Method for manufacturing copper-clad glass substrates

Abstract

This invention relates to a method for manufacturing a copper-clad glass substrate, which differs from the materials and processes of traditional copper foil substrates. Instead, a glass substrate is first subjected to full etching with a hydrophilic and viscous etching solution to eliminate the physical properties of surface hardness, forming an etched glass that is not easily brittle. Then, a copper foil layer is laminated onto the surface of the etched glass at a processing temperature of 200-450°C, thereby constructing a copper-clad glass substrate with high flatness and excellent heat resistance. Circuit boards (PCBs) made from this copper-clad glass substrate prevent the formation of a non-uniform stress field on the glass surface, thus preventing warpage. It also improves the adhesion between the circuitry and the substrate, enhances the processing precision of the circuitry, reduces the impact of the circuitry on high-frequency electrical performance, and achieves a significant improvement in conductivity.

Claims

1. A method for manufacturing a copper-clad glass substrate, comprising the following steps: a) providing a glass substrate with a thickness ranging from 0.4 mm to 1.6 mm; b) pretreatment: cleaning and drying the glass substrate; c) vertical etching: placing the glass substrate vertically into an etching tank, wherein the etching solution in the etching tank comprises 3-10 wt% hydrofluoric acid (HF), 5-15 wt% ammonium fluoride (NH₄F), 0.1-3 wt% surfactant, and the remainder being water, and has a viscosity of 12-20 cP, this step being used to establish a rough substrate structure for the glass substrate; d) horizontal etching: changing the vertical etching of the previous step c) to a horizontal etching type; e) cyclic treatment: alternating between steps c) and d) immersion 1-3 times to achieve full surface etching; f) Spiral water spray cleaning: The glass substrate with full-surface etching in the previous step is cleaned with an aqueous solution. The aqueous solution is sprayed vertically from a spiral nozzle arranged in a spiral pattern, while the glass substrate is horizontally conveyed to the bottom of the spiral nozzle. The spiral nozzle is 8cm to 15cm away from the glass substrate when the aqueous solution is sprayed. g) Drying and inspection: The glass substrate cleaned in the previous step f) is dried, and its roughness (Ra) and haze are inspected. h) Forming an etched glass: An etched thin layer is formed on the surface of the glass substrate, with a surface roughness (Ra) of 0.1μm to 0.5μm, a haze value of 7 to 15%, an elastic modulus of 43 GPa or higher, a hardness of less than 8 GPa, and a density of 2.3 to 3.3 g / cm3. i) A copper foil layer is provided and laminated onto the surface of the etched glass at a processing temperature of 200 to 450°C. j) A flat and heat-resistant copper-clad glass substrate is formed.

2. The method for manufacturing a copper-clad glass substrate as described in claim 1, wherein, In step a), the glass substrate is composed of any one of aluminosilicate glass, soda-lime glass, sapphire glass, ultra-clear glass, and borosilicate alkali-free glass.

3. The method for manufacturing a copper-clad glass substrate as described in claim 1, wherein, In step b), the glass substrate is cleaned with an alkaline solution.

4. The method for manufacturing a copper-clad glass substrate as described in claim 1, wherein, In step f), the aqueous solution includes deionized water.

5. The method for manufacturing a copper-clad glass substrate as described in claim 1, wherein, In step i), the copper foil layer comprises being laminated onto the surface of the etched glass by any of the following methods: lamination, PVD (physical vapor deposition), or CVD (chemical vapor deposition).

6. A copper-clad glass substrate manufactured by the method described in claim 1, comprising: a glass substrate having a thickness of 0.4 mm to 1.6 mm; an etched thin layer etched onto the surface of the glass substrate, the etched thin layer having a roughness (Ra) of 0.1 μm to 0.5 μm and a haze of 7 to 15%, thereby constituting an etched glass, wherein the etched glass has an elastic modulus of 43 GPa or higher, a hardness of less than 8 GPa, and a density of 2.3 to 3.3 g / cm³; and a copper foil layer laminated onto the surface of the etched thin layer of the etched glass, thereby constituting a copper-clad glass substrate.

7. The copper-clad glass substrate as described in claim 6, wherein, The etched thin layer system includes upper and lower surfaces formed on the glass substrate, and the copper foil layer system is respectively laminated on the upper and lower surfaces of the etched thin layer.

8. The copper-clad glass substrate as described in claim 7, wherein, The copper foil layer is laminated onto the surface of the etched glass by any of the following methods: lamination, PVD (physical vapor deposition), or CVD (chemical vapor deposition).

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