Detachable pocket for semiconductor test socket housing
USD1112120SActive Publication Date: 2026-02-10TFE CO LTD
Patent Information
- Application Number
- US29/973157
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2024-06-04
- Filing Date
- 2024-11-14
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2041-02-10
Smart Images
Figure USD1112120-D00000_ABST
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Description
[0001] FIG. 1 is a top, front, and left-side perspective view of a detachable pocket for semiconductor test socket housing, showing my new design;
[0002] FIG. 2 is a front elevational view thereof;
[0003] FIG. 3 is a rear elevational view thereof;
[0004] FIG. 4 is a right-side elevational view thereof;
[0005] FIG. 5 is a left-side elevational view thereof;
[0006] FIG. 6 is a top plan view thereof; and,
[0007] FIG. 7 is a bottom view thereof.
Claims
The ornamental design for a detachable pocket for semiconductor test socket housing as shown and described.
Citation Information
Patent Citations
Pressure device for test socket
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Test socket for testing semiconductor package
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Test socket assembly having heat dissipation module
US20100289513A1
Test socket with a rapidly detachable electrical connection module
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Semiconductor chip package test sockets
US20130260592A1