Molding apparatus, molding method, and method for manufacturing articles

Abstract

To solve such problems that there is such a possibility that a base plate is carried out in such a state that a composition is uncured state when molding processing cannot be normally performed in a molding device which forms a layer on the base plate by curing a member in a state of being in contact with the composition on the base plate, and there is such a possibility that an external device storing the device and the base plate is contaminated by a chemical material that is vaporized from the uncured composition when the base plate is carried out.SOLUTION: A molding device separates a member after curing a curable composition by a first curing part in such a state that the member is in contact with the curable composition on a base material when it is determined that molding processing can be performed, further cures the curable composition by a second curing part, and performs curing by a second curing part in a state of being apart from the member without performing curing by the first curing part when it is determined that the molding processing cannot be performed. With this, the generation of contamination on the inside and outside of the device due to carrying-out of the base plate applied with the uncured composition can be prevented even when processing cannot be normally performed.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a molding apparatus, a molding method, and a method for manufacturing an article.

Background Art

[0002] With the increasing demand for miniaturization of semiconductor devices, in addition to conventional photolithography technology, a microfabrication technology that molds an uncured composition on a substrate with a mold and cures it to form a pattern of the composition on the substrate has attracted attention. Such a technology is called an imprint technology and can form a fine pattern on the order of several nanometers on a substrate.

[0003] As one of the imprint technologies, for example, there is a photocuring method. An imprint apparatus employing the photocuring method forms a photocurable composition supplied to a shot region on a substrate with a mold, irradiates light to cure the composition, and separates the mold from the cured composition, thereby forming a pattern on the substrate.

[0004] In recent years, a technology for planarizing a composition on a substrate has been proposed (see Patent Document 1). The technology disclosed in Patent Document 1 aims to improve the accuracy of planarization by dropping a composition based on the step of the substrate and curing the composition in a state where the flat surface of the mold is in contact with the dropped composition.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In molding processes such as imprinting and planarization, if the process is performed correctly, the composition on the substrate is removed from the equipment in a cured state. However, if the molding process cannot be continued normally, the composition may be removed in an uncured state. If a substrate coated with an uncured composition is removed, it is undesirable because volatile chemical substances released from the uncured composition can contaminate the equipment that transports the substrate and the external equipment that stores the removed substrate.

[0007] The present invention aims to provide a method for preventing contamination inside and outside the apparatus by preventing substrates coated with an uncured composition from being discharged, even when a normal molding process cannot be performed. [Means for solving the problem]

[0008] To achieve the above objective, the present invention provides a molding apparatus for forming a layer on a substrate by curing a curable composition while a member is in contact with the curable composition on the substrate, comprising: a coating unit for coating the substrate with a curable composition; a first curing unit for curing the curable composition on the substrate; a second curing unit for curing the curable composition on the substrate; and a control unit that controls the first curing unit to cure the curable composition by the first curing unit while the member is in contact with the curable composition coated on the substrate by the coating unit, and then controls the second curing unit to further cure the curable composition separated from the member, thereby forming the layer, wherein if the control unit determines that the molding process cannot be performed, it controls the second curing unit to perform curing by the second curing unit while the member is separated, without performing curing by the first curing unit. [Effects of the Invention]

[0009] According to the present invention, even if a normal molding process cannot be performed, it is possible to prevent the substrate coated with the uncured composition from being discharged and contaminating the inside and outside of the apparatus. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram showing the configuration of a planarization device. [Figure 2] This is a diagram showing the configuration of the coating module of the planarization device. [Figure 3] This is a diagram showing the configuration of the planarization module of the planarization device. [Figure 4] This diagram shows the configuration of the heat treatment module of the planarization apparatus. [Figure 5] This is a diagram to explain the flattening process. [Figure 6] This is a flowchart illustrating the flow of the planarization process in a molding machine. [Figure 7] This diagram shows the heat treatment process of a heat treatment module. [Figure 8] This figure shows the polymerization conversion rate of the curable composition. [Modes for carrying out the invention]

[0011] Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings. In each drawing, the same reference numeral is used for identical components, and redundant descriptions are omitted.

[0012] Figure 1 is a schematic diagram showing the configuration of a planarizing apparatus 100 (planarizing system) used as a molding apparatus. In this specification and drawings, directions are indicated in an XYZ coordinate system in which the horizontal plane is the XY plane. Hereafter, directions parallel to the X axis, Y axis, and Z axis in the XYZ coordinate system are referred to as the X direction, Y direction, and Z direction, respectively.

[0013] The planarization apparatus 100 consists of a coating module 101 (coating section) for applying a curable composition, a planarization module 102 for planarization using a planarization member 109 (Super Straight), and a heat treatment module 103 for heat treatment. Furthermore, it is provided with a transport mechanism 104, a planarization member loading / unloading mechanism 105, a substrate loading / unloading mechanism 106, a control unit 111, and an input unit 112.

[0014] According to the planarization apparatus of the present invention, a curable composition on a substrate is cured while in contact with a planarization member 109, and a large-scale or local flat surface of the cured composition can be formed on the substrate by separating the cured composition from the planarization member. Furthermore, by further curing the separated cured composition, a cured state suitable for post-processing can be achieved.

[0015] In this embodiment, the explanation will be given using an example in which one coating module 101, one planarization module 102, and one heat treatment module 103 are each provided in the planarization apparatus. Note that multiple coating modules 101, 102, and 103 may be provided.

[0016] While silicon wafers are a typical substrate for the substrate 110, it is not limited to silicon wafers. The substrate 110 can be arbitrarily selected from among those known as semiconductor device substrates, such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. Furthermore, the substrate 110 may be a substrate in which an adhesion layer has been formed by surface treatment such as silane coupling treatment, silazane treatment, or deposition of an organic thin film to improve adhesion with the curable composition. Typically, the substrate 110 has a circular outer perimeter shape with a diameter of 300 mm or 200 mm, but it is not limited to this. For example, it may have a circular outer perimeter shape with a diameter of 300 mm or more and less than 500 mm.

[0017] As the planarization member 109, it is preferable to use a mold made of a light-transmissive material in consideration of the light irradiation process. As the material of the material constituting the planarization member 109, glass, quartz, PMMA (Polymethyl methacrylate), a light-transparent resin such as a polycarbonate resin, a transparent metal vapor deposition film, a flexible film such as polydimethylsiloxane, a photocurable film, a metal film, etc. are preferable. In addition, the planarization member 109 preferably has a circular shape with a size larger than that of the substrate 110. Also, the thickness of the planarization member 109 is preferably 0.25 mm or more and less than 2 mm, but is not limited thereto.

[0018] The substrate loading / unloading mechanism 106 is a mechanism that can arrange a substrate carrier 108 holding a plurality of substrates 110 and is used to load and unload the substrate 110 from the outside to the planarization apparatus 100. The planarization member loading / unloading mechanism 105 is a mechanism that can arrange a member carrier 107 holding a plurality of members 109 and is used to load and unload the planarization member 109 from the outside to the planarization apparatus 100.

[0019] The transfer mechanism 104 is a mechanism that can transfer the planarization member 109 and the substrate 110 within the apparatus. Specifically, the planarization member 109 can be loaded and unloaded between the planarization module 102 and an arbitrary slot of the member carrier 107 mounted on the planarization member loading / unloading mechanism 105. Also, the substrate 110 can be loaded and unloaded between the coating module 101, the planarization module 102, the heat treatment module 103, the cooling chuck 403, and an arbitrary slot of the substrate carrier 108 arranged in the substrate loading / unloading mechanism 106. Further, the transfer mechanism 104 includes a hand for holding the substrate 110 to be loaded into each module and a hand for recovering the substrate 110 from each module, and can hold two substrates 110 simultaneously.

[0020] The control unit 111 controls the entire planarization apparatus 100, including a processor such as a CPU, a storage unit such as RAM, ROM, or HDD, and an interface unit for connecting external devices to the processor. In other words, the control unit 111 functions as a processing unit that comprehensively controls each module of the planarization apparatus 100 and performs planarization processing. The interface unit also includes a communication interface for communicating with a host computer. The host computer may be, for example, a computer that controls the entire factory or a specific area of ​​the factory where the molding apparatus 100 is located. The processor executes programs stored in the storage unit and controls the operation of the planarization apparatus 100. The control unit 111 may also be composed of multiple circuit boards, which may be arranged separately inside or outside the apparatus.

[0021] Figure 2 is a diagram showing the configuration of the coating module 101 of the planarization apparatus 100. The coating module 101 is a module that coats (supplies) a curable material for planarizing a substrate 110 that has an uneven surface due to processing in a previous step. Specifically, it has a dispenser 206 that includes a discharge port (nozzle) for dispensing an uncured (liquid) curable composition onto the substrate 110. The dispenser 206 then drops (supplies) droplets of the composition onto the substrate, which has been transported by the transport mechanism 104 and held in the substrate chuck 202.

[0022] The dispenser 206 can supply a minute volume of droplet-shaped composition onto the substrate by employing, for example, a piezojet system or a microsolenoid system. Furthermore, the number of dispensing ports in the dispenser 206 is not limited; it may be one (single nozzle) or more than 100. That is, it may be a linear nozzle array or a combination of multiple linear nozzle arrays.

[0023] The substrate stage 203 is movable on the base 204 while the substrate 110 is held in the substrate chuck 202. In this embodiment, a linear motor is used as the drive unit 205 for driving the substrate stage 203. However, it is not limited to this, and known technologies such as a drive mechanism combining a ball screw and a rotary motor can be applied. In this embodiment, the movement direction of the substrate stage 203 is in two axes, the X and Y directions, but it is not limited to six axes. By applying the curable composition 201 onto the substrate 110 from the dispenser 206 while scanning the substrate stage 203 on the XY plane, multiple droplets of the curable composition can be arranged in a desired coating pattern.

[0024] As the curable composition 201 used as a molding material, ultraviolet or thermosetting compositions (e.g., resins) are used. The curable composition 201 may also contain any of a polymerizable compound, a photopolymerization initiator, a nonpolymerizable compound, or a solvent, and as a nonpolymerizable compound, it may contain at least one of a sensitizer, a hydrogen donor, an internally added separation agent, a surfactant, an antioxidant, or a polymer component. The curable composition 201 of this embodiment will be described using, for example, an example of a composition that hardens by irradiation with light (ultraviolet light) with a wavelength of 200 to 380 nm. Such a curable composition hardens by irradiation with light such as ultraviolet light, and the photosensitive reaction can be completed by further hardening by applying heat after hardening (post-exposure bake treatment).

[0025] The off-axis scope 207 can detect a reference mark placed on the substrate stage 203 and a mark formed on the substrate 110 mounted on the substrate stage 203. The relative position between the reference mark on the substrate stage 203 and the substrate 110 is measured using the off-axis scope 207. By adjusting the position of the component 109 or the substrate 110 using the measured relative position, the dispenser 206 and the substrate 110 can be applied at the desired relative position. These scopes may include a light source, an image sensor, and an optical system that directs detection light to the object under test or the image sensor.

[0026] Figure 3 is a diagram showing the configuration of the planarization module 102 of the planarization apparatus 100. The planarization module 102 is a module for a layer forming process that plans a substrate 110 on which multiple droplets of a curable composition have been placed by a coating module by bringing a planarization member 109 into contact with the substrate to planarize it, and then curing the curable composition to form a planarized layer.

[0027] The planarization module 102 has an irradiation unit 307 that irradiates light to cure the curable composition 201 supplied onto the substrate 110. The irradiation unit 307 includes a light source and may further have an optical system including lenses and mirrors that guide the light from the light source. The substrate stage 303 supports a substrate chuck 302 (substrate holding unit) for holding the substrate 110 that has been transported by the transport mechanism 104. The planarization head 313 supports a member chuck 312 for holding the planarization member 109. The drive unit 309 drives the planarization head 313 in the vertical direction (Z direction), and the guide 308 guides the vertical movement of the planarization head 313. The surface 109a of the member 109 is brought into contact with droplets of the curable composition 201 supplied onto the substrate 110 to planarize it, and in this state, light is irradiated onto the curable composition 201 from the irradiation unit 307 (first curing unit) to cure the curable composition 201. After curing, the planarizing member 109 is moved upward to separate it from the curable composition 201 on the substrate. As a result, a cured product with a surface shape corresponding to the shape of the contact surface of the planarizing member 109 is formed on the substrate 110.

[0028] The substrate stage 303 is movable on the base 304 while the substrate 110 is held in the substrate chuck 302. When loading the substrate 110 onto the substrate chuck 302 or when unloading the substrate 110 from the substrate chuck 302, the substrate stage 303 is moved to a position away from below the planarization head 313. This makes it easy to avoid interference (physical contact) between the transport mechanism 104 and the planarization head 313. In addition, by moving the substrate stage 303 by a small amount before bringing the curable composition 201 on the substrate 110 into contact with the planarization member 109, the relative position between the planarization member 109 and the substrate 110 can be finely adjusted. In this embodiment, a linear motor is used as the drive unit 305 that drives the substrate stage 303. However, it is not limited to this, and known technologies such as a drive mechanism combining a ball screw and a rotary motor can be applied. In this embodiment, the movement direction of the substrate stage 303 is in two axes, the X direction and the Y direction, but it is not limited to six axes. The substrate stage 303 may have a top plate and a plate-shaped member connected to the top plate.

[0029] Furthermore, a separation assist mechanism 316 is positioned on the substrate stage 303 to assist in separation. The separation assist mechanism 316 is driven upward in the Z direction so as to pass through the notches used for circumferential positioning of the substrate 110, and assists in separation by contacting the member 109 and pushing up the member 109.

[0030] The substrate chuck 302 is fixed by being attracted to the substrate stage 303. The substrate chuck 302 has a holding surface for holding the substrate 110. Known techniques such as vacuum suction and electrostatic suction can be applied as methods for holding the substrate 110 with the substrate chuck 302. In the case of vacuum suction, a recess (groove) formed on the surface of the substrate chuck 302 is connected to a negative pressure generating device. The substrate 110 can be held by creating negative pressure inside the recess while the substrate 110 is placed on the holding surface. The component chuck 312 has a holding surface for holding the planarization member 109 and holds the planarization member 109 by known techniques such as vacuum suction or electrostatic suction.

[0031] Multiple support columns 301 are arranged on the base 304, and the structure 306 is supported by the support columns 301. The structure 306 may be a top plate. In this embodiment, four support columns 301 are arranged (only two are shown in Figure 1), but this is not limited to this. The base 314 is supported (suspended) by the structure 306 via the support columns 310. A TTM (Through the Mold) scope 315 is attached to the base 314. The base 314 may also be equipped with a sensor (not shown) for measuring the surface height of the substrate 110. The structure 306 and the base 314 are provided with openings for the guide 308 described above to pass through.

[0032] The off-axis scope 311 can detect a reference mark placed on the substrate stage 303 and a mark formed on the substrate 110 mounted on the substrate stage 303. The TTM scope 315 can detect a reference mark placed on the substrate stage 303 and a mark formed on the member 109 held by the member chuck 312. In this embodiment, the relative position between the reference mark on the substrate stage 303 and the mark formed on the member 109 is measured using the TTM scope 315, and the relative position between the reference mark on the substrate stage 303 and the substrate 110 is measured using the off-axis scope 311. By adjusting the position of the member 109 or the substrate 110 using the measured relative position, the member 109 and the substrate 110 can be brought into contact at a desired relative position. These scopes may include a light source, an image sensor, and an optical system that directs detection light to the object under test or the image sensor.

[0033] Figure 4 is a diagram showing the configuration of the heat treatment module 103 (second curing section) of the planarization apparatus 100. The heat treatment module 103 is a module that performs a post-exposure bake treatment to accelerate the curing of the curable composition 201 cured in the planarization module 102 by heating it.

[0034] The heat treatment module 103 includes a heating chuck 401 for holding and heating the substrate 110, a heating chamber 402 arranged around the heating chuck 401, a cooling chuck 403 for holding and cooling the substrate 110, and a cooling chamber 404 arranged around the cooling chuck 403.

[0035] The heating chuck 401 holds the substrate 110 that has been brought in by the transport mechanism 104 and heats the substrate 110. The heating chuck 401 needs to have high thermal conductivity in order to speed up heating and cooling, and for example, a thermal conductivity of 150 W / m·K or higher is desirable. The heating chuck 401 has a power supply unit 405, and the heating element is heated by the power supplied from the power supply unit 405, thereby heating the heating chuck. Alternatively, instead of heating with the heating chuck, a heating method may be used in which infrared rays are irradiated onto the substrate 110.

[0036] The heating chamber 402 is positioned to surround the heating chuck 401. When heating the heating chuck 401, it is desirable that the heating chamber 402 can form a closed space. Furthermore, when loading and unloading the substrate 110 into and out of the heating chuck 401, it is desirable that the atmosphere inside the heating chamber 402 be maintained, and that the opening of the heating chamber 402 for loading and unloading the substrate 110 be as small as possible, and that the opening and closing be performed in a short time.

[0037] The cooling chuck 403 holds the substrate 110 and cools the substrate 110. The cooling chuck 403 is controlled to a lower temperature than the heating chuck 401 and cools the substrate 110, which has been heated by the heating chuck 401, to a temperature at which it can be transported to the substrate carrier 108. The cooling chamber 404 is positioned to surround the cooling chuck 403.

[0038] Figure 7 shows the heating process of the heating chuck 401 until the heat treatment module 103 loads the substrate 110 into the heating chuck 401. The heat treatment module 103 starts heating the heating chuck 401 at time S0 and raises the temperature from the initial temperature T0 to the first temperature T1 by time S2. The first temperature T1 is higher than the second temperature T2, which is the heating temperature for heating the substrate 110. Furthermore, it is desirable that the first temperature T1 be 250°C or higher in order to remove moisture-containing impurities on the heating chuck. The heating chuck 401 continues to be heated at the first temperature T1 from time S2 to S3. This completes the first step. Once the first step is complete, the heat treatment module 103 cools the heating chuck 401 down to the second temperature T2. This completes the second step. Once the second process is complete, the molding apparatus 100 starts loading the substrate 110 at time S5, places the substrate 110 on the heating chuck 401, and heats the substrate 110 for a predetermined time.

[0039] Next, with reference to Figure 5, the planarization process mainly performed by the coating module 101 and the planarization module 102 of the planarization apparatus 100 will be described. First, the curable composition 201 is supplied to the substrate 110 on which the base pattern 110a is formed by the dispenser 206. Figure 5(a) shows the state after the curable composition 201 has been placed on the substrate but before the planarization member 109 is brought into contact with it. Next, as shown in Figure 5(b), the curable composition 201 on the substrate 110 is brought into contact with the flat surface 25 of the planarization member 109. The planarization member 109 presses the curable composition 201, causing it to spread over the entire surface of the substrate 110. Figure 5(b) shows the state in which the entire flat surface 25 of the planarization member 109 is in contact with the curable composition 201 on the substrate 110, and the flat surface 25 of the planarization member 109 conforms to the surface shape of the substrate 110. Then, in the state shown in Figure 5(b), light is irradiated from the light source 20 onto the curable composition 201 on the substrate 110 via the planarizing member 109, thereby curing the curable composition 201. After that, the planarizing member 109 is separated from the cured curable composition 201 on the substrate. As a result, a cured layer (planarized layer) of the curable composition 201 of uniform thickness is formed over the entire surface of the substrate 110. Figure 5(c) shows the state in which a planarized layer of the curable composition 201 has been formed on the substrate 110.

[0040] Next, using Figure 6, a flowchart will be used to explain the processes performed when the flattening process is performed normally and the processes performed when it is determined that the process cannot be continued normally in this embodiment. As described above, these processes are performed by the control unit 111 comprehensively controlling each part of the flattening device 100.

[0041] In S601, the control unit 111 controls the transport mechanism 104 so that the substrate 110 is unloaded from the substrate carrier 108 and transported to the coating module 101. In S602, the control unit 111 controls the coating module 101 so that the curable composition 201 is applied to the substrate 110.

[0042] In S603, the control unit 111 causes the transport mechanism 104 to unload the substrate 110 from the coating module 101. When it becomes possible to load the substrate into the planarization module 102, the control unit 111 determines whether the planarization member can be brought into contact with the substrate within a predetermined time after the curable composition 201 has been applied to the substrate in the coating module 101. If it is within the predetermined time, it is determined that normal processing can be performed, and the process proceeds to S604 to load the substrate 110 into the planarization module 102. On the other hand, if the planarization member cannot be brought into contact with the substrate within the predetermined time, the process proceeds to S611, as normal processing cannot be performed. Factors that prevent the planarization member from being brought into contact with the substrate within the predetermined time after application include delays in the processing of the previous substrate 110 in the planarization module 102, which causes delays in the loading of the substrate 110 into the planarization module 102.

[0043] In S605, the control unit 111 brings the surface 109a of the planarizing member 109 into contact with the curable composition 201 of the substrate 110 in the planarizing module 102. However, even after being loaded into the planarizing module 102, if the timing of bringing the surface 109a of the planarizing member 109 into contact with the curable composition 201 of the substrate 110 is delayed, the planarizing member will not be able to make contact within the predetermined time, and normal processing will not be possible. In such cases, the transport mechanism 104 will unload the substrate 110 from the planarizing module 102, and the process will proceed to S611. Even after being loaded into the planarizing module 102, factors that may prevent the planarizing member from making contact within the predetermined time include cases where the measurement process performed inside the planarizing module 102 before the planarizing process begins takes a long time.

[0044] In S606, the control unit 111 irradiates the curable composition 201 with light from the irradiation unit 307 to cure the curable composition 201 (first curing). The light irradiation from the irradiation unit 307 cures the curable composition 201 to a degree that does not cause the mold to collapse upon separation. The irradiation conditions for performing the first curing from the irradiation unit 307, namely the irradiation light amount [J / m2] and exposure time [seconds], can be set from the input unit 112.

[0045] In S607, the control unit 111 determines whether irradiation was performed without any problems with the irradiation unit 307. If it is determined in S607 that irradiation was performed without problems, the process proceeds to S608, and the planarizing member 109 is separated from the substrate 110. On the other hand, if irradiation was not performed due to a problem, the process proceeds to S613, and the planarizing member 109 is separated from the substrate 110. Note that at the time of separation, the curable composition on the substrate is in an uncured state, so the planarizing member 109 needs to be cleaned after separation.

[0046] In S609, the control unit 111 controls the transport mechanism 104 so that the substrate 110 is loaded into the heating chuck 401 of the heat treatment module 103. In S610, the control unit 111 heats the curable composition 201, which has been planarized and first cured in the heat treatment module 103, to perform a second curing. The heating conditions for the second curing in the heat treatment module 103, namely the processing temperature [°C] and the heating time [seconds], can be set from the input unit 112. After the second curing is performed, the control unit 111 causes the transport mechanism 104 to unload the substrate 110 from the heating chuck 401 and load the substrate 110 into the cooling chuck 403. After the substrate 110 has cooled, the transport mechanism 104 unloads the substrate 110 from the cooling chuck 403 and loads the substrate 110 into the substrate carrier 108 to complete the process.

[0047] On the other hand, if it is determined in S603 that the planarizing member cannot be made to contact within a predetermined time, the control unit 111 determines in S611 that normal processing cannot be performed and controls the transport mechanism 104 so that the substrate 110 is transported to the heating chuck 401 of the heat treatment module 103. In S612, the control unit 111 heats the curable composition 201 on the substrate 110 that has not been first cured by the irradiation unit 307 so that it is cured in the heat treatment module 103 (error processing A). After that, the control unit 111 has the transport mechanism 104 transport the substrate 110 out of the heating chuck 401 and transport the substrate 110 to the cooling chuck 403. After the substrate 110 has cooled, the transport mechanism 104 transports the substrate 110 out of the cooling chuck 403 and transports the substrate 110 to the substrate carrier 108 to complete the process.

[0048] If the first curing is not performed, the curable composition 201 on the substrate is cured by the heat treatment module 103 and then returned to the substrate carrier 108. This prevents substrates coated with the uncured composition from being removed and contaminating the inside and outside of the apparatus.

[0049] Furthermore, if irradiation was not performed in S607 due to a problem, the process proceeds to S613. After separating the planarizing member 109 from the substrate 110 in S613, the process proceeds to S614, where the control unit 111 heats the curable composition 201 on the substrate 110 that has not been first cured by the irradiation unit 307 so that it is cured in the heat treatment module 103 (error processing B). Subsequently, the control unit 111 has the transport mechanism 104 remove the substrate 110 from the heating chuck 401 and load the substrate 110 into the cooling chuck 403. After the substrate 110 has cooled, the transport mechanism 104 removes the substrate 110 from the cooling chuck 403 and loads the substrate 110 into the substrate carrier 108 to complete the process.

[0050] Even if the first curing cannot be performed in this manner, the curable composition 201 on the substrate is cured by the heat treatment module 103 and then returned to the substrate carrier 108, thus preventing substrates coated with uncured composition from being removed and contaminating the inside and outside of the apparatus.

[0051] In error processing A and B, the temperature [°C] and heating time [seconds] for curing the uncured curable composition 201 in the heat treatment module 103 can be different from the heating conditions used during the second curing process in normal processing, and can be set via the input unit 112. Specifically, it is preferable that the heating time during error processing be set to be shorter than the heating time during the second curing process used in normal processing.

[0052] Furthermore, the heating conditions performed in the heat treatment module 103 during error processing A and B can also be determined from the irradiation conditions for the first curing irradiated from the irradiation unit 307 during normal processing. Figure 8 shows the polymerization conversion rate, which is the curing rate of the curable composition 201. The conversion rate by light irradiation 701 indicates how far the curing of the curable composition 201 progresses when the curable composition 201 is irradiated with a light intensity I [J / m2] for an exposure time s [seconds]. The slope of the conversion rate by light irradiation 701 can be expressed as a constant F1(I) that depends on the irradiated light intensity I [J / m2]. The conversion rate by heating 702 indicates how far the curing of the curable composition 201 progresses when the curable composition 201 is heated at a temperature T [°C] for a heating time s [seconds]. The slope of the conversion rate by heating 702 can be expressed as a constant F2(T) that depends on the heating temperature T [°C].

[0053] Therefore, based on the light intensity Ia [J / m2] and exposure time Sa [seconds], which are the irradiation conditions for the first curing in the planarization module 102, the heating conditions for curing the curable composition 201 in error processing A and B can be determined from the irradiation conditions for the first curing, as follows.

[0054] The polymerization conversion rate Pa is expressed as Pa = F1(Ia) * Sa [%] when the light intensity is Ia [J / m2] and the exposure time is Sa [seconds]. Therefore, in order to achieve the same curing state when heat-treating the curable composition 201 in error processing A and B, it is sufficient to obtain the same polymerization conversion rate, and the required heating time at temperature Tb [°C] is as follows. Heating time Sb=F1(Ia)*Sa / F2(Tb) …(1)

[0055] By using these heating conditions to heat-treat the curable composition 201 in error processing A and B with the heat treatment module, it can be hardened to a hardness equivalent to that achieved by irradiation with the irradiation unit 307, thus allowing for easy determination of heat treatment conditions. The reason for using the irradiation conditions for the first hardening is that if the composition has hardened to a hardness corresponding to the first hardening, the possibility of contamination inside and outside the apparatus is low even if it is returned to the substrate carrier 108. Furthermore, by considering only the first hardening, it is possible to prevent the heat treatment time from becoming unnecessarily long.

[0056] In this embodiment, an example was described using a method in which first curing is performed by light irradiation and second curing by heating. However, it is also possible to perform both first and second curing by light irradiation. In such cases, the exposure time [seconds] may be set separately from the irradiation conditions of the curable composition 201 by the input unit 112, based on the light intensity [J / m2] which is the irradiation condition for curing the curable composition 201. Alternatively, the irradiation conditions for the second curing may be determined from the irradiation conditions for the first curing. Furthermore, the first curing can be performed not only by light curing but also by thermal curing.

[0057] Furthermore, although this embodiment describes a planarization apparatus, it can also be applied to an imprint apparatus that imprints a pattern onto a substrate using a mold with a pre-formed pattern.

[0058] <Embodiment of Article Manufacturing Method> Next, a method for manufacturing articles (semiconductor IC elements, liquid crystal display elements, color filters, MEMS, etc.) using the aforementioned planarization apparatus will be described. This manufacturing method includes the steps of: planarizing a composition placed on a substrate (wafer, glass substrate, etc.) by bringing the composition into contact with a plate using the aforementioned planarization apparatus; curing the composition; and separating the composition from the plate. This forms a planarized layer on the substrate. Then, the substrate with the planarized layer is processed by forming a pattern using a lithography apparatus, and the processed substrate is processed in other well-known processing steps to manufacture an article. Other well-known processes include etching, resist stripping, dicing, bonding, packaging, etc. According to this manufacturing method, articles of higher quality than conventional methods can be manufactured.

Claims

1. A molding apparatus for forming a layer on a substrate by curing a curable composition while a member is in contact with the curable composition on the substrate, A coating section for applying a curable composition onto the substrate, A first curing unit for curing the curable composition on the substrate, A second curing unit for curing the curable composition on the substrate, The device includes a control unit which controls the first curing unit to cure the curable composition applied to the substrate by the coating unit while the member is in contact with the curable composition applied to the substrate by the coating unit, and then controls the second curing unit to further cure the curable composition separated from the member, thereby performing a molding process to form the layer. If the control unit determines that the molding process cannot be performed, it controls the process so that curing by the second curing unit is performed while the member is separated, without curing by the first curing unit. A molding apparatus characterized by the following features.

2. The molding apparatus according to claim 1, characterized in that the control unit determines that the molding process cannot be performed if the member does not come into contact with the curable composition within a predetermined time after the curable composition has been applied to the substrate by the coating unit.

3. The molding apparatus according to claim 2, characterized in that the control unit determines whether or not the molding process can be performed, and if the molding process can be performed, it brings the member into contact with the curable composition on the substrate.

4. The molding apparatus according to claim 3, characterized in that, if the curable composition is applied to the substrate by the coating unit and the member is brought into contact with it, the first curing unit fails to cure the curable composition, the member is separated and then curing is performed by the second curing unit.

5. The molding apparatus according to claim 1, characterized in that the second curing part cures the curable composition by heat.

6. The molding apparatus according to claim 5, characterized in that the control unit shortens the processing time for the heating conditions of the second curing section in the second case, in which curing is performed in the second curing section without curing in the first curing section, compared to the heating conditions of the second curing section in the first case, in which curing is performed in the second curing section after curing in the first curing section.

7. The molding apparatus according to claim 6, characterized in that the heating conditions of the second curing portion in the second case are conditions determined according to the processing conditions of the first curing portion in the first case.

8. The molding apparatus according to claim 1, characterized in that the second curing part cures the curable composition by light irradiation.

9. The molding apparatus according to claim 1, characterized in that the first curing part cures the curable composition by light irradiation.

10. The control unit determines that if the curable composition cannot be cured by the first curing unit after the curable composition has been applied to the substrate by the coating unit and the member has been brought into contact with it, the molding process cannot be performed. The molding apparatus according to claim 1, characterized in that, after separating the member, the process is controlled so that curing is performed by the second curing section without curing by the first curing section.

11. A molding method for forming a layer on a substrate by curing a curable composition while a member is in contact with the curable composition on the substrate, A coating step of applying a curable composition onto the substrate, A determination step of determining whether a molding process can be performed on the substrate to which the curable composition has been coated, If it is determined in the determination step that the molding process can be performed, the curable composition on the substrate is in contact with the member, the curable composition is cured by the first curing unit, the member is separated, and the curable composition is further cured by the second curing unit. If it is determined in the judgment step that the molding process can not be performed, the curing step is performed in which the second curing part is cured while the member is separated from the first curing part, without curing by the first curing part. A molding method characterized by having the following features.

12. A step of processing the substrate using the molding apparatus described in any one of claims 1 to 10, A process of manufacturing an article by processing the aforementioned processed substrate, A method for manufacturing an article having

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