafer processing chamber for processing substrates one by one, a single wafer substrate transfer mechanism for transferring substrates in a horizontal orientation relative to the single wafer processing chamber one by one, and a posture change mechanism for converting the plurality of vertically oriented batch-processed substrates to a horizontal orientation all at once. and a mechanism for transferring the substrates in the vertical orientation from the substrate holding unit to the single substrate transfer unit, the mechanism comprising: a substrate holding unit that is provided at a position accessible to the first batch transfer unit and that collectively receives and holds the plurality of vertically oriented substrates that have been batch processed from the first batch transfer unit; a position changing unit that is provided at a position accessible to the single substrate transfer unit and that collectively changes the plurality of vertically oriented substrates to a horizontal orientation; and a mechanism that is movable between the substrate holding unit and the position changing unit and that receives the plurality of vertically oriented substrates held by the substrate holding unit and passes them to the position changing unit. and a second batch substrate transport mechanism, the second batch substrate transport mechanism comprising two horizontal chucks that hold the plurality of vertically oriented substrates held by the substrate holding unit while pinching, from a radial direction, two side portions of the outer edge of each of the plurality of vertically oriented substrates, and the posture conversion unit comprises upper chucks and lower chucks that are capable of receiving the plurality of vertically oriented substrates from the two horizontal chucks by pinching, from a radial direction, an upper portion and a lower portion of the outer edge of each of the plurality of vertically oriented substrates held by the two horizontal chucks. and an upper and lower chuck rotation unit that rotates the upper chuck and the lower chuck around a horizontal axis perpendicular to the alignment direction of the plurality of vertically oriented substrates held by the upper chuck and the lower chuck in order to convert the plurality of vertically oriented substrates received from the two horizontal chucks into a horizontal position, and the single substrate transport mechanism is characterized in that it takes out substrates one by one from the plurality of horizontally oriented substrates held by the upper chuck and the lower chuck and transports them to the single substrate processing chamber.

[0012] In the substrate processing apparatus according to the present invention, the upper and lower chucks of the attitude conversion unit clamp the upper and lower outer edges of each of the vertically oriented substrates held by the two horizontal chucks of the second batch substrate transport mechanism. This allows the attitude conversion unit to directly receive substrates from the two horizontal chucks of the second batch substrate transport mechanism. Furthermore, the substrate holding unit is located in a position accessible to the first batch transport mechanism, and the attitude conversion unit is located in a position accessible to the single substrate transport mechanism. Therefore, even if the position where the substrate holding unit receives the substrate from the first batch substrate transport mechanism is far from the single substrate transport mechanism, the second batch substrate transport mechanism can transport the substrate from the substrate holding unit to the attitude conversion unit. This allows easy access for the single substrate transport mechanism.

[0013] Furthermore, in the above-mentioned substrate processing apparatus, it is preferable that each of the two horizontal chucks has a plurality of V-shaped holding grooves for holding each of the plurality of substrates in a vertical position, the upper chuck has a plurality of first horizontal placement guide grooves, each having a width wider than the thickness of each of the plurality of substrates, to accommodate the outer edges of each of the plurality of substrates, and the lower chuck has a plurality of second horizontal placement guide grooves, each having a width wider than the thickness of each of the plurality of substrates, to accommodate the outer edges of each of the plurality of substrates.

[0014] The two horizontal chucks use V-shaped holding grooves to hold substrates in a vertical position, preventing two adjacent substrates from sticking together. This, for example, prevents the substrates from being scratched. Furthermore, the first horizontal placement guide groove and the second horizontal placement guide groove each have a width greater than the thickness of the substrate. Therefore, after the substrate's position is changed to horizontal, when the single-substrate transfer mechanism removes the substrate from the upper chuck and the lower chuck, there is enough space to lift the substrate, allowing it to be removed without applying any load to the substrate.

[0015] Furthermore, in the above-described substrate processing apparatus, it is preferable that the posture conversion unit further includes two auxiliary chucks provided on both sides of the lower chuck along the circumferential direction of each substrate, each of the two auxiliary chucks having a plurality of second V-shaped grooves for holding the plurality of substrates in a vertical posture, and when the upper chuck and the lower chuck hold the plurality of substrates in a vertical posture, each of the two auxiliary chucks holds the plurality of substrates in a vertical posture by accommodating the outer edges of the plurality of substrates in each of the second V-shaped grooves, and when the upper chuck and the lower chuck hold the plurality of substrates in a horizontal posture, each of the two auxiliary chucks removes the plurality of substrates from the plurality of second V-shaped grooves and moves away from the plurality of substrates to a position that does not interfere with the removal of the plurality of substrates by the single-substrate transport mechanism.

[0016] When the upper and lower chucks hold a substrate in a vertical position, the two closed auxiliary chucks hold the substrate in a vertical position, preventing two adjacent substrates from sticking together. Also, when a substrate in a horizontal position is removed from the upper and lower chucks, the two auxiliary chucks are in an open position, so they do not interfere with the removal of the substrate by the single-substrate transport mechanism.

[0017] In the substrate processing apparatus described above, it is preferable that the posture changing unit further includes a relative moving unit that moves the two auxiliary chucks relatively to the upper chuck and the lower chuck in a direction in which the plurality of substrates are aligned, the plurality of first horizontal placement guide grooves include a plurality of mounting surfaces for respectively mounting one horizontally oriented substrate, and when the posture changing unit changes the postures of the plurality of substrates to horizontal, the relative moving unit moves the two auxiliary chucks relatively so that the plurality of vertically oriented substrates held in the plurality of second V-shaped holding grooves contact the plurality of mounting surfaces, respectively. This can prevent particles from being generated due to collisions between moving substrates during posture change.

[0018] In the above-described substrate processing apparatus, the posture conversion mechanism preferably further includes a standby tank for storing the liquid so that the plurality of substrates held by the substrate holders can be immersed in the liquid. If the substrates dry before being dried in the single-wafer processing chamber, pattern collapse on the substrates occurs. However, the present invention can prevent the substrates held by the substrate holders from drying out.

[0019] In the above-described substrate processing apparatus, it is preferable that the posture conversion mechanism further includes a holder nozzle that supplies liquid in the form of a shower or mist to the plurality of substrates held by the substrate holder. If the substrate dries before the drying process in the single wafer processing chamber, pattern collapse on the substrate occurs. However, the present invention can prevent the substrates held by the substrate holder from drying out.

[0020] In the substrate processing apparatus described above, it is preferable that the attitude changing mechanism further includes an attitude changing nozzle that supplies a liquid in the form of a shower or mist to the plurality of substrates held by the upper chuck and the lower chuck of the attitude changing unit. If the substrates dry before the drying process in the single wafer processing chamber, pattern collapse on the substrate occurs. However, the present invention can prevent the substrates held by the upper chuck and the lower chuck of the attitude changing unit from drying.

[0021] In the substrate processing apparatus described above, it is preferable that the attitude changing mechanism further includes a rotation unit that rotates the substrate holder about a vertical axis. The substrate can be delivered to the second batch substrate transport mechanism in any orientation. Furthermore, the substrate, which has been in a horizontal orientation after the attitude change, can be rotated to any orientation.

[0022] Furthermore, in the above-described substrate processing apparatus, it is preferable that the batch processing tank and the attitude conversion mechanism are arranged in a horizontal first direction, and the second batch substrate transport mechanism transports the plurality of substrates from the substrate holder along a horizontal second direction perpendicular to the first direction. If the batch processing tank and its surrounding structure are long in the second direction, it may be difficult for the single substrate transport mechanism to access it. Since the second batch substrate transport mechanism can move in the second direction, the attitude conversion mechanism can be brought closer to the single substrate transport mechanism. This allows the single substrate transport mechanism to transport substrates easily.

[0023] In the above-described substrate processing apparatus, it is preferable that each of the two horizontal chucks has two or more V-shaped holding grooves for holding a predetermined two or more substrates from the plurality of substrates, and the second batch substrate transport mechanism uses the two horizontal chucks to extract the two or more substrates from the plurality of substrates in a vertical position held by the substrate holder. The second batch substrate transport mechanism can extract and transport two or more substrates from the substrates held by the substrate holder.

[0024] Furthermore, in the above-described substrate processing apparatus, it is preferable that the second batch substrate transport mechanism can switch the two horizontal chucks between a first pattern and a second pattern, and when the two horizontal chucks are the first pattern, the second batch substrate transport mechanism extracts one or more predetermined substrates from the plurality of vertically oriented substrates held by the substrate holding unit, and when the two horizontal chucks are the second pattern, the second batch substrate transport mechanism extracts one or more predetermined substrates different from the first pattern from the plurality of vertically oriented substrates held by the substrate holding unit. The second batch substrate transport mechanism can extract and transport different substrates from the substrates held by the substrate holding unit. [Effects of the Invention]

[0025] According to the substrate processing apparatus of the present invention, the single substrate transport mechanism can easily access a plurality of substrates that have been received from the batch substrate transport mechanism by the attitude changing section and changed to a horizontal attitude. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. [Figure 3] 10(a) to 10(f) are side views for explaining the position change unit and the pusher mechanism in the transfer block. [Figure 4] FIG. 2(a) is a plan view showing the second position change mechanism, and FIG. 2(b) is a front view showing the second position change mechanism. [Figure 5] FIG. 10 is a side view illustrating a second transport mechanism and a posture changing unit. [Figure 6] 1A is a plan view showing an auxiliary chuck opening / closing section of the attitude changing section, and FIG. 1B is a side view showing an advancing / retreating section of the attitude changing section. [Figure 7] 10(a) and 10(b) are diagrams for explaining the operation of the advancing and retreating part of the attitude changing part. [Figure 8] 10 is a flowchart illustrating an operation of the substrate processing apparatus. [Figure 9] 10 is a flowchart illustrating the first half of the operation of the second attitude change mechanism. [Figure 10] 10 is a flowchart illustrating the latter half of the operation of the second attitude change mechanism. [Figure 11] 10(a) to 10(d) are plan views illustrating the operation of the second attitude changing mechanism. [Figure 12] 10(a) to 10(d) are front views illustrating the operation of the second attitude changing mechanism. [Figure 13] 10(a) and 10(b) are plan views for explaining the operation of the second position change mechanism, and 10(c) and 10(d) are front views for explaining the operation of the second position change mechanism. [Figure 14]10(a) is a vertical cross-sectional view showing a pusher mechanism of a second position change mechanism according to a second embodiment, and FIG. 10(b) is a plan view showing the second position change mechanism according to the second embodiment. [Figure 15] (a) is a side view of Example 3 showing how a substrate is passed through two passing grooves in a predetermined pattern, and (b) is a side view of Example 3 showing how a substrate is held by two holding grooves in another pattern. [Figure 16] (a) is a diagram for explaining the allocation of six patterns, (b) is a diagram for explaining the operation of the second transport mechanism when two specified patterns are opposed to each other, and (c) is a diagram for explaining the operation of the second transport mechanism when two other patterns are opposed to each other. [Figure 17] FIG. 10 is a side view showing a ceiling-suspended center robot according to a modified example. [Figure 18] FIG. 10 is a plan view showing a schematic configuration of a substrate processing apparatus according to a modified example. Example 1

[0027] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a side view showing a batch transport mechanism HTR. Figs. 3(a) to 3(f) are side views for explaining a posture conversion unit and a pusher mechanism in a transfer block.

[0028] <1. Overall structure> 1, the substrate processing apparatus 1 includes a stocker block 3, a transfer block 5, and a processing block 7. The stocker block 3, the transfer block 5, and the processing block 7 are arranged in this order in a single horizontal row.

[0029] The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 successively performs batch processing and single wafer processing on the substrates W. That is, the substrate processing apparatus 1 performs batch processing and then single wafer processing on the substrates W. Batch processing is a processing method in which multiple substrates W are processed at once. Single wafer processing is a processing method in which substrates W are processed one by one.

[0030] For convenience, in this specification, the direction in which the stocker block 3, transfer block 5, and processing block 7 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the transfer block 5 toward the stocker block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the width direction Y is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For example, in Figure 1, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0031] <2. Stocker block> The stocker block 3 accommodates at least one carrier C. The stocker block 3 is provided with one or more (for example, two) load ports 9. The stocker block 3 is equipped with a carrier transport mechanism (robot) 11 and shelves 13.

[0032] The carrier transport mechanism 11 transports the carrier C between the load port 9 and the shelf 13. The carrier transport mechanism 11 is equipped with a gripping portion that grips a protrusion on the top surface of the carrier C, or a hand that supports the carrier C while contacting the bottom surface of the carrier C. The shelf 13 is divided into a shelf 13A for removing and storing the substrates W, and a shelf 13B for storage.

[0033] The shelf 13A is arranged adjacent to the transfer block 5. The shelf 13A may be provided with a mechanism for attaching and detaching the lid of the carrier C. At least one shelf 13A is provided. The carrier C is placed on the shelf 13A. The carrier C stores a plurality of substrates W (for example, 25 substrates) in a horizontal position in the vertical direction Z at predetermined intervals (for example, 10 mm intervals). The substrates W are aligned in the thickness direction of the substrates W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C. A FOUP is a sealed container. The carrier C may also be an open container, and any type of container is acceptable.

[0034] <3. Transfer block> The transfer block 5 is disposed adjacent to the rear X of the stocker block 3. The transfer block 5 includes a batch transport mechanism (substrate handling mechanism) HTR and a first attitude changing mechanism 15.

[0035] The bulk transport mechanism (robot) HTR is provided on the right Y side within the transfer block 5. The bulk transport mechanism HTR transports a plurality of substrates W (e.g., 25 substrates) in a horizontal position all at once. The bulk transport mechanism HTR collectively retrieves and stores a plurality of substrates W from and into a carrier C placed on the shelf 13A. The bulk transport mechanism HTR is also configured to be able to transfer a plurality of substrates W all at once between itself and the first position change mechanism 15 and between itself and the buffer unit 33, which will be described later. In other words, the bulk transport mechanism HTR can transport a plurality of substrates W between the carrier C placed on the shelf 13A, the first position change mechanism 15, and the buffer unit 33.

[0036] Please refer to Figure 2. The batch transport mechanism HTR has a plurality of (e.g., 25) hands 17. For convenience of illustration, in Figure 2, the batch transport mechanism HTR is shown to have three hands 17. Each hand 17 holds one substrate W.

[0037] The batch transport mechanism HTR also includes a hand support unit 19, an advancing / retreating unit 20, and an elevation rotation unit 21. The hand support unit 19 supports a plurality of hands 17. This allows the plurality of hands 17 to move integrally. The advancing / retreating unit 20 moves the plurality of hands 17 forward and backward via the hand support unit 19. The elevation rotation unit 21 rotates the advancing / retreating unit 20 about the vertical axis AX1, thereby rotating the plurality of hands 17, etc. about the vertical axis AX1. The elevation rotation unit 21 also raises and lowers the plurality of hands 17, etc. by raising and lowering the advancing / retreating unit 20. The elevation rotation unit 21 is fixed to the floor surface. In other words, the elevation rotation unit 21 does not move horizontally. The advancing / retreating unit 20 and the elevation rotation unit 21 each include an electric motor. The batch transport mechanism HTR may also include a hand (not shown) for transporting a single substrate W, in addition to the hand 17 and the hand support unit 19.

[0038] Please refer to Figure 1. The first position change mechanism 15 changes the position of a plurality of substrates W collectively from a horizontal position to a vertical position. The first position change mechanism 15 includes a position change unit 23 and a pusher mechanism 25. In Figure 1, the batch transport mechanism HTR, the position change unit 23 and the pusher mechanism 25 are arranged in this order on the left side Y. Figures 3(a) to 3(f) are diagrams for explaining the first position change mechanism 15.

[0039] As shown in FIGS. 1 and 3(a), the posture conversion unit 23 includes a support base 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are provided on the support base 23A. The horizontal holding units 23B and the vertical holding units 23C receive multiple substrates W transported by the batch transport mechanism HTR. When the substrates W are in a horizontal posture, the pair of horizontal holding units 23B contact the underside of each substrate W and support the substrates W from below. When the substrates W are in a vertical posture, the pair of vertical holding units 23C hold the substrates W.

[0040] The rotation drive unit 23D supports the support table 23A so that it can rotate about the horizontal axis AX2. Furthermore, the rotation drive unit 23D rotates the support table 23A about the horizontal axis AX2, thereby converting the orientation of the multiple substrates W held by the holders 23B and 23C from horizontal to vertical.

[0041] 1 and 3(f), the pusher mechanism 25 includes a pusher 25A, an elevation rotation unit 25B, a horizontal movement unit 25C, and a rail 25D. The pusher 25A supports the lower portion of each of a plurality of (e.g., 50) substrates W in a vertical position. For convenience of illustration, in FIGS. 3(a) to 3(f), the pusher 25A is configured to be able to support six substrates W.

[0042] The lifting and rotating unit 25B is connected to the underside of the pusher 25A. The lifting and rotating unit 25B moves the pusher 25A up and down by extending and retracting. The lifting and rotating unit 25B also rotates the pusher 25A around the vertical axis AX3. The horizontal moving unit 25C supports the lifting and rotating unit 25B. The horizontal moving unit 25C moves the pusher 25A and the lifting and rotating unit 25B horizontally along the rail 25D. The rail 25D is formed to extend in the width direction Y. The rotation driving unit 23D, the lifting and rotating unit 25B, and the horizontal moving unit 25C each include an electric motor.

[0043] The operation of the first position change mechanism 15 will now be described. The batch processing baths BT1 to BT6 in the processing block 7, which will be described later, process, for example, 50 substrates W in two carriers C at once. The first position change mechanism 15 changes the position of the 50 substrates W in groups of 25. The first position change mechanism 15 also arranges the substrates W face-to-face at a predetermined interval (half pitch). The half pitch is, for example, 5 mm. The pusher mechanism 25 transports these 50 substrates W to the first transport mechanism WTR1.

[0044] The 25 substrates W in the first carrier C will be described as substrates W1 of the first substrate group. The 25 substrates W in the second carrier C will be described as substrates W2 of the second substrate group. For convenience of illustration, in Figures 3(a) to 3(f), the first substrate group will be described as having three substrates W1, and the second substrate group will be described as having three substrates W2. When there is no particular distinction between substrates W1 and substrates W2, substrates W1 and W2 will be referred to as "substrates W."

[0045] See Figure 3(a). The attitude conversion unit 23 receives the 25 substrates W1 of the first substrate group transported by the batch transport mechanism HTR at the holders 23B and 23C. At this time, the 25 substrates W1 are in a horizontal position, with their device surfaces facing upward. The 25 substrates W1 are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm. The full pitch is also called the normal pitch.

[0046] The half pitch is half the distance of the full pitch. The device surface of the substrate W (W1, W2) is the surface on which the electronic circuit is formed and is called the "front surface." The back surface of the substrate W is the surface on which the electronic circuit is not formed. The surface opposite the device surface is called the back surface.

[0047] See Figure 3(b). The attitude conversion unit 23 rotates the holders 23B and 23C by 90 degrees around the horizontal axis AX2 to convert the attitude of the 25 substrates W1 from horizontal to vertical. See Figure 3(c). The pusher mechanism 25 raises the pusher 25A to a position higher than the holders 23B and 23C of the attitude conversion unit 23. As a result, the pusher 25A receives the 25 substrates W from the holders 23B and 23C. The 25 substrates W1 held by the pusher 25A face leftward Y. Note that in Figures 3(a) to 3(f), the arrows AR attached to the substrates W indicate the orientation of the device surfaces of the substrates W.

[0048] See FIG. 3(d). The pusher mechanism 25 rotates the 25 substrates W in a vertical position by 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 are inverted and face rightward Y. The inverted 25 substrates W1 then move half a pitch (e.g., 5 mm) leftward Y from their pre-rotation positions. The holders 23B and 23C of the position changer 23 are rotated -90 degrees around the horizontal axis AX2 to prepare for receiving the next substrate W2. The position changer 23 then receives the 25 substrates W2 of the second substrate group transported by the batch transport mechanism HTR with the holders 23B and 23C. At this time, the 25 substrates W2 are in a horizontal position, with their device surfaces facing upward. The position changer 23 and the pusher mechanism 25 are operated so as not to interfere with each other.

[0049] See Figure 3(e). The pusher mechanism 25 lowers the pusher 25A holding the 25 substrates W1 of the first substrate group to the retracted position. Thereafter, the attitude changing unit 23 changes the attitude of the 25 substrates W2 from horizontal to vertical. After the attitude change, the 25 substrates W2 face leftward Y. See Figure 3(f). Thereafter, the pusher mechanism 25 raises the pusher 25A holding the 25 substrates W2 of the second substrate group. This causes the pusher mechanism 25 to receive another 25 substrates W2 from the attitude changing unit 23.

[0050] As a result, the pusher 25A holds 50 substrates W (W1, W2) of the first substrate group and the second substrate group. The 50 substrates W are arranged alternately, with 25 substrates W1 and 25 substrates W2 arranged one by one. The 50 substrates W are arranged at a half pitch (e.g., 5 mm intervals). Furthermore, the 25 substrates W1 face in the opposite direction to the 25 substrates W2. Therefore, the 50 substrates W are arranged face-to-face. That is, two adjacent substrates W1 and W2 have their two device surfaces (or two back surfaces) facing each other.

[0051] Thereafter, the pusher mechanism 25 moves the pusher 25A holding the 50 substrates W along the rails 25D to the substrate transfer position PP below the pair of chucks 49, 50 of the first transport mechanism WTR1.

[0052] <4. Processing Block 7> The processing block 7 is adjacent to the transfer block 5. The processing block 7 is disposed behind the transfer block 5 at a position X. The processing block 7 includes a batch processing area R1, a single substrate transport area R2, a single substrate processing area R3, and a batch substrate transport area R4. The substrate processing apparatus 1 includes an electrical equipment area R5.

[0053] <4-1. Batch processing area R1> The batch processing area R1 is adjacent to the transfer block 5, the single substrate transport area R2, and the batch substrate transport area R4. The batch processing area R1 is also disposed between the single substrate transport area R2 and the batch substrate transport area R4. One end of the batch processing area R1 is adjacent to the transfer block 5, and the other end of the batch processing area R1 extends in a direction away from the transfer block 5, i.e., toward the rear X.

[0054] The batch processing region R1 is provided with, for example, six batch processing vessels BT1 to BT6 and a second position change mechanism 31. The six batch processing vessels BT1 to BT6 are aligned in a row in the front-rear direction X along which the batch processing region R1 extends. The second position change mechanism 31 is disposed on the opposite side of the transfer block 5, with the six batch processing vessels BT1 to BT6 interposed therebetween. That is, the six batch processing vessels BT1 to BT6 are disposed between the transfer block 5 and the second position change mechanism 31. The second position change mechanism 31 (pusher mechanism 61) is disposed on an extension of the row of the six batch processing vessels BT1 to BT6. The number of batch processing vessels is not limited to six, and may be any plural number.

[0055] Each of the six batch processing tanks BT1 to BT6 immerses a plurality of vertically oriented substrates W in a single process. For example, the six batch processing tanks BT1 to BT6 are composed of four chemical processing tanks BT1 to BT4 and two water rinsing processing tanks BT5 and BT6. Specifically, two chemical processing tanks BT1 and BT2 and a water rinsing processing tank BT5 form one set, and two chemical processing tanks BT3 and BT4 and a water rinsing processing tank BT6 form another set.

[0056] Each of the four chemical treatment tanks BT1 to BT4 performs etching treatment using a chemical solution. For example, phosphoric acid is used as the chemical solution. The chemical treatment tank BT1 stores the chemical solution supplied from a chemical solution jetting pipe (not shown). The chemical solution jetting pipe is provided on the inner wall of the chemical treatment tank BT1. Each of the three chemical treatment tanks BT2 to BT4 has the same configuration as the chemical treatment tank BT1.

[0057] Each of the two water-rinsing processing tanks BT5, BT6 performs a pure water cleaning process in which chemicals adhering to a plurality of substrates W are washed away with pure water. Deionized water (DIW), for example, is used as the pure water. Each of the two water-rinsing processing tanks BT5, BT6 stores pure water supplied from a cleaning liquid jetting pipe (not shown). The cleaning liquid jetting pipe is provided on the inner wall of each of the water-rinsing processing tanks BT5, BT6.

[0058] Six lifters LF1 to LF6 are provided for the six batch processing tanks BT1 to BT6, respectively. For example, the lifter LF1 holds multiple substrates W in a vertical position arranged at a predetermined interval (half pitch). The lifter LF1 also raises and lowers the multiple substrates W between a processing position inside the batch processing tank (chemical processing tank) BT1 and a transfer position above the batch processing tank BT1. The other five lifters LF2 to LF6 are configured similarly to the lifter LF1.

[0059] The second position changing mechanism 31 collectively changes all or some of the plurality of vertically positioned substrates W that have been batch processed to a horizontal position. The second position changing mechanism 31 will be described in detail later.

[0060] <4-2. Single-substrate transport area R2> The single substrate transport area R2 is adjacent to the transfer block 5, the batch processing area R1, the single substrate processing area R3, and the electrical equipment area R5. The single substrate transport area R2 is located between the batch processing area R1 and the single substrate processing area R3. One end of the single substrate transport area R2 is adjacent to the transfer block 5. The other end of the single substrate transport area R2 extends in a direction away from the transfer block 5, i.e., toward the rear X.

[0061] A center robot CR and a buffer unit 33 are provided in the single substrate transfer region R2. The center robot CR transfers substrates between the second position conversion mechanism 31, the single substrate processing chambers SW1 to SW4 (described later), and the buffer unit 33. For example, the center robot CR transfers substrates W in a horizontal position one by one to each of the single substrate processing chambers SW1 to SW4. The center robot CR corresponds to the single substrate transfer mechanism of the present invention.

[0062] The center robot CR includes two hands 35, an advance / retreat section 37, an elevation / rotation section 39, and a horizontal movement section 41 (including a guide rail). Each of the two hands 35 holds one substrate W in a horizontal position.

[0063] The advancing / retreating unit 37 movably supports the hand 35 and individually advances and retreats the hand 35. The lifting and rotating unit 39 rotates the hand 35 and the advancing / retreating unit 37 about the vertical axis AX13. The lifting and rotating unit 39 also raises and lowers the hand 35 and the advancing / retreating unit 37. The guide rail is provided along the direction in which the single-substrate transport region R2 extends and is provided on the floor surface of the single-substrate transport region R2. The horizontal moving unit 41 moves the hand 35, the advancing / retreating unit 37, etc. in the forward / backward direction X along the guide rail. The advancing / retreating unit 37, the lifting and rotating unit 39, and the horizontal moving unit 41 each include an electric motor.

[0064] For example, the advancing / retracting unit 37 may advance two hands 35 to remove the substrate W from the second attitude changing mechanism 31. Thereafter, the advancing / retracting unit 37 may advance one hand 35 holding one substrate W to transport the one substrate W to one single-wafer processing chamber. The center robot CR may be equipped with one hand 35 or three or more hands 35. When equipped with three or more hands 35, the center robot CR advances and retracts the three or more hands 35 individually.

[0065] The buffer unit 33 is equipped with a plurality of loading shelves. Each of the plurality of loading shelves is in a horizontal position. Each of the plurality of loading shelves can load one substrate W. The buffer unit 33 loads the plurality of substrates W in a horizontal position at a predetermined interval (full pitch) in the vertical direction Z. In other words, the plurality of loading shelves are arranged at a predetermined interval (full pitch) in the vertical direction Z. The buffer unit 33 is configured to be able to load at least 25 substrates W that can be transported by the batch transport mechanism HTR. The buffer unit 33 is configured to be able to load, for example, 50 substrates W.

[0066] 1, the buffer unit 33 is specifically disposed across the transfer block 5 and the single substrate transport area R2. That is, the buffer unit 33 is provided at the boundary between the transfer block 5 and the single substrate transport area R2. The buffer unit 33 may also be provided only in the transfer block 5 or the single substrate transport area R2. Therefore, the buffer unit 33 only needs to be fixedly provided at the boundary between the transfer block 5 and the single substrate transport area R2, the transfer block 5, or the single substrate transport area R2. Because the buffer unit 33 is fixed and does not move, the configuration of the buffer unit 33 and its surroundings can be simplified.

[0067] <4-3. Single wafer processing area R3> The single wafer processing area R3 is adjacent to the single substrate transport area R2 and the electrical equipment area R5. One end of the single wafer processing area R3 is located close to the transfer block 5 via the electrical equipment area R5. The electrical equipment area R5 is provided with electrical circuits necessary for the substrate processing apparatus 1 and a control unit 59 (described later). The other end of the single wafer processing area R3 extends in a direction away from the transfer block 5, i.e., toward the rear X. The single wafer processing area R3 is provided along the batch processing area R1 and the single substrate transport area R2.

[0068] A plurality of (for example, four) single wafer processing chambers SW1 to SW4 are provided in the single wafer processing region R3. The four single wafer processing chambers SW1 to SW4 are aligned in the front-rear direction X along which the single wafer processing region R3 extends. Each of the single wafer processing chambers SW1 to SW4 processes a single substrate W. The first single wafer processing chamber SW1 is located at the farthest position from the transfer block 5. The second single wafer processing chamber SW2 is located in front of the first single wafer processing chamber SW1 in the X direction. The third single wafer processing chamber SW3 is located in front of the second single wafer processing chamber SW2 in the X direction. The fourth single wafer processing chamber SW4 is located in front of the third single wafer processing chamber SW3 in the X direction. The single wafer processing chambers SW1 to SW4 may be configured in multiple stages. For example, 12 single wafer processing chambers may be arranged with four in the front-rear direction X (horizontal direction) and three in the vertical direction Z.

[0069] For example, each of the single wafer processing chambers SW1 and SW2 includes a rotation processing unit 45 and a nozzle 47. The rotation processing unit 45 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W. The spin chuck may hold the lower surface of the substrate W by vacuum suction. The spin chuck may also include three or more chuck pins that grip the outer edge of the substrate W.

[0070] The nozzle 47 supplies a processing liquid to the substrate W held in the rotary processing unit 45. The nozzle 47 is moved between a standby position away from the rotary processing unit 45 and a supply position above the rotary processing unit 45. For example, deionized water (DIW) and IPA (isopropyl alcohol) are used as the processing liquid. Each of the single wafer processing chambers SW1 and SW2 may perform a cleaning process on the substrate W with deionized water, and then perform a preliminary drying process with IPA, or may form a liquid film of IPA on the upper surface of the substrate W.

[0071] Each of the single-wafer processing chambers SW3 and SW4 performs a drying process using, for example, a supercritical fluid. Carbon dioxide, for example, is used as the fluid. Each of the single-wafer processing chambers SW3 and SW4 includes a chamber body (container) 48, a support tray, and a lid. The chamber body 48 includes an internal processing space, an opening for inserting the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray. The lid closes the opening of the chamber body 48. For example, each of the single-wafer processing chambers SW3 and SW4 brings a fluid into a supercritical state and supplies the supercritical fluid to the processing space in the chamber body 48 from the supply port. At this time, the processing space in the chamber body 48 is exhausted from the exhaust port. The supercritical fluid supplied to the processing space performs a drying process on the substrate W.

[0072] The supercritical state is achieved by adjusting the fluid to its specific critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes almost zero. Therefore, the gas-liquid interface does not affect the pattern on the substrate W. Therefore, the pattern on the substrate W is less likely to collapse.

[0073] <4-4. Batch substrate transport area R4> The batch substrate transport region R4 is adjacent to the transfer block 5 and the batch processing region R1. The batch substrate transport region R4 is provided along the batch processing region R1. The batch substrate transport region R4 extends in the front-rear direction X. The four regions R1, R2, R3, and R4 are provided to extend parallel to one another.

[0074] The batch substrate transfer region R4 has a first transport mechanism (robot) WTR1. That is, the first transport mechanism WTR1 is provided in the batch substrate transfer region R4. The first transport mechanism WTR1 transports a plurality of substrates W (e.g., 50 substrates) collectively between a substrate transfer position PP defined in the transfer block 5, each of six batch processing baths BT1 to BT6, and the second attitude conversion mechanism 31.

[0075] The first transport mechanism WTR1 includes a pair of chucks 49, 50 and a guide rail 53. Each of the chucks 49, 50 includes 50 holding grooves for holding, for example, 50 substrates W. The two chucks 49, 50 each extend parallel to the Y direction (FIG. 1) in a plan view. The first transport mechanism WTR1 opens and closes the two chucks 49, 50. The first transport mechanism WTR1 moves the pair of chucks 49, 50 along the guide rail 53. The first transport mechanism WTR1 is driven by an electric motor. The first transport mechanism WTR1 corresponds to the first batch substrate transport mechanism of the present invention.

[0076] <5. Control Unit> The substrate processing apparatus 1 includes a control unit 59 and a storage unit (not shown). The control unit 59 controls each component of the substrate processing apparatus 1. The control unit 59 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0077] <6. Second attitude conversion mechanism> FIG. 4(a) is a plan view showing the second position changing mechanism 31. FIG. 4(b) is a side view showing the second position changing mechanism 31. FIG. 5 is a side view for explaining the second transport mechanism WTR2 and the position changing unit 63. The second position changing mechanism 31 includes a pusher mechanism 61, the second transport mechanism WTR2, and the position changing unit 63. The second position changing mechanism 31 corresponds to the changing mechanism of the present invention. The second transport mechanism WTR2 corresponds to the second batch substrate transport mechanism of the present invention.

[0078] <6-1. Pusher mechanism> The pusher mechanism 61 receives multiple vertically oriented substrates W that have been batch processed from the first transport mechanism WTR1. The pusher mechanism 61 is capable of holding the multiple vertically oriented substrates W and rotating the multiple substrates W around a vertical axis AX4. The pusher mechanism 61 includes a pusher 65 and an elevation rotation unit 67.

[0079] The pusher 65 holds a plurality of vertically oriented substrates W that are transported by the first transport mechanism WTR1 and that are arranged at predetermined intervals (e.g., half pitch). The pusher 65 is provided at a position accessible to the first transport mechanism WTR1. That is, the pusher 65 and the six batch processing tanks BT1 to BT6 are arranged linearly in a plan view (see FIG. 1). The lifting and rotating unit 67 lifts and lowers the pusher 65 and rotates the pusher 65 about a vertical axis AX4. The lifting and rotating unit 67 includes, for example, one or more electric motors. The pusher 65 corresponds to the substrate holding unit of the present invention. The rotating and lifting unit 67 corresponds to the rotating unit of the present invention.

[0080] <6-2. Second batch transfer mechanism> The second transport mechanism (robot) WTR2 transports multiple substrates W from a pusher 65. The second transport mechanism WTR2 includes two chucks (horizontal chucks) 69, 70, an opening / closing unit 71, a lifting unit 73, and a horizontal movement unit 75. As shown in Fig. 5, the chucks 69, 70 hold multiple substrates W in a vertical position by pinching two side portions of the outer edge of each of the multiple substrates W in the radial direction. Each of the chucks 69, 70 corresponds to a horizontal chuck of the present invention.

[0081] Each of the two chucks 69, 70 has a plurality of (e.g., 25) V-shaped holding grooves 78 and a plurality of (e.g., 25) passing grooves 80. The V-shaped holding grooves 78 and the passing grooves 80 are arranged alternately. The innermost part of each V-shaped holding groove 78 has a V-shaped cross section. The V-shaped holding groove 78A of the chuck 69 faces the V-shaped holding groove 78B of the chuck 70. This allows each pair of V-shaped holding grooves 78A, 78B to hold one substrate W. The 25 pairs of V-shaped holding grooves 78 of the two chucks 69, 70 each hold 25 substrates W in a vertical position. This prevents two adjacent substrates W from adhering to each other. This, for example, can prevent the substrates W from being scratched.

[0082] The passing grooves 80 do not hold the substrates W. The V-shaped holding grooves 78 are arranged at predetermined intervals (for example, full pitch). The passing grooves 80 are also arranged at predetermined intervals (for example, full pitch). This allows the second transport mechanism WTR2 to extract every other substrate W from the plurality of substrates W arranged at half pitch.

[0083] The opening / closing unit 71 shown in FIG. 4(a) swings (rotates) the chuck 69 around the horizontal axis AX5 and swings the chuck 70 around the horizontal axis AX6. This allows the opening / closing unit 71 to clamp and hold the substrate W, and to release the clamped state of the substrate W. When the substrate W is clamped between the chucks 69 and 70, the width of the two innermost portions of the V-shaped holding grooves 78A and 78B becomes smaller than the diameter of each substrate W. Therefore, the substrate W is held. The two horizontal axes AX5 and AX6 each extend in the front-rear direction X in which the substrates W are aligned. Furthermore, the horizontal axis AX5 extends parallel to the horizontal axis AX6.

[0084] The lifting unit 73 lifts and lowers the chucks 69, 70 and the opening / closing unit 71. The horizontal moving unit 75 moves the chucks 69, 70 and the lifting unit 73 in the width direction Y (see FIG. 4(a)). The horizontal moving unit 75 moves the chucks 69, 70 between a position above the pusher 65 and a delivery position for the attitude changing unit 63. The opening / closing unit 71, the lifting unit 73, and the horizontal moving unit 75 each include, for example, an electric motor.

[0085] The upper end of each of the chucks 69, 70 is preferably lower than the upper end of each of the substrates W that it holds. The lower end of each of the chucks 69, 70 is preferably higher than the lower end of each of the substrates W that it holds. This allows the chucks 69, 70 that hold the substrates W to easily pass between the upper chuck 81 and the lower chuck 83, which will be described later. Therefore, the chucks 69, 70 can smoothly transfer the substrates W to the upper and lower chucks 81, 83.

[0086] <6-3. Posture conversion unit> Fig. 6(a) is a plan view showing the auxiliary chuck opening / closing part 87 of the attitude changing part 63. Fig. 6(b) is a side view showing the advancing / retreating part 88 of the attitude changing part 63. Figs. 7(a) and 7(b) are diagrams for explaining the operation of the advancing / retreating part 88 of the attitude changing part 63.

[0087] See Figures 4(a), 4(b), 6(a), etc. The attitude conversion unit 63 converts the attitude of the substrate W transported by the second transport mechanism WTR2 from vertical to horizontal. The attitude conversion unit 63 is provided in a position accessible to the center robot CR. The attitude conversion unit 63 includes an upper chuck 81, a lower chuck 83, an upper chuck moving unit 84, two auxiliary chucks 85 and 86, an auxiliary chuck opening / closing unit 87, an advancing / retracting unit 88, an upper and lower chuck rotating unit 89, a support arm 90, and a base frame 91. The advancing / retracting unit 88 corresponds to the relative moving unit of the present invention.

[0088] The upper chuck 81 and the lower chuck 83 (hereinafter referred to as "upper and lower chucks 81, 83" as appropriate) radially sandwich the upper and lower outer edges of each of the multiple substrates W in a vertical position held by the two chucks 69, 70. This allows the upper chuck 81 and the lower chuck 83 to directly receive the substrates W from the two chucks 69, 70 of the second transport mechanism WTR2.

[0089] The upper chuck 81 is movably mounted on the support arm 90. The upper chuck moving unit 84 can move the upper chuck 81 closer to the lower chuck 83 or move the upper chuck 81 away from the lower chuck 83. The upper chuck moving unit 84 is mounted on the support arm 90. The upper chuck moving unit 84 includes, for example, a linear actuator having an electric motor. The lower chuck 83 is not movable but is fixed to the support arm 90.

[0090] As shown in FIG. 5, the upper chuck 81 has a plurality of (e.g., 25) first horizontal placement guide grooves 93. Similarly, the lower chuck 83 has a plurality of (e.g., 25) second horizontal placement guide grooves 94. For example, the 25 first horizontal placement guide grooves 93 are configured to accommodate the outer edges of 25 substrates W, respectively. Furthermore, the 25 second horizontal placement guide grooves 94 are configured to accommodate the outer edges of 25 substrates W, respectively. Each of the horizontal placement guide grooves 93, 94 has a placement surface 95 for placing one substrate W thereon (see FIG. 7(a)).

[0091] Furthermore, each of the horizontal placement guide grooves 93, 94 has a width WD that is wider than the thickness TC of each substrate W. That is, from the entrance to the back of each of the horizontal placement guide grooves 93, 94, the width WD of each groove 93, 94 is wider than the thickness TC of each substrate W. This allows for space to lift the substrate W when the center robot CR removes the substrate W from the upper and lower chucks 81, 83 after converting the orientation of the substrate W to horizontal, so that the substrate W can be removed without applying any load to it.

[0092] That is, when the hand 35 of the center robot CR takes out one substrate W in a horizontal position from the horizontal placement guide grooves 93, 94, it can lift up the one substrate W in a horizontal position within the horizontal placement guide grooves 93, 94. This is because the horizontal placement guide grooves 93, 94 have a space in which the substrate W can move freely.

[0093] Furthermore, when the upper chuck 81 and the lower chuck 83 sandwich the substrate W, a gap GP (space) is provided for moving the substrate W in the radial direction of the substrate W within the horizontal placement guide grooves 93, 94.

[0094] Auxiliary chucks 85, 86 hold the underside of each substrate W. The two auxiliary chucks 85, 86 are provided on both sides of the lower chuck 83 along the circumferential direction of each substrate W. Explaining this in more detail with reference to FIG. 5, when the two chucks 69, 70, the upper chuck 81, and the lower chuck 83 sandwich each substrate W, the first auxiliary chuck 85 is disposed between the chuck 69 and the lower chuck 83. Furthermore, the second auxiliary chuck 86 is disposed between the chuck 70 and the lower chuck 83.

[0095] Similar to the chucks 69 and 70, each of the two auxiliary chucks 85 and 86 has a plurality of (for example, 25) V-shaped holding grooves 97. The innermost part of each holding groove 97 is formed to have a V-shaped cross section.

[0096] When the upper chuck 81 and the lower chuck 83 hold the substrate W in a "vertical position", the auxiliary chucks 85 and 86 each hold the substrate W in a vertical position by accommodating the outer edge of the substrate W in the V-shaped holding groove 97. Also, when the upper chuck 81 and the lower chuck 83 hold the substrate W in a "horizontal position", the two auxiliary chucks 85 and 86 each release the substrate W from the V-shaped holding groove 97 and move away from the substrate W to a position where they do not interfere with the removal of the substrate W by the center robot CR.

[0097] When the upper chuck 81 and the lower chuck 83 hold the substrate W in a vertical position, the two closed auxiliary chucks 85, 86 hold the substrate W in a vertical position, preventing two adjacent substrates from adhering to each other. Furthermore, when the horizontally oriented substrate W is removed from the upper chuck 81 and the lower chuck 83, the two auxiliary chucks 85, 86 are in an open position, so do not interfere with the removal of the substrate W by the center robot CR.

[0098] The auxiliary chuck opening / closing unit 87 is provided on the support arm 90 via an advancing / retreating unit 88. The auxiliary chuck opening / closing unit 87 swings (rotates) the first auxiliary chuck 85 about the horizontal axis AX7 and swings the second auxiliary chuck 86 about the horizontal axis AX8. This will be described with reference to FIG. 6(a). The auxiliary chuck opening / closing unit 87 includes, for example, an electric motor 87A, a first gear 87B, a second gear 87C, a third gear 87D, a fourth gear 87E, a first shaft 87F, and a second shaft 87G.

[0099] The first gear 87B is fixed to an output shaft 87H of the electric motor 87A. The second gear 87C is fixed to a first shaft 87F. The first shaft 87F is supported rotatably about a horizontal axis AX7. A first auxiliary chuck 85 is coupled to the tip of the first shaft 87F. The third gear 87D is supported rotatably about a horizontal axis. The fourth gear 87E is fixed to a second shaft 87G. The second shaft 87G is supported rotatably about a horizontal axis AX8. A second auxiliary chuck 86 is coupled to the tip of the second shaft 87G.

[0100] The two gears 87B and 87C mesh with each other. The two gears 87B and 87D mesh with each other. Furthermore, the two gears 87D and 87E mesh with each other. When the electric motor 87A rotates the output shaft 87H in the forward direction, the auxiliary chucks 85 and 86 hold the substrate W. On the other hand, when the electric motor 87A rotates the output shaft 87H in the reverse direction, the auxiliary chucks 85 and 86 move away from the substrate W, and the state in which they hold the substrate W is released.

[0101] The two horizontal axes AX7 and AX8 each extend in the front-rear direction X in which the substrate W is aligned. The horizontal axis AX7 extends parallel to the horizontal axis AX8. When the auxiliary chucks 85 and 86 are not holding the substrate W, the auxiliary chuck opening / closing unit 87 moves the pair of auxiliary chucks 85 and 86 outward from the dashed line 101, as shown by the dashed line in FIG.

[0102] 6(b), the advancing / retracting unit 88 is provided on the support arm 90. The advancing / retracting unit 88 moves (advance and retreat) the auxiliary chucks 85, 86 relative to the upper and lower chucks 81, 83 in the front-rear direction X in which the substrates W are aligned. The advancing / retracting unit 88 includes, for example, an electric motor 88A, a screw shaft 88B, a slider 88C, and a guide rail 88D.

[0103] An output shaft 88E of the electric motor 88A is connected to one end of the screw shaft 88B. The screw shaft 88B penetrates the slider 88C while meshing with a nut portion 88F of the slider 88C. A guide rail 88D penetrates the slider 88C. The slider 88C can move freely relative to the guide rail 88D. The slider 88C is connected to an auxiliary chuck opening / closing portion 87. The screw shaft 88B and the guide rail 88D extend in the front-rear direction X in which the substrates W are aligned. When the electric motor 88A rotates the output shaft 88E in the forward direction, the auxiliary chucks 85 and 86 advance relative to the upper and lower chucks 81 and 83. Conversely, when the electric motor 88A rotates the output shaft 88E in the reverse direction, the auxiliary chucks 85 and 86 retreat relative to the upper and lower chucks 81 and 83.

[0104] When the attitude changing unit 63 changes the attitude of the substrate W from vertical to horizontal, the advancing / retreating unit 88 moves the two auxiliary chucks 85, 86 so that the vertically oriented substrate W accommodated in the V-shaped holding groove 97 comes into contact with the mounting surface 95. This will be described in detail with reference to Figures 7(a) and 7(b). In Figures 7(a) and 7(b), for convenience of illustration, it is assumed that the upper and lower chucks 81, 83 are disposed at the left end of the substrate W, and the auxiliary chucks 85, 86 are disposed at the right end of the substrate W.

[0105] 7(a) shows the state immediately after the attitude changing unit 63 receives the substrate W from the second transport mechanism WTR2 using the upper and lower chucks 81, 83 and the auxiliary chucks 85, 86. That is, the outer edge of the substrate W is located at the back of the V-shaped holding groove 97 and at the center of the width WD of the horizontal placement guide grooves 93, 94.

[0106] The advancing / retracting unit 88 can move the auxiliary chucks 85, 86 between the contact position and the standby position. When changing the posture of the substrate W, the advancing / retracting unit 88 retracts the auxiliary chucks 85, 86 from the standby position to the contact position (moves them backward X). As a result, as shown in FIG. 7(b), the back surface of the substrate W in a vertical posture held by the V-shaped holding groove 97 comes into contact with or is close to the placement surfaces 95 of the horizontal placement guide grooves 93, 94 of the upper and lower chucks 81, 83, respectively.

[0107] When the auxiliary chucks 85, 86 are not holding the substrate W, the substrate W can move freely within the horizontal placement guide grooves 93, 94. However, when the attitude is changed, the substrate W moves within the horizontal placement guide grooves 93, 94 and collides with other objects. This may result in the generation of particles. Therefore, by using the advance / retract section 88 to bring the substrate W into contact with the placement surface 95, the impact caused by the collision of the substrate W can be reduced. This makes it possible to suppress the generation of particles.

[0108] 4(b) rotates the upper and lower chucks 81 and 83 around a horizontal axis AX9 that is perpendicular to the alignment direction (front-rear direction X) of the 25 substrates W in a vertical position held by the upper and lower chucks 81 and 83. This converts the position of the 25 substrates W received by the two chucks 69 and 70 from vertical to horizontal.

[0109] The upper and lower chuck rotating unit 89 is provided on a base frame 91. The base frame 91 includes, for example, a beam member 91A extending horizontally in the front-rear direction X, and two pillar members 91B supporting both ends of the beam member. The upper and lower chuck rotating unit 89 supports the upper and lower chucks 81, 83 rotatably about a horizontal axis AX9 via an L-shaped support arm 90. The upper and lower chuck rotating unit 89 includes, for example, an electric motor.

[0110] <6. Operational Description> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of Figures 8 to 10. See Figure 1. An external transfer robot (not shown) transfers two carriers C to the load port 9 in turn.

[0111] [Step S01] Transferring substrates from carriers The carrier transport mechanism 11 in the stocker block 3 transports the first carrier C from the load port 9 to the shelf 13A. The bulk transport mechanism HTR in the transfer block 5 takes out 25 substrates W1 in a horizontal position from the first carrier C placed on the shelf 13A and transports them to the attitude changing unit 23. The carrier transport mechanism 11 then transports the empty first carrier C to the shelf 13B. The carrier transport mechanism 11 then transports the second carrier C from the load port 9 to the shelf 13A. The bulk transport mechanism HTR takes out 25 substrates W2 in a horizontal position from the second carrier C placed on the shelf 13A and transports them to the attitude changing unit 23.

[0112] [Step S02] Transformation to vertical posture Fifty substrates W (W1, W2) on two carriers C are transported to the attitude conversion unit 23. As shown in Figures 3(a) to 3(f), the attitude conversion unit 23 and pusher mechanism 25 align the 50 substrates W face-to-face at a half pitch (5 mm) and convert the attitude of the 50 substrates W from horizontal to vertical, 25 at a time. The pusher mechanism 25 transports the 50 substrates W in the vertical attitude to a substrate transfer position PP defined within the transfer block 5.

[0113] [Step S03] Chemical treatment (batch treatment) The first transport mechanism WTR1 receives 50 substrates W in a vertical position from the pusher mechanism 25 at the substrate transfer position PP, and transports the 50 substrates W to any one of the four lifters LF1 to LF4 of the four chemical liquid processing tanks BT1 to BT4.

[0114] For example, the first transport mechanism WTR1 transports 50 substrates W to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 50 substrates W in phosphoric acid, which serves as the treatment liquid in the chemical liquid treatment tank BT1. This allows the 50 substrates W to be etched. After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the chemical liquid treatment tank BT1. Note that when the 50 substrates W are transported to the lifters LF2 to LF4 of the other chemical liquid treatment tanks BT2 to BT4, the same treatment as in the chemical liquid treatment tank BT1 is performed.

[0115] [Step S04] Pure water cleaning process (batch processing) The first transport mechanism WTR1 receives 50 substrates W in a vertical position from, for example, the lifter LF1 (or lifter LF2), and transports the 50 substrates W to the lifter LF5 in the water washing processing tank BT5. The lifter LF5 receives the 50 substrates W at a position above the water washing processing tank BT5. The lifter LF5 immerses the 50 substrates W in the pure water in the water washing processing tank BT5. This causes the 50 substrates W to undergo a cleaning process.

[0116] When the first transport mechanism WTR1 receives 50 vertically oriented substrates W from one of the lifters LF3 and LF4, the first transport mechanism WTR1 transports the 50 substrates W to the lifter LF6 in the water washing processing tank BT6. The lifter LF6 receives the 50 substrates W at a position above the water washing processing tank BT6. The lifter LF6 immerses the 50 substrates W in the pure water in the water washing processing tank BT6.

[0117] In this embodiment, the second position changing mechanism 31 is provided on the opposite side of the transfer block 5, with six batch processing tanks BT1 to BT6 interposed therebetween. The first transport mechanism WTR1 transports 50 substrates W in a batch from, for example, the batch processing tank BT1 (BT3) on the side closer to the transfer block 5, via the batch processing tank BT5 (BT6) on the side farther from the transfer block 5, to the second position changing mechanism 31.

[0118] [Step S05] Transform to horizontal position The second position change mechanism 31 collectively changes the position of the substrates W that have been cleaned from vertical to horizontal. However, the following problem occurs: When the position of 50 substrates W arranged at half pitch (5 mm intervals) is collectively changed, one hand 35 of the center robot CR may not be able to properly enter the gap between two adjacent substrates W among the 50 substrates W.

[0119] Furthermore, when the substrates W are aligned face-to-face, some of the substrates W converted to a horizontal position have their device surfaces facing upward, while others have their device surfaces facing downward. For example, it is undesirable for the hand 35 of the center robot CR to come into contact with the device surfaces of the substrates W. Furthermore, it is undesirable for substrates W with device surfaces facing different directions to be transported to each of the single-wafer processing chambers SW1 to SW4.

[0120] Therefore, in this embodiment, the distance between two adjacent substrates W is widened and the orientations of the device surfaces of 50 substrates W are aligned with one another. This will be specifically described with reference to the flowcharts of Figures 9 and 10, Figures 11(a) to 11(d), Figures 12(a) to 12(d), and Figures 13(a) to 13(d).

[0121] [Step S11] Transporting the substrate to the pusher mechanism See Figure 11(a). Figures 11(a) to 11(d) are plan views for explaining the operation of the second position changing mechanism 31. The first transport mechanism WTR1 transports 50 substrates W from one of the lifters LF5 and LF6 to the pusher mechanism 61 of the second position changing mechanism 31 (see Figure 1). The pushers 65 of the pusher mechanism 61 hold the 50 substrates W in a vertical position arranged at half pitch and in a face-to-face manner. The 50 substrates W are aligned along the width direction Y.

[0122] The second transport mechanism WTR2 waits on the side of the attitude changing part 63 so as not to interfere with the first transport mechanism WTR1. After transporting the substrate W to the pusher mechanism 61, the first transport mechanism WTR1 moves from above the pusher mechanism 61.

[0123] [Step S12] Rotate the substrate around the vertical axis by the pusher mechanism 11(b), the lifting and rotating unit 67 of the pusher mechanism 61 rotates the 50 substrates W by 90 degrees counterclockwise around the vertical axis AX4 in a plan view. This enables the pusher mechanism 61 to transfer the substrates W to the second transport mechanism WTR2, and also enables the device surfaces of the 25 substrates W1 of the first substrate group to face upward when the orientation is changed.

[0124] [Step S13] Transport of the substrate (W1) by the second batch transport mechanism The second transport mechanism WTR2 moves to the substrate standby side. That is, the second transport mechanism WTR2 moves so that the chucks 69, 70 are positioned above the 50 substrates W held by the pusher 65. The opening / closing unit 71 opens the chucks 69, 70 so that the 50 substrates W can pass between them.

[0125] 11(c), after the chucks 69, 70 arrive above the substrates W, the lifting unit 73 of the second transport mechanism WTR2 lowers the chucks 69, 70 below the center of the substrates W. Thereafter, the opening / closing unit 71 closes the chucks 69, 70 to sandwich the 50 substrates W. At this time, the 25 substrates W1 are positioned in the 25 V-shaped holding grooves 78, respectively, and the 25 substrates W2 are positioned in the 25 passing grooves 80, respectively.

[0126] After the 50 substrates W are clamped by the chucks 69, 70, the lifting unit 73 raises the chucks 69, 70. This enables the second transport mechanism WTR2 to extract the 25 substrates W1 arranged at full pitch (for example, 10 mm intervals) from the 50 substrates W (W1, W2) held by the pusher 65. In other words, the 25 substrates W2 of the second substrate group are left on the pusher 65.

[0127] See Figure 11(d). The second transport mechanism WTR2 transports 25 substrates W1 in a batch between the upper and lower chucks 81, 83 of the posture conversion unit 63. At this time, the upper chuck 81 has been moved by the upper chuck moving unit 84 to an open position away from the lower chuck 83. The auxiliary chucks 85, 86 are closed so as to be able to hold the substrates W in a vertical posture. The auxiliary chucks 85, 86 may also be open.

[0128] Furthermore, the lifting and rotating unit 67 of the pusher mechanism 61 rotates the 25 substrates W2 held by the pusher 65 by 180 degrees around the vertical axis AX4. This allows the device surfaces of the 25 substrates W2 of the second substrate group to face upward when their postures are changed. Furthermore, the 180-degree rotation causes the position of each substrate W2 to move backward X by half a pitch compared to before the rotation. Therefore, when the 25 substrates W2 are transported, they can be accommodated in the V-shaped holding grooves 78 of the chucks 69 and 70. Note that this 180-degree rotation of the substrates W2 is preferably performed in steps S13 to S17.

[0129] [Step S14] Transfer the substrate (W1) to the posture change unit Please refer to Figure 12(a). Figures 12(a) to 12(d) are front views for explaining the operation of the second attitude change mechanism 31, i.e., views seen from the single-substrate transport region R2. Furthermore, Figure 12(a) is a front view of the state shown in Figure 11(d) in which the second transport mechanism WTR2 has moved 25 substrates W1 between the upper and lower chucks 81, 83.

[0130] 12(b), the auxiliary chucks 85 and 86 are closed so as to hold the substrates W in a vertical position. The lifting unit 73 of the second transport mechanism WTR2 lowers the 25 substrates W1 held by the chucks 69 and 70 until the substrates W1 contact the V-shaped holding grooves 97 of the auxiliary chucks 85 and 86. That is, the lifting unit 73 lowers the 25 substrates W1 until the 25 substrates W1 are held by the 25 V-shaped holding grooves 97. Once the 25 substrates W1 are held by the 25 V-shaped holding grooves 97 of each of the auxiliary chucks 85 and 86, the outer edges of the 25 substrates W1 are accommodated in the second horizontal placement guide groove 94 of the lower chuck 83.

[0131] Thereafter, the upper chuck moving unit 84 lowers the upper chuck 81 to bring the upper chuck 81 closer to the lower chuck 83. As a result, the outer edges of the 25 substrates W1 are accommodated in the first horizontal placement guide grooves 93 of the upper chuck 81. In addition, the 25 substrates W1 are held (gripped) by the upper and lower chucks 81, 83 and the auxiliary chucks 85, 86.

[0132] 12(c). Thereafter, the opening / closing unit 71 of the second transport mechanism WTR2 opens the chucks 69, 70. This releases the 25 substrates W1 from their hold. The 25 substrates W1 are then transferred to the attitude changing unit 63. Thereafter, the lifting unit 73 of the second transport mechanism WTR2 raises the chucks 69, 70 above the substrates W. This moves the second transport mechanism WTR2 to a position where it does not interfere with the attitude changing unit 63.

[0133] [Step S15] Contact of the mounting surface with the substrate (W1) As shown in Fig. 6(b), the advancing / retreating unit 88 retracts the auxiliary chucks 85, 86 (moves them backward X). That is, the advancing / retreating unit 88 brings the 25 substrates W1 held in the 25 V-shaped holding grooves 97 into contact with the placement surfaces 95 of the horizontal placement guide grooves 93, 94 (see Figs. 7(a) and 7(b)). This makes it possible to prevent collisions caused by the movement of the substrates W1 during posture changes and the opening operation of the auxiliary chucks 85, 86.

[0134] [Step S16] Posture conversion by the posture conversion unit See Figure 12(d). Then, the upper and lower chuck rotator 89 of the attitude conversion unit 63 rotates the upper and lower chucks 81, 83, etc., which hold the 25 substrates W1, counterclockwise by 90 degrees around the horizontal axis AX9. This allows the attitudes of the 25 substrates W1 in the first substrate group to be converted from vertical to horizontal. After the 90-degree rotation, the auxiliary chuck opener / closer 87 opens the auxiliary chucks 85, 86 to positions where they do not interfere with the transport of the substrates W1 by the center robot CR. In other words, the auxiliary chucks 85, 86 are moved to the positions indicated by the dashed lines in Figure 5.

[0135] [Step S17] Transport of substrate (W1) by center robot After opening the auxiliary chucks 85, 86, the center robot CR uses the two hands 35 to sequentially remove the 25 horizontally oriented substrates W1 held by the upper and lower chucks 81, 83, and transport the substrates W1 to the single-wafer processing chambers SW1, SW2. The spacing between the substrates W has been increased from half pitch to full pitch. This allows the hands 35 of the center robot CR to easily enter the gap between two adjacent substrates W. This allows the substrates W to be removed smoothly.

[0136] The center robot CR transfers the 25 substrates W1 of the first substrate group from the posture changing section 63, and then changes the posture of the 25 substrates W2 of the second substrate group. Steps S18 to S22 are similar to steps S13 to S17, so the overlapping parts will be explained briefly.

[0137] [Step S18] Transport of substrate (W2) by second batch transport mechanism See Figure 13(a). Figures 13(a) and 13(b) are plan views for explaining the operation of the second position changing mechanism 31. The second transport mechanism WTR2 moves so that the chucks 69, 70 are positioned above the 25 substrates W2 held by the pusher 65. The chucks 69, 70 are in an open state.

[0138] Thereafter, the lifting unit 73 of the second transport mechanism WTR2 lowers the chucks 69, 70 below the center of the substrates W2. Thereafter, the opening / closing unit 71 closes the chucks 69, 70 to clamp the 25 substrates W2. In step S13, the substrates W2 are rotated 180 degrees, and the position of each substrate W2 moves by a half pitch. Therefore, when the chucks 69, 70 are closed, the 25 substrates W2 are positioned in the 25 V-shaped holding grooves 78, respectively.

[0139] Thereafter, the elevator 73 raises the chucks 69 and 70. As a result, the second transport mechanism WTR2 lifts up the 25 substrates W2 held by the pusher 65.

[0140] 13(b). Thereafter, the second transport mechanism WTR2 transports 25 substrates W2 in a batch between the upper and lower chucks 81, 83 of the attitude changing section 63. After the second transport mechanism WTR2 has transported the 25 substrates W2, the pusher 65 is no longer holding any substrates W. Therefore, the first transport mechanism WTR1 can transport the next 50 substrates W from one of the lifters LF3, LF6 to the pusher 65.

[0141] [Step S19] Transfer the substrate (W2) to the posture change unit See Figure 13(c). Figures 13(c) and 13(d) are front views of the second position conversion mechanism 31. The 25 substrates W2 held by the chucks 69 and 70 are positioned between the upper and lower chucks 81 and 83. The auxiliary chucks 85 and 86 are closed so that they can hold the substrates W2 in a vertical position. The auxiliary chucks 85 and 86 have been moved by the advance / retract unit 88 from the contact position (the state in Figure 7(b)) to the standby position (the state in Figure 7(a)).

[0142] Thereafter, the lifting unit 73 of the second transport mechanism WTR2 lowers the 25 substrates W2 held by the chucks 69, 70 until the 25 V-shaped holding grooves 97 of each of the auxiliary chucks 85, 86 hold the 25 substrates W2. Thereafter, the upper chuck moving unit 84 lowers the upper chuck 81. As a result, the 25 substrates W2 are held (grasped) by the upper and lower chucks 81, 83 and the auxiliary chucks 85, 86.

[0143] Thereafter, the opening / closing unit 71 of the second transport mechanism WTR2 opens the chucks 69, 70. This releases the 25 substrates W2 from their hold, and the 25 substrates W2 are transferred to the attitude changing unit 63. Thereafter, the lifting unit 73 of the second transport mechanism WTR2 raises the chucks 69, 70 to a position above the substrates W where they do not interfere with the attitude changing unit 63.

[0144] [Step S20] Contact of the mounting surface with the substrate (W2) Thereafter, the advancing / retreating section 88 brings the 25 substrates W2 held in the 25 V-shaped holding grooves 97 into contact with the placement surfaces 95 of the horizontal placement guide grooves 93, 94 (see FIGS. 7(a) and 7(b)).

[0145] [Step S16] Posture conversion by the posture conversion unit See Figure 13(d). Then, the upper and lower chuck rotation unit 89 of the attitude conversion unit 63 rotates the upper and lower chucks 81, 83, etc., which hold the 25 substrates W2, by 90 degrees counterclockwise around the horizontal axis AX9. This converts the attitude of the 25 substrates W2 from a vertical attitude to a horizontal attitude. After the 90-degree rotation, the auxiliary chuck opening / closing unit 87 opens the auxiliary chucks 85, 86 to the positions indicated by the dashed lines in Figure 5.

[0146] [Step S17] Transport of substrate (W2) by center robot After opening the auxiliary chucks 85 and 86, the center robot CR sequentially takes out the 25 horizontally oriented substrates W2 and transports the substrates W2 to one of the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2.

[0147] [Step S06] First single wafer processing Returning to the explanation of the flowchart in Fig. 8, for example, the center robot CR transports the substrate W (W1, W2) from the attitude conversion unit 63 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1 supplies pure water to the device surface from the nozzle 47 while rotating the substrate W with the device surface facing upward by, for example, the rotation processing unit 45. Thereafter, the first single-wafer processing chamber SW1 supplies IPA from the nozzle 47 to the device surface (upper surface) of the substrate W to replace the pure water on the substrate W with IPA.

[0148] [Step S07] Second Single-Wafer Processing (Drying Processing) Thereafter, the center robot CR removes the substrate W wetted with IPA from the first single wafer processing chamber SW1 (SW2) and transports the substrate W to one of the single wafer processing chambers SW3 and SW4. Each of the single wafer processing chambers SW3 and SW4 performs a drying process on the substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid prevents pattern collapse on the device surface of the substrate W.

[0149] [Step S08] Transferring substrates from the buffer unit to the carrier The center robot CR transports the dried substrates W from one of the single-wafer processing chambers SW3, SW4 to one of the loading shelves in the buffer unit 33. When one lot (25 substrates) of substrates W1 have been transported to the buffer unit 33, the batch transport mechanism HTR transports all 25 substrates W1 from the buffer unit 33 into an empty first carrier C placed on the shelf 13A. Thereafter, the carrier transport mechanism 11 in the stocker block 3 transports the first carrier C to the load port 9.

[0150] Furthermore, when one lot of substrates W2 is placed in the buffer section 33, the batch transport mechanism HTR transports 25 substrates W2 in a batch from the buffer section 33 into an empty second carrier C placed on the shelf 13A. Thereafter, the carrier transport mechanism 11 in the stocker block 3 transports the second carrier C to the load port 9. An external transport mechanism (not shown) transports the two carriers C in turn to their next destinations.

[0151] According to this embodiment, the upper and lower chucks 81, 83 of the attitude conversion unit 63 clamp the upper and lower outer edges of the substrate W1 (W2) in a vertical position held by the two horizontal chucks 69, 70 of the second transport mechanism WTR2. This allows the attitude conversion unit 63 to directly receive the substrate W1 (W2) from the two horizontal chucks 69, 70 of the second transport mechanism WTR2. The pusher 65 is provided at a position accessible to the first transport mechanism WTR1, and the attitude conversion unit 63 is provided at a position accessible to the center robot CR. Therefore, even if the position where the pusher 65 receives the substrate W from the first transport mechanism WTR1 is far from the center robot CR, the second transport mechanism WTR2 can transport the substrate W from the pusher 65 to the attitude conversion unit 63. This allows easy access for the center robot CR.

[0152] Furthermore, the upper and lower chuck rotation unit 89 rotates the upper and lower chucks 81, 83 around a horizontal axis AX9 that is perpendicular to the alignment direction of the multiple vertically oriented substrates W1 (W2) held by the upper and lower chucks 81, 83. This allows the substrate W1 (W2) to be removed from between the upper and lower chucks 81, 83, and also allows access to the attitude conversion unit 63 along the horizontal axis AX9 that is perpendicular to the alignment direction of the substrates W1 (W2).

[0153] The second position change mechanism 31 further includes an elevation rotation unit 67 that rotates the pusher 65 around the vertical axis AX4. The substrate W can be delivered to the second transport mechanism WTR2 in any orientation. Furthermore, the substrate W in the horizontal position after the position change can be oriented in any orientation.

[0154] Furthermore, the batch processing tanks BT1 to BT6 and the second position change mechanism 31 are arranged in the horizontal front-rear direction X (first direction), and the second transport mechanism WTR2 transports multiple substrates W from the pusher 65 along the horizontal width direction Y (second direction) perpendicular to the front-rear direction X. If the batch processing tanks BT1 to BT6 and their surrounding structure are long in the width direction Y, it may be difficult for the hand 35 of the center robot CR to access them. Because the second transport mechanism WTR2 can move in the width direction Y, the position change part 63 can be brought closer to the center robot CR. This allows the center robot CR to easily transport the substrates W.

[0155] Each of the two horizontal chucks 69, 70 has two or more V-shaped holding grooves 78 for holding a predetermined number of two or more substrates W1 (W2) from the plurality of substrates W. The second transport mechanism WTR2 uses the two horizontal chucks 69, 70 to extract two or more substrates W1 (W2) from the plurality of substrates W in a vertical position held by the pusher 65. The second transport mechanism WTR2 can extract and transport two or more substrates W1 (W2) from the substrates W held by the pusher 65. Example 2

[0156] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first embodiment will be omitted. Fig. 14(a) is a vertical cross-sectional view showing a pusher mechanism 61 of a second position change mechanism 31 according to the second embodiment. Fig. 14(b) is a plan view showing the second position change mechanism 31 according to the second embodiment.

[0157] 14(a). The pusher mechanism 61 of the second position change mechanism 31 of the second embodiment includes a standby tank 107 that stores liquid so that the substrate W held by the pusher 65 is immersed in the liquid when the pusher 65 is lowered, and two ejection pipes 109 that supply the liquid, such as deionized water (DIW), to the standby tank 107. The ejection pipes 109 are formed to extend linearly in the front-rear direction X or the width direction Y. The ejection pipes 109 include a plurality of ejection ports 109A (nozzles for holders) in the direction in which the ejection pipes 109 extend. Each of the plurality of ejection ports 109A ejects deionized water. The standby tank 107 stores the deionized water ejected by the ejection pipes 109.

[0158] For example, as shown in FIG. 11(d), while the posture change unit 63 is changing the posture of the substrate W1, the waiting substrate W2 can be immersed in pure water in the waiting tank 107, thereby preventing the substrate W from drying out.

[0159] It is noted that the standby tank 107 does not have to store pure water. In this case, the nozzle 109A of the jet pipe 109 may supply pure water in the form of a shower or mist to the substrate W held by the pusher 65. The nozzle 109A may also be disposed at a position higher than the substrate W, as shown by the dashed jet pipe 109 in FIG. 14(a). When pure water is supplied to the substrate W in the form of a shower or mist, the standby tank 107 may or may not be provided.

[0160] 14(b), the second position changing mechanism 31 includes a first group of nozzles 111 and a second group of nozzles 112. The nozzles 111 and 112 are nozzles for the position changing unit 63. The nozzles 111 and 112 each supply a liquid, such as deionized water (DIW), in the form of a shower or mist onto the substrate W held by the upper and lower chucks 81 and 83 of the position changing unit 63. The first group of nozzles 111 and the second group of nozzles 112 are arranged to sandwich the substrate W in a plan view. The nozzles 111 and 112 are provided at a higher position than the substrate W. The nozzles 111 and 112 may be configured to be movable so as not to interfere with the second transport mechanism WTR2.

[0161] The upper and lower chuck rotation unit 89 positions the substrate W held by the upper and lower chucks 81, 83 in either a vertical position or an oblique position. In this state, the nozzles 111, 112 supply pure water in the form of a shower or mist onto the substrate W held by the upper and lower chucks 81, 83. The oblique position is a position in which the device surface of the substrate faces upward.

[0162] For example, when the center robot CR suspends the transport of the substrate W, the substrate W held by the upper and lower chucks 81, 83 can be prevented from drying out. Also, if the orientation of the substrate W is horizontal during supply, the shower or mist of pure water is unlikely to reach the entire device surface. However, by positioning the substrate W in either a vertical orientation or an oblique orientation with the device surface facing upward, the shower or mist of pure water can more easily reach the entire device surface.

[0163] The substrate processing apparatus 1 may employ both the configuration shown in Fig. 14(a) and the configuration shown in Fig. 14(b). Alternatively, the substrate processing apparatus 1 may employ only one of the configuration shown in Fig. 14(a) and the configuration shown in Fig. 14(b).

[0164] If the substrate W dries before the drying process in the single wafer processing chambers SW3 and SW4, the pattern on the substrate W will collapse. However, according to this embodiment, the substrate W held by the pusher 65 can be prevented from drying. Also, the substrate W held by the upper and lower chucks 81 and 83 of the attitude changing unit 63 can be prevented from drying. Example 3

[0165] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first and second embodiments will be omitted.

[0166] The second transport mechanism WTR2 of Example 1 shown in Figure 4(a) was able to extract 25 substrates W1 (W2) from the 50 substrates W in a vertical position held by the pusher 65. In other words, the second transport mechanism WTR2 of Example 1 extracted the substrates W in a single pattern. In contrast, the second transport mechanism WTR2 of Example 3 extracts the substrates W in multiple patterns (e.g., six patterns) in which at least one of the number and position can be changed.

[0167] See Figures 15(a) and 15(b). The second transfer mechanism WTR2 includes two horizontal chucks 115 and 117. The first horizontal chuck 115 is formed in a columnar shape extending along a horizontal axis AX11 and is rotatable about the horizontal axis AX11. The second horizontal chuck 117 is formed in a columnar shape extending along a horizontal axis AX12 and is rotatable about the horizontal axis AX12. The two horizontal chucks 115 and 117 are each rotated by an electric motor of the opening / closing unit 71 shown in Figure 4(a).

[0168] The second transport mechanism WTR2 of this embodiment extracts one or more predetermined substrates W1 (W2) from the 25 substrates W1 of the first substrate group (or the 25 substrates W2 of the second substrate group) among the 50 vertically oriented substrates W held by the pusher 65. Therefore, six patterns PT1 to PT6 are formed on the circumferential surface of the first horizontal chuck 115 about the horizontal axis AX11. Similarly, six patterns PT1 to PT6 are formed on the circumferential surface of the second horizontal chuck 117 about the horizontal axis AX12. In FIG. 15(a), the two horizontal chucks 115, 117 are formed symmetrically. Furthermore, the second transport mechanism WTR2 can switch between the two horizontal chucks 115, 117 among the six patterns PT1 to PT6.

[0169] Each of the six patterns PT1 to PT6 has at least one of a holding groove 119 and a passing groove 121. Figure 15(a) shows the holding groove 119 and the passing groove 121 of each of the patterns PT1 to PT6 corresponding to one substrate W. Each of the five patterns PT1, PT3 to PT6 has a passing groove 121. In contrast, the pattern PT2 has a holding groove 119.

[0170] As shown in Figure 15(a), the second transport mechanism WTR2 rotates the horizontal chucks 115, 117 so that, for example, two patterns PT1 face each other. This allows the second transport mechanism WTR2 to pass the substrate W between the two horizontal chucks 115, 117. Also, as shown in Figure 15(b), the second transport mechanism WTR2 rotates the horizontal chucks 115, 117 so that, for example, two patterns PT2 face each other. This allows the second transport mechanism WTR2 to hold the substrate W with the two horizontal chucks 115, 117.

[0171] The two horizontal chucks 115, 117 will be described in more detail. Fig. 16(a) is a diagram for explaining the allocation of the six patterns PT1 to PT6. The 50 substrates W are arranged at a half pitch and in a face-to-face manner. The 25 substrates W1 are numbered 1 (No. 1), 2, 3, ..., 25 from the base end side of the horizontal chucks 115, 117.

[0172] The pattern PT1 allows all 50 substrates W to pass through. The pattern PT1 has passage grooves (passing portions) 121 formed at positions corresponding to the 50 substrates W. Here, assume the situation shown in FIG. 11(c). When the two patterns PT1 of the two horizontal chucks 115, 117 are opposed to each other, that is, when the two horizontal chucks 115, 117 are patterns PT1, the second transport mechanism WTR2 does not hold all of the substrates W.

[0173] The pattern PT2 extracts the first to fifth five substrates W1. As shown in FIG. 16(b), the pattern PT2 has five holding grooves 119 at positions corresponding to the first to fifth five substrates W1. The pattern PT2 also has passing grooves 121 at positions corresponding to the other substrates W1 and W2. In other words, no holding grooves 119 are provided at other positions. Now, assume the situation shown in FIG. 11(c). When the two horizontal chucks 115, 117 are pattern PT2, the second transport mechanism WTR2 extracts a predetermined five substrates W1 (first to fifth) from the 50 substrates W.

[0174] Pattern PT3 extracts the sixth to tenth five substrates W1. Pattern PT3 has five holding grooves 119 at positions corresponding to the sixth to tenth five substrates W1. Pattern PT3 also has passing grooves 121 at positions corresponding to the other substrates W1 and W2. In other words, no holding grooves 119 are provided at other positions. Now, assume the situation shown in FIG. 11(c). When the two horizontal chucks 115, 117 are pattern PT3, the second transport mechanism WTR2 extracts the sixth to tenth five substrates W1 from the 50 substrates W.

[0175] The pattern PT4 has five holding grooves 119 at positions corresponding to the five eleventh to fifteenth substrates W1, and does not have any other holding grooves 119. In the situation shown in FIG. 11(c), when the two horizontal chucks 115, 117 are of the pattern PT4, the second transport mechanism WTR2 extracts the five eleventh to fifteenth substrates W1 from the 50 substrates W.

[0176] As shown in Figure 16(c), pattern PT5 has five holding grooves 119 at positions corresponding to the five 16th to 20th substrates W1, and has no holding grooves 119 at the other positions. In the situation shown in Figure 11(c), when the two horizontal chucks 115, 117 are pattern PT5, the second transport mechanism WTR2 extracts the five 11th to 15th substrates W1 from the 50 substrates W. The five 11th to 15th substrates W1 are different from the substrates W1 extracted in the other five patterns PT1 to PT4 and PT6.

[0177] The pattern PT6 has five holding grooves 119 at positions corresponding to the five 21st to 25th substrates W1, and does not have any other holding grooves 119. In the situation shown in Figure 11(c), when the two horizontal chucks 115, 117 are of the pattern PT6, the second transport mechanism WTR2 extracts the five 21st to 25th substrates W1 from the 50 substrates W.

[0178] When the substrates W2 of the second substrate group are removed, the lifting and rotating unit 67 of the pusher mechanism 61 rotates the 25 substrates W2 held by the pusher 65 by 180 degrees around the vertical axis AX4. The 180-degree rotation allows the position of each substrate W2 to be moved backward X by half a pitch compared to before the rotation.

[0179] The six patterns PT1 to PT6 are not limited to the above example. For example, they may be set as follows: Pattern PT2 is set to extract the first to tenth substrates W1 (W2). Pattern PT3 is set to extract the eleventh to twentieth ten substrates W1 (W2). Pattern PT4 is set to extract the twenty-first to twenty-fifth five substrates W1 (W2). The other three patterns PT1, PT5, and PT6 are set so as not to extract any substrates W (W1, W2).

[0180] According to this embodiment, the second transport mechanism WTR2 can extract and transport different substrates W1 (W2) from the substrates W held by the pusher 65. For example, in pattern PT2, the first to fifth five substrates W1 can be extracted. Also, in pattern PT5, the sixteenth to twentieth five substrates W1 can be extracted.

[0181] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0182] (1) In the above-described embodiments, the guide rails of the horizontal movement unit 41 of the center robot CR are provided on the floor surface of the single-substrate transport area R2. Alternatively, the guide rails 41A of the horizontal movement unit 41 of the center robot CR may be provided above the single-substrate transport area R2, and the lifting and rotating unit 39 of the center robot CR and the like may be hung upside down on the guide rails 41A.

[0183] The center robot CR includes a mechanism main body 123 (two hands 35A, 35B, an advance / retract section 37, and an elevation / rotation section 39) and a horizontal movement section 41. The horizontal movement section 41 includes, for example, a guide rail 41A, a slider 41B, a screw shaft, and an electric motor. The guide rail 41A is provided in the front-rear direction X above the single substrate transport area R2 and along the single substrate transport area R2. Specifically, the guide rail 41A is provided on or near the ceiling surface 125 of the single substrate transport area R2 (or the processing block 7). The guide rail 41A corresponds to the upper rail of the present invention.

[0184] The mechanism body 123 is suspended from the guide rails 41A and moves along the guide rails 41A in the front-rear direction X. This prevents droplets falling from the wet substrate W from contaminating, for example, the advance / retract part 37 and the lifting / rotating part 39. For example, contamination of the advance / retract part 37 and the like with droplets could cause the center robot CR to malfunction, but this can be prevented.

[0185] As shown in FIG. 17, when the first hand 35A is positioned above the second hand 35B, the first hand 35A is used to transport the substrate W after drying processing, and the second hand 35B is used to transport the wet substrate W from the second posture conversion mechanism 31 to one of the single-wafer processing chambers SW3, SW4.

[0186] (2) In the above-described embodiments and modifications, the single-wafer processing chambers SW3 and SW4 perform a drying process on the substrate W using a supercritical fluid. In this regard, each of the single-wafer processing chambers SW3 and SW4 may be provided with a rotation processing unit 45 and a nozzle 47, similar to each of the single-wafer processing chambers SW1 and SW2. In this case, each of the single-wafer processing chambers SW1 to SW4 supplies, for example, pure water and IPA to the substrate W in this order, and then performs a drying process (spin drying) on ​​the substrate W.

[0187] (3) In the above-described embodiments and modifications, each of the batch processing vessels BT1 to BT6 processed 50 substrates W arranged face-to-face at a half pitch. However, each of the batch processing vessels BT1 to BT6 may process substrates W arranged face-to-back, in which the device surfaces of all substrates W face the same direction. Each of the batch processing vessels BT1 to BT6 may process 25 substrates W corresponding to one carrier C arranged at a full pitch. Note that, in the case of FIG. 11(b) where 50 substrates W are arranged face-to-back, the opening / closing unit 71 extracts 25 substrates W1 or 25 substrates W2 by moving the two chucks 69, 70 in the forward / backward direction X in which the substrates W are aligned.

[0188] (4) In each of the above-described embodiments and modifications, the width direction Y of the batch processing region R1 may become long. For example, in the region R11 to the right Y of the batch processing tank BT6, shown by the dashed line in FIG. 18, piping for supplying pure water or the like to the batch processing tank BT6 and piping for draining liquid from the batch processing tank BT6 are provided. Therefore, if the piping structure in the region R11 becomes complex, the width direction Y of the batch processing region R1 becomes long. The position change unit 63 of the second position change mechanism 31 is provided on the side of the single-substrate transport region R2, allowing easy access by the center robot CR.

[0189] 18, the buffer unit 33 is provided in the transfer block 5. In addition, the second position change mechanism 31 may be provided so as to protrude from the batch processing region R1. For example, the second position change mechanism 31 may be provided so as to advance into the single-substrate transport region R2. In addition, in FIG. 18, the buffer unit 33 is provided in the transfer block 5.

[0190] (5) In the above-described embodiments and modifications, when the second transport mechanism WTR2 transports the substrate W from the pusher mechanism 61, the second transport mechanism WTR2 receives the substrate W by raising and lowering the chucks 69, 70 using the elevator 73. However, the elevator rotator 67 of the pusher mechanism 61 may raise and lower the pusher 65 that holds the substrate W in a vertical position, thereby causing the second transport mechanism WTR2 to receive the substrate W from the pusher mechanism 61. Alternatively, the elevator rotator 67 may raise the chucks 69, 70 using the elevator 73 and lower the pusher 65, thereby causing the elevator rotator 67 to lower the pusher 65, thereby causing the second transport mechanism WTR2 to receive the substrate W from the pusher mechanism 61. [Explanation of symbols]

[0191] 1... Substrate processing equipment 31 ... Second attitude conversion mechanism BT1~BT6 ... Batch processing tanks CR... Center robot 35...Hand WTR1: First transport mechanism 59 ... Control section 61 ... Pusher mechanism WTR2: Second transport mechanism 63 ... Posture conversion unit 65 ... Pusher 67 ... Elevating and rotating part 69,70 ... Chuck 78(78A,78B) … V-shaped holding groove 81 ... Upper zipper 83 ... Lower zipper 85,86 ... Auxiliary chuck 88 … Advancement and retreat club 89 ... Upper and lower chuck rotation part 95 ... Placement surface 97 … V-shaped holding groove AX4: Vertical axis AX9,AX11,AX12…Horizontal axis 107 … Standby tank 109A … spout 111,112 ... nozzle 115,117 ... Horizontal chuck

Claims

1. A substrate processing apparatus that continuously performs batch processing, in which a plurality of substrates are processed at once, and single-substrate processing, in which substrates are processed one by one, a batch processing tank for processing multiple substrates at once; a first batch transfer mechanism that transfers the plurality of substrates in a vertical orientation to the batch processing tank at once; a single wafer processing chamber for processing substrates one by one; a single-substrate transport mechanism for transporting substrates in a horizontal position one by one to the single-substrate processing chamber; a posture changing mechanism for collectively changing the posture of the plurality of substrates that have been batch processed and are in a vertical posture into a horizontal posture, The attitude conversion mechanism includes: a substrate holder that is provided at a position accessible to the first batch transfer mechanism and that receives and holds the plurality of substrates in a vertical position that have been batch processed from the first batch transfer mechanism; a posture changing unit that is provided at a position accessible to the single substrate transport mechanism and that collectively changes the plurality of substrates from a vertical posture to a horizontal posture; a second batch substrate transport mechanism that is movable between the substrate holding unit and the attitude changing unit, receives the plurality of substrates in a vertical attitude held by the substrate holding unit, and passes them to the attitude changing unit; the second batch substrate transport mechanism includes two horizontal chucks that hold the plurality of vertically oriented substrates held by the substrate holding unit while pinching two side portions of an outer edge of each of the plurality of vertically oriented substrates from a radial direction; The posture conversion unit is upper chucks and lower chucks capable of receiving the plurality of substrates in a vertical position from the two horizontal chucks by radially clamping upper and lower portions of the outer edges of each of the plurality of substrates in a vertical position held by the two horizontal chucks; an upper and lower chuck rotation unit that rotates the upper chuck and the lower chuck around a horizontal axis that is perpendicular to an alignment direction of the plurality of substrates in a vertical position held by the upper chuck and the lower chuck, in order to convert the plurality of substrates in a vertical position received from the two horizontal chucks into a horizontal position; The substrate processing apparatus is characterized in that the single substrate transport mechanism removes a substrate one by one from the plurality of horizontally oriented substrates held by the upper chuck and the lower chuck and transports the substrate to the single substrate processing chamber.

2. 2. The substrate processing apparatus according to claim 1, each of the two horizontal chucks has a plurality of V-shaped holding grooves for holding the plurality of substrates in a vertical position; the upper chuck includes a plurality of first horizontal placement guide grooves each having a width greater than the thickness of each substrate, for accommodating the outer edges of the plurality of substrates, a lower chuck provided with a plurality of second horizontal guide grooves each having a width greater than the thickness of each substrate to accommodate the outer edges of the plurality of substrates, the second horizontal guide grooves being arranged in a direction perpendicular to the substrate surface;

3. 3. The substrate processing apparatus according to claim 2, the posture conversion unit further includes two auxiliary chucks provided on both sides of the lower chuck along the circumferential direction of each substrate, each of the two auxiliary chucks includes a plurality of second V-shaped holding grooves for holding the plurality of substrates in a vertical position; when the upper chuck and the lower chuck hold the plurality of substrates in a vertical position, the two auxiliary chucks each hold the plurality of substrates in a vertical position by accommodating outer edges of the plurality of substrates in the plurality of second V-shaped holding grooves, respectively; a substrate processing apparatus characterized in that, when the upper chuck and the lower chuck hold the plurality of substrates in a horizontal position, the two auxiliary chucks each remove the plurality of substrates from the plurality of second V-shaped holding grooves and move away from the plurality of substrates to a position that does not interfere with the removal of the plurality of substrates by the single substrate transport mechanism.

4. 4. The substrate processing apparatus according to claim 3, the posture conversion unit further includes a relative movement unit that moves the two auxiliary chucks relatively to the upper chuck and the lower chuck in a direction in which the plurality of substrates are aligned, the plurality of first horizontal placement guide grooves each include a plurality of placement surfaces on which one horizontally positioned substrate is placed, A substrate processing apparatus characterized in that, when the posture conversion unit converts the postures of the plurality of substrates to horizontal, the relative movement unit moves the two auxiliary chucks relatively so that the plurality of substrates in a vertical posture held in the plurality of second V-shaped holding grooves contact each of the plurality of mounting surfaces.

5. 5. The substrate processing apparatus according to claim 1, 2. The substrate processing apparatus according to claim 1, wherein the posture changing mechanism further comprises a standby tank for storing the liquid so that the plurality of substrates held by the substrate holding unit are immersed in the liquid.

6. 5. The substrate processing apparatus according to claim 1, The substrate processing apparatus according to claim 1, wherein the attitude changing mechanism further comprises a holder nozzle that supplies a liquid in the form of a shower or mist onto the plurality of substrates held by the substrate holder.

7. 5. The substrate processing apparatus according to claim 1, a nozzle for the posture change unit that supplies liquid in the form of a shower or mist to the plurality of substrates held by the upper chuck and the lower chuck of the posture change unit.

8. 5. The substrate processing apparatus according to claim 1, The substrate processing apparatus according to claim 1, wherein the attitude changing mechanism further comprises a rotation unit that rotates the substrate holding unit around a vertical axis.

9. 9. The substrate processing apparatus according to claim 8, the batch processing tank and the attitude changing mechanism are arranged in a horizontal first direction, The substrate processing apparatus, wherein the second batch substrate transport mechanism transports the plurality of substrates from the substrate holder along a horizontal second direction perpendicular to the first direction.

10. 5. The substrate processing apparatus according to claim 1, each of the two horizontal chucks includes two or more V-shaped holding grooves for holding a predetermined number of two or more substrates among the plurality of substrates; The second batch substrate transport mechanism uses the two horizontal chucks to extract two or more substrates from the plurality of substrates held in a vertical position by the substrate holding section.

11. 5. The substrate processing apparatus according to claim 1, the second batch substrate transport mechanism is capable of switching the two horizontal chucks between a first pattern and a second pattern; When the two horizontal chucks are of the first pattern, the second batch substrate transport mechanism extracts one or more substrates that are set in advance from the plurality of substrates that are held in a vertical position by the substrate holding unit, When the two horizontal chucks are the second pattern, the second batch substrate transport mechanism extracts one or more predetermined substrates different from the first pattern from the plurality of substrates in a vertical position held by the substrate holding unit.

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