Resin composition, adhesive film, bonding sheet for interlayer adhesion, and resin composition for semiconductor package with antenna

Abstract

Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an end and (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more.

Description

Resin composition, adhesive film, bonding sheet for interlayer attachment, and resin composition for semiconductor package with antenna

[0001] The present invention relates to a resin composition, an adhesive film, a bonding sheet for interlayer bonding, and a resin composition for a semiconductor package with an antenna.

[0002] Recent demands for faster transmission signals on printed wiring boards have led to a marked increase in the frequency of transmission signals, which in turn has led to a demand for materials used in printed wiring boards that can reduce transmission loss in the high-frequency range, specifically in the frequency range of 1 GHz or higher.

[0003] Known examples of resin compositions used in insulating layers of printed wiring boards include thermosetting resin compositions containing a thermosetting resin having a styrene group at its terminal and a styrene-based thermoplastic elastomer (see, for example, Patent Document 1). For example, the thermosetting resin composition disclosed in Patent Document 1 uses a thermosetting resin having a styrene group at its terminal and a phenylene ether skeleton as the thermosetting resin having a styrene group at its terminal. Furthermore, a low-molecular-weight styrene-based elastomer is used as the styrene-based thermoplastic elastomer.

[0004] In recent years, the standardization of 5G as the next-generation communications technology has progressed, and market demand for high-frequency compatible products is increasing. Technological developments such as multi-element antenna technology and high-speed transmission have accelerated, and the use of high-frequency bands has increased communication capacity. At the same time as improving information processing capabilities, the amount of high-frequency noise and heat generated has also increased, and countermeasures for these issues have become a major challenge.

[0005] For example, 5G millimeter-wave antennas require a packaging technology structure that shortens the wiring distance between the antenna and the IC to reduce conductor loss (in other words, reduces transmission loss). For this reason, in recent years, semiconductor packages with antennas (e.g., antenna-in-package (AiP) and antenna-on-package (AoP)) have been developed in which the antenna is integrated into the semiconductor device. In such packages, the insulating layer around the antenna also becomes hotter than in conventional structures due to heat generated by the IC, so low dielectric loss is required even when placed in a high-temperature environment. Note that "IC" stands for integrated circuit.

[0006] International Publication No. 2019 / 230531

[0007] The resin composition disclosed in Patent Document 1 contains a thermosetting resin having a terminal styrene group and a styrene-based thermoplastic elastomer as described above, and is considered to contain a thermosetting resin having a terminal styrene group and a styrene-based thermoplastic elastomer. On the other hand, solder heat resistance is sometimes required for insulating layers of printed wiring boards, but the resin composition disclosed in Patent Document 1 makes no mention of such solder heat resistance.

[0008] Resin compositions intended for use in the high frequency range as described above are required to have excellent solder heat resistance, low dielectric properties, and the like, and there is a strong demand for the development of resin compositions that are excellent in these various properties.

[0009] The present invention has been made in consideration of the problems of the prior art. The present invention provides a resin composition that can be suitably used for adhesive films, interlayer bonding sheets, interlayer adhesives, etc., and that has excellent solder heat resistance and low dielectric properties. Furthermore, the present invention provides adhesive films, interlayer bonding sheets, and resin compositions for antenna-equipped semiconductor packages that use such resin compositions.

[0010] According to the present invention, there are provided a resin composition, an adhesive film, an interlayer bonding sheet, and a resin composition for an antenna-equipped semiconductor package, as shown below.

[0011] [1] A resin composition comprising: (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at its terminal; and (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more.

[0012] [2] The resin composition according to [1], wherein the component (A) contains a modified polyphenylene ether having a styrene structure at its terminal.

[0013] [3] The resin composition according to [1] or [2], wherein the component (A) contains a modified polyphenylene ether having a group represented by the following formula (1) at its terminal:

[0014] (However, in the formula (1), R １ represents a hydrogen atom or an alkyl group.

[0015] [4] The resin composition according to any one of [1] to [3], wherein the component (B) is a styrene-based thermoplastic elastomer.

[0016] [5] The resin composition according to [4], wherein the component (B) is a hydrogenated styrene-based thermoplastic elastomer.

[0017] [6] The resin composition according to [5], wherein the hydrogenated styrene-based thermoplastic elastomer of the component (B) is a styrene / ethylene / butylene / styrene block copolymer.

[0018] [7] The resin composition according to any one of [1] to [6], wherein the component (B) is a thermoplastic elastomer having a number average molecular weight of 100,000 or more.

[0019] [8] The resin composition according to any one of [1] to [7], wherein the mass ratio of the component (A) to the component (B) is 5:95 to 70:30.

[0020] [9] The resin composition according to any one of [1] to [8], wherein the content of the component (B) is greater than the content of the component (A).

[0021]

[10] The resin composition according to any one of [1] to [9] above, further comprising (C) an epoxy resin.

[0022]

[11] The resin composition according to

[10] , wherein the content of the (C) component is 0.1 to 5.0 parts by mass relative to a total of 100 parts by mass of the (A) component, the (B) component, and the (C) component in the resin composition.

[0023]

[12] The resin composition according to any one of [1] to

[11] above, further comprising (D) a curing agent.

[0024]

[13] An adhesive film using the resin composition according to any one of [1] to

[12] above.

[0025]

[14] A bonding sheet for interlayer bonding using the resin composition according to any one of [1] to

[12] above.

[0026]

[15] A resin composition for a semiconductor package with an antenna, comprising the resin composition according to any one of [1] to

[12] .

[0027]

[16] A laminate or a semiconductor device comprising a cured product of the resin composition according to any one of [1] to

[12] above.

[0028] The resin composition of the present invention exhibits the effects of having excellent solder heat resistance and low dielectric properties. Therefore, the resin composition of the present invention can be suitably used for adhesive films, interlayer bonding sheets, interlayer adhesives, etc. Furthermore, the adhesive films, interlayer bonding sheets, and resin compositions for antenna-equipped semiconductor packages of the present invention use the resin composition of the present invention and exhibit the effects of having excellent solder heat resistance and low dielectric properties.

[0029] 1A and 1B are schematic partial cross-sectional views showing an example of a semiconductor package with an antenna, and another example of a semiconductor package with an antenna.

[0030] While the present invention will be described below with reference to exemplary embodiments, it should be understood that the present invention is not limited to the following exemplary embodiments. Therefore, it should be understood that modifications and improvements to the following exemplary embodiments, based on the ordinary knowledge of those skilled in the art, are also within the scope of the present invention, provided that they do not deviate from the spirit of the present invention.

[0031] [Resin Composition] One embodiment of the resin composition of the present invention is a resin composition comprising (A) a polyphenylene ether resin having a terminal functional group containing a carbon-carbon double bond, and (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more. Hereinafter, (A) the polyphenylene ether resin having a terminal functional group containing a carbon-carbon double bond may be referred to as component (A). Similarly, (B) the thermoplastic elastomer having a number average molecular weight of 60,000 or more may be referred to as component (B).

[0032] The resin composition of this embodiment has excellent solder heat resistance and low dielectric properties. In particular, the resin composition of this embodiment contains, as component (A), a polyphenylene ether resin having a terminal functional group containing a carbon-carbon double bond, thereby imparting low dielectric properties to the resin composition and effectively improving solder heat resistance. Furthermore, by containing, as component (B), a thermoplastic elastomer having a number-average molecular weight of 60,000 or more, the resin composition becomes less likely to melt, thereby further improving solder heat resistance.

[0033] In addition to the components (A) and (B), the resin composition of this embodiment may contain other components such as an epoxy resin (C), a curing agent (D), an organic peroxide (E), a flame retardant (F), a filler (G), and a crosslinking agent (H). Hereinafter, the components described above may be referred to as components (C) to (H) as appropriate.

[0034] [Component (A)] Component (A) is a polyphenylene ether resin having a terminal functional group containing a carbon-carbon double bond. Examples of the functional group containing a carbon-carbon double bond include a terminal vinyl group, a vinylene group, or a vinylidene group. Component (A) is not particularly limited as long as it has a terminal functional group containing a carbon-carbon double bond and a polyphenylene ether skeleton. By including component (A), it is possible to impart low dielectric properties to the resin composition while effectively improving solder heat resistance.

[0035] Examples of component (A) include those containing modified polyphenylene ethers having a styrene structure at the terminal. Such modified polyphenylene ethers are not particularly limited as long as they have a styrene structure at the terminal. The styrene structure may be an unsubstituted styrene group having no substituent, or a styrene group having any substituent. By including such component (A), the solder heat resistance of the resin composition can be improved. In particular, modified polyphenylene ethers having a styrene structure at the terminal undergo a curing reaction without the use of a peroxide, resulting in extremely excellent solder heat resistance.

[0036] The modified polyphenylene ether having a terminal styrene structure used as component (A) can be, for example, a compound having a structure represented by the following general formula (2).

[0037]

[0038] In the general formula (2), —(OXO)— is represented by the structural formula (3) or (4).

[0039] In structural formula (3), R ２ , R ３ , R ４ , R ７ , and R ８ R are alkyl groups having 6 or less carbon atoms or phenyl groups, and may be the same as or different from each other. ５ , R ６ , and R ７are hydrogen atoms, alkyl groups having 6 or less carbon atoms, or phenyl groups, and may be the same as or different from each other.

[0040] In structural formula (4), R １０ , R １１ , R １２ , R １３ , R １４ , R １５ , R １６ , and R １７ represents a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group, and may be the same as or different from each other. -A- represents a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms.

[0041] In addition, in the general formula (2), -(Y-O)- is represented by the above structural formula (5). In -(Y-O)-, one type of structure or two or more types of structures are randomly arranged. In the structural formula (5), R １８ and R １９ R are alkyl groups having 6 or less carbon atoms or phenyl groups, and may be the same as or different from each other. ２０ and R ２１ are hydrogen atoms, alkyl groups having 6 or less carbon atoms, or phenyl groups, and may be the same as or different from each other.

[0042] In the general formula (2), a and b are integers of 0 to 100. At least one of a and b is not 0.

[0043] Examples of -A- in structural formula (4) include divalent organic groups such as methylene, ethylidene, 1-methylethylidene, 1,1-propylidene, 1,4-phenylenebis(1-methylethylidene), 1,3-phenylenebis(1-methylethylidene), cyclohexylidene, phenylmethylene, naphthylmethylene, and 1-phenylethylidene, although -A- in structural formula (4) is not limited thereto.

[0044] The compound represented by general formula (2) includes R ２ , R ３ , R ４ , R ８ , R９ , R １８ , and R １９ is an alkyl group having 3 or less carbon atoms, and R ５ , R ６ , R ７ , R １０ , R １１ , R １２ , R １３ , R １４ , R １５ , R １６ , R １７ , R ２０ , and R ２１ is preferably a hydrogen atom or an alkyl group having 3 or less carbon atoms. In particular, it is more preferable that -(O-X-O)- represented by structural formula (3) or structural formula (4) is a compound represented by the following structural formula (6), structural formula (7), or structural formula (8). Similarly, it is more preferable that -(Y-O)- represented by structural formula (5) is a compound represented by the following structural formula (9) or structural formula (10), or a structure in which compounds represented by structural formula (9) and compounds represented by structural formula (10) are randomly arranged.

[0045]

[0046] The method for producing the compound represented by general formula (2) is not particularly limited. For example, the compound represented by general formula (2) can be produced by the following method. First, a bifunctional phenylene ether oligomer is obtained by oxidative coupling of a bifunctional phenol compound and a monofunctional phenol compound. Next, the terminal phenolic hydroxyl groups of the obtained bifunctional phenylene ether oligomer are converted to vinylbenzyl ether. In this manner, the compound represented by general formula (2) can be produced.

[0047] The number-average molecular weight of the compound represented by general formula (2) is preferably 1,000 to 5,000, more preferably 1,000 to 3,000, and even more preferably 1,000 to 2,500. If the number-average molecular weight is 1,000 or more, the resin composition is less likely to become sticky when formed into a coating film. Furthermore, if the number-average molecular weight is 5,000 or less, the resin composition's solubility in solvents can be effectively suppressed. Furthermore, by using a compound having a number-average molecular weight within the above range as component (A), the resin composition's electrical properties and curability at high frequencies are improved. Here, the number-average molecular weight is a value determined by gel permeation chromatography (GPC) using a calibration curve based on standard polystyrene.

[0048] As the component (A), a compound represented by general formula (2) may be used alone, or two or more compounds represented by general formula (2) may be used in combination.

[0049] Examples of polyphenylene ethers having a styrene structure at the end of the component (A) include those available from Mitsubishi Gas Chemical Company, Inc. under the trade names "OPE-2200" and "OPE-1200."

[0050] In addition to the components (A) described above that contain a modified polyphenylene ether having a terminal styrene structure (for example, a compound represented by the general formula (2) above), components (A) may also include those that contain a modified polyphenylene ether having a terminal group represented by the following formula (1):

[0051]

[0052] In the above formula (1), R １ represents a hydrogen atom or an alkyl group. １ The alkyl group is not particularly limited, and is preferably an alkyl group having 1 to 18 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms. Specific examples include a methyl group, an ethyl group, a propyl group, a hexyl group, and a decyl group.

[0053] Examples of the group represented by formula (1) include an acrylate group and a methacrylate group.

[0054] Furthermore, the modified polyphenylene ether having a group represented by formula (1) has a polyphenylene ether chain in the molecule, and preferably has, for example, a repeating unit represented by the following structural formula (11) in the molecule.

[0055]

[0056] In the structural formula (11), m represents 1 to 50. ２２ ~R ２５ are each independently and may be the same as or different from one another. ２２ ~R ２５ represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, a formyl group, an alkylcarbonyl group, an alkenylcarbonyl group, or an alkynylcarbonyl group, among which a hydrogen atom and an alkyl group are preferred.

[0057] R ２２ ~R ２５ Specific examples of the functional groups mentioned in the above include the following:

[0058] R ２２ ~R ２５ The alkyl group in is not particularly limited, but is preferably an alkyl group having 1 to 18 carbon atoms, and more preferably an alkyl group having 1 to 10 carbon atoms. Specific examples include a methyl group, an ethyl group, a propyl group, a hexyl group, and a decyl group.

[0059] R ２２ ~R ２５ The alkenyl group in is not particularly limited, but is preferably an alkenyl group having 2 to 18 carbon atoms, and more preferably an alkenyl group having 2 to 10 carbon atoms. Specific examples include a vinyl group, an allyl group, and a 3-butenyl group.

[0060] R ２２ ~R ２５ The alkynyl group in is not particularly limited, but is preferably an alkynyl group having 2 to 18 carbon atoms, and more preferably an alkynyl group having 2 to 10 carbon atoms. Specific examples include an ethynyl group and a prop-2-yn-1-yl group (propargyl group).

[0061] R ２２ ~R ２５ The alkylcarbonyl group in is not particularly limited as long as it is a carbonyl group substituted with an alkyl group, but for example, an alkylcarbonyl group having 2 to 18 carbon atoms is preferred, and an alkylcarbonyl group having 2 to 10 carbon atoms is more preferred. Specific examples include an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a pivaloyl group, a hexanoyl group, an octanoyl group, and a cyclohexylcarbonyl group.

[0062] R ２２ ~R ２５ The alkenylcarbonyl group in is not particularly limited as long as it is a carbonyl group substituted with an alkenyl group, but for example, an alkenylcarbonyl group having 3 to 18 carbon atoms is preferred, and an alkenylcarbonyl group having 3 to 10 carbon atoms is more preferred. Specific examples include an acryloyl group, a methacryloyl group, and a crotonoyl group.

[0063] R ２２ ~R ２５ The alkynylcarbonyl group in is not particularly limited as long as it is a carbonyl group substituted with an alkynyl group, but for example, an alkynylcarbonyl group having 3 to 18 carbon atoms is preferred, and an alkynylcarbonyl group having 3 to 10 carbon atoms is more preferred. Specific examples include a propioloyl group.

[0064] Examples of modified polyphenylene ethers having a group represented by formula (1) include polyphenylene ethers represented by formula (12) or (13) below, which have a group represented by formula (1) at the end. Specific examples of modified polyphenylene ethers include modified polyphenylene ethers represented by formula (14) or (15) below.

[0065]

[0066] In formulas (12) to (15), s and t are preferably such that the sum of s and t is, for example, 1 to 30. Furthermore, s is preferably 0 to 20, and t is preferably 0 to 20. That is, it is preferable that s represents 0 to 20, t represents 0 to 20, and the sum of s and t represents 1 to 30. Furthermore, in formulas (12) to (15), Y represents an alkylene group having 1 to 3 carbon atoms or a direct bond, and examples of this alkylene group include a dimethylmethylene group. Furthermore, in formulas (14) and (15), R １ is R in the above formula (1). １ and represents a hydrogen atom or an alkyl group. The alkyl group is not particularly limited, and is preferably, for example, an alkyl group having 1 to 18 carbon atoms, and more preferably an alkyl group having 1 to 10 carbon atoms. Specific examples include a methyl group, an ethyl group, a propyl group, a hexyl group, and a decyl group.

[0067] The number-average molecular weight (Mn) of the modified polyphenylene ether having a group represented by formula (1) is not particularly limited. Specifically, it is preferably 500 to 5,000, more preferably 800 to 4,000, and even more preferably 1,000 to 3,000. Here, the number-average molecular weight may be measured by a general molecular weight measurement method, and specifically, a value measured using gel permeation chromatography (GPC) may be mentioned. Furthermore, when the modified polyphenylene ether having a group represented by formula (1) has a repeating unit represented by formula (11) in the molecule, m is preferably a value such that the weight-average molecular weight of the modified polyphenylene ether falls within this range. Specifically, m is preferably 1 to 50.

[0068] When the weight-average molecular weight of the modified polyphenylene ether having a group represented by formula (1) falls within the above-mentioned numerical range, the cured product exhibits excellent heat resistance while retaining the excellent dielectric properties inherent to the polyphenylene ether. Furthermore, the moldability of the resin composition can also be improved. For example, when the weight-average molecular weight of a conventional polyphenylene ether falls within the above-mentioned numerical range, the molecular weight becomes relatively low, and the heat resistance of the cured product tends to decrease. On the other hand, the modified polyphenylene ether having the group represented by formula (1) has a terminal group represented by formula (1), which can improve the heat resistance of the cured product. Furthermore, since the weight-average molecular weight of the modified polyphenylene ether can be made relatively low, the moldability is also excellent. Therefore, by using component (A) containing a modified polyphenylene ether having a terminal group represented by formula (1), a resin composition can be obtained which exhibits excellent heat resistance and moldability of the cured product.

[0069] Furthermore, the average number of groups represented by the above formula (1) at the molecular terminals per molecule of the modified polyphenylene ether used as component (A) (the number of terminal functional groups) is not particularly limited. Specifically, it is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.5 to 3. If the number of terminal functional groups is too small, it tends to be difficult to obtain sufficient heat resistance of the cured product. On the other hand, if the number of terminal functional groups is too large, the reactivity becomes too high, which may result in problems such as reduced shelf life and reduced fluidity of the resin composition. In other words, when such modified polyphenylene ether is used, there is a risk of moldability problems such as poor molding, such as the generation of voids during multilayer molding, making it difficult to obtain highly reliable printed wiring boards due to insufficient fluidity.

[0070] The number of terminal functional groups in the modified polyphenylene ether described above can be, for example, a numerical value representing the average number of groups represented by the above formula (1) per molecule of all modified polyphenylene ethers present in 1 mole of the modified polyphenylene ether. This number of terminal functional groups can be measured, for example, by measuring the number of hydroxyl groups remaining in the obtained modified polyphenylene ether and calculating the difference from the number of hydroxyl groups in the polyphenylene ether before modification. This difference from the number of hydroxyl groups in the polyphenylene ether before modification is the number of terminal functional groups. The number of hydroxyl groups remaining in the modified polyphenylene ether can be measured by adding a quaternary ammonium salt (tetraethylammonium hydroxide) that associates with hydroxyl groups to a solution of the modified polyphenylene ether and measuring the UV absorbance of the resulting mixed solution.

[0071] The intrinsic viscosity of the modified polyphenylene ether used as component (A) is not particularly limited. Specifically, it is preferably 0.03 to 0.12 dl / g, more preferably 0.04 to 0.11 dl / g, and even more preferably 0.06 to 0.095 dl / g. If the intrinsic viscosity is too low, the molecular weight tends to be low, and it tends to be difficult to achieve low dielectric properties such as a low dielectric constant and a low dielectric loss tangent. If the intrinsic viscosity is too high, the viscosity tends to be high, sufficient fluidity cannot be achieved, and the moldability of the cured product tends to be reduced. Therefore, if the intrinsic viscosity of the modified polyphenylene ether is within the above range, excellent heat resistance and moldability of the cured product can be achieved.

[0072] The intrinsic viscosity mentioned above is the intrinsic viscosity measured in methylene chloride at 25° C., and more specifically, it is the value measured, for example, with a viscometer using a 0.18 g / 45 ml methylene chloride solution (liquid temperature: 25° C.). An example of such a viscometer is the "AVS500 Visco System" manufactured by Schott.

[0073] The method for synthesizing the modified polyphenylene ether used as component (A) is not particularly limited as long as it is possible to synthesize a modified polyphenylene ether having a group represented by the above formula (1) at its terminal.

[0074] The component (A) may be a modified polyphenylene ether having a terminal group represented by the formula (1) alone, or a combination of two or more modified polyphenylene ethers having a terminal group represented by the formula (1).Furthermore, it may be used in combination with one or more compounds represented by the general formula (2) described above.

[0075] An example of the modified polyphenylene ether having a group represented by the above formula (1) at its terminal, which is the component (A), is "Noryl SA9000" manufactured by SABIC Japan.

[0076] From the viewpoint of achieving low dielectric properties and excellent solder heat resistance, the content of component (A) is preferably 5 to 70 parts by mass, more preferably 6 to 60 parts by mass, even more preferably 7 to 50 parts by mass, and particularly preferably 8 to 40 parts by mass, per 100 parts by mass of the total of components (A), (B), and (B'). Component (B') will be described later.

[0077] [Component (B)] Component (B) is a thermoplastic elastomer having a number-average molecular weight of 60,000 or more. By including a thermoplastic elastomer having a number-average molecular weight of 60,000 or more as component (B), the resin composition becomes less likely to melt, and solder heat resistance can be improved. Furthermore, hereinafter, thermoplastic elastomers other than component (B) as described above, i.e., thermoplastic elastomers having a number-average molecular weight of less than 60,000, may be referred to as component (B').

[0078] The number average molecular weight of the thermoplastic elastomer as component (B) is determined by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene. When measuring the number average molecular weight of a film made of the resin composition, for example, the film may be dissolved in a solvent and the number average molecular weight of the component dissolved in the solvent may be measured.

[0079] The thermoplastic elastomer as component (B) preferably has a number average molecular weight of 60,000 or more, more preferably 100,000 or more, even more preferably 110,000 or more, and particularly preferably 120,000 or more. Such a number average molecular weight further improves solder heat resistance. There is no particular upper limit for the number average molecular weight of the thermoplastic elastomer as component (B). However, if the number average molecular weight of the thermoplastic elastomer is too high, the thermoplastic elastomer may become difficult to melt, resulting in poor workability. Therefore, the number average molecular weight of the thermoplastic elastomer as component (B) is preferably 200,000 or less, more preferably 150,000 or less, even more preferably 140,000 or less, and particularly preferably 130,000 or less.

[0080] The thermoplastic elastomer used as component (B) is not particularly limited, but is preferably a thermoplastic elastomer having a dielectric dissipation factor (tan δ) of less than 0.005 in the frequency range of 1 to 100 GHz. This contributes to the excellent dielectric properties of the thermosetting film formed from the resin composition of the present disclosure in the high-frequency range. The "thermoplastic elastomer having a dielectric dissipation factor (tan δ) of less than 0.005 in the frequency range of 1 to 100 GHz" is preferably a styrene-based thermoplastic elastomer, and more preferably a hydrogenated styrene-based thermoplastic elastomer. Here, the hydrogenated styrene-based thermoplastic elastomer refers to a hydrogenated styrene-based thermoplastic elastomer. Examples of hydrogenated styrene-based thermoplastic elastomers include styrene / butadiene / butylene / styrene block copolymer (partially hydrogenated, SBBS) and styrene / ethylene / butylene / styrene block copolymer (fully hydrogenated, SEBS). The use of a hydrogenated styrene-based thermoplastic elastomer can improve dielectric properties. When component (B) is a styrene-based thermoplastic elastomer, the styrene ratio of component (B) is preferably 10 to 70%, more preferably 15 to 60%. A styrene ratio of component (B) of 20 to 50% provides excellent film-forming properties and workability.

[0081] The hydrogenated styrene-based thermoplastic elastomer (B) is not particularly limited, but is preferably a styrene / ethylene / butylene / styrene block copolymer (SEBS). The styrene / ethylene / butylene / styrene block copolymer (SEBS) is a fully hydrogenated styrene-based thermoplastic elastomer without double bonds, which can further improve dielectric properties. Furthermore, using a styrene / ethylene / butylene / styrene block copolymer (SEBS) with a number-average molecular weight of 60,000 or more can improve solder heat resistance while also maintaining good dielectric properties. Furthermore, using a styrene / ethylene / butylene / styrene block copolymer (SEBS) as the (B) component can reduce curling when the resin composition is formed into a film. Another suitable example of the hydrogenated styrene-based thermoplastic elastomer (B) is a styrene / ethylene / ethylene / propylene / styrene block copolymer (SEEPS).

[0082] There are no particular restrictions on the content of the (B) component, but the mass ratio of the (A) component to the (B) component ((A) component:(B) component) is preferably 5:95 to 70:30, more preferably 10:90 to 67:33, even more preferably 20:80 to 60:40, and particularly preferably 25:75 to 40:60. From the viewpoint of solder heat resistance, the content of the (B) component is preferably greater than that of the (A) component. However, if the ratio of the (B) component is excessively high, tack may easily occur in the film when the resin composition is formed into a film, which may reduce workability. Furthermore, if the ratio of the (B) component is high, the dielectric properties of the resin composition may deteriorate, so the above range is preferred.

[0083] Furthermore, when the amount of the resin composition excluding the filler is taken as 100 parts by mass, the content of component (B) is preferably 20 to 95 parts by mass, more preferably 30 to 93 parts by mass, and even more preferably 35 to 80 parts by mass. By being in this range, excellent solder heat resistance is achieved while maintaining low dielectric properties.

[0084] The resin composition of this embodiment may contain multiple thermoplastic elastomers as component (B). The component (B) may contain multiple types of thermoplastic elastomers having a number average molecular weight of 60,000 or more. Furthermore, the resin composition of this embodiment may contain a thermoplastic elastomer (component (B')) having a number average molecular weight of less than 60,000 as a thermoplastic elastomer other than component (B). When the resin composition of this embodiment contains multiple thermoplastic elastomers, it is preferable that the content (by mass) of the thermoplastic elastomers having a number average molecular weight of 60,000 or more is greater than the content of the thermoplastic elastomers having a number average molecular weight of 60,000 or less.

[0085] Examples of the thermoplastic elastomer (B) having a number average molecular weight of 60,000 or more include those available from Kuraray Co., Ltd. under the trade names "Septon 8004," "Septon 8006," and "Septon V9461."

[0086] [Component (C)] Component (C) is an epoxy resin. Epoxy resins are compounds having one or more epoxy groups in their molecules, and when heated, the epoxy groups react to form a three-dimensional network structure, which then hardens. By including an epoxy resin as component (C), solder heat resistance can be further improved. Furthermore, by including an epoxy resin as component (C), adhesion can be improved even to smooth adherend surfaces, such as shiny copper surfaces.

[0087] The content of the epoxy resin of component (C) is not particularly limited, but is preferably 0.1 to 5.0 parts by mass, more preferably 0.5 to 4.0 parts by mass, and even more preferably 0.7 to 3.0 parts by mass, per 100 parts by mass of the total of components (A), (B), and (C). If the content of component (C) is too high, the dielectric loss tangent of the cured product may become high.

[0088] Furthermore, when the amount of the resin composition excluding the filler is taken as 100 parts by mass, the content of component (C) is preferably 0.1 to 5.0 parts by mass, more preferably 0.5 to 3.0 parts by mass, and even more preferably 0.6 to 2.0 parts by mass.

[0089] Specific examples of epoxy resins include, but are not limited to, bifunctional epoxy resins obtained by epoxidizing bisphenol compounds such as bisphenol A, bisphenol E, and bisphenol F, or derivatives thereof (e.g., alkylene oxide adducts); diols having an alicyclic structure such as cyclohexanediol, cyclohexanedimethanol, and cyclohexanediethanol, or derivatives thereof; aliphatic diols such as butanediol, hexanediol, octanediol, nonanediol, and decanediol, or derivatives thereof; trifunctional epoxy resins having a trihydroxyphenylmethane skeleton or an aminophenol skeleton; and polyfunctional epoxy resins obtained by epoxidizing phenol novolac resins, cresol novolac resins, phenol aralkyl resins, biphenyl aralkyl resins, and naphthol aralkyl resins. Bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and aminophenol-type epoxy resins are preferred. The compounds exemplified here may be used alone or in combination.

[0090] The epoxy resin of component (C) is preferably liquid at room temperature (25°C).

[0091] [Component (D)] Component (D) is a curing agent. There are no particular limitations on the curing agent for component (D) as long as it generally cures epoxy resins, and the curing agent in this application also includes curing catalysts that promote the reaction of epoxy resins. There are no particular limitations on the curing agent, but imidazole-based curing catalysts are more preferred because they allow for appropriate adjustment of curability.

[0092] The imidazole curing catalyst may be imidazole, and it is also possible to use imidazole adducts, clathrated imidazoles, microencapsulated imidazoles, imidazole compounds coordinated with stabilizers, etc. These have a nitrogen atom with an unshared electron pair in their structure, which can activate the epoxy group and also activate other epoxy resins used in combination, thereby accelerating curing.

[0093] Specific examples of imidazole-based curing catalysts include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methyl, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazolium trimellitate, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazolium trimellitate, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diaminoimidazole, 2,4-dimethyl ... Examples of the methylimidazole derivatives include, but are not limited to, 2,4-diamino-6-(2'-methylimidazolyl-(1'))-ethyl-s-triazine, 2,4-diamino-6-(2'-undecylimidazolyl-(1'))-ethyl-s-triazine, 2,4-diamino-6-(2'-ethyl-4-methylimidazolyl-(1'))-ethyl-s-triazine, 2,4-diamino-6-(2'-methylimidazolyl-(1'))-ethyl-s-triazine·isocyanuric acid adduct, 2-phenylimidazole·isocyanuric acid adduct, 2-methylimidazole·isocyanuric acid adduct, 1-cyanoethyl-2-phenyl-4,5-di(2-cyanoethoxy)methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole. Imidazoles modified by adduct treatment, inclusion treatment with a foreign molecule, microencapsulation treatment, or coordination with a stabilizer are the imidazoles described above. These imidazoles exhibit excellent pot life at low temperatures while still maintaining high curing and curing acceleration capabilities by reducing their activity through adduct treatment, inclusion treatment with a foreign molecule, microencapsulation treatment, or coordination with a stabilizer.

[0094] Commercially available imidazole products (hereinafter referred to as trade names) include, but are not limited to, 2E4MZ, 2P4MZ, 2PZ-CN, C11Z-CNS, C11Z-A, 2MZA-PW, 2MA-OK, 2P4MHZ-PW, and 2PHZ-PW (all manufactured by Shikoku Chemicals Corporation), and EH2021 (manufactured by ADEKA Corporation). Commercially available imidazole adducts include, but are not limited to, PN-50, PN-50J, PN-40, PN-40J, PN-31, PN-23, and PN-H (all manufactured by Ajinomoto Fine-Techno Co., Inc.), which have a structure in which an imidazole compound is ring-opened and added to the epoxy group of an epoxy resin. Commercially available products of clathrate imidazole include, but are not limited to, TIC-188, KM-188, HIPA-2P4MHZ, NIPA-2P4MHZ, TEP-2E4MZ, HIPA-2E4MZ, and NIPA-2E4MZ (all manufactured by Nippon Soda Co., Ltd.). Commercially available products of microencapsulated imidazole include, for example, Novacure HX3721, HX3722, HX3742, and HX3748 (all manufactured by Asahi Kasei Corporation), and LC-80 (all manufactured by A&C Catalysts).

[0095] The content of the curing agent can be appropriately selected depending on the type of curing agent used as component (D). Furthermore, when the amount of the resin composition excluding the filler is 100 parts by mass, the content of component (D) is preferably 0.001 to 1.0 part by mass, more preferably 0.005 to 0.60 part by mass. Furthermore, the content of the imidazole-based curing catalyst is preferably 0.1 to 10% by mass, more preferably 1 to 6% by mass, relative to the epoxy resin. If the content of component (D) is too low, the curing properties of the film produced using the resin composition may be impaired, resulting in reduced adhesion, toughness, and heat resistance. On the other hand, if the content of component (D) is too high, the shelf life of the film produced using the resin composition may be reduced, and the inherent physical properties of the resin may be impaired in the cured product, resulting in reduced adhesion, toughness, and heat resistance.

[0096] [Component (E)] Component (E) is an organic peroxide. The inclusion of such an organic peroxide shifts the reaction initiation temperature of component (A) to a lower temperature, accelerating the curing of the resin composition. This further improves the solder heat resistance of the resin composition. The content of the organic peroxide can be selected appropriately depending on the type, but is typically preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, per 100 parts by mass of component (A).

[0097] Examples of organic peroxides include diacyl peroxides such as benzoyl peroxide, isobutyryl peroxide, isononanoyl peroxide, decanoyl peroxide, lauroyl peroxide, parachlorobenzoyl peroxide, and di(3,5,5-trimethylhexanoyl)peroxide; peroxyketals such as 2,2-di(4,4-di-(di-tert-butylperoxy)cyclohexyl)propane; isopropyl percarbonate; Peroxydicarbonates such as sec-butyl purge carbonate, di-2-ethylhexyl purge carbonate, di-1-methylheptyl purge carbonate, di-3-methoxybutyl purge carbonate, and dicyclohexyl purge carbonate; tert-butyl perbenzoate, tert-butyl peracetate, tert-butyl per-2-ethylhexanoate, tert-butyl perisobutyrate, tert-butyl perpivalate, and tert-butyl Peroxy esters such as diperadipate, cumyl perneodecanoate, tert-butyl peroxybenzoate, and 2,5-dimethyl-2,5-di(benzoylperoxy)hexane; ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; dialkyl peroxides such as di-tert-butyl peroxide, dicumyl peroxide, tert-butylcumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne-3,1,1-di(t-hexylperoxy)-3,3,5-trimethylcyclohexane, di-tert-hexyl peroxide, and di(2-tert-butylperoxyisopropyl)benzene; and hydroperoxides such as cumene hydroxyperoxide, tert-butyl hydroperoxide, and p-menthahydroperoxide can be used. There are no particular restrictions on the organic peroxide used, but since a drying step at, for example, about 60 to 80° C. is often required when curing the resin composition, it is preferable to use one whose 10-hour half-life temperature is 100 to 140° C. Furthermore, one whose 10-hour half-life temperature is 110 to 130° C. is more preferable.

[0098] Commercially available organic peroxides of component (E) (hereinafter referred to as trade names) include Perbutyl H, Perbutyl Z, Perbutipurcumyl P, Percumyl D, Percumyl H, and Perhexa C (all manufactured by NOF Chemical Corporation).

[0099] [Component (F)] Component (F) is a flame retardant. The flame retardant as component (F) is an optional component that is appropriately contained within a range that does not impair the effects of the resin composition of the present embodiment described above. For example, in resin compositions used for insulating layers of printed wiring boards, flame retardancy may be required in addition to the solder heat resistance and low dielectric properties described above. In response to such requirements, further including a flame retardant as component (F) can contribute to improving the flame retardancy of a cured product made from the resin composition of the present embodiment.

[0100] The type of flame retardant is not particularly limited. For example, the flame retardant as component (F) may be an inorganic phosphorus-based flame retardant, an organic phosphorus-based flame retardant, or a metal hydrate such as aluminum hydroxide hydrate or magnesium hydroxide hydrate. One type of flame retardant as component (F) may be used alone, or two or more types may be used in combination.

[0101] Examples of inorganic phosphorus-based flame retardants include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; inorganic nitrogen-containing phosphorus compounds such as phosphoric acid amide; phosphoric acid; and phosphine oxide.

[0102] Examples of organic phosphorus-based flame retardants include phosphate ester-based flame retardants, mono-substituted phosphonic acid diesters and di-substituted phosphinic acid esters, metal salts of di-substituted phosphinic acids, organic nitrogen-containing phosphorus compounds, cyclic organic phosphorus compounds, etc. Examples of "metal salts" include lithium salts, sodium salts, potassium salts, calcium salts, magnesium salts, aluminum salts, titanium salts, zinc salts, etc.

[0103] The content of the flame retardant can be appropriately selected depending on the type of flame retardant used as component (F). Furthermore, when the amount of the resin composition excluding the filler is taken as 100 parts by mass, the content of component (F) is preferably 15 to 50 parts by mass, and more preferably 20 to 40 parts by mass. Furthermore, examples of the flame retardant as component (F) include metal phosphinates (for example, trade name "OP-935" manufactured by Clariant Japan KK).

[0104] [Component (G)] Component (G) is a filler. There are no particular limitations on the type of filler used as component (G), and examples include known inorganic fillers. The filler used as component (G) is required to have insulating properties and a low thermal expansion coefficient.

[0105] As the inorganic filler of component (G), a general inorganic filler can be used. Examples of inorganic fillers include silica, alumina, aluminum nitride, calcium carbonate, aluminum silicate, magnesium silicate, magnesium carbonate, barium sulfate, barium carbonate, lime sulfate, aluminum hydroxide, calcium silicate, potassium titanate, titanium oxide, zinc oxide, silicon carbide, silicon nitride, and boron nitride. The inorganic fillers may be used alone or in combination of two or more. From the viewpoint of insulating properties, silica fillers and alumina fillers are particularly preferred. Furthermore, from the viewpoint of dielectric properties, silica fillers are preferred. The inorganic fillers may be surface-treated with a silane coupling agent having one or more functional groups selected from acrylic, methacrylic, styryl, amino, epoxy, and vinyl. For example, the inorganic filler is preferably surface-treated with a surface treatment agent such as an aminosilane coupling agent, a ureidosilane coupling agent, an epoxysilane coupling agent, a mercaptosilane coupling agent, a silane coupling agent, a vinylsilane coupling agent, a styrylsilane coupling agent, an acrylate silane coupling agent, an isocyanate silane coupling agent, a sulfide silane coupling agent, an organosilazane compound, or a titanate coupling agent to improve its heat resistance, moisture resistance, and dispersibility. These may be used alone or in combination of two or more. More preferably, among surface-treated silica fillers, it is preferable to use a silica filler surface-treated with a vinylsilane coupling agent. By using a silica filler surface-treated with a vinylsilane coupling agent, the thermal expansion coefficient can be improved.

[0106] The shape of the inorganic filler is not particularly limited, and examples include spherical, scaly, needle-like, and amorphous shapes. From the viewpoint of workability, spherical shapes are preferred. The average particle diameter is preferably 0.1 to 10 μm, and more preferably 0.1 to 4 μm. When the average particle diameter of the inorganic filler is within this range, excellent embedding properties are achieved between fine structures. The average particle diameter is the particle diameter at 50% of the cumulative value in the particle size distribution on a volume basis, measured by a laser diffraction / scattering method. The average particle diameter can be measured, for example, using a laser scattering diffraction particle size distribution measuring device: LS13320 (manufactured by Beckman Coulter, Inc., wet type).

[0107] Furthermore, when the resin composition contains the component (G), the content of the component (G) is preferably 0.1 to 90 parts by mass, more preferably 20 to 85 parts by mass, even more preferably 30 to 80 parts by mass, and particularly preferably 50 to 80 parts by mass, per 100 parts by mass of the nonvolatile components in the resin composition. By configuring the resin composition in this manner, the thermal expansion coefficient can be improved satisfactorily.

[0108] [Component (H)] Component (H) is a crosslinking agent. By including a crosslinking agent as component (H), cracking of a film made of the resin composition can be effectively prevented. Furthermore, by crosslinking with the polyphenylene ether resin as component (A), further improvement in the solder heat resistance of the resin composition can be expected.

[0109] Examples of crosslinking agents that can be used as component (H) include polybutadiene, triallyl isocyanurate, diallyl monoglycidyl isocyanurate, monoallyl diglycidyl isocyanurate, diallyl isocyanurate, and 2,2'-diallyl bisphenol A. However, among these crosslinking agents, it is preferable to use a crosslinking agent having an isocyanuric ring structure and two allyl groups in one molecule. The crosslinking agent for component (H) has two allyl groups, which allows it to have low dielectric properties while improving solder heat resistance. While the details are unclear, it is presumed that the isocyanuric ring structure of component (H) improves the heat resistance of the resin composition. Component (H) may also be a compound having an isocyanuric ring structure and two allyl groups in one molecule. This provides good solder heat resistance while maintaining low dielectric properties, as well as excellent film-forming properties, making it easier to form into a film. Component (H) may also be a compound that is liquid at 25°C.

[0110] Furthermore, component (H) may be a flame-retardant crosslinking agent that crosslinks with the polyphenylene ether resin (component (A)) and also imparts flame retardancy. For example, a flame-retardant crosslinking agent having an isocyanuric ring structure and two allyl groups in one molecule and a phosphorus-based substituent at the end can be used. This crosslinks with the polyphenylene ether resin (component (A)), improving the solder heat resistance of the resin composition and imparting flame retardancy.

[0111] Furthermore, the component (H) is preferably a compound represented by the following general formula (16).

[0112]

[0113] In the general formula (16), R is an alkyl group having 4 to 14 carbon atoms, preferably an alkyl group having 8 to 14 carbon atoms, and particularly preferably an alkyl group having 10 to 12 carbon atoms. R may also be a phosphorus-based substituent.

[0114] The content of the (H) component is preferably 10 to 70 parts by mass per 100 parts by mass of the (A) component. This configuration allows for improved solder heat resistance while maintaining low dielectric properties. While not particularly limited, the content of the (H) component is more preferably 15 to 65 parts by mass, and even more preferably 20 to 60 parts by mass, per 100 parts by mass of the (A) component. Furthermore, the (H) component is preferably contained in an amount of 2 to 50% by mass, more preferably 3 to 40% by mass, and particularly preferably 4 to 30% by mass, per 100% by mass of the nonvolatile components in the resin composition. When the content of the (H) component in 100% by mass of the nonvolatile components in the resin composition is within this range, the dielectric properties of the resin composition are excellent. The content of the (H) component in the nonvolatile components can be measured, for example, by infrared spectroscopy (FTIR) or gas chromatography mass spectrometry. If the number-average molecular weight of the thermoplastic elastomer (B) is too high, the thermoplastic elastomer may be difficult to melt, resulting in poor workability. However, by including a compound having an isocyanuric ring structure and two allyl groups per molecule and being liquid at 25°C, the melt viscosity of the resin composition can be reduced, making it easier to form a film, even when a thermoplastic resin with a high molecular weight is used. Furthermore, for example, when 50 parts by mass or more of the filler (G) is added per 100 parts by mass of the nonvolatile components in the resin composition, the cured resin composition tends to become brittle, and cracks may occur when the resin composition is formed into a film. In contrast, by adding the component (H) within the above range, the occurrence of cracks when the resin composition is formed into a film can be suppressed. Furthermore, by adding the component (H) within the above range, the curling tendency described below can be suppressed when the resin composition is formed into a film. From the above viewpoints, the amount of component (H) added is preferably 1 to 30 parts by mass, more preferably 3 to 25 parts by mass, even more preferably 5 to 20 parts by mass, and particularly preferably 7 to 15 parts by mass, per 100 parts by mass of filler (G).

[0115] An example of a compound of component (H) that has an isocyanuric ring structure and two allyl groups in one molecule and is liquid at 25°C is "L-DAIC," a product name manufactured by Shikoku Chemical Industries, Ltd. An example of a flame-retardant crosslinking agent that has an isocyanuric ring structure and two allyl groups in one molecule and has a phosphorus-based substituent at the terminal is "P-DAIC," a product name manufactured by Shikoku Chemical Industries, Ltd.

[0116] [Other Components] The resin composition of this embodiment may further contain components other than the components (A) to (H) described above. Examples of other components include various additives such as colorants, dispersants, silane coupling agents, antioxidants, and rheology control agents.

[0117] [Method for Producing Resin Composition] The resin composition of this embodiment can be produced by a conventional method, for example, by mixing the components described above using a Raikai mixer, a pot mill, a three-roll mill, a rotary mixer, a twin-screw mixer, or the like.

[0118] [Uses of Resin Composition] The resin composition of this embodiment can be suitably used as a resin composition for adhesive films used in electronic components. The resin composition of this embodiment can also be suitably used as a bonding sheet or interlayer adhesive for interlayer bonding of multilayer substrates. When the resin composition of this embodiment is used for various applications for electronic components, there are no particular restrictions on the electronic components to be bonded, and examples include ceramic substrates, organic substrates, semiconductor chips, and semiconductor devices.

[0119] Adhesive films, interlayer bonding sheets, interlayer adhesives, etc. using the resin composition of this embodiment are contained as cured products of the resin composition in laminates and semiconductor devices that constitute electronic components, etc. Therefore, laminates and semiconductor devices that constitute electronic components, etc. preferably contain a cured product of the resin composition of this embodiment.

[0120] The resin composition of this embodiment can also be used as a resin composition used to produce a semiconductor package with an antenna (a resin composition for a semiconductor package with an antenna). Details of the semiconductor package with an antenna will be described later. The resin composition of this embodiment can be suitably used as a resin composition for forming an insulating layer for connecting a semiconductor device part and an antenna part, or an insulating layer inside the antenna part, in such a semiconductor package with an antenna.

[0121] [Semiconductor Package with Antenna] Next, an embodiment of a semiconductor package with an antenna will be described. One embodiment of a semiconductor package with an antenna is a semiconductor package with an antenna 100 as shown in Fig. 1. Fig. 1 is a schematic partial cross-sectional view showing an example of a semiconductor package with an antenna.

[0122] 1, the antenna-equipped semiconductor package 100 has an antenna section 5 integrally formed with a semiconductor device section 10, and in particular is a semiconductor package 100 with an antenna as a high-frequency substrate on which an RF (radio frequency) chip 8 that performs 5G millimeter wave communication for transmitting and receiving is mounted. In the semiconductor device section 10, the antenna section 5 is connected to the RF chip 8 that performs millimeter wave communication by a wiring layer 4 having various wiring patterns.

[0123] 1 includes a core substrate 2, an antenna portion 5 disposed on one surface side of the semiconductor device portion 10, an insulating layer 1 (first insulating layer 1A) for connecting the semiconductor device portion 10 and the antenna portion 5, a wiring layer 4 having a multilayer structure disposed within the core substrate 2, and insulating layers 1 (second insulating layer 1B, third insulating layer 1C, fourth insulating layer 1D, fifth insulating layer 1E) configured to cover wiring vias in the wiring layer 4. The first insulating layer 1A may be provided not only so as to be interposed between the semiconductor device portion 10 and the antenna portion 5, but also so as to extend into the interior of the antenna portion 5.

[0124] In the semiconductor package with antenna 100, on the other surface side of the semiconductor device section 10, a part of the wiring layer 4 is connected to an RF chip 8 that performs communication by transmitting and receiving millimeter waves, and another part of the wiring layer 4 is connected to an electrical connecting metal 7. In the example shown in Fig. 1, the wiring layer 4 and the RF chip 8 are electrically connected via a hemispherical connecting pad 9. The electrical connecting metal 7 is a terminal section for physically and / or electrically connecting the semiconductor package with antenna 100 to the outside via the electrical connecting metal 7 according to its function.

[0125] During transmission, the insulating layer 1 is required to suppress attenuation of the current and millimeter-wave signal output from the RF chip 8 while transmitting them to the antenna unit 5 and efficiently radiating them into space, thereby minimizing loss (transmission loss) at the connection connecting the antenna unit 5 and the RF chip 8. Similarly, during reception, it is required to suppress attenuation of the reflected wave of the millimeter-wave signal received by the antenna unit 5 while transmitting the signal to the RF chip 8 serving as a receiver, thereby minimizing loss (transmission loss) at the connection connecting the antenna unit 5 and the RF chip 8.

[0126] The antenna section 5 is disposed on one surface of the semiconductor device section 10 as a patch antenna serving as a planar antenna.

[0127] The semiconductor package 100 with an antenna has a particular main feature in the configuration of at least one of the insulating layer 1 (e.g., first insulating layer 1A) for connecting the semiconductor device section 10 and the antenna section 5 and the insulating layer 1 inside the antenna section 5. The configuration of the insulating layer 1 in the semiconductor package 100 with an antenna of this embodiment will be described in more detail below. Note that hereinafter, the insulating layer 1 for connecting the semiconductor device section 10 and the antenna section 5 and the insulating layer 1 inside the antenna section 5 may be collectively referred to simply as the "insulating layer 1."

[0128] In the antenna-equipped semiconductor package 100, at least one insulating layer 1 is made of a cured product of a resin composition that is configured in the same manner as the resin composition of the present invention described above. That is, the cured product that constitutes the insulating layer 1 is a cured product of a resin composition that includes, as component (A), a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at its terminal, and as component (B), a thermoplastic elastomer having a number average molecular weight of 60,000 or more.

[0129] The antenna-equipped semiconductor package 100 having the insulating layer 1 configured as described above has excellent solder heat resistance and low dielectric properties. In the antenna-equipped semiconductor package 100 having the antenna unit 5 for 5G millimeter waves, for example, a solder test at 288°C may be performed on the insulating layer 1 for connecting the antenna unit 5, and solder heat resistance at a heat resistance temperature that was not previously required is required. Conventional semiconductor packages use known high-frequency films as insulating layers, but some of these high-frequency films do not meet the above-mentioned solder heat resistance requirements, and many of them are unusable for the antenna-equipped semiconductor package 100 having the antenna unit 5 for 5G millimeter waves. In the antenna-equipped semiconductor package 100 of this embodiment, the cured product constituting the insulating layer 1 preferably has a dielectric loss tangent (tanδ) of 0.0020 or less as measured at a frequency of 10 GHz using the SPDR (split post dielectric resonator) method, and a solder heat resistance of 290°C or more for 2 minutes.

[0130] The insulating layer 1 can be obtained by heat curing a resin composition containing the above-described components (A) and (B). The resin composition for forming the insulating layer 1 is a resin composition having the same composition as the resin composition of the present invention described above. In addition to the components (A) and (B) already described, the resin composition may also contain any of the other components (C) to (H), and further other components.

[0131] The semiconductor package 100 with an antenna of this embodiment has excellent solder heat resistance and excellent dielectric properties, and is therefore suitable for use as a semiconductor package equipped with an RF (radio frequency) chip 8 that transmits and receives 5G millimeter waves.

[0132] In the semiconductor package 100 with an antenna, it is preferable that the first insulating layer 1A for connecting the semiconductor device section 10 and the antenna section 5, and the second insulating layer 1B, third insulating layer 1C, fourth insulating layer 1D, and fifth insulating layer 1E configured to cover the wiring vias in the wiring layer 4 are each configured in the same manner as the insulating layer 1 made of the cured product described above.

[0133] Next, the method for producing the insulating layer 1 in the antenna-equipped semiconductor package 100 is not particularly limited, but the following method can be mentioned, for example.

[0134] First, a resin composition for a semiconductor package with an antenna containing at least component (A) and component (B) is prepared. Hereinafter, the "resin composition for a semiconductor package with an antenna" may be simply referred to as the "resin composition." From the viewpoint of ease of handling, the resin composition is preferably in the form of a film. This film for a semiconductor package with an antenna can be obtained, for example, by applying a solution of a resin composition containing component (A) and component (B) in an organic solvent to a support such as a PET film that has been subjected to a release treatment, and drying the solution at 80 to 130°C. The obtained film for a semiconductor package with an antenna is peeled from the support, attached to the semiconductor device portion 10, and subjected to heat treatment, for example, at 200°C for 30 to 60 minutes, thereby producing a semiconductor package with an antenna.

[0135] The configuration of the wiring layer 4 and the like in the semiconductor device portion 10 in the antenna-equipped semiconductor package 100 is not limited to the configuration shown in Fig. 1, and can be applied to various semiconductor packages equipped with a 5G millimeter wave antenna. For example, Fig. 2 is a schematic partial cross-sectional view showing another example of an antenna-equipped semiconductor package.

[0136] 2 is a semiconductor package with an antenna 200 in which antenna sections 25 and 26 are integrally formed with a semiconductor device section 30. In the semiconductor device section 10, the antenna sections 25 and 26 are connected to an RF chip 28 that performs millimeter wave communication by a wiring layer 24 having various wiring patterns.

[0137] The semiconductor device section 30 has a core substrate 22, an antenna section 25 disposed on one surface side of the semiconductor device section 30, and an insulating layer 21 for connecting the semiconductor device section 30 and the antenna section 25. An RF chip 28 that transmits and receives 5G millimeter waves is housed within the core substrate 22 and is wired by a wiring layer 24 disposed within the core substrate 22. Antenna sections 26 serving as dipole antennas in which linear conductors (elements) are disposed symmetrically on both ends of the semiconductor device section 30 are provided. The other surface side of the semiconductor device section 30 is connected to an electrical connecting metal 27 for physically and / or electrically connecting the antenna-equipped semiconductor package 200 to the outside.

[0138] 2, the insulating layer 21 is made of a cured resin composition containing a polyphenylene ether resin having a terminal functional group containing a carbon-carbon double bond as component (A) and a thermoplastic elastomer having a number average molecular weight of 60,000 or more as component (B), thereby providing excellent solder heat resistance and low dielectric properties. The cured product used for the insulating layer 21 can be one having the same configuration as the cured product used for the insulating layer 1 of the antenna-equipped semiconductor package 100 shown in FIG.

[0139] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. In the following examples, parts and % represent parts by mass and % by mass unless otherwise specified.

[0140] (Examples 1 to 20, Comparative Examples 1 and 2) [Sample Preparation] After weighing and blending the components to the blending ratios (parts by mass) shown in Tables 1 to 4 below, they were placed in a reaction vessel heated to 80°C and mixed at normal pressure for 4 hours while rotating at 150 rpm. When a curing agent (D) and / or an organic peroxide (E) were added, the curing agent (D) and / or the organic peroxide (E) were added after cooling. In this manner, varnishes containing the resin compositions of Examples 1 to 20 and Comparative Examples 1 and 2 were prepared.

[0141] The raw materials used in the preparation of the resin compositions in Examples 1 to 20 and Comparative Examples 1 and 2 are as follows: The number average molecular weights (Mn) of components (A), (B), and (B') were determined by chromatography.

[0142] [Component (A): Polyphenylene ether resin having a terminal functional group containing a carbon-carbon double bond] (A1): Polyphenylene ether resin having a terminal methacrylic group, manufactured by SABIC Japan, trade name "Noryl SA9000", number average molecular weight (Mn): 1,700. (A2): Polyphenylene ether resin having a terminal styrene group, manufactured by Mitsubishi Gas Chemical Company, Inc., trade name "OPE-2200", number average molecular weight (Mn): 2,200. (A3): Polyphenylene ether resin having a terminal styrene group, manufactured by Mitsubishi Gas Chemical Company, Inc., trade name "OPE-1200", number average molecular weight (Mn): 1,200.

[0143] [Component (B): Thermoplastic elastomer with a number average molecular weight of 60,000 or more] (B1): Styrene-based elastomer (SEBS (styrene ratio 31%)), manufactured by Kuraray Co., Ltd., trade name "Septon 8004", number average molecular weight (Mn): 76,495. (B2): Styrene-based elastomer (SEBS (styrene ratio 33%)), manufactured by Kuraray Co., Ltd., trade name "Septon 8006", number average molecular weight (Mn): 125,769. (B3): Styrene-based elastomer (SEEPS (styrene ratio 30%)), manufactured by Kuraray Co., Ltd., trade name "Septon V9461", number average molecular weight (Mn): 129,783.

[0144] [Component (B'): Thermoplastic elastomer having a number average molecular weight of less than 60,000] (B'4): Styrene-based elastomer (SEBS (styrene ratio 30%)), manufactured by Kraton, trade name "G1652", number average molecular weight (Mn): 53,864. (B'5): Styrene-based elastomer (SEEPS-OH (styrene ratio 28%)), manufactured by Kuraray, trade name "HG-252", number average molecular weight (Mn): 54,029.

[0145] [Component (C): Epoxy Resin] (C1): Bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name "828EL." (C2): Novolac type epoxy resin, manufactured by Nippon Kayaku Co., Ltd., trade name "EPPN-502H."

[0146] [Component (D): Curing Agent] (D1): ADEKA Corporation, trade name "EH2021". [Component (E): Organic Peroxide] (E1): NOF Chemical Corporation, trade name "Perbutyl Z". (E2): NOF Chemical Corporation, trade name "Percumyl D". [Component (F): Flame Retardant] (F1): Clariant Japan KK, trade name "OP935". [Component (G): Filler] (G1): Spherical silica surface-treated with an aminosilane coupling agent, Admatechs Corporation, trade name "SC4050 SX", average particle size 1.0 μm. [Component (H): Crosslinking Agent] (H1): Shikoku Chemical Industries, Ltd., trade name "L-DAIC". (H2): Shikoku Chemical Industries, Ltd., trade name "P-DAIC".

[0147] The "Raw Material Ratio" column in Tables 1 to 4 shows the ratios of raw materials used in preparing the resin compositions in Examples 1 to 17 and Comparative Examples 1 and 2. The ratios in each "Raw Material Ratio" column in Tables 1 to 4 are as follows: The "A / (A+B+B') x 100 (mass ratio)" column shows the content (parts by mass) of component (A) relative to 100 parts by mass of the total of component (A), component (B), and component (B'). The "B / (A+B) x 100 (mass ratio)" column shows the content (parts by mass) of component (B) relative to 100 parts by mass of the total of component (A) and component (B). The "C / (A+B+C) x 100 (mass ratio)" column shows the content (parts by mass) of component (C) relative to 100 parts by mass of the total of component (A), component (B), and component (C).

[0148] Next, a varnish containing the resin composition prepared as described above was applied to one side of a support (a PET film subjected to a release treatment) and dried at 100°C to obtain an adhesive film with a support.

[0149] The dielectric properties of the adhesive film with the support thus obtained were evaluated by the following method. The measurement results are shown in Tables 1 to 4.

[0150] [Dielectric Properties (Dielectric Constant (ε), Dielectric Loss Tangent (tan δ)]] Both sides of the adhesive film were sandwiched between release-treated PET films, and the adhesive film was thermally cured using a press. The thermal curing using a press was carried out at 200°C for 60 minutes under a pressure of 10 kgf / cm. ２ The conditions were as follows. Thereafter, the release-treated PET films placed on both sides of the cured adhesive film were removed, and test specimens (50±0.5 mm x 100±2 mm) were cut from the adhesive film, and their thicknesses were measured. The "Film Thickness" column in Tables 1 to 4 shows the measured film thicknesses of the adhesive films. Next, the dielectric constant (ε) and dielectric dissipation factor (tanδ) of the films (test specimens) whose thicknesses had been measured were measured using a dielectric resonator method (SPDR method). Note that the measurement frequency for the dielectric resonator method was 10 GHz. A dielectric constant (ε) of 2.50 or less was rated as "excellent," a value greater than 2.50 and less than 3.00 was rated as "good," and a value greater than 3.00 was rated as "unacceptable." Furthermore, a dielectric loss tangent (tan δ) of less than 0.00010 is rated as "excellent," 0.00010 or more and less than 0.0020 is rated as "good," 0.0020 or more and less than 0.0030 is rated as "passable," and 0.030 or more is rated as "unacceptable."

[0151] The adhesive films with the support thus obtained were subjected to the following solder heat resistance test, and evaluations of peel strength and curling properties were carried out. The results are shown in Tables 1 to 4.

[0152] [Soldering heat resistance] This was performed in accordance with JIS C5012 (1993). Specifically, copper foil was attached to both sides of the adhesive film with the roughened side facing inward, and the adhesive was subjected to thermocompression bonding using a press. The thermocompression bonding conditions were 200°C, 60 minutes, and 10 kgf / cm. ２The obtained test pieces were cut into 25 mm x 25 mm pieces and floated in a solder bath heated to 288°C, and the presence or absence of blistering was confirmed for 4 minutes. The results (seconds) shown in Tables 1 to 4 indicate the time (seconds) until blistering occurred visually on the test piece. If no blistering occurred within 4 minutes, it was recorded as "4 min ≦." The solder heat resistance was evaluated as "excellent" if no blistering occurred for 4 minutes or more. Furthermore, if the time until blistering occurred was 3 minutes or more but less than 4 minutes, it was evaluated as "good," if it was 2 minutes or more but less than 3 minutes, it was evaluated as "passable," and if it was less than 2 minutes, it was evaluated as "fail."

[0153] [Peel strength] This was performed in accordance with JIS C 6471. Specifically, copper foil was attached to both sides of the adhesive film with the roughened side facing inward, and then thermocompression bonded using a press. The copper foil used was 18 μm, product name "CF-T9" manufactured by Fukuda Metal Foil Co., Ltd. The thermocompression bonding conditions were 200°C, 60 minutes, and 10 kgf / cm ２ The obtained test pieces were cut into 10 mm widths and peeled off using an autograph to measure the peel strength. The measurement results were averaged for N=5.

[0154] [Curling] First, a varnish containing a resin composition was applied to one side of a support (a 38 μm thick PET film that had been subjected to a release treatment) and dried at 100°C to obtain a supported adhesive film. After the obtained supported adhesive film was returned to room temperature, the supported adhesive film was cut into a size of 30 cm x 50 cm to prepare a test piece for evaluating curling. The prepared test piece was placed on a horizontal table with the support side of the test piece facing downward, and the length shortened by curling of the test piece (warpage) was measured using the method described below. First, one edge of the test piece placed on a horizontal table was fixed to the table. For the test piece with one edge fixed in this way, the length shortened by curling was measured at the edge of the opposite edge of the test piece. If the length shortened by curling of the test piece (amount of warping) was less than 5 cm, it was rated as passing (good; "◯"), if it was 5 cm or more but less than 7 cm, it was also rated as passing (fair; "△"), and if it was 7 cm or more, it was rated as failing ("x").

[0155]

[0156]

[0157]

[0158]

[0159] [Results] As shown in Tables 1 to 4, the resin compositions of Examples 1 to 20 contained, as component (A), a polyphenylene ether resin having a terminal functional group containing a carbon-carbon double bond, and as component (B), a thermoplastic elastomer having a number average molecular weight of 60,000 or more. The resin compositions of Examples 1 to 20 showed good results in all evaluations of dielectric properties (dielectric constant (ε) and dielectric dissipation factor (tanδ)), solder heat resistance, peel strength, and curl resistance.

[0160] Furthermore, among the resin compositions of Examples 1 to 17, those using a styrene-based elastomer of SEBS as component (B) (i.e., Examples 1 to 5, 7 to 17) showed particularly good results in the evaluation of curling properties. Furthermore, those containing 50 parts by mass or more of the filler of component (G), such as the resin compositions of Examples 16, 18 to 20, also met the pass criteria in the evaluations of solder heat resistance, peel strength, and curling properties. In particular, the resin compositions containing a predetermined amount or more of the crosslinking agent of component (H), such as those of Examples 16, 18, and 19, showed good results in all evaluations, including the evaluation of curling properties.

[0161] The resin compositions of Comparative Examples 1 and 2 used a thermoplastic elastomer having a number average molecular weight of less than 60,000 as component (B'), and had significantly inferior solder heat resistance compared to the resin compositions of Examples 1 to 17. Furthermore, the resin composition of Comparative Example 2 showed a significantly large shortening in length due to curling (warpage), resulting in a significantly poor evaluation of curling. The deterioration in curling of the resin composition of Comparative Example 2 is presumed to be due to the use of a styrene-based elastomer, SEEPS-OH, as the thermoplastic elastomer.

[0162] The resin composition of the present invention can be used as a resin composition for adhesive films used in electronic components. The resin composition of the present invention can also be used as a bonding sheet for interlayer bonding or an interlayer adhesive for multilayer substrates. Furthermore, a semiconductor package with an antenna using the resin composition of the present invention can be used as a high-frequency substrate on which an RF chip that transmits and receives 5G millimeter waves is mounted. The resin composition for a semiconductor package with an antenna of the present invention can be used for the insulating layer of a semiconductor package with an antenna.

[0163] REFERENCE SIGNS LIST 1 Insulating layer 1A First insulating layer 1B Second insulating layer 1C Third insulating layer 1D Fourth insulating layer 1E Fifth insulating layer 2 Core substrate 4 Wiring layer 5 Antenna portion (patch antenna) 7 Electrically connecting metal 8 RF chip 9 Connection pad 10 Semiconductor device portion 21 Insulating layer 22 Core substrate 24 Wiring layer 25 Antenna portion (patch antenna) 26 Antenna portion (dipole antenna) 27 Electrically connecting metal 28 RF chip 30 Semiconductor device portion 100, 200 Semiconductor package with antenna

Claims

1. (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at its terminal; (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more.

2. The resin composition according to claim 1 , wherein the component (A) contains a modified polyphenylene ether having a styrene structure at its terminal.

3. The resin composition according to claim 1 or 2, wherein the component (A) contains a modified polyphenylene ether having a group represented by the following formula (1) at its terminal: 【Chemistry 1】 (In the above formula (1), R １ represents a hydrogen atom or an alkyl group.

4. The resin composition according to claim 1 or 2, wherein the component (B) is a styrene-based thermoplastic elastomer.

5. The resin composition according to claim 4 , wherein the component (B) is a hydrogenated styrene-based thermoplastic elastomer.

6. The resin composition according to claim 5, wherein the hydrogenated styrene-based thermoplastic elastomer of the component (B) is a styrene / ethylene / butylene / styrene block copolymer.

7. The resin composition according to claim 1 or 2, wherein the component (B) is a thermoplastic elastomer having a number average molecular weight of 100,000 or more.

8. The resin composition according to claim 1 or 2, wherein the mass ratio of the (A) component to the (B) component is 5:95 to 70:

30.

9. The resin composition according to claim 1 or 2, wherein the content of the component (B) is greater than the content of the component (A).

10. The resin composition according to claim 1 or 2, further comprising an epoxy resin (C).

11. The resin composition according to claim 10, wherein the content of the (C) component is 0.1 to 5.0 parts by mass relative to a total of 100 parts by mass of the (A) component, the (B) component, and the (C) component in the resin composition.

12. The resin composition according to claim 1 or 2, further comprising a curing agent (D).

13. An adhesive film using the resin composition according to claim 1 or 2.

14. A bonding sheet for interlayer bonding, which uses the resin composition according to claim 1 or 2.

15. A resin composition for a semiconductor package with an antenna, comprising the resin composition according to claim 1 or 2.

16. A laminate or a semiconductor device comprising a cured product of the resin composition according to claim 1 or 2.

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