Electronic component mounting device and electronic component mounting method

Abstract

To provide an electronic component mounting device capable of accurately mounting electronic components onto a circuit board with high yield.SOLUTION: A disclosed electronic component mounting device includes:a circuit board holding unit that holds a circuit board; a height position measurement unit that acquires a piece of height position information SH2 regarding the height position of the upper surface of the circuit board held by the circuit board holding unit; a calculation unit that calculates a target height position when a component holder holding an electronic component descends toward the circuit board by using height position information PH1 regarding height position of the upper surface of a pre-measured solder precoat, a piece of height position information SH1 regarding a height position of the upper surface of the circuit board, the piece of height position information SH2 measured by the height position measurement unit; and a mounting head that mounts the electronic component on the solder precoat by lifting / lowering the component holder based on the target height position. The solder precoat is formed by melting the solder paste supplied onto the land, and has a solder paste residue on the surface. The height position information PH1 is the height of the upper surface of the residue.SELECTED DRAWING: Figure 15A

Description

Technical Field

[0001] The present invention relates to an electronic component mounting apparatus and an electronic component mounting method.

Background Art

[0002] An electronic component mounting method for manufacturing an electronic component mounting substrate is known by mounting an electronic component on a substrate by solder bonding (for example, Patent Document 1). The method of Patent Document 1 includes a step of printing a solder paste and a step of placing an electronic component on the solder paste and performing reflow soldering. However, such a method may not be able to cope with high-density mounting. Therefore, in recent years, a method of previously forming a solder film on the lands of a substrate on which electronic components are placed (solder precoat method) has been attracting attention again (for example, Patent Document 2). The formed solder film may be referred to as a "solder precoat".

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a manufacturer of electronic component mounting substrates attempts to manufacture an electronic component mounting substrate by the solder precoat method, it is necessary to obtain a substrate on which a solder precoat has been previously formed. There are two methods for this obtaining method: procuring a substrate on which a solder precoat has been formed from the outside or preparing it in-house. However, if procured from the outside, the manufacturing cost of the electronic component mounting substrate increases. Also, it becomes difficult to quickly respond to design changes of the electronic component mounting substrate.

[0005] On the other hand, if one were to prepare the equipment in-house, it would be possible to repurpose the assembly line used for manufacturing electronic component mounting boards for solder precoating. However, in that case, it would be necessary to change the settings of the assembly line for solder precoating and for manufacturing electronic component mounting boards, which would complicate operations and make it impractical.

[0006] Furthermore, when mounting electronic components onto a circuit board, it is necessary to mount the components accurately and with good yield. However, due to the miniaturization of electronic components, it has become difficult to mount them accurately and with good yield.

[0007] In this context, one of the objectives of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can mount electronic components onto a substrate with high yield and accuracy. [Means for solving the problem]

[0008] One aspect of the present invention relates to a mounting substrate manufacturing apparatus. The manufacturing apparatus is for manufacturing a mounting substrate that includes a substrate having lands and electronic components soldered to the lands, and comprises: a substrate transport line for transporting the substrate having lands; a solder pre-coat forming unit for forming a solder pre-coat on the lands; a first substrate holding unit for holding the substrate transported from the solder pre-coat forming unit by the substrate transport line; a first height position measuring unit for acquiring height position information PH1 relating to the height position of the upper surface of the solder pre-coat and height position information SH1 relating to the height position of the upper surface of the substrate by first height position measurement on the substrate held by the first substrate holding unit; and a second substrate holding unit for holding the substrate transported from the first substrate holding unit by the substrate transport line. The electronic component mounting unit includes a substrate holding unit, a second height position measuring unit that acquires height position information SH2 relating to the height position of the upper surface of the substrate held by the second substrate holding unit by a second height position measurement, an electronic component mounting unit that mounts the electronic component on the solder precoat of the substrate held by the second substrate holding unit using a component holder, and a calculation unit that calculates a target height position when the component holder holding the electronic component descends toward the substrate in order to mount the electronic component on the solder precoat, using the height position information PH1, the height position information SH1, and the height position information SH2, wherein the electronic component mounting unit controls the raising and lowering operation of the component holder based on the target height position to mount the electronic component on the solder precoat.

[0009] Another aspect of the present invention relates to a printed circuit board manufacturing apparatus. The manufacturing apparatus is a mounting substrate manufacturing apparatus for manufacturing a mounting substrate including a substrate having lands and electronic components soldered to the lands, and includes a substrate transport line for transporting the substrate having lands, a solder pre-coat forming unit for forming a solder pre-coat on the lands, a substrate holding unit for holding the substrate transported from the solder pre-coat forming unit by the substrate transport line, a height position measuring unit for acquiring height position information PH2 relating to the height position of the upper surface of the solder pre-coat on the substrate held by the substrate holding unit by height position measurement, an electronic component mounting unit for mounting the electronic components on the solder pre-coat of the substrate held by the substrate holding unit using a component holder, and a calculation unit for calculating a target height position when the component holder holding the electronic components descends toward the substrate in order to mount the electronic components on the solder pre-coat, using the height position information PH2, wherein the electronic component mounting unit controls the raising and lowering operation of the component holder based on the target height position to mount the electronic components on the solder pre-coat.

[0010] Another aspect of the present invention relates to a method for manufacturing a mounting substrate. The manufacturing method is for manufacturing a mounting substrate that includes a substrate having lands and electronic components soldered to the lands, comprising: a solder precoat formation step of forming a solder precoat on the lands; a first height position measurement step of acquiring height position information PH1 relating to the height position of the upper surface of the solder precoat and height position information SH1 relating to the height position of the upper surface of the substrate by first height position measurement while the substrate on which the solder precoat has been formed is held by a first substrate holding part; and a second height position measurement step of acquiring height position information SH2 relating to the height position of the upper surface of the substrate by second height position measurement while the substrate that has gone through the first height position measurement step is held by a second substrate holding part. The process includes, in this order, a position measurement step and an electronic component mounting step of mounting the electronic component on the solder precoat of the substrate held by the second substrate holding part using a component holder, further including a calculation step between the second height position measurement step and the electronic component mounting step in which the component holder holding the electronic component descends toward the substrate to mount the electronic component on the solder precoat, using the height position information PH1, the height position information SH1, and the height position information SH2, and in the electronic component mounting step, the raising and lowering operation of the component holder is controlled based on the target height position calculated in the calculation step so that the electronic component is mounted on the solder precoat.

[0011] Another aspect of the present invention relates to a method for manufacturing a mounting substrate. The manufacturing method is for manufacturing a mounting substrate that includes a substrate having lands and electronic components soldered to the lands, and includes, in this order: a solder precoat formation step of forming a solder precoat on the lands; a height position measurement step of acquiring height position information PH2 relating to the height position of the upper surface of the solder precoat by height position measurement while the substrate on which the solder precoat has been formed is held by a substrate holding part; and an electronic component mounting step of mounting the electronic component on the solder precoat of the substrate held by the substrate holding part using a component holder, wherein the method further includes a calculation step between the height position measurement step and the electronic component mounting step of calculating a target height position when the component holder holding the electronic component descends toward the substrate in order to mount the electronic component on the solder precoat, using the height position information PH2, and in the electronic component mounting step, the raising and lowering operation of the component holder is controlled based on the target height position so that the electronic component is mounted on the solder precoat. The present invention further includes the following technologies. (Technology 1) An electronic component mounting apparatus for mounting electronic components on a substrate having multiple lands on which a solder precoat has been formed, using a component holder, A substrate holding portion for holding the substrate, A height position measuring unit that acquires height position information SH2 relating to the height position of the upper surface of the substrate held by the substrate holding unit, A calculation unit calculates the target height position when the component holder, which holds the electronic component, descends toward the substrate to mount the electronic component onto the solder precoat, using height position information PH1 relating to the height position of the upper surface of the solder precoat, height position information SH1 relating to the height position of the upper surface of the substrate, and height position information SH2 measured by the height position measurement unit, respectively. Includes a mounting head that raises and lowers the component holder based on the target height position to mount the electronic component onto the solder precoat, The solder precoat is formed by melting solder paste supplied onto the land and has a residue of the solder paste on its surface, and the height position information PH1 is the height of the upper surface of the residue, in an electronic component mounting device. (Technology 2) The aforementioned substrate is provided with identification information for individually identifying the substrate, The calculation unit is stored in the height position measurement information storage unit together with the identification information by the solder precoat inspection device, and the height position information PH1 and height position information SH1 obtained from the height position measurement information storage unit are used in the electronic component mounting device according to Technical 1. (Technology 3) The substrate holding portion holds the substrate on which solder flux has been applied to the solder precoat. The electronic component mounting apparatus according to Technology 1 or 2, wherein the height position measurement unit acquires the height position information SH2 by measuring the height position of the portion of the substrate that is not covered with solder flux. (Technology 4) The aforementioned height position measurement unit acquires the height position information SH2 using laser light, an electronic component mounting device according to any one of technologies 1 to 3. (Technology 5) An electronic component mounting method for mounting electronic components on a substrate having multiple lands on which a solder precoat has been formed, using a component holder, The solder pre-coat inspection device measures height position information PH1 regarding the height position of the upper surface of the solder pre-coat and height position information SH1 regarding the height position of the upper surface of the substrate, and the substrate is held in the substrate holding unit. The height position of the upper surface of the substrate held by the substrate holder is measured to obtain height position information SH2. The target height position when the component holder holding the electronic component descends toward the substrate to mount the electronic component onto the solder precoat is calculated using the height position information PH1, the height position information SH1, and the height position information SH2. The method includes a step of lowering the component holder holding the electronic component to the target height position and mounting the electronic component on the solder precoat of the substrate held by the substrate holder. The solder precoat is formed by melting a solder paste supplied onto the land and has residues of the solder paste on its surface. The height position information PH1 is the height of the upper surface of the residues. An electronic component mounting method. (Technology 6) The substrate is provided with identification information for individually identifying the substrate. The target height position is calculated using the height position information PH1 and the height position information SH1 obtained from the height position measurement information storage unit, which is stored in the height position measurement information storage unit together with the identification information by the solder precoat inspection device. The electronic component mounting method according to Technology 5. (Technology 7) The substrate holder holds a substrate on which a solder flux is applied on the solder precoat. The height position information SH2 is obtained by performing height position measurement on a portion of the substrate that is not covered by the solder flux. The electronic component mounting method according to Technology 5 or 6.

Effect of the Invention

[0012] According to the mounting substrate manufacturing apparatus and the mounting substrate manufacturing method of the present invention, it is possible to continuously perform the steps from the formation of the solder precoat to the soldering of the electronic component to the substrate. According to the electronic component mounting apparatus and the electronic component mounting method of the present invention, the electronic component can be accurately mounted on the substrate with high yield. The novel features of the present invention are described in the appended claims. However, the present invention relates to both the configuration and the content, and will be better understood from the following detailed description in combination with other objects and features of the present invention and with reference to the drawings.

Brief Description of the Drawings

[0013] [Figure 1] It is a diagram schematically showing the configuration of the mounting substrate manufacturing apparatus of Embodiment 1. [Figure 2] It is a diagram schematically showing an example of a control system of a mounting substrate manufacturing apparatus shown in FIG. 1. [Figure 3] It is a diagram schematically showing a configuration of an example of a solder precoat forming section included in the apparatus shown in FIG. 1. [Figure 4] It is a diagram schematically showing a part of the solder precoat forming section shown in FIG. 3. [Figure 5] It is a diagram schematically showing one step of a method of applying solder paste to a substrate using the apparatus of this embodiment. [Figure 6A] It is a cross-sectional view schematically showing one step of an example of a process of forming a solder precoat using the apparatus of Embodiment 1. [Figure 6B] It is a cross-sectional view schematically showing one step following one step shown in FIG. 6A. [Figure 6C] It is a cross-sectional view schematically showing one step following one step shown in FIG. 6B. [Figure 6D] It is a cross-sectional view schematically showing one step following one step shown in FIG. 6C. [Figure 7] It is a diagram schematically showing an example of a solder precoat inspection apparatus included in the apparatus shown in FIG. 1. [Figure 8] It is a flowchart showing an example of a process in a solder precoat inspection apparatus. [Figure 9A] It is a diagram schematically showing one step of an example of a method of holding a substrate in a solder precoat inspection apparatus. [Figure 9B] It is a diagram schematically showing one step following one step shown in FIG. 9A. [Figure 10] It is a top view schematically showing measurement positions etc. in a solder precoat inspection apparatus. [Figure 11] It is a schematic diagram for explaining height position measurement in a solder precoat inspection apparatus. [Figure 12] It is a diagram schematically showing an example of an electronic component mounting apparatus included in the apparatus shown in FIG. 1. [Figure 13] It is a flowchart showing an example of a process in the electronic component mounting apparatus shown in FIG. 12. [Figure 14] Figure 12 schematically illustrates an example of the process of mounting electronic components in the electronic component mounting apparatus shown. [Figure 15A] This is a schematic cross-sectional view showing one step of an example of the process for manufacturing a mounted substrate in the manufacturing apparatus of Embodiment 1. [Figure 15B] This is a schematic cross-sectional view illustrating the step following the step shown in Figure 15A. [Figure 15C] This is a schematic cross-sectional view illustrating the step following the step shown in Figure 15B. [Figure 15D] This is a schematic cross-sectional view illustrating the step following the step shown in Figure 15C. [Figure 15E] This is a schematic cross-sectional view illustrating the step following the step shown in Figure 15D. [Figure 16] This flowchart shows an example of a process in an electronic component mounting device included in the manufacturing apparatus of Embodiment 2. [Figure 17] This is a schematic diagram illustrating height position measurement in an electronic component mounting device included in the manufacturing apparatus of Embodiment 2. [Figure 18] This is a schematic diagram illustrating an example of the process of mounting electronic components in an electronic component mounting device included in the manufacturing apparatus of Embodiment 2. [Modes for carrying out the invention]

[0014] Embodiments of the present invention will be described below with reference to examples. However, the present invention is not limited to the examples described below. In this specification, "height position" means a coordinate position when the vertical direction is the coordinate axis. "Height position" may also be indicated as a height relative to a reference height position.

[0015] (Plastic circuit board manufacturing equipment) The manufacturing apparatus of this embodiment is an apparatus for manufacturing a mounting board on which multiple electronic components are mounted. A mounting board is a board on which electronic components are mounted. In other words, the manufacturing apparatus of this embodiment is an electronic component mounting board manufacturing apparatus. Two examples of the manufacturing apparatus of this embodiment will be described below. These two examples may be referred to as "manufacturing apparatus (D1)" and "manufacturing apparatus (D2)".

[0016] (Manufacturing equipment (D1)) Manufacturing apparatus (D1) is a manufacturing apparatus for manufacturing a mounted substrate including a substrate having lands and electronic components soldered to the lands. Manufacturing apparatus (D1) includes a substrate transport line for transporting substrates having lands, a solder pre-coat forming unit for forming a solder pre-coat on the lands, a first substrate holding unit for holding the substrate transported from the solder pre-coat forming unit by the substrate transport line, a first height position measuring unit for acquiring height position information PH1 regarding the height position of the upper surface of the solder pre-coat and height position information SH1 regarding the height position of the upper surface of the substrate by first height position measurement on the substrate held by the first substrate holding unit, and a substrate transport line for transporting the substrate transported from the first substrate holding unit. The system includes a second substrate holding unit that holds the substrate, a second height position measurement unit that acquires height position information SH2 relating to the height position of the upper surface of the substrate held by the second substrate holding unit through a second height position measurement, an electronic component mounting unit that mounts electronic components on the solder precoat of the substrate held by the second substrate holding unit using a component holder, and a calculation unit that calculates a target height position when the component holder holding the electronic components descends toward the substrate to mount the electronic components on the solder precoat, using height position information PH1, height position information SH1, and height position information SH2. The electronic component mounting unit controls the raising and lowering movement of the component holder based on the target height position to mount the electronic components on the solder precoat.

[0017] According to the manufacturing equipment (D1), the process from forming the solder precoat to mounting the electronic components onto the substrate can be carried out continuously, and the electronic components can be mounted onto the substrate accurately with a high yield.

[0018] In the following, the terms "upstream" and "downstream" may be used depending on the direction in which the substrate is transported. The substrate is transported from the upstream to the downstream side, during which time the solder precoat is formed and the electronic components are mounted. The solder paste supply unit, heating unit, solder flux application unit, electronic component mounting unit, and reflow unit are arranged in this order from the upstream to the downstream side. The first substrate holding unit and the first height position measuring unit may be located between the heating unit and the solder flux application unit (described later), or they may be included in other components. For example, the first substrate holding unit and the first height position measuring unit may be incorporated into the solder precoat inspection device (described later), or they may be incorporated into the solder flux application unit.

[0019] A circuit board is a substrate on which electronic components are mounted. The circuit board has wiring areas to which electronic components are soldered. For example, the circuit board may have areas called lands to which electronic components are soldered. There are no particular limitations on the circuit board; it may be any known circuit board on which electronic components are mounted.

[0020] It is preferable that the first substrate holding section and the second substrate holding section have the same configuration. By having the same configuration, it becomes possible to accurately utilize the height position information measured by the first substrate holding section as the height position information of the substrate held by the second substrate holding section.

[0021] The manufacturing apparatus (D1) may further include a height position measurement information storage unit that stores height position information PH1 and height position information SH1 obtained by the first height position measurement unit. In this case, the calculation unit may read the height position information PH1 and height position information SH1 from the height position measurement information storage unit. With this configuration, the height position information obtained by the measurement by the first height position measurement unit can be reliably transmitted to the calculation unit.

[0022] The circuit board may be marked with identification information to individually identify the circuit board. The first height position measurement unit may store the height position information PH1 and height position information SH1 obtained by the first height position measurement, along with the identification information, in the height position measurement information storage unit. Furthermore, the calculation unit may read the identification information, height position information PH1, and height position information SH1 from the height position measurement information storage unit. With this configuration, appropriate height position information PH1 and height position information SH1 can be reliably transmitted to the calculation unit.

[0023] The solder precoat forming unit may include a solder paste supply unit that supplies solder paste onto the land, and a heating unit that forms a solder precoat on the land by heating the solder paste. With this configuration, since the solder precoat is formed using solder paste, the manufacturing cost of the mounted substrate can be reduced.

[0024] In a typical example, the solder precoat has solder paste residue on its surface. In this case, the first height position measuring unit may measure the height of the top surface of the residue. In this configuration, the solder precoat covered with residue is measured by the first height position measuring unit. This eliminates the need for equipment to remove the residue from the surface of the solder precoat, thereby simplifying the mounted substrate manufacturing equipment and the mounted substrate manufacturing process.

[0025] Flux residue is formed when the flux in the solder paste is modified and hardened by heating. Unlike the flux before hardening, the residue has low light transmittance. Therefore, the height of the residue surface can be measured optically more accurately than with the flux before hardening.

[0026] In general electronic component mounting, it is preferable to remove flux residue by washing. However, this requires a washing process using a washing device, and may also require a drying process using a drying device. Therefore, when flux residue is washed away, the mounting system for electronic components becomes long and complex. In addition, the time required for mounting electronic components increases. In the manufacturing apparatus of this embodiment and the manufacturing method (M) of this embodiment described later, it is possible to mount electronic components without removing flux residue. Therefore, the equipment and processes required for removing flux residue can be omitted.

[0027] The manufacturing apparatus (D1) may further include a solder flux application unit positioned between a first substrate holding unit and a second substrate holding unit. This solder flux application unit applies solder flux onto the solder precoat of the substrate. The second height position measuring unit may acquire height position information SH2 by performing a second height position measurement on the portion of the substrate not covered with solder flux. With this configuration, accurate measurement is possible because the surface of the substrate not covered with solder flux is measured.

[0028] (Manufacturing equipment (D2)) The manufacturing apparatus (D2) is an apparatus for manufacturing a mounted circuit board that includes a substrate having lands and electronic components soldered to the lands. The manufacturing apparatus (D2) includes a substrate transport line for transporting substrates having lands, a solder pre-coat forming unit for forming a solder pre-coat on the lands, a substrate holding unit for holding the substrate transported from the solder pre-coat forming unit by the substrate transport line, a height position measuring unit for acquiring height position information PH2 regarding the height position of the upper surface of the solder pre-coat on the substrate held by the substrate holding unit by height position measurement, an electronic component mounting unit for mounting electronic components on the solder pre-coat of the substrate held by the substrate holding unit using a component holder, and a calculation unit for calculating a target height position when the component holder holding the electronic component descends toward the substrate in order to mount the electronic component onto the solder pre-coat, using the height position information PH2. The electronic component mounting unit controls the lifting and lowering operation of the component holder based on the target height position to mount the electronic component onto the solder pre-coat.

[0029] Since manufacturing equipment (D2) can be implemented using some or all of the components of manufacturing equipment (D1), redundant explanations may be omitted. Manufacturing equipment (D2) provides the same effects as manufacturing equipment (D1).

[0030] The manufacturing apparatus (D2) may further include a solder flux application section positioned between the solder precoat forming section and the substrate holding section. The solder flux application section may apply solder flux onto the solder precoat of the substrate. The height position measurement section may acquire height position information PH2 by measuring the height position of the solder precoat covered with solder flux. In this case, the height position measurement section may use laser light to measure the height position.

[0031] (Manufacturing method for mounted circuit boards) The manufacturing method of this embodiment is a method for manufacturing a mounting board on which multiple electronic components are mounted. Two examples of the manufacturing method of this embodiment will be described below. These two examples may be referred to as "manufacturing method (M1)" and "manufacturing method (M2)". Since manufacturing method (M1) and manufacturing method (M2) correspond to manufacturing apparatus (D1) and manufacturing apparatus (D2), respectively, redundant explanations may be omitted. According to manufacturing method (M1) and manufacturing method (M2), the same effects as those of manufacturing apparatus (D1) and manufacturing apparatus (D2) can be obtained.

[0032] (Manufacturing method (M1)) Manufacturing method (M1) is a method for manufacturing a mounted substrate that includes a substrate having lands and electronic components soldered to the lands. Manufacturing method (M1) includes, in this order: a solder precoat formation step of forming a solder precoat on the lands; a first height position measurement step of acquiring height position information PH1 relating to the height position of the upper surface of the solder precoat and height position information SH1 relating to the height position of the upper surface of the substrate by first height position measurement while the substrate with the solder precoat formed is held by a first substrate holding part; a second height position measurement step of acquiring height position information SH2 relating to the height position of the upper surface of the substrate by second height position measurement while the substrate that has undergone the first height position measurement step is held by a second substrate holding part; and an electronic component mounting step of mounting electronic components on the solder precoat of the substrate held by the second substrate holding part using a component holder. Between the second height measurement step and the electronic component mounting step, a calculation step is further included in which the component holder, which holds the electronic component, calculates the target height position when it descends toward the substrate to mount the electronic component onto the solder precoat, using height position information PH1, height position information SH1, and height position information SH2. In the electronic component mounting step, the raising and lowering operation of the component holder is controlled based on the target height position calculated in the calculation step, and the electronic component is mounted onto the solder precoat.

[0033] The manufacturing method (M1) may further include a height position information storage step in which the height position information PH1 and height position information SH1 obtained by the first height position measurement step are stored in a height position measurement information storage unit. In that case, the height position information PH1 and height position information SH1 may be read from the height position measurement information storage unit in the calculation step.

[0034] In the manufacturing method (M1), the substrate may be marked with identification information for individual identification of the substrate. In that case, in the first height position measurement step, the height position information PH1 and height position information SH1 obtained by the first height position measurement may be stored in the height position measurement information storage unit together with the identification information. In that case, in the calculation step, the identification information, height position information PH1, and height position information SH1 may be read from the height position measurement information storage unit.

[0035] In the manufacturing method (M1), the solder precoat formation step may include a solder paste supply step of supplying solder paste onto a land, and a heating step of forming a solder precoat on the land by heating the solder paste.

[0036] In a typical example, the solder precoat has solder paste residue on its surface. In the manufacturing method (M1), the height of the top surface of the residue may be measured in the first height position measurement step.

[0037] The manufacturing method (M1) may further include a solder flux application step between the first height position measurement step and the second height position measurement step. The solder flux application step is a step of applying solder flux onto the solder precoat of the substrate. In the second height position measurement step, height position information SH2 may be obtained by performing a second height position measurement on the portion of the substrate not covered with solder flux.

[0038] (Manufacturing method (M2)) Manufacturing method (M2) is a method for manufacturing a mounted circuit board that includes a substrate having lands and electronic components soldered to the lands. Manufacturing method (M2) includes, in this order, a solder precoat formation step of forming a solder precoat on the lands, a height position measurement step of acquiring height position information PH2 regarding the height position of the upper surface of the solder precoat by height position measurement while the substrate with the solder precoat formed is held by a substrate holder, and an electronic component mounting step of mounting electronic components on the solder precoat of the substrate held by the substrate holder using a component holder. Manufacturing method (M2) further includes a calculation step between the height position measurement step and the electronic component mounting step of calculating a target height position when the component holder holding the electronic component descends toward the substrate in order to mount the electronic component onto the solder precoat, using the height position information PH2. Then, in the electronic component mounting step, the raising and lowering operation of the component holder is controlled based on the target height position so that the electronic component is mounted on the solder precoat.

[0039] The manufacturing method (M2) may further include a solder flux application step between the solder precoat formation step and the electronic component mounting step. The solder flux application step is a step of applying solder flux onto the solder precoat of the substrate. In the height position measurement step, height position information PH2 may be obtained by performing height position measurement on the solder precoat covered with solder flux.

[0040] In the manufacturing method (M2), the height position measurement process may be performed using laser light.

[0041] Hereinafter, examples of the manufacturing apparatus and manufacturing method of the present invention will be specifically described with reference to the drawings. The components of the manufacturing apparatus and the processes of the manufacturing method described below can be applied to the components and processes described above. Furthermore, the components of the manufacturing apparatus and the processes of the manufacturing method described below can be modified based on the above description. In addition, the matters described below may be applied to the above embodiments. Furthermore, in the embodiments described below, components and processes that are not essential to the manufacturing apparatus and manufacturing method of the present invention may be omitted. Note that in the following drawings, some components and some reference numerals may be omitted in order to facilitate understanding.

[0042] (Embodiment 1) Embodiment 1 describes an example of a manufacturing apparatus (D1) and an example of a manufacturing method (M1). The configuration of the mounted substrate manufacturing apparatus 10 of Embodiment 1 is schematically shown in Figure 1. The manufacturing apparatus 10 is an example of the manufacturing apparatus (D1) described above. The manufacturing apparatus 10 includes a substrate transport line 11, an information processing device 20, a loader 50, a solder pre-coat formation unit 90, a solder pre-coat inspection device 300, a flux application device (flux application unit) 400, electronic component mounting devices (electronic component mounting units) 501 and 502, a mounting condition inspection device 600, a reflow device 700, a substrate inspection device 800, and an unloader 900. These are arranged in this order from upstream to downstream. Known configurations may be applied to configurations other than those specific to the present invention. Hereinafter, the electronic component mounting devices 501 and 502 may be collectively referred to as "electronic component mounting device 500".

[0043] The substrate transport line 11 transports the substrate 1 (described later) from the solder pre-coat forming unit 90 to the substrate inspection device 800. The substrate transport line 11 does not have to be a single continuous line, and may be composed of multiple transport lines. A known substrate transport line can be used for the substrate transport line 11.

[0044] Figure 2 schematically shows the configuration of the manufacturing apparatus 10, which handles the operation of each part (each device) and the processing of information. The information processing device 20 is connected to each part (each device). The information processing device 20 includes an arithmetic processing device 20a and a storage device 20b. The solder pre-coat inspection apparatus 300 includes an arithmetic processing device 302a and a storage device 302b, which constitute the control unit. The electronic component mounting apparatus 501 includes an arithmetic processing device 501a and a storage device 501b, which constitute the control unit. The arithmetic processing device 20a, storage device 20b, arithmetic processing device 302a, storage device 302b, arithmetic processing device 501a, and storage device 501b either include the parts shown in Figure 2 or function as the parts shown in Figure 2. The electronic component mounting apparatus 502 also includes an arithmetic processing device and a storage device, similar to the electronic component mounting apparatus 501.

[0045] The above-mentioned processing unit consists of a CPU (Central Processing Unit), etc. The above-mentioned storage device consists of one or more RAMs (Random Access Memory) or hard disks, etc. These may consist of individual circuits or LSIs (Large-Scale Integrated Circuits), or they may be configured as a single unit. The information processing device 20 is connected to other devices included in the mounted substrate manufacturing apparatus 10 (including the solder pre-coat formation unit 90, solder pre-coat inspection apparatus 300, flux application apparatus 400, electronic component mounting apparatus 500, and reflow apparatus 700) via a local area network 20N, such as wired or wireless connections. The information processing device 20 exchanges data with these devices. In doing so, the information processing device 20 manages the processes performed in the mounted substrate manufacturing apparatus 10.

[0046] The storage device of the information processing device 20 stores the programs and data necessary for each device of the mounted circuit board manufacturing device 10. For example, the data necessary for the electronic component mounting devices 501 and 502 includes mounting programs, control parameters, and work information. The mounting program is a program that includes the coordinates of the mounting points on the circuit board 1 (mounting coordinates of the electronic components 4), information on the electronic components 4 to be mounted at the mounting points, the supply position of the electronic components 4, and the mounting order on the circuit board 1. The control parameters are information necessary for controlling the operation of the electronic component mounting devices 501 and 502 (for example, speed and acceleration). The work data includes at least component information and circuit board information. The electronic component information includes data on the shape and dimensions (width, length, thickness) of the electronic components. In addition, the circuit board information includes data on the size and thickness of the circuit board, as well as the coordinates of reference marks. The data necessary for the solder pre-coat inspection device 300 includes a measurement program that includes the coordinates of the measurement points on the circuit board 1. The data required for the mounting condition inspection device 600 includes inspection data such as the coordinates of the inspection target (electronic components) on the substrate 1, the judgment criteria used for inspection, and image processing parameters. The data required for the reflow apparatus 700 includes data such as the set temperature of the heating device for heating the substrate and the transport speed of the substrate 1. The information processing device 20 transmits (downloads) these programs and data to each device that makes up the mounted substrate manufacturing apparatus 10 before operation begins. Each device downloads the programs and data from the information processing device 20 and stores them in the control unit of that device. The control unit of each device is equipped with an arithmetic processing unit composed of a CPU and a storage device composed of one or more RAMs (random access memory) or hard disks, and each device executes predetermined processing and operations based on the downloaded programs and data.

[0047] The loader 50 supplies substrates stored in racks (not shown) to the solder pre-coat formation unit 90. The unloader 900 collects the completed mounted substrates into the racks. Each device from the solder pre-coat formation unit 90 to the substrate inspection device 800 includes a conveyor (substrate transport line 11) for transporting substrates. Each conveyor is positioned to receive substrates from the upstream device (loader 50 side) and transfer them to the downstream device (unloader 900 side).

[0048] Next, the following will be described about the components (devices) that make up the mounted circuit board manufacturing apparatus 10: the solder precoat formation unit 90, the solder precoat inspection device 300, and the electronic component mounting device 500.

[0049] (Solder precoat formation area) Figure 3 schematically shows the configuration of the solder pre-coat forming section 90 of Embodiment 1. In this specification, the direction along which the substrate 1 is transported is defined as the X-axis, the perpendicular direction as the Z-axis, and the direction perpendicular to the X-axis and Z-axis as the Y-axis. The directions along each of these axes are referred to as the X direction, Y direction, and Z direction.

[0050] The solder pre-coat forming unit 90 is a device for forming a solder pre-coat on a substrate 1. As shown in Figure 3, the solder pre-coat forming unit 90 includes a control unit 95, a solder paste supply unit 100, a heating unit 210, and a cooling unit 220. These are arranged in a line along the X-axis on a base 101. Inside these is a substrate transport unit 230 that transports the substrate along the X-axis. The transport unit 230 constitutes part of the substrate transport line 11.

[0051] The solder paste supply unit 100 supplies solder paste to the substrate 1. The heating unit 210 heats the solder paste supplied to the substrate 1 to melt the solder particles contained in the solder paste. The cooling unit 220 cools and solidifies the melted solder particles (hereinafter sometimes referred to as "molten solder"). The substrate transport unit 230 transports the substrate 1 in the order of solder paste supply unit 100, heating unit 210, and cooling unit 220. Inside the base 101, a control unit 95 for controlling the solder precoat forming unit 90 is arranged. The control unit 95 controls the solder paste supply unit 100, heating unit 210, cooling unit 220, and substrate transport unit 230 to cause the solder precoat forming unit 90 to perform the work of forming a solder precoat on the substrate 1. Thus, the solder precoat forming unit 90 of the present invention is a device that integrally includes the solder paste supply unit 100 and heating unit 210 necessary for solder precoat formation.

[0052] (Solder paste supply department) The solder paste supply unit 100 shown in Embodiment 1 supplies solder paste onto the substrate 1 by screen printing. The solder paste contains solder (solder alloy) particles and flux. Note that the solder paste may be supplied by methods other than screen printing. For ease of understanding, Figure 3 shows an example in which the substrate 1 is placed on the solder paste supply unit 100, the heating unit 210, and the cooling unit 220, respectively.

[0053] The solder paste supply unit 100 includes a movable table 102, a lifting mechanism 103, a printing stage 104, a printing head 113, a camera unit 115, and a mask plate (mask) 116, a printing stage conveyor (first substrate transport unit) 231, a substrate input conveyor 234, and a substrate relay conveyor (second substrate transport unit) 232.

[0054] Figures 4 and 5 show schematic diagrams of the area around the printing stage 104 and print head 113 as viewed from the substrate loading conveyor 234 side.

[0055] A pair of support frames 91 are erected on the base 101 at intervals in the X direction. A mobile table 102 is placed on the base 101, sandwiched between the support frames 91. A lifting mechanism 103 for raising and lowering the printing stage 104 is mounted on the mobile table 102. The mobile table 102 moves the printing stage 104 horizontally by moving the lifting mechanism 103 horizontally (along the X and Y axes, and in the direction of rotation in the horizontal plane with the Z axis as the axis of rotation; the same applies hereinafter). The lifting mechanism 103 moves the printing stage 104 along the Z axis, i.e., raises and lowers it.

[0056] The printing stage 104 includes a base 104a connected to a lifting mechanism 103. A support column 104b is provided on the upper surface of the base 104a. A substrate guide 104c extending along the X-axis is connected to the upper end of the support column 104b. Inside the substrate guide 104c is a printing stage conveyor 231, which includes a belt for transporting the substrate 1.

[0057] The printing stage conveyor 231 is capable of transferring the substrate 1 between a substrate input conveyor 234, which is installed through the opening of one support frame 91, and a substrate relay conveyor 232, which is installed through the opening of the other support frame 91. The substrate 1, which is brought in by the substrate input conveyor 234, is transferred to the printing stage conveyor 231 and transported to the solder paste supply area PA, where it is held by the printing stage 104. After the solder paste has been supplied to the substrate 1 at the printing stage 104, the substrate 1 is discharged from the solder paste supply area PA of the printing stage conveyor 231 and transferred to the substrate relay conveyor 232.

[0058] A backup lifting mechanism 104e is positioned on the upper surface of the base 104a. The backup lifting mechanism 104e raises and lowers the backup section 104f, which supports the substrate 1 from below. When the substrate 1 is loaded into the solder paste supply area PA of the printing stage conveyor 231, the backup section 104f is raised to support the lower surface of the substrate 1 with the backup section 104f.

[0059] Each of the two substrate guides 104c is provided with a side clamper 104d extending along the X-axis on its upper surface. The side clamper 104d is opened and closed by a drive mechanism (not shown). The backup unit 104f supports the lower surface of the substrate 1 and simultaneously raises the substrate 1 to a height where the upper surface of the substrate 1 and the upper surface of the side clamper 104d are aligned. When the side clamper 104d closes when the height of the substrate 1 and the side clamper 104d are aligned, both sides of the substrate 1 are clamped by the side clamper 104d, and the substrate 1 is fixed in place. In this way, the printing stage 104 holds the substrate 1.

[0060] A support beam 113a supporting the print head 113 is positioned at the upper end of a pair of support frames 91 so as to be movable in the Y direction via a linear guide mechanism 11a. One end of the support beam 113a is connected to a well-known print head moving mechanism 91b, which consists of a lead screw and a motor that rotates it. When the print head moving mechanism 91b is driven, the print head 113 reciprocates in the Y direction, which is the squeegeeing direction.

[0061] As shown in Figure 4, the print head 113 is equipped with a rear squeegee 113b and a front squeegee 113c that extend downward from the support beam 113a. By driving the squeegee drive unit 113d provided on the upper surface of the support beam 113a, either the rear squeegee 113b or the front squeegee 113c descends depending on the squeegeeing direction.

[0062] A mask plate 116 is positioned horizontally below the print head 113. The mask plate 116 has an opening 116a (see Figure 6) that penetrates in the thickness direction. The solder paste supply unit 100 performs screen printing by moving the solder paste P (described later) supplied to the upper surface of the mask plate 116 with either a rear squeegee 113b or a front squeegee 113c to supply the solder paste P onto the substrate 1 in a predetermined print pattern. The solder paste P includes a solder alloy and flux.

[0063] A camera unit 115 is positioned below the mask plate 116 (see Figure 3). The camera unit 115 is movable in the X and Y directions by a well-known camera movement mechanism (not shown) fixed to the support frame 91. The camera unit 115 incorporates a camera that photographs the substrate 1 and the mask plate 116 held on the printing stage 104. A substrate reference mark (not shown) is formed on the surface of the substrate 1 to recognize the position of the substrate 1. Similarly, a mask reference mark or hole is formed on the mask plate 116 for the same purpose. The control unit 95 uses the camera unit 115 to photograph the substrate reference mark and the mask reference mark to acquire images, and performs image recognition on the acquired images to calculate the relative positional misalignment between the substrate 1 and the mask plate 116. Then, it drives the moving table 102 to adjust the position of the printing stage 104 so that the positional misalignment between the two is zero or minimized, thereby aligning the substrate 1 and the mask plate 116.

[0064] (heating part) Next, the configuration of the heating unit 210 will be described. The heating unit 210 includes a housing 213 that covers the downstream side of the substrate relay conveyor 232 extending from the solder paste supply unit 100, and a substrate heating device 211 and a local heating device 212 (heating device) arranged inside the housing 213. The housing 213 has ventilation holes 215 formed therein for exhausting volatile components from the solder paste generated by heating.

[0065] The local heating device 212 is positioned above the substrate relay conveyor 232 and is movable horizontally by a moving mechanism 216 located in the housing 213. The local heating device 212 can be any device that heats the substrate 1 or the solder paste P locally, such as microwave heating or induction heating. A heating region HA is provided on the substrate relay conveyor 232, and the local heating device 212 locally heats a portion of the solder paste P on the substrate 1 located in the heating region HA to melt the solder contained in that portion of the solder paste P. The substrate heating device 211 is positioned below the substrate relay conveyor 232 and heats the entire substrate 1 located in the heating region HA from below. Heating by the substrate heating device 211 is auxiliary heating of the substrate 1 to facilitate the melting of the solder by the local heating device 212. Note that if the solder in the solder paste P can be melted without the substrate heating device 211, the substrate heating device 211 may be omitted.

[0066] On the substrate relay conveyor 232, the substrate 1, which has been supplied with solder paste P by the solder paste supply unit 100, is received and transported to the heating area HA. ​​Then, when the solder melting by the local heating device 212 is complete, the substrate 1 is transported out of the heating area HA and sent to the cooling unit 220, which will be described later. In this embodiment, the substrate relay conveyor 232 serves as a second substrate transport unit that transports the substrate 1 in the heating area HA where heating by the heating device takes place. The substrate relay conveyor 232 extends from the solder paste supply unit 100 to the heating unit 210 and is shared by both units. This allows for smooth transport of the substrate 1 from the solder paste supply unit 100 to the heating unit 210, thereby simplifying and miniaturizing the solder precoat manufacturing apparatus. The substrate relay conveyor 232 may also be composed of multiple substrate transport conveyors divided into sections that pass through the heating area HA and sections that do not.

[0067] (cooling section) Next, the configuration of the cooling unit 220 will be described. The cooling unit 220 includes a housing 224 that covers the substrate discharge conveyor 233 and a cooling fan (cooling device) 221 located inside the housing 224. The housing 224 has ventilation holes 220a and 220b for introducing and discharging cooling air. By operating the cooling fan 221, the substrate 1 on the substrate discharge conveyor 233 is cooled. This cools and solidifies the solder that has melted in the heating unit 210. In this embodiment, the substrate discharge conveyor 233 constitutes a part of the substrate transport unit 230.

[0068] Referring to Figure 6, the solder precoat formation process will be described. As shown in Figure 6, the substrate 1 includes a plate-like portion 1a and a plurality of lands 1b formed on the plate-like portion 1a. The lands 1b are part of the wiring pattern and are the areas where the solder precoat is formed.

[0069] In forming the solder precoat, first, a mask plate 116 is placed on the substrate 1, as shown in Figure 6A. As shown in Figure 6A, the mask plate 116 has a plurality of openings 116a. The positions of the openings 116a correspond to the positions of the lands 1b. However, in the example shown in Embodiment 1, the openings 116a are larger than the corresponding lands 1b. That is, the area of ​​the openings 116a is larger than the area of ​​the corresponding lands 1b. Therefore, when the substrate 1 is perfectly aligned with the mask plate 116 in an ideal state, the lands 1b are located inside the openings 116a.

[0070] If the size of the land 1b is small, and an opening 116a having the same shape (i.e., the same area) as the land 1b is used, there may not be enough solder particles to fill the opening 116a by screen printing. To avoid this, it is conceivable to use solder paste with very small solder particle sizes, but in that case, expensive solder paste must be used. Therefore, by using an opening 116a that is larger than the area of ​​the corresponding land 1b, as in this embodiment, it is possible to solve the problems of insufficient solder and cost. Note that the size of the opening 116a may be less than or equal to the size of the land 1b.

[0071] Next, the solder paste P on the upper surface of the mask plate 116 is moved across the mask plate 116 using the rear squeegee 113b or the front squeegee 113c. As a result, as shown in Figure 6B, a portion of the solder paste P that has passed through the opening 116a fills the opening 116a.

[0072] Next, the substrate 1 is separated from the mask plate 116 by driving the lifting mechanism 103. Figure 6C shows the substrate 1 after the mask plate 116 has been separated. Solder paste P is placed on the land 1b.

[0073] Subsequently, the substrate 1 is transported to the heating region HA within the heating unit 210. The substrate 1 transported to the heating region HA is heated by the substrate heating device 211. Heating by the substrate heating device 211 is auxiliary heating to facilitate the melting of the solder by the local heating device 212. The control unit 95 heats the solder paste P on the substrate 1 located in the heating region HA with the local heating device 212 to melt the solder contained in the solder paste P. After a predetermined time has elapsed since heating by the substrate heating device 211, the control unit 95 operates the moving mechanism 216 to sequentially position the local heating device 212 opposite the solder paste P supplied to the substrate 1. As a result, the solder in the solder paste P melts and spreads across the surface of the land 1b. Even if the solder paste P becomes connected between adjacent land 1b, the local heating device 212 melts the solder on the land 1b first, so the solder between the land 1b is attracted to the molten solder. Therefore, so-called solder bridges, where molten solder connects between lands 1b, do not occur.

[0074] Once the solder melting process by the local heating device 212 is complete, the control unit 95 operates the substrate relay conveyor 232 and the substrate discharge conveyor 233 to transport the substrate 1 to the cooling unit 220. The cooling unit 220 operates the cooling fan 221 to blow air taken in through the ventilation holes 220a and / or 220b onto the substrate 1 for cooling. If there is no need to specially cool the substrate 1, the cooling by the cooling unit 220 may be omitted.

[0075] The cooled substrate 1 is discharged from the cooling unit 220 by driving the substrate discharge conveyor 233. In this way, solder precoat 2 is formed on the lands 1b on the substrate 1 (Figure 6D). The substrate 1 with the solder precoat 2 formed is transported to the solder precoat inspection device 300 by the substrate transport line 11.

[0076] (Solder pre-coat inspection device) Figure 7 schematically shows the configuration of the solder pre-coat inspection device 300. The inspection device 300 is a device for inspecting whether the solder pre-coat 2 is properly formed. The inspection device 300 includes an inspection head 310, a first substrate holding unit 320, and a substrate transport conveyor 330. The inspection head 310 includes a measuring instrument for measuring the height position (first height position measuring unit) and a camera unit. The inspection head 310 is movable in the horizontal direction by a well-known XY moving device (not shown). The first height position measuring unit includes a distance sensor and a displacement sensor and measures the height position non-contact.

[0077] The substrate transport conveyor 330 is mounted on a pair of substrate guides 331 that extend parallel to the X direction. The substrate transport conveyor 330 constitutes part of the substrate transport line 11.

[0078] The first substrate holding section 320 includes a lifting platform 321, a plurality of backup pins 322 extending vertically upward from the lifting platform 321, and an upper surface retainer 323. The lifting platform 321 moves up and down by a lifting mechanism 324.

[0079] The first substrate holding portion 320 may have a structure other than the one shown, as long as it can hold the substrate 1, and may also include other structures in addition to the structure shown.

[0080] The processing of the substrate 1 in the solder pre-coat inspection apparatus 300 will be explained with reference to Figures 8 to 10. First, the substrate 1 is brought into the inspection apparatus 300 and held (step S301). The substrate 1 is transported by the substrate transport conveyor 330 to the work area W1 (first work position) inside the apparatus, where it is held by the first substrate holding part 320. Figure 9A shows the state before fixing the substrate 1, and Figure 9B shows the state after the substrate 1 has been fixed. As shown in Figure 9B, when fixing the substrate 1, the backup pins 322 are raised. The raised backup pins 322 contact the lower surface of the substrate 1, raising the substrate 1. The upper surface retainer 323 presses down on the upper surface of the substrate 1 that has been raised by the backup pins 322. By raising the backup pins 322, the substrate 1 is fixed between the backup pins 322 and the upper surface retainer 323.

[0081] The data necessary for processing board 1 (such as board information related to board 1) may be pre-stored in the storage device 302b of the inspection device 300, or it may be downloaded from the storage device 20b of the information processing device 20 and stored in the storage device 302b.

[0082] Next, the reference marks 1r on the substrate 1 are recognized under the control of the arithmetic processing unit 302a (step S302). Specifically, the substrate 1 is photographed by the camera unit, and recognition processing is performed on the captured image to recognize the reference marks 1r. A top view of an example of the substrate 1 is shown in Figure 10. Multiple reference marks 1r are formed on the substrate 1. From the positions of the multiple reference marks 1r obtained by the recognition processing, information on the horizontal position of the substrate 1 held by the first substrate holding unit 320, that is, the position of the measurement point set on the substrate 1, is obtained. The inspection head 310 measures the height position of the measurement point set at a predetermined horizontal position, and at that time, the horizontal position of the inspection head 310 is adjusted based on the horizontal position information of the substrate 1.

[0083] Next, the height position measurement processing unit of the arithmetic processing unit 302a controls the first height position measurement unit (inspection head 310) of the solder precoat inspection device 300 to acquire height position information PH1 relating to the height position of the upper surface of the solder precoat 2 and height position information SH1 relating to the height position of the upper surface of the substrate 1, which is held by the first substrate holding unit, by the first height position measurement (step S303). The acquired height position information PH1 and height position information SH1 are stored in the storage device 302b. At that time, the height position information PH1 and height position information SH1 are stored together with identification information that individually identifies the substrate 1.

[0084] In Figure 10, the measurement location ph1 of the height position information PH1 related to the height position of the upper surface of the solder precoat 2 is indicated by a black circle. The position of the measurement location ph1 is selected from, for example, a position near the center of the solder precoat 2 (e.g., the center). The height position information PH1 is a collection of height positions Hp of multiple measurement locations ph1 obtained in the first height position measurement. Also, in Figure 10, the measurement location sh1 of the height position information SH1 related to the height position of the upper surface of the substrate 1 is indicated by an × mark. The position of the measurement location sh1 is set at multiple locations, for example, a position away from the land 1b on which the solder precoat 2 is formed. The height position information SH1 is a collection of height positions H1 of multiple measurement locations sh1 obtained in the first height position measurement. In Figure 10, the center of the mounting position of the electronic component is indicated by a + mark. Note that solder resist is formed on the substrate 1, but the solder resist is not shown in Figure 10.

[0085] An example inspection head 310 includes a light-emitting element and a light-receiving element. The light-emitting element is, for example, a laser element, and the light-receiving element is, for example, an image sensor or a photodiode (position detection element). Light (e.g., laser light) emitted from the light-emitting element and reflected by the object to be measured is received by the light-receiving element. The light-receiving element outputs a signal corresponding to the position where the light is received. The height position of the measured location can be obtained from the output signal of the light-receiving element. To obtain an accurate height position, the solder pre-coat inspection device 300 has a reference height position set as the basis for height measurement, and an accurate height position can be obtained by associating the output signal of the light-receiving element with the reference height position. The surface of a component placed on the inspection device 300, such as the upper surface of the substrate guide 331, can be used as the height reference position. The height position of the measurement location may be a relative height with respect to the reference height position. These configurations are publicly known, and known technologies can be applied. Furthermore, not limited to the inspection head 310 described here, any height measuring instrument can be used as long as it can perform the measurements necessary for the present invention.

[0086] Next, the pass / fail determination unit of the arithmetic processing unit 302a calculates the thickness of the solder precoat from the measured values ​​(step S304). The acquisition of height position information PH1 and height position information SH1 and the calculation of the solder precoat thickness will be explained with reference to Figure 11.

[0087] In the inspection device 300, the height position Hp from the reference height H0 to the top surface of the solder precoat 2 is obtained by the first height position measurement. Since residue 2a is present on the surface of the solder precoat 2, each height position Hp may be a value indicating the height position of the top surface of the residue 2a. However, considering that the residue 2a on the top surface of the solder precoat 2 is an extremely thin film of only a few micrometers and may transmit light and not be detected as a height position depending on the material, there is no problem in treating the height position Hp as a value indicating the height position of the solder precoat 2.

[0088] Furthermore, the height position H1 from the reference height H0 to the upper surface of the solder resist 1s on the substrate 1 is also obtained by the first height position measurement. The substrate 1 is marked with identification information for the individual identification of the substrate 1. The height position measurement information storage unit of the storage device 302b of the inspection device 300 stores multiple height positions Hp (height position information PH1) and multiple height positions Hs (height position information SH1) obtained by the first height position measurement unit, as well as the identification information of the substrate 1 (height position information storage step). Note that it is sufficient to measure the height position of the upper surface of the substrate 1, so instead of measuring the height position of the upper surface of the solder resist 1s, the height position of the upper surface of the substrate 1 in the area where the solder resist 1s is not formed may be measured (the same applies to height position measurement in the electronic component mounting device 501).

[0089] The height position H1 is measured to estimate the height position of the upper surface of the substrate 1 where the solder precoat 2 is formed. Therefore, it is preferable that the measurement location sh1 be selected from the vicinity of the solder precoat 2. Furthermore, when estimating the shape of the upper surface of the substrate 1 from the measurement results, the number and position of the measurement locations sh1 are selected so that the shape can be appropriately estimated.

[0090] The calculation unit of the arithmetic processing unit 302a of the inspection device 300 reads height position information PH1 and height position information SH1 from the height position measurement information storage unit. The calculation unit of the arithmetic processing unit 302a then uses the read values ​​to calculate the thickness TP of the solder precoat 2. Specifically, the thickness TP of the solder precoat is obtained by the following formula (1). TP=Hp(ph1)-Hs(ph1)-HL···(1) Here, height position Hp(ph1) is the height from the reference height H0 at measurement point ph1 to the top surface of the solder precoat 2 (top surface of residue 2a). Height position Hs(ph1) is the height from the reference height H0 at measurement point ph1 to the top surface of substrate 1. Also, HL is the thickness of land 1b. The thickness of land 1b and the thickness Ds of solder resist 1s are obtained in advance as information for substrate 1.

[0091] Since a solder precoat 2 is present at measurement point ph1, it is impossible to directly measure the height position Hs(ph1) at measurement point ph1 with the inspection head 310. However, the height position Hs(ph1) can be approximated by the height position Hs(sh1) of the upper surface of substrate 1 at one of the nearby measurement points sh1. If a solder resist 1s is present at measurement point sh1, the thickness TP of the solder precoat can be calculated using equation (2). TP=Hp(ph1)-[H1(sh1)-Ds]-HL...(2) Here, H1(sh1) is the height position on the top surface of the substrate at measurement point sh1, so Hs(sh1) can be obtained by subtracting the thickness Ds of the solder resist 1s from H1(sh1). That is, if Hs(sh1) is considered as Hs(ph1), the thickness TP of the solder precoat can be determined from the height position information SH1 and PH1 obtained by the first height position measurement and the information of the substrate 1 (the thickness HL of the land 1b and the thickness Ds of the solder resist 1s). Alternatively, Hs(ph1) may be approximated by the average of the height positions Hs(sh1) on the top surface of the substrate 1 at multiple measurement points sh1 in the vicinity of measurement point ph1. In this case, the calculation formula can be obtained by replacing "H1(sh1)" in equation (2) with the average value of the height positions of multiple measurement points sh1. Alternatively, the shape of the top surface of the substrate 1 may be estimated from Hs(sh1) at multiple measurement points sh1, and Hs(ph1) may be calculated based on the estimated shape (virtual plane). Such estimation of a virtual plane can be performed by known methods. In this case, the calculation formula can be modified by replacing “Hs(ph1)” in equation (1) with Hs(ph1) estimated based on the virtual plane.

[0092] Next, the pass / fail determination unit of the arithmetic processing unit 302a determines whether the solder precoat 2 is pass or fail based on the calculated thickness TP of the solder precoat 2 (step S305). If the thickness TP of the solder precoat 2 is within a preset appropriate range, it is determined to pass; otherwise, it is determined to fail. A substrate 1 whose solder precoat 2 is determined to be unsuccessful is removed from the manufacturing equipment (D1) to correct the unsuccessful solder precoat 2, and after the correction is completed, it is put back into the solder precoat inspection equipment 300 and sent to the remaining processes. A substrate 1 whose solder precoat 2 is determined to be passable proceeds to the subsequent processes.

[0093] Next, the arithmetic processing unit 302a uploads inspection result information, including height position information PH1 and SH1, the pass / fail judgment result of the solder precoat 2, the calculated thickness TP of the solder precoat 2, and the identification information of the inspected substrate 1, to the storage device 20b of the information processing unit 20 (step S306). After the inspection of the solder precoat 2 is completed, the substrate 1 is released and the substrate 1 is discharged (step S307).

[0094] (Flux coating device) The substrate 1, inspected by the inspection device 300, is transported to the flux application device 400 via the substrate transport line 11. In the flux application device 400, flux for reflow soldering is applied to the solder precoat 2. There are no particular limitations on the method of applying the flux, and it may be applied by a known method (e.g., screen printing). The substrate 1 with the flux applied is transported to the electronic component mounting device 501 via the substrate transport line 11.

[0095] (Electronic component mounting device) Figure 12 schematically shows the configuration of the electronic component mounting device 501. Note that the electronic component mounting device 502 has the same configuration and functions as the electronic component mounting device 501, so redundant explanations are omitted.

[0096] The electronic component mounting device 501 mounts electronic components 4 onto a solder precoat 2 covered with flux (not shown). The electronic component mounting device 501 includes a substrate transport conveyor 521 for transporting substrates 1, a plurality of component supply units 580 arranged to the side of the substrate transport conveyor 521, a mounting head 542, and a second substrate holding unit 550. The substrate transport conveyor 521 is provided on a pair of substrate guides 520 extending parallel to the X direction. The substrate transport conveyor 521 constitutes part of the substrate transport line 11.

[0097] The substrate transport conveyor 521 supports both ends of the substrate 1 in the Y direction from below and is driven by a drive source (not shown) to transport the substrate 1 in the X direction. The middle section of the substrate transport conveyor 521 in the X direction is a work area W2 (second work position) where electronic components 4 are mounted on the substrate 1. Below this work area W2, a member (part of the substrate holding section 550) that supports the substrate 1 from below is arranged.

[0098] The substrate holding section 550 includes a plurality of backup pins 552 that support the lower surface of the substrate 1, a lifting platform 551 on which the backup pins 552 are arranged, a lifting section 553 that raises and lowers the lifting platform 551, and an upper surface retainer 554. When the backup pin lifting section 553 is driven while the substrate 1 is being transported into the work area W2 by the substrate transport conveyor 521, the backup pins 552 push up the substrate 1 and press the upper surfaces of both ends in the Y direction against the upper surface retainer 554. As a result, the substrate 1 is temporarily fixed in the work area W2, sandwiched from above and below by the plurality of backup pins 552 and the pair of upper surface retainers 554. The substrate transport conveyor 521 of the electronic component mounting device 501 transports the substrate 1 received from upstream into the work area W2 within the device and transports the substrate 1, on which the electronic components 4 have been mounted, to the device downstream.

[0099] The electronic component mounting device 501 includes a mounting head 542, a moving mechanism (not shown) for moving the mounting head 542 in the X and Y directions, a height position measuring unit 543, and a known substrate camera (not shown). The height position measuring unit 543 and the substrate camera are mounted on the mounting head 542 and move in the X and Y directions by the moving mechanism for moving the mounting head 542. The mounting head 542 incorporates a plurality of suction nozzles 541 for attracting and holding electronic components 4, and a nozzle driving mechanism (not shown) for lifting and lowering the suction nozzles 541 and rotating them around the Z axis. The mounting head 542 holds the electronic components 4 supplied by the component supply unit 580 with the suction nozzles 541 and performs the operation of mounting them on the solder precoat 2 to which flux has been applied. The height position measurement unit 543 (second height position measurement unit) acquires height position information SH2 relating to the height position of the upper surface of the substrate 1 held by the second substrate holding unit (substrate holding unit 550) by second height position measurement. The height position measurement unit 543 can be configured in the same way as the first height position measurement unit.

[0100] The operation of the electronic component mounting device 501 will be explained with reference to Figure 13. Figure 13 shows the workflow for mounting electronic components onto a single circuit board 1. First, the arithmetic processing unit 501a of the electronic component mounting device 501 downloads the necessary data from the storage device 20b of the information processing device 20 and updates the storage unit of the storage device 501b (step S501). The downloaded data should include at least the data necessary for calculating the target height position, which will be described later. In this embodiment, inspection result information is downloaded.

[0101] Next, the substrate 1 is loaded into the electronic component mounting device 501 under the control of the arithmetic processing unit 501a, and the substrate 1 is held by the second substrate holding unit (substrate holding unit 550) (step S502).

[0102] Next, the processing unit 501a controls the camera on the mounting head 542 to recognize the reference mark 1r on the substrate 1 (step S503). This allows the horizontal position of the substrate 1 held by the substrate holding unit 550 to be determined. Depending on the horizontal position of the substrate 1, the height position measurement of predetermined locations and the placement of electronic components 4 are performed.

[0103] Next, the substrate height position measurement processing unit of the arithmetic processing unit 501a acquires height position information SH2 relating to the height position of the upper surface of the substrate 1 held by the second substrate holding unit (substrate holding unit 550) by second height position measurement (step S504). The acquisition of height position information SH2 will be explained with reference to Figure 14.

[0104] The electronic component mounting device 501 measures the height of the top surface of the solder resist 1s at a predetermined measurement point sh2. Specifically, the height from the reference height H0 to the top surface of the solder resist 1s (height position H2(sh2)) is measured by the height position measurement unit 543 (second height position measurement). The height position information SH2 acquired in the second height position measurement includes the height positions H2(sh2) of multiple measurement points sh2.

[0105] To ensure consistency of measurement results between the solder precoat inspection device 300 and the electronic component mounting device 500, it is preferable to set measurement point sh2 to the same location as measurement point sh1. Furthermore, to avoid false detections due to solder flux 3, it is desirable to set measurement point sh2 to a location where solder flux 3 is not applied. That is, the second height position measurement unit may acquire height position information SH2 by performing a second height position measurement on a portion of the substrate 1 that is not covered with solder flux 3. By performing the measurement in a location where solder flux 3 is not applied, more accurate measurement becomes possible. Measurement point sh2 may also be a location where solder resist 1s is not formed.

[0106] Next, the calculation unit of the arithmetic processing unit 501a calculates the target height position NH when the suction nozzle 541 (component holder) descends toward the substrate 1 (step S505). Specifically, the arithmetic processing unit 501a calculates the target height position NH of the lowest end of the suction nozzle 541 when the suction nozzle 541, which has picked up the electronic component 4, places the electronic component 4 onto the solder precoat 2 (more specifically, on the solder precoat 2 to which solder flux 3 has been applied).

[0107] The target height position NH at the mounting point including the measurement point ph1 is calculated using the following formula (3) from the thickness TP of the solder precoat 2 obtained by the solder precoat inspection device 300, the height position Hs(ph1) on the upper surface of the substrate 1 at the measurement point ph1, the thickness HL of the land 1b, and the thickness TE of the electronic component 4. If there are multiple lands 1b at a single mounting point and multiple height positions Hs(ph1) are available, the highest height position Hs(ph1) is adopted, and the thickness TP of the solder precoat 2 at the measurement point ph1 where the adopted height position Hs(ph1) was measured is used in the calculation of the target height position NH. NH = Hs(ph1) + HL + TP + TE···(3)

[0108] Here, the height position Hs(ph1) of the upper surface of substrate 1 at measurement point ph1 can be approximated by the height position of one measurement point sh2 located near the mounting point that includes measurement point ph1. In this case, the target height position NH is obtained by equation (4). NH=[H2(sh2)-Ds]+HL+TP+TE···(4) Here, H2(sh2) is the height position at measurement point sh2, and Hs(sh2) can be obtained by subtracting the thickness Ds of the solder resist 1s from H2(sh2). Therefore, according to equation (4), the electronic component mounting device 500 can determine the target height position NH from the height position information SH2 obtained by the second height position measurement, the work information (thickness HL of land 1b, thickness Ds of solder resist 1s, thickness TE of electronic component 4), and the thickness TP of the solder precoat 2 included in the inspection result information downloaded in S501. The thickness TP of the solder precoat 2 is calculated using height position information PH1 related to the height position of the upper surface of the solder precoat 2 and height position information SH1 related to the height position of the upper surface of the substrate 1. In other words, equation (5) can be derived by applying equation (2) to equation (4). NH=H2(sh2)-H1(sh1)+Hp(ph1)+TE...(5) According to equation (5), the electronic component mounting device 500 can calculate NH from the height position information PH1 and SH1 obtained from the first height position measurement, the height position information SH2 obtained from the second height position measurement, and the dimensions (thickness) of the electronic component 4.

[0109] Furthermore, equations (3) and (4) above may include terms other than height position information and workpiece information, for example, terms that add or subtract some margin or parameters for deforming the elastic body that pushes the suction nozzle 541 toward the substrate 1 (the same applies to other embodiments).

[0110] In equations (4) and (5), “H2(sh2)” may be approximated by the average of the height positions Hs(sh2) of the upper surface of the substrate 1 at multiple measurement points sh2 in the vicinity of the mounting point including measurement point ph1. Alternatively, Hs(ph1) may be calculated based on a virtual plane estimated from the height positions Hs(sh2) at multiple measurement points sh2, and this may be applied to equation (3). Such estimation of a virtual plane can be performed by known methods. In addition, the inspection result information used in equations (3) to (5) includes identification information of the substrate 1 held in the second substrate holding part (substrate holding part 550).

[0111] Next, the electronic component mounting section of the arithmetic processing unit 501a controls the raising and lowering movement of the suction nozzle 541 (component holder) based on the calculated target height position to mount the electronic component 4 onto the solder precoat 2 (more specifically, onto the solder precoat 2 to which the solder flux 3 has been applied) (step S506). Specifically, the electronic component mounting section of the arithmetic processing unit 501a drives the nozzle drive mechanism based on the target height position NH to cause the suction nozzle 541 holding the electronic component 4 to descend toward the mounting point on the substrate 1. By controlling the movement of the suction nozzle 541 in this way, the electronic component 4 can be released at an appropriate height position. As a result, mounting defects of the electronic component 4 can be reduced.

[0112] A solder flux 3 is applied to the solder precoat 2 of the substrate 1 that is fed into the electronic component mounting device 501. It can be difficult to accurately measure the height of the upper surface of the solder precoat 2 to which the solder flux 3 has been applied. In Embodiment 1, the height of the upper surface of the solder precoat 2 is measured before the solder flux 3 is applied, making it possible to calculate the thickness of the solder precoat 2 more accurately. Therefore, according to the manufacturing apparatus and manufacturing method of Embodiment 1, electronic components 4 can be mounted on the solder precoat 2 with good yield and accuracy.

[0113] After the mounting of the electronic components 4 in the electronic component mounting device 501 is completed, the holding of the substrate 1 is released, and the substrate 1 is discharged from the electronic component mounting device 501 (step S507). In this way, the processing of the substrate 1 in the electronic component mounting device 501 is completed. The electronic components 4 are then mounted in the next electronic component mounting device 502 in the same manner.

[0114] Once all electronic components 4 have been mounted, the substrate 1 is transported to the mounting condition inspection device 600 via the substrate transport line 11. The mounting condition inspection device 600 inspects the mounting condition of the electronic components 4 on the substrate 1. Inspection items include mounting misalignment, incorrect orientation, presence or absence of electronic components 4, etc. The mounting condition inspection device 600 uses optical measuring devices such as cameras and three-dimensional measuring machines to recognize the mounting condition of the electronic components 4, such as mounting position, orientation, and presence or absence, and determines whether it meets predetermined criteria. If a substrate 1 is found to contain electronic components 4 that are not properly mounted, that substrate 1 may be excluded from subsequent processing. Alternatively, the mounting defect of the electronic component 4 may be corrected, and then subsequent processing may continue.

[0115] After inspection is complete, the substrate 1 is transported to the reflow apparatus 700 via the substrate transport line 11. The reflow apparatus 700 heats the substrate 1 on which the electronic components 4 are mounted to melt the solder precoat 2 and solder the electronic components 4 to the lands 1b. In this way, a mounted substrate 1x with the electronic components 4 mounted is manufactured.

[0116] After processing in the reflow machine 700, the assembled board 1x is transported by the board transport line 11 to the board inspection machine 800 for inspection. After inspection in the board inspection machine 800, the assembled board 1x is transported by the board transport line 11 to the unloader 900. The unloader 900 collects the completed assembled board 1x into a rack.

[0117] The entire manufacturing process of the mounted substrate 1x will be explained with reference to Figures 15A to 15E. First, the substrate 1 shown in Figure 15A is prepared. Substrate 1 includes lands 1b. Solder resist 1s is formed on the surface of substrate 1.

[0118] Next, as shown in Figure 15B, a solder precoat 2 is formed on the land 1b. The solder precoat 2 includes surface residue 2a. Note that the substrate 1 held by the substrate holder may undergo deformation such as warping. Therefore, in order to accurately mount the electronic components 4 in the electronic component mounting device 501, it is preferable to calculate the target height position while taking into account the warping of the substrate 1. According to the manufacturing apparatus and manufacturing method of the present invention, it is possible to calculate the target height position while taking into account the warping of the substrate 1.

[0119] Next, as shown in Figure 15C, solder flux 3 is applied to the solder precoat 2. Then, as shown in Figure 15D, the electronic component 4 is mounted on the solder precoat 2 to which the solder flux 3 has been applied. Next, as shown in Figure 15E, the solder precoat 2 is melted and then solidified to solder the land 1b and the terminal portion of the electronic component 4 together via solder 2x. In this way, a mounting board 1x with the electronic component 4 mounted is manufactured.

[0120] (Embodiment 2) Embodiment 2 describes an example of a manufacturing apparatus (D2) and an example of a manufacturing method (M2). The mounted substrate manufacturing apparatus and method of Embodiment 2 differ from those of Embodiment 1 only in the method of acquiring the target height position in the electronic component mounting section, so redundant explanations will be omitted. The configuration of the mounted substrate manufacturing apparatus of Embodiment 2 may be the same as the configuration of the mounted substrate manufacturing apparatus 10 of Embodiment 1.

[0121] The manufacturing apparatus of Embodiment 2 includes a height position measuring unit that acquires height position information PH2 relating to the height position of the upper surface of the solder precoat on a substrate held by a substrate holding unit, by height position measurement. The substrate holding unit and the height position measuring unit can be the same as those of the electronic component mounting apparatus 501 of Embodiment 1 (second substrate holding unit 550) and height position measuring unit (height position measuring unit 543). In other words, the electronic component mounting unit (electronic component mounting apparatus 500) of the manufacturing apparatus 10 of Embodiment 1 can be applied to the electronic component mounting unit in the manufacturing apparatus of Embodiment 2.

[0122] The operation of the electronic component mounting device 501 (electronic component mounting process) will be explained with reference to Figure 16. The same procedure can be applied to the operation of the electronic component mounting device 502.

[0123] First, the arithmetic processing unit 501a of the electronic component mounting device 501 downloads the necessary data and updates the storage unit of the storage device 501b (step S1501). The downloaded data includes the solder precoat inspection results, i.e., the pass / fail judgment results. However, in Embodiment 2, unlike Embodiment 1, values ​​related to the thickness of the solder precoat and data related to the height position obtained from the first height position measurement are not necessary for calculating the target height position. Therefore, these values ​​do not need to be downloaded.

[0124] Next, the circuit board 1 is loaded into the electronic component mounting device 501 under the control of the arithmetic processing unit 501a, and the circuit board 1 is held by the second circuit board holding unit (circuit board holding unit 550) (step S1502). Next, the arithmetic processing unit 501a controls the camera of the mounting head 542 to recognize the reference mark 1r on the circuit board 1 (step S1503). Steps S1502 and S1503 are the same processes as steps S502 and S503.

[0125] Next, the substrate height position measurement processing unit of the arithmetic processing unit 501a acquires height position information PH2 relating to the height position Hp of the upper surface of the solder precoat 2 on the substrate 1 held by the substrate holding unit by height position measurement (step S1504). The acquisition of height position information PH2 will be explained with reference to Figure 17.

[0126] In Embodiment 2, the height position Hp(ph1) of the upper surface (upper surface of the residue 2a) of the solder precoat 2 to which the solder flux 3 has been applied is acquired by the height position measurement unit 543 at measurement point ph1. Height position Hp(ph1) is a height relative to the reference height H0. Height position Hp(ph1) is height position information PH2. The position of measurement point ph1 is selected, for example, from a position near the center of the solder precoat 2 (for example, the center). As described above, the height position measurement unit 543 may perform the measurement using laser light.

[0127] Next, the calculation unit of the arithmetic processing unit 501a calculates the target height position NH when the suction nozzle 541 (component holder) descends toward the substrate 1 (step S1505). For example, the arithmetic processing unit 501a may calculate the target height position NH of the lowest end of the suction nozzle 541 when the suction nozzle 541, which has picked up the electronic component 4, moves the electronic component 4 onto the solder precoat 2 (more specifically, onto the solder precoat 2 to which the solder flux 3 has been applied) and releases the electronic component 4.

[0128] The target height position NH at measurement point ph1 is calculated from the measured height position Hp(ph1) and the thickness TE of the electronic component 4 using the following equation (6). NH = Hp(ph1) + TE···(6)

[0129] In the manufacturing apparatus and manufacturing method of Embodiment 2, it is not necessary to measure the height position of the upper surface of the substrate 1 in the electronic component mounting apparatus 501. Therefore, the time required for mounting electronic components can be shortened.

[0130] Next, as shown in Figure 18, the electronic component mounting section of the arithmetic processing unit 501a controls the raising and lowering movement of the suction nozzle 541 (component holder) based on the calculated target height position NH to mount the electronic component 4 onto the solder precoat 2 (more specifically, onto the solder precoat 2 to which the solder flux 3 has been applied) (step S1506). Step S1506 is the same as step S506.

[0131] After the mounting of the electronic component 4 in the electronic component mounting device 501 is completed, the holding of the substrate 1 is released, and the substrate 1 is removed from the electronic component mounting device 501 (step S1507). Step S1507 is the same as step S507. In this way, the mounting of the electronic component 4 in the electronic component mounting device 501 is carried out.

[0132] The substrate 1 on which the electronic component 4 is mounted is processed in the same manner as in Embodiment 1. In this way, in Embodiment 2 as well, a mounted substrate 1x on which the electronic component 4 is mounted is manufactured.

[0133] Thus, in the manufacturing apparatus (D2) of Embodiment 2, the height position Hp of the upper surface of the solder precoat 2 covered with solder flux 3 is acquired by the height position measurement unit 543. For this reason, in the manufacturing apparatus (D2), the usable solder flux 3 is limited to one that easily transmits light used for height position measurement. In this respect, it is a disadvantage compared to the manufacturing apparatus (D1) of Embodiment 1, but by measuring the height position of the solder precoat 2 in the electronic component mounting apparatus 500, it is advantageous in terms of productivity compared to the manufacturing apparatus (D1). [Industrial applicability]

[0134] This embodiment can be used in electronic component mounting devices and electronic component mounting methods. Although the present invention has been described in relation to preferred embodiments at present, such disclosure should not be interpreted restrictively. Various modifications and alterations will undoubtedly become apparent to those skilled in the art in the field to which the invention pertains by reading the above disclosure. Accordingly, the appended claims should be interpreted as encompassing all modifications and alterations without departing from the true spirit and scope of the invention. [Explanation of symbols]

[0135] 1: Circuit board 1b: Land 1x: Mounting board 2: Solder pre-coat 2a:Residue 2x: Solder 3: Solder flux 4: Electronic components 10: Assembly circuit board manufacturing equipment 11: PCB transport line 90: Solder precoat formation area 100: Solder paste supply unit 210: Heating section 320: First substrate holding part 500, 501, 502: Electronic component mounting device (electronic component mounting section) 550: Second substrate holding part

Claims

1. An electronic component mounting apparatus for mounting electronic components on a substrate having multiple lands on which a solder precoat has been formed, using a component holder, A substrate holding portion for holding the substrate, A height position measuring unit that acquires height position information SH2 relating to the height position of the upper surface of the substrate held by the substrate holding unit, A calculation unit calculates the target height position when the component holder, which holds the electronic component, descends toward the substrate to mount the electronic component onto the solder precoat, using height position information PH1 relating to the height position of the upper surface of the solder precoat, height position information SH1 relating to the height position of the upper surface of the substrate, and height position information SH2 measured by the height position measurement unit. Includes a mounting head that raises and lowers the component holder based on the target height position to mount the electronic component onto the solder precoat, The solder precoat is formed by melting solder paste supplied onto the land and has a residue of the solder paste on its surface, and the height position information PH1 is the height of the upper surface of the residue, in an electronic component mounting device.

2. The aforementioned substrate is provided with identification information for individually identifying the substrate, The calculation unit is stored in the height position measurement information storage unit together with the identification information by the solder precoat inspection device, and the height position information PH1 and the height position information SH1 obtained from the height position measurement information storage unit are used, as described in claim 1, for the electronic component mounting device.

3. The substrate holding portion holds the substrate on which solder flux has been applied to the solder precoat. The electronic component mounting apparatus according to claim 1, wherein the height position measuring unit acquires the height position information SH2 by measuring the height position of the portion of the substrate that is not covered with the solder flux.

4. The electronic component mounting apparatus according to claim 1, wherein the height position measuring unit acquires the height position information SH2 using laser light.

5. An electronic component mounting method for mounting electronic components on a substrate having multiple lands on which a solder precoat has been formed, using a component holder, The solder pre-coat inspection device measures height position information PH1 regarding the height position of the upper surface of the solder pre-coat and height position information SH1 regarding the height position of the upper surface of the substrate, and the substrate is held in the substrate holding unit. The height position of the upper surface of the substrate held by the substrate holder is measured to obtain height position information SH2. The target height position when the component holder holding the electronic component descends toward the substrate to mount the electronic component onto the solder precoat is calculated using the height position information PH1, the height position information SH1, and the height position information SH2. The process includes lowering the component holder holding the electronic component to the target height position and mounting the electronic component onto the solder precoat of the substrate held by the substrate holder, An electronic component mounting method wherein the solder precoat is formed by melting solder paste supplied onto the land and has a residue of the solder paste on its surface, and the height position information PH1 is the height of the upper surface of the residue.

6. The aforementioned substrate is provided with identification information for individually identifying the substrate, The method for mounting electronic components according to claim 5, wherein the target height position is stored in the height position measurement information storage unit together with the identification information by the solder precoat inspection device, and is calculated using the height position information PH1 and the height position information SH1 obtained from the height position measurement information storage unit.

7. The substrate holding portion holds the substrate on which solder flux has been applied to the solder precoat. The method for mounting electronic components according to claim 5, wherein the height position information SH2 is obtained by measuring the height position in the portion of the substrate that is not covered with solder flux.

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