A method for determining probing parameters used when a probe system tests a device under test, a probe system and its operation method, a computer-readable non-temporary recording medium, a method for testing an unpackaged semiconductor device, a tested semiconductor device and its manufacturing method, and a method for generating a virtual mark image.

Abstract

To provide a method for determining probing parameters used when a probe system performs a test on a device under test.SOLUTION: A method defines a dataset representing the relationship between a slip distance and a probing stroke on the basis of the configuration of probes in a probe assembly within a probe system and the configuration of contact pads on the device under test to be tested. A control device acquires a value for setting the slip distance after the probe tip contacts the contact pad of the device under test or a value for setting the probing stroke which represents the relative movement between the probe assembly and the device under test after the probe tip contacts the contact pad of the device under test, acquires a slip distance value and a probing stroke value on the basis of the probe target position or probe current position, and determines the position used for the relative positioning of the probe assembly and the device under test.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a technique for performing inspection and measurement using a probe assembly. In particular, the present invention relates to a method for determining probing parameters used when a probe system tests a device under measurement, an operation method of a probe system using the method, a probe system, a computer-readable non-temporary recording medium, a method for testing an unpackaged semiconductor device, a method for manufacturing a tested semiconductor device and a tested semiconductor device, and a method for generating a virtual mark image.

Background Art

[0002] As shown in Figures 1A and 1B, conventionally, when testing a device under test using a probe assembly, the device under test is placed on a chuck, and the probe assembly and the chuck move relative to each other until the probe tip 11 of the probe 10 of the probe assembly makes initial contact with the contact pad 12 of the device under test. At this time, the probe tip 11 of the probe 10 is located at the initial contact position P1 (see Figures 1A and 1B). Subsequently, the probe assembly and the chuck move relative to each other in the vertical direction (i.e., along the Z-axis) for a predetermined distance (probing stroke (overdrive) OD). Normally, the chuck moves upward from the contact height and approaches the probe assembly, so that the probe tip 11 of the probe 10 and the surface of the contact pad 12 of the device under test receive force and make secure contact with each other. Simultaneously, the probe tip 11 of the probe 10 deflects (i.e., moves along the X or Y axis), travels a predetermined distance (skate distance SD) across the surface of the contact pad 12, and stops at the final contact position P2, thereby creating a probe mark on the surface of the contact pad 12. The length of the probe mark is equal to the skate distance SD. In order for the probe assembly to exhibit good test performance for the device under test and to maintain that performance consistently, it is usually desirable that consistent probe marks be generated in each test. That is, accurate initial contact position P1, final contact position P2, and skate distance SD are required.

[0003] Currently, before starting a test, it is necessary to first find the appropriate probing stroke OD using a calibration board. This process is very inconvenient and time-consuming. For example, there is at least a difference in material between the calibration board and the device under test during actual operation. Therefore, even if the appropriate probing stroke OD is obtained on the calibration board, it is difficult to guarantee that the probe tip 11 of the probe 10 will stop at a predetermined final contact position P2 when applied to the device under test. If the device under test is the calibration reference (test circuit) of the calibration board, it is usually not possible to know the initial contact position P1 at which the probe tip 11 of the probe will stop at a predetermined final contact position P2 without performing calibration tests of the probing stroke OD on that calibration reference (test circuit). This process is not only inconvenient and time-consuming, but repeated operation can also cause wear and damage to the probe or calibration reference. Furthermore, errors may occur in the calibration results of the probing stroke OD, which can result in an inaccurate final contact position P2 during actual testing and lead to incorrect test results. An accurate final contact position P2 is particularly important in high-frequency testing. More specifically, once the probing stroke OD is obtained, this setting is applied uniformly to all devices under test on the board. Therefore, it is not practical to individually adjust and set the probing stroke OD for each device under test so that the probe tip 11 of the probe 10 stops at the desired final contact position P2 in order to obtain good test results.

[0004] Furthermore, when performing tests, it is necessary to confirm using an image forming device (e.g., a microscope) whether the position where the probe tip 11 of the probe 10 is initially in contact with the contact pad 12 of the device under test is the desired initial contact position P1. However, because the field of view (FOV) of the image forming device is narrow, even if the probe tip 11 of the probe 10 and the contact pad 12 of the device under test are on the same plane, they generally cannot be seen clearly at the same time, except when the probe tip 11 of the probe 10 and the contact pad 12 of the device under test are in contact. As a result, even if the desired initial contact position P1 is known, it is difficult to accurately position the probe tip 11 of the probe 10 to the desired initial contact position P1. Consequently, it is difficult to produce consistent probe marks, and it is difficult to maintain and match good test performance of the device under test using the probe assembly. [Overview of the project] [Problems that the invention aims to solve]

[0005] The present invention has been made to solve the above-mentioned problems and aims to provide a method for determining probing parameters used when a probe system tests a device under test, enabling easy and rapid acquisition of probing parameters, and ensuring that the probe assembly exhibits good and consistent test performance. [Means for solving the problem]

[0006] To solve the above-mentioned problems, the present invention provides a method for determining probing parameters used when a probe system performs a test on a device under test, The steps include defining a dataset that shows the relationship between slip distance and probing stroke based on the shape of the probe in the probe assembly of the probe system and the shape of the contact pad of the device under test, and A step of providing a control device with one of the slip distance value and the probing stroke value, The aforementioned sliding distance value sets the distance that the tip of the probe slides over the contact pad of the device under measurement after it has come into contact with the contact pad. The probing stroke value sets the distance the probe assembly and the device under test move relative to each other again after the probe tip of the probe contacts the contact pad of the device under test, step, A step of providing the control device with one of the probe target position and the probe current position, The probe target position is the position where the probe tip of the probe is expected to stop after sliding over the contact pad of the device being measured. The current position of the probe is the current position of the probe tip, a step and The method includes the steps of: using the control device to determine the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and a dataset showing the relationship between the slip distance and the probing stroke; and determining a position used for relative positioning of the probe assembly and the device under measurement based on the slip distance value and one of the probe target position and the probe current position.

[0007] This means that the dataset showing the relationship between slip distance and probing stroke may be data pre-stored within the control unit, or the relationship between slip distance and probing stroke may be measured using a calibration board before the test, and the dataset based on that measurement may be constructed within the control unit. Subsequently, given a predetermined slip distance value or probing stroke value and a predetermined probe target position or probe current position, the control unit can perform calculations using this dataset. Thus, both the slip distance value and the probing stroke value can be known, and the necessary parameters can be calculated according to the requirements of the alignment method. For example (but not limited to), the position where the probe tip should begin to contact the contact pad of the device under test (e.g., initial contact position P1 in Figure 1B) can be calculated from the probe target position and the slip distance value. In other words, if a dataset showing the relationship between slip distance and probing stroke has already been constructed, the user can input partial parameters (e.g., slip distance value and probe target position) into the control unit and obtain the parameters necessary to test the device under test using the probe assembly. Thus, a time-consuming initial setup process is not required before each test. For example, it eliminates the need for processes such as finding the appropriate probing stroke using a calibration board, or obtaining the initial contact position by calibrating and measuring multiple probing strokes. Furthermore, the method of the present invention can provide accurate parameters and ensure that the probe tip of the probe stops at the desired probe target position after sliding over the contact pad of the device under test. Thus, the method of determining the probing parameters used when a probe system tests a device under test according to the present invention is convenient and time-saving, allows the probe assembly to exhibit good and consistent test performance, improves test accuracy, and reduces wear on the probe and calibration board, thereby extending their lifespan.

[0008] Preferably, as in the example given in the previous paragraph, the probe target position is provided to the control device. The position used for relative positioning of the probe assembly and the device under test is the probe contact position. The probe contact position is the position where the probe tip of the probe is expected to begin contacting the contact pad of the device under test, and is used to position the probe tip of the probe at the probe contact position.

[0009] As a result, when the control device acquires the probe contact position, it directly positions the probe tip at the probe contact position, and then executes the probing stroke work program so that the probe tip stops at the desired probe target position.

[0010] More preferably, a method for determining the probing parameters used when the probe system performs a test on the device under test further includes the step of confirming that both the probe contact position and the probe target position are located within the tolerance range corresponding to the contact pad of the device under test.

[0011] As mentioned above, the control device performs calculations based on a dataset showing the relationship between slip distance and probing stroke, making it possible to obtain the slip distance value, probing stroke value, probe contact position, and probe target position. Therefore, after the probe contact position and probe target position are obtained, it is possible to confirm whether these two positions are within the tolerance range of the contact pad of the device under test, ensuring that the probe tip makes reliable contact with the contact pad of the device under test during the probing stroke process, and that appropriate probe marks are generated, thereby further ensuring test accuracy.

[0012] More preferably, a method for determining probing parameters used when the probe system performs a test on a device under test further includes the steps of using the control device to generate a virtual alignment mark indicating the probe contact position, and aligning the probe tip of the probe with respect to the virtual alignment mark.

[0013] This allows the user to align the probe tip to a virtual alignment mark simply by displaying a virtual alignment mark on the display device, even if only the probe tip is clearly displayed on the microscope and the contact pad of the device under measurement is not clearly displayed when the user is manually aligning the probe. Therefore, after accurately positioning the probe tip to the probe contact position, executing the probing stroke work program ensures that the probe tip stops at the required probe target position. Furthermore, even when performing automatic positioning, the virtual alignment mark is displayed on the display device so that the user can understand the current situation.

[0014] Preferably, the current probe position can be provided to the control device. The position used for relative positioning of the probe assembly and the device under test is a relative target position. The relative distance between the relative target position and the current probe position is the same as the sliding distance value, and by moving the relative target position and the probe assembly synchronously relative to the device under test, the relative target position is moved relative to the position corresponding to the contact pad of the device under test, and is used for relative positioning of the probe assembly and the device under test.

[0015] As a result, the position of the contact pad of the device under test is set visually by the user, and the numerical value has not yet been provided to the control device. To be more precise, the position of the contact pad of the device under test may be the position where the user intends to stop after sliding the probe tip over the contact pad of the device under test. This is similar to the aforementioned probe target position, and no numerical value is set; it is determined by the user when performing the operation. This allows the relative target position to be calculated based on the sliding distance value and the current probe position, and the user moves the relative target position relative to the probe stopping position they have determined. Alternatively, even if the probe target position is already known, it is possible to perform alignment by calculating the relative target position and moving the relative target position relative to the probe target position, rather than positioning by the probe contact position. In this case, the position of the corresponding contact pad of the device under test becomes the probe target position. This relative target position moves relative to the device under test along with the probe assembly. By simply moving the relative target position relative to the aforementioned position of the contact pad of the device under test, the probe tip of the probe will be positioned in the appropriate position on the contact pad of the device under test. Therefore, after executing the probing stroke work program, the probe tip can be stopped at the desired position.

[0016] More preferably, a method for determining probing parameters used when a probe system performs a test on a device under test includes, using the control device, generating a virtual alignment mark indicating the relative target position, moving the virtual alignment mark relative to a position corresponding to the contact pad of the device under test, and moving the relative target position to a position corresponding to the contact pad of the device under test.

[0017] This allows the user to manually align the probe even if the microscope cannot clearly display both the probe tip and the contact pad of the device under test simultaneously. By displaying a virtual alignment mark on the display device and synchronizing the movement of the probe assembly and the virtual alignment mark relative to the device under test, the user can align the virtual alignment mark to the target probe position once the target probe position is displayed on the display device. Alternatively, with the contact pad of the device under test clearly displayed on the display device, the user can visually move the alignment mark relative to the set probe stop position to ensure the probe tip is positioned correctly on the contact pad of the device under test, and after the probing stroke program is executed, the probe tip will stop at the required position. Furthermore, even when performing automatic positioning, the virtual alignment mark is displayed on the display device so that the user can understand the current situation.

[0018] Preferably, a dataset showing the relationship between the sliding distance and the probing stroke is constructed using the probe system and the calibration substrate, and the method of construction includes the following steps. Step 1: Bring the tip of the probe into contact with the calibration substrate. Step 2: The probe and the calibration substrate are moved relative to each other by one probing stroke in the vertical axis direction, and the tip of the probe is slid on the calibration substrate to generate a sliding distance, which is then observed using an optical image forming apparatus. Step 3: Using the control device, a dataset showing the relationship between the sliding distance and the probing stroke is generated based on the sliding distance and the probing stroke.

[0019] This allows the user to provide multiple different probing strokes and measure each on a calibration substrate to obtain the corresponding slip distance, thereby building a dataset within the control unit that shows the relationship between this slip distance and the probing stroke. In the future, when the form uses a probe corresponding to this dataset to test a contact pad corresponding to this dataset, it can directly use the already constructed dataset showing the relationship between slip distance and probing stroke. Thus, the necessary probing parameters can be obtained easily and quickly, ensuring that the probe assembly delivers good and consistent test performance.

[0020] Furthermore, the method of operating the probe system according to the present invention corresponds to a situation in which positioning is performed using the probe contact position described above. The probe system comprises a probe assembly and a control device. The probe assembly includes a probe having a probe tip used to contact the contact pad of the device to be measured. The method of operating the probe system includes the following steps. Step 1: Using the control device, perform a method for determining the probing parameters used when the aforementioned probe system tests the device under test. Step 2: Using the control device, position the probe tip of the probe at the probe contact position. Step 3: Use the control device to execute the probing stroke work program. The probing stroke operation program causes the probe assembly and the device under measurement to move relative to each other by a probing stroke value, so that the probe tip of the probe is deflected and slides and stops at the probe target position.

[0021] By this operation method, accurate probing parameters can be obtained simply and quickly. Then, by first positioning using the probe contact position and later performing a spot test using the probing stroke value, the probe assembly can be made to exhibit good and consistent test performance and achieve excellent test accuracy.

[0022] Furthermore, the operation method of the probe system according to the present invention corresponds to the situation of performing positioning using the relative target position described above. The probe system includes a probe assembly and a control device. The probe assembly includes a probe having a probe tip used to contact the contact pad of the device under measurement. The operation method of the probe system includes the following steps. Step 1: Use the control device to execute a method for determining the probing parameters used when the probe system described above performs a test on the device under measurement. Step 2: Use the control device to relatively move the relative target position to a position corresponding to the contact pad of the device under measurement. Step 3: Use the control device to execute a probing stroke work program. The probing stroke work program causes the probe assembly and the device under measurement to relatively move by a probing stroke value, and causes the probe tip of the probe to deflect and slide to stop at a position corresponding to the contact pad of the device under measurement.

[0023] By this operation method, accurate probing parameters can be obtained simply and quickly. Then, by first positioning using the probe contact position and later performing a spot test using the probing stroke value, the probe assembly can be made to exhibit good and consistent test performance and achieve excellent test accuracy.

[0024] Furthermore, the probe system according to the present invention comprises a chuck, a probe assembly, an optical image forming apparatus, and a control device. The chuck includes a chuck support surface configured to support a substrate containing one or more devices under test. The probe assembly includes a probe having a probe tip, the probe configured to test the devices under test. The optical image forming apparatus is configured to receive optical images from at least a portion of the probe system, which include images from at least a portion of the probe assembly. The control device is programmed to perform a method for determining probing parameters used when the aforementioned probe system tests the devices under test.

[0025] This probe system allows for easy, rapid, and accurate acquisition of probing parameters, enabling the probe assembly to deliver good and consistent test performance and achieve excellent test accuracy.

[0026] Furthermore, the computer-readable non-temporary recording medium according to the present invention includes a computer-executable instruction. When the instruction is executed, it instructs the probe system to perform a method for determining the probing parameters used when the probe system performs a test on the device under test.

[0027] This readable, non-transient recording medium allows for easy, rapid, and accurate acquisition of probing parameters, enabling the probe assembly to deliver good and consistent test performance and achieve superior test accuracy.

[0028] Furthermore, the method for testing an unpackaged semiconductor device according to the present invention includes the following steps: Step 1: Provide at least one probe assembly, including a probe having a probe tip configured for mechanical and electrical contact with an unpackaged semiconductor device. Step 2: Provide a control device programmed to perform a method for determining the probing parameters used when the aforementioned probe system tests the device under test, and to obtain the results. Step 3: Based on the results, the control device is used to test the unpackaged semiconductor device with the probe.

[0029] This method for testing unpackaged semiconductor devices allows for easy, rapid, and accurate probing parameter acquisition, enabling probe assemblies to deliver good and consistent test performance and achieve excellent test accuracy.

[0030] Furthermore, the tested method for manufacturing a semiconductor device according to the present invention includes the following steps: Step 1: Provide at least one probe assembly, including a probe having a probe tip configured for mechanical and electrical contact with an unpackaged semiconductor device. Step 2: Provide a control device programmed to perform a method for determining the probing parameters used when the aforementioned probe system tests the device under test, and to obtain the results. Step 3: Based on the results, the control device is used to test the unpackaged semiconductor device with the probe.

[0031] Semiconductor devices manufactured using this method undergo highly precise testing, ensuring their performance.

[0032] Furthermore, the tested semiconductor device according to the present invention comprises an unpackaged semiconductor device. The unpackaged semiconductor device includes a plurality of contact pads. The unpackaged semiconductor device is tested by a single test process. This test process includes the following steps. Step 1: Perform the method for determining the probing parameters used when the aforementioned probe system tests the device under test, and obtain the results. Step 2: The contact pad is made to receive the mechanical and electrical contact performed based on the above result.

[0033] This ensures that the semiconductor device undergoes highly precise testing and that its performance is guaranteed.

[0034] Furthermore, the method for generating virtual mark images according to the present invention is used to generate virtual mark images that represent a part of a probe system. The probe system comprises a substrate having one or more devices to be measured, and probes configured to perform tests on the devices to be measured. This method includes the following steps. Step 1: Using an optical image forming apparatus, acquire a current probe system image which includes at least a part of the probe system, an image of at least a part of the probe, and an image of at least a part of the substrate. Step 2: Use the control device to generate a virtual mark image based at least partially on the current probe system image. Step 3: Use a display device to show the virtual mark image. The virtual mark image includes a display of the probe contact position or a display of the probe target position. The probe contact position is the position where the tip of the probe is expected to begin contacting the contact pad of the device being measured. The probe target position is the position where the probe tip is expected to stop after sliding across the contact pad of the device being measured.

[0035] As a result, the representation of the probe contact position is, for example, a virtual alignment mark indicating the aforementioned probe contact position, and the representation of the probe target position is, for example, a virtual alignment mark indicating the aforementioned relative target position. Even if the optical image generation device cannot simultaneously and clearly display the contact pad of the device under measurement and the probe tip of the probe, the user can manually align the probe and the device under measurement using the virtual mark image. Alternatively, even when automatic positioning is performed, the user can understand the current situation using the virtual mark image.

[0036] Preferably, the control device obtains the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and obtains the probe contact position based on the slip distance value and the probe target position.

[0037] In other words, the aforementioned method for generating virtual mark images is used for manual or automatic alignment between the probe and the device under test by obtaining the probe contact position through the method for determining the probing parameters used when the probe system performs tests on the device under test, and further displaying the probe contact position in the virtual mark image.

[0038] Preferably, the control device obtains the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and a dataset showing the relationship between the slip distance and the probing stroke, obtains the relative target position based on the slip distance value and the current probe position, wherein the current probe position is the current position of the probe tip, and the relative distance between the relative target position and the current probe position is equal to the slip distance value.

[0039] In other words, the aforementioned method for generating virtual mark images is used to obtain the relative target position by determining the probing parameters used when the probe system performs tests on the device under test, and further, by displaying the relative target position in the virtual mark image, it is used for manual or automatic alignment between the probe and the device under test.

[0040] Preferably, in the current probe system image, the device under measurement is clearer than at least the probe tip of the probe. The step of generating a virtual mark image includes the step of generating a virtual alignment mark. The virtual alignment mark indicates the probe contact position.

[0041] This allows the optical image generator to define the probe target position and calculate the probe contact position from existing probe system images if the device under measurement is clearly visible in the acquired images, even if the optical image generator cannot simultaneously capture clear images of both the probe tip and the device under measurement. The resulting virtual mark image will include a virtual alignment mark indicating the probe contact position. Therefore, the user can manually align the probe tip to the virtual alignment mark, accurately positioning the probe tip at the probe contact position. Even when automatic positioning is performed, the user can still understand the current situation.

[0042] Preferably, in the current probe system image, at least the probe tip of the probe is clearer than the device under measurement. The step of generating a virtual mark image includes the step of generating a virtual alignment mark. The virtual alignment mark displays a relative target position. The relative relationship between the relative target position and the current position of the probe tip is equal to the relative relationship between the probe target position and the probe contact position.

[0043] This allows the optical image generator to define the current probe position and calculate the relative target position from existing images of the probe system, even if it cannot simultaneously capture clear images of both the probe tip and the device under measurement. As a result, if the probe tip is clearly visible in the acquired images of the existing probe system, the virtual mark image will include a virtual alignment mark indicating the relative target position. Therefore, the user can manually adjust the relative target position to a probe stop position determined by the user, thereby positioning the probe tip to the appropriate probe contact position.

[0044] Preferably, the step of generating virtual alignment marks determines the relative position of the virtual alignment marks with respect to the probe tip of the probe. The step of generating a virtual mark image modifies the virtual mark image based on at least the determined relative position of the virtual alignment marks with respect to the probe tip of the probe so that the virtual mark image includes the virtual alignment marks.

[0045] As a result, in either the case where a virtual alignment mark indicating the probe contact position as described above is generated, or where a virtual alignment mark indicating the relative target position as described above is generated, the optical image generation device can acquire the position of the probe tip, determine the position of the virtual alignment mark relative to the probe tip, and add the virtual alignment mark to the virtual mark image.

[0046] Detailed structures, features, assembly, or uses of the method for determining probing parameters used when a probe system tests a device under test, the probe system and its operation, a computer-readable non-temporary recording medium, a method for testing an unpackaged semiconductor device, a tested semiconductor device and its manufacturing method, and a method for generating a virtual mark image, according to the present invention, will be described in the description of embodiments for carrying out the invention below. However, those with general skill in the art of the present invention should understand that such detailed descriptions and the specific embodiments listed for carrying out the invention are merely illustrative of the invention and not intended to limit the scope of the claims of the present invention. [Brief explanation of the drawing]

[0047] [Figure 1A] This is a side view showing the state in which the tip of the probe of a conventional probe assembly makes point contact with the contact pad of the device being measured. [Figure 1B] This is a plan view showing the state in which the tip of the probe of a conventional probe assembly makes point contact with the contact pad of the device being measured. [Figure 2] This figure shows a flowchart illustrating the operation method of the probe system according to the first embodiment of the present invention. [Figure 3] This is a schematic diagram showing a probe system according to the present invention. [Figure 4] This is a schematic diagram showing the execution process of the operation method of the probe system according to the first embodiment of the present invention, viewed from above (Z-axis). [Figure 5] This is a schematic diagram showing the execution process of the operation method of the probe system according to the first embodiment of the present invention, viewed from above (Z-axis). [Figure 6] This is a schematic diagram showing the execution process of the operation method of the probe system according to the first embodiment of the present invention, viewed from above (Z-axis). [Figure 7]This is a schematic diagram showing the execution process of the operation method of the probe system according to the first embodiment of the present invention, viewed from above (Z-axis). [Figure 8] This is a schematic diagram showing the execution process of the operation method of the probe system according to the first embodiment of the present invention, viewed from above (Z-axis). [Figure 9] This is a schematic diagram showing the execution process of the operation method of the probe system according to the first embodiment of the present invention, viewed from above (Z-axis). [Figure 10] Similar to Figure 7, but differing in that it displays virtual alignment marks in different states and also shows the probe target position and the tolerance range of the contact pad of the device being measured. [Figure 11] This figure shows a flowchart illustrating the operation method of the probe system according to the second embodiment of the present invention. [Figure 12] This is a schematic diagram showing the execution process of the operation method of the probe system according to the second embodiment of the present invention. [Figure 13] This is a schematic diagram showing the execution process of the operation method of the probe system according to the second embodiment of the present invention. [Figure 14] This is a schematic diagram showing the execution process of the operation method of the probe system according to the second embodiment of the present invention. [Figure 15] This is a schematic diagram showing the relationship between slip distance and probe measurement stroke data set. [Modes for carrying out the invention]

[0048] The applicant hereby states that in the embodiments and drawings described below, the same reference numerals represent the same or similar components or their structural features. It should be noted that the components and structures in the drawings are not illustrated based on actual proportions and quantities for illustrative purposes, and that features of different embodiments may be interchangeable where applicable. Furthermore, when referring to one component being mounted on another, it means either that the aforementioned component is directly mounted on the other component, or that the aforementioned component is indirectly mounted on the other component, i.e., that one or more other components are further configured between the two components. When a component is "directly" mounted on another component, it means that no other components are configured between the two components.

[0049] As shown in Figures 2 and 3, a first embodiment of the present invention provides a method for operating a probe system 20. The probe system 20 includes a chuck 21, a probe assembly 22, an optical image forming apparatus 23, a control device 24, a display device 25, and an electrically operable positioning assembly 26. The probe system 20 can define two horizontal axis directions (i.e., the X axis and the Y axis) and one vertical axis direction (i.e., the Z axis).

[0050] The chuck 21 includes a chuck support surface 211 along the X and Y axes. The chuck support surface 211 is configured to support a substrate 30 (e.g., a wafer). The substrate 30 includes one or more devices under test 31 (e.g., unpackaged semiconductor devices diced on a wafer), and the devices under test 31 include a plurality of contact pads 311.

[0051] The probe assembly 22 includes a probe 221 having probe tips 222 configured to make mechanical and electrical contact with the contact pads 311 of the device under test 31. This allows testing to be performed on the device under test 31. Depending on the testing needs, the probe 221 may have any appropriate number of probe tips 222. For example, it may include one probe tip 222, two probe tips 222, three probe tips 222, or three or more probe tips 222. A commonly seen two-probe-tip 222 configuration includes a signal probe and a ground probe, and is also called a GS (ground-signal) probe configuration. A commonly seen three-probe-tip 222 configuration includes a signal probe located in the middle and a pair of ground probes located on either side, and is also called a GSG (ground-signal-ground) probe configuration.

[0052] The optical image forming apparatus 23 is configured to receive optical images of at least a portion of the probe system 20. These images include images of at least a portion of the probe assembly 22 (particularly the probe tip 222), and generally also images of at least a portion of the substrate 30 (particularly the contact pads 311 of the device under measurement 31).

[0053] The control device 24 is electrically connected to the optical image generation device 23 and acquires the video received by the optical image generation device 23. The control device 24 is programmed to execute the operation method of the probe system 20 as shown in Figure 2. The control device 24 is also electrically connected to the display device 25. As a result, the display device 25 displays video related to the operation of the probe system 20. Figures 4 to 9 schematically show the images displayed on the display 25 during the operation of the probe system 20 according to this embodiment, and this part will be described later.

[0054] An electrically operable positioning assembly 26 is connected to the probe assembly 22. The electrically operable positioning assembly 26 is also electrically connected to a control device 24. The control device 24 controls the electrically operable positioning assembly 26 according to the test needs and controls the movement of the probe assembly 22 along the X, Y, and Z axes. In this invention, the relative movement of the probe assembly 22 and the device under test 31 is achieved by the electrically operable positioning assembly 26 moving the probe assembly 22, or by another moving device (not shown) moving the chuck 21. Therefore, the probe system 20 of this invention is not limited to a configuration that includes an electrically operable positioning assembly 26 connected to the probe assembly 22.

[0055] The operation method of the probe system 20 in this embodiment is a method for determining the probing parameters used when the probe system performs a test on the device under test, and includes the following steps a) to f).

[0056] Step a): Based on the configuration of the probe 221 of the probe assembly 22 of the probe system 20 and the configuration of the contact pad 311 of the device under test 31, a dataset is defined showing the relationship between the slip distance and the probing stroke. Here, the slip distance is along the X and / or Y axes, and the probing stroke is along the Z axis.

[0057] It is necessary to explain first that, because the relative relationship between the slip distance and the probing stroke differs depending on the probe configuration (e.g., probe thickness, material, shape, etc.) and / or the contact pad configuration (e.g., contact pad material, etc.), a dataset showing the relationship between the slip distance and the probing stroke is required. The dataset showing the relationship between the slip distance and the probing stroke may be pre-built in the control device 24 by the manufacturer of the probe system 20, for example, as shown in the graph in Figure 15, or it may be built in the control device 24 by the user of the probe system 20. These initial setup steps are included in the operation method of the probe system 20 shown in Figure 2, namely steps S1 to S2, and will be explained in detail below.

[0058] As shown in Figures 2 and 4, step S1 defines the contact height on the calibration substrate 41. This contact height is the position on the Z-axis when the probe tip 222 first makes contact with the contact pad 311 of the device under test 31. That is, when at this contact height, the probe tip 222 has just made contact with the contact pad 311 of the device under test 31, and no deflection has occurred due to the probing stroke. In this step, the probe assembly 22 and the calibration substrate 41 are moved relative to each other along the Z-axis until the probe tip 222 is in contact with the calibration substrate 41, and the contact height is found and recorded. This allows the probing stroke value required for subsequent tests to be set.

[0059] As shown in Figure 2, in step S2, a dataset showing the relationship between the sliding distance and the probing stroke is defined on the calibration substrate 41. The calibration substrate 41 includes multiple parallelization patterns (not shown) that represent different types of contact pads. In this step, a test is performed using the probe assembly 22 of the probe system 20 in an area of ​​the calibration substrate 41 that has the same shape as the parallelization pattern of the contact pad 311 of the device under test 31. That is, first, the probe tip 222 is brought into contact with this parallelization pattern on the calibration substrate 41. Then, the probe assembly 22 and the calibration substrate 41 are moved relative to each other by one probing stroke in the Z-axis, causing the probe tip 222 to slide on the calibration substrate 41 and generate one sliding distance. During the aforementioned sliding process, the probe tip 222 is located on the same XY plane as the calibration substrate 41, and the optical image forming apparatus 23 can simultaneously and clearly image the probe tip 222 and the calibration substrate 41, so the sliding distance can be observed by the optical image forming apparatus 23. The user can provide multiple different probing strokes, each measured on the calibration substrate 41. This allows for the determination of the corresponding slip distance for each, and the control device 24 can be used to generate a dataset showing the relationship between slip distance and probing stroke, at least partially, based on the detected slip distance and the corresponding probing stroke. Once this dataset showing the relationship between slip distance and probing stroke is built within the control device 24, when the system tests the contact pad 311 corresponding to this dataset using the probe 221 corresponding to this dataset, the already built dataset showing the relationship between slip distance and probing stroke can be directly used, and furthermore, the measurement parameters required in later steps can be easily and quickly obtained.

[0060] Step b): In step S3 shown in Figure 2, either a sliding distance value or a probing stroke value is provided to the control device 24. The sliding distance value sets the distance that the probe tip 222 of the probe 221 slides along the X or Y axis on the contact pad 311 of the device under test 31 after it has made contact with the contact pad 311 of the device under test 31. The probing stroke value sets the distance that the probe assembly 22 and the device under test 31 move relative to each other again along the Z axis after the probe tip 222 of the probe 221 has made contact with the contact pad 311 of the device under test 31.

[0061] The sliding distance and probing stroke in this invention are the same as the sliding distance SD and probing stroke OD in the prior art (see Figures 1A and 1B). The sliding distance value and probing stroke value are values ​​set for the sliding distance and probing stroke, and are used by the control device 24 to perform related calculations and control.

[0062] Step c): In step S4 shown in Figure 2, the probe target position P3 (see Figure 3) is provided to the control device 24. The probe target position P3 is the position where the probe tip 222 of the probe 221 is intended to stop after sliding over the contact pad 311 of the device under test 31. In this embodiment, this stopping position is the position where the probe assembly 22 intends to perform a test (electrical test) on the device under test 31.

[0063] The user first moves the line of sight of the chuck 21 or the optical image forming apparatus 23 so that the optical image forming apparatus 23 roughly finds the device to be tested 31. Then, the user fine-tunes the line of sight of the optical image forming apparatus 23 on the Z axis and focuses on the contact pad 311, which is the object of test, to obtain a clear image of the contact pad 311. After that, the user defines the probe target position P3 on the image, and the control device 24 receives the numerical value of the probe target position P3 and displays the probe target position P3 on the image. In this embodiment, the probe assembly 22 includes three probe tips 222 and is configured to test the three contact pads 311 of the device to be tested 31. Since the three probe tips 222 are displaced synchronously, in this embodiment, the probe target positions P3 of the three probe tips 222 are displayed together with only a dashed line. Alternatively, as shown in Figure 10, the probe target positions P3 of the three probe tips 222 can also be displayed separately. In this step, the optical image forming apparatus 23 is focused on the contact pad 311, so the image of the probe assembly 22 is relatively blurred. Therefore, in Figure 5, the probe assembly 22 is shown by dashed lines.

[0064] As shown in Figure 6, in this embodiment, the current probe position P4 can be defined (but is not limited to this). The current probe position P4 is the current position of the probe tip 222. The user first moves the line of sight of the probe assembly 22 or the optical image forming apparatus 23 so that the optical image forming apparatus 23 roughly finds the probe tip 222. Then, the user fine-tunes the line of sight of the optical image forming apparatus 23 on the Z axis and focuses on the probe tip 222 to obtain a clear image of the probe tip 222. After that, the user defines the current probe position P4 on the image, and the control device 24 receives the numerical value of the current probe position P4 and displays the current probe position P4 on the image. In this embodiment, the current probe positions P4 of the three probe tips 222 are displayed together with a single dashed line. However, it is also possible to display the current probe positions P4 of the three probe tips 222 separately. During the process of defining the current probe position P4, the optical image forming apparatus 23 is focused on the probe tip 222, so the image of the contact pad 311 is relatively blurred. Therefore, in Figure 6, the contact pad 311 is shown by a dashed line. In the steps of defining the probe target position P3 shown in Figure 5 and defining the current probe position P4 shown in Figure 6, there is no restriction on the order of the steps.

[0065] Step d): Using the control device 24, the other of the slip distance value and probing stroke value is determined based on one of the slip distance value and probing stroke value provided in step b), and a dataset showing the relationship between slip distance and probing stroke defined in step a). In other words, if the user provides the slip distance value to the control device 24, the control device 24 can obtain the probing stroke value based on the dataset showing the relationship between slip distance and probing stroke. Alternatively, if the user provides the probing stroke value to the control device 24, the control device 24 can obtain the slip distance value based on the dataset showing the relationship between slip distance and probing stroke.

[0066] In this step, the control device 24 is used to obtain the probe contact position P5 based on the slip distance value and the probe target position P3 provided in step c) (see Figure 7). The probe contact position P5 is the position where the probe tip 222 is expected to begin contacting the contact pad 311 of the device under test 31, and will be used in the following steps to position the probe assembly 22 relative to the device under test 31.

[0067] In other words, when this step is completed, the control device 24 has acquired the main probing parameters that the probe system 20 needs to perform the test on the device under test 31, namely, the slip distance value, the probing stroke value, the probe target position P3, and the probe contact position P5. For example, this is step S5 shown in Figure 2.

[0068] Step e): In step S6 shown in Figure 2, after obtaining the probe target position P3 and the probe contact position P5, it is confirmed that both the probe contact position P5 and the probe target position P3 are located within the tolerance range corresponding to the contact pad 311 of the device under test 31. As shown in Figure 10, the tolerance range 42 is equal to or smaller than the range of the contact pad 311. The control device 24 can calculate whether the entirety of the probe contact position P5 and the probe target position P3 are located within the tolerance range 42. Alternatively, the probe contact position P5, the probe target position P3, and the tolerance range 42 are displayed in the video for the user to determine. This step is used to ensure that the probe tip 222 reliably contacts the contact pad 311 of the device under test 31 during the probing stroke, and that appropriate probe marks are generated. Thus, test accuracy can be further ensured. However, this step is not required.

[0069] Step f): In step S71 shown in Figure 2, the control device 24 is used to generate a virtual alignment mark 43 that displays the probe contact position P5 (see Figure 7), and the probe tip 222 is used to align with the virtual alignment mark 43 (see Figure 8).

[0070] Depending on the operating method, the virtual alignment mark 43 is selectively displayed. As shown in step S81 in Figure 2, when the operation is performed manually, the virtual alignment mark 43 is displayed on the display device 25 and used by the user to align the probe tip 222 with the virtual alignment mark 43. In this case, even if only the probe tip 222 is clearly displayed and the contact pad 311 of the device under measurement 31 is not clearly displayed, the user can still align the probe tip 222 with the virtual alignment mark 43 and accurately position the probe tip 222 at the probe contact position P5. When the operation is performed automatically, as shown in step S72 in Figure 2, if only the current position of the probe tip 222, i.e., the current probe position P4 mentioned in step c) above, is defined, the probe system 20 automatically moves the probe tip 222 relative to the probe contact position P5, as shown in step S82 in Figure 2. In this case as well, the virtual alignment mark 43 can be displayed on the display device 25 so that the user can understand the current situation. Furthermore, it is not necessary to display the virtual alignment marks 43. Additionally, it is not necessary to perform step f) to generate the virtual alignment marks 43.

[0071] In this embodiment, the same virtual alignment mark 43 is used to indicate the probe contact positions P5 of the three probe tips 222. However, as shown in Figure 10, three virtual alignment marks 43 may be used to indicate the probe contact positions P5 of the three probe tips 222, respectively. There are no restrictions on the shape of the virtual alignment marks; they can be shaped to correspond to the shapes of different probe tips. Alternatively, they can be shaped solely for position identification, as shown in Figure 12, for example.

[0072] After the user positions the probe tip 222 to the probe contact position P5 using the virtual alignment mark 43, or after the control device 24 automatically positions the probe tip 222 to the probe contact position P5, the control device 24 can be used to execute a probing stroke operation program as shown in S91 or S92 in Figure 2. The probing stroke operation program causes the probe assembly 22 and the device under measurement 31 to move relative to the probing stroke value acquired in step b) or step d), deflecting the probe tip 222 and sliding it to the probe target position P3 and stopping, as shown in Figure 9. This ensures that when the probing stroke operation program is completed, the probe tip 222 stops at the required probe target position.

[0073] As shown in Figure 11, the operation method of the probe system according to the second embodiment of the present invention is similar to that of the first embodiment. Similarly, first, a method is performed to determine the probing parameters used when the probe system tests the device under test, and then the probe assembly 22 and the device under test 31 are positioned relative to each other by manual operation. Then, the probing stroke work program is executed. This embodiment has the following differences from the first embodiment.

[0074] As shown in Figures 11 and 12, in this embodiment, the same steps S1 to S3 as in the first embodiment are performed. Then, in step S4, the current probe position P4 is provided to the control device 24. It is also displayed (but not limited to) on the probe current position P4 video.

[0075] The control device 24 can acquire both the slip distance value and the needle probing stroke value based on a dataset showing the relationship between the slip distance and the probing stroke defined in step S2, and the slip distance value or needle stroke value provided in step S3. The control device 24 then calculates the relative target position P6 from the slip distance value and the current probe position P4, and the relative distance between the relative target position P6 and the current probe position P4 becomes the slip distance value. The relative relationship between the relative target position P6 and the current probe position P4 is the same as the relative relationship between the probe target position P3 and the probe contact position P5 described in the first embodiment. Therefore, although the probe contact position P5 is not acquired in this embodiment, if the probe assembly 22 and the relative target position P6 are moved synchronously relative to the device under test 31, and the relative target position P6 is moved relative to the position where the probe tip 222 of the probe assembly 22 is expected to stop after sliding on the contact pad 311 of the device under test 31, for example, a position that coincides with the probe target position P3 described in the first embodiment, then the probe assembly 22 and the device under test 31 can be positioned.

[0076] In other words, in step S5 of this embodiment, the control device 24 acquires the main probing parameters necessary for testing the device under test 31 by the probe system 20, namely the slip distance value, the probing stroke value, the current probe position P4, and the relative target position P6.

[0077] Then, in step S6' shown in Figure 11, the control device 24 generates a virtual alignment mark 43 indicating the relative target position P6. When operated manually, the virtual alignment mark 43 is displayed on the display device 25 and moves relative to the device under test 31 in synchronization with the probe assembly 22 (see Figure 13), allowing the user to move the virtual alignment mark 43 relative to the position of the contact pad 311 of the device under test 31 (see Figure 14). This is step S7 shown in Figure 11. This moves the relative target position P6 relative to the contact pad 311 of the device under test 31. To explain more clearly, the position of the contact pad 311 of the device under test 31 is the position where the user intends the probe tip 222 to stop after sliding over the contact pad 311 of the device under test 31. It is similar to the probe target position P3 described in the first embodiment, but no numerical value is set, and it is a position determined by the user's visual observation during operation. In this specification, this position is also referred to as the probe stopping position determined by the user.

[0078] To further explain, there are two ways in which the relative target position P6 moves relative to the device under measurement 31. The first method is for the user to control the movement of the probe assembly 22 by operating a lever on the machine. The relative target position P6 moves in synchronization with the probe assembly 22. At this time, the virtual alignment mark 43 also moves in synchronization on the display device 25. The user can move the relative target position P6 (i.e., the virtual alignment mark 43) to a desired position by controlling the movement of the probe assembly 22 while observing the movement of the virtual alignment mark 43 on the display device 25. The second method is for the user to drag and move the virtual alignment mark 43 on the display device 25 to a desired position using a mouse or the touch function of a touchscreen. At this time, the probe assembly 22 may move in synchronization, and the relative target position P6 may move in synchronization with the virtual alignment mark 43. Alternatively, the probe assembly 22 may move after the user has determined the stopping position of the virtual alignment mark 43. These methods are all operated by the user and belong to the category of manual operation according to the present invention, and it can be seen that both manual and automatic operation according to the present invention are performed via the control device 24.

[0079] During the aforementioned movement, even if only the image of the contact pad 311 of the device under test 31 is clear and the probe tip 222 is blurry, the user can align the virtual alignment mark 43 to the corresponding position on the contact pad 311 of the device under test 31. That is, the user can align the probe tip 222 of the probe assembly 22 to the position where they intend to slide it over the contact pad 311 of the device under test 31 and then stop it. For example, this is the probe target position P3 described in the first embodiment. This allows the probe tip 222 to be positioned at the appropriate position on the contact pad 311 of the device under test 31, i.e., the probe contact position P5 described above.

[0080] The user positions a virtual alignment mark 43 at the position where the probe tip 222 of the probe assembly 22 is expected to stop after sliding across the contact pad 311 of the device under test 31. This position is, for example, the probe target position P3 described in the first embodiment. Then, as shown in step S8 of Figure 11, the control device 24 is used to execute a probing stroke operation program. The probing stroke operation program causes the probe assembly 22 and the device under test 31 to move relative to each other by the probing stroke value provided in step S3 or acquired in step S5, deflecting the probe tip 222 and causing it to slide and stop at the probe stop position determined by the user. As a result, the probe tip 222 stops at the required position when the probing stroke operation program is completed.

[0081] According to a second embodiment of the present invention, a dataset showing the relationship between slip distance and probing stroke has been constructed. Therefore, when performing a test, the user can obtain the parameters necessary to test the device under test 31 using the probe assembly 22 by providing the slip distance value or probing stroke value and the probe target position P3 or probe current position P4. There is no need to perform time-consuming initial setup for each test, such as the step of finding the appropriate probing stroke using a calibration board, or the step of obtaining the initial contact position by calibrating and measuring multiple probing strokes. Furthermore, by providing accurate parameters, the method of the present invention can ensure that the probe tip 222 of the probe 221 stops at the desired position after sliding on the contact pad 311 of the device under test 31. Thus, the method according to the present invention is convenient and time-saving, allows the probe assembly to exhibit good and consistent test performance, improves test accuracy, and reduces wear on the probe and calibration board, extending their lifespan.

[0082] The control device 24 may include (or be itself) any suitable structure, single device, or multiple devices that are configured, designed, built, and / or programmable for performing the functions described herein. For example, the control device 24 may include one or more of the following: an electronic control device, a dedicated control device, a special-purpose control device, a personal computer, a special-purpose computer, a display device, a logic device, and a storage device.

[0083] Where a computer-readable storage medium exists, it may also be referred to herein as a computer-readable non-temporary storage medium, which contains and / or stores computer-executable instructions, programs and / or program code. These computer-executable instructions can instruct the probe system 20 and / or its control device 24 to execute any appropriate part or subset of any of the methods described above. Examples of such computer-readable non-temporary storage media include CD-ROMs, magnetic disks, hard disks, and flash memory. The storage or storage devices and / or storage mediums used herein have computer-executable instructions and have methods and other methods that are carried out by a computer in accordance with this disclosure and are subject matter that is patentable under 35, Section 101 of the United States Act.

[0084] Therefore, the computer-readable non-temporary recording medium according to the present invention includes a computer-executable instruction. The timing of the execution of this instruction is to instruct the probe system 20 to perform a method for determining the probing parameters used when the probe system performs a test on the device under test, thereby enabling easy, rapid, and accurate acquisition of probing parameters, allowing the probe assembly 22 to exhibit good and consistent test performance, and achieving good test accuracy.

[0085] As described in the second embodiment above, the method for generating a virtual mark image according to the present invention is used to generate a virtual mark image that represents a part of the probe system 20. As part of this method, first, an optical image forming apparatus 23 is used to acquire a current probe system image that is at least a part of the probe system 20 (for example, the image shown in Figure 5). This current probe system image includes an image of at least a part of the probe 221 (for example, the probe tip 222) and / or an image of at least a part of the substrate 30 (for example, the contact pad 311 of the device under measurement 31). Then, a control device 24 is used to generate a virtual mark image based at least partially on the current probe system image, and a display device 25 is used to display the virtual mark image (for example, the image shown in Figure 7). The virtual mark image includes the display of the probe contact position or the display of the probe target position.

[0086] In the first embodiment, the virtual mark image includes a display of the probe contact position, i.e., a virtual alignment mark 43 that displays the probe contact position P5 shown in Figure 7. In the first embodiment, the virtual mark image includes a display of the probe target position, i.e., a virtual alignment mark 43 that displays the relative target position P6 shown in Figure 12. The method for generating the virtual alignment mark 43 includes the step of determining the relative position of the virtual alignment mark 43 with respect to the probe tip 222. For example, the position of the probe tip 222 is obtained using an optical image forming apparatus 23, thereby determining the relative position of the virtual alignment mark 43 with respect to the probe tip 222. The step of generating the virtual mark image modifies the virtual mark image based on at least the determined relative position of the virtual alignment mark 43 with respect to the probe tip 222 so that the virtual mark image includes the virtual alignment mark 43.

[0087] To further explain, in the first embodiment, since the probe target position P3 is provided, the probe tip 222 in the current probe system image is blurred compared to the device under measurement 31. However, the probe target position P3 is defined by a clear image of the device under measurement 31, and the probe contact position P5 is calculated based on this, and the virtual mark image is made to include a virtual alignment mark 43 indicating the probe contact position P5. This allows the user to manually align the probe tip 222 to the virtual alignment mark 43 and accurately position the probe tip 222 to the probe contact position P5, and the current status can also be communicated to the user in the case of automatic positioning. Conversely, in the second embodiment, since the probe current position P4 is provided, the probe tip 222 in the current probe system image is clear compared to the device under measurement 31. The probe current position P4 is defined by a clear image of the probe tip 222, and the relative target position P6 is calculated based on this, and the virtual mark image is made to include a virtual alignment mark 43 indicating the relative target position P6. This allows the user to manually adjust the relative target position P6 to the probe stop position determined by the user, thereby positioning the probe tip 222 at the appropriate probe contact position.

[0088] Finally, it is reiterated that the components disclosed in embodiments of the present invention are for illustrative purposes only and do not limit the scope of the present invention, and substitutions or modifications of other equivalent components should be included within the scope of the claims of the present invention. [Explanation of Symbols]

[0089] 10: Probe 11: Probe tip 12: Contact pads 20: Probe System 21: Chuck 211: Chuck support surface 22: Probe Assembly 221: Probe 222: Probe tip 23: Optical image forming apparatus 24: Control device 25: Display device 26: Electrically operable positioning assembly 30: Circuit board 31: Device under test 311: Contact pad 41: Calibration board 42: Tolerance 43: Virtual alignment marks P1: Initial contact position P2: Final contact position P3: Probe target position P4: Probe current position P5: Probe contact position P6: Relative target position OD: Probing Stroke SD: Slip distance S1, S2, S3, S4, S5, S6, S6', S7, S71, S72, S8, S81, S82, S91, S92: Step

Claims

1. A method for determining probing parameters used when a probe system performs a test on a device under test, The steps include defining a dataset that shows the relationship between slip distance and probing stroke based on the shape of the probe in the probe assembly of the probe system and the shape of the contact pad of the device under test, and A step of providing a control device with one of the slip distance value and the probing stroke value, The aforementioned sliding distance value is defined as the distance the probe tip slides over the contact pad of the device being measured after it has made contact with the contact pad. The probing stroke value is defined as the distance the probe assembly and the device under test move relative to each other again after the probe tip has contacted the contact pad of the device under test, step, A step of providing the control device with one of the probe target position and the probe current position, The probe target position is the position where the probe tip of the probe is expected to stop after sliding over the contact pad of the device being measured. The current position of the probe is the current position of the probe tip, a step and The process includes the steps of: using the control device to determine the other of the slip distance value and the probing stroke value based on a dataset showing the relationship between the slip distance and the probing stroke; and determining a position used for relative positioning of the probe assembly and the device under measurement based on the slip distance value, the probing stroke value, and one of the probe target position and the probe current position. A method characterized by the following:

2. A method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, The probe target position is provided to the control device, The position used for relative positioning of the probe assembly and the device under measurement is the probe contact position. The probe contact position is the position where the tip of the probe is expected to begin contacting the contact pad of the device under measurement, and is used to position the tip of the probe at the probe contact position. A method characterized by the following:

3. A method for determining probing parameters used when the probe system according to claim 2 performs a test on a device under test, The step further includes confirming that both the probe contact position and the probe target position are located within an acceptable range corresponding to the contact pad of the device under measurement. A method characterized by the following:

4. A method for determining probing parameters used when the probe system according to claim 2 performs a test on a device under test, The method further includes a step of using the control device to generate a virtual alignment mark that indicates the probe contact position, and aligning the probe tip of the probe with respect to the virtual alignment mark. A method characterized by the following:

5. A method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, The current position of the probe is provided to the control device. The position used for relative positioning of the probe assembly and the device under measurement is a relative target position. The relative distance between the relative target position and the current probe position is the same as the slip distance value. By moving the relative target position and the probe assembly synchronously relative to the device under test, the relative target position is moved relative to the position corresponding to the contact pad of the device under test, and the probe assembly and the device under test are used to position themselves relative to each other. A method characterized by the following:

6. A method for determining probing parameters used when the probe system according to claim 5 performs a test on a device under test, The steps include: using the control device to generate a virtual alignment mark that displays the relative target position; moving the virtual alignment mark relative to a position corresponding to the contact pad of the device under test; and moving the relative target position to a position corresponding to the contact pad of the device under test. A method characterized by the following:

7. A method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, A dataset showing the relationship between slip distance and probing stroke is constructed using the probe system and calibration substrate, and the method of construction is as follows: The step of bringing the tip of the probe into contact with the calibration substrate, The steps include: moving the probe and the calibration substrate relative to each other by one probing stroke in the vertical axis direction, generating a sliding distance by sliding the tip of the probe on the calibration substrate, and observing the sliding distance using an optical image forming apparatus; and The process includes the step of using the control device to generate a dataset showing the relationship between the sliding distance and the probing stroke, based on the sliding distance and the probing stroke. A method characterized by the following:

8. A method for operating a probe system, The probe system comprises a probe assembly and a control device. The probe assembly includes a probe having a probe tip used to contact the contact pad of the device under test, The operation method of the probe system is as follows: The steps include: using the control device described above to perform a method for determining probing parameters used when the probe system described in claim 2 performs a test on a device under test; The steps include using the control device to position the probe tip of the probe at the probe contact position, The steps include: executing a probing stroke work program using the control device; The probing stroke operation program causes the probe assembly and the device under measurement to move relative to each other by a probing stroke value, so that the probe tip of the probe deflects and slides and stops at the probe target position. A method for operating a probe system characterized by the following features.

9. A method for operating a probe system, The probe system comprises a probe assembly and a control device. The probe assembly includes a probe having a probe tip used to contact the contact pad of the device under test, The operation method of the probe system is as follows: The steps include: using the control device described above to perform a method for determining probing parameters used when the probe system described in claim 5 performs a test on a device under test; Using the control device, the relative target position is moved relative to the position corresponding to the contact pad of the device under measurement. The steps include: executing a probing stroke work program using the control device; The probing stroke operation program causes the probe assembly and the device under test to move relative to each other by a probing stroke value, so that the probe tip of the probe deflects and slides and stops at a position corresponding to the contact pad of the device under test. A method for operating a probe system characterized by the following features.

10. A probe system, A chuck including a chuck support surface configured to support a substrate containing one or more devices to be measured, A probe assembly comprising a probe having a probe tip, wherein the probe is configured to test a device under test, An optical image forming apparatus configured to receive optical images of at least a portion of the probe system, the optical images of at least a portion of the probe assembly being included therein, The probe system according to claim 1 comprises a control device programmed to perform a method for determining probing parameters used when testing a device under test. A probe system characterized by the following features.

11. A non-temporary recording medium that can be read by a computer, Includes instructions that a computer can execute, When the command is executed, the probe system is instructed to perform a method for determining probing parameters used when the probe system according to claim 1 performs a test on the device under test. A recording medium characterized by the following features.

12. A method for testing unpackaged semiconductor devices, The step of providing at least one probe assembly, which includes a probe having a probe tip configured for mechanical and electrical contact with an unpackaged semiconductor device, The steps of providing a control device programmed to perform a method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, and to obtain results, Based on the results, the control device is used to perform a test on the unpackaged semiconductor device using the probe, including the step of performing the test on the unpackaged semiconductor device. A test method characterized by the following features.

13. A tested method for manufacturing a semiconductor device, The step of providing at least one probe assembly, which includes a probe having a probe tip configured for mechanical and electrical contact with an unpackaged semiconductor device, The steps of providing a control device programmed to perform a method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, and to obtain results, Based on the results, the control device is used to perform a test on the unpackaged semiconductor device using the probe, including the step of performing the test on the unpackaged semiconductor device. A manufacturing method characterized by the following features.

14. A tested semiconductor device, A non-packaged semiconductor device comprising multiple contact pads, The aforementioned unpackaged semiconductor device is tested by a single test process. The aforementioned test process is The probe system according to claim 1 performs a method for determining probing parameters used when testing a device under test and obtains the results, The contact pad is made to receive mechanical and electrical contact performed based on the results. A semiconductor device characterized by the following features.

15. A method for generating virtual mark images, used to generate virtual mark images that represent a part of a probe system, The probe system is A substrate having one or more devices to be measured, The system comprises a probe configured for performing tests on the device under measurement, The aforementioned method, A step of using an optical image forming apparatus to acquire a current probe system image which includes an image of at least a part of the probe and an image of at least a part of the substrate, Using a control device, a step of generating a virtual mark image based at least partially on the current probe system image, The step includes displaying the virtual mark image using a display device, The aforementioned virtual mark image includes a display of the probe contact position or a display of the probe target position. The probe contact position is the position where the tip of the probe is expected to begin contacting the contact pad of the device under measurement. The probe target position is the position where the probe tip is expected to stop after sliding over the contact pad of the device being measured. A method for generating products characterized by the following features.

16. A method for generating a virtual mark image according to claim 15, The control device acquires the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and based on a dataset showing the relationship between the slip distance and the probing stroke, and acquires the probe contact position based on the slip distance value and the probe target position. A method for generating products characterized by the following features.

17. A method for generating a virtual mark image according to claim 15, The control device obtains the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and a dataset showing the relationship between the slip distance and the probing stroke. Based on the slip distance value and the current probe position, it obtains the relative target position, where the current probe position is the current position of the probe tip, and the relative distance between the relative target position and the current probe position is equal to the slip distance value. A method for generating products characterized by the following features.

18. A method for generating a virtual mark image according to claim 15, In the current probe system image, the device under measurement is clearer than at least the tip of the probe. The step of generating a virtual mark image includes the step of generating a virtual alignment mark, The virtual alignment marks indicate the probe contact positions. A method for generating products characterized by the following features.

19. A method for generating a virtual mark image according to claim 15, In the current probe system image, at least the tip of the probe is clearer than the device being measured. The step of generating a virtual mark image includes the step of generating a virtual alignment mark, The aforementioned virtual alignment marks display the relative target position. The relative relationship between the aforementioned target position and the current position of the probe tip is equal to the relative relationship between the probe target position and the probe contact position. A method for generating products characterized by the following features.

20. A method for generating a virtual mark image according to claim 18 or 19, The step of generating a virtual alignment mark involves determining the relative position of the virtual alignment mark with respect to the probe tip of the probe, The step of generating a virtual mark image includes modifying the virtual mark image based on the relative position of the virtual alignment mark to the probe tip of the probe, which has been determined, so that the virtual mark image includes the virtual alignment mark. A method for generating products characterized by the following features.

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