Electronic device including thermal hinge assembly

Abstract

An electronic device according to an embodiment may comprise: a first housing including at least one first heat-generating body; a second housing including at least one second heat-generating body; and a thermal hinge assembly connecting the first and second housings such that the first and second housings can rotate about a hinge axis. The thermal hinge assembly may include: a first hollow hinge member made of a metal material; a second hollow hinge member spaced apart from the first hollow hinge member along the hinge axis; a center hinge member disposed between the first and second hollow hinge members along the hinge axis; at least one heat transfer member that passes through the first and second hollow hinge members and the center hinge member and is thermally coupled to the first and second hollow hinge members and the center hinge member; a first rotation guide part coupled to one end of the center hinge member and the first hollow hinge member; and a second rotation guide part coupled to the other end of the center hinge member and the second hollow hinge member. Various other embodiments that can be understood through the specification are also possible.

Description

Electronic device comprising a thermal hinge assembly

[0001] The present invention relates to an electronic device comprising a thermal hinge assembly capable of heat transfer.

[0002] An electronic device, such as a notebook PC, may include two housings and a hinge assembly that rotatably connects the two housings. For example, a data input unit (e.g., a plurality of keys, a touchpad, or a touch screen) may be located in one housing, and a data output unit (e.g., a display) may be located in the other housing.

[0003] These electronic devices may be equipped with a fan, such as a cooling fan, to dissipate heat from the inside of the housing to the outside. However, due to the noise generated by cooling fans, electronic devices without fans and with separate cooling devices are emerging.

[0004] For example, as a separate cooling device, the electronic device may be structured to have heat pipes of a shape that are bent multiple times placed in two housings, respectively, and to radiate heat from the heating element to the outside via a hinge assembly.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0006] However, these electronic devices may have a thicker hinge assembly or a thicker housing due to the arrangement of the heat pipe for heat dissipation in the hinge assembly or the housing, and in particular, the durability of the hinge assembly for heat transfer may be deteriorated.

[0007] For example, when forming a heat pipe made of copper material considering heat transfer properties, the hinge assembly may be deformed due to the rotation of the housing when the housing rotates.

[0008] Additionally, when a heat pipe made of copper is placed in a housing, such as a housing in which a display is placed, considering heat transfer, the thickness of the housing including the display may increase.

[0009] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0010] As a technical means for achieving the above-described technical task, according to various embodiments of the present invention, there is provided an electronic device including a thermal hinge assembly that is advantageous for slimming the electronic device.

[0011] According to various embodiments of the present invention, there is provided an electronic device including a thermal hinge assembly that is advantageous for slimming a housing in which a display is arranged.

[0012] According to various embodiments of the present invention, there is provided an electronic device including a thermal hinge assembly having improved rotational durability according to a rotational motion while performing a heat transfer function.

[0013] According to various embodiments of the present invention, there is provided an electronic device including a thermal hinge assembly capable of minimizing thermal resistance between hinge components by penetrating at least one heat pipe between hinge components constituting the hinge assembly.

[0014] An electronic device according to various embodiments of the present invention comprises: a first housing including at least one first heating element; a second housing including at least one second heating element; and a thermal hinge assembly rotatably connecting the first and second housings about a hinge axis, wherein the thermal hinge assembly is made of a metal material and comprises: a first hollow hinge member; a second hollow hinge member spaced apart from the first hollow hinge member along the hinge axis; a center hinge member disposed between the first and second hollow hinge members and disposed along the hinge axis; at least one heat transfer member disposed to penetrate the first and second hollow hinge members and the center hinge member and thermally coupled to the first and second hollow hinge members and the center hinge member; a first rotation guide portion coupled to one end of the center hinge member and the first hollow hinge member; And it may include a second rotation guide part that is coupled with the other end of the center hinge member and the second hollow hinge member.

[0015] According to various embodiments of the present invention, it is effective to reduce the thickness of a housing in which a display is placed, and in particular, rotational durability according to rotation of the housing can be improved.

[0016] According to various embodiments of the present invention, deformation and damage of a heat transfer member due to rotational motion of a housing can be relatively reduced.

[0017] According to various embodiments of the present invention, the electronic device can implement a sufficient heat transfer path between the first and second housings.

[0018] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0019] FIG. 1A is a perspective view showing an electronic device in a folded state according to one embodiment of the present invention.

[0020] FIG. 1b is a perspective view showing a thermal hinge assembly in a folded state according to one embodiment of the present invention.

[0021] FIG. 2A is a perspective view showing an electronic device in an unfolded state of approximately 90 degrees according to one embodiment of the present invention.

[0022] FIG. 2b is a perspective view showing a thermal hinge assembly in an unfolded state of approximately 90 degrees according to one embodiment of the present invention.

[0023] FIG. 3 is a plan view illustrating a separated thermal hinge assembly according to one embodiment of the present invention.

[0024] FIG. 4 is a plan view showing an assembled thermal hinge assembly according to one embodiment of the present invention.

[0025] FIG. 5 is a cross-sectional view showing a portion of a separated thermal hinge assembly according to one embodiment of the present invention.

[0026] FIG. 6 is a cross-sectional view showing an assembled thermal hinge assembly according to one embodiment of the present invention.

[0027] FIG. 7 is an exemplary diagram showing a heat transfer path of a thermal hinge assembly according to one embodiment of the present invention.

[0028] Figure 8 is an exemplary diagram showing a joint structure between hinge members according to one embodiment of the present invention.

[0029] Figure 9 is an exemplary diagram showing a joint structure between hinge members according to one embodiment of the present invention.

[0030] FIG. 10a is a perspective view showing a hinge arm coupled to a center hinge member according to one embodiment of the present invention, and is a drawing showing the hinge arm in a folded state.

[0031] FIG. 10b is a perspective view showing a hinge arm coupled to a center hinge member according to one embodiment of the present invention, and is a drawing showing the hinge arm in an unfolded state of approximately 90 degrees.

[0032] Figures 11 to 18 are exemplary drawings each showing the structure of a thermal hinge assembly according to various embodiments of the present invention.

[0033] FIG. 19 is a block diagram of an electronic device within a network environment according to various embodiments.

[0034] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0035] Below, embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, for the purpose of clearly explaining the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar parts are designated with similar reference numerals throughout the specification.

[0036] The terms used in this disclosure are described as currently common terms, taking into account the functions mentioned herein. However, these terms may mean various other terms depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terms used in this disclosure should not be interpreted solely based on their names, but rather based on the meanings of the terms and the overall content of this disclosure.

[0037] Additionally, while terms such as first, second, etc. may be used to describe various components, the components should not be limited by these terms. These terms are used to distinguish one component from another.

[0038] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the cases where the parts are "directly connected" but also the cases where the parts are "electrically connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise stated.

[0039] The phrases “in one embodiment” and the like appearing in various places throughout this disclosure do not necessarily all refer to the same embodiment.

[0040] An embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various hardware and / or software configurations that perform specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a given function. Furthermore, for example, the functional blocks of the present disclosure may be implemented in various programming or scripting languages. The functional blocks may be implemented by algorithms that execute on one or more processors. Furthermore, the present disclosure may employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as "mechanism," "element," "means," and "configuration" may be used broadly and are not limited to mechanical and physical configurations.

[0041] Additionally, the connecting lines or connecting members between components depicted in the drawings are merely exemplary representations of functional connections and / or physical or circuit connections. In an actual device, connections between components may be represented by various functional connections, physical connections, or circuit connections that may be replaced or added.

[0042] The present disclosure will be described in detail with reference to the attached drawings below.

[0043] FIG. 1A is a perspective view illustrating an electronic device in a folded state according to one embodiment of the present invention. FIG. 1B is a perspective view illustrating a thermal hinge assembly in a folded state according to one embodiment of the present invention. FIG. 2A is a perspective view illustrating an electronic device in an unfolded state approximately 90 degrees according to one embodiment of the present invention. FIG. 2B is a perspective view illustrating a thermal hinge assembly in an unfolded state approximately 90 degrees according to one embodiment of the present invention.

[0044] Referring to FIGS. 1A to 2B, an electronic device (100) according to one embodiment may include first and second housings (10, 20) and a thermal hinge assembly (30). According to one embodiment, the first and second housings (10, 20) may be rotatably connected by the thermal hinge assembly (30). According to one embodiment, the first housing (10) may include at least one data input unit, and the second housing (20) may include at least one data output unit. For example, the data input unit may include at least one of a plurality of keys, a touch screen, or at least one touch pad. For example, the data output unit may include any one of a display or a touch screen display.

[0045] In one embodiment, the second housing (20) can be brought into an unfolded state, approximately 90 degrees, approximately 120 degrees to 130 degrees, or either an unfolded or folded state, relative to the first housing (10) by a thermal hinge assembly (30). The stopping force of the second housing (20) can be provided by the thermal hinge assembly (30). For example, the thermal hinge assembly (30) can be a damping hinge assembly. The stopping force mentioned can refer to a force that can keep the second housing (20) in a stopped state at a specific angle, for example, approximately about 120 degrees.

[0046] According to one embodiment, the second housing (20) may be rotatably arranged about a hinge axis (h) with respect to the first housing (10) by a thermal hinge assembly (30) and may be arranged to transfer heat. According to one embodiment, the first housing (10) may include at least one first heating element, and the second housing (20) may include at least one second heating element. For example, the first heating element may include a main printed circuit board, and the second housing may include a display circuit board. According to one embodiment, the main printed circuit board or the display circuit board may be made of either a rigid material or a flexible material.

[0047] Figure 3 is a plan view illustrating a separated thermal hinge assembly according to one embodiment of the present invention. Figure 4 is a plan view illustrating an assembled thermal hinge assembly according to one embodiment of the present invention.

[0048] Referring to FIGS. 3 and 4, according to one embodiment, the thermal hinge assembly (30) may include a rotation function, a connection function, and a heat transfer function. According to one embodiment, the thermal hinge assembly (30) may include a center hinge member (31), a first hollow hinge member (32), a second hollow hinge member (33), and a heat transfer member (34). According to one embodiment, the first and second hollow hinge members (32, 33) and the center hinge member (31) may be thermally coupled along a hinge axis (h).

[0049] According to one embodiment, the center hinge member (31) may be disposed in the first housing (10) (e.g., the first housing (10) of FIGS. 1A and 2A), and the first and second hollow hinge members (32, 33) may be disposed in the second housing (20) (e.g., the second housing (20) of FIGS. 1A and 2A). According to one embodiment, the center hinge member (31) may be coupled to the first thermal expansion plate (35), and the first thermal expansion plate (35) (thermal spreader) may be disposed so as to face the first housing (10). According to one embodiment, the first and second hollow hinge members (32, 33) may be coupled to the second thermal expansion plate (36), and the second thermal expansion plate (36) may be disposed so as to face the second housing (20). For example, the first row expansion plate (35) or the second row expansion plate (36) may be a heat transfer member and may be in the shape of a thin plate.

[0050] According to one embodiment, the first row expansion plate (35) may be responsible for the function of transferring heat transferred from the first heating element, e.g., the main printed circuit board, disposed in the first housing (10) to the center hinge member (31), and the second row expansion plate (36) may be responsible for the function of transferring heat transferred from the first and second hollow hinge members (32, 33) to the second housing (20).

[0051] Figure 5 is a cross-sectional view illustrating a portion of a separated thermal hinge assembly according to one embodiment of the present invention. Figure 6 is a cross-sectional view illustrating an assembled thermal hinge assembly according to one embodiment of the present invention.

[0052] Referring to FIGS. 5 and 6, according to one embodiment, the center hinge member (31) may include a center hinge body (311), a cylindrical opening (312) formed inside the center hinge body (311), a fastening portion (313) formed on an outer surface of the center hinge body (311), and first and second coupling grooves (314, 315) formed at both ends of the center hinge body (311).

[0053] According to one embodiment, the first hollow hinge member (32) may include a first hinge body (321), a first cylindrical opening (322) formed inside the first hinge body (321), a first protrusion (323) formed at one end of the first hinge body (321), and a first fastening portion (324) formed on an outer circumferential surface of the first hinge body (321). According to one embodiment, the first cylindrical opening (322) may be a space into which a heat transfer member (34) is inserted, the first fastening portion (324) may be a portion fastened to a second row expansion plate (36), and the first protrusion (323) may be a portion inserted into a first coupling groove of the center hinge member (31).

[0054] According to one embodiment, the second hollow hinge member (33) may include a second hinge body (331), a second cylindrical opening (332) formed inside the second hinge body (331), a second fastening portion (334) formed on an outer surface of the second hinge body (331), and a second protrusion (333) formed at one end of the second hinge body (331). According to one embodiment, the second cylindrical opening (332) may be a space into which a heat transfer member (34) is inserted, the second fastening portion (334) may be a portion fastened to a second heat expansion plate (36), and the second protrusion (333) may be a portion inserted into the other end of the center hinge member (31).

[0055] According to one embodiment, the heat transfer member (34) is a thermal member and connecting member that is arranged to penetrate the first and second hollow hinge members (32, 33) and the center hinge member (31), and may be arranged along the hinge axis (h). According to one embodiment, the heat transfer member (34) is a water-cooled heat dissipation member including a vapor chamber, and may be, for example, at least one heat pipe. Hereinafter, the heat transfer member (34) will be referred to as a heat pipe.

[0056] According to one embodiment, when the heat pipe (34) is thermally coupled with the first and second hollow hinge members (32, 33) and the center hinge member (31), the heat pipe (34), the first and second hollow hinge members (32, 33) and the center hinge member (31) can be arranged along the hinge axis (h). According to one embodiment, the hip pipe (34) is cylindrical, and the outer circumferential surface thereof can be arranged to be thermally coupled in close contact with the cylindrical opening (312) and the first and second cylindrical openings (322, 332).

[0057] According to one embodiment, a first rotation guide part (351) may be arranged between one end of the center hinge member (31) and the first hollow hinge member (32), and a second rotation guide part (352) may be arranged between the other end of the center hinge member (31) and the second hollow hinge member (33). According to one embodiment, the first rotation guide part (351) may facilitate a more precise and rotatable coaxial assembly between one end of the center hinge member (31) and the first hollow hinge member (32), and the second rotation guide part (352) may facilitate a more precise and rotatable coaxial assembly between the other end of the center hinge member (31) and the second hollow hinge member (33).

[0058] According to one embodiment, the first rotation guide portion (351) may include a first coupling groove (314) formed on one side of the center hinge member (31) and a first protrusion (323) formed on one side of the first hollow hinge member (32). According to one embodiment, the second rotation guide portion (352) may include a second coupling groove (315) formed on the other side of the center hinge member (31) and a second protrusion (333) formed on one side of the second hollow hinge member (33). For example, the diameter of the first coupling groove (314) and the diameter of the first protrusion (323) may be approximately the same, and the diameter of the second coupling groove (315) and the diameter of the second protrusion (333) may be approximately the same. For example, each of the first and second coupling grooves need not be limited to a cylindrical shape, but may have a truncated cone shape such as a cup shape, and each of the first and second protrusions need not be limited to a cylindrical shape, but may have a truncated cone shape such as a cup shape.

[0059] FIG. 7 is an exemplary diagram showing a heat transfer path of a thermal hinge assembly according to one embodiment of the present invention.

[0060] Referring to FIG. 7, according to one embodiment, heat generated from a heating element (H) accommodated in a first housing, for example, a main printed circuit board, may be transferred to a first row expansion plate (35), and then the transferred heat may be transferred to a heat pipe (34), and then the heat of the transferred heat pipe (34) may be transferred to a first hollow hinge member (32), and then to a second row expansion plate (36), which may be formed as a heat transfer path. In addition, the heat of the heat pipe (34) may be transferred to a second hollow hinge member (e.g., the second hollow hinge member (33) of FIG. 6), and then to a second row expansion plate (36), which may be formed as a heat transfer path. Finally, the heat transferred to the second row expansion plate (36) may be transferred to a second housing (e.g., the second housing (20) illustrated in FIGS. 1A and 2A) and released to the outside. The arrows shown may represent heat transfer flow.

[0061] According to one embodiment, a portion of a first heat expansion plate (35) of a first housing (e.g., the first housing (10) illustrated in FIGS. 1A and 2A) may be thermally coupled, the first heat expansion plate (35) and a center hinge member (31) may be thermally coupled, the center hinge member (31) and a heat pipe (34) may be thermally coupled, the heat pipe (34) and the first and second hollow hinge members (32, 33) may be thermally coupled, the first and second hollow hinge members (32, 33) and a second heat diffusion plate (36) may be thermally coupled, and the second heat diffusion plate (36) may be thermally coupled to a portion of a second housing (e.g., the second housing (20) illustrated in FIGS. 1A and 2A).

[0062] Figure 8 is an exemplary diagram showing a joint structure between hinge members according to one embodiment of the present invention.

[0063] Referring to FIG. 8, according to one embodiment, the rotation guide portion between the hinge members is a joint between a cylindrical groove and a cylindrical projection, which facilitates more precise jointing along a coaxial axis (e.g., hinge axis) and minimizes eccentricity between the axes.

[0064] For example, a more precise coaxial coupling between the absence of (a) and the absence of (b) may be facilitated, a more precise coaxial coupling between the absence of (b) and the absence of (c) may be facilitated, and a more precise coaxial coupling between the absence of (c) and the absence of (d) may be facilitated.

[0065] Figure 9 is an exemplary diagram showing a joint structure between hinge members according to one embodiment of the present invention.

[0066] Referring to FIG. 9, according to one embodiment, the rotation guide portion between the hinge members is a joint between a cup-shaped groove and a cup-shaped protrusion, facilitating more precise jointing coaxially (e.g., hinge axis) and minimizing eccentricity between the axes.

[0067] For example, a more precise coaxial coupling between the absence of (a) and the absence of (b) may be facilitated, a more precise coaxial coupling between the absence of (b) and the absence of (c) may be facilitated, and a more precise coaxial coupling between the absence of (c) and the absence of (d) may be facilitated.

[0068] FIG. 10a is a perspective view showing a state in which a hinge arm is coupled to a center hinge member according to one embodiment of the present invention, and is a drawing showing the hinge arm in a folded state. FIG. 10b is a perspective view showing a state in which a hinge arm is coupled to a center hinge member according to one embodiment of the present invention, and is a drawing showing the hinge arm in an unfolded state of approximately 90 degrees.

[0069] Referring to FIGS. 10A and 10B, according to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1 and 2) may rotatably connect first and second housings (10, 20) (e.g., the first and second housings (10, 20) illustrated in FIGS. 1A and 2A), and may include hinge arms (37) each of which is coupled to one end of a second hollow hinge member (33). According to one embodiment, one end (371) of the hinge arm (37) may be coupled to one end of the second hollow hinge member (33), and the other end may be fastened to the first row expansion plate (35). Although not illustrated in the drawings, the first hollow hinge member (32) and the hinge arm (37) may also be coupled in substantially the same manner.

[0070] Figures 11 to 18 are exemplary drawings each showing the structure of a thermal hinge assembly according to various embodiments of the present invention.

[0071] Referring to FIG. 11, according to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1 and 2) may form first and second heat transfer paths (①, ②) in both directions through first and second heat pipes (341, 342). According to one embodiment, the first and second heat transfer paths (①, ②) may be formed approximately symmetrically with respect to a center hinge member (31).

[0072] According to one embodiment, the first heat transfer path (①) may be sequentially transferred to a heating element (H), a first heat diffusion plate (35), a center hinge member (31), a first hollow hinge member (32), and a second heat diffusion plate (36). For example, the heating element (H) may be a main printed circuit board on which a plurality of chips are mounted, or a plurality of mounted chips.

[0073] According to one embodiment, the second heat transfer path (②) can be transferred in the following order: a heating element (H), a first heat diffusion plate (35), a center hinge member (31), a second hollow hinge member (33), and a second heat diffusion plate (36).

[0074] Referring to FIG. 12, a thermal hinge assembly according to one embodiment is compared with the thermal hinge assembly illustrated in FIG. 11, and the same configuration is omitted to avoid redundant description, and only the differences are described.

[0075] A thermal hinge assembly according to one embodiment (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1 and 2) may be replaced with two third and fourth heat pipes (343, 344) instead of the first heat diffuser plate (e.g., the first heat diffuser plate (35) illustrated in FIG. 11). The third heat pipe (343) may be thermally coupled to the center hinge member (31) and the first heat pipe (341), and the fourth heat pipe (344) may be thermally coupled to the center hinge member (31) and the second heat pipe (342).

[0076] According to one embodiment, the first and second heat transfer paths (①,②) can be formed approximately symmetrically around the center hinge member (31).

[0077] According to one embodiment, the first heat transfer path (①) may be transferred in the following order: a heating element (H), a third heat pipe (343), a center hinge member (31), a first hollow hinge member (32), and a second heat diffusion plate (36).

[0078] According to one embodiment, the second heat transfer path (②) may be transferred in the following order: a heating element (H), a fourth heat pipe (344), a center hinge member (31), a second hollow hinge member (33), and a second heat diffusion plate (36).

[0079] For example, the first heat pipe (341) and the third heat pipe (343) may be integral or separate, and the second heat pipe (342) and the fourth heat pipe (344) may be integral or separate.

[0080] Referring to FIG. 13, according to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1 and 2) may form a single heat transfer path in one direction through a single heat pipe (345). According to one embodiment, the single heat transfer path may be formed in one area centered around the center hinge member (31).

[0081] According to one embodiment, a single heat transfer path may be configured to transfer heat in the following order: a heating element (H), a first heat diffusion plate (35), a center hinge member (31), a single heat pipe (345), a hollow hinge member (32), and a second heat diffusion plate (36). For example, the heating element (H) may be a main printed circuit board on which a plurality of chips are mounted, or a plurality of mounted chips.

[0082] According to one embodiment, the second row diffuser (36) can be formed with an area approximately half that of the second row diffuser (36) illustrated in FIG. 11.

[0083] Referring to FIG. 14, a thermal hinge assembly according to one embodiment is compared with the thermal hinge assembly illustrated in FIG. 13, and the same configuration is omitted to avoid redundant description, and only the differences are described.

[0084] According to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1 and 2) may be replaced with a second heat pipe (343) instead of the first heat diffuser plate. The second heat pipe (343) may be thermally coupled to the center hinge arm (31) and the first heat pipe (341). According to one embodiment, a heat transfer path may be formed on one side centered on the center hinge member (31).

[0085] According to one embodiment, the heat transfer path may be sequentially transferred to a heating element (H), a second heat pipe (343), a center hinge member (31), a hollow hinge member (32), and a second heat diffusion plate (36). For example, the first heat pipe (341) and the second heat pipe (343) may be integral or separate.

[0086] Referring to FIG. 15, a thermal hinge assembly according to one embodiment is compared with the thermal hinge assembly illustrated in FIG. 11, and the same configuration is omitted to avoid redundant description, and only the differences are described.

[0087] According to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1A and 2A) may have first and second hinge arms (381, 382) coaxially arranged along a hinge axis (h). In one embodiment, the first hinge arm (381) may be connected to a first hollow hinge member (32), and the second hinge arm (382) may be connected to a second hollow hinge member (33). In one embodiment, the first hinge arm (381) may be coupled to an outer end of the first hollow hinge member (32), and the second hinge arm (382) may be coupled to an outer end of the second hollow hinge member (33).

[0088] According to one embodiment, the first and second hinge arms (381, 382) may be responsible for the function of rotatably connecting the first and second housings (e.g., the first and second housings (10, 20) illustrated in FIGS. 1A and 2A).

[0089] Referring to FIG. 16, a thermal hinge assembly according to one embodiment is compared with the thermal hinge assembly illustrated in FIG. 12, and the same configuration is omitted to avoid redundant description, and only the differences are described.

[0090] According to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1A and 2A) may have first and second hinge arms (381, 382) coaxially arranged along a hinge axis (h). In one embodiment, the first hinge arm (381) may be connected to a first hollow hinge member (32), and the second hinge arm (382) may be connected to a second hollow hinge member (33). In one embodiment, the first hinge arm (381) may be coupled to an outer end of the first hollow hinge member (32), and the second hinge arm (382) may be coupled to an outer end of the second hollow hinge member (33). According to one embodiment, the first and second hinge arms (381, 382) may be responsible for the function of rotatably connecting the first and second housings (e.g., the first and second housings (10, 20) illustrated in FIGS. 1A and 2A).

[0091] Referring to FIG. 17, a thermal hinge assembly according to one embodiment is compared with the thermal hinge assembly illustrated in FIG. 13, and the same configuration is omitted to avoid redundant description, and only the differences are described.

[0092] According to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIGS. 1 and 2) may have first and second hinge arms (381, 382) coaxially arranged along a hinge axis (h). In one embodiment, the first hinge arm (381) may be connected to a first hollow hinge member (32), and the second hinge arm (382) may be connected to a second hollow hinge member (33). In one embodiment, the first hinge arm (381) may be coupled to an outer end of the first hollow hinge member (32), and the second hinge arm (382) may be coupled to an outer end of the second hollow hinge member (33). According to one embodiment, the first and second hinge arms (381, 382) may be responsible for the function of rotatably connecting the first and second housings (e.g., the first and second housings (10, 20) illustrated in FIGS. 1A and 2A).

[0093] Referring to FIG. 18, a thermal hinge assembly according to one embodiment is compared with the thermal hinge assembly illustrated in FIG. 14, and the same configuration is omitted to avoid redundant description, and only the differences are described.

[0094] According to one embodiment, a thermal hinge assembly (e.g., the thermal hinge assembly (30) illustrated in FIG. 1) may have first and second hinge arms (381, 382) coaxially arranged along a hinge axis (h). According to one embodiment, the first hinge arm (381) may be connected to a first hollow hinge member (32), and the second hinge arm (382) may be connected to a second hollow hinge member (33). According to one embodiment, the first hinge arm (381) may be coupled to an outer end of the first hollow hinge member (32), and the second hinge arm (382) may be coupled to an outer end of the second hollow hinge member (33).

[0095] FIG. 19 is a block diagram of an electronic device within a network environment according to various embodiments.

[0096] Referring to FIG. 19, in a network environment (1900), an electronic device (1901) may communicate with an electronic device (1902) via a first network (1998) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1904) or a server (1908) via a second network (1999) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1901) may communicate with the electronic device (1904) via the server (1908). According to one embodiment, the electronic device (1901) may include a processor (1920), a memory (1930), an input module (1950), an audio output module (1955), a display module (1960), an audio module (1970), a sensor module (1976), an interface (1977), a connection terminal (1978), a haptic module (1979), a camera module (1980), a power management module (1988), a battery (1989), a communication module (1990), a subscriber identification module (1996), or an antenna module (1997). In some embodiments, the electronic device (1901) may omit at least one of these components (e.g., the connection terminal (1978)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1976), camera module (1980), or antenna module (1997)) may be integrated into a single component (e.g., display module (1960)).

[0097] The processor (1920) may control at least one other component (e.g., a hardware or software component) of the electronic device (1901) connected to the processor (1920) by executing, for example, software (e.g., a program (1940)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1920) may store commands or data received from other components (e.g., a sensor module (1976) or a communication module (1990)) in a volatile memory (1932), process the commands or data stored in the volatile memory (1932), and store result data in a non-volatile memory (1934). According to one embodiment, the processor (1920) may include a main processor (1921) (e.g., a central processing unit or an application processor) or a secondary processor (1923) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1921). For example, when the electronic device (1901) includes the main processor (1921) and the secondary processor (1923), the secondary processor (1923) may be configured to use less power than the main processor (1921) or to be specialized for a given function. The secondary processor (1923) may be implemented separately from the main processor (1921) or as a part thereof.

[0098] The auxiliary processor (1923) may control at least a portion of functions or states associated with at least one component (e.g., a display module (1960), a sensor module (1976), or a communication module (1990)) of the electronic device (1901), for example, on behalf of the main processor (1921) while the main processor (1921) is in an inactive (e.g., sleep) state, or together with the main processor (1921) while the main processor (1921) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1923) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1980) or a communication module (1990)). In one embodiment, the auxiliary processor (1923) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1901) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1908)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0099] The memory (1930) can store various data used by at least one component (e.g., the processor (1920) or the sensor module (1976)) of the electronic device (1901). The data can include, for example, software (e.g., the program (1940)) and input data or output data for commands related thereto. The memory (1930) can include volatile memory (1932) or non-volatile memory (1934).

[0100] The program (1940) may be stored as software in memory (1930) and may include, for example, an operating system (1942), middleware (1944), or an application (1946).

[0101] The input module (1950) can receive commands or data to be used in a component of the electronic device (1901) (e.g., a processor (1920)) from an external source (e.g., a user) of the electronic device (1901). The input module (1950) can include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0102] The audio output module (1955) can output audio signals to the outside of the electronic device (1901). The audio output module (1955) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0103] The display module (1960) can visually provide information to an external party (e.g., a user) of the electronic device (1901). The display module (1960) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display module (1960) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0104] The audio module (1970) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1970) can acquire sound through the input module (1950), output sound through the sound output module (1955), or an external electronic device (e.g., electronic device (1902)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1901).

[0105] The sensor module (1976) can detect the operating status (e.g., power or temperature) of the electronic device (1901) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1976) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0106] The interface (1977) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1901) with an external electronic device (e.g., the electronic device (1902)). In one embodiment, the interface (1977) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0107] The connection terminal (1978) may include a connector through which the electronic device (1901) may be physically connected to an external electronic device (e.g., the electronic device (1902)). In one embodiment, the connection terminal (1978) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0108] A haptic module (1979) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1979) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0109] The camera module (1980) can capture still images and moving images. In one embodiment, the camera module (1980) may include one or more lenses, image sensors, image signal processors, or flashes.

[0110] The power management module (1988) can manage the power supplied to the electronic device (1901). According to one embodiment, the power management module (1988) can be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[0111] A battery (1989) may power at least one component of the electronic device (1901). In one embodiment, the battery (1989) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0112] The communication module (1990) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1901) and an external electronic device (e.g., electronic device (1902), electronic device (1904), or server (1908)), and the performance of communication through the established communication channel. The communication module (1990) may operate independently from the processor (1920) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1990) may include a wireless communication module (1992) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1994) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1904) via a first network (1998) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1999) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1992) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1996) to identify or authenticate the electronic device (1901) within a communication network such as the first network (1998) or the second network (1999).

[0113] The wireless communication module (1992) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1992) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1992) may support various technologies for securing performance in high frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1992) may support various requirements specified in the electronic device (1901), an external electronic device (e.g., the electronic device (1904)), or a network system (e.g., the second network (1999)). According to one embodiment, the wireless communication module (1992) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0114] The antenna module (1997) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1997) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1997) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1998) or the second network (1999), may be selected from the plurality of antennas by, for example, the communication module (1990). A signal or power may be transmitted or received between the communication module (1990) and the external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1997).

[0115] According to various embodiments, the antenna module (1997) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0116] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0117] According to one embodiment, commands or data may be transmitted or received between the electronic device (1901) and an external electronic device (1904) via a server (1908) connected to a second network (1999). Each of the external electronic devices (1902 or 1904) may be the same or a different type of device as the electronic device (1901). According to one embodiment, all or part of the operations executed in the electronic device (1901) may be executed in one or more of the external electronic devices (1902, 1904, or 1908). For example, when the electronic device (1901) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1901) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or additional functions or services related to the request, and transmit the result of the execution to the electronic device (1901). The electronic device (1901) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1901) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1904) may include an Internet of Things (IoT) device. The server (1908) may be an intelligent server utilizing machine learning and / or a neural network.In one embodiment, an external electronic device (1904) or server (1908) may be included within the second network (1999). The electronic device (1901) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0118] According to one embodiment, an electronic device (e.g., an electronic device (100) illustrated in FIG. 1A) comprises: a first housing (e.g., a first housing (10) illustrated in FIG. 1A) including at least one first heating element; a second housing (e.g., a second housing (20) illustrated in FIG. 1A) including at least one second heating element; and a thermal hinge assembly (e.g., a thermal hinge assembly (30) illustrated in FIG. 1A) rotatably connecting the first and second housings about a hinge axis (e.g., a hinge axis (h) illustrated in FIG. 1A), wherein the thermal hinge assembly is made of a metal material and comprises: a first hollow hinge member (e.g., a first hollow hinge member (32) illustrated in FIG. 3); A second hollow hinge member (e.g., the second hollow hinge member (33) illustrated in FIG. 3) disposed apart from the first hollow hinge member along the hinge axis; a center hinge member (e.g., the center hinge member (31) illustrated in FIG. 3) disposed between the first and second hollow hinge members and along the hinge axis; at least one heat transfer member (e.g., the heat transfer member (34) illustrated in FIG. 3) disposed to penetrate the first and second hollow hinge members and the center hinge member and thermally coupled to the first and second hollow hinge members and the center hinge member; a first rotation guide member (e.g., the first rotation guide member (351) illustrated in FIG. 6) coupled to one end of the center hinge member and the first hollow hinge member; And it may include a second rotation guide part (e.g., the second rotation guide part (352) illustrated in FIG. 6) that is coupled to the other end of the center hinge part and the second hollow hinge part.

[0119] According to one embodiment, the first rotation guide part (e.g., the first rotation guide part (351) illustrated in FIG. 6) may include a first coupling groove formed at one end of the center hinge member (e.g., the first coupling groove (314) illustrated in FIG. 5); and a first protrusion (e.g., the first protrusion (323) illustrated in FIG. 5) formed on the first hollow hinge member and thermally rotatably coupled to the first coupling groove, and the second rotation guide part (e.g., the second rotation guide part (352) illustrated in FIG. 6) may include a second coupling groove formed at the other end of the center hinge member (e.g., the second coupling groove (315) illustrated in FIG. 6); and a second protrusion (e.g., the second protrusion (333) illustrated in FIG. 6) formed on the second hollow hinge member and thermally rotatably coupled to the second coupling groove.

[0120] According to one embodiment, the diameter of the first coupling groove (e.g., the first coupling groove (314) illustrated in FIG. 5) and the diameter of the first protrusion (e.g., the first protrusion (323) illustrated in FIG. 5) are approximately the same, and the diameter of the second coupling groove (e.g., the second coupling groove (315) illustrated in FIG. 5) and the diameter of the second protrusion (e.g., the second protrusion (333) illustrated in FIG. 6) are approximately the same.

[0121] According to one embodiment, the heat transfer member (e.g., the heat transfer member (34) illustrated in FIG. 6) may be a heat pipe and provide a heat transfer path between the first and second housings.

[0122] According to one embodiment, the first housing (e.g., the first housing (10) illustrated in FIG. 1a) may further include a first heat diffusion plate (e.g., the first heat diffusion plate (35) illustrated in FIG. 3) thermally coupled to the center hinge member.

[0123] According to one embodiment, the first heat diffuser (e.g., the first heat diffuser (35) illustrated in FIG. 3) includes a first protrusion (e.g., the first protrusion (350) illustrated in FIG. 3) for connection to the center hinge member, and the first protrusion can be thermally coupled to the center hinge member (e.g., the center hinge member (31) illustrated in FIG. 3).

[0124] According to one embodiment, the second housing may further include a second heat diffusion plate (e.g., the second heat diffusion plate (36) illustrated in FIG. 3) disposed in the second housing and thermally coupled to the first and second hollow hinge members.

[0125] According to one embodiment, the second heat diffuser (e.g., the second heat diffuser (36) illustrated in FIG. 3) includes a second protrusion (e.g., the second protrusion (360) illustrated in FIG. 3) for connection to the first and second hollow hinge members, and the second protrusion can be thermally coupled to the first and second hollow hinge members (e.g., the first and second hollow hinge members (32, 33) illustrated in FIG. 3).

[0126] According to one embodiment, a first heat diffusion plate (e.g., the first heat diffusion plate (35) illustrated in FIG. 3) may be thermally disposed to face the first housing and thermally coupled to the first heating element.

[0127] According to one embodiment, a thermal hinge assembly (e.g., a thermal hinge assembly (30) illustrated in FIG. 1A) may further include first and second housings (e.g., first and second housings (10, 20) illustrated in FIG. 1A) rotatably connected about the hinge axis, and first and second hinge arms (e.g., first and second hinge arms (381, 382) illustrated in FIG. 15) respectively coupled to the first and second hollow hinge members.

[0128] According to one embodiment, a center hinge member (e.g., a center hinge member (31) illustrated in FIG. 6) may include a center hinge body (e.g., a center hinge body (311) illustrated in FIG. 6); a cylindrical opening formed inside the center hinge body (e.g., a cylindrical opening (312) illustrated in FIG. 6); and a fastening member formed on an outer surface of the center hinge body and coupled to the first heat diffuser plate (e.g., a fastening member (313) illustrated in FIG. 6).

[0129] According to one embodiment, the first hollow hinge member (e.g., the first hollow hinge member (32) illustrated in FIG. 5) further includes a first hinge body (e.g., the first hinge body (321) illustrated in FIG. 5); a first cylindrical opening formed inside the first hinge body for the heat transfer member to pass through (e.g., the first cylindrical opening (322) illustrated in FIG. 5); and a first fastening portion formed on an outer surface of the first hinge body and fastened to the second heat diffusion plate (e.g., the first fastening portion (324) illustrated in FIG. 6), and the second hollow hinge member (e.g., the second hollow hinge member (33) illustrated in FIG. 6) further includes a second hinge body (e.g., the second hinge body (331) illustrated in FIG. 6); It may further include a second cylindrical opening formed inside the second hinge body for the heat transfer member to pass through (e.g., the second cylindrical opening (332) illustrated in FIG. 6); and a second fastening portion formed on the outer surface of the second hinge body and fastened to the second heat diffusion plate (e.g., the second fastening portion (334) illustrated in FIG. 6).

[0130] According to one embodiment, the heat transfer member (e.g., the heat transfer member (34) illustrated in FIG. 6) may be a single cylindrical heat pipe that extends from the first hollow hinge member (e.g., the first hollow hinge member (32) illustrated in FIG. 6) to the second hollow hinge member (e.g., the second hollow hinge member (33) illustrated in FIG. 6).

[0131] In one embodiment, the heat transfer member may be cylindrical and include a first heat pipe (e.g., the first hinge pipe (341) illustrated in FIG. 11) extending from the first hollow hinge member (e.g., the first hollow hinge member (341) illustrated in FIG. 11) to the middle of the center hinge member; and a second heat pipe (e.g., the second heat pipe (341) illustrated in FIG. 11) extending from the middle of the center hinge member to the second hollow hinge member.

[0132] According to one embodiment, the first housing may further include an additional heat pipe (e.g., an additional heat pipe (343) illustrated in FIG. 14) disposed therein and thermally coupled to the heat transfer member and the heating element.

[0133] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0134] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0135] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0136] Various embodiments of the present document may be implemented as software (e.g., a program (1940)) including one or more instructions stored in a storage medium (e.g., an internal memory (1936) or an external memory (1938)) readable by a machine (e.g., an electronic device (1901)). For example, a processor (e.g., a processor (1920)) of the machine (e.g., an electronic device (1901)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0137] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0138] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A first housing comprising at least one first heating element; a second housing comprising at least one second heating element; and Including a thermal hinge assembly that rotatably connects the first and second housings about a hinge axis, The above thermal hinge assembly is made of metal, First hollow hinge member; A second hollow hinge member arranged apart from the first hollow hinge member along the hinge axis; A center hinge member disposed between the first and second hollow hinge members and arranged along the hinge axis; At least one heat transfer member disposed to penetrate the first and second hollow hinge members and the center hinge member and thermally coupled with the first and second hollow hinge members and the center hinge member; A first rotation guide part coupled with one end of the center hinge member and the first hollow hinge member; and An electronic device including a second rotation guide part coupled with the other end of the center hinge member and the second hollow hinge member.

2. In the first paragraph, the first rotation guide part a first joining groove formed at one end of the center hinge member; and A first projection formed on the first hollow hinge member and thermally rotatably coupled to the first coupling groove, The above second rotation guide part A second joining groove formed on the other end of the center hinge member; and An electronic device comprising a second protrusion formed on the second hollow hinge member and thermally rotatably coupled to the second coupling groove.

3. An electronic device in the second paragraph, wherein the diameter of the first coupling groove and the diameter of the first protrusion are approximately the same, and the diameter of the second coupling groove and the diameter of the second protrusion are approximately the same.

4. An electronic device in accordance with claim 1, wherein the heat transfer member is a heat pipe, providing a heat transfer path between the first and second housings.

5. An electronic device according to claim 1, further comprising a first heat diffusion plate disposed in the first housing and thermally coupled to the center hinge member.

6. In the fifth paragraph, the first heat diffuser plate includes a first protrusion for connecting to the center hinge member, and the first protrusion is an electronic device thermally coupled to the center hinge member.

7. An electronic device according to claim 6, further comprising a second heat diffusion plate disposed in the second housing and thermally coupled to the first and second hollow hinge members.

8. In the 7th paragraph, the second heat diffusion plate includes a second protrusion for connection to the first and second hollow hinge members, and the second protrusion is an electronic device thermally coupled to the first and second hollow hinge members.

9. An electronic device in accordance with claim 7, wherein the first heat diffusion plate is thermally disposed to face the first housing and is thermally coupled to the first heating element.

10. In the first paragraph, the thermal hinge assembly An electronic device further comprising first and second hinge arms each connected to the first and second hollow hinge members so as to be rotatable about the hinge axis.

11. In the fifth paragraph, the center hinge member Center hinge body; a cylindrical opening formed inside the center hinge body; and An electronic device including a fastening member formed on an outer surface of the center hinge body and coupled to the first row diffuser.

12. In the 7th paragraph, the first hollow hinge member First hinge body; A first cylindrical opening formed inside the first hinge body for the heat transfer member to penetrate through; and It further includes a first fastening part formed on the outer surface of the first hinge body and connected to the second row diffuser plate, The above second hollow hinge member Second hinge body; A second cylindrical opening formed inside the second hinge body for the heat transfer member to penetrate through; and An electronic device further comprising a second fastening portion formed on an outer surface of the second hinge body and fastened to the second heat diffusion plate.

13. An electronic device according to claim 1, wherein the heat transfer member is a single cylindrical heat pipe extending from the first hollow hinge member to the second hollow hinge member.

14. In the first paragraph, the heat transfer member A first heat pipe having a cylindrical shape and extending from the first hollow hinge member to the middle of the center hinge member; and An electronic device comprising a second heat pipe extending from the middle of the center hinge member to the second hollow hinge member, the second heat pipe being cylindrical.

15. An electronic device according to claim 1, further comprising an additional heat pipe disposed in the first housing and thermally coupled with the heat transfer member and the heating element.

Images