Method for manufacturing printed circuit board and printed wiring board dividing jig

Abstract

A method for manufacturing a printed circuit board (400) comprises the following processes. A printed wiring board (200) is held using a printed wiring board dividing jig (100). The printed wiring board (200) is divided in a state in which a plurality of pressing portions (5) of the printed wiring board dividing jig (100) are supporting the printed wiring board (200). The printed wiring board (200) includes a first substrate member (91), a second substrate member (92), and a connecting portion (93). The plurality of pressing portions (5) include a plurality of first pressing portions (10) and a plurality of second pressing portions (20). In a step for dividing the printed wiring board (200), each of the plurality of first pressing portions (10) are disposed spaced apart along an extending direction of the connecting portion (93), each of the plurality of second pressing portions (20) are disposed spaced apart along the extending direction of the connecting portion (93), and the second substrate member (92) is divided from the first substrate member (91) at the connecting portion (93).

Description

Printed circuit board manufacturing method and printed wiring board dividing jig

[0001] The present disclosure relates to a method for manufacturing a printed circuit board and a printed wiring board dividing jig.

[0002] In the manufacture of a printed circuit board, wiring patterns are formed on the printed wiring board and electronic components are mounted on the printed wiring board. The printed wiring board is then divided. When dividing the printed wiring board, it is necessary to divide the printed wiring board in a manner that does not damage the electronic components mounted on the printed wiring board or the wiring patterns provided on the printed wiring board. As an example of a method for dividing a printed wiring board, Japanese Patent Laid-Open Publication No. 63-191599 (Patent Document 1) describes a method for dividing a printed wiring board using a board dividing device equipped with a jig member that clamps the printed wiring board.

[0003] Japanese Unexamined Patent Publication No. 191599 / 1983

[0004] However, with the board dividing device disclosed in Patent Document 1, when electronic components are mounted on or around the dividing boundary line of the board, it is difficult to fix the area around the board dividing line while avoiding interference between the board dividing device and the components, which may result in damage to the electronic components mounted on the printed wiring board and the wiring pattern provided on the printed wiring board when dividing the printed wiring board.

[0005] The present disclosure has been made in consideration of the above, and its purpose is to provide a method for manufacturing a printed circuit board and a printed wiring board dividing jig that can suppress damage to electronic components mounted on the printed wiring board and to wiring patterns provided on the printed wiring board.

[0006] A method for manufacturing a printed circuit board according to the present disclosure includes the following steps: A printed wiring board is held using a printed wiring board dividing jig; The printed wiring board is divided while multiple holding portions of the printed wiring board dividing jig support the printed wiring board; The printed wiring board has a first substrate member, a second substrate member, and a connecting portion; Electronic components are mounted on the first substrate member; The second substrate member is divided from the first substrate member; The connecting portion connects the first substrate member and the second substrate member; The first substrate member has a first surface and a second surface; The second surface is opposite the first surface; The multiple holding portions include multiple first holding portions and multiple second holding portions; The multiple second holding portions are spaced apart from the multiple first holding portions in the thickness direction of the printed wiring board. In the process of dividing the printed wiring board, each of the multiple first holding portions is arranged at a distance along the direction in which the connection portion extends, each of the multiple second holding portions is arranged at a distance along the direction in which the connection portion extends, the multiple first holding portions support the first surface, the multiple second holding portions support the second surface, and the second substrate member is divided from the first substrate member at the connection portion.

[0007] According to the method for manufacturing a printed circuit board disclosed herein, the printed wiring board is divided while the multiple clamping portions of the printed wiring board dividing jig support the printed wiring board. Therefore, even if electronic components are mounted on or around the connection portions, the multiple clamping portions can support the periphery of the connection portions while avoiding the electronic components. This reduces damage to the electronic components mounted on the printed wiring board and the wiring pattern provided on the printed wiring board.

[0008] 1 is a schematic perspective view showing the configuration of a printed wiring board dividing jig according to embodiment 1. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1. FIG. 3 is a schematic cross-sectional view taken along line III-III of FIG. 2. FIG. 4 is a schematic plan view showing the configuration of a printed wiring board according to embodiment 1. FIG. 5 is a schematic cross-sectional view taken along line V-V of FIG. 4. FIG. 6 is a flow diagram outlining a method for manufacturing a printed circuit board according to embodiment 1. FIG. 7 is a schematic perspective view showing a step of preparing a printed wiring board dividing jig. FIG. 8 is a schematic perspective view showing a step of holding a printed wiring board using a printed wiring board dividing jig. FIG. 9 is a schematic perspective view showing a step of dividing a printed wiring board. FIG. 10 is a schematic plan view showing positions at which a plurality of pressing portions are arranged. FIG. 11 is a schematic cross-sectional view showing positions at which a plurality of pressing portions are arranged. FIG. 12 is a schematic plan view showing the configuration of a printed circuit board according to embodiment 1. FIG. 13 is a schematic plan view showing the configuration of a printed wiring board according to a modified example of embodiment 1. FIG. 14 is a schematic perspective view showing the configuration of a printed wiring board dividing jig according to embodiment 2. FIG. 15 is a schematic cross-sectional view showing the configuration of a printed wiring board dividing jig according to embodiment 3.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0010] 1 to 3, the configuration of a printed wiring board dividing jig 100 according to embodiment 1 will be described. As shown in Fig. 1, the printed wiring board dividing jig 100 mainly includes a base portion 4, a holding portion 3, a plurality of pressing portions 5, a first plate 1, a second plate 2, a stopper 6, and a support portion 7.

[0011] The base portion 4 is shaped like a plate, for example. The thickness direction of the base portion 4 is the up-down direction Z. The holding portion 3 is provided on the base portion 4. The holding portion 3 holds the printed wiring board 200. The support portion 7 is provided on the base portion 4. The support portion 7 supports the second plate 2. The first plate 1 is attached to the base portion 4. The second plate 2 is attached to the support portion 7. The second plate 2 faces the first plate 1. The second plate 2 is spaced apart from the first plate 1. A plurality of pressing portions 5 are attached to each of the first plate 1 and the second plate 2. The plurality of pressing portions 5 support the printed wiring board 200. A stopper 6 is provided on the base portion 4. The stopper 6 is used to position the printed wiring board 200. The printed wiring board dividing jig 100 is a jig that supports the printed wiring board 200 when dividing the printed wiring board 200.

[0012] The holding unit 3 has a fixed rail 31, a movable rail 32, and a fixed unit 33. The fixed rail 31 is provided on the base unit 4. The fixed rail 31 extends in a direction perpendicular to the up-down direction Z. The direction in which the fixed rail 31 extends is defined as the front-rear direction Y. The direction perpendicular to each of the up-down direction Z and the front-rear direction Y is defined as the left-right direction X.

[0013] The movable rail 32 is provided on the base portion 4. The movable rail 32 extends along the front-rear direction Y. The movable rail 32 faces the fixed rail 31. The movable rail 32 is spaced apart from the fixed rail 31. The position of the movable rail 32 in the left-right direction X can be adjusted. From another perspective, the distance between the movable rail 32 and the fixed rail 31 in the left-right direction X can be adjusted. The fixed rail 31 and the movable rail 32 are configured to support the printed wiring board 200. A fixing portion 33 is provided on each of the fixed rail 31 and the movable rail 32.

[0014] The fixed rail 31 has a first bottom surface 41, a first top surface 43, and a first support surface 42. The fixed rail 31 contacts the base portion 4 at the first bottom surface 41. The first top surface 43 is located opposite the first bottom surface 41. The fixed portion 33 is provided on the first top surface 43. The first support surface 42 is located opposite the first bottom surface 41. In the vertical direction Z, the first support surface 42 is located between the first bottom surface 41 and the first top surface 43. From another perspective, in the vertical direction Z, the first support surface 42 is located between the fixed portion 33 and the base portion 4. In the left-right direction X, the first support surface 42 is located between the first top surface 43 and the movable rail 32. The first support surface 42 extends along the front-rear direction Y.

[0015] The movable rail 32 has a second bottom surface 51, a second top surface 53, and a second support surface 52. The movable rail 32 contacts the base portion 4 at the second bottom surface 51. The second top surface 53 is located opposite the second bottom surface 51. The fixed portion 33 is provided on the second top surface 53. The second support surface 52 is located opposite the second bottom surface 51. In the vertical direction Z, the second support surface 52 is located between the second bottom surface 51 and the second top surface 53. From another perspective, the second support surface 52 is located between the fixed portion 33 and the base portion 4 in the vertical direction Z. In the vertical direction Z, the second support surface 52 is located at substantially the same position as the first support surface 42. In the left-right direction X, the second support surface 52 is located between the first support surface 42 and the second top surface 53. The second support surface 52 extends along the front-rear direction Y.

[0016] In the vertical direction Z, the first plate 1 is located opposite the first top surface 43 with respect to the first support surface 42. From another perspective, in the vertical direction Z, the first support surface 42 is located between the first plate 1 and the first top surface 43. The first plate 1 extends in a direction perpendicular to the vertical direction Z. A first slit 19 is provided in the first plate 1. The first slit 19 extends in the left-right direction X. The first slit 19 penetrates the first plate 1 in the vertical direction Z.

[0017] In the up-down direction Z, the second plate 2 is located opposite the first plate 1 with respect to the first support surface 42. From another perspective, in the up-down direction Z, the first support surface 42 is located between the first plate 1 and the second plate 2. The second plate 2 extends along a direction perpendicular to the up-down direction Z. A second slit 29 is provided in the second plate 2. The second slit 29 extends along the left-right direction X. In the up-down direction Z, the second slit 29 penetrates the second plate 2. In the front-rear direction Y, the second slit 29 may be provided at substantially the same position as the first slit 19. From another perspective, the second slit 29 may overlap the first slit 19 when viewed along the up-down direction Z.

[0018] The plurality of pressing portions 5 are spaced apart from one another. Each of the plurality of pressing portions 5 is made of resin. Specifically, each of the plurality of pressing portions 5 is made of, for example, epoxy resin. The plurality of pressing portions 5 includes a plurality of first pressing portions 10 and a plurality of second pressing portions 20.

[0019] The first pressing portions 10 are attached to the first plate 1 in the first slits 19. The first pressing portions 10 extend along the up-down direction Z. The number of first pressing portions 10 is, for example, six. The six first pressing portions 10 are spaced apart from one another. The six first pressing portions 10 are lined up along the left-right direction X.

[0020] The second pressing portions 20 are attached to the second plate 2 through the second slits 29. The second pressing portions 20 are spaced apart from the first pressing portions 10. Specifically, the second pressing portions 20 are spaced apart from the first pressing portions 10 in the up-down direction Z. The second pressing portions 20 extend along the up-down direction Z. The number of second pressing portions 20 is, for example, six. The six second pressing portions 20 are spaced apart from one another. The six second pressing portions 20 are lined up along the left-right direction X. The six second pressing portions 20 face the first pressing portions 10. In the front-rear direction Y, the second pressing portions 20 may be located at substantially the same position as the first pressing portions 10.

[0021] As shown in Figures 2 and 3, the printed wiring board dividing jig 100 has a third plate 63, a first screw 61, a second screw 62, and a spring 64. The cross section shown in Figure 2 is parallel to the left-right direction X and intersects with each of the first pressing portion 10 and the second pressing portion 20. Figure 2 shows an enlarged view of an area including one first screw 61, one first pressing portion 10, one second screw 62, and one second pressing portion 20. The cross section shown in Figure 3 is parallel to the front-rear direction Y and intersects with each of the first pressing portion 10 and the second pressing portion 20.

[0022] 2 and 3, the first plate 1 has an outer circumferential portion 16 and an inner circumferential portion 17. The outer circumferential portion 16 is in contact with the base portion 4 (see FIG. 1). The inner circumferential portion 17 is continuous with the outer circumferential portion 16. The inner circumferential portion 17 is surrounded by the outer circumferential portion 16. The inner circumferential portion 17 is in contact with the first pressing portion 10. In the vertical direction Z, the thickness of the inner circumferential portion 17 is smaller than the thickness of the outer circumferential portion 16.

[0023] The first pressing portion 10 has a first main body portion 11 and a first tapered portion 12. The first main body portion 11 is in contact with an inner peripheral portion 17. The first main body portion 11 is surrounded by an outer peripheral portion 16. A first screw hole 18 is provided in the first main body portion 11. The first screw hole 18 extends along the up-down direction Z. The first tapered portion 12 is continuous with the first main body portion 11. The diameter of the first tapered portion 12 decreases as the distance from the first main body portion 11 increases.

[0024] The first tapered portion 12 forms a first tip surface 13. The first tip surface 13 is a portion that contacts the printed wiring board 200. The diameter of the first tip surface 13 is a first diameter D1. The first diameter D1 is, for example, 3 mm. In the vertical direction Z, the position of the first tip surface 13 and the positions of the first support surface 42 (see FIG. 1) and the second support surface 52 (see FIG. 1) may be substantially the same.

[0025] The first screw 61 is fastened to the first retaining portion 10 in the first screw hole 18. The first screw 61 is surrounded by both the inner circumferential portion 17 and the outer circumferential portion 16. The first screw 61 and the first retaining portion 10 sandwich the inner circumferential portion 17, thereby fixing the first retaining portion 10 and the first screw 61. By loosening the fastening between the first screw 61 and the first retaining portion 10, the first retaining portion 10 and the first screw 61 can move along the first slit 19. From another perspective, by loosening the fastening between the first screw 61 and the first retaining portion 10, the positions of the first retaining portion 10 and the first screw 61 in the left-right direction X can be adjusted. In other words, the six first retaining portions 10 are provided so that the positions of each of the six first retaining portions 10 in the left-right direction X can be adjusted.

[0026] 2 and 3, the second pressing portion 20 has a second main body portion 21, a second tapered portion 22, a neck portion 24, and a head portion 25. The second tapered portion 22 is continuous with the second main body portion 21. The second tapered portion 22 faces the first tapered portion 12. The diameter of the second tapered portion 22 decreases with increasing distance from the second main body portion 21.

[0027] The second tapered portion 22 forms a second tip surface 23. The second tip surface 23 is the portion that contacts the printed wiring board 200. The second tip surface 23 faces the first tip surface 13. The diameter of the second tip surface 23 is defined as a second diameter D2. The second diameter D2 is, for example, substantially the same as the first diameter D1.

[0028] The neck portion 24 is continuous with the second main body portion 21. The neck portion 24 is located on the opposite side of the second main body portion 21 from the second tapered portion 22. From another perspective, the second main body portion 21 is located between the second tapered portion 22 and the neck portion 24. The shape of the neck portion 24 is, for example, cylindrical. The diameter of the neck portion 24 is smaller than the diameter of the second main body portion 21.

[0029] The head 25 is continuous with the neck 24. The head 25 is located on the opposite side of the neck 24 from the second body 21. From another perspective, the neck 24 is located between the second body 21 and the head 25. The head 25 has a disk-like shape, for example. The diameter of the head 25 is larger than the diameter of the neck 24.

[0030] The third plate 63 has a through hole 27 and a second screw hole 28. The through hole 27 extends along the vertical direction Z. The second pressing portion 20 is attached to the third plate 63 through the through hole 27. Specifically, a neck portion 24 is disposed in the through hole 27. From another perspective, the neck portion 24 is surrounded by the third plate 63. The neck portion 24 may be spaced apart from the third plate 63. The head portion 25 may be surrounded by the second plate 2. The head portion 25 may be in contact with the third plate 63. The through hole 27 allows the second pressing portion 20 to move along the vertical direction Z.

[0031] The second screw holes 28 are provided along the up-down direction Z. In the second screw holes 28, second screws 62 are fastened to the third plate 63. The second screws 62 are surrounded by the second plate 2. The second screws 62 and the third plate 63 are fixed by sandwiching the second plate 2 between them. By loosening the fastening between the second screws 62 and the third plate 63, the second screws 62, the third plate 63, and the second pressing portions 20 can move along the second slits 29. From another perspective, by loosening the fastening between the second screws 62 and the third plate 63, the positions of the second screws 62, the third plate 63, and the second pressing portions 20 in the left-right direction X can be adjusted. In other words, the six second pressing portions 20 are provided so that the positions of each of the six second pressing portions 20 in the left-right direction X can be adjusted.

[0032] The spring 64 surrounds the neck portion 24. In the vertical direction Z, the spring 64 is provided between the third plate 63 and the second main body portion 21. The spring 64 is in contact with, for example, each of the third plate 63 and the second main body portion 21. The spring 64 is, for example, a compression coil spring. The spring 64 can apply an elastic force along the vertical direction Z to each of the third plate 63 and the second pressing portion 20.

[0033] 4 and 5, the configuration of a printed wiring board 200 according to the present disclosure will be described. As shown in Fig. 4, the printed wiring board 200 mainly includes a first substrate member 91, a second substrate member 92, a connection portion 93, an electronic component 99, a connector 97, an integrated circuit 98, and a wiring pattern (not shown). The thickness direction of the printed wiring board 200 is the vertical direction Z (see Fig. 1).

[0034] An electronic component 99, an integrated circuit 98, and a connector 97 are mounted on the first substrate member 91. Specifically, the electronic component 99, the integrated circuit 98, and the connector 97 are fixed to the first substrate member 91 by solder (not shown). The solder contains, for example, tin (Sn), silver (Ag), and copper (Cu). In other words, the solder is, for example, an Sn-Ag-Cu solder. A wiring pattern is provided on the first substrate member 91. The wiring pattern is made of metal. The wiring pattern electrically connects the electronic component 99, the integrated circuit 98, and the connector 97.

[0035] The second substrate member 92 is a portion separated from the first substrate member 91. The electronic components 99, the integrated circuit 98, and the connector 97 may not be mounted on the second substrate member 92. The second substrate member 92 is spaced apart from the first substrate member 91. The connection portion 93 is provided between the first substrate member 91 and the second substrate member 92. The connection portion 93 connects the first substrate member 91 and the second substrate member 92. The connection portion 93 extends along the left-right direction X.

[0036] Each of the first substrate member 91, the second substrate member 92, and the connecting portion 93 is made of, for example, glass cloth and epoxy resin. Specifically, each of the first substrate member 91, the second substrate member 92, and the connecting portion 93 is made by impregnating glass cloth with epoxy resin.

[0037] The electronic component 99 is, for example, a surface-mount electronic component. Specifically, the electronic component 99 is, for example, a ceramic capacitor. When viewed along the vertical direction Z, the shape of the electronic component 99 is, for example, rectangular. When viewed along the vertical direction Z, the long side of the electronic component 99 is, for example, 0.6 mm. When viewed along the vertical direction Z, the short side of the electronic component 99 is, for example, 0.3 mm. The ceramic capacitor has an internal electrode (not shown) and a dielectric ceramic (not shown). The dielectric ceramic is, for example, barium titanate (BaTiO ３ ), calcium titanate (CaTiO ３ ), strontium titanate (SrTiO ３ ) or calcium zirconate (CaZrO ３ ) etc.

[0038] As shown in Fig. 5, the first substrate member 91 has a first surface 81 and a second surface 82. The second surface 82 is opposite the first surface 81. An electronic component 99 (see Fig. 4) and an integrated circuit 98 (see Fig. 4) are mounted on the second surface 82. The electronic component 99 and the integrated circuit 98 may also be mounted on the first surface 81. For example, a connector 97 is mounted on the second surface 82. On the other hand, the connector 97 is not mounted on the first surface 81.

[0039] The thickness of the printed wiring board 200 in the vertical direction Z is defined as a first thickness H1. The first thickness H1 is the distance between the first surface 81 and the second surface 82 in the vertical direction Z. The first thickness H1 is, for example, 1.6 mm. The first thickness H1 may be, for example, 0.2 mm or more and 3 mm or less. The cross section shown in FIG. 5 is parallel to the front-rear direction Y and intersects with the connector 97.

[0040] 4 and 5 , a portion of the connector 97 may be located on the connecting portion 93. A portion of the connector 97 may be located on the second substrate member 92. The connector 97 is spaced apart from each of the connecting portion 93 and the second substrate member 92.

[0041] 5 , the connection portion 93 has a first groove surface 71 and a second groove surface 72. The first groove surface 71 is continuous with the first surface 81. The second groove surface 72 is opposite the first groove surface 71. The second groove surface 72 is continuous with the second surface 82. In a cross section that is parallel to the front-rear direction Y and intersects with the connector 97, the first groove surface 71 is recessed in a direction from the first surface 81 to the second surface 82. In a cross section that is parallel to the front-rear direction Y and intersects with the connector 97, the second groove surface 72 is recessed in a direction from the second surface 82 to the first surface 81.

[0042] The distance between the first groove surface 71 and the second groove surface 72 in the vertical direction Z decreases with increasing distance from each of the first substrate member 91 and the second substrate member 92. From another perspective, the thickness of the connection portion 93 in the vertical direction Z is smallest at the center of the connection portion 93 in the Y direction. The thickness of the portion of the connection portion 93 that is thinnest in the vertical direction Z is defined as a second thickness H2. The second thickness H2 is smaller than the first thickness H1. The second thickness H2 is, for example, 0.4 mm.

[0043] (Method of Manufacturing Printed Circuit Board) Next, a method of manufacturing printed circuit board 400 according to embodiment 1 will be described with reference to Fig. 6 to Fig. 11. As shown in Fig. 6, the method of manufacturing printed circuit board 400 according to embodiment 1 mainly includes a step (S10) of preparing a printed wiring board dividing jig, a step (S20) of holding the printed wiring board using the printed wiring board dividing jig, and a step (S30) of dividing the printed wiring board.

[0044] First, a step (S10) of preparing a printed wiring board dividing jig is performed. As shown in Fig. 7 , the first plate 1 having the first pressing portion 10 attached thereto is attached to the base portion 4. With the first screw 61 and the first pressing portion 10 loosened, the position of the first pressing portion 10 in the left-right direction X is adjusted. The first pressing portion 10 is fixed by fastening the first screw 61 and the first pressing portion 10.

[0045] The distance between the movable rail 32 and the fixed rail 31 in the left-right direction X is adjusted so that the printed wiring board 200 (see FIG. 4) can be supported using the first support surface 42 and the second support surface 52. The position of the stopper 6 in the front-rear direction Y is adjusted. This adjusts the distance between the multiple pressing portions 5 and the connection portion 93 (see FIG. 4) in the front-rear direction Y.

[0046] Next, a step (S20) of holding the printed wiring board using a printed wiring board dividing jig is performed. As shown in Fig. 8 , printed wiring board 200 is placed on fixed rail 31 and movable rail 32. Specifically, printed wiring board 200 is placed on first support surface 42 (see Fig. 7 ) and second support surface 52 (see Fig. 7 ). In the left-right direction X, printed wiring board 200 is placed between first top surface 43 and second top surface 53.

[0047] The first pressing portion 10 contacts the first surface 81 (see FIG. 5 ) of the first substrate member 91. The printed wiring board 200 is pressed against the stopper 6. This positions the printed wiring board 200 in the front-rear direction Y. The printed wiring board 200 is sandwiched between the fixed rail 31, the movable rail 32, and the fixed portion 33. In this manner, the printed wiring board 200 is held using the printed wiring board dividing jig 100.

[0048] Next, a step (S30) of dividing the printed wiring board is performed. Second pressing portions 20 are attached to the second plate 2. The position of the second pressing portions 20 in the left-right direction X is adjusted. As shown in FIG. 9 , the second plate 2 to which the second pressing portions 20 are attached is attached to the support portion 7. The second pressing portions 20 contact the second surface 82 of the first substrate member 91. The first substrate member 91 is sandwiched between the first pressing portions 10 and the second pressing portions 20. From another perspective, the multiple second pressing portions 20 and the multiple first pressing portions 10 face each other with the first substrate member 91 interposed therebetween. This supports the first substrate member 91.

[0049] In Fig. 10 , the first support surface 42, the second support surface 52, and the second tip surface 23 of the second pressing portion 20 are each indicated by a two-dot chain line. The cross section shown in Fig. 11 corresponds to the cross section shown in Fig. 3 . As shown in Figs. 10 and 11 , each of the first pressing portion 10 and the second pressing portion 20 is spaced apart from the connecting portion 93. Each of the first pressing portion 10 and the second pressing portion 20 is arranged along the direction in which the connecting portion 93 extends. Specifically, each of the six first pressing portions 10 is spaced apart from each other along the direction in which the connecting portion 93 extends. Each of the six second pressing portions 20 is spaced apart from each other along the direction in which the connecting portion 93 extends.

[0050] The first pressing portion 10 is positioned so as to avoid the electronic component 99, the integrated circuit 98, and the connector 97. Similarly, the second pressing portion 20 is positioned so as to avoid the electronic component 99, the integrated circuit 98, and the connector 97. From another perspective, the first pressing portion 10 and the second pressing portion 20 do not press the electronic component 99, the integrated circuit 98, and the connector 97. Therefore, damage to the electronic component 99, the integrated circuit 98, and the connector 97 by the first pressing portion 10 and the second pressing portion 20 can be prevented. Note that it is sufficient for the first pressing portion 10 and the second pressing portion 20 not to come into contact with the electronic component 99, the integrated circuit 98, and the connector 97. The first pressing portion 10 and the second pressing portion 20 are spaced apart from the electronic component 99, the integrated circuit 98, and the connector 97. In the left-right direction X, the first pressing portion 10 and the second pressing portion 20 are each disposed between the first support surface 42 and the second support surface 52 .

[0051] The shortest distance between each of the plurality of holding portions 5 and the connecting portion 93 as viewed in the vertical direction Z is defined as a first shortest distance E1. Specifically, as shown in FIGS. 10 and 11 , as viewed in the vertical direction Z, the first shortest distance E1 in the second holding portion 20 is the shortest distance between the boundary between the second surface 82 and the second groove surface 72 and the outer edge of the second tip surface 23. Similarly, as viewed in the vertical direction Z, the first shortest distance E1 in the first holding portion 10 is the shortest distance between the boundary between the first surface 81 and the first groove surface 71 and the outer edge of the first tip surface 13. The first shortest distance E1 is, for example, 3 mm or more and 10 mm or less. The lower limit of the first shortest distance E1 is not particularly limited, but may be, for example, 5 mm or more or 6 mm or more. The upper limit of the first shortest distance E1 is not particularly limited, but may be, for example, 8 mm or less or 7 mm or less. If the first shortest distance E1 is less than 3 mm, the first pressing portion 10 and the second pressing portion 20 may each interfere with the second substrate member 92 when separating the second substrate member 92 from the first substrate member 91. If the first shortest distance E1 is longer than 10 mm, it may not be possible to sufficiently reduce distortion in the first substrate member 91 when separating the second substrate member 92 from the first substrate member 91.

[0052] 10 , when viewed along the vertical direction Z, the shortest distance between each of the first support surface 42 and the second support surface 52 and the connection portion 93 is set to be a second shortest distance E2. The second shortest distance E2 may be substantially the same as the first shortest distance E1.

[0053] In the left-right direction X, the distance between two adjacent first holding portions 10 out of the six first holding portions 10 is preferably 30 mm or less. If the distance between two adjacent first holding portions 10 is longer than 30 mm, distortion in the first substrate member 91 may not be sufficiently reduced when separating the second substrate member 92 from the first substrate member 91. By setting the distance between two adjacent first holding portions 10 to 30 mm or less, distortion in the first substrate member 91 can be effectively reduced. Similarly, in the left-right direction X, the distance between two adjacent second holding portions 20 out of the six second holding portions 20 is preferably 30 mm or less. If the distance between two adjacent second holding portions 20 is longer than 30 mm, distortion in the first substrate member 91 may not be sufficiently reduced when separating the second substrate member 92 from the first substrate member 91. Setting the distance between two adjacent second retaining portions 20 to 30 mm or less effectively reduces distortion in the first substrate member 91. The spring 64 applies an elastic force to the first substrate member 91 via the second retaining portions 20. The elastic force applied by the spring 64 is preferably, for example, 5 N or greater.

[0054] 11 , in a direction perpendicular to the up-down direction Z, the position of the second pressing portion 20 and the position of any one of the six first pressing portions 10 are substantially the same. From another perspective, the central axis (second central axis 102) of the second pressing portion 20 may substantially overlap the central axis (first central axis 101) of any one of the six first pressing portions 10. This causes the force applied from the first pressing portion 10 to the printed wiring board 200 and the force applied from the second pressing portion 20 to the printed wiring board 200 to be applied along the same straight line. This reduces the moment of the force applied to the printed wiring board 200. As a result, distortion in the printed wiring board 200 can be reduced.

[0055] Next, a force is applied to the second substrate member 92 in the vertical direction Z. This causes the thinner portion of the connection portion 93 to break. As a result, the second substrate member 92 is separated from the first substrate member 91 at the connection portion 93.

[0056] When the second substrate member 92 is separated from the first substrate member 91 at the connection portion 93, each of the multiple pressing portions 5 supports the first substrate member 91. Specifically, the first pressing portion 10 supports the first surface 81. The second pressing portion 20 supports the second surface 82. The printed wiring board 200 is separated while the multiple pressing portions 5 of the printed wiring board separating jig 100 support the printed wiring board 200. In this manner, the printed circuit board 400 is manufactured.

[0057] (Configuration of Printed Circuit Board) Next, the configuration of the printed circuit board 400 according to the first embodiment will be described with reference to FIG. 12 . As shown in FIG. 12 , the printed circuit board 400 mainly includes a first substrate member 91, an electronic component 99, an integrated circuit 98, a connector 97, and a wiring pattern (not shown). The electronic component 99, the integrated circuit 98, and the connector 97 are each fixed to the first substrate member 91 by solder (not shown). The electronic component 99 and the integrated circuit 98 may each be mounted on both sides of the first substrate member 91. The connector 97 is mounted on the second surface 82 of the first substrate member 91. The wiring pattern electrically connects the electronic component 99, the integrated circuit 98, and the connector 97. When viewed along the thickness direction of the printed circuit board 400, the connector 97 protrudes outside the first substrate member 91.

[0058] Next, the effects of the printed wiring board dividing jig 100 according to the first embodiment will be described.

[0059] Typically, when the printed wiring board 200 is divided, stress is applied to the periphery of the connection portion 93. This causes distortion around the connection portion 93. If the printed wiring board 200 is divided without supporting the periphery of the connection portion 93, distortion in the portion of the first substrate member 91 located around the connection portion 93 becomes excessively large. In this case, the electronic components mounted around the connection portion 93 and the wiring pattern of the board may each be damaged. In particular, if distortion in the portion of the first substrate member 91 where the ceramic capacitor is mounted is excessively large, cracks will occur inside the ceramic capacitor, damaging the ceramic capacitor.

[0060] If the retainer were an integrated part, it would be difficult to position the retainer while avoiding components mounted on or around the connecting portion 93 when supporting the first substrate member 91. As a result, the electronic components 99 mounted on the printed wiring board 200 and the wiring pattern provided on the printed wiring board 200 may each be damaged.

[0061] According to the manufacturing method for the printed circuit board 400 of the first embodiment, the printed wiring board is divided while the multiple pressing portions 5 of the printed wiring board dividing jig 100 support the printed wiring board 200. The multiple pressing portions 5 include multiple first pressing portions 10 and multiple second pressing portions 20. The multiple first pressing portions 10 are spaced apart along the direction in which the connection portions 93 extend. The multiple second pressing portions 20 are spaced apart along the direction in which the connection portions 93 extend. Therefore, even if electronic components 99 are mounted on or around the connection portions 93, the multiple pressing portions 5 can support the periphery of the connection portions 93 while avoiding the electronic components 99. This reduces distortion in the portion of the first substrate member 91 around the connection portions 93 when dividing the printed wiring board 200. As a result, damage to the electronic components 99 mounted on the printed wiring board 200 and to the wiring pattern provided on the printed wiring board 200 can be suppressed.

[0062] Moreover, according to the method for manufacturing the printed circuit board 400 according to the first embodiment, it is possible to obtain a highly reliable printed circuit board 400. Furthermore, by manufacturing an electronic device using the printed circuit board 400, it is possible to obtain a highly reliable electronic device.

[0063] According to the manufacturing method for printed circuit board 400 according to the first embodiment, in the step of dividing the printed wiring board, first pressing portion 10 supports first surface 81. Second pressing portion 20 supports second surface 82. Therefore, compared to a case where only one of first surface 81 or second surface 82 is supported, distortion of first substrate member 91 in the up-down direction Z can be reduced when dividing printed wiring board 200. This further reduces damage to electronic components 99 mounted on printed wiring board 200 and to the wiring pattern provided on printed wiring board 200.

[0064] According to the method for manufacturing printed circuit board 400 according to the first embodiment, each of the plurality of retaining portions 5 is made of resin. Resin is softer than the metal that constitutes the wiring pattern of printed wiring board 200. Therefore, when the plurality of retaining portions 5 support printed wiring board 200, even if the wiring pattern comes into contact with the plurality of retaining portions 5, damage to the wiring pattern can be suppressed.

[0065] If the first shortest distance E1 is excessively small, each of the multiple pressing portions 5 may interfere with the second substrate member 92 when the second substrate member 92 is separated from the first substrate member 91. If the first shortest distance E1 is excessively large, distortion in the first substrate member 91 cannot be sufficiently reduced when the second substrate member 92 is separated from the first substrate member 91. According to the manufacturing method for the printed circuit board 400 according to the first embodiment, in the step (S30) of separating the printed wiring board, the first shortest distance E1 between each of the multiple pressing portions 5 and the connection portion 93 is 3 mm or more and 10 mm or less when viewed along the vertical direction Z. Therefore, distortion in the first substrate member 91 can be sufficiently reduced while avoiding interference between each of the multiple pressing portions 5 and the second substrate member 92.

[0066] If the holding portion 5 were an integrated component, a dedicated holding portion 5 corresponding to the arrangement of components on the printed wiring board 200 would be necessary, for example, to avoid components mounted on or around the connection portion 93. According to the printed wiring board dividing jig 100 of the first embodiment, the first holding portion 10 and the second holding portion 20 are each configured to be adjustable in position in the left-right direction X. This allows the position of each of the multiple holding portions 5 to be adjusted to match the position of the connector 97 mounted on the connection portion 93 for each type of board. Therefore, it is possible to support the portion of the first board member 91 located around the connection portion 93 without providing a dedicated holding portion corresponding to the arrangement of components on the printed wiring board 200.

[0067] Although the above description has been given of a configuration in which the connection portion 93 has the first groove surface 71 and the second groove surface 72, the configuration of the printed wiring board dividing jig 100 according to the present disclosure is not limited to the above configuration. Specifically, as shown in Fig. 13 , perforations may be provided in the connection portion 93. From another perspective, a through hole 95 may be provided in the connection portion 93.

[0068] The connection portion 93 may have a connection member 94. When viewed along the vertical direction Z, the connection member 94 is a portion of the printed wiring board 200 included in an area obtained by extending the through hole 95 in the direction in which the through hole 95 extends. The connection member 94 connects the first substrate member 91 and the second substrate member 92. The connection portion 93 is an area that combines the area in which the through hole 95 is provided and the area in which the connection member 94 is located.

[0069] When viewed along the vertical direction Z, the first shortest distance E1 is the shortest distance between the outer edge of the connection portion 93 and the outer edge of each of the multiple pressing portions 5. From another perspective, when viewed along the vertical direction Z, the first shortest distance E1 is the shortest distance in the Y direction between the wall surface forming the through hole 95 and the outer edge of each of the multiple pressing portions 5.

[0070] Printed wiring board 200 may be made of an insulating base material, such as a glass nonwoven fabric, a paper base material, or the like, containing polyimide resin, phenolic resin, etc. First pressing portion 10 and second pressing portion 20 may each be made of a resin such as MC nylon (trademark) or polycarbonate.

[0071] The electronic component 99 may be a resistor, an inductor, a thermistor, etc. The solder may contain bismuth (Bi), indium (In), antimony (Sb), or lead (Pb). The solder may be made of Sn—Cu solder, Sn—Bi solder, Sn—In solder, Sn—Sb solder, or Sn—Pb solder.

[0072] A portion of the connector 97 may not be located above the connection portion 93. The number of first holding portions 10 is not limited to six. The number of first holding portions 10 may be, for example, two or more and thirty or less. The number of second holding portions 20 is not limited to six. The number of second holding portions 20 may be, for example, two or more and thirty or less. The second shortest distance E2 may be smaller than the first shortest distance E1. The second shortest distance E2 may be larger than the first shortest distance E1. In the front-rear direction Y, each of the first holding portions 10 and the second holding portions 20 may be disposed between the first support surface 42 and the second board member 92.

[0073] The outer shape of the first holding portion 10 may be a cylinder, an elliptical cylinder, a square prism, or a polygonal prism. When the outer shape of the first holding portion 10 is a square prism, the shape of the first tip surface 13 may be a square or a rectangle. Similarly, the outer shape of the second holding portion 20 may be a cylinder, an elliptical cylinder, a square prism, or a polygon. When the outer shape of the second holding portion 20 is a square prism, the shape of the second tip surface 23 may be a square, a rectangle, or a polygon.

[0074] Second Embodiment Next, the configuration of a printed wiring board dividing jig 100 according to a second embodiment will be described with reference to Figure 14. The printed wiring board dividing jig 100 according to the second embodiment differs from the configuration of the printed wiring board dividing jig 100 according to the first embodiment mainly in that it does not have the second pressing portion 20, but in other respects is substantially the same as the configuration of the printed wiring board dividing jig 100 according to the first embodiment. The following description will focus on the differences from the configuration of the printed wiring board dividing jig 100 according to the first embodiment.

[0075] 14 , the printed wiring board dividing jig according to the second embodiment does not necessarily have the second pressing portion 20 and the second plate 2. In the step (S30) of dividing the printed wiring board, when the second substrate member 92 is separated from the first substrate member 91, the first pressing portion 10 supports the first substrate member 91.

[0076] The surface of the first substrate member 91 supported by the first holding portion 10 is preferably a surface on which the connector 97 is not mounted. When the second substrate member 92 is separated from the first substrate member 91, the direction of the force applied to the second substrate member 92 is preferably along the vertical direction Z and in a direction from the first substrate member 91 toward the first holding portion 10. In other words, with the first holding portion 10 supporting the surface on which the connector 97 is not mounted, the force is preferably applied to the second substrate member 92 in a direction from the first substrate member 91 toward the first holding portion 10. This allows the first substrate member 91 to be supported by the first holding portion 10 while avoiding the second substrate member 92 coming into contact with the connector 97.

[0077] Third Embodiment Next, the configuration of a printed wiring board dividing jig 100 according to a third embodiment will be described with reference to Figure 15. The printed wiring board dividing jig 100 according to the third embodiment differs from the printed wiring board dividing jig 100 according to the first embodiment mainly in that it includes a pressure sensor 9, but is otherwise substantially identical to the configuration of the printed wiring board dividing jig 100 according to the first embodiment. The following description will focus on the differences from the configuration of the printed wiring board dividing jig 100 according to the first embodiment. The cross section shown in Figure 15 corresponds to the cross section shown in Figure 3.

[0078] 15 , the printed wiring board dividing jig 100 has a pressure sensor 9. In the vertical direction Z, the pressure sensor 9 is provided, for example, between the second pressing portion 20 and the third plate 63. Specifically, in the vertical direction Z, the pressure sensor 9 is provided, for example, between the third plate 63 and the spring 64. The pressure sensor 9 may surround the neck portion 24. The pressure sensor 9 is, for example, a piezoelectric element type.

[0079] The pressure sensor 9 detects the force applied from the first substrate member 91 to the plurality of holding portions 5. Specifically, when a force is applied to the second holding portion 20 in a direction from the printed wiring board 200 toward the second holding portion 20, the pressure sensor 9 is sandwiched between the spring 64 and the third plate 63. In this case, the force applied to the second holding portion 20 is applied to the pressure sensor 9 via the spring 64. As a result, the pressure sensor 9 indirectly detects the force applied from the first substrate member 91 to the second holding portion 20.

[0080] If there is an abnormality in the printed wiring board dividing jig 100 when the printed wiring board 200 is fixed using the multiple retaining members 5, the magnitude of the force applied from the first substrate member 91 to the multiple retaining members 5 will be outside the range of expected force magnitude. Therefore, by detecting the magnitude of the force using the pressure sensor 9, it is possible to detect an abnormality in the printed wiring board dividing jig 100.

[0081] Examples of abnormalities in the printed wiring board dividing jig 100 include, for example, abnormalities in the attachment of the first plate 1 or the second plate 2, misalignment of the first holding portion 10 or the second holding portion 20, damage to the first holding portion 10 or the second holding portion 20, a decrease in the elastic force of the spring 64 due to deterioration of the spring 64, abnormalities in the attachment of the first holding portion 10 to the first plate 1, abnormalities in the attachment of the second holding portion 20 to the second plate 2, etc.

[0082] Similarly, the pressure sensor 9 can be used to detect the above-mentioned abnormality when separating the second substrate member 92 from the first substrate member 91. If there is an abnormality in the shape of the connection portion 93, an excessively large force will be applied to the first substrate member 91 when separating the second substrate member 92 from the first substrate member 91. As a result, the force applied from the first substrate member 91 to the multiple pressing portions 5 will be larger than the expected range of force magnitude. Therefore, when separating the second substrate member 92 from the first substrate member 91, the pressure sensor 9 can be used to detect an abnormality in the shape of the connection portion 93.

[0083] When the second substrate member 92 is separated from the first substrate member 91 while an abnormality exists in either the printed wiring board dividing jig 100 or the connection portion 93, excessive strain may occur in the first substrate member 91. The printed wiring board dividing jig 100 according to the third embodiment includes a pressure sensor 9. This allows for detection of an abnormality in the printed wiring board dividing jig 100 or the connection portion 93. This prevents the second substrate member 92 from being separated from the first substrate member 91 while an abnormality exists in the printed wiring board dividing jig 100 or the connection portion 93. As a result, damage to the electronic components 99 mounted on the printed wiring board 200 and the wiring pattern provided on the printed wiring board 200 can be prevented.

[0084] Although the above description has been given of a configuration in which the pressure sensor 9 is a piezoelectric element type, the configuration of the printed wiring board dividing jig 100 according to the present disclosure is not limited to the above configuration. Specifically, the pressure sensor 9 may be a resistive film type or a capacitive type. In the vertical direction Z, the pressure sensor 9 may be provided between the first pressing portion 10 and the spring 64. The pressure sensor 9 may be provided between the first pressing portion 10 and the first plate 1.

[0085] The embodiments disclosed herein are to be considered as illustrative in all respects and not restrictive. The scope of the present disclosure is defined by the claims, not by the above description, and is intended to include meanings equivalent to the claims and all modifications within the scope thereof.

[0086] Various aspects of the present disclosure are summarized below as appendices. (Supplementary Note 1) A method for manufacturing a printed wiring board, comprising: a step of holding a printed wiring board using a printed wiring board dividing jig; and a step of dividing the printed wiring board with a plurality of pressing portions of the printed wiring board dividing jig supporting the printed wiring board, wherein the printed wiring board has: a first substrate member on which electronic components are mounted; a second substrate member to be divided from the first substrate member; and a connecting portion connecting the first substrate member and the second substrate member, the first substrate member having a first surface and a second surface opposite to the first surface, the plurality of pressing portions having a plurality of first pressing portions and a plurality of second pressing portions spaced apart from the plurality of first pressing portions in a thickness direction of the printed wiring board, and in the step of dividing the printed wiring board, each of the plurality of first pressing portions is arranged spaced apart along the direction in which the connecting portion extends, and each of the plurality of second pressing portions is arranged spaced apart along the direction in which the connecting portion extends, the plurality of first pressing portions support the first surface, The method for manufacturing a printed circuit board according to any one of Supplementary Notes 1 to 3, wherein the plurality of second pressing portions support the second surface, and the second substrate member is separated from the first substrate member at the connection portion. (Appendix 2) The method for manufacturing a printed circuit board according to Supplementary Note 1, wherein, in the step of dividing the printed wiring board, the plurality of second pressing portions and the plurality of first pressing portions face each other across the printed wiring board. (Appendix 3) The method for manufacturing a printed circuit board according to Supplementary Note 1 or Supplementary Note 2, wherein the plurality of first pressing portions are arranged so that their positions in the direction of extension of the connection portion are adjustable, and the plurality of second pressing portions are arranged so that their positions in the direction of extension of the connection portion are adjustable. (Appendix 4) The method for manufacturing a printed circuit board according to any one of Supplementary Notes 1 to 3, wherein, in the step of dividing the printed wiring board, the plurality of first pressing portions and the plurality of second pressing portions do not press down the electronic components.(Supplementary Note 5) The method for manufacturing a printed circuit board according to any one of Supplementary Notes 1 to 4, wherein the spacing between two adjacent first pressing portions among the plurality of first pressing portions in the direction of extension of the connection portion is 30 mm or less, and the spacing between two adjacent second pressing portions among the plurality of second pressing portions in the direction of extension of the connection portion is 30 mm or less. (Supplementary Note 6) The method for manufacturing a printed circuit board according to any one of Supplementary Notes 1 to 5, wherein each of the plurality of pressing portions is made of resin. (Supplementary Note 7) The method for manufacturing a printed circuit board according to any one of Supplementary Notes 1 to 6, wherein the printed wiring board dividing jig has a pressure sensor, and in the step of dividing the printed wiring board, the pressure sensor detects the force applied to the plurality of pressing portions from the printed wiring board. (Appendix 8) A method for manufacturing a printed circuit board according to any one of Appendices 1 to 7, wherein in the step of dividing the printed wiring board, the shortest distance between each of the plurality of pressing portions and the connection portion, as viewed along the thickness direction of the printed wiring board, is 3 mm or more and 10 mm or less. (Supplementary Note 9) A printed wiring board comprising: a holding portion that holds a printed wiring board; and a plurality of pressing portions that support the printed wiring board, wherein the printed wiring board has: a first substrate member on which electronic components are mounted; a second substrate member that is separated from the first substrate member; and a connection portion that connects the first substrate member and the second substrate member, wherein the first substrate member has a first surface and a second surface opposite to the first surface, wherein the plurality of pressing portions include a plurality of first pressing portions that are spaced apart from each other; and a plurality of second pressing portions that are spaced apart from each other in a thickness direction of the printed wiring board from the plurality of first pressing portions, wherein each of the plurality of first pressing portions is arranged along a direction in which the connecting portion extends, and each of the plurality of second pressing portions is arranged along a direction in which the connecting portion extends, wherein each of the plurality of first pressing portions and the plurality of second pressing portions support the first substrate member when the second substrate member is separated from the first substrate member at the connecting portion, and wherein the plurality of first pressing portions support the first surface, The plurality of second pressing portions support the second surface.(Supplementary Note 10) The printed wiring board dividing jig according to Supplementary Note 9, wherein the plurality of first pressing portions are provided so that the position of each of the plurality of first pressing portions in the direction of extension of the connection portion is adjustable, and the plurality of second pressing portions are provided so that the position of each of the plurality of second pressing portions in the direction of extension of the connection portion is adjustable. (Supplementary Note 11) The printed wiring board dividing jig according to Supplementary Note 9 or Supplementary Note 10, wherein each of the plurality of pressing portions is made of resin. (Supplementary Note 12) The printed wiring board dividing jig according to any one of Supplementary Notes 9 to 11, further comprising a pressure sensor that detects the force applied from the first substrate member to each of the plurality of pressing portions.

[0087] 1 First plate, 2 Second plate, 3 Holding portion, 4 Base portion, 5 Pressing portion, 6 Stopper, 7 Support portion, 9 Pressure sensor, 10 First pressing portion, 11 First main body portion, 12 First tapered portion, 13 First tip surface, 16 Outer periphery, 17 Inner periphery, 18 First screw hole, 19 First slit, 20 Second pressing portion, 21 Second main body portion, 22 Second tapered portion, 23 Second tip surface, 24 Neck portion, 25 Head portion, 27 Through hole, 28 Second screw hole, 29 Second slit, 31 Fixed rail, 32 Movable rail, 33 Fixed portion, 41 First bottom surface, 42 First support surface, 43 First top surface, 51 Second bottom surface, 52 Second support surface, 53 Second top surface, 61 First screw, 62 Second screw, 63 Third plate, 64 Spring, 71 First groove surface, 72 Second groove surface, 81 First surface, 82 Second surface, 91 First substrate member, 92 Second substrate member, 93 Connection portion, 94 Connection member, 95 Through hole, 97 Connector, 98 Integrated circuit, 99 Electronic component, 100 Printed wiring board dividing jig, 101 First central axis, 102 Second central axis, 200 Printed wiring board, 400 Printed circuit board, D1 First diameter, D2 Second diameter, E1 First shortest distance, E2 Second shortest distance, H1 First thickness, H2 Second thickness, X Left / right direction, Y Front / rear direction, Z Up / down direction.

Claims

1. holding the printed wiring board using a printed wiring board dividing jig; dividing the printed wiring board in a state where the plurality of holding portions of the printed wiring board dividing jig are supporting the printed wiring board, The printed wiring board comprises: a first substrate member on which electronic components are mounted; a second substrate member separated from the first substrate member; a connection portion connecting the first substrate member and the second substrate member, the first substrate member has a first surface and a second surface opposite the first surface; The plurality of holding portions include A plurality of first pressing portions; a plurality of second pressing portions spaced apart from the plurality of first pressing portions in a thickness direction of the printed wiring board, In the step of dividing the printed wiring board, The first pressing portions are spaced apart from one another along a direction in which the connecting portion extends, The second pressing portions are spaced apart from one another along a direction in which the connecting portion extends, The plurality of first pressing portions support the first surface, The plurality of second pressing portions support the second surface, the second substrate member is separated from the first substrate member at the connection portion, The first pressing portions are provided so that positions of the first pressing portions in a direction in which the connection portion extends can be adjusted, A method for manufacturing a printed circuit board, wherein the plurality of second pressing portions are provided so that the positions of each of the plurality of second pressing portions in the extension direction of the connection portion can be adjusted.

2. A step of holding a printed wiring board using a printed wiring board dividing jig; dividing the printed wiring board in a state where the plurality of holding portions of the printed wiring board dividing jig are supporting the printed wiring board, The printed wiring board comprises: a first substrate member on which electronic components are mounted; a second substrate member separated from the first substrate member; a connection portion connecting the first substrate member and the second substrate member, the first substrate member has a first surface and a second surface opposite the first surface; The plurality of holding portions include A plurality of first pressing portions; a plurality of second pressing portions spaced apart from the plurality of first pressing portions in a thickness direction of the printed wiring board, In the step of dividing the printed wiring board, The first pressing portions are spaced apart from one another along a direction in which the connecting portion extends, The second pressing portions are spaced apart from one another along a direction in which the connecting portion extends, The plurality of first pressing portions support the first surface, The plurality of second pressing portions support the second surface, the second substrate member is separated from the first substrate member at the connection portion, the printed wiring board dividing jig has a pressure sensor, A method for manufacturing a printed circuit board, wherein in the step of dividing the printed wiring board, the pressure sensor detects a force applied from the printed wiring board to each of the plurality of pressing portions.

3. 3. The method for manufacturing a printed circuit board according to claim 1, wherein in the step of dividing the printed wiring board, the second pressing portions and the first pressing portions face each other with the printed wiring board interposed therebetween.

4. 3. The method for manufacturing a printed circuit board according to claim 1, wherein in the step of dividing the printed wiring board, the plurality of first pressing portions and the plurality of second pressing portions do not press the electronic components.

5. In the extending direction of the connection portion, a distance between two adjacent first pressing portions among the plurality of first pressing portions is 30 mm or less; 3. The method for manufacturing a printed circuit board according to claim 1, wherein a distance between two adjacent second pressing portions of the plurality of second pressing portions in the extending direction of the connection portion is 30 mm or less.

6. The method for manufacturing a printed circuit board according to claim 1 or 2, wherein each of the plurality of pressing portions is made of resin.

7. 3. The method for manufacturing a printed circuit board according to claim 1, wherein in the step of dividing the printed wiring board, a shortest distance between each of the plurality of pressing portions and the connection portion, as viewed along a thickness direction of the printed wiring board, is 3 mm or more and 10 mm or less.

8. a holding portion for holding the printed wiring board; A plurality of pressing portions for supporting the printed wiring board are provided, The printed wiring board comprises: a first substrate member on which electronic components are mounted; a second substrate member separated from the first substrate member; a connection portion that connects the first substrate member and the second substrate member, the first substrate member has a first surface and a second surface opposite the first surface; The plurality of holding portions include A plurality of first pressing portions spaced apart from each other; a plurality of second pressing portions disposed at a distance from the plurality of first pressing portions in a thickness direction of the printed wiring board and spaced apart from each other; Each of the plurality of first pressing portions is disposed along a direction in which the connection portion extends, Each of the second pressing portions is disposed along a direction in which the connecting portion extends, each of the first and second pressing portions supports the first substrate member when the second substrate member is separated from the first substrate member at the connection portion; The plurality of first pressing portions support the first surface, The plurality of second pressing portions support the second surface, The first pressing portions are provided so that positions of the first pressing portions in a direction in which the connection portion extends can be adjusted, The plurality of second pressing portions are provided so that their positions in the direction in which the connection portions extend are adjustable.

9. A holding portion for holding a printed wiring board; A plurality of pressing portions for supporting the printed wiring board are provided, The printed wiring board comprises: a first substrate member on which electronic components are mounted; a second substrate member separated from the first substrate member; a connection portion that connects the first substrate member and the second substrate member, the first substrate member has a first surface and a second surface opposite the first surface; The plurality of holding portions include A plurality of first pressing portions spaced apart from each other; a plurality of second pressing portions disposed at a distance from the plurality of first pressing portions in a thickness direction of the printed wiring board and spaced apart from each other; Each of the plurality of first pressing portions is disposed along a direction in which the connection portion extends, Each of the second pressing portions is disposed along a direction in which the connecting portion extends, each of the first and second pressing portions supports the first substrate member when the second substrate member is separated from the first substrate member at the connection portion; The plurality of first pressing portions support the first surface, The plurality of second pressing portions support the second surface, The printed wiring board dividing jig further includes a pressure sensor that detects a force applied from the first substrate member to each of the plurality of pressing portions.

10. 10. The printed wiring board dividing jig according to claim 8, wherein each of the plurality of pressing portions is made of resin.