Wiring boards and mounting structures

The wiring board design addresses stress and capacitance issues by strategically arranging differential pair conductors with varying land and via-hole configurations, improving electrical reliability through reduced capacitance and noise interference.

JP7875754B2Active Publication Date: 2026-06-18KYOCERA CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
KYOCERA CORP
Filing Date
2022-07-27
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Conventional wiring boards experience increased stress and capacitance between differential pair conductors due to laminated via-hole conductors, leading to potential malfunctions from noise mixing.

⚗Method used

The wiring board design includes a configuration where differential pair conductors are arranged with specific land and via-hole conductors positioned at varying distances and layers, with some conductors extending longer in a direction to reduce overlap and capacitance, and others intersecting or aligning with via-hole conductor directions to minimize stress and noise interference.

🎯Benefits of technology

This configuration effectively reduces capacitance and noise mixing between differential pair conductors, enhancing electrical reliability and reducing the risk of malfunctions.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a wiring board with which an increase in the electrostatic capacitance of differential pair conductors is suppressed, and the possibility of erroneous operation due to the mutual inclusion of noise between the differential pair conductors is reduced.SOLUTION: A wiring board according to the present disclosure includes a laminate unit comprising a plurality of insulating layers that are mutually laminated and have a plurality of via holes, and a plurality of wiring conductors that are arranged on the surface of the insulating layers and in the via holes. The wiring conductors include a first pair conductors and a second pair conductors extending adjacent to each other. The first pair conductors and the second pair conductors include two line conductors, respectively. The line conductors have a plurality of land conductors located on the surface of insulating layers and a plurality of via hole conductors that are located in the via holes and connect to the land conductors. The first pair conductors include a plurality of first via hole conductors, as well as a first land conductor and a second land conductor. The second pair conductors include a plurality of second via hole conductors, as well as a third land conductor and a fourth land conductor. The second and fourth land conductors are located between different layers of the plurality of insulating layers.SELECTED DRAWING: Figure 2
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