Method for manufacturing a wound body and an electronic component device.

Abstract

To provide a wound body of a sealing film that is a laminate having a base material sheet and a sealing resin layer, which suppress peeling between layers when being stored at low temperature.SOLUTION: A wound body 1 has a winding core 20, and a sealing film 10 wound around the winding core 20. The sealing film 10 is a laminate having a base material sheet A11, a sealing resin layer 15 and a base material sheet B12 in this order. Tensile elastic modulus of the base material sheet A11 is larger than tensile elastic modulus of the base material sheet B12. The sealing film 10 is wound around the winding core 20 in a direction in which the base material sheet A11 is positioned inside.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a wound body having a sealing film and a method for manufacturing an electronic component device.

Background Art

[0002] In order to achieve miniaturization and thinning of semiconductor devices, for example, a method has been proposed in which a large number of individual semiconductor chips are rearranged at appropriate intervals, sealed with a sealing resin, and terminals for external connection are provided in the sealing resin portion of the obtained sealed molded body (see, for example, Patent Documents 1 to 4). The rearranged semiconductor chips are usually sealed by mold molding using a liquid or solid resin encapsulant. By forming a large-sized sealed molded body having a wafer shape, simplification of the manufacturing process and cost reduction are also aimed at (see, for example, Patent Documents 5 and 6).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Patent Document 6

Summary of the Invention

Problems to be Solved by the Invention

[0004] Electronic components such as semiconductor chips are sometimes sealed using a pre-formed sealing resin layer, which is generally formed on a support. Furthermore, for ease of handling, a protective film is laminated to the sealing resin layer. For ease of transport, the sealing film, which is a long laminate composed of a support, sealing resin layer, and protective film, is sometimes supplied as a wound material on a core.

[0005] Windings of sealing film are sometimes stored at low temperatures to suppress the reaction of the sealing resin layer. However, it has become clear that when the sealing resin layer has a large thickness for embedding electronic components, the sealing resin layer and the base sheet tend to separate while the winding is stored at low temperatures.

[0006] This disclosure relates to a wound body of a sealing film, which is a laminate having a base sheet and a sealing resin layer, and to suppress delamination between layers when stored at low temperatures. [Means for solving the problem]

[0007] This disclosure generally includes the following means: [1] A winding body comprising a core and a sealing film wound on the core. The sealing film is a laminate having a base sheet A, a sealing resin layer and a base sheet in that order. The tensile modulus of the base sheet A is greater than the tensile modulus of the base sheet B. The sealing film is wound on the core in an orientation in which the base sheet A is located on the inside. [2] A member comprising an electronic component, wiring, or both, the winding body according to [1], used for sealing such a member to be embedded in the sealing resin layer. [3] The winding body according to [1] or [2], wherein the sealing resin layer has a thickness of 30 μm or more and 1000 μm or less. [4] The winding body according to any one of [1] to [3], wherein the sealing resin layer contains an inorganic filler, and the content of the inorganic filler is 40% by mass or more and 95% by mass based on the mass of the sealing resin layer. [5] The winding body according to any one of [1] to [4], wherein the sealing resin layer contains an epoxy resin and a curing agent thereof, and at least one of the epoxy resin or the curing agent contains one or more liquid compounds that are liquid at 25°C, and the total content of the liquid compounds is 30% by mass or more and 80% by mass or less based on the total amount of the epoxy resin and the curing agent. [6] The winding body according to any one of [1] to [5], wherein the base sheet B is a polyolefin resin film or a fluororesin film. [7] The winding body according to any one of [1] to [6], wherein the base sheet A is a polyester resin film. A method for manufacturing an electronic component device, comprising: peeling the base sheet B from the sealing film unwound from any of the windings described in [8][1] to [7] to expose the sealing resin layer; and sealing a member including an electronic component, wiring, or both, with the sealing resin layer such that the member is embedded in the sealing resin layer. [9] The method according to [8], further comprising storing the winding body in an environment of 10°C or below. [Effects of the Invention]

[0008] Regarding a wound sealing film, which is a laminate having a base sheet and a sealing resin layer, delamination between layers can be suppressed when stored at low temperatures. The occurrence of curling and wrinkling in the sealing film can also be suppressed. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing an example of a coiled body. [Figure 2] This is a process diagram illustrating an example of a method for manufacturing electronic components using a sealing film. [Figure 3] This is a process diagram illustrating an example of a method for manufacturing electronic components using a sealing film. [Modes for carrying out the invention]

[0010] The present invention is not limited to the following examples. Embodiments described with reference to the drawings are not limited to the configurations shown in the drawings. The sizes of the components in each drawing are conceptual, and the relative relationships of the sizes between components are not limited to those shown.

[0011] Figure 1 is a perspective view showing an example of a winding body having a sealing film. The winding body 1 shown in Figure 1 consists of a core 20 and a long sealing film 10 wound around the core 20. The sealing film 10 is a laminate having a base sheet A11, a sealing resin layer 15, and a base sheet B12 in that order. The sealing film 10 is wound around the core 20 with the base sheet A11 facing inward. "Facing with the base sheet A11 facing inward" means that in the thickness direction of the sealing film 10, the base sheet A11 is facing the core 20 side of the sealing resin layer 15. The length of the sealing film 10 wound around the core 20 may be, for example, 10 to 1000 m.

[0012] The tensile modulus of base sheet A11 is greater than that of base sheet B12. In other words, the ratio of the tensile modulus of base sheet B to the tensile modulus of base sheet A (hereinafter sometimes simply referred to as the "ratio of moduli") is less than 1.

[0013] From the perspective of protecting the sealing film during transportation and use, it is the common idea of those skilled in the art that a hard base sheet having a relatively high tensile elastic modulus is preferably located on the outside in the wound body. However, when the sealing resin layer has a large thickness to ensure good embedding properties, it has been revealed that delamination occurs between the layers while the wound body is stored at a low temperature. As a result of investigations in view of this problem, the inventors have found that when the base sheet A having a relatively high tensile elastic modulus is located inside in the wound body 1, delamination between the layers while the wound body is stored at a low temperature is effectively suppressed. The inventors consider that this effect is because the base sheet B12 located on the outside and having a relatively low tensile elastic modulus follows the deformation of the base sheet A11 having a relatively high tensile elastic modulus and being difficult to deform, thereby relaxing the stress. However, the effects according to the present disclosure are not limited to this.

[0014] The tensile elastic moduli of the base sheet A11 and the base sheet B12 can be values measured in accordance with JIS K6251:2010. The tensile elastic moduli of the base sheet A11 and the base sheet B12 may be average values of the tensile elastic moduli measured using two types of test pieces having longitudinal directions along two directions orthogonal to each other in the plane of each base sheet. In the case of a long base sheet, the tensile elastic modulus thereof may be an average value of the tensile elastic moduli measured using test pieces along the longitudinal direction (MD direction) and the direction (TD direction) orthogonal thereto. The method for measuring the tensile elastic modulus will be described in more detail in the examples below.

[0015] The ratio of the elastic moduli of the base sheet A11 and the base sheet B12 may be 0.9 or less, 0.8 or less, 0.7 or less, 0.6 or less, 0.5 or less, 0.4 or less, 0.3 or less, or 0.2 or less, and may also be 0.01 or more. When the ratio of the elastic moduli is small, there is a tendency that delamination is further suppressed and a tendency that handling properties are improved.

[0016] The thicknesses of the base material sheet A11 and the base material sheet B12 may be, for example, 2 μm or more, 5 μm or more, 10 μm or more, 15 μm or more, or 20 μm or more, and may also be 200 μm or less, 150 μm or less, 100 μm or less, 90 μm or less, 80 μm or less, 70 μm or less, or 60 μm or less. When the thickness of the base material sheet A11 is 2 μm or more, it is easy to stably apply the varnish for forming the sealing resin layer. When the thicknesses of the base material sheet A11 and the base material sheet B12 are 200 μm or less, even when drying the varnish coating film using a dryer that blows hot air from both the coating surface and the back surface, the coating film is easily dried efficiently.

[0017] The base material sheet A11 and the base material sheet B12 may be, for example, a polymer film or a metal foil. Examples of the polymer film include polyolefin films such as polyethylene film, polypropylene film, and polyvinyl chloride film, fluororesin films such as polytetrafluoroethylene film, polyester films such as polyethylene terephthalate film, polycarbonate film, acetyl cellulose film, and polyimide film. From the viewpoints of handleability and economy, the base material sheet A11 may be a polyester film, and the base material sheet B12 may be a polyolefin film or a fluororesin film. The base material sheet A11 and the base material sheet B12 may be single-layer films or multilayer films composed of two or more layers of films.

[0018] The base material sheet A11 and the base material sheet B12 may have a surface subjected to a release treatment. The release treatment includes, for example, applying a release agent to the surface of the base material sheet A11 or the base material sheet B12 and drying the coating film. The release agent can be, for example, a siloxane-based, fluorine-based, or olefin-based release agent.

[0019] The sealing resin layer 15 can be a resin layer having thermosetting properties. In the wound body 1 before use, the sealing resin layer 15 can be in an uncured state or a B-stage in which curing has partially progressed.

[0020] The thickness of the sealing resin layer 15 may be, for example, 1 μm or more, 20 μm or more, 30 μm or more, 40 μm or more, 50 μm or more, 60 μm or more, 70 μm or more, 80 μm or more, 90 μm or more, or 100 μm or more, and may be 1000 μm or less, 500 μm or less, 300 μm or less, or 200 μm or less. A sealing resin layer 15 with a large thickness makes it easier to embed electronic components and the like. When the thickness of the sealing resin layer 15 is 1000 μm or less, the effects of the present invention are more easily obtained at a higher level. By selecting the direction in which the sealing film 10 is wound onto the winding core 20 based on the ratio of the elastic moduli of the base sheet A11 and the base sheet B12, interlayer delamination is effectively suppressed while the winding body 1 is stored at low temperatures, even when the sealing resin layer 15 has a large thickness.

[0021] The sealing resin layer 15 may contain an epoxy resin. The epoxy resin can be a compound having two or more epoxy groups. Examples of epoxy resins include bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol AF type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol G type epoxy resin, bisphenol M type epoxy resin, bisphenol S type epoxy resin, bisphenol P type epoxy resin, bisphenol PH type epoxy resin, bisphenol TMC type epoxy resin, bisphenol Z type epoxy resin, bisphenol S type epoxy resin such as hexanediol bisphenol S diglycidyl ether, novolacphenol type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, bixylenol type epoxy resin such as bixylenol diglycidyl ether, hydrogenated bisphenol A type epoxy resin such as hydrogenated bisphenol A glycidyl ether, and these dibasic acid modified diglycidyl ether type epoxy resins and these aliphatic epoxy resins. The sealing resin layer 15 may contain two or more epoxy resins selected from these.

[0022] The epoxy resin may be a commercially available product. Examples of commercially available epoxy resins include naphthalene-type epoxy resins such as EXA4700 (tetrafunctional naphthalene-type epoxy resin) manufactured by DIC Corporation and NC-7000 (naphthalene skeleton-containing polyfunctional solid epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; epoxides of condensates of phenols and aromatic aldehydes having phenolic hydroxyl groups (trisphenol-type epoxy resins) such as EPPN-502H (trisphenol epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; and Epiclon HP-7200H (DIC) manufactured by DIC Corporation. Dicyclopentadiene aralkyl epoxy resins such as chloropentadiene skeleton-containing polyfunctional solid epoxy resin; biphenyl aralkyl epoxy resins such as NC-3000H (biphenyl skeleton-containing polyfunctional solid epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; novolac epoxy resins such as Epiclon N660 and Epiclon N690 manufactured by DIC Corporation, and EOCN-104S manufactured by Nippon Kayaku Co., Ltd.; tris(2,3-epoxypropyl) isocyanurate such as TEPIC manufactured by Nissan Chemical Industries, Ltd., and DIC Corporation Epiclon 860, Epiclon 900-IM, Epiclon EXA-4816, Epiclon EXA-4822, Araldite AER280 (manufactured by Asahi Chiba Co., Ltd.), Epotote YD-134 (manufactured by Toto Kasei Co., Ltd.), JER834, JER872 (manufactured by Mitsubishi Chemical Corporation), ELA-134 (manufactured by Sumitomo Chemical Co., Ltd.), Epicort 807, 815, 825, 827, 828, 834, 1001, 1004, 1007, 1009 (manufactured by Mitsubishi Chemical Corporation), DER-330, 301, 361 (manufactured by Dow Chemical Company), Toto Kasei Co., Ltd. Examples include bisphenol A type epoxy resins such as YD8125 and YDF8170 manufactured by Mitsubishi Chemical Corporation; bisphenol F type epoxy resins such as JER806 manufactured by Mitsubishi Chemical Corporation; naphthalene type epoxy resins such as Epiclon HP-4032 manufactured by DIC Corporation; phenol novolac type epoxy resins such as Epiclon N-740 manufactured by DIC Corporation; and aliphatic epoxy resins such as Denacol DLC301 manufactured by Nagase ChemteX Corporation.

[0023] The sealing resin layer 15 may contain a curing agent for the epoxy resin. The curing agent can be a compound that reacts with the epoxy resin to form a crosslinked structure together with the epoxy resin. Examples of curing agents include phenolic resins, acid anhydrides, imidazole compounds, aliphatic amines, and alicyclic amines. The sealing resin layer 15 may contain two or more curing agents selected from these.

[0024] Phenolic resins can be compounds having two or more phenolic hydroxyl groups. Examples of phenolic resins include phenols such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F, or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene, and aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde, obtained by condensation or co-condensation under an acidic catalyst; biphenyl skeleton phenolic resins; paraxylylene-modified phenolic resins; metaxylylene-paraxylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-modified phenolic resins; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; and xylylene-modified naphthol resins.

[0025] The phenolic resin may be a commercially available product. Examples of commercially available phenolic resins include Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, and Phenolite VH4170 from DIC Corporation; XLC-LL and XLC-4L from Mitsui Chemicals, Inc.; SN-100, SN-300, and SN-400 from Nippon Steel & Sumitomo Metal Chemical Corporation; and SK Resin HE910 from Air Water Inc.

[0026] At least one of the epoxy resin or curing agent may contain a liquid compound that is liquid at 25°C. "Liquid compound that is liquid at 25°C" means a compound having a viscosity of 400 Pa·s or less at 25°C. Here, viscosity is measured using an E-type or B-type viscometer.

[0027] The total content of the liquid compound may be 30% by mass or more, 40% by mass or more, or 45% by mass or more, or 80% by mass or less, 70% by mass or less, or 60% by mass or less, based on the total amount of epoxy resin and curing agent in the sealing resin layer 15, from the viewpoint of embedding properties, etc. The sealing resin layer 15 containing the liquid compound tends to have particularly good embedding properties.

[0028] The epoxy resin that is liquid at 25°C may be an epoxy resin having a bisphenol skeleton. The epoxy resin that is liquid at 25°C may contain one or more selected from bisphenol A type epoxy resin, bisphenol B type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol G type epoxy resin, and bisphenol Z type epoxy resin. The epoxy resin having a bisphenol skeleton and being liquid at 25°C has relatively high heat resistance.

[0029] The curing agent, which is liquid at 25°C, may be a phenol resin having a bisphenol skeleton. Examples of phenol resins that are liquid at 25°C include bisphenols such as bisphenol A, bisphenol F, bisphenol AD, and bisphenol S; dihydroxybiphenyls such as 4,4'-dihydroxybiphenyl; and dihydroxyphenyl ethers such as bis(4-hydroxyphenyl) ether. Substituents selected from linear alkyl groups, branched alkyl groups, aryl groups, hydroxyalkyl groups, allyl groups, and cyclic aliphatic groups may be introduced to the aromatic rings of these phenol skeletons. Linear alkyl groups, branched alkyl groups, allyl groups, substituted allyl groups, cyclic aliphatic groups, and alkoxycarbonyl groups may be introduced to the carbon atom located in the center of the bisphenol skeleton.

[0030] The ratio of the equivalent amount of epoxy groups in the epoxy resin to the equivalent amount of functional groups that react with the epoxy groups in the curing agent (equivalent amount of epoxy groups in the epoxy resin / equivalent amount of functional groups that react with the epoxy groups in the curing agent) may be 0.7 to 2.0, 0.8 to 1.8, or 0.9 to 1.7.

[0031] The sealing resin layer 15 may further contain a curing accelerator. The curing accelerator can be a compound that promotes the reaction between the epoxy resin and the curing agent. The curing accelerator can be, for example, an amine compound or a phosphorus compound. The curing accelerator may also contain an imidazole compound.

[0032] The content of the curing accelerator may be 0.01% by mass or more and 5% by mass or less, 0.1% by mass or more and 3% by mass or less, or 0.3% by mass or more and 1.5% by mass or less, based on the total amount of epoxy resin and curing agent. When the content of the curing accelerator is 0.01% by mass or more, a sufficient curing acceleration effect is easily obtained. When the content of the curing accelerator is 5% by mass or less, cracking and molding defects of the sealing resin layer 15 are less likely to occur.

[0033] The sealing resin layer 15 may further contain inorganic fillers. Examples of inorganic fillers include barium sulfate, barium titanate, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, silicon nitride, and aluminum nitride. The sealing resin layer 15 may contain two or more inorganic fillers selected from these. The inorganic filler may also be silica. Examples of silica include amorphous silica, crystalline silica, fused silica, and spherical silica.

[0034] The inorganic filler may be surface-modified. For example, the inorganic filler may be surface-modified with a silane coupling agent. Examples of silane coupling agents include alkylsilanes, alkoxysilanes, vinylsilanes, epoxysilanes, aminosilanes, acrylsine, methacrylicilsilanes, mercaptosilanes, sulfidosilanes, isocyanatesilanes, sulfursilanes, styrylsilanes, and alkylchlorosilanes.

[0035] Specific examples of silane coupling agents include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, diisopropyldimethoxysilane, isobutyltrimethoxysilane, diisobutyldimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, n-dodecylmethoxysilane, phenyltrimethoxysilane, diphenyldimethoxysilane, triphenylsilanol, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, n-octyldimethylchlorosilane, tetraethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropylmethyldi Methoxysilane, 3-phenylaminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, bis(3-(triethoxysilyl)propyl)disulfide, bis(3-(triethoxysilyl)propyl)tetrasulfide, vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyl Examples include lyisopropoxysilane, allyltrimethoxysilane, diallyldimethylsilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, N-(1,3-dimethylbutylidene)-3-aminopropyltriethoxysilane, and aminosilanes.

[0036] The inorganic filler content may be 40% by mass or more, 45% by mass or more, 50% by mass or more, 55% by mass or more, 60% by mass or more, 65% by mass or more, or 70% by mass or more, based on the total amount of the sealing resin layer 15, and may be 95% by mass or less, or 90% by mass or less. A higher inorganic filler content makes it easier to reduce warping of electronic component devices caused by the difference in thermal expansion coefficients between the member embedded by the sealing resin layer 15 and the sealing resin layer 15. When the inorganic filler content is 95% by mass or less, the sealing resin layer 15 tends to have good embedding properties. A higher inorganic filler content tends to make delamination more likely to occur when the winding body 1 is stored at low temperatures, but by selecting the direction in which the sealing film 10 is wound onto the core 20 based on the ratio of the elastic moduli of the base sheet A11 and the base sheet B12, delamination is effectively suppressed when the winding body 1 is stored at low temperatures, even when the sealing resin layer 15 has a large thickness.

[0037] The average particle size of the inorganic filler may be between 0.01 μm and 50 μm, between 0.1 μm and 25 μm, or between 0.3 μm and 10 μm. Inorganic fillers having an average particle size within these ranges are easily dispersed uniformly in the sealing resin layer 15.

[0038] The sealing resin layer 15 may further contain an organic solvent. The organic solvent contained in the sealing resin layer 15 is often residual organic solvent from the varnish used to form the sealing resin layer 15. Examples of organic solvents include aliphatic hydrocarbons, aromatic hydrocarbons, terpenes, halogenated hydrocarbons, esters, ketones, alcohols, and aldehydes. The organic solvent may be an ester, ketone, alcohol, or a combination thereof, from the viewpoint of reducing environmental impact and solubility of the epoxy resin and curing agent. The organic solvent may be a ketone in particular. The ketone may be acetone, methyl ethyl ketone, methyl isobutyl ketone, or a combination thereof.

[0039] The content of volatile components (mainly organic solvents) in the sealing resin layer 15 may be between 0.2% by mass and 2.0% by mass, based on the mass of the sealing resin layer 15. If the content of volatile components is 0.2% by mass or more, defects such as cracking in the sealing resin layer 15 are less likely to occur, and the sealing resin layer 15 is more likely to have good embedding properties. If the content of volatile components is 2.0% by mass or less, the handling properties of the sealing resin layer 15 are improved, and defects such as foaming during heat curing are less likely to occur. From a similar viewpoint, the content of volatile components may be between 0.3% by mass and 1.5% by mass, based on the mass of the sealing resin layer 15.

[0040] The sealing resin layer 15 may further contain an elastomer. Examples of elastomers include styrene-butadiene particles, silicone powder, silicone oil, and silicone oligomer. The sealing resin layer 15 may further contain other additives as needed. Examples of additives include pigments, dyes, mold release agents, antioxidants, and surface tension modifiers.

[0041] The wound body 1 can be obtained, for example, by a method that includes applying a varnish to a base sheet A11 to form a sealing resin layer 15, drying the varnish coating to form the sealing resin layer 15 on the base sheet A11, laminating a base sheet B12 on the side of the sealing resin layer 15 opposite to the base sheet A11, thereby forming a sealing film 10 which is a laminate having the base sheet A11, the sealing resin layer 15, and the base sheet B12, and winding the sealing film 10 onto a core 20 in an orientation where the base sheet A is located on the inside.

[0042] The varnish is applied to the substrate sheet A11 by a coating method such as a die coater or comma coater. The coating can be dried by, for example, hot air blowing. The application of the varnish and drying of the coating may be carried out continuously while the long substrate sheet A11 is being transported.

[0043] The sealing film is not limited to a laminate having the three-layer structure illustrated in Figure 1. For example, the sealing film may have other layers between the base sheet A and the sealing resin layer, between the sealing resin layer and the base sheet B, on the side of base sheet A opposite to the sealing resin layer, or on the side of base sheet B opposite to the sealing resin layer. Examples of other layers include an antistatic layer, a coloring layer, and an adhesion-enhancing layer.

[0044] The sealing film 10 constituting the wound body 1 can be used to seal a component including electronic components, wiring, or both, such that the component is embedded in the sealing resin layer 15.

[0045] Figures 2 and 3 are process diagrams illustrating an example of a method for manufacturing an electronic component device using a sealing film. The method illustrated in Figures 2 and 3 includes peeling the base sheet B12 from the sealing film 10 unwound from the winding body 1 to expose the sealing resin layer 15, and sealing a plurality of members 32 provided on the substrate 31 with the sealing resin layer 15 such that the members 32 are embedded in the sealing resin layer 15.

[0046] The component 32 includes electronic components, wiring, or both. The electronic components may include semiconductor components, such as semiconductor chips. The height of the component 32 from the substrate 31 may be, for example, 10 to 3000 μm. The substrate 31 may be, for example, a structure including semiconductor chips or a printed wiring board. The sealing resin layer 15 may form a build-up layer that seals the multilayer wiring. In that case, the substrate 31 may be a wiring board including the underlying wiring and the sealing resin layer that seals it.

[0047] Before the sealing film 10 is unwound, the winding body 1 may be stored in an environment below 10°C. The winding body can be stored in an environment below 10°C for, for example, 1 to 730 days.

[0048] As shown in Figure 2(a), the base sheet B12 is peeled off. Then, as shown in Figure 2(b), the sealing film 10 is positioned so that the exposed sealing resin layer 15 faces the member 32. As shown in Figure 3(c), the member 32 is embedded in the molten sealing resin layer 15 by heating and pressurizing the entire structure using pressing members 41 and 42. The conditions for embedding may be, for example, a pressure of 0.1 to 0.5 MPa, a temperature of 70 to 110°C, and a pressurizing time of 20 to 60 seconds. Heating and pressurizing may also be performed under a reduced pressure atmosphere.

[0049] Next, the sealing resin layer 15 in which the member 32 is embedded is cured by heating (Figure 3(d)). As shown in Figure 3(e), the base sheet A11 is peeled off from the cured sealing resin layer 15, and the electronic component device 50 is obtained. By using the sealing film 10 unwound from the winding body according to this disclosure, the electronic component device 50 can be manufactured simply and quickly. If the member 32 is a semiconductor component, a semiconductor device is obtained as the electronic component device 50. The surface layer portion of the sealing resin layer 15 on the side opposite to the substrate 31 may be removed to expose the member 32.

[0050] The methods for manufacturing the sealing film and the electronic component are not limited to the examples described above, and can be modified as appropriate without departing from the spirit of the present invention. [Examples]

[0051] The present invention is not limited to the following embodiments.

[0052] 1. Varnish preparation 497.5 g of methyl ethyl ketone and 3500 g of silica particles treated with phenylaminosilane (manufactured by Admatex Co., Ltd., product name: SX-E2, phenylaminosilane treated, average particle size: 5.8 μm) were placed in a 10 L capacity plastic container, and the mixture in the container was stirred to prepare a mixture in which silica particles were dispersed in methyl ethyl ketone. To this mixture, 300 g of bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, JER806 / epoxy equivalent: 160), which is liquid at 25°C, and 460 g of phenol novolac resin (manufactured by Asahi Organic Chemicals Co., Ltd., product name: PAPS-PN2, phenolic hydroxyl group equivalent: 104), which is not liquid at 25°C, were added, and the mixture was stirred. After the bisphenol F type epoxy resin and phenol novolac resin dissolved, 2.5 g of imidazole (manufactured by Shikoku Chemicals, Ltd., solid, product name: 2PHZ-PW) was added, and the mixture was stirred for a further 1 hour. Subsequently, the mixture was filtered through a nylon #200 mesh (aperture 75 μm), and the filtrate was obtained as a varnish for forming a thermosetting sealing resin layer. In the obtained varnish, the content of the liquid compound, bisphenol F type epoxy resin, was 39% by mass based on the total amount of bisphenol F type epoxy resin and phenol novolac resin, and the content of silica particles was approximately 82% by mass based on the total amount of components other than the solvent, methyl ethyl ketone.

[0053] 2. Winding of sealing film Example 1 The following were prepared as base sheet A and base sheet B. Base sheet A: Polyethylene terephthalate (PET) film (tensile modulus: 4.0 GPa, thickness: 38 μm) Base sheet B: Polyethylene (PE) film (Tensile modulus: 0.4 GPa, Thickness: 40 μm) While conveying the base sheet A at a transport speed of 3 m / min, varnish was applied to the base sheet A using a coating machine (coating head type: comma). The formed coating film and base sheet A were then passed sequentially through three drying ovens, each 3.3 m long, to dry the coating film and form a 120 μm thick sealing resin layer on the base sheet A. The temperatures of the three drying ovens were set to 60°C, 70°C, and 80°C from upstream to downstream. A long sealing film was formed by laminating a base sheet B onto a sealing resin layer, and the laminate comprising base sheet A, a sealing resin layer, and base sheet B. The formed sealing film was wound onto a core with base sheet A positioned on the inside and base sheet B on the outside to obtain a winding of the sealing film.

[0054] Examples 2-3 and Comparative Examples 1-4 A winding of sealing film was obtained in the same manner as in Example 1, except that the types of base sheets A and B, and the positions of base sheets A and B in the winding body were changed as shown in Table 1.

[0055] 3. Evaluation (1) Tensile modulus of the base sheet From each film used as base sheet A or B, test specimens were cut out in a shape corresponding to the dumbbell-shaped No. 1 test specimen standardized in JIS K6251:2010. From each film, test specimen A was cut out in a direction where the longitudinal direction of the test specimen coincided with the longitudinal direction of the film (MD direction), and test specimen B was cut out in a direction where the longitudinal direction of the test specimen coincided with the direction perpendicular to the longitudinal direction of the film (TD direction). Two parallel gauge marks, 40 mm apart, were marked on the center of each test specimen. Following the test method standardized in JIS K6251:2010, the test specimens were mounted on a tensile testing machine (A&D Co., Ltd., RTC-1210) at a temperature of 23°C and stretched to 100% strain at a tensile speed of 500 mm / min. At this point, the specimen was stretched until the distance between the two gauge marks was 80 mm. From the stress-strain curve (a graph showing the relationship between stress and strain during stretching), the stress σ1 (MPa) at strain ε1 = 0.0005 (0.05%) and the stress σ2 (MPa) at strain ε2 = 0.0025 (0.25%) were determined. The tensile modulus was calculated using the following formula. Tensile modulus (MPa) = (σ² - σ¹) / (ε² - ε¹) The average of the tensile moduli of test specimens A and B was used as the tensile moduli of the base sheet. For each example or comparative example, the ratio of the tensile moduli of the outer base sheet (outer base sheet) to the tensile moduli of the inner base sheet (inner base sheet) was calculated using the following formula. Ratio of tensile modulus = Tensile modulus of outer base sheet / Tensile modulus of inner base sheet

[0056] (2) Thickness of the sealing resin layer The thickness of the sealing film, consisting of base sheet A, a sealing resin layer, and base sheet B, was measured using a digital indicator (Mitutoyo Corporation, product name: ID-C125B) under the following conditions. The thickness of the sealing resin layer was determined by subtracting the separately measured thicknesses of base sheets A and B from the obtained thickness. • Measuring probe: Flat type • Stand: Comparable stand BSG-20

[0057] (3) Delamination The rolled material was stored at a temperature of -20°C or lower for 24 hours or more. Afterward, the rolled material was returned to room temperature. The sealing film unwound from the rolled material was visually inspected from either the base sheet A side or the base sheet B side to check for delamination between the base sheet and the sealing resin layer. The state of delamination was determined according to the following criteria. NG: No peeling on both base sheet A and base sheet B. NG: Delamination is present on at least one of the two sides of base sheet A or base sheet B.

[0058] 4.Results The evaluation results are shown in Table 1. In Examples 1 to 3, where the tensile modulus of elasticity of the inner base sheet (base sheet A) was greater than that of the outer base sheet (base sheet B), no delamination was observed between the base sheet and the sealing resin layer. On the other hand, in the sealing films of Comparative Examples 1 to 3, where the tensile modulus of elasticity of the inner base sheet (base sheet B) was smaller than that of the outer base sheet (base sheet A), delamination was observed between the outer base sheet A and the sealing resin layer. In Comparative Example 4, where the tensile modulus of elasticity of the inner base sheet (base sheet A) was the same as that of the outer base sheet (base sheet B), delamination was observed between the inner base sheet A and the sealing resin layer.

[0059] [Table 1] [Explanation of symbols]

[0060] 1...winding body, 10...sealing film, 11...base sheet A, 12...base sheet B, 15...sealing resin layer, 20...winding core, 31...substrate, 32...component, 41,42...pressing member, 50...electronic component device.

Claims

1. It comprises a core and a sealing film wound onto the core, The sealing film is a laminate comprising, in order, a base sheet A, a sealing resin layer, and a base sheet B. The tensile modulus of base sheet A is greater than the tensile modulus of base sheet B. The sealing film is wound onto the core in a orientation where the base sheet A is positioned on the inside. The thickness of the base sheet A and the base sheet B is 2 μm or more and 200 μm or less. The sealing resin layer contains an inorganic filler, and the content of the inorganic filler is 40% by mass or more and 95% by mass, based on the mass of the sealing resin layer. A coiled body.

2. The winding body according to claim 1, used for sealing an electronic component, wiring, or both thereof, such that the component is embedded in the sealing resin layer.

3. The wound body according to claim 1 or 2, wherein the sealing resin layer has a thickness of 30 μm or more and 1000 μm or less.

4. The sealing resin layer contains an epoxy resin and its curing agent, and at least one of the epoxy resin or the curing agent contains one or more liquid compounds that are liquid at 25°C. The wound body according to any one of claims 1 to 3, wherein the total content of the liquid compound is 30% by mass or more and 80% by mass or less based on the total amount of the epoxy resin and the curing agent.

5. The wound body according to any one of claims 1 to 4, wherein the base sheet B is a polyolefin film or a fluororesin film.

6. The wound body according to any one of claims 1 to 5, wherein the base sheet A is a polyester film.

7. The process involves peeling the base sheet B from the sealing film unwound from the winding body according to any one of claims 1 to 6, thereby exposing the sealing resin layer. The sealing resin layer seals an electronic component, wiring, or both, such that the component is embedded in the sealing resin layer. A method for manufacturing electronic component devices, including [the specified element].

8. The method according to claim 7, further comprising storing the winded body in an environment of 10°C or below.

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