Conductive connector and socket

Abstract

[Problem] To provide a conductive connector that is easy to manufacture and has a low disconnection risk. [Solution] This conductive connector comprising a non-conductive elastic body 200 and a reticulated fiber body 100 comprising a covered region 10 with a surface covered by metal is manufactured through the covering of the periphery of the non-conductive elastic body 200 with the reticulated fiber body 100 such that the reticulated fiber body 100 is in a C-shape. The reticulated fiber body 100 has, for example, alternatingly arranged uncovered regions 20 not covered with metal and covered regions 10.

Description

Conductive connector and socket

[0001] The present invention relates to a conductive connector and a socket, and more particularly to a conductive connector and a socket used in connectors for electronic devices, sockets for semiconductors, and the like.

[0002] Patent Document 1 describes a contact probe that is placed between a pair of opposing conductive members to electrically connect the conductive members, and that has a roughly U-shaped wiring member made of a bundle of copper wires that connects a contact portion that contacts one of the conductive members with a contact portion that contacts the other of the conductive members via an intermediate portion, and a covering member that is manufactured by molding a block-shaped rubber elastic body in which the parts of the wiring member other than the contact portions are embedded.

[0003] Abstract of JP 2015-036664 A, paragraphs

[0032] ,

[0049] , and

[0050]

[0004] However, the contact probe disclosed in Patent Document 1 is covered with a block-shaped rubber elastic body in which the parts of the wiring member other than the contact portion are embedded, and it is not easy to manufacture a contact probe with such a structure.

[0005] In addition, the wiring member has difficulty following the displacement of the block-shaped rubber elastic body, and therefore excessive stress is likely to be applied to only certain parts, which can lead to problems such as breakage in those parts with use.Furthermore, due to the structure, there is also the problem that the contact parts of the wiring member are prone to peeling off from the covering member.

[0006] Therefore, an object of the present invention is to provide a conductive connector that does not have such inconveniences.

[0007] In order to solve the above problems, the conductive connector and socket of the present invention comprise a non-conductive elastic body and a mesh-like fiber body having a surface coated with metal, and the mesh-like fiber body covers the periphery of the non-conductive elastic body in a C-shaped manner.

[0008] Furthermore, when the mesh-like fiber body has uncoated areas that are not coated with metal and the coated areas arranged alternately, it can be suitably used in semiconductor devices in which connection objects are arranged in a two-dimensional or three-dimensional manner.

[0009] The mesh-like fiber body may be a fiber body in which metal fibers that have been coated with metal are provided with uncoated regions that are not coated with metal.

[0010] The uncovered area may be formed by a chemical or mechanical treatment. MODE FOR CARRYING OUT THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, descriptions may be made using notations such as top, bottom, left, and right based on the drawings. Please note that these are merely relative notations and are not absolute. Also, please note that the dimensional ratios between the drawings are not consistent, as priority is given to convenience of explanation.

[0012] 1A to 1E are schematic diagrams illustrating the configuration of a conductive connector 1000 according to a first embodiment of the present invention. The conductive connector 1000 is broadly divided into a mesh fiber body 100 and a non-conductive elastic body 200, which will be described below.

[0013] 1A is a right side view, FIG. 1B is a plan view above it, FIG. 1C is a bottom view below it, FIG. 1D is a front view to the left of it, and FIG. 1E is a rear view to the right of it. For convenience of explanation, FIG. 1E does not show the non-conductive elastic body 200. Also, a left side view is not shown in FIG. 1, but it is symmetrical to the right side view.

[0014] As will be described later with reference to Fig. 4, the mesh fibrous body 100 can have a coated region 10 whose surface is coated with a metal including a precious metal, and an uncoated region 20 whose surface is not coated with metal. The coated region 10 faces the central region 10A shown in Fig. 1E, and the uncoated region 20 faces the peripheral region 20A shown in Fig. 1E.

[0015] However, the entire mesh-like fiber body 100 may be the covered region 10, and it is not necessary to form the uncovered region 20. However, forming the uncovered region 20 has the advantage that, for example, when the objects that come into contact with the conductive connectors 1000 are arranged with relatively short gaps between them, it is possible to prevent adjacent conductive connectors 1000 from coming into contact with each other and causing a short circuit.

[0016] Because of its mesh-like shape, the mesh fiber body 100 can come into full contact with the conductive elastic body 200 on its opposing surface. Furthermore, for example, the viscosity of the conductive elastic body 200 before hardening is set to 500 mPa to 100,000 mPa, preferably 5,000 mPa to 50,000 mPa, and more preferably 11,000 mPa to 14,000 mPa, depending on the size of the mesh of the mesh fiber body 100, and the conductive elastic body 200 can penetrate into the mesh, and together with this anchor effect, high adhesion with the conductive elastic body 200 is achieved.

[0017] In addition, the mesh-like fiber body 100 has folded portions 110 formed at the upper and lower ends of the covering region 10. The folded portions 110 also contribute to the adhesion between the mesh-like fiber body 100 and the conductive elastic body 200. While FIG. 1 shows the folded portions 110 folded back 180 degrees, this is not limitative and they may be folded back at, for example, approximately 120 to 150 degrees. The size and number of the folded portions 110 are also not limited to those shown in FIG. 1. Furthermore, it is not essential to form the folded portions 110 in the covering region 10 in the first place.

[0018] As shown in Figure 1A, the mesh fibrous body 100 has a roughly ⊂-shaped configuration, which provides springiness. Furthermore, although the mesh fibrous body 100 has portions on its upper and lower surfaces that are parallel to each other, the ⊂-shape referred to in this specification is not strictly limited to this configuration. Therefore, referring to Figure 1A, the mesh fibrous body 100 may also have a configuration in which the entire upper surface is curved. The shape of the mesh fibrous body 100 is preferably one that can ensure a large contact surface depending on the shape of the object it contacts.

[0019] The conductive connector 1000 can be used for testing semiconductor devices, etc. In this case, one of the upper and lower surfaces of the mesh fiber body 100 is brought into contact with an electrode terminal of an electronic component such as a semiconductor device, and the other is brought into contact with an electrode terminal of an electronic component testing device. In this state, when a voltage is applied to a normal semiconductor device, a current flows through the covering region 10 of the mesh fiber body 100 toward the testing device.

[0020] 1A, the top, front, and bottom surfaces of the non-conductive elastic body 200 are covered by a roughly C-shaped mesh fibrous body 100. The non-conductive elastic body 200 can be made of, for example, a silicone resin material, but can also be made of other resin materials other than silicone, such as thermoplastic polyurethane (TPU), as long as it meets the conditions of being non-conductive and having elasticity.

[0021] When the conductive connector 1000 is used to test a semiconductor device, a physical force is applied to the conductive connector 1000 while it is in contact with the terminals. This force is absorbed by the deformation of the non-conductive elastic body 200. This operating principle is the same as when the contact probe of Patent Document 1 is used.

[0022] However, since the mesh-like fiber body 100 has only one corner on the underside, the stress acting there is limited, and the conductive connector 1000 may be made in a correct C-shape with no corners, or may be made as shown in the figure, for example, when the conductive connector 1000 is placed on a substrate of a semiconductor device or the like, in order to increase the mounting surface and provide stability.

[0023] In this specification, the use of the conductive connector 1000 has been described mainly as an example of an inspection device for a semiconductor device, but the use of the conductive connector 1000 is not limited to this, and the conductive connector 1000 can also be used for internal wiring of a semiconductor device, etc. In this case, the conductive connector 1000 can be connected to a wiring board, etc. provided in the semiconductor device, etc. by a conductive adhesive, reflow soldering, etc.

[0024] In this case, for example, soldering requires only a temperature rise of about 260°C, so if the material of the non-conductive elastic body 200 is made of a material that can withstand heat up to about 280°C, it will be possible to connect the conductive connector 1000 to the substrate of a semiconductor device, etc., by soldering.

[0025] Fig. 2 is a perspective view of a portion of the covering region 10 of the mesh fiber body 100 constituting the conductive connector 1000 shown in Fig. 1. The mesh fiber body 100 can be a woven fabric, a nonwoven fabric, or the like, such as an insulating material.

[0026] The mesh-like fiber body 100 is produced by weaving together a plurality of fibers 5 arranged in a lattice pattern. The thickness of the mesh-like fiber body 100 may be, for example, about 5 μm to 200 μm, preferably about 10 μm to 150 μm, and more preferably about 20 μm to 100 μm. The fibers 5 themselves may be any flexible insulating material (non-conductive fibers), and may be, for example, glass fibers, chemical fibers, carbon fibers, or the like.

[0027] The surface of each fiber 5 shown in Figure 2 is coated with a metal to form a coated region 10. The metal used here may be gold, silver, platinum, or an alloy containing any of these as a main component, which has electrical conductivity. Specifications such as the diameter and strength of the fiber 5 are not particularly limited, but the thickness of the metal itself can be selected as appropriate from approximately 0.1 µm to 20 µm, preferably approximately 2 µm to 10 µm, and the hardness can be selected as appropriate from approximately 1 or higher.

[0028] There is no particular limitation on the method for manufacturing the mesh-like fiber body 100. For example, the fibers 5 without the coating region 10 formed thereon may be woven into a lattice pattern, and then the region where the coating region 10 is to be formed may be brought into contact with a metal plating solution or metal gas.

[0029] Alternatively, fibers 5 previously coated with a metal may be woven into a lattice pattern, and then the desired uncoated regions 20 may be formed by etching using an etching solution appropriate for the metal. In this case, however, it is necessary to use an etching solution that does not dissolve the fibers 5 themselves.

[0030] Either method can be used to manufacture a mesh-like fibrous body 100 having a coated region 10 and an uncoated region 20, but in particular, when the mesh-like fibrous body 100 does not have an uncoated region 20 and has only a coated region 10, the latter method is preferable because it has high manufacturing efficiency.

[0031] The non-covered region 20 does not necessarily have to be formed by etching, and may be formed by a chemical treatment other than etching. Examples of such a treatment include mechanical treatments such as sandblasting and ion irradiation.

[0032] 3 is a schematic perspective view of a portion of a conductive connector 1000 according to a second embodiment of the present invention. The conductive connector 1000 has a shape in which the components shown in FIG. 1 are continuously and repeatedly arranged in a line in a two-dimensional manner. However, the conductive connector 1000 may also have a shape in which the components shown in FIG. 1 are continuously and repeatedly arranged in a planar manner in a two-dimensional manner.

[0033] 1 can also be manufactured by first manufacturing the conductive connector 1000 shown in Fig. 3 and then cutting it into appropriate slices at the uncovered regions 20. The number and size of the covered regions 10 and uncovered regions 20 may be selected appropriately depending on the number, size, dimensions, etc. of the electrode terminals to be inspected.

[0034] Figure 4 is an explanatory diagram of the mesh fiber body 100 constituting the conductive connector 1000 shown in Figure 3. Figure 4A shows a rear view corresponding to Figure 1E, and Figure 4B shows a perspective view including the non-conductive elastic body 200. In the mesh fiber body 100 according to this embodiment, too, folded portions 110 can be provided at appropriate intervals. Note that the conductive connector 1000 shown in Figure 4 does not have corners in the mesh fiber body 100.

[0035] The non-conductive elastic body 200 has a rectangular parallelepiped shape, but the upper and lower ends are uneven. This uneven shape occurs when the conductive connector 1000 is manufactured using a jig 3000 shown in Fig. 6A, which will be described later, and is not essential to the conductive connector 1000.

[0036] 5 is a perspective view showing a state in which the plurality of conductive connectors 1000 shown in FIG. 4 are mounted in a socket 2000. The socket 2000 includes a socket body 2100 to which the plurality of conductive connectors 1000 are mounted, and positioning pins 2200 provided at the four corners of the socket body 2100.

[0037] In the example shown in Figure 5, the socket body 2100 is shown to have conductive connectors 1000, each having seven covering regions 10, arranged in 14 rows and 2 columns, but these numbers are merely examples.

[0038] 6A to 6D are schematic diagrams illustrating the manufacturing process of the conductive connector 1000 shown in FIG. 4. The manufacturing process of the conductive connector 1000 shown in FIGS. 6A to 6D is merely an example and is not limited thereto. For example, the mesh-like fiber body 100 having the covered region 10 and the uncovered region 20 may be manufactured, and the non-conductive elastic body 200 may be separately manufactured, and the conductive connector 1000 may be manufactured by bonding these together using a conductive or non-conductive adhesive. In this case, it is preferable that the adhesive penetrates into the mesh of the mesh-like fiber body 100. Furthermore, it is preferable that the adhesive also has the heat resistance described above, as this does not limit the applications.

[0039] 6A shows a jig 3000 for manufacturing the conductive connector 1000. The jig 3000 has a roughly rectangular parallelepiped shape. Side walls are formed along both long sides of the top surface of the jig 3000. These side walls, together with the top surface of the jig 3000, form a flow path 3200 into which the resin that will become the non-conductive elastic body 200 is poured. In addition, a comb portion consisting of a plurality of protrusions 3100 is formed on each side wall.

[0040] 6B shows a mesh-like fibrous body 100 having a covered region 10 and an uncovered region 20. The mesh-like fibrous body 100 may be manufactured by the method described with reference to FIG. 2. Note that although the mesh-like fibrous body 100 is depicted as if it is already shaped like a triangle, this is merely to make it easier to visualize the non-conductive elastic body 200.

[0041] Fig. 6C shows a state in which the mesh fiber body 100 shown in Fig. 6B is attached to the jig 3000 shown in Fig. 6A, resin is poured into the flow path 3200, and after the resin reaches the meshes of the mesh fiber body 100, it is cured to form the non-conductive elastic body 200. Note that the mesh fiber body 100 is attached to the jig 3000 in a manner such that each uncovered region 20 corresponds to each protrusion 3100.

[0042] 6D shows the completed conductive connector 1000 removed from the jig 3000. From FIG. 6D, it can be seen that the non-conductive elastic body 200 is covered with the ⊂-shaped mesh fiber body 100.

[0043] 1, the conductive connector 1000 can be manufactured by inserting the blades of a slicer between the protrusions 3100 in the state shown in FIG. 6C and cutting into round slices at the uncoated regions 20. Of course, as shown in FIG. 6D, the conductive connector 1000 removed from the jig 3000 can also be cut into round slices at the uncoated regions 20.

[0044] Furthermore, when arranging the conductive connectors 1000 two-dimensionally in a planar manner, the covering region 10 may be formed, for example, in a matrix, and a jig 3000 such as that shown in Figure 6A may be used, in which the jig 3000 is arranged continuously in the short direction.

[0045] As described above, the conductive connector 1000 according to each embodiment of the present invention is easy to manufacture, has a low risk of disconnection, and can be used semi-permanently.

[0046] FIG. 1 is a schematic structural diagram of a conductive connector 1000 according to a first embodiment of the present invention. FIG. 2 is a perspective view of a portion of a covering region 10 of a mesh fiber body 100 constituting the conductive connector 1000 shown in FIG. 1. FIG. 3 is a schematic perspective view of a portion of a conductive connector 1000 according to a second embodiment of the present invention. FIG. 4 is an explanatory diagram of a mesh fiber body 100 constituting the conductive connector 1000 shown in FIG. 5. FIG. 6 is a perspective view showing a state in which a plurality of conductive connectors 1000 shown in FIG. 6 are mounted in a socket 2000. FIG. 7 is a schematic manufacturing process diagram of the conductive connector 1000 shown in FIG.

[0047] 5 Fiber 10 Covered region 20 Uncovered region 100 Meshed fiber body 200 Non-conductive elastic body 1000 Conductive connecting body 2000 Socket 2100 Socket body 2200 Positioning pin

Claims

1. A non-conductive elastic body; a mesh-like fibrous body having a surface coated region coated with a metal and a non-coated region not coated with a metal; Equipped with The non-conductive elastic body is surrounded by the mesh-like fiber body in a ⊂-shaped manner, The non-covered area is a conductive connection formed by a chemical or mechanical process.

2. The conductive connector according to claim 1 , wherein the mesh-like fiber body has the uncovered regions and the covered regions arranged alternately.

3. A socket having a plurality of the conductive connectors according to any one of claims 1 and 2 attached thereto.

4. A semiconductor device using the conductive connector according to any one of claims 1 to 2 for internal wiring.