Cooling system and cooling method for electronic equipment

Abstract

[Problem] To provide a simple and efficient cooling system and cooling method with improved cooling performance for electronic equipment. [Solution] This cooling system includes a cooling intermediary complex 100. The cooling intermediary complex 100 includes: a non-conductive bag 11 for wrapping a piece of electronic equipment that includes a substrate and a heat-generating element 33 mounted on the substrate; a heatsink 21; and a joining layer 23 that joins the surface of the heatsink 21 and the inner surface of the non-conductive bag 11. The joining layer 23 is formed from a dissimilar materials joining film. A first opening 25 is formed in the dissimilar materials joining film and a second opening is formed in the non-conductive bag. The first and second openings provide a window for allowing a fin area 211 of the heatsink to exit the non-conductive bag 11, and a back surface 21B of the heatsink, which is inside the non-conductive bag 11, provides a connecting surface that is thermally connected to one side of the heat-generating element 33.

Description

Technical Field

[0001] The present invention relates to a cooling system and a cooling method for electronic devices, and particularly to a cooling system and a cooling method for efficiently cooling electronic devices that require high-performance operation, stable operation, or low-power consumption operation, and have a large amount of heat generation from themselves, such as supercomputers, data centers, artificial intelligence processing systems, quantum computing systems, cryptographic processing systems, blockchain processing systems, etc.

Background Art

[0002] One of the biggest challenges in determining the performance limits of recent computer-related devices is power consumption. In particular, the importance of research on power saving in representative supercomputers has already been widely recognized. That is, the speed performance (Flops / W) per power consumption has become one of the indicators for evaluating supercomputers. Also, in data centers, it is said that more than 30% of the total power consumption of the data center is spent on cooling, and the demand for reducing power consumption by improving cooling efficiency is increasing. In addition, due to recent global warming and the intense heat and sweltering heat caused by abnormal weather, a situation has occurred where the data center cannot be cooled in summer with the existing cooling methods, and it has become an urgent task to improve the cooling capacity of the existing system itself. Furthermore, with the rapid growth of artificial intelligence processing, the increasing need for encryption processing, the rapid increase in virtual currency mining processing, which is a major case of blockchain processing, and the development of the metaverse, which is expected to grow rapidly, a geometric increase in the processing capacity of data centers and computer systems is essential in all of them, and the demand for enhancing cooling capacity has become extremely large.

[0003] Air cooling and liquid cooling have traditionally been used to cool supercomputers and data centers. Liquid cooling is generally considered to have better cooling efficiency because it uses a liquid with significantly superior heat transfer performance than air. For example, "TSUBAME-KFC," built by Tokyo Institute of Technology, achieved 4.50 GFlops / W using a liquid immersion cooling system with synthetic oil, and was ranked first in the "Supercomputer Green500 List" announced in November 2013 and June 2014. However, because synthetic oil with high viscosity that forms an oil film is used as the coolant, it is difficult to completely remove the oil adhering to electronic equipment after it has been removed from the oil immersion rack, making maintenance of the electronic equipment (specifically, adjustment, inspection, repair, replacement, and expansion; the same applies below) extremely difficult. Furthermore, there have been reports of problems occurring where the synthetic oil used corrodes electronic circuit boards and gaskets that make up the cooling system in a short period of time, causing failures, or leaking refrigerant, thus hindering operation.

[0004] On the other hand, immersion cooling systems using fluorocarbon-based coolants have been proposed, instead of synthetic oils or mineral oils that cause the problems described above. Specifically, these systems use fluorocarbon-based coolants (hydrofluoroether (HFE) compounds known by 3M's trade names "Novec (a trademark of 3M; hereinafter the same) 7100," "Novec 7200," and "Novec 7300") (see, for example, Patent Documents 1 and 2).

[0005] In addition to these, since 2014, the inventors have been developing a new immersion cooling system and a series of related technologies that directly cool electronic equipment by circulating a low-evaporation cooling liquid, mainly composed of fully fluorinated materials, within the open space of a cooling tank (for example, Patent Document 3).

[0006] However, PFAS (Perfluoroalkyl Substances and Polyfluoroalkyl Substances), including all of these fluorocarbon-based coolants, have long been criticized for their adverse effects on human health, crops, and the natural environment. In December 2022, the world's largest manufacturer announced that it would completely cease production by the end of 2025, and in Europe, both production and use are expected to be banned by law within a few years. Therefore, there is a need for a new immersion cooling method that does not use any harmful compounds such as PFAS as a refrigerant, has superior cooling capacity compared to immersion cooling methods that use PFAS as a refrigerant, and is also cheaper and can be widely used worldwide.

[0007] A prime example of a cooling method that does not use any harmful compounds such as PFAS as a refrigerant is one that can use ordinary water (tap water or industrial water) rather than pure water. Specifically, this method involves installing a "water-cooling block" that contains a water flow path within a copper or aluminum block, instead of a heat sink that is attached in direct contact with the top surface of the CPU (Central Processing Unit), which is the main heat source in computer equipment (for example, Patent Document 4).

[0008] Furthermore, as another cooling method that utilizes water, a method has been proposed in which semiconductor chips mounted on a circuit board are placed in a flexible bag, the bag is immersed in a container filled with water as a cooling liquid, and the bag is contracted and deformed by the pressure difference between the inside and outside of the bag when the water is filled around the bag or when the pressure inside the bag is reduced, thereby making the bag adhere tightly to the semiconductor device (for example, Patent Document 5).

[0009] Furthermore, as another cooling method that utilizes water, natural water-cooled computers have been proposed, which use river, lake, seawater, or tap water as a cooling source to directly cool the computer. Specifically, this is a cooling method in which a computer with a parylene resin coating on its circuit board surface is immersed in water (for example, Non-Patent Document 1).

[0010] Furthermore, a method has been proposed in which the entire substrate is completely covered with an ultra-nano hydrophobic coating thin film using silicon compound nanoparticles to create an electronic device with excellent waterproof and moisture-resistant properties, and then cooled by immersing it in water (for example, Patent Document 6). [Prior art documents] [Patent Documents]

[0011] [Patent Document 1] Japanese Patent Publication No. 2013-187251 [Patent Document 2] Special Publication No. 2012-527109 [Patent Document 3] Patent No. 5853072 [Patent Document 4] Japanese Patent Publication No. 2016-119345 [Patent Document 5] Patent No. 2804640 [Patent Document 6] U.S. Patent No. 10717881 [Non-Patent Document 1] Ikki Fujiwara et al., Information Processing Society of Japan Research Report, High-Performance Computing (HPC), "A First Step Towards a Directly Natural Water-Cooled Computer," 2017-HPC-158(5), pp.1-5 (March 1, 2017). URL: http: / / research.nii.ac.jp / ~koibuchi / pdf / ikki-sighpc158.pdf [Overview of the project] [Problems that the invention aims to solve]

[0012] The cooling system disclosed in Patent Document 4 uses water as a refrigerant, unlike the systems used in Patent Documents 1-3 which use harmful substances such as PFAS. It provides a water flow path within a water-cooling block mounted on the surface of semiconductor elements in electronic devices, cooling the water-cooling block first, and then only the semiconductor elements in direct contact with the water-cooling block. Therefore, other electronic components and circuit boards that do not directly contact the water-cooling block, while not primary components, generate a significant amount of heat and require cooling. These components do not benefit from the cooling and must be cooled separately by methods such as air cooling. Furthermore, electronic devices used in modern supercomputers and data centers have numerous components to cool besides the CPU (Central Processing Unit), including GPUs (Graphics Processing Units), high-speed memory, chipsets, power-related components such as FETs (Field-Effect Transistors), electrolytic capacitors, network units, bus switch units, and SSDs (Solid State Drives). It is difficult to adequately cool all of these components, which generate vastly different amounts of heat, using air cooling, which has inferior cooling capacity compared to liquid cooling. Furthermore, water-cooled blocks typically require a large supply of cooling water, and because they are large and not finned like heat sinks, they obstruct airflow for air cooling. In addition, at least two piping routes are essential to supply and collect water from the water-cooled block, and these piping routes for cooling the water-cooled block also obstruct airflow for air cooling to some extent. As a result, the cooling efficiency becomes extremely low for objects that are not directly cooled by the water-cooled block.

[0013] Furthermore, the cooling system disclosed in Non-Patent Document 1 employs a method in which the entire electronic component and electronic substrate are completely covered with a parylene thin film that does not conduct electricity and does not allow water to pass through, and the entire electronic component and electronic substrate covered with the parylene thin film are immersed in water or seawater, and the equipment is cooled using the low temperature of the water or seawater that comes into contact with the entire parylene thin film.

[0014] Similarly, the cooling system disclosed in Patent Document 6 also employs a method in which the entire electronic component and electronic substrate are completely coated with an ultra-nano hydrophobic coating thin film made of silicon compound nanoparticles that do not conduct electricity and do not allow water to pass through, and the entire electronic component and electronic substrate coated with the hydrophobic coating thin film is immersed in water, and the equipment is cooled using the low temperature of the water that comes into contact with the entire hydrophobic coating thin film.

[0015] In the cooling systems described in Non-Patent Document 1 and Patent Document 6 above, all electronic components and electronic substrates to be cooled are in contact with the refrigerant, which is water or seawater, via a parylene thin film or a hydrophobic coating thin film. For this reason, when efficiently cooling major heat sources such as CPUs, the cooling capacity and efficiency are inevitably inferior compared to cooling systems in which, for example, a heat sink directly contacts the semiconductor surface of a water-cooled block and the heat sink is directly cooled by a refrigerant such as water.

[0016] Furthermore, with the method of coating with the thin film described above, even a slight leak in the coating can lead to water ingress into the electronic components and circuit board beneath the coating. When power is applied, all electronic components and the circuit board will suffer irreversible damage due to an electrical short circuit, so the coating must be applied completely. However, apart from visual inspection, it is impossible to know whether an electrical short circuit will occur without actually powering on the electronic equipment, so there is always a possibility of losing the object being cooled. This is because, not only is leakage of the coating a problem when the electronic equipment is first used, but even after use, there remains a possibility that the thin coating will rupture due to deterioration, aging, or even slight contact with other electronic equipment, inspection equipment, or tools during maintenance and inspection work. Therefore, with parylene thin films and hydrophobic coating thin films, there is a dilemma: while the film thickness should be as thin as possible to increase thermal conductivity from the coolant for cooling, the film thickness must be above a certain level to prevent leakage or rupture of the coating and avoid damage to the electronic equipment.

[0017] Recent electronic circuit boards and their shapes are becoming increasingly complex in three-dimensional structures and are constantly shrinking. Establishing technology to coat these with flawless, perfect thin films is expected to present considerable technical challenges. Consequently, cooling systems using these thin films remain largely undeveloped.

[0018] Furthermore, since these thin film coatings require a strong coating by methods such as vapor deposition, electronic components and circuit boards with such surface modifications are not covered by quality assurance, and their use is at the user's own risk. In addition, even if one wishes to repurpose or resell them after use, it is extremely difficult to find demand for coated electronic components, so in principle, reuse or resale cannot be expected.

[0019] Incidentally, the water-cooling method disclosed in Patent Document 5 involves housing a semiconductor device in a flexible bag and immersing it in a refrigerant such as water to obtain cooling. However, like the film coating, the bag has a problem that the cooling performance is suppressed because it inhibits the direct contact between the semiconductor device surface and the refrigerant.

[0020] As described above, in the conventional liquid-cooling method, in the immersion method, in addition to the fact that immersion cooling using PFAS will become unusable in the near future, when synthetic oil or silicon, which is a non-conductive liquid that does not use PFAS, is used, the cooling capacity is not sufficient. Also, in the immersion method using water with high cooling capacity, non-conductivity must be ensured by coating a thin film on the front surface without any leakage. However, perfect film formation is becoming increasingly difficult as the three-dimensional substrate structure and miniaturization of electronic components progress, which has hindered its widespread use. Also, in the conventional liquid-cooling method, in the method using a water-cooling block, high cooling performance can be obtained for the CPU, which is the main heat source. However, there is a problem that sufficient cooling of most other electronic components and electronic substrates cooled by the air-cooling method cannot be achieved due to the large water-cooling block and the piping path for water cooling. Furthermore, in the conventional liquid-cooling method of housing a semiconductor device in a flexible bag and immersing it in water for cooling, there is a problem that the cooling performance is suppressed because the bag inhibits the direct contact between the semiconductor device surface and the refrigerant.

[0021] Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art and provide a simple, efficient, inexpensive, and highly maintainable cooling system and cooling method that improve the cooling performance of electronic devices.

Means for Solving the Problems

[0022] To solve the above problems, according to one aspect of the present invention, a cooling system is provided in which an electronic device is immersed in a common water (such as tap water, industrial water, or seawater), which is a typical example of a conductive, highly thermally conductive coolant, and a heat sink, which is often made of copper or aluminum and is thermally connected to an electronic component such as a CPU, which is the main heat source, is directly cooled by the water. In a preferred embodiment of the cooling system according to the present invention, the cooling system includes a cooling mediation complex. The cooling mediation complex includes a non-conductive bag for enclosing an electronic device including a substrate and at least one heat-generating element mounted on the substrate, a heat sink, and a bonding layer that watertightly connects the surface of the heat sink to the inner surface of the non-conductive bag. The bonding layer is formed from a dissimilar material bonding film. A first opening is formed in the dissimilar material bonding film and a second opening is formed in the non-conductive bag, and the first and second openings provide windows for the fin area of ​​the heat sink to exit the non-conductive bag, and the back surface of the heat sink inside the non-conductive bag provides a connection surface that is thermally connected to one surface of at least one heat-generating element.

[0023] In a preferred embodiment of the above cooling system, a raised portion may be formed on the back surface of the heat sink.

[0024] Furthermore, in a preferred embodiment of the cooling system described above, the second opening formed in the non-conductive bag may have an opening area larger than the area of ​​the fin region of the heat sink.

[0025] Furthermore, in a preferred embodiment of the cooling system described above, the bonding layer may watertightly connect the surface of the heat sink, excluding the fin area, to the inner surface of the non-conductive bag.

[0026] Furthermore, in a preferred embodiment of the cooling system described above, the heat sink may have a substrate fixing mechanism, and the substrate of the electronic device may be configured to be fixed to the substrate fixing mechanism of the heat sink.

[0027] Furthermore, in a preferred embodiment of the cooling system described above, the heat sink substrate fixing mechanism is preferably two or more screw holes formed on the back surface of the heat sink, spaced apart from each other.

[0028] Furthermore, in a preferred embodiment of the cooling system described above, the heat sink substrate fixing mechanism may be two or more screw support holes or two or more push pin support holes formed on the back surface of the heat sink, spaced apart from each other.

[0029] Furthermore, in a preferred embodiment of the cooling system described above, the cooling mediation complex may be configured such that, when the inside of the non-conductive bag is evacuated, the inner surface of the non-conductive bag comes into close contact with both sides of the substrate and the surfaces of various electronic components mounted on the substrate.

[0030] Furthermore, in a preferred embodiment of the cooling system described above, the non-conductive bag may be configured to have a check valve that provides a path for vacuuming and allows for the maintenance of a tight seal.

[0031] Furthermore, in a preferred embodiment of the cooling system described above, the non-conductive bag may have a zipper mechanism, which is configured to allow the placement of electronic devices inside the non-conductive bag when the zipper is open, and to maintain the airtightness of the non-conductive bag when the zipper is closed.

[0032] Furthermore, in a preferred embodiment of the cooling system described above, the non-conductive bag may have a heat-sealing mechanism, and the heat-sealing mechanism may be configured to allow the installation of electronic equipment inside the non-conductive bag in the unheated state and to allow vacuuming after heat sealing, while maintaining the airtightness of the non-conductive bag in the heat-sealed state.

[0033] Furthermore, in a preferred embodiment of the cooling system described above, the non-conductive bag may have a perforation for passing a power cable, network communication cable, or control cable connected to an electronic device, and a sealing material provided in the perforation may be configured to maintain the airtightness of the non-conductive bag.

[0034] Furthermore, in a preferred embodiment of the cooling system described above, the cooling mediation complex may further include a wireless power supply unit for supplying power to the electronic device and a wireless communication unit for enabling wireless communication between the electronic device and the outside, all within a non-conductive bag.

[0035] Furthermore, in a preferred embodiment of the cooling system, the cooling system may further include a monitoring unit within the non-conductive bag for monitoring the degree of vacuum inside the non-conductive bag.

[0036] Furthermore, in a preferred embodiment of the cooling system described above, the cooling system may further include a controller that activates an external vacuum pump and controls the vacuuming of the non-conductive bag when the output of the monitoring unit indicates a vacuum level below a predetermined threshold.

[0037] Furthermore, in a preferred embodiment of the cooling system, the cooling system may further include a shutdown unit that stops the operation of the electronic equipment and cuts off power when the output of the monitoring unit indicates a vacuum level below a predetermined threshold.

[0038] In addition, according to another aspect of the present invention, a method for cooling electronic equipment is provided, comprising the steps of: preparing a cooling mediation composite by joining the surface of a heat sink and the inner surface of a non-conductive bag using a dissimilar material bonding film such that the fin region of the heat sink is located outside the non-conductive bag through an opening formed in the non-conductive bag; placing the electronic equipment inside the cooling mediation composite and thermally connecting one surface of at least one heat-generating element contained in the electronic equipment to the back surface of the heat sink; sealing the non-conductive bag; and immersing the sealed cooling mediation composite in a coolant.

[0039] In a preferred embodiment of the above cooling method, two or more push pin support holes are formed on the back surface of the heat sink, spaced apart from each other, and through holes are formed in the electronic device at positions corresponding to the two or more push pin support holes. The step of preparing the cooling mediation complex includes preparing a heat sink with push pins, where push pins are placed in each of the two or more push pin support holes of the heat sink, and the step of connecting may include inserting each of the push pins into each of the through holes.

[0040] Furthermore, according to another aspect of the present invention, a method for cooling electronic equipment is provided, comprising the steps of: thermally connecting one surface of at least one heat-generating element contained in the electronic equipment to the back surface of a heat sink; placing the electronic equipment in a non-conductive bag having an opening, and forming a cooling mediation composite by joining the surface of the heat sink and the inner surface of the non-conductive bag using a dissimilar material bonding film such that the fin region of the heat sink is located outside the non-conductive bag through the opening formed in the non-conductive bag; sealing the non-conductive bag; and immersing the sealed cooling mediation composite in a coolant.

[0041] In a preferred embodiment of the above cooling method, the step of sealing the non-conductive bag may include the step of vacuuming the inside of the non-conductive bag. [Effects of the Invention]

[0042] The cooling system according to the present invention uses a cooling intermediate composite body which includes a non-conductive bag for enclosing an electronic device including a substrate and at least one heat-generating element mounted on the substrate, a heat sink, and a bonding layer formed from a dissimilar material bonding film that watertightly connects the surface of the heat sink to the inner surface of the non-conductive bag. A first opening is formed in the dissimilar material bonding film, and a second opening is formed in the non-conductive bag. The first and second openings provide windows for allowing the fin region of the heat sink to exit the non-conductive bag, and the back surface of the heat sink inside the non-conductive bag provides a connection surface that is thermally connected to one surface of the at least one heat-generating element. When the cooling intermediate composite body is immersed in a coolant, the coolant directly removes heat from the fin region on the surface side of the heat sink, and the heat sink locally and powerfully removes heat from the heat-generating element thermally connected to the back surface of the heat sink. Here, by forming a bonding layer from a dissimilar material bonding film, a strong and stable watertight bond can be achieved between the surface of the heat sink and the inner surface of the bag. This ensures the overall airtightness of the cooling mediation complex, even if windows are formed in the dissimilar material bonding film or the non-conductive bag. Conventional cooling methods that involve immersion in a conductive coolant such as water or seawater have the problem that the coating or bag used to keep the electronic device watertight to the surrounding coolant hinders heat transfer between the heat source and the coolant. In contrast, the cooling system of the present invention, by using a cooling mediation complex configured as described above, completely eliminates the heat transfer problems between the heat source and the coolant in the conventional technology, and improves the cooling performance of the electronic device. In addition, even if windows are formed in the dissimilar material bonding film or the non-conductive bag, a strong and stable sealed structure can be provided for the entire cooling mediation complex. Furthermore, when sealing a non-conductive bag, if the inside of the bag is evacuated, the inner surface of the non-conductive bag comes into close contact with both sides of the substrate and the surfaces of various electronic components mounted on the substrate. This increases the efficiency of heat removal from the various electronic components, thereby further improving the cooling performance of the electronic equipment.

[0043] The non-conductive bag can be made of a synthetic resin (e.g., polyethylene, polypropylene, polyester, etc.) that has water resistance and relatively low heat resistance (e.g., above 100°C), and can maintain airtightness (airtight / watertight) when sealed. Combined with the use of a dissimilar material bonding film that can form a bonding layer by short-time heating and pressing followed by cooling and fixing (other methods such as pressurization, ultrasound, electromagnetic waves, or light irradiation may also be used), a cooling mediation composite can be prepared simply, efficiently, and inexpensively. Furthermore, during maintenance of electronic equipment, it is only necessary to tear open the non-conductive bag of the cooling mediation composite and remove the electronic equipment from the bag, which not only provides excellent maintainability but also almost completely avoids the risk of contamination of the electronic equipment surface with foreign matter, making it advantageous from the perspective of reusing used electronic equipment.

[0044] The above-mentioned objectives and advantages of the present invention, as well as other objectives and advantages, will be more clearly understood through the following description of embodiments. However, the embodiments described below are illustrative and the present invention is not limited thereto. [Brief explanation of the drawing]

[0045] [Figure 1A] This is a front view showing the configuration of the main components of a cooling system according to one embodiment of the present invention. [Figure 1B] This is a side view showing the configuration of the main components of a cooling system according to one embodiment of the present invention. [Figure 2] This figure shows a heat sink applied to an example of a cooling mediation complex. [Figure 3] This is an exploded view showing an example of a cooling mediation complex. [Figure 4A] This figure shows an example of a cooling mediation complex. [Figure 4B] This figure shows an example of a cooling mediation complex. [Figure 5] This is a cross-sectional view showing an example of a cooling mediation complex. [Figure 6] This is an explanatory diagram showing an example of installing electronic equipment in a cooling mediation complex. [Figure 7]This is a cross-sectional view showing an example of installing electronic equipment in a cooling mediation complex. [Figure 8] This is a bottom view of a heatsink applied to other examples of cooling mediation complexes. [Figure 9] This is an explanatory diagram showing another example of installing electronic equipment in a cooling mediation complex. [Figure 10] This is a cross-sectional view showing another example of installing electronic equipment in a cooling mediation complex. [Figure 11] This is an explanatory diagram illustrating an example of configuring a cooling mediation complex by installing electronic equipment with a heat sink. [Figure 12] This is a cross-sectional view showing an example of an electronic device with a heatsink. [Figure 13] This is an explanatory diagram illustrating an example of configuring a cooling mediation complex by installing electronic equipment with a heat sink. [Figure 14] This is an explanatory diagram illustrating an example of configuring a cooling mediation complex by installing electronic equipment with a heat sink. [Figure 15] This is a cross-sectional view showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 16] This is a cross-sectional view showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 17] This is a cross-sectional view showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 18] This figure shows a heatsink, which is applied to yet another example of a cooling mediation complex. [Figure 19] This is an explanatory diagram showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 20] This is a cross-sectional view showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 21] This is an explanatory diagram showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 22] This is a cross-sectional view showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 23] This is a cross-sectional view showing yet another example of installing electronic equipment in a cooling mediation complex. [Figure 24] This figure shows an example of how the cooling system is operated. [Modes for carrying out the invention]

[0046] Hereinafter, several preferred embodiments of the cooling system according to the present invention will be described in detail with reference to the drawings.

[0047] Referring to Figures 1A and 1B, the cooling system 1 includes a cooling mediation complex 100. The cooling mediation complex 100 includes a non-conductive bag 11 for enclosing the electronic device 10, a heat sink 21, and a bonding layer 23 connecting the surface of the heat sink 21 (described later) to the inner surface of the non-conductive bag 11. The heat sink refers to a copper or aluminum heat sink that can be thermally connected to the heat-generating element of the electronic device. The heat sink may have a number of plate-shaped or rod-shaped fins on its surface side to increase its surface area. Hereinafter in this specification, the area on the surface side of the heat sink where a number of plate-shaped or rod-shaped fins are provided may be referred to as the "fin area" of the heat sink, while the area not including the "fin area" may be referred to as the "surface" of the heat sink.

[0048] The non-conductive bag 11 is made of a synthetic resin film (e.g., polyethylene, polypropylene, polyester, etc.) that has water resistance and heat resistance to relatively low temperatures (e.g., 100°C or higher), and can maintain airtightness (airtightness / watertightness) when sealed. A zipper mechanism 20 is provided on one side of the non-conductive bag 11. The zipper mechanism 20 is configured to allow the electronic equipment 10 to be placed inside the non-conductive bag 11 when the zipper is open, and to maintain the airtightness of the non-conductive bag 11 when the zipper is closed. In addition, a check valve 19 is provided on one side of the non-conductive bag 11. The check valve 19 provides a path for vacuuming the inside of the non-conductive bag 11 and maintains the seal during and after vacuuming.

[0049] The electronic device 10 includes a circuit board 31, at least one heat-generating element 33 (shown in Figure 6 and other, e.g., a CPU) mounted on the circuit board 31, and various electronic components 35 such as electrolytic capacitors. One end of each of the network communication cable 36 and the power cable 37 is connected to the electronic device 10, which is installed inside the non-conductive bag 11, via a connector. Each of the network communication cable 36 and the power cable 37 passes through a through-hole formed on one side of the non-conductive bag 11. Since a sealing material 17 is provided in the through-hole, the other ends of each of the network communication cable 36 and the power cable 37 can be connected to network equipment and power distribution equipment located outside the non-conductive bag 11 while maintaining the airtightness of the non-conductive bag 11.

[0050] Figure 2 shows a heat sink 21 applied to the cooling mediation complex 100, where (A) is a plan view of the heat sink, (B) is a front view, and (C) is a cross-sectional view. On the surface side of the heat sink, the fin region 211 is provided with numerous plate-shaped fins rising from the base portion 212. The area surrounding the fin region 211 is a flat surface 21A without fins, and in this specification, this surface is referred to as the surface 21A of the heat sink. Note that 21B refers to the back surface of the heat sink 21.

[0051] Figure 3 shows the components of the cooling mediation composite 100, namely the non-conductive bag 11, the heat sink 21, and the bonding layer 23, in an disassembled state. Figure 4A shows the cooling mediation composite 100 viewed from the outer surface 11A side of the non-conductive bag 11, Figure 4B shows the cooling mediation composite 100 viewed from the inner surface 11B side of the non-conductive bag 11, and Figure 5 shows the AA cross-section in Figure 4A. The bonding layer 23 is a layer that connects the surface of the heat sink 21 and the inner surface of the non-conductive bag 11, and in particular the bonding layer 23 is formed from a dissimilar material bonding film. A first opening 25 is formed in the dissimilar material bonding film that forms the bonding layer 23. The size of the dissimilar material bonding film is preferably the same as or slightly larger than the size of the heat sink 21, and the size of the first opening 25 is preferably the same as or slightly larger than the size of the fin region 211 of the heat sink 21. A second opening 15 is also formed in the non-conductive bag 11. The size of the second opening 15 may be similar to the size of the first opening 25 formed in the dissimilar material bonding film, and together with the first opening 23, it provides a window for the fin region 211 of the heat sink 21 to exit the non-conductive bag 11. On the other hand, the back surface 21B of the heat sink 21 inside the non-conductive bag 11 provides a connection surface that is thermally connected to one side of the heating element.

[0052] As an example of a dissimilar material bonding film that forms the bonding layer 23, the "MetaSeal" series (Fujimori Kogyou's product name) manufactured by Fujimori Kogyou Co., Ltd. can be used. Since this dissimilar material bonding film is formed into a film of uniform thickness, it can be sandwiched between the surface 21A of the heat sink 21 and the inner surface 11B of the non-conductive bag 11 and heat-pressed to form a bonding layer 23 that joins the heat sink 21 and the non-conductive bag 11. A heat press or an iron-type heater can be used for heat-pressing, and the bonding process between the heat sink 21 and the non-conductive bag 11 can be completed easily and quickly (in a few seconds or more). The method for forming the bonding layer 23 is not limited to heat-pressing, and various methods such as pressurization, ultrasound, electromagnetic waves, and light irradiation may be used.

[0053] By forming the bonding layer 23 from a dissimilar material bonding film, it is possible to achieve surface bonding between the surface 21A of the heat sink 21 and the inner surface 11B of the non-conductive bag 11 with a uniform film thickness and no variation in adhesive strength. This makes it suitable for use in firmly bonding the heat sink and the bag.

[0054] Another example of a dissimilar material bonding film that forms the bonding layer 23 is "WelQuick" (Resonac's product name) manufactured by Resonac Corporation. This dissimilar material bonding film utilizes the solid-liquid phase change of the film material, allowing the bonding process to be completed in a short time (a few seconds), and also enabling reheating, peeling, and re-bonding after bonding. Therefore, it is easy to recover the cooling mediation composite 100 of the cooling system after a certain period of use and peel the heat sink 21 from the non-conductive bag 11, resulting in high resource reusability.

[0055] Here, the dissimilar material bonding film can preferably be a sheet or film that has been pre-formed into shape and then cut. However, it is not limited to this, and for example, if a certain environment is in place that allows for appropriate control of various conditions, including the film thickness and shape, the bonding layer 23 formed from the dissimilar material bonding film can be obtained starting from a liquid or gel-like adhesive material. Specifically, as an example, first, a mold is placed on the surface of the heat sink and filled with a liquid or gel-like adhesive material to form a coating of the adhesive material of the desired shape (i.e., a shape with a window in the center) and volume on the surface of the heat sink. Next, with the coating of the adhesive material in contact with the surface of the heat sink and the inner surface of the non-conductive bag, the coating of the adhesive material can be solidified by methods such as heating and pressing, pressurizing, ultrasonic waves, electromagnetic waves, or light irradiation. In this way, a bonding layer formed from the dissimilar material bonding film can be obtained starting from a liquid or gel-like adhesive material.

[0056] Figure 6 shows an example of installing electronic equipment 10 in the cooling mediation complex 100, and Figure 7 shows the BB cross section in Figure 6. As shown in Figure 6, the electronic equipment 10 is installed inside the cooling mediation complex 100. At this time, as shown in Figure 7, one surface of the heating element 33 makes surface contact with the back surface 21B of the heat sink 21 and is thermally connected. In order to ensure surface contact and thermal connection, it is preferable to fill the minute gap between one surface of the heating element 33 and the back surface 11B of the heat sink 21 with thermal conductive grease 34. After installing the electronic equipment 10 inside the cooling mediation complex 100, the zipper mechanism of the non-conductive bag 11 is closed, and then the inside of the non-conductive bag 11 is evacuated via the check valve 19. By evacuating, the inner surface of the non-conductive bag can be brought into close contact with both sides of the substrate and the surfaces of various electronic components mounted on the substrate.

[0057] Figure 24 shows an example of the operation of the cooling system 1. The cooling tank 3 contains a sufficient amount of coolant 4 to immerse the cooling mediation complex 100. The coolant 4 can be ordinary water (tap water, industrial water, or seawater, etc.). The piping 5 connected to the cooling tank 3 provides a passage for discharging the coolant heated in the cooling tank 3 and returning the coolant cooled by a heat exchanger (not shown) to the cooling tank 3. In the cooling mediation complex 100 immersed in the coolant 4, the coolant 4 directly absorbs heat from the fin region 211 on the surface side of the heat sink 21, and the heat sink 21 locally and powerfully absorbs heat from the heat-generating element 33 that is thermally connected to the back surface 21B of the heat sink 21. Conventional cooling methods have the problem that the coating or bag covering electronic or semiconductor equipment hinders heat transfer between the heat-generating element and the coolant, but this problem can be resolved and the cooling performance of electronic equipment can be improved. Furthermore, by evacuating the inside of the non-conductive bag 11 and bringing the inner surface of the non-conductive bag 11 into close contact with both sides of the substrate 31 and the surfaces of various electronic components 35 mounted on the substrate 31, the efficiency of removing heat from the various electronic components 35 can be increased, further improving the cooling performance of the electronic device 100.

[0058] Next, other examples of cooling mediation complexes will be described with reference to Figures 8 to 23. Note that the same reference numerals are used for parts that are the same as those in Figures 1A to 7. Figures 8 to 10 show other examples of the cooling mediation complex, and the difference between the cooling mediation complex 200 and the cooling mediation complex 100 shown in Figures 2 to 7 is that the heat sink 41 has a substrate fixing mechanism 43. The substrate fixing mechanism 43 may be, for example, two or more screw holes formed apart from each other on the back surface 41B of the heat sink 41. In the example shown in Figure 8, screw holes are formed at the four corners of the back surface 41B of the heat sink 41.

[0059] Figure 9 shows an example of installing an electronic device 50 in the cooling mediation complex 200, and Figure 10 shows a cross-sectional view of the CC in Figure 9. As shown in Figure 10, through-holes 53 are also formed in the substrate 51 of the electronic device 50 at positions corresponding to the screw holes 43. When installing the electronic device 50 in the cooling mediation complex 200, screws 55 are passed through the through-holes 53 in the substrate 51 and engaged with the screw holes 43 in the heat sink 41. The cooling system including the cooling mediation complex 200 configured in this way is particularly advantageous when installing large and heavy electronic devices, or when the surface connecting the electronic device 50 and the heat sink 41 of the cooling mediation complex 200 is not horizontal but vertical or inclined, because the coupling between the electronic device 50 and the heat sink 41 of the cooling mediation complex 200 is strengthened. It goes without saying that the cooling system including the cooling mediation complex 200 has the same effects as the cooling system including the cooling mediation complex 100 described above.

[0060] Figures 11 to 14 show other examples of installing electronic equipment 50 in the cooling mediation complex, and in particular, an example of configuring the cooling mediation complex 300 by installing electronic equipment with a heatsink. Figure 12 shows the DD cross section in Figure 11, and Figure 14 shows the EE cross section in Figure 13. The cooling mediation complex 300 has a similar configuration to the cooling mediation complex 200 shown in Figures 8 to 10. However, it differs in that the heatsink 45 has a screw support hole 57 for supporting the head side of the screw 55 as a substrate fixing mechanism, and the electronic equipment 50 with a heatsink, which is fixed to the substrate 51 with a screw 55 and a nut, is installed in a non-conductive bag 11, and the surface of the heatsink 45 and the inner surface of the non-conductive bag 11 are joined using a dissimilar material bonding film 23 so that the fin region of the heatsink is located outside the non-conductive bag 11 through an opening 15 formed in the non-conductive bag 11, thereby configuring the cooling mediation complex. A cooling system including the cooling mediation complex 300 configured in this manner has the same effects as a cooling system including the cooling mediation complex 200 described above.

[0061] Figure 15 shows yet another example of installing electronic equipment in a cooling mediation complex. This example differs from the cooling mediation complex 200 in that a screw 55 is inserted through the non-conductive bag 11 and bonding layer 23 into a screw support hole 57 of the heat sink to form a cooling mediation complex 400, and inside the cooling mediation complex 400, the screw 55 is inserted into a through-hole formed in the substrate of the electronic equipment and secured with a nut. A cooling system including the cooling mediation complex 400 configured in this way has the same effects as the cooling system including the cooling mediation complex 200 described above.

[0062] Figure 16 shows yet another example of installing electronic equipment in a cooling mediation complex. In this example, the cooling mediation complex 500 has a similar configuration to the cooling mediation complex 400 shown in Figure 15. However, it differs from the cooling mediation complex 400 in that the heads of the screws 55 inserted into the screw support holes 57 of the heatsink 41 are located on the outer surface of the non-conductive bag 11 (in the cooling mediation complex 400, the surface of the screw heads 55 is aligned with the outer surface of the non-conductive bag 11). A cooling system including the cooling mediation complex 500 configured in this way has the same effects as the cooling system including the cooling mediation complex 400 described above.

[0063] Figure 17 shows yet another example of installing electronic equipment in a cooling mediation complex. In this example, the cooling mediation complex 600 has a similar configuration to the cooling mediation complex 300 shown in Figure 14. However, it differs from the cooling mediation complexes 200 to 500 in that (1) the heat sink 45 has push pin support holes 59 formed separately on the back surface of the heat sink as a substrate fixing mechanism to support the heads of the push pins 56, (2) a heat sink with push pins is prepared, with push pins placed in each of the push pin support holes 59, and then the inner surface of the non-conductive bag 11 and the surface of the heat sink with push pins are joined using a dissimilar material bonding film to prepare the cooling mediation complex, and (3) installation is completed simply by inserting the tips of the push pins into the through holes of the electronic equipment (in the cooling mediation complex 300, the tips of the screws 55 are fixed with a separate component such as a nut). Here, a push pin is a fastener consisting of a split shaft with a barb at the tip and a spring, and is known as a fastener for fixing components such as circuit boards of electronic devices to other components such as housings, so a detailed explanation will be omitted here. When using screw fastening, preparing the cooling mediation complex may require the proper tightening of individual screws. Furthermore, screw-fastening electronic equipment inside the cooling mediation complex is not always easy and can be relatively time-consuming. In contrast, with push-pin fastening, a heat sink with push pins attached, where the heads of the push pins are fitted into support holes for the push pins, is prepared. Then, the inner surface of a non-conductive bag and the surface of the heat sink with push pins are joined using a dissimilar material bonding film. This allows for a simpler and more efficient preparation of the cooling mediation complex. Moreover, the work inside the cooling mediation complex only requires passing the push pins through the through-holes in the substrate and engaging the barb at the tip of the push pin with the back surface of the substrate. This allows for installation to be completed in a shorter time and with simpler operation, while still achieving sufficiently strong fastening. It goes without saying that a cooling system including the cooling mediation complex 500 configured in this way will have the same effects as a cooling system including the cooling mediation complex 400 described above.

[0064] Further examples of the cooling mediation complex will be described with reference to Figures 18 to 20. The cooling mediation complex 700 uses a heat sink 81 with the structure shown in Figure 18. Specifically, the heat sink 81 has a rectangular raised portion 822 formed near the center of its back surface 81B. The raised portion 822 has a flat raised surface 82B. In Figure 18, (A) is a front view of the heat sink 81, (B) is a central cross-sectional view, and (C) is a bottom view.

[0065] Figure 19 shows an example of installing electronic equipment 60 on a cooling mediation complex 700, and Figure 20 shows a cross-section of the FF in Figure 19. As shown in Figure 19, the electronic equipment 60 specifically includes a large semiconductor device 32 mounted on a substrate 61, and the large semiconductor device 32 includes a relatively large heating element 63 near its center. In addition, a semiconductor frame 65 (sometimes called a stiffener) is provided to surround the rectangular edge of the large semiconductor device 32. The semiconductor frame 65 is a reinforcing material, and the surface of the semiconductor frame 65 may be higher than the surface of the large semiconductor device 32.

[0066] The electronic device 60 is installed within the cooling mediation complex 700. At this time, as shown in Figure 20, one surface of the heating element 63 is in surface contact with the raised surface 82B on the back side of the heat sink 81, and is thermally connected. Because there is a raised surface 82B on the raised portion 822 on the back side of the heat sink 81, such connection is possible even when the surface of the large semiconductor device 32, i.e., the surface of the heating element 63, is lower than the surface of the semiconductor frame 65. In order to ensure surface contact and thermal connection, it is preferable to fill the minute gap between one surface of the heating element 63 and the raised surface 82B of the raised portion 822 on the back side of the heat sink 81 with thermal conductive grease 34.

[0067] Figures 19 to 20 show an example in which the large semiconductor device 32 includes one heat-generating element 63, but of course the large semiconductor device 32 may include two or more heat-generating elements. In this case, the raised surface 82B of one of the raised portions 82 on the back side of the heat sink 81 may be in surface contact with each of the two or more heat-generating elements and be thermally connected.

[0068] Figures 21 to 23 show yet another example of a cooling mediation complex, wherein the cooling mediation complex 800 differs from the cooling mediation complex 700 shown in Figures 16 to 20 in that the heat sink 81 has push pin support holes 59 as a substrate fixing mechanism. For example, there may be two or more push pin support holes 59 formed apart from each other on the back surface 81B of the heat sink 81, excluding the raised surface 82B. In the example shown in Figure 21, push pin support holes 59 are formed at the four corners of the back surface 81B of the heat sink 81.

[0069] Figure 21 shows an example of installing an electronic device 60 in the cooling mediation complex 800, where (A) shows the GG cross-section in Figure 22 and (B) shows the HH cross-section. As shown in Figure 22, through-holes 53 are also formed in the substrate 61 of the electronic device 60 at positions corresponding to the push-pin support holes 59. When installing the electronic device 60 in the cooling mediation complex 600, the push-pins 56 are passed through the through-holes 53 in the substrate 51 and engaged with the back surface of the substrate 61 by the barb at the tip of the push-pins 56. A cooling system including the cooling mediation complex 800 configured in this way is particularly advantageous when installing large and heavy electronic devices, or when the surface connecting the electronic device 50 and the heat sink 81 of the cooling mediation complex 800 is not horizontal but vertical or inclined, because the coupling between the electronic device 60 and the heat sink 81 of the cooling mediation complex 800 is strengthened. It goes without saying that the cooling system including the cooling mediation complex 800 has the same effects as the cooling system including the cooling mediation complex 500 described above. In particular, as has already been mentioned, push-pin fixing allows for the preparation of the cooling mediation complex more simply and efficiently than screw fixing, and the work inside the cooling mediation complex can be completed in a short time and with extremely simple operations, while still achieving sufficiently strong fixing, so a detailed explanation will be omitted here.

[0070] Referring again to Figure 24, an example of the operation of the cooling system 1 will be described in more detail. Two or more cooling media complexes 100 may be immersed in the coolant 4 placed in the cooling tank 3. A top plate 3A may be installed in the cooling tank 3 to reduce the evaporation of the coolant 4. In addition, the cooling media complex 100 of the cooling system 1 may contain a wireless power supply unit (not shown) for supplying power to the electronic equipment 10 in place of a power cable, in a non-conductive bag 11, and a wireless communication unit (not shown) for enabling wireless communication between the electronic equipment 100 and the outside in place of a network communication cable, in a non-conductive bag 11. In this case, a penetration for passing the cable and a sealing material provided in the penetration are unnecessary, and the effort required to ensure and maintain the airtightness of the penetration can be reduced.

[0071] Furthermore, the cooling mediation complex 100 of the cooling system 1 may include a monitor unit 120 inside the non-conductive bag 11 for monitoring the degree of vacuum inside the non-conductive bag 11. In addition, the cooling system 1 may include a controller 160 that controls the activation of an external vacuum pump 7 when the output of the monitor unit 120 indicates a vacuum degree below a predetermined threshold, and performs vacuuming of the non-conductive bag 11 via an air tube 9 connected to a check valve 19. The operator may also be able to visually check the output value of the monitor unit 120 and the operating status of the controller 160 on a computer (PC) 180 that is communicably connected to the controller 160. This allows for autonomous vacuuming as needed while monitoring the degree of vacuum, thus maintaining the near-vacuum sealed structure of the cooling mediation complex 100 for a long period of time. Additionally or alternatively, the cooling system 1 may include a shutdown unit 140 that stops the operation of the electronic equipment 10 and cuts off power when the output of the monitor unit 120 indicates a vacuum degree below a predetermined threshold. If the vacuum in the cooling mediation complex 100 is compromised, the surrounding coolant may enter the complex, causing an electrical short circuit and potentially irreversibly damaging the entire electronic device 100. The shutdown unit 140 can prevent this problem from occurring by instantly stopping the operation and power supply to the electronic device 100.

[0072] In addition, various modifications to the components are possible in the above-described embodiment of the cooling system. For example, instead of a zipper mechanism, a non-conductive bag may have a heat-sealing mechanism, and the heat-sealing mechanism may be configured to allow the placement of electronic equipment inside the non-conductive bag in the unheated state and to allow vacuuming after heat sealing, while maintaining the airtightness of the non-conductive bag in the heat-sealed state. If two or more heat-generating elements are mounted on the substrate of the electronic equipment, the size and / or number of heat sinks, the size and / or number of dissimilar material bonding films forming the bonding layer, the size and / or number of windows formed in the film, and the position, size and / or number of windows formed in the non-conductive bag may be appropriately determined considering the position of the two or more heat-generating elements mounted on the substrate, the size of the heat-generating elements, the expected maximum heat generation, etc. [Industrial applicability]

[0073] The present invention can be widely applied to cooling systems and cooling methods that efficiently cool electronic devices by immersing them in a conductive cooling liquid such as ordinary water, tap water, or seawater. [Explanation of Symbols]

[0074] 1. Cooling System 3 Cooling tank 3A Top plate 4 Coolant (water) 5 Piping 7. Vacuum pump 9 Air tube 10, 50, 60, electronic equipment 100, 200, 300, 400, 500, 600, 700, 800 Cooling Median Complex 120 Vacuum Level Monitor Unit 140 Shutdown Units 160 Control Unit 180 Computers (PCs) 11, 71 Non-conductive bags 11A, 71A External surface 11B, 71B inner 15. 85 Window (second opening) 17. Sealant 19 Check valve 20 Zipper mechanism 21, 41, 45, 81 Heatsink 211, 811 fin regions 212, 812 Base section 21A heatsink surface Backside of 21B, 41B, and 81B heatsinks 82, 822 elevated portion 81B Reverse side 82B Raised surface 23, 83, bonding layer 25, 85 Window (First opening) 31, 51, 61 PCBs 32 Large Semiconductor Equipment 33, 63 Heat-generating element (CPU) 34 Thermal conductive grease 35 Electronic Components 36 Network communication cables 37 Power Cable 43 Screw holes (for circuit board fixing mechanism) 53 Through Holes 55 screws 56 push pins 57 Screw support holes (substrate fixing mechanism) 59 Support hole for push pin (board fixing mechanism) 65 Stiffener 75. Window (third opening)

Claims

1. A cooling system that cools electronic equipment by immersing it in a cooling liquid, The cooling system includes a cooling mediation complex. The aforementioned cooling mediation complex is A non-conductive bag for enclosing an electronic device including a substrate and at least one heating element mounted on the substrate, heatsink and A bonding layer that watertightly connects the surface of the heat sink and the inner surface of the non-conductive bag, Includes, The bonding layer is formed from a dissimilar material bonding film, A first opening is formed in the dissimilar material bonding film, and a second opening is formed in the non-conductive bag. The first and second openings provide windows for allowing the fin region of the heat sink to exit the non-conductive bag, and the back surface of the heat sink inside the non-conductive bag provides a connection surface that is thermally connected to one surface of the at least one heating element. Cooling system.

2. The cooling system according to claim 1, wherein a raised portion is formed on the back surface of the heat sink.

3. The cooling system according to claim 1, wherein the second opening formed in the non-conductive bag has an opening area larger than the area of ​​the fin region of the heat sink.

4. The cooling system according to claim 1, wherein the bonding layer watertightly connects the surface of the heat sink, excluding the fin region, to the inner surface of the non-conductive bag.

5. The cooling system according to claim 1, wherein the heat sink has a substrate fixing mechanism, and the substrate of the electronic device is fixed to the substrate fixing mechanism of the heat sink.

6. The cooling system according to claim 5, wherein the substrate fixing mechanism of the heat sink is two or more screw holes formed apart from each other on the back surface of the heat sink.

7. The cooling system according to claim 5, wherein the substrate fixing mechanism of the heat sink is two or more screw support holes formed apart from each other on the back surface of the heat sink.

8. The cooling system according to claim 5, wherein the substrate fixing mechanism of the heat sink is two or more push pin support holes formed apart from each other on the back surface of the heat sink.

9. The cooling system according to claim 1, wherein the cooling mediation composite is configured such that when the inside of the non-conductive bag is evacuated, the inner surface of the non-conductive bag comes into close contact with both sides of the substrate and the surfaces of various electronic components mounted on the substrate.

10. The cooling system according to claim 9, wherein the non-conductive bag is configured to have a check valve that provides a path for vacuuming and allows for the maintenance of a seal.

11. The cooling system according to claim 9, wherein the non-conductive bag has a zipper mechanism, the zipper mechanism is configured to allow the placement of the electronic device inside the non-conductive bag when the zipper is open, and to maintain the airtightness of the non-conductive bag when the zipper is closed.

12. The cooling system according to claim 9, wherein the non-conductive bag has a heat-sealing mechanism, and the heat-sealing mechanism is configured to allow the installation of the electronic equipment inside the non-conductive bag in an unheated state and to allow vacuuming after heat sealing, and to maintain the airtightness of the non-conductive bag in a heat-sealed state.

13. The cooling system according to claim 9, wherein the non-conductive bag has through holes formed for passing power cables, network communication cables, or control cables connected to electronic equipment, and a sealing material provided in the through holes is configured to maintain the airtightness of the non-conductive bag.

14. The cooling system according to claim 9, wherein the cooling mediation complex further includes a wireless power supply unit for supplying power to the electronic device and a wireless communication unit for enabling wireless communication between the electronic device and the outside, within the non-conductive bag.

15. The cooling system according to claim 9, wherein the cooling mediation complex further includes a monitoring unit within the non-conductive bag for monitoring the degree of vacuum inside the non-conductive bag.

16. The cooling system according to claim 15, further comprising an exhaust controller that controls the activation of a vacuum pump located outside the cooling mediation complex to evacuate the non-conductive bag when the output of the monitoring unit indicates a vacuum level below a predetermined threshold.

17. The cooling system according to claim 15, further comprising a shutdown unit that stops the operation of the electronic device and cuts off power when the output of the monitoring unit indicates a vacuum level below a predetermined threshold.

18. A method for cooling electronic devices, The steps include: preparing a cooling mediation composite comprising: bonding the inner surface of a non-conductive bag for enclosing an electronic device including a substrate and at least one heat-generating element mounted on the substrate, and the surface of a heat sink, using a dissimilar material bonding film, such that the fin region of the heat sink is located outside the non-conductive bag through an opening formed in the non-conductive bag; The steps include: placing the electronic device within the cooling mediation complex and thermally connecting one surface of the at least one heat-generating element to the back surface of the heat sink; The steps include sealing the non-conductive bag, The steps include immersing the sealed cooling media complex in the coolant, A method that includes this.

19. Two or more push pin support holes are formed on the back surface of the heat sink, spaced apart from each other, and through holes are formed in the electronic device at positions corresponding to the two or more push pin support holes. The step of preparing the cooling mediation complex includes the step of preparing a heat sink with push pins, wherein push pins are placed in each of the two or more push pin support holes of the heat sink. The method according to claim 18, wherein the connecting step includes inserting each of the push pins into each of the through holes.

20. A method for cooling electronic devices, The steps include: thermally connecting one surface of at least one heat-generating element included in an electronic device to the back surface of a heat sink by making surface contact with it; The steps include: placing the electronic device inside a non-conductive bag having an opening, and joining the surface of the heat sink and the inner surface of the non-conductive bag using a dissimilar material bonding film such that the fin region of the heat sink is located outside the non-conductive bag through the opening formed in the non-conductive bag; The steps include sealing the non-conductive bag, The steps include immersing the sealed cooling media complex in the coolant, A method that includes this.

21. The method according to claim 17 or 18, wherein the step of sealing the non-conductive bag includes the step of vacuuming the inside of the non-conductive bag.

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