Component mounting machine

Abstract

To provide a technology that allows the head to move at high speed.SOLUTION: A component mounting machine mounts an electronic component on a board. The component mounting machine includes a nozzle that sucks an electronic component, a head that removably holds the nozzle, a moving device that moves the head, and an imaging device that images the nozzle and the electronic component that is sucked by the nozzle, and is installed at a position that is not moved by the moving device and that can image the nozzle and the electronic component attracted to the nozzle from the side.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The technology disclosed in this specification relates to a component mounter for mounting electronic components on a substrate.

Background Art

[0002] Some component mounters for mounting electronic components on a substrate adsorb the electronic components to a nozzle and move them to the substrate. In this type of component mounter, when an electronic component is adsorbed to the nozzle, it is determined whether there is an abnormality in the adsorption state of the electronic component by the nozzle. For example, Patent Document 1 discloses a component mounter including an imaging device that images the nozzle and the electronic component adsorbed to the nozzle. Using the image captured by the imaging device, the adsorption state of the electronic component to the nozzle is confirmed. In Patent Document 1, the imaging device is installed so as to move integrally with the head that holds the nozzle.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the component mounter of Patent Document 1, the imaging device that images the nozzle and the electronic component adsorbed to the nozzle is installed at a position that moves integrally with the head. For this reason, there is a problem that the part that moves together with the head by the imaging device becomes large, making it difficult to move the head at high speed.

[0005] This specification discloses a technology for enabling the head to move at high speed.

Means for Solving the Problems

[0006] The component mounting machine disclosed herein mounts electronic components onto a substrate. The component mounting machine comprises a nozzle for picking up electronic components, a head for detachably holding the nozzle, a moving device for moving the head, and an imaging device for imaging the nozzle and the electronic components picked up by the nozzle. The imaging device is positioned so as not to be moved by the moving device and so as to be able to image the nozzle and the electronic components picked up by the nozzle from the side.

[0007] In the component mounting machine described above, the imaging device is positioned in a location that is not moved by the moving device. That is, the imaging device does not move with the head, but instead images the nozzle and the electronic components attracted to the nozzle. This avoids increasing the size of the part that moves with the head due to the imaging device, and allows the head to move at high speed. [Brief explanation of the drawing]

[0008] [Figure 1] A diagram showing the schematic configuration of the component mounting machine according to Examples 1 and 2. [Figure 2] Cross-sectional view along line II-II in Figure 1. [Figure 3] A perspective view showing the configuration of the first imaging device, light source, parts feeder, and feeder holding unit. [Figure 4] A block diagram showing the control system of the component mounting machine according to Examples 1 and 2. [Figure 5] A flowchart illustrating an example of a process for determining whether a nozzle has properly attracted an electronic component. [Figure 6] This figure shows an example of an image captured when the nozzle properly attracts an electronic component. [Figure 7] This figure shows an example of an image captured when the nozzle is not properly adsorbing the electronic component. [Figure 8] This figure shows an example of an image captured when the parts feeder is not properly held in the feeder holder. [Modes for carrying out the invention]

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] The component mounting machine disclosed herein may further comprise a supply device for supplying electronic components and a holding unit in which the supply device is detachably held. The imaging device may be supported by the holding unit. With such a configuration, the imaging device can be installed in a suitable position.

[0011] The component mounting machine disclosed herein may further include a supply device for supplying electronic components. The imaging device may be configured to further image at least a portion of the area between the supply device and the substrate, in which the nozzle held by the head is moved by the moving device. The component mounting machine may further include a determination unit that determines whether the nozzle held by the head interferes within the component mounting machine based on the image captured by the imaging device. With such a configuration, it is possible to determine whether the nozzle held by the head interferes with components, etc., within the component mounting machine when the head is moved within the imaging range by the moving device, using the image captured by the imaging device. For example, when determining nozzle interference within the component mounting machine using a sensor, it can be difficult to optimize the interference position where the nozzle interferes with components, etc., within the component mounting machine, and the installation position of the sensor for determining whether or not there is interference at that interference position. For example, it may not be possible to install the sensor at a desired position near the interference position, and a complex structure may have to be adopted. Since nozzle interference within the component mounting machine is determined from the image captured, it is possible to easily confirm nozzle interference within the component mounting machine.

[0012] In the component mounting machine disclosed herein, the imaging device may include a camera and a light source. The camera may be positioned to capture images of the nozzle and the imaging surface of the electronic component attached to the nozzle. The light source may be positioned to illuminate the nozzle and the surface of the electronic component attached to the nozzle that is opposite to the imaging surface. With such a configuration, the nozzle and the electronic component attached to the nozzle can be suitably imaged. [Examples]

[0013] (Example 1) Referring to the drawings, a component mounting machine 10 according to an embodiment will be described. The component mounting machine 10 is a device for mounting electronic components 4 onto a circuit board 2. The component mounting machine 10 is also called an electronic component mounting device or a chip mounter. Typically, the component mounting machine 10 is installed together with other circuit board work machines such as a solder printing machine and a circuit board inspection machine to form a series of mounting lines.

[0014] As shown in Figures 1 and 2, the component mounting machine 10 includes a plurality of component feeders 12, a feeder holding unit 14, a head 16, a head moving device 18, a substrate conveyor 20, a first imaging device 30, a light source 34, a second imaging device 40, a component retrieval unit 42, a control device 26, and a touch panel 24. A management device 8 configured to communicate with the component mounting machine 10 is located outside the component mounting machine 10. Note that in Figure 1, the first imaging device 30 and the light source 34 are omitted from the illustration for clarity.

[0015] Each component feeder 12 contains multiple electronic components 4. The component feeders 12 are detachably attached to the feeder holder 14 and supply the electronic components 4 to the head 16. The specific configuration of the component feeders 12 is not particularly limited. Each component feeder 12 may be, for example, a tape-type feeder that supplies multiple electronic components 4 contained on a tape, a tray-type feeder that supplies multiple electronic components 4 contained on a tray, or a bulk-type feeder that supplies multiple electronic components 4 randomly contained in a container.

[0016] The feeder holding part 14 has a plurality of slots, and component feeders 12 can be detachably installed in each of the plurality of slots. In this embodiment, the feeder holding part 14 was fixedly equipped on the component mounter 10, but it may be detachable from the component mounter.

[0017] The head 16 has a nozzle 6 for adsorbing the electronic component 4. The nozzle 6 is detachably attached to the head 16. The head 16 can move the nozzle 6 in the Z direction (here, the vertical direction), and approach and separate the nozzle 6 from the component feeder 12 and the circuit board 2. The head 16 can adsorb the electronic component 4 from the component feeder 12 by the nozzle 6 and mount the electronic component 4 adsorbed by the nozzle 6 onto the circuit board 2.

[0018] The head moving device 18 moves the head 16 between the component feeder 12 and the circuit board 2. Although it is an example, the head moving device 18 of this embodiment is an XY robot that moves a moving base 18a in the X direction and the Y direction, and the head 16 is fixed to the moving base 18a. The head moving device 18 can move the nozzle 6 in a plane (XY plane) parallel to the surface of the circuit board 2. Note that the head 16 is not limited to being fixed to the moving base 18a, and may be detachably attached to the moving base 18a.

[0019] The substrate conveyor 20 is a device for carrying in, positioning, and carrying out the circuit board 2. Although it is an example, the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.

[0020] As shown in Figures 2 and 3, the first imaging device 30 is positioned on the feeder holding unit 14. The first imaging device 30 is supported by a support unit 32, which is fixed to the feeder holding unit 14. The first imaging device 30 is positioned outside the multiple slots of the feeder holding unit 14 (on the +X side in Figures 2 and 3). When component feeders 12 are inserted into the multiple slots of the feeder holding unit 14, the supply positions of the electronic components 4 of the multiple component feeders 12 (hereinafter also referred to as "component supply positions") align on a straight line perpendicular to the insertion direction of the component feeders 12. The first imaging device 30 is positioned on the straight line where the component supply positions of the multiple component feeders 12 are aligned. For example, a CCD camera may be used as the first imaging device 30. The first imaging device 30 is installed so that its imaging direction is perpendicular to the insertion direction of the component feeder 12, and it images the nozzle 6 that has picked up the electronic component 4 and the picked-up electronic component 4 from the side at the component supply position of the component feeder 12.

[0021] The light source 34 is positioned on the feeder holding unit 14. The light source 34 is supported by a support unit 36, which is fixed to the feeder holding unit 14. The light source 34 is positioned on the outside of a plurality of slots on the opposite side of where the first imaging device 30 is installed (on the -X side in Figures 2 and 3). The light source 34 is also positioned on a straight line where the component supply positions of the plurality of component feeders 12 are aligned. That is, the component supply positions of the plurality of component feeders 12 are positioned between the first imaging device 30 and the light source 34. The light source 34 is composed of LEDs and is positioned to irradiate light toward the imaging surface of the first imaging device 30. Therefore, the first imaging device 30 images the nozzle 6 that has attracted the electronic component 4 and the attracted electronic component 4 while they are illuminated from behind.

[0022] The second imaging device 40 is positioned between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side of the pair of substrate conveyors 20). The second imaging device 40 includes a camera and a light source (not shown). The camera of the second imaging device 40 is positioned so that its imaging direction faces upward, and it images the nozzle 6 from below while it is holding the electronic component 4. That is, when the nozzle 6 holds the electronic component 4, the camera photographs the underside of the electronic component 4 held by the nozzle 6. For example, a CCD camera is used for the camera of the second imaging device 40. The light source is made up of LEDs and illuminates the underside (imaging surface) of the electronic component 4 held by the nozzle 6. The image data of the image captured by the second imaging device 40 is stored in the memory (not shown) of the control device 26.

[0023] The component recovery unit 42 recovers electronic components 4 supplied from the component feeder 12 that were not properly picked up by the nozzle 6. When the nozzle 6 picks up the electronic components 4 supplied from the component feeder 12, the electronic components 4 may be picked up at a position that is not appropriate for the nozzle 6. If the electronic components 4 are not properly picked up by the nozzle 6, they cannot be mounted in the correct position on the circuit board 2. Electronic components 4 that are determined not to be properly picked up by the nozzle 6 are not mounted on the circuit board 2 and are stored in the component recovery unit 42.

[0024] The control device 26 is configured using a computer equipped with a CPU and a memory device. The control device 26 controls the operation of each part of the component mounting machine 10 based on the production program transmitted from the management device 8. As shown in Figure 4, the control device 26 is connected to the head moving device 18, the substrate conveyor 20, the touch panel 24, the first imaging device 30, and the second imaging device 40, and controls each part of the head moving device 18, the substrate conveyor 20, the touch panel 24, the first imaging device 30, and the second imaging device 40. The touch panel 24 is a display device that provides various information about the component mounting machine 10 to the operator, as well as an input device that receives instructions and information from the operator.

[0025] Next, we will describe the process of determining whether or not the electronic component 4 has been properly attracted to the nozzle 6 using the image captured by the first imaging device 30. First, the control device 26 moves the nozzle 6 above the component supply position of the component feeder 12 (S12). Specifically, the control device 26 moves the moving base 18a so that the nozzle 6 is positioned above the component supply position of the component feeder 12.

[0026] Next, the control device 26 causes the nozzle 6 to attract the electronic component 4 (S14). Specifically, the control device 26 controls the head 16 so that the nozzle 6 descends. When the nozzle 6 comes into contact with the electronic component 4, the nozzle 6 attracts the electronic component 4. Once the nozzle 6 has attracted the electronic component 4, the control device 26 controls the head 16 so that the nozzle 6 rises.

[0027] Next, the control device 26 uses the first imaging device 30 to image the electronic component 4 attracted to the nozzle 6 and the nozzle 6 (S16). As described above, the first imaging device 30 is positioned to image the component supply position of the component feeder 12. Therefore, when imaging is performed with the first imaging device 30, the nozzle 6 located above the component supply position of the component feeder 12 and the electronic component 4 attracted to the nozzle 6 are also imaged.

[0028] Next, the control device 26 determines from the image captured in step S16 whether the nozzle 6 is properly adsorbing the electronic component 4 (S18). Specifically, the control device 26 identifies the nozzle 6 and the electronic component 4 in the image captured in step S16 and detects the orientation of the electronic component 4 while it is adsorbed by the nozzle 6. The control device 26 then determines whether the detected orientation of the electronic component 4 is appropriate.

[0029] For example, in the image captured in Figure 6, the upper surface of the electronic component 4 is in contact with the lower end of the nozzle 6, and both the upper and lower surfaces of the electronic component 4 are horizontal. When such an image is captured, the control device 26 determines that the nozzle 6 is properly attracting the electronic component 4.

[0030] On the other hand, if the captured image is not like that of Figure 6, the control device 26 determines that the nozzle 6 is not properly adsorbing the electronic component 4. For example, in the captured image of Figure 7, the upper surface of the electronic component 4 is not in contact with the lower end of the nozzle 6, and the upper and lower surfaces of the electronic component 4 are tilted, not horizontal. In other words, the nozzle 6 is not adsorbing the upper surface of the electronic component 4. In the case of such an captured image, the control device 26 determines that the nozzle 6 is not properly adsorbing the electronic component 4.

[0031] If the nozzle 6 properly attracts the electronic component 4 (YES in step S18), the control device 26 mounts the electronic component 4 attracted by the nozzle 6 onto the circuit board 2 (S20). On the other hand, if the nozzle 6 does not properly attract the electronic component 4 (NO in step S18), the control device 26 stores the electronic component 4 attracted by the nozzle 6 in the component recovery unit 42 (S22).

[0032] In this embodiment, the first imaging device 30 and the light source 34 are supported by the feeder holding unit 14. In conventional component mounting machines, the imaging device that images the nozzle 6 from the side was installed to move integrally with the head 16. That is, the imaging device that images the nozzle 6 from the side was fixed to the moving base 18a in this embodiment. When the imaging device is installed to move integrally with the head 16, the imaging device and its light source need to be lightweight and compact, and also vibration resistant. In this embodiment, since the first imaging device 30 and the light source 34 are supported by the feeder holding unit 14, it is not necessary to install the imaging device and its light source that images the nozzle 6 with the electronic component 4 attached from the side to move integrally with the head 16 (i.e., on the moving base 18a). This makes it possible to miniaturize the part that moves integrally with the head 16. As a result, it becomes possible to move the head 16 at high speed, and productivity can be improved. Furthermore, since the first imaging device 30 and light source 34 do not move integrally with the head 16, the requirements for lightness, compactness, and vibration resistance are reduced compared to imaging devices and light sources that move integrally with the head 16. This expands the range of selection for imaging devices and light sources used as the first imaging device 30 and light source 34. For example, the first imaging device 30 and light source 34 can be those with improved maintainability or those that do not prioritize miniaturization. Also, because miniaturization is not a priority for the first imaging device 30 and light source 34, less expensive models can be used, making it possible to reduce costs.

[0033] Furthermore, if the imaging device and light source are installed to move integrally with the head 16, as in conventional component mounting machines, the installation position of the imaging device and light source becomes restricted, and it may not be possible to position the imaging device and light source so as to sandwich the nozzle 6. In other words, the light source cannot be placed behind the nozzle 6, and the imaging device and light source may be placed in front of the nozzle 6. In this case, in order to image the nozzle 6 and electronic component 4, it becomes necessary to install a reflector that reflects the light from the light source in order to illuminate the nozzle 6 and electronic component 4 from behind, and to move the nozzle 6 and electronic component 4 in front of the reflector so that they can be imaged by the imaging device and light source. In this embodiment, since the first imaging device 30 and light source 34 are not installed on the moving base 18a, the constraints on the installation position of the first imaging device 30 and light source 34 are relatively reduced, and the first imaging device 30 and light source 34 can be positioned such that the nozzle 6 and the electronic component 4 attracted by the nozzle 6 are located between the first imaging device 30 and light source 34. In other words, the first imaging device 30 and light source 34 can be installed in a position suitable for imaging the nozzle 6 and electronic component 4. Therefore, in order to image the nozzle 6 and the electronic component 4, it is not necessary to move the nozzle 6, the first imaging device 30, and the light source 34 to specific positions, and the time required to image the nozzle 6 and the electronic component 4 can be shortened.

[0034] In this embodiment, the first imaging device 30 and the light source 34 were supported by the feeder holding unit 14, but the configuration is not limited to this. The first imaging device 30 and the light source 34 only need to be installed in a position where they can image the nozzle 6 that has picked up the electronic component 4 from the side, above the component supply position of the component feeder 12. For example, the first imaging device 30 and the light source 34 may be fixed to the base of the component mounting machine 10 on which the feeder holding unit 14 is supported.

[0035] (Example 2) In the above embodiment 1, the control device 26 used the image captured by the first imaging device 30 to determine whether the electronic component 4 was properly attracted to the nozzle 6, but the configuration is not limited to this. For example, the control device 26 may use the image captured by the first imaging device 30 to determine whether the nozzle 6 interferes with other members, etc. For example, when installing the component feeder 12 into the slot of the feeder holding unit 14, if the component feeder 12 is not properly inserted into the slot, the component feeder 12 will shift from its proper position in the slot. Specifically, as shown in Figure 8, the tip of the component feeder 12 in the insertion direction may lift up. If the nozzle 6 is moved above the component supply position of the component feeder 12 in this state, the tip of the nozzle 6 may interfere with the lifted portion of the component feeder 12. In this embodiment, it is detected whether there are any members that interfere with the nozzle 6 within the range of movement of the nozzle 6 (more specifically, the range captured by the first imaging device 30).

[0036] The process of determining whether the parts feeder 12 is properly installed (i.e., determining whether there is a component interfering with the nozzle 6) using the image captured by the first imaging device 30 will be described. When the parts feeder 12 is inserted into the slot, the control device 26 uses the first imaging device 30 to image the parts supply position of the parts feeder 12. As described above, the first imaging device 30 is positioned to capture the nozzle 6 located above the parts supply position of the parts feeder 12 and the electronic components 4 attracted to the nozzle 6. For this reason, the image captured by the first imaging device 30 can include the tip of the parts feeder 12 in the insertion direction.

[0037] Next, the control device 26 determines from the captured image whether the parts feeder 12 is properly inserted. The control device 26's memory (not shown) stores an image of the parts feeder 12 when it is properly inserted. The control device 26 determines that the parts feeder 12 is not properly inserted if the parts feeder 12 in the image captured by the first imaging device 30 is deviated by more than a predetermined range from the parts feeder 12 in the stored image. In other words, it determines that the nozzle 6 may interfere with the tip of the parts feeder 12 in the insertion direction.

[0038] In this embodiment, a first imaging device 30 that images the nozzle 6 and the electronic component 4 attracted to the nozzle 6 from the side is used to determine whether the component feeder 12 is properly inserted. Therefore, it is possible to determine whether the component feeder 12 is properly inserted without adding any additional configuration for detecting whether the component feeder 12 is properly inserted. In conventional component mounting machines, detection mechanisms such as sensors were used to detect whether the component feeder 12 was properly inserted. However, this not only required the installation of dedicated components for detecting whether the component feeder 12 was properly inserted, but also presented the problem of difficulty in optimizing the installation position of detection mechanisms such as sensors. In this embodiment, since the determination of whether the component feeder 12 is properly inserted is made using the captured image, it is possible to explicitly and easily determine whether the component feeder 12 is properly inserted.

[0039] In this embodiment, the first imaging device 30 was used to determine whether the parts feeder 12 was properly inserted, but the configuration is not limited to this. For example, the control device 26 may detect other components that interfere with the nozzle 6 within the nozzle's movement range from the captured image. The nozzle 6 moves between the parts supply position of the parts feeder 12 and the circuit board 2. The control device 26 may use the first imaging device 30 to image components installed within the nozzle 6's movement range and detect whether those components are in a state where they may interfere with the nozzle 6. For example, as shown in Figures 1 and 2, the second imaging device 40 and the parts retrieval unit 42 are installed within the nozzle 6's movement range (i.e., between the supply position of the electronic components 4 of the parts feeder 12 and the circuit board 2). For example, a fallen component may get caught at the upper end of the second imaging device 40 and the parts retrieval unit 42, and such a fallen component may interfere with the nozzle 6. Therefore, the first imaging device 30 may image the upper part of the second imaging device 40 and the upper part of the parts retrieval unit 42, and the control device 26 may detect from the captured image whether or not there is a possibility of interference between the falling parts on the second imaging device 40 or the parts retrieval unit 42 and the nozzle 6. In this case, for example, the support part 32 that supports the first imaging device 30 may be configured to rotate around its axis, and by changing the imaging direction of the first imaging device 30, the upper part of the second imaging device 40 and the upper part of the parts retrieval unit 42 may be imaged. Alternatively, an additional imaging device may be installed to image the upper part of the second imaging device 40 and the upper part of the parts retrieval unit 42.

[0040] The following points should be noted regarding the component mounting machine 10 described in the embodiment. In the embodiment, the component feeder 12 is an example of a "supplying device," the head moving device 18 is an example of a "moving device," the control device 26 is an example of a "determination unit," and the first imaging device 30 is an example of a "camera."

[0041] The specific examples of the technologies disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples described above. Furthermore, the technical elements described herein or in the drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technologies illustrated herein or in the drawings achieve multiple objectives simultaneously, and achieving even one of these objectives constitutes technical usefulness in itself. [Explanation of Symbols]

[0042] 2: Circuit board 4: Electronic components 6: Nozzle 10: Component mounting machine 12: Parts feeder 14: Feeder holding section 16: Mounting head 18: Head moving device 18a: Mobile base 20: Circuit board conveyor 24: Touch panel 26: Control device 30: First imaging device 34:Light source 40: Second imaging device 42: Parts Recovery Department

Claims

1. A component mounting machine for mounting electronic components onto a circuit board, A nozzle for adsorbing the aforementioned electronic component, A head that detachably holds the nozzle, A moving device for moving the head, An imaging device for imaging the nozzle and the electronic component attached to the nozzle, wherein the imaging device is installed in a position that is not moved by the moving device and in a position that allows imaging of the nozzle and the electronic component attached to the nozzle from the side, A supply device for supplying the aforementioned electronic components to the nozzle, Equipped with, The imaging device is configured to further image at least a portion of the area between the supply device and the substrate, in which the nozzle held in the head is moved by the moving device. A component mounting machine further comprising a determination unit that determines, based on an image captured by the imaging device, whether the nozzle is properly adsorbing the electronic component, and whether the nozzle held in the head interferes within the component mounting machine.

2. The system further comprises a supply device for supplying the aforementioned electronic components, and a holding unit that detachably holds the supply device. The component mounting machine according to claim 1, wherein the imaging device is supported by the holding portion.

3. The imaging device comprises a camera and a light source. The camera is positioned to capture images of the nozzle and the imaging surface of the electronic component adsorbed to the nozzle. The component mounting machine according to claim 1 or 2, wherein the light source is installed to illuminate the nozzle and the side of the electronic component adsorbed to the nozzle that is opposite to the imaging surface.

Images