Component mounting apparatus and component mounting method

Abstract

This component mounting apparatus (100) comprises: a component supply unit (tape feeder (5)); a mounting unit (component mounting mechanism (130)); a subsequent tape processing execution unit (LCR checker (19)) that executes predetermined subsequent tape processing on a component of a subsequent tape supplied to a component extraction position; and a control unit (110). The control unit (110) controls the mounting unit so that a first component of the subsequent tape is not extracted in the first turn when it is detected that the first component of the subsequent tape has been supplied to the component extraction position as a second or any subsequent component from the component supply unit in the first turn, and causes the subsequent tape processing execution unit to execute the predetermined subsequent tape processing on the first component of the subsequent tape in the second turn.

Description

Component mounting device and component mounting method

[0001] The present disclosure relates to a component mounting apparatus and the like.

[0002] Patent Document 1 discloses a component mounting device that can accurately determine the identity of components before and after switching from a leading tape to a trailing tape in a tape feeder, and can ensure component mounting quality even after the tape is switched.

[0003] Japanese Patent Application Laid-Open No. 2007-19297

[0004] In a component mounting device such as that described in Patent Document 1, when a switch from a preceding tape to a succeeding tape occurs, subsequent tape processing is performed on the components on the succeeding tape, such as measuring the electrical characteristics of the components on the succeeding tape and detecting the component pickup position and pickup height, etc. This allows components with the correct electrical characteristics to be mounted, and also allows the components to be mounted in the correct position, ensuring component mounting quality.

[0005] However, when picking up multiple components in one turn, a switch from the leading tape to the trailing tape may occur. Note that one turn refers to the process of picking up at least one component supplied to the component pick-up position by a mounting head with multiple pickup nozzles, moving the head onto the board, placing the component on the board, and then returning the mounting head to the component pick-up position. In this case, the components on the trailing tape picked up in this turn have not undergone trailing tape processing, so it may not be possible to ensure the component mounting quality for the components on the trailing tape that are mounted in this turn.

[0006] Therefore, the present disclosure provides a component mounting device and the like that can ensure component mounting quality even when a switch from a leading tape to a trailing tape occurs while multiple components are being picked up in one turn.

[0007] The component mounting device according to the present disclosure includes a component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that repeats a plurality of turns, each turn consisting of removing at least one component supplied to the component removal position by the component supply unit and mounting it on a board; a trailing tape processing execution unit that executes predetermined trailing tape processing on the components on the trailing tape supplied to the component removal position by the component supply unit; and a control unit that controls the component supply unit and the leading tape. and a control unit that controls the mounting unit and the subsequent tape processing execution unit, wherein when the control unit causes the component supply unit to supply a plurality of components to the component removal position in a first turn of a plurality of turns, and when it is detected that the first component of the subsequent tape has been supplied to the component removal position from the component supply unit in the first turn as a second or subsequent component, the control unit controls the mounting unit so as not to remove the first component of the subsequent tape in the first turn, and causes the subsequent tape processing execution unit to perform the specified subsequent tape processing on the first component of the subsequent tape in a second turn after the first turn.

[0008] These comprehensive or specific aspects may be realized by a system, an apparatus, a method, a recording medium, or a computer program, or may be realized by any combination of a system, an apparatus, a method, a recording medium, and a computer program.

[0009] According to the component mounting device and the like disclosed herein, the quality of component mounting can be ensured even if a switch from a leading tape to a trailing tape occurs when multiple components are being adsorbed in one turn.

[0010] FIG. 1 is a plan view showing an example of a component mounting apparatus according to an embodiment. FIG. 2 is a partial cross-sectional view showing an example of a component mounting apparatus according to an embodiment. FIG. 3 is a view for explaining a configuration of a tape feeder according to an embodiment. FIG. 4 is a view for explaining tape splicing. FIG. 5 is a view for explaining tape splicing. FIG. 6 is a view for explaining a method for detecting a joint portion between a leading tape and a following tape. FIG. 7 is a view for explaining a method for detecting a joint portion between a leading tape and a following tape. FIG. 8 is a view for explaining an operation example of a component mounting apparatus in a comparative example. FIG. 9 is a view for explaining an operation example of a component mounting apparatus according to an embodiment. FIG. 10 is a block diagram showing an example of a component mounting apparatus according to an embodiment. FIG. 11 is a view showing an example of mounting data. FIG. 12 is a flowchart showing an example of operation of a component mounting apparatus according to an embodiment.

[0011] The embodiments described below are all comprehensive or specific examples, and the numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0012] (Embodiment) Hereinafter, a component mounting apparatus according to an embodiment will be described with reference to Figs.

[0013] First, the structure of the component mounting apparatus will be described with reference to FIGS.

[0014] FIG. 1 is a plan view showing an example of a component mounting apparatus 100 according to an embodiment.

[0015] 2 is a partial cross-sectional view showing an example of the component mounting apparatus 100 according to the embodiment. FIG. 2 partially shows the cross section AA in FIG.

[0016] In FIG. 1 , a transport path 2 is disposed in the center of a base 1 in the X direction (board transport direction). The transport path 2 transports a board 3 carried in from the upstream side and positions it on a mounting stage. The transport path 2 is an example of a board transport mechanism 120 (see FIG. 7 , described later) that transports the board 3. Component supply units 4 are disposed on both sides of the transport path 2, and multiple tape feeders 5 are arranged in parallel in each component supply unit 4. The tape feeders 5 are also referred to as component supply units 4. The tape feeders 5 feed the carrier tape holding the components by a pitch, thereby supplying the components to a component suction position (also referred to as a component removal position) where the components are picked up by the suction nozzle 8a (see FIG. 2 ) of the mounting head 8.

[0017] Y-axis tables 6A and 6B are disposed on both ends of the upper surface of base 1, and two X-axis tables 7A and 7B are mounted on Y-axis tables 6A and 6B. Driving Y-axis table 6A causes X-axis table 7A to move horizontally in the Y direction, and driving Y-axis table 6B causes X-axis table 7B to move horizontally in the Y direction. Mounting head 8 and board recognition camera 9, which moves integrally with mounting head 8, are attached to X-axis tables 7A and 7B, respectively.

[0018] By driving the Y-axis table 6A, X-axis table 7A, Y-axis table 6B, and X-axis table 7B in combination, the mounting head 8 moves horizontally, picks up components from each component supply unit 4 with a suction nozzle 8a, and mounts them on a board 3 positioned on the transport path 2. The mounting head 8 is an example of a mounting unit that makes multiple turns, with one turn being defined as picking up at least one component supplied to the component pick-up position by the component supply unit 4 and mounting (mounting) it on a board 3. The Y-axis table 6A, X-axis table 7A, Y-axis table 6B, X-axis table 7B, and mounting head 8 are an example of a component mounting mechanism 130 (see FIG. 7 described later) that moves the mounting head 8 to mount components on a board 3.

[0019] The board recognition camera 9, which has moved above the board 3, captures and recognizes the board 3. A component recognition camera 10 and a nozzle holder 11 are disposed on the path from the component supply unit 4 to the transport path 2. When the mounting head 8, which has picked up a component from the component supply unit 4, moves to the board 3 positioned on the mounting stage, the component held by the suction nozzle 8a is moved in the X direction above the component recognition camera 10, whereby the component recognition camera 10 captures an image of the component held by the suction nozzle 8a.

[0020] The imaging results are then recognized by an imaging processing unit 114 (see FIG. 7 described later), thereby recognizing the position of the component while it is held by the suction nozzle 8a and identifying the type of component. The nozzle holding unit 11 stores multiple types of suction nozzles 8a in predetermined orientations, and the mounting head 8 accesses the nozzle holding unit 11 to perform a nozzle exchange operation, thereby exchanging the nozzles in the mounting head 8 according to the type of target component.

[0021] The structure of the component supply unit 4 will now be described. As shown in Figure 2, the component supply unit 4 is provided with a feeder base 4a on which a plurality of tape feeders 5 are mounted. The tape feeders 5 are placed in the component supply unit 4 by a feeder mounting carriage 12. The carriage 12 is provided with a reel holding portion 13 for holding a tape reel 14 on which a carrier tape 15 is stored in a wound state. The reel holding portion 13 is equipped with a holding roller for rotatably holding the tape reel 14, and by rotating the tape reel 14 placed in the component supply unit 4, the carrier tape 15 can be pulled out.

[0022] Next, the function of the tape feeder 5 will be described with reference to FIG.

[0023] FIG. 3 is a diagram for explaining the configuration of the tape feeder 5 according to the embodiment.

[0024] 3, a frame member 5a mounted on the feeder base 4a is provided with a tape running path 5b along which a carrier tape 15 runs. Components P are held in component pockets 16a, which are recesses for storing components and are formed at regular intervals in the carrier tape 15. The upper surfaces of the component pockets 16a are covered with a top tape 17.

[0025] The carrier tape 15 unwound from the tape reel 14 is introduced from the rear of the frame member 5a and fed downstream (to the right in FIG. 3 ) along the upper surface of the tape running path 5b. During the component supply operation in which components are continuously supplied while the carrier tape 15 is fed pitchwise, when the carrier tape 15 (also referred to as the leading tape 15) wound on the tape reel 14 is consumed, tape splicing is performed in which the leading end of a newly loaded carrier tape 15A (also referred to as the trailing tape 15A) is spliced ​​to the trailing end of the carrier tape 15 already loaded on the tape feeder 5 via a splice J. In this manner, the leading tape 15 and the trailing tape 15A are spliced ​​together. The component supply unit 4 feeds the leading tape 15 and the trailing tape 15A, each containing a plurality of components, to the component removal position, and then supplies the plurality of components on the trailing tape 15A to the component removal position.

[0026] A sprocket 21 driven by a rotary drive mechanism 20 is disposed above the downstream end of frame member 5a. Sprocket 21 is provided with feed pins 21a (see FIGS. 5A and 5B) that fit into feed holes 16b (see FIGS. 4A and 4B) that are formed at regular intervals in carrier tape 15. When sprocket 21 is driven to rotate by rotary drive mechanism 20, sprocket 21 rotates, thereby feeding carrier tape 15 downstream.

[0027] The front side of the sprocket 21 is a component suction position where the component P in the component pocket 16a is picked up by suction with the suction nozzle 8a of the mounting head 8. Note that suctioning a component will hereinafter also be referred to as "removing a component." The sprocket 21 and the rotation drive mechanism 20 form a tape feed mechanism that feeds the carrier tape 15 pitch-feed along the tape running path 5b, thereby feeding the component P held on the carrier tape 15 to the component suction position by the suction nozzle 8a.

[0028] An upper guide section 18 is disposed on the upper surface of the downstream portion of the frame member 5a, covering and guiding the carrier tape 15 near the component suction position. The upper guide section 18 is provided with a suction opening 18a, which exposes the component suction position from the upper guide section 18. The downstream end of the suction opening 18a serves as a top tape peeling section for peeling off the top tape 17. As the carrier tape 15 travels below the upper guide section 18, the top tape 17 is peeled off by the top tape peeling section and folded back toward the upstream side. Then, a component P is picked up by the suction nozzle 8a from a component pocket 16a exposed by the peeling of the top tape. The folded back top tape 17 is fed into the tape recovery section 5c by a top tape feeding mechanism 22 and recovered.

[0029] 4A and 4B, tape splicing will now be described.

[0030] 4A and 4B are diagrams for explaining tape splicing.

[0031] As shown in Fig. 4A, in tape splicing, the tail end of carrier tape 15 already loaded on tape feeder 5 is joined to the head end of carrier tape 15A to be newly loaded via butt line E. Splice tapes 28 and 29 are attached to both the top and bottom of the tape attachment margins of base tape 16, sandwiching butt line E, in positions that cover component pockets 16a and feed holes 16b, respectively. As a result, as shown in Fig. 4B, the two carrier tapes 15 and 15A become one continuous carrier tape at seam J.

[0032] The splice tape 29 has a slit 29a in the longitudinal direction, so that when the feed pin 21a of the sprocket 21 fits into the feed hole 16b from below, the feed pin 21a can protrude upward through the slit 29a, preventing interference with tape feeding. Note that while Figure 4A shows the top tape 17 peeled from the base tape 16, in tape splicing, the splice tape 28 is attached from above the top tape 17.

[0033] This tape splicing operation is performed using a dedicated jig, and the two carrier tapes 15 and 15A are aligned so that the pitch p* between the two component pockets 16a on either side of the butt line E is equal to the predetermined pitch p in the base tape 16. Due to operational errors, the pitch p* does not necessarily match the predetermined pitch p perfectly, which may result in a pitch error between the component pockets 16a near the seam J after splicing, or a misalignment in the longitudinal direction of the two carrier tapes 15 and 15A.

[0034] Such pitch errors and alignment errors can cause the component pockets 16a to be pitch-fed to the correct position when the seam J approaches the component suction position. The component pockets 16a are aligned by fitting the feed pins 21a of the sprocket 21 into the component pockets 16a. However, if there are pitch errors or alignment errors such as those described above, the positions of the component pockets 16a will vary, and the suction nozzles 8a will not be able to stably pick up the components P in the component pockets 16a. This requires a suction position correction to relatively align the suction nozzles 8a with the component suction position where the components P fed by the tape feed mechanism will stop.

[0035] For example, by photographing the components on the following tape 15A with the board recognition camera 9, the positions of the components on the following tape 15A, i.e., the suction positions of the components on the following tape 15A, can be detected, and suction position correction can be performed. Also, for example, by lowering the suction nozzle 8a and measuring the distance until it contacts the top surface of the component on the following tape 15A, the height of the component on the following tape 15A, i.e., the suction height of the component on the following tape 15A, can be detected, and suction position correction can be performed.

[0036] Furthermore, the component mounting apparatus 100 is provided with an LCR checker 19 to accurately determine the identity of the electrical characteristics of components before and after the switch from the leading tape 15 to the trailing tape 15A in the tape feeder 5. The LCR checker 19 can measure, for example, the inductance, capacitance, and resistance of components as electrical characteristics of the components. For example, when a component on the trailing tape 15A that has been picked up by the suction nozzle 8a is placed on the LCR checker 19, the electrical characteristics of the component are measured, and it is possible to determine whether the electrical characteristics are identical to those of the component on the leading tape 15. Note that the component placed on the LCR checker 19 for use in measuring the electrical characteristics may be discarded or mounted on the board 3 after the electrical characteristics have been measured.

[0037] The LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130 are an example of a subsequent tape processing execution unit that performs predetermined subsequent tape processing on the components on the subsequent tape 15A that are supplied to the component removal position by the component supply unit 4. For example, the predetermined subsequent tape processing includes measuring the electrical characteristics of the components on the subsequent tape 15A, detecting the suction positions of the components on the subsequent tape 15A, or detecting the suction height of the components P on the subsequent tape 15A.

[0038] Next, a method for detecting the seam J during the tape feeding process of the carrier tape 15 will be described with reference to FIGS. 5A and 5B.

[0039] 5A and 5B are diagrams for explaining a method for detecting the joint J between the leading tape 15 and the trailing tape 15A.

[0040] 5A shows a plan view of the upper guide portion 18 provided at the tip of the frame member 5a. A component pocket 16a is exposed within a suction opening 18a of the upper guide portion 18, which is provided corresponding to the pickup position of the suction nozzle 8a. The feed pins 21a of the sprocket 21 engage with the feed holes 16b downstream of the suction opening 18a. A groove for accommodating the feed pins 21a is provided in the upper guide portion 18 at a position corresponding to the sprocket 21, so that the feed pins 21a protruding upward from the feed holes 16b do not interfere with the upper guide portion 18.

[0041] A seam detection opening 18b is provided upstream of the suction opening 18a at a position above the feed hole 16b in the upper guide portion 18. As shown in Fig. 5B, a sensor 30, which is a reflective optical sensor, is inserted from below into the frame member 5a at a position corresponding to the opening 18b. A detection signal from the sensor 30 is sent to a control unit 110 (see Fig. 7 described later). The control unit 110 detects the seam J in the carrier tape 15 based on the detection signal from the sensor 30. In other words, the control unit 110 detects that a component on the following tape 15A has been supplied to the suction opening 18a (the component removal position) (i.e., that a change of tape has occurred) after the tape has been fed a predetermined number of times.

[0042] When the normal portion of the carrier tape 15 passes above the sensor 30, the light from the sensor 30 passes upward through the sprocket holes 16b and the openings 18b when the sprocket holes 16b are positioned between the sensor 30 and the openings 18b. At this timing, the sensor 30 does not detect the reflected light, and a signal indicating that the sprocket holes 16b have been detected is sent. This sprocket hole detection signal is then repeatedly output at intervals corresponding to the sprocket hole pitch, allowing the control unit 110 to determine that no seam J exists.

[0043] 5B, when the splice tape 29 blocks the feed holes 16b of the joint J and the joint J passes above the sensor 30, the light from the sensor 30 is reflected by the splice tape 29 and the feed holes 16b are not detected within the area where the splice tape 29 is attached. If this state of not detecting the feed holes continues for a predetermined period of time, the control unit 110 detects that the joint J has passed the position of the sensor 30.

[0044] When picking up a plurality of components in one turn, there may be a case where the tape is switched from the leading tape 15 to the trailing tape 15A. The problem that arises in this case will be described with reference to FIG. 6A.

[0045] 6A is a diagram for explaining an example of the operation of a component mounting device in a comparative example. Fig. 6A shows a top view of the leading tape 15 and the trailing tape 15A connected at the joint J. In Fig. 6A, the component marked "L" is the last component on the leading tape 15, the component marked "1" is the first component on the trailing tape 15A, and the components from the second onwards on the trailing tape 15A are marked "2," "3," and "4."

[0046] For example, when component supply unit 4 is caused to supply multiple components to the component take-out position in the first turn of multiple turns, assume that in the first turn, in addition to the components on leading tape 15, up to the first component "1" on trailing tape 15A is supplied to the component take-out position. In this case, in the comparative example, in addition to the components on leading tape 15, up to the first component "1" on trailing tape 15A is picked up in the first turn. At this point, the component "1" on trailing tape 15A has not undergone the specified following tape processing, such as measuring electrical characteristics or detecting the pickup position or height, and therefore it may not be possible to ensure the component mounting quality for component "1" on trailing tape 15A that is mounted in the first turn.

[0047] In contrast, the component mounting apparatus 100 according to the embodiment can solve the above problem by operating as shown in FIG. 6B.

[0048] 6B is a diagram for explaining an example of the operation of the component mounting apparatus 100 according to the embodiment. Fig. 6B shows a top view of the leading tape 15 and the trailing tape 15A connected at the joint J. In Fig. 6B, the component marked "L" is the last component on the leading tape 15, the component marked "1" is the first component on the trailing tape 15A, and the components from the second onwards on the trailing tape 15A are marked "2" and "3."

[0049] For example, as in the comparative example, when component supply unit 4 is caused to supply multiple components to the component take-out position in the first turn of multiple turns, it is assumed that in the first turn, in addition to the components on leading tape 15, the first component "1" on trailing tape 15A is also supplied to the component take-out position. In this case, in the embodiment, only the components on leading tape 15 are picked up in the first turn, and the first component "1" on trailing tape 15A is not picked up. This ensures component mounting quality even when a switch from leading tape 15 to trailing tape 15A occurs when multiple components are being picked up in one turn.

[0050] Below, we will explain the functional configuration and operation of the component mounting device 100, which can ensure the quality of component mounting even when switching from the leading tape 15 to the trailing tape 15A occurs while adsorbing multiple components in one turn.

[0051] 7 is a block diagram showing an example of a component mounting apparatus 100 according to an embodiment. Note that the board transport mechanism 120, the component mounting mechanism 130, the tape feeder 5, the LCR checker 19, the component recognition camera 10, and the board recognition camera 9 have already been described, and therefore their description will be omitted.

[0052] The control unit 110 controls the component supply unit 4, the mounting unit (for example, the mounting head 8), and the subsequent tape processing execution unit (for example, the LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130).

[0053] The control unit 110 includes a storage unit 111, a mechanism drive unit 112, a new tape processing control unit 113, and an image capture processing unit 114. The control unit 110 is a computer including a processor (microprocessor) and a memory. The memory may be a read-only memory (ROM) or a random access memory (RAM), and can store programs executed by the processor. The mechanism drive unit 112, the new tape processing control unit 113, and the image capture processing unit 114 are implemented by a processor that executes programs stored in the memory. The storage unit 111 is implemented by a memory, but may be a memory separate from the memory in which the programs are stored.

[0054] For example, mounting data, component data, tape switching information, a new tape processing required flag, and component pickup position / height information are stored in the storage unit 111. The mounting data will now be described with reference to FIG.

[0055] FIG. 8 is a diagram illustrating an example of the mounting data.

[0056] 8, for example, the mounting data includes information indicating, for each turn, which component ID each of the multiple suction nozzles 8a of the mounting head 8 will pick up, from which supply position (in other words, from which of the multiple tape feeders 5), and at which position (x, y) and in what orientation (θ) on the board 3 the picked-up component will be mounted. Note that specific content of each piece of information is not shown in FIG. 8. By referencing such mounting data, the component mounting device 100 can mount components supplied to the component pick-up position onto the board 3 for each turn.

[0057] 7, the component data includes information indicating the electrical characteristics of each component mounted on the board 3. For example, by comparing the electrical characteristics of the components on the following tape 15A measured by the LCR checker 19 with the component data, it can be determined whether the electrical characteristics of the components on the following tape 15A are correct.

[0058] The tape change information is stored in the memory unit 111 for each of the multiple tape feeders 5. For example, when a detection signal for the seam J from the sensor 30 of a certain tape feeder 5 is sent to the control unit 110, tape change information indicating that the seam J has been detected for that tape feeder 5 is stored in the memory unit 111. This allows the control unit 110 to detect that a component on the following tape 15A has been supplied to the component removal position, i.e., that a tape change has occurred, by the tape feeder 5 feeding the tape a predetermined number of times. For example, the predetermined number of times can be set depending on the distance between the portion where the sensor 30 detects the seam J (e.g., the opening 18b) and the component removal position (e.g., the suction opening 18a). Note that the tape feeder 5 may transmit to the control unit 110 a notification that a component on the following tape 15A has been supplied to the component removal position (i.e., that a tape change has occurred) at the timing when the tape feeder 5 has fed the tape a predetermined number of times after detecting the seam J. In this way, the control unit 110 can also detect that a component on the succeeding tape 15A has been supplied to the component removal position, that is, that a change of tape has occurred.

[0059] The new tape processing required flag is stored in the storage unit 111 for each of the plurality of tape feeders 5. The new tape processing required flag will be described later.

[0060] The component suction position / height information is stored in the memory unit 111 for each of the multiple tape feeders 5. For example, component suction position / height information indicating the suction position and suction height of the components on the following tape 15A detected by the board recognition camera 9 and the component mounting mechanism 130 is stored in the memory unit 111. This allows the control unit 110 to correct the suction position in order to correctly pick up the components on the following tape 15A. Note that the component suction position / height information may be information indicating the corrected component suction position and suction height.

[0061] The mechanism driving unit 112 is a component for driving the board transport mechanism 120 , the component mounting mechanism 130 and the tape feeder 5 .

[0062] The new tape processing control unit 113 is a component that causes the subsequent tape processing execution unit (e.g., the LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130) to execute a predetermined subsequent tape process (e.g., measuring the electrical characteristics of the components on the subsequent tape 15A, detecting the suction position of the components on the subsequent tape 15A, or detecting the suction height of the components on the subsequent tape 15A).

[0063] The image capturing processing unit 114 controls the component recognition camera 10 and the board recognition camera 9 , and also performs recognition processing on the images captured by the component recognition camera 10 and the board recognition camera 9 .

[0064] When the control unit 110 causes the component supply unit 4 to supply multiple components to the component removal position in the first turn of multiple turns, if it detects that the first component on the following tape 15A has been supplied to the component removal position from the component supply unit 4 as the second or subsequent component in the first turn, it controls the mounting head 8 so as not to remove the first component on the following tape 15A in the first turn, and causes the following tape processing execution unit to perform a predetermined following tape processing on the first component on the following tape 15A in the second turn after the first turn. Details of this operation of the control unit 110 will be described using FIG. 9.

[0065] 9 is a flowchart showing an example of the operation of the component mounting apparatus 100 according to the embodiment. The component mounting apparatus 100 performs the process shown in FIG.

[0066] First, the control unit 110 determines whether the new tape processing required flag is ON (step S11). For example, the control unit 110 makes this determination by checking the new tape processing required flag of the target tape feeder 5 stored in the memory unit 111. The new tape processing required flag is turned ON in step S18, which will be described later.

[0067] If the control unit 110 determines that the new tape processing required flag is not ON (No in step S11), it determines whether or not a component is being picked up in this turn (step S12). For example, the control unit 110 makes this determination by checking the mounting data stored in the memory unit 111.

[0068] If the control unit 110 determines that a component is being picked up in this turn (Yes in step S12), it causes the tape feeder 5 to feed the tape (step S13). This supplies the component to the component pick-up position. For example, this turn may be the first turn of multiple turns.

[0069] Next, the control unit 110 determines whether a change of tape has occurred (step S14). For example, if the tape feed in step S13 is the predetermined number of times after the seam J is detected, the control unit 110 determines that a change of tape has occurred.

[0070] If the control unit 110 determines that no tape switching has occurred (No in step S14), that is, if it determines that the component on the leading tape 15 has been supplied to the component removal position, it controls the mounting head 8 to remove (adsorb) the component on the leading tape 15 (step S15).

[0071] Next, the control unit 110 determines whether or not there is another component pickup in this turn (first turn) (step S16). For example, the control unit 110 makes this determination by checking the mounting data stored in the memory unit 111.

[0072] If the control unit 110 determines that there will be another component pickup in this turn (Yes in step S16), it causes the tape feeder 5 to feed the tape (step S13).

[0073] Next, the control unit 110 determines whether a tape switch has occurred (step S14), and if it determines that a tape switch has occurred (Yes in step S14), that is, if it detects that the first component on the subsequent tape 15A has been supplied to the component removal position as the second or subsequent component from the component supply unit 4 in the first turn, it controls the mounting head 8 so that it does not remove (does not adsorb) the first component on the subsequent tape 15A in the first turn (step S17).

[0074] Then, the control unit 110 turns on the new tape processing required flag (step S18). For example, the control unit 110 stores in the memory unit 111 that the new tape processing required flag for the target tape feeder 5 has been turned on. The new tape processing required flag is a flag for causing the subsequent tape processing execution unit (e.g., the LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130) to execute a predetermined subsequent tape process (e.g., measurement of the electrical characteristics of the component on the subsequent tape 15A, detection of the suction position of the component on the subsequent tape 15A, or detection of the suction height of the component on the subsequent tape 15A) on the first component on the subsequent tape 15A in the second turn after the first turn.

[0075] If the control unit 110 determines that no component was picked up in this turn (first turn) (No in step S12 or step S16), or if the new tape processing required flag is turned ON, it determines whether there is a next turn (step S19). For example, the control unit 110 makes this determination by checking the mounting data stored in the memory unit 111. For example, the next turn is set to the second turn after the first turn.

[0076] When the control unit 110 determines that there is a next turn (Yes in step S19), it determines whether the new tape processing required flag is ON (step S11). If the new tape processing required flag is ON (Yes in step S11), it causes the subsequent tape processing execution unit to execute a predetermined subsequent tape processing for the first component on the subsequent tape 15A in the second turn. Specifically, the control unit 110 causes the board recognition camera 9 and the component mounting mechanism 130 to detect the component suction position and component suction height (step S20), controls the mounting head 8 to pick up (pick up) the component (step S21), and causes the LCR checker 19 to measure the electrical characteristics of the component (LCR check) (step S22). For example, in step S20, the board recognition camera 9 and the component mounting mechanism 130 detect the component suction position and component suction height for a component supplied at the component pick-up position. For example, in step S21, the component whose component suction position and component suction height have been detected is picked up by the mounting head 8. For example, in step S22, the component picked up by the mounting head 8 is moved to the LCR checker 19 and placed on the LCR checker 19, where an LCR check is performed.

[0077] Next, the control unit 110 obtains the result of the LCR check from the LCR checker 19 and determines whether the result is acceptable (step S23). For example, the control unit 110 makes the determination by comparing the obtained result of the LCR check with the component data stored in the storage unit 111.

[0078] If the control unit 110 determines that the LCR check results are satisfactory (Yes in step S23), that is, if it has confirmed that the electrical characteristics of the components before and after the switch from the preceding tape 15 to the succeeding tape 15A are identical, it turns off the new tape processing required flag (step S24). Thereafter, the component mounting apparatus 100 can mount components on the board 3 using the components on the succeeding tape 15A whose electrical characteristics have been confirmed to be identical to those of the components on the preceding tape 15. As mentioned above, the components used in the LCR check may be mounted on the board 3 or discarded.

[0079] If the control unit 110 determines that the LCR check results are problematic (No in step S23), that is, if it cannot confirm that the electrical characteristics of the components before and after the switch from the preceding tape 15 to the following tape 15A are identical, it issues a notification (step S25). This allows an operator or the like to recognize that the following tape 15A contains components with different electrical characteristics from those of the preceding tape 15, and to replace the following tape 15A with one that contains the correct components, for example.

[0080] The component supply unit 4 may be an autoload feeder that automatically starts feeding the following tape 15A when it detects that the end of the preceding tape 15 has passed a predetermined position. In this case, when it detects in step S13 that the end of the preceding tape 15 has passed a predetermined position, the control unit 110 can determine in step S14 that a tape switch has occurred.

[0081] As described above, when it is detected that the first component on the following tape 15A has been supplied to the component pick-up position from the component supply unit 4 as the second or subsequent component during the first turn, the first component on the following tape 15A is not picked up during the first turn, thereby preventing components on the following tape 15A that have not undergone the required subsequent tape processing during the first turn from being mounted. Furthermore, the required subsequent tape processing is performed on the first component on the following tape 15A during the second turn, which follows the first turn. Therefore, components on the following tape 15A that have undergone the required subsequent tape processing can be mounted during turns after the second turn. Therefore, even if a switch occurs from the preceding tape 15A to the following tape 15A when multiple components are being picked up during a single turn, component mounting quality can be ensured. For example, components with correct electrical characteristics (inductance, capacitance, or resistance) can be mounted, and components can be picked up at the correct pickup position and pickup height, for example.

[0082] If the leading tape 15 and the trailing tape 15A are joined by splicing, detecting the joint J between the leading tape 15 and the trailing tape 15A makes it possible to detect that the first component on the trailing tape 15A has been supplied to the component removal position as the second or subsequent component from the component supply unit 4 in the first turn by detecting the joint J between the leading tape 15 and the trailing tape 15A. Also, if the component supply unit 4 is an autoload feeder, detecting that the end of the leading tape 15 has passed a predetermined position makes it possible to detect that the first component on the trailing tape 15A has been supplied to the component removal position as the second or subsequent component from the component supply unit 4 in the first turn.

[0083] (Other Embodiments) While the component mounting device 100 of the present disclosure has been described above based on the embodiments, the present disclosure is not limited to the above-described embodiments. As long as they do not deviate from the spirit of the present disclosure, various modifications conceivable by those skilled in the art to the present embodiments and configurations constructed by combining components of different embodiments are also included within the scope of the present disclosure.

[0084] For example, the present disclosure can be realized not only as the component mounting apparatus 100 but also as a component mounting method including steps (processing) performed by the components that make up the component mounting apparatus 100 .

[0085] The component mounting method is a component mounting method executed by a component mounting device, and the component mounting device includes a component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that repeats turns a plurality of times, each turn consisting of removing at least one component supplied to the component removal position by the component supply unit and mounting it on a board; and a trailing tape processing execution unit that performs predetermined trailing tape processing on the components on the trailing tape that have been supplied to the component removal position by the component supply unit. In the component mounting method, as shown in FIG. 9 , when the component supply unit is caused to supply multiple components to the component removal position in the first turn of multiple turns, if it is detected that the first component on the subsequent tape has been supplied to the component removal position as the second or subsequent component from the component supply unit in the first turn (Yes in step S14), the mounting unit is controlled so as not to remove the first component on the subsequent tape in the first turn (step S17), and in the second turn after the first turn, the subsequent tape processing execution unit is caused to perform a predetermined subsequent tape process on the first component on the subsequent tape (steps S20 and S22).

[0086] For example, the present disclosure can be realized as a program for causing a computer (processor) to execute steps included in the component mounting method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

[0087] For example, when the present disclosure is realized as a program (software), each step is performed by running the program using hardware resources such as a computer's CPU, memory, input / output circuits, etc. In other words, each step is performed by the CPU acquiring data from memory or input / output circuits, etc., performing calculations, and outputting the calculation results to memory or input / output circuits, etc.

[0088] In the above embodiment, each component included in the component mounting apparatus 100 may be configured with dedicated hardware or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory.

[0089] Some or all of the functions of the component mounting apparatus 100 according to the above-described embodiment are typically realized as an LSI, which is an integrated circuit. These may be individually integrated into single chips, or may be integrated into a single chip that includes some or all of the functions. Furthermore, the integrated circuit is not limited to an LSI, and may be realized using a dedicated circuit or a general-purpose processor. It is also possible to use an FPGA (Field Programmable Gate Array) that can be programmed after LSI manufacturing, or a reconfigurable processor that can reconfigure the connections and settings of circuit cells within an LSI.

[0090] Furthermore, if an integrated circuit technology that can replace LSI emerges due to advances in semiconductor technology or other derived technologies, that technology may naturally be used to integrate the components included in the component mounting device 100 into integrated circuits.

[0091] In addition, this disclosure also includes forms obtained by making various modifications to the embodiments that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions in each embodiment within the scope of the present disclosure.

[0092] (Additional Notes) The above description of the embodiments discloses the following techniques.

[0093] (Technology 1) A component supply unit that feeds a leading tape and a trailing tape, each storing a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that repeats a plurality of turns, each turn consisting of removing at least one component supplied to the component removal position by the component supply unit and mounting it on a board; a trailing tape processing execution unit that executes predetermined trailing tape processing on the components on the trailing tape supplied to the component removal position by the component supply unit; and a system that links the component supply unit, the mounting unit, and the trailing tape. and a control unit that controls the mounting unit and a subsequent tape processing execution unit, wherein when the control unit causes the component supply unit to supply a plurality of components to the component removal position in a first turn of a plurality of turns, and when it is detected that the first component on the subsequent tape has been supplied to the component removal position from the component supply unit in the first turn as a second or subsequent component, the control unit controls the mounting unit so as not to remove the first component on the subsequent tape in the first turn, and causes the subsequent tape processing execution unit to perform the specified subsequent tape processing on the first component on the subsequent tape in a second turn after the first turn.

[0094] According to this, when it is detected in the first turn that the first component on the subsequent tape has been supplied to the component removal position from the component supply unit as the second or subsequent component, the first component on the subsequent tape is not removed in the first turn, so that components on the subsequent tape that have not undergone the specified subsequent tape processing in the first turn are not mounted. Also, in the second turn after the first turn, the specified subsequent tape processing is performed on the first component on the subsequent tape, so that components on the subsequent tape that have undergone the specified subsequent tape processing can be mounted in turns after the second turn. Therefore, component mounting quality can be ensured even if a switch from the preceding tape to the subsequent tape occurs when multiple components are being picked up in one turn.

[0095] (Technology 2) The component mounting apparatus according to Technology 1, wherein the predetermined subsequent tape processing includes measuring electrical characteristics of components on the subsequent tape.

[0096] This allows components with the correct electrical characteristics (inductance value, capacitance value, or resistance value) to be mounted even if a switch from the preceding tape to the succeeding tape occurs while multiple components are being picked up in one turn.

[0097] (Technology 3) The component mounting device according to Technology 1 or 2, wherein the predetermined subsequent tape processing includes detecting the suction position of the component on the subsequent tape.

[0098] This allows components to be picked up at the correct pickup position even if a switch from the preceding tape to the succeeding tape occurs when multiple components are being picked up in one turn.

[0099] (Technology 4) The component mounting device according to any one of Technologies 1 to 3, wherein the predetermined subsequent tape processing includes detecting the suction height of the components on the subsequent tape.

[0100] This allows the components to be picked up at the correct pickup height even if a switch from the preceding tape to the succeeding tape occurs when picking up multiple components in one turn.

[0101] (Technology 5) The component mounting apparatus according to any one of Technologies 1 to 4, wherein the preceding tape and the succeeding tape are joined by splicing.

[0102] When the preceding tape and the following tape are joined by splicing, by detecting the joint between the preceding tape and the following tape, it is possible to detect that the first component of the following tape has been supplied to the component removal position as the second or subsequent component from the component supply section in the first turn.

[0103] (Technology 6) A component mounting device according to any one of technologies 1 to 4, wherein the component supply unit is an autoload feeder, and when it detects that the end of the preceding tape has passed a predetermined position, it automatically starts feeding out the following tape.

[0104] If the component supply unit is an autoload feeder, by detecting that the end of the preceding tape has passed a predetermined position, it is possible to detect that the first component of the succeeding tape has been supplied to the component removal position as the second or subsequent component from the component supply unit in the first turn.

[0105] (Technology 7) A component mounting method executed by a component mounting device, the component mounting device including: a component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, and supplies all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that repeats a plurality of turns, each turn consisting of removing at least one component supplied to the component removal position by the component supply unit and mounting it on a board; and a predetermined trailing tape processing unit that performs predetermined processing on the components on the trailing tape supplied to the component removal position by the component supply unit. and a subsequent tape processing execution unit that executes the predetermined subsequent tape processing on the first component of the subsequent tape, wherein the component mounting method causes the component supply unit to supply a plurality of components to the component removal position in a first turn of the plurality of turns, and when it is detected that the first component of the subsequent tape has been supplied to the component removal position from the component supply unit in the first turn as a second or subsequent component, the component mounting method controls the mounting unit not to remove the first component of the subsequent tape in the first turn, and causes the subsequent tape processing execution unit to execute the predetermined subsequent tape processing on the first component of the subsequent tape in a second turn after the first turn.

[0106] This provides a component mounting method that can ensure component mounting quality even when switching from the preceding tape to the succeeding tape occurs while multiple components are being picked up in one turn.

[0107] The present disclosure can be applied to a component mounting device that picks up components from a tape feeder and mounts the components.

[0108] REFERENCE SIGNS LIST 1 Base 2 Transport path 3 Board 4 Component supply section 4a Feeder base 5 Tape feeder 5a Frame member 5b Tape running path 5c Tape recovery section 6A, 6B Y-axis table 7A, 7B X-axis table 8 Mounting head 8a Suction nozzle 9 Board recognition camera 10 Component recognition camera 11 Nozzle holding section 12 Cart 13 Reel holding section 14 Tape reel 15 Carrier tape (leading tape) 15A Carrier tape (following tape) 16 Base tape 16a Component pocket 16b Feed hole 17 Top tape 18 Upper guide section 18a Suction opening 18b Opening 19 LCR checker 20 Rotation drive mechanism 21 Sprocket 21a Feed pin 22 Top tape feed mechanism 28, 29 Splice tape 29a Slit 30 Sensor 100 Component mounting device 110 Control section 111 Memory section 112 Mechanism driving section 113 New tape processing control section 114 Image capturing processing section 120 Substrate conveying mechanism 130 Component mounting mechanism E Butt line J Seam section P Component p, p* Pitch

Claims

1. A component supply unit that sends out a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that repeats a plurality of turns, each turn consisting of removing at least one component supplied to the component removal position by the component supply unit and mounting it on a board; a trailing tape processing execution unit that executes a predetermined trailing tape process on the components on the trailing tape supplied to the component removal position by the component supply unit; and a control unit that controls the component supply unit, the mounting unit, and the trailing tape processing execution unit, a component mounting device in which, when the control unit causes the component supply unit to supply multiple components to the component removal position in a first turn of the multiple turns, when it is detected that a first component of the subsequent tape has been supplied to the component removal position as a second or subsequent component from the component supply unit in the first turn, the control unit controls the mounting unit not to remove the first component of the subsequent tape in the first turn, and causes the subsequent tape processing execution unit to execute the predetermined subsequent tape processing on the first component of the subsequent tape in a second turn after the first turn.

2. The component mounting apparatus according to claim 1, wherein the predetermined subsequent tape processing includes measuring electrical characteristics of components on the subsequent tape.

3. The component mounting device according to claim 1, wherein the predetermined subsequent tape processing includes detection of a component pickup position on the subsequent tape.

4. The component mounting device according to claim 1, wherein the predetermined subsequent tape processing includes detection of a suction height of components on the subsequent tape.

5. The component mounting device according to claim 1, wherein the preceding tape and the succeeding tape are joined by splicing.

6. The component mounting device according to claim 1, wherein the component supply unit is an autoload feeder that automatically starts feeding the following tape when it detects that the end of the preceding tape has passed a predetermined position.

7. A component mounting method executed by a component mounting device, the component mounting device comprising: a component supplying section that feeds out a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; an attachment section that repeats a plurality of turns, each turn consisting of removing at least one component supplied to the component removal position by the component supplying section and mounting it on a board; and a trailing tape processing execution section that executes a predetermined trailing tape processing on the components on the trailing tape supplied to the component removal position by the component supplying section; and in the component mounting method, when the component supplying section is caused to supply a plurality of components to the component removal position in a first turn of the plurality of turns, if it is detected in the first turn that the first component on the trailing tape has been supplied to the component removal position by the component supplying section as a second or subsequent component, the attachment section controls the attachment section so as not to remove the first component on the trailing tape in the first turn; and causing the subsequent tape processing execution unit to execute the predetermined subsequent tape processing on a first component on the subsequent tape in a second turn after the first turn.