Thermally conductive buffer for electronic devices

Abstract

To disclose a thermally conductive shock absorber for an electronic device.SOLUTION: An electronic device includes a housing, and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber includes an impact absorbing part, and a thermal conductive part that is in contact with at least a portion of the impact absorbing part.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure generally relates to hardware and / or software shocks, and more particularly to a thermal conductive buffer for an electronic device.

Background Art

[0002] An electronic device requires a thermal system to manage thermal conditions in order to maintain optimal efficiency. To manage the thermal conditions, the electronic device utilizes a thermal cooling system to cool the electronic components of the electronic device during use.

Brief Description of the Drawings

[0003] [Figure 1] An exemplary electronic device having an exemplary thermal management system configured in accordance with the teachings of the present disclosure.

[0004] [Figure 2] A cross-sectional view of the exemplary electronic device of FIG. 1 taken along line 2-2 of FIG. 1.

[0005] [Figure 3] A cross-sectional view of another exemplary electronic device having another exemplary thermal management system disclosed in the present specification.

[0006] [Figure 4] An exemplary electronic device having another exemplary thermal management system disclosed in the present specification.

[0007] [Figure 5] A cross-sectional view of the exemplary electronic device of FIG. 4 taken along line 5-5 of FIG. 4.

[0008] [Figure 6] A cross-sectional view of another exemplary electronic device having another exemplary thermal management system disclosed in the present specification.

[0009] [Figure 7]This is a schematic diagram of different heat conduction sections on which the exemplary thermal management system disclosed in this specification can be implemented.

[0010] [Figure 8] This specification discloses another exemplary electronic device having a different exemplary thermal management system.

[0011] [Figure 9] This is a cross-sectional view of an exemplary thermal management system disclosed in this specification.

[0012] [Figure 10A] This specification discloses another exemplary electronic device having a different exemplary thermal management system.

[0013] [Figure 10B] Figure 10A is a partially enlarged view of an exemplary electronic device.

[0014] [Figure 10C] Figure 10B is a partial cross-sectional perspective view of an exemplary thermal conductive buffer in an exemplary thermal management system. [Modes for carrying out the invention]

[0015] The drawings are not to scale. Generally, the same reference numerals are used throughout the drawings and any accompanying descriptions referring to the drawings or parts thereof. References to connections (e.g., attached, joined, connected, joined) should be considered broadly and, unless otherwise specified, may include intermediate members between sets of elements and relative movement between elements. Thus, references to connections do not necessarily presume that two elements are directly connected and have a fixed relationship with one another.

[0016] Descriptors such as “First,” “Second,” “Third,” etc., are used in this specification to identify multiple elements or components that may be referenced separately. Unless otherwise specified and as understood in the context in which they are used, such descriptors do not carry any meaning of priority, physical order, placement in a list, or temporal order, but are simply used as labels to refer to multiple elements or components individually in order to facilitate understanding of the disclosed examples. In some examples, the descriptor “First” may be used to represent an element in the detailed description, but the same element may be represented in the claims by different descriptors such as “Second” or “Third.” In such examples, it should be understood that such descriptors are simply used to facilitate reference to multiple elements or components.

[0017] During operation of an electronic device (e.g., a laptop, tablet, etc.), hardware components located within the device's body or enclosure, such as the processor, graphics card, and / or battery, generate heat. The heat generated by the hardware components of the electronic device can cause the temperature of one or more electronic components to exceed their operating temperature limits. In some cases, the heat generated by the electronic device can raise the temperature of the outer surface or skin of the device's housing, making it warm and potentially too hot to touch.

[0018] To prevent overheating of hardware components, damage to the device, and / or discomfort to the user of the device when touching it or placing one or more parts of the user's body near the device's skin and / or components accessible through the surface of the housing, such as a touchpad, an electronic device includes a thermal management system to dissipate heat from the electronic device. Exemplary thermal systems include active or passive cooling systems. Passive cooling systems are often used by processors with power not exceeding approximately 0 watts. Processors with power exceeding 10 watts often require active cooling systems to efficiently cool these processors below the desired operating temperature.

[0019] An active cooling system increases the rate of flow and the rate of heat removal by utilizing a forced convention method. For example, to discharge the heat or hot air generated within the electronic device body and cool the electronic device, the active cooling system may utilize external devices such as a fan or blower, a forced refrigerant liquid, a thermoelectric cooler, etc. In known electronic devices, the operation of the fan of the electronic device and / or the management of the power consumed by the device are controlled based on thermal constraints. For example, when the temperature of the hardware components of the device approaches the maximum temperature defined by the thermal constraints for the components, the rotational speed of the fan (e.g., revolutions per minute (RPM)) is increased to exhaust the hot air and lower the temperature of the components. However, the operation of the fan at high speeds increases the audible acoustic noise generated by the fan. In some known electronic devices, the fan speed, and thus the amount of cooling provided by the fan, may be restricted to avoid generating a fan noise level that exceeds a certain decibel (e.g., a maximum noise level of 35 dBA during the operation of the fan). As a result of the restricted fan speed, the performance of the device may be limited so that the fan can cool the user device within the range of the fan speed restriction. Further, the cooling system imposes additional space requirements and / or electrical usage. This results in a larger enclosure form factor and / or higher manufacturing costs.

[0020] A passive cooling system utilizes natural heat convection and heat dissipation by using a heat spreader or heat sink to increase (e.g., maximize) radiative and convective heat transfer. For example, the passive cooling system does not utilize external devices such as a fan or blower that forces air flow to exhaust heat from the enclosure of the electronic device. Instead, the passive cooling system relies on material properties to provide a heat transfer path between the electronic components of the electronic device and the outer surface or skin. The passive cooling system is significantly less expensive than an active cooling system, requires no power to operate, and provides the benefit of space savings.

[0021] Some exemplary electronic devices (e.g., laptops, tablets, etc.) provide improved durability for student use, business, construction sites, etc. A durable electronic device utilizes a chassis with a thicker wall structure to protect electronic components within the frame from mechanical shock and / or shock. Thus, a durable electronic device is structurally improved to improve shock resistance and thus reduce damage to the electronic components when, for example, the electronic device is dropped. To increase the strength of the frame, the chassis of a durable electronic device typically utilizes a wall structure between 2 millimeters and 8 millimeters. However, an improved wall structure presents a thermal challenge to the passive cooling system if the increased thickness of the frame reduces thermal conductivity. Thus, the low-cost thermal solution provided by the passive cooling system is often not efficient for durable electronic devices. Such devices often need to use an active thermal system to cool the electronic components. This significantly increases the manufacturing cost.

[0022] The exemplary devices disclosed in this specification provide a passive cooling system combined with shock resistance. The exemplary passive cooling system disclosed in this specification provides a physical heat transfer path between one or more electronic components of an electronic device and one or more outer skins of the electronic device, and a buffer material between the electronic components and the outer skins. The exemplary heat transfer path disclosed in this specification can be formed by having a heat transfer material (e.g., a graphite sheet) that physically or mechanically connects the electronic components of the electronic device to the outer skins of the electronic device. Furthermore, the exemplary shock-resistant material of the shown example is positioned between the electronic components and the outer skins to protect the electronic components from damage that may be caused by minor impacts. The exemplary electronic components (e.g., motherboard, battery, etc.), passive cooling system, frame, and outer skin of the electronic device disclosed in this specification provide a sandwich structure (e.g., a very rigid sandwich structure) that provides heat transfer capability and a strong structure against mechanical shock. Some exemplary passive cooling systems disclosed in this specification provide shock-resistant material placed inside the heat transfer material. Several exemplary passive cooling systems disclosed in this specification provide a plurality of buffers enclosed by a plurality of heat transfer units. Several exemplary passive cooling systems disclosed in this specification provide heat transfer materials positioned between spaced heat transfer materials.

[0023] Figure 1 shows an exemplary electronic device 100 configured in accordance with the teachings of this disclosure. The illustrated example electronic device is a personal computing device, such as a tablet. The illustrated example electronic device 100 includes a housing 102 and a display 104. The housing 102 defines a first side wall 102a, a second side wall 102b, a third side wall 102c, and a fourth side wall 102d. The housing 102 houses one or more electronic components and the display 104. To enable user input, the illustrated example display 104 provides a graphical user input device, a virtual keyboard, a virtual touchpad, etc. Although the illustrated example electronic device 100 is a tablet, in some examples the electronic device 100 may be a laptop, desktop, mobile device, cell phone, smartphone, hybrid or convertible PC, personal computing (PC) device, server, modular computer, digital picture frame, graphics computer, smart watch, and / or any other electronic device utilizing passive cooling.

[0024] Figure 2 is a cross-sectional view of the exemplary electronic device 100 of Figure 2, taken along line 2-2 of Figure 1, illustrating the exemplary thermal management system 200 disclosed in this specification. The housing 102 of the illustrated example includes a frame 202 (e.g., chassis) and a skin 204 (e.g., bottom skin, outer skin, D cover, etc.). The frame 202 and skin 204 define a cavity 206 that receives one or more hardware components 208. The skin 204 and / or display 104 of the illustrated example are attached to the frame 202 by adhesive (e.g., glue). However, in some examples, the skin 204 of the illustrated example may be attached to the frame 202 by mechanical fasteners, e.g., screws, clips, rivets; chemical fasteners, e.g., glue, plastic welding, etc.; and / or any other suitable fasteners. In some examples, the skin 204 may be formed integrally with the frame 202. The frame 202 and / or skin 204 in the illustrated example can be made of plastic, magnesium, aluminum, a combination thereof, and / or any other material. In some examples, the wall thickness of the housing 102, frame 202, and / or skin 204 may be between approximately 2 mm and 8 mm.

[0025] The illustrated example enclosure 102 carries hardware components 208. The illustrated example hardware components 208 include a printed circuit board (PCB) 210 coupled to a processor 212 (e.g., a system-on-a-chip (SOS)). The illustrated example processor 212 does not exceed 10 watts of power. However, in some examples, the processor 212 may exceed 10 watts of power. To bond the PCB 210 to the skin 204, the illustrated example electronic device 100 includes a number of fasteners 213 (e.g., standoffs, screws, etc.). Specifically, the illustrated example skin 204 includes one or more bosses 214 (e.g., cylindrical bosses) having openings 216 for receiving the fasteners 213. The bosses 214 in the illustrated example can be formed by or attached to the skin 204. Although not shown in the cross-sectional view of Figure 2, the hardware component 208 in the illustrated example may include a graphics card, battery, light-emitting diode, speaker, microphone, camera, memory, storage device, etc.

[0026] To dissipate or diffuse the heat generated by the hardware components 208 during the operation of the electronic device 100, the illustrated example thermal management system 200 utilizes a heat sink or vapor chamber 218. The illustrated example vapor chamber 218 is a heat sink that includes a vacuum-sealed metal containment and an internal core structure attached to the inner wall of the containment, which uses capillary action to move a liquid around the vapor chamber 218 to diffuse heat along the surface areas of the vapor chamber 218 (e.g., the upper and lower surfaces). In some examples, the vapor chamber is a flat heat pipe that can diffuse heat in two dimensions (e.g., across the surface of the vapor chamber). The illustrated example vapor chamber 218 can be constructed of brass, copper, and / or any other suitable material for conducting and / or diffusing heat. The illustrated example vapor chamber 218 is coupled to the PCB 210 by fasteners 213 (e.g., standoffs). The fastener 213 connects the PCB 210 to the vapor chamber 218, but separates the PCB 210 from the vapor chamber 218, providing a gap 220 for the processor 212. Thus, in the illustrated example, the processor 212 is positioned (e.g., sandwiched) between the PCB 210 and the vapor chamber 218, and the vapor chamber 218 is positioned between the processor 212 and the skin 204. Furthermore, the vapor chamber 218 is connected to the skin 204 by the fastener 213 and projection 214. Thus, the fastener 213 stacks the PCB 210, processor 212, vapor chamber 218, and skin 204. In some examples, the thermal management system 200 may utilize a heat diffuser, heat sink, heat pipe, and / or any other heat diffusion device instead of the vapor chamber 218.

[0027] To transfer heat from the vapor chamber to the housing 102, the illustrated example thermal management system 200 utilizes a thermally conductive buffer 224 (e.g., a passive cooler and shock absorber). The illustrated example thermally conductive buffer 224 is positioned between the housing 102 and the hardware components 208. Specifically, the illustrated example thermally conductive buffer 224 is positioned between the skin 204 and the vapor chamber 218 (e.g., sandwiched). The illustrated example thermally conductive buffer 224 provides a thermally conductive cooling passage for the electronic device 100. Specifically, the illustrated example thermally conductive buffer 224 directly connects the vapor chamber 218 and the skin 204. In other words, the thermally conductive buffer 224 in the illustrated example has a first side surface 224a that directly engages with or contacts the first side surface 216a of the vapor chamber 218, and a second side surface 224b that directly engages with or contacts the first side surface 204a of the skin 204 (e.g., the inner surface oriented toward the cavity 206). For reference, the second side surface 214b of the vapor chamber 218 opposite to the first side surface 214a is oriented toward the processor 212 and PCB 210. Furthermore, the second side surface 204b of the skin 204 opposite to the first side surface 204a defines a portion of the outer surface of the housing 102 (e.g., the bottom surface).

[0028] The thermally conductive buffer 224 in the illustrated example is located within the cavity 206 and has a shape complementary to the shape of the vapor chamber 218. For example, the thermally conductive buffer 224 in the illustrated example (e.g., the first side surface 224a) has a surface area substantially similar (e.g., within 10%) to the surface area provided by the vapor chamber 218 (e.g., the first side surface 214a of the vapor chamber 218). In other words, it has a length and width substantially equal (e.g., within 10% of its displacement) to the length and width of the vapor chamber 218. Providing a surface area similar (e.g., identical) to the surface area of ​​the vapor chamber 218 improves heat transfer efficiency. In some examples, the thermally conductive buffer 224 in the illustrated example may have a length extending between the first side wall 102a and the second side wall 102b, and a width extending between the third side wall 102c and the fourth side wall 102d of the housing 102. In some examples, the thermally conductive buffer 224 in the illustrated example may have a length and / or width shorter than the length and / or width of the housing 102, the skin 204 (e.g., the first side surface 204a of the skin 204), and / or the vapor chamber 218 (e.g., the first side surface 214a of the vapor chamber 218). In some examples, the surface area of ​​the thermally conductive buffer 224 (e.g., the first side surface 224a) may be smaller than the surface area of ​​the vapor chamber 218 and / or the skin 204 (e.g., the first side surface 214a of the skin 204). In some examples, the thermally conductive buffer 224 in the illustrated example may be of any size relative to the vapor chamber 218 and / or the skin 204. In some examples, the thermally conductive buffer 224 in the illustrated example may be substantially the same size as the vapor chamber 218 and / or may be located only within an area aligned with the hardware component 208.

[0029] The illustrated example of a thermally conductive buffer 224 includes a buffer body 230 (e.g., shock-absorbing material or shock-absorbing section) and a thermally conductive material 232 (e.g., a thermal conductive layer, sheet, etc.). The buffer body 230 in the illustrated example is a body composed of a shock-absorbing material (e.g., shock-absorbing material). For example, the buffer body 230 in the illustrated example can be a body composed of rubber, silicone, urethane, elastic material, and / or any other suitable yielding material for absorbing shock forces. For example, the shock-absorbing material can be a jelly and / or liquid sealed inside the thermally conductive material 232. The buffer body 230 elastically deforms, bends, or deforms to absorb energy or shock force during a shock event. For example, the buffer body 230 absorbs shock force to protect hardware components 208 (e.g., processor 212, PCB 210, vapor chamber 218, etc.) from damage when the electronic device 100 is dropped. Therefore, the shock absorber body 230 provides an energy sink in the load path. After absorbing the impact, the shock absorber body 230 in the illustrated example has resilient properties and returns to its original position (e.g., an undeformed or unbent position).

[0030] To define a thermally conductive cooling passage between the vapor chamber 218 and the skin 204, the thermally conductive buffer 224 of the illustrated example electronic device 100 includes a thermally conductive material 232. The thermally conductive material 232 in the illustrated example comprises a first sheet 232a (e.g., an upper sheet) that defines the first side surface 224a of the thermally conductive buffer 224 and is in direct contact with the first side surface 214a of the vapor chamber 218, and a second sheet 232b (e.g., a lower sheet) that defines the second side surface 224b of the thermally conductive buffer 224 and is in direct contact with the first side surface 204a of the skin 204. The illustrated thermally conductive material 232 is in contact with at least a portion of the buffer body 230. In the illustrated example, the thermally conductive buffer 232 encloses or surrounds (e.g., completely surrounds) the buffer body 230 so that the buffer body 230 is completely positioned inside the thermally conductive material 232. The thermal conductive material 232 includes ends 232c, 232d that connect the first sheet 232a and the second sheet 232b. For example, the first sheet 232a, the second sheet 232b, and the ends 232c, 232d surround the perimeter of the buffer body 230. In other words, the thermal conductive material 232 is a continuous sheet that provides a continuous heat transfer path from the vapor chamber 218 to the skin 204 and / or housing 102.

[0031] The thermally conductive buffer 224 in the illustrated example may have a thickness between approximately 0.5 mm and 1 mm. For example, the buffer body 230 may have a thickness between approximately 0.3 mm and 0.7 mm. Each of the first sheet 232a and the second sheet 232b of the thermally conductive material 232 may have a thickness between approximately 0.1 mm and 0.3 mm. The thermally conductive material 232 in the illustration is formed as a tube and then crushed or compressed after the buffer body 230 is positioned inside the tube. The thermally conductive material 232 in the illustrated example consists of graphite (e.g., a single layer of graphite, multiple folded layers of graphite, a thin film, etc.). However, in other examples, the thermally conductive material 232 may be copper, aluminum, copper thin film, aluminum thin film, graphite thin film, sheet, layer, combination thereof, and / or any suitable thermally conductive material. In some examples, the thermal conductive material 232 can be copper, graphite, aluminum, and / or any other combination or suitable material. When the thermal conductive material 232 is a thin film, it can cover the periphery of the buffer body 230 and surround the buffer body 230.

[0032] During operation, the thermally conductive material 232 provides a passive cooling system or heat sink. For example, heat generated by the hardware component 208 in the illustrated example is dissipated (e.g., diffused) across the surface area of ​​the vapor chamber 218. For example, heat generated by the processor 212 is absorbed and dissipated across the vapor chamber 218. The vapor chamber 218 is configured to dissipate heat from the first side surface 214a to the second side surface 214b. The thermally conductive material 232 transfers heat from the second side surface 124b of the vapor chamber 218 to the housing 102. Specifically, heat is transferred from the first sheet 232a and to the second sheet 232b via the edges 232c and 232d. The heat is then transferred to the skin 204 via the second sheet 232b and to the frame 202 via the ends 232c and 232d, and dissipates from the housing 102.

[0033] Figure 3 shows an exemplary electronic device having an exemplary cooling system disclosed in this specification. Many of the components of the exemplary electronic device 300 in Figure 3 are substantially the same as or identical to the components described above with respect to Figures 1 and 2. Therefore, those components will not be described in detail again below. Instead, interested readers should refer to the corresponding descriptions above, which fully describe the structure and operation of such components. To assist in this process, the same or identical reference numerals used in Figures 1 and 2 are used for similar structures in Figure 3. For example, the electronic device 300 includes a housing 102, a display 104, a frame 202, a skin 204, hardware components 208 (e.g., electronic components, PCB 210, processor 212, graphics card, memory, camera, speaker, microphone, etc.), and a vapor chamber 218, which are configured substantially the same as those of the electronic device 100 in Figures 1 and 2.

[0034] Referring to Figure 3, the electronic device 300 includes another exemplary thermal management system 302 disclosed in this specification. The illustrated example of the thermal management system 302 includes a plurality of thermally conductive buffers 304 (e.g., passive cooling and shock-absorbing units). The thermally conductive buffers 304 are positioned between the vapor chamber 218 and the skin 204 and define a heat transfer path for transferring heat from the vapor chamber 218 to the housing 102 (e.g., the skin 204). Specifically, the thermally conductive buffers 304 in the illustrated example are spaced apart through the housing 102.

[0035] Each of the illustrated examples of thermally conductive buffers 304 includes a buffer body 306 and a thermally conductive material 308 (e.g., a layer, sheet, thin film, etc.). The thermally conductive material 308 encloses the buffer body 306. The buffer body 306 is a buffer composed of, for example, rubber, silicone, gel, liquid, and / or other shock-absorbing material. The thermally conductive material 308 in the illustrated examples can be composed of graphite, copper, aluminum, any combination thereof, and / or other suitable thermally conductive material. In some examples, the buffer body 306 and thermally conductive material 308 in the illustrated examples can be similar to the buffer body 230 and thermally conductive material 232 in Figure 2, but can be composed or formed with a smaller footprint.

[0036] To define the thermal load path from the vapor chamber 218 to the skin 204, the thermal conductive material 232 of the thermal conductive buffer 304 in the illustrated example directly engages with the vapor chamber 218 and the skin 204. Furthermore, to reduce (e.g., prevent) hot spots on the housing 102, the thermal conductive buffers 304 are spaced apart from each other, with a space or air gap 310 between them. In this method, the air gap 310 acts as insulation that resists heat transfer from the vapor chamber 218 to the skin 204.

[0037] During operation, the heat generated by the processor 212 is dissipated through the vapor chamber 218. The thermal conductive material 308 of the thermal conductive buffer 304 transfers heat from the vapor chamber 218 to the housing 102 (e.g., the skin 204). Each of the thermal conductive buffer 304 provides a continuous path for heat transfer from the vapor chamber 218 to the housing 102. In contrast, the air gap 310 restricts (prevents) heat transfer from the vapor chamber 218 to the skin 204 through the air gap 310. In this way, the heat transferred from the vapor chamber 218 to the housing 102 is channeled (e.g., only or directly) through the thermal conductive material 232 of the thermal conductive buffer 204. As a result, the air gap 310 restricts (e.g., prevents) the occurrence of hot spots on the skin 204. For example, the processor 212 typically generates the most heat during operation, and the air gap 310 directly beneath the processor 212 restricts or prevents the portion of the skin 204 aligned with the air gap 310 and the processor 212 (e.g., vertically aligned) from having a higher temperature than the portion of the skin 204 further away from the processor 212. By dispersing heat to the portion of the skin 204 associated with the thermally conductive buffer 304, the heat transferred to the skin 204 is more uniformly distributed across the skin 204, reducing (e.g., preventing) the occurrence of hot spots on the housing 102. In other words, heat transferred from the thermally conductive buffer material 308 in direct contact with the skin 204 is transferred laterally to the cooler portion of the skin 204 directly aligned with the air gap 310.

[0038] Figure 4 shows another exemplary electronic device 400 disclosed in this specification. The illustrated example electronic device 400 is a mobile computer (e.g., a durable laptop, etc.). The illustrated example electronic device 400 includes a first housing 404 coupled to a second housing 404 by a hinge 406. The hinge 406 allows the second housing 404 to rotate or fold back relative to the first housing 402 between a stowed position (e.g., the second housing 404 is aligned with or parallel to the first housing 402) and an open position as shown in Figure 4 (e.g., the second housing 404 is not parallel to the first housing 402). In the open position, the second housing 404 can rotate around the hinge 406 relative to the first housing 402 to a desired viewing angle. The illustrated example first housing 402 includes a keyboard 408, a trackpad 410, and input keys 412. The second housing 404 holds a display 414, a camera 416, and a speaker 418.

[0039] Figure 5 is a cross-sectional view of an exemplary electronic device 400 taken along line 4-4 in Figure 4. The illustrated example of the electronic device 400 includes another exemplary thermal management system 500 disclosed in this specification to dissipate heat generated within the first housing 402. In some examples, the second housing 404 may include a thermal management system 500 to dissipate heat generated within the second housing 404, for example by a display 414.

[0040] The first enclosure 402 in the illustrated example includes a frame 502 (e.g., a chassis) having side walls 504 and a support surface 506. The frame 502 in the illustrated example is a single-piece structure. The frame 502 in the illustrated example defines a cavity 508 for holding hardware components 208 and a thermal management system 500. The support surface 506 in the illustrated example is oriented toward the cavity 508. The hardware components 208 in the illustrated example include a PCB 210 and a processor 212. The PCB 210 and processor 212 are located beneath the keyboard 408. The thermal management system 500 in the illustrated example includes a vapor chamber 218 and a thermally conductive buffer 510. The thermally conductive buffer 510 is located between the vapor chamber 218 and the support surface 506 of the first enclosure 402.

[0041] The illustrated example of the thermally conductive buffer 510 includes a buffer body 512 and a thermally conductive material 514. The buffer body 512 in the illustrated example is a buffer or shock absorber. The buffer body 512 is made of a shock-absorbing material such as rubber, silicone, jelly, and / or any suitable material.

[0042] The illustrated example of the buffer body 512 includes a first set 516 (e.g., a first row) of buffer body 512 and a second set 518 (e.g., a second row) of buffer body 512. In particular, the first set 516 of buffer body 512 is oriented in a first direction, and the second set 518 of buffer body 512 is oriented in a second direction opposite to the first direction. Specifically, the first set 516 and the second set 518 of buffer body 512 are positioned in an alternating relationship. Specifically, the first set 516 of buffer body 512 is coupled (e.g., mounted) to the vapor chamber 218, and the second set 518 of buffer body 512 is coupled (e.g., mounted) to the support surface 506 of the first housing 402.

[0043] Each buffer body 512 includes a mounting surface 520 and a guide surface 522. In the illustrated example, the mounting surface 520 is substantially flat (e.g., substantially planar). For example, in the orientation of Figure 5, the mounting surface 520 of the first set 516 of buffer bodies 512 is substantially parallel to the second surface 218a of the vapor chamber 218 oriented toward the support surface 506 (e.g., nearly parallel, exactly parallel, within 1 percent of perfectly parallel, etc.), and the mounting surface 520 of the second set 518 of buffer bodies 512 is substantially parallel to the inner surface 506a of the support surface 506 oriented toward the vapor chamber 218 (e.g., nearly parallel, exactly parallel, within 1 percent of perfectly parallel). For example, the mounting surface 520 of the first set 516 of the cushioning body 512 is coupled (e.g., directly) to or attached to the second surface 218b of the vapor chamber 218, and the mounting surface 520 of the second set 518 of the cushioning body 512 is coupled (e.g., directly) to or attached to the inner surface 506a of the support surface 506. For example, the mounting surface 520 is permanently deformed to provide a flat surface, and the guide surface is elastically deformed to absorb forces during an impact event.

[0044] The guide surface 522 in the illustrated example has an arc-shaped surface. For example, the guide surface 522 is a semicircle (e.g., a semicircle) protruding from the mounting surface 520. As will be described later, the radius of the guide surface 522 in the illustrated example depends on the bending radius of the heat conduction section. Specifically, the radius of the guide surface 522 is greater than the bending radius of the heat conduction material 514.

[0045] Furthermore, each of the cushioning bodies 512 includes an air gap 524. The air gap 524 in the illustrated example can be defined by a cutout, opening, channel, etc. The air gap 524 in the illustrated example functions as an insulator that reduces (e.g., resists or hinders) heat conduction through the cushioning body 512. Furthermore, the air gap 524 formed in the cushioning body 512 improves (e.g., increases) the flexibility properties of the cushioning body 512 (e.g., of the guide surface 522). In some examples, the air gap 524 of the cushioning body 512 in the illustrated example can be filled with jelly, liquid, and / or any other shock-absorbing material, insulating material, any combination thereof, and / or any other suitable shock-absorbing material, and / or a non-thermal-conductive material.

[0046] In the illustrated example, the thermal conductive material 514 is positioned between a first set 516 of buffer bodies 512 and a second set 518 of buffer bodies 512. For example, because the thermal conductive material 514 is positioned between the buffer bodies 512, the buffer bodies 512 do not directly interlock with each other. The thermal conductive material 514 at least surrounds (e.g., partially covers) the buffer bodies 512. Specifically, in the illustrated example, the thermal conductive material 514 covers at least a portion of the guide surface 522 of the buffer body 512. In order to at least partially contact (e.g., direct contact or at least partially cover) the thermal conductive material 514 with the buffer body 512 (e.g., the arched or curved surface of the buffer body 512), the thermal conductive material 514 in the illustrated example has an arched or corrugated shape (e.g., a sinusoidal shape). The thermally conductive material 514 in the illustrated example has alternating waves 526 that interlock (e.g., directly interlock) with at least a portion of the vapor chamber 218 and a portion of the support surface 506. For example, the waves 526 of the thermally conductive material 514 in the illustrated example, which at least partially cover the periphery of the guide surface 522 of the first set 516 of the buffer body 512, interlock at least partially with the support surface 506. In some examples, the first set 516 of the buffer body 512 interlocks portions of the thermally conductive material 514 with the support surface 506.

[0047] Similarly, the waves 526 of the thermal conductive material 514 in the illustrated example, which at least partially contact or cover the periphery of the guide surface 522 of the second set 518 of the buffer body 512, at least partially engage with (e.g., directly engage with) the vapor chamber 218. The waves 526 of the thermal conductive material 514 have a shape similar to or complementary to the shape of the guide surface 522 of the buffer body 512. In some examples, the second set 518 of the buffer body 512 engages the portion of the thermal conductive material 514 with the vapor chamber 218. The thermal conductive material 514 in the illustrated example is a continuous strip of material.

[0048] To change the heat transfer coefficient of the thermal conductive material 514 (e.g., increase or decrease it), the bending radius of the wave 526 and / or the thickness 528 of the thermal conductive material 514 can be changed (e.g., increase or decrease it). Furthermore, the number of direct contacts (e.g., waves 526) of the thermal conductive material 514 with the vapor chamber 218 and the support surface 506 can change the heat transfer coefficient. For example, the more direct contacts (e.g., waves 526) there are, the greater the heat transfer coefficient, and vice versa. The thermal conductive material 514 can be a layer, sheet, thin film, etc., and can be made of aluminum, graphite, copper, any combination thereof, and / or any other suitable thermal conductive material.

[0049] During operation, the thermally conductive material 514 facilitates heat transfer between the vapor chamber 218 and the frame 502. For example, heat generated by the hardware component 208 is diffused across the surface area of ​​the vapor chamber 218. The heat is transferred through the vapor chamber 218 to the waves 526 of the thermally conductive material 514 that are in direct contact with the vapor chamber 218. The air gap 524 of the buffer body 512 restricts heat transfer through the buffer body 512, thereby reducing (e.g., preventing) the formation of hot spots in the portion of the support surface 506 that is not in direct contact with the thermally conductive material 514. The heat is transferred from the waves 526 of the thermally conductive material 514 that are in direct contact with the vapor chamber 218 to the waves 526 of the thermally conductive material 514 that are in direct contact with the support surface 506. The heat then dissipates from the support surface 506 and / or laterally across the support surface 506 (for example, in the direction between the side walls 504). During an impact event (for example, when an electronic device is dropped from a height of, for example, 2-3 feet), the buffer body 512 absorbs the impact load and limits the impact force applied to the hardware component 208. In some examples, the guide surface 522 tilts or bends toward the mounting surface 520 during impact (for example, to absorb the force) and returns to its original position after the impact event (for example, deflected to the position shown in Figure 5).

[0050] Figure 6 shows another exemplary electronic device 600 having another exemplary thermal management system 602 disclosed in this specification. Many of the components of the exemplary electronic device 600 in Figure 6 are substantially the same as or identical to the components described above with respect to Figure 5. Therefore, those components will not be described in detail again below. Instead, interested readers should refer to the corresponding descriptions above, which fully describe the structure and operation of such components. To assist in this process, the same or identical reference numerals used in Figures 1-5 are used for similar structures in Figure 6. For example, the electronic device 600 includes a first housing 402, a keyboard 408, hardware components 208 (e.g., PCB 210, processor 212, vapor chamber 218), a frame 502, side walls 504, support surfaces 506, and a thermally conductive material 514, which are configured substantially the same as the electronic device 400 in Figure 5.

[0051] Referring to Figure 6, the illustrated example thermal management system 602 includes a thermal conduction buffer 604. The illustrated example thermal conduction buffer 604 includes a plurality of buffer bodies 606 (e.g., buffers) and a thermal conduction material 514. The illustrated example buffer bodies 606 have solid bodies made of shock-absorbing materials, including, but not limited to, rubber, silicone, gel, combinations thereof, and / or any other suitable shrinkable material. In other words, the illustrated example buffer bodies 606 are substantially similar to the buffer body 512 of Figure 5, except that the illustrated example buffer body 606 does not have an air gap 524. Thus, the illustrated example buffer body 606 has boundary characteristics substantially similar to the boundary (perimeter) characteristics of the buffer body 512 of Figure 5. For example, the buffer body 606 includes a mounting surface 610 and a guide surface 612, respectively.

[0052] The illustrated example of the buffer body 606 includes a first set 614 (e.g., a first row) of buffer body 606 and a second set 616 (e.g., a second row) of buffer body 606. In particular, the first set 614 of buffer body 606 is oriented in a first direction, and the second set 616 of buffer body 606 is oriented in a second direction opposite to the first direction. Specifically, the first set 614 of buffer body 606 is coupled (e.g., mounted) to the vapor chamber 218, and the second set 616 of buffer body 606 is coupled (e.g., mounted) to the support surface 506 of the first housing 402. The illustrated example of the buffer body 606 can dissipate a greater amount of force than the buffer body 512 in Figure 5.

[0053] Figure 7 is a schematic diagram of thermally conductive materials 702a to 702d that can be used to implement the exemplary thermal management systems 500 and 602 shown in Figures 4 to 6. Figure 7 shows the relationship between the bending radius (R=3), height 704a to 704d, pitch 706a to 706d, and count (e.g., 5 waves) of the thermally conductive materials 702a to 702d fixed to 3.

[0054] Figure 8 is a cross-sectional view of another exemplary electronic device 800 having another exemplary thermal management system 802 disclosed in this specification. The exemplary electronic device 800 in the illustrated example may be a tablet, a laptop display portion (e.g., the second housing 404 in Figure 4), and / or any other suitable electronic device. The electronic device 800 in the illustrated example has a frame 804 (e.g., a chassis). The frame 804 in the illustrated example holds a display 806 and a cover 808 (e.g., a glass cover). The frame 804 in the illustrated example includes support surfaces 810 and side walls 812 that define a cavity 814 for housing or receiving hardware components 208 of the electronic device 800 (e.g., a PCB 210, a processor 212, etc.).

[0055] The illustrated thermal management system 802 includes a heat sink or heat spreader 816 and a plurality of thermally conductive buffers 818. The heat spreader 816 in the illustrated example is a plate or block of a material having high thermal conductivity. For example, the heat spreader 816 in the illustrated example may be made of copper, aluminum, diamond, and / or a thermally conductive material. In other examples, the thermal management system 802 may use a vapor chamber, a heat sink, and / or any other heat spreader that dissipates or diffuses the heat generated by the hardware component 208. The thermally conductive buffers 818 are positioned between the heat spreader 816 and the support surface 810 of the frame 804.

[0056] Each illustrated example of a thermally conductive buffer 818 includes a buffer body 820 (e.g., a buffer) positioned between a first thermally conductive material 822 (e.g., a layer, sheet, etc.) and a second thermally conductive material 824 (e.g., a layer, sheet, etc.). The first thermally conductive material 822 of the thermally conductive buffer 818 is directly coupled to the heat spreader 816, and the second thermally conductive material 824 of the thermally conductive buffer 818 is directly coupled to the support surface 819. To provide a continuous heat path between the heat spreader 816 and the support surface 810, the first thermally conductive material 822 is directly coupled to the second thermally conductive material 824. Specifically, the respective ends 822a and 822b of the first thermally conductive material 822 directly interlock with the respective ends 824a and 824b of the second thermally conductive material 824. In some examples, the respective ends 822a, 822b of the first thermal conductive material 822 can be joined to the respective ends 824a, 824b of the second thermal conductive material 824 via fasteners (e.g., pins, rivets, screws), conductive adhesives, crimping, twisting, and / or any other fasteners or manufacturing techniques, providing a thermal conductive path between the first thermal conductive material 822 and the second thermal conductive material 824.

[0057] The cushioning body 820 in the illustrated example may be an impact-absorbing material, but is not limited to, rubber, silicone, gel, liquid, a combination thereof, and / or any other shrinkable material that absorbs impact forces. The first thermal conductive material 822 and the second thermal conductive material 824 in the illustrated example may each be a sheet of material, a folded sheet of material, a graphite layer, a folded graphite layer, a layer of copper, an aluminum layer, a combination thereof, and / or any thermal conductive material.

[0058] Furthermore, the buffer body 820 in the illustrated example has a trapezoidal cross-sectional shape. The second thermal conductive material 824 is contoured at least partially so as to interlock matably with the buffer body 820. In other words, the portion 824c of the second thermal conductive material 824 between the respective ends 824a, 824b has a shape complementary to the shape of the buffer body 820, allowing the second thermal conductive material 824 to at least partially contact or cover the periphery of the buffer body 820. The arched portion 820a of the buffer body 820 in the illustrated example has a radius greater than the minimum required bending radius necessary to give the second thermal conductive material 824 a shape complementary to the buffer body 820. In some examples, the buffer body 820 can have any suitable shape.

[0059] In the illustrated example, the thermally conductive buffer 818 is positioned between the heat sink 816 and the support surface 810. Furthermore, the first thermally conductive buffer 818a is positioned at a distance from the second thermally conductive buffer 818b, providing an air gap 826 beneath the processor 212.

[0060] During operation, heat generated by the hardware component 208 (e.g., processor 212) is diffused across the surface of the heat spreader 816. The heat is transferred to the first thermal conductive material 822 of the thermal conductive buffer 818, which is in direct contact with the heat spreader 816, and then to the second thermal conductive material 824 of the thermal conductive buffer 818 via connections provided by their respective ends 822a-b and 824a-b. The heat is transferred to the support surface 810 via direct contact between the second thermal conductive material 824 of the thermal conductive buffer 818 and the support surface 810. The air gap 826, aligned with the processor 212 and providing insulation against heat transfer, reduces (e.g., prevents) the formation of hot spots on the support surface 810 during operation. The buffer body 820 in the illustrated example absorbs the impact force during a drop event (e.g., a drop between 6 inches and 5 feet).

[0061] Figure 9 shows another exemplary thermal control system 900 disclosed in this specification. The illustrated example thermal control system 900 can be used with the electronic devices 100, 400, 600, 700, and 800 and / or any other electronic devices disclosed in this specification. The illustrated example thermal control system 900 is a pre-assembled unit or assembly cartridge that facilitates the assembly of the electronic devices. In some examples, the thermal control system 900 can be added to existing electronic devices.

[0062] Many of the components of the exemplary thermal management system 900 in Figure 9 are substantially the same as or identical to the components described above with respect to Figure 8. Therefore, those components will not be described in detail again below. Instead, interested readers should refer to the corresponding descriptions above, which fully describe the structure and operation of such components. To assist in this process, the same or identical reference numerals used in Figure 8 are used for similar structures in Figure 9. For example, the thermal management system 900 includes a heat spreader 816, a buffer body 820, a first thermal conductive material 822, and a second thermal conductive material 824, which are configured substantially the same as the thermal management system 802 in Figure 8.

[0063] The thermal management system 900 in Figure 9 includes a thermally conductive buffer 902 (e.g., a passive cooling and impact-resistant assembly) coupled to a heat spreader 816. The thermally conductive buffer 902 includes a buffer body 820 positioned between a first thermally conductive material 822 and a second thermally conductive material 824. In the illustrated example, the first thermally conductive material 822 is bonded to the first surface 904 of the heat spreader 816 via a first conductive adhesive layer 906. Similarly, the second thermally conductive material 824 is attached to the first thermally conductive material 822 via a second thermally conductive adhesive layer 908. In some examples, the first thermally conductive material 822 is bonded to the heat spreader 816 by fasteners, chemical fasteners (e.g., glue), welding, and / or any other fasteners and / or manufacturing techniques. In some examples, the second thermal conductive material 824 is bonded to the first thermal conductive material 822 by fasteners, chemical fasteners (e.g., glue), welding, and / or any other fasteners and / or manufacturing techniques.

[0064] The thermally conductive buffer 902 in the illustrated example has an overall height 910. The overall height 910 in the illustrated example is determined based on the thickness 912 of the buffer body 820, the thickness 914 of the first thermally conductive material 822, and the thickness 916 of the second thermally conductive material 824. By changing the overall height 910, the shock absorption properties of the buffer body 820 and / or the heat transfer coefficients of the first thermally conductive material 822 and / or the second thermally conductive material 824 can be adjusted (e.g., increased or decreased). For example, the overall height 910 may be between approximately 1 micron and 500 microns. In some examples, the thickness 912 of the buffer may be between 10 microns and 300 microns. In some examples, the thickness 912 of the first thermally conductive material 822 and / or the thickness 914 of the second thermally conductive material 824 may be between 1 micron and 50 microns.

[0065] Figure 10A is another exemplary electronic device 1000 disclosed in this specification. Figure 10B is a partial enlargement of the exemplary electronic device 1000 in Figure 10A. Referring to Figures 10A and 10B, the illustrated example electronic device 1000 includes another exemplary thermal management system 1002 disclosed in this specification. The illustrated example electronic device 1000 is a desktop computer, such as a NUC Extreme Compute Element manufactured by Intel® Corporation. In some examples, the illustrated example electronic device 1000 may be a mobile device (e.g., a mobile phone, smartphone, tablet, etc.), a server, a modular compute system, a graphics computer, and / or any other electronic device.

[0066] The illustrated example of the electronic device includes a main frame 1004 (e.g., chassis) that defines a cavity 1006 that receives a hardware component 1008. In Figure 10B, the hardware component is shown detached from the main frame 1004. The hardware component 1008 is cantilevered from one side by an auxiliary frame 1010 (e.g., a handle portion). The hardware component 1008 in the illustrated example includes a printed circuit board, processor, memory, graphics card, antenna, power supply, and / or any other hardware components used with the electronic device.

[0067] The illustrated example of the thermal management system 1002 includes a thermally conductive buffer 1012. The illustrated example of the thermally conductive buffer 1012 extends between the first end 1004a and the second end 1004b of the main frame 1004, and between the first side end 1004c and the second side end 1004d of the main frame 1004. Although not shown, in some examples the thermal management system 1002 may include a vapor chamber and / or heat spreader positioned on the thermally conductive buffer 1012 and / or held by a hardware component 1008 of the electronic device 1000.

[0068] Figure 10C is a perspective view of an exemplary thermal conductive buffer 1014 representing the exemplary thermal conductive buffer 1012 of Figure 10B. The illustrated example of the thermal conductive buffer 1014 includes a buffer body 1016 (e.g., a buffer) and a thermal conductive material 1018. The illustrated example of the buffer body 1016 is a body 1020 having a cylindrical shape (e.g., a cylindrical cross-sectional shape) and an elongated length 1022. The illustrated example of the buffer body 1016 is a solid body composed of a buffer or shock-absorbing material, including, but not limited to, rubber, silicone, jelly, and / or any other suitable material. In some examples, the buffer body 1016 may include an air gap (e.g., a bore or opening) extending through at least a portion of the body 1020 (e.g., longitudinally). The illustrated example of the thermal conductive material 1018 covers at least partially the periphery of the buffer body 1016. As a result, when the electronic device 1000 is assembled as shown in the assembly diagram of Figure 10A and the electronic device is in operation, the thermally conductive material 1018 establishes a heat transfer path between the hardware component 1008 and the frame 1004. The illustrated thermally conductive material 1018 forms a tube or cylinder that receives the buffer body 1016.

[0069] In some examples, hardware components 208, PCB 210, and / or processor 212 disclosed in this specification provide means for processing instructions (e.g., calculations, logical comparisons, data, etc.). In some examples, enclosures 102, 402, 404, and / or enclosure 102, frame 502, frame 804, main frame 1004 provide means for housing the processing means and / or means for housing hardware components 208, PCB 210, processor 212, thermal management systems 200, 302, 500, 602, 802, 900, 1002, etc. In some examples, vapor chambers 218, heat spreaders 816, heat sinks, and / or other suitable heat spreaders provide means for dissipating heat. In some examples, buffer bodies 230, 306, 512, 606, 820, 1016 provide means for absorbing shock from impacts. In some examples, the thermally conductive materials 232, 308, 514, 702a-d, the first thermally conductive material 822, the second thermally conductive material 824, and / or the thermally conductive material 1018 provide means for transferring heat.

[0070] The electronic devices 100, 300, 400, 600, 800, 1000, the thermal management systems 200, 302, 500, 602, 802, 900, 1002, and the thermally conductive buffers 224, 304, 510, 604, 818, 902, 1012, 1014 improve passive heat transfer coefficient and provide shock resistance. For example, the thermally conductive buffer bodies 224, 304, 510, 604, 818, 902, 1012, 1014 can provide stress reduction between approximately 25% and 75%. For example, in a simulation of dropping an electronic device from a height of 1 meter onto concrete, an electronic device having a 0.6 mm thick outer cover, a 0.20 mm thick graphite thermal conductive layer, a 0.4 mm thick jelly buffer material, and a 0.2 mm thick outer cover resulted in a 67 percent stress reduction compared to the same electronic device without the graphite layer and jelly buffer material. In some examples, the thermal conductive buffer sections 224, 304, 510, 604, 818, 902, 1012, and 1014 disclosed in this specification reduce the strain of the housing, chassis, and / or cover (e.g., housing 102, 402, 404, frame 202, 502, 804, 1004, skin 204, support surface 506, cover 808, etc.) by approximately 50% to 80%. For example, a force of 30 Newtons applied to an electronic device without the thermally conductive buffers 224, 304, 510, 604, 818, 902, 1012, and 1014 disclosed in this specification, using a pogo pin having a diameter of 10 inches, resulted in a cover deformation of 0.9333 mm. A force of 30 Newtons applied to an electronic device including the thermally conductive buffers 224, 304, 510, 604, 818, 902, 1012, and 1014 disclosed in this specification, using a pogo pin having a diameter of 10 inches, resulted in a cover deformation of 0.318 mm. This represents a 68 percent reduction. Therefore, the exemplary thermally conductive buffers 224, 304, 510, 604, 818, 902, 1012, and 1014 disclosed in this specification provide an effective, low-cost thermal management and shock resistance solution for electronic devices.

[0071] Electronic devices 100, 300, 400, 600, 800, 1000, thermal management systems 200, 302, 500, 602, 802, 900, 1002, thermally conductive buffers 224, 304, 510, 604, 818, 902, 1012, 1014, and / or other components disclosed herein can be used in conjunction with electronic devices, thermal management systems, or thermally conductive buffers. Electronic devices 100, 300, 400, 600, 800, 1000, thermal management systems 200, 302, 500, 602, 802, 900, 1002, thermally conductive buffers 224, 304, 510, 604, 818, 902, 1012, 1014, and / or other components disclosed herein have specific features, and it should be understood that specific features of one example are not necessarily used exclusively in that example. Instead, any of the features described above and / or illustrated may be combined with any of the examples and may be added to or substituted for any of the other features of those examples. Features of one example are not mutually exclusive with features of another example. Instead, the scope of this disclosure encompasses any combination of any of the features.

[0072] Exemplary methods, apparatus, systems, and products for analyzing malicious activity in computer systems are disclosed in this specification. Further examples and combinations thereof include:

[0073] Example 1 is an electronic device comprising a housing and hardware components located inside the housing. A thermally conductive buffer is disposed between the inner surface of the housing and the hardware components. The thermally conductive buffer includes a shock-absorbing portion and a thermal conductive portion in contact with at least a portion of the shock-absorbing portion.

[0074] Example 2 includes the electronic device described in Example 1, wherein the shock-absorbing portion is composed of at least one of silicon or an elastic material.

[0075] Example 3 is the electronic device described in Example 2, wherein the heat conduction part includes graphite.

[0076] Example 4 includes an electronic device according to any one of Examples 1 to 3, further comprising a vapor chamber positioned between a thermally conductive buffer and a hardware component.

[0077] Example 5 includes an electronic device according to any one of Examples 1 to 4, wherein the first side surface of the heat conduction portion directly engages with the vapor chamber, and the second side surface of the heat conduction portion opposite to the first side surface directly engages with the housing.

[0078] Example 6 includes the electronic device described in Example 1, further comprising a plurality of thermally conductive buffers.

[0079] Example 7 includes the electronic device described in Example 6, wherein the thermally conductive buffers are arranged at intervals within the housing.

[0080] Example 8 is an electronic device, Chassis and, Processor and Printed circuit board and heatsink and Cushioning body and The electronic device includes a heat conduction section having a first surface that at least partially engages with the heat sink and a second surface that at least partially engages with the chassis. The heat conduction section transfers heat from the heat sink to the chassis, and the heat conduction section at least partially covers the periphery of the buffer body.

[0081] Example 9 is the electronic device according to Example 8, wherein the heat conduction portion includes a first sheet that defines the first surface and a second sheet that defines the second surface.

[0082] Example 10 includes the electronic device described in Example 9, wherein the first sheet is bonded to the second sheet to define a cavity, and the cavity receives the buffer body.

[0083] Example 11 includes the electronic device described in Example 9, wherein the first sheet is directly attached to the heat sink by a thermally conductive adhesive.

[0084] Example 12 includes the electronic device described in Example 11, wherein the buffer body is coupled to the first sheet and the second sheet is coupled to the buffer body.

[0085] Example 13 includes the electronic device described in Example 12, wherein the second seat is coupled to the chassis.

[0086] Example 14 includes the electronic device described in Example 9, wherein at least a portion of the first sheet meshes with at least a portion of the second sheet, enabling heat transfer from the heat sink to the chassis.

[0087] Example 15 includes the electronic device described in Example 8, wherein the buffer body includes a plurality of buffer bodies arranged at intervals between the heat sink and the chassis.

[0088] Example 16 includes the electronic device described in Example 15, wherein the plurality of buffer bodies include a first set of buffer bodies positioned in a first direction and a second set of buffer bodies positioned in a second direction opposite to the first direction, and the first set of buffer bodies and the second set of buffer bodies are positioned in an alternating relationship.

[0089] Example 17 includes the electronic device described in Example 16, wherein the heat conduction section is positioned between the first set of buffer bodies and the second set of buffer bodies.

[0090] Example 18 includes the electronic device described in Example 17, wherein the first set of the buffer body engages with the portion of the heat conduction part with the heat sink, and the second set of the buffer body engages with the portion of the heat conduction part with the chassis, and the heat conduction part facilitates heat transfer between the heat sink and the chassis.

[0091] Example 19 is an electronic device, Means for processing instructions, Means for housing means for processing the aforementioned instructions, Means for diffusing heat from means for processing the aforementioned instructions, Means of absorbing shock from impact, The electronic device includes a heat transfer means that at least partially covers the shock-absorbing means. The heat transfer means and the shock-absorbing means are positioned between the heat-diffusing means and the housing means.

[0092] Example 20 includes the electronic device described in Example 19, wherein the heat transfer means transfers heat from the heat diffusing means to the housing means.

[0093] While certain exemplary methods, apparatus, and products are disclosed herein, the scope of this patent is not limited thereto. Conversely, this patent covers all methods, apparatus, and products that are fairly included within the claims of this patent. [Explanation of Symbols]

[0094] 100 Electronic equipment 102 cabinets 200 Thermal Management Systems 202 frames 204 Skins 206 Cavity 208 Hardware Components 210 PCB 212 processors 213 Fasteners 214 Protrusion 218 Vapor Chamber 224 Thermally conductive buffer 230 shock absorber body 232 Thermally conductive materials

Claims

1. An electronic device, The casing and Hardware components located inside the aforementioned enclosure, A thermally conductive buffer is disposed between the inner surface of the housing and the hardware component, A heat diffusion member disposed between the heat conductive buffer and the hardware component, Includes, The aforementioned thermally conductive buffer portion is An impact-absorbing part having a curved surface and a flat surface, The shock-absorbing portion includes a heat-conducting portion that contacts at least a portion of the arc-shaped surface of the shock-absorbing portion, An electronic device comprising a plurality of shock-absorbing units, including a first set of shock-absorbing units positioned in a first direction and a second set of shock-absorbing units positioned in a second direction opposite to the first direction, wherein the first set and the second set are positioned in an alternating relationship.

2. The electronic device according to claim 1, wherein the shock-absorbing portion is composed of at least one of silicon or an elastic material.

3. The electronic device according to claim 1 or 2, wherein the heat conduction portion includes graphite.

4. The electronic device according to any one of claims 1 to 3, wherein the heat diffusion member is a vapor chamber, a heat sink, a heat spreader, or a heat pipe.

5. The electronic device according to any one of claims 1 to 4, wherein the first side surface of the heat conduction portion is in contact with the heat diffusion member, and the second side surface of the heat conduction portion opposite to the first side surface is in contact with the housing.

6. The electronic device according to any one of claims 1 to 5, wherein the thermally conductive buffer is arranged at intervals within the housing.

7. An electronic device, Chassis and, Printed circuit board and heatsink and A cushioning body having a curved surface and a flat surface, A heat conduction portion having a first surface that is at least partially in contact with the heat sink and a second surface that is at least partially in contact with the chassis, wherein the heat conduction portion transfers heat from the heat sink to the chassis, and the heat conduction portion covers at least a portion of the arc-shaped surface of the buffer body, Includes, The buffer body includes a plurality of buffer bodies arranged with a gap between the heat sink and the chassis, The plurality of buffer bodies include a first set of buffer bodies positioned in a first direction and a second set of buffer bodies positioned in a second direction opposite to the first direction, and the first set and the second set are positioned in an alternating relationship, in an electronic device.

8. The electronic device according to claim 7, wherein the heat conduction portion is positioned between the first set of buffer bodies and the second set of buffer bodies.

9. The electronic device according to claim 7 or 8, wherein the first set of the buffer body has a portion of the heat conduction part in contact with the heat sink, and the second set of the buffer body has a portion of the heat conduction part in contact with the chassis, and the heat conduction part promotes heat transfer between the heat sink and the chassis.

10. An electronic device, Means for processing instructions, Means for housing means for processing the aforementioned instructions, Means for diffusing heat from means for processing the aforementioned instructions, A means for absorbing impact from an impact, having an arc-shaped surface and a flat surface, A heat-transmitting means covering at least a portion of the arc-shaped surface of the impact-absorbing means, wherein the heat-transmitting means and the impact-absorbing means are positioned between the heat-diffusing means and the housing means, Includes, An electronic device comprising a plurality of impact-absorbing means, including a first set of impact-absorbing means positioned in a first direction and a second set of impact-absorbing means positioned in a second direction opposite to the first direction, wherein the first set and the second set are positioned in an alternating relationship.

11. The electronic device according to claim 10, wherein the means for transferring heat transfers heat from the means for diffusing heat to the means for housing.

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