Package and light-emitting device for mounting optical elements

Abstract

To provide a package for mounting an optical element and a light emitting device with reduced degradation of optical properties.SOLUTION: A body (10) of a package for mounting an optical element includes an insulating frame (11), a base (12) that is positioned to cover the lower end of the frame (11) and has a higher thermal conductivity than the frame (11), and a protrusion (121) that protrudes from an upper surface (12a) of the base (12) into a recess (10a) surrounded by the frame (11) and the base (12). The frame (11) has a mounting surface on the side of an upper surface (11a) opposite the lower end to which a lid (30) having a light-transmitting flat plate (32) can be joined. The protrusion (121) intersects with the upper surface (12a) and has a mounting surface (121a) on which an edge-emitting optical element (50) can be mounted.SELECTED DRAWING: Figure 2

Description

【Technical Field】 【0001】 The present disclosure relates to a package for mounting an optical element and a light-emitting device. 【Background Art】 【0002】 There is a package that houses a laser light source inside and emits the light emitted by the laser light source. In Patent Document 1, the light emitted by the light source in a direction along the bottom surface of the package is reflected upward by a mirror and then emitted. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 International Publication No. 2020 / 175303 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 However, there is a problem that when the optical path length in the package becomes long due to reflection, the optical characteristics deteriorate. 【0005】 Therefore, a package for mounting an optical element and a light-emitting device with reduced deterioration of optical characteristics are provided. 【Means for Solving the Problems】 【0006】 One aspect of the present disclosure is [1] an insulating frame, a heat conductor that closes the first end of the frame and has a higher thermal conductivity than the frame, and a protruding portion that protrudes from the first surface of the heat conductor with respect to the space surrounded by the frame and the heat conductor, the frame having a first mounting surface to which a lid body having a light-transmitting portion can be joined on the second end side opposite to the first end, the protruding portion intersecting the first surface and having a second mounting surface on which an end-face light-emitting type optical element can be mounted Furthermore, the second mounting surface intersects the first surface at an angle of 45 degrees or more and 90 degrees or less. , a package for mounting an optical element. 2 The device comprises an insulating frame, a heat transfer element positioned to block the first end of the frame and having a higher thermal conductivity than the frame, and a projection extending from the first surface of the heat transfer element into the space enclosed by the frame and the heat transfer element, wherein the frame has a first mounting surface on the second end side opposite to the first end to which a lid having a light-transmitting portion can be joined, and the projection intersects with the first surface and has a second mounting surface on which an end-face light-emitting type optical element can be mounted. ​​Multiple optical elements can be mounted on the second mounting surface, [1 ]of Package for mounting optical elements. [ 3 The frame has wiring conductors that connect the optical element to the outside, [1] or [2] A package for mounting one of the following optical elements. [ 4 The frame has exposed electrodes that are electrically connected to the wiring conductor, and the surface including the electrodes is oriented along the second mounting surface. 3 Package for mounting optical elements. [ 5 When viewed from the side directly facing the second mounting surface, the second mounting surface and the electrode are visible at the same time, and the height of the frame from the first surface on the side opposite to the side with the electrode relative to the protrusion is lower than the height of the protrusion from the first surface. 4 Package for mounting optical elements. [6] A package for mounting an optical element, comprising: an insulating frame; a heat transfer element positioned to close the first end of the frame and having a higher thermal conductivity than the frame; and a projection extending from the first surface of the heat transfer element into the space enclosed by the frame and the heat transfer element, wherein the frame has a first mounting surface to which a lid having a translucent portion can be joined on the second end side opposite to the first end; the projection intersects the first surface and has a second mounting surface on which an end-face emitting optical element can be mounted; the frame has a wiring conductor connecting the optical element to the outside; the frame has an electrode that is electrically connected to the wiring conductor exposed; the surface including the electrode is oriented along the second mounting surface; the second mounting surface and the electrode are visible simultaneously when viewed from the side facing the second mounting surface; and the height of the frame from the first surface on the side opposite to the side with the electrode relative to the projection is lower than the height of the projection from the first surface. [ 7 The heat transfer element is aluminum or copper, or an alloy containing at least one of these. [1]~[ 6 A package for mounting one of the following optical elements. [ 8 The frame is made of ceramic, [1]~[ 7 A package for mounting one of the following optical elements. [ 9 The ceramic is alumina, 8 Package for mounting optical elements. [ 10 [1]~[ The light-emitting portion of the optical element has a light-transmitting portion through which light is transmitted, and the lid is bondable to the first mounting surface. 8 A package for mounting one of the following optical elements. [ 11 The light-transmitting portion has a lens structure, and is a package for mounting the optical element

[10] . [ 12 ][1]~[ 9A package for mounting any of the light elements, a light element mounted on the second mounting surface, and a lid body having a light-transmitting portion through which the light emitted by the light element passes and capable of being joined to the first mounting surface, wherein the light element is mounted on the second mounting surface in a direction of emitting light to the outside of the package for mounting the light element through the light-transmitting portion, a light-emitting device. 【Effect of the Invention】 【0007】 According to the present disclosure, it is possible to reduce a decrease in optical characteristics in the light-emitting device. 【Brief Description of the Drawings】 【0008】 [Figure 1] It is an overall perspective view of the light-emitting device of the first embodiment. [Figure 2] It is a perspective view of the main body and the lid body of the light-emitting device disassembled. [Figure 3] It is a cross-sectional view of the main body. [Figure 4] It is a perspective view and a cross-sectional view showing the main body of the second embodiment. [Figure 5] It is a perspective view showing the light-emitting device of the third embodiment, and an exploded perspective view showing the lid body and the main body of the light-emitting device separated. [Figure 6] It is a perspective view showing the light-emitting devices of the fourth and fifth embodiments. [Figure 7] It是第六实施方式的主体的斜视图和剖视图。 [Figure 8] It is a cross-sectional view showing the main body of the seventh embodiment. [Figure 9] It is a view showing an example in which a plurality of light-emitting devices are arranged on a circuit board. 【Mode for Carrying Out the Invention】 【0009】 Hereinafter, embodiments will be described based on the drawings. [First Embodiment] FIG. 1 is an overall perspective view of a light-emitting device 1 of the first embodiment. FIG. 2 is a perspective view of the main body 10 and the lid body 30 of the light-emitting device 1 disassembled. The light-emitting device 1 comprises a main body 10, a cover 30, and a light element 50, among other things. 【0010】 The main body 10 is the housing of a package for mounting an optical element 50, which houses the optical element 50 inside. The lid 30 seals the optical element 50 inside the main body 10. The lid 30 has a light-transmitting plate 32 on the upper surface of the frame 31, allowing light to be emitted from the optical element 50 inside the main body 10 through the plate 32. The lid 30 may be included in the optical element mounting package, or it may be distributed independently of the optical element mounting package which consists only of the main body 10. 【0011】 The main body 10 comprises a frame 11 and a base 12. The base 12 is located inside the frame 11, closing the lower end (first end) of the frame 11, which is open at the top and bottom. The base 12 is a heat transfer material and has a higher thermal conductivity than the frame 11. For example, the base 12 is a metal member such as copper or aluminum, or an alloy containing at least one of these. Alternatively, the base 12 may be a ceramic material. Furthermore, single-crystalline inorganic materials may be suitably used for the base 12. In addition, the base 12 may be a composite material of inorganic material and metal that provides high thermal conductivity. That is, the presence or absence of electrical conductivity of the base 12 is irrelevant. 【0012】 The frame 11 is insulating. The frame 11 can be made of, for example, alumina, aluminum nitride, silicon nitride, zirconia, or resin. Therefore, when ceramic, especially alumina, is used as the main component of the frame 11, the airtightness of the frame 11 is higher compared to when a material other than ceramic is used. Also, when ceramic is used as the main component of the frame 11, the difference in thermal expansion coefficient with the substrate 12 can be made smaller compared to when a material other than ceramic is used. The frame 11 may have a structure in which multiple layers are stacked. Each layer has via conductors 118 that penetrate the frame 11 in the thickness direction and are connected to each other. 【0013】 The frame 11 has an annular projection 111 extending inward from its inner surface. The projection 111 is integrally structured with the frame 11 and made of the same material. The peripheral edge of the upper surface 12a of the base 12 is joined to the lower side of the projection 111. 【0014】 The recess 10a (space) is located surrounded by the inner surface of the frame 11 and the upper surface 12a (first surface) of the base 12. A projection 121 protrudes from the upper surface 12a of the base 12 relative to the recess 10a. The projection 121 is, for example, rectangular parallelepiped in shape. The height of the projection 121 from the upper surface 12a is greater than the height from the upper surface 12a to the upper end of the frame 11. The projection 121 is integral in structure with the base 12 and made of the same material. The area around the projection 121 is stepped due to the upper surface and the projection 111. 【0015】 One of the protruding portions 121 that intersects with the upper surface 12a, i.e., is perpendicular to it, is the mounting surface 121a (second mounting surface) for the optical element 50. The mounting surface 121a is the surface of the protruding portion 121 facing the center of the recess 10a. One or more optical elements 50 can be bonded and mounted on the mounting surface 121a. For example, three optical elements 50 are located on the mounting surface 121a. The optical element 50 is an end-emitting type laser diode (LD). The optical element 50 is in contact with the protruding portion 121 along its long side. As a result, when the optical element 50 is in operation, it emits light outward through the cover 30, and the heat generated is quickly transferred to the substrate 12 via the heat transfer material, the protruding portion 121. 【0016】 Here, the optical element 50 is positioned to emit light perpendicularly upward (opposite to the upper surface 12a), but it is not limited to this. The optical element 50 may emit light at a slightly oblique angle to the upper surface 12a. 【0017】 Three optical elements 50 are connected in series, with both ends connected to electrodes 115a and 115b. Bonding wires connect the optical elements 50 to each other and to electrodes 115a and 115b. For example, four sets of bonding wires are connected in parallel between electrode 115a, optical elements 50, and electrode 115b. By being connected by multiple sets of bonding wires, even if one set is broken, the optical elements 50 can still emit light using the bonding wires of the other sets. 【0018】 The electrodes 115a and 115b are exposed on the side surface of the support base 112, which is located on the projection 111. The support base 112 is located between the side of the projection 121 opposite to the mounting surface 121a and the inner surface of the frame 11. The support base 112 may be a separate entity from the frame 11. That is, the support base 112 is joined to the frame 11. The joining can be done with sintering paste or the like. The support base 112 has internal wiring structures connected to the electrodes 115a and 115b, respectively. The parts of the support base 112 other than the wiring structures are made of insulating material and may be, for example, the same as the frame 11. 【0019】 At this time, electrodes 115a and 115b are positioned so that they can be seen simultaneously with the mounting surface 121a and the optical element 50 in a plan view from the side directly facing the mounting surface 121a. In particular, it is preferable that the surface including electrodes 115a and 115b is oriented in a direction along the mounting surface 121a. "In a direction along the surface" means that they are parallel to each other or within a range slightly deviated from the parallel direction. Specifically, the angle between the two surfaces is ±30 degrees or less, more preferably ±20 degrees or less, and even more preferably ±10 degrees or less. The wiring structure is connected to the wiring structure of the frame 11 as described later, and is electrically connected to the external electrodes located on the lower surface of the frame 11. 【0020】 The upper surface 11a (second end) of the frame 11 is a first mounting surface to which the lid 30 can be joined. The separate body 10 and lid 30 are joined after the optical element 50 is mounted on the mounting surface 121a and the optical element 50 and electrodes 115a and 115b are connected by bonding wire W. This seals the recess 10a containing the optical element 50. At this time, the recess 10a may be filled with dry air or an inert gas. 【0021】 As described above, the lid 30 has a frame 31 and a flat plate 32. The frame 31 may be made of the same material as the frame 11 of the main body 10, i.e., alumina. The outer circumferential shape of the frame 31 is the same as the outer circumferential shape of the frame 11. The inner circumferential shape of the frame 31 does not have to be the same as the inner circumferential shape of the frame 11. The height of the frame 31 is determined so that when the recess 10a is sealed by the lid 30, the widths of the upper surface of the protrusion 121 and the light-emitting end of the optical element 50 do not come into contact with the lower surface of the flat plate 32. As a result, the light emitted by the optical element 50 has an optical path length corresponding to the thickness of the lid 30. A short optical path length, especially an optical path length inside the recess 10a, suppresses the diffusion of the emitted light. Accordingly, compared to the case where there is no protrusion 121 and the optical path length inside the recess 10a of light emitted from near the upper surface 12a is longer than the optical path length of this embodiment, interference between each emitted light becomes less likely. Therefore, the spacing between the multiple optical elements 50 mounted on the mounting surface 121a can be narrowed. Depending on the spacing between the optical elements 50, the planar size of the optical element mounting package can also be reduced. 【0022】 The flat plate 32 is an airtight, light-transmitting member (light-transmitting portion), and is, for example, borosilicate glass or sapphire glass. The surface of the flat plate 32 may be coated with an anti-reflective coating (AR coating). The flat plate 32 is joined to the frame 31 using, for example, frit glass. 【0023】 The main body 10 and the lid 30 can be joined via a joining member 40. For example, the joining member 40 can be made of tin. For example, an annular preform narrower than each frame 11, 31 can be used as a sealing ring. 【0024】 Alternatively, frit glass or the like may be used for joining. In this case, a material with a lower melting point than the frit glass of the lid 30 is used so that the joint surface between the frame 31 and the flat plate 32 of the lid 30 does not remelt during joining. Low-melting-point frit glass may contain, for example, a mixture of metals such as terylium, bismuth, and vanadium. 【0025】 Figure 3 is a cross-sectional view of the main body 10 along section line AA. In this cross-sectional view including electrode 115a, a wiring member is connected between electrode 115a and the external connection electrode 117 located on the bottom surface of frame 11. 【0026】 Specifically, multiple via conductors 118 overlap within the frame 11 and are connected to a connecting wire 119 located on the upper surface of the projection 111. The electrode 115a is connected to a wiring member 116 (wiring conductor) that extends inside the support base 112. The wiring member 116 is exposed from the lower end of the support base 112 and is connected to the connecting wire 119. In other words, the wiring conductor, including the wiring member 116, the external connecting electrode 117, the via conductors 118, and the connecting wire 119, connects the optical element 50, which is connected to the electrode 115a by a bonding wire W, to the outside. 【0027】 Thus, the heat dissipation path from the optical element 50 is mainly the substrate 12, while the electrical path to the optical element 50 is the frame 11. In other words, the heat dissipation path and the electrical path are separated. As a result, the electrical path is less likely to experience large temperature changes, and consequently, changes in the resistance value of the electrical path are suppressed. On the other hand, as mentioned above, the heat dissipation path is wide and has a remarkably high thermal conductivity. Therefore, heat is quickly dissipated from the optical element 50. 【0028】 [Second Embodiment] Figure 4 shows a perspective view (Figure 4(a)) of the main body 101 of the second embodiment and a cross-sectional view (Figure 4(b)) along the cross-sectional line AA. The main body 101 does not have a support base 112. Instead of electrodes 115a and 115b, the main body 101 has independent, upright electrode columns (pillars 115c and 115d). The contact portions of the pillars 115c and 115d with the projections 111 may be thickened for stability. The shape of the pillars 115c and 115d is arbitrary. However, the fact that the joint portion of the bonding wire W is partially flat and approximately parallel to the mounting surface 121a makes the wire bonding work easier. 【0029】 The pillars 115c and 115d can be fixed in place while being electrically connected to the connecting wiring 119 using a brazing material such as silver solder. 【0030】 [Third Embodiment] Figure 5 shows a perspective view (Figure 5(a)) of the light-emitting device 1b of the third embodiment, and an exploded perspective view (Figure 5(b)) showing the lid 302 and body 102 of the light-emitting device 1b separated. 【0031】 This light-emitting device 1b has a housing 312 with a cap-shaped lid 302 and a flat plate 322 that seals an opening on the upper surface of the housing 312. The flat plate 322 may be joined to the outside of the opening as shown in the figure, or to the inside of the opening. Alternatively, the flat plate 322 may be fitted along the edge of the opening. The size of the opening should be within a range that allows the light emitted from the optical element 50 to be emitted without obstruction. Such a three-dimensional housing 312 may be obtained, for example, by forming a metal member by drawing. 【0032】 The main body 102 is identical to the main body 10 of the first embodiment, except that an annular metal frame material 13 is located on the upper end surface of the frame body 11. The same components are denoted by the same reference numerals and detailed descriptions are omitted. The metal frame material 13 is, for example, a low-resistance material, such as Kovar (registered trademark). In a plan view, the metal frame material 13 overlaps with the position where the lower end of the housing 312 contacts the main body 102, that is, the lower end of the housing 312 and the metal frame material 13 are joined. Since both the housing 312 and the metal frame material 13 are low-resistance metals, they may be joined by seam welding. 【0033】 [Fourth and fifth embodiments] Figure 6 is a perspective view showing the light-emitting devices 1c and 1d of the fourth and fifth embodiments. Note that the configuration within the recess 10a of the light-emitting device 1c is omitted here. In the fourth embodiment, the light-emitting device 1c shown in Figure 6(a) has a lens structure 33 located on the flat plate 32 of the lid 30 in the light-emitting device 1 of the first embodiment. In the fifth embodiment, the light-emitting device 1d shown in Figure 6(b) has a lens structure 33d located on the upper part of the flat plate 322 of the lid 302 in the light-emitting device 1b of the third embodiment. 【0034】 The lens structures 33 and 33d have a collimating lens structure that reduces the diffusion of light emitted from the optical element 50 and further makes it parallel or focused. The lens structure 33 is a separate component joined to the flat plate 32 (transparent portion), but it may also be integrally constructed with the flat plate 32. The lens structure 33d is integrally constructed with the flat plate 322, but a separate component may be joined to the flat plate 322. The focusing ratio of the lens structures 33 and 33d may differ in one axis direction and in an axis direction perpendicular thereto. Here, the lens structures 33 and 33d mainly focus the emitted light in the direction of the long side of the light-emitting devices 1c and 1d, but are not limited to this. 【0035】 [Sixth Embodiment] Figure 7 is a perspective view and a cross-sectional view showing the main body 103 of the sixth embodiment. Figure 7(b) is a cross-sectional view along the cross-sectional line BB in Figure 7(a). Figure 7(b) also shows a cross-section of the circuit board 7 to which the light-emitting device 1 is attached. As shown in Figure 7(a), one end of the optical element 50 is directly electrically connected to the protrusion 121 without the need for a bonding wire. As described above, the substrate 12 including the protrusion 121 may be made of an electrically conductive material such as copper. 【0036】 As shown in Figure 7(b), an external electrode 124 may be located on the lower surface of the substrate 12. The external electrode 124 can be connected to a conductive layer 71 such as an electrode pad or ground surface of the circuit board 7. The conductive layer 71 is, for example, copper. The circuit board 7 may be, for example, a metal core printed circuit board (MCPCB). The conductive layer 71 of the MCPCB has protrusions that contact the lower surface of the substrate 12. A plating layer as an anti-oxidation film may be located on the upper surface of these protrusions. The plating is, for example, Ni plating or Au plating. The conductive layer 71 of the MCPCB is separated vertically by an insulator 72. The insulator 72 is, for example, an organic adhesive containing an insulating filler with high thermal conductivity. Therefore, heat can pass through the insulator 72 and flow further downward. The lower conductive layer 71 acts as a heat sink. On the other hand, current along the conductive layer 71 flows only in the conductive layer 71 on the upper side of the circuit board 7. In other words, the upper conductor layer 71 is a wiring layer. The pattern edges of the wiring may be covered with solder resist. The wiring conductors on the circuit board 7 that connect to the external connection electrode 117 outside the cross-section in Figure 7(b) are separated from the conductor layer 71 by an insulator 73. 【0037】 As in the main body 103 of this sixth embodiment, the heat dissipation path from the light-emitting device 1 and one of the electrical paths may be partially common. 【0038】 [Seventh Embodiment] Figure 8 is a cross-sectional view showing the main body 104 of the seventh embodiment. This cross-section is identical to the cross-sectional line AA in Figure 2. 【0039】 The main body 104 is similar to the main body 10 of the first embodiment in that the base 12 has a protrusion 1211 instead of the protrusion 121. The other configurations and structures are the same. The protrusion 1211 is such that the mounting surface 121a of the optical element 50 is inclined with respect to the upper surface 12a. The inclination angle should be within a range that does not significantly extend the optical path from the optical element 50 to the outside of the cover 30, for example, 45 degrees or more and 90 degrees or less. The inclination angle here may be the smaller of two angles that the mounting surface 121a makes with respect to the upper surface 12a. 【0040】 Figure 9 shows an example in which multiple light-emitting devices 1c are arranged on a circuit board 7. As described above, since the light-emitting device 1c itself can be made smaller than conventional devices, the size of the circuit board 7 can be made smaller in relation to the total required amount of light, i.e., the number of light-emitting devices 1c. In addition, multiple light-emitting devices 1c can be densely arranged on the circuit board 7. 【0041】 As described above, the main body 10 of the optical element mounting package of this embodiment comprises an insulating frame 11, a base 12 positioned to cover the lower end of the frame 11 and having a higher thermal conductivity than the frame 11, and a protruding portion 121 that protrudes from the upper surface 12a of the base 12 into a recess 10a surrounded by the frame 11 and the base 12. The frame 11 has an upper surface 11a on the upper end side opposite its lower end to which a lid 30 having a light-transmitting portion can be joined. The protruding portion 121 intersects with the upper surface 12a and has a mounting surface 121a on which an end-face light-emitting optical element 50 can be mounted. Thus, the main body 10 of the optical element mounting package can mount an end-face emitting optical element 50, which has higher luminous efficiency and light intensity compared to top-face emitting types, so that it faces directly towards the lid 30. As a result, the diffusion of the emitted light immediately after it is emitted out of the package is not advanced. Therefore, compared to the case where the light emitted by the optical element 50 is reflected towards the lid 30 by a mirror surface and emitted to the outside, the deterioration of the light emission characteristics of the light-emitting device 1 using this optical element mounting package is suppressed. In particular, interference between the emitted light from multiple light-emitting devices 1 is reduced, so multiple optical element mounting packages can be placed closer together than before. Also, since the optical element 50 in this orientation is positioned in contact with the mounting surface 121a, which is the side surface of the protrusion 121, the optical element 50 is stably supported. Furthermore, because the protrusion 121 increases the contact area between the optical element 50 and the mounting surface 121a, the main body 10 can quickly dissipate the heat emitted by the optical element 50 to the protrusion 121. Therefore, the main unit 10 can reduce deterioration and failure of the optical element 50 due to overheating. 【0042】 Furthermore, the protrusion 121 is integrally structured with at least a part of the base body 12, and this integral structured portion penetrates the upper and lower surfaces of the base body 12. As a result, the main body 10 of the optical element mounting package can quickly dissipate the heat generated by the optical element 50 from the lower surface of the base body 12 through the base body 12 including the protrusion 121. 【0043】 Furthermore, the mounting surface 121a may intersect the upper surface 12a at an angle of 45 to 90 degrees. In other words, the optical element 50 is not limited to emitting light in the direction normal to the upper surface 12a, i.e., directly upwards. This allows the main body 10 to emit light in a flexible direction depending on the application. On the other hand, by not making the inclination angle too small, the optical path length through which the light emitted from the end face of the optical element 50 passes through the cover 30 is kept within a range that is not excessively long. Therefore, this main body 10 suppresses a decrease in the light emission characteristics of the light-emitting device 1. 【0044】 Furthermore, multiple optical elements 50 may be mounted on the mounting surface 121a. A short optical path length allows the emitted light from the optical elements 50 to pass through the cover 30, preventing excessive diffusion of the emitted light and avoiding interference between them. Therefore, the spacing between the mounting positions of the optical elements 50 in this main body 10 can be reduced compared to conventional designs. In other words, the main body 10 can be miniaturized relative to the number of optical elements 50 that can be mounted. 【0045】 Furthermore, the frame 11 has a wiring member 116, an external connection electrode 117, a via conductor 118, and a connecting wire 119 as wiring conductors connecting the optical element 50 to the outside. In other words, electrical signals and supplied power are supplied from the outside through the frame 11. Therefore, the heat flow and path mainly transmitted through the base body 12 including the protrusion 121 are separated, and electrical signals are less likely to be directly affected by heat. 【0046】 Furthermore, the frame 11 has exposed electrodes 115a and 115b that are electrically connected to the wiring conductor. The surface containing electrodes 115a and 115b is oriented along the mounting surface 121a. In this way, the electrodes 115a and 115b connected by the bonding wire W and the terminals of the optical element 50 on the mounting surface 121a are oriented in approximately the same direction, so that the capillary only needs to move in two dimensions during wire bonding. Therefore, wire bonding becomes easier, and labor and costs are reduced. 【0047】 In particular, when viewed from the side directly facing the mounting surface 121a, the mounting surface 121a and the electrodes 115a and 115b are visible simultaneously, and the height of the upper surface 11a of the frame 11 on the side opposite to the side with electrodes 115a and 115b relative to the protrusion 121 from the upper surface 12a is lower than the height of the protrusion 121 from the upper surface 12a. As a result, the movement of the capillary body 10 from outside to inside during wire bonding can be limited to two-dimensional movement. Therefore, this body 10 can be obtained at a lower cost through easier wire bonding. 【0048】 Furthermore, the base material 12 may be aluminum, copper, or an alloy containing at least one of these. In other words, the base material 12 is preferably one that has high thermal conductivity and low cost. This allows the main body 10 to quickly dissipate the heat generated by the optical element 50 to the outside. 【0049】 Furthermore, the frame 11 is preferably made of ceramic. The frame 11 is preferably an insulator and made of a highly airtight material. Therefore, high airtightness can be obtained by making the frame 11 of ceramic. 【0050】 Furthermore, the ceramic may also be alumina. The substrate 12, which has high thermal conductivity, often also has a high coefficient of thermal expansion. If the difference in thermal expansion coefficient between the substrate 12 and the frame 11 is large, significant strain is likely to occur between the frame 11 and the substrate 12, accelerating the deterioration of the main body 10. Therefore, by using alumina, which has a relatively high coefficient of thermal expansion among inexpensive ceramics, for the frame 11, the deterioration of the main body 10 can be reduced. 【0051】 Furthermore, the optical element mounting package may have a flat plate 32 which is a light-transmitting portion through which the light emitted by the optical element 50 passes, and may also have a lid 30 that can be bonded to the upper surface 11a. By distributing the main body 10 and the lid 30 as a set for the optical element mounting package, the optical element 50 can be sealed with a suitable combination of lids 30 after it has been mounted on the main body 10. 【0052】 Furthermore, the lens structure may be located on the flat plate 32, or a light-transmitting member having a lens structure may be used instead of the flat plate 32. By having a lens structure that converts the emitted light of the optical element mounting package into parallel light from the outset, the selection, acquisition, and optical axis adjustment of a public lens for the emitted light become unnecessary. Therefore, this optical element mounting package improves user convenience. 【0053】 Furthermore, the light-emitting device 1 of this embodiment comprises a main body 10 as a package for mounting the optical element, an optical element 50 mounted on the mounting surface 121a, and a lid 30 that can be joined to the upper surface 11a and has a flat plate 32 through which the light emitted by the optical element 50 passes. The optical element 50 is mounted on the mounting surface 121a in a direction that emits light to the outside of the optical element mounting package via the flat plate 32. Thus, the light-emitting device 1 of this embodiment can emit light directly upwards from the end-face emitting optical element 50. Therefore, the optical path length from the light emitted by the optical element 50 to the outside of the cover 30 can be shortened. As a result, the degradation of the optical properties of the light-emitting device 1 is suppressed. 【0054】 The above embodiments are illustrative examples, and various modifications are possible. For example, the protrusion 121 does not necessarily have to be an integral structure with the base body 12. If they are separate, they can be joined together with a brazing material, solder, sintering material, or the like, which have high thermal conductivity. In this case, the protrusion 121 does not have to rest on the base body 12. It may be partially embedded in a hole located on the upper surface 12a of the base body 12. This hole may penetrate the base body 12. 【0055】 In this case, the protrusion 121 may be made of a different material than the base body 12. Even in this case, it is more preferable that heat is transferred between the protrusion 121 and the base body 12 with high thermal conductivity. 【0056】 Furthermore, the positions and shapes of electrodes 115a, 115b and pillars 115c, 115d were determined above considering two-dimensional wire bonding. However, if we are not limited to two-dimensional wire bonding, the positions and shapes of electrodes 115a, 115b and pillars 115c, 115d are not limited to those described above. 【0057】 Furthermore, although the above description assumes that four bonding wires W are connected in parallel, this is not the only option. Other numbers of wires may be used. Alternatively, a strip-shaped (ribbon-shaped) conductor may be bonded instead of wires to connect the electrodes and terminals. 【0058】 Furthermore, although the sixth embodiment was described as having only one signal path passing through the conductive substrate 12, it is not limited to this. Two signal paths may pass through the insulating substrate 12, no bonding wires W may be used at all, and the frame 11 may not have any wiring paths. In this case, conversely, the frame 11 may be made of an electrically conductive material. 【0059】 In addition, castellations, side electrodes, etc., may be used instead of or in addition to the via conductor 118. 【0060】 In addition, the shapes of the mounting surface 121a of the protruding portion 121 and the surfaces of the support base 112 other than the electrodes 115a and 115b are not limited to those shown in the above embodiments. They may have other shapes. 【0061】 In addition, among the plurality of optical elements 50 mounted on a certain optical element mounting package, those emitting light of different wavelengths from each other may be included. For example, an LD emitting red light and an LD emitting blue light may be mounted on the same optical element mounting package. 【0062】 In addition, in the optical element mounting packages of the third and fifth embodiments, although the flat plate 322 in the lid body 30 is located at approximately the center of the housing 312, it is not limited thereto. It may be at a deviated position according to the mounting position of the optical element 50. In addition, specific details such as the configurations, structures, positional relationships, and materials shown in the above embodiments can be appropriately changed within the scope not departing from the gist of the present disclosure. The scope of the present invention includes the scope of the invention described in the claims and its equivalent scope. 【Description of Reference Numerals】 【0063】 1, 1b to 1d Light emitting device 10, 101 to 104 Main body 10a Recess 11 Frame body 11a Upper surface 111 Protruding portion 112 Support base 115a, 115b Electrodes 115c, 115d Pillars 116 Wiring member 117 External connection electrode 118 Via conductor 119 Connection wiring 12 Substrate 12a Upper surface 121, 1211 Protruding portion 121a Mounting surface 124 External electrode 13 Metal frame material 30, 302 Lid body 31 Frame body 312 cabinets 32, 322 flat plate 33x33d lens structure 40 Joining members 50 optical elements 7 Circuit board 71 Conductor layer 72, 73 Insulators W bonding wire

Claims

[Claim 1] An insulating frame, A heat transfer element is positioned to block the first end of the frame and has a higher thermal conductivity than the frame, A protruding portion that extends from the first surface of the heat transfer body into the space enclosed by the frame and the heat transfer body, Equipped with, The frame has a first mounting surface on the second end side opposite to the first end to which a lid having a light-transmitting portion can be attached, The aforementioned protrusion intersects with the first surface and has a second mounting surface on which an end-face light-emitting optical element can be mounted. The second mounting surface intersects the first surface at an angle of 45 degrees or more and 90 degrees or less. Package for mounting optical elements. [Claim 2] An insulating frame, A heat transfer element is positioned to block the first end of the frame and has a higher thermal conductivity than the frame, A protruding portion that extends from the first surface of the heat transfer body into the space enclosed by the frame and the heat transfer body, Equipped with, The frame has a first mounting surface on the second end side opposite to the first end to which a lid having a light-transmitting portion can be attached, The aforementioned protrusion intersects with the first surface and has a second mounting surface on which an end-face light-emitting optical element can be mounted. Multiple optical elements can be mounted on the second mounting surface. Package for mounting optical elements. [Claim 3] The optical element mounting package according to claim 1, wherein the frame has a wiring conductor that connects the optical element to the outside. [Claim 4] The frame has exposed electrodes that are electrically connected to the wiring conductor. The optical element mounting package according to claim 3, wherein the surface including the electrode is oriented along the second mounting surface. [Claim 5] When viewed from the side directly facing the second mounting surface, the second mounting surface and the electrode are visible simultaneously, and the height of the frame from the first surface on the side opposite to the electrode with respect to the protrusion is lower than the height of the protrusion from the first surface. Package for mounting optical element according to claim 4. [Claim 6] An insulating frame, A heat transfer element is positioned to block the first end of the frame and has a higher thermal conductivity than the frame, A protruding portion that extends from the first surface of the heat transfer body into the space enclosed by the frame and the heat transfer body, Equipped with, The frame has a first mounting surface on the second end side opposite to the first end to which a lid having a light-transmitting portion can be attached, The aforementioned protrusion intersects with the first surface and has a second mounting surface on which an end-face light-emitting optical element can be mounted. The frame has wiring conductors that connect the optical element to the outside, The frame has exposed electrodes that are electrically connected to the wiring conductor. The surface including the electrode is oriented in a direction along the second mounting surface. When viewed from the side directly facing the second mounting surface, the second mounting surface and the electrode are visible simultaneously, and the height of the frame from the first surface on the side opposite to the electrode with respect to the protrusion is lower than the height of the protrusion from the first surface. Package for mounting optical elements. [Claim 7] The optical device mounting package according to claim 1, wherein the heat transfer element is aluminum, copper, or an alloy containing at least one of these. [Claim 8] The optical element mounting package according to claim 1, wherein the frame is made of ceramic. [Claim 9] The optical element mounting package according to claim 8, wherein the ceramic is alumina. [Claim 10] The optical element mounting package according to claim 1, comprising a light-transmitting portion through which light emitted by the optical element is transmitted, and a lid that can be bonded to the first mounting surface. [Claim 11] The package for mounting an optical element according to claim 10, wherein the light-transmitting portion has a lens structure. [Claim 12] A package for mounting an optical element according to any one of claims 1 to 9, The optical element mounted on the second mounting surface, A cover having a light-transmitting portion through which the light emitted by the optical element passes, and which can be bonded to the first mounting surface, Equipped with, The optical element is mounted on the second mounting surface in a manner that emits light to the outside of the optical element mounting package through the light-transmitting portion. Light-emitting device.

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