Electronic component mounting equipment

Abstract

To provide an electronic component mounting device that simplifies alignment of a cut of an anisotropic conductive film (ACF) with respect to an edge of a chip on film (COF), which has been required each time the size of the COF changes, and omits a moving mechanism of a pressure head.SOLUTION: An electronic component mounting device includes a supply device that supplies a film-like electronic component F, a sticking device that sticks an anisotropic conductive member on the film-like electronic component F at a predetermined sticking position R2, a mounting device that mounts the film-like electronic component F to which the anisotropic conductive member is adhered on a display panel, and a transfer device in which a reference position R1 is set for alignment with the sticking position R2, and aligns the edge of the film-like electronic component F with the reference position R1 to receive the film-like electronic component F from the supply device and stick the anisotropic conductive member to the component, and then transfers the component to the mounting device.SELECTED DRAWING: Figure 15

Description

Technical Field

[0001] The present invention relates to an electronic component mounting apparatus.

Background Art

[0002] As displays such as televisions and personal computers, liquid crystal displays and organic EL displays have become widespread. In the manufacturing process of such displays, there is an assembly process of a panel for mounting drive electronic components on a display panel. In this assembly process, there are two methods: a method of directly mounting a driver IC for driving, and a method of mounting a film-shaped electronic component called a COF (Chip On Film) in which a driver IC is mounted on a film-shaped circuit board.

[0003] The former is called COG (Chip On Glass) mounting because a chip-shaped electronic component such as a driver IC is mounted on a glass substrate constituting a display panel, and the latter is called FOG (Film On Glass) mounting because a film-shaped electronic component is mounted on a glass substrate. Also, for COG mounting, an electronic component mounting apparatus called a COG mounting apparatus is used, and for FOG mounting, an electronic component mounting apparatus called an OLB (Outer Lead Bonding) apparatus or a FOG mounting apparatus is used.

[0004] Conventionally, generally with the boundary of a display panel size of 10 inches, for example, in a large display panel exceeding 10 inches, FOG mounting is used, and in a small display panel of 10 inches or less, COG mounting is used. Therefore, also in an electronic component mounting apparatus for mounting electronic components on a display panel, an FOG mounting apparatus is used for a large display panel, and a COG mounting apparatus is used for a small display panel.

[0005] Incidentally, in the manufacturing process of display panels, there is a growing demand for electronic component mounting equipment that can selectively perform COG mounting and FOG mounting. Here, COF is supplied by punching out a tape-like material. Driver ICs are supplied from a tray. Therefore, such electronic component mounting equipment needs to be equipped with two types of supply devices: a supply device that uses punching and a supply device that uses trays.

[0006] In such an electronic component mounting device, the driver IC or COF is temporarily pressed onto the display panel via an anisotropic conductive material called ACF (Anisotropic Conductive Film), and then mounted onto the display panel by heat pressing (hereinafter also referred to as final pressing). Specifically, the ACF is attached to the display panel before the temporary pressing, and the driver IC or COF is temporarily and final pressed onto this display panel. Such an ACF is a sheet-like material in which many small conductive particles are contained in a thermosetting resin base material, and is supplied as a tape-like material attached to a release tape (hereinafter referred to as ACF tape).

[0007] On the other hand, there is a need for an electronic component mounting device that can attach ACF to COF instead of a display panel, and then mount the COF with the attached ACF onto a display panel. As an attachment device for attaching ACF to COF, for example, the one disclosed in Patent Document 1 is known. In Patent Document 1, an ACF tape with ACF attached is supplied, and this ACF is attached to the COF. Such an ACF has cuts made in advance to match the dimensions of the COF, and when the release tape is pulled off from the COF after attachment, the ACF attached to the COF and the ACF tape are separated at these cuts. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2008-016594 [Overview of the project] [Problems that the invention aims to solve]

[0009] Incidentally, conventionally, when electronic component mounting equipment held electronic components such as COF, the center of the holding part and the center of the electronic component were aligned to hold the electronic component. Therefore, when attaching ACF to COF of various dimensions, it was necessary to align the cut in the ACF with the end of the COF each time the COF dimensions changed. At this time, as shown in Figure 16, the ACF to be attached to the COF (shaded area in the figure) is separated to the dimensions of the COF by the cut made in the ACF and then attached to the COF. At this time, the ACF tape downstream of the ACF to be attached to the COF has no ACF remaining because ACF has already been attached to the COF, but upstream of the cut (the supply side of the ACF tape) ACF that will be attached to the COF is attached to the ACF tape. Since the properties of ACF change when heated, it is desirable to avoid applying heat to the ACF before it is attached to the COF as much as possible. Therefore, the cut in the ACF was aligned with the end face of the COF, and the end of the pressurizing head was pressed and attached to the cut in the ACF to prevent the heated pressurizing head from contacting the ACF upstream of the cut. Consequently, in order to accommodate COF of various dimensions, it was necessary to add adjustments to align the cut in the ACF with the end face of the COF each time the COF dimensions changed, as well as a moving mechanism to align the end of the pressurizing head with the cut in the ACF, and control mechanisms for these adjustments.

[0010] The present invention aims to provide an electronic component mounting apparatus that simplifies the alignment of the cut in the ACF with respect to the end of the COF, which was previously required each time the dimensions of the COF changed, and also eliminates the need for a moving mechanism for the pressure head. [Means for solving the problem]

[0011] To achieve the above objective, the electronic component mounting apparatus of the present invention comprises a supply device for supplying film-shaped electronic components, and a device for applying pressure to the film-shaped electronic components at a predetermined attachment position using a pressure head. Cuts were made at the cutting point.An attachment device for attaching an anisotropic conductive member, and a mounting device for mounting the film-like electronic component with the anisotropic conductive member attached to it onto a display panel, The aforementioned film-like electronic component A transfer device for which a reference position is set to align with the aforementioned attachment position, comprising an arm for receiving the film-like electronic component from the supply device, The aforementioned arm is set The system includes a transfer device which receives the film-like electronic component from the supply device by aligning the end of the film-like electronic component with the aforementioned reference position, and after the anisotropic conductive member is attached, it is passed to the mounting device, wherein the attachment position is set on the pressure head. The aforementioned attachment position is determined by positioning the cut at the aforementioned attachment position. The aforementioned reference position is determined by the rotation of the arm, and the film-like electronic component is positioned on the adhesive device, even without movement of the pressure head for aligning the adhesive position with respect to the reference position. before Paste position and the aforementioned break It is set to the position where and are aligned. [Effects of the Invention]

[0012] This invention simplifies the alignment of the cut in the ACF with respect to the end of the COF, which was previously required each time the dimensions of the COF changed, and also eliminates the need for a moving mechanism for the pressurizing head. [Brief explanation of the drawing]

[0013] [Figure 1] This is a perspective view showing a film-like electronic component (A) and a chip-like electronic component (B) according to the embodiment. [Figure 2] This is a plan view showing the overall configuration of the electronic component mounting device according to the embodiment. [Figure 3] Diagram (A) shows the process of mounting film-shaped electronic components in the electronic component mounting apparatus of the embodiment, and diagram (B) shows the process of mounting chip-shaped electronic components. [Figure 4] This is an explanatory diagram showing the punching and feeding device of the embodiment before punching (A) and after punching (B). [Figure 5] This is an explanatory diagram showing the tray receiving process of the tray supply device according to the embodiment. [Figure 6]It is a perspective view showing the first holding head and the second holding head of the embodiment. [Figure 7] It is an explanatory view showing the operation of the moving mechanism of the embodiment. [Figure 8] It is a plan view showing the reference position of the embodiment. [Figure 9] It is an explanatory view showing the sticking device of the embodiment. [Figure 10] It is a functional block diagram showing the control device of the embodiment. [Figure 11] It is a flowchart showing the mounting procedure of the film-shaped electronic component of the embodiment. [Figure 12] It is a flowchart showing the mounting procedure of the film-shaped electronic component of the embodiment. [Figure 13] It is an explanatory view showing the relationship between the reference position, the half-cut line, and the sticking position of the embodiment. [Figure 14] It is a flowchart showing the mounting procedure of the chip-shaped electronic component of the embodiment. [Figure 15] It is an explanatory view showing the alignment of the embodiment. [Figure 16] It is an explanatory view showing the alignment of the ACF and the pressing head corresponding to the COFs of various dimensions of the prior art. [Embodiment for Carrying Out the Invention]

[0014] Embodiments of the present invention (hereinafter referred to as "the present embodiments") will be specifically described with reference to the drawings. Note that the drawings schematically show each member and each component, and do not accurately show dimensions, intervals, and the like.

[0015] [Configuration] [Electronic Component and Mounting Target] The electronic components in this embodiment are a film-type electronic component F as shown in Figure 1(A) and a chip-type electronic component C as shown in Figure 1(B). The film-type electronic component F is a component in which an electronic component is mounted on a flexible resin film, and electrodes are formed on the edge of one side. This film-type electronic component F is prepared as a component that is mounted by individually punching out a sheet-type or tape-type thin plate member in which multiple film-type electronic components F are integrally formed. In addition, the film-type electronic component F in this embodiment comes in various dimensions. The chip-type electronic component C is a driver IC. This chip-type electronic component C is prepared by mounting it on a tray T (see Figure 3) in a state where it has been separated into individual products in advance.

[0016] The mounting targets for the film-type electronic component F and the chip-type electronic component C are components that make electrical connections to the electrodes of the film-type electronic component F or the chip-type electronic component C. In this embodiment, the mounting target is the display panel D that constitutes the display device. In other words, it is a component equipped with a display function and electrodes.

[0017] [Electronic component mounting equipment] (Overall structure) The overall configuration of the electronic component mounting apparatus of this embodiment will be described with reference to Figures 2 and 3. As shown in Figure 2, the electronic component mounting apparatus includes a punching and feeding device 10, a tray feeding device 20, a transfer device 40, a bonding device 50, a mounting device 60, and a control device 80.

[0018] The punching and feeding device 10 is a device that punches out film-shaped electronic components F from a thin sheet-shaped member ST and supplies the film-shaped electronic components F. The tray feeding device 20 is a device that supplies trays T containing chip-shaped electronic components C.

[0019] The transfer device 40 receives film-shaped electronic components F from the die-cutting supply device 10 and transfers the film-shaped electronic components F to the mounting device 60 via the adhesive device 50. The transfer device 40 also receives chip-shaped electronic components C from the tray supply device 20 and transfers them to the mounting device 60. A first holding head H1 is used for transferring film-shaped electronic components F from the die-cutting supply device 10 to the transfer device 40. A second holding head H2 is used for transferring chip-shaped electronic components C from the tray supply device 20 to the transfer device 40. The first holding head H1 and the second holding head H2 are detachably mounted on the transfer device 40.

[0020] The adhesive device 50 is a device for attaching an anisotropic conductive material called ACF (Anisotropic Conductive Film) to the electrodes of a film-shaped electronic component F. ACF is a sheet-like material in which many small conductive particles are contained in a resin base material. The mounting device 60 is a device for pressing the film-shaped electronic component F or chip-shaped electronic component C onto the display panel D to be mounted.

[0021] The control device 80 controls the die-cutting and feeding device 10, the tray feeding device 20, the transfer device 40, the adhesive device 50, and the mounting device 60. This control device 80 is composed of, for example, a dedicated electronic circuit or a computer that operates with a predetermined program. The control device 80 has the control contents of each part programmed into it, and this program is executed by a processing unit such as a PLC or CPU.

[0022] Furthermore, on a plane parallel to the mounting surface of the electronic component mounting device, the straight line from the punching and feeding device 10 to the mounting device 60 is defined as the Y direction, and one direction perpendicular to this is defined as the X direction. The axis along the Y direction is defined as the Y-axis, and the axis along the X direction is defined as the X-axis. The XY plane formed by the Y-axis and X-axis is parallel to the film-shaped electronic component F, the chip-shaped electronic component C, the display panel D, and the planes supporting them. In the following explanation, the XY plane may also be referred to as the horizontal plane.

[0023] Furthermore, the direction perpendicular to the XY plane and extending upward from the mounting surface is defined as the Z direction, and the axis along the Z direction is defined as the Z-axis. When the mounting surface is horizontal, the Z-axis is vertical. The Z-axis is perpendicular to the film-type electronic component F, the chip-type electronic component C, the display panel D, and the planes supporting them. In the following description, the Z direction is defined as upward, and the opposite direction as downward. In addition, the rotation direction parallel to the XY plane with respect to the Z-axis is defined as the θ direction, and the rotation direction perpendicular to the XY plane with respect to the Y-axis is defined as the α direction. These directions are used to describe the positional relationships of each component of the electronic component mounting device and do not limit the positional relationships or directions when installed on the mounting surface.

[0024] (Punching supply device) As shown in Figures 2 and 4, the punching and feeding device 10 includes a feeding unit 110, a table 120, a die 130, and a lifting mechanism 140.

[0025] The supply unit 110 is a mechanism that sequentially feeds out the punched-out portions of electronic components using a reel on which a thin plate-shaped member ST on which an electronic component is formed is wound (see Figure 2). For this reason, the supply unit 110 is equipped with a center of rotation for the reel, a shaft that acts as the axis of rotation for the reel, and a feed roller that feeds out the thin plate-shaped member ST.

[0026] Table 120 is a base that supports mold 130. Mold 130 has a die 131 and a punch 132.

[0027] The die 131 is a flat plate-shaped member having a surface on which a thin plate-shaped member ST fed from the supply unit 110 is placed, and having a punch hole 131a formed therein. The punch hole 131a is a through hole that substantially matches the outer shape of the film-like electronic component F. The die 131 is fixed to the upper surface of the table 120, and the table 120 is provided with an opening 120a, which is a through hole larger than the punch hole 131a, at a position corresponding to the punch hole 131a.

[0028] The punch 132 is a roughly rectangular die with an outer edge that substantially coincides with the inner edge of the punch hole 131a. The bottom surface of the punch 132 moves toward the thin plate-like member ST placed on the die 131, along the Z-axis, until it is inserted into the punch hole 131a, thereby punching out the film-like electronic component F from the thin plate-like member ST. Although not shown in the figure, a suction hole connected to a pneumatic circuit is formed on the bottom surface of the punch 132, which holds the punched-out film-like electronic component F by negative pressure.

[0029] The lifting mechanism 140 is a mechanism that punches out film-like electronic components F by moving the punch 132 along the Z-axis. The lifting mechanism 140 has a support part 141 and a drive part 142.

[0030] The support section 141 is a component that supports the punch 132 so that it can move up and down. The support section 141 has support columns 141a and support plates 141b. The support columns 141a are four rod-shaped members that are raised on the die 131. The support plates 141b are plate-shaped bodies that are attached to the upper ends of the support columns 141a parallel to the upper surface of the die 131.

[0031] The drive unit 142 is connected to the punch 132 and is a device that drives the punch 132 in the direction of moving toward and toward the die 131. An air cylinder or the like can be used as the drive source for the drive unit 142. The drive unit 142 has a shaft 142a. The shaft 142a is connected to the drive source and also passes through the support plate 141b and is connected to the punch 132. As the shaft 142a moves up and down by the drive source, the punch 132 punches out the film-like electronic component F. The lower moving end of the punch 132 becomes the receiving position for the first holding head H1. In other words, the punch 132 descends, holding the punched film-like electronic component F by attraction, and stops when it reaches a position where the first holding head H1 can receive it.

[0032] As shown in Figure 2, the punching and feeding devices 10 described above are arranged in pairs on the left and right sides along the X-axis in a plan view. One punching and feeding device 10a and the other punching and feeding device 10b are positioned on either side of the transfer device 430, which will be described later, in a plan view. Hereafter, when the punching and feeding devices 10a and 10b are not distinguished, they will be referred to as punching and feeding device 10.

[0033] [Tray feeding device] As shown in Figure 5, the tray supply device 20 has a frame 210 and a gripping portion 220. The frame 210 is a pair of parallel, elongated members. The distance between the pair of frames 210 is approximately equal to the width of the tray T, but the tray T can pass through vertically. The gripping portion 220 is provided on opposing sides of the frame 210 and is provided to move back and forth in a direction toward and away from the side of the tray T by a drive mechanism (not shown).

[0034] In the tray supply device 20, one tray T is gripped by the gripping part 220, and multiple trays T are stacked on top of it (Figure 5(A)). The bottom surface of the bottom tray T is the surface opposite to the surface containing the chip-shaped electronic components C, and becomes the receiving position for the second holding head H2 (Figure 5(B)).

[0035] As shown in Figure 2, the tray supply devices 20 described above are arranged in pairs on the left and right sides along the X-axis in a plan view. One tray supply device 20a and the other tray supply device 20b are positioned on either side of the transfer device 430, which will be described later, in a plan view. Hereafter, when the tray supply devices 20a and 20b are not distinguished, they will be referred to as tray supply device 20.

[0036] (Transfer device) As shown in Figures 2 and 3, the transfer device 40 receives film-shaped electronic components F from the punching and feeding device 10 and passes them to the mounting device 60 via the adhesive device 50. The transfer device 40 also receives chip-shaped electronic components C from the tray feeding device 20 and passes them to the mounting device 60. As shown in Figures 3, 6 to 8, the transfer device 40 includes a mounting section 410, a moving mechanism 420, and a transfer device 430.

[0037] (Attachment part) A first retaining head H1 or a second retaining head H2 is attached to and detached from the mounting portion 410. The mounting portion 410 has a mounting portion 411 and a locking portion 412. The mounting portion 411 is a cylindrical member on which the first retaining head H1 or the second retaining head H2 is mounted. The locking portion 412 consists of multiple pins erected from the upper surface of the mounting portion 411. The first retaining head H1 and the second retaining head H2, which are attached to and detached from such a mounting portion 410, will be described with reference to Figure 6.

[0038] The first holding head H1 holds the film-like electronic components F supplied from the punching and feeding device 10 (see Figure 3). The first holding head H1 has a holding portion H11, a connecting portion H12, and a support portion H13.

[0039] The holding portion H11 is a roughly rectangular parallelepiped-shaped member whose longitudinal direction corresponds to the side on which the electrodes of the film-like electronic component F are arranged. Although not shown in the figure, an adsorption hole connected to a pneumatic circuit is formed on the upper surface of the holding portion H11, and the punched-out film-like electronic component F is held in place by adsorption using negative pressure.

[0040] The connecting portion H12 is a roughly rectangular parallelepiped-shaped member that rests on the mounting portion 410. The bottom surface of the connecting portion H12 has a hole into which the locking portion 412 is inserted (not shown in the figure). The support column H13 is a roughly rectangular parallelepiped-shaped member that rises from the top surface of the connecting portion H12 and supports the bottom of the holding portion H11.

[0041] The second holding head H2 holds the tray T supplied from the tray supply device 20 (see Figure 3). The second holding head H2 has a holding portion H21, a connecting portion H22, and a support portion H23.

[0042] The holding portion H21 has a roughly rectangular parallelepiped shape, with the outer edge of its upper surface being larger than or equal to the outer edge of the tray T. Although not shown in the figure, suction holes connected to a pneumatic circuit are formed on the upper surface of the holding portion H21, and the tray T is held in place by negative pressure. Note that the bottom surface of the tray T may have an uneven surface for static electricity prevention. In this case, sufficient suction force may not be obtained in the uneven areas, so it is preferable to form the suction holes in positions corresponding to flat surfaces, avoiding the uneven areas. For example, suction holes can be provided in positions corresponding to the edge of the bottom surface of the tray T to ensure stable suction.

[0043] The connecting portion H22 is a roughly rectangular parallelepiped-shaped member that is placed on the mounting portion 410. The bottom surface of the connecting portion H22 has a hole into which the locking portion 412 is inserted (not shown in the figure). In other words, the connecting portions H12 and H22 of the first retaining head H1 and the second retaining head H2 have a common configuration so that they can be attached to and detached from the common mounting portion 410. The support column H23 is a roughly rectangular parallelepiped-shaped member that rises from the top surface of the connecting portion H22 and supports the bottom of the retaining portion H21.

[0044] (moving mechanism) As shown in Figure 7(A), the moving mechanism 420 moves the mounting section 410, to which the first holding head H1 is attached, between the punching supply device 10 and the transfer device 430, which will be described later. Alternatively, as shown in Figure 7(B), the moving mechanism 420 moves the mounting section 410, to which the second holding head H2 is attached, between the tray supply device 20 and the transfer device 430. The moving mechanism 420 is located below the transfer device 430 and is configured to be movable in the XYZ directions, for example, by combining a drive source (not shown), a ball screw, a slider, etc.

[0045] (transfer device) As shown in Figure 2, the transfer device 430 receives the film-shaped electronic component F held by the first holding head H1 and passes it to the mounting device 60 via the adhesive device 50. The transfer device 430 also receives the chip-shaped electronic component C from the tray T held by the second holding head H2 and passes it to the mounting device 60.

[0046] As shown in Figures 2 and 3, the transfer device 430 includes a first arm 431, a cleaning device B, a gauging device G, and a second arm 432.

[0047] The first arm 431 is a member that is rotatably mounted on a plane parallel to the XY plane by a drive source such as a motor (not shown). The first arm 431 is a cross-shaped arm in which four substantially rectangular parallelepiped arms extend in a cross direction from the center, and the center is fixed to the rotation axis of the drive source (not shown). Suction nozzles 431a connected to a pneumatic circuit are provided at the tips of the four arms. The suction nozzles 431a, by negative pressure from the vacuum source of the pneumatic circuit, suction and hold the back surface of the electrode portion of the film-like electronic component F held by the first holding head H1 from above, across the entire width in the direction in which the electrodes of the film-like electronic component F are aligned.

[0048] The first arm 431 rotates intermittently by 90° increments. More specifically, with respect to the rotation axis of the first arm 431, if the Y-direction where the punching and feeding device 10 is located is considered the 12 o'clock direction, the arm rotates intermittently in a counterclockwise or clockwise direction so that it stops at the 12 o'clock, 9 o'clock, 6 o'clock, and 3 o'clock positions. The first arm 431 receives the film-like electronic component F from the first holding head H1 at the 12 o'clock position, has the ACF attached by the attachment device 50 at the 9 o'clock position, passes the film-like electronic component F with the ACF attached to it to the second arm 432 at the 6 o'clock position, and rotates intermittently counterclockwise in the order that it passes the 3 o'clock position.

[0049] As shown in Figure 8, reference positions R1 are set at the tips of the four arms of the first arm 431 to define the position for receiving the film-like electronic component F. Reference position R1 is, for example, a reference line parallel to the direction in which each arm extends, and is set to the right of each arm tip when viewed from the center side of the first arm 431. Reference position R1 is the reference position at which the ACF is attached to the film-like electronic component F in the adhesive device 50 described later, when the film-like electronic component F, which is held by suction on the first arm 431, is positioned at the 9 o'clock position by the rotation of the first arm 431. Here, it is the supply-side end of the tape-like member TP of the pressure head 530 of the adhesive device 50. The film-like electronic component F is handed to the first arm 431 so that its end, i.e., the shorter side on the right when viewed from the center of the first arm 431, aligns with reference position R1. As a result, the film-like electronic component F is transferred to the first arm 431 so that one side of it aligns with the reference position R1, regardless of its dimensions. In other words, the film-like electronic component F is positioned in the X direction with respect to the reference position R1 at the 12 o'clock position. As a result, when the first arm 431 rotates to face the adhesive device 50 described later, the component is positioned in the Y direction relative to the adhesive device 50.

[0050] The cleaning device B is positioned below the first arm 431 at the 12 o'clock position described above. The cleaning device B is a device for removing dirt and other debris adhering to the electrode portion of the punched film-like electronic component F. The cleaning device B has a brush B1. The brush B1 is rotatably mounted around an axis in the X-axis direction by a drive source such as a motor (not shown). The cleaning device B is mounted by a drive mechanism (not shown) so as to be movable in a direction toward and away from the electrode portion of the film-like electronic component F held by the first arm 431.

[0051] The gauging device G is positioned below the first arm 431 at the 12 o'clock position described above. The gauging device G has a protruding surface G1 parallel to the XZ plane. This protruding surface G1 is movable in the Y direction by a drive mechanism (not shown). As a result, the protruding surface G1 of the gauging device G pushes the film-like electronic component F toward the punching and feeding device 10 while it is held in place by the suction nozzle 431a, shifting the relative position of the film-like electronic component F with respect to the suction nozzle 431a. In other words, the gauging device G aligns the film-like electronic component F held in place by the suction nozzle 431a in the Y direction. As a result, when the film-like electronic component F faces the adhesive device 50 due to the rotation of the first arm 431, it is aligned in the X direction with respect to the adhesive device 50. In other words, by aligning the film-like electronic component F in the Y direction at the 12 o'clock position, the gauging device G has aligned the film-like electronic component F in the X direction at the 9 o'clock position. This alignment ensures that the electrodes of the film-like electronic component F are positioned at the location of the ACF supplied by the adhesive device 50, allowing the ACF to be applied accurately by the adhesive device 50.

[0052] The second arm 432 is positioned between the first arm 431 and the mounting device 60. The second arm 432 is a long member that is rotatable on a plane parallel to the XY plane by a drive source such as a motor. One end of the second arm 432 is fixed to the rotation axis of a drive source (not shown). A rotating head 432a is provided at the tip of the second arm 432. The rotating head 432a is rotatable in the α direction about the longitudinal direction of the second arm 432 as its axis. The second arm 432 rotates intermittently in 180° increments. More specifically, it rotates intermittently in a counterclockwise or clockwise direction so as to stop at the 12 o'clock and 6 o'clock positions.

[0053] The rotating head 432a is equipped with a suction nozzle 432b that extends along the radial direction of the rotation circle. Although not shown in the figure, the suction nozzle 432b is connected to a pneumatic circuit and uses negative pressure from a vacuum source to attract and hold film-like electronic components F or chip-like electronic components C. The direction of the tip of the suction nozzle 432b is changed by 180° by the rotating head 432a. In other words, the second arm 432 is configured as an inverting transfer device that can invert the received components.

[0054] Therefore, when the suction nozzle 432b receives a film-like electronic component F held by the suction nozzle 431a of the first arm 431, it suctions and holds the electrode side of the film-like electronic component F from below, and when it picks up a chip-shaped electronic component C from the tray T held by the second holding head H2, it suctions and holds each chip-shaped electronic component C from above. In other words, the punching and feeding device 10 punches out the film-like electronic component F so that the electrode portion faces downward, and the first holding head H1 holds the film-like electronic component F punched out by the punching and feeding device 10 from below while maintaining the electrode portion facing downward, and hands it over to the first arm 431. The suction nozzle 431a of the first arm 431 suctions and holds the film-like electronic component F held from below by the first holding head H1 from above. Therefore, when the suction nozzle 432b receives the film-shaped electronic component F from the suction nozzle 431a, the film-shaped electronic component F is held from above by the suction nozzle 431a with its electrode portion facing downwards, so the suction nozzle 432b holds the electrode side from below. Also, since the tray T held by the second holding head H2 contains the chip-shaped electronic component C with its electrode portion facing upwards, the suction nozzle 432b holds the chip-shaped electronic component C from above.

[0055] When the suction nozzle 432b picks up and holds a film-shaped electronic component F, the rotating head 432a reaches the mounting device 60 with the electrode side still facing downwards. In other words, in this case, the rotating head 432a does not reverse. When the suction nozzle 432b picks up and holds a chip-shaped electronic component C, the rotating head 432a turns the electrode side of the chip-shaped electronic component C downwards before reaching the mounting device 60. In other words, in this case, the rotating head 432a reverses.

[0056] [Application device] The adhesive device 50 adheres ACF to the electrode portion of the film-like electronic component F held by the suction nozzle 431a of the first arm 431. As shown in Figure 9, the adhesive device 50 includes a supply unit 51, a cutting unit 52, an adhesive unit 53, a peeling unit 54, a transport unit 55, and a recovery unit 56.

[0057] (Supply Department) The supply unit 51 supplies the tape-like member TP to the adhesive unit 53. The tape-like member TP is, for example, an adhesive tape T1 made of ACF attached to a release tape T2. The release tape T2 is a tape that can be peeled off from the adhesive tape T1 and is formed of, for example, a resin film such as polyimide. The width of the tape-like member TP in this embodiment is approximately 0.5 to 3.5 mm.

[0058] The supply unit 51 includes a supply reel 510, a tension mechanism 511, and a path roller 512. The supply reel 510 is a reel that winds the tape-like member TP and feeds out the tape-like member TP by rotation. The tension mechanism 511 applies tension to the tape-like member TP. The tension mechanism 511 is a pair of rollers spaced apart vertically to guide the movement of the tape-like member TP as it is pulled out from the supply reel 510. One roller is a fixed roller 511a that does not move up and down, and the other roller is a movable roller 511b that can move up and down. The movable roller 511b moves up and down by a lifting mechanism (not shown). That is, it moves in the direction of the black-filled arrow in the figure. The path roller 512 is a roller that changes the direction of movement of the tape-like member TP from the tension mechanism 511 and feeds it towards the cutting unit 52.

[0059] (cutting part) The cutting section 52 cuts the adhesive tape T1 in the tape-shaped member TP. Cutting only the adhesive tape T1 in this manner is hereafter referred to as a half-cut, and the cut formed in the adhesive tape T1 by the cutting section 52 is called a half-cut line HC. These half-cut lines HC are formed at intervals corresponding to the dimensions of the film-like electronic component F. The interval between half-cut lines HC is approximately the same as the length of the side of the film-like electronic component F that is connected to the display panel. In other words, the interval between half-cut lines HC is determined to match the dimensions of the side of the film-like electronic component F that is mounted and connected to the display panel.

[0060] The cutting section 52 is provided upstream of the adhesive section 53 and includes a cutter 520 and a backup member 521. The cutter 520 is a member that cuts the adhesive tape T1 in the width direction. That is, the blade at the tip of the cutter 520 extends in the width direction of the tape-like member TP. The cutter 520 also moves its blade toward and away from the adhesive tape T1 by a moving mechanism (not shown). As described above, the cutter 520 forms a half-cut line HC on the tape-like member TP supplied by the supply section 51 to match the dimensions of the film-like electronic component F. The backup member 521 is a block with a substantially rectangular parallelepiped shape. This backup member 521 sandwiches the tape-like member TP between itself and the cutter 520 and has a flat surface 521a that contacts the release tape T2.

[0061] (Attaching part) The adhesive portion 53 adheres the adhesive tape T1 of the tape-shaped member TP to the electrode portion of the film-shaped electronic component F. The adhesive portion 53 has a pressure head 530 and a backup member 531. The pressure head 530 moves up and down by a lifting device (not shown). The tape-shaped member TP is pushed up, and the adhesive tape T1 is heated and pressurized against the electrode portion of the film-like electronic component F. For this purpose, the pressurizing head 530 is provided with a heater (not shown), and the contact surface with the tape-shaped member TP is heated to a predetermined temperature. Furthermore, a buffer member 530a is provided on the contact surface of the pressurizing head 530 with the tape-like member TP. This buffer member 530a is, for example, a sheet made of an elastic material, and prevents the adhesive tape T1, which has been softened by heating, from adhering to the pressurizing head 530. The backup member 531 is a member that supports the first arm 431 from above when the adhesive tape T1 is heated and pressed onto the electrode portion of the film-like electronic component F by the pressurizing head 530. The backup member 531 has a pair of support rollers 531a at a position opposite to the pressurizing head 530, and the outer circumferential surface of the support rollers 531a supports the upper surface of the first arm 431, which is held by the suction nozzle 431a of the film-like electronic component F and rotated to be positioned on the adhesive device 50.

[0062] An adhesive position R2 is set in the adhesive section 53. The adhesive position R2 is a reference position where the half-cut line HC of the adhesive tape T1 on the tape-shaped member TP is aligned by the transport section 55, which will be described later. In this case, it is the position of the end of the pressure head 530 on the supply section 51 side in the direction in which the tape-shaped member TP travels.

[0063] (Peeling area) The release section 54 peels the release tape T2 from the adhesive tape T1 attached to the film-like electronic component F. The release section 54 has release rods 540 and 541. The release rods 540 and 541 are, for example, round rods and are members that come into contact with the release tape T2. The release rod 540 comes into contact with the surface of the release tape T2, i.e., the surface on the adhesive tape T1 side, and the release rod 541 comes into contact with the back surface of the release tape T2. The release rods 540 and 541 move horizontally towards the upstream side (in the direction of the dotted arrow) of the tape-like member TP while sandwiching the release tape T2, as shown in Figure 9, by a moving mechanism (not shown), thereby peeling the release tape T2 from the adhesive tape T1 that is pressed onto the film-like electronic component F.

[0064] (Transportation section) The transport unit 55 sends the tape-shaped member TP from the supply unit 51 to the collection unit 56 via the adhesive unit 53. In particular, the transport unit 55 sends the tape-shaped member TP to the adhesive unit 53 so that the half-cut line HC aligns with the adhesive position R2. The transport unit 55 has a feed roller 550 and a feed motor (not shown). The feed roller 550 grips the release tape T2 with a pair of rollers and moves the tape-shaped member TP from the supply unit 51 side to the collection unit 56 side by the rotation of the rollers. The feed motor is the drive source that rotates the feed roller 550. The feed motor's rotation shaft is connected to the feed roller 550, and the rotation of the motor causes the rotation shaft to rotate around the axis, thereby rotating the feed roller 550 around the rotation shaft.

[0065] (Collection Department) The recovery unit 56 recovers the release tape T2 that has been peeled off from the adhesive tape T1 attached to the electrode portion of the film-like electronic component F in the adhesive unit 53. The recovery unit 56 has a recovery reel 560 and a path roller 561. The recovery reel 560 is a reel that winds up and recovers the release tape T2. The path roller 561 is a roller that changes the direction of movement of the release tape T2 from the adhesive unit 53 side and feeds it towards the recovery reel 560.

[0066] [Mounting device] As shown in Figures 2 and 3, the mounting device 60 is a device that heat-presses the electrodes of a film-shaped electronic component F or a chip-shaped electronic component C onto the electrodes of a display panel D via an ACF.

[0067] The mounting device 60 has a table 610 and a crimping section 620. The table 610 is a horizontal plate-like body on which the display panel D is placed. Although not shown, suction holes connected to a pneumatic circuit are formed on the upper surface of the table 610, and the display panel D is held in place by suction using negative pressure. The table 610 is provided to be movable in the direction along the X axis, Y axis and θ direction by a drive mechanism (not shown).

[0068] As shown in Figure 3, the crimping section 620 includes a pressurizing member 621 and a backup 622. The pressurizing member 621, by a drive mechanism (not shown), places a film-like electronic component F or a chip-like electronic component C onto the display panel D supported on the table 610, and then heats and pressurizes it. The pressurizing member 621 holds the film-like electronic component F or chip-like electronic component C by adsorption using a holding part (not shown), and heats it using a heating device (not shown). The backup 622 is a member that supports the display panel D when the pressurizing member 621 heats and presses the film-like electronic component F or chip-like electronic component C via the ACF.

[0069] In this embodiment, although a detailed explanation is omitted, when a chip-shaped electronic component C is heat-pressed, it is assumed that the ACF is already attached to the display panel D. Similarly, when a film-shaped electronic component F is heat-pressed, the ACF may also be attached to the display panel D beforehand. In this case, the ACF is not attached by the attachment device 50.

[0070] The crimping section 620 is a device for performing preliminary crimping before the final crimping. After the preliminary crimping by the crimping section 620, the final crimping is performed by the main crimping section located in a downstream process (not shown in the diagram).

[0071] [Control device] As shown in Figure 10, the control device 80 includes a mechanism control unit 81, a storage unit 82, and an input / output control unit 83. The mechanism control unit 81 controls the operation of each part of the punching and feeding device 10, tray feeding device 20, transfer device 40, adhesive device 50, and mounting device 60. The storage unit 82 stores information necessary for the control of this embodiment, such as programs and data for realizing the above parts. The input / output control unit 83 is an interface that controls signal conversion and input / output between each of the parts to be controlled.

[0072] Furthermore, the control device 80 is connected to an input device 91 and an output device 92. The input device 91 is an input means such as a switch, touch panel, keyboard, or mouse for the operator to operate the electronic component mounting device via the control device 80. The output device 92 is an output means such as a display device that makes information for checking the status of the electronic component mounting device visible to the operator.

[0073] [Effect] The operation of the electronic component mounting device described above will be explained separately for cases where film-type electronic components F are mounted and cases where chip-type electronic components C are mounted.

[0074] (Mounting of film-type electronic components) First, the procedure for mounting the film-like electronic component F will be explained with reference to Figures 3(A), 11 to 13. The mounting section 410 is assumed to have a first retaining head H1 pre-installed. The transport section 55 positions the tape-like member TP, which has a half-cut line HC formed on it, at the attachment position R2. As shown in Figure 11, the moving mechanism 420 moves the first retaining head H1, which is installed on the mounting section 410, so that it is directly below the punching and feeding device 10 (step S01). The punching and feeding device 10 punches out the film-like electronic component F (step S02). The punched-out film-like electronic component F descends while being held by the punch 132, and upon release of the hold, is held by the retaining part H11 of the first retaining head H1. As a result, the first retaining head H1 receives the film-like electronic component F (step S03).

[0075] The moving mechanism 420 moves the first holding head H1, which has received the film-like electronic component F, to the area below the suction nozzle 431a at the end of the first arm 431 (step S04). That is, the moving mechanism 420 moves the first holding head H1 so that the film-like electronic component F is positioned directly below the suction nozzle 431a of the arm positioned at the 12 o'clock position among the four arms of the first arm 431. At this time, the moving mechanism 420 positions the film-like electronic component F in the X direction so that its end aligns with the reference position R1 of the first arm 431 (step S05). Then, by releasing the suction of the holding portion H11 of the first holding head H1 and performing suction by the suction nozzle 431a, the first arm 431 receives the film-like electronic component F with its end aligned with the reference position R1 (step S06).

[0076] Next, at the 12 o'clock position described above, the cleaning device B rises, and the rotating brush B1 makes contact, cleaning the electrode portion of the film-like electronic component F (step S07). Furthermore, when the cleaning device B descends after cleaning, the protruding surface G1 of the gauging device G moves toward the 12 o'clock position and comes into contact with the film-like electronic component F, thereby aligning the film-like electronic component F, which has been picked up by the suction nozzle 431a, in the Y direction (step S08).

[0077] Next, with reference to Figure 12, the attachment of the ACF to the film-like electronic component F and the temporary pressing of the film-like electronic component F to the display panel D will be described. After cleaning by the cleaning device B and positioning by the gauging device G are completed, the first arm 431 is rotated to position the film-like electronic component F at the 9 o'clock position, i.e., on the attachment device 50 (step S11). More specifically, the upper surface of the first arm 431 enters between the backup member 531 and the tape-like member TP of the attachment device 50, while contacting the support roller 531a, and the film-like electronic component F and the first arm 431, which is adsorbing the film-like electronic component F, are positioned in a sandwiched manner. At this time, the reference position R1 set on the first arm 431 is set to the position where the ACF is attached when the first arm 431 rotates and is positioned on the attachment device 50 at the 12 o'clock position. Therefore, the reference position R1 set on the first arm 431 and the attachment position R2 set on the pressure head 530 coincide. Furthermore, as described above, the tape-shaped member TP with the half-cut line HC formed on it is positioned with its half-cut line HC at the attachment position R2. That is, as shown in Figure 13, the reference position R1, the half-cut line HC, and the attachment position R2 all coincide. As a result, the attachment device 50 can attach ACF to film-shaped electronic components F of different dimensions without requiring control to align the half-cut line HC of the tape-shaped member TP or a moving mechanism to move the end of the pressure head 530 each time the dimensions of the film-shaped electronic component F change.

[0078] In this state, the support roller 531a of the backup member 531 supports the upper surface of the first arm 431. Next, the pressure head 530 rises (step S12), pushing up the tape-like member TP from the release tape T2 side, and the half-cut adhesive tape T1 is attached to the electrode portion of the film-like electronic component F (step S13). After the adhesive tape T1 is attached, the pressure head 530 is lowered, and the peeling rods 540 and 541 are moved horizontally to the upstream side of the tape-like member TP, thereby peeling the release tape T2 from the adhesive tape T1 attached to the electrode portion of the film-like electronic component F (step S14). In this way, the adhesive tape T1, i.e., ACF, is attached to the film-like electronic component F.

[0079] After the ACF is attached to the film-like electronic component F, the first arm 431 is rotated to position the film-like electronic component F at the 6 o'clock position, and the film-like electronic component F is moved to the upper part of the suction nozzle 432b of the second arm 432, which is waiting at the 12 o'clock position (step S15). Then, by releasing the suction by the suction nozzle 431a of the first arm 431 and applying suction by the suction nozzle 432b, the film-like electronic component F is passed to the second arm 432 (step S16).

[0080] The second arm 432 rotates 180° in the XY plane to move the film-like electronic component F to the crimping section 620 of the mounting device 60 (step S17). The suction by the suction nozzle 432b of the second arm 432 is released, and suction is performed by the pressurizing member 621, thereby holding the film-like electronic component F in place. As the pressurizing member 621, which is holding the film-like electronic component F, descends, the electrodes of the film-like electronic component F are heated and pressed against the electrodes of the display panel D via the ACF (step S18). The suction by the pressurizing member 621 is released, and the display panel D with the film-like electronic component F temporarily pressed is transported to the main crimping section for final crimping.

[0081] The film-like electronic components F are initially supplied by one of the punching and feeding devices 10a. When the thin sheet material ST in the feeding section 110 of the punching and feeding device 10a runs out, the system switches to the other punching and feeding device 10b to continue supplying the film-like electronic components F. During this time, the reel of thin sheet material ST in the punching and feeding device 10a is replaced, and when the thin sheet material ST in the other punching and feeding device 10b runs out, the system switches back to supplying the film-like electronic components F from the punching and feeding device 10a. This allows the electronic component mounting equipment to continue mounting without being stopped.

[0082] (Mounting of chip-type electronic components) Next, the procedure for mounting the chip-shaped electronic component C will be explained with reference to Figures 3(B), 5, and 14. The second retaining head H2 is assumed to be pre-attached to the mounting section 410. As shown in Figure 5(A), the moving mechanism 420 moves the second retaining head H2 attached to the mounting section 410 so that it is directly below the tray supply device 20 (step S21). In the tray supply device 20, as shown in Figure 5(B), the retaining portion 61 of the second retaining head H2 contacts the bottom surface of the lowest tray T and holds it by suction (step S22). Then, the retaining portion 61 of the second retaining head H2 receives the tray T by the following procedure (step S23).

[0083] As shown in Figure 5(C), the tray supply device 20 releases its grip from the gripping part 220. Then, as shown in Figure 5(D), the second holding head H2 descends by the length of one tray T. As shown in Figure 5(E), the gripping part 220 grips the tray T one layer above the bottom layer. As shown in Figure 5(F), the second holding head H2 descends and the tray T is passed to the holding part H21.

[0084] The moving mechanism 420 moves the second holding head H2, which has received the tray T, to the area below the suction nozzle 432b of the second arm 432 (step S24). That is, the moving mechanism 420 moves the second holding head H2 so that the tray T is positioned below the suction nozzle 432b of the second arm 432, which is positioned at the 12 o'clock position as described above. The suction nozzle 432b of the second arm 432 faces the tray T held by the second holding head H2 due to the rotation of the rotating head 432a.

[0085] The moving mechanism 420 sequentially positions each chip-shaped electronic component C on the tray T to a position opposite the suction nozzle 432b of the second arm 432. This positioning is performed by a scanning unit (not shown) scanning the tray T. More specifically, the tray T is provided with storage compartments divided in a grid pattern, and the chip-shaped electronic components C are housed in these compartments. The mechanism sequentially positions each storage compartment to a position where the suction nozzle 432b of the second arm 432 will receive the chip-shaped electronic component C, that is, a position directly below the suction nozzle 432b when the second arm 432 stops at the 12 o'clock position. Once one storage compartment on the tray T is positioned, the suction nozzle 432b starts picking up the chip-shaped electronic component C, and the chip-shaped electronic component C is passed to the second arm 432 (step S25).

[0086] The second arm 432 rotates 180° in the XY plane to move the chip-shaped electronic component C to the crimping section 620 of the mounting device 60 (step S26). During this movement, the rotating head 432a rotates in the α direction, inverting the chip-shaped electronic component C so that its electrodes face downward. The suction by the suction nozzle 432b of the second arm 432 is released, and the suction by the pressurizing member 621 of the crimping section 620 is applied, so that the pressurizing member 621 holds the chip-shaped electronic component C. The electrode portion of the chip-shaped electronic component C is then heated and pressed against the electrodes of the display panel D via the ACF (step S27). The suction by the pressurizing member 621 is released, and the display panel D with the chip-shaped electronic component C temporarily pressed is transported to the final crimping section for final crimping.

[0087] When the chip-shaped electronic components C have been removed from one tray T, the moving mechanism 420 transports the second holding head H2, which is holding the empty tray T, to the empty tray T storage section provided in the tray supply device 20, and passes the tray T to this storage section. Then, as described above, the moving mechanism 420 has the second holding head H2 receive the tray T containing the chip-shaped electronic components C and mounts the chip-shaped electronic components C. The empty tray T storage section can be provided, for example, adjacent to the tray supply device 20, with the same configuration as the tray supply device 20. With this configuration, empty trays T can be stacked and stored in the reverse procedure of the tray supply device 20, that is, in the procedure of (F), (E), (D), (C), (B), (A) in Figure 5.

[0088] The supply of these trays T is first performed by one tray supply device 20a. When the tray supply device 20a runs out of trays T containing chip-shaped electronic components C, the supply switches to the other tray supply device 20b, and the supply of trays T continues. During this time, the trays T in tray supply device 20a are replaced, and when the trays T in the other tray supply device 20b run out, the supply switches back to tray supply device 20a. This allows the electronic component mounting equipment to continue mounting without stopping.

[0089] [effect] (1) The electronic component mounting apparatus of this embodiment comprises a punching and feeding device 10 that supplies a film-like electronic component F, a bonding device 50 that bonds an anisotropic conductive member to the film-like electronic component F at a predetermined bonding position R2, a mounting device 60 that mounts the film-like electronic component F with the anisotropic conductive member bonded to it onto a display panel D, and a transfer device 40 which is set to a reference position R1 that matches the bonding position R2, and which receives the film-like electronic component F from the punching and feeding device 10 by aligning the end of the film-like electronic component F with the reference position R1, and after the anisotropic conductive member has been bonded to it, it passes it to the mounting device 60.

[0090] As a result, as shown in Figure 15, even if the film-like electronic component F has different dimensions, its edges can be aligned to the reference position R1. Therefore, even if the dimensions of the supplied film-like electronic component F change, the ACF can be accurately attached to the film-like electronic component F without the need for a moving mechanism to move the pressure head 530 of the attachment device 50. This simplifies the time required to align the pressure head 530 of the attachment device 50, thereby improving productivity, and also reduces costs by eliminating the need for a moving mechanism to move the pressure head 530.

[0091] (2) The adhesive device 50 of this embodiment includes a cutting unit 52 that forms cuts in the anisotropic conductive member at intervals corresponding to the dimensions of the film-like electronic component F, and a transport unit 55 that feeds out the anisotropic conductive member so that the cuts align with the adhesive position R2. As a result, when the film-like electronic component F is positioned in the adhesive device 50, not only is the alignment of the reference position R1 and the adhesive position R2 completed, but the alignment of the adhesive position R2 and the cuts in the anisotropic conductive member is also completed, thus simplifying the time that was previously required to align the cuts in the anisotropic conductive member with the adhesive position.

[0092] (3) The transfer device 40 of this embodiment includes a first arm 431 that receives the film-like electronic component F from the punching and feeding device 10, and a gauging device G that adjusts the position where the first arm 431 receives the film-like electronic component F, with the end of the film-like electronic component F aligned with the reference position R1. This makes it possible to align the anisotropic conductive member and the film-like electronic component F even in the width direction of the anisotropic conductive member.

[0093] (4) The electronic component mounting apparatus of this embodiment further includes a tray supply device 20 that supplies a tray T containing chip-shaped electronic components C, a transfer device 40 receives the chip-shaped electronic components C from the tray supply device 20 and passes them to the mounting device 60, and the mounting device 60 mounts the chip-shaped electronic components C onto a display panel D to which an anisotropic conductive member has been attached in advance. This makes it possible to selectively mount a film-shaped electronic component F to the display panel D with an anisotropic conductive member attached, and mount a chip-shaped electronic component C to the display panel D with an anisotropic conductive member attached.

[0094] [Differentiation] (1) In the above embodiment, the configuration was described as simply switching between one punching supply device 10a and the other punching supply device 10b alternately. However, thin plate-shaped members ST on which film-like electronic components F of different dimensions are formed may be attached to one punching supply device 10a and the other punching supply device 10b. With this embodiment, since it is not necessary to align the cuts in the ACF with respect to the ends of the COF each time the dimensions of the COF change, multiple film-like electronic components F of different dimensions can be easily mounted on the display panel D without stopping the electronic component mounting device.

[0095] (2) In the above embodiment, a punching and supplying device 10 that punches out the film-like electronic component F from a thin plate-like member ST is used as the configuration for supplying the film-like electronic component F, but the device is not limited to this. For example, a supplying device that supplies the film-like electronic component F that has been punched out from the thin plate-like member ST in advance may be used.

[0096] (3) The adhesive device 50 in the above embodiment includes a supply unit 51, a cutting unit 52, an adhesive unit 53, a peeling unit 54, a transport unit 55, and a recovery unit 56, but is not limited thereto. The adhesive device 50 only needs to include an adhesive unit 53, and the other components, namely the supply unit 51, the cutting unit 52, the peeling unit 54, the transport unit 55, and the recovery unit 56, may have different configurations from the adhesive device 50.

[0097] (4) In the above embodiment, the adhesive tape T1 has a half-cut line HC formed by the cutting portion 52, but is not limited to this. The adhesive tape T1 may be one which has cuts formed in advance to match the dimensions of the film-like electronic component F. Also, the adhesive tape T1 does not necessarily have to have cuts formed therein. For example, the entire surface of the adhesive tape T1 may have countless fine holes, and the peeling portion 54 may tear it off at the edge of the film-like electronic component F.

[0098] (5) The electronic component mounting apparatus only needs to have mounting sections 410 for a first retaining head H1 and a second retaining head H2, and is not limited to a configuration in which the two can be replaced. For example, the apparatus may have multiple mounting sections 410, with the first retaining head H1 fixed to one and the second retaining head H2 fixed to the other. This makes it possible to switch between mounting film-type electronic components F and mounting chip-type electronic components C without replacing the first retaining head H1 and the second retaining head H2.

[0099] (6) The moving mechanisms 420 may be provided in pairs in the X-axis direction, flanking the transfer device 430. That is, one moving mechanism 420 may be provided corresponding to one punching supply device 10a and tray supply device 20a, and the other moving mechanism 420 may be provided corresponding to the other punching supply device 10b and tray supply device 20b. The first holding head H1 and the second holding head H2 may also be provided in pairs, each corresponding to a pair of moving mechanisms 420.

[0100] (7) Since the movement paths of the film-like electronic component F and the chip-like electronic component C are shared in the second arm 432, positioning and other operations can be performed using a common camera by installing cameras that image the film-like electronic component F and the chip-like electronic component C at two stopping positions of the second arm 432 (12 o'clock position and 6 o'clock position). For example, at the 12 o'clock position, one pre-alignment camera is placed above the suction nozzle 432b. Using this camera, when the film-like electronic component F is held by the suction nozzle 432b, alignment marks provided at both ends of the electrode portion of the film-like electronic component F are imaged, and the position of the film-like electronic component F is recognized based on these alignment marks. Recognition can be performed by the control device 80 using known image recognition technology. Based on this recognized position, the relative positions of the suction nozzle 432b and the pressurizing member 621 are adjusted when the film-like electronic component F is transferred to the pressurizing member 621. In this way, the positional accuracy of the transfer of the film-like electronic component F to the pressurizing member 621 can be ensured.

[0101] Furthermore, when removing the chip-shaped electronic component C from the tray T, the alignment marks provided on the electrode surface of the chip-shaped electronic component C are imaged, and the position of the chip-shaped electronic component C is recognized based on these alignment marks. Based on this recognized position, the relative position of the suction nozzle 432b and the chip-shaped electronic component C is adjusted when removing the chip-shaped electronic component C. In this way, the accuracy of the transfer position of the film-shaped electronic component F to the pressurizing member 621 can be ensured.

[0102] Meanwhile, a pair of simultaneous recognition cameras for temporary crimping are positioned at the 6 o'clock position. The simultaneous recognition cameras simultaneously capture and image the alignment marks provided on one end of the electrode portion of the film-like electronic component F and the chip-like electronic component C, as well as the corresponding alignment marks on the display panel D, within their field of view. The pair of simultaneous recognition cameras are positioned corresponding to the alignment marks on both ends of the film-like electronic component F and the chip-like electronic component C. This ensures accuracy whether temporarily crimping the film-like electronic component F or the chip-like electronic component C.

[0103] [Other embodiments] Although embodiments and modifications of the present invention have been described above, these embodiments and modifications are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the invention described in the claims. [Explanation of Symbols]

[0104] 10, 10a, 10b punching supply device 20, 20a, 20b Tray feeding device 210 frames 220 Gripping part 40 Transfer device 410 Mounting part 420 Moving mechanism 430 Transfer device 431 First Arm 431a Suction nozzle 432 Second Arm 432a Rotating head 432b Suction nozzle 50 Pasting device 51 Supply section 52 Cut section 53 Adhesive part 54 Peeled section 55 Conveying section 56 Recovery Section 60 Mounting device 80 Control device 91 Input device 92 Output device B Cleaning device C Chip-shaped electronic component D Display Panel F Film-type electronic components G Gauging Device H1 First retaining head H2 Second retaining head ST Thin plate-shaped member T Tray

Claims

1. A supply device for supplying film-like electronic components, An adhesive device for attaching an anisotropic conductive member, which has been cut by a cutting section, to the aforementioned film-like electronic component by applying pressure with a pressure head at a predetermined attachment position, A mounting device for mounting the film-like electronic component to which the anisotropic conductive member is attached to the display panel, A transfer device for which a reference position is set for aligning the film-like electronic component with the attachment position, comprising an arm for receiving the film-like electronic component from the supply device, aligning the end of the film-like electronic component with the reference position set on the arm, receiving the film-like electronic component from the supply device, and after the anisotropic conductive member is attached, transferring the device to the mounting device, Equipped with, The aforementioned attachment position is set on the pressure head, The aforementioned attachment position is determined by positioning the cut at the aforementioned attachment position. The reference position is set to a position where, when the arm rotates and the film-like electronic component is positioned on the attachment device, the attachment position and the cut are aligned without the need to move the pressure head to align the attachment position with respect to the reference position.

2. A supply device for supplying film-like electronic components, An adhesive device for attaching an anisotropic conductive member to the aforementioned film-like electronic component, A mounting device for mounting the film-like electronic component to which the anisotropic conductive member is attached to the display panel, A transfer device that receives the film-like electronic component from the supply device and transfers it to the mounting device, Equipped with, The aforementioned transfer device is An arm that receives the film-like electronic component from the supply device, and a moving mechanism that receives the film-like electronic component from the supply device and transfers it to the arm, It has, The aforementioned adhesive device, A cutting portion that forms a cut in the anisotropic conductive member, A transport unit for transporting the anisotropic conductive member, A pressure head is positioned opposite the arm and pressurizes and adheres the anisotropic conductive member to the film-like electronic component held by the arm, It has, During the aforementioned attachment, the end of the pressure head is set to the attachment position for attaching the anisotropic conductive member to the film-like electronic component so that the end of the pressure head, the cut, and the end of the film-like electronic component coincide, and a reference position for aligning the film-like electronic component to the attachment position is set on the arm. The transport unit transports the anisotropic conductive member so as to align the cut with the reference position. The electronic component mounting apparatus is characterized in that the moving mechanism positions the end of the film-like electronic component to match the reference position and transfers the film-like electronic component to the arm.

3. The aforementioned transfer device is A gauging device in which the arm adjusts the position where the film-like electronic component is received, An electronic component mounting apparatus according to claim 1 or 2, comprising:

4. The aforementioned adhesive device, The system further includes a backup member that supports the arm that has received the previously received film-like electronic component, The backup member has a pair of support rollers, and the outer circumferential surface of the support rollers supports the arm. The electronic component mounting apparatus according to claims 1 to 3.

5. The system further includes a tray supply device that supplies trays containing chip-shaped electronic components, When mounting a chip-shaped electronic component instead of the aforementioned film-shaped electronic component, The transfer device receives the chip-shaped electronic component from the tray supply device and passes it to the mounting device. The mounting device mounts the chip-shaped electronic component onto a display panel to which an anisotropic conductive member has been previously attached. The electronic component mounting apparatus according to any one of claims 1 to 4.

Images