Imprinting apparatus, imprinting method, and method for manufacturing articles

Abstract

To provide a technique advantageous for accuracy of superimposing a mold on a substrate.SOLUTION: An imprint device is provided which forms a pattern of an imprint material on a substrate by using a mold, and the imprint device has: a substrate holding unit that includes a plurality of holding areas in which a pressure between each of the holding areas and the substrate is individually controlled, and holds the substrate in the plurality of holding areas; a first acquisition unit that, in bringing the mold and the imprint material on the substrate into contact with each other, acquires first information on pressing force applied to the mold; and a control unit that, on the basis of the first information acquired by the first acquisition unit, controls the pressure between each of the plurality of holding areas and the substrate in a state in which the mold and the imprint material on the substrate are in contact with each other, so that deformation of the substrate caused by the pressing force falls within an allowable range.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article.

Background Art

[0002] As a lithography technique for manufacturing semiconductor devices and the like, an imprint technique for forming an imprint material (curable composition) on a substrate using a mold is known. In an imprint apparatus using the imprint technique, the imprint material is cured in a state where the mold is in contact with the imprint material on the substrate, and by separating the mold from the cured imprint material, a pattern of the imprint material can be formed on the substrate.

[0003] In an imprint apparatus, it is required to transfer the pattern of the mold onto the substrate with high accuracy. Therefore, techniques for accurately aligning (positioning) the mold (the pattern region on which the pattern is formed) and the substrate (the transfer region (shot region)) have been proposed (see Patent Document 1). Patent Document 1 discloses a technique for controlling the pressure of a substrate holding unit that holds a substrate based on the shape information of the substrate or the alignment information.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the prior art, when adjusting the alignment between the mold and the substrate, if the force (pressing force) for pressing the mold is changed, the mold and the substrate may be deformed due to such a change, and it may become impossible to achieve the intended alignment accuracy.

[0006] This invention has been made in view of the problems of the prior art, and its exemplary objective is to provide a technology that is advantageous in terms of the accuracy of the overlap between the mold and the substrate. [Means for solving the problem]

[0007] To achieve the above objective, an imprint apparatus as one aspect of the present invention is an imprint apparatus that forms a pattern of imprint material on a substrate using a mold, and includes a substrate holding unit that holds the substrate in a plurality of holding regions in which the pressure between the substrate and the holding region is independently controlled; a first acquisition unit that acquires first information relating to the pressing force applied to the mold when the mold and the imprint material on the substrate are brought into contact; and a control unit that controls the pressure between each of the plurality of holding regions and the substrate in a state in which the mold and the imprint material on the substrate are in contact, based on the first information acquired by the first acquisition unit, so that the deformation caused in the substrate by the pressing force is within an acceptable range.

[0008] Further objects or other aspects of the present invention will be revealed by embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, for example, it is possible to provide a technology that is advantageous in terms of the accuracy of the overlap between the mold and the substrate. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram showing the configuration of an imprint device as one aspect of the present invention. [Figure 2] This is a diagram illustrating the configuration of the substrate and the substrate holder. [Figure 3] This diagram schematically shows the shape of the mold and substrate in the imprint printing process. [Figure 4] This is a flowchart to explain the operation of the imprinting device. [Figure 5]This is a diagram showing the substrate holder section from above. [Figure 6] This diagram illustrates the misalignment of a substrate held in the substrate holder. [Figure 7] This is a diagram illustrating the manufacturing method of an article. [Modes for carrying out the invention]

[0011] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0012] Figure 1 is a schematic diagram showing the configuration of an imprint apparatus 100 as one aspect of the present invention. The imprint apparatus 100 is a lithography apparatus used in the lithography process, which is a manufacturing process for devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media, to form patterns on a substrate. The imprint apparatus 100 performs an imprint process to form a pattern of imprint material on a substrate using a mold. Specifically, the imprint apparatus 100 brings the uncured imprint material supplied (placed) on the substrate into contact with the mold and applies curing energy to the imprint material to form a pattern of cured material onto which the pattern of the mold has been transferred.

[0013] The imprint material used is a material (curable composition) that hardens when curing energy is applied. The curing energy can be electromagnetic waves or heat. Electromagnetic waves include, for example, light selected from wavelengths between 10 nm and 1 mm, specifically infrared rays, visible light, and ultraviolet rays.

[0014] The curable composition is a composition that cures upon irradiation with light or by heating. The photocurable composition that cures upon irradiation with light contains at least a polymerizable compound and a photoinitiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0015] The imprint material may be applied in a film form on a substrate by a spin coater or a slit coater. Further, the imprint material may be applied on the substrate in a droplet form or in an island or film form formed by connecting a plurality of droplets by a liquid injection head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] For the substrate, glass, ceramics, metal, semiconductor, resin, etc. are used, and a member made of a material different from the substrate may be formed on its surface as necessary. Specifically, the substrate includes a silicon wafer, a compound semiconductor wafer, quartz glass, and the like.

[0017] In this specification and the accompanying drawings, the direction is indicated in an XYZ coordinate system in which the direction parallel to the surface on which the substrate is disposed is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are θX, θY, and θZ, respectively.

[0018] In this embodiment, the imprint apparatus 100 employs a photocuring method in which the imprint material is cured by irradiating light as a method for curing the imprint material, but is not limited thereto. For example, the imprint apparatus 100 can also employ a thermocuring method in which the imprint material is cured by applying heat as a method for curing the imprint material.

[0019] As shown in FIG. 1, the imprint apparatus 100 includes a pre-alignment unit 7, a dispenser 8, an off-axis alignment measurement system 9, and an alignment measurement system 10. The imprint apparatus 100 also includes a light transmission member 13, a control unit 14, a console unit 15, an irradiation unit 16, a filling monitor 17, a mold stage 50, and a substrate stage 60.

[0020] The irradiation unit 16 irradiates light (e.g., ultraviolet light) onto the imprint material on the substrate through the mold 3. The irradiation unit 16 includes, for example, a light source unit 161 that emits light for curing the imprint material on the substrate, and an optical member 162 that guides the light emitted from the light source unit 161 to the imprint material on the substrate. The optical member 162 includes optical elements for adjusting the light emitted from the light source unit 161 to light suitable for the imprint process.

[0021] The mold 3 has a rectangular outer peripheral shape. A three-dimensional pattern 3a is formed on the surface (pattern surface) of the mold 3 that faces the substrate 1. The mold 3 is made of a material that can transmit light (ultraviolet light) from the irradiation unit 16, such as quartz glass. The mold 3 includes a cavity (recess) 3b for facilitating deformation of the pattern 3a. The cavity 3b has a circular planar shape, and its depth (thickness) is appropriately set according to the shape and material of the mold 3.

[0022] Above the cavity 3b, the light transmission member 13 is disposed. The light transmission member 13 is a member for making the space 12 surrounded by the cavity 3b and a part of the opening region provided in the mold stage 50 into a sealed space. By adjusting the pressure in the space 12 through a pressure adjustment device (not shown) connected to the space 12, the pattern 3a of the mold 3 can be deformed, for example, the pattern 3a of the mold 3 can be deformed into a convex shape on the substrate side.

[0023] The mold stage 50 includes a mold holding section 51 that holds the mold 3 by vacuum suction or electrostatic force, a mold drive section 52 that drives the mold holding section 51 in the Z direction (up and down direction), and a mold deformation mechanism 53. The mold holding section 51 and the mold drive section 52 (mold stage 50) are provided with an aperture region in their center for irradiating the imprint material on the substrate with light from the irradiation section 16.

[0024] The mold drive unit 52 includes, for example, an actuator such as a voice coil motor or an air cylinder. The mold drive unit 52 drives the mold holder 51 (and the mold 3 held by it) in the Z direction to bring the mold 3 into contact with the imprint material on the substrate or to pull the mold 3 away from the imprint material on the substrate. The mold drive unit 52 may also have a function to drive the mold holder 51 in the X and Y directions, not just the Z direction (i.e., a function to adjust the position of the mold 3 in the X and Y directions). Furthermore, the mold drive unit 52 may also have a function to adjust the position of the mold holder 51 in the θZ direction or a function to adjust the tilt of the mold holder 51.

[0025] The mold deformation mechanism 53 deforms the mold 3 (or its pattern 3a) by applying an external force or displacement to the side surface of the mold 3 held by the mold holding section 51 (correcting the shape of the mold 3). The mold deformation mechanism 53 includes, for example, a plurality of actuators and is configured to apply pressure to multiple locations on each side surface of the mold 3.

[0026] Multiple shot regions are arranged in a matrix on substrate 1. Here, a shot region refers to a region (transfer region) where the pattern 3a of mold 3 is transferred in a single imprint process. In this embodiment, in order to maximize the effective area of ​​substrate 1 (the total area of ​​the regions where the pattern 3a of mold 3 is transferred), imprint processing is performed not only on the inner shot regions of substrate 1 but also on the peripheral shot regions including the outer perimeter of substrate 1. Peripheral shot regions are shot regions that are partially missing (extending from the outer perimeter of substrate 1), and are also called missing shot regions.

[0027] The substrate stage 60 includes a substrate holding section 2 for holding the substrate 1, and a substrate drive section 61 for driving the substrate holding section 2 (and the substrate 1 held by it) in the X and Y directions. The substrate drive section 61 may include, for example, a linear motor and be composed of multiple drive systems such as a coarse drive system and a fine drive system. Furthermore, the substrate drive section 61 may have a function to drive the substrate holding section 2 in the Z direction as well as the X and Y directions (i.e., a function to adjust the position of the substrate 1 in the Z direction). In addition, the substrate drive section 61 may have a function to adjust the position of the substrate holding section 2 in the θZ direction and a function to adjust the tilt of the substrate holding section 2.

[0028] The pre-alignment unit 7 includes a pre-alignment stage (not shown) on which the substrate 1 is mounted, and a pre-alignment sensor (not shown) for measuring the position of the substrate 1 mounted on the pre-alignment stage. The pre-alignment sensor measures the position of the substrate 1 by detecting notches or orientation flats provided on the substrate 1. Based on the measurement result of the pre-alignment sensor, the pre-alignment stage is driven, and at that position, the substrate 1 mounted on the pre-alignment stage is transferred to a transport hand (not shown). The transport hand then places the substrate 1 in the substrate holding unit 2. Alternatively, instead of driving the pre-alignment stage, the position of the transport hand that receives the substrate 1 from the pre-alignment stage (receiving position) and the position of the substrate holding unit 2 that receives the substrate 1 from the transport hand may be changed based on the measurement result of the pre-alignment sensor.

[0029] In this embodiment, the position of the substrate stage 60 is measured using an encoder system that includes a scale provided on the housing and a head (optical device) provided on the substrate drive unit 61, but is not limited to this. For example, the position of the substrate stage 60 may be measured using an interferometer system that includes a laser interferometer provided on the housing and a reflective mirror provided on the substrate drive unit 61.

[0030] The off-axis alignment measurement system 9 and the alignment measurement system 10 are used for pre-alignment measurement to measure the relative position between the mold 3 and the substrate 1 (each shot area). The off-axis alignment measurement system 9 and the alignment measurement system 10 each individually measure the positions of the substrate 1 and mold 3 with respect to the device coordinates, under the control of the control unit 14. The alignment measurement system 10 measures the position of mold 3 with respect to the position of the alignment measurement system 10 by detecting (observing) marks provided on mold 3. On the other hand, the off-axis alignment measurement system 9 measures the position of the substrate 1 (each shot area) with respect to the position of the substrate holding unit 2 by detecting multiple marks provided on the substrate 1 held by the substrate holding unit 2. Then, statistical calculation processing (global alignment) is performed to estimate the position coordinates of all shot areas of the substrate 1.

[0031] Furthermore, the alignment measurement system 10 measures the positional misalignment in the X and Y directions between the alignment marks provided on the substrate 1 and the alignment marks provided on the mold 3 (i.e., the positional misalignment between the substrate 1 and the mold 3). Under the control of the control unit 14, the position of the substrate stage 60 is adjusted based on the positional misalignment measured by the alignment measurement system 10, thereby overlapping (aligning) the mold 3 (pattern 3a) and the substrate 1 (shot area).

[0032] The dispenser 8 has the function of placing (supplying) imprint material onto the substrate. For example, the dispenser 8 dispenses droplets of imprint material to each shot area on the substrate. The dispenser 8 may place imprint material individually in each of the multiple shot areas on the substrate, or it may place imprint material in several shot areas at once.

[0033] The filling monitor 17 (spread camera) observes the contact state between the imprint material placed (supplied) on the substrate (in the shot area) and the mold 3. By observing the contact state between the imprint material on the substrate and the mold 3 with the filling monitor 17, it is possible to identify defects caused by particles or incomplete filling of the imprint material. The filling monitor 17 includes, for example, a light source, an image sensor, and an optical system. The light source is an LED that emits light of a wavelength that does not expose the imprint material, and the image sensor is a two-dimensional sensor such as a CCD sensor. The optical system includes an illumination system that uniformly illuminates the substrate 1 (in the shot area) with light from the light source, and an imaging system that optically conjugates the substrate 1 and the image sensor.

[0034] The control unit 14 is composed of a computer including, for example, a CPU and memory, and comprehensively controls each part of the imprint device 100 according to a program stored in memory to operate the imprint device 100.

[0035] In this embodiment, the control unit 14 controls the imprinting process and related processes, which involve forming a pattern of imprint material on a substrate using a mold 3 (transferring the pattern 3a of the mold 3 to the imprint material on the substrate). Here, the imprinting process typically includes a placement step, a contact step, a filling step, a curing step, and a demolding step. The placement step is the step of placing (supplying) the imprint material onto the substrate. The contact step is the step of bringing the imprint material on the substrate into contact with the mold 3. The filling step is the step of filling the pattern 3a of the mold 3 with imprint material while the imprint material on the substrate and the mold 3 are in contact. The curing step is the step of curing the imprint material while the imprint material on the substrate and the mold 3 are in contact. The demolding step is the step of separating the mold 3 from the cured imprint material on the substrate.

[0036] The console unit 15 includes a computer equipped with input devices such as a keyboard and mouse and a display, and serves as an interface for sharing information between the imprint device 100 (control unit 14) and the user. The console unit 15 outputs (transmits) information related to the imprint process input by the user to the control unit 14. The information related to the imprint process input to the console unit 15 is recorded as a log in the imprint device 100 and can be checked before and after the imprint process. Here, the information related to the imprint process includes an imprint recipe that describes various imprint conditions when forming a pattern of imprint material on the substrate. The imprint recipe includes, for example, the force (pressing force (imprinting force)) applied to the mold 3 when bringing it into contact with the imprint material on the substrate, a shot layout that shows the arrangement of shot areas on the substrate, and a drop pattern that shows the arrangement of droplets of imprint material to be placed on the substrate.

[0037] The configuration of the substrate 1 and the substrate holder 2 will be explained with reference to Figures 2(a) to 2(e). Figure 2(a) is a diagram showing the shot layout, which shows the arrangement of shot regions on the substrate. A shot region is a partitioned area on the substrate, and imprint processing is performed on each region. In Figure 2(a), among the multiple shot regions on the substrate, shot region 11 indicates the shot region that will be subjected to imprint processing.

[0038] Figures 2(b) to 2(e) show the detailed configuration of the substrate holding section 2. Figure 2(b) shows the substrate holding section 2 from the top (the holding surface that holds the substrate 1). As shown in Figure 2(b), the substrate holding section 2 (its holding surface) includes a plurality of holding regions 22a, 22b, and 22c partitioned (defined) by partition walls 21a, 21b, and 21c. In Figure 2(b), the plurality of holding regions 22a, 22b, and 22c have a concentric structure, that is, regions partitioned in a concentric manner.

[0039] Figures 2(c) to 2(e) are AA cross-sectional views of the substrate holding section 2 shown in Figure 2(b), showing only the portion corresponding to the shot region 11 on the substrate. The multiple holding regions 22a, 22b, and 22c of the substrate holding section 2 are connected to the pressure adjustment section 26 via tubes 23a, 23b, and 23c, respectively. The pressure adjustment section 26 has the function of adjusting the pressure in the spaces SPa, SPb, and SPc between each of the multiple holding regions 22a, 22b, and 22c and the substrate 1 (the shot region 11). In other words, the pressure adjustment section 26 has the function of adjusting the pressure applied to the back surface of the substrate 1 in each of the multiple holding regions 22a, 22b, and 22c. In this embodiment, the pressures in the spaces SPa, SPb, and Spc between each of the multiple holding regions 22a, 22b, and 22c and the substrate 1 are independently controlled via the pressure adjustment section 26 under the control of the control unit 14.

[0040] For example, Figure 2(c) shows a state in which the pressure in the spaces SPa, SPb, and Spc between the substrate 1 and each of the multiple holding regions 22a, 22b, and 22c is controlled so that the substrate 1 becomes flat. Figure 2(d) shows a state in which the pressure in the space SPa between the holding region 22a and the substrate 1 is changed to a positive pressure from the state shown in Figure 2(c), and the substrate 1 (its edge) is deformed upward. Figure 2(e) shows a state in which the pressure in the space SPa between the holding region 22a and the substrate 1 is changed to a negative pressure from the state shown in Figure 2(c), and the substrate 1 (its edge) is deformed downward.

[0041] In this way, by controlling the pressure in the spaces SPa, SPb, and Spc between each of the multiple holding regions 22a, 22b, and 22c in the substrate holding section 2 and the substrate 1, it is possible to change the shape of the substrate 1 relatively freely. Therefore, in this embodiment, this function is used to improve the overlapping accuracy between the mold 3 (pattern 3a) and the substrate 1 (shot region 11). The overlapping accuracy between the mold 3 and the substrate 1 can be measured, for example, using the alignment measurement system 10, or using an overlapping inspection device which is an external device of the imprint device 100.

[0042] Figures 3(a) to 3(c) schematically show the shape (deformation) of the mold 3 and substrate 1 during the imprint process, specifically the contact process and the filling process. During the contact process and the filling process, the substrate 1 deforms according to the pressing force 5 applied to the mold 3 and the pressures 6a and 6b in the spaces SPa and SPb between the holding areas 22a and 22b and the substrate 1, respectively. As described above, a pattern 3a to be transferred to the substrate 1 is formed on the surface of the mold 3 that contacts the imprint material 4 on the substrate.

[0043] Figure 3(a) shows the state where the pressing force 5 applied to mold 3 is small. Referring to Figure 3(a), as the pressing force 5 applied to mold 3 causes mold 3 to deform upward (concave shape), the mold 3 (and its pattern 3a) deforms in such a way that it stretches relative to the substrate 1.

[0044] Figure 3(b) shows a state where the pressing force 5 applied to the mold 3 is large. Referring to Figure 3(b), because the pressing force 5 applied to the mold 3 is large, the mold 3 becomes flat, while the substrate 1 deforms downward (convex shape), causing the upper surface of the substrate 1 to elongate relatively. In this embodiment, if the height of the outermost partition wall 21a among the partition walls 21a to 21c that divide the multiple holding areas 22a to 22c of the substrate holding part 2 is lower than the heights of the other partition walls 21b and 21c, the downward deformation of the substrate 1 becomes more pronounced.

[0045] Figure 3(c) shows the state in which a pressing force 5 is applied to the mold 3, and the pressures 6a and 6b in the spaces SPa and SPb between the holding regions 22a and 22b, respectively, and the substrate 1 are controlled (pre-pressurized). Referring to Figure 3(c), the mold 3 and the substrate 1 can be made flat by balancing the pressing force 5 applied to the mold 3 with the pressures 6a and 6b in the spaces SPa and SPb. Specifically, the pressure 6a in space SPa can be determined from the following equation (1), depending on the contact area 211 between the mold 3 and the imprint material 4 on the substrate in the shot region 11 on the substrate. The pressure 6b in space SPb can be determined in the same way as the pressure 6a. In equation (1), PP is the pressing force 5, and CA is the contact area 211.

[0046] Pressure 6a(6b) = PP / CA ... (1) In this embodiment, the pressure in the spaces SPa to Spc between each of the multiple holding regions 22a to 22c in the substrate holding portion 2 and the substrate 1 is controlled so that the substrate 1 becomes flat, but this is not the only way to do so. For example, the pressure in the spaces SPa to Spc between each of the multiple holding regions 22a to 22c in the substrate holding portion 2 and the substrate 1 may be controlled so that the deformation caused to the substrate 1 by the pressing force 5 is within an acceptable range (so that the substrate 1 takes on the target shape).

[0047] Referring to Figure 4, an example of the operation (imprint method) of the imprint device 100 will be described. As described above, this operation is performed by the control unit 14 comprehensively controlling each part of the imprint device 100.

[0048] In step S101, the mold 3 is loaded into the imprint device 100. Specifically, the mold 3 is loaded into the imprint device 100 by a mold transport unit (not shown), and the mold 3 is held in the mold stage 50 (mold holding unit 51).

[0049] In step S102, the substrate 1 is loaded into the imprint apparatus 100. Specifically, the substrate 1 is loaded into the imprint apparatus 100 by a substrate transport unit (not shown), and the substrate 1 is held by the substrate stage 60 (substrate holding unit 2) via the pre-alignment unit 7.

[0050] In S103, the contact area between the mold 3 and the imprint material on the substrate in the shot area 11 on the substrate (as shown in Figure 3(c), the contact area 211 when the entire pattern surface of the mold 3 and the imprint material 4 on the substrate are in overall contact) is obtained. Specifically, the control unit 14 obtains the shot layout from the imprint processing information, i.e., the imprint recipe, input via the console unit 15. The control unit 14 then extracts the area of ​​each shot area on the substrate from the shot layout and obtains this area as the contact area between the mold 3 and the imprint material on the substrate. Note that if the imprint material is not placed over the entire surface of the shot area 11 on the substrate, for example, if the imprint material is not placed in a predetermined width area (margin area) from the outer edge of the shot area 11, the control unit 14 can obtain the drop pattern from the imprint recipe and determine the contact area between the mold 3 and the imprint material on the substrate by considering the drop pattern in addition to the shot layout. In this way, the control unit 14 acquires information (second information) regarding the contact area between the mold and the imprint material on the substrate when the mold is brought into contact with the imprint material (it also functions as a second information acquisition unit).

[0051] In S104, the pressing force applied to mold 3 when it comes into contact with the imprint material on the substrate is acquired. Specifically, the control unit 14 acquires the shot layout from the imprint processing information, i.e., the imprint recipe, input via the console unit 15. Then, the control unit 14 extracts the force applied to mold 3 when it comes into contact with the imprint material on the substrate from the shot layout and acquires this force as the pressing force. In this way, the control unit 14 acquires information (first information) regarding the pressing force applied to mold 3 when it comes into contact with the imprint material on the substrate (it also functions as a first acquisition unit). If a load cell is provided on the mold stage 50, the measured value (actual value) obtained by the load cell when mold 3 comes into contact with the imprint material on the substrate may be acquired as the pressing force.

[0052] In S105, the pressure in the spaces SPa to SPc between each of the multiple holding regions 22a to 22c of the substrate holding portion 2 and the substrate is determined based on the contact area obtained in S103 and the pressing force obtained in S104. Specifically, the control unit 14 determines the pressure in each of the spaces SPa to SPc according to the value obtained by substituting the contact area obtained in S103 and the pressing force obtained in S104 into the above-mentioned equation (1).

[0053] In S106, the pressure of the space SPa to Spc between each of the multiple holding regions 22a to 22c in the substrate holding section 2 and the substrate 1 is set according to the pressure determined in S105. Specifically, the control unit 14 controls the pressure of the space SPa to Spc between each of the multiple holding regions 22a to 22c in the substrate holding section 2 and the substrate 1 to the pressure determined in S105 via the pressure adjustment unit 26.

[0054] In step S107, a placement process is performed in which the imprint material is placed (supplied) onto the substrate. Specifically, the control unit 14 places the imprint material onto the shot area 11 on the substrate via the dispenser 8.

[0055] In S108, a contact process is performed to bring the mold 3 into contact with the imprint material on the substrate. Specifically, the control unit 14, via a pressure adjustment device connected to the space 12 defined by the light-transmitting member 13 and the cavity 3b, deforms the pattern 3a of the mold 3 into a convex shape toward the substrate, and brings the mold 3 into contact with the imprint material on the substrate. Then, by gradually reducing the pressure applied to the space 12 from the pressure adjustment mechanism, the entire surface of the mold 3 is brought into contact with the imprint material on the substrate.

[0056] In step S110, a filling process is performed in which the pattern 3a of the mold 3 is filled with imprint material while the mold 3 is in contact with the imprint material on the substrate. Specifically, the control unit 14 maintains the state in which the entire surface of the mold 3 is in contact with the imprint material on the substrate until the pattern 3a of the mold 3 is filled with imprint material. At this time, it is also advisable to adjust the overlap (positioning) of the mold 3 and the substrate 1 based on the measurement results of the alignment measurement system 10.

[0057] In step S110, a curing process is performed to harden the imprint material while it is in contact with the mold 3 on the substrate. Specifically, the control unit 14 hardens the imprint material on the substrate by irradiating it with light from the irradiation unit 16 while it is in contact with the mold 3 on the substrate.

[0058] In step S111, a release process is performed to separate the mold 3 from the hardened imprint material on the substrate. This forms a pattern of the hardened imprint material on the substrate.

[0059] In S112, it is determined whether the imprint material pattern has been formed in all shot areas on the substrate. If the imprint material pattern has not been formed in all shot areas on the substrate, the process proceeds to S104 to form the imprint material pattern in the next shot area, and steps S104 to S112 are repeated. On the other hand, if the imprint material pattern has been formed in all shot areas on the substrate, the process proceeds to S113.

[0060] In S113, the substrate 1 is discharged from the imprint apparatus 100. Specifically, the substrate transport unit (not shown) discharges the substrate 1, on which the imprint material pattern has been formed in each shot area, from the substrate stage 60 to the outside of the imprint apparatus 100.

[0061] Thus, in this embodiment, the pressure in the space SPa to Spc between each of the multiple holding areas 22a to 22c in the substrate holding section 2 and the substrate 1 is controlled based on the pressing force applied to the mold 3 when the mold 3 is brought into contact with the imprint material on the substrate. This allows the deformation caused in the substrate 1 by the pressing force during the imprint process, specifically the contact and filling processes, to be kept within an acceptable range, for example, making the substrate 1 flat. Therefore, according to this embodiment, the overlapping accuracy between the mold 3 (pattern 3a) and the substrate 1 (shot area) can be maintained and improved. Such control is particularly useful in peripheral shot areas where the height of the outermost partition wall 21a is lower than the heights of the other partition walls 21b and 21c, and downward deformation caused in the substrate 1 by the pressing force applied to the mold 3 is significant.

[0062] Furthermore, by acquiring the pressing force applied to the mold 3 during the contact and filling processes as time-series data, it becomes possible to maintain and improve the overlapping accuracy even when the pressing force is changed, for example, when adjusting the overlap between the mold 3 and the substrate 1. When the pressing force is changed when adjusting the overlap between the mold 3 and the substrate 1, the measured value obtained from the load cell provided on the mold stage 50 may be acquired in real time as the pressing force, as described above.

[0063] Furthermore, in this embodiment, as shown in Figure 2(b), the multiple holding regions 22a, 22b, and 22c of the substrate holding portion 2 are concentrically divided regions, but the embodiment is not limited to this. For example, the multiple holding regions of the substrate holding portion 2 may be rectangularly divided regions, as shown in Figures 5(a) and 5(b). Figures 5(a) and 5(b) show the substrate holding portion 2 from the top surface (the holding surface that holds the substrate 1).

[0064] In Figure 5(a), the multiple holding regions 27 of the substrate holding section 2 are divided into a grid. Each of the multiple holding regions 27 may, for example, be a region having the same shape and size as a single shot region on the substrate. Alternatively, each of the multiple holding regions 27 may be a region smaller than a single shot region on the substrate. This allows for more flexible changes in the shape of the substrate 1 by controlling the pressure in the space between each of the multiple holding regions 27 in the substrate holding section 2 and the substrate 1, thereby providing superior accuracy in the superposition of the mold 3 and the substrate 1. When each of the multiple holding regions 27 is a region having the same shape and size as a single shot region on the substrate, the pressure can be simply set (determined) from the pressing force and contact area. Therefore, the control of the pressure in the space between each of the multiple holding regions 27 in the substrate holding section 2 and the substrate 1 can be further simplified.

[0065] In Figure 5(b), the multiple holding regions 28 of the substrate holding section 2 are divided into strip-like sections. The structure of the substrate holding section 2 (holding region 28) shown in Figure 5(b) is a simplified version of the structure of the substrate holding section 2 (holding region 27) shown in Figure 5(b). By simplifying the structure of the substrate holding section 2 in this way, the cost of the substrate holding section 2 is reduced, and the control of the pressure in the space between each of the multiple holding regions 28 in the substrate holding section 2 and the substrate 1 can be further simplified. This contributes to improving the responsiveness of pressure control.

[0066] Furthermore, in the imprint apparatus 100, as shown in Figure 6, when the substrate 1 is held in the substrate holder 2, a misalignment of the substrate 1 relative to the substrate holder 2 may occur. For example, in Figure 6, a misalignment of the substrate 1 (ΔCx, ΔCy) occurs because the center position 1a of the substrate 1 and the center position 2a of the substrate holder 2 are misaligned. This misalignment of the substrate 1 relative to the substrate holder 2 results in a change in the contact area (area of ​​the shot region) between the mold 3 and the imprint material on the substrate in each of the shot regions 11a, 11b, and 11c on the substrate. As a result, an error occurs in the pressure in the space between each of the multiple holding regions in the substrate holder 2 and the substrate 1, which is determined from the pressing force applied to the mold 3, and this becomes a factor that reduces the accuracy of the overlap between the mold 3 and the substrate 1.

[0067] If a misalignment occurs between the substrate 1 and the substrate holding section 2, in this embodiment, the off-axis alignment measurement system 9 measures the position of the alignment marks provided on the substrate 1 and the position of the outer edge of the substrate 1. From the measurement results of the off-axis alignment measurement system 9, the control unit 14 can determine the misalignment (ΔCx, ΔCy) of the substrate 1. In this way, the off-axis alignment measurement system 9 and the control unit 14 acquire information (third information) regarding the misalignment of the substrate 1 held by the substrate holding section 2 with respect to the substrate holding section 2 (functioning as a third acquisition unit). Furthermore, once the misalignment (ΔCx, ΔCy) of the substrate 1 with respect to the substrate holding section 2 is determined, it becomes possible to obtain (recalculate) the contact area between the mold 3 and the imprint material on the substrate based on this misalignment (ΔCx, ΔCy). By substituting the contact area obtained in this way into the above-described equation (1), the pressure in the space between each of the multiple holding regions in the substrate holding section 2 and the substrate 1 can be determined without generating errors caused by the misalignment of the substrate 1. This makes it possible to suppress (prevent) a decrease in the overlapping accuracy between the mold 3 and the substrate 1, even if a misalignment occurs between the substrate 1 and the substrate holding part 2. Note that the measuring instrument for measuring the position of the outer edge of the substrate 1 is not limited to the off-axis alignment measurement system 9; a length measuring sensor for measuring the height of the substrate 1 may also be used.

[0068] The patterns of the cured material formed using the imprint apparatus 100 are used permanently on at least a part of various articles, or temporarily when manufacturing various articles. Articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, or molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, as well as semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0069] The pattern of the cured material is either used as is as a component of at least some of the articles described above, or temporarily used as a resist mask. After etching or ion implantation is performed during the substrate processing process, the resist mask is removed.

[0070] Next, we will explain the specific manufacturing method of the product. As shown in Figure 7(a), a substrate such as a silicon wafer with a workpiece material such as an insulator formed on its surface is prepared, and then an imprint material is applied to the surface of the workpiece material by an inkjet method or the like. Here, we show how multiple droplet-shaped imprint materials are applied to the substrate.

[0071] As shown in Figure 7(b), the mold for imprinting is positioned facing the imprint material on the substrate, with the side where the raised and recessed pattern is formed facing the material. As shown in Figure 7(c), the substrate to which the imprint material has been applied and the mold are brought into contact, and pressure is applied. The imprint material fills the gap between the mold and the workpiece. In this state, when light is shone through the mold as curing energy, the imprint material hardens.

[0072] As shown in Figure 7(d), after the imprint material has hardened, when the mold and substrate are separated, a pattern of the hardened imprint material is formed on the substrate. In this pattern, the recesses of the mold correspond to the protrusions of the hardened material, and the protrusions of the mold correspond to the recesses of the hardened material. In other words, the pattern of the mold's irregularities has been transferred to the imprint material.

[0073] As shown in Figure 7(e), when etching is performed using the cured material pattern as an etching-resistant mask, the parts of the workpiece surface where there is no cured material, or where a thin layer remains, are removed, forming grooves. As shown in Figure 7(f), when the cured material pattern is removed, an article with grooves formed on the surface of the workpiece can be obtained. Here, the cured material pattern was removed, but it may also be used without removal after processing, for example, as an interlayer insulating film included in semiconductor devices, i.e., as a component of the article.

[0074] The disclosures herein include the following imprinting apparatus, imprinting method, and method for manufacturing articles.

[0075] (Item 1) An imprint apparatus that uses a mold to form a pattern of imprint material on a substrate, A substrate holding section includes a plurality of holding regions in which the pressure between the substrate and the substrate is independently controlled, and the substrate is held in the plurality of holding regions, A first acquisition unit that acquires first information regarding the pressing force applied to the mold when the mold and the imprint material on the substrate are brought into contact, A control unit controls the pressure between each of the plurality of holding regions and the substrate when the mold and the imprint material on the substrate are in contact, based on the first information acquired by the first acquisition unit, so that the deformation caused in the substrate by the pressing force remains within an acceptable range. An imprinting device characterized by having the following features.

[0076] (Item 2) The imprint apparatus according to item 1, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate so that the substrate becomes flat when the mold and the imprint material on the substrate are in contact and the pressing force is applied to the mold.

[0077] (Item 3) The imprint apparatus according to item 1 or 2, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate so that the pressure between the holding region and the substrate and the pressing force are balanced in each of the plurality of holding regions.

[0078] (Item 4) The system further includes a second acquisition unit that acquires second information regarding the contact area between the mold and the imprint material when the entire surface of the pattern surface of the mold is in contact with the imprint material on the substrate. The imprint apparatus according to any one of items 1 to 3, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate, based on the second information acquired by the second acquisition unit, so that the deformation caused in the substrate by the pressing force falls within the allowable range.

[0079] (Item 5) If the pressing force is PP and the contact area is CA, The imprint apparatus according to item 4, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate to PP / CA.

[0080] (Item 6) The system further includes a third acquisition unit that acquires third information regarding the misalignment of the substrate held in the substrate holding unit, The imprint apparatus according to item 4 or 5, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate, based on the third information acquired by the third acquisition unit, so that the deformation caused in the substrate by the pressing force falls within the allowable range.

[0081] (Item 7) The third acquisition unit is, The system includes a measuring system for measuring the position of a mark provided on the substrate and the position of the outer edge of the substrate. The imprinting apparatus according to item 6, characterized in that the positional deviation is determined from the position of the mark and the position of the outer peripheral end measured by the measurement system.

[0082] (Item 8) The imprint apparatus according to any one of items 1 to 7, characterized in that the plurality of holding regions are regions divided in a concentric circular manner.

[0083] (Item 9) The imprint apparatus according to any one of items 1 to 7, characterized in that the plurality of holding areas are areas partitioned in a rectangular shape.

[0084] (Item 10) The imprint apparatus according to any one of items 1 to 9, characterized in that each of the plurality of holding regions is smaller than a single shot region on the substrate.

[0085] (Item 11) The substrate holding portion is provided and further has a plurality of partition walls that divide the plurality of holding regions, An imprinting apparatus according to any one of items 1 to 10, characterized in that the height of the outermost partition wall among the plurality of partition walls is lower than the height of the other partition walls.

[0086] (Item 12) An imprint method for forming an imprint material pattern on a substrate using a mold, A step of holding the substrate in a substrate holding section which includes a plurality of holding regions in which the pressure between the substrate and the holding section is independently controlled, A step of obtaining information regarding the pressing force applied to the mold when bringing the mold into contact with the imprint material on the substrate, Based on the information described above, a step of controlling the pressure between each of the plurality of holding regions and the substrate in a state where the mold and the imprint material on the substrate are in contact, so that the deformation caused in the substrate by the pressing force falls within an acceptable range, An imprinting method characterized by having the following features.

[0087] (Item 13) A step of forming a pattern on a substrate using the imprint method described in item 12, A step of processing the substrate on which the pattern has been formed in the above step, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by having the following:

[0088] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0089] 1: Substrate 2: Substrate holder 14: Control unit 22a, 22b, 22c: Holding area 100: Imprint device

Claims

1. An imprint apparatus that uses a mold to form a pattern of imprint material on a substrate, A substrate holding section includes a plurality of holding regions in which the pressure between the substrate and the substrate is independently controlled, and the substrate is held in the plurality of holding regions, A first acquisition unit that acquires first information regarding the pressing force applied to the mold when the mold and the imprint material on the substrate are brought into contact, A control unit controls the pressure between each of the plurality of holding regions and the substrate when the mold and the imprint material on the substrate are in contact, based on the first information acquired by the first acquisition unit, so that the deformation caused in the substrate by the pressing force remains within an acceptable range. An imprinting device characterized by having the following features.

2. The imprint apparatus according to claim 1, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate so that the substrate becomes flat when the mold and the imprint material on the substrate are in contact and the pressing force is applied to the mold.

3. The imprint apparatus according to claim 1, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate so that the pressure between the holding region and the substrate and the pressing force are balanced in each of the plurality of holding regions.

4. The system further includes a second acquisition unit that acquires second information regarding the contact area between the mold and the imprint material when the entire surface of the pattern surface of the mold is in contact with the imprint material on the substrate. The imprint apparatus according to claim 1, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate, based on the second information acquired by the second acquisition unit, so that the deformation caused in the substrate by the pressing force falls within the allowable range.

5. If the pressing force is PP and the contact area is CA, The imprint apparatus according to claim 4, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate to PP / CA.

6. The system further includes a third acquisition unit that acquires third information regarding the misalignment of the substrate held in the substrate holding unit, The imprint apparatus according to claim 4, characterized in that the control unit controls the pressure between each of the plurality of holding regions and the substrate, based on the third information acquired by the third acquisition unit, so that the deformation caused in the substrate by the pressing force falls within the allowable range.

7. The aforementioned acquisition unit is: The system includes a measuring system for measuring the position of a mark provided on the substrate and the position of the outer edge of the substrate. The imprint apparatus according to claim 6, characterized in that the positional deviation is determined from the position of the mark and the position of the outer peripheral end measured by the measurement system.

8. The imprint apparatus according to claim 1, characterized in that the plurality of holding regions are regions partitioned in a concentric circular manner.

9. The imprint apparatus according to claim 1, characterized in that the plurality of holding regions are regions partitioned in a rectangular shape.

10. The imprint apparatus according to claim 1, characterized in that each of the plurality of holding regions is a region smaller than a single shot region on the substrate.

11. The substrate holding portion is provided and further has a plurality of partition walls that divide the plurality of holding regions, The imprint apparatus according to claim 1, characterized in that the height of the outermost partition wall among the plurality of partition walls is lower than the height of the other partition walls.

12. An imprint method for forming an imprint material pattern on a substrate using a mold, A step of holding the substrate in a substrate holding section which includes a plurality of holding regions in which the pressure between the substrate and the holding section is independently controlled, A step of obtaining information regarding the pressing force applied to the mold when bringing the mold into contact with the imprint material on the substrate, Based on the information described above, a step of controlling the pressure between each of the plurality of holding regions and the substrate in a state where the mold and the imprint material on the substrate are in contact, so that the deformation caused in the substrate by the pressing force falls within an acceptable range, An imprinting method characterized by having the following features.

13. A step of forming a pattern on a substrate using the imprint method described in claim 12, A step of processing the substrate on which the pattern has been formed in the above step, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by having the following:

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