Temperature control module and temperature control method

Abstract

PURPOSE: To provide a temperature adjustment module and a temperature adjustment method that may effectively adjust a temperature of a peripheral circuit element on a mother board.SOLUTION: A temperature adjustment module includes a temperature control module, a temperature changing module, and a temperature sensor. The temperature changing module is in contact with a peripheral circuit element and electrically connected to the temperature control module. The temperature sensor is in contact with the peripheral circuit element and electrically connected to the temperature control module. When a cooling module on a main circuit element of a mother board cools the main circuit element, the temperature sensor detects a peripheral temperature of the peripheral circuit element. The temperature control module determines whether the peripheral temperature is lower than or higher than a target temperature to determine whether to operate the temperature changing module to perform temperature adjustment on the peripheral circuit element.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an adjustment module, and particularly to a temperature adjustment module.

Background Art

[0002] Currently, in the process of performing extreme overclocking on a central processing unit (CPU) chip, a graphics processing unit (GPU) chip, and / or a memory module on a computer motherboard (mother board, MB), since liquid nitrogen or liquid helium can be used to cool the overclocking target element, the frequency of the overclocking target element may increase to an extremely high frequency. Furthermore, in the cooling process, peripheral circuit elements on the motherboard adjacent to the overclocking target element may be cooled simultaneously. At that time, since the optimal operating temperature of the peripheral circuit elements may not reach an extremely low temperature or insufficient cooling may occur, the operating efficiency of the overclocking target element cannot operate normally or efficiently due to the peripheral circuit elements, and as a result, the actual operating efficiency of the overclocking target element cannot achieve the corresponding efficiency improvement effect by overclocking.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present invention provides a temperature adjustment module and a temperature adjustment method capable of effectively adjusting the temperature of peripheral circuit elements on a motherboard.

Means for Solving the Problems

[0004] The temperature control module of the present invention is located on a motherboard. The temperature control module includes a temperature control module, a temperature change module, and a temperature sensor. The temperature change module is in contact with peripheral circuit elements and is electrically connected to the temperature control module. The temperature sensor is in contact with peripheral circuit elements and is electrically connected to the temperature control module. When the cooling module on the main circuit elements of the motherboard cools the main circuit elements, the temperature sensor detects the ambient temperature of the peripheral circuit elements. The temperature control module determines whether the ambient temperature is lower or higher than the target temperature and operates the temperature change module to determine whether to adjust the temperature of the peripheral circuit elements.

[0005] The temperature control method of the present invention includes the following steps: When a cooling module on the main circuit element of a motherboard cools the main circuit element, a temperature sensor detects the ambient temperature of the peripheral circuit element. A temperature control module determines whether the ambient temperature is lower or higher than the target temperature, and operates a temperature change module to determine whether to perform temperature adjustment on the peripheral circuit element. [Effects of the Invention]

[0006] As described above, the temperature control module and temperature control method of the present invention allow the cooling module to cool the main circuit element and then perform temperature control on the peripheral circuit elements surrounding the main circuit element, so that the main circuit element can be operated under good operating conditions.

[0007] To make the features and advantages of the present invention clearer and easier to understand, the following embodiments are provided and described in detail below in conjunction with the accompanying drawings. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic circuit diagram of a temperature control module according to one embodiment of the present invention. [Figure 2] This is a schematic circuit diagram of a temperature control module according to one embodiment of the present invention. [Figure 3]This is a schematic diagram of a temperature control module placed on a motherboard according to one embodiment of the present invention. [Figure 4] This is a flowchart of a temperature control method according to one embodiment of the present invention. [Figure 5] This is a schematic diagram of a temperature control module placed on a motherboard according to one embodiment of the present invention. [Figure 6] This is a schematic diagram of a temperature control module placed on a motherboard according to one embodiment of the present invention. [Figure 7] This is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. [Figure 8] This is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. [Figure 9] This is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. [Figure 10] This is a schematic diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention. [Figure 11] This is a schematic diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention. [Modes for carrying out the invention]

[0009] To facilitate understanding of the present invention, the following specific embodiments are shown as actual embodiments of the invention. Furthermore, wherever possible, elements / components / steps having the same reference numerals in the drawings and embodiments represent the same or similar parts.

[0010] The main circuit elements described in each embodiment of the present invention may include at least one of a central processing unit (CPU) chip, a graphics processing unit (GPU) chip, and a memory module mounted on a computer motherboard (MB). The memory module may be, for example, a double data rate synchronous dynamic random access memory (DDR SDRAM). The peripheral circuit elements described in each embodiment of the present invention may include circuit elements arranged around the main circuit elements, such as resistors, capacitors, inductors, transistors, power stage circuits, other functional chips, and / or associated circuit wiring.

[0011] Figure 1 is a schematic circuit diagram of a temperature control module according to one embodiment of the present invention. Referring to Figure 1, the temperature control module 100 includes a temperature control module 110 and a temperature change module 120. The temperature control module 110 is electrically connected to the temperature change module 120. In this embodiment, the temperature control module 100 is configured to be located on a motherboard and to perform temperature control on peripheral circuit elements. Specifically, the temperature change module 120 may include a temperature change region, and the temperature change module 120 may be in contact with peripheral circuit elements via the temperature change region and a thermal conductive material. The thermal conductive material may be, for example, a thermal paste or an associated thermal interface material. In this embodiment, the temperature control module 110 is configured to control the temperature of the temperature change module 120 to reach a target temperature. That is, the temperature control module 110 can directly adjust the temperature of peripheral circuit elements via the temperature change module 120.

[0012] It should be noted that the temperature-changing regions provided in each embodiment of the present invention may include printed circuit boards (PCBs). The temperature-changing modules provided in each embodiment of the present invention can achieve the function of changing (or influencing) the temperature of surrounding electronic elements in contact with them by causing a temperature change via windings on the PCB (e.g., by increasing the voltage or current on the windings), by causing a temperature change via temperature-variable electronic components on the PCB (e.g., thermistors, thermocouples, thermal resistors, etc.), or by causing a temperature change simultaneously via windings and temperature-variable electronic components on the PCB. Furthermore, the temperature-changing regions provided in each embodiment of the present invention may consist of one temperature-changing region or may include multiple temperature-changing regions, each of which may have one or more sub-temperature-changing regions. The temperatures of all temperature-changing regions and sub-temperature-changing regions may be controlled together or individually.

[0013] Figure 2 is a schematic circuit diagram of a temperature control module according to one embodiment of the present invention. Referring to Figure 2, the temperature control module 200 includes a temperature control module 210, a temperature change module 220, and a temperature sensor 230. The temperature control module 210 is electrically connected to the temperature change module 220 and the temperature sensor 230. In this embodiment, the temperature control module 200 is configured to be placed on a motherboard and to perform temperature control on peripheral circuit elements. Specifically, the temperature change module 220 may include a temperature change region, and the temperature change module 220 may be in contact with peripheral circuit elements via the temperature change region and a thermal conductive material. The temperature sensor 230 may be placed within the temperature change region of the temperature change module 220. In this embodiment, the temperature control module 210 is configured to detect the ambient temperature of peripheral circuit elements in contact with the temperature change region in real time via the temperature sensor 230, and to control the temperature of the temperature change module 220 accordingly to reach a target temperature based on the ambient temperature of the peripheral circuit elements. In other words, the temperature control module 210 can adjust the temperature of the peripheral circuit elements via the temperature change module 220 based on the ambient temperature of the peripheral circuit elements.

[0014] Figure 3 is a schematic diagram of a temperature control module arranged on a motherboard according to one embodiment of the present invention. Referring to Figure 3, the arrangement of the temperature control module provided in each embodiment of the present invention is shown in Figure 3. In this embodiment, the motherboard 300 may have a first surface S1 (e.g., the front of the motherboard) and a second surface S2 (e.g., the back of the motherboard). The first surface S1 may be parallel to the second surface S2. The first surface S1 and the second surface S2 may be parallel to a plane formed by extending directions D1 and D2, respectively. Directions D1, D2, and D3 are perpendicular to each other. In this embodiment, a main circuit element 301 can be arranged on the first surface S1 of the motherboard 300. A peripheral circuit element 302 can be arranged on the first surface S1 of the motherboard 300, adjacent to the periphery of the main circuit element 301. A peripheral circuit element 303 can be arranged on the second surface S2 of the motherboard 300, and at a position corresponding to the main circuit element 301 in direction D3. On the second surface S2 of the motherboard 300, peripheral circuit elements 304 can be arranged adjacent to the periphery corresponding to the position of the main circuit element 301 in direction D3.

[0015] In this embodiment, a cooling module 310 can be placed on the main circuit element 301. Temperature change modules 320 to 340 can be placed on the peripheral circuit elements 302 to 304. In this embodiment, the main circuit element 301 can perform overclocking operations. However, during the process of the main circuit element 301 performing overclocking operations, the main circuit element 301 itself may generate heat. Therefore, in order for the main circuit element 301 to maintain normal and highly efficient operation (e.g., data processing function) during the overclocking operation, the main circuit element 301 can be cooled by the cooling module 310. The cooling module 310 can cool the main circuit element 301 to a first temperature, which may be lower than or equal to the target temperature. In one embodiment, the cooling module 310 may be, for example, an air-cooled type, a water-cooled type, or an extreme heat dissipation type (e.g., using liquid nitrogen or liquid helium).

[0016] In particular, the cooling module 310 may be an extreme heat dissipation type for performing extreme heat dissipation to the main circuit element 301. At this time, since the cooling module 310 can cool down to an extreme low temperature (for example, -196°C (liquid nitrogen) or -267°C (liquid helium)), the peripheral circuit elements 302-304 may also be affected by the cooling. Therefore, in the present embodiment, in order to prevent the temperatures of the peripheral circuit elements 302-304 from becoming too low and making the peripheral circuit elements 302-304 unusable or having poor operating efficiency (not being at the optimal operating temperature), and instead to reduce the operating efficiency after overclocking of the main circuit element 301, the temperature change modules 320-340 can heat the peripheral circuit elements 302-304 until they reach the target temperature (that is, the optimal operating temperature). From another perspective, the main circuit element 301 and the peripheral circuit elements 302-304 can have different optimal operating temperatures.

[0017] Alternatively, in one embodiment, when the optimal operating temperatures of the peripheral circuit elements 302-304 are lower than the current ambient temperature, the temperature change modules 320-340 may cool the peripheral circuit elements 302-304. Furthermore, in another embodiment, the peripheral circuit elements 302-304 may have different target temperatures (that is, the optimal operating temperatures), or the temperature change modules 320-340 may cool or heat the peripheral circuit elements 302-304 to different extents.

[0018] Also, it should be noted that the attachment, or the arrangement position and quantity of the main circuit element and the peripheral circuit elements of the present invention are not limited to the attachment, or the arrangement position and quantity shown in FIGURE 3. FIGURE 3 is merely an example. The peripheral circuit elements shown in each embodiment of the present invention may be arranged on the surface on the same side as the main circuit element of the same circuit board. Alternatively, the peripheral circuit elements and the main circuit element shown in each embodiment of the present invention may be arranged on the surfaces on different sides of the same circuit board. Furthermore, the peripheral circuit elements and the main circuit element may be arranged on different circuit boards.

[0019] FIG. 4 is a flowchart of a temperature adjustment method according to an embodiment of the present invention. Referring to FIGS. 2 and 4, the temperature adjustment module 200 in FIG. 2 can execute the following steps S410 to S430. In step S410, when the cooling module on the main circuit element of the motherboard cools the main circuit element, the temperature control module 210 can detect the ambient temperature of the peripheral circuit element via the temperature sensor 230. In step S420, the temperature control module 210 can determine whether the ambient temperature is lower or higher than the target temperature. If the ambient temperature is neither lower nor higher than the target temperature, the temperature control module 210 detects the ambient temperature of the peripheral circuit element again via the temperature sensor 230 after a predetermined waiting time, and determines again whether the ambient temperature is lower or higher than the target temperature. If the ambient temperature is lower or higher than the target temperature, the temperature control module 210 operates the temperature change module 220 to adjust the temperature of the peripheral circuit element to reach the target temperature. At this time, when the temperature control module 210 determines that the ambient temperature is lower than a predetermined target temperature (that is, for example, the optimal operating temperature of the peripheral circuit element), the temperature control module 210 can operate the temperature change module 220 to heat the peripheral circuit element to reach the target temperature. Also, when the temperature control module 210 determines that the ambient temperature is higher than a predetermined target temperature, the temperature control module 210 can operate the temperature change module 220 to cool the peripheral circuit element to reach the target temperature. In this way, when the main circuit element is in the overclock operation state, the peripheral circuit element can be maintained at a good (or optimal) operating temperature, so that the main circuit element can effectively achieve high-efficiency operation after overclocking when operating together with the peripheral circuit element. Furthermore, the temperature adjustment method provided in this embodiment can also be applied to the temperature adjustment module 100 in FIG. 1.

[0020] Referring again to Figure 3, in the embodiment shown in Figure 3, the multiple temperature sensors of the temperature change modules 320 to 340 can each detect multiple ambient temperatures of the peripheral circuit elements 302 to 304, and the temperature control module can individually determine whether temperature adjustment is necessary based on the ambient temperature. In other words, at least some of the temperature change modules 320 to 340 can adjust the temperature of the peripheral circuit elements 302 to 304 to different degrees.

[0021] Figure 5 is a schematic diagram of a temperature control module arranged on a motherboard according to one embodiment of the present invention. Referring to Figure 5, peripheral circuit elements 501 can be arranged on the surface S2 of the motherboard 500. A temperature change module 520 is arranged on the peripheral circuit elements 501, and a heat conductive material 502 is present between the temperature change module 520 and the peripheral circuit elements 501. A temperature control module 510 is electrically connected to the temperature change module 520. The surface S4 of the temperature change module 520 may have a temperature change region. The temperature change region of the surface S4 of the temperature change module 520 can contact the peripheral circuit elements 501 via the heat conductive material 502, and a temperature sensor can be placed within the temperature change region.

[0022] In this embodiment, the temperature control module 510 and the temperature change module 520 may be located on different circuit boards. That is, the temperature control module 510 may be located on an external circuit board, and the temperature control module 510 may be electrically connected to the temperature change module 520 and the temperature sensor via connecting wires. Alternatively, in one embodiment, the temperature control module 510 and the temperature change module 520 may be located (integrated) on the same circuit board.

[0023] Figure 6 is a schematic diagram of a temperature control module arranged on a motherboard according to one embodiment of the present invention. Referring to Figure 6, peripheral circuit elements 601 can be arranged on the surface S2 of the motherboard 600. The temperature control module provided in this embodiment may include a metal thermostat 630. The metal thermostat 630 is arranged on the peripheral circuit elements 601, and a heat conductive material 602 is present between the metal thermostat 630 and the peripheral circuit elements 601. A temperature control module 610 is electrically connected to a temperature change module 620. The surface S4 of the temperature change module 620 may have a temperature change region. The temperature change region of the surface S4 of the temperature change module 620 can contact the peripheral circuit elements 601 via the metal thermostat 630 and the heat conductive material 602, and a temperature sensor can be placed within the temperature change region.

[0024] In this embodiment, the metal thermostat 630 is positioned between the temperature change module 620 and the peripheral circuit element 601. The contact area between the metal thermostat 630 and the peripheral circuit element 601 via the heat conductive material 602 is larger than the contact area between the metal thermostat 630 and the temperature change module 620. In other words, the temperature change module 620 provided in this embodiment can increase the contact area for temperature changes via the metal thermostat 630, thereby covering more components and a wider area of ​​the peripheral circuit element 601.

[0025] Figure 7 is a schematic distribution diagram of multiple temperature-changing regions of a temperature-changing module according to one embodiment of the present invention. The temperature-changing module 720 provided in this embodiment can be applied to regulate the temperature of multiple peripheral circuit elements in multiple sub-regions of the back region of a motherboard on which a CPU chip is located. Referring to Figure 7, the surface S4 of the temperature-changing module 720 can include multiple temperature-changing regions 701 to 709. The temperature-changing regions 701 to 709 can be arranged in an array, for example, but the present invention is not limited thereto. The temperature-changing regions 701 to 709 can be in contact with multiple peripheral circuit elements via a thermal conductive material (or via multiple metal thermostats), and multiple temperature sensors can be placed within each of the temperature-changing regions 701 to 709. In one embodiment, at least some of the temperature-changing regions 701 to 709 can correspond to different target temperatures.

[0026] Specifically, in this embodiment, the temperature change module 720 can be mounted on the motherboard on the back of the CPU chip socket. Since the back of the CPU chip socket on the motherboard is not a flat surface, a heat conductive material can be provided between the temperature change module 720 and the back of the motherboard, allowing the temperature change module 720 to be fixed to the back of the CPU chip socket on the motherboard. Temperature sensors can be placed in each of the temperature change regions 701 to 709. In this embodiment, the temperature change region 705 may, for example, directly face the front and back areas of the CPU chip socket on the motherboard. During extreme overclocking, the temperature of the temperature change region 705 can be made the lowest compared to the other temperature change regions by cooling the CPU chip via liquid nitrogen. Therefore, the temperature change region 705 can accommodate specific lower or higher target temperatures. Furthermore, the remaining temperature-changing regions 701-704 and 706-709 can be designed to accommodate different target temperatures based on factors such as different relative positions to temperature-changing region 705, different electronic components on the motherboard, or different layouts and wiring.

[0027] In this embodiment, assuming that temperature-changing regions 701, 702, 703, 706, and 709 correspond to the locations of the power supply circuits of the CPU chip on the motherboard, the temperatures of temperature-changing regions 701, 702, 703, 706, and 709 may become relatively high during extreme overclocking. Therefore, by setting multiple target temperatures of temperature-changing regions 701, 702, 703, 706, and 709 to, for example, 0 degrees or higher, the motherboard and electronic components can be protected from freezing due to low temperatures, and damage to the motherboard from liquid water after the ice melts can also be prevented.

[0028] Figure 8 is a schematic distribution diagram of multiple temperature-changing regions of a temperature-changing module according to one embodiment of the present invention. The temperature-changing module 820 provided in this embodiment can be applied to regulate the temperature of multiple peripheral circuit elements in multiple sub-regions on the back of a motherboard on which memory modules are located. Referring to Figure 8, the surface S4 of the temperature-changing module 820 can include multiple temperature-changing regions 801 to 804. The temperature-changing regions 801 to 804 can be arranged, for example, in direction D2, but the present invention is not limited thereto. The temperature-changing regions 801 to 804 can be in contact with multiple peripheral circuit elements via a thermal conductive material (or via multiple metal thermostats), and multiple temperature sensors can be placed in each of the temperature-changing regions 801 to 804. In one embodiment, at least some of the temperature-changing regions 801 to 804 can correspond to different target temperatures.

[0029] Specifically, in this embodiment, the temperature change module 820 can be placed on the motherboard behind the memory module sockets. Since the back of the motherboard's memory module sockets is not a flat surface, a thermal conductive material can be provided between the temperature change module 820 and the back of the motherboard, allowing the temperature change module 820 to be fixed to the back of the motherboard's memory module sockets. Two temperature sensors can be provided in each of the temperature change regions 801 to 804. In this embodiment, the temperature change regions 801 and 802 may, for example, directly face the front and back areas of the motherboard's memory module sockets. During extreme overclocking, the temperature of the temperature change regions 801 and 802 can be made the lowest compared to the other temperature change regions by cooling the memory modules via liquid nitrogen. Therefore, the temperatures of the temperature change regions 801 and 802 can correspond to specific lower or higher target temperatures. Furthermore, the remaining temperature-changing regions 803 and 804 can be designed to accommodate different target temperatures based on factors such as different relative positions to temperature-changing regions 801 and 802, different electronic components on the motherboard, or different layouts and wiring.

[0030] In this embodiment, assuming that temperature-changing regions 803 and 804 correspond to the locations of the power supply circuits or function buttons on the motherboard's memory modules, freezing is likely to occur at temperatures in temperature-changing regions 803 and 804 during extreme overclocking, potentially causing malfunctions in the function buttons. Therefore, by setting multiple target temperatures in temperature-changing regions 803 and 804 to, for example, 0 degrees or higher, the motherboard and electronic components can be protected from freezing due to low temperatures, and damage to the motherboard from liquid water after the ice melts can also be prevented.

[0031] Figure 9 is a schematic distribution diagram of multiple temperature-changing regions of a temperature-changing module according to one embodiment of the present invention. The temperature-changing module 920 provided in this embodiment can be applied to regulate the temperature of multiple peripheral circuit elements in multiple sub-regions of the rear or front peripheral region of a motherboard on which a GPU chip is located. Referring to Figure 9, the surface S4 of the temperature-changing module 920 can include multiple temperature-changing regions 901 to 904. The temperature-changing regions 901 to 904 can be arranged, for example, in a ring shape, but the present invention is not limited thereto. The temperature-changing regions 901 to 904 can be in contact with multiple peripheral circuit elements via a thermal conductive material (or via multiple metal thermostats), and multiple temperature sensors can be placed in each of the temperature-changing regions 901 to 904. In one embodiment, at least some of the temperature-changing regions 901 to 904 can correspond to different target temperatures.

[0032] Specifically, in this embodiment, the temperature change module 920 can be positioned in the rear area of ​​the motherboard's GPU chip socket. Since the rear area of ​​the motherboard's GPU chip socket is not a flat surface, a thermal conductive material can be provided between the temperature change module 920 and the back of the motherboard, allowing the temperature change module 920 to be fixed to the rear area of ​​the motherboard's GPU chip socket. Each of the temperature change areas 901 to 904 can be provided with two temperature sensors. In this embodiment, the temperature change areas 901 to 903 may, for example, directly face the graphics card memory area of ​​the GPU chip. During extreme overclocking, the temperature of the temperature change areas 901 to 903 can be made the lowest compared to the other temperature change areas by cooling the GPU chip via liquid nitrogen. Therefore, the temperature change areas 901 to 903 can correspond to specific lower or higher target temperatures. Furthermore, the temperature change areas 904 can be designed to correspond to a different target temperature.

[0033] In this embodiment, whether the graphics card memory of the GPU chip operates at the optimal operating temperature has a serious impact on the performance of the GPU chip after overclocking. Furthermore, since there is a difference between the optimal operating temperature of the graphics card memory and the optimal operating temperature of the passive elements, by setting the target temperature of temperature change regions 901-903 to, for example, above room temperature during extreme overclocking, the motherboard and electronic components can be prevented from being affected by freezing due to low temperatures, and damage to the motherboard by liquid water resulting from the melting of ice can also be prevented.

[0034] Figure 10 is a schematic diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention. Referring to Figure 10, the temperature control modules provided in each embodiment of the present invention can be arranged as described in this embodiment. In this embodiment, the temperature control modules 1011 and 1012 can be arranged on a motherboard 1000. The temperature control modules 1011 and 1012 may be, for example, a microcontroller unit (MCU) or a control chip. In one embodiment, the temperature control modules 1011 and 1012 may be implemented via a basic input / output system (BIOS) chip or an application program (App) of an operating system (OS).

[0035] In this embodiment, the temperature control module 1011 is electrically connected to the temperature change module 1021 (and corresponding temperature sensors) via a dedicated connector and connecting wires, and can control the temperature change module 1021. The temperature control module 1012 is electrically connected to multiple temperature change modules 1022-1024 (and corresponding multiple temperature sensors) via a dedicated connector and multiple connecting wires, and can control the temperature change modules 1022-1024. In one embodiment, the temperature control modules 1011 and 1012 can also use hardware circuitry to control the temperature change modules 1021-1024 via various switches or jumpers, thereby adjusting the temperature of peripheral circuit elements in multiple specific areas on the motherboard.

[0036] In this embodiment, each temperature change module 1021 to 1024 includes a power input interface and is configured to connect to a DC power terminal or interface on the motherboard to acquire a power signal. Alternatively, in one embodiment, each temperature change module 1021 to 1024 can acquire corresponding power signals from temperature control modules 1011 and 1012, respectively, via corresponding connection lines.

[0037] Figure 11 is a schematic diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention. Referring to Figure 11, the temperature control modules provided in each embodiment of the present invention can be arranged as described in this embodiment. In this embodiment, the temperature control modules 1111 and 1112 can be arranged on the same or different external circuit boards. The temperature control modules 1111 and 1112 may be, for example, microcontrollers or control chips.

[0038] In this embodiment, the temperature control module 1111 is electrically connected via connection lines to a connection interface 1101 (having a specific or dedicated connector) on the motherboard 1100, and is also electrically connected via connection lines to a temperature change module 1121 (and corresponding temperature sensors), and can control the temperature change module 1121. The temperature control module 1112 is electrically connected via connection lines to a connection interface 1102 (having a specific or dedicated connector) on the motherboard 1100, and is also electrically connected via multiple connection lines to multiple temperature change modules 1122-1124 (and corresponding multiple temperature sensors), and can control the temperature change modules 1122-1124. In one embodiment, the temperature control modules 1111 and 1112 can also use hardware circuitry to control the temperature change modules 1121-1124 via various switches or jumpers, thereby adjusting the temperature of peripheral circuit elements in multiple specific areas on the motherboard.

[0039] As described above, the temperature control module and temperature control method provided in the present invention can synchronously adjust the temperature of peripheral circuit elements via a temperature change module that is in contact with the peripheral circuit elements during the extreme cooling process in which the main circuit elements are operated in overclock mode. As a result, the peripheral circuit elements can be operated at an appropriate temperature, and thereby both the main circuit elements and peripheral circuit elements can be operated in a highly efficient state.

[0040] Although the present invention has been described with reference to the embodiments described above, these embodiments are not intended to limit the invention. Those skilled in the art can modify and alter the invention without departing from its spirit and scope. Therefore, the scope of protection of the present invention should be defined by the following claims. [Industrial applicability]

[0041] The temperature control module and temperature control method can be applied to the field of extreme overclocking. [Explanation of symbols]

[0042] 100, 200 Temperature Control Modules 110, 210, 510, 610, 1011, 1012, 1111, 1112 Temperature control modules 120, 220, 320~340, 520, 620, 720, 820, 920, 1021~1024, 1121~1124 Temperature change module 230 Temperature Sensor 300, 500, 1000, 1100 motherboards 301 Main Circuit Elements 302-304, 501, 601 Peripheral circuit elements 310 Cooling Module 502, 602 Thermal Conductive Materials 630 Metal Thermostat Temperature change ranges 701-709, 801-804, 901-904 1101, 1102 Connection Interfaces S1, S2, S4 surface S410~S430 Step Directions D1-D3

Claims

1. A temperature control module located on the motherboard, Temperature control module and A temperature change module configured to contact peripheral circuit elements and be electrically connected to the temperature control module, A temperature sensor configured to contact the aforementioned peripheral circuit elements and to be electrically connected to the temperature control module, The cooling module on the main circuit element of the motherboard cools the main circuit element by a cooling method that includes applying liquid nitrogen or liquid helium to the main circuit element, and as the main circuit element is cooled by the cooling module, the peripheral circuit elements adjacent to the main circuit element are cooled in conjunction, causing the temperature sensor to detect a decrease in the ambient temperature of the peripheral circuit elements. The ambient temperature of the peripheral circuit element is affected by the cooling method, and the temperature control module determines whether the ambient temperature is lower than the target temperature, and operates the temperature change module to determine whether to adjust the temperature of the peripheral circuit element. A temperature adjustment module which, when the cooling module cools the main circuit element and the temperature control module determines that the ambient temperature is lower than the target temperature, operates the temperature change module to heat the peripheral circuit element.

2. The temperature control module according to claim 1, wherein the cooling module cools the main circuit element to a first temperature, and the first temperature is lower than or equal to the target temperature.

3. The temperature control module according to claim 1, wherein when the temperature control module determines that the ambient temperature is higher than the target temperature, the temperature control module operates the temperature change module to cool the peripheral circuit elements.

4. The temperature change module, The temperature control module according to claim 1, comprising a temperature changing region configured to contact the peripheral circuit elements via a heat conductive material, wherein the temperature sensor is disposed within the temperature changing region.

5. The temperature change module, A temperature control module according to claim 1, comprising a plurality of temperature-changing regions configured to contact a plurality of peripheral circuit elements via a heat-conducting material, wherein a plurality of temperature sensors are disposed within each of the temperature-changing regions.

6. The temperature control module according to claim 5, wherein at least a portion of the temperature change region corresponds to a different target temperature.

7. The temperature control module according to claim 1, wherein the peripheral circuit elements and the main circuit elements are arranged on the same side of the same circuit board.

8. The temperature control module according to claim 1, wherein the peripheral circuit elements and the main circuit elements are arranged on different sides of the same circuit board.

9. The temperature control module according to claim 1, wherein the temperature control module is arranged on the motherboard and the temperature control module is electrically connected to the temperature change module and the temperature sensor via connecting wires.

10. The temperature control module according to claim 9, wherein the temperature control module is electrically connected to a plurality of temperature change modules and a plurality of temperature sensors via a plurality of connection lines.

11. The temperature control module according to claim 1, wherein the temperature control module is arranged on an external circuit board, and the temperature control module is electrically connected to the temperature change module and the temperature sensor via connecting wires.

12. The temperature control module according to claim 11, wherein the temperature control module is electrically connected to a plurality of temperature change modules and a plurality of temperature sensors via a plurality of connection lines.

13. The temperature control module according to claim 1, wherein the main circuit element performs an overclocking operation.

14. The temperature control module according to claim 1, wherein the main circuit element comprises at least one of a central processing chip, a graphics processing chip, and a memory module.

15. When a cooling module on a motherboard's main circuit element cools the main circuit element by a cooling method that includes applying liquid nitrogen or liquid helium to the main circuit element, the cooling of the main circuit element by the cooling module causes the peripheral circuit elements adjacent to the main circuit element to cool in conjunction, thereby allowing a temperature sensor to detect a decrease in the ambient temperature of the peripheral circuit elements. The temperature control module determines whether the ambient temperature is lower than the target temperature, and the temperature change module is operated to determine whether to adjust the temperature of the peripheral circuit elements. When the cooling module cools the main circuit element and the temperature control module determines that the ambient temperature is lower than the target temperature, the temperature control module operates the temperature change module to heat the peripheral circuit element. A temperature control method that includes this.

16. The temperature adjustment method according to claim 15, wherein the cooling module cools the main circuit element to a first temperature, and the first temperature is equal to or greater than the target temperature.

17. Performing temperature control on the aforementioned peripheral circuit elements is, The temperature adjustment method according to claim 15, wherein when the temperature control module determines that the ambient temperature is higher than the target temperature, the temperature control module operates the temperature change module to cool the peripheral circuit elements.

18. The temperature control method according to claim 15, further comprising performing an overclocking operation on the main circuit element.

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