Removable solder joints for connecting superconducting current paths

Abstract

Concepts are described that are directed to systems, structures, and techniques for producing low-resistance, high-current-capable, removable solder joint connections. Such systems, structures, and techniques can be used to simultaneously produce low-resistance, high-current-capable removable solder joint connections at multiple locations between non-insulated (NI) superconductors, particularly between NI high-temperature superconductors (HTS) such as may be used in NI-HTS magnets.

Description

Technical Field

[0001]

[0001] This application relates to the joining of superconducting current paths, and more particularly to a detachable solder joint suitable for joining superconducting current paths.

Background Art

[0002]

[0002] A superconductor is a material that has no electrical resistance to current (is "superconducting") below a certain critical temperature. For many superconductors, the critical temperature is below 30°K. Thus, the operation of such materials in the superconducting state requires significant cooling, such as can be achieved with liquid helium or supercritical helium.

[0003]

[0003] Due to the ability of superconductors to carry large currents without resistance, high magnetic field magnets are often constructed from superconductors. Such magnets can carry currents in excess of, for example, 5 kA.

Summary of the Invention

Means for Solving the Problems

[0004]

[0004] The concepts disclosed herein generally relate to systems, structures, and techniques for creating low-resistance, high-current-capacity detachable solder joint connections at multiple locations between superconductors. In embodiments, the concepts, systems, structures, and techniques are used to simultaneously create low-resistance, high-current-capacity detachable solder joint connections at multiple locations between uninsulated (or non-insulated) (NI) superconductor structures (such as coils). Application examples include soldering solder joints at multiple locations within a magnet assembly, solder joints between arrays of conductors comprising the winding packs of non-insulated superconducting magnets, and (for example, between current leads) single isolated joints. In embodiments, the superconductor can be a high-temperature superconductor (HTS).

[0005]

[0005] As used herein, “high temperature superconductor” or “HTS” refers to a material having a critical temperature above 30°K. In some cases, the critical temperature may depend on other factors, such as the presence of an electromagnetic field. Where the critical temperature of a material is referred to herein, it should be understood that it may refer to whatever temperature happens to be critical for that material under given conditions.

[0006]

[0006] According to one embodiment of the concepts, systems, structures, and techniques described herein, an assembly comprises an array of NI-HTS conductors, the array of NI-HTS conductors being soldered to a plate and fastened together via an array of joints. In the embodiment, the HTS (for example, in the form of an HTS tape stack) is disposed within a channel of the plate, and solder connections are made in the array of joints between conductors extending along the upper or lower end of the HTS.

[0007]

[0007] According to a first aspect of the concept disclosed herein, the apparatus comprises a first plate having a plurality of channels including a first layer of high-temperature superconductor (HTS) and a first conductive layer covering the first layer of HTS; a second plate having a plurality of channels including a second layer of HTS and a second conductive layer covering the second layer of HTS; and a solder layer connecting a portion of the first conductive layer of the first plate and a portion of the second conductive layer of the second plate.

[0008]

[0008] In this embodiment, a second plate is placed on top of the first plate, thereby positioning a portion of the first conductive layer next to the portion of the second conductive layer, together with the solder layer between the portion of the first conductive layer and the portion of the second conductive layer, thereby providing a conductive path from the first conductive layer to the second conductive layer.

[0009]

[0009] In the embodiment, the first plate is provided with at least one solder channel extending from outside the first plate to at least one of a plurality of channels in the first plate.

[0010]

[0010] In this embodiment, the first conductive layer is positioned in contact with the first layer of the HTS.

[0011]

[0011] In this embodiment, the first plate comprises a stack of layers of HTS, and the stack of layers includes the first layer of HTS.

[0012]

[0012] In the embodiment, the at least one solder channel has a path shape that allows solder to flow between a first layer of HTS in a channel of the first plate and a second layer of HTS in an overlapping channel of the second plate.

[0013]

[0013] In this embodiment, the multiple channels of the first plate are arranged next to the multiple channels of the second plate, and each portion of the first conductive layer within the multiple channels of the first plate is arranged next to the portion of the second conductive layer within the multiple channels of the second plate.

[0014]

[0014] In this embodiment, the solder layer extends over each portion of the first conductive layer within a plurality of channels of the first plate.

[0015]

[0015] The above features can be better understood from the following description of the drawings. Please note that the drawings are not necessarily to scale. In the drawings, identical or nearly identical components shown in different drawings are represented by similar numbers. For clarity, not all components are shown or referenced in every drawing. The drawings are intended to explain and help understand the disclosed technology. Since it is often impractical or impossible to illustrate and describe every possible embodiment, the drawings given show one or more exemplary embodiments. Accordingly, the drawings are not intended to limit the scope of the concepts, systems, structures, and techniques that are sought to be protected. [Brief explanation of the drawing]

[0016] [Figure 1A]

[0016] It is an isometric projection partial cross-sectional view of a tokamak power generation device. [Figure 1B]

[0017] It is an exploded isometric projection partial cross-sectional view of the tokamak power generation device of FIG. 1A, showing a toroidal field (TF) magnet having a detachable joint. [Figure 2A]

[0018] It is an isometric projection view of upper and lower end plates having superconducting current paths, joined by detachable solder joints. [Figure 2B]

[0019] It is a cross-sectional view taken along the straight line 2B-2B of FIG. 2A. [Figure 2C]

[0020] It is a cross-sectional view showing various possible locations of solder for providing detachable solder joints. [Figure 2D]

[0021] It is an isometric projection view of the upper end plate of FIG. 2A. [Figure 3A]

[0022] It is an isometric projection view of the lower end plate of FIGS. 2A and 2B, with gaskets disposed over its surface. [Figure 3B]

[0023] It is an isometric projection view of upper and lower end plates having superconducting current paths, joined by detachable solder joints. [Figure 3C]

[0024] It is an isometric projection view of the upper and lower end plates of FIG. 3B, joined to each other using bolts. [Figure 3D]

[0025] It is an isometric projection view of the upper and lower end plates of FIG. 3B, joined to each other and having solder inlets and outlets. [Figure 3E]

[0026] It is an isometric projection view of the upper and lower end plates of FIG. 3B, aligned and joined to each other, with the upper end plate being transparent to show the underlying structure. [Figure 3F]

[0027] It is an isometric projection view of the upper and lower end plates of FIG. 3B, aligned with and joined to the access hole of the upper end plate. [Figure 3G]

[0028] An isometric projection view of the upper and lower end plates of FIG. 3B aligned and joined with the filled access holes in the upper end plate. [Figure 4A]

[0029] Top view of the removable plate. [Figure 4B]

[0030] Exploded perspective view of the removable plate of FIG. 4A. [Figure 4C]

[0031] Top perspective view of the removable plate of FIG. 4A. [Figure 5]

[0032] Enlarged perspective view of the joint area of FIG. 4C. [Figure 6]

[0033] Perspective view of the joint area of the lower end plate of FIG. 5. [Figure 7]

[0034] Cross-sectional view of the removable joint area in a clasp configuration. [Figure 8]

[0035] Flow diagram of the process for joining plates having a high-temperature superconductor (HTS) current path provided as part of the plate. [Figure 9]

[0036] Flow diagram of the process for separating plates having a high-temperature superconductor (HTS) current path provided as part of the plate. [Figure 10A]

[0037] A series of isometric projection views showing the removal of a toroidal field (TF) magnet having a removable joint from a tokamak power generator. [Figure 10B] A series of isometric projection views showing the removal of a toroidal field (TF) magnet having a removable joint from a tokamak power generator. [Figure 10C] A series of isometric projection views showing the removal of a toroidal field (TF) magnet having a removable joint from a tokamak power generator. [Figure 10D] A series of isometric projection views showing the removal of a toroidal field (TF) magnet having a removable joint from a tokamak power generator. [Figure 11A]

[0038] Figure 11A is a cross-sectional view of a removable joint region having a joint plate. [Figure 11B]

[0039] Figure 11B is a perspective view of a removable joint region having a joint plate. [Modes for carrying out the invention]

[0017]

[0040] High-field superconducting magnets often consist of multiple electrically insulated cable turns, grouped in a multilayer configuration. When the superconductors within the cable are cooled below their critical temperature (the temperature below which the electrical resistivity of the superconducting material drops to zero), driving the magnet allows current to pass through the superconducting path without loss. Non-insulated (NI) magnets (sometimes called non-insulated (NI) magnets) consist of adjacent superconducting turns that are not insulated from each other but are instead separated by conventional (i.e., non-superconductor) conductors. When the magnet is operating below the superconductor's critical temperature, current flows through the superconductor rather than across the turns, because the superconductor has zero resistance compared to the finite resistance of the conductor between the superconducting turns.

[0018]

[0041] Non-insulating high-temperature superconductors (NI-HTS) magnets can be used in a variety of applications, including, but not limited to, magnetic resonance imaging (MRI) machines, nuclear magnetic resonance (NMR) instruments, mass spectrometers, particle accelerators, magnetic separation processes, and nuclear fusion reactors.

[0019]

[0042] Figure 1A is a perspective view of a fusion reactor 10 comprising a removable vacuum vessel 11. The vacuum vessel 11 is housed within a radiation shield (or "shielding tank") 41. In this exemplary embodiment, the radiation shield 41 is separable and has an upper half 41a and a lower half 41b. The vacuum vessel 11 and the radiation shield are housed around a central solenoid 12. A separable toroidal magnetic field (TF) magnet 13 is housed around the removable vacuum vessel 11. In this exemplary embodiment, the TF magnet is provided as an NI-HTS magnet 13 having a D-shape, with a straight portion 14 coupled to a curved portion 15 at a joint region 16. As will be described in detail below and as shown in Figure 1B, the NI-HTS magnet 13 is separable at the joint region 16.

[0020]

[0043] The body of the NI-HTS magnet may be formed from a conductive metal in the form of a plate, often containing one or more superconducting current paths. In embodiments, the superconducting current path may be wound one or more times around the D-shaped body to form an annular winding that runs through the NI-HTS magnet. This allows current to flow through the superconducting material around the D-shape, generating a high-intensity magnetic field. Although not shown in Figures 1A and 1B, the reactor may include one or more current drivers coupled to the superconducting current path of the NI-HTS magnet 12 to drive the current and generate the magnetic field.

[0021]

[0044] In embodiments, the NI HTS magnet 13 may comprise a plurality of plates arranged in a stack, and the superconducting current path has a conductive channel provided in at least one plate, in which high-temperature superconductor (HTS) material is disposed within the conductive channel. The conductive channel may also have conductive material disposed therein (in addition to the HTS) (sometimes referred to as "co-wind"). In embodiments, a conductor (sometimes referred to herein as a conductive layer or channel cap) may be disposed on top of the HTS. According to some embodiments, the HTS may include a rare-earth barium copper oxide superconductor (REBCO), such as yttrium barium copper oxide (YBCO). In some embodiments, the HTS may comprise a co-wound stack of HTS tape. In embodiments, the HTS tape may comprise long, thin strands of HTS material having cross-sectional dimensions (and lengths extending along the length of the conductive channel) with a thickness (or height) ranging from about 0.001 mm to about 0.1 mm and a width ranging from about 1 mm to about 12 mm. According to some embodiments, each strand of the HTS tape may contain an HTS material such as REBCO in addition to the conductive material. In some embodiments, the conductive material may be disposed on top of the REBCO. In some embodiments, the conductive material may be a cladding material such as copper. In some embodiments, the HTS tape may contain polycrystalline HTS and / or have a high level of crystal alignment.

[0022]

[0045] As shown in Figures 1A and 1B, a series of NI-HTS magnets 13 are arranged around a central solenoid 12, and a hollow toroidal shape may be formed around the central solenoid. A removable toroidal vacuum vessel 11 is disposed through the central opening of the D-shaped magnet 13. The reactor 10 may also include a base 18, an outer wall 20, and a donut-shaped removable retaining ring 24 for structurally fixing / holding the vacuum vessel 11 and the NI-HTS magnets 13. The outer wall 20 includes a plurality of pieces joined by seams or joints 32. The outer wall 20 may be joined at the seams 32 via fastening structures such as bolt rings 34. Thus, the outer wall 20 may be separated and disassembled or bolted together.

[0023]

[0046] As can be seen from the exploded view in Figure 1B, the reactor 10 can be separated (or disassembled) into several sections (or parts) so that the container 11 can be removed. To separate the reactor 10, the retaining ring 24 is removed (for example by lifting or separating the retaining ring from the outer wall 20), and the outer wall 20 is separated at the seams or joints 32 (for example by removing the bolts from the bolt ring 34).

[0024]

[0047] As described above, the NI-HTS magnet 13 has one or more joints (e.g., joint 16) that allow the magnet to be separated (or disassembled) into multiple parts or plates. In the illustrated example, the NI-HTS magnet 13 has two joints 16. The joints 16 may be provided as removable solder joints, as will be described in detail below with Figures 2A-9. Thus, the removable solder joints 16 allow the NI-HTS magnet 13 to be separated into two parts 13a and 13b.

[0025]

[0048] Separating (or disassembling) the NI-HTS magnet into multiple parts allows for the removal of the NI-HTS magnet portion, thereby exposing the vacuum vessel 11. In this way, the vacuum vessel 11 can be lifted or removed from the reactor, as shown in Figure 1B.

[0026]

[0049] Of course, in other embodiments, the NI-HTS magnet 13 may have three or more joints, and the joints may be in areas other than (or added to) the area 16 shown in Figure 1A. For example, in some embodiments, the NI-HTS magnet 13 may have a joint at or near position 36. This allows the curved portion of the magnet 13 to separate from the flat portion 14 so that the NI-HTS magnet can be radially disassembled and separated from the reactor while the vacuum vessel 30 remains in place. An example of such a radially separable embodiment is described below with reference to Figures 10A, 10B, 10C, and 10D. However, in general, the NI-HTS magnet 13 may have one, two, or more joints located at any point on the magnet so that the magnet can be disassembled or separated into multiple parts.

[0027]

[0050] Introducing couplings within NI-HTS magnets can present challenges because the couplings may create interruptions or discontinuities in the superconducting current path (which in the case of NI-HTS magnets may be superconducting HTS channels). Due to the potential for large currents flowing through superconductors, any couplings or interfaces between two superconducting components (for example, between two superconducting current paths in an NI-HTS magnet) should have sufficiently low resistance so that the couplings do not generate excessive heat or interfere with or interrupt the current in the superconducting current path.

[0028]

[0051] Next, referring to Figures 2A–3G, which provide similar elements with similar reference numerals throughout several figures, an example of an overlapping joint 200 (sometimes more simply called a “lap joint”) suitable for coupling a superconducting current path 201 disposed within a first (or lower) plate 204 to a superconducting current path 203 (Figure 2D) disposed within a second (or upper) plate 208 is shown. In this example, the superconducting current paths 201, 203 are provided by forming channels 202 in each of the plates 204, 208 and disposing of HTSs within the channels. Conductors (or channel caps) which may contain or be composed of copper may be disposed on top of the HTSs. Thus, in this exemplary embodiment, the superconducting current paths 201, 203 are provided as HTS superconducting current paths and may be called “HTS superconducting channels,” or more simply “HTS channels” 207, 209.

[0029]

[0052] Techniques for forming a lap joint, as shown in Figure 2A, are described with reference to Figures 2B-3G. However, regardless of the specific manner in which the lap joint is formed, such a lap joint 200 can be provided between sections of a magnet (e.g., the NI-HTS magnet 13 in Figures 1A and 1B) to form an electrical connection between the superconducting channel on one side of the joint 200 (i.e., the HTS channel 207 in the lower plate 204 (Figure 2B)) and the superconducting channel on the other side of the joint 200 (i.e., the HTS channel 209 in the upper plate 208 (Figure 2B)). The overlapping portion of the lower plate 204 and the upper plate 208 forms a joint region, i.e., an area or region where two (or more) plates can be joined. As will be discussed below, the electrical connection between the HTS superconducting channels 207 and 209 can be formed by introducing a layer of solder 218 (Figure 2B) between the HTS superconducting channels 207 and 209. Such solder connections (or solder joints) mechanically bond plates 204 and 208, as well as electrically bond HTS superconducting channels 207 and 209. The solder used to form the solder layer 218 introduced between superconducting channels 207 and 209 may be referred to herein as “joint solder”.

[0030]

[0053] In the embodiment, the HTS may be soldered into one or more channels of a plate to form HTS superconducting channels 207, 209. That is, the HTS may be fixed in a channel of the lower plate 204 via solder to form the HTS superconducting channel 207 in the lower plate 204, and the HTS may be fixed in a channel of the upper plate 208 via solder to form the HTS superconducting channel 209 in the upper plate.

[0031]

[0054] In cases where HTS (or any superconducting material) is soldered within channels of a plate, the joint solder 218 introduced between the superconducting channels 207, 209 to electrically and mechanically couple the superconducting channels 207, 209 has a lower melting temperature (e.g., liquidus) than the solder used to fix the HTS within the channels and form the superconducting channels 207, 209 (sometimes referred to herein as "HTS solder"). Thus, the joint solder may be referred to as "low-temperature solder" in the sense that it has a lower liquidus than the HTS solder. In embodiments, a first type of solder may be used within the HTS superconducting channels, and a second different type of solder may be used to form a solder layer or solder joint between the HTS conductors 207, 209 in the first and second plates. Thus, simply put, the HTS solder may be different from the joint solder.

[0032]

[0055] Figure 2B is a cross-sectional view of the assembled joint 200 as seen from the plane 210 of Figure 2A. The lower end plate 204 has several (six in this example) HTS superconducting channels 207 that wind through the plate. In this example, each HTS superconducting channel 207 includes a superconducting material 212 extending along the length of the channel and a conductive layer 216 (also called a channel cap layer, or more simply, a channel cap) covering the superconducting material. In some embodiments, the channel cap 216 is substantially coplanar with the surface 204a of the plate 204, and in other embodiments, the channel cap 216 may be recessed relative to the surface 204a together with the plate 204.

[0033]

[0056] Similarly, the HTS superconducting channel 209 within the upper plate 208 also includes a superconducting material 220 on which a channel cap 222 is disposed. In some embodiments, the channel cap 222 is substantially coplanar with the surface 208a of the plate 208 (Figure 2D), and in other embodiments, the channel cap 222 may be recessed relative to the surface 208a together with the plate 208.

[0034]

[0057] The superconducting materials 212, 220 may be high-temperature superconducting (HTS) materials such as rare-earth barium copper oxide (REBCO) material, and the channel caps 216, 222 may be made from a conductive material such as copper. The plates 204 and 208 may include any conductive metal or any conductive material. According to some embodiments, the plates may include or be composed of high mechanical strength materials such as steel, Inconel®, Nitronic® 40, Nitronic® 50, Incoloy®, or a combination thereof, but are not limited. In some embodiments, the plates may be plated with a metal such as nickel to facilitate adhesion of other components, including solder, to the plates, as described below. As previously stated, the HTS (and any co-wind material and / or channel caps) may be soldered into one or more channels of the plates using a first type of solder to form the HTS superconducting channels 207, 209.

[0035]

[0058] The solder channel 224 (Figure 2D), also called a "solder flow channel" or "solder path," passes through a region of the upper plate where a joint will be formed, along the superconducting channel 207, and follows a path between the superconducting channels 207. The solder channel 224 is used to deliver a solder layer 218 to the interface between the superconducting channels in the first and second plates. While the exemplary embodiments in Figures 2A–2C show the solder channel 224 as a single continuous channel having a snake-like shape, embodiments may use two or more separate solder channels. For example, individual solder channels may be provided adjacent to each superconducting channel.

[0036]

[0059] In some embodiments, solid solder material may be placed in some or all of the solder channels before the plates are joined together. This eliminates the need to connect the channels to each other via the solder channels and to deliver the required amount of solder in liquid form.

[0037]

[0060] In embodiments, a vacuum impregnation ("VPI") step may be used to introduce solder 218 into the solder channel 224 and subsequently into the interface between the superconducting channels 207 and 209 in the first and second plates. As previously stated, the solder can provide an electrical connection between the superconducting channels 207 and 209 and mechanically fasten the plates together. In embodiments, instead of using the VPI method, solid solder may be placed in the channels or pockets next to or adjacent to the joint pads to be soldered, prior to joint assembly.

[0038]

[0061] The upper plate 208 is aligned with the superconducting channel 207 of the lower plate 204 and has several superconducting channels 209 that interface with (e.g., contact with) it. Solder 218 is placed between channels 207 and 209 to form a solder joint (or solder joint) between channels 207 and 209. The solder joint provides an electrical connection between superconducting channels 207 and 209, having a resistance low enough to allow large currents within the superconductor to pass from one superconducting channel (e.g., channel 207) through the solder 218 to the other superconducting channel (e.g., channel 209). Solder 218 also provides a mechanical bond between the plates to help fix them together.

[0039]

[0062] In the embodiment, the joint solder (for example, the solder used for solder layer 218) is a second type of solder different from the one used to solder or fix the HTS within the plate channels. In the embodiment, the joint solder has a lower liquidus level than the solder used to fix the HTS within the plate channels. Therefore, the joint solder is called low-temperature solder in the sense that it has a lower melting point than the solder used to fix the HTS within the plate channels.

[0040]

[0063] By using low-temperature solder as a joint solder, the plate can be decomposed without further decomposing the HTS from the plate channel. In embodiments, the low-temperature solder is lead solder, lead-free solder, gallium or gallium alloy solder, Sn 60 Pb 40 This may include solder, tin-lead solder, or any type of solder capable of providing mechanical and electrical connections between superconducting channels.

[0041]

[0064] As discussed below, in embodiments in which the solder 218 includes a low-temperature solder, heat can be applied to the plates at least within the joint region 200 until the temperature of the joint solder 218 rises to near or above the melting point of the solder. When the solder transitions from a solid state to a paste-like or liquid state, the mechanical joint can be broken and the plates 204, 208 can be separated. Since the melting point of the joint solder occurs at a temperature lower than the melting point of the HTS solder, the plates 204, 208 can be separated (or disintegrated) without damaging the HTS, and furthermore, without separating (or obscuring, disturbing, or interrupting) the HTS from the plate channels.

[0042]

[0065] The depth 226 of the solder channel 224 may be greater than the depth of the copper cap 216 so that the solder is in direct contact with the superconducting material 212. In another embodiment, some or all of the solder channel 224 may have a depth less than the depth of the copper cap, as shown in section 228 of the solder channel.

[0043]

[0066] Figure 2C shows various possible locations for solder channels 224a-224j and 228a-228f within plates 204 and 208. It should be understood that reference numbers 224a-224j and 228a-228f may also represent locations where solder is laid and solder joints 218 between HTS laid within plates 204 and 208 may be formed.

[0044]

[0067] As shown in Figure 2C, one or more solder channels may be provided on one or both of plates 204, 208. Thus, the solder channels may be located on one side of an HTS channel (for example, as shown in solder channel 224 in Figure 2B) or on both sides of an HTS channel (for example, as shown in solder channels 224a and 224b in Figure 2C). Furthermore, a single solder channel may be provided in plate 204 on the opposite side of a single solder channel in plate 208 (for example, as shown in solder channels 224c and 224d in Figure 2C). In yet another embodiment, a single solder channel may be provided in plate 204 on one side of an HTS channel in plate 204 (for example, as shown in solder channels 224e and 224f in Figure 2C), and a single solder channel may be provided in plate 208 on the opposite side of the HTS channel. In yet another embodiment, multiple solder channels may be provided on both sides of an HTS channel in plate 204 (for example, as shown by solder channels 224g to 228j in Figure 2C), and multiple solder channels may be provided on both sides of an HTS channel in plate 208. Furthermore, solder channels having reduced heights 228a to 228f may be arranged in any configuration shown in Figure 2C.

[0045]

[0068] In summary, it should be understood that solder and / or solder channels may be arranged in various different configurations / locations within one or more plates, and various different combinations may be used. After reading the disclosures provided herein, those skilled in the art will understand how to choose one or more locations for placing solder, and / or one or more locations for placing solder channels.

[0046]

[0069] Referring to Figure 2D, a perspective view of the upper plate 208 shows the bottom surface 208a of the plate (i.e., the surface of plate 208 positioned on top of the surface 204a of the lower plate 204). As shown in the figure, in this example, a solder channel 224 is provided within the upper plate 208 and has a snake-like path shape extending from a first solder port 230 along a superconducting channel 206 to a second solder port 231. Thus, the first end of the solder channel 224 is coupled to the solder port 230, and the second opposite end of the solder channel 224 is coupled to the solder port 231.

[0047]

[0070] The solder channel 224 also passes through (or crosses) the superconducting channel 209 at multiple locations (e.g., location 232), resulting in a direct electrical connection between the solder and the superconducting channel 209 when the solder channel is filled with solder. In one embodiment, the solder channel 224 may be a recess in the upper plate. In another embodiment, the solder channel may be a recess in the lower plate. In yet another embodiment, the solder channel may be formed from recesses in both the upper and lower plates. Regardless of the particular manner in which one or more solder channels are formed, when the upper and lower plates are facing each other, the solder channel becomes a closed channel.

[0048]

[0071] Figures 3A–3G show exemplary vacuum pressure injection (VPI) steps for forming a solder joint between superconducting channels 207 and 209 (Figure 2D). In Figure 3A, a gasket 304 is positioned, fitted, or formed on the surface 204a of the lower plate 204 around the area where the solder channel 224 (Figure 2D) is formed. In embodiments, the lower plate 204 and / or the upper plate 208 may include recesses into which the gasket 304 is fitted. The gasket helps to form a vacuum seal around the solder path. Gasket materials may include silicone rubber, Viton®, and Teflon®. Of course, those skilled in the art will understand that any material suitable for forming a vacuum seal may be used.

[0049]

[0072] The lower plate 204 includes a hole 302 positioned to obstruct the path that the solder will follow (for example, a solder flow channel). As will become clear after reading the description of Figure 3E below, once the solder is in place and has solidified, a conductive path (or solder "bridge") may exist between the superconducting current paths. Therefore, the hole 302 is positioned over the portion of the solder bridge between the superconducting current paths.

[0050]

[0073] The holes 302 provide an access point from which solder bridges can be broken or interrupted by mechanical, chemical, or any other technique. After the solder bridges are broken, the superconducting channels 207 are no longer electrically connected to one or more solder bridges.

[0051]

[0074] In this embodiment, bolt holes 305 may be drilled and threaded within the lower plate 204, providing the holes as threaded bolt holes. In Figure 3B, the upper plate 208 is positioned on the lower plate 204 such that at least each portion of the upper plate 208 is aligned with and overlaps with at least each portion of the lower plate 208. The upper plate 208 also has bolt holes 305 that are aligned with the bolt holes 305 of the lower plate 204, allowing the plates to be bolted together during the soldering process.

[0052]

[0075] Referring to Figure 3C, the upper plate is fixed (e.g., joined or attached) to the lower plate, forming a vacuum seal between the plates (together with the gasket 304). In this example, bolts 306 are used to fasten the plates together. However, in other cases, a press or clamp may be used. When the bolts are tightened, the lower plate 204 and the upper plate 208 press against each other together with the gasket 304 between them, forming a vacuum seal between the plates. Any openings within the bolt area may also be sealed by using a liquid-tight sealant or tape around the bolt threads and / or head to prevent air or other fluids from leaking or entering the vacuum-sealed area through the bolt threads.

[0053]

[0076] In Figure 3D, the solder inlet 308 and outlet 310 are coupled to the solder ports 230 and 231. The inlet 308 and outlet 310 are essentially pipes. At the inlet 308, molten solder is introduced into the pipe. At the outlet 310, a vacuum is applied to the joint region, thereby drawing the molten solder through the inlet 308 and through the solder channel (e.g., solder channel 224 in Figure 2D). Once it is observed that the solder has exited the solder channel through the outlet 310, the solder channel is filled. Furthermore, during the process, at least the joint regions of the lower plate 204 and upper plate 208 may be heated to a temperature near, at, or above the melting point of the joint solder 218, but below the melting point of the HTS solder, so that the joint solder 218 can flow through the solder channel without solidifying, while the HTS solder is exposed to a temperature below its liquidus and therefore remains in a solid state.

[0054]

[0077] In embodiments, the inner diameter (ID) of the pipe should be larger than the ID of the solder channel (e.g., a serpentine solder channel) through which the pipe is fluid-communicated, in order to facilitate the flow of molten metal (e.g., solder) within an acceptable overall system pressure drop. The locations of the inlet and outlet pipes should be chosen to facilitate physical connection. To facilitate connection between the inlet / outlet pipes and the solder channel, the ends of the inlet and outlet pipes may be threaded to match threaded holes in a plate that open to the solder channel. Other means may also be used to provide fluid connections leading from the inlet / outlet pipes to the solder channel.

[0055]

[0078] In Figure 3E, the upper plate 208 is made transparent so that the solder channel 224 can be seen. Solder 218 may be introduced into the solder inlet 308 and allowed to flow through the solder channel 224 until the entire solder channel 224 is filled with molten solder. As previously mentioned, the solder 218 may follow a snake-like path through the solder channel 224, creating an electrical connection between the superconducting channel 207 of the upper plate 204 and the superconducting channel 209 of the paired (or parallel) lower plate 208. The solder and plates are then allowed to cool so that the solder in the solder path 224 solidifies.

[0056]

[0079] At this point in the process, since the solder path is a continuous path that contacts all the superconducting channels, the solder creates an electrical connection (or "solder bridge") 312 between the superconducting channels, effectively short-circuiting the superconducting channels to each other. Therefore, after cooling, a section of the solder path (e.g., section 312) may be cut, interrupted, or separated so that the electrically connected superconducting channels do not short-circuit each other. As shown in Figure 3F, the solder bridge may be cut, for example, by inserting a drill into the access hole 302 and drilling a hole in the section 312 of solder, thus interrupting or separating the solder bridge.

[0057]

[0080] In Figure 3G, the inlet 308 and outlet 310 are removed, and a plug (e.g., a stud screw) is inserted into the access hole 302, and the access hole 302 may optionally be sealed. Some or all of the bolts 306 may also be removed, and any remaining bolt holes (if any) may be filled and sealed (e.g., by inserting a stud screw into any open threaded holes).

[0058]

[0081] In some embodiments, the clamping function of the bolt may be carried out via a vise or clamp-like external structure. In this case, if a vise is provided to hold the plate, the bolt may not be necessary or may not be located in immediate vicinity of the joint.

[0059]

[0082] Next, referring to Figures 4A–4C, which feature similar elements with similar reference numerals throughout several figures, Figures 4A–4C show one embodiment of a NI-HTS magnet 400 having removable solder joints in locations 401a and 401b (Figure 4A). As will be apparent from the description of Figures 4B and 4C, the removable solder joints allow the NI-HTS magnet 400 to be separated (or disassembled) into several parts.

[0060]

[0083] It should be understood that the removable solder joints at locations 401a and 401b are configured in a so-called "prayer" configuration. In contrast to lap joint configurations (as shown in Figures 2A-3G) which are commonly used to connect the superconducting current paths of joined plates and the plates end to end, in the prayer joint configuration, the ends of the superconducting channels (e.g., end 404 of plate 406 and end 408 of plate 410) extend in the same direction, much like the fingers of two hands held together in prayer.

[0061]

[0084] Figure 4A shows an NI-HTS magnet 400 having a generally D-shape, where a nearly straight section is joined to a curved section 410 via joints in a girder configuration at locations 401a and 401b. Of course, it should be understood that, as an addition or alternative, the magnet 400 may have sections of different shapes and different joint locations for disassembly. For example, the magnet 400 may have joints in one or both of regions 402 and 403. Furthermore, since the curved shape at location 403 may be oriented towards overlapping plates with opposite ends rather than a girder joint with ends facing the same direction, location 403 may be suitable for a lap joint. Thus, in embodiments, the magnet 400 may have two different types of removable solder joints (i.e., one or more joints in a “girder” configuration and one or more joints in a “lap joint” configuration). After reading the disclosures given herein, those skilled in the art will understand how to select joint locations and joint configurations to meet the needs of a particular application.

[0062]

[0085] In Figure 4B, the illustrated magnet 402 is separated (or disassembled) into two plates 406 and 410, with plate 406 being straight and plate 410 having a curved portion. Please note that plates 406 and 410 in Figure 4B are made transparent to show the internal structure of the plates, which would normally be invisible. Plate 406 has two joint regions 412a and 414a, and plate 410 has two joint regions 412b and 414b. By aligning the respective joint regions 412a, 412b and 414a, 414b, a gable joint can be formed, as shown in Figure 4C.

[0063]

[0086] In Figure 4C, plates 406 and 410 are aligned, and the joint has overlapping portions formed at locations 412 and 414. In this case, as in Figure 4B, the plates are made transparent to show structures that would normally be invisible. In various embodiments, the ends of the plates in the gable joint may be coplanar. For example, in joint area 414, the ends of plates 406 and 410 form a coplanar end 418 when stacked on top of each other. On the other hand, in joint area 412, the ends of plates 406 and 410 are not coplanar. Rather, the end 404 of plate 406 extends beyond the end 408 of plate 410.

[0064]

[0087] If deemed necessary, a thin insulating material may be placed between plates 406 and 410 in areas where no joints are formed. According to some embodiments, the insulating material 250 may include polyimide (e.g., Kapton®), epoxy resin, phenolic resin, glass epoxy laminate, plastic, elastomer, or a combination thereof. According to some embodiments, the insulating material may have a breakdown voltage or dielectric strength greater than 25 kV / mm, greater than 50 kV / mm, greater than 75 kV / mm, or greater than 100 kV / mm. In some cases, the voltage inside the superconducting magnet is relatively low, in which case a low-voltage standoff insulating material such as anodized aluminum may be used as the insulating material.

[0065]

[0088] Plate 406 has multiple, in this case seven HTS channels 420a to 420g, and plate 410 has multiple, in this case six HTS channels 422a to 422f. Note that HTS channel 420a extends from the first end 404 of plate 406 into the joint region 414a of plate 406, and HTS channel 420g extends from the first end 404 of plate 406 into the joint region 412a of plate 406. The ends 421a and 421b of each HTS channel 420a and 420g can be coupled to a power supply (not shown in Figure 4C).

[0066]

[0089] When the joint regions of plates 406 and 410 are aligned (as shown in Figure 4C), the first end of HTS channel 422a aligns (or overlaps) with a portion of HTS channel 420a in joint region 414, and the second end of HTS channel 422a aligns (or overlaps) with HTS channel 420b in joint region 412. In other words, the HTS channels are shifted. Similarly, the first end of HTS channel 422b aligns (or overlaps) with a portion of HTS channel 420b in joint region 414, and the second end of HTS channel 422a aligns (or overlaps) with HTS channel 420c in joint region 412, and so on, until finally all HTS channels in plate 410 are aligned with the HTS channels in plate 406. By shifting the alignment HTS channel, a loop (or continuous current path) may be formed between the ends 421a and 421b of the HTS channels 420a and 420g.

[0067]

[0090] Referring to Figures 5 and 6, which feature similar elements in Figures 4A to 4C with similar reference numerals, a gable joint can be formed using the same or similar steps as those for forming the lap joint described above. A gasket 506 is placed between plates 502 and 504 to create an airtight seal in the joint area. The upper plate 502 (shown transparently in Figure 5) is aligned with the lower plate 504, so that at least a portion of the superconducting current paths 420a to 420f in plate 502 are aligned with the superconducting current paths 422a to 422f in plate 504.

[0068]

[0091] As shown in Figure 5, the superconducting current path comprises a superconducting material (e.g., HTS) 507a on which a conductor (e.g., copper channel cap) 507b is disposed. Although not explicitly shown in Figure 5, the superconductor 507a and the conductor 507b may be fixed (and further fixed to each other) within the channel of the plate via solder.

[0069]

[0092] In this example, the ends 508 of plates 502 and 504 are coplanar, and all superconducting current paths in plate 502 are aligned with the superconducting current paths in plate 504. Bolts 510 fasten plates 502 and 504 together with sufficient force to allow a vacuum to be formed within the joint region. As described above with Figures 2A-2C, the area around the threads of the bolts may also be sealed to create a liquid-tight seal around the bolts.

[0070]

[0093] At least the joint region of the plate is heated (for example, to a temperature above the melting point of the low-temperature solder), and molten solder can be introduced into the inlet 512. Simultaneously, a vacuum is applied to the outlet (not shown), and the molten solder can be drawn from the inlet 512 through the solder channel 514 to the outlet. After the solder has penetrated the solder channel 514 (for example, seeping between and around the superconducting current paths 420, 422 and becoming wet), the plate is cooled, allowing the solder to solidify. The solder is then cut, separated, or interrupted at the access point 518, and the conductive current path (i.e., solder short circuit) is removed. The bolt 510 is then removed, and the bolt hole, access port, and solder inlet and output ports can be filled and sealed. As previously stated, the solder channel 514 may be provided in the upper plate, the lower plate, or both plates. Furthermore, solder channels may be formed either before or after the HTS channel is formed, and may be further formed either before or after the HTS is placed within the HTS channel.

[0071]

[0094] Referring to Figure 6, the lower plate 504 is shown without the upper plate 502. The superconducting channels 422a-422f comprise a superconducting material (e.g., HTS) 509a on which a conductor (e.g., copper channel cap) 509b is disposed. Although not explicitly shown in Figure 5, the superconductor 509a and the conductor 509b may be fixed (and even fixed to each other) within the channels of the plate 504 via solder.

[0072]

[0095] As illustrated, the solder channel 514 may create a snake-like path along and through the superconducting channels 422a-422f. However, in another embodiment, the solder may follow a straight or angled path. Any path that allows the superconducting channels of the upper and lower plates to solder or electrically couple to each other may be used appropriately. Although the solder flow path is shown as a single continuous channel in Figure 6, it should also be understood that in another embodiment, multiple individual solder flow channels may be used, positioned adjacent to the superconducting current path within a joint region (e.g., the region defined by the periphery of the gasket 506).

[0073]

[0096] In some embodiments, solid solder material may be placed in some or all of the solder channels before the plates are joined together. This connects the channels to each other and eliminates the need to deliver the required amount of solder in liquid form (i.e., this technique may use multiple separate solder channels rather than a single continuous channel (for example, as shown in Figures 2C, 3E, and 6)).

[0074]

[0097] Once the top plate is removed, the breakers 518 drilled into the solder channel 514 become visible. These breakers eliminate short-circuit current paths between superconducting channels that may be created during the soldering process (such as the VPI soldering process).

[0075]

[0098] Referring to Figure 7, a plate assembly comprising plates 502 and 504 may include superconducting channels (e.g., aligned channels 702 and 704) extending to the ends 706 and 708 of plates 502 and 504. Thus, the aligned channels 702 and 704 are sometimes said to form superconducting channel pairs 705a. In this exemplary embodiment, the plate assembly includes six such superconducting channel pairs 705a to 705f.

[0076]

[0099] In this case (i.e., when the superconducting channel extends to the end of the plate), solder can be deposited through the end of the superconducting channel. This technique for introducing solder between the superconducting channels of opposing plates 502, 504 can be used instead of, or in addition to, solder deposited through solder channels such as solder channel 514 (Figures 5, 6). A solder joint, such as solder joint 710 positioned on top of superconducting channel pair 705b and covering the end of the superconducting channel, can provide an electrical connection between the paired channels and can also act as a mechanical fastener for holding the plates together. For simplicity and clarity, only one such solder joint 710 is shown in Figure 7. In practice, some or all of the superconducting channel pairs 705a-705f can be joined to each other at their ends using solder joints similar to joint 710.

[0077]

[0100] To create a joint such as joint 710, a manifold is placed over the ends 706 and 708 of the respective plates 502 and 504, thereby covering some or all of the superconducting channel pairs 705a to 705f. The manifold may then be filled with molten solder, which directs the molten solder toward the respective channel pairs 705a to 705f. When the solder solidifies, the manifold may be removed. Any remaining solder that creates an undesirable low-impedance current path (e.g., a short-circuit current path) between each of the superconducting channel pairs 705a to 705f may be removed. In embodiments, if the ends of the superconducting channels are soldered, the plates and the solder channels passing through the solder inlet and outlet may be unnecessary and may be omitted.

[0078]

[0101] Figures 8 and 9 are flowcharts showing a sequence of operations that form an exemplary embodiment of the process for constructing, joining, and separating superconducting current paths coupled to solder joints, according to the concepts described herein. Unless otherwise specified, the operations listed in the flowcharts are not in any particular order, meaning they can be performed in any convenient order.

[0079]

[0102] Figure 8 is a flowchart of the process for constructing and joining plates of NI-HTS magnets. In 802, superconducting HTS conductors (e.g., conductors 212 and 220 in Figure 2B) are placed within the conductor channels of the conductive plates. In 804, conductors such as conductor channel caps (e.g., caps 216 and 222 in Figure 2B) are placed on top of the HTS conductors. In 806, a first type of solder may adhere to the HTS conductors and / or channel caps. In 808, a gasket (e.g., gasket 304) may be placed on one or both plates, around at least one joint area of ​​the plates. In 810, the plates are aligned such that a portion of the HTS conductor channels of one plate is placed on top of a portion of the HTS conductor channels of the other plate. In 812, the plates are secured to each other (e.g., fastened, bolted, clamped, pressed, etc.) to form an array of joints between the HTS conductor channels of the plates. In 814, a second type of solder in molten form is introduced into one or more solder channels that pass through the joint area and deliver the molten solder to the HTS conductor channels, and flows through them. The second type of solder has a lower liquidus line than the first type of solder. In 816, if necessary, current paths (e.g., shorts) between adjacent HTS conductor channels are eliminated to prevent undesirable short circuits between the HTS conductor channels.

[0080]

[0103] Figure 9 is a flowchart of the process for separating (or disassembling) a superconducting current path joined via a solder joint. In embodiments, the superconductor may be provided as an HTS conductor embedded in channels of two or more plates. Such plates may be used to provide an HTS magnet.

[0081]

[0104] In 902, any mechanical fasteners (bolts, clamps, etc.) between the plates (e.g., plates 204, 208; 406, 410; 502, 504) are removed. In 904, at least the joint areas of the plates are heated to a temperature above the melting point of the solder (so-called joint solder or low-temperature solder) joining the HTS conductors in the opposing plates, but below the melting point of any solder (if any) in the HTS channels. After one joint solder has become paste-like (i.e., softened) or liquidus, in 906 the plates are physically separated. In 908, the plates are actively or passively cooled to ambient temperature for transport and / or storage and / or reuse.

[0082]

[0105] Referring to Figures 10A–10D, which feature similar elements with similar reference numerals, the fusion reactor 1000 is shown with a toroidal magnetic field (TF) HTS magnet 1002 comprising several, here eight, HTS magnets 400a–g, which may be identical or similar to the HTS magnet 400 in Figure 4C, each HTS magnet having a straight plate portion (e.g., plate 406) coupled to a curved plate portion (e.g., plate 410) joined via a gable joint (e.g., in joint regions such as regions 412 and 414). In Figure 10A, the HTS magnets 400a–g are assembled and installed within the reactor 1000 to form the TF magnet 1002.

[0083]

[0106] In Figure 10B, the HTS magnets 400a-g are (or disassembled) into their two-component plates: straight plates 406a-406h and curved plates 410a-410h. In this embodiment, the disassembled magnets can be removed from the reactor 1000 by separating the respective joint regions and separating the TF magnets 400a-g at the joint locations into their respective straight sections (e.g., straight plates 406a-406h) and curved sections (e.g., curved plates 410a-410h) using the techniques described above in this specification. Specifically, as shown in Figure 10B, the curved sections can be removed from the reactor by, for example, pulling them away from the radiation shielding section 41 (which has a vacuum vessel inside) on the side indicated by arrow 1014 (e.g., radially). This allows the HTS magnets to be removed from the reactor while facilitating the disassembly process by leaving heavier reactor parts such as the radiation shielding section 41 and vacuum vessel in place.

[0084]

[0107] Referring to Figure 10C, after the curved sections 410a to 410h are removed, the straight plates (for example, plates 406a to 406h) remain in place around the central solenoid 12 and within the central hole 1016 in the toroidal vacuum vessel and radiation shielding section 41.

[0085]

[0108] As shown in Figure 10D, the linear plate and solenoid 12 can then be removed from the radiation shielding section 41 and vacuum vessel by lifting them upward outwards from the central hole 1016 of the radiation shielding section 41 (in the direction indicated by arrow 1020 in Figure 10D), leaving the radiation shielding section 41 and vacuum vessel in place. This allows the reactor 1000 to be disassembled without requiring the movement of the radiation shielding section 41 and vacuum vessel, which are heavy and may be difficult to lift or move during disassembly.

[0086]

[0109] Figures 11A and 11B show a removable joint comprising a joint plate 1100. It should be understood that in the exemplary embodiments described above in this specification, the conductor (e.g., copper cap) is located on only one surface of the HTS (as shown, for example, in the conductor 212 and HTS 216 in Figure 2B). In some embodiments, it is desirable, and even necessary, to have conductors on opposing surfaces of the HTS. This is because, at times, it is desirable, and even necessary, for a joint within a particular plate to be located on a plate surface opposite to the plate surface where the copper cap (or other conductor) is located. For example, in the example of Figures 11A and 11B, it is desirable, or may be necessary, to form the joint on the surface of plate 204 opposite the conductive cap 212. Therefore, in this example, the joint plate 1100 is positioned over the surface of the HTS where the solder joint is to be formed. Note that the joint plate 1100 is positioned over a short section of the HTS where the solder joint is to be formed.

[0087]

[0110] Various embodiments of the concepts, systems, devices, structures, and techniques that are required to be protected have been described above with reference to the relevant drawings. Alternative embodiments may be devised without departing from the scope of the described concepts, systems, devices, structures, and techniques. Note that various connections and positional relationships (e.g., above, below, adjacent, etc.) may be used to describe elements in the description and drawings. Unless otherwise specified, such connections and / or positional relationships may be direct or indirect, and the described concepts, systems, devices, structures, and techniques are not limited in this respect. Thus, the joining of entities may refer to either direct or indirect joining, and the positional relationships between entities may be direct or indirect positional relationships.

[0088]

[0111] As an example of an indirect positional relationship, placing element "A" above element "B" may include a situation where one or more intermediate elements are between elements "A" and "B," provided that the important properties and functions of elements "A" and "B" are not substantially altered by the intermediate elements (e.g., element "C").

[0089]

[0112] Furthermore, the following definitions and abbreviations should be used for the purposes of the claims and interpretation of this specification: The terms “equipment,” “includes,” “have,” or any other variation thereof shall include non-exclusive inclusion. For example, an apparatus, method, composition, mixture, or article comprising a list of elements may not necessarily be limited to those elements alone, and may include other elements not explicitly listed or specific to such apparatus, method, composition, mixture, or article.

[0090]

[0113] Furthermore, the term “exemplary” means “serving as an example, case, or illustration.” Any embodiment or design described as “exemplary” should not necessarily be interpreted as being preferable or advantageous to other embodiments or designs. The terms “one or more” and “at least one” refer to any integer greater than or equal to one, i.e., 1, 2, 3, 4, etc. The term “more” refers to any integer greater than one. The term “connection” may include indirect “connection” and direct “connection.”

[0091]

[0114] References herein to “embodiment,” “one embodiment,” “exemplary embodiment,” “example,” “case,” and “aspect” indicate that the described embodiments may include certain features, structures, or characteristics, but every embodiment may or may not include such features, structures, or characteristics. Furthermore, such terms do not necessarily refer to the same embodiment. Moreover, when certain features, structures, or characteristics are described in relation to one embodiment, whether explicitly described or not, this may affect such features, structures, or characteristics in other embodiments.

[0092]

[0115] Relative or positional terms include, but are not limited to, the terms “upper,” “lower,” “right,” “left,” “vertical,” “horizontal,” “upper end,” “lower end,” and their derivatives, relating to the structure and method of describing the orientation of a drawing. The terms “on top,” “on the top,” “placed on top,” and “placed above” mean that a first element, such as a first structure, is on a second element, such as a second structure, and intervening elements, such as an interface structure, may be present between the first and second elements. The term “direct contact” means that a first element, such as a first structure, and a second element, such as a second structure, are connected without any intermediate elements.

[0093]

[0116] The use of sequential terms such as "first," "second," and "third" in the claims to modify claim elements does not in itself imply any priority, priority, or order or temporal order in which one claim element takes precedence over another, or any action of the method being performed. Rather, it is used merely as a label to distinguish one claim element having a certain name from another element having the same name (except for the use of sequential terms).

[0094]

[0117] The terms “approximately” and “about” may be used in some embodiments to mean within ±20% of the target value, within ±10% of the target value, within ±5% of the target value, and even within ±2% of the target value. The terms “approximately” and “about” may include the target value. The term “approximately equal” may be used in some embodiments to refer to values ​​that are within ±20% of each other, within ±10% of each other, within ±5% of each other, and even within ±2% of each other.

[0095]

[0118] The term “approximately” may be used in some embodiments to refer to a value that is within ±20% of the comparison scale, within ±10%, within ±5%, and within ±2%. For example, a first direction that is “approximately” perpendicular to a second direction may refer in some embodiments to a first direction that is within ±20% of a 90° angle with the second direction, within ±10% of a 90° angle with the second direction, within ±5% of a 90° angle with the second direction, and within ±2% of a 90° angle with the second direction.

[0096]

[0119] The disclosed subject matter, in its applications, is not limited to the configuration details and arrangement of the components described in the following description and shown in the drawings. Other embodiments of the disclosed subject matter are possible and can be implemented and carried out in various ways.

[0097]

[0120] Furthermore, the phrasing and terminology used in this patent are for illustrative purposes only and should not be considered limiting. Accordingly, the underlying concepts of this disclosure can readily be used as a basis for designing other structures, methods, and systems to accomplish some of the objectives of the disclosed subject matter. Therefore, the claims should be considered to include such equivalent configurations, provided they do not deviate from the spirit and scope of the disclosed subject matter.

[0098]

[0121] Although the subject matter to be disclosed is described and illustrated in the exemplary embodiments described above, this disclosure is provided only as an example. Therefore, numerous modifications to the details of the implementation of the disclosed subject matter can be made without departing from the spirit and scope of the disclosed subject matter.

[0099]

[0122] Therefore, the scope of this patent should not be limited to the implementation described, but should be limited only by the intent and scope of the following claims. All publications and references cited in this patent are implicitly incorporated in their entirety by reference.

Claims

1. A first plate having a plurality of channels including a first layer of high-temperature superconductor (HTS) and a first conductive layer covering the first layer of HTS, A second plate having a plurality of channels including a second layer of the HTS and a second conductive layer covering the second layer of the HTS, A solder layer connecting a portion of the first conductive layer of the first plate and a portion of the second conductive layer of the second plate, A device equipped with, The second plate is disposed on the first plate, thereby so that a portion of the first conductive layer overlaps with the portion of the second conductive layer, together with the solder layer between the portion of the first conductive layer and the portion of the second conductive layer, thereby providing a conductive path from the first conductive layer to the second conductive layer. The first plate comprises at least one solder channel extending from outside the first plate to at least one of the plurality of channels of the first plate. Device.

2. The apparatus according to claim 1, wherein the first conductive layer is arranged in contact with the first layer of the HTS.

3. The apparatus according to claim 1, wherein the first plate comprises a stack of layers of the HTS, and the stack of layers includes the first layer of the HTS.

4. The apparatus according to claim 1, wherein the at least one solder channel has a path shape that allows solder to flow between the first layer of the HTS in the channel of the first plate and the second layer of the HTS in the overlapping channel of the second plate.

5. The apparatus according to claim 1, wherein the plurality of channels of the first plate are arranged next to the plurality of channels of the second plate, and each portion of the first conductive layer within the plurality of channels of the first plate is arranged next to the portion of the second conductive layer within the plurality of channels of the second plate.

6. The apparatus according to claim 5, wherein the solder layer extends over each of the portions of the first conductive layer in the plurality of channels of the first plate.

7. A first plate having one or more channels provided on the surface of the first plate and having a joint region, wherein the joint region has at least one opening into which solder can be introduced, A first high-temperature superconductor (HTS) disposed within one or more channels of the first plate, A conductor disposed on the HTS in one or more channels of the first plate, A second plate having one or more channels provided on the surface of the second plate and having a joint region, A second HTS disposed within one or more channels of the second plate, A conductor disposed on the HTS in one or more channels of the second plate, A device equipped with, The second plate is disposed on the first plate, thereby the joint region in the first plate is disposed on the joint region in the second plate, and at least a portion of the conductor disposed on the HTS in one or more channels of the first plate overlaps with and contacts at least a portion of the conductor disposed on the HTS in one or more channels of the first plate. The first plate comprises at least one solder channel extending from outside the first plate to at least one of the one or more channels of the first plate. Device.

8. The apparatus according to claim 7, wherein the joint region comprises at least one opening into which solder can be introduced into the at least one solder channel.

9. The apparatus according to claim 8, wherein the at least one solder flow path is a solder flow channel in the first plate, and the solder flow channel has a path shape configured to allow solder to flow between the conductor in the first plate and the overlapping portion of the conductor in the second plate.

10. The apparatus according to claim 8, wherein the at least one solder flow path is a solder flow channel having a snake-like path shape around the portion of the channel in the joint region of the first plate.

11. The apparatus according to claim 8, further comprising a gasket disposed around the joint region.

12. Disposed within one or more channels of the first plate, a first type of solder providing electrical and mechanical connections between the HTS and the wall defining the channel in which the HTS is disposed, Disposed within one or more channels of the second plate, the first type of solder provides an electrical and mechanical connection between the HTS and the surface defining the channel in which the HTS is disposed, The apparatus according to claim 7, further comprising:

13. The apparatus according to claim 12, further comprising a second type of solder disposed within one or more channels in the joint region of the first plate, which provides an electrical and mechanical connection between the HTS in the first plate and the HTS in the second plate.

14. The apparatus according to claim 13, wherein the first type of solder has a melting point higher than the melting point of the second type of solder.

15. A first plate having one or more channels provided on the surface of the first plate and having a joint region, wherein the joint region has at least one solder channel formed within the joint region, and the first plate has an opening into which solder can be introduced into the at least one solder channel, A high-temperature superconductor (HTS) disposed in one or more channels of the first plate, A channel cap disposed on the HTS in one or more channels of the first plate, A second plate having one or more channels provided on the surface of the second plate and having a joint region, HTS disposed in one or more channels of the second plate, A channel cap disposed on the HTS in one or more channels of the second plate, A device equipped with, The second plate is disposed on the first plate, thereby the joint region in the first plate is disposed on the joint region in the second plate, and at least a portion of one channel cap disposed in one or more channels of the first plate overlaps with and contacts at least a portion of one channel cap disposed in one or more channels of the second plate such that it forms at least one conductive path. The at least one solder channel extends from outside the first plate to at least one of the one or more channels of the first plate. Device.

16. The apparatus according to claim 15, further comprising a gasket disposed around the joint region.

17. The apparatus according to claim 15, wherein the at least one solder flow path is a solder flow channel in the first plate, and the solder flow channel has a path shape configured to allow solder to flow between the HTS in the channel of the first plate and the HTS in the overlapping channel of the second plate.

18. The apparatus according to claim 15, wherein the at least one solder flow path is a solder flow channel having a snake-like path shape around the portion of the channel in the joint region of the first plate.

19. Disposed within one or more channels of the first plate, a first type of solder providing electrical and mechanical connections between the HTS and the wall defining the channel in which the HTS is disposed, Disposed within one or more channels of the second plate, the first type of solder provides an electrical and mechanical connection between the HTS and the surface defining the channel in which the HTS is disposed, The apparatus according to claim 15, further comprising:

20. The apparatus according to claim 19, further comprising a second type of solder disposed within one or more channels in the joint region of the first plate, which provides an electrical and mechanical connection between the HTS in the first plate and the HTS in the second plate.

21. The apparatus according to claim 20, wherein the first type of solder has a melting point higher than the melting point of the second type of solder.

22. The apparatus according to claim 21, wherein the first type of solder has a melting point of 185°C or higher.

23. The apparatus according to claim 22, wherein the second type of solder has a melting point of less than 185°C.

24. The apparatus according to claim 23, wherein the second type of solder has a melting point of 117°C or lower.

25. The apparatus according to claim 21, wherein the first type of solder has a melting point of 185°C or higher, and the second type of solder has a melting point of less than 185°C.

26. The apparatus according to claim 20, wherein the first plate is arranged relative to the second plate so as to form a gable joint configuration.

27. The apparatus according to claim 20, wherein the first plate is arranged relative to the second plate so as to form a lap joint.

28. The apparatus according to claim 20, wherein when the first plate and the second plate are aligned, the HTS in the first plate is electrically coupled to the HTS in the second plate such that the HTS channels in the first plate are offset from the HTS channels in the second plate, forming a plurality of conductive loops.

29. The apparatus according to claim 20, wherein the channel has a channel cap disposed on the channel.

30. A first plate having first and second ends and first and second joint regions, and having a plurality of parallel channels provided within the first plate, wherein the first channel of the plurality of parallel channels extends at least from the first joint region through the second joint region of the first plate, at least one of the plurality of parallel channels extends from the first joint region to the second joint region of the first plate, and one of the plurality of parallel channels extends from the second joint region of the first plate to the second end of the first plate, A gasket disposed around the first joint region of the first plate, High-temperature superconductors (HTS) are disposed within the plurality of channels of the first plate, A channel cap disposed on the HTS within the parallel channels of the first plate, A second plate having first and second joint regions, and having a plurality of parallel channels provided within the second plate, extending from the first joint region to the second joint region, An HTS disposed within the plurality of parallel channels of the second plate and forming the first HTS conductor channel, A channel cap disposed on the HTS within the parallel channels of the second plate, An HTS disposed within the parallel channels of the second plate and forming a second HTS conductor channel, A device equipped with, The second plate is disposed on the first plate, thereby aligning the first and second joint regions in the first plate with the first and second joint regions in the second plate, and the channel cap in at least one of the parallel channels in the first plate overlaps with at least one channel cap in at least one of the parallel channels in the second plate. The first plate comprises at least one solder flow channel extending from outside the first plate to at least one of the plurality of parallel channels of the first plate. Device.

31. The apparatus according to claim 30, wherein the first channel among the plurality of channels in the first plate extends at least from the first joint region through the second joint region to the second end of the first plate.

32. The apparatus according to claim 30, wherein the first joint region of the second plate is located at the first end of the second plate, the second joint region of the second plate is located at the second end of the second plate, and the plurality of parallel channels in the second plate extend from the first end of the second plate to the second end of the second plate.

33. The apparatus according to claim 30, wherein the first plate is substantially straight and at least a portion of the second plate has a curved shape.

34. The apparatus according to claim 30, wherein the first joint region of the first plate is located at the first end of the first plate.

35. The apparatus according to claim 34, wherein the first channel among the plurality of channels in the first plate extends at least from the first joint region through the second joint region to the second end of the first plate.

36. The apparatus according to claim 30, wherein each of the at least one of the plurality of channels in the first plate extending from the first joint region of the first plate to the second joint region of the first plate extends from the first end of the first plate to the second joint region of the first plate.

37. The apparatus according to claim 30, wherein the first joint region of the second plate is located at the first end of the second plate, and the second joint region of the second plate is located at the second end of the second plate.

38. The apparatus according to claim 30, wherein the channel of the first plate is offset from the channel in the second within at least one joint region, so that the first and second HTS conductor channels form a loop between an input terminal and an output terminal.

39. The first plate has at least one solder flow channel provided within the first plate and at least one opening provided within the first plate into which solder can be introduced. The at least one solder flow channel is configured to introduce solder between the channel cap of the first plate and the channel cap of the second plate. The apparatus according to claim 30.

40. A first plate having a joint region, a plurality of high-temperature superconductor (HTS) channels extending at least from the joint region through the non-joint region of the first plate, and solder flow channels within the joint region of the first plate, A first channel cap disposed on the HTS within the channel of the first plate, A second plate having a joint region, wherein a plurality of HTS channels extend at least from the joint region of the second plate through the non-joint region of the second plate, A second channel cap disposed on the HTS channel of the second plate, A device equipped with, The second plate is disposed on the first plate, thereby the joint region in the first plate is disposed on the joint region in the second plate, and at least a portion of one channel cap disposed in one or more channels of the first plate overlaps with at least a portion of one channel cap disposed in one or more channels of the second plate. The solder flow channel in the first plate has a path shape configured to allow solder to flow between the overlapping portions of the HTS channels in the joint regions of the first and second plates, The solder flow channel extends from outside the first plate to at least one of the plurality of HTS channels of the first plate. Device.

41. The apparatus according to claim 40, wherein the first plate is provided with a solder inlet.

42. The apparatus according to claim 40, further comprising fastening means disposed in one of the joint regions of the first and second plates for mechanically fixing the first plate to the second plate.

43. The HTS channel in the first plate comprises a first type of solder arranged to provide an electrical and mechanical connection between the HTS and a wall defining the channel in which the HTS is disposed, The HTS channel in the second plate comprises the first type of solder disposed to provide an electrical and mechanical connection between the HTS and the surface defining the channel on which the HTS is disposed. The solder flow channel within the joint region of the first plate comprises a second type of solder arranged to provide an electrical and mechanical connection between the HTS in the first plate and the HTS in the second plate. The apparatus according to claim 41.

44. The apparatus according to claim 43, wherein the first type of solder has a melting point higher than the melting point of the second type of solder.

45. The joint region within the first plate is the first joint region among a plurality of joint regions within the first plate, The joint region within the second plate is the first joint region among a plurality of joint regions within the second plate. Each of the plurality of joint regions in the second plate comprises an HTS channel having a first type of solder disposed to provide an electrical and mechanical connection between the HTS and a wall defining the channel in which the HTS is disposed, Each of the plurality of joint regions within the first plate is An HTS channel comprising an HTS and the first type of solder disposed to provide an electrical and mechanical connection between the HTS and the wall defining the channel in which the HTS is disposed, A solder flow channel comprising a second type of solder disposed to provide an electrical and mechanical connection between the HTS in the first plate and the HTS in the second plate, wherein the first type of solder has a melting point higher than that of the second type of solder, The apparatus according to claim 40, comprising:

46. The apparatus according to claim 40, wherein the first plate, the second plate, or both are disposed over the solder channel and have at least one access hole that allows cutting of the solder in the solder channel.

47. The apparatus according to claim 46, wherein at least one solder hold is positioned between the adjacent channels of the plurality of channels so as to enable the solidified solder between adjacent channels to eliminate an electrical short-circuit current path between the adjacent channels arranged on the same plate.

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