A method for manufacturing a pressing plate, and a method for processing a workpiece using a pressing plate manufactured by the same method.

Abstract

To provide a production method of a pressing processing plate which has desired shape accuracy and dimension accuracy of a desired salient, recess, irregular part, fine irregular part, and the like, in chemical corrosion etching processing having a simpler step than that in conventional general purpose chemical corrosion etching processing, the pressing processing plate having a desired shape in which corrosion etching in a region for which etching must not be performed on a plate mold substrate, is suppressed.SOLUTION: In a production method of a pressing processing plate, to a desired region on a plate mold substrate 1 on which an existing irregular part 45 is formed, an inkjet resist material 2 is adhered by an inkjet method, for forming a desired region inkjet resist cured film 3. Then, an etchant is brought into contact with a surface of the plate mold substrate 1 to which the desired region inkjet resist cured film 3 is formed, for performing etching a region on the plate mold substrate to which no desired region inkjet resist cured film 3 is adhered, for forming an inkjet resist film corrosion second recess formation part 121 formed in a recess shape, on the surface on the plate mold substrate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a pressing plate used for processing a workpiece such as paper, cardboard, plastic products, sheet transfer foil materials, metal products, composite products thereof, etc. into a predetermined shape by pressing, a pressing plate manufactured by the manufacturing method, and a processing method for processing a workpiece using the pressing plate.

Background Art

[0002] As pressing plates, depending on their applications, those made of metal, plastic, resin, or rubber are used, such as foil pressing plates, die pressing plates, cutting blade dies, and processing plate types combined from these. The foil pressing plate is a pressing plate used to transfer a transfer foil material onto a workpiece in accordance with a graphic, character, or pattern formed in a concave-convex shape on the pressing plate. The die pressing plate is a pressing plate used to transfer a graphic, character, or pattern formed in a concave-convex shape onto a workpiece in accordance with a graphic, character, or pattern formed in a concave-convex shape on the die pressing plate. The cutting blade die is a pressing plate used to perform cutting or punching and cutting operations on a workpiece into a predetermined shape in accordance with a graphic, character, or pattern formed on the cutting blade die for cutting and punching.

[0003] A schematic diagram of a known pressing device constituting a pressing plate is shown in FIG. 16. In FIG. 16, (A) is a flat-type pressing device, where a pressing plate 100 is mounted on the surface of a first base 92 that can move up and down, and a receiving plate 94 is mounted on a second base 93 that can move up and down at a position facing the first base 92. A workpiece 108 is arranged between the pressing plate 100 and the receiving plate 94. In this state, when at least one of the first base 92 and the second base 93 operates, the pressing plate 100 presses the workpiece 108, and a graphic, character, or pattern that coincides with the graphic, character, or pattern formed in a concave-convex shape on the pressing plate 100 is formed in a concave-convex shape on the workpiece. In this flat plate type pressing apparatus, when the workpiece 108 is in a strip shape, the workpiece 108 is intermittently supplied between the pressing plate 100 and the receiving plate 94 in conjunction with the operation of at least one of the first base plate 92 and the second base plate 93, and is processed and formed into a predetermined uneven shape. Furthermore, although not shown in the diagram, in the case of a molded product that can be placed on the receiving plate 94, the workpiece 108 is placed and supplied between the pressing plate 100 and the receiving plate 94 in conjunction with the operation of at least one of the first base plate 92 and the second base plate 93, and the workpiece is pressed to obtain a workpiece that has been processed and formed into a predetermined shape. In this way, a workpiece processed to have a predetermined uneven shape, and / or a cut and cut workpiece, are obtained.

[0004] Figure 16(B) shows a roll-type pressing device in which a pressing plate 100 is formed on the surface of a rotatable main roll 96 having a cylindrical or columnar shape, and a rotatable counter roll 97 is formed at a position opposite the main roll 96. A workpiece 108 is placed between the main roll 96 and the counter roll 97, and in this state, when the main roll 96 and the counter roll 97 are operated, the pressing plate 100 presses the workpiece 108, and a workpiece processed into a predetermined uneven shape is obtained. In this case, the pressing plate 100 can be a pressing plate 100 that has enough flexibility to be mounted around the main roll 96, or a non-flexible pressing plate 100 can be fixed and installed at a predetermined position on the main roll 96 by a fixing jig. Alternatively, the main roll 96 may have a graphic or symbolic pattern formed directly on its surface in a predetermined uneven shape. As for the counter-roll 97, an anvil roll having a smooth surface that does not form irregularities, or a counter-roll having an irregular surface formed with an irregular shape that can engage with the irregular shape formed on the main roll, have also been implemented. In such a roll-type pressing device, a strip-shaped workpiece 108 is continuously supplied between the main roll 96 and the opposing roll 97. In this state, the main roll 96 and the opposing roll 97 operate, pressing the workpiece 108 against them to obtain a workpiece processed into a predetermined uneven shape, and / or a cut and cut-out workpiece.

[0005] Various materials such as paper, various plastic materials, rubber, soft materials, flexible materials, leather, cloth, and metal are used as workpieces, as well as various products such as corrugated cardboard, plastic products, leather products, cloth products, metal products, and emblems, and composite products composed of multiple materials such as labels, adhesive tapes, adhesives, and adhesives.

[0006] When the pressing plate is a foil stamping plate, the surface of the foil stamping plate has a raised and recessed pattern of predetermined characters, numbers, designs, motifs, patterns, images, etc. By pressing this foil stamping plate onto the workpiece via a transfer foil material, the pattern formed by the transfer foil material, which matches the raised and recessed pattern of the foil stamping plate, is transferred and formed on the surface of the workpiece. Almost any material can be used as the workpiece, including paper, various plastic materials, leather, wood, cloth, and metal, and it is applied to various products such as packaging containers, wrapping paper, decorative items, books, labels, plastic products, leather products, cloth products, metal products, and emblems. A foil stamping plate with such uneven surfaces is installed in a pressing device equipped with opposing substrates such as a support plate or receiving part. When at least one of the foil stamping plate and the opposing substrate is driven, the foil stamping plate and the opposing substrate are pressed against each other, and a foil-stamped graphic or graphic pattern that matches the graphic or graphic pattern formed by the uneven surface is transferred and formed on the surface of the workpiece.

[0007] Generally, foil stamping plates are made from materials such as steel, brass, copper, magnesium, stainless steel, other metals, plastics, or resins, while the opposing substrate is made from metal, plastic, resin, rubber, or other materials. A predetermined design, character, or pattern is engraved in a raised or recessed shape on the surface of the foil stamping plate. With the transfer foil material positioned between the foil stamping plate and the workpiece, the foil stamping plate and the opposing substrate are pressed against each other. As a result, the entire surfaces of both the foil stamping plate and the opposing substrate are simultaneously pressed and in contact, and a predetermined graphic, letter, or pictographic pattern formed by the transfer foil material is transferred and formed on the surface of the workpiece in an uneven, raised or recessed shape. In this process, a stamping system that uses a foil stamping plate heated with a hot plate is also used; this is known as a hot stamping stamping system. Furthermore, in such stamping systems, there are cases where a single foil stamping plate is used, and cases where multiple foil stamping plates are used simultaneously.

[0008] When the pressing plate is an embossing plate, it is used in an embossing system that directly presses the embossing plate onto processed products such as paper, plastic, leather, wood, cloth, and laminate materials without using transfer foil material, thereby transferring a predetermined relief shape of a graphic character or pattern, engraved on the embossing plate, onto the surface of the workpiece. Such an embossing system is composed of an embossing plate and a counter substrate, similar to the foil pressing system described above, with a graphic character or pattern formed in a relief shape on the surface of the embossing plate. For example, at least one of the embossing plate and the counter substrate is driven to press the embossing plate and the counter substrate against each other. With the workpiece positioned between the counter substrate and the embossing plate, the entire surface areas of the embossing plate and the counter substrate are simultaneously pressed against each other via the workpiece, transferring and forming a predetermined relief shape of a graphic character or pattern onto the workpiece. In such a pressing system, materials that deform under pressure, such as paper, paper products, soft plastics, leather, wood, and cloth, can be used as workpieces. Furthermore, either a single embossing plate or multiple embossing plates can be used simultaneously.

[0009] When the pressing plate is a cutting die, the cutting die is used in a pressing system to cut or punch out thin workpieces such as paper, plastic, leather, wood, cloth, laminate materials, adhesive sheets, and transfer foil materials into a predetermined shape by pressing the cutting die onto the workpiece. The cutting die has a predetermined blade shape with raised and recessed edges, and the processed product is cut or punched in accordance with the shape of these blades. Such a pressing system is similar to the pressing system using the embossing plate or foil stamping plate described above, and consists of a cutting die and a counter substrate, with a raised and recessed die pattern formed on the surface of the cutting die. For example, the mechanism involves driving at least one of the cutting die and the counter substrate so that the cutting die and the counter substrate press against each other. With the workpiece positioned between the opposing substrate and the cutting die, the cutting die and the opposing substrate are pressed against each other. As a result, the entire surfaces of the cutting die and the opposing substrate are simultaneously pressed against each other through the workpiece, causing a predetermined area of ​​the workpiece to be cut or punched out in a predetermined shape. In such a pressing system, one cutting die may be used, or multiple cutting dies may be used simultaneously. Furthermore, it is possible to perform this cutting and punching process in combination with the foil stamping or embossing process described above.

[0010] The following technologies are known as examples of plates for such pressing processes. Japanese Patent Publication No. 2002-99196 discloses a press transfer processing method in which a hot stamping plate, which is a foil stamping plate used as a pressing plate, and a receiving portion, which is a counter substrate, are placed between a hologram transfer foil, which is a transfer foil material, and a workpiece. Furthermore, Japanese Utility Model Publication No. 7-55065 discloses a hot stamping transfer machine in which a hot stamping die, which serves as a plate for foil stamping, and a support base, which serves as an opposing substrate, are arranged with a transfer foil, which serves as a transfer foil material, and a workpiece, which serves as a workpiece. In particular, a processing die is disclosed in which a rubber material is attached to the recesses formed by the unevenness of the processing die, thereby forming the surface of the processing die so that it is flush with the convex parts. Furthermore, Utility Model Registration No. 3130674 discloses a flatbed transfer apparatus comprising: a processing die on which a graphic character and pictogram pattern is engraved in a raised and recessed shape, the surface of which at least one direction of the surface of the processing die has a surface shape consisting of a curved or rounded top and an inclined surface that becomes continuously and smoothly lower as it moves away from the top; a support plate having a planar surface as a counter substrate; a transfer foil film as a transfer foil material positioned between the processing die and the support plate; and a transfer object as a processed product.

[0011] Japanese Patent Publication No. 8-85099 discloses a method for manufacturing a die having a high cutting edge and a low cutting edge by chemical corrosion etching, and also describes a method for rounding the tip of the low cutting edge with a file or the like after etching. Furthermore, as prior art, a method of forming the low cutting edge by grinding with a grinder or the like after etching is also disclosed. Publication No. 2002-53332 discloses a flexible die and a method for manufacturing a flexible die, in which a flexible base and a projection protruding from the base are formed by etching, the sides of the projection are cut to form a vertical projection, and then a double-edged or single-edged cutting edge is machined at the tip of the vertical projection to form a push-cutting blade. This makes it possible to reduce the width of the base side of the push-cutting blade compared to the base side of a conventional flexible die, thereby reducing the difference in dimensions between the upper and lower parts of the material when punching out thick materials, improving processing accuracy. Furthermore, since the cutting edge is machined only at the tip of the vertical projection, less pressure is required on the push-cutting blade when punching out materials, improving the durability of the push-cutting blade, and resulting in improved productivity and reduced product costs.

[0012] When manufacturing a pressing plate comprising a recess and a projection protruding from the recess, wherein the surface of the projection has a plurality of uneven surfaces having a plurality of recesses and a plurality of protrusions, conventionally, the known methods for manufacturing pressing plates are a manufacturing method by mechanical processing, a manufacturing method by chemical etching, and a manufacturing method by a combination of chemical etching and mechanical processing. Generally, the depth dimension of the recess (which has the same meaning as the height dimension of the protrusion) varies depending on the type of workpiece, but is approximately 0.5 mm or more. Furthermore, there are no particular restrictions on the width dimension of the recess or protrusion; it can be any desired dimension.

[0013] Figure 18 shows a schematic cross-sectional diagram illustrating a conventional method for manufacturing a pressing plate by mechanical processing. In Figure 18, (A) a plate mold substrate 1 with a thickness of approximately 3 mm and a smooth surface is prepared, and (B) a desired area of ​​the surface of the plate mold substrate 1 is mechanically cut to form multiple concave recesses 452, and multiple protrusions 451 protruding from the recesses 452, thereby forming a pre-made multiple uneven surface 45. In this case, the depth dimension "D1" of the pre-made multiple uneven surface recesses 452 (height dimension "D1" of the pre-made multiple uneven surface protrusions 451) is, for example, approximately 0.9 mm. (C) Next, the area around the pre-existing multiple uneven portion 45, which consists of multiple pre-existing multiple uneven portion recesses 452 and multiple pre-existing multiple uneven portion protrusions 451 formed as described above, is cut by machining to form a conventional second recess-forming portion 121a. This produces a pressing plate having a conventional conventional machined uneven portion protrusion 450 formed by conventional machining, which has multiple pre-existing multiple uneven portion protrusions 451 and multiple pre-existing multiple uneven portion recesses 452, and a conventional second recess-forming portion 121a. In this case, the depth dimension "D12a" of the conventional second recess-forming portion 121a is, for example, about 2 mm.

[0014] Figure 19 shows a schematic cross-sectional diagram illustrating a manufacturing method in which, after forming multiple pre-existing uneven surfaces 45 by conventional chemical etching, the area around the pre-existing multiple uneven surfaces 45 is further processed by machining to form conventionally machined uneven surfaces 450 formed by conventional machining. In Figure 19, (A) a conventional resist material 20 is applied to a desired area on the surface of a printing substrate 1 with a thickness of approximately 3 mm (and if a liquid resist material is used, it is further dried), (B) an exposure mask member 23 is installed to cover the conventional resist material and form an opening for a predetermined graphic character pattern, and ultraviolet light or the like is irradiated onto the printing substrate via the exposure mask member to expose and chemically alter the conventional resist material, (C) the unwanted resist material is dissolved and removed and developed to match the graphic character pattern of the exposure mask member. (D) A conventional resist-cured film 30 is formed, and after baking is performed as necessary. (D) An etching solution is brought into contact with the surface of the plate-making substrate 100 on which the conventional resist-cured film 30 is formed, and the surface of the plate-making substrate in the area where the plate-making substrate surface without the conventional resist material 30 is exposed is etched to form a concave conventional recess 452. (E) The conventional resist-cured film is removed, thereby forming a concave pre-existing multiple recess 452 and a convex pre-existing multiple protrusion 451, thereby forming a pre-existing multiple recess 45. In this case, the depth dimension D1 of the pre-existing multiple recess 452 (height dimension D1 of the pre-existing multiple protrusion 451) is, for example, about 0.9 mm. (F) Furthermore, the area around the pre-existing uneven portion 45, which consists of a plurality of pre-existing concave recesses 452 and a plurality of pre-existing convex protrusions 451 formed as described above, is cut by machining to form a conventional second concave forming portion 121a. Thus, a pressing plate is manufactured which has a conventional machined uneven portion protrusion 450 formed by conventional machining having a plurality of pre-existing convex protrusions 451 and a plurality of pre-existing concave recesses 452, and a conventional second concave forming portion 121a. In this case, the depth dimension "D12a" of the conventional second concave forming portion 121a is, for example, about 2 mm.

[0015] In Figure 19(A), conventional conventional resist materials 20 generally include conventional liquid resist materials or conventional dry film resist materials in sheet or film form. Conventionally, generally, conventional liquid resist materials are attached and formed in desired regions of a substrate for a pattern plate by conventional screen printing methods, spray coating methods, curtain coating methods, and the like. The screen printing method is a method of attaching a liquid resist material to a desired region of a substrate for a pattern plate through a screen printing plate having predetermined through holes. The spray coating method is a method of spraying a liquid resist material in a spray form from a nozzle having a predetermined number of fine holes and attaching it to a desired region of a substrate for a pattern plate. Conventional dry film resist materials are attached to desired regions of a substrate for a pattern plate by an adhesion method. In FIGS. 19(B) and (C), a method of directly irradiating a laser, an electron beam, etc. to chemically alter a conventional resist material without using an exposure mask member is also implemented.

Prior Art Documents

Patent Documents

[0016]

Patent Document 1

Patent Document 2

[0018] [[ID=⑥]]In addition, in the conventional chemical etching processing, a resist adhesion film is formed by a conventional resist coating method such as a spray coating method, a screen printing method, a curtain coating method, a spin coating method, etc. using a conventional general-purpose liquid resist material, and the resist adhesion film is exposed through an exposure mask member to form a conventional resist cured film having a desired shape, and the substrate is etched using the conventional resist cured film as an etching mask. In the case of forming a high height or a deep depth such as the height dimension of the concave portion and the convex portion and the depth dimension of the concave portion, there is a problem that the processing accuracy such as the shape accuracy and the dimension accuracy is inferior.

[0019] In general, the thickness of the conventional resist adhesion film is less than about 50 μm (about 0.05 mm). When the thickness of the applied conventional resist film is approximately 50 μm or more, the variation in the thickness of the planar region of the conventional resist film increases as the thickness increases, making it difficult to form a uniform conventional resist film. As a result, variations in exposure occur when using an exposure mask with ultraviolet light, making it impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when the conventional resist-cured film is used as an etching mask to etch the plate mold container, it becomes impossible to form uneven areas with the desired shape and dimensional accuracy, resulting in poor etching accuracy.

[0020] In particular, when attempting to adhere a general-purpose conventional liquid resist material to the sides of desired recesses or protrusions, the conventional liquid resist material applied to the sides tends to flow down to the bottom of the recess, making it difficult to adhere the conventional liquid resist material to the desired area on the sides of the protrusions or recesses. Furthermore, when the cured conventional resist film formed by this adhesion is used as an etching mask to etch a plate-making substrate, it becomes impossible to form the desired recesses, protrusions, and other uneven surfaces, resulting in a problem of inferior processing accuracy, such as shape accuracy and dimensional accuracy. Even when conventional resist coating methods such as spray coating, screen printing, curtain coating, and spin coating are used to fill the entire recess of the uneven areas formed on the printing plate substrate and to form a conventional resist-cured film on the sides of the recesses and protrusions, the thickness of the conventional resist-cured film varies greatly, making it impossible to form a uniform conventional resist-cured film. Consequently, variations in exposure occur during exposure using ultraviolet light or other exposure masks, leading to a decrease in dimensional accuracy. As a result, it becomes impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when this conventional resist-cured film is used as an etching mask for corrosion etching, it becomes impossible to form uneven areas with the desired shape and dimensional accuracy, resulting in poor etching accuracy.

[0021] Conventional corrosion etching processes that use general-purpose sheet-type dry film resist materials to form a resist-cured film have the problem of poor processing accuracy, such as shape accuracy and dimensional accuracy, when it comes to forming high heights and deep depths, such as the height dimensions of recesses and protrusions, and recesses and protrusions. In particular, when using a plate-making substrate with an uneven surface to further form desired recesses and protrusions on the plate-making substrate with an uneven surface, the adhesion between the plate-making substrate with the uneven surface and the conventional dry film resist material becomes insufficient, resulting in gaps between the plate-making substrate and the conventional dry film resist material. As a result, the sides and bottom surfaces of the recesses are not covered by the resist material, and etching occurs through the gaps between the resist material and the substrate, resulting in poor processing accuracy, such as the desired shape accuracy and dimensional accuracy.

[0022] Furthermore, in the conventional technology, when manufacturing a pressing plate that includes a recess and a projection protruding from the recess, and in which a plurality of uneven surfaces having a plurality of recesses and a plurality of protrusions are formed on the surface of the projection, there is a problem that the sides of each of the recesses and protrusions are etched, and as a result, it is not possible to form a projection with the desired uneven surface.

[0023] When manufacturing a pressing plate having recesses and protrusions extending from the recesses, and having multiple uneven surfaces formed on the surface of the protrusions, an example of a conventional manufacturing method using chemical etching will be explained with reference to Figure 20. Figure 20 is a schematic diagram illustrating the process of manufacturing a plate for pressing using a conventional chemical etching process with a conventional resist material. In Figure 20, (A) a substrate for printing plates is prepared in which a pre-existing multiple uneven surface 45 having multiple pre-existing multiple uneven surfaces 451 and multiple pre-existing multiple uneven surface recesses 452 is formed by machining or chemical etching using a conventional resist material. The depth dimension D1 of the pre-existing multiple uneven surface recesses 452 (the same as the height dimension of the pre-existing multiple uneven surface protrusions 451) is approximately 0.9 mm. (B) A conventional liquid resist material 20 is applied to the surface of the pre-existing multiple uneven portions 45. In this case, the conventional liquid resist material tends to fall to the bottom surface of the pre-existing multiple uneven portion recesses 452 without adhering to the side surfaces of the recesses 452. The thickness of the conventional liquid resist material 20 applied to the top surface of the pre-existing multiple uneven portion protrusions 451 and the bottom surface of the pre-existing multiple uneven portion recesses 452 is approximately 10 μm (approximately 0.01 mm) or more and less than approximately 50 μm (approximately 0.05 mm). (C) A conventional liquid resist material attached to the surface of the multiple existing uneven parts 45 is covered, and a pre-prepared exposure mask member 23 is installed. Then, (D) exposure such as ultraviolet irradiation, development, curing, etc. are performed to form a conventional cured resist film 30 having the desired shape. (E) The etching solution is brought into contact with the substrate to which the conventional resist-cured film 30 is attached, and the surface of the plate-making substrate in areas where the conventional resist-cured film 30 is not attached is etched by corrosion, and the area around the existing multiple uneven parts 45 is etched by corrosion to a depth of approximately 1 mm in the etching depth dimension "D3" during the etching process, thereby forming the second etched recessed part 121b during the etching process. (F) Further, corrosion etching is continued until the depth of the area surrounding the existing multiple recessed parts 45 reaches a predetermined depth, thereby forming a conventional second recessed part 121a with a depth dimension "D12a" of approximately 2 mm. (G) Remove the conventionally cured resist film 30.

[0024] In this manufacturing method, in (E), the recessed side surface of the pre-existing multiple uneven portion recess 452 to which the conventional resist-cured film 30 is not attached is also corroded and etched, and a side-etched area is created where the side surface of the pre-existing multiple uneven portion protrusion 451 is corroded and etched due to the side etching phenomenon, forming a side-etched pre-existing multiple uneven portion protrusion side surface 451s (side-etched pre-existing multiple uneven portion recess side surface 452s), and as a result, there is a problem that a pre-existing uneven portion protrusion that maintains the shape of a normal uneven pattern is not formed. Note that the side surface of the pre-existing multiple uneven portion protrusion 451 means the same area as the side surface of the pre-existing multiple uneven portion recess 452, so the side-etched pre-existing multiple uneven portion protrusion side surface 451s means the same area as the side-etched pre-existing multiple uneven portion recess side surface 452s. Also, "side etching" has the same meaning as "side etching," and refers to the phenomenon in which the side surface of the protrusion of the uneven portion or the side surface of the recess of the uneven portion is etched. In (F), a pressing plate is manufactured which comprises a recess (conventionally used second recess forming portion 121a) with a depth dimension "D12a" of approximately 2 mm and a projection that protrudes from the recess, and on the surface of the projection, a plurality of side-etched pre-existing recessed projection portions 455s are formed, each having a side-etched surface portion 451s of the protruding portion and a side-etched surface portion 452s of the recessed portion. Furthermore, the conventional second recess forming portion 121a has the form of a side-etched eroded second recess forming portion 121s.

[0025] As described above, in the conventional method of manufacturing a pressing plate using conventional liquid resist material 20, the sides of the multiple pre-existing multiple protrusions 451 (or the sides of the multiple pre-existing multiple recesses 452) are also etched, making it impossible to maintain the initial shape of the multiple pre-existing multiple protrusions 451 and multiple pre-existing multiple recesses 452, and thus there is a problem in that a desired normal pressing plate cannot be manufactured.

[0026] Furthermore, in the conventional technology, when manufacturing a pressing plate comprising a recess and a projection protruding from the recess, and having a plurality of pre-existing multiple fine uneven surfaces 466 having a plurality of pre-existing multiple fine uneven surfaces protruding 461 and a plurality of pre-existing multiple fine uneven surfaces recessed 462 on the surface of the projection, there is a problem that the sides of the plurality of pre-existing multiple fine uneven surfaces protruding 461 and a plurality of pre-existing multiple fine uneven surfaces recessed 462 are etched, and as a result, it is not possible to form the desired projection having a plurality of pre-existing multiple fine uneven surfaces protruding 461 and a plurality of pre-existing multiple fine uneven surfaces recessed 462. When manufacturing a pressing plate having a recess and a projection protruding from the recess, and having multiple pre-existing multiple fine uneven surfaces formed on the surface of the projection, each having multiple pre-existing multiple fine uneven surfaces protruding 461 and multiple pre-existing multiple fine uneven surfaces recessed 462, an example of a conventional manufacturing method by chemical etching will be explained with reference to Figure 21.

[0027] Figure 21 is a schematic diagram illustrating the process of manufacturing a plate for pressing using a conventional chemical etching process with a conventional resist material. In Figure 21, (A) a substrate for printing plates is prepared in which a pre-existing multiple fine uneven surface 46 having multiple pre-existing multiple fine uneven surface protrusions 461 and multiple pre-existing multiple fine uneven surface recesses 462 is formed by machining or chemical etching using a conventional resist material. The depth dimension "d1" of the multiple pre-existing multiple fine uneven surface recesses 462 (height dimension of the pre-existing multiple fine uneven surface protrusions 461) is approximately 0.05 mm (approximately 50 μm) to approximately 1 mm (approximately 1000 μm), and the width dimension of the multiple pre-existing multiple fine uneven surface recesses 462 and the width dimension of the pre-existing multiple fine uneven surface protrusions 461 are approximately 0.01 mm (approximately 10 μm) to approximately 1 mm (approximately 1000 μm). (B) A conventional sheet-like dry film resist material 20 is attached to the surface of the existing multiple fine uneven areas 46. In this case, the sheet-like general-purpose conventional dry film resist material 20 does not adhere completely to the upper surface of the protrusions 461 of the existing multiple fine uneven areas, nor does the sheet-like conventional dry film resist material 20 adhere completely to the sides and bottom surfaces of the recesses 452 of the existing multiple fine uneven areas, and gaps tend to form between the sheet-like conventional dry film resist material 30 and the existing multiple fine uneven areas 45. The thickness of the sheet-like conventional dry film resist material 30 is approximately 0.02 mm to 0.04 mm (approximately 20 μm to approximately 40 μm). (C) A conventional dry film resist material attached to the surface of the multiple pre-existing fine uneven parts 46 is covered, and a pre-prepared exposure mask member 23 is set up. Then, (D) exposure such as ultraviolet irradiation, development, curing, etc. are performed to form a conventional cured resist film 30 having the desired shape. (D) The etching solution is brought into contact with the substrate to which the conventional resist-cured film 30 is attached, and the surface of the plate-making substrate in areas where the conventional resist-cured film 30 is not attached is etched by corrosion, and the area around the multiple existing fine uneven parts 46 is etched by corrosion to a depth of approximately 1 mm in etching depth dimension "d3", thereby forming the second etched recess 121b during etching. (E) Further, the etching process is continued until the depth of the surrounding area of ​​the multiple existing fine uneven areas 46 reaches a predetermined depth, thereby forming a conventional second etched recess 121a with a depth dimension "d12a" of approximately 2 mm. (F) Remove the conventionally cured resist film 30.

[0028] In this manufacturing method, in (E), the recessed side surface of the pre-existing multiple fine unevenness recess 462 to which the conventional resist-cured film 30 is not attached is also corroded and etched, and a side-etched area is created where the side surface of the pre-existing multiple fine unevenness protrusion 461 is corroded and etched due to the side-etching phenomenon, forming a side-etched pre-existing multiple fine unevenness protrusion side surface 461s (side-etched pre-existing multiple fine unevenness recess side surface 462s). As a result, there is a problem that a normal pre-existing multiple fine unevenness protrusion that maintains the shape of the desired multiple fine unevenness pattern cannot be formed. Note that the side surface of the pre-existing multiple fine unevenness protrusion 461 refers to the same area as the side surface of the pre-existing multiple fine unevenness recess 462, so the side-etched pre-existing multiple fine unevenness protrusion side surface 461s refers to the same area as the side-etched pre-existing multiple fine unevenness recess side surface 462s. (F) A pressing plate is manufactured which comprises a recess (conventionally used second recess forming portion 121a) with a depth dimension "D12a" of approximately 2 mm and a projection that protrudes from the recess, and on the surface of the projection a side-etched pre-existing multiple fine uneven surface projection portion 466s is formed, having a side-etched pre-existing multiple fine uneven surface projection portion side surface 461s and a side-etched pre-existing multiple fine uneven surface recess side surface 462s. In addition, the conventional second recess forming portion 121a has the form of a side-etched eroded second recess forming portion 121s.

[0029] As described above, in the conventional method of manufacturing a pressing plate using conventional dry film resist material 20, the sides of the existing multiple fine uneven protrusions 461 (or the sides of the existing multiple fine uneven recesses 462) are also etched, making it impossible to maintain the initial shape of the existing multiple fine uneven protrusions 461 and the existing multiple fine uneven recesses 462. This presents a problem in that it is not possible to manufacture a pressing plate with the desired shape accuracy and dimensional accuracy.

[0030] Furthermore, in the method for manufacturing a pressing plate as described using Figure 21 above, although not shown, even when the pressing plate is manufactured by replacing the (B) step of "attaching the conventional dry film resist material 30" with a step similar to the case where the conventional liquid resist material 20 in Figure 20 is used, "attaching the conventional liquid resist material 20 to the surface of the multiple pre-existing fine irregularities 46", followed by (C) development and resist hardening film formation (setting up the exposure mask member, exposure, development), (D) corrosion etching, (E) continuing corrosion etching, (F) removing the resist hardened film, etc., there is a problem in that a pressing plate with the desired shape accuracy and dimensional accuracy cannot be manufactured. In other words, even in this case, a pressing plate is manufactured which comprises a recess (conventionally used second recess forming part 121a) with a depth dimension "d12a" of approximately 2 mm, and a projection that protrudes from the recess, and a side-etched pre-existing multiple fine unevenness projection 466s having a side-etched pre-existing multiple fine unevenness projection side 461s and a side-etched pre-existing multiple fine unevenness recess side 462s on the surface of the projection, and the side of the pre-existing multiple fine unevenness projection 461 (or the side of the pre-existing multiple fine unevenness recess 462) is also etched, and the shape of the initial pre-existing multiple fine unevenness projection 461 and pre-existing multiple fine unevenness recess 462 cannot be maintained, resulting in the problem that a pressing plate with the desired shape accuracy and dimensional accuracy cannot be manufactured.

[0031] There is a problem in that when a workpiece is processed using a pressing plate with the desired shape and dimensional accuracy, it may not be possible to form a workpiece with the desired shape and dimensional accuracy.

[0032] The present invention provides a method for manufacturing a pressing plate, which solves the above-mentioned conventional problems. It is a method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, and provides a method for manufacturing a pressing plate that has desired shapes such as desired convex portions, desired recesses, desired uneven portions, desired fine uneven portions, etc., and has desired shape accuracy and dimensional accuracy, while suppressing erosive etching in "areas of the plate-making substrate that must not be etched".

[0033] The present invention provides a pressing plate that has desired shapes such as desired convex portions, desired recesses, desired uneven portions, and desired fine uneven portions, and that also has desired shape accuracy and dimensional accuracy, while suppressing corrosive etching in the "areas of the plate-making substrate that must not be etched".

[0034] The present invention provides a method for processing workpieces such as paper, corrugated cardboard, plastic film, plastic board, plastic molded product, and laminates thereof, which can be processed to produce workpieces having desired shapes such as desired convex portions, desired recesses, desired uneven surfaces, and desired fine uneven surfaces, while also having desired shape accuracy and dimensional accuracy. [Means for solving the problem]

[0035] The present invention's method for manufacturing a plate for pressing is: A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, (A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12), (B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and A desired region inkjet resist curing step, which involves curing the aforementioned desired region inkjet resist deposition film to form a desired region inkjet resist cured film (3), (C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the inkjet resist cured film (3) in the desired area is formed, and the surface of the plate-making substrate on which the inkjet resist cured film (3) in the desired area is not attached is etched. This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1), And, (D) A step to remove the inkjet resist cured film in the desired region, It is characterized by comprising the following:

[0036] Preferably, In step (A) above, The second region surface (12) of the plate-type substrate has one or more smooth, non-irregular areas. The first region surface (11) of the substrate for the plate mold has one or more pre-existing uneven surfaces (4), (i) The surface (12) of the second region of the substrate for the plate mold has a single smooth surface without any irregularities, When the first region surface (11) of the substrate for the plate mold has one pre-existing uneven portion (4), The smooth portion is located in the area surrounding the pre-existing uneven portion (4). The aforementioned pre-existing uneven portion (4) is (i) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes, Or, (b) A pre-existing multiple micro-recessed portion (46) having multiple pre-existing multiple micro-recessed portions (461) formed by multiple micro-convex shapes and multiple pre-existing multiple micro-recessed portions (462) formed by multiple micro-concave shapes, (ii) The second region surface (12) of the substrate for the plate mold has a plurality of smooth, non-irregular areas, When the first region surface (11) of the plate-type substrate has a plurality of pre-existing uneven portions (4), Each of the plurality of smooth areas is located in the surrounding region of each of the plurality of pre-existing uneven areas (4). Each of the aforementioned multiple pre-existing uneven surfaces (4) is, (i) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes, and / or, (b) A pre-existing multiple micro-recessed portion (46) having multiple pre-existing multiple micro-recessed portions (461) formed by multiple micro-convex shapes and multiple pre-existing multiple micro-recessed portions (462) formed by multiple micro-concave shapes, In step (B) above, A desired region inkjet resist film formation step, which involves covering the pre-existing uneven portion (4) on the first region surface (11) of the plate-making substrate (1) with an inkjet resist material (2) and depositing it by an inkjet method to form an inkjet resist film in the desired region. And, The process includes a desired region inkjet resist curing step, which involves curing the aforementioned desired region inkjet resist deposition film to form a desired region inkjet resist cured film (3), In step (C) above, The process includes an etching step for a printing plate substrate in which an etching solution is brought into contact with the surface of the printing plate substrate (1) on which the desired region inkjet resist cured film (3) is formed, thereby etching the second region surface (12) of the printing plate substrate where the desired region inkjet resist cured film is not attached, thereby etching the second region surface (12) of the printing plate substrate without etching the pre-existing uneven portion (4), and forming an inkjet resist film corrosion second recess forming portion 121 which is formed in a recessed shape, where the inkjet resist film corrosion second recess forming portion 121 corresponds to the inkjet resist film corrosion recess forming portion. In step (D) above, The system includes a step for removing the inkjet resist cured film (3) in the desired region, This allows etching of the second region surface (12) of the plate-making substrate without etching the pre-existing uneven portion (4) to form a second recessed portion (121) of the inkjet resist film corrosion, while simultaneously forming the pre-existing uneven portion (4) into a protruding shape that extends from the second recessed portion (121) of the inkjet resist film corrosion. It is characterized by the following:

[0037] The pressing plate of the present invention is a pressing plate manufactured by the method for manufacturing a pressing plate of the present invention.

[0038] The present invention's method for processing a workpiece is: (Sa) A step of supplying a pressing plate (10) manufactured by the pressing plate manufacturing method of the present invention, (Sb) A step of preparing a pressing device equipped with a first base (92) and a second base (93) facing each other, (Sd) A step of installing a predetermined receiving plate (94) on the second base (93) of the pressing device, (Se) With the workpiece (108) positioned between the pressing plate (10) and the receiving plate (94), the process of driving at least one of the first base (92) and the second base (93) so that the pressing plate (10) and the receiving plate (94) press the workpiece, This creates a workpiece surface (108) with a surface shape that matches the surface shape of the pre-existing surface (4), And, (Sf) A step of driving at least one base of the pressing plate (10) and the receiving plate (94) to separate the pressing plate (10) and the receiving plate (94) from each other and to release the pressure on the workpiece, This prepares a workpiece in which the workpiece surface (108) has a workpiece surface formed with a workpiece surface area that has been transferred and formed in a manner that matches the surface shape of the pre-existing surface area (4). It is characterized by comprising the following: [Effects of the Invention]

[0039] The present invention provides a method for manufacturing a plate for pressing, which offers the following advantages: [(Effect of manufacturing method A: Effect of forming a surface shape with desired dimensions of irregularities using inkjet resist) By using a process that includes chemical corrosion etching, which has a simpler process than conventional general-purpose chemical corrosion etching, it becomes possible to manufacture a plate for pressing that has desired shapes such as desired convex parts, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing corrosion etching in areas of the plate-making substrate that should not be etched].

[0040] In particular, the method for manufacturing a pressing plate of the present invention provides the effect of [(Effect of manufacturing method a-a: Effect of forming pre-existing uneven parts of desired dimensions having a protruding shape by inkjet resist) a chemical corrosion etching process in which a recess and a projection protruding from the recess, and a pre-existing multiple uneven parts having a plurality of pre-existing multiple uneven parts recesses and a plurality of pre-existing multiple uneven parts protrusions on the surface of the projection, and / or a pre-existing multiple fine uneven parts having a plurality of pre-existing multiple fine uneven parts protrusions and a plurality of pre-existing multiple fine uneven parts recesses are formed, and corrosion etching of the "area of ​​the plate mold substrate that must not be etched" is suppressed, thereby enabling the manufacture of a pressing plate having a desired shape].

[0041] The pressing plate of the present invention provides the following effect: [Effect of the pressing plate configuration: to obtain a pressing plate having desired shapes such as desired convex portions, desired recesses, desired uneven portions, desired fine uneven portions, and having desired shape accuracy and dimensional accuracy, while suppressing corrosive etching in the "areas of the plate-making substrate that must not be etched"].

[0042] The workpiece processing method of the present invention provides the following effect: [Effect of workpiece processing method A: It is possible to prepare workpieces that have desired shapes such as desired protrusions, desired recesses, desired uneven surfaces, and desired fine uneven surfaces, and that are processed and formed with desired shape accuracy and dimensional accuracy, such as paper, corrugated cardboard, plastic film, plastic board, plastic molded product, and laminates thereof]. [Brief explanation of the drawing]

[0043] [Figure 1] A schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to one embodiment of the present invention. [Figure 2] A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. [Figure 3] A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. [Figure 4] A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. [Figure 5] A schematic diagram illustrating a plurality of pre-existing fine irregularities formed on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. [Figure 6] A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. [Figure 7] A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. [Figure 8] A schematic diagram illustrating the shape of a graphic character pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. [Figure 9] A schematic diagram illustrating the shape of a graphic character pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. [Figure 10] A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. [Figure 11]A schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention. [Figure 12] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 13] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 14] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 15] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 16] This is a schematic diagram of a known pressing device that has a pressing plate configured for pressing, and which can also be used with the pressing plate of the present invention, where (A) is a processing device that has a flat plate type pressing plate configured, and (B) is a roll-type pressing device. [Figure 17] A schematic diagram of a known pressing device comprising a pressing plate, which can also be used with the pressing plate of the present invention. [Figure 18] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 19] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 20] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 21] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 22] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Figure 23] A schematic diagram illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes. [Modes for carrying out the invention]

[0044] <Regarding the manufacturing method of a pressing plate according to the present invention> [Basic configuration 1] The present invention's method for manufacturing a plate for pressing has the following configuration. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, comprising: (A) a plate-type substrate supply step of supplying a plate-type substrate 1 having a first plate-type substrate surface area 11 and a second plate-type substrate surface area 12; (B) a desired-area inkjet resist film formation step of forming a desired-area inkjet resist film by attaching an inkjet resist material 2 to a desired area of ​​the first plate-type substrate surface area 11 of the plate-type substrate 1 using an inkjet method; and a desired-area inkjet resist cured film formation step of curing the desired-area inkjet resist film to form a desired-area inkjet resist cured film 3; (C) a plate-type substrate etching step of contacting an etching solution with the surface of the plate-type substrate 1 on which the desired-area inkjet resist cured film 3 has been formed, thereby etching the surface of the plate-type substrate 1 where the desired-area inkjet resist cured film 3 is not attached, thereby forming an erosion recess formed in a recess shape on the surface of the plate-type substrate 1; and (D) a desired-area inkjet resist cured film removal step of removing the desired-area inkjet resist cured film 3. In this way, a pressing plate with a desired uneven surface shape is manufactured.

[0045] In addition, in step (A) above, the "process of supplying the substrate for printing plates 1" can also be performed as the "process of preparing the substrate for printing plates 1," as "supply" and "prepare" have similar meanings. Furthermore, the first region surface 11 of the plate-making substrate is a virtual first region surface of the plate-making substrate, and the second region surface 12 of the plate-making substrate is a virtual second region surface of the plate-making substrate. That is, the first region surface 11 of the plate-making substrate is a virtual first region surface of the plate-making substrate, and the second region surface 12 of the plate-making substrate is a virtual second region surface of the plate-making substrate. Furthermore, it is preferable to implement a configuration in which the first region surface 11 and the second region surface 12 of the substrate for printing are located on adjacent region surfaces, and / or a configuration in which the second region surface 12 of the substrate for printing is located on the surrounding region surface of the first region surface 11, and / or a configuration in which the first region surface 11 of the substrate for printing is located on the surrounding region surface of the second region surface 12. Furthermore, as will be explained in "Dependent Configuration 4" and "Dependent Configuration 7" described later, the pre-existing multiple uneven parts 45 having pre-existing multiple uneven parts convex parts 451 and pre-existing multiple uneven parts recessed parts 452 can preferably be a desired graphic character picture pattern formed with at least one uneven shape selected from the group consisting of (a) characters, (b) symbols, (c) figures, (d) patterns, and (e) designs, or a desired fine graphic character picture pattern in which these graphic character picture patterns are formed with fine uneven shapes.

[0046] The present invention provides a method for manufacturing a plate for pressing, which offers the following advantages: [(Effect of manufacturing method A: Effect of forming a surface shape with desired dimensions of irregularities using inkjet resist) By using a process that includes chemical corrosion etching, which has a simpler process than conventional general-purpose chemical corrosion etching, it becomes possible to manufacture a plate for pressing that has desired shapes such as desired convex parts, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing corrosion etching in areas of the plate-making substrate that should not be etched].

[0047] The plate-making substrate 1 is not particularly limited. For example, a plate-making substrate 1 made of metal, plastic, or resin, which is commonly used as a plate for pressing, can be used. Particularly preferred are plate mold substrates 1 made of metals such as stainless steel, brass, copper, magnesium, and duralumin, and steels such as iron, cemented carbide (GM MF), powder high-speed steel (YXM), high-speed steel (SKH, HSS), die steel (SKD), alloy tool steel (SKT, SKS), and carbon tool steel (SK). Cemented carbide is a composite material that possesses hard properties and is not particularly limited, but for example, it is made by sintering carbides of group IVa, Va, and VIa metals of the wear resistance periodic table (e.g., tungsten carbide, WC) with iron-based metals such as Fe, Co, and Ni. It has excellent mechanical properties and is the steel material with the least occurrence of breakage or scratching, and cemented carbide such as WC-Co, WC-TiC-Co, WC-TaC-Co, WC-TiC-TaC-Co, WC-Ni, and WC-Ni-Cr can be used. As cemented carbide, for example, cemented carbide having a hardness of HRA90 or higher, or a hardness of HRC70 or higher, such as GM30 (hardness HRA90) and MF20 (hardness HRA91), can be preferably used. High-speed steel is tough, possesses excellent resilience, high resistance, and high heat resistance, and contains 3-10% molybdenum-based components. For example, steel materials such as SKH51 (hardness HRC 62-64), DC53 (hardness HRC 59-61), and SKD (hardness HRC 59-61) are preferably used. Powdered high-speed steel has high toughness, wear resistance, and a hardness greater than that of high-speed steel. It contains 4.7-5.3% molybdenum-based components, such as YXM1, and steel materials with a hardness of HRC64-67 are preferably used. The die steel is resistant to heat and physical impact, and preferably uses steel materials such as SKD11, KD21, KD11, DC53, D2, etc., with a hardness of HRC59 to 61.

[0048] Thus, cemented carbide has a harder hardness than high-speed steel, die steel, alloy tool steel, and carbon tool steel. The types and properties of these steels can be selected as desired from those listed in the Japanese Industrial Standards (JIS). The hardness symbols HRA, HRC, etc., represent the Rockwell hardness according to the JIS. In this invention, metals containing at least an iron component are defined as steel. Furthermore, metals such as iron, copper, magnesium, and duralumin refer to metals whose main component is one of these metals, or metals whose main component is one of these metals, with other metals added and contained within. For pressing plates, these metal, plastic, resin, or rubber plate mold substrates are selected as desired, and plate mold substrates having a desired size and shape are used.

[0049] As a desired region inkjet resist film formation step, which involves depositing an inkjet resist material 2 onto a desired region of the first region surface 11 of the printing substrate 1 using an inkjet method, for example, an apparatus similar to an inkjet printing system apparatus commonly used in the field of wiring boards for electronic components and printing can be used to deposit the inkjet resist material 2 onto the desired region of the printing substrate using an inkjet method. For example, using an on-demand inkjet printing system apparatus, the inkjet resist material 2 is ejected from an ejection nozzle equipped with a predetermined number of fine holes, and controlled by CAD data to move relative to the printing substrate, so that the inkjet resist material 2 is deposited and coated onto the desired region of the printing substrate surface with high precision in the form of fine droplets, thereby forming a desired region inkjet resist film deposited on the desired region of the printing substrate 1 with high precision. As the discharge nozzle, for example, an inkjet printing system device equipped with a nozzle head having a large number (approximately 1,000 to 10,000) discharge nozzles with minute diameters can be used. The inkjet printing system equipment is not particularly limited, but for example, on-demand inkjet printing system equipment manufactured by Microcraft, Fujifilm, Ishii Hyoki, Keyence, SSI Japan, or other companies similar to these inkjet printing system equipment can be used, provided that the specifications such as the desired ejection frequency, resolution, droplet volume, number of nozzles, etc., have been modified to the desired specifications. In the embodiment described later, an on-demand inkjet printing system manufactured by Microcraft was used to deposit the inkjet resist material onto the printing plate substrate using an inkjet method.

[0050] Preferably, an inkjet printing system apparatus having the following specifications is preferred. The amount of inkjet resist material droplets ejected from the ejection nozzle is 3 pl to 15 pl, the lateral resolution is 360 dpi, 720 dpi, 1080 dpi, 1440 dpi, or 600 dpi, 900 dpi, 1200 dpi, 1500 dpi, 2400 dpi, the vertical resolution is 720 dpi, 1440 dpi, 2160 dpi, or 1200 dpi, 2400 dpi, the standard resolution is 720 dpi to 1200 dpi, and the minimum line width when the inkjet resist film attached to the desired area is linear is 40 μm to 90 μm. The thickness of the desired region inkjet resist film is not particularly limited, but for example, a desired region inkjet resist film with a cured thickness of approximately 5 μm to approximately 100 μm is preferably used. More preferably, a desired region inkjet resist film with a thickness of approximately 5 μm to approximately 50 μm is also preferably used.

[0051] When using conventional liquid resist materials, the thickness is approximately 50 μm or more, and as the thickness increases, the variation in the thickness of the planar region of the conventional resist coating material increases, making it difficult to form a uniform conventional resist coating. As a result, when using an exposure mask component with ultraviolet light or the like, variations in exposure occur, making it impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when the conventional resist-cured film is used as an etching mask to etch a plate-making substrate, it tends not to be possible to form uneven surfaces with the desired shape and dimensional accuracy.

[0052] In contrast, when a desired region inkjet resist film is formed, it is possible to adhere it to a thickness of approximately 100 μm, which is thicker than when using conventional liquid resist materials. Furthermore, by directly exposing the desired region inkjet resist film without developing it using an exposure mask, it is possible to form a desired region inkjet resist cured film even with a desired region inkjet resist film of approximately 50 μm or more in thickness. As a result, when the desired region inkjet resist cured film is used as an etching mask to etch a plate-making substrate, it is possible to form uneven areas with desired shape and dimensional accuracy. However, when using an inkjet resist material, an inkjet resist film with a desired region in the range of approximately 5 μm to approximately 50 μm can preferably be produced.

[0053] The inkjet resist material 2 is not particularly limited, but can be any conventional general-purpose liquid inkjet resist material used in fields such as the manufacturing of electronic component wiring boards and the photolithography technology field, having the desired viscosity, photoreactivity, temperature reactivity, etc. The inkjet resist material is used for partial protection during chemical corrosion etching, that is, as a corrosion etching mask against etching during chemical corrosion etching. Depending on the etching chemicals used during the corrosion etching of the substrate for printing plates, an etching resist material 2 having alkali resistance, acid resistance, etc., and solubility to the etching solution can be selected and used as desired. For example, a general-purpose conventional inkjet resist material 2 can be used, which is a type of negative-type photoresist that is a fluid material mainly composed of a two-dimensional chemical structure organic polymer material and has the property of chemically crosslinking and curing into a three-dimensional chemical structure crosslinked organic polymer state by ultraviolet irradiation, electron beam irradiation, laser irradiation, or heating. Particularly preferred is an inkjet resist material that chemically reacts and crosslinks by general-purpose ultraviolet irradiation or ultraviolet exposure. Furthermore, it is also preferable to further heat the material at a temperature of 80°C to 150°C after curing into a three-dimensional chemical structure crosslinked organic polymer state to form a further matured cured film. The inkjet resist-cured film 3 formed in this manner provides partial protection during chemical corrosion etching, that is, it functions as a corrosion etching mask during corrosion etching.

[0054] Furthermore, the viscosity of the inkjet resist material 2 is not particularly limited. For example, an inkjet resist material 2 having a viscosity of 5 mPa·s to 100 mPa·s (25°C) is preferred, and more preferably 10 mPa·s to 50 mPa·s (25°C) is preferred. As the viscosity of the inkjet resist material 2 decreases, the thickness of the inkjet resist film tends to decrease, and as the viscosity of the inkjet resist material 2 increases, the thickness of the inkjet resist film tends to increase. An inkjet resist material having a viscosity that allows for the formation of an inkjet resist film of the desired thickness required for its function as a corrosion etching mask is selected and used. Using an inkjet resist material 2 with optimal viscosity, a desired region inkjet resist film having the desired graphic, character, and pattern shape is formed in a desired area on the surface of the printing plate substrate with high precision.

[0055] When a printing plate substrate with an uneven surface formed using the above-described inkjet resist material 2 is used, the inkjet resist material can be applied to the desired area of ​​the uneven surface without dripping onto the sides of the recesses or protrusions. Then, the desired region inkjet resist cured film (3) formed by curing the desired region inkjet resist adhesive film is used as a corrosion etching mask, acting as a partial protective film on the sides of the uneven parts of the plate-making substrate during etching. This exhibits a remarkable effect of enabling etching only the desired region where corrosion etching on the sides of the uneven parts is suppressed.

[0056] The specific material of the inkjet resist material is not particularly limited. For example, general-purpose inkjet resist materials used for corroding and etching metals on printed circuit boards in the field of electronic components can be used. Various types of inkjet resist materials with different physical properties are commercially available and supplied by companies such as Taiyo Ink Manufacturing Co., Ltd., Mitsui Chemicals, Go-O Chemical Industries, Ltd., JNC Corporation, Nikko Material Co., Ltd., Asahi Kasei Corporation, Agfarewald Japan Ltd., and Tokyo Ohka Kogyo Co., Ltd., and can be selected and used as desired, such as an inkjet resist material with a desired viscosity that chemically reacts and becomes insoluble under ultraviolet irradiation to form a resist-cured film.

[0057] The etching solution used to corrode and etch a desired area of ​​the plate-making substrate 1 is not particularly limited, and a general-purpose etching solution used in the manufacture of pressing processes can be selected and used as desired. The etching solution is not limited, but for example, a general-purpose "ferric chloride aqueous solution" is preferably used. For example, if the printing plate substrate 1 is made of copper, brass, magnesium alloy, iron, or steel, the etching solution is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has been formed using a ferric chloride aqueous solution, and the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has not been attached is etched. For example, if the printing plate substrate is made of resin, plastic, or rubber, an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in the desired area has been formed, using a liquid agent capable of dissolving the resin, plastic, or rubber, to etch the surface of the printing plate substrate 1 where the inkjet resist cured film 3 in the desired area is not attached.

[0058] The method of contacting the surface of the printing plate substrate 1 with the etching solution is not particularly limited. For example, a method of contacting the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 in a desired area has been formed with the etching solution in a shower manner, a method of immersing the printing plate substrate 1 on which the inkjet resist cured film 3 in a desired area has been formed in an etching solution container containing the etching solution, or a paddle blowing method are all preferred contact methods. Furthermore, as the contact time of the etching solution with the surface of the printing plate substrate 1 on which the inkjet resist cured film 3 is formed in the desired area increases, the etching depth of the printing plate substrate increases. Therefore, etching is performed by controlling the etching time to achieve the desired etching depth.

[0059] The resist removal method for removing the inkjet resist cured film in a desired region is not particularly limited, and involves using a liquid agent capable of chemically decomposing the inkjet resist cured film, such as an aqueous sodium hydroxide solution, and bringing the aqueous sodium hydroxide solution into contact with the inkjet resist cured film to chemically decompose, dissolve, swell, and / or peel off the inkjet resist cured film, thereby removing the inkjet resist cured film from the plate-type substrate in which the desired region has been etched.

[0060] Subsequently, after processes such as washing and drying, a recessed corrosion area is formed on the surface of the printing plate substrate 1. As described above, the area covered by the inkjet resist cured film 3 in the desired area remains unetched, and an erosion protrusion is formed as a convex shape, having a shape that protrudes from the bottom surface of the concave shape of the erosion recess formation area. In this way, a pressing plate with an uneven surface shape is manufactured.

[0061] [Dependency Structure 2] In the manufacturing method of the pressing plate of the present invention as described in [Basic Configuration 1] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented. In step (A) of [Basic Configuration 1], the second region surface 12 of the plate-making substrate has one or more smooth, non-irregular areas, and the first region surface 11 of the plate-making substrate has one or more pre-existing irregular areas 4. (i) When the second region surface 12 of the substrate for printing plates has one smooth surface and the first region surface 11 of the substrate for printing plates has one pre-existing uneven surface 4, the smooth surface is located in the area surrounding the pre-existing uneven surface (4), and the pre-existing uneven surface 4 has (a) a pre-existing multiple uneven surface 45 having a plurality of pre-existing multiple uneven surface protrusions 45 formed by a plurality of convex shapes and a plurality of pre-existing multiple uneven surface recesses 452 formed by a plurality of concave shapes, or (b) a pre-existing multiple fine uneven surface 46 having a plurality of pre-existing multiple fine uneven surface protrusions 461 formed by a plurality of fine convex shapes and a plurality of pre-existing multiple fine uneven surface recesses 462 formed by a plurality of fine concave shapes. (ii) When the second region surface 12 of the substrate for printing has a plurality of smooth areas without irregularities, and the first region surface 11 of the substrate for printing has a plurality of pre-existing irregularities 4, each of the plurality of smooth areas is located in the surrounding region of each of the plurality of pre-existing irregularities 4, and each of the plurality of pre-existing irregularities 4 has (a) a plurality of pre-existing multiple irregularities 45 having a plurality of pre-existing multiple irregularity protrusions 451 formed by a plurality of convex shapes and a plurality of pre-existing multiple irregularity recesses 452 formed by a plurality of concave shapes, and / or (b) a plurality of pre-existing multiple fine irregularities 46 having a plurality of pre-existing multiple fine irregularity protrusions 461 formed by a plurality of fine convex shapes and a plurality of pre-existing multiple fine irregularity recesses 462 formed by a plurality of fine concave shapes.

[0062] In step (B) of [Basic Configuration 1], the process includes a desired region inkjet resist film formation step, in which an inkjet resist material 2 is attached by an inkjet method to cover the pre-existing uneven portion 4 on the surface 11 of the first region of the printing substrate 1 to form a desired region inkjet resist film, and a desired region inkjet resist cured film formation step, in which the desired region inkjet resist film is cured to form a desired region inkjet resist cured film 3.

[0063] In step (C) of [Basic Configuration 1], an etching step for the plate-making substrate is provided, in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the inkjet resist cured film 3 in the desired area is formed, and the surface of the second area 12 of the plate-making substrate, on which the inkjet resist cured film in the desired area is not attached, is etched, thereby forming the inkjet resist film corrosion second recess-forming portion 121 which is formed in a recessed shape, without etching the pre-existing uneven portion 4. Here, the "inkjet resist film corrosion second recess forming portion 121" formed in a recessed shape corresponds to the "corrosion recess forming portion" formed in a recessed shape in the "basic configuration 1" described above. In step (D) of [Basic Configuration 1], a desired region inkjet resist curing film removal step is provided for removing the desired region inkjet resist curing film 3.

[0064] As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the pre-existing uneven portion 4, forming the inkjet resist film corrosion second recess-forming portion 121 which is formed in a recessed shape, and the pre-existing uneven portion 4 is formed into a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121. In this way, a plate for pressing is manufactured. In addition, the "inkjet resist film corrosion second recess formation section 121" in this dependent configuration 2 corresponds to the "corrosion recess formation section" in the basic configuration 1 described above.

[0065] In this configuration, as mentioned above, the viscosity of the inkjet resist material 2 is not particularly limited. For example, an inkjet resist material 2 having a viscosity of 5 mPa·s to 100 mPa·s (25°C) is preferred, and more preferably 10 mPa·s to 50 mPa·s (25°C) is preferred. As the viscosity of the inkjet resist material 2 decreases, the thickness of the inkjet resist film tends to decrease, and as the viscosity of the inkjet resist material 2 increases, the thickness of the inkjet resist film tends to increase. An inkjet resist material having a viscosity that allows for the formation of an inkjet resist film of the desired thickness required for its function as a corrosion etching mask is selected and used. By using an inkjet resist material 2 having optimal viscosity, it becomes possible to form an inkjet resist film with a desired thickness and high precision on a desired area of ​​the surface of the printing plate substrate. Furthermore, for example, when a printing plate substrate with multiple pre-existing uneven areas 4 is used, the inkjet resist material attached to each side of the multiple pre-existing multiple uneven areas convex portions 451 formed by multiple convex shapes and multiple pre-existing multiple uneven areas recessed portions 452 formed by multiple concave shapes, and / or multiple pre-existing multiple fine uneven areas convex portions 461 formed by multiple fine convex shapes and multiple pre-existing multiple fine uneven areas recessed portions 462 formed by multiple fine concave shapes does not drip off, and an inkjet resist film is formed on each side of the desired area. Furthermore, the inkjet resist film attached to the desired area acts as a partial protective film on the sides of the multiple pre-existing multiple protrusions 451 and multiple pre-existing multiple recesses 452, and / or multiple pre-existing multiple fine protrusions 461 and multiple pre-existing multiple fine recesses 462 of the uneven surface during corrosion etching of the printing plate substrate. As a result, corrosion etching of the sides of the multiple pre-existing multiple protrusions 451 and multiple pre-existing multiple recesses 452, and / or multiple pre-existing multiple fine protrusions 461 and multiple pre-existing multiple fine recesses 462 is suppressed, and a significant effect is achieved in that only the desired area around the pre-existing uneven surface 4 can be etched.

[0066] The configuration of the present invention provides the aforementioned "(Manufacturing method effect a: Effect that enables the formation of a desired uneven surface shape using an inkjet resist)," and in particular, "(Manufacturing method effect a-a: Effect that enables the formation of a desired uneven portion having a protruding shape using an inkjet resist) a chemical corrosion etching process that produces a plate for pressing with a desired shape, having a recess, a projection protruding from the recess, and on the surface of the projection a plurality of pre-existing multiple uneven portions having a plurality of pre-existing multiple uneven recesses and a plurality of pre-existing multiple uneven protrusions, and / or a plurality of pre-existing multiple fine uneven portions having a plurality of pre-existing multiple fine uneven protrusions and a plurality of pre-existing multiple fine uneven recesses, and suppressing corrosion etching of the "area of ​​the plate-making substrate that must not be etched"."

[0067] The method for manufacturing a pressing plate according to the present invention will be described below with reference to the drawings. In the drawings, the shape, size, dimensions, etc. of the pressing plate and its components are not shown precisely, but are schematic outlines to explain the characteristics such as shape, structure, system, and effects.

[0068] [Dependency Structure 3] In the manufacturing method of the pressing plate of the present invention as described in [Basic Configuration 1] above, it is preferable that a manufacturing method of the pressing plate comprising the following "Dependent Configuration 3" can be implemented. Figures 1 and 2 are schematic diagrams illustrating the manufacturing process of a method for manufacturing a pressing plate according to one embodiment of the present invention. Figures 1 and 2 show schematic planar diagrams (Ab), (Bb), (Cb), and (Db) respectively, while (A), (B), (C), and (D) are schematic cross-sectional diagrams along line AA of the schematic planar diagrams. Figure 3 is a schematic diagram illustrating the manufacturing process of a method for manufacturing a pressing plate according to another embodiment of the present invention, where (A), (B), (C), and (D) in Figure 3 are schematic cross-sectional diagrams.

[0069] In step (A) of the aforementioned dependent configuration 2, as shown in Figures 1, 2(A), (Ab), and 3(A), the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing uneven surface 4, and the second region surface 12 of the plate-making substrate is located in the peripheral region of the first region surface 11. The pre-existing uneven surface 4 has a plurality of pre-existing uneven surfaces 45. (i) The pre-existing multiple recessed portion 45 has a plurality of pre-existing multiple recessed portion protrusions 451 formed with a plurality of convex shapes and a plurality of pre-existing multiple recessed portion recesses 452 formed with a plurality of concave shapes, the plurality of pre-existing multiple recessed portion protrusions 451 has a plurality of pre-existing multiple recessed portion protrusion upper surfaces 451a and a plurality of pre-existing multiple recessed portion protrusion side surfaces 451b, and the plurality of pre-existing multiple recessed portion recesses 452 has a plurality of pre-existing multiple recessed portion recess bottom surfaces 452c and a plurality of pre-existing multiple recessed portion recess side surfaces 452b. Here, the multiple pre-existing protruding surface 451b and the multiple pre-existing recessed surface 452b correspond to the same surface region.

[0070] In step (B) of the dependent configuration 2 described above, as shown in Figures 1, 2(B), (Bb), and 3(B), the inkjet resist material 2 is applied by an inkjet method to cover the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, and the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, thereby forming an inkjet resist film attached to the upper surface of the uneven parts, an inkjet resist film attached to the side surfaces of the uneven parts, and an inkjet resist film attached to the bottom surface of the inkjet recess. Here, the inkjet resist material 2 is not applied to the surface 12 of the second region of the plate-making substrate located in the area surrounding the multiple pre-existing multiple uneven parts 45. The (B) step further comprises a desired region inkjet resist curing film step, in which the inkjet resist upper surface adhering film, the inkjet resist side surface adhering film, and the inkjet resist bottom surface adhering film are cured to form a desired region inkjet resist cured film 3 having a desired region inkjet resist upper surface cured film 3a, a desired region inkjet resist side surface cured film 3b, and a desired region inkjet resist bottom surface cured film 3c. In this way, a desired region inkjet resist cured film 3 is formed, having a cured upper surface film 3a of the desired region inkjet resist protrusions, a cured side surface film 3b of the desired region inkjet resist protrusions, and a cured bottom surface film 3c of the desired region inkjet resist recesses.

[0071] Here, since the multiple pre-existing multiple uneven surface areas (convex side surfaces 451b) and the multiple pre-existing multiple uneven surface areas (concave side surfaces 452b) correspond to the same side surface region, the inkjet resist convex side surface attachment film and the inkjet resist concave side surface attachment film correspond to the same attachment film, and the desired region inkjet resist convex side surface cured film 3b means the same cured film as the desired region inkjet resist concave side surface cured film.

[0072] In step (C) of the dependent configuration 2 described above, as shown in Figures 1, 2(C), (Cb), and 3(C), an etching solution is brought into contact with the surface of the plate-making substrate 1 on which a hardened film 3a on the upper surface of the desired region inkjet resist protrusions, a hardened film 3b on the side surface of the desired region inkjet resist protrusions, and a hardened film 3c on the bottom surface of the desired region inkjet resist recesses have been formed, thereby etching the surface 12 of the second region of the plate-making substrate on which the hardened film 3 of the desired region inkjet resist is not attached. As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the pre-existing multiple uneven portions 45, forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recessed shape, and the pre-existing multiple uneven portions 45 are formed into inkjet film corrosion pre-existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

[0073] In step (D) of the aforementioned dependent configuration 2, as shown in Figures 1, 2(D) and (Db), and 3(D), a resist curing film removal step is included in which the upper surface curing film 3a of the desired region inkjet resist protrusions, the side surface curing film 3b of the desired region inkjet resist protrusions, and the bottom surface curing film 3c of the desired region inkjet resist are removed.

[0074] As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the pre-existing multiple recesses 45, and the first region surface 11 of the plate-making substrate, which has a pre-existing multiple recesses 45 having a plurality of pre-existing multiple recesses 451 and a plurality of pre-existing multiple recesses 452, is formed in the form of an inkjet film corrosion pre-existing multiple recesses projection portion 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. As shown in Figures 1, 2(D), (Db), and 3(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "D12", and the depth dimensions of the multiple pre-existing multiple uneven portions convex portions 451 and the multiple pre-existing multiple uneven portions concave portions 452 each maintain the initial depth dimension "D1". In this way, a plate for pressing is manufactured.

[0075] This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a desired uneven surface shape using an inkjet resist)," and in particular, "(Manufacturing method effect A-a: Effect that enables the formation of a desired uneven portion having a protruding shape using an inkjet resist) a chemical corrosion etching process that produces a pressing plate having a desired shape, in which a recess, a projection protruding from the recess, and a plurality of pre-existing multiple uneven portions having a plurality of pre-existing multiple uneven recesses and a plurality of pre-existing multiple uneven protrusions on the surface of the projection, are formed, and corrosion etching of the "area of ​​the plate-making substrate that must not be etched" is suppressed." In other words, the second recessed portion 121 of the inkjet resist film, which is formed by corrosion etching, is formed, and the effect is obtained that "corrosion etching of the convex side surface 451b (the same side surface as the concave side surface 452b of the multiple pre-existing multiple uneven parts) which is an area of ​​the plate-making substrate that should not be etched is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape."

[0076] The manufacturing processes for the pressing plates shown in Figures 1, 2, and 3 differ from each other in the following respects.

[0077] In the manufacturing process of the pressing plate shown in Figure 1, in step (A), the recessed portion 452 of the pre-existing multiple uneven portion 45 in Figure 1(A) has a depth of "D1", and the surface 12 of the second region of the plate mold substrate has the same height as the upper surface 451a of the pre-existing multiple uneven portion 45. In step (B), as shown in Figure 1(B), an inkjet resist cured film 3 is formed to cover all areas of the pre-existing multiple uneven surfaces, including the convex side surfaces 451b, the concave bottom surfaces 452c, and the concave side surfaces 452b. (C) In step (C), as shown in Figure 1(C), the areas where the inkjet resist cured film 3 has not been formed in the desired area are etched by corrosion to form the inkjet resist film corrosion second recess formation area 121. In step (D), as shown in Figure 1(D), the inkjet resist cured film 3 in the desired region is removed, thereby forming the inkjet film corrosion multiple uneven portion protrusions 455 which have a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. In other words, as shown in Figure 1(D), the surrounding region of the pre-existing multiple uneven portions 45 maintains the depth "D1" of the initial pre-existing multiple uneven portion recess bottom surface 452c, and a second inkjet resist film corrosion recess forming portion 121 having a depth "D12" is formed in the surrounding region, thereby forming an inkjet film corrosion pre-existing multiple uneven portion protrusion portion 455 that protrudes from the second inkjet resist film corrosion recess forming portion 121.

[0078] In the manufacturing process for the pressing plate shown in Figure 2, in step (A), the pre-existing multiple recesses 452 of the pre-existing multiple recesses 45 in Figure 2(A) have a depth of "D1", and the second region surface 12 of the plate mold substrate has the same height shape as the bottom surface of the pre-existing multiple recesses 452c of the pre-existing multiple recesses 45. This height shape of the second region surface 12 of the plate mold substrate is different from the height shape of the second region surface 12 of the plate mold substrate in Figure 1(A). In step (B), as shown in Figure 2(B), a desired region inkjet resist cured film 3 is formed by covering all areas of the pre-existing multiple uneven surface convex side surface 451b, the multiple pre-existing multiple uneven surface recess bottom surface 452c, and the multiple pre-existing multiple uneven surface recess side surface 452b. (C) In step (C), as shown in Figure 2(C), the areas where the inkjet resist cured film 3 has not been formed in the desired region are etched by corrosion to form the inkjet resist film corrosion second recess formation portion 121. In step (D), as shown in Figure 2(D), the inkjet resist cured film 3 in the desired region is removed, thereby forming the inkjet film corrosion multiple uneven portion protrusions 455 which have a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. In other words, as shown in Figure 2(D), the surrounding region of the pre-existing multiple uneven portions 45 forms an inkjet resist film corrosion second recess formation portion 121 having a depth "D12", and the pre-existing multiple uneven portions 45 are formed on an inkjet film corrosion pre-existing multiple uneven portion projection 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.

[0079] In the manufacturing process for a pressing plate shown in Figure 3, in step (A), as shown in Figure 3(A), the second region surface 12 of the plate mold substrate has multiple smooth, even areas, and the first region surface 11 of the plate mold substrate has multiple pre-existing uneven areas 4. Each of the multiple pre-existing uneven surfaces 4 has a pre-existing multiple uneven surface 45, and the pre-existing multiple uneven surface recess 452 of the pre-existing multiple uneven surface 45 has a depth (same as the height of the pre-existing multiple uneven surface protrusion 451) of "D1". Each smooth, non-irregular surface of the second region surface 12 of the substrate for printing plates has the same height and shape as the upper surface 451a of the pre-existing multiple irregular portions 45. In step (B), as shown in Figure 3(B), a desired region inkjet resist cured film 3 is formed to cover all areas of each of the pre-existing multiple uneven surfaces, including the convex side surface 451b, the concave bottom surface 452c, and the concave side surface 452b. Furthermore, the desired region inkjet resist cured film 3 is also formed on the area of ​​the second region surface 12 of the printing substrate, which is only the area surrounding the pre-existing multiple uneven surfaces 45. In this case, the desired region inkjet resist cured film 3 is not formed on the central area of ​​the second region surface 12 of the printing substrate, which is located between adjacent pre-existing multiple uneven surfaces 45. (C) In step (C), as shown in Figure 3(C), the areas where the inkjet resist cured film 3 has not been formed in the desired region are etched by corrosion to form the inkjet resist film corrosion second recess formation portion 121. In step (D), as shown in Figure 3(D), the inkjet resist cured film 3 in the desired region is removed, thereby forming a plurality of inkjet resist film corrosion second recess formation portions 121, and the plurality of pre-existing uneven portions 45 are formed in the form of inkjet film corrosion pre-existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portions 121. In other words, as shown in Figure 3(D), multiple inkjet resist film corrosion second recess formation portions 121 having a depth "D12" are formed, and multiple inkjet film corrosion pre-existing multiple uneven portion protrusions 455 are formed, each of which maintains the initial depth "D1" of the bottom surface 452c of the pre-existing multiple uneven portion recess.

[0080] In Figures 1, 2, and 3, "D1" represents the height dimension of the protrusions 451 and the depth dimension of the recesses 452 of the existing multiple uneven surfaces. Since the depth of the recesses 452 of the existing multiple uneven surfaces represents the same area as the height of the protrusions 451, the depth dimension of the recesses 452 of the existing multiple uneven surfaces has the same "D1" as the height dimension of the protrusions 451. "W1" indicates the width dimension of the protrusions 451 of the pre-existing multiple recessed parts, and "W2" indicates the width dimension of the recesses 452 of the pre-existing multiple recessed parts.

[0081] [Dependency Structure 4] In the manufacturing method of the pressing plate described in [Dependent Configuration 3] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented. In step (A) above, the pre-existing multiple uneven portion 45 having pre-existing multiple uneven portion protrusions 451 and pre-existing multiple uneven portion recesses 452 forms a graphic character picture pattern, which is formed by at least one uneven shape selected from the group consisting of (a) letters, (b) symbols, (c) figures, (d) patterns, and (e) designs.

[0082] This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a desired dimensional uneven surface shape using inkjet resist)" and "(Manufacturing method effect A-a: Effect that enables the formation of a desired dimensional uneven part having a protruding shape using inkjet resist)," and in particular, "(Manufacturing method effect A-ab: Effect that enables the manufacture of a pressing plate having a surface formed of recesses, protrusions, and / or uneven parts having a desired graphic, character, or pattern shape) having a desired dimensional shape, (a) characters, (b) symbols, (c) figures, (d) patterns The effect is obtained that it is possible to manufacture a pressing plate having a surface formed of recesses, protrusions, and / or uneven surfaces having desired graphic character patterns such as (e) patterns, and that corrosion etching of areas that should not be etched is suppressed, and it is possible to manufacture a pressing plate having the desired shape and desired size dimensions, such as the desired height dimension of the protrusions, the depth dimension of the recesses, the desired height dimension and depth dimension of the uneven surfaces, etc. In particular, "side etching," which occurs when "the sides of each pre-existing multiple uneven surface, specifically the convex side surface 451b and the concave side surface 452b," are corroded and etched, is suppressed.

[0083] [Dependency Structure 5] In the manufacturing method of the pressing plate of the above-described [dependent configuration 3] and / or [dependent configuration 4], the respective shapes and dimensions are not particularly limited, but for example, a manufacturing method of the pressing plate having the following configuration is preferably implementable. In step (A) of the above-described [dependent configuration 3] and / or [dependent configuration 4], the height dimension "D1" of each of the multiple pre-existing multiple protrusions 451 is not particularly limited, but is preferably 0.1 mm or more, more preferably 0.1 mm to 3.0 mm, even more preferably 0.3 mm to 2.0 mm, and even more preferably 0.5 mm to 1.0 mm. The width dimension "W1" of each of the multiple pre-existing multiple recessed or protruding parts 451 is not particularly limited. The depth dimension "D1" of each of the multiple pre-existing multiple recesses 452 is not particularly limited, but is preferably 0.1 mm or more, more preferably 0.1 mm to 3.0 mm, even more preferably 0.3 mm to 2.0 mm, and even more preferably 0.5 mm to 1.0 mm. The width dimension "W2" of each of the multiple pre-existing multiple recesses 452 is not particularly limited. Here, the depth of the pre-existing multiple recessed portion recess 452 is the same as the height of the pre-existing multiple protruding portion protruding portion 451, and the depth dimension "D1" of the pre-existing multiple recessed portion recess 452 is the height dimension "D1" of the pre-existing multiple protruding portion protruding portion 451. If the depth dimension "D1" of the pre-formed multiple uneven recesses 452 (the height dimension "D1" of the pre-formed multiple uneven protrusions 451) is less than 0.1 mm, when a workpiece is pressed using a pressing plate with the pre-formed multiple uneven protrusions 45, it tends not to be possible to obtain a workpiece with an uneven shape having the pre-formed multiple uneven recesses 452 of the desired depth and the pre-formed multiple uneven protrusions 451 of the desired height.

[0084] Generally, for flat-pressure type pressing devices, a plate-type plate-type pressing device base with a thickness of 7 mm is commonly used, corresponding to the movable stroke of the base. Then, taking into account the thickness of the workpiece to be processed, the depth of the uneven parts, etc., a pressing plate having a depth dimension "D1" of the pre-existing multiple uneven recesses 452 is manufactured. From this viewpoint, a depth dimension "D1" of the pre-existing multiple uneven recesses 452 is preferably 0.1 mm to 3 mm.

[0085] The depth dimension "D12" of the second recess-forming portion 121 of the inkjet resist film corrosion is not particularly limited, but is greater than the depth dimension "D1" of the aforementioned multiple recessed portions, and is preferably 1.0 mm or more, more preferably 1.5 mm to 5 mm, and even more preferably 1.8 mm to 3 mm. When the depth dimension "D12" of the second recess formation portion 121 of the inkjet resist film corrosion is smaller than the depth dimension "D1" of the pre-existing multiple uneven portion recess 452, when a workpiece is pressed using a pressing plate on which the pre-existing multiple uneven portion 45 has been formed, the area of ​​the pre-existing multiple uneven portion 45 on the pressing plate tends not to be able to press the surface of the workpiece to the desired depth, and a workpiece processed with an uneven shape having the pre-existing multiple uneven portion recess 452 of the desired depth and the pre-existing multiple uneven portion protrusion 451 of the desired height tends not to be obtained.

[0086] Generally, as a conventional technique, if the dimensions of each part of the pre-existing multiple protrusions 45 do not fall within the above range, it tends to become impossible to process the workpiece into the desired shape. However, in the present invention, it is possible to carry out the process even if the dimensions do not fall within the above range, although in this case, it tends to be more difficult to obtain a workpiece with the desired shape compared to when the dimensions fall within the above range.

[0087] Figure 8 is a schematic diagram illustrating the shape of a graphic character pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. In the present invention, a pressing plate equipped with multiple inkjet-etched pre-formed uneven protrusions 455 is also possible. For example, a pressing plate equipped with multiple inkjet-etched pre-formed uneven protrusions 455 as shown in Figure 8(A) is possible. In Figure 8, the "ABCDE pattern," "heart pattern," and "star pattern" shown in black are pressing plates formed as inkjet-etched pre-formed uneven protrusions 455.

[0088] [Dependency Structure 6] In the manufacturing method of the pressing plate of the present invention described in [Basic Configuration 1] above, it is preferable that a manufacturing method of the pressing plate comprising the following "Dependent Configuration 6" can be implemented. Figures 4 and 6 are schematic diagrams illustrating the manufacturing process for a method of manufacturing a pressing plate according to one embodiment of the present invention. Figures 4(Ab), (Bb), (Cb), and (Db) are schematic planar diagrams, and (A), (B), (C), and (D) are schematic cross-sectional diagrams along line BB of the schematic planar diagram. In Figure 4, the schematic plan view and the schematic cross-sectional view do not represent identical convex and concave shapes. For example, the "heart pattern" in the schematic plan view is formed by multiple fine convex and concave shapes as shown in the schematic cross-sectional view, illustrating a structure that forms a heart pattern as a whole. Furthermore, the number of convex and concave shapes in the schematic cross-sectional view does not correspond to the number of convex and concave shapes forming the "heart pattern" in the schematic plan view. In reality, the number of concave and convex shapes in the schematic cross-sectional view is significantly greater than the number shown.

[0089] As shown in Figures 4(A) and 4(Ab), in step (A) of the aforementioned dependent configuration 2, the plate-making substrate 1 has a first plate-making substrate surface area 11 and a second plate-making substrate surface area 12, the second plate-making substrate surface area 12 has a smooth surface without irregularities, and the first plate-making substrate surface area 11 has a pre-existing irregularity 4. The second plate-making substrate surface area 12 is located in the peripheral region of the first plate-making substrate surface area 11. In Figure 4, the first region surface 11 of the substrate for printing plates has a single pre-existing uneven surface 4. (b) The pre-existing uneven portion 4 has a plurality of pre-existing fine uneven portions 46, the plurality of pre-existing fine uneven portions 46 has a plurality of pre-existing fine uneven portion protrusions 461 and a plurality of pre-existing fine uneven portion recesses 462, the plurality of pre-existing fine uneven portion protrusions 461 has a plurality of pre-existing fine uneven portion upper surfaces 461a and a plurality of pre-existing fine uneven portion protrusion sides 461b, and the plurality of pre-existing fine uneven portion recesses 462 has a plurality of pre-existing fine uneven portion bottom surfaces 462c and a plurality of pre-existing fine uneven portion recess sides 462b. Here, the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 462b correspond to the same side region. As shown in Figure 4(A), the thickness dimension of the plate-making substrate 1 is "h", the depth dimension "d1" of each of the multiple pre-made multiple fine uneven recesses 462 is "w2", and the width dimension is "w2". Similarly, the height dimension "d1" of each of the multiple pre-made multiple fine uneven protrusions 461 is "w1". Here, the depth of the pre-made multiple fine uneven recesses 462 is the same as the height of the pre-made multiple fine uneven protrusions 461, and the depth dimension "d1" of the pre-made multiple fine uneven recesses 462 is the same as the height dimension "d1" of the pre-made multiple fine uneven protrusions 461.

[0090] As shown in Figures 4(B) and 4(Bb), step (B) includes an inkjet resist film formation step in which an inkjet resist material 2 is applied by an inkjet method to cover the upper surfaces 461a of the multiple pre-existing multiple fine uneven parts, the side surfaces 461b of the multiple pre-existing multiple fine uneven parts, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven parts, thereby forming an inkjet resist film attached to the upper surface of the fine uneven parts, an inkjet resist film attached to the side surfaces of the fine uneven parts, and an inkjet resist film attached to the bottom surface of the fine uneven parts. Here, the inkjet resist material 2 is not applied to the surface 12 of the second region of the plate-making substrate located in the area surrounding the pre-existing multiple fine uneven parts 46. Furthermore, the method includes an inkjet resist curing film formation step, in which an inkjet resist curing film is formed by curing the inkjet resist fine protrusion upper surface film, the inkjet resist fine protrusion side surface film, and the inkjet resist fine recess side surface film to form a desired region inkjet resist curing film 3 having a desired region inkjet resist fine protrusion upper surface curing film 3e, a desired region inkjet resist fine protrusion side surface curing film 3f, and a desired region inkjet resist fine recess bottom surface curing film 3g. In this way, a desired region inkjet resist cured film 3 is formed, having a desired region inkjet resist upper surface cured film 3e of the desired region inkjet resist fine protrusions, a desired region inkjet resist side surface cured film 3f of the desired region inkjet resist fine protrusions, and a desired region inkjet resist bottom surface cured film 3g of the desired region inkjet resist fine recesses.

[0091] Here, since the multiple pre-existing fine multiple uneven surface areas (convex side surfaces 461b) and the multiple pre-existing fine multiple uneven surface areas (concave side surfaces 462b) correspond to the same side surface region, the inkjet resist fine convex side surface attachment film and the inkjet resist fine concave side surface attachment film correspond to the same attachment film, and the desired region inkjet resist fine convex side surface cured film 3f means the same cured film as the desired region inkjet resist fine concave side surface cured film.

[0092] As shown in Figures 4(C) and (Cb), step (C) includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1, which has a hardened upper surface film 3e of the desired region inkjet resist fine protrusions, a hardened side surface film 3f of the desired region inkjet resist fine protrusions, and a hardened bottom surface film 3g of the desired region inkjet resist fine recesses, to etch the second region surface 12 of the plate-making substrate to which the hardened upper surface film 3 of the desired region inkjet resist is not attached. As a result, without etching the existing multiple fine uneven areas 46, the surface 12 of the second region of the plate-making substrate is etched to a depth dimension of "d12", forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the existing multiple fine uneven areas 46 are formed into inkjet film corrosion existing multiple fine uneven area protrusions 466 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

[0093] As shown in Figures 4(D) and (Db), step (D) includes a resist curing film removal step in which the upper surface curing film 3e of the desired region inkjet resist fine protrusions, the side surface curing film 3f of the desired region inkjet resist fine protrusions, and the bottom surface curing film 3g of the desired region inkjet resist fine recesses are removed. As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the existing multiple fine uneven portions 46, and the first region surface 11 of the plate-making substrate, which has an existing multiple fine uneven portion 46 having a plurality of existing multiple fine uneven portion protrusions 461 and a plurality of existing multiple fine uneven portion recesses 462, is formed in the form of an inkjet film corrosion existing multiple fine uneven portion protrusion 466 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. As shown in Figure 4(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "d12", and the depth dimensions of the multiple pre-existing multiple fine unevenness portions convex portions 461 and the multiple pre-existing multiple fine unevenness portions concave portions 462 each maintain the initial depth dimension "d1". In this way, a plate for pressing is manufactured.

[0094] This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a desired uneven surface shape using an inkjet resist)," and in particular, "(Manufacturing method effect A-b: Effect that enables the formation of a desired number of pre-existing fine uneven parts having a protruding shape using an inkjet resist) Effect that enables the manufacture of a pressing plate having a desired shape, in which a recess and a projection protruding from the recess and a plurality of pre-existing fine uneven parts having a plurality of pre-existing multiple fine uneven recesses and a plurality of pre-existing multiple fine uneven protrusions on the surface of the projection are formed, and corrosion etching of the "area of ​​the plate-making substrate that must not be etched" is suppressed." In other words, the second recessed portion 121 of the inkjet resist film, which is formed by corrosion etching, is formed, and the effect is obtained that "corrosion etching of the convex side surface 461b (the same side surface as the concave side surface 462b of the multiple pre-existing multiple fine uneven parts) which is a region of the plate-making substrate that should not be etched is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape." In particular, "side etching," which occurs when "the sides of each pre-existing multiple micro-protrusion convex portion 461b and each pre-existing multiple micro-protrusion concave portion 462b," which are areas that should not be etched, is suppressed.

[0095] In the "dependent configuration 6" described above, it is also possible to implement a configuration in which the first region surface 11 of the plate-making substrate has a plurality of pre-existing uneven portions 4. Figures (Ab), (Bb), (Cb), and (Db) in Figure 6 are schematic planar diagrams, and (A), (B), (C), and (D) are schematic cross-sectional diagrams along line BB of the schematic planar diagram. In step (A) of the aforementioned "dependent configuration 2", the plate mold substrate 1 has a first plate mold substrate surface area 11 and a second plate mold substrate surface area 12, the second plate mold substrate surface area 12 has a smooth surface without irregularities, and the first plate mold substrate surface area 11 has a plurality of pre-existing irregularities 4. In Figure 6, the first region surface 11 of the plate-making substrate has a plurality of pre-existing uneven surfaces 4. (b) Each of the multiple pre-existing uneven surfaces 4 has multiple pre-existing fine uneven surfaces 46, and each of the multiple pre-existing fine uneven surfaces 461 has multiple pre-existing fine uneven surface protrusions 461 and multiple pre-existing fine uneven surface recesses 462, each of the multiple pre-existing fine uneven surface protrusions 461 has multiple pre-existing fine uneven surface upper surfaces and multiple pre-existing fine uneven surface side surfaces, and each of the multiple pre-existing fine uneven surface recesses 462 has multiple pre-existing fine uneven surface bottom surfaces and multiple pre-existing fine uneven surface recess side surfaces. Here, the side surfaces of the multiple pre-existing multiple micro-uneven areas and the side surfaces of the multiple pre-existing multiple micro-uneven areas correspond to the same side surface region.

[0096] As shown in Figures 6(B) and (Bb), step (B) includes an inkjet resist film formation step in which an inkjet resist material 2 is applied by an inkjet method to cover the upper surfaces of multiple pre-existing multiple fine uneven parts, the side surfaces of multiple pre-existing multiple fine uneven parts (the side surfaces of multiple pre-existing multiple fine uneven parts), and the bottom surfaces of multiple pre-existing multiple fine uneven parts, thereby forming an inkjet resist film attached to the upper surface of the fine uneven parts, an inkjet resist film attached to the side surfaces of the fine uneven parts, and an inkjet resist film attached to the bottom surface of the fine uneven parts. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the plate-making substrate located in the area surrounding the pre-existing multiple fine uneven parts 46. Furthermore, the method includes a desired region inkjet resist curing film formation step, in which the inkjet resist fine protrusion upper surface film, the inkjet resist fine protrusion side surface film, and the inkjet resist fine recess bottom surface film are cured to form a desired region inkjet resist fine protrusion upper surface cured film 3e, a desired region inkjet resist fine protrusion side surface cured film 3f, and a desired region inkjet resist fine recess bottom surface cured film 3g.

[0097] As shown in Figures 6(C) and (Cb), step (C) includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1, which has a hardened upper surface film 3e of the desired region inkjet resist fine protrusions, a hardened side surface film 3f of the desired region inkjet resist fine protrusions, and a hardened bottom surface film 3g of the desired region inkjet resist fine recesses, to etch the second region surface 12 of the plate-making substrate to which the hardened upper surface film 3e of the desired region inkjet resist does not adhere. As a result, without etching the multiple pre-existing multiple fine uneven areas 46, the surface 12 of the second region of the plate-making substrate is etched to a depth dimension of "d12", forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recess shape, and the multiple pre-existing multiple fine uneven areas 46 are formed into inkjet film corrosion pre-existing multiple fine uneven area protrusions 466 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

[0098] As shown in Figures 6(D) and (Db), step (D) includes a resist hardening film removal step in which the hardened film 3e on the upper surface of the fine protrusions of the desired region of inkjet resist, the hardened film 3f on the side of the fine protrusions of the desired region of inkjet resist, and the hardened film 3g on the bottom surface of the fine recesses of the desired region of inkjet resist are removed. As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the multiple pre-existing multiple fine uneven portions 46, and the first region surface 11 of the plate-making substrate, each having multiple pre-existing multiple fine uneven portions 46 having multiple pre-existing multiple fine uneven portions protrusions 461 and multiple pre-existing multiple fine uneven portions recesses 462, is formed in the form of inkjet film corrosion pre-existing multiple fine uneven portion protrusions 466 that protrude from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. As shown in Figure 6(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "d13", and the depth dimensions of the multiple pre-existing multiple fine unevenness portions convex portions 461 and the multiple pre-existing multiple fine unevenness portions concave portions 462 each maintain the initial depth dimension "d1". In this way, a plate for pressing is manufactured.

[0099] This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a surface shape with irregularities of desired dimensions using an inkjet resist)," and in particular, the aforementioned "(Manufacturing method effect A-b: Effect that enables the formation of multiple pre-existing fine irregularities of desired dimensions having a protruding shape using an inkjet resist)."

[0100] [Dependency Structure 9] In the manufacturing method of the pressing plate of the present invention described in [Dependent Configuration 6] above, preferably, a manufacturing method of the pressing plate comprising the following "Dependent Configuration 10" can be implemented. Figure 5 is a schematic diagram illustrating a plurality of pre-existing fine irregularities formed on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. Figure 5(Ab) is a schematic plan view, (Aa) is a schematic cross-sectional view along line BB of the schematic plan view, and Figure 5(B) is a schematic enlarged view of the area enclosed by the circle in Figure 5(Ab). Figure 5(Aa) corresponds to Figure 4(D), and Figure 5(Ab) corresponds to Figure 4(Db). In Figures 4 and 5, the inkjet film corrosion pre-existing fine uneven protrusions 466 are formed in a form that protrudes from the inkjet film corrosion second recess formation portion 121, which has an etched and recessed shape. On the surface of the inkjet film corrosion pre-existing fine uneven protrusions 466, a plurality of pre-existing fine uneven protrusions 461 and a plurality of pre-existing fine uneven recesses 462 are formed. However, in Figures 4 and 5, the shapes of the multiple pre-existing multiple micro-recesses 461 and multiple pre-existing multiple micro-recesses 462 of the inkjet film corrosion-affected multiple micro-recesses 466 do not represent the exact shape or dimensions, but rather show a schematic general shape to explain the shape configuration.

[0101] The height dimension "d1" of each of the multiple pre-existing multiple fine uneven surfaces and protrusions 461 is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.05 mm to 1 mm, even more preferably 0.05 mm to 0.5 mm, and even more preferably 0.08 mm to 0.3 mm. The width dimension "w1" of each of the multiple pre-existing multiple fine uneven surfaces and protrusions 461 is not particularly limited, but is preferably 0.0005 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.05 mm to 0.1 mm.

[0102] The depth dimension "d1" of each of the multiple pre-existing multiple fine uneven recesses 462 is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.05 mm to 1 mm, even more preferably 0.05 mm to 0.5 mm, and even more preferably 0.08 mm to 0.3 mm. Furthermore, the depth of the recessed portion of the pre-existing multiple micro-ridges is the same as the height of the protruding portion of the pre-existing multiple micro-ridges, and the height dimension "d1" of the protruding portion of the pre-existing multiple micro-ridges is the same as the depth dimension "d1" of the recessed portion of the pre-existing multiple micro-ridges. The width dimension "w2" of each of the multiple pre-existing multiple fine uneven recesses 462 is not particularly limited, but is preferably 0.0005 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.05 mm to 0.1 mm. If the depth dimension "d1" of the recessed portion of the pre-existing multiple micro-recesses (the height dimension "d1" of the convex portion of the pre-existing multiple micro-recesses) is less than 0.05 mm, when a workpiece is pressed using a pressing plate with the pre-existing multiple micro-recesses formed on it, it tends not to be possible to obtain a workpiece with a textured shape having the pre-existing multiple micro-recessed recesses of the desired depth and the pre-existing multiple micro-recessed convex portion of the desired height. As the depth dimension "d1" of the recessed portion of the pre-existing multiple micro-recesses (the height dimension "d1" of the protruding portion of the pre-existing multiple micro-recesses) increases, it becomes possible to obtain a workpiece with the desired excellent dimensional accuracy of the micro-recessed shape when pressing a workpiece using a pressing plate with multiple pre-existing multiple micro-recesses formed thereon. As "d1" exceeds 1 mm, for example, when foil stamping is performed using a sheet-like foil material, the proportion of problems such as the sheet-like foil material tearing during pressing tends to increase.

[0103] Multiple of these pre-existing multiple micro-recesses 461 and multiple micro-recesses 462 come together to form an inkjet film corrosion pre-existing multiple micro-recess protrusion 466. The number of multiple pre-existing multiple micro-recesses 461 and multiple micro-recesses 462 is not particularly limited, but for example, it is between 10 and 10,000.

[0104] The depth dimension "d12" of the second recess-forming portion 121 of the inkjet resist film corrosion is not particularly limited, but is greater than the depth dimension "d1" of the pre-existing multiple fine uneven recesses, and is preferably 1.0 mm or more, more preferably 1.5 mm to 5 mm, and even more preferably 1.8 mm to 2 mm. When the depth dimension "d12" of the inkjet resist film corrosion second recess formation portion 121 is smaller than the depth dimension "d1" of the pre-existing multiple fine uneven recess portion recess 462, when a workpiece is pressed using a pressing plate on which the pre-existing multiple fine uneven portions 46 are formed, the area of ​​the pre-existing multiple fine uneven portions 46 on the pressing plate tends not to be able to press the surface of the workpiece to the desired depth, and a workpiece processed with an uneven shape having the pre-existing multiple fine uneven recess portion recess 462 of the desired depth and the pre-existing multiple fine uneven protrusion portion 461 of the desired height tends not to be obtained.

[0105] Figure 8 is a schematic diagram illustrating the shape of a graphic character pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. For example, a pressing plate equipped with multiple inkjet-etched pre-formed fine uneven protrusions 466, as illustrated in Figures 8(B) and (D), can be manufactured. In Figures 8(B) and (D), inkjet-etched pre-formed fine uneven protrusions 466 of "ABCDE pattern," "heart pattern," and "star pattern" are formed, and the surface of each pattern is formed having multiple pre-formed fine uneven protrusions and multiple pre-formed fine uneven recesses.

[0106] [Dependency Structure 7] In the manufacturing method of the pressing plate described in [Dependent Configuration 6] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented. A method for manufacturing a plate for pressing, wherein in step (A) above, the pre-existing multiple fine uneven portion 46 having a plurality of pre-existing multiple fine uneven portion protrusions 461 and a plurality of pre-existing multiple fine uneven portion recesses 462 is formed by at least one plurality of fine uneven shapes selected from the group consisting of (f) fine dot patterns, fine patterned patterns, fine picture patterns and / or fine grid patterns, (g) fine line patterns, (h) fine stripe patterns, and (i) latent image patterns that represent different pictographic patterns when viewed from different directions.

[0107] This configuration provides the aforementioned "(Manufacturing method effect a: effect that enables the formation of a desired dimensional uneven surface shape using inkjet resist)" and "(Manufacturing method effect a-b: effect that enables the formation of multiple pre-existing fine uneven parts of desired dimensions having a protruding shape using inkjet resist)", and in particular, "(Manufacturing method effect a-bb: effect that enables the manufacture of a pressing plate equipped with a surface formed of fine uneven parts having a desired fine graphic character pattern shape) having a desired dimensional shape, (f) fine dot pattern, fine graphic pattern, fine picture pattern, and / or fine grid pattern, (g) It is possible to manufacture a pressing plate having a surface formed with fine graphic and pictographic patterns such as fine line patterns, fine stripe patterns, and latent image patterns that represent different graphic and pictographic patterns when viewed from different directions. Furthermore, corrosion etching of areas that should not be etched is suppressed, and it is possible to manufacture a pressing plate having desired shapes and desired size dimensions such as height, depth, and width of each of the multiple pre-existing multiple fine uneven parts 46) having multiple pre-existing multiple fine uneven parts convex parts 461 and multiple pre-existing multiple fine uneven parts concave parts 462. In particular, the "side etching phenomenon," in which the "side surfaces 461b of each pre-existing multiple uneven surfaces and the side surfaces 462b of each pre-existing multiple uneven surfaces" are corroded and etched, is suppressed.

[0108] Furthermore, "fine line patterns" include fine line patterns formed by straight lines, dashed lines, dotted lines, dashed lines, etc. "Fine striped patterns" include fine striped patterns formed by curves of a desired shape, and fine striped patterns formed by wavy curves of a desired shape. "(Ri) Latent image patterns that represent different pictographic patterns when viewed from different directions" means, in other words, pictographic patterns that are recognized as different pictographic patterns when viewed from different directions.

[0109] [Dependency Structure 8] In the manufacturing method of the pressing plate according to the above-described [dependent configuration 6] or [dependent configuration 7], a manufacturing method of the pressing plate having the following configuration is preferably possible. Figure 9 is a schematic diagram, or schematic plan view, illustrating the shape of a graphic character or pictogram pattern formed by relief on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. Figures 9(Aa) and (Ab) are plan views illustrating the shapes of multiple pattern cells divided into predetermined shapes and arranged in a regular pattern, with (Aa) showing multiple pattern cells divided into approximately squares. Figures 9(Ba), (Bb), (Bc), (Bd), (Be), and (Bf) are schematic enlarged views showing one embodiment of the shape of the uneven pattern formed by the uneven shapes formed in the multiple pattern cells shown in Figures 9(Aa) and (Ab), with (Ba) showing fine left diagonal lines, (Bb) showing fine right diagonal lines, (Bc) showing fine horizontal lines, (Bd) showing fine vertical parallel lines, (Be) showing fine stripe patterns, and (Bf) showing fine dot patterns. Figure 9(C) shows the form of one embodiment of the uneven pattern formed by the uneven shape in each of the multiple pattern cells. Figures 9(Da), (Db), and (Dc) show multiple types of uneven pattern cells formed in Figure 9(C).

[0110] As shown in Figures 9(Aa) and (Ab), in step (A) of the aforementioned [dependent configuration 6] or [dependent configuration 7], the pre-existing multiple fine uneven portion 46 having a plurality of pre-existing multiple fine uneven portion protrusions 461 and a plurality of pre-existing multiple fine uneven portion recesses 462 is formed by a combination of multiple types of uneven pattern cells that are engraved with a fine uneven shape, divided into predetermined shapes, and arranged in a regular manner. As shown in Figures 9(Ba) to (Bf), each of the multiple types of uneven pattern cells forms a fine graphic character pattern, which is made up of at least two types of fine uneven shapes selected from the group consisting of fine dot patterns, fine patterned patterns, fine picture patterns, fine line patterns, and fine striped patterns. Furthermore, fine line patterns include fine line patterns formed by straight lines, dashed lines, dotted lines, dashed lines, etc. Fine striped patterns include fine striped patterns formed by curves of a desired shape, and fine striped patterns formed by wavy curves of a desired shape. As shown in Figure 9(C) and Figures 9(Da) to (Dc), a first image is formed by combining multiple micro-character patterns of one of two or more types of micro-character patterns, and another image is formed by combining multiple micro-character patterns of a second type, which is different from the first type, from the two or more types of micro-character patterns. In this way, a plate for pressing is manufactured.

[0111] Preferably, in the above configuration, it is possible to implement a configuration in which the first image is recognized when viewed from one direction, and the other image is recognized when viewed from a different direction than the one direction. In other words, it is preferable to implement a configuration in which multiple micro-picture patterns of one type from two or more types of micro-picture patterns come together to form one image, and multiple micro-picture patterns of other types come together to form another image, so that different images appear and are recognized when viewed from different directions.

[0112] For example, in Figure 9, which shows an embodiment, the fine left-diagonal line pattern in Figure 9(C) comes together to form the letter "H" image 46a in Figure 9(Da), the fine right-diagonal line pattern in Figure 9(C) comes together to form the letter "T" image 46b in Figure 9(Db), and the fine horizontal line pattern in Figure 9(C) comes together to form the letter "Z" image 46c in Figure 9(Dc). These characters are formed so that different image characters are recognized when viewed from different directions. In this way, a plate for pressing is manufactured.

[0113] Figure 9 shows a schematic shape of the surface of a pressing plate. The workpiece formed by pressing a workpiece using this pressing plate is processed to have a shape with irregularities that match the irregularities formed on the pressing plate used, and is formed so that different image characters are recognized when viewed from different directions.

[0114] In Figure 9, the "multiple types of raised and recessed pattern cells divided into predetermined shapes and arranged in a regular manner" have boundary lines formed between each of the pattern cells that are divided into predetermined shapes. However, the configuration is not limited to this, and it is possible to implement a configuration in which no boundary lines are formed between each of the pattern cells, and each pattern cell has a fine graphic character pattern formed by its raised and recessed shape.

[0115] This configuration provides the aforementioned "(Manufacturing method effect A: Effect that enables the formation of a desired uneven surface shape using an inkjet resist)," and in particular, the effect of "(Manufacturing method effect A-b: Effect that enables the formation of a desired number of pre-existing fine uneven parts having a protruding shape using an inkjet resist) a chemical corrosion etching process that produces a pressing plate having a desired shape in which a recess, a projection protruding from the recess, and a number of pre-existing multiple fine uneven parts having a number of pre-existing multiple fine uneven recesses and a number of pre-existing multiple fine uneven protrusions on the surface of the projection, and corrosion etching of the "area of ​​the plate-making substrate that must not be etched" is suppressed, and when a workpiece is pressed using this pressing plate, a pressing plate is obtained that is processed and formed to have an uneven shape that matches the uneven shape formed on the pressing plate used, and is formed so that different image characters can be recognized when viewed from different directions." In other words, the second recessed portion 121 of the inkjet resist film, which is formed by corrosion etching, is formed, and the effect is obtained that "corrosion etching of the convex side surface 461b (the same side surface as the concave side surface 462b of the multiple pre-existing multiple fine uneven parts) which is a region of the plate-making substrate that should not be etched is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape." In particular, the "side etching phenomenon," in which the "side surfaces 461b of each pre-existing multiple micro-protrusions and the side surfaces 462b of each pre-existing multiple micro-protrusions," which are areas that should not be etched, are corroded and etched, is suppressed.

[0116] [Dependency Structure 10] In the manufacturing method of the pressing plate described in [Dependent Configuration 1] above, preferably, a manufacturing method of the pressing plate having the following configuration can be implemented. Figure 7 is a schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to another embodiment of the present invention.

[0117] As shown in Figure 7(A), in step (A) of the aforementioned [dependent configuration 1], the second region surface 12 of the plate-making substrate has a plurality of smooth, non-irregular areas, and the first region surface 11 of the plate-making substrate has a plurality of pre-existing irregular areas 4. The second region surface 12 of the plate-making substrate is located in the peripheral region of the first region surface 11 of the plate-making substrate. One of the multiple pre-made uneven surfaces 4 has (a) a multiple pre-made multiple uneven surface 45 which has multiple convex portions 451 formed with multiple convex shapes and multiple concave portions 452 formed with multiple concave shapes. One of the multiple pre-existing uneven surfaces 4 has (b) a multiple pre-existing multiple fine uneven surface 46 which has multiple pre-existing multiple fine uneven surface protrusions 461 formed of multiple fine convex shapes and multiple pre-existing multiple fine uneven surface recesses 462 formed of multiple fine concave shapes. Each of the multiple pre-existing multiple uneven parts has multiple upper surfaces 451a and multiple side surfaces 451b, and each of the multiple pre-existing multiple uneven parts has multiple bottom surfaces 452c and multiple side surfaces 452b. Here, the multiple pre-existing protruding surface 451b and the multiple pre-existing recessed surface 452b correspond to the same surface region. Each of the multiple pre-existing multiple micro-recesses has a convex portion 461a and a side surface 461b, and each of the multiple pre-existing multiple micro-recesses has a concave portion 462 and a bottom surface 462c and a side surface 462b. Here, the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 456b correspond to the same side region.

[0118] In step (B) of the aforementioned [dependent configuration 1], the process includes an inkjet resist film formation step in which the inkjet resist material 2 is applied by an inkjet method to cover the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, and the upper surfaces 461a of the multiple pre-existing multiple fine uneven parts, the side surfaces 461b of the multiple pre-existing multiple fine uneven parts, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven parts, thereby forming an inkjet resist film attached to the upper surface of the protrusions, an inkjet resist film attached to the side surfaces of the protrusions, an inkjet resist film attached to the bottom surface of the recesses, and an inkjet resist film attached to the upper surface of the fine protrusions, an inkjet resist film attached to the side surfaces of the fine protrusions, and an inkjet resist film attached to the bottom surface of the fine recesses. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the plate-making substrate located in the area surrounding the multiple pre-existing multiple uneven parts 45. In step (B) above, the process further includes a desired region inkjet resist curing film formation step, in which the inkjet resist curing film attached to the upper surface of the protrusions, the inkjet resist curing film attached to the side of the protrusions, the inkjet resist curing film attached to the bottom of the recesses, and the inkjet resist curing film attached to the upper surface of the fine protrusions, the inkjet resist curing film attached to the side of the fine protrusions, and the inkjet resist curing film attached to the bottom of the fine recesses are cured to form a desired region inkjet resist curing film 3 having a desired region inkjet resist curing film 3a on the upper surface of the protrusions, a desired region inkjet resist curing film 3b on the side of the protrusions, a desired region inkjet resist curing film 3c on the bottom of the recesses, and a desired region inkjet resist curing film 3e on the upper surface of the fine protrusions, a desired region inkjet resist curing film 3f on the side of the fine protrusions, and a desired region inkjet resist curing film 3g on the bottom of the fine recesses.

[0119] In step (C) of the aforementioned [dependent configuration 1], the process includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the desired region inkjet resist upper surface cured film 3a, desired region inkjet resist upper surface cured film 3b, desired region inkjet resist upper surface cured film 3e, desired region inkjet resist upper surface cured film 3f, and desired region inkjet resist lower surface cured film 3g are formed, thereby etching the second region surface 12 of the plate-making substrate on which the desired region inkjet resist cured film is not attached. As a result, the surface 12 of the second region of the plate-type substrate is etched without etching the existing multiple uneven portions 45 and the existing multiple fine uneven portions 46, thereby forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recessed shape. The existing multiple uneven portions 45 are formed into inkjet film corrosion existing multiple uneven portion protrusions 455 having a protruding shape that extends from the inkjet resist film corrosion second recess-forming portion 121, and the existing multiple fine uneven portions 46 are formed into inkjet film corrosion existing multiple fine uneven portion protrusions 466 having a protruding shape that extends from the inkjet resist film corrosion second recess-forming portion 121.

[0120] In step (D) of the aforementioned [dependent configuration 1], a resist curing film removal step is provided to remove the inkjet resist curing film 3 in a desired area. This process etches the surface 12 of the second region of the plate-making substrate without etching the existing uneven portion 4, thereby forming the inkjet resist corrosion second recess formation portion 121, and also forms the existing uneven portion into an inkjet film corrosion existing uneven portion protrusion having a protruding shape that extends from the inkjet resist corrosion second recess formation portion 121. In other words, the process includes a resist hardening film removal step that removes the hardened upper surface film 3a of the desired region inkjet resist protrusions, the hardened side surface film 3b of the desired region inkjet resist protrusions, the hardened bottom surface film 3c of the desired region inkjet resist, and the hardened upper surface film 3e of the desired region inkjet resist fine protrusions, the hardened side surface film 3f of the desired region inkjet resist fine protrusions, and the hardened bottom surface film 3g of the desired region inkjet resist fine recesses. As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate without etching the existing multiple recesses 45 and the existing multiple fine recesses 46. The first region surface 11 of the plate-making substrate, which has an existing multiple recesses 45 having a plurality of existing multiple protrusions 451 and a plurality of existing multiple recesses 452, and an existing multiple fine recesses 46 having a plurality of existing multiple protrusions 461 and a plurality of existing multiple fine recesses 462, is formed in the form of inkjet film corrosion existing multiple recesses protrusions 455 and inkjet film corrosion existing multiple fine recesses protrusions 466, which have a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. In this way, a plate for pressing is manufactured.

[0121] This configuration provides the above-mentioned (manufacturing method effect I-a: effect of being able to form pre-existing uneven parts of desired dimensions with a protruding shape using inkjet resist) and also the (manufacturing method effect I-b: effect of being able to form multiple pre-existing fine uneven parts of desired dimensions with a protruding shape using inkjet resist). In other words, the second recessed portion 121 of the inkjet resist film, which is formed by corrosion etching, is formed, and the effect is obtained that "corrosion etching of the 'side surfaces of multiple existing multiple uneven parts (the same side surfaces as the recessed sides of multiple existing multiple uneven parts)' and the 'side surfaces of multiple existing multiple fine uneven parts (the same side surfaces as the recessed sides of multiple existing multiple fine uneven parts)' which are areas of the plate-making substrate that should not be etched, is suppressed, thereby enabling the manufacture of a pressing plate with a desired shape."

[0122] Figure 8 is a schematic diagram illustrating the shape of a graphic character pattern formed by reliefs on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. As one embodiment of the pressing plate manufactured by this manufacturing method, a pressing plate equipped with both inkjet-etched pre-existing multiple uneven protrusions 455 and inkjet-etched pre-existing multiple fine uneven protrusions 466 can be manufactured, as shown in Figures 8(C), (E), and (F).

[0123] [Dependency Structure 11] In the manufacturing method of the pressing plate described in [Basic Configuration 1] above, it is preferable that a manufacturing method of the pressing plate having the following configuration can be implemented. Figure 10 is a schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to another embodiment of the present invention. Figures 10(A), (B), (C), and (D) are schematic cross-sectional views illustrating a method for manufacturing a pressing plate. Figures 10(Aa), (Ba),(Ca), and (Da) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate having a desired graphic, letter, or pictorial pattern formed by reliefs, and Figures 10(Ab), (Bb),(Cb), and (Db) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate having a desired fine graphic, letter, or pictorial pattern formed by reliefs.

[0124] As shown in Figure 10(A), the first region surface 11 of the plate-making substrate has a pre-formed protrusion 47, and the second region surface 12 of the plate-making substrate has a pre-formed recess 48. The first region surface 11 of the plate-making substrate is located in the peripheral region of the second region surface 12 of the plate-making substrate. The pre-formed protrusion 47 has a pre-formed protrusion upper surface 47a and a pre-formed protrusion side surface 47b, and the pre-formed recess 48 has a pre-formed recess bottom surface 48c and a pre-formed recess side surface 48b. Here, the pre-formed protrusion side surface 47b and the pre-formed recess side surface 48b correspond to the same side surface.

[0125] As shown in Figure 10(B), the (B) step of the [Basic Configuration 1] described above includes a desired region inkjet resist film formation step in which an inkjet resist material 2 is attached to the upper surface 47a of the pre-existing protrusions by an inkjet method to cover the side surface 47b of the pre-existing protrusions, the side surface 48b of the pre-existing recesses, and the bottom surface 48c of the pre-existing protrusions, thereby forming a desired region inkjet resist film having (a) a desired graphic character pattern, or (b) a desired fine graphic character pattern, and a desired region inkjet resist cured film formation step in which the desired region inkjet resist film is cured to form a desired region inkjet resist cured film 3. For example, as shown in Figures 10(B), (Ba), and (Bb), an "ABCDE pattern" or a "heart pattern formed with fine figures and characters" is formed on the upper surface 47a of the pre-existing protrusion by a desired region inkjet resist cured film, and no desired region inkjet resist film is formed in the areas other than the "ABCDE pattern" or the "heart pattern formed with fine figures and characters".

[0126] As shown in Figure 10(C), the (C) step of the [Basic Configuration 1] described above includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the desired region inkjet resist cured film 3 is formed, and the areas on the upper surface 47a of the pre-formed protrusions to which the desired region inkjet resist cured film is not attached are etched. This allows for the formation of a pre-existing protruding upper surface 477 having multiple recesses and multiple protrusions by etching the areas on the pre-existing protruding upper surface 47a where the inkjet resist cured film is not attached, without etching the pre-existing protruding side surface 47b, pre-existing recessed side surface 48b, and pre-existing recessed bottom surface 48c. Here, if the inkjet resist cured film 3 in the desired region (a) has a desired graphic, character, or pattern, then, as shown in Figure 10(Ca), the pre-formed protruding upper surface uneven portion 477 is a pre-formed protruding upper surface multiple uneven portion 477a having a plurality of concave shapes corresponding to the desired graphic, character, or pattern and a plurality of protruding shapes formed by the pre-formed protruding upper surface multiple uneven portion 471a. Alternatively, if the desired region inkjet resist cured film 3 has (b) a desired fine figure, character, or pattern, then, as shown in Figure 10(Cb), the pre-formed protrusion upper surface uneven portion 477 is a pre-formed protrusion upper surface multiple fine uneven portion 477b having a plurality of fine recessed shapes corresponding to the desired fine figure, character, or pattern and a plurality of protrusions 471b formed by a plurality of fine convex shapes.

[0127] As shown in Figure 10(D), the (D) step of the [Basic Configuration 1] described above includes a desired region inkjet resist curing film removal step for removing the desired region inkjet resist curing film 3. As a result, if the inkjet resist cured film 3 in the desired region has a desired graphic, character, or pattern, then, as shown in Figure 10(Da), multiple pre-existing protrusions 477a are formed on the upper surface 47a of the pre-existing protrusion, which are pre-existing upper surface irregularities 477. Alternatively, if the inkjet resist cured film 3 in the desired region has a desired fine figure, character, or pattern, then, as shown in Figure 10(Db), a plurality of fine uneven surfaces 477b are formed on the upper surface 47a of the pre-existing protrusion, which are pre-existing uneven surfaces 477 of the pre-existing protrusion. In this way, a pressing plate is manufactured having a pre-formed recess 48 and a pre-formed protrusion 47, wherein a plurality of pre-formed upper surface irregularities 477a, or a plurality of pre-formed upper surface irregularities 477b, are formed on the upper surface of the pre-formed protrusion 477.

[0128] In this configuration, the height dimension of each of the multiple pre-existing protrusions 471a (which is the same as the depth dimension of each of the multiple pre-existing recesses 472a) is not particularly limited, but for example, it is preferably 0.1 mm or more, and is smaller (shorter, shallower) than the depth dimension of the pre-existing recess 48. Furthermore, the height dimension of each of the multiple micro-recesses on the upper surface of the pre-existing protrusions 471b (which is the same as the depth dimension of the recesses 472b on the upper surface of the pre-existing protrusions) is not particularly limited, but for example, it is preferably 0.05 mm or more, and is smaller (shorter, shallower) than the depth dimension of the pre-existing recess 48. Furthermore, the width dimensions of each of the multiple micro-recesses on the upper surface of the pre-existing protrusion 471b and the width dimensions of the recesses 472b of the multiple micro-recesses on the upper surface of the pre-existing protrusion are not particularly limited, but for example, 0.0005 mm to 1 mm is preferably achievable.

[0129] This method for manufacturing a pressing plate provides the following effect: [(Effect of manufacturing method A: Effect of forming a surface shape with irregularities of desired dimensions using inkjet resist) By using a process that includes chemical corrosion etching, which has a simpler process than conventional general-purpose chemical corrosion etching, it becomes possible to manufacture a pressing plate that has desired shapes such as desired convex parts, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing corrosion etching in the "areas of the plate-making substrate that must not be etched"]. In other words, without etching areas that should not be etched (the side surface 47b of the pre-existing protrusion, the side surface 48b of the pre-existing recess, and the bottom surface 48c of the pre-existing recess), it is possible to form desired uneven surfaces, desired fine uneven surfaces, etc., on the upper surface 47a of the pre-existing protrusion 477.

[0130] [Dependency Structure 12] In the manufacturing method of the pressing plate described in [Basic Configuration 1] above, it is preferable that a manufacturing method of the pressing plate having the following configuration can be implemented. Figure 11 is a schematic diagram illustrating the manufacturing process for a method of manufacturing a pressing plate according to another embodiment of the present invention. Figures 11(A), (B), (C), and (D) are schematic cross-sectional views illustrating a method for manufacturing a pressing plate. Figures 11(Aa), (Ba),(Ca), and (Da) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate that has a desired graphic, letter, or pictorial pattern formed by reliefs, and Figures 11(Ab), (Bb),(Cb), and (Db) are schematic plan views corresponding to (A), (B), (C), and (D), illustrating a method for manufacturing a pressing plate that has a desired fine graphic, letter, or pictorial pattern formed by reliefs.

[0131] As shown in Figure 11(A), the first region surface 11 of the printing plate substrate has a pre-formed protrusion 47, and the second region surface 12 of the printing plate substrate has a pre-formed recess 48. The first region surface 11 of the printing plate substrate is located in the peripheral region of the second region surface 12 of the printing plate substrate. The pre-formed protrusion 47 has a pre-formed protrusion upper surface 47a and a pre-formed protrusion side surface 47b, and the pre-formed recess 48 has a pre-formed recess bottom surface 48c and a pre-formed recess side surface 48b. Here, the pre-existing convex side surface 47b and the pre-existing concave side surface 48b correspond to the same side surface.

[0132] As shown in Figure 11(B), the (B) step of the [Basic Configuration 1] described above includes a desired region inkjet resist film formation step in which an inkjet resist material 2 is attached by an inkjet method to cover the pre-existing protruding side surface 47b, the pre-existing recessed side surface 48b, and the pre-existing protruding upper surface 47a, and to the pre-existing recessed bottom surface 48c, thereby forming a desired region inkjet resist film having (a) a desired graphic character pattern, or (b) a desired fine graphic character pattern, and a desired region inkjet resist cured film formation step in which the desired region inkjet resist film is cured to form a desired region inkjet resist cured film 3. For example, as shown in Figures 11(B), (Ba), and (Bb), on the bottom surface 48c of a pre-existing recess, no desired region inkjet resist film is formed in the area of ​​the "ABCDE pattern" or the "heart pattern formed with fine figures and characters," and a desired region inkjet resist cured film is formed in the area excluding the "ABCDE pattern" or the "heart pattern formed with fine figures and characters."

[0133] As shown in Figure 11(C), the (C) step of the [Basic Configuration 1] described above includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the desired region inkjet resist cured film 3 is formed, and the areas on the bottom surface 48c of the pre-formed recesses to which the desired region inkjet resist cured film is not attached are etched. As a result, the areas on the bottom surface 48c of the pre-formed recesses to which the desired region inkjet resist cured film is not attached are etched without etching the side surface 47b of the pre-formed protrusions, the side surface 48b of the pre-formed recesses, and the top surface 47a of the pre-formed protrusions, thereby forming a pre-formed recess bottom surface uneven portion 488 having a plurality of recesses and a plurality of protrusions. Here, if the desired region inkjet resist cured film (3) has a desired graphic, character, or pattern, then, as shown in Figure 11(Ca), the pre-existing recessed bottom surface uneven portion 488 is a pre-existing recessed bottom surface multiple uneven portion 488a having a plurality of concave shapes corresponding to the desired graphic, character, or pattern and a plurality of convex shapes. Alternatively, if the desired region inkjet resist cured film 3 has (b) a desired fine figure, character, or pattern, then, as shown in Figure 11(Cb), the pre-existing recess bottom surface uneven portion 488 is (b) a pre-existing recess bottom surface multiple fine uneven portion recess 482b formed by a plurality of fine concave shapes corresponding to the desired fine figure, character, or pattern, and a pre-existing recess bottom surface multiple fine uneven portion protrusion 481b formed by a plurality of fine convex shapes.

[0134] As shown in Figure 11(D), the (D) step of the [Basic Configuration 1] described above includes a desired region inkjet resist curing film removal step for removing the desired region inkjet resist curing film 3. As a result, if the inkjet resist cured film 3 in the desired region has a desired graphic, character, or picture pattern, then, as shown in Figure 11(Da), multiple pre-existing recessed areas 488a are formed on the bottom surface 48c of the pre-existing recess, which are pre-existing recessed area recesses 488. Alternatively, if the desired region inkjet resist cured film 3 has a desired fine figure, character, or pattern, a plurality of fine irregularities 488b are formed on the bottom surface 48c of the pre-existing recess as pre-existing recess bottom surface irregularities 488. In this way, a pressing plate is manufactured having a pre-formed recess 48 and a pre-formed protrusion 47, wherein a plurality of pre-formed recess bottom surface protrusions 488a, or a plurality of pre-formed recess bottom surface protrusions 488b, is formed on the bottom surface of the pre-formed recess 48.

[0135] In this configuration, the height dimension of each of the multiple recessed surface protrusions 481a of the multiple recessed surface protrusions 488 (which is the same as the depth dimension of the recess 482a of the multiple recessed surface protrusions 482a) is not particularly limited, but for example, it is preferable to have a depth dimension of 0.1 mm or more, and which is smaller (shorter, shallower) than the depth dimension of the original recess 48. Furthermore, the height dimension of each of the multiple micro-recesses 481a of the multiple micro-recesses 488b on the bottom surface of the pre-existing recess (which is the same as the depth dimension of the recess 482a on the bottom surface of the pre-existing recess) is not particularly limited, but for example, it is preferably 0.05 mm or more, and a depth dimension that is smaller (shorter, shallower) than the depth dimension of the pre-existing recess 48 is feasible. Furthermore, the width dimension of each of the multiple micro-recesses 488b on the bottom surface of the pre-existing recess, which are formed with multiple micro-recesses, is not particularly limited, but for example, 0.0005 mm to 1 mm is preferably achievable.

[0136] This method for manufacturing a pressing plate provides the following effect: [(Effect of manufacturing method A: Effect of forming a surface shape with irregularities of desired dimensions using inkjet resist) By using a process that includes chemical corrosion etching, which has a simpler process than conventional general-purpose chemical corrosion etching, it becomes possible to manufacture a pressing plate that has desired shapes such as desired convex parts, desired recesses, desired irregularities, desired fine irregularities, etc., and also has desired shape accuracy and dimensional accuracy, while suppressing corrosion etching in the "areas of the plate-making substrate that must not be etched"]. In other words, without etching areas that should not be etched (the pre-existing convex side surface 47b, the pre-existing recessed side surface 48b, and the pre-existing recessed bottom surface 48c), it is possible to form pre-existing recessed bottom surface irregularities 488, such as desired irregularities or desired fine irregularities, on the pre-existing recessed bottom surface 48c.

[0137] [Dependency Structure 13] In the manufacturing method of the pressing plate described above in [Dependent Configuration 2] to [Dependent Configuration 12], a manufacturing method of the pressing plate having the following configuration is preferably possible. A method for manufacturing a pressing plate, wherein in step (A), the surface 11 of the first region of the plate-making substrate is formed by (a) chemical etching using an inkjet resist-cured film formed using an inkjet resist material as a mask for etching, and / or (b) chemical etching using a resist-cured film formed using a conventional liquid resist material as a mask for etching, and / or (c) chemical etching using a resist-cured film formed using a conventional sheet-type dry film resist material as a mask for etching, and / or (d) mechanical processing using a conventional machine tool, thereby forming the pre-existing uneven portion 4. For example, a plate-type substrate having a pre-existing uneven surface 4 having multiple pre-existing uneven surfaces 45 and / or multiple pre-existing fine uneven surfaces 46 as shown in Figures 1, 2, 3, 6, and 7, can be manufactured by chemical corrosion etching using a resist-cured film made from (a) an inkjet resist material, (b) a conventional liquid resist material, (c) a conventional sheet-type dry film resist material, etc., as a mask for corrosion etching, and / or (d) conventional machining.

[0138] (a) Chemical etching using an inkjet resist-cured film formed using an inkjet resist material as a mask for etching is a process in which an inkjet resist material used in the manufacturing method of the pressing plate of the present invention is attached to the surface of the plate-making substrate by an inkjet method to form an inkjet resist attachment film, the inkjet resist attachment film is cured to form an inkjet resist-cured film, and the plate-making substrate is chemically etched using an etching solution with the inkjet resist-cured film as a mask for etching to form a pre-existing uneven surface 4. In this chemical etching process using an inkjet resist material, the processing method can be similar to or the same as the method described in "Basic Configuration 1" above.

[0139] The inkjet resist material is not particularly limited, and as described in "Basic Configuration 1" above, any inkjet resist material 2 manufactured by a company that supplies general-purpose resist materials, such as Taiyo Ink Manufacturing Co., Ltd., Mitsui Chemicals, Go-O Chemical Industries, Ltd., JNC Corporation, Nikko Material Co., Ltd., Asahi Kasei Corporation, Agfarewald Japan Ltd., and Tokyo Ohka Kogyo Co., Ltd., can be used. For example, any inkjet resist material 2 having a viscosity of 5 mPa·s to 100 mPa·s (25°C), preferably 10 mPa·s to 50 mPa·s (25°C), which is desired above, can be used as it chemically reacts with ultraviolet irradiation to become insoluble and form resist hardening.

[0140] As the viscosity of the inkjet resist material 2 decreases, the thickness of the inkjet resist film tends to decrease, and as the viscosity of the inkjet resist material 2 increases, the thickness of the inkjet resist film tends to increase. An inkjet resist material having a viscosity that allows for the formation of an inkjet resist film of the desired thickness required for its function as a corrosion etching mask is selected and used. By using an inkjet resist material 2 with optimal viscosity, it becomes possible to form a desired region inkjet resist film with high precision and the desired graphic, character, and pattern shape in a desired area on the surface of the printing plate substrate.

[0141] (b) Chemical etching using a resist-cured film formed with conventional liquid resist material as a mask for etching involves attaching a conventional liquid resist material to the surface of a printing plate substrate by conventional screen printing, spray coating, curtain coating, spin coating, or other conventional attachment methods, drying the liquid resist material to form a resist-attached film, exposing the resist-attached film to ultraviolet light irradiation or the like through an exposure mask member having desired through-holes, developing, baking, etc. to form a resist-cured film, and using the resist-cured film as a mask for etching, chemically etching the surface of the printing plate substrate with an etching solution to form a pre-existing uneven surface 4.

[0142] Conventional liquid resist materials are not particularly limited, and for example, any conventional general-purpose liquid resist material used in the field of photolithography, having the desired viscosity, photoreactivity, temperature reactivity, etc., can be used. For example, a general-purpose liquid resist material 2, which is a type of negative photoresist that is a fluid material mainly composed of a two-dimensional chemical structure organic polymer and has the property of chemically crosslinking and curing into a three-dimensional chemical structure crosslinked organic polymer state by ultraviolet irradiation, electron beam irradiation, laser irradiation, or heating, can be used. Furthermore, while there are no particular limitations on the viscosity of conventional liquid resist materials, it is preferable to use a conventional liquid resist material having a viscosity of 1 mPa·s (25°C) or higher to form a conventional resist-cured film of less than 50 μm (approximately 0.05 mm). As the viscosity of the resist material 2 decreases, the thickness of the resist film becomes thinner. By using a liquid resist material 2 with optimal viscosity, a resist-cured film of the desired thickness can be formed.

[0143] The specific material of the liquid resist material is not particularly limited. For example, general-purpose liquid resist materials used for corrosive etching of metal substrates for printing plates can be used. Preferably, a liquid resist material with a desired viscosity that chemically reacts with ultraviolet irradiation to become insoluble and form a resist harden can be used.

[0144] Furthermore, in this processing method using conventional liquid resist material, it is also possible to perform a method in which, without using an exposure mask member, the conventional resist adhesion film or resist curing film is chemically altered by laser irradiation, electron beam irradiation, etc., the resist material is developed to form an etching mask having the desired shape, and this etching mask is used to chemically etch the plate-making substrate using an etching solution to form a pre-existing uneven surface 4.

[0145] (c) Chemical etching using a conventional sheet-shaped dry film resist material as a mask for etching involves attaching a conventional sheet-shaped dry film resist material to the surface of a plate-making substrate, exposing the sheet-shaped dry film resist material to ultraviolet light irradiation, etc., through an exposure mask member having desired through holes, and forming a resist-cured film through processes such as development and baking. Using this resist-cured film as a mask for etching, the surface of the plate-making substrate is chemically etched using an etching solution to form a pre-existing uneven surface 4. Furthermore, in this processing method, it is also possible to perform a method in which, without using an exposure mask member, a conventional sheet-shaped dry film resist material is chemically altered by laser irradiation, electron beam irradiation, etc., and developed to form an etching mask having the desired shape, and then the etching solution is used to chemically etch the plate-making substrate using this etching mask to form the pre-existing uneven surface 4. The laser exposure apparatus is not particularly limited, and for example, a laser exposure apparatus manufactured by Daishin Sangyo Co., Ltd. can be used.

[0146] Furthermore, in this processing method, instead of "attaching a conventional sheet-shaped dry film resist material to the surface of a plate-making substrate," it is also possible to use "a plate-making substrate with a resist-attached sheet-shaped dry film resist material attached to the surface of a commonly available plate-making substrate." The specific material for the sheet-shaped dry film resist material is not particularly limited, and general-purpose sheet-shaped dry film resist materials supplied by companies such as Tokyo Ohka Kogyo Co., Ltd., Mitsui Chemicals, Taiyo Ink Manufacturing Co., Ltd., JNC Corporation, Nikko Material Co., Ltd., Asahi Kasei Corporation, and Agfarewald Japan Ltd. can be used.

[0147] (d) Mechanical processing using conventional machining equipment is a process in which conventional NC machining, cutting, grinding, and other general-purpose machining processes are used to form pre-existing uneven or recessed parts 4.

[0148] In this process, the thickness of the cured film of the conventional liquid resist material, the sheet-like dry film resist material, etc., is not particularly limited, but for example, a thickness of less than approximately 50 μm (approximately 0.05 mm) is preferably used. When the thickness of the applied conventional resist film is approximately 50 μm or more, the variation in the thickness of the planar region of the conventional resist film increases as the thickness increases, making it difficult to form a uniform conventional resist film. As a result, variations in exposure occur when using an exposure mask with ultraviolet light, making it impossible to form a developed conventional resist-cured film with the desired shape and dimensional accuracy. Consequently, when the conventional resist-cured film is used as an etching mask to etch the plate mold container, it becomes impossible to form uneven areas with the desired shape and dimensional accuracy, resulting in poor etching accuracy.

[0149] [Dependency Structure 14] In the manufacturing method of the pressing plate described above in [Basic Configuration 1] to [Dependent Configuration 13], a plate mold substrate 1 made of metal, plastic, or resin, which is not particularly limited but is commonly used as a pressing plate, can be used. In particular, a method for manufacturing a pressing plate having the following configuration can be implemented. A method for manufacturing a pressing plate, wherein the plate mold substrate 1 is made of iron, stainless steel, brass, copper, magnesium steel, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel. For iron, stainless steel, brass, copper, magnesium steel, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel, those described in detail in the above-mentioned [Basic Configuration 1] are preferably implementable.

[0150] [Dependency Structure 15] In the manufacturing method of the pressing plate described above in [Basic Configuration 1] to [Dependent Configuration 14], preferably, a manufacturing method of the pressing plate having at least one of the following forms (a) to (g) can be implemented. (i) A flat plate mold configured in a flat-pressure type processing device having flat plates facing each other. (b) A roll plate configured in a roll-type processing device having roll shapes that face each other. (h) A flexible plate configured by winding and fixing it around a cylindrical or cylindrical roll, or a flexible plate configured by contacting and fixing it to the surface of a plate-shaped substrate for printing plates. (ii) A die for processing a workpiece into a predetermined uneven shape. (e) A foil stamping plate for applying foil stamping to a workpiece. (h) A cutting / cutting plate for cutting and / or cutting a workpiece into a predetermined shape. (t) A die-stamping / cutting / cutting plate for embossing or foil-stamping a workpiece into a predetermined uneven shape, and for cutting and / or cutting it. The above classifications (a), (b), and (c) are based on the shape of the pressing plate, while (d), (e), (f), and (g) are based on the purpose and use.

[0151] Figure 17 shows a schematic diagram illustrating the configuration of the pressing plate in the method for manufacturing a pressing plate of the present invention. Figure 17 is a schematic diagram of a conventional flat plate or roll type pressing device, showing the pressing plate of the present invention mounted on this conventional pressing device.

[0152] As shown in Figure 17(A), the sheet-like workpiece substrate 108a and the sheet-like foil material 108b are positioned between the pressing plate 10 and the receiving plate 94, which have formed a fine graphic character pattern with a predetermined uneven shape. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, a graphic character pattern with an uneven shape matching the pressing plate 10 is formed on the sheet-like workpiece substrate 108a, and a foil transfer uneven graphic character pattern formed by the transfer of the sheet-like foil material 108b is also transferred and formed. This pressing plate 10 corresponds to (e) a foil stamping plate for applying foil stamping to a workpiece.

[0153] As shown in Figure 17(B), the sheet-like workpiece 108 is positioned between a pressing plate 10 and a receiving plate 94, which have a graphic character pattern formed with a predetermined uneven shape. When at least one of the pressing plate 100 and the receiving plate 94 presses against each other, a graphic character pattern formed with an uneven shape that matches the pressing plate 10 is formed on the sheet-like workpiece 108. This pressing plate 10 corresponds to (ii) a die plate for processing a workpiece into a predetermined uneven shape. Incidentally, the printing plate used for embossing is also called an embossing plate.

[0154] As shown in Figure 17(C), the sheet-like workpiece 108 is positioned between a pressing plate 10 on which a plurality of fine graphic character and pictographic patterns formed with a predetermined uneven shape are formed, and a receiving plate 94. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, a graphic character and pictographic pattern formed with an uneven shape that matches the pressing plate 10 and the receiving plate 94 is formed on the sheet-like workpiece 108. Furthermore, although not shown in the illustration, it is also possible to implement a pressing plate 100 that does not form a fine graphic character or pictographic pattern, but only has a pressing plate 10 that forms a graphic character or pictographic pattern with one or more predetermined uneven shapes. This pressing plate 10 corresponds to (e) a foil stamping plate for foil stamping on a workpiece. This pressing plate 10 is applied, for example, to the pressing plates of the aforementioned "dependent components 3 to 5" and "dependent components 6 to 9".

[0155] As shown in Figure 17(D), the sheet-like workpiece 108 is positioned between a graphic character pattern formed with a predetermined uneven shape and a receiving plate 94 on which the graphic character pattern formed with a predetermined uneven shape is formed. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, a graphic character pattern formed with an uneven shape that matches the pressing plate 10 and the receiving plate 94 is formed on the sheet-like workpiece 108. This pressing plate 10 corresponds to (ii) a die plate for processing a workpiece into a predetermined uneven shape.

[0156] As shown in Figure 17(E), the sheet-like workpiece 108 is positioned between the die pattern, which is formed in a predetermined shape, and the receiving plate 94. When at least one of the pressing plate 10 and the receiving plate 94 presses against each other, the sheet-like workpiece 108 is cut or cut out in a shape that matches the pressing plate 10 and the receiving plate 94. This pressing plate 10 corresponds to (f) a cutting / cutting plate for cutting and / or cutting a workpiece into a predetermined shape.

[0157] Although not shown in the diagram, the device is configured such that a sheet-like workpiece is positioned between a pressing plate and a receiving plate, with a graphic, character, and pictorial pattern formed in a predetermined uneven shape. When at least one of the pressing plate and the receiving plate presses against each other, a graphic, character, and pictorial pattern formed in an uneven shape matching the pressing plate is formed on the sheet-like workpiece, and it is also cut or cut into a predetermined shape.

[0158] Although not shown in the diagram, the device is configured such that a sheet-like workpiece substrate and a sheet-like foil material are positioned between a pressing plate that has formed a graphic character pattern with a predetermined uneven shape and a receiving plate 94 that has formed a graphic character pattern with a predetermined uneven shape, and at least one of the pressing plate and the receiving plate presses against the other, thereby forming a graphic character pattern on the sheet-like workpiece substrate with an uneven shape that matches the pressing plate and the receiving plate, and also transferring and forming a foil transfer uneven graphic character pattern that is formed by the transfer of the sheet-like foil material. This pressing plate corresponds to (e) a foil stamping plate for applying foil to a workpiece.

[0159] In the pressing plate of the present invention, the flat plate type plate configured in the flat pressing processing device having a flat plate shape with opposing flat plates as described above (a) is used as a flat plate type plate configured in a flat pressing processing device having a first base 92 and a second base 93, and each base having a pressing plate 10 and a receiving plate 94 installed facing each other.

[0160] In the pressing plate of the present invention, the roll plate configured in the roll-type processing apparatus having opposing roll shapes as described above (b) is a roll apparatus equipped with a main roll 96 and a pair of rolls 97 having opposing cylindrical or cylindrical roll shapes, as shown in Figure 16(B), and is used as a roll plate configured on the surface of each roll. The following role versions are applicable. (a) A roll plate formed by directly engraving and creating an uneven shape at a desired position on the surface of the roll. (b) A roll plate comprising a flat plate-shaped plate-type substrate having a flat surface with uneven surfaces, which is installed and fixed at a desired position on the surface of the roll. (L-c) A roll plate comprising a curved plate-making substrate having a curved surface with uneven surfaces, which is installed and fixed at a desired position on the surface of the roll.

[0161] As described above, (c) the flexible plate, which is constructed by wrapping and fixing around a cylindrical or cylindrical roll, has a degree of flexibility that allows it to bend, and is installed and used by wrapping it around the surface of the roll. For example, the circumferential surface of the roll is magnetic, and the flexible plate is made of a magnetic metal such as iron or iron-containing steel, and is in a roughly sheet-like shape with a bendable thickness. This flexible plate is then installed and fixed to the circumferential surface of the roll by magnetic attraction. As a flexible plate constructed by installing and fixing it to the surface of a plate-shaped substrate for printing plates, it is installed and fixed to the surface of a flat plate-shaped substrate of a desired thickness in a flatbed processing device and used for application.

[0162] In a pressing apparatus using a pressing plate, it is also possible to implement a configuration in which a heating mechanism, such as a heater, is provided for heating at least one of the first substrate 92, the second substrate 93, the pressing plate 100, and the receiving plate 94. In such an apparatus equipped with a heating mechanism, (e) in a pressing apparatus configured with a foil stamping plate for foil stamping on a workpiece, when a sheet workpiece 108 consisting of a sheet workpiece base material 108a and a sheet foil material 108b is used, foil stamping is formed on the sheet foil material 108b while it is heated.

[0163] <Regarding a pressing plate manufactured by the pressing plate manufacturing method of the present invention> [Dependency Structure 16] The pressing plate of the present invention is a pressing plate manufactured by a method for manufacturing a pressing plate, comprising at least one of the above-described "basic configuration 1" and "dependent configurations 2" to "dependent configurations 15". For example, the pressing plate of the present invention is a pressing plate manufactured by the manufacturing method of "dependent configuration 1". That is, the pressing plate of the present invention is a method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, and comprises the following configuration. (A) A process for supplying a plate-type substrate 1 having a first plate-type substrate surface area 11 and a second plate-type substrate surface area 12. (B) A desired region inkjet resist film formation step, wherein an inkjet resist material 2 is attached to a desired region of the first region surface 11 of the printing substrate 1 by an inkjet method to form a desired region inkjet resist film, and a desired region inkjet resist cured film formation step, wherein the inkjet resist film is cured to form an inkjet resist cured film 3. (C) A plate-making substrate etching step is performed in which an etching solution is brought into contact with the surface of the plate-making substrate 1 on which the inkjet resist cured film 3 in the desired area is formed, thereby etching the surface of the plate-making substrate on which the inkjet resist cured film 3 in the desired area is not attached, thereby forming an etched recess formed in a concave shape on the surface of the plate-making substrate. (D) A resist curing step to remove the inkjet resist curing film in the desired area.

[0164] Furthermore, the pressing plate of the present invention is not limited to the above, and a pressing plate manufactured by at least one of the pressing plate manufacturing methods described above as "dependent configuration 2" to "dependent configuration 13" is also possible.

[0165] The pressing plate of the present invention provides the effect of obtaining a pressing plate that has desired shapes such as desired convex portions, desired recesses, desired uneven portions, and desired fine uneven portions, and that has desired shape accuracy and dimensional accuracy, while suppressing corrosive etching in the "areas of the plate-making substrate that must not be etched".

[0166] <Regarding the processing method of the workpiece according to the present invention> [Dependency Structure 17] The present invention relates to a method for processing a workpiece, characterized by processing the workpiece using a pressing plate manufactured by a method for manufacturing a pressing plate, which is produced by manufacturing a pressing plate using at least one of the above-described "basic configuration 1" and "dependent configurations 2" to "dependent configurations 15," to produce a workpiece that has been processed into a predetermined shape.

[0167] The workpieces that can be processed using the above-described processing method are not particularly limited, but preferably include paper, corrugated cardboard, plastic film, plastic board, plastic molded products, leather, wood, cloth, soft metal, and laminates thereof. Furthermore, a method for processing a workpiece into a predetermined shape by at least one process selected from the group consisting of embossing, foil stamping, cutting, and die-cutting can be preferably implemented.

[0168] [Dependency Structure 18] The present invention relates to a method for processing a workpiece, characterized in that the pressing plate manufactured by the method for manufacturing a pressing plate described in any of the above "Basic Configuration 1" or "Dependent Configuration 2" to "Dependent Configuration 15" is a flat plate type plate having a flat plate shape, and the workpiece is processed using the pressing plate having a flat plate shape to produce a workpiece processed into a predetermined shape, and comprises the following configuration. (Sa) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the above-mentioned "basic configuration 1" or "dependent configuration 2" to "dependent configuration 15". (Sb) A step of preparing a pressing device equipped with a first base 92 and a second base 93 facing each other. (Sd) A step of installing a predetermined receiving plate 94 on the second base 93 of the pressing device. (Se) A step in which, with the workpiece 108 positioned between the pressing plate 10 and the receiving plate 94, at least one of the first base 92 and the second base 93 is driven so that the pressing plate 10 and the receiving plate 94 press the workpiece. This creates a workpiece surface with a surface that matches the surface shape of the pre-existing surface area 4. (Sf) A step of driving at least one of the bases of the pressing plate 10 and the receiving plate 94 to separate the pressing plate 10 and the receiving plate 94 from each other and release the pressure on the workpiece. Thereby, a processed product is prepared in which a processed product uneven formation part is formed in a form having an uneven shape that matches the uneven shape of the existing uneven part 4 on the surface of the workpiece 108.

[0169] In the step of installing the above-mentioned (S-d) predetermined receiving plate 94 on the second base plate 93 of the pressing processing apparatus, as the receiving plate 94, a receiving plate 94 having a smooth surface and no uneven shape as shown in FIG. 17(A) can be used to configure a processing method for a workpiece. Further, the receiving plate 94 is not limited to the above, and a processing method for a workpiece configured using a receiving plate 94 having an uneven shape on the surface manufactured using the inkjet resist material of the present invention or a conventional conventional resist material as shown in FIG. 17(D) is also feasible.

[0170] In this processing method for a workpiece, a flat plate type plate as a pressing processing plate configured in a flat pressing type processing apparatus having flat plate shapes facing each other is applied, and (d) a die pressing plate for processing the workpiece into a predetermined uneven shape is applied.

[0171] By the processing method for a workpiece of the present invention, [Effect I of the processing method for a workpiece of the present invention: The processing method for a workpiece of the present invention can prepare a processed product having a desired shape such as a desired convex part, a desired concave part, a desired uneven part, a desired fine uneven part, etc., and having a desired shape accuracy and dimensional accuracy].

[0172] [Dependent Configuration 19] Another processing method for a workpiece of the present invention is a processing method for a workpiece characterized in that a pressing processing plate manufactured by the manufacturing method of the pressing processing plate described in any one of the above "Basic Configuration 1", "Dependent Configuration 2" to "Dependent Configuration 15" is a flat plate type plate having a flat plate shape, and using the pressing processing plate having the flat plate shape, the workpiece is foil-pressed to manufacture a processed product foil-pressed into a predetermined shape, and includes the following configuration. (Sa) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the following: "Basic Configuration 1", "Dependent Configuration 2" to "Dependent Configuration 13". (Sb) A step of preparing a pressing device equipped with a first base 92 and a second base 93 facing each other. (Sd) A step of installing a predetermined receiving plate 94 on the second base 93 of the pressing device. (Se) A step in which, with the workpiece base material 108a and the sheet-like foil material 108b positioned between the pressing plate 10 and the receiving plate 94, at least one of the first base 92 and the second base 93 is driven so that the pressing plate 10 and the receiving plate 94 press the workpiece. This transfers the sheet-like foil material 108b onto the surface of the workpiece substrate 108a, forming a workpiece foil stamping transfer portion having an uneven shape that matches the uneven shape of the pre-existing uneven portion 4. (Sf) A step of driving at least one of the bases of the pressing plate 10 and the receiving plate 94 to separate the pressing plate 10 and the receiving plate 94 from each other and release the pressure on the workpiece. This process prepares a workpiece in which a workpiece foil stamping transfer forming portion is formed on the surface of the workpiece substrate 108a by transferring a sheet-like foil material 108b in a form that matches the shape of the pre-existing uneven portion 4.

[0173] In this method of processing a workpiece, the flat plate die set configured in a flat-pressure processing device having flat plates facing each other, and the flat plate die set used as a foil stamping plate for foil stamping a workpiece is applied. In addition, in this foil stamping method, it is also preferable to carry out a configuration in which foil stamping is performed while at least one of the first substrate 92, the second substrate 93, the pressing plate 10, and the receiving plate 94 is heated. By heating, a desired area of ​​the sheet-like foil material 108b is transferred to and joined to the surface of the workpiece, thereby forming a foil stamping transfer area on the workpiece.

[0174] The present invention provides the following effect of processing a workpiece: "The effect of processing a workpiece is that it is possible to prepare a workpiece in which a workpiece such as paper, corrugated cardboard, plastic film, plastic board, plastic molded product, or laminate thereof is formed by foil stamping with excellent shape and dimensional accuracy, having a shape formed by recesses, protrusions and / or uneven surfaces having a desired graphic character, graphic pattern form such as a desired character, symbol, figure, design, grid pattern, and fine multiple uneven pattern." In particular, the effect of being able to prepare a workpiece formed by foil stamping with excellent shape and dimensional accuracy can be obtained. Furthermore, especially when using a pressing plate manufactured by the "dependent configuration 8" in which multiple types of fine figures, characters, and patterns are gathered to form different images from each other, it becomes possible to prepare a foil-stamped workpiece with remarkably superior quality because the workpiece is formed in such a way that different images are visible when viewed from different directions.

[0175] [Dependent Structure 20] Another workpiece processing method of the present invention is a workpiece processing method characterized by installing a pressing plate, manufactured by a method for manufacturing a pressing plate described in any of the above "Basic Configuration 1" or "Dependent Configuration 2" to "Dependent Configuration 15", on a roll device, processing a workpiece, and producing a workpiece processed into a predetermined shape, and comprising the following configuration. (Sa) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the following: "Basic Configuration 1", "Dependent Configuration 2" to "Dependent Configuration 13". (Sb) A step of preparing a pressing device equipped with a main roll 96 and a counter roll 97 facing each other. (Sc) A step of setting the pressing plate 10 on the main roll 96. (Sd) A step of installing a predetermined receiving plate 94 on the opposing roll 97 of the pressing device. (Se) A process in which the main roll 96 and the opposing roll 97 are driven, and a workpiece is supplied between the main roll 96 and the opposing roll 97, so that the pressing plate 10 and the receiving plate 94 press the workpiece. This creates a workpiece surface 108 with a workpiece surface having a surface shape that matches the surface shape of the pre-existing surface 4. (Sf) A step in which the workpiece separates from the main roll 96 and the opposing roll 97, thereby releasing the pressure on the workpiece. This process prepares a workpiece in which a workpiece transfer forming portion is formed on the surface of the workpiece 108, having an uneven shape that matches the uneven shape of the pre-existing uneven portion 4.

[0176] In this method of processing a workpiece, the following are applicable: (b) a roll plate configured in a roll-type processing device having opposing roll shapes, which is installed and fixed at a predetermined position on the rolls; or (c) a flexible plate configured by being wrapped around and installed and fixed around the cylindrical or columnar rolls of the roll device.

[0177] The workpiece processing method of the present invention provides the effect described in "Effect A of Workpiece Processing Method" above. In particular, it provides the effect of "preparing workpieces with excellent shape and dimensional accuracy."

[0178] [Dependent Structure 21] Another method for processing a workpiece according to the present invention is a method for processing a workpiece characterized by installing a pressing plate, manufactured by a method for manufacturing a pressing plate described in any of the above "Basic Configuration 1" or "Dependent Configuration 2" to "Dependent Configuration 15", into a roll device, processing the workpiece, and manufacturing a workpiece that has been foil-stamped into a predetermined shape, and comprising the following configuration. (Sa) A step of supplying a pressing plate 10 manufactured by a pressing plate manufacturing method of any of the following: "Basic Configuration 1", "Dependent Configuration 2" to "Dependent Configuration 13". (Sb) A step of preparing a pressing device equipped with a main roll 96 and a counter roll 97 facing each other. (Sc) A step of setting the pressing plate 10 on the main roll 96. (Sd) A step of setting a predetermined receiving plate 94 on the roll 97 of the pressing device. (Se) A process in which the main roll 96 and the opposing roll 97 are driven, and the workpiece base material 108a and the sheet-like foil material 108b are supplied between the main roll 96 and the opposing roll 97, so that the pressing plate 10 and the receiving plate 94 press the workpiece. This transfers the sheet-like foil material 108b onto the surface of the workpiece substrate 108a, forming a workpiece foil stamping transfer portion having an uneven shape that matches the uneven shape of the pre-existing uneven portion 4. (Sf) A step in which the workpiece separates from the main roll 96 and the opposing roll 97, thereby releasing the pressure on the workpiece. This process prepares a workpiece in which a workpiece transfer forming portion is formed on the surface of the workpiece 108 by transferring a sheet-like foil material 108b into a form having an uneven shape that matches the uneven shape of the pre-existing uneven portion 4.

[0179] In this method of processing a workpiece, the following is applied: (b) a roll plate configured in a roll-type processing device having opposing roll shapes, and (c) a flexible plate configured by being wrapped around and fixed to the tubular or cylindrical rolls of a circular roll device. In addition, in this foil stamping method, it is also preferable to carry out the foil stamping process while at least one of the main roll 96, the opposing roll 97, and the pressing plate 10 is heated. By heating, a desired area of ​​the sheet-like foil material 108b is transferred to and joined to the surface of the workpiece, thereby forming a foil stamping transfer area on the workpiece.

[0180] The workpiece processing method of the present invention provides the effect described above as "Effect B of Workpiece Processing Method". In particular, the effect of being able to prepare a workpiece formed by foil stamping with excellent shape and dimensional accuracy can be obtained. Furthermore, especially when using a "pressing plate made by combining multiple types of fine figures, characters, and patterns to form different images" manufactured by "dependent configuration 8", it becomes possible to prepare a foil-stamped workpiece with remarkably superior quality because the workpiece is formed so that different images are visible when viewed from different directions.

[0181] [Dependent configuration 22] In the method for processing a workpiece described in any one of the above "Dependent configuration 17" to "Dependent configuration 21", a method for processing a workpiece having the following configuration can be preferably implemented. The workpiece is at least one workpiece selected from the group consisting of paper, cardboard, plastic film, plastic board, plastic molded product, leather, wood, cloth, soft metal, and laminates thereof. "Method for processing a workpiece". With this configuration, the effects of the above-mentioned "Workpiece processing method effect A" and "Workpiece processing method effect B" can be obtained, and in particular, the effect of "being able to prepare a processed product formed by processing with excellent shape and dimensional accuracy" can be obtained.

Example

[0182] Hereinafter, a method for manufacturing a plate for pressing processing of the present invention, a plate for pressing processing manufactured by the method for manufacturing a plate for pressing processing, and a method for processing a workpiece to be processed into a predetermined shape using a plate for pressing processing manufactured by the method for manufacturing a plate for pressing processing, etc. will be described with reference to typical examples. In the drawings, the shapes, sizes, dimensions, etc. of the components are not shown accurately, but are schematically shown for the purpose of explaining the features of the shape, configuration, function, and effect, etc.

[0183] <Example 1A (Manufacturing A of a flat plate type plate and a die pressing plate as a plate for pressing processing)> This example is a method for manufacturing a plate for pressing processing similar to the above-mentioned "Dependent configuration 3", and is a method for manufacturing a plate for pressing processing shown in FIG. 1, in which the graphic pattern of the characters "ABCDE" is formed in a convex shape on the surface of the convex portion protruding from the concave portion. This plate for pressing processing is used as a flat plate type plate and a die pressing plate. In this embodiment, a conventional resist material is used to form a plurality of pre-existing uneven portions 45, and an inkjet resist material is used to form a second inkjet resist film corrosion recess formation portion 121 on the surface of the plate-type substrate on which the plurality of pre-existing uneven portions 45 are formed, and the substrate is prepared in such a form that the plurality of pre-existing uneven portions 45 are formed into an inkjet film corrosion pre-existing multiple uneven portion projection portion 455 having a protruding shape that protrudes from the bottom surface of the second inkjet resist film corrosion recess formation portion 121. This embodiment will be described in detail below.

[0184] (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 45. A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of stainless steel and has a substantially flat shape with a thickness "h" of 7.0 mm, a width of 125 mm, and a height of 90 mm. Next, a general-purpose conventional liquid resist material (a conventional liquid resist material commonly used for plate making and etching printed circuit boards, selected from commercially available general-purpose liquid resist materials) having the property of chemically reacting with ultraviolet irradiation to crosslink into a three-dimensional chemical structure was applied to a desired area of ​​the first region surface 11 of the plate-making substrate 1, and was applied to a thickness of approximately 0.02 mm to approximately 0.04 mm using a conventional spray-coating method, and dried by a predetermined method to form a resist film. Then, ultraviolet light was irradiated onto the resist film through an exposure mask member having through-holes for light transmission and forming a desired graphic pattern (ABCDE pattern). After that, unwanted resist film in areas not irradiated with ultraviolet light was removed using a commercially available general-purpose conventional developer (aqueous solution of sodium carbonate). Subsequently, the film was matured by heating and baking in a predetermined conventional method. In this way, a cured resist film having the desired graphic pattern (ABCDE pattern) was formed.

[0185] Next, a commercially available general-purpose conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which the resist-cured film had been formed, and the surface of the plate-making substrate that did not have the resist-cured film attached was etched until the depth "D1" reached 0.9 mm, thereby forming a plurality of pre-existing concave and convex portions 452 on the plate-making substrate, as well as a plurality of pre-existing convex portions 451. Next, the hardened resist film was removed using a commercially available, general-purpose, conventional resist remover (aqueous soda solution). In this way, multiple pre-existing multiple recessed / concave parts, convex parts 451 and multiple pre-existing multiple recessed / concave parts, concave parts 452 were formed. Note that a diagram illustrating the process of forming a pre-existing multiple uneven portion 45 having multiple pre-existing multiple uneven portions convex portions 451 formed in the convex shape described above, and multiple pre-existing multiple uneven portions recessed portions 452 formed in the concave shape, is not shown in Figure 1.

[0186] In other words, the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing uneven surface 4, and the pre-existing uneven surface 4 has multiple pre-existing uneven surfaces 45. The pre-existing multiple recessed portion 45 has a plurality of pre-existing multiple recessed portion protrusions 451 formed with a plurality of convex shapes and a plurality of pre-existing multiple recessed portion recesses 452 formed with a plurality of concave shapes. The plurality of pre-existing multiple recessed portion protrusions 451 have a plurality of pre-existing multiple recessed portion upper surfaces 451a and a plurality of pre-existing multiple recessed portion protrusion sides 451b, and the plurality of pre-existing multiple recessed portion recesses 452 have a plurality of pre-existing multiple recessed portion bottom surfaces 452c and a plurality of pre-existing multiple recessed portion sides 452b. In this way, a plate-type substrate having multiple pre-existing uneven surfaces 45 as pre-existing uneven surfaces 4 was prepared. Furthermore, the multiple pre-existing protruding surface 451b and the multiple pre-existing recessed surface 452b correspond to the same surface region. Furthermore, the height dimension "D1" of the etched pre-existing multiple recessed portion, the protrusion 451, corresponds to the depth dimension "D1" of the pre-existing multiple recessed portion, which is 0.9 mm. The width dimension "W1" of the pre-existing multiple recessed portion, the protrusion 451, and the width dimension "W2" of the pre-existing multiple recessed portion, the recessed portion 452, had the desired dimensions as shown in (Ab) of Figure 1. In this way, a plate-type substrate 1 having a graphic character pattern (ABCDE pattern) formed by multiple pre-existing protrusions 451 shown in black in Figure 1 (Ab), and multiple pre-existing recesses 452 shown in white, was prepared and supplied.

[0187] (B) Process for forming an inkjet resist cured film in the desired area. Using the mold substrate 1 prepared in step (A) above, as shown in Figure 1(B), the inkjet resist material 2 was applied by inkjet by covering the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, and the side surfaces 452b of the multiple pre-existing multiple uneven parts, thereby forming an inkjet resist film attached to the upper surface of the raised parts, an inkjet resist film attached to the side surfaces of the raised parts, and an inkjet resist film attached to the bottom surface of the raised parts. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the mold substrate located in the area surrounding the multiple pre-existing multiple uneven parts 45. Subsequently, the inkjet resist film attached to the upper surface of the protrusions, the inkjet resist film attached to the side surface of the recesses, and the inkjet resist film attached to the bottom surface of the recesses were cured to form the desired region inkjet resist cured film 3a on the upper surface of the protrusions, the desired region inkjet resist cured film 3b on the side surface of the protrusions, and the desired region inkjet resist cured film 3c on the bottom surface of the recesses, thereby forming the desired region inkjet resist cured film 3. Furthermore, the side-cured film on the raised portion of the inkjet resist in the desired region and the side-cured film on the recessed portion of the inkjet resist in the desired region correspond to the same side-cured film.

[0188] In the process of forming the cured inkjet resist film in the desired area, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material commonly used in the manufacture of metal wiring boards as electronic components was selected and used, which has the property of crosslinking into a three-dimensional chemical structure through a chemical reaction upon irradiation with ultraviolet light, and has a viscosity of "10 mPa·s to 20 mPa·s (25℃)". The droplets ejected from the ejection nozzle were 2 pl to 15 pl and adhered to the printing plate substrate. Then, ultraviolet light was irradiated onto the inkjet resist film attached to the printing plate substrate to cause a chemical reaction of the inkjet resist material, and then heating burning was performed at 120℃ for 10 minutes to form the cured upper surface cured film 3a of the protrusions of the desired area inkjet resist, the side surface cured film 3b of the protrusions of the desired area inkjet resist, and the bottom surface cured film 3c of the recesses of the desired area inkjet resist. In this way, the cured inkjet resist film 3 in the desired area was formed. The thickness of the inkjet resist cured film in the desired area was in the range of approximately 0.03 mm to 0.05 mm.

[0189] In this process, the inkjet resist material adheres well to the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b) without flowing off the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b), and also adheres well to the existing multiple uneven surfaces 451a and the multiple existing multiple uneven surfaces bottom surfaces 452c. Furthermore, it was confirmed that a desired region inkjet resist upper surface cured film 3a, a desired region inkjet resist side surface cured film 3b, and a desired region inkjet resist bottom surface cured film 3c were formed in the desired region.

[0190] (C) Etching process. As shown in Figure 1(C), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the printing plate substrate 1, which had a hardened film 3a on the upper surface of the desired region inkjet resist protrusions, a hardened film 3b on the side of the desired region inkjet resist protrusions, and a hardened film 3c on the bottom surface of the desired region inkjet resist recesses, using a paddle blowing method. The second region surface 12 of the printing plate substrate, to which the hardened film of the desired region inkjet resist was not attached, was etched until the depth dimension (D12) was approximately 1.9 mm. As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the existing multiple uneven portions 45, forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recessed shape, and the existing multiple uneven portions 45 are formed into inkjet film corrosion existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

[0191] (D) Process to remove the inkjet resist curing film from the desired area. As shown in Figure 1(Db), the hardened film 3a on the upper surface of the raised portion of the inkjet resist in the desired region, the hardened film 3b on the side of the raised portion of the inkjet resist in the desired region, and the hardened film 3c on the bottom surface of the recessed portion of the inkjet resist in the desired region were removed using a commercially available general-purpose conventional resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

[0192] In this way, without etching the pre-existing multiple uneven portions 45 formed in an uneven shape, the second region surface 12 of the plate-making substrate is etched to form an inkjet resist film corrosion second recess-forming portion 121. At the same time, the first region surface 11 of the plate-making substrate, which has a pre-existing multiple uneven portion 45 having a plurality of pre-existing multiple uneven portion protrusions 451 and a plurality of pre-existing multiple uneven portion recesses 452, is prepared in a form in which an inkjet film corrosion pre-existing multiple uneven portion projection 455 is formed, having a protruding shape that protrudes from the bottom surface of the second recess-forming portion 121 of the inkjet resist film corrosion.

[0193] As shown in Figure 1(D), the depth dimension "D12" of the inkjet resist film corrosion second recess formation portion 121 was 1.9 mm, and the height dimension "D1" of the multiple pre-existing multiple recesses 451 and the depth dimension "D1" of the multiple pre-existing multiple recesses 452 represented the same area, maintaining their initial dimensions, which was 0.9 mm. In this way, a plate for pressing was manufactured.

[0194] As described above, in this embodiment, a plate-making substrate 1 is prepared by using a conventional resist material to form a plurality of pre-existing uneven parts 45 having a pre-existing plurality of protrusions 451 with a height dimension "D1" and a pre-existing plurality of pre-existing uneven parts recesses 452 with a depth dimension "D1" on the surface 11 of the first region of the plate-making substrate. Using the plate-making substrate 1 with the plurality of pre-existing uneven parts 45 formed thereon, etching is performed using an inkjet resist material to form an inkjet resist film etching second recess formation portion 121. As a result, the plurality of pre-existing uneven parts 45 having an "ABCDE pattern" formed in an uneven shape are formed into inkjet film etching pre-existing multiple uneven parts protrusions 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film etching second recess formation portion 121.

[0195] In this embodiment, it was confirmed that the object has a combination of pre-existing multiple uneven surfaces 45 having desired shape and dimensional accuracy, and that it also has a protruding shape that extends from the bottom surface of the inkjet resist film etching second recess forming portion 121, and that this protruding portion 455 is formed on the object. Furthermore, it was confirmed that the desired shape accuracy and dimensional accuracy were not observed on the desired pre-existing multiple uneven surfaces, specifically on the convex side surface 451b (and the pre-existing multiple uneven surfaces, specifically on the concave side surface 452b), and that the surface was not etched in a recessed state.

[0196] <Example 1B (Manufacturing of flat die plates and stamping plates for pressing)> This embodiment is a method for manufacturing a pressing plate similar to the "dependent configuration 3" described above, and is a pressing plate shown in Figure 2, in which a graphic letter pattern of "ABCDE pattern" is formed in a raised shape on the surface of the protrusions that protrude from the recesses. This pressing plate is used as a flat plate die plate and an embossing plate. In this embodiment, an inkjet resist material is used to form a plurality of pre-existing uneven portions 45, and an inkjet resist film corrosion second recess formation portion 121 is formed on the surface of the plate-type substrate on which the plurality of pre-existing uneven portions 45 are formed, using the inkjet resist material. The substrate is prepared in such a form that the plurality of pre-existing uneven portions 45 are formed into an inkjet film corrosion pre-existing multiple uneven portion projection 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. This embodiment will be described in detail below.

[0197] (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 45. A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of brass and has a substantially flat shape with a thickness "h" of 7 mm, a width of 125 mm, and a height of 90 mm.

[0198] Next, an inkjet resist film having an "ABCD pattern of graphic characters and images" was formed on the surface of the printing plate substrate 1 using an inkjet method with an inkjet resist material. In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, the same inkjet resist material used in step (B) of Example 1A described above was selected from commercially available inkjet resist materials, which have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation, and have a viscosity of 10 mPa·s to 20 mPa·s (25℃) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120℃ for 10 minutes to form a cured inkjet resist film having a pattern design with the desired ABCDE pattern. In this way, an inkjet resist-cured film having an ABCD pattern of letters and symbols was formed. The thickness of the inkjet resist-cured film was in the range of approximately 0.03 to 0.05 mm.

[0199] A commercially available conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of a printing plate substrate 1 on which an inkjet resist-cured film had been formed. The surface of the printing plate substrate that did not have the resist-cured film attached was etched until the depth "D1" was approximately 0.9 mm, thereby forming a pre-existing multiple uneven surface 45 having multiple pre-existing multiple uneven surface protrusions 451 and multiple pre-existing multiple uneven surface recesses 452 on the printing plate substrate.

[0200] Next, the inkjet resist curing film was removed using a commercially available, conventional resist remover. Note that the diagram illustrating the process of forming the pre-existing multiple uneven surfaces 45 described above is not shown in Figure 2.

[0201] In this way, a pre-existing multiple uneven portion 45 having a plurality of pre-existing multiple uneven portions, convex portions 451 and a plurality of pre-existing multiple uneven portions, concave portions 452 was formed on the first region surface 11 of the plate-making substrate 1, as shown in Figure 2(A). The depth "D1" of each pre-existing multiple recessed portion 452 was approximately 0.9 mm, and the height of the pre-existing multiple protrusions 451 was approximately 0.9 mm, corresponding to the depth of the pre-existing multiple recessed portion 452. In this manner, a plate-type substrate 1 having a graphic character pattern (ABCDE pattern) shown in black in Figure 2(Ab) and multiple pre-existing recessed areas 452 shown in white was prepared and supplied.

[0202] (B) Process for forming an inkjet resist cured film in the desired area. As shown in Figure 2(B), the inkjet resist material 2 was applied by inkjet by covering the upper surfaces 451a of the multiple pre-existing multiple uneven parts, the side surfaces 451b of the multiple pre-existing multiple uneven parts, the bottom surfaces 452c of the multiple pre-existing multiple uneven parts, and the side surfaces 452b of the multiple pre-existing multiple uneven parts, thereby forming an inkjet resist film attached to the upper surface of the raised parts, an inkjet resist film attached to the side surfaces of the raised parts, and an inkjet resist film attached to the bottom surface of the raised parts. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the plate-making substrate located in the area surrounding the pre-existing multiple uneven parts 45. Subsequently, the inkjet resist cured film attached to the upper surface of the protrusions, the inkjet resist cured film attached to the side of the protrusions, and the inkjet resist cured film attached to the bottom surface of the recesses were cured to form a desired region inkjet resist cured film 3 having a desired region inkjet resist cured upper surface film 3a, a desired region inkjet resist cured side surface film 3b, and a desired region inkjet resist cured bottom surface film 3c. Furthermore, the side-cured film 3b on the raised portion of the inkjet resist in the desired region and the side-cured film on the recessed portion of the inkjet resist in the desired region correspond to the same side-cured film.

[0203] A Microcraft on-demand inkjet printing system was used. As the inkjet resist material, a commercially available inkjet resist material was selected and used that is the same as the inkjet resist material used in step (B) of Example 1A described above, which has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation, and has a viscosity of 10 mPa to 20 mPa·s (25℃) (the same inkjet resist material used in step (B) of Example 1A and step (A) of Example 2B described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. The above inkjet resist film attached to the printing plate substrate was then irradiated with ultraviolet light, and subsequently burned at 120℃ for 10 minutes to form a hardened upper surface hardened film 3a of the desired area inkjet resist protrusions, a hardened side surface hardened film 3b of the desired area inkjet resist protrusions, and a hardened bottom surface hardened film 3c of the desired area inkjet resist recesses. The thickness of the inkjet resist cured film 3 in the desired area was in the range of approximately 0.03 to 0.05 mm.

[0204] In this process, the inkjet resist material adheres well to the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b) without flowing off the existing multiple uneven surfaces 451b (existing multiple uneven surfaces 452b), and also adheres well to the existing multiple uneven surfaces 451a and the multiple existing multiple uneven surfaces bottom surfaces 452c. Furthermore, it was confirmed that a desired region inkjet resist upper surface cured film 3a, a desired region inkjet resist side surface cured film 3b, and a desired region inkjet resist bottom surface cured film 3c were formed in the desired region.

[0205] (C) Etching process. As shown in Figure 2(C), a commercially available conventional etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the printing plate substrate 1, which had a hardened film 3a on the upper surface of the desired region inkjet resist protrusions, a hardened film 3b on the side of the desired region inkjet resist protrusions, and a hardened film 3c on the bottom surface of the desired region inkjet resist recesses, using a paddle blowing method, and the second region surface 12 of the printing plate substrate, to which the hardened film of the desired region inkjet resist was not attached, until the depth dimension "D12" was approximately 1.9 mm. As a result, the surface 12 of the second region of the plate-making substrate is etched without etching the existing multiple uneven portions 45, forming an inkjet resist film corrosion second recess-forming portion 121 having an etched recessed shape, and the existing multiple uneven portions 45 are formed into inkjet film corrosion existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion 121.

[0206] (D) Process to remove the inkjet resist curing film from the desired area. As shown in Figure 2(Db), the hardened film 3a on the upper surface of the raised portion of the inkjet resist in the desired region, the hardened film 3b on the side of the raised portion of the inkjet resist in the desired region, and the hardened film 3c on the bottom surface of the recessed portion of the inkjet resist in the desired region were removed using a commercially available conventional resist remover (aqueous sodium hydroxide aqueous solution or sodium hydroxide aqueous solution).

[0207] In this way, without etching the pre-existing multiple uneven portions 45 having an "ABCDE pattern" formed in an uneven shape, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate-making substrate, and the first region surface 11 of the plate-making substrate, which has a pre-existing multiple uneven portions 45 having a plurality of pre-existing multiple uneven portions convex portions 451 and a plurality of pre-existing multiple uneven portions concave portions 452, is prepared in a form in which an inkjet film corrosion pre-existing multiple uneven portion protrusion portion 455 is formed having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.

[0208] As shown in Figure 2(D), the depth dimension "D12" of the inkjet resist film corrosion second recess formation portion 121 was 1.9 mm, and the height dimension "D1" of the multiple pre-existing multiple recesses 451 and the depth dimension of the multiple pre-existing multiple recesses 452 indicated the same area, maintaining their respective initial dimensions, which was 0.9 mm. In this way, a plate for pressing was manufactured.

[0209] As described above, in this embodiment, a plate-making substrate 1 is prepared by forming a plurality of pre-existing uneven surfaces 45 having a height dimension D1 for the protruding portions 451 and a depth dimension D for the recessed portions 452 on the first region surface 11 of the plate-making substrate using an inkjet resist material. Using the plate-making substrate 1 with the plurality of pre-existing uneven surfaces 45 formed thereon, etching is performed using an inkjet resist material to form an inkjet resist film etching second recess formation portion 121. As a result, the plurality of pre-existing uneven surfaces 45 are formed into inkjet film etching pre-existing uneven surface protrusions 455 that protrude from the bottom surface of the inkjet resist film etching second recess formation portion 121.

[0210] In this embodiment, it was confirmed that the desired pre-existing multiple uneven portions 45 having desired shape accuracy and dimensional accuracy are formed, and that the desired inkjet film corrosion pre-existing multiple uneven portion protrusions 455 having a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion 121 are formed. Furthermore, it was confirmed that the desired shape accuracy and dimensional accuracy were achieved, as the side surfaces 451b of the convex portions (and the side surfaces 452b of the concave portions) of the pre-existing multiple uneven portions did not exhibit the side etching phenomenon where they were etched in a recessed state.

[0211] <Example 1B-a (Processing of a workpiece using the pressing plate of Example 1B)> In this embodiment, the pressing plate 10 manufactured in the above-described embodiment 1B is used as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108 as a workpiece 108. The workpiece was embossed using the following process. (Sa) An embossing plate 10 was prepared to be used as a pressing plate 10, which had the pre-existing uneven surface 4 manufactured in Example 1B formed on it. (Sb) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other. (Sd) A stainless steel receiving plate 94, which had been prepared separately and had a smooth, flat surface without irregularities, was installed on the second base 93 of the pressing device. (Se) In this state, a paper sheet 108 with a thickness of approximately 1.5 mm is placed between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press against the workpiece 108. As a result, a workpiece surface irregularity forming portion is created on the surface of the workpiece 108, having an irregularity shape that matches the irregularity shape of the pre-existing irregularity portion 4. (Sf) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 is driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece. As a result, a workpiece was prepared on the paper sheet 108, which served as the workpiece 108, with an embossed shape having a relief of approximately 0.9 mm in depth, having a relief of

[0212] In this embodiment of the processing method for the workpiece, a paper sheet 108, which served as the workpiece 108, was produced with a graphic "ABCDE pattern" formed on it, having the desired shape and dimensional accuracy. The graphic "ABCDE pattern" formed on the workpiece was confirmed to be formed with the desired unevenness of approximately 0.9 mm, without any abnormalities.

[0213] <Comparative Example 1A (Manufacturing of a pressing plate using conventional liquid resist material)> This comparative example describes a method for manufacturing a pressing plate using a conventional liquid resist material instead of an inkjet resist material in the "(B) Desired Area Inkjet Resist Curing Film Formation Process" of Example 1A described above. Schematic diagrams illustrating the manufacturing process of this comparative example are shown in Figures 12 and 13. Figures 12 and 13 are schematic diagrams illustrating the manufacturing process of a conventional method for manufacturing plates used in pressing processes.

[0214] (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 45. As shown in Figure 12(A), the material and shape of the printing plate substrate were the same as in Example 1A. A printing plate substrate made of stainless steel was prepared, having a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm, and a substantially flat shape. As shown in Figure 12(B), using the same method as in step (A) of Example 1A described above, a conventional general-purpose liquid resist material (the same liquid resist material used in step (A) of Example 1A described above, and a conventional liquid resist material commonly used for plate making and etching of printed circuit boards) was applied by spray coating to a thickness of approximately 0.02 mm to approximately 0.04 mm, dried to form a resist adhesion film, and the resist adhesion film was irradiated with ultraviolet light through a desired exposure mask member having through-holes for light transmission, and a resist cured film having a desired graphic letter pattern (ABCDE pattern) was formed by after-baking, development, and other processes. Subsequently, the mold substrate on which the resist-cured film was formed was etched using an etching solution to create a pre-existing multiple uneven surface 45 having multiple existing protrusions 451 and multiple existing uneven surface recesses 452. In this way, a printing plate substrate was prepared in which a plurality of pre-existing uneven surfaces 45 were formed on the surface 11 of the first region of the printing plate substrate as shown in Figure 12(B). The material and shape of the prepared mold substrate were the same as in Example 1A, and the height dimension D1 (depth dimension D1 of the pre-existing multiple recessed parts 452) was 0.9 mm, the same as in Example 1. The second region surface 12 of the substrate for printing plates has a smooth surface without irregularities, the first region surface 11 of the substrate for printing plates has a pre-existing uneven surface 4, the pre-existing uneven surface 4 has a pre-existing multiple uneven surface 45, the pre-existing multiple uneven surface 45 consists of a plurality of pre-existing multiple uneven surface protrusions 451 formed with a plurality of convex shapes and a plurality of pre-existing multiple uneven surface protrusions 451a and a plurality of pre-existing multiple uneven surface protrusions side surfaces 451b, and the plurality of pre-existing multiple uneven surface recesses 452 consists of a plurality of pre-existing multiple uneven surface recesses bottom surfaces 452c and a plurality of pre-existing multiple uneven surface recesses side surfaces 452b. Note that the multiple pre-existing multiple uneven surface parts, the convex side surfaces 451b and the multiple pre-existing multiple uneven surface parts, the concave side surfaces 452b refer to the same side surface.

[0215] (B) Conventional liquid resist curing film formation process. A liquid resist film was formed on the surface of a plate-making substrate 1, which had multiple pre-existing multiple uneven surfaces, including upper surfaces 451a of the raised parts, multiple pre-existing multiple uneven surfaces, upper surfaces 451b of the raised parts (multiple pre-existing multiple uneven surfaces, including lower surfaces 452b of the recessed parts), and multiple pre-existing multiple uneven surfaces, including lower surfaces 452c of the recessed parts. This film was then coated using a conventional liquid resist material 20 (the same liquid resist material used in step (A) of Comparative Example 1A, which has the property of undergoing a chemical reaction upon ultraviolet irradiation to crosslink into a three-dimensional chemical structure, and is a conventional liquid resist material commonly used for plate making and etching of printed circuit boards) by a conventional spray-coating method. Subsequently, the material was exposed to ultraviolet light through an exposure mask member of the desired shape (an exposure mask member having through holes in the portion corresponding to the "ABCDE pattern" region formed on the first region surface 11 of the plate-making substrate when the exposure mask member is placed on the surface of the plate-making substrate, and having a light-blocking portion in the surrounding region). After that, the resist film attached to the areas not irradiated with ultraviolet light was removed using a developer (aqueous solution of sodium carbonate) and developed. Then, the attached conventional resist film was cured by conventional methods such as after-baking to form a conventional resist cured film 30 having a conventional resist convex upper surface cured film 30a and a conventional resist recess bottom surface cured film 30c, as shown in Figure 12(C). However, the conventional resist material attached to the convex side surface 451b (concrete side surface 452b) of the pre-existing multiple uneven parts flowed down to the bottom surface of the recess of the pre-existing multiple uneven parts, and a conventional resist recess side surface cured film was not formed. The thickness of the conventionally cured resist film 30 was in the range of approximately 0.02 mm to approximately 0.04 mm.

[0216] In this case, a resist-cured film was formed in a form in which no resist-cured film was formed in the peripheral region of the mold substrate, but a conventional resist-cured film was formed in the internal region. Furthermore, the conventional liquid resist material adhered well to the upper surface 451a of the convex portion and the lower surface 452c of the concave portion, forming a conventional resist upper surface cured film 30a and conventional resist lower surface cured film 30c in the desired area. However, the conventional liquid resist material flowed down from the side surface 451b (side surface 452b) of the convex portion, and no cured film was formed on the side surface 451b (side surface 452b) of the convex portion.

[0217] (C) Etching process. As shown in Figure 13(D), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1, which had a conventional resist upper surface hardened film 30a and a conventional resist lower surface hardened film 30c formed on it, using a paddle blowing method, and the surface 12 of the second region of the plate-making substrate, to which the conventional resist hardened film was not attached, until the depth dimension (D3) was approximately 1.0 mm. In this case, slight side etching occurred on the convex side surface 451b (concave side surface 452b) of the pre-existing multiple uneven surfaces.

[0218] As shown in Figure 13(E), the etching was further continued until the surface of the second region 12 of the plate-making substrate was etched to a depth dimension (D12a) of approximately 1.9 mm. As a result, the surface 12 of the second region of the substrate for printing plates is etched to form a conventional second recess-forming portion 121a having an etched recessed shape, and the existing multiple recessed portions 45 are formed to protrude from the conventional second recess-forming portion 121a.

[0219] (D) Conventional resist curing film removal process. As shown in Figure 13(F), the conventional resist cured film 30a on the upper surface of the protruding portion and the conventional resist cured film 30c on the lower surface of the recessed portion were removed using a general-purpose resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

[0220] In the aforementioned "(C) Corrosion Etching Process," the pre-existing multiple uneven surfaces (convex side surfaces 451b, concave side surfaces 452b) where the hardened film had not been attached were also corroded and etched, resulting in side-etched pre-existing multiple uneven surfaces (convex side surfaces 451s, concave side surfaces 452s) as shown in Figure 13(D). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained. Such side-etched pre-existing multiple uneven surfaces have undesirable shapes, resulting in undesirable shapes. When a workpiece is processed using a press-forming die with such side-etched uneven surfaces, it is undesirable because a workpiece with the desired uneven shape cannot be obtained. Side etching refers to a shape in which the side surface 451b of the convex portion or the side surface 452b of the concave portion of the existing multiple uneven portions is etched in a way that causes it to be recessed toward the inner surface of the side surface. This shape is undesirable for a plate used for pressing.

[0221] <Comparative Example 1Ab (Manufacturing of a pressing plate using conventional dry film resist material)> Other comparative examples of Example 1A described above are explained below. Comparative Example 1Ab is a method for manufacturing a plate for pressing, in which a conventional dry film resist material is used instead of an inkjet resist material in step (B) of Example 1A described above. Although diagrams illustrating the series of steps in this comparative example are not provided, some components are similar to those in comparative example 1A, and some components will be described with their respective reference numerals. (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 45. Using the same method as in step (A) of the above-described Example 1A, a conventional liquid resist material was used to prepare a plate-making substrate in which the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a pre-existing multiple irregularity 45, (i) the pre-existing multiple irregularity 45 has a plurality of pre-existing multiple irregularity convex portions 451 formed by a plurality of convex shapes and a plurality of pre-existing multiple irregularity recesses 452 formed by a plurality of concave shapes, the plurality of pre-existing multiple irregularity convex portions 451 have a plurality of pre-existing multiple irregularity convex upper surfaces 451a and a plurality of pre-existing multiple irregularity convex side surfaces 451b, and the plurality of pre-existing multiple irregularity recesses 452 have a plurality of pre-existing multiple irregularity recess bottom surfaces 452c and a plurality of pre-existing multiple irregularity recess side surfaces 452b. The material and shape of the plate-making substrate are the same as in Example 1A, being made of stainless steel and having a substantially flat shape with a thickness of 7.0 mm, a width of 125 mm, and a height of 90 mm. Also, the height dimension D1 of the protrusions 451 of the pre-existing multiple protrusions (the depth dimension D1 of the recesses 452 of the pre-existing multiple protrusions) is 0.9 mm, the same as in Example 1A.

[0222] (B) Conventional resist curing film formation process. A conventional dry film resist material (with a thickness of approximately 0.02 mm to 0.04 mm) was attached to the surface of the printing plate substrate on which the pre-formed multiple uneven areas 45 were formed. In this case, gaps were created between the multiple protruding surfaces 451b (recessed surfaces 452b) and the bottom surfaces 452c of the recessed areas of the pre-formed multiple uneven areas 45 formed on the printing plate substrate, as the dry film resist material did not come into contact with them. As the dry film resist material, a sheet-type dry film resist material with a desired thickness of approximately 0.02 mm to 0.04 mm was selected and used from among commercially available conventional sheet-type dry film resist materials. On the plate-making substrate to which the conventional dry film resist material is attached, an exposure mask member (when the exposure mask member is placed on the surface of the plate-making substrate, formed on the first region surface 11 of the plate-making substrate) is attached. 「 A resist-cured film was formed by irradiating with conventional ultraviolet light, developing, and other conventional processes, using an exposure mask member that has through holes in the area corresponding to the "ABCDE pattern" region and a light-blocking portion in the surrounding area. In this case, no resist-cured film was formed in the peripheral region of the plate-making substrate, and a conventional resist-cured film was formed covering the "ABCDE pattern" region formed by the uneven shape of the internal region of the plate-making substrate. Furthermore, in the resist-cured film formed in the internal region, the conventional resist-cured film did not come into contact with the convex side surface 451b (concave side surface 452b) and the concave bottom surface 452c of the pre-existing multiple uneven areas, and no conventional resist-cured film was attached to or formed on these surfaces.

[0223] (C) Etching process. Next, an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a conventional resist-cured film had been formed, and the second region surface 12 of the plate-making substrate, on which the conventional resist-cured film was not attached, was etched to a depth of approximately 1.0 mm in "D3". Further etching was then carried out until the depth of "D12a" reached approximately 1.9 mm. As a result, the surface 12 of the second region of the substrate for printing plates is etched to form a conventional second recess-forming portion 121a having an etched recessed shape, and a plurality of pre-existing recessed portions 45 forming the "ABCDE pattern" are formed to protrude from the conventional second recess-forming portion 121a.

[0224] (C) Conventional resist curing film removal process. Next, the conventionally cured resist film was removed using a resist remover (caustic soda aqueous solution or sodium hydroxide aqueous solution).

[0225] In this "corrosion etching process," the existing multiple uneven surfaces (convex side surfaces 451b, concave side surfaces 452b) where the hardened film had not been attached were also corroded and etched, resulting in side-etched existing multiple uneven surfaces (convex side surfaces 451s, concave side surfaces 452s). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained. Such side-etched pre-existing multiple uneven surfaces have undesirable shapes, and when a workpiece is processed using a press-forming die with such side-etched uneven surfaces, it is undesirable because a workpiece with the desired uneven shape cannot be obtained. This side etching phenomenon occurred when a conventional resist material (with a thickness of approximately 0.02 mm to 0.04 mm) was applied to the surface of a plate-making substrate with multiple pre-formed uneven areas 45. As a result, gaps were created between the sides 451b (sides 452b) of the convex parts and the bottom surface 452c of the concave parts of the multiple uneven areas, without contact by the dry film resist material. This was due to the absence of a conventionally cured resist film on the sides 451b (sides 452b) and bottom surface 452c of the concave parts of the multiple uneven areas, leading to etching of these sides and bottom surfaces.

[0226] <Comparative Example 1A-a (Processing of a workpiece using the pressing plate of Comparative Example 1A)> This comparative example uses the pressing plate 10 manufactured in "Comparative Example 1A" above as the embossing plate 10 of a flat-pressure type processing device to emboss a paper sheet 108 as a workpiece 108. This comparative example uses the pressing plate 10 configured in "Comparative Example 1A" instead of the pressing plate 10 configured in "Example 1A-a" described above, and the other configurations are the same as those of "Example 1B-a" described above. In other words, the workpiece was embossed using the following process. (Sa) A die-cutting plate 10 was prepared to be used as a pressing plate 10, which had the pre-existing uneven surface 4 manufactured in Comparative Example 1A formed on it. (Sb) As shown in Figure 16(A), a pressing device was prepared that had a first base 92 and a second base 93 facing each other. (Sd) A stainless steel receiving plate 94 with a smooth surface, which was prepared separately, was installed on the second base 93 of the pressing device. (Se) In this state, a paper sheet 108 with a thickness of approximately 1.5 mm is placed between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 is driven by a conventional driving method so that the pressing plate 10 and the receiving plate 94 press against the workpiece 108. As a result, a workpiece surface irregularity forming portion is created on the surface of the workpiece 108, having an irregularity shape that matches the irregularity shape of the pre-existing irregularity portion 4. (Sf) The base of at least one of the pressing plate 10 (embossing plate) and the receiving plate 94 is driven to separate the pressing plate 10 (embossing plate) and the receiving plate 94 from each other, thereby releasing the pressure on the workpiece. In this way, a workpiece was prepared on the paper sheet 108, which served as the workpiece 108, with an embossed shape having a graphic character pattern that matched the graphic character pattern formed in a raised and recessed shape on the pre-existing raised and recessed portion 4.

[0227] In this case, irregularities were observed in the graphic and pictorial patterns formed by the uneven shape, and the desired shape and dimensional accuracy of the workpiece could not be obtained. Furthermore, during repeated pressing, a phenomenon was observed in some cases where the workpiece 108 was driven to detach from the pressing plate while remaining stuck to or caught on the pressing plate, rather than detaching from it. In other words, due to the shape of the side-etched surface 451s (and the side-etched recessed surface 452s) of the pressing plate, it was not possible to obtain a workpiece with the desired shape accuracy and dimensional accuracy of graphic characters and patterns.

[0228] <Example 2A (Manufacturing of flexible plates and foil stamping plates for pressing processes)> This embodiment is a method for manufacturing a stamping plate similar to the "dependent configuration 6" described above, and is a method for manufacturing a stamping plate shown in Figure 4, in which a "heart pattern formed with fine irregularities" is formed on the surface of the protrusions that protrude from the recesses. This stamping plate is used as a flexible plate or foil stamping plate that is wrapped around the surface of a roll and used for installation. In this embodiment, a conventional resist material is used to form a plurality of pre-existing fine uneven areas 46. An inkjet resist material is then applied to the surface of the printing plate substrate on which the plurality of pre-existing fine uneven areas 46 are formed, and an inkjet resist material is applied, cured, and etched to form a second inkjet resist film corrosion recess 121. The result is an inkjet film corrosion pre-existing plurality of fine uneven areas protruding from the bottom surface of the second inkjet resist film corrosion recess 121, forming a protruding shape called an inkjet film corrosion pre-existing plurality of fine uneven area projection 466. This embodiment will be described in detail below.

[0229] (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing fine irregularities 46. A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of steel and has a substantially flat shape with a thickness "h" of 0.5 mm, a width of 125 mm, and a length of 90 mm, and is flexible. Next, a general-purpose liquid resist material having the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon irradiation with ultraviolet light (a general-purpose liquid resist material commonly used for plate making and etching of printed circuit boards, a desired general-purpose liquid resist material selected from commercially available general-purpose liquid resist materials, the same liquid resist material used in step (A) of Example 1A described above) was selected and used on a desired area of ​​the first region surface 11 of the plate-making substrate 1, and was applied to a thickness of approximately 0.02 mm to approximately 0.04 mm by a conventional spray-coating method, and dried by a predetermined method to form a resist adhesion film. Then, ultraviolet light was irradiated onto the resist-attached film through an exposure mask member having through-holes and forming a desired fine graphic / character pattern (heart pattern) for light transmission. Unwanted areas of the resist-attached film were removed using a developer in a manner similar to that of Example 1A, and after baking was performed to form a cured resist film having the desired fine graphic / character pattern (heart pattern).

[0230] A commercially available general-purpose etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a resist-cured film had been formed, and the surface of the plate-making substrate that did not have a resist-cured film attached was etched until the depth "d1" reached 0.1 mm, thereby forming multiple pre-existing multiple fine uneven recesses 462 in a concave shape, and multiple pre-existing multiple fine uneven protrusions 461 in a convex shape. Next, the hardened resist film was removed using a commercially available general-purpose resist remover (caustic soda aqueous solution). In this way, multiple pre-existing multiple micro-recesses 461 formed in a convex shape and multiple pre-existing multiple micro-recesses 462 formed in a concave shape are formed, and thus the multiple pre-existing multiple micro-recesses 46 are formed. Note that the diagram illustrating the formation of the pre-existing multiple micro-recessed portion 46, which has multiple pre-existing multiple micro-recessed portions convex portions 461 and multiple pre-existing multiple micro-recessed portions concave portions 462 formed in a concave shape, is not shown in Figure 4.

[0231] In other words, a plate-making substrate was prepared such that the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a plurality of pre-existing fine irregularities 46, the plurality of pre-existing fine irregularities 46 has a plurality of pre-existing multiple fine irregularity convex portions 461 formed by a plurality of convex shapes and a plurality of pre-existing multiple fine irregularity recesses 462 formed by a plurality of concave shapes, the plurality of pre-existing multiple fine irregularity convex portions 461 has a plurality of pre-existing multiple fine irregularity convex upper surfaces 461a and a plurality of pre-existing multiple fine irregularity convex side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b. Furthermore, the multiple pre-existing multi-fine uneven surface convex side surfaces 461b and the multiple pre-existing multi-fine uneven surface concave side surfaces 462b correspond to the same side surface region.

[0232] In this way, a pre-existing multiple fine uneven portion 46 having multiple pre-existing multiple fine uneven portion protrusions (461) and multiple pre-existing multiple fine uneven portion recesses 462 is formed on the printing plate substrate as shown in Figure 4(A). The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm, and the height of each pre-existing multiple micro-recessed portion protrusion (461) was approximately 0.1 mm, corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (50 μm). In this way, a plate-making substrate 1 having multiple pre-existing fine relief sections 46, represented by a "heart pattern" fine relief shape formed in the relief shape of Figure 4 (Ab), was prepared and supplied.

[0233] (B) Process for forming an inkjet resist cured film in the desired area. Next, as shown in Figure 4(B), the inkjet resist material 2 was applied using an inkjet method to cover the multiple pre-existing multiple fine uneven surfaces 46 of the printing plate substrate 1, specifically the multiple pre-existing multiple fine uneven surfaces convex portions 461 and multiple pre-existing multiple fine uneven surfaces recessed portions 462, thereby forming a pre-existing multiple fine uneven surface inkjet resist coating film. In this case, it was confirmed that the inkjet resist material was attached to the upper surfaces 461a of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 461b of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 462b of the multiple pre-existing multiple fine uneven surfaces recessed portions, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven surfaces recessed portions. Note that the multiple pre-existing multiple micro-protrusions and protrusions upper surfaces 461a and the multiple pre-existing multiple micro-protrusions and recesses side surfaces 462b refer to the same side surface.

[0234] In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material commonly used in the manufacture of metal wiring boards as electronic components was selected and used, which has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and has a viscosity of 10 mPa·s to 20 mPa·s (25℃) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the above inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120℃ for 10 minutes to form a hardened upper surface hardened film 3e of the fine protrusions of the desired region inkjet resist, a hardened side surface hardened film 3f of the fine protrusions of the desired region inkjet resist, and a hardened bottom surface hardened film 3g of the fine recesses of the desired region inkjet resist. The thickness of each desired region inkjet resist hardened film was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, inkjet resist cured films 3 were formed in each desired region.

[0235] (C) Etching process. Next, as shown in Figure 4(C), an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the desired region inkjet resist fine protrusion upper surface hardened film 3e, the desired region inkjet resist fine protrusion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g have been formed. The surface 12 of the second region of the printing plate substrate 1, on which the desired region inkjet resist hardened film 3 is not attached, is etched to a depth of approximately 0.3 mm. This forms an inkjet resist film corrosion second recess formation portion 121 having a recessed shape, and also forms an inkjet film corrosion pre-existing multiple fine protrusions 466 having a protruding shape, with the pre-existing multiple fine protrusions 46 protruding from the inkjet resist film corrosion second recess formation portion 121.

[0236] (D) Process to remove the inkjet resist curing film from the desired area. As shown in Figure 4(D), the inkjet resist cured film 3 was removed from the desired area. This creates an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-existing multiple fine uneven protrusion portion 466 having a plurality of pre-existing multiple fine uneven protrusion portions 461 and a plurality of pre-existing multiple fine uneven recess portions 462 (heart pattern).

[0237] The depth "d1" of the recessed portion 462 of the pre-existing multiple micro-ridges was approximately 0.1 mm (100 μm), and the height "d1" of the convex portion 461 of the pre-existing multiple micro-ridges was approximately 0.1 mm (100 μm), corresponding to the depth "d1" of the recessed portion 462. The width "w2" of the recessed portion 462 of the pre-existing multiple micro-ridges was approximately 0.05 mm (approximately 50 μm), and the width "w1" of the convex portion 461 of the pre-existing multiple micro-ridges was approximately 0.05 mm (approximately 50 μm). Furthermore, the depth "d12" of the second recess formation area 121 due to inkjet resist film corrosion was approximately 0.3 mm.

[0238] Furthermore, it was confirmed that no side etching occurred on the side surface of the second recess formation portion 121 of the inkjet resist film corrosion, and that the side surface of the second recess formation portion 121 of the inkjet resist film corrosion has a smooth, desired inclined side surface that extends from the bottom surface of the second recess formation portion 121 of the inkjet resist film corrosion toward the multiple fine uneven protrusions 466 formed by the inkjet film corrosion. Furthermore, it was confirmed that the sides of the multiple pre-existing multiple micro-recesses 462 (corresponding to the sides of the multiple pre-existing multiple micro-recesses 461) in Figure 4(D) were not etched and maintained the normal, desired shape shown in Figure 4(A). In this way, a flexible embossing plate with a degree of flexibility that allows it to be deformed to match the spherical surface of a roll was manufactured, which had multiple pre-existing fine uneven protrusions 466 formed by inkjet film etching of a "heart pattern" with a fine uneven shape.

[0239] In this embodiment, it was confirmed that the desired inkjet film corrosion pre-existing multiple fine unevenness portion protrusions 466 are formed, which have a normal, desired multiple fine unevenness portion 46 and a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. Furthermore, it was confirmed that no side etching phenomenon occurred on the desired pre-existing multiple micro-recessed portion convex side surface 461b (pre-existing multiple micro-recessed portion concave side surface 462b), resulting in a recessed state, and that the desired shape accuracy and dimensional accuracy were achieved.

[0240] <Example 2B (Manufacturing of flexible plates and foil stamping plates for pressing processes)> This embodiment is a method for manufacturing a stamping plate similar to the "dependent configuration 6" described above, and is a method for manufacturing a stamping plate shown in Figure 4, in which a "heart pattern formed with fine irregularities" is formed on the surface of the protrusions that protrude from the recesses. This stamping plate is used as a flexible plate or foil stamping plate that is wrapped around the surface of a roll and used for installation. In the aforementioned Example 2A, the multiple pre-existing fine uneven surfaces 46 are formed by a process that includes a step of attaching them using a conventional liquid resist material by a spray coating method. However, in this example, a plate-making substrate is prepared in which the multiple pre-existing fine uneven surfaces 46 are formed by a process that includes a step of attaching them using an inkjet resist material by an inkjet method. This embodiment will be described in detail below.

[0241] (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing fine irregularities 46. A plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of steel, has a thickness "h" of 0.5 mm, a width of 125 mm, and a length of 90 mm, is flexible, and has a substantially flat shape.

[0242] Next, a fine-grained heart pattern was applied to the surface of the printing plate substrate 1 using an inkjet resist material. The inkjet resist material was then applied and cured to form an inkjet resist-cured film. In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material was selected from commercially available inkjet resist materials that have the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and have a viscosity of 10 mPa·s to 20 mPa·s (25℃) (the same inkjet resist material used in step (B) of Example 1A described above). The droplets ejected from the ejection nozzle were 2 pl to 15 pl. Then, the inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and subsequently, burning was performed at 120℃ for 10 minutes to form a cured inkjet resist film 3 having the desired heart pattern and fine pattern design. The thickness of the inkjet resist film was in the range of approximately 0.03 mm to approximately 0.05 mm.

[0243] Next, an etching solution was brought into contact with the surface of the printing plate substrate 1 on which the inkjet resist cured film had been formed, and the surface of the printing plate substrate that did not have the resist cured film attached was etched until the depth "d1" was approximately 0.1 mm (100 μm), thereby forming a plurality of pre-existing multiple fine uneven surfaces 46 having a plurality of pre-existing multiple fine uneven surfaces convex portions 461 and a plurality of pre-existing multiple fine uneven surfaces concave portions 462 on the printing plate substrate.

[0244] Next, the inkjet resist curing film was removed using a resist remover. In this way, a "heart pattern" of multiple pre-existing multiple fine uneven surfaces 46, having multiple pre-existing multiple fine uneven surfaces protrusions 461 and multiple pre-existing multiple fine uneven surfaces recesses 462, was formed on a printing plate substrate as shown in Figure 4(A). The depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm, and the height of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.1 mm, corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (approximately 50 μm).

[0245] (B) Process for forming an inkjet resist cured film in the desired area. Next, as shown in Figure 4(B), the inkjet resist material 2 was applied using an inkjet method to cover the multiple pre-existing multiple fine uneven surfaces 46 of the printing plate substrate 1, specifically the multiple pre-existing multiple fine uneven surfaces convex portions 461 and multiple pre-existing multiple fine uneven surfaces recessed portions 462, thereby forming a pre-existing multiple fine uneven surface inkjet resist adhesion film. In this case, it was confirmed that the inkjet resist material was adhered to the upper surfaces 461a of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 461b of the multiple pre-existing multiple fine uneven surfaces convex portions, the side surfaces 462b of the multiple pre-existing multiple fine uneven surfaces recessed portions, and the bottom surfaces 462c of the multiple pre-existing multiple fine uneven surfaces recessed portions. Note that the multiple pre-existing multiple micro-uneven surfaces 461b and the multiple pre-existing multiple micro-uneven surfaces 462b refer to the same region.

[0246] In this process, an on-demand inkjet printing system manufactured by Microcraft was used. As the inkjet resist material, a commercially available inkjet resist material was selected that has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and has a viscosity of 10 mPa·s to 20 mPa·s (25℃) (the same inkjet resist material used in the (B) step of Example 1A and the (A) step of this example), and the droplets ejected from the ejection nozzle were attached at a rate of 2 pl to 15 pl. Then, using a method similar to the (B) step of Example 1A, the above inkjet resist film attached to the printing plate substrate was irradiated with ultraviolet light, and then burned at 120℃ for 10 minutes to form a cured upper surface hardened film 3e of the fine protrusions of the desired region inkjet resist, a side surface hardened film 3f of the fine protrusions of the desired region inkjet resist, and a bottom surface hardened film 3g of the fine recesses of the desired region inkjet resist. The thickness of each desired region inkjet resist hardened film was in the range of approximately 0.03 mm to approximately 0.05 mm. In this way, inkjet resist cured films 3 were formed in each desired region.

[0247] (C) Etching process. Next, as shown in Figure 4(C), an etching solution is brought into contact with the surface of the printing plate substrate 1 on which the desired region inkjet resist fine protrusion upper surface hardened film 3e, the desired region inkjet resist fine protrusion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g have been formed. The surface 12 of the second region of the printing plate substrate 1, on which the desired region inkjet resist hardened film 3 is not attached, is etched to a depth of approximately 0.3 mm. This forms an inkjet resist film corrosion second recess formation portion 121 having a recessed shape, and also forms an inkjet film corrosion pre-existing multiple fine protrusions 466 having a protruding shape, with the pre-existing multiple fine protrusions 46 protruding from the inkjet resist film corrosion second recess formation portion 121.

[0248] (D) Process to remove the inkjet resist curing film from the desired area. As shown in Figure 4(D), the inkjet resist cured film 3 was removed from the desired area. This creates an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-existing multiple fine uneven protrusion portion 466 having a plurality of pre-existing multiple fine uneven protrusion portions 461 and a plurality of pre-existing multiple fine uneven recess portions 462.

[0249] The depth "d1" of the pre-existing multiple micro-recesses 462 was approximately 0.1 mm (100 μm), and the height "d1" of the pre-existing multiple micro-recesses 461 was approximately 0.1 mm (approximately 100 μm), corresponding to the depth "d1" of the pre-existing multiple micro-recesses 462. The width "w2" of the pre-existing multiple micro-recesses 462 was approximately 0.05 mm (approximately 50 μm), and the width "w1" of the pre-existing multiple micro-recesses 461 was approximately 50 μm. Furthermore, the depth "d12" of the second recess formation area 121 due to inkjet resist film corrosion was approximately 0.3 mm.

[0250] Furthermore, it was confirmed that no side etching occurred on the side surface of the second recess formation portion 121 of the inkjet resist film corrosion, and that the side surface of the second recess formation portion 121 of the inkjet resist film corrosion has a smooth, desired inclined side surface that extends from the bottom surface of the second recess formation portion 121 of the inkjet resist film corrosion toward the multiple fine uneven protrusions 466 formed by the inkjet film corrosion. Furthermore, it was confirmed that the sides of the multiple pre-existing multiple micro-recesses 462 (corresponding to the sides of the multiple pre-existing multiple micro-recesses 461) in Figure 4(D) were not etched and maintained the normal, desired shape shown in Figure 4(A). In this way, a flexible embossing plate with a degree of flexibility that allows it to be deformed to match the spherical surface of a roll was manufactured, which had multiple pre-existing fine uneven protrusions 466 formed by inkjet film etching of a "heart pattern" with a fine uneven shape.

[0251] In this embodiment, it was confirmed that the desired inkjet film corrosion pre-existing multiple fine unevenness portion protrusions 466 are formed, which have a normal, desired multiple fine unevenness portion 46 and a protruding shape that protrudes from the bottom surface of the inkjet resist film corrosion second recess formation portion 121. Furthermore, it was confirmed that no side etching phenomenon occurred on the desired pre-existing multiple micro-recessed portion convex side surface 461b (pre-existing multiple micro-recessed portion concave side surface 462b), resulting in a recessed state, and that the desired shape accuracy and dimensional accuracy were achieved.

[0252] <Example 2B-a (Processing of a workpiece using the pressing plate from Example 2B installed in a roll device)> In this embodiment, the pressing plate 10 manufactured in Embodiment 2B described above is installed in a roll-type processing device and used as a foil stamping plate 10 to perform foil stamping. The workpiece was foil-stamped using the following process. (Sa) A foil stamping plate 10, which is a pressing plate 10 on which a plurality of pre-existing fine uneven surfaces 46, which is a pre-existing uneven surface 4, manufactured in Example 2B, was prepared and supplied. (Sb) A pressing device was prepared, equipped with a main roll 96 and a counter roll 97 facing each other. (Sc) The foil stamping plate 10, which serves as the pressing plate, is wrapped around the main roll 96 and installed. In this case, a magnetic member that generates magnetic force is configured inside the main roll 96, and the foil stamping plate 10, which serves as the flexible pressing plate 10, is wrapped around the main roll 96 by magnetic force and installed. (Sd) The designated receiving plate 94 was installed on the opposing roll 97 of the pressing device. In this embodiment, a stainless steel anvil roll 97 with a smooth spherical surface, prepared separately, was prepared and installed as the counter-roll 97. (Se) The main roll 96 and the opposing roll 97 are driven, and the workpieces, consisting of a 1 mm thick paper sheet as the workpiece base material 108a and a thin gold-colored sheet-like foil material 108b with a thickness of approximately 30 μm, are continuously supplied parallel to each other between the main roll 96 and the opposing roll 97, so that the pressing plate 10 and the receiving plate 94 rotate and continuously press the workpieces. As a result, a sheet-like foil material having a fine uneven shape that matches the uneven shape of the multiple fine uneven parts 46, which are pre-existing uneven parts 4, is transferred to the surface of the workpiece substrate 108a, thereby transferring and forming the workpiece foil stamping transfer formation part. (Sf) As the roll rotated, the workpiece was separated from the main roll 96 and the opposing roll 97, releasing the pressure on the workpiece. As a result, a workpiece was prepared in which a workpiece transfer forming portion was formed on the surface of the workpiece 108, having a fine uneven shape that matches the uneven shape of the multiple pre-existing fine uneven portions 46 as pre-existing uneven portions 4. In this way, a processed product was prepared in which a metal foil having a heart pattern and multiple fine relief patterns was transferred and formed on the surface of a paper sheet 108a, which was to be processed 108.

[0253] In this case, no abnormalities occurred in the paper sheet 108a and the metal foil sheet 108b, which were the workpieces 108. Under normal conditions, a workpiece was obtained in which a plurality of fine uneven patterns, which are fine uneven shapes with desired shape accuracy and dimensional accuracy, were formed on the paper sheet 108a, which was the workpiece 108, by transferring the metal foil.

[0254] <Comparative Example 2A (Manufacturing of a pressing plate using conventional liquid resist material)> This comparative example describes a method for manufacturing a pressing plate in which, in step (B) of Example 2A above, a conventional liquid resist material is used instead of the inkjet resist material to form the second recessed portion 121 of the inkjet resist film corrosion. Schematic diagrams illustrating the manufacturing process of this comparative example are shown in Figures 14 and 15. Figures 14 and 15 are schematic diagrams illustrating the manufacturing process of a conventional method for manufacturing a pressing plate.

[0255] (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing uneven surfaces 46. As shown in Figures 14(A) and (B), a plate-type substrate 1 having a planar surface shape was prepared, comprising a first region surface 11 having a planar surface shape and a second region surface 12 having a planar surface shape. The plate-type substrate 1 is made of steel and has a substantially flat shape with a thickness "h" of 0.5 mm, a width of 125 mm, and a height of 90 mm. Next, in the same manner as in step (A) of Example 2A, a conventional liquid resist material (a conventional liquid resist material that has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and is commonly used for plate making and etching of printed circuit boards, and is a desired conventional liquid resist material from among commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material used in step (A) of Example 1A described above) was applied to the surface of the plate-making substrate 1, including the surface of the first region 11 of the plate-making substrate 1, using a conventional resist material, to a thickness in the range of approximately 0.02 mm to approximately 0.04 mm, and dried by a predetermined method to form a resist film. Then, ultraviolet light was irradiated onto the resist-attached film through an exposure mask member having a desired fine graphic pattern (heart pattern) formed on it for light blocking. A cured resist film having the desired fine graphic pattern (heart pattern) was formed by development, after-baking, development, etc.

[0256] An etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1 on which a resist-cured film had been formed, and the surface of the plate-making substrate that did not have a resist-cured film attached was etched until the depth "d1" was approximately 0.1 mm (100 μm), thereby forming multiple pre-existing multiple fine uneven recesses 462 in a concave shape, and multiple pre-existing multiple fine uneven protrusions 461 in a convex shape. Next, the resist curing film was removed using a resist remover (caustic soda aqueous solution). In this way, as shown in Figure 14(B), a plurality of pre-existing micro-recesses 461 formed in a convex shape and a plurality of pre-existing micro-recesses 462 formed in a concave shape were created.

[0257] In this way, a plate-making substrate was prepared, wherein the second region surface 12 of the plate-making substrate has a smooth surface without irregularities, the first region surface 11 of the plate-making substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a plurality of pre-existing fine irregularities 46, the plurality of pre-existing fine irregularities 46 has a plurality of pre-existing multiple fine irregularity protrusions 461 formed by a plurality of fine convex shapes, and a plurality of pre-existing multiple fine irregularity recesses 462 formed by a plurality of fine concave shapes, the plurality of pre-existing multiple fine irregularity protrusions 461 has a plurality of pre-existing multiple fine irregularity protrusion upper surfaces 461a and a plurality of pre-existing multiple fine irregularity protrusion side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b. Furthermore, the multiple pre-existing multiple micro-recessed protrusions 461b and the multiple pre-existing multiple micro-recessed recesses 462 are the same side region and represent the same side. The material and shape of the plate-making substrate are the same as in Example 2A, being made of steel, with a thickness "h" of 0.5 mm, a width of 125 mm, a height of 90 mm, flexibility, and a substantially flat shape. Furthermore, the depth "d1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.1 mm (approximately 100 μm), and the height "d1" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.1 mm (approximately 100 μm), corresponding to the depth of the pre-existing multiple micro-recessed portion recess 462. The width "w1" of each pre-existing multiple micro-recessed portion recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of each pre-existing multiple micro-recessed portion protrusion 461 was approximately 0.05 mm (approximately 50 μm).

[0258] (B) Conventional conventional resist curing film formation process. As shown in Figure 14(C), a conventional liquid resist material (a conventional liquid resist material that has the property of crosslinking into a three-dimensional chemical structure by chemical reaction upon ultraviolet irradiation and is commonly used for plate making and etching of printed circuit boards, and is a desired conventional liquid resist material from among commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material used in step (A) above in this embodiment 2A) was used to adhere to the surface of the plate-making substrate 1 by a conventional spray-coating method, covering the upper surfaces 461a of the multiple pre-existing multiple fine uneven surfaces, the side surfaces 461b of the multiple pre-existing multiple fine uneven surfaces, the bottom surfaces 462c of the multiple pre-existing multiple fine uneven surfaces, and the side surfaces 462b of the multiple pre-existing multiple fine uneven surfaces) and forming a liquid resist adhesion film.

[0259] Subsequently, the attached liquid resist film was cured by conventional methods such as ultraviolet irradiation exposure, development, and after-baking, using an exposure mask member of the desired shape (an exposure mask member having through holes in the portion corresponding to the "heart pattern" region formed on the first region surface 11 of the plate-making substrate when the exposure mask member is placed on the surface of the plate-making substrate, and having a light-blocking portion in the surrounding region), thereby forming a conventional resist cured film 30 that forms a conventional resist fine protrusion upper surface cured film 30e and a conventional resist fine recess bottom surface cured film 30g, as shown in Figure 14(C). However, the conventional resist material attached to the existing multiple fine uneven surface protrusion side surface 461b (existing multiple fine uneven surface recess side surface 462b) flowed down to the bottom surface of the existing multiple fine uneven surface recess, and a conventional resist fine recess side surface cured film (conventional resist fine protrusion side surface cured film) was not formed. The thickness of the conventionally cured resist film 30 was in the range of approximately 0.02 mm to approximately 0.04 mm.

[0260] In this process, a resist-cured film was formed in which no resist-cured film was formed in the peripheral region of the mold substrate, but a conventional resist-cured film was formed in the internal region. Furthermore, within that internal region, the conventional liquid resist material adhered well to the upper surface 461a of the multiple existing fine uneven surfaces and the bottom surface 462c of the multiple existing fine uneven surfaces, and formed a conventional resist hardened film 30e on the upper surface of the fine uneven surfaces and a conventional resist hardened film 30g on the bottom surface of the fine uneven surfaces in the desired region. However, the conventional liquid resist material flowed down from the side surfaces 461b (and the side surfaces 462b) of the multiple existing fine uneven surfaces, and no conventional resist hardened film was formed on the side surfaces 461b (and the side surfaces 462b) of the multiple existing fine uneven surfaces.

[0261] (C) Etching process. As shown in Figure 15(D), an etching solution (ferric chloride aqueous solution) was brought into contact with the surface of the plate-making substrate 1, which had a conventional resist fine protrusion upper surface hardened film 30e and a conventional resist fine recess bottom surface hardened film 30g formed on it, using a paddle blowing method. The surface 12 of the second region of the plate-making substrate, to which the conventional resist hardened film was not attached, was etched until the depth dimension "d3" was approximately 0.1 mm, thereby forming a second recessed area 121b during the etching process. In this case, slight side etching occurred on the convex side surface 461b (concrete side surface 462b) of the pre-existing multiple fine uneven areas.

[0262] As shown in Figure 15(E), the etching was further continued to etch the surface 12 of the second region of the plate-making substrate until the depth dimension "d12a" was approximately 0.3 mm. As a result, the surface 12 of the second region of the substrate for printing plates is etched to form a conventionally used second erosion recess-forming portion 121s having an etched recessed shape, and the multiple pre-existing fine irregularities 46 are formed to protrude from the conventionally used second erosion recess-forming portion 121s.

[0263] (D) Conventional resist curing film removal process. As shown in Figure 15(F), the conventional resist micro-protrusion upper surface hardened film 30e and the conventional resist micro-recess lower surface hardened film 30g were removed using a resist remover (caustic sota aqueous solution or sodium hydroxide aqueous solution).

[0264] In the aforementioned "(C) Corrosion Etching Process," the pre-existing multiple micro-recessed protrusions 461b (pre-existing multiple micro-recessed recesses 462b) on which the hardened film had not been attached were also corroded and etched, resulting in side-etched pre-existing multiple micro-recessed protrusions 461s (multiple side-etched pre-existing multiple micro-recessed recesses 462s) as shown in Figure 15(D). In other words, a pressing plate with the desired shape accuracy and dimensional accuracy could not be obtained. Such side-etched pre-existing multiple micro-recesses have undesirable shapes, resulting in undesirable shapes. When a workpiece is processed using a press-forming die with such side-etched micro-recesses, it is undesirable because a workpiece with the desired recessed shape cannot be obtained. Side etching refers to a shape in which the side surfaces 461b of the convex parts or the side surfaces 462b of the concave parts of the existing multiple fine uneven surfaces are etched in a way that causes them to be recessed toward the inner surface of the side surface. This shape is undesirable for a plate used for pressing.

[0265] <Comparative Example 2Ab (Manufacturing of a pressing plate using conventional dry film resist material)> Other comparative examples of Example 2A described above are explained below. This comparative example uses a plate-making substrate 1 equipped with a plate-making substrate second region surface 12 having a smooth, non-irregular area and a plate-making substrate first region surface 11 having a plurality of pre-existing fine irregularities 46 as pre-existing irregularities 4, using a conventional conventional liquid resist material in the same process as in step (A) of Example 2A above. Subsequently, in step (B), a conventional conventional dry film resist material is used instead of the inkjet resist material to manufacture a plate for pressing. Figures illustrating this comparative example are shown in Figures 21(B) to (F).

[0266] (A) A process of preparing and supplying a printing plate substrate 1 having a first region surface 11 and a second region surface 12 of the printing plate substrate, each having multiple pre-existing fine irregularities 46. A printing plate substrate was prepared using the same method as in step (A) of the above-described Example 2A, wherein the second region surface 12 of the printing plate substrate has a smooth surface without irregularities, the first region surface 11 of the printing plate substrate has a pre-existing irregularity 4, the pre-existing irregularity 4 has a pre-existing multiple fine irregularity 46, (b) the pre-existing multiple fine irregularity 46 has a plurality of pre-existing multiple fine irregularity protrusions 461 formed by a plurality of fine protrusion shapes, and a plurality of pre-existing multiple fine irregularity recesses 462 formed by a plurality of fine recess shapes, the plurality of pre-existing multiple fine irregularity protrusions 461 has a plurality of pre-existing multiple fine irregularity protrusion upper surfaces 461a and a plurality of pre-existing multiple fine irregularity protrusion side surfaces 461b, and the plurality of pre-existing multiple fine irregularity recesses 462 has a plurality of pre-existing multiple fine irregularity recess bottom surfaces 462c and a plurality of pre-existing multiple fine irregularity recess side surfaces 462b. The material and shape of the substrate for the printing plate are the same as in Example 2A, being made of steel and having a substantially flat shape with flexibility, a thickness of 0.5 mm, a width of 125 mm, and a height of 90 mm. Furthermore, the depth "d1" of the pre-existing multiple fine uneven recesses 462 was approximately 0.1 mm (approximately 100 μm), and the height "d1" of the pre-existing multiple fine uneven protrusions 461 was approximately 0.1 mm (approximately 100 μm), corresponding to the depth of the pre-existing multiple fine uneven recesses 462. The width "w1" of each pre-existing multiple fine uneven recess 462 was approximately 0.05 mm (approximately 50 μm), and the width "w2" of the pre-existing multiple fine uneven protrusions 461 was approximately 0.05 mm (approximately 50 μm). In this way, a plate-making substrate as shown in Figure 21(A) was prepared. In Figure 21(A), the reference numerals 461a, 461b, 462c, and 462b are not shown, but are similar to the reference numerals shown in Figure 14(B). A plurality of pre-existing multiple micro-recesses have multiple pre-existing multiple micro-recesses, protrusions 461a and multiple pre-existing multiple micro-recesses, protrusions 461b, and a plurality of pre-existing multiple micro-recesses have multiple pre-existing multiple micro-recesses, recesses 462 have multiple pre-existing multiple micro-recesses, recess bottoms 462c and multiple pre-existing multiple micro-recesses, recess sides 462b.

[0267] (B) Conventional resist curing film formation process. Next, as shown in Figure 21(B), a conventional dry film resist material 20 (with a thickness of approximately 0.02 mm to 0.04 mm) was attached to the surface of the mold substrate on which the pre-formed multiple fine irregularities 46 were created, using a conventional method. As the conventional dry film resist material 20, a sheet-type dry film resist material (with a thickness of approximately 0.02 mm to 0.04 mm) was selected from commercially available conventional sheet-type dry film resist materials. In this case, gaps were created between the conventional dry film resist material and the sides 461b (sides 462b) of the convex portions 46 of the pre-existing multiple fine uneven portions 46 formed on the mold substrate and the bottom surface 462c of the concave portions 46 of the pre-existing multiple fine uneven portions 46, without contact between them. Next, as shown in Figure 21(C), a resist-cured film was formed on the printing plate substrate to which the conventional dry film resist material was attached, by irradiating it with ultraviolet lig...

Claims

1. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, (A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12), (B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3), (C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched. This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1), And, (D) A step to remove the inkjet resist cured film (3) in the desired region. It is equipped with, The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel. In step (A) above, The second region surface (12) of the plate-type substrate has one or more smooth, non-irregular areas. The first region surface (11) of the plate-type substrate has one or more pre-existing uneven surfaces (4), (i) The surface (12) of the second region of the substrate for the plate mold has a single smooth surface without any irregularities, When the first region surface (11) of the substrate for the plate mold has one pre-existing uneven portion (4), The smooth portion is located in the area surrounding the pre-existing uneven portion (4). The aforementioned pre-existing uneven portion (4) is (a) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes, Or, (b) A pre-existing multiple micro-recessed portion (46) having multiple pre-existing multiple micro-recessed portions (461) formed by multiple micro-convex shapes and multiple pre-existing multiple micro-recessed portions (462) formed by multiple micro-concave shapes, It has, (ii) The second region surface (12) of the plate-type substrate has a plurality of smooth, even portions, When the first region surface (11) of the substrate for the plate mold has a plurality of pre-existing uneven portions (4), Each of the aforementioned smooth areas is located in the surrounding region of each of the aforementioned predetermined areas (4) Each of the aforementioned multiple pre-existing uneven surfaces (4) is, (a) A pre-existing multiple uneven portion (45) having multiple convex portions (451) formed by multiple convex shapes and multiple pre-existing multiple uneven portion recesses (452) formed by multiple concave shapes, and / or, (b) A pre-existing multiple micro-recessed portion (46) having multiple pre-existing multiple micro-recessed portions (461) formed by multiple micro-convex shapes and multiple pre-existing multiple micro-recessed portions (462) formed by multiple micro-concave shapes, It has, In step (B) above, A desired region inkjet resist film formation step, in which an inkjet resist material (2) is attached by an inkjet method to cover the pre-existing uneven portion (4) on the first region surface (11) of the plate-type substrate (1) to form a desired region inkjet resist film, And, The process includes a desired region inkjet resist curing step, which involves curing the aforementioned desired region inkjet resist deposition film to form a desired region inkjet resist cured film (3), In step (C) above, The process includes etching a plate-making substrate by contacting an etching solution with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, thereby etching the second region surface (12) of the plate-making substrate where the desired region inkjet resist cured film is not attached. As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing uneven portion (4), forming a second inkjet resist film corrosion recess-forming portion (121) with a recessed shape, where the second inkjet resist film corrosion recess-forming portion (121) corresponds to the inkjet resist film corrosion recess-forming portion. In step (D) above, The system includes a step for removing the inkjet resist cured film (3) in the desired region, This allows etching of the second region surface (12) of the plate-type substrate without etching the pre-existing uneven portion (4) to form the inkjet resist film corrosion second recess-forming portion (121) which is formed in a recessed shape, and also forms the pre-existing uneven portion (4) into a protruding shape that protrudes from the inkjet resist film corrosion second recess-forming portion (121). A method for manufacturing a plate for pressing, characterized by the above.

2. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, (A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12), (B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3), (C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched. This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1), And, (D) A step to remove the inkjet resist cured film (3) in the desired region. It is equipped with, The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel. In step (A) above, The surface (12) of the second region of the substrate for the plate mold has a smooth surface without irregularities. The first region surface (11) of the substrate for the plate mold has a pre-existing uneven portion (4), The second region surface (12) of the substrate for printing plates is located in the surrounding region of the first region surface (11) of the substrate for printing plates. The aforementioned pre-existing uneven portion (4) has a plurality of pre-existing uneven portions (45), (a) The pre-existing multiple uneven portion (45) has a plurality of pre-existing multiple uneven portion convex portions (451) formed by a plurality of convex shapes and a plurality of pre-existing multiple uneven portion recesses (452) formed by a plurality of concave shapes, The plurality of pre-existing multiple uneven parts protrusions (451) have a plurality of pre-existing multiple uneven parts protrusions upper surfaces (451a) and a plurality of pre-existing multiple uneven parts protrusions side surfaces (451b), The plurality of pre-existing multiple recesses (452) have a plurality of pre-existing multiple recesses bottom surfaces (452c) and a plurality of pre-existing multiple recesses side surfaces (452b), Here, the multiple pre-existing protruding surfaces (451b) and the multiple pre-existing recessed surfaces (452b) correspond to the same lateral region. In step (B) above, In the inkjet resist film formation step, an inkjet resist material (2) is applied by an inkjet method to cover the upper surfaces (451a) of the multiple pre-existing multiple uneven portions, the side surfaces (451b) of the multiple pre-existing multiple uneven portions, and the bottom surfaces (452c) of the multiple pre-existing multiple uneven portions, thereby forming an inkjet resist film attached to the upper surface of the uneven portions, an inkjet resist film attached to the side surfaces of the uneven portions, and an inkjet resist film attached to the bottom surface of the uneven portions, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-making substrate located in the area surrounding the multiple pre-existing multiple uneven portions (45), and The process includes a desired region inkjet resist curing film step, which involves curing the inkjet resist upper surface adhering film of the protrusions, the inkjet resist side surface adhering film of the protrusions, and the inkjet resist bottom surface adhering film to form a desired region inkjet resist curing film (3) having a desired region inkjet resist upper surface curing film (3a), a desired region inkjet resist side surface curing film (3b), and a desired region inkjet resist bottom surface curing film (3c), In step (C) above, The process includes an etching step for a plate-making substrate, in which an etching solution is brought into contact with the surface of the plate-making substrate (1), which has the desired region inkjet resist upper surface cured film (3a) of the desired region inkjet resist protrusions, the desired region inkjet resist side surface cured film (3b) of the desired region inkjet resist recess bottom surface cured film (3c), to etch the second region surface (12) of the plate-making substrate to which the desired region inkjet resist cured film (3) is not attached. As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple uneven portions (45), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape, The aforementioned multiple pre-existing uneven portions (45) are formed into inkjet film corrosion pre-existing multiple uneven portion protrusions (455) having a protruding shape that protrudes from the inkjet resist film corrosion second recess forming portion (121), In step (D) above, The process includes a step to remove the hardened film on the upper surface of the protrusions of the desired region inkjet resist (3a), the hardened film on the side of the protrusions of the desired region inkjet resist (3b), and the hardened film on the bottom surface of the desired region inkjet resist (3c). As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple recesses (45), The first region surface (11) of the plate-type substrate, which has the multiple pre-existing multiple protrusions (451) and the multiple pre-existing multiple recesses (452) of the multiple pre-existing multiple protrusions (455), is formed in the form of an inkjet film corrosion pre-existing multiple protrusions (455) that protrudes from the bottom surface of the inkjet resist film corrosion second recess-forming portion (121). A method for manufacturing a plate for pressing, characterized by the above.

3. In step (A) above, The pre-existing multiple uneven portion (45) having the pre-existing multiple uneven portion protrusions (451) and the pre-existing multiple uneven portion recesses (452) is, (i) Letters, (b) Symbol, (c) Figures, (ii) The design, and, (e) Pattern, The method for manufacturing a pressing plate according to claim 2, characterized in that it forms a graphic character pattern consisting of at least one uneven shape selected from the group consisting of the above.

4. In step (A) above, The height dimension of each of the aforementioned multiple pre-existing multiple recessed parts (451) is 0.1 mm or more. The depth dimension of each of the aforementioned multiple pre-existing multiple recesses (452) is 0.1 mm or more. The depth dimension of the inkjet resist film corrosion second recess formation portion (121) is the same as the depth dimension of the pre-existing multiple recesses, or a greater depth dimension than the pre-existing multiple recesses. The method for manufacturing a pressing plate according to feature 2.

5. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, (A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12), (B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3), (C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched. This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1), And, (D) A step to remove the inkjet resist cured film (3) in the desired region. It is equipped with, The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel. In step (A) above, The aforementioned mold substrate (1) has a first mold substrate surface area (11) and a second mold substrate surface area (12), The surface (12) of the second region of the substrate for the plate mold has a smooth surface without irregularities. The first region surface (11) of the substrate for the plate mold has a pre-existing uneven portion (4), The second region surface (12) of the substrate for printing plates is located in the surrounding region of the first region surface (11) of the substrate for printing plates. (b) The pre-existing uneven portion (4) has a plurality of pre-existing fine uneven portions (46), The aforementioned pre-existing multiple fine uneven portion (46) has a plurality of pre-existing multiple fine uneven portion protrusions (461) and a plurality of pre-existing multiple fine uneven portion recesses (462), The plurality of pre-existing multiple fine uneven protrusions (461) have a plurality of upper surfaces (461a) and a plurality of side surfaces (461b) of the pre-existing multiple fine uneven protrusions. The plurality of pre-existing multiple fine uneven recesses (462) have a plurality of pre-existing multiple fine uneven recess bottom surfaces (462c) and a plurality of pre-existing multiple fine uneven recess side surfaces (462b), Here, the multiple pre-existing multiple fine uneven surface convex side surfaces (461b) and the multiple pre-existing multiple fine uneven surface concave side surfaces (462b) correspond to the same side surface region. In step (B) above, In an inkjet resist film formation step, the inkjet resist material (2) is applied by an inkjet method to cover the upper surfaces (461a) of the multiple pre-existing multiple fine uneven portions, the side surfaces (461b) of the multiple pre-existing multiple fine uneven portions, and the bottom surfaces (462c) of the multiple pre-existing multiple fine uneven portions, thereby forming an inkjet resist film attached to the upper surface of the fine uneven portions, an inkjet resist film attached to the side surfaces of the fine uneven portions, and an inkjet resist film attached to the bottom surface of the fine recesses, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-making substrate located in the area surrounding the multiple pre-existing fine uneven portions (46), and The process includes an inkjet resist curing film formation step, in which the inkjet resist curing film attached to the upper surface of the inkjet resist fine protrusions, the inkjet resist curing film attached to the side surface of the inkjet resist fine protrusions, and the inkjet resist curing film attached to the bottom surface of the inkjet resist fine recesses are cured to form a desired region inkjet resist curing film 3 having a desired region inkjet resist curing film on the upper surface of the inkjet resist fine protrusions (3e), a desired region inkjet resist curing film on the side surface of the inkjet resist fine protrusions (3f), and a desired region inkjet resist curing film on the bottom surface of the inkjet resist fine recesses (3g). In step (C) above, The process includes an etching step for a printing plate substrate, in which an etching solution is brought into contact with the surface of the printing plate substrate (1) on which the desired region inkjet resist fine protrusion upper surface cured film (3e), the desired region inkjet resist fine protrusion side surface cured film (3f), and the desired region inkjet resist fine recess bottom surface cured film (3g) are formed, thereby etching the second region surface (12) of the printing plate substrate to which the desired region inkjet resist cured film 3 is not attached. As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple fine uneven portions (46), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape, The aforementioned multiple pre-existing fine uneven portions (46) are formed into the form of inkjet film corrosion pre-existing multiple fine uneven portion protrusions (466) that protrude from the inkjet resist film corrosion second recess forming portion (121), In step (D) above, The process includes a resist curing film removal step that removes the hardened film on the upper surface of the fine protrusions of the desired region inkjet resist (3e), the hardened film on the side of the fine protrusions of the desired region inkjet resist (3f), and the hardened film on the bottom surface of the fine recesses of the desired region inkjet resist (3g). As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple fine uneven portions (46), The first region surface (11) of the plate-type substrate, which has a plurality of pre-existing multiple fine uneven portions (46) having a plurality of pre-existing multiple fine uneven portions (461) and a plurality of pre-existing multiple fine uneven portions (462), is formed in the form of an inkjet film corrosion pre-existing multiple fine uneven portion projection (466) that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion (121). A method for manufacturing a plate for pressing, characterized by the above.

6. In step (A) above, The aforementioned multiple pre-existing multiple fine uneven parts (46) having multiple pre-existing multiple fine uneven parts protrusions (461) and multiple pre-existing multiple fine uneven parts recesses (462) is (f) Fine dot patterns, fine patterned designs, fine picture patterns, and / or fine grid patterns, (T) Fine line pattern, (Chi) Fine striped pattern, and, (Ri) Latent patterns that represent different pictographic patterns when viewed from different directions. A fine graphic character pattern is formed by at least one plurality of fine uneven shapes selected from the group consisting of the following, The method for manufacturing a pressing plate according to feature 5.

7. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, (A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12), (B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3), (C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched. This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1), And, (D) A step to remove the inkjet resist cured film (3) in the desired region. It is equipped with, The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel. In step (A) above, The aforementioned mold substrate (1) has a first mold substrate surface area (11) and a second mold substrate surface area (12), The surface (12) of the second region of the substrate for the plate mold has a smooth surface without irregularities. The first region surface (11) of the substrate for the plate mold has a pre-existing uneven portion (4), The surface (12) of the second region of the substrate for the pattern is located in the peripheral region of the surface (11) of the first region of the substrate for the pattern, (b) The pre-existing uneven portion (4) has a plurality of pre-existing fine uneven portions (46), The aforementioned pre-existing multiple fine uneven portion (46) has a plurality of pre-existing multiple fine uneven portion protrusions (461) and a plurality of pre-existing multiple fine uneven portion recesses (462), The plurality of pre-existing multiple fine uneven protrusions (461) have a plurality of upper surfaces (461a) and a plurality of side surfaces (461b) of the pre-existing multiple fine uneven protrusions. The plurality of pre-existing multiple fine uneven recesses (462) have a plurality of pre-existing multiple fine uneven recess bottom surfaces (462c) and a plurality of pre-existing multiple fine uneven recess side surfaces (462b), Here, the multiple pre-existing multiple fine uneven surface convex side surfaces (461b) and the multiple pre-existing multiple fine uneven surface concave side surfaces (462b) correspond to the same side surface region. In step (A) above, The pre-existing multiple fine uneven portion (46), which has multiple pre-existing multiple fine uneven portion protrusions (461) and multiple pre-existing multiple fine uneven portion recesses (462), is formed by a combination of multiple types of uneven pattern cells that are engraved with a fine uneven shape, divided into predetermined shapes, and arranged in a regular manner. Each of the aforementioned multiple types of uneven pattern cells is formed with a fine graphic character pattern, which consists of at least two types of fine uneven shapes selected from the group consisting of fine dot patterns, fine patterned patterns, fine picture patterns, fine line patterns, and fine striped patterns. Multiple micro-picture patterns of one of two or more types of micro-picture patterns come together to form the first image. Multiple fine graphic character patterns of a second type, different from one of the two or more types of fine graphic character patterns mentioned above, are gathered together to form another image. In step (B) above, In an inkjet resist film formation step, the inkjet resist material (2) is applied by an inkjet method to cover the upper surfaces (461a) of the multiple pre-existing multiple fine uneven portions, the side surfaces (461b) of the multiple pre-existing multiple fine uneven portions, and the bottom surfaces (462c) of the multiple pre-existing multiple fine uneven portions, thereby forming an inkjet resist film attached to the upper surface of the fine uneven portions, an inkjet resist film attached to the side surfaces of the fine uneven portions, and an inkjet resist film attached to the bottom surface of the fine recesses, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-making substrate located in the area surrounding the multiple pre-existing fine uneven portions (46), and The process includes an inkjet resist curing film formation step, in which the inkjet resist curing film attached to the upper surface of the inkjet resist fine protrusions, the inkjet resist curing film attached to the side surface of the inkjet resist fine protrusions, and the inkjet resist curing film attached to the bottom surface of the inkjet resist fine recesses are cured to form a desired region inkjet resist curing film 3 having a desired region inkjet resist curing film on the upper surface of the inkjet resist fine protrusions (3e), a desired region inkjet resist curing film on the side surface of the inkjet resist fine protrusions (3f), and a desired region inkjet resist curing film on the bottom surface of the inkjet resist fine recesses (3g). In step (C) above, The process includes an etching step for a printing plate substrate, in which an etching solution is brought into contact with the surface of the printing plate substrate (1) on which the desired region inkjet resist fine protrusion upper surface cured film (3e), the desired region inkjet resist fine protrusion side surface cured film (3f), and the desired region inkjet resist fine recess bottom surface cured film (3g) are formed, thereby etching the second region surface (12) of the printing plate substrate to which the desired region inkjet resist cured film 3 is not attached. As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple fine uneven portions (46), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape, The aforementioned multiple pre-existing fine uneven portions (46) are formed into the form of inkjet film corrosion pre-existing multiple fine uneven portion protrusions (466) that protrude from the inkjet resist film corrosion second recess forming portion (121), In step (D) above, The process includes a resist curing film removal step that removes the hardened film on the upper surface of the fine protrusions of the desired region inkjet resist (3e), the hardened film on the side of the fine protrusions of the desired region inkjet resist (3f), and the hardened film on the bottom surface of the fine recesses of the desired region inkjet resist (3g). As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple fine uneven portions (46), The first region surface (11) of the plate-type substrate, which has a plurality of pre-existing multiple fine uneven portions (46) having a plurality of pre-existing multiple fine uneven portions (461) and a plurality of pre-existing multiple fine uneven portions (462), is formed in the form of an inkjet film corrosion pre-existing multiple fine uneven portion projection (466) that protrudes from the bottom surface of the inkjet resist film corrosion second recess forming portion (121). A method for manufacturing a plate for pressing, characterized by the above.

8. In step (A) above, The height dimension of each of the aforementioned multiple pre-existing multiple fine uneven protrusions (461) is 0.05 mm or more. The width dimension of each of the aforementioned multiple pre-existing multiple fine uneven protrusions (461) is 0.0005 mm to 1 mm. The depth dimension of each of the aforementioned multiple pre-existing multiple fine uneven recesses (462) is 0.05 mm or more. The width dimension of each of the aforementioned multiple pre-existing multiple fine uneven recesses (462) is 0.0005 mm to 1 mm. The depth dimension of the inkjet resist film corrosion second recess formation portion (121) is greater than the depth dimension of the pre-existing multiple fine uneven recesses. A method for manufacturing a pressing plate according to claim 5 or 7.

9. A method for manufacturing a pressing plate for processing a workpiece into a predetermined shape by pressing, (A) A plate-type substrate supply process that supplies a plate-type substrate (1) having a first plate-type substrate surface area (11) and a second plate-type substrate surface area (12), (B) A desired region inkjet resist film formation step, wherein an inkjet resist material (2) is attached to a desired region of the first region surface (11) of the plate-type substrate (1) by an inkjet method to form a desired region inkjet resist film, and A desired region inkjet resist curing film step, which involves curing the inkjet resist-adhered film to form a desired region inkjet resist cured film (3), (C) A plate-making substrate etching step, in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is formed, and the surface of the plate-making substrate (1) on which the desired region inkjet resist cured film (3) is not attached is etched. This creates an inkjet resist film corrosion recess formation portion formed in a recessed shape on the surface of the plate-type substrate (1), And, (D) A step to remove the inkjet resist cured film (3) in the desired region. It is equipped with, The aforementioned plate mold substrate (1) is made of iron, stainless steel, brass, copper, magnesium, duralumin, cemented carbide, powder high-speed steel, high-speed steel, die steel, alloy tool steel, carbon tool steel, or steel. In step (A) above, The surface (12) of the second region of the substrate for the plate mold has a plurality of smooth, even areas without irregularities. The first region surface (11) of the plate-type substrate has a plurality of pre-existing uneven portions (4), Each of the multiple second region surfaces (12) of the plate-type substrate is located in the surrounding region of each of the multiple first region surfaces (11) of the plate-type substrate, One of the multiple pre-existing uneven surfaces (4) is, (a) Having a plurality of pre-existing multiple recessed parts (45) which have a plurality of convex shapes and a plurality of pre-existing multiple recessed parts (452) which have a plurality of concave shapes, Of the plurality of pre-existing uneven surfaces (4), one other pre-existing uneven surface (4) is (b) Having a plurality of pre-existing multiple micro-recessed portions (46) which have a plurality of pre-existing multiple micro-recessed portions (461) formed by a plurality of micro-convex shapes and a plurality of pre-existing multiple micro-recessed portions (462) formed by a plurality of micro-concave shapes, The plurality of pre-existing multiple uneven parts protrusions (451) have a plurality of pre-existing multiple uneven parts protrusions upper surfaces (451a) and a plurality of pre-existing multiple uneven parts protrusions side surfaces (451b), The plurality of pre-existing multiple recesses (452) have a plurality of pre-existing multiple recesses bottom surfaces (452c) and a plurality of pre-existing multiple recesses side surfaces (452b), Here, the multiple pre-existing protruding surfaces (451b) and the multiple pre-existing recessed surfaces (452b) correspond to the same lateral region. The plurality of pre-existing multiple fine uneven protrusions (461) have a plurality of upper surfaces (461a) and a plurality of side surfaces (461b) of the pre-existing multiple fine uneven protrusions. The plurality of pre-existing multiple fine uneven recesses (462) have a plurality of pre-existing multiple fine uneven recess bottom surfaces (462c) and a plurality of pre-existing multiple fine uneven recess side surfaces (462b), Here, the multiple pre-existing multiple fine uneven surface convex side surfaces (461b) and the multiple pre-existing multiple fine uneven surface concave side surfaces (456b) correspond to the same side surface region. In step (B) above, In an inkjet resist film formation step, inkjet resist material (2) is applied by inkjet method to cover the multiple pre-existing multiple uneven portion convex upper surfaces (451a), the multiple pre-existing multiple uneven portion convex side surfaces (451b), the multiple pre-existing multiple uneven portion recess bottom surfaces (452c), and the multiple pre-existing multiple multiple fine uneven portion convex upper surfaces (461a), the multiple pre-existing multiple multiple fine uneven portion convex side surfaces (461b), and the multiple pre-existing multiple multiple fine uneven portion recess bottom surfaces (462c), thereby forming an inkjet resist film attached to the upper surface of the convex portion, an inkjet resist film attached to the side surfaces of the convex portion, an inkjet resist film attached to the bottom surface of the recess, and an inkjet resist film attached to the upper surface of the fine uneven portion, an inkjet resist film attached to the side surfaces of the fine uneven portion, and an inkjet resist film attached to the bottom surface of the fine recess, wherein the inkjet resist material (2) is not applied to the second region surface (12) of the plate-type substrate located in the area surrounding the multiple pre-existing multiple uneven portions (45), and The process includes an inkjet resist curing film formation step, in which the inkjet resist material (2) is applied by an inkjet method to form an inkjet resist cured film 3 having an inkjet resist cured film on the upper surface of the inkjet resist protrusions, an inkjet resist cured film on the side of the inkjet resist protrusions, an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist protrusions, and an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist protrusions, an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist fine protrusions, and an inkjet resist cured film on the bottom of the inkjet resist recesses, and an inkjet resist cured film on the bottom of the inkjet resist fine recesses, and the inkjet resist cured film on the upper surface of the inkjet resist fine protrusions, an inkjet resist cured film on the side of the inkjet resist fine protrusions, and an inkjet resist cured film on the bottom of the inkjet resist fine recesses, respectively. In step (C) above, The process includes a plate-making substrate etching step in which an etching solution is brought into contact with the surface of the plate-making substrate (1) on which the above-mentioned desired-area inkjet resist upper surface cured film (3a) of the raised portion As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing multiple uneven portions (45) and the pre-existing multiple fine uneven portions (46), thereby forming an inkjet resist film corrosion second recess-forming portion (121) having an etched recess shape, The aforementioned multiple pre-existing uneven portions (45) are formed into the form of inkjet film corrosion pre-existing multiple uneven portion protrusions (455) having a protruding shape that protrudes from the inkjet resist film corrosion second recess forming portion (121), The aforementioned multiple pre-existing fine uneven portions (46) are formed into inkjet film corrosion pre-existing multiple fine uneven portion protrusions (466) having a shape that protrudes from the inkjet resist film corrosion second recess forming portion (121), In step (D) above, The system includes a resist curing film removal step for removing the inkjet resist curing film (3) in the desired region, As a result, the surface of the second region (12) of the plate-type substrate is etched without etching the pre-existing uneven portion (4) to form the inkjet resist film corrosion second recess-forming portion (121), and the pre-existing uneven portion is formed into the form of an inkjet film corrosion pre-existing uneven portion projection having a protruding shape that extends from the inkjet resist film corrosion second recess-forming portion (121). The process includes a resist curing film removal step for removing the hardened film on the upper surface of the desired region inkjet resist protrusions (3a), the hardened film on the side of the desired region inkjet resist protrusions (3b), the hardened film on the bottom surface of the desired region inkjet resist recesses (3c), and the hardened film on the upper surface of the desired region inkjet resist fine protrusions (3e), the hardened film on the side of the desired region inkjet resist fine protrusions (3f), and the hardened film on the bottom surface of the desired region inkjet resist fine recesses (3g). As a result, the inkjet resist film corrosion second recess formation portion (121) is formed by etching the second region surface (12) of the plate-type substrate without etching the pre-existing multiple recesses (45), The first region surface (11) of the printing plate substrate, which has a plurality of pre-existing multiple uneven parts (45) having a plurality of pre-existing multiple uneven parts (451) and a plurality of pre-existing multiple uneven parts (452), and a plurality of pre-existing multiple fine uneven parts (46) having a plurality of pre-existing multiple fine uneven parts (461) and a plurality of pre-existing multiple fine uneven parts (462), is formed in the form of an inkjet film corrosion pre-existing multiple uneven parts protrusion (455) and an inkjet film corrosion pre-existing multiple fine uneven parts protrusion (466) that protrude from the bottom surface of the inkjet resist film corrosion second recess forming portion (121). A method for manufacturing a plate for pressing, characterized by the above.

10. The aforementioned pressing plate is (i) Flat plates configured in a flat-pressure type processing device having flat plates facing each other, (b) Roll plates configured in a roll-type processing device having roll shapes facing each other, (h) A flexible plate configured by winding and fixing it around a cylindrical or cylindrical roll, or a flexible plate configured by fixing it to the surface of a plate-shaped substrate for printing plates. (ii) A die for processing a workpiece into a predetermined uneven shape, (e) A foil stamping plate for applying foil stamping to a workpiece. (f) Cutting and cutting plates for cutting and / or cutting a workpiece into a predetermined shape. And, (t) A die-stamping / cutting / cutting plate for stamping or foil-stamping a workpiece into a predetermined uneven shape, and for cutting and / or cutting it. A pressing plate having at least one form selected from the group consisting of the following: A method for manufacturing a pressing plate according to claim 1, 2, 5, or 9.

11. (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9, (S-b) A step of preparing a pressing device equipped with a first base (92) and a second base (93) facing each other, (S-d) A step of installing a predetermined receiving plate (94) on the second base (93) of the pressing device, (S-e) With the workpiece (108) positioned between the pressing plate (10) and the receiving plate (94), the process of driving at least one of the first base (92) and the second base (93) so that the pressing plate (10) and the receiving plate (94) press the workpiece, This creates a workpiece surface (108) with a surface shape that matches the surface shape of the pre-existing surface (4), And, (S-f) A step of driving at least one base of the pressing plate (10) and the receiving plate (94) to separate the pressing plate (10) and the receiving plate (94) from each other and to release the pressure on the workpiece, This prepares a workpiece in which the workpiece transfer forming portion is formed on the surface of the workpiece (108) in a form that has an uneven shape that matches the uneven shape of the pre-existing uneven portion (4). A method for processing a workpiece, characterized by comprising the following:

12. (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9, (S-b) A step of preparing a pressing device equipped with a first base (92) and a second base (93) facing each other, (S-d) A step of installing a predetermined receiving plate (94) on the second base (93) of the pressing device, (S-e) With the workpiece substrate (108a) and the sheet-like foil material (108b) positioned between the pressing plate (10) and the receiving plate (94), the process of driving at least one of the first base (92) and the second base (93) so that the pressing plate (10) and the receiving plate (94) press the workpiece, As a result, the sheet-like foil material (108b) is used to form a workpiece foil stamping transfer forming portion on the surface of the workpiece substrate (108a) having an uneven shape that matches the uneven shape of the pre-formed uneven portion (4), And, (S-f) A step of driving at least one base of the pressing plate (10) and the receiving plate (94) to separate the pressing plate (10) and the receiving plate (94) from each other and to release the pressure on the workpiece, This prepares a workpiece in which the workpiece foil stamping transfer forming portion is formed on the surface of the workpiece substrate (108a) by the sheet-like foil material (108b) in a form that matches the shape of the pre-existing uneven portion (4). A method for processing a workpiece, characterized by comprising the following:

13. (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9, (S-b) A step of preparing a pressing device equipped with a main roll (96) and a counter roll (97) facing each other, (S-c) Step of installing the pressing plate (10) on the main roll (96), (S-d) A step of installing a predetermined receiving plate (94) on the pair of rolls (97) of the pressing device, (S-e) A step of driving the main roll (96) and the opposing roll (97), and supplying a workpiece between the main roll (96) and the opposing roll (97), so that the pressing plate (10) and the receiving plate (94) press the workpiece. This creates a workpiece surface (108) with a workpiece surface having a surface shape that matches the surface shape of the pre-existing surface (4). And, (S-f) A step in which the workpiece separates from the main roll (96) and the opposing roll (97) to release the pressure on the workpiece. This prepares a workpiece in which a workpiece surface (108) has a workpiece surface formed with a workpiece surface area having a surface shape that matches the surface shape of the pre-existing surface area (4). A method for processing a workpiece, characterized by comprising the following:

14. (S-a) A step of supplying a pressing plate (10) manufactured by the method for manufacturing a pressing plate according to claim 1, 2, 5, or 9, (S-b) A step of preparing a pressing device equipped with a main roll (96) and a counter roll (97) facing each other, (S-c) Step of installing the pressing plate (10) on the main roll (96), (S-d) A step of installing a predetermined receiving plate (94) on the pair of rolls (97) of the pressing device, (S-e) A step of driving the main roll (96) and the opposing roll (97), and supplying the workpiece substrate (108a) and the sheet-like foil material (108b) between the main roll (96) and the opposing roll (97), so that the pressing plate (10) and the receiving plate (94) press the workpiece, This transfers the sheet-like foil material (108b) onto the surface of the workpiece substrate (108a) to form a workpiece foil stamping transfer forming portion having an uneven shape that matches the uneven shape of the pre-existing uneven portion (4). And, (S-f) A step in which the workpiece separates from the main roll (96) and the opposing roll (97) to release the pressure on the workpiece. This prepares a workpiece in which a workpiece transfer forming portion is formed on the surface of the workpiece (108) by transferring the sheet-like foil material (108b) in a form that has an uneven shape that matches the uneven shape of the pre-existing uneven portion (4). A method for processing a workpiece, characterized by comprising the following:

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