Component mounting apparatus and nozzle management method

Abstract

To suppress the reduction in mounting accuracy caused by the combination of a mounting head and a nozzle.SOLUTION: A component mounting device includes: multiple nozzles 22 which suck components; a nozzle station which stores the multiple nozzles 22; and multiple mounting heads 19. A control unit executes: allocation processing which allocates one mounting head 19 to the multiple nozzles 22 stored in the nozzle station; adjustment processing which performs adjustment to suppress reduction in the mounting accuracy of a component due to the combination of the mounting head 19 and the nozzle 22 for each combination of the nozzle 22 and the mounting head 19 allocated to the nozzle 22; and setting processing which sets the combination of the mounting head 19 and the nozzle 22 when the adjustment is made as the combination of the mounting head 19 and the nozzle 22 when the component is mounted on the substrate.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The technology disclosed in this specification relates to a component mounting device for mounting components on a substrate and a nozzle management method for the component mounting device.

Background Art

[0002] Conventionally, there is known a component mounting device including a plurality of nozzles for sucking components, a nozzle station for storing the plurality of nozzles, and a mounting unit having a plurality of mounting heads, which mounts components on a substrate by attaching the nozzles stored in the nozzle station to the mounting heads (see, for example, Patent Document 1). Specifically, the rotary head type component mounting device described in Patent Document 1 includes a rotary head that holds a predetermined number of nozzles in the circumferential direction so as to be replaceable at a predetermined nozzle pitch, and a nozzle station in which a plurality of nozzles for exchanging the nozzles held by the rotary head are arranged.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Conventionally, the decrease in mounting accuracy due to the combination of the mounting head and the nozzle has not been sufficiently studied. This specification discloses a technology capable of suppressing the decrease in mounting accuracy due to the combination of the mounting head and the nozzle.

Means for Solving the Problems

[0005] A component mounting apparatus for mounting components onto a substrate, comprising: a plurality of nozzles for adsorbing the components; a nozzle station for storing the plurality of nozzles; a mounting unit having a plurality of mounting heads, for mounting the components onto the substrate by attaching the nozzles stored in the nozzle station to the mounting heads; and a control unit, wherein the control unit performs: an assignment process for assigning one mounting head to each of the plurality of nozzles stored in the nozzle station; an adjustment process for performing adjustments for each combination of a nozzle and the mounting head assigned to that nozzle to suppress a decrease in the mounting accuracy of the components caused by the combination of the mounting head and the nozzle; and a setting process for setting the combination of the mounting head and the nozzle after the adjustment as the combination of the mounting head and the nozzle when mounting the components onto the substrate. [Effects of the Invention]

[0006] The above configuration makes it possible to suppress the decrease in mounting accuracy caused by the combination of the mounting head and nozzle. [Brief explanation of the drawing]

[0007] [Figure 1] Side view of the component mounting device according to Embodiment 1, viewed from the front. [Figure 2] Top view of a component mounting device [Figure 3] Side view of the head unit and head movement mechanism, seen from the front. [Figure 4] Perspective view of the nozzle [Figure 5] Perspective view of the nozzle station [Figure 6] Cross-sectional view of the nozzle station and side view of the nozzle. [Figure 7] Top view of the nozzle plate [Figure 8] Block diagram showing the electrical configuration of a component mounting device. [Figure 9] Schematic diagram of the mapping table [Figure 10] Schematic diagram of the allocation table [Figure 11] Flowchart of Assignment Process [Figure 12] Top View of Substrate and Components [Figure 13] Schematic Diagram of Operation Screen (Operation / Measurement Tab) [Figure 14] Flowchart of Operator's Operation Procedure and Process Executed by Control Unit [Figure 15] Schematic Diagram of Adjustment Dialog [Figure 16] Schematic Diagram of Error Message [Figure 17] Schematic Diagram of Operation Screen (Measurement Result Tab) [Figure 18] Schematic Diagram of Assignment Table and Association Table [Figure 19] Flowchart of Setting Process [Figure 20] Schematic Diagram of Error Message [Figure 21] Flowchart of Nozzle Confirmation before Mounting and Nozzle Arrangement Change

Mode for Carrying Out the Invention

[0008] [Outline of Embodiment of the Present Disclosure] (1) The component mounting apparatus according to the embodiment is a component mounting apparatus for mounting components on a substrate, and includes a plurality of nozzles for adsorbing the components, a nozzle station for storing the plurality of nozzles, a plurality of mounting heads, and a mounting unit for mounting the components on the substrate by attaching the nozzles stored in the nozzle station to the mounting heads, and a control unit. The control unit executes an assignment process of assigning one of the mounting heads to each of the plurality of nozzles stored in the nozzle station, an adjustment process of performing adjustment to suppress a decrease in the mounting accuracy of the components caused by the combination of the mounting head and the nozzle for each combination of the nozzle and the mounting head assigned to the nozzle, and a setting process of setting the combination of the mounting head and the nozzle when the adjustment is performed as the combination of the mounting head and the nozzle when mounting the components on the substrate.

[0009] The above-mentioned "mounting" means sucking the components supplied by a component supply device or the like with a nozzle and mounting them on a substrate. The above-mentioned adjustment can also be referred to as calibration or correction. The inventor of the present application has found that when mounting components on a substrate, there are differences in mounting accuracy depending on the combination of the mounting head and the nozzle. Such differences are considered to be caused by the combination of variations in the machining accuracy of the mounting head and variations in the machining accuracy of the nozzle. If there are such differences, the mounting accuracy may decrease due to the combination of the mounting head and the nozzle.

[0010] According to the component mounting apparatus described in the above (1), the mounting head and the nozzle are combined by allocating one mounting head to each of the plurality of nozzles, and for each combination of the mounting head and the nozzle, adjustment is performed to suppress a decrease in the mounting accuracy of the component caused by the combination of the mounting head and the nozzle. Then, according to the component mounting apparatus described in the above (1), since the combination of the mounting head and the nozzle when the adjustment is performed is set as the combination of the mounting head and the nozzle when mounting components on the substrate, components can be mounted on the substrate with the combination of the mounting head and the nozzle when the adjustment is performed. Therefore, a decrease in the mounting accuracy caused by the combination of the mounting head and the nozzle can be suppressed.

[0011] (2) The component mounting apparatus according to the above (1), further comprising an operation unit that receives a setting instruction for instructing the execution of the setting process from an operator, and the control unit may execute the setting process when receiving the setting instruction at the operation unit after the adjustment process.

[0012] After the adjustment process, it is also possible for the operator to manually set the combination of the mounting head and the nozzle when the adjustment is performed as the combination of the mounting head and the nozzle when mounting components on the substrate. However, in that case, the burden on the operator becomes large. According to the component mounting device described in (2) above, when a setting instruction is received by the operation unit, the control unit executes the setting process, thus reducing the burden on the operator compared to when the operator sets the components manually.

[0013] (3) A component mounting apparatus as described in (2) above, wherein the operation unit has a display device, and the control unit displays an operation screen on the display device that shows an adjustment button for receiving an adjustment instruction to instruct the execution of the adjustment process, and when the adjustment button is pressed, the adjustment process is executed, and a setting button for receiving a setting instruction may be displayed on the operation screen.

[0014] According to the component mounting device described in (3) above, the setting button that accepts setting instructions is displayed on the operation screen where the adjustment button that accepts adjustment instructions is displayed. Therefore, when the operator issues a setting instruction after pressing the adjustment button, they do not need to search for the setting button on another screen. As a result, the operator can promptly issue an instruction to execute the setting process after the adjustment process is completed.

[0015] (4) A component mounting apparatus as described in (2) or (3) above, comprising a detection unit for detecting the nozzles stored in the nozzle station, wherein the operation unit further receives an assignment instruction from an operator for instructing the execution of the assignment process, and when the operation unit receives the assignment instruction, the control unit detects the nozzles stored in the nozzle station using the detection unit and assigns one mounting head to each of the detected nozzles.

[0016] According to the component mounting device described in (4) above, the nozzles stored in the nozzle station are automatically detected by the detection unit, so the allocation process can be performed automatically. Therefore, the burden on the operator can be reduced compared to when the operator has to allocate them manually.

[0017] (5) A component mounting apparatus according to any one of (1) to (3) above, comprising an imaging unit for imaging the component mounted on the substrate, wherein the adjustment process is a process of mounting the component on the substrate using a combination of the mounting head and the nozzle, imaging it with the imaging unit, detecting at least one of the difference between the target mounting position and the actual mounting position of the component and the difference between the target mounting angle and the actual mounting angle of the component based on the image, and adjusting at least one of the amount of movement of the mounting head and the rotation angle of the mounting head according to the detected difference.

[0018] The discrepancy between the target mounting position and the actual mounting position, as well as the discrepancy between the target mounting angle and the actual mounting angle, may vary depending on the combination of the mounting head and nozzle. According to the component mounting apparatus described in (5) above, at least one of the discrepancies between the target mounting position and the actual mounting position, and the discrepancy between the target mounting angle and the actual mounting angle, caused by the combination of the mounting head and the nozzle, can be suppressed.

[0019] (6) In the component mounting apparatus described in (5) above, the control unit does not have to perform the setting process if the deviation detected in the adjustment process is greater than a predetermined upper limit.

[0020] If the detected misalignment is large, adjusting the amount of movement or rotation angle of the mounting head may not adequately suppress the decrease in mounting accuracy. According to the component mounting device described in (6) above, the setting process is not executed if the deviation exceeds the upper limit, thus preventing combinations from being set that do not sufficiently suppress the reduction in mounting accuracy. If the configuration process is not performed, rearranging the nozzle arrangement so that the mounting head assigned to the nozzle changes, then re-running the allocation process, and subsequently re-running the adjustment process, increases the likelihood of setting a combination that sufficiently suppresses the decrease in mounting accuracy.

[0021] (7) A component mounting apparatus according to any one of (1) to (3) above, comprising a detection unit for detecting the nozzles stored in the nozzle station, wherein the control unit, after the setting process, when production of the substrate is instructed, detects the nozzles stored in the nozzle station using the detection unit and performs a first determination process for determining whether or not the nozzles set in the setting process are stored in the nozzle station, and if the first determination process determines that the nozzles are not stored, it performs an error notification process for notifying an error indicating that the set nozzles are not stored.

[0022] After the setup process, before production of the circuit board is instructed, it is possible that the operator may remove the nozzle stored in the nozzle station or replace it with a different nozzle. In this case, when production of the circuit board is instructed, the nozzle set during the setup process will no longer be stored in the nozzle station, making it impossible to mount components using the combination that was adjusted. According to the component mounting device described in (7) above, if the nozzle set during the setting process is not stored in the nozzle station, an error indicating that the set nozzle is not stored is reported. Upon receiving this error, the operator stores the set nozzle in the nozzle station. This allows the component to be mounted using the combination that was adjusted.

[0023] (8) A component mounting apparatus as described in (7) above, wherein the nozzle station has a plurality of storage units, each of which stores one nozzle, and each storage unit is associated with one mounting head, and the mounting unit mounts the component by attaching the nozzle stored in the storage unit to the mounting head associated with the storage unit, and the control unit may, if it determines in the first determination process that the nozzle is stored, perform a second determination process for each storage unit to determine whether the nozzle combined with the mounting head associated with the storage unit is stored in the storage unit, and if it determines in the second determination process that the nozzle is not stored, perform a change process to automatically change the arrangement of the nozzles so that the nozzle combined with the mounting head associated with the storage unit is stored in the storage unit.

[0024] After the setup process, before production of the circuit board is instructed, it is possible that the operator may change the arrangement of the nozzles stored in the nozzle station. In this case, if the nozzles stored in the storage unit associated with the mounting head are used as the nozzles combined with that mounting head, the mounting accuracy may decrease because the combination is not the one that was adjusted. According to the component mounting apparatus described in (8) above, if a nozzle that is combined with a mounting head associated with a storage unit is not stored in the storage unit, the nozzle arrangement is automatically changed so that the nozzle that is combined with that mounting head is stored in the storage unit. Therefore, when mounting components by attaching a nozzle stored in a storage unit to a mounting head associated with that storage unit, the components can be mounted in the combination that was adjusted.

[0025] (9) A nozzle management method according to an embodiment is a nozzle management method for a component mounting apparatus that mounts components onto a substrate, wherein the component mounting apparatus comprises a plurality of nozzles for adsorbing components, a nozzle station where the plurality of nozzles are stored, and a mounting unit which has a plurality of mounting heads and mounts the components onto the substrate by attaching the nozzles stored in the nozzle station to the mounting heads, and the nozzle management method includes an assignment step of assigning one mounting head to each of the plurality of nozzles stored in the nozzle station, an adjustment step of performing adjustments for each combination of a nozzle and the mounting head assigned to that nozzle to suppress a decrease in the mounting accuracy of the components caused by the combination of the mounting head and the nozzle, and a setting step of setting the combination of the mounting head and the nozzle when the adjustment has been performed as the combination of the mounting head and the nozzle when mounting the components onto the substrate.

[0026] According to the nozzle management method described in (9) above, it is possible to suppress the decrease in mounting accuracy caused by the combination of the mounting head and the nozzle.

[0027] [Details of the embodiments of this disclosure] The embodiments of this disclosure are described below in detail. This disclosure is not limited to these examples, but is indicated by the claims, and all modifications within the meaning and scope equivalent to the claims are intended. Embodiments of the present disclosure can be implemented in various forms, such as apparatus, methods, computer programs for realizing the functions of such apparatus or methods, and recording media on which such computer programs are stored.

[0028] <Embodiment 1> Embodiment 1 will be described with reference to Figures 1 to 21. In the following description, the left-right direction in Figure 1 will be referred to as the X direction, the up-down direction as the Z direction, and the front-back direction in Figure 2 as the Y direction. The right side in Figure 1 will be referred to as the upstream side, and the left side as the downstream side. In the following description, reference numerals in the drawings may be omitted for identical components, with some exceptions.

[0029] (1) Configuration of the component mounting device Referring to Figures 1 and 2, the configuration of the component mounting apparatus 1 according to Embodiment 1 will be described. The component mounting apparatus 1 is a device that mounts components E (see Figure 12), such as electronic components, onto a substrate P (see Figure 12) on which a circuit pattern is printed.

[0030] Referring to Figure 1, the external appearance of the component mounting device 1 as seen from the front will be described. Figure 1 shows the component mounting device 1 in a state where the tape component supply device 12 (see Figure 2), which will be described later, is not set up. As shown in Figure 1, the component mounting device 1 is equipped with a box-shaped housing 1A. An opening is formed in the right wall of the housing 1A into which the substrate P is loaded. An opening is formed in the left wall of the housing 1A from which the substrate P is unloaded. The substrate P is loaded into the housing 1A through the opening in the right wall, and after the components E are mounted inside the housing 1A, it is unloaded from the opening on the left side. The housing 1A is open in the front-to-back direction, and the tape component supply device 12 (see Figure 2), which will be described later, is set on both the front and rear sides. An operating section 31 is provided in the housing 10.

[0031] As shown in Figure 2, the component mounting apparatus 1 comprises a frame 10, a transport conveyor 11, four tape component supply devices 12, a head unit 13, a head movement unit 14, two component imaging cameras 17, a substrate imaging camera 18, a nozzle station 26, a control unit 30 (see Figure 8), and an operation unit 31 (see Figure 1). The head unit 13 and the head movement unit 14 are examples of mounting units according to Embodiment 1. The substrate imaging camera 18 is an example of a detection unit and an imaging unit.

[0032] The mounting frame 10 has a rectangular shape in plan view and a flat top surface. In Figure 2, the area A shown by the dashed line is the work position (hereinafter referred to as work position A) where the substrate P is fixed when components E are mounted on the substrate P. Below work position A is a backup device that fixes the substrate P in place when it is transported to work position A. The conveyor belt 11 includes a pair of conveyor belts 15 (front conveyor belt 15A and rear conveyor belt 15B) that circulate in the X direction, a plurality of rollers around which the conveyor belts 15 are routed, and a conveyor drive motor 44 (see Figure 8) that drives the conveyor belts 15. The conveyor belt 11 transports substrates P brought in from the upstream side to the work position A, and then transports the substrates P with components E mounted on them to the downstream side at the work position A.

[0033] The tape component supply device 12 is located in four places in total, two on each side of the component mounting device 1 in the X direction, on the Y direction. Multiple tape feeders 12A are mounted on the tape component supply device 12, aligned horizontally in the X direction. Each tape feeder 12A is equipped with a reel around which a component tape holding a component E is wound, and an electrically operated feeding device that pulls the component tape from the reel, supplying components E one by one.

[0034] The head unit 13 is equipped with multiple (in this case, five) mounting heads 19 for attracting and releasing components E. The head unit 13 is a so-called in-line type, with multiple mounting heads 19 arranged in the X direction. The head unit 13 will be described later. The head unit 13 may also be a so-called rotary head, in which multiple mounting heads 19 are arranged circumferentially.

[0035] The head movement unit 14 is a mechanism that moves the head unit 13 in the X and Y directions within a predetermined range of motion. The head movement unit 14 includes a beam 20 that supports the head unit 13 so that it can reciprocate in the X direction, a pair of Y-axis guide rails 21 that support the beam 20 so that it can reciprocate in the Y direction, an X-axis servo motor 40 that moves the head unit 13 back and forth in the X direction, and a Y-axis servo motor 41 that moves the beam 20 back and forth in the Y direction.

[0036] The nozzle station 26 houses the nozzles (see Figure 4) that are attached to the mounting head 19. The nozzle station 26 will be described later. The two component imaging cameras 17 are each positioned between two tape component supply devices 12 that are aligned in the X direction. The component imaging cameras 17 are mounted on a stand 10 and image the component E that is held in place by the mounting head 19 from below.

[0037] The substrate imaging camera 18 is a camera that captures images of the fiducial marks written on the upper surface of the substrate P from above. The substrate imaging camera 18 is attached to the head unit 13 and moves together with the head unit 13 in the X and Y directions. The substrate imaging camera 18 is also used for detecting nozzles 22 (see Figure 5) stored in the nozzle station 26 and for imaging components E mounted on the substrate P.

[0038] (1-1) Head Unit The head unit 13 will be described with reference to Figure 3. The head unit 13 is equipped with multiple mounting heads 19, a Z-axis servo motor 42 (see Figure 8) that raises and lowers these mounting heads 19 individually, and an R-axis servo motor 43 (see Figure 8) that rotates these mounting heads 19 simultaneously around their axes.

[0039] Each mounting head 19 has a cylindrical nozzle shaft 19A. A nozzle 22, stored in a nozzle station 26, is detachably attached to the lower end of the nozzle shaft 19A. Each mounting head 19 is assigned a head number (here, 1 to 5).

[0040] As shown in Figure 4, the nozzle 22 has a generally cylindrical nozzle body 22A and a flange portion 22B that protrudes annularly from the nozzle body 22A. There are several types of nozzles 22 depending on the shape of the component E to be adsorbed, and the diameter of the nozzle body 22A and the diameter of the flange portion 22B differ depending on the type of nozzle 22. The nozzle ID 22C is written on the upper surface of the nozzle body 22A to uniquely identify that nozzle 22. The nozzle 22 is supplied with negative and positive pressure from an air supply device (not shown) via the nozzle shaft 19A. The nozzle 22 attracts component E when negative pressure is supplied and releases component E when positive pressure is supplied.

[0041] (1-2) Nozzle Station Referring to Figure 5, the nozzle station 26 will be described. The nozzle station 26 houses multiple nozzles 22 (six in the example shown in Figure 5). As shown in Figure 6, the nozzle station 26 includes a plate-shaped nozzle plate 25, a plate-shaped shutter 24 positioned above the upper surface of the nozzle plate 25 at a distance greater than the thickness of the flange portion 22B of the nozzle 22, and a shutter movement mechanism that moves the shutter 24 in a direction parallel to the plate surface of the nozzle plate 25.

[0042] As shown in Figure 7, the nozzle plate 25 has a row of storage holes 25A (an example of a storage section) formed therein, in which the nozzle 22 is housed. The diameter of the storage holes 25A is larger than the diameter of the nozzle body 22A and smaller than the diameter of the flange 22B. Each of the storage holes 25A is assigned a hole number.

[0043] As shown in Figure 5, the shutter 24 has elongated holes 24A formed in it corresponding to the rows of nozzles 22 (arranged in the left-right direction as shown in Figure 5). The elongated holes 24A are formed by connecting shutter holes 24B that are located in positions corresponding to the storage holes 25A of the nozzle plate 25. The diameter of the shutter holes 24B is larger than the diameter of the flange portion 22B. In the following description, the portion of the elongated hole 24A that connects the shutter holes 24B will be referred to as the connecting hole 24C. The width of the connecting hole 24C (the width in the short direction of the elongated hole 24A) is larger than the diameter of the nozzle body portion 22A and smaller than the diameter of the flange portion 22B.

[0044] The shutter 24 is slidable relative to the nozzle plate 25 in the left-right direction (longitudinal direction of the elongated hole 24A) as shown in Figure 5, and is movable between a position where the shutter hole 24B is located above the storage hole 25A and a position where the connecting hole 24C is located above the storage hole 25A (the position shown in Figure 5). When the connecting hole 24C is located above the storage hole 25A, the flange portion 22B comes into contact with the shutter 24, making it impossible to remove the nozzle 22. In the following explanation, the state in which the shutter hole 24B is located above the storage hole 25A will be referred to as the open state, and the state in which the connecting hole 24C is located above the storage hole 25A will be referred to as the closed state.

[0045] (2) Electrical configuration of component mounting device Referring to Figure 8, the electrical configuration of the component mounting device 1 will be described. The component mounting device 1 includes a control unit 30 and an operation unit 31. The control unit 30 includes an arithmetic processing unit 30A, a motor control unit 30B, a storage unit 30C, an image processing unit 30D, an external input / output unit 30E, a feeder communication unit 30F, and the like.

[0046] The arithmetic processing unit 30A is equipped with a CPU, RAM, etc., and controls each part of the component mounting device 1 by executing the control program stored in the memory unit 30C. The motor control unit 30B controls the rotation of each motor, such as the X-axis servo motor 40 and the Y-axis servo motor 41, under the control of the arithmetic processing unit 30A.

[0047] The memory unit 30C stores various programs and data executed by the arithmetic processing unit 30A. The data stored in the memory unit 30C includes component mounting data that sets the target mounting position, target mounting angle, and mounting order for each component E, as well as the correspondence table 51 (see Figure 9), which will be described later.

[0048] The image processing unit 30D is configured to receive image signals output from the component imaging camera 17 and the substrate imaging camera 18. The external input / output unit 30E is a so-called interface and is configured to receive detection signals output from various sensors 32 provided on the main body of the component mounting device 1. Furthermore, the external input / output unit 30E is configured to perform operational control of various actuators 33 (air supply device, shutter movement mechanism, etc.) based on control signals output from the calculation processing unit 30A.

[0049] The feeder communication unit 30F is connected to the tape feeder 12A and controls the tape feeder 12A comprehensively. The control unit 31 includes a display device 31A (see Figure 1) and input devices. The display device 31A consists of a liquid crystal display, a drive circuit for driving the liquid crystal display, etc. The input devices include a touch panel, keyboard, mouse, and various buttons. The operator can operate the control unit 31 to make various settings and give instructions for operation.

[0050] (3) Correspondence table between mounting head and nozzle Referring to Figure 9, the mapping table 51 stored in the memory unit 30C will be described. The mapping table 51 is a table that sets the combinations of the mounting head 19 and nozzle 22 when mounting components E onto the substrate P. Each row of the mapping table 51 corresponds to one storage hole 25A, and the hole numbers are set sequentially from 1 from the top row to the bottom row. The type of nozzle 22, the head number of the mounting head 19, the nozzle fixing, and the nozzle ID are associated with each hole number.

[0051] In Embodiment 1, the mounting head 19 and nozzle 22 are associated with the storage holes 25A of the nozzle station 26. Specifically, one mounting head 19 is pre-associated with each storage hole 25A. For example, if there are 60 storage holes 25A and 5 mounting heads 19, the head numbers 1 to 5 are sequentially associated with storage holes 25A 1 to 5, and the head numbers 1 to 5 are also sequentially associated with storage holes 6 to 10. Head numbers are associated with the other storage holes 25A in a similar manner.

[0052] The nozzle ID is the nozzle ID of the nozzle 22 associated with its storage hole 25A. The first five digits of the nozzle ID (e.g., 8105A) represent the type of nozzle 22. The last digit of the nozzle ID (e.g., 1, 2, ..., 60) represents the nozzle number.

[0053] Nozzle fixing is information indicating whether or not to fix the nozzle 22 used when mounting component E with the mounting head 19 associated with the storage hole 25A. If "Yes" is set for nozzle fixing, the nozzle 22 used when mounting component E with the mounting head 19 associated with that storage hole 25A is limited to the nozzle 22 indicated by the nozzle ID associated with that storage hole 25A. If "No" is set, it is not limited to the nozzle 22 indicated by the nozzle ID associated with that storage hole 25A.

[0054] When the control unit 30 attaches the nozzle 22 to the mounting head 19, it attaches the nozzle 22 that is stored in the corresponding storage hole 25A of the mounting head 19. Therefore, by storing the nozzle 22 that is associated with the storage hole 25A in the storage hole 25A, the component E can be mounted using the combination of mounting head 19 and nozzle 22 set in the correspondence table 51.

[0055] (4) Setting up the mapping table First, let's briefly explain the setup of the mapping table 51. The control unit 30 detects the nozzles 22 stored in the nozzle station 26 using the substrate imaging camera 18 and assigns one mounting head 19 to each detected nozzle 22 (an example of the assignment process). This assignment is performed in RAM. Therefore, it is not yet reflected in the mapping table 51 at this point.

[0056] The control unit 30 then performs adjustments (so-called calibration) for each combination of the nozzle 22 and the mounting head 19 assigned to the nozzle 22 to suppress the decrease in mounting accuracy of component E caused by the combination of the mounting head 19 and the nozzle 22 (an example of adjustment processing). The control unit 30 then sets the combination of the mounting head 19 and the nozzle 22 after adjustment in the mapping table 51 as the combination of the mounting head 19 and the nozzle 22 to be used when mounting component E on the substrate P (an example of setting processing). The following provides a detailed explanation of how to configure the mapping table 51.

[0057] (4-1) Allocation process First, with reference to Figure 10, the allocation table 50 stored in RAM will be described. The allocation table 50 is a table for storing hole number, nozzle ID, head number, and status in association with each other. The "Status" indicates whether the nozzle 22, indicated by the nozzle ID, is attached to the mounting head 19. If the nozzle 22 indicated by the nozzle ID is attached to the mounting head 19, "In Use" is set; if it is not attached (i.e., stored in the storage hole 25A), "Stored" is set. At the time of the allocation process, it is assumed that none of the nozzles 22 are attached to the mounting head 19. Therefore, at the time of the allocation process, the status of all nozzles 22 will be "Stored".

[0058] Referring to Figure 11, the allocation process flow will be explained in detail. The allocation process starts when an operator operates the control unit 31 to instruct the execution of the allocation process. In the following explanation, operating the control unit 31 to instruct the execution of the allocation process will be referred to as an allocation instruction. An allocation instruction can be given at any time when production of the substrate P is not taking place.

[0059] In S101, the control unit 30 sets the variable i, which indicates the hole number, to an initial value of 1. In S102, the control unit 30 moves the substrate imaging camera 18 above the storage hole 25A of hole number i, and the substrate imaging camera 18 images the storage hole 25A from above. In S103, the control unit 30 analyzes the image captured by the substrate imaging camera 18 to determine whether or not the nozzle 22 is stored in the captured storage hole 25A. If the nozzle 22 is stored, the control unit 30 proceeds to S104; otherwise, it proceeds to S105.

[0060] In S104, the control unit 30 analyzes the captured image to obtain the nozzle ID. This allows the nozzle 22 to be detected. The control unit 30 associates the obtained nozzle ID with the hole number i and registers it in the allocation table 50. In S105, the control unit 30 determines whether or not all storage holes 25A have been imaged. If not all storage holes 25A have been imaged, the process proceeds to S106. If all storage holes 25A have been imaged, the process proceeds to S107.

[0061] In S106, the control unit 30 adds 1 to the variable i, and then returns to S102 to repeat the process. In S107, the control unit 30 assigns a head number to each hole number in the allocation table 50. Specifically, the control unit 30 assigns to each hole number the head number of the mounting head 19 that is pre-associated with the storage hole 25A for that hole number. As a result, one mounting head 19 is assigned to each detected nozzle 22.

[0062] (4-2) Adjustment and setting processes First, referring to Figure 12, we will explain the adjustments made to suppress the decrease in mounting accuracy of component E caused by the combination of the mounting head 19 and the nozzle 22. The adjustments according to Embodiment 1 are operations to suppress both the deviation between the target mounting position 60 and the actual mounting position 61 of component E (deviation in the X direction dX, deviation in the Y direction dY), and the deviation between the target mounting angle and the actual mounting angle of component E (deviation in the rotation angle dR).

[0063] During adjustment, the control unit 30 attaches the nozzle 22, indicated by the nozzle ID registered in the assignment table 50, to the mounting head 19 assigned to that nozzle 22, and mounts the component E onto the substrate P using the combination of the nozzle 22 and the mounting head 19. The control unit 30 then captures the component E mounted on the substrate P with the substrate imaging camera 18, analyzes the captured image to detect dX, dY, and dR. The control unit 30 repeats this detection multiple times to obtain the average value of dX, dY, and dR, and sets the obtained average value as the correction value for the movement amount of the mounting head 19 and the correction value for the rotation angle of the mounting head 19. In Embodiment 1, setting these correction values ​​is called adjustment.

[0064] When mounting components E onto the substrate P, the control unit 30 corrects the movement amount and rotation angle of the mounting head 19 based on the correction values ​​described above. This suppresses the decrease in mounting accuracy of components E caused by the combination of the mounting head 19 and the nozzle 22 (deviation between the target mounting position and the actual mounting position, and deviation between the target mounting angle and the actual mounting angle).

[0065] Referring to Figure 13, the operation screen 70 for which the operator instructs the execution of adjustment and setting processes will be described. The operation screen 70 is a screen displayed on the display device 31A. The operation screen 70 has an operation / measurement tab 71 (an example of an operation screen) for the operator to instruct the execution of adjustment and setting processes, and a measurement results tab 72 (see Figure 17) for displaying the adjustment results.

[0066] The Operation / Measurement tab 71 displays adjustment settings 71A for selecting the type of nozzle 22 to be adjusted and the mounting head 19, an all-execute button 71B (an example of an adjustment button) that accepts adjustment instructions to signal the execution of the adjustment process, and a nozzle ID registration button 71C (an example of a setting button) that accepts setting instructions to signal the execution of the setting process.

[0067] Referring to the flowchart shown in Figure 14, the operator's procedure and the processes performed by the control unit 30 will be explained. Here, it is assumed that the allocation process has already been performed and the aforementioned allocation table 50 has been created. In S201, the operator selects the type of nozzle 22 and the mounting head 19 to be adjusted in the adjustment settings section 71A of the operation / measurement tab 71. In S202, the operator presses the All Execute button 71B on the Operation / Measurement tab 71. This accepts the adjustment instructions.

[0068] In S203, the control unit 30 attaches the nozzle 22 to the selected mounting head 19, which is assigned to the selected nozzle 22 of the selected type. At this time, the control unit 30 changes the status of the nozzle 22 attached to the mounting head 19 to "in use" in the assignment table 50. Then, the control unit 30 makes adjustments for each combination of nozzle 22 and mounting head 19. As described above, the control unit 30 makes adjustments to find the average values ​​of dX, dY, and dR, and sets the found average values ​​as correction values. When the control unit 30 is performing adjustments, it displays the adjustment dialog 73 shown in Figure 15. The adjustment dialog 73 displays information such as dX, dY, and dR.

[0069] In S204, the control unit 30 determines whether the average value of the deviation (dX, dY, dR) for at least one combination is greater than or equal to a predetermined upper limit. If the average value is greater than or equal to the upper limit, the control unit 30 determines that the decrease in mounting accuracy cannot be sufficiently suppressed even if a correction value is set, and the adjustment fails. If the control unit 30 determines that the adjustment has failed, it proceeds to S205. If the control unit 30 determines that the deviation for any combination is less than the upper limit, it proceeds to S209.

[0070] In step S205, the control unit 30 displays the error message 74 shown in Figure 16. The error message 74 also displays the type of nozzle 22 and the head number where the error (adjustment failure) occurred. In S206, the operator presses a nozzle retraction button (not shown). This opens the nozzle station 26. In S207, the operator manually swaps the nozzle 22 placements of the types indicated in error message 74 so that the mounting head 19 assigned to the nozzle 22 is changed.

[0071] In S208, the operator operates the control unit 31 to instruct the re-execution of the assignment process. When the nozzles 22 are rearranged and the assignment process is re-executed, the mounting heads 19 are re-assigned to the nozzles 22 according to the rearranged nozzles 22. After the assignment process is re-executed, the operator returns to S202 and presses the all-execute button 71B again. This causes the adjustments to be made again with the re-assigned combinations. After rearranging the nozzles 22, the operator may press the nozzle retraction button instead of operating the control unit 31. When the nozzle retraction button is pressed, the control unit 30 may close the nozzle station 26 and automatically re-execute the assignment process. In other words, the nozzle retraction button may also be a trigger for re-executing the assignment process.

[0072] In S209, the operator checks the measurement results on the measurement results tab 72 shown in Figure 17. In S210, the operator presses the nozzle ID registration button 71C if the adjustment result is "adjustment successful" for all combinations. This accepts the setting instruction. In S211, the control unit 30 performs a setting process.

[0073] Referring to Figure 18, the setting process performed in S211 will be explained. The mapping table 51 shown in Figure 18 shows the mapping table 51 before the nozzle IDs are registered in S211. Hole numbers and mounting heads 19 are pre-associated and registered in the mapping table 51. The setting process involves registering nozzle IDs registered in the allocation table 50 whose status is "in use" (i.e., the nozzle IDs of the nozzles 22 that have been adjusted) in the mapping table 51, and further changing the "nozzle fixed" status of the registered nozzle IDs to "fixed".

[0074] Refer to Figure 19 to explain the flow of the setup process. In S301, the control unit 30 retrieves hole numbers whose status is "in use" from the allocation table 50 stored in RAM. In S302, the control unit 30 reads the nozzle ID corresponding to the hole number acquired in S301 from the assignment table 50 and registers it in the corresponding hole number nozzle ID in the mapping table 51. In S303, the control unit 30 changes the nozzle fixing status in the mapping table 51 to "fixed" for the row where the nozzle ID was registered in S302. As a result, the mapping table 51 is set up as shown in Figure 9.

[0075] (5) Checking the nozzles before implementation and changing the nozzle placement In the first embodiment, when producing a substrate P, the control unit 30 considers that a nozzle 22 associated with the mounting head 19 is stored in a storage hole 25A to which the mounting head 19 is associated, and installs the nozzle 22 stored in the storage hole 25A.

[0076] Therefore, before starting production of the substrate P, the control unit 30 uses the substrate imaging camera 18 to image each storage hole 25A of the nozzle station 26 and detects the nozzle ID of the nozzle 22 stored in each storage hole 25A. The control unit 30 then determines whether all the nozzles 22 with the nozzle IDs set in the correspondence table 51 are stored in the nozzle station 26 (an example of the first determination process).

[0077] Then, as shown in Figure 20, if at least one of the nozzles 22 set in the mapping table 51 is not stored in the nozzle station 26, the control unit 30 displays an error message 75 on the operation unit 31 indicating that the nozzle 22 set in the mapping table 51 is not stored (an example of error notification processing). The error message 75 also displays the nozzle ID of the unstored nozzle 22 and the hole number where that nozzle 22 should be stored.

[0078] If error message 75 is displayed, the operator stores nozzle 22 with the displayed nozzle ID in storage hole 25A with the displayed hole number. This ensures that all nozzles 22 set in the mapping table 51 are stored in nozzle station 26.

[0079] Even if all nozzles 22 set in the mapping table 51 are stored in the nozzle station 26, it is possible that a nozzle 22 stored in a storage hole 25A is not the nozzle 22 associated with that storage hole 25A. For this reason, if all nozzles 22 set in the mapping table 51 are stored in the nozzle station 26, the control unit 30 determines whether or not a nozzle 22 associated with that storage hole 25A is stored in each storage hole 25A of the nozzle station 26 (an example of a second determination process).

[0080] If there are any nozzles 22 that are not stored, the control unit 30 automatically changes the arrangement of the nozzles 22 so that each storage hole 25A has a nozzle 22 associated with that storage hole 25A stored in it (an example of the change process). This makes it possible to mount the component E using the combination of mounting head 19 and nozzle 22 set in the mapping table 51. Here, the arrangement of the nozzles 22 is changed using the mounting head 19. The control unit 30 attaches the nozzle 22 whose arrangement is to be changed to the mounting head 19, stores the attached nozzle 22 in the storage hole 25A at the destination, and removes it from the mounting head 19. This automatically changes the arrangement of the nozzles 22.

[0081] Refer to Figure 21 to explain the flow of checking the nozzles before implementation and changing the nozzle placement. In S401, the control unit 30 uses the substrate imaging camera 18 to image each storage hole 25A and detects the nozzles 22 stored in the nozzle station 26. In S402, the control unit 30 compares the nozzle ID of the detected nozzle 22 with the mapping table 51 to determine whether all nozzles 22 set in the mapping table 51 are stored in the nozzle station 26. If there are nozzles 22 that are not stored, the control unit 30 proceeds to S403; if all nozzles 22 are stored, it proceeds to S404.

[0082] In S403, the control unit 30 displays error message 75. In S404, the control unit 30 determines whether the detected nozzle 22 is stored in the storage hole 25A to which the nozzle 22 is associated in the mapping table 51. If it is stored, the process ends; otherwise, the process proceeds to S405.

[0083] In S405, the control unit 30 automatically changes the arrangement of the detected nozzle 22 so that it is stored in the corresponding storage hole 25A (the storage hole 25A with the corresponding hole number in the correspondence table 51 to which the nozzle ID of the nozzle 22 is associated).

[0084] (6) Effects of the Embodiment According to the component mounting apparatus 1 of Embodiment 1, one mounting head 19 is assigned to each of a plurality of nozzles 22 to combine the mounting head 19 and nozzles 22. For each combination of mounting head 19 and nozzle 22, adjustments are made to suppress the decrease in mounting accuracy of the component E caused by the combination of mounting head 19 and nozzle 22. Then, according to the component mounting apparatus 1, the combination of mounting head 19 and nozzle 22 after adjustment is set as the combination of mounting head 19 and nozzle 22 to be used when mounting the component E on the substrate P. Therefore, the component E can be mounted on the substrate P with the combination of mounting head 19 and nozzle 22 after adjustment. As a result, the decrease in mounting accuracy caused by the combination of mounting head 19 and nozzle 22 can be suppressed.

[0085] According to the component mounting device 1, when a setting instruction is received by the operation unit 31, the control unit 30 executes the setting process, thus reducing the burden on the operator compared to when the operator sets the settings manually.

[0086] According to the component mounting device, the nozzle ID registration button 71C (an example of a setting button) is displayed on the operation / measurement tab 71 (an example of an operation screen), where the all-execute button 71B (an example of an adjustment button) is displayed. Therefore, when the operator presses the all-execute button 71B to give an adjustment instruction and then gives a setting instruction, they do not need to search for the nozzle ID registration button 71C on another screen (or another tab). As a result, the operator can promptly instruct the execution of the setting process after the adjustment process is completed.

[0087] According to the component mounting device 1, the nozzles 22 stored in the nozzle station 26 are automatically detected by the substrate imaging camera 18, so the allocation process can be performed automatically. This reduces the burden on the operator compared to when the operator has to allocate the nozzles manually.

[0088] The component mounting apparatus 1 can suppress at least one of the discrepancies between the target mounting position and the actual mounting position, and the discrepancy between the target mounting angle and the actual mounting angle, which are caused by the combination of the mounting head 19 and the nozzle 22.

[0089] According to the component mounting device 1, if the deviation exceeds the upper limit, the setting process is not executed, thus preventing the setting of combinations that do not sufficiently suppress the reduction in mounting accuracy. If the setting process is not executed, the arrangement of the nozzles 22 is rearranged so that the mounting heads 19 assigned to the nozzles 22 are changed, the assignment process is re-executed, and then the adjustment process is re-executed, which increases the likelihood of setting a combination that sufficiently suppresses the reduction in mounting accuracy.

[0090] According to the component mounting device 1, if the nozzle 22 set during the setting process is not stored in the nozzle station 26, an error message 75 indicating that the set nozzle 22 is not stored is reported. Upon receiving the error message 75, the operator stores the set nozzle 22 in the nozzle station 26. This allows the component E to be mounted using the combination that was adjusted.

[0091] In the component mounting device 1, one mounting head 19 is associated with each storage hole 25A, and the mounting unit mounts component E by attaching the nozzle 22 stored in the storage hole 25A to the mounting head 19 associated with that storage hole 25A. In this case, if the nozzle 22 that is combined with the mounting head 19 associated with the storage hole 25A is not stored in that storage hole 25A, the control unit 30 automatically changes the arrangement of the nozzles 22 so that the nozzle 22 that is combined with the mounting head 19 is stored in that storage hole 25A. Therefore, when mounting component E by attaching the nozzle 22 stored in the storage hole 25A to the mounting head 19 associated with that storage hole 25A, component E can be mounted in the combination that was adjusted.

[0092] <Other Embodiments> The technology disclosed herein is not limited to the embodiments described above in the description and drawings, and the following embodiments, for example, are also included in the technical scope disclosed herein.

[0093] (1) In the above embodiment, the operator checks the measurement results in S209 and presses the nozzle ID registration button 71C if the adjustment result is "adjustment successful" for all combinations. When the nozzle ID registration button 71C is pressed, the control unit 30 executes the setting process (S211). Alternatively, the control unit 30 may automatically execute the setting process if the adjustment result is "adjustment successful" for all combinations.

[0094] (2) In the above embodiment, an example was given in which the assignment process is executed when an operator operates the operation unit 31 (an example of an operation unit) to instruct the execution of the assignment process. In contrast, the assignment process may be executed automatically when production of the substrate P is not taking place.

[0095] (3) In the above embodiment, adjustments to suppress the decrease in mounting accuracy of component E caused by the combination of mounting head 19 and nozzle 22 were given as examples of adjustments to suppress the decrease in mounting accuracy of component E caused by the combination of mounting head 19 and nozzle 22. However, the adjustment may be either the adjustment of the amount of movement or the adjustment of the rotation angle. The adjustment is not limited to these, and any other adjustment may be made as long as it suppresses the decrease in mounting accuracy of component E caused by the combination of mounting head 19 and nozzle 22.

[0096] (4) In the above embodiment, an example was given in which the setting process is not performed if the deviation detected in the adjustment process is greater than a predetermined upper limit, but the setting process may be performed regardless of the magnitude of the detected deviation.

[0097] (5) In the above embodiment, the mounting head 19 is associated with the storage hole 25A, and an example was given in which the mounting head 19 and the nozzle 22 are associated via the storage hole 25A. More specifically, an example was given in which the nozzle 22 stored in the storage hole 25A to which the mounting head 19 is associated is attached to the mounting head 19 as the nozzle 22 that is combined with the mounting head 19. In contrast, the mounting head 19 and the nozzle 22 may be associated without going through the storage hole 25A. Specifically, the hole number may not be included in the association table 51. In this case, the control unit 30 may detect the nozzle 22 stored in the nozzle station 26 and associate the storage hole 25A with the nozzle 22, and then move the mounting head 19 above the storage hole 25A in which the nozzle 22 associated with the mounting head 19 is stored, and attach the nozzle 22 stored in the storage hole 25A to the mounting head 19.

[0098] (6) In the above embodiment, when all the nozzles 22 set in the setting process are stored in the nozzle station 26, if the nozzle 22 that is combined with the mounting head 19 associated with the storage hole 25A is not stored in that storage hole 25A, the control unit 30 automatically changes the arrangement of the nozzles 22 so that the nozzle 22 that is combined with the mounting head 19 associated with the storage hole 25A is stored in that storage hole 25A. In contrast, if the nozzle 22 that is combined with the mounting head 19 associated with the storage hole 25A is not stored in that storage hole 25A, the operator may manually change the arrangement of the nozzles 22.

[0099] (7) In the above embodiment, a storage hole 25A was exemplified as the storage part, but the storage part is not limited to a storage hole 25A as long as the nozzle 22 can be stored in it. For example, the storage part may be a recess in which the nozzle 22 is stored.

[0100] (8) In the above embodiment, the substrate imaging camera 18 (imaging unit for imaging fiducial marks) is shown as also serving as the detection unit (detection unit for detecting the nozzles 22 stored in the nozzle station 26), but a camera other than the substrate imaging camera 18 may be provided as the detection unit. [Explanation of Symbols]

[0101] 1: Component mounting equipment 13: Head unit (an example of the mounting section) 14: Head movement section (an example of a mounting section) 18: Substrate imaging camera (an example of a detection unit and imaging unit) 19: Implementation Head 22: Nozzle 25A: Storage hole (an example of a storage section) 26: Nozzle Station 30: Control Unit 31: Control section 31A: Display device 71: Operation / Measurement Tab (Example of operation screen) 71B: All Execution Button (Example of an adjustment button) 71C: Nozzle ID registration button (an example of a settings button) E: Parts P: Board

Claims

1. A component mounting device for mounting components onto a circuit board, Multiple nozzles for adsorbing the aforementioned component, A nozzle station in which multiple nozzles are stored, A mounting unit having multiple mounting heads, which attaches the nozzles stored in the nozzle station to the mounting heads to mount the components onto the substrate, Control unit and Equipped with, The control unit, An assignment process in which one mounting head is assigned to each of the multiple nozzles stored in the nozzle station, For each combination of the nozzle and the mounting head assigned to the nozzle, an adjustment process is performed to suppress the reduction in the mounting accuracy of the component caused by the combination of the mounting head and the nozzle. A setting process to set the combination of the mounting head and the nozzle when the adjustment described above is performed as the combination of the mounting head and the nozzle when mounting the component onto the substrate, A component mounting device that performs this task.

2. A component mounting apparatus according to claim 1, The system includes an operation unit that receives setting instructions from an operator to instruct the execution of the aforementioned setting process, The control unit, after the adjustment process, executes the setting process when it receives the setting instruction from the operation unit, is a component mounting apparatus.

3. A component mounting apparatus according to claim 2, The operation unit has a display device, The control unit displays an operation screen on the display device in which an adjustment button that accepts an adjustment instruction to execute the adjustment process is displayed, and when the adjustment button is pressed, it executes the adjustment process. A component mounting device in which a setting button that accepts the setting instruction is displayed on the operation screen.

4. A component mounting apparatus according to claim 2 or claim 3, The nozzle station is equipped with a detection unit that detects the nozzles stored in the nozzle station, The operation unit further receives an assignment instruction from the operator that instructs the execution of the assignment process, A component mounting apparatus in which, upon receiving the assignment instruction from the operation unit, the control unit detects the nozzles stored in the nozzle station using the detection unit and assigns one mounting head to each of the detected nozzles.

5. A component mounting apparatus according to any one of claims 1 to 3, The system includes an imaging unit for imaging the components mounted on the substrate, The adjustment process is a component mounting apparatus comprising: mounting the component on the substrate using the combination of the mounting head and the nozzle and capturing an image with the imaging unit; detecting at least one of the discrepancy between the target mounting position and the actual mounting position of the component, and the discrepancy between the target mounting angle and the actual mounting angle of the component, based on the captured image; and adjusting at least one of the amount of movement of the mounting head and the rotation angle of the mounting head according to the detected discrepancy.

6. A component mounting apparatus according to claim 5, The control unit does not execute the setting process if the deviation detected in the adjustment process is greater than a predetermined upper limit, in a component mounting apparatus.

7. A component mounting apparatus according to any one of claims 1 to 3, The nozzle station is equipped with a detection unit that detects the nozzles stored in the nozzle station, The control unit, After the setting process, when production of the substrate is instructed, the detection unit detects the nozzles stored in the nozzle station and performs a first determination process to determine whether the nozzles set in the setting process are stored in the nozzle station. If the first determination process determines that the nozzle is not stored, an error notification process is performed to notify an error indicating that the set nozzle is not stored. A component mounting device that performs this task.

8. A component mounting apparatus according to claim 7, The nozzle station has a plurality of storage compartments, each of which stores one nozzle, and each storage compartment is associated with one mounting head. The mounting unit mounts the component by attaching the nozzle stored in the storage unit to the mounting head associated with the storage unit. The control unit, when it determines in the first determination process that the nozzle is stored, performs a second determination process for each storage unit to determine whether the nozzle, which is combined with the mounting head associated with the storage unit, is stored in the storage unit. If the second determination process determines that the nozzle is not stored, a modification process is performed to automatically change the arrangement of the nozzle so that the nozzle, which is associated with the storage unit and is combined with the mounting head, is stored in the storage unit. A component mounting device that performs this task.

9. A nozzle management method for a component mounting apparatus that mounts components onto a circuit board, The aforementioned component mounting device is Multiple nozzles for adsorbing the aforementioned component, A nozzle station in which multiple nozzles are stored, A mounting unit having multiple mounting heads, which attaches the nozzles stored in the nozzle station to the mounting heads to mount the components onto the substrate, Equipped with, The nozzle management method is: A division step of assigning one mounting head to each of the multiple nozzles stored in the nozzle station, For each combination of the nozzle and the mounting head assigned to the nozzle, an adjustment step is performed to suppress the reduction in the mounting accuracy of the component caused by the combination of the mounting head and the nozzle. A setting step of setting the combination of the mounting head and the nozzle when the adjustment described above is performed as the combination of the mounting head and the nozzle when mounting the component onto the substrate, A nozzle management method, including the following.

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