Wiring board and electronic module

Abstract

The problem addressed by the present invention is to reduce a likelihood of cracks being formed in an insulating board. A wiring board according to an embodiment of the present disclosure includes an insulating board having a first side face, a first via conductor and a second via conductor that are situated in the insulating board, a first conductor extending from the first via conductor toward the first side face in a first direction from the first via conductor toward the first side face on the insulating board, and a second conductor extending from the second via conductor toward the first side face in the first direction on the insulating board. Of end portions of the first conductor in the first direction, the first via conductor is connected to an end portion on the opposite side from a first end portion on the first side face side. Of end portions of the second conductor in the first direction, the second via conductor is connected to an end portion on the opposite side from a second end portion on the first side face side. The first conductor and the second conductor are situated side by side in a second direction that is orthogonal to the first direction. The first via conductor is situated at a position that is farther away from the first side face than the second via conductor in the first direction. The first conductor and the second conductor are situated away from each other in a side view from the first direction. The first via conductor and the second via conductor are situated away from each other in a side perspective view from the first direction and a side perspective view from the second direction.

Description

Wiring board and electronic module

[0001] The present disclosure relates to a wiring board on which electronic components are mounted.

[0002] A wiring board on which electronic components are mounted is known, as disclosed in Patent Document 1. In such a wiring board, signals are transmitted and received through via conductors formed inside the wiring board.

[0003] International Publication No. 2022 / 070856

[0004] A wiring board according to one aspect of the present disclosure includes an insulating substrate having a first side surface, a first via conductor and a second via conductor located within the insulating substrate, a first conductor extending from the first via conductor toward the first side surface in a first direction from the first via conductor toward the first side surface on the insulating substrate, and a second conductor extending from the second via conductor toward the first side surface in the first direction on the insulating substrate, wherein the first via conductor is connected to an end of the first conductor in the first direction that is opposite to a first end on the first side surface side, and the second via conductor is , is connected to an end of the second conductor in the first direction opposite to the second end on the first side surface side, the first conductor and the second conductor are positioned side by side in a second direction perpendicular to the first direction, the first via conductor is positioned farther from the first side surface in the first direction than the second via conductor, when viewed from the side in the first direction, the first conductor and the second conductor are positioned apart, and when viewed from the side in a perspective view from the first direction and from the side in a perspective view from the second direction, the first via conductor and the second via conductor are positioned apart.

[0005] 10 is a perspective view showing a configuration of an electronic module according to a first embodiment of the present disclosure. FIG. 11 is a side view of the electronic module as viewed from a second direction. FIG. 12 is a plan view of the electronic module in which region A shown in FIG. 1 is viewed from above. FIG. 13 is a plan view of a first conductor, a second conductor, a third conductor, and a fourth conductor according to the first embodiment of the present disclosure are viewed from above. FIG. 14 is a cross-sectional view taken along the arrows V-V shown in FIG. 3. FIG. 15 is a side perspective view of a wiring board viewed from a first direction. FIG. 16 is a side perspective view of a wiring board viewed from a second direction. FIG. 17 is a plan view of a wiring board viewed from above. FIG. 18 is a cross-sectional view of a wiring board according to one aspect of the present disclosure. FIG. 19 is a perspective view of a wiring board according to a second embodiment of the present disclosure. FIG. 19 is a cross-sectional view taken along the arrows XII-XII shown in FIG. 11. FIG. 19 is a plan view of a wiring board according to a third embodiment of the present disclosure as viewed from above. FIG. 20 is a plan view of a wiring board according to a third embodiment of the present disclosure as viewed from above. FIG. 21 is a plan view of a first conductor, a second conductor, a third conductor, and a fourth conductor according to the third embodiment of the present disclosure as viewed from above. FIG. 22 is a side perspective view of the wiring board according to a fourth embodiment of the present disclosure. 21 is a perspective view of a wiring board according to a fifth embodiment of the present disclosure. FIG. 22 is a top view of the wiring board. FIG. 23 is a cross-sectional view taken along line XIX-XIX in FIG. 18. FIG. 24 is a perspective view of a wiring board according to a sixth embodiment of the present disclosure. FIG. 25 is a top view of the wiring board. FIG. 26 is a cross-sectional view taken along line XXII-XXII in FIG. 21. FIG. 27 is a perspective view of a wiring board according to a seventh embodiment of the present disclosure, seen through the vicinity of a first side surface.

[0006] In recent years, as electronic components have become larger, the area in which conductors connected to the electronic components are formed has become smaller, reducing the degree of freedom in arranging via conductors. As a result, the distance between via conductors has become shorter, which may cause cracks to occur in the wiring substrate and lead to short circuits. According to one aspect of the present disclosure, it is possible to reduce the possibility of cracks occurring in the insulating substrate.

[0007] [Embodiment 1] An embodiment of the present disclosure will be described in detail below. FIG. 1 is a perspective view showing the configuration of an electronic module 1 according to this embodiment. In the following description, the X-axis direction shown in FIG. 1 will be referred to as the left-right direction, the Y-axis direction as the front-rear direction, and the Z-axis direction as the up-down direction. In addition, the +X-axis direction in FIG. 1 may be referred to as the right direction, the −X-axis direction as the left direction, the +Z-axis direction as the up direction, and the −Z-axis direction as the down direction. In the following description, the Z-axis direction may be referred to as the thickness direction. FIG. 2 is a side view of the electronic module 1 as viewed from the Y-axis direction. As shown in FIGS. 1 and 2, the electronic module 1 includes a wiring substrate 10 and an electronic component 2.

[0008] The electronic component 2 is mounted on the upper surface 21 of the insulating substrate 20, which will be described later. The electronic component 2 may be mounted on the upper surface 21 by being bonded via a bonding material such as brazing material, glass, or adhesive, or may be indirectly mounted on the upper surface 21 via a member such as a base. The electronic component 2 may be a semiconductor element, a piezoelectric element, a sensor element, a passive element, or the like, such as a CCD (Charge-Coupled Device) element or a CMOS (Complementary Metal-Oxide Semiconductor) element. The electronic component 2 may also be a display element such as a liquid crystal display. The electronic module 1 may have a plurality of electronic components 2 of different types mounted thereon.

[0009] The wiring substrate 10 includes an insulating substrate 20 , a plurality of first connecting conductors 30 , a plurality of second connecting conductors 40 , and a plurality of via conductors 50 .

[0010] The insulating substrate 20 has a thickness in the vertical direction. In this embodiment, the insulating substrate 20 has a rectangular parallelepiped shape. However, the insulating substrate 20 of the present disclosure is not limited to a rectangular parallelepiped shape. The insulating substrate 20 may have any shape as long as it has a predetermined thickness, and may be, for example, a triangular prism shape or a three-dimensional shape with chamfered corners.

[0011] The insulating substrate 20 is made of an insulating material. Examples of insulating materials that can be used include ceramic materials such as aluminum oxide (alumina), silicon oxide, and aluminum nitride; organic resin materials such as epoxy resin, polyimide resin, olefin resin, polyphenylene resin, and polytetrafluoroethylene (PTFE); and glass materials. The insulating substrate 20 has an upper surface 21 on which the electronic component 2 is mounted, a lower surface 22 opposite the upper surface 21, and four side surfaces 23 that are outer surfaces of the insulating substrate 20. In this embodiment, the side surfaces 23 are flat surfaces perpendicular to the upper surface 21, but may also be flat surfaces inclined relative to the upper surface 21. The side surfaces 23 may have an uneven surface. The insulating substrate 20 may have a structure in which multiple materials with different insulating properties are stacked, for example.

[0012] The first conductor 31 , second conductor 32 , third conductor 33 and fourth conductor 34 described below are examples of the first connecting conductor 30 .

[0013] The first connecting conductor 30 is provided on the upper surface 21 of the insulating substrate 20. The first connecting conductor 30 is electrically conductive. The first connecting conductor 30 may contain a metal with a high melting point, such as tungsten or molybdenum. In this case, the first connecting conductor 30 may contain a glass material. This reduces the possibility of the first connecting conductor 30 melting when the insulating substrate 20 is made of ceramic and is manufactured by heating the ceramic. The first connecting conductor 30 may contain at least one of gold, silver, and copper. In this case, low resistance can be achieved because gold, silver, and copper have lower resistance values ​​than other metal materials. Furthermore, at least a portion of the first connecting conductor 30 may be plated.

[0014] A plurality of first connecting conductors 30 are provided on the upper surface 21, lined up along the four side surfaces 23 of the insulating substrate 20. In the example shown in FIG. 1 , only the first connecting conductors 30 formed lined up along one of the four side surfaces 23 of the insulating substrate 20 are shown, but a plurality of first connecting conductors 30 may be provided on each of the four side surfaces 23. In the example shown in FIG. 1 , four first connecting conductors 30 are provided on one side surface 23, but the number of first connecting conductors 30 provided on one side surface 23 is not limited to four, and it is sufficient that at least two first connecting conductors 30, namely, a first conductor 31 and a second conductor 32, which will be described later, are provided. As shown in FIGS. 1 and 2 , the first connecting conductors 30 may be electrically connected to any of the electrodes (not shown) of the electronic component 2 by bonding wires 3. The electronic component 2 may be electrically connected to the first connecting conductors 30 via solder or a conductive adhesive.

[0015] The second connecting conductor 40 may be provided on the lower surface 22 of the insulating substrate 20. The second connecting conductor 40 may be a terminal for electrically connecting to an electrode of an external device, or may be a terminal for electrically connecting to a metal substrate having a ground potential. The electrode of the external device may be, for example, a mounting electrode of a printed circuit board. The second connecting conductor 40 is conductive. The second connecting conductor 40 may or may not contain the same material as the first connecting conductor 30. The second connecting conductor 40 may contain, for example, a metal with a high melting point, such as tungsten or molybdenum. The second connecting conductor 40 may be part of an LGA (Land Grid Array) or a PGA (Pin Grid Array) on the lower surface 22 of the insulating substrate 20.

[0016] The via conductors 50 are located within the insulating substrate 20. Each of the multiple via conductors 50 electrically connects one of the first connecting conductors 30 to one of the second connecting conductors 40. In this embodiment, as shown in FIG. 2 , the via conductors 50 may extend vertically within the insulating substrate 20, with their upper ends connected to the first connecting conductors 30 and their lower ends electrically connected to the second connecting conductors 40. The via conductors 50 may have a circular cross-sectional shape in a plane perpendicular to the vertical direction. The via conductors 50 may or may not contain the same material as the first connecting conductors 30. The via conductors 50 may contain a metal with a high melting point, such as tungsten or molybdenum. This reduces the possibility of the via conductors 50 melting when the insulating substrate 20 is made of ceramic and is manufactured by heating the ceramic.

[0017] In the following description, the details of the wiring substrate 10 will be described using as an example the first connecting conductor 30 and the via conductor 50 in the vicinity of the side surface 23 located on the right side in Fig. 2 out of the four side surfaces 23 of the insulating substrate 20. In the following description, the side surface 23 located on the right side in Fig. 2 will be referred to as the first side surface 23A.

[0018] Fig. 3 is a plan view of the electronic module 1, in which region A shown in Fig. 1 is viewed from above. Fig. 4 is a plan view of a first conductor 31, a second conductor 32, a third conductor 33, and a fourth conductor 34, which will be described later, as viewed from the +Z axis direction. In Fig. 4, a first via conductor 51, a second via conductor 52, a third via conductor 53, and a fourth via conductor 54, which will be described later, are indicated by dotted lines. Fig. 5 is a cross-sectional view taken along line V-V in Fig. 3.

[0019] As shown in FIG. 3 , the wiring board 10 includes at least a first conductor 31 and a second conductor 32 as the first connection conductor 30 , and a first via conductor 51 and a second via conductor 52 as the via conductor 50 .

[0020] 4, the first conductor 31 includes a first linear portion 31A and a first land portion 31B. The first conductor 31 may have a rectangular shape with one side formed as an arc by the first linear portion 31A and the first land portion 31B.

[0021] The first linear portion 31A is a region that extends in the X-axis direction in the first conductor 31. In the following description, the X-axis direction will be referred to as the first direction. The first linear portion 31A may have a rectangular shape in a plan view.

[0022] The first land portion 31B is connected to an end 31D of the first linear portion 31A opposite to the first end 31C, which is the end of the first conductor 31 on the first side surface 23A side in the first direction. The first end 31C can also be considered to be the end of the first conductor 31 on the first side surface 23A side in the first direction. In one embodiment, the first end 31C may be in contact with the first side surface 23A. As shown in FIG. 4 , the first land portion 31B is connected to the upper end of the first via conductor 51 and is positioned to surround the first via conductor 51 in a planar perspective view. With this configuration, the first via conductor 51 is connected to the end of the first conductor 31 opposite the first end 31C in the first direction, and the first conductor 31 extends from the first via conductor 51 toward the first side surface 23A in the first direction. While the first end 31C is linear in FIG. 3 , in one embodiment, the first end 31C may be arc-shaped. In one embodiment, a second end 32C, a third end 33C, and a fourth end 34C, which will be described later, may also have an arc shape.

[0023] The first land portion 31B may have an arc-shaped outer shape at a portion other than the portion where it connects to the first linear portion 31A. In other words, the first land portion 31B may have an arc on its outer edge in a plan view. In the following description, the arc of the first land portion 31B will be referred to as a first arc 31E. The circumferential angle of the first arc 31E is not limited to 180° as shown in FIG. 4 , but may be in the range of 160° to 340°.

[0024] The second conductor 32 is positioned alongside the first conductor 31 in a second direction perpendicular to the first direction. In other words, the first conductor 31 and the second conductor 32 are positioned alongside each other in the second direction. On the upper surface 21, no other conductors exist between the first conductor 31 and the second conductor 32. The second direction can also be considered to be the Y-axis direction. As shown in FIG. 4 , the second conductor 32 includes a second linear portion 32A and a second land portion 32B. The second conductor 32 may have a rectangular shape with one side formed as an arc by the second linear portion 32A and the second land portion 32B.

[0025] The second linear portion 32A is a region of the second conductor 32 that extends in the first direction. The second linear portion 32A may be rectangular in plan view. As shown in FIG. 3 , the distance between the first conductor 31 and the first side surface 23A and the distance between the second conductor 32 and the first side surface 23A may be the same. The distance between the first conductor 31 and the first side surface 23A and the distance between the second conductor 32 and the first side surface 23A being the same means that they are substantially the same, and a deviation of 1 μm to 30 μm is allowed.

[0026] The second land portion 32B is connected to an end portion 32D of the second linear portion 32A opposite to the second end portion 32C, which is the end portion of the second conductor 32 on the first side surface 23A side in the first direction. The second end portion 32C can also be considered to be the end portion of the second conductor 32 on the first side surface 23A side in the first direction. The second land portion 32B is connected to the upper end of the second via conductor 52 and is positioned to surround the second via conductor 52 in a planar perspective view. With this configuration, the second via conductor 52 is connected to the end portion of the second conductor 32 opposite to the second end portion 32C in the first direction, and the second conductor 32 extends from the second via conductor 52 toward the first side surface 23A in the first direction.

[0027] The second land portion 32B may have an arc-shaped outer shape at a portion other than the portion where the second land portion 32B connects to the second linear portion 32A. In other words, the second land portion 32B may have an arc on its outer edge in a plan view. In the following description, the arc of the second land portion 32B will be referred to as a second arc 32E.

[0028] The upper end of the first via conductor 51 is connected to the first land portion 31B of the first conductor 31. In other words, the first via conductor 51 is connected to the end of the first conductor 31 opposite to the first end portion 31C. The distance between the first via conductor 51 and the first side surface 23A may be, for example, 0.45 mm or more and 2.00 mm or less. As shown in FIG. 5 , the lower end of the first via conductor 51 may be electrically connected to any one of the second connecting conductors 40. The width of the first linear portion 31A may be less than twice the length of the first via conductor 51 in the second direction.

[0029] The upper end of the second via conductor 52 is connected to the second land portion 32B of the second conductor 32. In other words, the second via conductor 52 is connected to the end of the second conductor 32 opposite the second end portion 32C. The distance between the second via conductor 52 and the first side surface 23A may be, for example, 0.40 mm or more and 1.95 mm or less. As shown in FIG. 6 , which will be described later, the lower end of the first via conductor 51 may be electrically connected to one of the second connecting conductors 40. In the second direction, the distance between the first via conductor 51 and the second via conductor 52 is greater than the distance between the first conductor 31 and the second conductor 32.

[0030] FIG. 6 is a side perspective view of the wiring board 10 from a first direction. For ease of explanation, FIG. 6 only illustrates the insulating substrate 20, the first conductor 31, the second conductor 32, the first via conductor 51, the second via conductor 52, and two second connection conductors 40 connected to the first via conductor 51 or the second via conductor 52. As shown in FIG. 6 , the first conductor 31 and the second conductor 32 are spaced apart from each other in the side view from the first direction. The first conductor 31 and the second conductor 32 do not need to be in contact with each other in the side view from the first direction, and may be spaced apart by, for example, 0.02 mm or more and 0.10 mm or less. As shown in FIG. 6 , the first via conductor 51 and the second via conductor 52 are spaced apart from each other in the side view from the first direction. The first via conductor 51 and the second via conductor 52 do not need to be in contact with each other in the side view from the first direction, and may be spaced apart by, for example, 0.05 mm or more and 0.15 mm or less. FIG. 7 is a side perspective view of the wiring board 10 viewed from the second direction. For ease of explanation, FIG. 7 only illustrates the insulating substrate 20, the first via conductor 51, and the second via conductor 52. As shown in FIG. 7 , the first via conductor 51 and the second via conductor 52 are spaced apart in the side perspective view from the second direction. The first via conductor 51 and the second via conductor 52 need not be in contact with each other in the side perspective view from the second direction. For example, the first via conductor 51 and the second via conductor 52 may be spaced apart by 0.05 mm or more and 0.15 mm or less. Because the first via conductor 51 and the second via conductor 52 are spaced apart in the side perspective view from both the first direction and the second direction, the distance between the first via conductor 51 and the second via conductor 52 can be increased in the wiring board 10. This reduces the possibility of cracks occurring in the insulating substrate 20. As a result, the possibility of a short circuit between the first via conductor 51 and the second via conductor 52 can be reduced. Furthermore, it is possible to reduce the possibility of crosstalk noise occurring when different signals are transmitted between the first conductor 31 and the second conductor 32. Furthermore, inside the insulating substrate 20, the distance between the internal wiring connected to the first via conductor 51 and the second via conductor 52 can be increased, thereby reducing the possibility of a short circuit between the internal wiring.Furthermore, when different signals are transmitted between the internal wirings connected to the first via conductor 51 and the second via conductor 52, respectively, the possibility of crosstalk noise occurring can be reduced.

[0031] In the wiring board 10 according to one aspect of the present disclosure, the diameter of the first arc 31E may be equal to the width of the first linear portion 31A, and the diameter of the second arc 32E may be equal to the width of the second linear portion 32A. The width of the first linear portion 31A refers to the width in the second direction. This configuration reduces the possibility of the first conductor 31 and the second conductor 32 coming into contact and causing a short circuit due to bleeding of the first conductor 31 and the second conductor 32 or misalignment during manufacturing when the wiring board 10 is miniaturized. Furthermore, the first via conductor 51 and the second via conductor 52 are spaced apart in a side perspective view from both the first and second directions, and the diameter of the first arc 31E is equal to the width of the first linear portion 31A. This reduces the possibility of the second via conductor 52 coming into contact with the conductor of the first land portion 31B and causing a short circuit, even if the conductor of the second via conductor 52 bleeds or is misaligned. The diameter of the arc means the diameter of a circle with which the arc partially coincides. The diameter of the first arc 31E and the width of the first straight portion 31A coincide with each other means that the diameter of the first arc 31E and the width of the first straight portion 31A substantially coincide with each other, and an error of, for example, ±0.05 mm is allowed.

[0032] In the wiring board 10 according to one aspect of the present disclosure, as shown in FIG. 3 , the first conductors 31 and the second conductors 32 may be located away from the first side surface 23A. This configuration reduces the possibility of damage to the first conductors 31 and the second conductors 32 when forming the dividing grooves by dicing, laser, or the like, when manufacturing the wiring board 10 by dividing a multi-piece substrate. Furthermore, this configuration reduces the possibility of the material forming the first conductors 31 and the second conductors 32 dripping onto the first side surface 23A when forming the first conductors 31 and the second conductors 32. Furthermore, this configuration reduces the possibility of the first conductors 31 and the second conductors 32 being connected by the conductive material and causing a short circuit, even if a conductive material adheres to the portion where the first side surface 23A and the top surface 21 intersect.

[0033] As shown in FIG. 3 , the wiring board 10 according to one aspect of the present disclosure may further include a third conductor 33 as the first connection conductor 30 and a third via conductor 53 as the via conductor 50 .

[0034] The third conductor 33 may be located away from the second conductor 32 in the second direction on the opposite side of the first conductor 31 with the second conductor 32 in between. As shown in Fig. 4, the third conductor 33 may include a third straight portion 33A and a third land portion 33B. The third conductor 33 may have a rectangular shape with one side formed as an arc by the third straight portion 33A and the third land portion 33B.

[0035] The third linear portion 33A is a region that extends in the first direction in the third conductor 33. The third linear portion 33A may have a rectangular shape in a plan view.

[0036] The third land portion 33B is connected to an end portion 33D of the third linear portion 33A opposite to the third end portion 33C, which is the end portion of the third conductor 33 on the first side surface 23A side in the first direction. The third end portion 33C can also be considered to be the end portion of the third conductor 33 on the first side surface 23A side in the first direction. The third land portion 33B is connected to the upper end of the third via conductor 53 and is positioned to surround the third via conductor 53 in a planar perspective view. With this configuration, the third via conductor 53 is connected to the end portion of the third conductor 33 opposite to the third end portion 33C in the first direction, and the third conductor 33 extends from the third via conductor 53 toward the first side surface 23A in the first direction.

[0037] The third land portion 33B may have an arc-shaped outer shape at a portion other than the portion where it connects to the third linear portion 33A. In other words, the third land portion 33B may have an arc on its outer edge in a plan view. In the following description, the arc of the third land portion 33B will be referred to as a third arc 33E.

[0038] The upper end of the third via conductor 53 is connected to the third land portion 33B of the third conductor 33. In other words, the third via conductor 53 is connected to the end of the third conductor 33 opposite the third end portion 33C. The lower end of the third via conductor 53 may be electrically connected to one of the second connecting conductors 40. The third via conductor 53 may be located farther from the first side surface 23A in the first direction than the second via conductor 52. With this configuration, the first via conductors 51, the second via conductors 52, and the third via conductors 53 can be alternately formed in the first direction, thereby reducing the distance between the third via conductors 53 and the first via conductors 51 in the second direction and allowing the first connecting conductors 30 to be arranged more densely. Furthermore, the above configuration reduces the possibility of cracks occurring in the insulating substrate 20 between the second via conductors 52 and the third via conductors 53. In a side perspective view from the second direction, the third via conductor 53 may overlap at least a portion of the first via conductor 51. The distance between the third via conductor 53 and the first side surface 23A may be the same as the distance between the first via conductor 51 and the first side surface 23A. In a side perspective view from the first direction and a side perspective view from the second direction, the third via conductor 53 and the second via conductor 52 may be positioned apart from each other.

[0039] In the wiring board 10 according to one aspect of the present disclosure, the diameter of the third arc 33E may be the same as the width of the third linear portion 33A. This configuration reduces the possibility of the second conductor 32 and the third conductor 33 coming into contact and causing a short circuit due to bleeding of the second conductor 32 and the third conductor 33 or misalignment during manufacturing when the wiring board 10 is miniaturized. Furthermore, even if the conductor of the third via conductor 53 bleeds or is misaligned, the possibility of the third via conductor 53 coming into contact with the conductor of the second land portion 32B and causing a short circuit can be reduced.

[0040] In the wiring board 10 according to one aspect of the present disclosure, the distance between the first conductor 31 and the second conductor 32 in the second direction may be the same as the distance between the second conductor 32 and the third conductor 33 .

[0041] As shown in FIG. 3 , the wiring board 10 according to one aspect of the present disclosure may further include a fourth conductor 34 as the first connection conductor 30 and a fourth via conductor 54 as the via conductor 50 .

[0042] The fourth conductor 34 may be located away from the first conductor 31 in the second direction on the opposite side of the second conductor 32 with the first conductor 31 in between. The fourth conductor 34 may include a fourth straight portion 34A and a fourth land portion 34B, as shown in Fig. 4. The fourth conductor 34 may have a rectangular shape with one side formed as an arc by the fourth straight portion 34A and the fourth land portion 34B.

[0043] The fourth linear portion 34A is a region that extends in the first direction in the fourth conductor 34. The fourth linear portion 34A may have a rectangular shape in a plan view.

[0044] The fourth land portion 34B is connected to an end portion 34D of the fourth linear portion 34A opposite to the fourth end portion 34C, which is the end portion on the first side surface 23A side in the first direction. The fourth end portion 34C can also be considered to be the end portion of the fourth conductor 34 on the first side surface 23A side in the first direction. The fourth land portion 34B is connected to the upper end of the fourth via conductor 54 and is positioned to surround the fourth via conductor 54 in a planar perspective view. With this configuration, the fourth via conductor 54 is connected to the end portion of the fourth conductor 34 opposite to the fourth end portion 34C in the first direction, and the fourth conductor 34 extends from the fourth via conductor 54 toward the first side surface 23A in the first direction.

[0045] The fourth land portion 34B may have an arc-shaped outer shape at a portion other than the portion where it connects to the fourth linear portion 34A. In other words, the fourth land portion 34B may have an arc on its outer edge in a plan view. In the following description, the arc of the fourth land portion 34B will be referred to as a fourth arc 34E.

[0046] The upper end of the fourth via conductor 54 is connected to the fourth land portion 34B of the fourth conductor 34. In other words, the fourth via conductor 54 is connected to the end of the fourth conductor 34 opposite the fourth end portion 34C. The lower end of the fourth via conductor 54 may be electrically connected to one of the second connecting conductors 40. The fourth via conductor 54 may be located closer to the first side surface 23A in the first direction than the first via conductor 51. With this configuration, the closer the fourth via conductor 54 is to the first side surface 23A, the shorter the length of the fourth linear portion 34A of the fourth conductor 34 in the first direction can be, thereby reducing the electrical resistance of the fourth conductor 34. Furthermore, the area of ​​the conductor located on the upper surface 21 can be reduced, thereby reducing the possibility of the conductor being damaged when it comes into contact with another component. Furthermore, the possibility of detecting unnecessary electromagnetic noise in the conductor can be reduced. In a side perspective view from the second direction, the fourth via conductor 54 may overlap at least a portion of the second via conductor 52. Furthermore, the distance between the fourth via conductor 54 and the first side surface 23A may be the same as the distance between the second via conductor 52 and the first side surface 23A. Moreover, the fourth via conductor 54 and the first via conductor 51 may be positioned apart from each other in a side perspective from the first direction and a side perspective from the second direction.

[0047] In the wiring board 10 according to an aspect of the present disclosure, the diameter of the fourth arc 34E may be the same as the width of the fourth linear portion 34A. With this configuration, when the wiring board 10 is miniaturized, it is possible to reduce the possibility that the first conductor 31 and the fourth conductor 34 will come into contact with each other, causing a short circuit, due to bleeding between the first conductor 31 and the fourth conductor 34.

[0048] As shown in FIGS. 3 and 5 , the wiring board 10 according to an embodiment of the present disclosure may further include a conductive ground conductor 60. The ground conductor 60 may be formed on the upper surface 21 of the insulating substrate 20. FIG. 8 is a plan view of the wiring board 10 viewed from above. A first insulating layer 61 and a second insulating layer 62, which will be described later, are not shown in FIG. 8 . As shown in FIG. 8 , the ground conductor 60 surrounds at least a portion of the first conductor 31 and the second conductor 32 in a plan view and is spaced apart from the first conductor 31 and the second conductor 32. The inclusion of the ground conductor 60 strengthens the ground potential of the wiring board 10. As a result, the high-frequency characteristics of the wiring board 10 can be improved. The distance between the ground conductor 60 and the first land portion 31B may include a portion that is the same distance as the distance between the ground conductor 60 and the second land portion 32B. This configuration can bring the impedance of the first conductor 31 and the impedance of the second conductor 32 closer together. Therefore, by adjusting the distance between the ground conductor 60 and the first land portion 31B and the distance between the ground conductor 60 and the second land portion 32B, signals of the same frequency band can be transmitted through the first conductor 31 and the second conductor 32. This allows the amount of signal transmitted through the first conductor 31 and the second conductor 32 to be increased.

[0049] As shown in FIGS. 3 and 5 , the wiring board 10 according to one embodiment of the present disclosure may further include a first insulating layer 61 covering the first end 31C of the first conductor 31 and the second end 32C of the second conductor 32. The first insulating layer 61 is made of an insulating material. Examples of insulating materials that can be used include the aforementioned ceramic materials, organic resin materials, and glass materials. The first insulating layer 61 may contain the same material as the insulating substrate 20. In this case, the first insulating layer 61 and the insulating substrate 20 may be integrated, and the interface between the first insulating layer 61 and the insulating substrate 20 may not be visible. The first insulating layer 61 may be provided on the upper surface 21 of the insulating substrate 20 along the outer periphery of the insulating substrate 20. The first insulating layer 61 may be provided in contact with the first side surface 23A in a plan view, or may be provided away from the first side surface 23A in a plan view. The first insulating layer 61 covering the first end 31C of the first conductor 31 and the second end 32C of the second conductor 32 reduces the exposed area of ​​the first conductor 31 and the second conductor 32. This reduces the possibility of the first conductor 31 and the second conductor 32 electrically connecting and shorting when plating the first conductor 31 and the second conductor 32 to form a plating layer 63 (described later) or when the first conductor 31 and the second conductor 32 come into contact with another conductive member. Furthermore, because the first conductor 31 and the second conductor 32 are covered with the first insulating layer 61, the possibility of the first conductor 31 and the second conductor 32 peeling off from the insulating substrate 20 when bonding the first conductor 31 and the second conductor 32 to the electrodes of the electronic component 2 is reduced. Furthermore, the first insulating layer 61 prevents the conductive adhesive from spreading beyond a predetermined area when bonding the first conductor 31 and the second conductor 32 to the electrodes of the electronic component 2.

[0050] As shown in FIGS. 3 and 5 , the wiring board 10 according to one embodiment of the present disclosure may further include a second insulating layer 62 that overlaps at least the first via conductor 51 and the second via conductor 52 in a planar perspective and is spaced apart from the first side surface 23A. The thickness of the second insulating layer 62, i.e., the length of the second insulating layer 62 in a direction perpendicular to the top surface 21, may be the same as or thicker than the thickness of the first insulating layer 61. The second insulating layer 62 is made of an insulating material. Examples of insulating materials that can be used include ceramics such as aluminum oxide (alumina), silicon oxide, and aluminum nitride. The second insulating layer 62 may be made of the same material as the first insulating layer 61. Here, stress tends to concentrate in areas where vias are formed in the insulating substrate, potentially reducing the strength of the insulating substrate. However, the inclusion of the second insulating layer 62 can improve the strength of the insulating substrate 20. Furthermore, when bonding the first conductor 31 and the second conductor 32 to the electrodes of the electronic component 2, it is possible to reduce the possibility that the first conductor 31 and the second conductor 32 will peel off from the insulating substrate 20. The second insulating layer 62 may cover the ground conductor 60.

[0051] By forming the plating layer 63 after forming the second insulating layer 62, the plating layer 63 can be formed on the conductor exposed from the second insulating layer 62. This reduces the exposed area of ​​the conductor not required for connection to the electronic component 2, reducing the possibility of the conductor being damaged by contact with other members, resulting in an increase in resistance, and reducing the possibility of detecting unnecessary electromagnetic noise. Furthermore, in the above configuration, if the plating layer 63 has a glossy finish, such as gold, it can be easily recognized by image detection or visual inspection when placing a bonding wire or conductive adhesive on the plating layer 63.

[0052] When the wiring board 10 includes the first insulating layer 61 and the second insulating layer 62, the region between the first insulating layer 61 and the second insulating layer 62 serves as a connection region where the electrodes of the electronic component 2 are electrically connected to the first conductor 31 and the second conductor 32 via bonding wire 3, solder, a conductive adhesive, or the like. In the wiring board 10 according to one aspect of the present disclosure, a plating layer 63 may be formed on the upper surface of the first conductor 31 in the connection region. The plating layer 63 may be located at a position that does not overlap the first via conductor 51 and the second via conductor 52 in a planar perspective view from the thickness direction. The thickness of the plating layer 63 may be smaller than the thicknesses of the first insulating layer 61 and the second insulating layer 62.

[0053] The plating layer 63 may be composed of a first plating layer 63A located on the first conductor 31 side and a second plating layer 63B covering the first plating layer 63A. The first plating layer 63A may contain, for example, tungsten, molybdenum, or nickel as a primary component. The second plating layer 63B may contain, for example, at least one of gold, silver, and copper as a primary component. For example, if the second plating layer 63B contains gold as a primary component, the second plating layer 63B has a glossy finish. This allows for easier alignment of the electronic component 2 on the wiring board 10 using the glossy second plating layer 63B as a reference when mounting the electronic component 2 on the wiring board 10. The plating layer 63 may be formed on the second conductor 32, the third conductor 33, and the fourth conductor 34 in the same manner as the first conductor 31. Here, the phrase "the second plating layer 63B contains gold as a primary component" means that the second plating layer 63B is essentially composed of gold. For example, the second plating layer 63B may contain a non-metallic material that is unavoidable during manufacturing.

[0054] FIG. 9 is a cross-sectional view of a wiring board 10 according to an embodiment of the present disclosure. FIG. 9 is a cross-sectional view corresponding to FIG. 5 . As shown in FIG. 9 , the wiring board 10 according to an embodiment of the present disclosure may include an exposed portion 31F exposed from the second insulating layer 62 in a portion of the region where the first conductor 31 overlaps with the first via conductor 51 in a planar perspective view from the Z-axis direction, and may include a metal layer 64 located on the exposed portion 31F. This configuration allows heat generated by the first conductor 31 and the first via conductor 51 to be dissipated via the metal layer 64. The metal layer 64 may be made of a thermally conductive material and may include, for example, gold. The second insulating layer 62 may have an exposed portion exposed from the second insulating layer 62 in a portion of the region where the second via conductor 52 overlaps with the second via conductor 52 in a planar perspective view, and may include a metal layer 64 located on the exposed portion. This allows heat generated by the second conductor 32 and the second via conductor 52 to be dissipated via the metal layer 64. The metal layer 64 may be made of the same material as the plating layer 63, and may have the same layer structure as the plating layer 63. In this case, the metal layer 64 can be formed simultaneously with the plating layer 63, which makes it easier to manufacture the wiring board 10.

[0055] [Embodiment 2] Another embodiment of the present disclosure will be described below. For convenience of explanation, the same reference numerals will be used to designate components having the same functions as those described in the above embodiment, and the description thereof will not be repeated.

[0056] Fig. 10 is a perspective view showing the configuration of an electronic module 1A according to this embodiment. Fig. 11 is a plan view of the electronic module 1A, in which region B shown in Fig. 10 is viewed from above. As shown in Figs. 10 and 11 , the electronic module 1A includes a wiring board 10A instead of the wiring board 10 according to the first embodiment. The wiring board 10A includes a third insulating layer 65 in addition to the configuration of the wiring board 10 according to the first embodiment.

[0057] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 11 . As shown in FIGS. 10 and 12 , the third insulating layer 65 is located on the second insulating layer 62. The third insulating layer 65 overlaps at least the first via conductors 51 in a planar perspective view. The third insulating layer 65 is made of an insulating material. Examples of insulating materials that can be used include the aforementioned ceramic materials, organic resin materials, and glass materials. The third insulating layer 65 may be made of the same material as the first insulating layer 61. The third insulating layer 65 may be made of the same material as the second insulating layer 62. In the electronic module 1A, the electronic component 2 is mounted on the third insulating layer 65. In the wiring board 10A of this embodiment, the inclusion of the third insulating layer 65 reduces warping of the wiring board 10A when the electronic component 2 is mounted on the wiring board 10A.

[0058] In the wiring board 10A of the present embodiment, the third insulating layer 65 overlaps the first via conductor 51 but does not overlap the second via conductor 52 in a planar perspective view, but is not limited to this. In one aspect of the wiring board 10A of the present embodiment, the third insulating layer 65 may overlap the first via conductor 51 and the second via conductor 52 in a planar perspective view.

[0059] When the second insulating layer 62 and the third insulating layer 65 are made of the same material, the second insulating layer 62 and the third insulating layer 65 can also be considered to be a single insulating layer. In this case, the single insulating layer has a first region where the second insulating layer 62 and the third insulating layer 65 do not overlap, and a second region where the second insulating layer 62 and the third insulating layer 65 overlap and is thicker than the first region, and the second region can also be considered to be farther from the first side surface 23A than the first region.

[0060] [Embodiment 3] Another embodiment of the present disclosure will be described below. Fig. 13 is a diagram showing the configuration of a wiring board 10B in this embodiment, and corresponds to Fig. 8 in embodiment 1. Fig. 14 is a plan view of a first conductor 31, a second conductor 35, a third conductor 36, and a fourth conductor 37, which will be described later, as viewed from the +Z axis direction.

[0061] As shown in Fig. 14, the wiring board 10B includes a second conductor 35 instead of the second conductor 32 in the first embodiment. The second conductor 35 is positioned alongside the first conductor 31 in a second direction perpendicular to the first direction. In other words, the first conductor 31 and the second conductor 35 are positioned alongside in the second direction. As shown in Fig. 14, the second conductor 35 includes a second linear portion 35A and a second land portion 35B.

[0062] The second linear portion 35A is a region that extends in the first direction in the second conductor 35. The second linear portion 35A may have a rectangular shape in a plan view.

[0063] The second land portion 35B is connected to an end portion 35D of the second linear portion 35A opposite to the second end portion 35C, which is the end portion on the first side surface 23A side in the first direction. The second end portion 35C can also be considered the end portion on the first side surface 23A side of the ends of the second conductor 35 in the first direction of the second land portion 35B. The second land portion 35B is connected to the upper end of the second via conductor 52 and is positioned to surround the second via conductor 52 in a planar perspective view. With this configuration, the second via conductor 52 is connected to the end portion of the second conductor 35 in the first direction opposite to the second end portion 35C on the first side surface 23A side.

[0064] The second land portion 35B may have an arc-shaped outer shape at a portion other than the portion where the second land portion 35B is connected to the second linear portion 35A. In other words, the second land portion 35B may have a second arc 35E on its outer edge in a plan view.

[0065] In plan view, the second land portion 35B is bent in a direction away from the first conductor 31 with respect to the first direction in which the second linear portion 35A extends. In other words, the second land portion 35B is formed such that, in plan view, the distance from the center of the first via conductor 51 to the center of the second via conductor 52 in the second direction is greater than the distance from the center of the first via conductor 51 to the center of the width direction of the second linear portion 35A. With this configuration, in plan view, the center of the second via conductor 52 is located on the opposite side of the first via conductor 51 from the center of the width direction of the second linear portion 35A. This allows the distance between the first via conductor 51 and the second via conductor 52 to be greater than in the wiring board 10 of the first embodiment. As a result, the possibility of cracks occurring in the insulating substrate 20 can be reduced, and the distance between the first conductor 31 and the second conductor 35 can be shortened. The angle formed between the second land portion 35B and the first direction in which the second linear portion 35A extends may be in the range of 2° to 90°, for example.

[0066] 13, a wiring board 10B according to one aspect of the present embodiment may further include a third conductor 36 instead of the third conductor 33 in the first embodiment. The third conductor 36 may be located away from the second conductor 35 on the opposite side of the second conductor 35 from the first conductor 31 in the second direction. As shown in FIG. 14, the third conductor 36 includes a third linear portion 36A and a third land portion 36B.

[0067] The third linear portion 36A is a region that extends in the first direction in the third conductor 36. The third linear portion 36A may have a rectangular shape in a plan view.

[0068] The third land portion 36B is connected to an end portion 36D of the third linear portion 36A opposite to the third end portion 36C, which is the end portion on the first side surface 23A side in the first direction. The third end portion 36C can also be considered to be the end portion on the first side surface 23A side of the ends of the third conductor 36 in the first direction of the third land portion 36B. The third land portion 36B is connected to the upper end of the third via conductor 53 and is positioned to surround the third via conductor 53 in a planar perspective view. With this configuration, the third via conductor 53 is connected to the end portion of the third conductor 36 in the first direction opposite to the third end portion 36C on the first side surface 23A side.

[0069] The third land portion 36B may have an arc-shaped outer shape at a portion other than the portion where the third land portion 36B is connected to the third linear portion 36A. In other words, the third land portion 36B may have a third arc 36E on its outer edge in a plan view.

[0070] In plan view, the third land portion 36B bends in a direction away from the second conductor 35 with respect to the first direction in which the third linear portion 36A extends. In other words, the third land portion 36B is formed such that, in the second direction, the distance from the center of the second via conductor 52 to the center of the third via conductor 53 is greater than the distance from the center of the second via conductor 52 to the center of the width direction of the third linear portion 36A. With this configuration, in the second direction, the center of the third via conductor 53 is located on the opposite side of the second via conductor 52 from the center of the width direction of the third linear portion 36A. This increases the distance between the second via conductor 52 and the third via conductor 53. As a result, the possibility of cracks occurring in the insulating substrate 20 can be reduced, and the distance between the second conductor 35 and the third conductor 36 can be reduced.

[0071] As shown in FIG. 13 , the third via conductor 53 may be located closer to the first side surface 23A in the first direction than the second via conductor 52. With this configuration, the closer the third via conductor 53 is to the first side surface 23A, the shorter the length of the third linear portion 36A of the third conductor 33 in the first direction can be, thereby reducing the electrical resistance of the third conductor 33. Furthermore, the area of ​​the conductor located on the upper surface 21 can be reduced, thereby reducing the possibility of the conductor being damaged when it comes into contact with another component. Furthermore, the possibility of detecting unnecessary electromagnetic noise in the conductor can be reduced. In a side perspective view from the second direction, the third via conductor 53 may overlap at least a portion of the first via conductor 51. Furthermore, in a side perspective view from the first direction and a side perspective view from the second direction, the third via conductor 53 and the second via conductor 52 may be located apart from each other.

[0072] 15 is a perspective side view of the wiring board 10B from a first direction. As shown in FIG. 15 , the second conductor 35 and the third conductor 36 are spaced apart from each other in the side view from the first direction. In other words, the second land portion 35B of the second conductor 35 and the third linear portion 36A of the third conductor 36 are spaced apart from each other in the side view from the first direction. This increases the distance between the second via conductor 52 and the third via conductor 53, thereby reducing the possibility of a short circuit between the second conductor 35 and the third conductor 36. Furthermore, when inspecting the manufactured wiring board 10B for quality or non-quality by image recognition, the second conductor 35 and the third conductor 36 are easily distinguishable from each other, improving inspection accuracy.

[0073] 13, a wiring board 10B according to one aspect of the present embodiment may further include a fourth conductor 37 instead of the fourth conductor 34 in the first embodiment. The fourth conductor 37 may be located away from the first conductor 31 on the opposite side of the first conductor 31 from the second conductor 35 in the second direction. As shown in FIG. 14, the fourth conductor 37 includes a fourth linear portion 37A and a fourth land portion 37B.

[0074] The fourth linear portion 37A is a region that extends in the first direction in the fourth conductor 37. The fourth linear portion 37A may have a rectangular shape in a plan view.

[0075] The fourth land portion 37B is connected to an end portion 37D of the fourth linear portion 37A opposite to a fourth end portion 37C, which is the end portion on the first side surface 23A side in the first direction. The fourth end portion 37C can also be considered to be the end portion on the first side surface 23A side of the ends of the fourth conductor 37 in the first direction of the fourth land portion 37B. The fourth land portion 37B is connected to the upper end of the fourth via conductor 54 and is positioned to surround the fourth via conductor 54 in a planar perspective view. With this configuration, the fourth via conductor 54 is connected to the end portion of the fourth conductor 37 in the first direction opposite to the fourth end portion 37C on the first side surface 23A side.

[0076] The fourth land portion 37B may have an arc-shaped outer shape at a portion other than the portion where the fourth land portion 37B is connected to the fourth linear portion 37A. In other words, the fourth land portion 37B may have a fourth arc 37E on its outer edge in a plan view.

[0077] In plan view, the fourth land portion 37B bends in a direction away from the first conductor 31 with respect to the first direction in which the fourth linear portion 37A extends. In other words, the fourth land portion 37B is formed such that, in plan view, the distance from the center of the first via conductor 51 to the center of the fourth via conductor 54 in the second direction is greater than the distance from the center of the first via conductor 51 to the center of the width direction of the fourth linear portion 37A. With this configuration, in plan view, the center of the fourth via conductor 54 is located on the opposite side of the first via conductor 51 from the center of the width direction of the fourth linear portion 37A. This increases the distance between the first via conductor 51 and the fourth via conductor 54. As a result, the possibility of cracks occurring in the insulating substrate 20 can be reduced, and the distance between the first conductor 31 and the fourth conductor 37 can be reduced.

[0078] [Embodiment 4] Another embodiment of the present disclosure will be described below. Fig. 16 is a side view of a wiring board 10C according to this embodiment. For ease of explanation, Fig. 16 illustrates only an insulating board 20A (described later) and a first connecting conductor 30.

[0079] As shown in FIG. 16 , the wiring board 10C includes an insulating board 20A instead of the insulating board 20 in the first embodiment. The insulating board 20A has a thickness that decreases in the vicinity of the side surface 23 as it approaches the side surface 23. More specifically, the upper surface 21 slopes downward toward the lower surface 22 as it approaches the side surface 23. This reduces the possibility of damage, such as chipping, at the corner where the first side surface 23A and the upper surface 21 of the insulating board 20A connect if the insulating board 20A comes into contact with another member when the wiring board 10C is moved. Furthermore, this reduces the possibility of damage to each member of the electronic component 2 if the wiring board 10C and the electronic component 2 collide when the electronic component 2 is mounted on the wiring board 10C.

[0080] In the wiring substrate 10C, the first connecting conductor 30 may be inclined in accordance with the inclination of the upper surface 21 of the insulating substrate 20A. In the example shown in Fig. 16, the thickness of the insulating substrate 20A is thinner near one side surface 23, but the thickness of the insulating substrate 20A may also be thinner near the other side surface 23 as it approaches the side surface 23.

[0081] In the wiring board according to one embodiment of the present disclosure, the insulating substrate may be formed by stacking multiple insulating layers in the thickness direction. In this case, the inclination of the insulating substrate may be reduced by coating an insulating layer between the insulating layers near the side surface 23. When the insulating substrate is formed by stacking multiple insulating layers in the thickness direction, a conductor (land portion) may be provided between the insulating layers. In this case, a via conductor connecting any one of the first connecting conductors 30 and any one of the second connecting conductors 40 may be provided in each insulating layer. In this case, the via conductors located in each insulating layer may be located at different positions from each other in a planar perspective view from above, and a wiring conductor connecting the via conductors may be provided between the insulating layers.

[0082] Fifth Embodiment Another embodiment of the present disclosure will be described below. Fig. 17 is a perspective view of a wiring board 10D according to this embodiment. Fig. 18 is a top view of the wiring board 10D. Fig. 19 is a cross-sectional view taken along line XIX-XIX in Fig. 18. Fig. 19 shows the wiring board 10D on which an electronic component 2 is mounted. The electronic component 2 may be directly mounted on a bottom surface 74 (described below), or may be indirectly mounted via a base member such as a heat dissipation member.

[0083] 17 to 19, the wiring board 10D has an insulating substrate 20B instead of the insulating substrate 20A in embodiment 1. The insulating substrate 20B has a base 70 and a frame 79 that surrounds the periphery of the base 70.

[0084] The base 70 has a rectangular parallelepiped shape and has an upper surface 71 and a lower surface 72. A recess 73 recessed in the thickness direction is formed in the center of the upper surface 71. The recess 73 has a bottom surface 74 on which the electronic component 2 is located and an inner side surface 75 of the recess 73.

[0085] 17 and 18 , the first conductor 31, the second conductor 32, the third conductor 33, and the fourth conductor 34 described in the first embodiment are formed on the upper surface 71 of the base 70. The first conductor 31, the second conductor 32, the third conductor 33, and the fourth conductor 34 are arranged along the inner surface 75 in the order of the fourth conductor 34, the first conductor 31, the second conductor 32, and the third conductor 33. In the following description, the inner surface 75 located on the upper side in FIG. 18 will be described as the first side surface 75A.

[0086] 19 , a first via conductor 51 is located inside the base 70, and the upper end of the first via conductor 51 is connected to the first conductor 31. The lower end of the first via conductor 51 may be electrically connected to a second connecting conductor 40 formed on the lower surface 72. Although not shown, a second via conductor 52, a third via conductor 53, and a fourth via conductor 54 are located inside the base 70, and are connected to the second conductor 32, the third conductor 33, and the fourth conductor 34, respectively. A second connecting conductor 40 is provided on the lower surface 72 of the base 70, and is electrically connected to the second via conductor 52, the third via conductor 53, and the fourth via conductor 54, respectively.

[0087] In the wiring board 10D of this embodiment, the first conductor 31 extends from the first via conductor 51 toward the first side surface 75A in a first direction from the first via conductor 51 toward the first side surface 75A. The second conductor 32 extends from the second via conductor 52 toward the first side surface 75A in the first direction. The third conductor 33 extends from the third via conductor 53 toward the first side surface 75A in the first direction. The fourth conductor 34 extends from the fourth via conductor 54 toward the first side surface 75A in the first direction.

[0088] In the wiring board 10D, when viewed from a first direction from the first via conductor 51 toward the first side surface 75A, the first conductor 31 and the second conductor 32 are spaced apart. When viewed from a side perspective from the first direction, the first via conductor 51 and the second via conductor 52 are spaced apart. When viewed from a side perspective from a second direction perpendicular to the first direction, the first via conductor 51 and the second via conductor 52 are spaced apart. With the above configuration, the wiring board 10D can increase the distance between the first via conductor 51 and the second via conductor 52. This reduces the possibility of cracks occurring in the insulating substrate 20. As a result, the possibility of a short circuit between the first via conductor 51 and the second via conductor 52 can be reduced. Furthermore, when different signals are transmitted through the first conductor 31 and the second conductor 32, the possibility of crosstalk noise occurring can be reduced.

[0089] Sixth Embodiment Another embodiment of the present disclosure will be described below. Fig. 20 is a perspective view of a wiring board 10E in this embodiment. Fig. 21 is a top view of the wiring board 10E. Fig. 22 is a cross-sectional view taken along line XXII-XXII shown in Fig. 21. Fig. 22 shows a wiring board 10D on which an electronic component 2 is mounted.

[0090] 17 to 19, wiring board 10D has insulating substrate 20C instead of insulating substrate 20 in embodiment 1. Insulating substrate 20C has a rectangular parallelepiped shape and has an upper surface 81 and a lower surface 82. A recess 83 recessed in the thickness direction is formed in the center of upper surface 81. Recess 83 has a through portion 84 and a mounting surface 85.

[0091] The through portion 84 penetrates the insulating substrate 20C in the thickness direction. The mounting surface 85 is provided around the through portion 84, between the upper surface 81 and the lower surface 82 in the thickness direction. The through portion 84 is formed by an inner surface 86 of the insulating substrate 20C.

[0092] The first conductor 31, the second conductor 32, the third conductor 33, and the fourth conductor 34 described in the first embodiment are formed on the mounting surface 85. The first conductor 31, the second conductor 32, the third conductor 33, and the fourth conductor 34 are arranged along the inner side surface 86 in the order of the fourth conductor 34, the first conductor 31, the second conductor 32, and the third conductor 33. In the following description, the inner side surface 86 located on the upper side in FIG. 21 will be described as a first side surface 86A.

[0093] 22 , a first via conductor 51 is located inside insulating substrate 20C, and the upper end of first via conductor 51 is connected to first conductor 31. The lower end of first via conductor 51 may be electrically connected to second connecting conductor 40 formed on lower surface 82. Although not shown, second via conductors 52, third via conductors 53, and fourth via conductors 54 are located inside insulating substrate 20C, and are connected to second conductor 32, third conductor 33, and fourth conductor 34, respectively. Second connecting conductors 40 are provided on lower surface 82 of insulating substrate 20C, and are electrically connected to second via conductor 52, third via conductor 53, and fourth via conductor 54, respectively.

[0094] In the wiring board 10E of this embodiment, the first conductor 31 extends from the first via conductor 51 toward the first side surface 86A in a first direction from the first via conductor 51 toward the first side surface 86A. The second conductor 32 extends from the second via conductor 52 toward the first side surface 86A in the first direction. The third conductor 33 extends from the third via conductor 53 toward the first side surface 86A in the first direction. The fourth conductor 34 extends from the fourth via conductor 54 toward the first side surface 86A in the first direction.

[0095] In the wiring board 10E, when viewed from a first direction from the first via conductor 51 toward the first side surface 86A, the first conductor 31 and the second conductor 32 are spaced apart. When viewed from a side perspective from the first direction, the first via conductor 51 and the second via conductor 52 are spaced apart. When viewed from a side perspective from a second direction perpendicular to the first direction, the first via conductor 51 and the second via conductor 52 are spaced apart. With the above configuration, the wiring board 10E can increase the distance between the first via conductor 51 and the second via conductor 52. This reduces the possibility of cracks occurring in the insulating substrate 20. As a result, the possibility of a short circuit between the first via conductor 51 and the second via conductor 52 can be reduced. Furthermore, when different signals are transmitted through the first conductor 31 and the second conductor 32, the possibility of crosstalk noise occurring can be reduced.

[0096] Seventh Embodiment Another embodiment of the present disclosure will be described below. Fig. 23 is a perspective view of a wiring substrate 10F according to this embodiment, seen through the first side surface 23A and its vicinity. As shown in Fig. 23, the wiring substrate 10F includes an insulating substrate 20D instead of the insulating substrate 20 in the first embodiment.

[0097] The insulating substrate 20D is configured by laminating a first layer 91 and a second layer 92 in the thickness direction. In the wiring substrate 10D, the first conductor 31, the second conductor 32, the third conductor 33, and the fourth conductor 34 are formed on an upper surface 91A of the first layer 91.

[0098] The wiring board 10F includes a plurality of internal conductors between a first layer 91 and a second layer 92. In the example shown in Fig. 23, the internal conductors include a first internal conductor 93, a second internal conductor 94, and a third internal conductor 95. The first internal conductor 93, the second internal conductor 94, and the third internal conductor 95 are positioned side by side in the second direction.

[0099] The first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 are exposed from the first side surface 23A. The first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 are thermally connected to any one of the first connecting conductors 30. Therefore, the first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 can function as heat dissipation members for the first connecting conductor 30.

[0100] In the following description, the first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 are respectively connected to the first conductor 31, the second conductor 32, and the third conductor 33, but this is not necessarily limited to this. The distance between the first inner conductor 93 and the second inner conductor 94 in the second direction may be greater than the distance between the first conductor 31 and the second conductor 32 in the second direction. This allows the first conductor 31 and the second conductor 32 to be closer to each other in the second direction, enabling fine wiring and reducing the possibility of heat remaining inside the insulating substrate 20D.

[0101] The first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 may be electrically connected to any one of the first connecting conductors 30. This allows the first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 to be used as wiring for electrolytic plating.

[0102] 23 , the first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 are exposed from the first side surface 23A, but the wiring board 10F of this embodiment is not limited to this configuration. In one aspect of the wiring board 10F of this embodiment, the first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 may be exposed from a side surface 23 other than the first side surface 23A. For example, the first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 may be exposed from a side surface 23 that intersects with the first side surface 23A, or from a side surface 23 that faces the first side surface 23A.

[0103] In one aspect of the wiring board 10F of the present embodiment, the insulating substrate 20D may have a layer other than the first layer 91 and the second layer 92. For example, the insulating substrate 20D may have a third layer below the second layer 92. In this case, the first inner conductor 93, the second inner conductor 94, and the third inner conductor 95 may be formed between the second layer 92 and the third layer.

[0104] The invention according to the present disclosure has been described above based on the drawings and examples. However, the invention according to the present disclosure is not limited to the above-described embodiments. In other words, the invention according to the present disclosure can be modified in various ways within the scope of the present disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the invention according to the present disclosure. In other words, it should be noted that a person skilled in the art can easily make various modifications or corrections based on the present disclosure. It should also be noted that these modifications or corrections are included in the scope of the present disclosure.

[0105] [Summary] A wiring board according to a first aspect of the present disclosure includes an insulating substrate having a first side surface, a first via conductor and a second via conductor located within the insulating substrate, a first conductor extending from the first via conductor toward the first side surface in a first direction from the first via conductor toward the first side surface on the insulating substrate, and a second conductor extending from the second via conductor toward the first side surface in the first direction on the insulating substrate, wherein the first via conductor is connected to an end of the first conductor in the first direction that is opposite to a first end on the first side surface side, and the second via conductor is , is connected to an end of the second conductor in the first direction opposite to the second end on the first side surface side, the first conductor and the second conductor are positioned side by side in a second direction perpendicular to the first direction, the first via conductor is positioned farther from the first side surface in the first direction than the second via conductor, when viewed from the side in the first direction, the first conductor and the second conductor are positioned apart, and when viewed from the side in a perspective view from the first direction and from the side in a perspective view from the second direction, the first via conductor and the second via conductor are positioned apart.

[0106] A wiring board according to aspect 2 of the present disclosure is the same as aspect 1 above, wherein the first conductor has a first land portion having a first arc in a planar view and a first straight portion connected to the first land portion, the second conductor has a second land portion having a second arc in a planar view and a second straight portion connected to the second land portion, the first land portion is positioned to surround the first via conductor in a planar perspective, the second land portion is positioned to surround the second via conductor in a planar perspective, the diameter of the first arc and the width of the first straight portion are the same, and the diameter of the second arc and the width of the second straight portion are the same.

[0107] A wiring board according to aspect 3 of the present disclosure is, in the above-mentioned aspect 1 or 2, such that the first conductor has a first land portion having a first arc in a planar view and a first straight portion connected to the first land portion, the second conductor has a second land portion having a second arc in a planar view and a second straight portion connected to the second land portion, the first land portion is positioned to surround the first via conductor in a planar perspective, the second land portion is positioned to surround the second via conductor in a planar perspective, and in the second direction, the center of the second via conductor is positioned on the opposite side to the first via conductor than the widthwise center of the second straight portion.

[0108] The wiring board of aspect 4 of the present disclosure, in accordance with aspect 1 above, further comprises a third via conductor located within the insulating substrate, and a third conductor on the insulating substrate extending from the third via conductor toward the first side surface in the first direction, wherein the third conductor is located away from the second conductor on the opposite side of the first conductor across the second conductor in the second direction, and the third via conductor is connected to the end of the third conductor in the first direction opposite the end on the first side surface side, and is located farther from the first side surface in the first direction than the second via conductor.

[0109] The wiring board of aspect 5 of the present disclosure, in accordance with aspect 3 above, further comprises a third via conductor located within the insulating substrate, and a third conductor on the insulating substrate extending from the third via conductor toward the first side surface in the first direction, wherein the third conductor is located opposite the first conductor across the second conductor in the second direction, and the third via conductor is connected to the end of the third conductor in the first direction opposite the end on the first side surface side, and is located closer to the first side surface in the first direction than the second via conductor.

[0110] A wiring board according to aspect 6 of the present disclosure is the same as aspect 5 above, except that the third conductor has a third land portion having a third arc in a planar view and a third straight portion connected to the third land portion, the third land portion is positioned surrounding the third via conductor in a planar perspective view, and in the second direction, the center of the third via conductor is positioned on the opposite side to the second via conductor than the widthwise center of the third straight portion.

[0111] A wiring board according to a seventh aspect of the present disclosure is the same as the sixth aspect, wherein the second land portion and the third linear portion are positioned with a gap therebetween when viewed from the side in the first direction.

[0112] The wiring board according to aspect 8 of the present disclosure, in accordance with aspect 6 or 7 above, further comprises a fourth via conductor located within the insulating substrate, and a fourth conductor on the insulating substrate extending from the fourth via conductor toward the first side surface in the first direction, wherein the fourth conductor is located away from the first conductor on the opposite side of the second conductor across the first conductor in the second direction, and has a fourth land portion having a fourth arc in a planar view and a fourth straight portion connected to the fourth land portion, wherein the fourth land portion is located surrounding the fourth via conductor in a planar perspective view, and in the second direction, the center of the fourth via conductor is located on the opposite side of the first via conductor from the widthwise center of the fourth straight portion.

[0113] A wiring board according to a ninth aspect of the present disclosure is the wiring board of any one of the first to eighth aspects, wherein the first conductor and the second conductor are located away from the first side surface.

[0114] The wiring board in aspect 10 of the present disclosure is, in any of aspects 1 to 9 above, further comprising a ground conductor that surrounds at least a portion of the first conductor and the second conductor and is positioned at a distance from the first conductor and the second conductor.

[0115] The wiring board according to an eleventh aspect of the present disclosure is the wiring board according to any one of the first to tenth aspects, further comprising a first insulating layer covering the first end and the second end.

[0116] The wiring board in aspect 12 of the present disclosure, in any of aspects 1 to 11 above, further comprises a second insulating layer that, when viewed from above, overlaps at least the first via conductor and the second via conductor and is spaced apart from the first side surface.

[0117] In aspect 13 of the present disclosure, the wiring board is the same as in aspect 12 above, wherein a portion of the first conductor in a region overlapping with the first via conductor in a planar perspective and a portion of the second conductor in a region overlapping with the second via conductor in a planar perspective have exposed portions exposed from the second insulating layer, and further includes a metal layer located on the exposed portions.

[0118] In aspect 14 of the present disclosure, the wiring board is the same as in aspect 12 or 13 above, wherein the second insulating layer has a first region and a second region that is thicker than the first region, and the second region is farther from the first side than the first region.

[0119] The wiring board in aspect 15 of the present disclosure is, in the above-mentioned aspects 12 or 13, further provided with a third insulating layer that is positioned overlapping at least the first via conductor in a planar perspective and is positioned on the second insulating layer, and the third insulating layer is farther from the first side in the first direction than the second insulating layer.

[0120] A wiring board according to a sixteenth aspect of the present disclosure is the wiring board according to any one of the first to fifteenth aspects, wherein the first side surface is an outer side surface of the insulating substrate.

[0121] The wiring board in aspect 17 of the present disclosure is any one of aspects 1 to 15 above, wherein the insulating substrate has a recess that is recessed in the thickness direction and has a bottom surface on which an electronic component is located, and the first side surface is the inner surface of the recess.

[0122] The wiring board in aspect 18 of the present disclosure is any one of aspects 1 to 15 above, wherein the insulating substrate has a through-hole penetrating in the thickness direction and a mounting surface around the through-hole on which electronic components are located, and the first side surface is an inner surface of the insulating substrate that forms the through-hole.

[0123] A wiring board according to a nineteenth aspect of the present disclosure is the wiring board according to any one of the first to eighteenth aspects, wherein the thickness of the insulating substrate becomes thinner toward the first side surface.

[0124] A wiring board in aspect 20 of the present disclosure comprises a wiring board according to any one of aspects 1 to 19 above, and an electronic component electrically connected to the first conductor and the second conductor and positioned on the wiring board.

[0125] REFERENCE SIGNS LIST 1, 1A Electronic module 2 Electronic component 10, 10A, 10B, 10C, 10D, 10E, 10F Wiring board 20, 20A, 20B, 20C, 20D Insulating substrate 23A, 75A, 86A First side surface 31 First conductor 31A First linear portion 31B First land portion 31C First end portion 31E First arc 31F Exposed portion 32, 35 Second conductor 32A, 35A Second linear portion 32B, 35B Second land portion 32C, 35C Second end portion 32E, 35E Second arc 33, 36 Third conductor 33A, 36A Third linear portion 33B, 36B Third land portion 33C, 36C Third end portion 33E, 36E Third arc 34, 37 Fourth conductor 34A, 37A Fourth linear portion 34B, 37B Fourth land portion 34C, 37C Fourth end portion 34E, 37E Fourth arc 51 First via conductor 52 Second via conductor 53 Third via conductor 54 Fourth via conductor 60 Ground conductor 61 First insulating layer 62 Second insulating layer 63, 65 Third insulating layer 64 Metal layer 70 Base portion 73, 83 Recess 74 Bottom surface 75, 86 Inner surface 84 Penetration portion 85 Mounting surface

Claims

1. An insulating substrate having a first side surface, A first via conductor and a second via conductor are located within the insulating substrate, On the insulating substrate, a first conductor extending from the first via conductor toward the first side surface in a first direction toward the first side surface from the first via conductor, The insulating substrate comprises a second conductor extending from the second via conductor toward the first side surface in the first direction, The first via conductor is connected to the end of the first conductor in the first direction that is opposite to the first end on the first side, The second via conductor is connected to the end of the second conductor in the first direction that is opposite to the second end on the first side surface, The first conductor and the second conductor are positioned side by side in a second direction perpendicular to the first direction. The first via conductor is located at a position further from the first side surface than the second via conductor in the first direction. In a side view from the first direction, the first conductor and the second conductor are located apart. A wiring board in which the first via conductor and the second via conductor are located separately in a side view from the first direction and a side view from the second direction.

2. The first conductor has a first land portion having a first circular arc in plan view, and a first straight portion connected to the first land portion. The second conductor has a second land portion having a second circular arc in plan view, and a second straight portion connected to the second land portion. The first land portion is positioned to surround the first via conductor in a planar perspective view, The second land portion is positioned to surround the second via conductor in a planar perspective view, The diameter of the first arc and the width of the first straight section are the same. The wiring board according to claim 1, wherein the diameter of the second arc and the width of the second straight section are the same.

3. The first conductor has a first land portion having a first circular arc in plan view, and a first straight portion connected to the first land portion. The second conductor has a second land portion having a second circular arc in plan view, and a second straight portion connected to the second land portion. The first land portion is positioned to surround the first via conductor in a planar perspective view, The second land portion is positioned to surround the second via conductor in a planar perspective view, The wiring board according to claim 1, wherein in the second direction, the center of the second via conductor is located on the opposite side from the first via conductor side from the center in the width direction of the second straight portion.

4. A third via conductor located within the insulating substrate, The insulating substrate further comprises a third conductor extending from the third via conductor toward the first side surface in the first direction, The third conductor is located away from the second conductor in the second direction, on the opposite side of the second conductor from the first conductor, and separated from the second conductor. The wiring board according to claim 1, wherein the third via conductor is connected to the end of the third conductor in the first direction that is opposite to the end on the first side surface, and is located further from the first side surface than the second via conductor in the first direction.

5. A third via conductor located within the insulating substrate, The insulating substrate further comprises a third conductor extending from the third via conductor toward the first side surface in the first direction, The third conductor is located on the opposite side of the first conductor from the second conductor in the second direction, The wiring board according to claim 3, wherein the third via conductor is connected to the end of the third conductor in the first direction that is opposite to the end on the first side surface, and is located closer to the first side surface than the second via conductor in the first direction.

6. The third conductor has a third land portion having a third circular arc in a plan view, and a third straight portion connected to the third land portion. The third land portion is positioned to surround the third via conductor in a planar perspective view, The wiring board according to claim 5, wherein in the second direction, the center of the third via conductor is located on the opposite side from the second via conductor side from the center in the width direction of the third straight portion.

7. The wiring board according to claim 6, wherein, in a side view from the first direction, the second land portion and the third straight portion are located with a gap between them.

8. A fourth via conductor located within the insulating substrate, The insulating substrate further comprises a fourth conductor extending from the fourth via conductor toward the first side surface in the first direction, The fourth conductor is located away from the first conductor on the opposite side of the first conductor in the second direction, and has a fourth land portion having a fourth circular arc in a plan view, and a fourth straight portion connected to the fourth land portion. The fourth land portion is positioned to surround the fourth via conductor in a planar perspective view, The wiring board according to claim 6, wherein in the second direction, the center of the fourth via conductor is located on the opposite side from the first via conductor side from the center in the width direction of the fourth straight portion.

9. The wiring board according to claim 1, wherein the first conductor and the second conductor are located away from the first side surface.

10. The wiring board according to claim 1, further comprising a ground conductor that surrounds at least a portion of the first conductor and the second conductor and is positioned at a distance from the first conductor and the second conductor.

11. The wiring board according to claim 1, further comprising a first insulating layer covering the first end and the second end.

12. The wiring board according to claim 1, further comprising a second insulating layer that, in a planar perspective view, is positioned overlapping with at least the first via conductor and the second via conductor, and is positioned at a distance from the first side surface.

13. In a planar perspective view, a portion of the first conductor in the region overlapping with the first via conductor, and a portion of the second conductor in the region overlapping with the second via conductor in a planar perspective view, have exposed portions that are exposed from the second insulating layer. The wiring board according to claim 12, further comprising a metal layer located on the exposed portion.

14. The second insulating layer has a first region and a second region that is thicker than the first region. The wiring board according to claim 12, wherein the second region is further away from the first side surface than the first region.

15. The third insulating layer is located on the second insulating layer and is positioned at least on top of the first via conductor in a planar perspective view. The wiring board according to claim 12, wherein the third insulating layer is further away from the first side surface than the second insulating layer in the first direction.

16. The wiring board according to claim 1, wherein the first side surface is the outer surface of the insulating substrate.

17. The insulating substrate has a recess that is concave in the thickness direction and has a bottom surface on which electronic components are located. The wiring board according to claim 1, wherein the first side surface is the inner surface of the recess.

18. The insulating substrate is A through-hole that penetrates in the thickness direction, The structure includes a mounting surface provided around the aforementioned through-hole where electronic components are located, The wiring board according to claim 1, wherein the first side surface is the inner surface of the insulating substrate that forms the through-hole.

19. The wiring board according to claim 1, wherein the thickness of the insulating substrate decreases towards the first side surface.

20. A wiring board according to any one of claims 1 to 19, An electronic module comprising an electronic component that is electrically connected to the first conductor and the second conductor and located on the wiring board.