Mounting assistance device

Abstract

The present invention provides a mounting assistance device to be applied to a component mounter that mounts components on a board by picking components from a component supply device equipped with a bulk feeder in which are formed a plurality of cavities that can accommodate components in a supply area for supplying components in a pickable manner, the mounting assistance device comprising an acquisition unit that acquires cavity information pertaining to the plurality of cavities by performing image processing on initial image data acquired by imaging the supply area in a state with components removed from the supply area.

Description

Wearing assistance device

[0001] The present invention relates to a wearing assistance device.

[0002] The mounting support device supports a mounting process by a component mounting machine using a bulk feeder. The bulk feeder is equipped to the component mounting machine that mounts components on a board and supplies the components in bulk (see Patent Document 1). During the mounting process, the component mounting machine performs image processing to recognize the state of components being supplied by the bulk feeder, and controls the component suction operation using a suction nozzle based on the results of the image processing.

[0003] International Publication No. 2021 / 095219

[0004] The image processing for recognizing the supply status includes determining whether or not parts are accommodated in the multiple cavities formed in the supply area of ​​the bulk feeder so that they can be picked up. If there is an incorrect determination in this image processing, it can lead to a mistake in the picking operation, and even if the parts are picked up successfully, it can affect the subsequent processing.

[0005] The present specification aims to provide a bulk feeder suitable for image processing to recognize the supply state, and to provide a mounting assistance device that supports the mounting process by improving the accuracy of the image processing.

[0006] This specification discloses a mounting assistance device that is applied to a component mounting machine that picks up components from a component supply device equipped with a bulk feeder that has multiple cavities that can accommodate the components in a supply area that supplies the components in a pickable manner, and mounts the components on a board, and that includes an acquisition unit that processes initial image data acquired by imaging the supply area when the components have been removed from the supply area, and acquires cavity information regarding the multiple cavities.

[0007] This specification also discloses the technical idea of ​​changing "the wearing assistance device according to any one of claims 1 to 6" in claim 8 originally filed to "the wearing assistance device according to any one of claims 1 to 7," and the technical idea of ​​changing "the wearing assistance device according to claim 8" in claim 10 originally filed to "the wearing assistance device according to claim 8 or 9." This specification also discloses the technical idea of ​​changing "the wearing assistance device according to any one of claims 1 to 6" in claim 11 originally filed to "the wearing assistance device according to any one of claims 1 to 10," and the technical idea of ​​changing "the wearing assistance device according to any one of claims 1 to 6" in claim 12 originally filed to "the wearing assistance device according to any one of claims 1 to 11."

[0008] This configuration improves the accuracy of image processing, thereby preventing errors in the picking operation of the component mounting machine and, as a result, maintaining high productivity in the component mounting machine.

[0009] FIG. 3 is a plan view schematically showing a component mounting machine. FIG. 4 is a side view schematically showing a part of a bulk feeder including a supply area. FIG. 5 is a plan view seen from direction III of FIG. 2. FIG. 6 is a block diagram showing a component mounting machine to which a mounting assistance device is applied. FIG. 7 is a flowchart showing a supply state recognition process. FIG. 8 is a diagram showing image data of an image of a supply area. FIG. 9 is an enlarged view showing image data after blob generation process has been executed. FIG. 10 is a diagram showing a design cavity superimposed on initial image data. FIG. 11 is a flowchart showing a cavity information update process. FIG. 12 is a flowchart showing a process for acquiring initial image data. FIG. 13 is an explanatory diagram of a first example showing recognized components and before and after blob removal process. FIG. 14 is an explanatory diagram of a second example showing recognized components and before and after blob removal process.

[0010] 1. Overview of the Placement Support Device 50 The placement support device 50 supports the placement process by the component placement machine 10 using the bulk feeder 30. In this embodiment, the placement support device 50 is incorporated into the control device 20 of the component placement machine 10. The placement support device 50 improves the accuracy of image processing that recognizes the supply status of components supplied by the bulk feeder 30, thereby reducing the occurrence of errors in the picking operation during the placement process.

[0011] The component mounting machine 10 described above performs a mounting process for mounting components on a board 91 as a predetermined substrate-related operation. The component mounting machine 10 is installed along with other substrate-related operation machines in the transport direction of the board 91 to form a production line. Each of the multiple substrate-related operation machines is communicably connected to a host computer 60 (see FIG. 4) that controls the production line as a whole. The production line includes, for example, multiple substrate-related operation machines, such as a printing machine, the component mounting machine 10, a reflow oven, and an inspection machine.

[0012] The setup device 65 is an external device used to set up the feeder 122 to be used in the planned placement process. The setup device 65 is used for tasks such as loading components into the feeder 122 and removing components from the feeder 122 that has been used in the placement process. The setup device 65 includes a support base 66 that supports the feeder 122 or some of the units removed from the feeder 122. The setup device 65 includes a dedicated camera 67 that can capture images of the supply area As of the bulk feeder 30 supported by the support base 66. The setup device 65 is connected to the host computer 60 so as to be able to communicate with it, and inputs and outputs various information related to the setup.

[0013] 1, the component mounting machine 10 includes a board transport device 11. The board transport device 11 sequentially transports the boards 91 in a transport direction and positions the boards 91 at predetermined positions within the machine.

[0014] 2-2. Component Supply Device 12 The component mounting machine 10 is equipped with a component supply device 12. The component supply device 12 supplies components to be mounted on the board 91. The component supply device 12 has feeders 122 set in multiple slots 121. For example, a tape feeder that feeds and moves a carrier tape containing a large number of components to supply the components so that they can be picked is used as the feeder 122. Furthermore, a bulk feeder 30 that supplies components stored in a bulk state so that they can be picked is used as the feeder 122. Details of the bulk feeder 30 will be described later.

[0015] 2-3. Component Transfer Device 13 The component mounting machine 10 is equipped with a component transfer device 13. The component transfer device 13 transfers components supplied by the component supply device 12 to predetermined mounting positions on the board 91. The component transfer device 13 is equipped with a head drive device 131, a movable table 132, a mounting head 133, and a suction nozzle 134. The head drive device 131 moves the movable table 132 in horizontal directions (X and Y directions) using a linear motion mechanism. The mounting head 133 is detachably fixed to the movable table 132 by a clamp member (not shown) and is provided so as to be movable horizontally within the machine.

[0016] The mounting head 133 supports a plurality of suction nozzles 134 that are rotatable and movable up and down. The suction nozzles 134 are holding members that pick up and hold components supplied by the feeder 122. The suction nozzles 134 use supplied negative pressure air to pick up the components supplied by the feeder 122. A chuck or the like that grips and holds components can be used as the holding member attached to the mounting head 133.

[0017] 2-4. Component camera 14, board camera 15 The component mounting machine 10 is equipped with a component camera 14 and a board camera 15. The component camera 14 and the board camera 15 are digital imaging devices having imaging elements such as CMOS. The component camera 14 and the board camera 15 capture images based on control signals and send image data acquired by the images. The component camera 14 is configured to be able to capture images of the components held by the suction nozzle 134 from below. The board camera 15 is mounted on a moving stage 132 so as to be movable horizontally integrally with the mounting head 133. The board camera 15 is configured to be able to capture images of the board 91 from above.

[0018] Furthermore, in addition to capturing an image of the surface of the circuit board 91, the board camera 15 can also capture an image of various devices within the movable range of the movable stage 132. For example, in this embodiment, as shown in Fig. 3, the board camera 15 can capture an image of the supply area As to which the bulk feeder 30 supplies components and the reference mark 49 provided on the upper part of the bulk feeder 30 within the camera's field of view. In this way, the board camera 15 can be used to capture images of different objects in order to obtain image data to be used for various image processing.

[0019] 2-5. Control Device 20 As shown in FIG. 1, the component mounting machine 10 includes a control device 20. The control device 20 is primarily composed of a CPU, various memories, and control circuits. As shown in FIG. 4, the control device 20 also includes a storage unit 21. The storage unit 21 is composed of a storage device such as a hard disk drive or flash memory. The storage unit 21 of the control device 20 stores various data such as a control program M1 used to control the mounting process, component data M2, and cavity information M3.

[0020] The control program M1 indicates the placement positions, placement angles, and component types of components to be placed on the board 91 in the planned placement order during the placement process. The placement process includes a process of repeating a PP cycle (pick-and-place cycle), which includes a pickup cycle and a placement cycle, multiple times. The "pick-up cycle" refers to a process of repeating a pickup operation, in which components supplied by the component supply device 12 are picked up by the suction nozzle 134, multiple times.

[0021] The above-mentioned "placement cycle" refers to a process of repeating a plurality of times a placement operation in which a picked component is placed at a predetermined placement angle in a predetermined placement position on the board 91. In this way, the control program M1 presets the execution order of a PP cycle, which is made up of a plurality of grouped picking and placement operations, taking into consideration the number of suction nozzles 134 supported by the placement head 133, the movement distance of the placement head 133, etc.

[0022] The part data M2 includes shape data for each type of part. The "shape data" includes at least one of the outer edge shape of the part, the shape of the feature part of the part, and the dimensions of the part. The "outer edge shape" of a part corresponds to the shape of the outer edge when the inside of the part and the background are separated using the outer edge as a boundary.

[0023] The "shape of the characteristic part" of a part corresponds to the boundary shape of the characteristic part on the exterior due to the part's shape, pattern, color, etc. The characteristic part of a part may be a corner, bump, terminal, lead, etc. of the part. In addition to the shape data, the part data M2 may also include, for example, the maximum allowable movement speed (acceleration) for each part, the pick-up position (for example, the position where the part comes into contact with the suction nozzle 134), etc.

[0024] The cavity information M3 is information about the cavities 45 formed in the supply area As of the bulk feeder 30 and which individually accommodate components. In this embodiment, the cavity information M3 includes the shape (including the length of each side and depth) of the cavity 45 in the supply area As, the position, the orientation, the type of corresponding component, etc. The cavity information M3 is stored in association with the identification information (ID) of the bulk feeder 30. Details of obtaining the cavity information M3 and the processing using the cavity information M3 will be described later.

[0025] The control device 20 executes a process for recognizing the holding state of the components held by each of the multiple holding members (suction nozzles 134). Specifically, the control device 20 processes image data acquired by imaging with the component camera 14, and recognizes the position and angle of each component relative to the reference position of the mounting head 133. Note that in addition to the component camera 14, the control device 20 may also process image data acquired by, for example, a head camera unit integrally provided on the mounting head 133 capturing an image of the component from the side, below, or above.

[0026] In the mounting process, the control device 20 controls the mounting operation by the mounting head 133 so that the component is mounted on the board 91 in a predetermined orientation. At this time, the control device 20 controls the mounting operation based on the recognized holding state of the component. In other words, the control device 20 corrects the position of the mounting head 133 and the angle of the suction nozzle 134 about the Q axis so as to correct any positional and angular deviations of the component held by the suction nozzle 134 relative to the Q axis (the axis of rotation of the suction nozzle 134). As a result, the component held by the suction nozzle 134 is mounted at a predetermined mounting position and angle instructed by the control program M1.

[0027] 3. Configuration of Bulk Feeder 30 Bulk feeder 30 is set in component mounting machine 10 and functions as part of component supply device 12. Bulk feeder 30 supplies components housed in component cases in a bulk state (loose, with each component in an irregular position) that is not packaged like a carrier tape. Therefore, unlike tape feeders, bulk feeder 30 does not use carrier tape, which has the advantage of eliminating the need to load carrier tape and collect used tape.

[0028] Some bulk feeders 30 supply components in irregular positions to the planar supply area As. However, if the components are so close together in the supply area As that they touch each other, or if they are piled up (overlapping vertically), or if the components are positioned horizontally so that their widths are vertical, the component mounting machine 10 cannot pick these components. Therefore, to increase the percentage of components that can be picked, some bulk feeders 30 supply components in an aligned state in the supply area As. In this embodiment, a bulk feeder 30 that aligns components will be described as an example.

[0029] The bulk feeder 30 has a track unit 40 attached to a flat, box-shaped feeder body 31 so that the track unit 40 can vibrate and be detachably attached to the feeder body 31. A connector 311 and two positioning pins 312 are provided at the front (right end in FIG. 2 ) of the feeder body 31. When the feeder body 31 is set in the slot 121 of the component supply device 12, it is supplied with power via the connector 311 and is capable of communicating with the control device 20 of the component mounting machine 10.

[0030] The track unit 40 is vibrated by the vibrator 35. The track unit 40 has a track body 41. The track body 41 is formed with a conveying path R along which a plurality of parts are conveyed, and a supply area As that is connected to the conveying path R and opens upward so that a plurality of parts can be picked up. The track body 41 is formed to extend in the front-to-rear direction (left-to-right direction in FIG. 3 ) of the feeder body 31. A pair of side walls 46 that protrude upward are formed on both edges of the track body 41 in the width direction (up-down direction in FIG. 3 ). The pair of side walls 46, together with a tip end 47 of the track body 41, surround the periphery of the conveying path R and are wall members that prevent parts conveyed along the conveying path R from leaking out.

[0031] As shown in FIG. 3 , the supply area As of the track body 41 is formed with a plurality of cavities 45 capable of accommodating components. Each of the cavities 45 opens upward and accommodates components with their thickness direction aligned vertically. In this embodiment, the cavities 45 are arranged in a staggered pattern. Each of the cavities 45 is formed, for example, from one or more plate-like members (e.g., a plate member for the cavity bottom and a plate member for the cavity side). The track unit 40 is a unitized track member formed by attaching plate members selected according to the shapes of multiple types of components to a common track body 41.

[0032] Here, the "supply area As" of the track unit 40 is an area where components are supplied in bulk and where components can be picked up by the suction nozzles 134 supported by the mounting head 133. The "transport path R" of the track unit 40 is a path along which components circulated from the component case side to the track unit 40 are transported to the supply area As.

[0033] The vibration device 35 also applies vibration to the track unit 40 so that the multiple parts are transported along the transport path R. When the track unit 40 vibrates, a forward and upward external force or a backward and upward external force is applied to the parts. As a result, the multiple parts are transported to the front or rear of the track unit 40. The bulk feeder 30 controls the operation of the vibration device 35 using the feeder control device 36 to transport the parts and supply them to the supply area As. When the parts are stored in the multiple cavities 45 through the supply operation, the suction nozzle 134 is ready to pick up the parts.

[0034] A shutter 48 capable of closing the opening of the supply area As is provided on the upper part of the track unit 40. When the track unit 40 is attached to the feeder body 31, the shutter 48 is in a state where its opening and closing operation is controlled by a shutter drive device (not shown). By opening and closing the shutter 48, the bulk feeder 30 can prevent parts from flying out and foreign objects from entering the supply area As.

[0035] The reference marks 49 indicate a reference position Pf of the supply area As. In this embodiment, the reference marks 49 are provided in pairs in the width direction of the bulk feeder 30 and are formed in a circular shape. The reference position Pf indicates, for example, the origin of the supply area As, and in this embodiment, is set at the midpoint of the reference marks 49.

[0036] 4 to 11B, the configuration of the placement support device 50 will be described. The placement support device 50 supports the component supply status recognition process executed by the control device 20 of the component placement machine 10 during the placement process. The supply status recognition process includes image processing, which includes determining whether the components supplied to the supply area As of the bulk feeder 30 are suitable for the component placement machine 10 to pick up.

[0037] Specifically, the control device 20 processes image data D1 (see FIG. 6) acquired by imaging with a camera (in this embodiment, the board camera 15), recognizes whether there are any components in the supply area As that are suitable for the picking operation, and if there are any components that are suitable for the picking operation, recognizes the position and angle of those components. Then, the control device 20 controls the operation of the mounting head 133 in the picking operation based on the results of the supply status recognition process.

[0038] In the above-mentioned suitability assessment, if there is an erroneous judgment in the image processing, such as misidentifying part of multiple parts as one part or misidentifying a foreign object as part of a part, the position and orientation of the recognized part (hereinafter also referred to as "recognized part") will differ from the actual one, which may cause an error in the picking operation. Furthermore, even if the part is successfully picked, there is a risk that this will affect subsequent processes, such as the part transfer operation and mounting operation.

[0039] Therefore, in this embodiment, the placement assist device 50 incorporated in the control device 20 of the component placement machine 10 employs a configuration that can improve the accuracy of the image processing included in the component supply state recognition process (see FIG. 5 ). Specifically, as shown in FIG. 4 , the placement assist device 50 includes an acquisition unit 53. Furthermore, the placement assist device 50 may include a state recognition unit 51, a determination unit 52, an information management unit 54, and a condition setting unit 55.

[0040] 5, in the process of recognizing the supply state of components, the mounting support device 50 acquires image data D1 captured by the board camera 15 (S11). The state recognition unit 51 executes a recognition process (S20) using the image data D1. The determination unit 52 executes a determination process (S30) as to whether the component is suitable for the picking operation.

[0041] 4-1. State Recognition Unit 51 The state recognition unit 51 performs image processing on image data D1 acquired by capturing an image of the supply area As, in which multiple cavities 45 are formed, each accommodating multiple components 92, to acquire information about the recognized components 80. In this embodiment, blob analysis is used as a method for recognizing the components 92 scattered in the supply area As as recognized components 80.

[0042] Specifically, the state recognition unit 51 first executes a generation step (S21) of generating a plurality of blobs 70 from the image data D1. Specifically, the state recognition unit 51 binarizes the image data D1 using a predetermined threshold value, coloring each pixel white if its brightness value is higher than the threshold value and black if its brightness value is equal to or lower than the threshold value. Figure 7 shows an enlarged portion of the binarized image data D1, with the pre-processing cavity 45 indicated by a dashed line. The blobs 70 correspond to closed white regions in the binarized image data D1.

[0043] Here, the blob 70 may refer to, for example, a pair of electrodes formed at both ends of the component 92 in the longitudinal direction, or may refer to the entire component 92 including its body. These may differ depending on the type of component 92 (including the color and gloss of the body and electrodes) and the threshold used for binarization. In this embodiment, the recognition process (S20) recognizes the component 92 using one or more blobs 70. The mounting assistance device 50 can determine how the blob 70 is formed based on the component data M2.

[0044] However, as shown in Figures 11A and 11B, the blobs 70 in the binarized image data D1 may include, for example, foreign matter 89 or a component 92 that is not housed in the cavity 45. If these defective blobs 72, 73 are mistakenly recognized as part of the component 92, the accuracy of the recognition process will decrease. Therefore, the state recognition unit 51 extracts candidate blobs 71 that are suitable for the recognition process from the multiple blobs 70 (S22). In other words, this extraction step is a process of removing blobs 70 (72, 73) that are unsuitable for the recognition process.

[0045] 11A and 11B, the state recognition unit 51 extracts candidate blobs 71 included in the appropriate region Rh (S22). In more detail, the state recognition unit 51 extracts a blob 70 as a candidate blob 71 when all pixels constituting the blob 70 are within the appropriate region Rh. The "appropriate region Rh" is an area defined based on the position, angle, and shape of the cavity 45, and is an area that can be expected to be the blob 70 of a component 92 accommodated in a normal orientation.

[0046] In this embodiment, the "suitable region Rh" is set mainly by adding a tolerance to a region having the same shape as the cavity 45 indicated by the cavity information M3. The state recognition unit 51 extracts blobs 70 included in the suitable region Rh as candidate blobs 71. As a result, as shown in Figures 11A and 11B, blobs 70 located outside the cavity 45 are removed (failed blobs 72 and 73 indicated by dashed lines on the right side).

[0047] This makes it possible to remove, for example, defective blobs 72 corresponding to closed regions of component 92 that are not housed in cavity 45 and defective blobs 73 corresponding to foreign matter 89 located outside cavity 45, and to prevent them from being used in subsequent processing. Note that in the extraction step (S22), depending on the relationship with subsequent processing, it is also possible to omit the extraction using blobs 70 and suitable regions Rh as described above, and simply extract candidate blobs 71 from the multiple blobs 70 that correspond to at least a portion of the closed region of component 92 (allowing that some of them may include defective blobs).

[0048] Next, the state recognition unit 51 executes a recognition step (S23) in which a rectangular area including one or more candidate blobs 71 is recognized as a component 92 in the image data D1. In this embodiment, as shown in Fig. 11A, the state recognition unit 51 recognizes a rectangular area circumscribing one or more candidate blobs 71 as a component 92 in the image data D1. As a result, for example, a recognized component 80 formed by a pair of candidate blobs 71 or a recognized component 80 formed by one candidate blob 71 is acquired.

[0049] The state recognition unit 51 also recognizes information necessary for subsequent processing, such as the reference position, angle (supply angle), shape (including the lengths of the short and long sides), and area (corresponding to the number of pixels contained in the rectangular area) in the supply area As for each of the multiple recognized components 80. Through this processing, the state recognition unit 51 recognizes the supply state of the components 92 in the supply area As and stores the recognition results in the memory unit 21.

[0050] The above-described recognition process (S20) is premised on the assumption that the component mounting machine 10 targets only components 92 that are properly accommodated in the cavities 45. Therefore, if the bulk feeder 30 is a type that does not have a cavity 45 in the supply area As, the state recognition unit 51 may extract candidate blobs 71 from the multiple blobs 70 based on conditions such as having an area within a certain range and a blob shape that is close to a rectangle, and obtain the position and shape of the recognized component 80 in the supply area As.

[0051] The determination unit 52 determines (S30) whether the component 92 (recognized component 80) recognized in the recognition process (S20) is suitable for the picking operation by the component mounting machine 10 based on the supply state of the component 92. Here, even if the recognized component 80 is recognized in the recognition process (S20) using a candidate blob 71 corresponding to at least a portion of the closed region of the component 92, the recognized component 80 may not be suitable for the picking operation.

[0052] One possible cause of this is that two components 92 are housed in the cavity 45 in an abnormal position, with their longitudinal directions aligned vertically. In such a case, it is possible that the electrode portions of each component 92 are mistakenly recognized as the electrode portions of a single component 92, resulting in the recognition of the recognized component 80. Furthermore, if the process of removing the blob 70 outside the cavity 45 is omitted in the recognition process (S20), it is possible that the defective blob 73 corresponding to the foreign object 89 is mistakenly recognized as part of the component 92, resulting in the recognition of the recognized component 80.

[0053] The determination unit 52 first determines whether the blob 70 is good or bad (S31). Various methods can be used to determine whether the blob 70 is good or bad. For example, if the ratio of the area of ​​one or more candidate blobs 71 included in the rectangular region to the area of ​​the recognized component 80 exceeds a preset threshold, the determination unit 52 determines that the candidate blob 71 occupies a predetermined area corresponding to an electrode portion and determines the candidate blob 71 to be "good." On the other hand, if the area of ​​the candidate blob 71 is small, the determination unit 52 determines that a foreign object in the cavity 45 may have been recognized as an electrode portion and determines the candidate blob 71 to be "bad."

[0054] In addition, in this determination process (S31), the determination unit 52 may determine whether the candidate blob 71 is appropriate in terms of its positional relationship with the appropriate region Rh. In this way, if the candidate blob 71 constituting the recognition component 80 is determined to be "bad," the recognition component 80 is excluded from the subsequent determination process.

[0055] Next, the determination unit 52 determines whether the recognition component 80 is a component 92 that has been supplied in a manner that allows it to be picked up in the supply area As (S32). Specifically, the determination unit 52 determines whether the recognition component 80 is suitable for the picking operation based on whether at least one of the position, angle, shape, and area of ​​the recognition component 80 is within a range that can be assumed if the recognition component 80 is accommodated in a normal orientation.

[0056] The judgment process (S30), which includes the pass / fail judgment of the blob (S31) and the pass / fail judgment of the recognized component 80 (S32), is sequentially performed for all recognized components 80 recognized by the state recognition unit 51. As a result, the mounting assistance device 50 obtains a judgment result as to whether each of the multiple recognized components 80 is suitable for the picking operation. This judgment result is stored as information indicating whether each of the multiple cavities 45 contains a pickable component 92. In addition, the pickable component 92 is associated with information such as its reference position (center position) and supply angle.

[0057] 4-3. Acquisition Unit 53 As described above, the appropriate region Rh used in the extraction process (S22) of candidate blobs 71 and the pass / fail judgment (S31) of blobs 70 is set based on cavity information M3. The cavity information M3 includes the positions, angles, and shapes of multiple cavities 45. The positions of the cavities 45 are recorded, for example, as relative positions with respect to the reference position Pf of the supply area As. Here, as shown by the dashed line in FIG. 8 , the design cavity 45 (ideal cavity 95) can be drawn based on the reference position Pf of the supply area As.

[0058] However, because the actual cavity 45 is formed, for example, by machining a plate member fixed to the raceway body 41, machining errors may be present in the position, angle, and shape. Therefore, there is an error Ta-Te between the center position ScA-ScE of the actual cavity 45 and the center position SdA-SdE of the ideal cavity 95A-95E (the errors are exaggerated in FIG. 8). In other words, if the appropriate region Rh is set, for example, by taking into account tolerances for the position, angle, and shape of the designed cavity 45 (ideal cavity 95), the appropriate region Rh will encompass the actual cavity 45 but be larger than the actual cavity 45.

[0059] In this case, for example, in the extraction process (S22) of candidate blobs 71, a blob 70 that is located outside the actual cavity 45 but inside the appropriate region Rh may not be removed as a defective blob 72 and may be extracted as a candidate blob 71. Therefore, the mounting assistance device 50 of this embodiment employs a configuration that acquires cavity information M3 based on the actual states of multiple cavities 45 in the supply region As of the bulk feeder 30 that supplies components 92.

[0060] The acquisition unit 53 acquires cavity information M3 relating to the plurality of cavities 45 by image processing the initial image data Dn acquired by capturing an image of the supply area As with the components 92 removed from the supply area As. In more detail, as shown in FIG. 9 , the initial image data Dn is first acquired by capturing an image with a camera (S41). In this embodiment, the camera is the board camera 15 used to capture an image of the board 91 positioned inside the component mounting machine 10. Details of the process of acquiring the initial image data Dn will be described later.

[0061] Next, the acquisition unit 53 performs image processing on the initial image data Dn (see FIG. 8 ) (S42). This image processing includes, for example, binarization and edge detection. As a result, the acquisition unit detects the outlines of the multiple cavities 45 in the initial image data Dn. Next, the acquisition unit 53 calculates the center position of each cavity 45 (S43). Specifically, the acquisition unit 53 may calculate the center position from the intersection of diagonals of the outlines of the detected cavities 45, or may calculate the center or center of gravity of a closed region recognized as a cavity 45.

[0062] The acquisition unit 53 calculates the coordinate values ​​of the center position of each of the multiple cavities 45 based on the position coordinates of the board camera 15 that was positioned when imaging was performed to acquire the initial image data Dn. At this time, if the initial image data Dn includes a reference mark 49, for example, the acquisition unit 53 may calculate the position (center position) of each of the multiple cavities 45 relative to the reference position Pf indicated by the reference mark 49. As a result, when a calibration process using the reference mark 49 is later performed and the reference position Pf is determined, the coordinate values ​​of the center positions of the cavities 45 within the machine are determined.

[0063] Here, the cavity information M3 may include a mixture of information calculated from the actual cavity 45 and design information. For example, of the position, angle, shape, depth, and corresponding part type as the cavity information M3, the acquiring unit 53 may acquire only the position, angle, and shape that can be calculated from the initial image data Dn. On the other hand, for example, in the case where there is a small processing error in the angle and shape of the cavity 45, or even if there is a processing error, the effect on image processing is small, the acquiring unit 53 may acquire only the calculated position of the cavity 45.

[0064] For example, the cavity information M3 includes a setting that specifies the information to be calculated by the initial image data Dn. If the setting indicates that the angle and shape of the cavity 45 do not need to be acquired (S44: No), the acquisition unit 53 acquires design values ​​assuming that all angles and shapes are ideal (S45). On the other hand, if the setting indicates that the angle and shape of the cavity 45 need to be acquired (S44: Yes), the acquisition unit 53 further performs image processing to calculate the angle and shape of each of the multiple cavities 45 (S46).

[0065] Finally, the acquisition unit 53 updates the cavity information M3 by adding the angles and shapes acquired in S45 or S46 to the positions (center positions) of the multiple cavities 45 calculated in S43 (S47). The cavity information M3 is stored in the storage unit 21 of the control device 20 and in the host computer 60 serving as a management device.

[0066] When the mounting assist device 50 performs a picking operation for components 92 supplied by a predetermined bulk feeder 30, the mounting assist device 50 performs image processing in the supply status recognition process using the cavity information M3 acquired and updated by the acquisition unit 53. The information management unit 54 manages this cavity information M3.

[0067] In this embodiment, the information management unit 54 deletes the cavity information M3 or restricts the use of the cavity information M3 when the track unit 40 serving as a track member is removed from the feeder body 31. In other words, the information management unit 54 keeps the cavity information M3 valid even when the bulk feeder 30 moves between two slots 121 or between the component mounting machine 10 and the setup device 65.

[0068] However, when the track unit 40 is removed from the feeder body 31, the information management unit 54 deletes the cavity information M3 or restricts its use, since there is a possibility that the positional relationship of the multiple cavities 45 with respect to the reference position Pf indicated by the reference mark 49 may change. The criteria for this deletion or restriction of use can be set appropriately by the administrator of the mounting assistance device 50. For example, the criteria may be relaxed, and the cavity information M3 may be deleted or its use restricted when the plate member forming the cavity 45 is removed from the track body 41.

[0069] This configuration can prevent the use of cavity information M3 that contains errors due to changes in the positional relationship between the reference position Pf and the multiple cavities 45 caused by, for example, removing the track unit 40. This encourages the regeneration and updating of cavity information M3, preventing a decrease in the accuracy of image processing.

[0070] 4-5. Condition setting unit 55 The condition setting unit 55 sets the imaging conditions applied to imaging for acquiring the initial image data Dn to conditions that define the outer edge and bottom surface of the cavity 45, different from the imaging conditions applied to imaging for acquiring the image data D1 used in the supply state recognition process. In the process of acquiring the initial image data Dn by imaging with a camera (S41), the condition setting unit 55 sets the imaging conditions (S51) as shown in FIG.

[0071] Here, in the imaging for acquiring the image data D1 used in the image processing for the supply state recognition processing, it is preferable that the cavity 45 is not captured or that the outer shape of the cavity 45 is removed (converted to black) by binarization processing for the later generation processing of the blob 70. On the other hand, since the initial image data Dn is used to recognize the shape of the cavity 45, it is preferable that the outer shape of the cavity 45 is captured.

[0072] Therefore, the condition setting unit 55 adjusts the light source (epi-light, lateral light, etc.), exposure time, etc. as imaging conditions for acquiring the initial image data Dn, and sets conditions under which the outer edge and bottom surface of the cavity 45 are defined. These settings may be read out from settings previously set by an administrator, or conditions under which the outer edge can be recognized may be searched for by repeating imaging and image processing. In addition to setting one imaging condition, the condition setting unit 55 may set multiple types of imaging conditions on the assumption that imaging will be performed multiple times.

[0073] The mounting support device 50 captures an image of the supply area As under the imaging conditions set by the condition setting unit 55 (S52) and acquires initial image data Dn (S53). If multiple imaging conditions are set, the mounting support device 50 may capture images multiple times for each imaging condition (S52) and combine the multiple image data acquired thereby to acquire initial image data Dn that allows the outer edges of the cavities 45 to be recognized (S53). With this configuration, suitable initial image data Dn is acquired, and the outer edges of the multiple cavities 45 can be recognized with high accuracy in the subsequent image processing (S42).

[0074] 5. Mounting Process by Component Mounting Machine 10 The mounting process by the component mounting machine 10 will now be described. Here, it is assumed that the component supply device 12 is equipped with a bulk feeder 30. After the bulk feeder 30 is set in the slot 121, the control device 20 executes a calibration process to recognize the positions of the multiple cavities 45 within the machine. In the calibration process, the control device 20 first moves the board camera 15 to above the reference mark 49 of the bulk feeder 30 and acquires image data by capturing an image with the board camera 15.

[0075] Then, the control device 20 recognizes the reference position Pf as the position of the bulk feeder 30 within the machine based on the positions of the pair of reference marks 49 included in the image data through image processing and the position of the board camera 15 when the image was taken. The control device 20 can obtain the coordinate values ​​of each of the cavities 45 based on the result of the calibration process and the cavity information M3 indicating the arrangement of the cavities 45.

[0076] In the mounting process, first, the board transport device 11 of the component mounting machine 10 executes a loading process for the board 91. As a result, the board 91 is loaded into the machine and positioned at a predetermined position within the machine. After or in parallel with the loading process for the board 91, the control device 20 causes the bulk feeder 30 to execute a supply operation. As a result of the execution of the supply operation, a state is created in which a plurality of components 92 are accommodated in at least some of the plurality of cavities 45 of the bulk feeder 30. After the supply operation by the bulk feeder 30 is completed, the mounting assistance device 50 executes a process to recognize the supply status of the components 92.

[0077] This acquires specific information (such as the address of the cavity 45) about the cavity 45 that currently contains the pickable component 92 in a pickable state, as well as the reference position and supply angle of the pickable component 92 (the component 92 suitable for the picking operation). Next, the control device 20 executes a PP cycle. In the PP cycle, the control device 20 executes a picking cycle in which the control device 20 repeatedly picks up components 92 using multiple suction nozzles 134. At this time, the control device 20 controls the operation of the mounting head 133 in the picking operation so that the mounting head 133 is sequentially positioned according to the reference positions of the pickable components 92. At this time, the control device 20 determines the angle of the suction nozzle 134 according to the supply angle of the pickable component 92.

[0078] Next, the control device 20 executes a process for recognizing the holding state of the components 92 held by each of the plurality of suction nozzles 134. Specifically, the control device 20 moves the mounting head 133 above the component camera 14 and sends an image capture command to the component camera 14. The control device 20 processes the image data acquired by the component camera 14, and recognizes the orientation (position and angle) of the components 92 held by each of the plurality of suction nozzles 134. The result of the holding state recognition process is recorded in the memory unit 21 as an operation result indicating whether or not a picking error occurred in the picking operation.

[0079] Thereafter, the control device 20 executes a mounting cycle in which the mounting operation of mounting components using the multiple suction nozzles 134 is repeated. In the mounting operation of this mounting cycle, the control device 20 controls the operation of the mounting head 133 so that the components 92 are mounted at the mounting positions specified by the control program M1. Furthermore, the control device 20 controls the operation of the mounting head 133 so that the suction nozzles 134 are positioned and angled relative to the mounting positions based on the results of the recognition process.

[0080] The control device 20 also executes a supply management process for the components 92 in parallel with the above-described PP cycle. The supply management process includes setting the execution timing of the supply operation of the components 92 by the bulk feeder 30, issuing a command for the supply operation, and recognizing the supply status. For example, when a supply operation of the components 92 is executed, the supply operation by the bulk feeder 30 is executed during the period from the end of the collection cycle of the current PP cycle to the start of the collection cycle of the next PP cycle. When the supply operation by the bulk feeder 30 is executed, the mounting assistance device 50 executes the above-described supply status recognition process again.

[0081] When all PP cycles based on the control program M1 have been completed, the control device 20 executes the unloading process of the board 91. In the unloading process of the board 91, the board transport device 11 unclamps the positioned board 91 and unloads the board 91 from the component mounting machine 10.

[0082] 6. Effects of the Configuration of the Embodiment The configuration of the mounting assistance device 50 as described above can improve the accuracy of image processing in the process of recognizing the supply state of the components 92 supplied by the bulk feeder 30. This can prevent errors from occurring in the picking operation of the component mounting machine 10, and as a result, the component mounting machine 10 can maintain high productivity.

[0083] 7. Modifications of the Embodiment In the embodiment, the placement assist device 50 is configured to be incorporated into the control device 20 of the component placement machine 10. However, part or all of the placement assist device 50 may be incorporated into an external device used for setup or maintenance of the host computer 60 and the bulk feeder 30.

[0084] For example, the acquisition unit 53 of the mounting assistance device 50 may be incorporated into a setup device 65 as an external device. The setup device 65 includes a support base 66 that supports the bulk feeder 30 and a dedicated camera 67 that can capture an image of the supply area As of the bulk feeder 30 supported by the support base 66. For example, after the track unit 40 is attached to the feeder main body 31, the acquisition unit 53 acquires the initial image data Dn by capturing an image of the supply area As with the dedicated camera 67.

[0085] The acquisition unit 53 executes the same process as in the embodiment, associates the cavity information M3 with identification information (ID) that identifies the bulk feeder 30, and stores the associated information in the setup device 65 and the host computer 60 that manages the component mounting machine 10. When the bulk feeder 30 is installed in the slot 121 of a specific component mounting machine 10, the control device 20 acquires the identification information (ID) of the bulk feeder 30 via communication, sends the identification information (ID) to the host computer 60, and inquires whether the bulk feeder 30 is permitted to be used in the mounting process that is scheduled to be executed.

[0086] If the bulk feeder 30 is suitable for a specific mounting process, the host computer 60 permits its use and sends cavity information M3 corresponding to the bulk feeder 30 to the control device 20. In this way, the component mounting machine 10 obtains cavity information M3 associated with the identification information (ID) of the bulk feeder 30 installed in the component supply device 12 from the host computer 60 based on the identification information (ID). Then, when the mounting process is executed, a process for recognizing the component supply status using this cavity information M3 is executed. This configuration also achieves the same effects as the embodiment.

[0087] In the embodiment, there is no limitation on the color scheme between the portion constituting the outer edge of the cavity 45 and the bottom surface of the cavity 45. Alternatively, the color scheme may be different between the outer edge and the bottom surface of the cavity 45. For example, the base plate constituting the bottom surface of the cavity 45 may be black, and the upper surface of the mask plate in which the through holes constituting the side surfaces of the cavity 45 are formed may be gray that is brighter than the bottom surface.

[0088] The initial image data Dn obtained by imaging the supply area As configured in this manner is then subjected to image processing (S42), which is expected to more appropriately capture the outer edge of the cavity 45. However, the brightness of the gray color of the upper surface of the mask plate is set lower than the brightness of the electrode portion corresponding to the blob 70 of the component 92. As a result, the upper surface of the mask plate and the bottom surface of the cavity 45 are colored black by binarization in the image processing for recognizing the component supply state, and this does not affect subsequent image processing. This configuration also achieves the same effects as the embodiment.

[0089] 10: Component mounting machine, 12: Component supply device, 13: Component transfer device, 131: Head drive device, 132: Moving table, 133: Mounting head, 134: Suction nozzle, 14: Component camera, 15: Board camera, 20: Control device, 21: Memory unit, 30: Bulk feeder, 31: Feeder body, 40: Track unit (track member), 45: Cavity, 48: Shutter, 49: Reference mark, 50: Mounting support device, 51: Status recognition unit, 52: Determination unit, 53: Acquisition unit, 54: Information management unit, 55: Condition setting unit, 60: Host computer (host device), 65: Setup device (external device), 66: Support stand, 67: Dedicated camera, 70: Blob, 71: Candidate blob, 72, 73: Defective blob, 80: Recognized component, 89: Foreign substance, 91: Substrate, 92: Component, 95, 95A-95E: Ideal cavity, As: Supply area, R: Transport path, M1: Control program, M2: Component data, M3: Cavity information, D1: Image data, Dn: Initial image data, Rh: Appropriate area, Pf: Reference position

Claims

1. A mounting assistance device applied to a component mounting machine that picks up components from a component supply device equipped with a bulk feeder formed with a plurality of cavities capable of accommodating components in a supply area that supplies the components in a pickable manner, and mounts the components on a board, the mounting assistance device comprising an acquisition unit that performs image processing on initial image data acquired by imaging the supply area with the components removed from the supply area, and acquires cavity information regarding the plurality of cavities.

2. The mounting assistance device described in claim 1, wherein the component mounting machine is equipped with a camera capable of capturing images of the supply area of ​​the bulk feeder equipped on the component supply device, the initial image data is acquired by capturing images with the camera, and the acquisition unit acquires the positions of each of the multiple cavities relative to a reference position of the supply area as the cavity information by processing the image.

3. The mounting assistance device according to claim 2, wherein the camera is a board camera used to capture an image of the board positioned inside the machine.

4. The mounting assistance device described in claim 1, wherein an external device used for setting up or maintaining the bulk feeder comprises a support stand that supports the bulk feeder and a camera capable of imaging the supply area of ​​the bulk feeder supported by the support stand, the initial image data is acquired by imaging with the camera, the bulk feeder has a reference mark that indicates a reference position of the supply area, and the acquisition unit acquires the position of each of the multiple cavities relative to the reference mark as the cavity information by the image processing.

5. The mounting assistance device according to claim 4, wherein the acquisition unit associates the cavity information with identification information that specifies the bulk feeder, and stores the association information in a management device that manages the external device and the component mounting machine.

6. The mounting assistance device according to claim 5, wherein the component mounting machine acquires the cavity information associated with the identification information from the management device based on the identification information of the bulk feeder equipped on the component supply device.

7. The mounting assistance device according to any one of claims 1 to 6, wherein the bulk feeder comprises a feeder body, and a track member that is detachably attached to the feeder body and forms the supply area, and further comprises an information management unit that deletes the cavity information or restricts the use of the cavity information when the track member is detached from the feeder body.

8. A mounting assistance device as described in any one of claims 1 to 6, further comprising a state recognition unit that, after the bulk feeder equipped on the component supply device performs a supply operation to supply the components, performs image processing using the cavity information on image data acquired by imaging the supply area, and recognizes the supply state of the components in the supply area.

9. The mounting assistance device of claim 8, wherein the image processing includes a generation step of generating a plurality of blobs by binarizing the image data, an extraction step of extracting candidate blobs from the plurality of blobs that correspond to at least a portion of a closed area of ​​the component based on the cavity information, and a recognition step of recognizing a rectangular area including one or more of the candidate blobs as the component in the image data.

10. The mounting assistance device of claim 8, further comprising a condition setting unit that sets the imaging conditions applied to the imaging for acquiring the initial image data to conditions under which the outer edge and bottom surface of the cavity are partitioned, different from the imaging conditions applied to the imaging for acquiring the image data used in the supply state recognition process.

11. A mounting assistance device as described in any one of claims 1 to 6, wherein the acquisition unit acquires at least one of the positions, angles, and shapes of the multiple cavities in the supply area as the cavity information.

12. A mounting assistance device as described in any one of claims 1 to 6, wherein the acquisition unit acquires the positions of the multiple cavities in the supply area as the cavity information.