Electronic component tester and electronic component testing method

Abstract

To properly place an electronic component at a predetermined position.SOLUTION: A ROM writing device comprises a device body, a jig 5, and a robot. The device body includes a plurality of device-side terminals. A slide surface 42 and a sinkhole 47 are formed in the jig 5. After a ROM is placed on the jig 5 so that an electronic component body contacts the slide surface 42, the robot moves the ROM toward the sinkhole 47 while the electronic component body is kept in contact with the slide surface 42. The robot further grasps the ROM after the ROM is fitted into the sinkhole 47, and makes a plurality of component-side terminals electrically contact the plurality of device-side terminals, respectively.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The technology of the present disclosure relates to an electronic component tester and an electronic component testing method.

Background Art

[0002] There is known a robot for loading an electronic component into an electronic component tester for inspecting an electronic component (Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, such an electronic component tester may not properly inspect an electronic component when the electronic component is not properly loaded.

[0005] The disclosed technology has been made in view of such a point, and an object thereof is to provide an electronic component tester and an electronic component testing method for properly placing an electronic component at a predetermined position.

Means for Solving the Problems

[0006] An electronic component tester according to one aspect of the present disclosure is an electronic component tester for testing an electronic component including an electronic component body and a plurality of component-side terminals fixed to the electronic component body, The electronic component body is provided at intervals along the length of the electronic component and comprises two end faces extending in the vertical direction of the electronic component, and a lower surface extending to the lower ends of each of the two end faces, and the component-side terminals are provided on each of the two end faces and protrude downward in the direction away from the end face on which the component-side terminals are provided in the length direction, and the electronic component tester is, a device body having a plurality of device-side terminals, a jig in which a sliding surface and a dropping hole are formed, and the electronic component body the lower surface after the electronic component is placed on the jig so that the electronic component body contacts the sliding surface, the electronic component body the lower surfaceThe system includes a robot that moves the electronic component toward the pit while remaining in contact with the sliding surface, and the robot further grasps the electronic component after it has fallen into the pit and brings the plurality of component-side terminals into electrical contact with the plurality of device-side terminals, respectively. [Effects of the Invention]

[0007] The disclosed electronic component tester and electronic component testing method can appropriately place electronic components in predetermined positions. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram showing a ROM writing device equipped with an electronic component tester according to the embodiment. [Figure 2] Figure 2 is a front view showing the ROM handled by the electronic component tester of the embodiment. [Figure 3] Figure 3 is a top view showing the ROM handled by the electronic component tester of the embodiment. [Figure 4] Figure 4 is a side view showing the ROM handled by the electronic component tester of the embodiment. [Figure 5] Figure 5 is a perspective view showing the jig. [Figure 6] Figure 6 is a front view showing the jig body. [Figure 7] Figure 7 is a top view showing the jig body. [Figure 8] Figure 8 is a rear view showing the jig body. [Figure 9] Figure 9 is a perspective view showing the jig body and ROM when the ROM falls into a trap. [Modes for carrying out the invention]

[0009] The electronic component tester and electronic component test method according to embodiments disclosed herein will be described below with reference to the drawings. However, the technology of this disclosure is not limited by the following description. Furthermore, the same reference numerals are used for identical components, and redundant descriptions are omitted. [Examples]

[0010] The electronic component tester of the embodiment is provided in the ROM writing device 1, as shown in Figure 1. Figure 1 is a schematic diagram showing the ROM writing device 1 in which the electronic component tester of the embodiment is provided. The ROM writing device 1 comprises a base 2, a device body 3, a jig 5, a robot 6, a control device 7, and a plurality of trays 8. The device body 3 is provided with a plurality of device-side terminals, which are not shown. The plurality of device-side terminals are located inside an opening 10 formed on the upper surface of the device body 3. The device body 3 is fixed to the base 2. The jig 5 is fixed to the base 2 and fixed to the device body 3 via the base 2.

[0011] The robot 6 comprises a gripping unit 11 and an actuator 12. The gripping unit 11 is movably supported on the base 2 via the actuator 12. The gripping unit 11 is controlled by a control device 7 to grip electronic components handled by the electronic component tester of the embodiment, and to release electronic components gripped by the gripping unit 11. The actuator 12 is controlled by the control device 7 to move the gripping unit 11 relative to the base 2, positioning the gripping unit 11 at a predetermined position relative to the base 2.

[0012] The control device 7 is a computer and includes a storage device and a CPU (Central Processing Unit), which are not shown. The storage device stores the computer program installed in the control device 7 and information used by the CPU. The CPU controls the storage device and processes information by executing the computer program installed in the control device 7. The CPU also controls the main body 3, the gripping unit 11, and the actuator 12 by executing the computer program installed in the control device 7.

[0013] Each of the multiple trays 8 is formed in a plate shape. Each of the multiple trays 8 has multiple holes 14 formed in it. The multiple trays 8 include an unprocessed parts tray 15, a processed parts tray 16, and a defective parts tray 17. The unprocessed parts tray 15 is properly placed on the unprocessed parts tray area of ​​the base 2 and fixed to the base 2 such that the multiple holes 14 of the unprocessed parts tray 15 are positioned at multiple predetermined unprocessed parts positions on the base 2. The processed parts tray 16 is properly placed on the processed parts tray area of ​​the base 2 and fixed to the base 2 such that the multiple holes 14 of the processed parts tray 16 are positioned at multiple predetermined processed parts positions on the base 2. The defective parts tray 17 is properly placed on the defective parts tray area of ​​the base 2 and fixed to the base 2 such that the multiple holes 14 of the defective parts tray 17 are positioned at multiple predetermined defective parts positions on the base 2.

[0014] FIG. 2 is a front view showing the ROM 21 handled by the electronic component tester of the embodiment. The ROM 21 is an electronic component and includes an electronic component body 22 and a plurality of component-side terminals 23. FIG. 3 is a top view showing the ROM 21 handled by the electronic component tester of the embodiment. The electronic component body 22 is formed in a rectangular plate shape. An electric circuit is arranged inside the electronic component body 22, and the electric circuit is covered with an outer shell formed of an insulator. Each of the plurality of component-side terminals 23 is formed of a conductor, formed in a strip shape, and electrically connected to the electric circuit. The plurality of component-side terminals 23 includes a plurality of first terminals 24 and a plurality of second terminals 25. The plurality of first terminals 24 are arranged in the width direction 29 so as to protrude from one end face 26 of the electronic component body 22 and are fixed to the electronic component body 22. The width direction 29 is parallel to the plane along which the electronic component body 22 lies and is parallel to the plane along which the end face 26 lies. The plurality of second terminals 25 are arranged in the width direction 29 so as to protrude from the end face 27 on the opposite side of the end face 26 of the electronic component body 22 and are fixed to the electronic component body 22. At this time, the extent of the electronic component body 22 in the width direction 29 is equal to the distance between two planes that sandwich the electronic component body 22 when the electronic component body 22 is sandwiched between two planes perpendicular to the width direction 29, and is equal to the width W of the electronic component body 22.

[0015] FIG. 4 is a side view showing the ROM 21 handled by the electronic component tester of the embodiment. A lower surface 28 is formed on the electronic component body 22. The tips of the plurality of component-side terminals 23 protrude downward from the plane along which the lower surface 28 lies, and are along another plane parallel to the plane along which the lower surface 28 lies. That is, the plurality of component-side terminals 23 are bent and intersect the plane along which the lower surface 28 lies. At this time, the distance between the plane along which the lower surface 28 lies and the plane along which the tips of the plurality of component-side terminals 23 lie is equal to the length A by which the plurality of component-side terminals 23 protrude from the lower surface 28.

[0016] The plurality of first terminals 24 are formed such that the tips of the plurality of first terminals 24 on the opposite side of one end joined to the electronic component body 22 are along a plane P1 perpendicular to the length direction 30. The length direction 30 is parallel to the plane along which the lower surface 28 lies and perpendicular to the width direction 29. The plurality of second terminals 25 are formed such that the tips of the plurality of second terminals 25 on the opposite side of one end joined to the electronic component body 22 are along a plane P2 perpendicular to the length direction 30. At this time, the distance between the plane P1 and the plane P2 is equal to the length of the ROM 21 in the length direction 30 and equal to the length L of the ROM 21.

[0017] FIG. 5 is a perspective view showing the jig 5. The jig 5 includes a jig body 31 and a plate-like member 32. The jig body 31 is generally formed in a rectangular parallelepiped shape. A groove 34 is formed on the upper surface 33 of the jig body 31. The groove 34 is formed along a straight line parallel to the sliding direction 37 so that the upper surface 33 is divided into a first region 35 and a second region 36, and one end of the groove 34 is arranged on the front surface 38 adjacent to the upper surface 33. The sliding direction 37 is parallel to the plane along which the upper surface 33 lies and perpendicular to the plane along which the front surface 38 lies.

[0018] The plate-like member 32 is formed in a plate shape. A first main body abutting surface 39 is formed on the plate-like member 32. The plate-like member 32 is arranged on the back side of the jig body 31 on the opposite side of the front surface 38 so that the first main body abutting surface 39 faces the back side, closes the back side end of the groove 34, and is fixed to the jig body 31.

[0019] FIG. 6 is a front view showing the jig body 31. A protrusion 41 is further formed inside the groove 34 of the jig body 31. The protrusion 41 protrudes upward from the bottom of the groove 34. The height at which the protrusion 41 protrudes from the bottom of the groove 34 is greater than the length A at which the plurality of component-side terminals 23 of the ROM 21 protrude from the lower surface 28. A sliding surface 42 is formed at the upper end of the protrusion 41. The protrusion 41 is formed such that the sliding surface 42 is along another plane parallel to the plane along which the upper surface 33 lies and the sliding surface 42 is arranged below the plane along which the upper surface 33 lies.

[0020] The groove 34 is formed such that it becomes shallower as it approaches the first region 35 and also as it approaches the second region 36. That is, a first terminal guide surface 43 and a second terminal guide surface 44 are further formed inside the groove 34 of the jig body 31. The first terminal guide surface 43 is positioned between the projection 41 and the first region 35 and is adjacent to the first region 35. The first terminal guide surface 43 is flat and faces diagonally upward. The plane along which the first terminal guide surface 43 is aligned is parallel to the sliding direction 37. The second terminal guide surface 44 is positioned between the projection 41 and the second region 36 and is adjacent to the second region 36. The second terminal guide surface 44 is flat and faces diagonally upward. The plane along which the second terminal guide surface 44 is aligned is parallel to the sliding direction 37.

[0021] The jig body 31 is further formed with a first terminal guide groove 45 and a second terminal guide groove 46. The depth of the first terminal guide groove 45 and the depth of the second terminal guide groove 46 are greater than the length A by which the multiple component-side terminals 23 of the ROM 21 protrude from the lower surface 28. Figure 7 is a top view showing the jig body 31. The first terminal guide groove 45 is formed between the projection 41 and the first terminal guide surface 43, is formed to be recessed from the plane along which the sliding surface 42 follows, and is aligned with a straight line parallel to the sliding direction 37. The second terminal guide groove 46 is formed between the projection 41 and the second terminal guide surface 44, is formed to be recessed from the plane along which the sliding surface 42 follows, and is aligned with a straight line parallel to the sliding direction 37.

[0022] A pitfall hole 47 is further formed in the jig body 31. The pitfall hole 47 is located at the far end of the groove 34 and behind the projection 41. Inside the pitfall hole 47, a terminal abutment bottom surface 51, a first terminal abutment side surface 52, a second terminal abutment side surface 53, and a second body abutment surface 54 are formed. The terminal abutment bottom surface 51 forms part of the far end of the bottom of the groove 34.

[0023] Figure 8 is a rear view showing the jig body 31. The terminal abutment bottom surface 51 is positioned below the plane along which the sliding surface 42 follows, and aligns with another plane parallel to the plane along which the sliding surface 42 follows. The distance between the plane along which the terminal abutment bottom surface 51 follows and the plane along which the sliding surface 42 follows is longer than the length A of the multiple component-side terminals 23 of the ROM 21 protruding from the bottom surface 28.

[0024] The first terminal abutment side surface 52 is positioned between the terminal abutment bottom surface 51 and the first terminal guide surface 43, and is adjacent to both the terminal abutment bottom surface 51 and the first terminal guide surface 43. The first terminal abutment side surface 52 is flat, and the plane along which the first terminal abutment side surface 52 lies is parallel to the sliding direction 37 and perpendicular to the plane along which the terminal abutment bottom surface 51 lies. The second terminal abutment side surface 53 is positioned between the terminal abutment bottom surface 51 and the second terminal guide surface 44, and is adjacent to both the terminal abutment bottom surface 51 and the second terminal guide surface 44. The second terminal abutment side surface 53 is flat, faces the first terminal abutment side surface 52, and the plane along which the second terminal abutment side surface 53 lies is parallel to the sliding direction 37 and perpendicular to the plane along which the terminal abutment bottom surface 51 lies. At this time, the jig body 31 is formed such that the distance between the plane along which the first terminal abutment side surface 52 is aligned and the plane along which the second terminal abutment side surface 53 is aligned is equal to the length L of the ROM 21, or slightly longer than the length L.

[0025] The second body abutment surface 54 is formed at the far end of the projection 41. The second body abutment surface 54 is flat, and the plane along which the second body abutment surface 54 lies is perpendicular to the sliding direction 37. The second body abutment surface 54 is formed such that when the plate-shaped member 32 is properly attached to the jig body 31, the distance between the plane along which the second body abutment surface 54 lies and the plane along which the first body abutment surface 39 lies is equal to or slightly longer than the width W of the electronic component body 22. The jig 5 is placed on the base 2 with its sliding surface 42 aligned with a horizontal plane and is fixed to the base 2.

[0026] [Operation of ROM writing device 1] When a user wants to write predetermined information to multiple ROMs using the ROM writing device 1, they place multiple ROMs on the unprocessed parts tray 15 so that each ROM fits into one of the multiple holes 14 on the unprocessed parts tray 15. The user then places the unprocessed parts tray 15 with the multiple ROMs on it onto the unprocessed parts tray area of ​​the base 2, places the processed parts tray 16 onto the processed parts tray area of ​​the base 2, and places the defective parts tray 17 onto the defective parts tray area of ​​the base 2. The multiple ROMs are appropriately positioned on the base 2 at predetermined unprocessed parts locations when the unprocessed parts tray 15 is properly placed on the unprocessed parts tray area and when the multiple ROMs are properly fitted into the multiple holes 14. After the unprocessed parts tray 15, processed parts tray 16, and defective parts tray 17 are placed on the base 2, the user starts the ROM writing device 1.

[0027] When the ROM writing device 1 is activated, the robot 6 places one of the multiple ROMs 21, each positioned at one of the multiple unprocessed component locations, onto the jig 5. Specifically, the control device 7 controls the actuator 12 to move toward the unprocessed component location where the ROM 21 is located, bringing the gripping part 11 into contact with the electronic component body 22 of the ROM 21. After the gripping part 11 has made contact with the electronic component body 22, the control device 7 controls the gripping part 11 to grip the ROM 21. After the ROM 21 is gripped by the gripping part 11, the control device 7 controls the actuator 12 to move the gripping part 11 so that the lower surface 28 of the electronic component body 22 of the ROM 21 faces the sliding surface 42 of the jig 5. After the lower surface 28 of the electronic component body 22 of the ROM 21 faces the sliding surface 42 of the jig 5, the control device 7 controls the gripping part 11 to release the ROM 21 from the gripping part 11.

[0028] When the ROM 21 is released from the gripping portion 11, it is properly placed on the jig 5 such that the multiple first terminals 24 fit into the first terminal guide grooves 45, the multiple second terminals 25 fit into the second terminal guide grooves 46, and the lower surface 28 contacts the sliding surface 42.

[0029] ROM21 may be improperly positioned in the unprocessed parts location. For example, ROM21 is improperly positioned in the unprocessed parts location when the unprocessed parts tray 15 is placed in a location offset from the unprocessed parts tray holder on the base 2. Furthermore, ROM21 may be improperly positioned in the unprocessed parts location when it is not properly fitted into any of the multiple holes 14, causing it to tilt from its proper orientation as if rotated around a rotation axis parallel to the vertical, or to be positioned offset from the unprocessed parts location. When ROM21 is improperly positioned in the unprocessed parts location, ROM21 may be improperly gripped by the gripping portion 11 such that the gripping portion 11 contacts a region of the electronic component body 22 other than a predetermined region, or the electronic component body 22 is tilted relative to the gripping portion 11.

[0030] Multiple first terminals 24 may be positioned on the first terminal guide surface 43 when the ROM 21 is improperly gripped by the gripping portion 11 and immediately before the ROM 21 is released from the gripping portion 11. Multiple second terminals 25 may be positioned on the second terminal guide surface 44 when the ROM 21 is improperly positioned in an unprocessed component position and immediately before the ROM 21 is released from the gripping portion 11.

[0031] When the ROM 21 is released from the gripping portion 11, the terminals among the multiple first terminals 24 that are positioned on the first terminal guide surface 43 come into contact with the first terminal guide surface 43 and move along the first terminal guide surface 43 toward the first terminal guide groove 45. When the ROM 21 is released from the gripping portion 11, the terminals among the multiple second terminals 25 that are positioned on the second terminal guide surface 44 come into contact with the second terminal guide surface 44 and move along the second terminal guide surface 44 toward the second terminal guide groove 46. The ROM 21 is properly placed on the jig 5 by the movement of the multiple first terminals 24 toward the first terminal guide groove 45, or by the movement of the multiple second terminals 25 toward the second terminal guide groove 46. In other words, the ROM writing device 1 can properly place the ROM 21 on the jig 5 even if the ROM 21 is improperly positioned in the unprocessed component position.

[0032] After the ROM 21 is properly placed on the jig 5, the robot 6 moves the ROM 21 toward the pit 47 and fits the ROM 21 into the pit 47. That is, after the ROM 21 is properly placed on the jig 5, the control device 7 controls the actuator 12 to position the gripping part 11 on the front side of the ROM 21 placed on the jig 5. After the gripping part 11 is positioned on the front side of the ROM 21, the control device 7 controls the actuator 12 to move the gripping part 11 toward the rear. As the gripping part 11 moves toward the rear, the electronic component body 22 of the ROM 21 comes into contact with the gripping part 11 and is pushed toward the rear. As the electronic component body 22 is pushed toward the rear, the ROM 21 moves toward the rear while its lower surface 28 remains in contact with the sliding surface 42 and its multiple first terminals 24 and multiple second terminals 25 remain fitted into the first terminal guide grooves 45 and second terminal guide grooves 46, respectively. The electronic component body 22 comes into contact with the first body abutment surface 39 as the ROM 21 moves inward. After the electronic component body 22 comes into contact with the first body abutment surface 39, the control device 7 controls the actuator 12 to separate the gripping part 11 from the electronic component body 22. When the gripping part 11 separates from the electronic component body 22, the ROM 21 falls into the pit 47 and gets stuck in the pit 47.

[0033] The electronic component body 22 of the ROM 21 faces the first body abutment surface 39 and makes contact with the first body abutment surface 39 when the ROM 21 is fitted into the hole 47. The electronic component body 22 faces the second body abutment surface 54 and makes contact with the second body abutment surface 54 when the ROM 21 is fitted into the hole 47. In other words, the electronic component body 22 is sandwiched between the first body abutment surface 39 and the second body abutment surface 54 when the ROM 21 is fitted into the hole 47. The ROM 21 is positioned so that its position in the sliding direction 37 is appropriate when the electronic component body 22 is sandwiched between the first body abutment surface 39 and the second body abutment surface 54.

[0034] Figure 9 is a perspective view showing the jig body 31 and the ROM 21 when the ROM 21 is fitted into the pit hole 47. The multiple component-side terminals 23 of the ROM 21 come into contact with the terminal abutment bottom surface 51 when the ROM 21 is fitted into the pit hole 47. The ROM 21 is positioned so that its vertical position is appropriate when the multiple component-side terminals 23 come into contact with the terminal abutment bottom surface 51. The tips of the multiple first terminals 24 face the first terminal abutment side surface 52 and come into contact with the first terminal abutment side surface 52 when the ROM 21 is fitted into the pit hole 47. The tips of the multiple second terminals 25 face the second terminal abutment side surface 53 and come into contact with the second terminal abutment side surface 53 when the ROM 21 is fitted into the pit hole 47. The ROM 21 is positioned such that its position in the left-right direction is appropriate, with the tips of the multiple first terminals 24 facing the first terminal abutment side surface 52 and the tips of the multiple second terminals 25 facing the second terminal abutment side surface 53. The left-right direction is perpendicular to the sliding direction 37 and parallel to the plane along which the terminal abutment bottom surface 51 is aligned.

[0035] After the ROM 21 is placed in the pit 47, the robot 6 properly inserts the ROM 21 into the opening 10 of the device body 3 so that the multiple component-side terminals 23 of the ROM 21 contact the multiple device-side terminals of the device body 3. That is, after the ROM 21 is placed in the pit 47, the control device 7 controls the actuator 12 to lower the gripping part 11 from above the pit 47 and bring the gripping part 11 into contact with the electronic component body 22 of the ROM 21 that is placed in the pit 47. After the gripping part 11 has made contact with the electronic component body 22, the control device 7 controls the gripping part 11 to grip the ROM 21. After the ROM 21 is gripped by the gripping part 11, the control device 7 controls the actuator 12 to raise the gripping part 11 and lift the ROM 21. At this time, the ROM 21 is properly gripped by the gripping portion 11 such that the gripping portion 11 contacts a predetermined area of ​​the electronic component body 22, and the ROM 21 is positioned in a predetermined orientation relative to the gripping portion 11, due to the ROM 21 being fitted into the pit 47.

[0036] After the ROM 21 is lifted, the control device 7 controls the actuator 12 to position the gripping part 11 over the writing position on the device body 3, and position the ROM 21 over the writing position on the device body 3. After the ROM 21 is positioned over the writing position, the control device 7 controls the actuator 12 to lower the gripping part 11 and lower the ROM 21. As the ROM 21 lowers, it is properly positioned over the writing position on the device body 3. The multiple component-side terminals 23 of the ROM 21 make electrical contact with the multiple device-side terminals of the device body 3, respectively, as the ROM 21 is properly positioned over the writing position on the device body 3. After the ROM 21 is properly positioned over the writing position, the control device 7 controls the gripping part 11 and releases the ROM 21 from the gripping part 11. After the ROM 21 is released from the gripping part 11, the control device 7 controls the actuator 12 to raise the gripping part 11 and move the gripping part 11 away from the ROM 21.

[0037] After the gripping unit 11 leaves the ROM 21, the control device 7 controls the main body 3 and outputs a write signal to the ROM 21 via multiple device-side terminals, writing predetermined information to the ROM 21. After the write signal is output to the ROM 21, the control device 7 controls the main body 3 and outputs a read signal to the ROM 21 via multiple device-side terminals, and receives an electrical signal output from the ROM 21 in response to the read signal. Based on the electrical signal output from the ROM 21, the control device 7 determines whether the information has been properly written to the ROM 21.

[0038] After determining whether information has been properly written to the ROM 21, the robot 6 removes the ROM 21 from the device body 3 and places it on the processed parts tray 16 or the defective parts tray 17. Specifically, when information has been properly written to the ROM 21, the control device 7 controls the actuator 12 to lower the gripping part 11 from above the opening 10 and bring the gripping part 11 into contact with the electronic component body 22 of the ROM 21. After the gripping part 11 has made contact with the electronic component body 22, the control device 7 controls the gripping part 11 to grip the ROM 21. After the ROM 21 is gripped by the gripping part 11, the control device 7 controls the actuator 12 to raise the gripping part 11 and remove the ROM 21 from the device body 3. After the ROM 21 has been removed from the device body 3, the control device 7 further controls the actuator 12 to move the gripping part 11 so that the ROM 21 fits into one of the available holes 14 of the processed parts tray 16. After the ROM 21 is fitted into the hole, the control device 7 controls the gripping part 11 to release the ROM 21 from the gripping part 11. After the ROM 21 is released from the gripping part 11, the control device 7 controls the actuator 12 to raise the gripping part 11 and separate the gripping part 11 from the ROM 21.

[0039] When information is not properly written to the ROM 21, the control device 7 controls the actuator 12 to lower the gripping part 11 from above the opening 10, bringing the gripping part 11 into contact with the electronic component body 22 of the ROM 21. After the gripping part 11 has made contact with the electronic component body 22, the control device 7 controls the gripping part 11 to grip the ROM 21. After the ROM 21 is gripped by the gripping part 11, the control device 7 controls the actuator 12 to raise the gripping part 11 and remove the ROM 21 from the device body 3. After the ROM 21 has been removed from the device body 3, the control device 7 further controls the actuator 12 to move the gripping part 11 so that the ROM 21 fits into one of the available holes 14 of the defective parts tray 17. After the ROM 21 is fitted into the hole, the control device 7 controls the gripping part 11 to release the ROM 21 from the gripping part 11. After the ROM 21 is released from the gripping part 11, the control device 7 controls the actuator 12 to raise the gripping part 11 and separate the gripping part 11 from the ROM 21. The ROM writing device 1 repeatedly performs the operations described above for ROM 21 on the other ROMs among the multiple ROMs that are different from ROM 21, until there are no more ROMs to be placed at each of the multiple unprocessed component positions.

[0040] The comparative example ROM writing device is the same as the ROM writing device 1 described above, except that the jig 5 is omitted. The robot 6 of the comparative example ROM writing device takes one of the multiple ROMs 21, each placed at one of the multiple unprocessed component positions, from the unprocessed component tray 15 and inserts it appropriately into the opening 10 of the device body 3. The gripping part 11 of the comparative example ROM writing device may not properly grip the ROM 21 when the ROM 21 is improperly placed at the unprocessed component position. The multiple component-side terminals 23 of the ROM 21 may not electrically contact the multiple device-side terminals of the device body 3 when the ROM 21 is not properly gripped by the gripping part 11. The comparative example ROM writing device may not be able to properly write information to the ROM 21 when the multiple component-side terminals 23 do not electrically contact the multiple device-side terminals. In other words, the ROM writing device 1 described above can more reliably position electronic components in predetermined locations on the device body 3 compared to the ROM writing device of the comparative example, and can more reliably write information to the ROM 21.

[0041] [Effects of the electronic component tester in the example] The electronic component tester of this embodiment is a device for testing a ROM 21. The ROM 21 comprises an electronic component body 22 and a plurality of component-side terminals 23 fixed to the electronic component body 22. The electronic component tester of this embodiment comprises a device body 3, a jig 5, and a robot 6. The device body 3 is provided with a plurality of device-side terminals. The jig 5 has a sliding surface 42 and a pit hole 47 formed therein. After the ROM 21 is placed on the jig 5 so that the electronic component body 22 is in contact with the sliding surface 42, the robot 6 moves the ROM 21 toward the pit hole 47 while the electronic component body 22 is in contact with the sliding surface 42. The robot 6 further grasps the ROM 21 after it has fallen into the pit hole 47 and electrically contacts the plurality of component-side terminals 23 with the plurality of device-side terminals, respectively.

[0042] In this embodiment, the electronic component tester can ensure that the robot 6 properly grips the ROM 21 so that the ROM 21 does not tilt or shift relative to the device body 3. By properly gripping the ROM 21 with the robot 6, the electronic component tester in this embodiment can properly position the ROM 21 on the device body 3 so that multiple component-side terminals 23 make electrical contact with multiple device-side terminals. By properly positioning the ROM 21 on the device body 3, the electronic component tester in this embodiment can properly write information to the ROM 21.

[0043] Furthermore, the jig 5 of the electronic component tester in the embodiment is further formed with a terminal abutment bottom surface 51, a first terminal abutment side surface 52, and a second terminal abutment side surface 53 that face the multiple component-side terminals 23 when the ROM 21 is fitted into the pit hole 47. In this case, the electronic component tester in the embodiment allows the robot 6 to properly grip the ROM 21 so that the multiple component-side terminals 23 are positioned appropriately by the robot 6 gripping the ROM 21 which is fitted into the pit hole 47.

[0044] Furthermore, the jig 5 of the electronic component tester in the embodiment is further formed with a first terminal guide groove 45 and a second terminal guide groove 46 into which a plurality of component-side terminals 23 are fitted when the electronic component body 22 is in contact with the sliding surface 42. The plurality of component-side terminals 23 move along the first terminal guide groove 45 and the second terminal guide groove 46 as the ROM 21 moves toward the pit hole 47. At this time, the electronic component tester in the embodiment can prevent the ROM 21 from tilting as it moves toward the pit hole 47. By preventing the ROM 21 from tilting, the electronic component tester in the embodiment can properly fit the ROM 21 into the pit hole 47, and the robot 6 can properly grip the ROM 21.

[0045] Furthermore, the jig 5 of the electronic component tester in the embodiment is further formed with a first terminal guide surface 43 and a second terminal guide surface 44 that face the multiple component-side terminals 23 when the electronic component body 22 is not in contact with the sliding surface 42 and the electronic component body 22 is facing the sliding surface 42. The electronic component tester in the embodiment can properly place the ROM 21 on the jig 5 even if the ROM 21 is not properly gripped by the robot 6 before it is placed on the jig 5, by aligning the multiple component-side terminals 23 with the first terminal guide surface 43 and the second terminal guide surface 44.

[0046] Furthermore, the jig 5 of the electronic component tester in this embodiment has a first body abutment surface 39 that faces the electronic component body 22 when the ROM 21 is fitted into the hole 47. The robot 6 moves the ROM 21 until the electronic component body 22 contacts the first body abutment surface 39, while the electronic component body 22 is in contact with the sliding surface 42. At this time, the electronic component tester in this embodiment can position the ROM 21 so that its position in the sliding direction 37 is appropriate when the ROM 21 is fitted into the hole 47.

[0047] Incidentally, the electronic component tester in the previously described embodiment is used in the ROM writing device 1 for writing information to the ROM 21, but it may also be used in other devices. An example of such a device is a testing device that checks whether an electronic component containing an integrated circuit is functioning properly. Similar to the ROM writing device 1 described above, such a testing device can also use the jig 5 to properly place the electronic component at a predetermined position on the device body, and can properly check whether the electronic component is functioning properly.

[0048] Although examples have been described above, the examples are not limited to those described above. Furthermore, the components described above include those that can be easily imagined by a person skilled in the art, those that are substantially the same, and those that fall within the so-called equivalent range. Moreover, the components described above can be combined as appropriate. Furthermore, at least one of various omissions, substitutions, and modifications of the components can be made without departing from the gist of the examples. [Explanation of Symbols]

[0049] 1: ROM writing device 3: Main unit of the device 5: Jig 6: Robots 7: Control device 11: Grip part 12: Actuator 22: Electronic component body 23: Multiple component-side terminals 24: Multiple first terminals 25: Multiple second terminals 28: Bottom surface 34: Groove 39: First main body abutment surface 42: Sliding surface 43: First terminal guide surface 44: Second terminal guide surface 45: First terminal guide groove 46: Second terminal guide groove 47: Pitfall 51: Terminal abutment bottom surface 52: First terminal abutment side 53: Side of the second terminal abutment 54: Second main body abutment surface

Claims

1. The electronic component itself, Multiple component-side terminals fixed to the electronic component body Electronic components equipped with It is an electronic component tester that tests, The aforementioned electronic component body is The electronic component is provided with a gap in the longitudinal direction, and has two end faces that extend in the vertical direction of the electronic component, The lower surface extending over the lower ends of each of the two end faces, Equipped with, The component-side terminals are provided on each of the two end faces, and protrude from the end face in a direction away from the end face in the longitudinal direction and downward, The aforementioned electronic component tester is A device body having multiple device-side terminals, A jig in which a sliding surface and a pitfall are formed, The electronic component is placed on the jig such that the lower surface of the electronic component body is in contact with the sliding surface, and a robot moves the electronic component toward the pit while the lower surface of the electronic component body is still in contact with the sliding surface. The robot further grasps the electronic component after it has fallen into the pit and brings the multiple component-side terminals into electrical contact with the multiple device-side terminals, respectively. Electronic component tester.

2. The jig is further formed with terminal abutment surfaces that face the terminals of the multiple components when the electronic components are fitted into the holes. The electronic component tester according to claim 1.

3. The jig is further provided with terminal guide grooves into which the plurality of component-side terminals are fitted when the lower surface of the electronic component body is in contact with the sliding surface. The plurality of component-side terminals move along the terminal guide groove when the electronic component moves toward the pitfall. The electronic component tester according to claim 1 or claim 2.

4. The jig has a terminal guide surface formed therein. The terminal guide surface faces the plurality of component-side terminals when the lower surface of the electronic component body is not in contact with the sliding surface, and when the lower surface of the electronic component body faces the sliding surface. An electronic component tester according to any one of claims 1 to 3.

5. The jig is further provided with a body abutment surface that faces the body of the electronic component when the electronic component is fitted into the pit. The robot moves the electronic component until the electronic component body contacts the body abutment surface, when the lower surface of the electronic component body is in contact with the sliding surface. An electronic component tester according to any one of claims 1 to 4.

6. A device body having multiple device-side terminals, A jig in which a sliding surface and a pitfall are formed, robot Using an electronic component tester equipped with the following, The electronic component itself, Multiple component-side terminals fixed to the electronic component body Electronic components equipped with This is an electronic component testing method for testing, The robot moves the electronic component toward the pit after the electronic component has been placed on the jig such that the electronic component body is in contact with the sliding surface, while the electronic component body remains in contact with the sliding surface. The robot grasps the electronic component after it has fallen into the trap and electrically connects the multiple component-side terminals to the multiple device-side terminals. An electronic component testing method comprising the following.

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