Sim assembly comprising slidable frame and electronic device comprising same

Abstract

In an embodiment, a printed circuit board may comprise: a substrate plate including a copper foil; wires exposed to a side surface of the substrate plate when the printed circuit board is routed; and a slit formed between the wires such that the wires are divided into at least two regions, in the direction in which the routing proceeds, when the substrate plate is viewed from the side.

Description

A core assembly having a slidable frame and an electronic device including the same

[0001] Various embodiments of the present document relate to a core assembly having a slidable frame and an electronic device including the same.

[0002] An electronic device includes a SIM (Subscriber Identity Module) assembly that supports a SIM card. The SIM card is also referred to as a USIM (Universal Subscriber Identity Module). The SIM assembly includes a tray mounted in a housing of the electronic device and a frame disposed on the tray. At least a portion of the tray may be exposed to the outside. The tray may be mounted in a socket provided inside the electronic device. The frame may support the SIM card.

[0003] In one embodiment, an electronic device includes a housing, and a SIM assembly insertable into the housing while supporting a SIM card, wherein the SIM assembly may include a tray including a tray body inserted into the housing, a pair of tray guides extending from the tray body, and a tray elastic body surrounding the tray body and in close contact with the housing, a frame capable of supporting the SIM card, mounted to the pair of tray guides, and slidably provided along a longitudinal direction of the tray guides, and a socket including a first socket arm hookable to the tray, and a second socket arm provided at a position spaced from the first socket arm and hookable to the frame.

[0004] In one embodiment, the SIM assembly may include a tray including a socket, a tray body inserted into the socket, a pair of tray guides extending from the tray body and capable of being hooked to the socket, and a tray elastic body surrounding the tray body, and a frame capable of supporting a SIM card, mounted on the pair of tray guides, slidably arranged along the length direction of the tray guides, and capable of being hooked to the socket.

[0005] In one embodiment, the SIM assembly has the technical effect of stably maintaining the connection between the SIM card and the printed circuit board (PCB) even when an external shock is applied to the electronic device by directly engaging the frame with the socket while implementing relative movement between the frame supporting the SIM card and the tray supporting the frame and mounted on the socket.

[0006] The effects of the SIM assembly and the electronic device including the same according to various embodiments are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0008] FIG. 2A is a front perspective view of an electronic device according to one embodiment.

[0009] FIG. 2b is a rear perspective view of an electronic device according to one embodiment.

[0010] FIG. 2c is an exploded perspective view of an electronic device according to one embodiment.

[0011] FIG. 3a is a cross-sectional view of an electronic device taken along cut line II of FIG. 2a.

[0012] FIG. 3b is a cross-sectional view of an electronic device according to one embodiment, showing the frame in a position maintained and the tray partially separated from the housing.

[0013] FIG. 3c is a bottom view illustrating the internal appearance of an electronic device according to one embodiment.

[0014] FIG. 3D is a bottom view illustrating the internal appearance of an electronic device according to one embodiment, with the frame maintained in position and the tray partially separated from the housing.

[0015] Figure 3e is a cross-sectional view of the electronic device taken along the cut line II-II of Figure 3c.

[0016] Figure 4 is an exploded perspective view of a core assembly according to one embodiment.

[0017] Figure 5 is a perspective view of a core assembly according to one embodiment.

[0018] Figure 6 is an enlarged partial view of area A of Figure 5.

[0019] Figure 7 is a perspective view of a core assembly according to one embodiment.

[0020] Figure 8 is an enlarged partial view of area B of Figure 7.

[0021] Figure 9 is a perspective view of a core assembly according to one embodiment.

[0022] Figure 10 is an enlarged partial view of area C of Figure 9.

[0023] FIG. 11A is a perspective view of a core assembly according to one embodiment.

[0024] Figure 11b is a partial enlarged view of a core assembly according to one embodiment.

[0025] FIG. 12 is a partial enlarged view of a core assembly according to one embodiment, showing the frame in position and the tray partially separated from the housing.

[0026] Figure 13 is a perspective view of a core assembly according to one embodiment.

[0027] FIG. 14 is a partially enlarged view illustrating a frame arm and a second socket arm according to one embodiment.

[0028] FIG. 15 is a partially enlarged view illustrating a frame arm and a second socket arm according to one embodiment.

[0029] FIG. 16 is a partially enlarged view illustrating a frame arm and a second socket arm according to one embodiment.

[0030] Figure 17 is a partial enlarged view of a core assembly according to one embodiment.

[0031] Figure 18 is a cross-sectional view of an electronic device according to one embodiment.

[0032] FIG. 19 is a cross-sectional view of an electronic device according to one embodiment.

[0033] FIG. 20 is a bottom view illustrating the internal appearance of an electronic device according to one embodiment.

[0034] FIG. 21 is a flowchart illustrating an operation of separating a core assembly according to one embodiment.

[0035] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0036] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a wireless power transmission / reception module (187), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, at least one of these components (e.g., the connection terminal (178)) may be omitted, or one or more other components may be added to the electronic device (101). In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC). The wireless power transmission / reception module (187) can be configured to wirelessly transmit and receive power.

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0059] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0060] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0061] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0062] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0063] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0064]

[0065] Fig. 2a is a front perspective view of an electronic device according to one embodiment. Fig. 2b is a rear perspective view of an electronic device according to one embodiment. Fig. 2c is an exploded perspective view of an electronic device according to one embodiment. Fig. 2c is illustrated with some internal components omitted for convenience of illustration, and the internal components of the electronic device are not limited to those illustrated in Fig. 2c.

[0066] Referring to FIGS. 2A, 2B, and 2C, an electronic device (201) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210), a support member (220), a display (230), a battery (240), and a printed circuit board (250).

[0067] In one embodiment, the housing (210) may form at least a portion of the exterior of the electronic device (201). The housing (210) may form a front surface (210a) (e.g., a first surface), a rear surface (210b) (e.g., a second surface), and a side surface (210c) (e.g., a third surface) enclosing an interior space between the front surface (210a) and the rear surface (210b). For example, the housing (210) may include a first plate (211) (e.g., a front plate), a second plate (212) (e.g., a rear plate), and a side member (213) (e.g., a side bezel structure).

[0068] In one embodiment, the front surface (210a) may be formed by a first plate (211) that is at least partially substantially transparent. For example, the first plate (211) may comprise a glass plate or a polymer plate including at least one coating layer. In one embodiment, the back surface (210b) may be formed by a second plate (212) that is substantially opaque. For example, the second plate (212) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination thereof. The side surface (210c) may be formed by a side member (213) that is joined to the first plate (211) and the second plate (212) and includes a metal and / or a polymer. In one embodiment, the second plate (212) and the side member (213) may be formed seamlessly and integrally. In one embodiment, the second plate (212) and the side member (213) may be formed of substantially the same material (e.g., aluminum).

[0069] In one embodiment, the side member (213) can surround at least a portion of the interior space between the front (210a) and the rear (210b). A support member (220) can be arranged in the interior space of the housing (210). For example, the support member (220) can be connected to the side member (213) or can be formed integrally with the side member (213). The support member (220) can form a space for arranging components of the electronic device (201). For example, the support member (220) can connect edges of the first plate (211) and the second plate (212) and surround the space between the first plate (211) and the second plate (212). For example, a display (230) can be coupled to one surface (e.g., a surface in the +z direction) of the support member (220). However, this is an example, and the number, position, and / or shape of the support member (220) are not limited thereto.

[0070] In one embodiment, the electronic device (201) may include a display (230) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (230) may be positioned on the front surface (210a). In one embodiment, the display (230) may be visible through at least a portion of the first plate (211). In one embodiment, the display (230) may have a shape substantially the same as an outer rim shape of the first plate (211). In some embodiments, an edge of the display (230) may substantially coincide with an outer rim of the first plate (211).

[0071] In one embodiment, a battery (240) (e.g., battery (189) of FIG. 1) may supply power to various electronic components included in an electronic device (201). The battery (240) may be supported by being seated in a space formed by a support member (220). For example, the battery (240) may be placed in a first space (221) formed by the support member (220).

[0072] In one embodiment, various electronic components for implementing the functions of the electronic device (201) may be arranged on the printed circuit board (250). For example, the printed circuit board (250) may include a first printed circuit board (251) and a second printed circuit board (252). The first printed circuit board (251) and the second printed circuit board (252) may be electrically connected to each other. For example, the first printed circuit board (251) may be arranged in a second space (222) formed by the support member (220). For example, the second printed circuit board (252) may be arranged in a third space (223) formed by the support member (220). The side portion of the printed circuit board (250) may be positioned spaced apart from the metal portion of the other component (e.g., the support member (220) and / or the housing (210)) so that the side portion of the printed circuit board (250) does not come into unnecessary contact with the metal portion of the other component (e.g., the support member (220) and / or the housing (210)). However, this is merely exemplary, and the number, position, and / or shape of the printed circuit board (250) are not limited thereto.

[0073] In one embodiment, the SIM assembly (200) can be inserted into a housing (210). The SIM assembly (200) can support a SIM card. The SIM card supported by the SIM assembly (200) can be physically and electrically connected to a printed circuit board provided inside the housing (210).

[0074] FIG. 3A is a cross-sectional view of an electronic device taken along the cut line II of FIG. 2A. FIG. 3B is a cross-sectional view of an electronic device according to one embodiment, showing a state in which a frame is maintained in position and a tray is partially separated from a housing. FIG. 3C is a bottom view showing the interior of an electronic device according to one embodiment. FIG. 3D is a bottom view showing the interior of an electronic device according to one embodiment, showing a state in which a frame is maintained in position and a tray is partially separated from a housing. FIG. 3E is a cross-sectional view of an electronic device taken along the cut line II-II of FIG. 3C.

[0075] Referring to FIGS. 3A to 3E, an electronic device (301) according to one embodiment (e.g., the electronic device (101) of FIG. 1, the electronic device (201) of FIG. 2C) may include a housing (390) (e.g., the housing (210) of FIG. 2C), a support member (380) (e.g., the support member (220) of FIG. 2C), a printed circuit board (370), a SIM card (360), a lever (340), and a SIM assembly (300) (e.g., the SIM assembly (200) of FIG. 2C).

[0076] The support member (380) can be provided in multiple pieces at intervals in the z-axis direction.

[0077] A printed circuit board (370) may be placed on a support member (380). For example, a plurality of printed circuit boards (370) may be provided, and each of the plurality of printed circuit boards (370) may be placed on a support member (380). One printed circuit board may face the SIM card in the +z direction. The printed circuit board may have a terminal protruding in the +z direction. Another printed circuit board may face the SIM card in the -z direction. The printed circuit board may have a terminal protruding in the -z direction.

[0078] The SIM card (360) can be inserted into the housing (390) while being supported by the SIM assembly (300). The SIM card (360) can be physically and electrically connected to the printed circuit board (370).

[0079] The core assembly (300) may include a plurality of components that are detachably assembled from each other. The core assembly (300) may include a tray (310), a frame (320), and a socket (330). The tray (310) and the frame (320) may be connected to enable relative movement. For example, the frame (320) may be slidable relative to the tray (310).

[0080] The socket (330) may be positioned in a fixed state within the housing (390). For example, the socket (330) may be fixed to the support member (380). The socket (330) may have a space for accommodating the tray (310). The socket (330) may include a terminal (330a) that is in contact with the SIM card (360). The terminal (330a) may be provided in multiple pieces. The terminal (330a) may be formed to protrude toward the inner space from the socket housing that constitutes the outer appearance of the socket (330). The terminal (330a) may have elasticity. The terminal (330a) may be maintained in an elastically deformed state while in contact with the SIM card (360). For example, the SIM card (360) may include a connection portion (360a) that is connected to the terminal (330a) of the socket (330).

[0081] The socket (330) may have a structure that can be hooked onto each of the tray (310) and the frame (320). The socket (330) may independently support the tray (310) and the frame (320) through different configurations. For example, even if the hooked state of the socket (330) and the tray (310) is temporarily released, the hooked state of the socket (330) and the frame (320) may be maintained.

[0082] As the socket (330) individually supports the tray (310) and the frame (320), the electronic device (301) can have various technical effects.

[0083] The socket (330) can support the frame (320) relatively strongly. In other words, the socket (330) can support the tray (310) relatively weakly. Even if an external impact is applied to the electronic device (301) and at least a portion of the tray (310) is dislodged from the housing (390), the frame (320) can maintain a normally coupled position. According to this structure, even if an external impact is applied, the SIM card (360) and the printed circuit board (370) can be maintained in an aligned state.

[0084] The tray (310) is slidable along the housing (390). The tray (310) may include a tray elastic body (317) to block or reduce the ingress of water or foreign substances from the outside through the gap between the tray (310) and the housing (390) when the core assembly (300) is fully coupled to the housing (390).

[0085] When the humidity inside the electronic device (301) is relatively high compared to the outside, water droplets may form inside the electronic device (301). In this case, when the frame (320) is fixed in position and only the tray (310) is separated from the housing (390), the moisture inside the electronic device (301) is discharged to the outside, so that the water droplets can be removed.

[0086] The tray (310) is slidable along the housing (390) while supporting the frame (320). The tray (310) can be caught in the socket (330). When the core assembly (300) is completely coupled to the housing (390), the tray (310) can be temporarily fixed to the socket (330). When an external force is applied to the tray (310), the caught state of the socket (330) and the tray (310) is released, and a portion of the tray (310) can be detached to the outside of the housing (390).

[0087] The frame (320) is slidable along the tray (310) while supporting the SIM card (360). The frame (320) can be caught in the socket (330). When the SIM assembly (300) is completely coupled to the housing (390), the frame (320) can be temporarily fixed to the socket (330). When an external force is applied to the tray (310), the caught state of the socket (330) and the tray (310) is released, and a portion of the tray (310) can be detached to the outside of the housing (390). While the tray (310) is detached, the frame (320) is provided to be slidable relative to the tray (310), and thus, its position can be maintained by being supported by the socket (330).

[0088] The frame (320) is slidable relative to the tray (310) only within the sliding region. For example, when the length of the sliding region is 10, if the distance by which the frame (320) is separated from the housing (390) exceeds 10, the frame (320) can be caught by the tray (310) and move integrally with it. For example, if the tray (310) is completely separated from the housing (390), the frame (320) can be caught by the tray (310) and thus separated from the housing (390) together with the tray (310).

[0089] A user can operate the lever (340) by inserting a pin through a housing hole (390a) provided in the housing (390). For example, the pin can push the lever (340) by passing through a tray hole (310a) provided in the tray (310), a housing hole (390a) provided in the housing (390), and a support member hole (380a) provided in the support member (380). The lever (340) can receive force from the pin and transmit the force to the tray (310). When the user applies force in the +y direction, the lever (340) can change the direction of the force and transmit the force to the tray (310) in the -y direction. When an external force is applied to the tray (310), the tray (310) can be released from the socket (330).

[0090] The electronic device (301) may have a waterproof structure. For example, the electronic device (301) may include an air vent (351) formed in a housing (390) and a support member (380), and a membrane (352) covering the air vent (351). The air vent (351) may be formed to penetrate the housing (390) and the support member (380). The membrane (352) may close an opening of the air vent (351) that opens into the interior of the housing (390). The membrane (352) may allow air to pass through but not allow moisture to pass through.

[0091] The frame (320) can support the SIM card in various ways. For example, the frame (320) can support the SIM card on only one side, or can support a pair of SIM cards on both sides as illustrated in the drawing. In one embodiment, the frame (320) can support multiple SIM cards on one side, or can support different cards. The frame (320) can be manufactured in various shapes. The tray (310) can be manufactured in a different shape corresponding to the shape of the frame (320).

[0092] FIG. 4 is an exploded perspective view of a shim assembly according to one embodiment. FIG. 5 is a perspective view of a shim assembly according to one embodiment. FIG. 6 is a partially enlarged view of area A of FIG. 5. FIG. 7 is a perspective view of a shim assembly according to one embodiment. FIG. 8 is a partially enlarged view of area B of FIG. 7. FIG. 9 is a perspective view of a shim assembly according to one embodiment. FIG. 10 is a partially enlarged view of area C of FIG. 9. FIG. 11a is a perspective view of a shim assembly according to one embodiment. FIG. 11b is a partially enlarged view of a shim assembly according to one embodiment. FIG. 12 is a partially enlarged view of a shim assembly according to one embodiment, in which the frame maintains its position and the tray is partially separated from the housing.

[0093] Referring to FIGS. 4 to 12, the core assembly (400) (e.g., the core assembly (300) of FIG. 3) may include a tray (410), a frame (420), and a socket (430). The tray (410) and the frame (420) are capable of relative movement. For example, the frame (420) may slide along the tray (410).

[0094] The tray (410) may include a tray body (411), a tray guide (412), a tray arm (415), a tray elastic body (417), a protrusion receiving portion (418), and a tray head (419).

[0095] The tray body (411) may have a plate shape.

[0096] The tray guide (412) extends from the tray body (411) and can be caught in the socket (430). The tray guide (412) may be provided as a pair. The pair of tray guides (412) may be provided spaced apart from each other. Each of the pair of tray guides (412) may extend from the tray body (411) in the y-axis direction. The pair of tray guides (412) may be spaced apart from each other in the x-axis direction. When an external force is applied, the pair of tray guides (412) may be elastically deformed so that both ends move away from each other temporarily. For example, while the frame (420) is coupled to the tray (410), the pair of tray guides (412) may be temporarily spread apart. In a state where the frame (420) is coupled to the tray (410), the pair of tray guides (412) may be restored to their original shape. In this application, the fact that the frame (420) is coupled to the tray (410) refers to a state in which the frame arm (425) is accommodated in the slot (4124) of the tray guide (412). In a state in which the frame (420) is coupled to the tray (410), a pair of tray guides (412) may be parallel to each other. The pair of tray guides (412) may include a first tray guide (412-1) and a second tray guide (412-2). Hereinafter, the description will be based on the first tray guide (412-1), and the first tray guide (412-1) will be referred to as the tray guide (412).

[0097] The tray guide (412) may include a guide body (4121), guide ribs (4122a, 4122b), a socket receiving portion (4123), and a slot (4124).

[0098] The guide body (4121) can cover the side surface of the frame (420). For example, the tray body (411) of a pair of tray guides (412) can cover the left and right sides of the frame (420). Here, the side surface of the frame (420) means a surface facing the x-axis direction among the outer surfaces of the frame (420).

[0099] The guide ribs (4122a, 4122b) may be formed to protrude from the guide body (4121) and support the frame (420). For example, the guide ribs (4122a, 4122b) may be provided as a pair. The pair of guide ribs (4122a, 4122b) may be provided on opposite sides with respect to the frame (420). The pair of guide ribs (4122a, 4122b) may include a first guide rib (4122a) and a second guide rib (4122b). The first guide rib (4122a) and the second guide rib (4122b) may have the same thickness as the frame (420). Here, the thickness of the frame (420) refers to the width in the z-axis direction.

[0100] The socket receiving portion (4123) is formed to be recessed into the guide body (4121) and can receive a portion of the socket (430). The socket receiving portion (4123) can be formed to be recessed from the outer surface of the guide body (4121). The socket receiving portion (4123) can receive a first socket arm (431) and a second socket arm (432). When the first socket arm (431) and the second socket arm (432) are received in the socket receiving portion (4123), the first socket arm (431) and the second socket arm (432) may not be deformed. For example, when the first socket arm (431) and the second socket arm (432) are not received in the socket receiving portion (4123) and are pressed by the tray (410) and the frame (420), the first socket arm (431) and the second socket arm (432) can be elastically deformed.

[0101] A slot (4124) is formed through the socket receiving portion (4123) and can accommodate at least a portion of the frame (420). The slot (4124) can accommodate a frame arm (425) of the frame (420). Since the frame arm (425) is exposed to the outside of the tray guide (412) through the slot (4124), the frame arm (425) can be directly supported by the socket (430).

[0102] The tray arm (415) may be formed to protrude outwardly from the tray body (411). The tray arm (415) may be caught on the socket (430). For example, the tray arm (415) may be caught on the first socket arm (431). When the shim assembly (400) is coupled to the housing (e.g., the housing (390) of FIG. 3), the tray arm (415) may be fixed in position while caught on the first socket arm (415). When an external force is applied, the tray arm (415) may press the first socket arm (431) to elastically deform it. When the first socket arm (415) elastically deforms, the caught state of the tray arm (415) and the first socket arm (431) may be released.

[0103] The tray elastic body (417) can surround the tray body (411). The tray elastic body (417) can close the gap between the tray (410) and the housing (e.g., the housing (390) of FIG. 3). The tray elastic body (417) can include an O-ring, a cushion, a pad, or the like.

[0104] The projection receiving portion (418) can receive at least a portion of the frame (420). For example, the projection receiving portion (418) can be an engraved embossing. For example, the projection receiving portion (418) can be a hole. The projection receiving portion (418) can receive a frame projection (428) provided on the frame (420). The frame projection (428) can be a positive embossing. When the tray (410) and the frame (420) are coupled, the frame projection (428) is provided in a state of being inserted into the projection receiving portion (418), so that the coupling stability of the tray (410) and the frame (420) can be improved.

[0105] The tray head (419) can be connected to the tray body (411). The tray head (419) can be provided on the opposite side of the tray guide (412) with respect to the tray body (411). The tray head (419) can be provided with a tray hole (419a). The length of the tray head (419) can be formed to be longer than the tray body (411).

[0106] The frame (420) may include a frame body (421), a frame arm (425), a frame rib (427), a frame protrusion (428), and a pressure member (429).

[0107] The frame body (421) may have a plate shape. The frame body (421) may support a SIM card (460). Since the frame (420) is slidable relative to the tray (410), when the position of the frame (420) is fixed, the position of the SIM card (460) may be fixed.

[0108] The frame arm (425) may be formed to protrude from the frame body (421). For example, the frame arm (425) may be formed to protrude outward from the frame body (421). The frame arm (425) may be provided as a pair. The pair of frame arms (425) may be provided on the left and right sides of the frame body (421), respectively. For example, one frame arm of the pair of frame arms (425) may be formed on a surface of the frame body (421) facing the -x direction. The other frame arm of the pair of frame arms (425) may be formed on a surface of the frame body (421) facing the +x direction.

[0109] The frame arm (425) is slidable while being accommodated in the slot (4124). The slidable range of the frame arm (425) can be set by the length of the slot (4124). The frame arm (425) is slidable along the slot (4124) until it is caught by the guide body (4121).

[0110] One end of the frame arm (425) can be hooked to the second socket arm (432). The -y direction end of the frame arm (425) can be hooked to the second socket arm (432). The coupling force of the frame arm (425) and the second socket arm (432) is relatively strong compared to the coupling force of the tray arm (415) and the first socket arm (431). For example, the second socket arm (432) may have a thickness greater than that of the first socket arm (431). For example, with respect to the z-axis direction, the thickness of the second socket arm (432) may be greater than that of the first socket arm (431). For example, with respect to the x-axis direction, the thickness of the second socket arm (432) may be greater than that of the first socket arm (431). For example, the second socket arm (432) may have a higher elastic modulus than the first socket arm (431). For example, the second socket arm (432) may include a material that is stiffer than the first socket arm (431). According to this structure, even if the tray arm (415) and the first socket arm (431) are released from connection due to an external impact and the tray (410) moves relative to the socket (430), the frame (420) can remain connected to the socket (430).

[0111] The other end of the frame arm (425) can be caught on the guide body (4121). When the tray (410) is completely detached from the housing, the guide body (4121) can apply force to the frame arm (425) to release the coupling between the frame arm (425) and the second socket arm (432).

[0112] The frame rib (427) may be formed to protrude from the frame body (421). The frame rib (427) may be formed to protrude in the z-axis direction. The frame rib (427) may be provided along the edge of the frame body (421). The frame rib (427) may surround a SIM card (460) placed in the frame body (421).

[0113] The frame protrusion (428) is formed to protrude from the frame body (421) and can be inserted into the tray guide (412).

[0114] The pressure member (429) may extend from the frame rib (427). The pressure member (429) may be provided in a state in which it protrudes into an area surrounded by the frame rib (427). The pressure member (429) may be elastically deformable. When the SIM card (460) is placed on the frame body (421), the pressure member (429) may apply pressure to the edge of the SIM card (460), thereby improving the bonding strength between the SIM card (460) and the frame (420). A plurality of pressure members (429) may be provided along the longitudinal direction of the frame rib (427).

[0115] The socket (430) may include a socket body (433), a first socket arm (431) and a second socket arm (432) connected to the socket body (433). The first socket arm (431) may be hooked to a tray arm (415), and the second socket arm (432) may be hooked to a frame arm (425). The socket body (433) may be placed on a support member (e.g., a support member (380) of FIG. 3A).

[0116] Figure 13 is a perspective view of a core assembly according to one embodiment.

[0117] Referring to FIG. 13, the SIM assembly (500) may include a frame (520) that supports a plurality of SIM cards (560). The plurality of SIM cards (560) may include a first SIM card (561) and a second SIM card (562). The first SIM card (561) and the second SIM card (562) may be arranged side by side. The frame (520) may support at least one SIM card (560) on a surface facing the +z direction, as illustrated in the drawing, and may also support at least one SIM card on a surface facing the -z direction. The frame (520) may be manufactured in various shapes. The frame (520) may be manufactured separately from the tray. The frame (520) may be slidably coupled to the tray.

[0118] FIG. 14 is a partially enlarged view illustrating a frame arm and a second socket arm according to one embodiment.

[0119] Referring to FIG. 14, a frame arm (625) may be formed to protrude from a frame body (621). The frame arm (625) may be hooked to a second socket arm (632). One end of the frame arm (625) may be hooked to the second socket arm (632), and the other end may be hooked to a guide body (e.g., the guide body (4121) of FIG. 4). One end and the other end of the frame arm (625) may be provided parallel to the x-axis, respectively.

[0120] FIG. 15 is a partially enlarged view illustrating a frame arm and a second socket arm according to one embodiment.

[0121] Referring to FIG. 15, a frame arm (725) may be formed to protrude from a frame body (721). The frame arm (725) may be hooked to a second socket arm (732). One end of the frame arm (725) may be hooked to the second socket arm (732), and the other end may be hooked to a guide body (e.g., the guide body (4121) of FIG. 4). One end and the other end of the frame arm (725) may each have an inclined surface inclined with respect to the x-axis.

[0122] FIG. 16 is a partially enlarged view illustrating a frame arm and a second socket arm according to one embodiment.

[0123] Referring to Fig. 16, a frame arm (825) may be formed to protrude from a frame body (821). The frame arm (825) may be hooked to a second socket arm (832). One end of the frame arm (825) may be hooked to the second socket arm (832), and the other end may be hooked to a guide body (e.g., the guide body (4121) of Fig. 4). The other end of the frame arm (825) may have an open shape.

[0124] Figure 17 is a partial enlarged view of a core assembly according to one embodiment.

[0125] Referring to FIG. 17, the socket may include a first socket arm (931) that can be hooked to a tray arm (915), a second socket arm (932) that can be hooked to a frame arm, a socket body (433) that supports the first socket arm (931) and the second socket arm (932), and a socket hole (934) that is formed through the socket body (433). The socket hole (934) may be formed on a portion where the first socket arm (931) and the socket body (933) are connected and / or on a portion where the second socket arm (932) and the socket body (933) are connected. By adjusting the size and / or position of the hole, the elastic coefficients of the first socket arm (931) and the second socket arm (932) may be adjusted.

[0126] Figure 18 is a cross-sectional view of an electronic device according to one embodiment.

[0127] Referring to FIG. 18, the electronic device may include a lever (1040) for moving a tray (1020). The lever (1040) may include a lever head (1041) that can be contacted by a pin entering from the outside, and a lever body (1042) that extends from the lever head (1041). The electronic device may include a rotating body (R1) that can rotate around a rotation axis (A1) and can rotate by receiving force from the lever (1040). The rotating body (R1) can pressurize a tray guide adjacent to the lever (1040) among a pair of tray guides (e.g., the tray guide (412) of FIG. 4). The tray (1020) may be provided to be able to move freely within the socket. The tray (1020) pressed by the rotating body (R1) can move in the -y direction.

[0128] FIG. 19 is a cross-sectional view of an electronic device according to one embodiment.

[0129] Referring to FIG. 19, the electronic device may include a lever (1140) for moving a tray (1120). The lever (1140) may include a lever head (1141) that can be contacted by a pin entering from the outside, and a lever body (1142) that extends from the lever head (1141). The electronic device may include a rotating body (R2) that can rotate around a rotation axis (A2) and can rotate by receiving force from the lever (1140). The rotating body (R2) can pressurize a tray guide that is relatively spaced apart from the lever (1140) among a pair of tray guides (e.g., the tray guide (412) of FIG. 4). The tray (1120) may be provided to be able to move freely within the socket. The tray (1020) pressed by the rotating body (R2) can move in the -y direction.

[0130] FIG. 20 is a bottom view illustrating the internal appearance of an electronic device according to one embodiment.

[0131] Referring to FIG. 20, the electronic device may further include a motor (1249) for automatically moving the tray (1220). The electronic device may control the motor (1249) through a control unit to move the tray (1220). For example, when condensation occurs inside the electronic device, the motor (1249) may move the tray (1220). The tray (1220) may also be manually operated through a lever (1240).

[0132] FIG. 21 is a flowchart illustrating an operation of separating a core assembly according to one embodiment.

[0133] Referring to FIG. 21, the method of separating the SIM assembly may include a step of sensing camera image quality (S110), a step of comparing transparency with a set value (S120), a step of activating an opaque state on the screen (S130), a step of checking whether a user has input (S130), a step of operating a motor (S150), a step of opening a tray (S160), a step of comparing transparency with a set value again (S170), a step of operating a motor (S180), and a step of closing the tray (S190).

[0134] In step (S110), the control unit can sense the camera image quality. For example, the control unit can calculate the transparency value of the screen output through the camera as a percentile value.

[0135] In step (S120), the control unit may compare the transparency with a set value. For example, the set value may be 70. If the actual calculated transparency value is less than the set value, the control unit may determine that the current state is abnormal.

[0136] In step (S130), the control unit may activate an opaque state on the display. For example, a video image indicating that a portion of the display is opaque may be output.

[0137] In step (S130), the control unit can check whether there is input from the user.

[0138] In step (S150), the control unit can operate the motor when detecting a user's input signal.

[0139] In step (S160), the tray can be opened. In this case, the opening of the tray means that the tray is at least partially separated from the housing, and the tray elastic body is separated from the housing.

[0140] In step (S170), the control unit can compare the transparency with the set value again.

[0141] In step (S180), if the control unit determines that the opaque state has been resolved, the motor can be operated.

[0142] At step (S190), the tray can be closed. In this case, the tray being closed means that the tray is fully coupled to the housing.

[0143] According to one embodiment, an electronic device (401) is an electronic device including a housing (490) and a SIM assembly (400) that can be inserted into the interior of the housing (490) while supporting a SIM card (460), wherein the SIM assembly (400) may include a tray (410) that is inserted into the housing, a pair of tray guides (412) extending from the tray body, and a tray elastic body (417) that surrounds the tray body and is in close contact with the housing, a frame (420) that can support the SIM card, is mounted to the pair of tray guides, and is provided to be slidable along the longitudinal direction of the tray guides, and a socket (430) that includes a first socket arm that can be hooked to the tray, and a second socket arm (432) that is provided at a position spaced from the first socket arm (431) and can be hooked to the frame.

[0144] In one embodiment, the first socket arm (431) and the second socket arm (432) are independently elastically deformable.

[0145] In one embodiment, the thickness of the first socket arm (431) may be smaller than the thickness of the second socket arm (432) in a direction perpendicular to the longitudinal direction of the tray guide.

[0146] In one embodiment, the tray guide (412) may include a guide body (4121) that covers a side of the frame, a guide rib (4122a, 4122b) that protrudes from the guide body and supports the frame, a socket receiving portion (4123) that is recessed into the guide body and receives the first socket arm, and a slot (4124) that is formed through the socket receiving portion and is capable of receiving at least a portion of the frame.

[0147] In one embodiment, the slot (4124) may set a slidable area of ​​the frame.

[0148] In one embodiment, the tray (410) may further include a tray arm (415) that protrudes from the socket receiving portion and is capable of being hooked onto the first socket arm.

[0149] In one embodiment, the guide ribs (4122a, 4122b) are provided as a pair, and the pair of guide ribs may be provided on opposite sides with respect to the frame.

[0150] In one embodiment, the frame (420) may include a frame body (421) supported by the guide rib, and a frame arm (425) protruding from the frame body and received by the slot, and capable of being hooked to the second socket arm.

[0151] In one embodiment, the frame (420) may further include a frame rib (427) protruding from the frame body (421); and a pressure member (429) extending from the frame rib (427).

[0152] In one embodiment, the frame arm (425) is capable of being caught on the tray guide.

[0153] In one embodiment, the thickness of the frame arm may be greater than the thickness of the tray arm in a direction perpendicular to the longitudinal direction of the tray guide.

[0154] In one embodiment, the frame (420) may further include a frame protrusion (428) that protrudes from the frame body and is inserted into the guide body.

[0155] In one embodiment, with the frame protrusion (428) inserted into the guide body, the tray arm and the frame arm may be arranged to overlap each other in a direction perpendicular to the longitudinal direction of the tray guide (412).

[0156] In one embodiment, the tray (410) is movable relative to the socket while the frame (420) is fixed in position while mounted to the socket.

[0157] In one embodiment, the ends of each of the pair of tray guides (412) are deformable to move away from each other by an external force.

[0158] According to one embodiment, the SIM assembly may include a tray (410) including a socket (430), a tray body (411) inserted into the socket, a pair of tray guides (412) extending from the tray body and capable of being hooked to the socket, and a tray elastic body (417) surrounding the tray body, and a frame (420) capable of supporting a SIM card, mounted on the pair of tray guides, slidably arranged along the length direction of the tray guides, and capable of being hooked to the socket.

[0159] In one embodiment, the socket (430) may include a first socket arm (431) that is hookable to the tray and elastically deformable, and a second socket arm (432) that is hookable to the frame and is provided at a position spaced from the first socket arm and elastically deformable independently of the first socket arm.

[0160] In one embodiment, the tray guide (412) may include a guide body (4121) covering a side of the frame, a socket receiving portion (4123) formed recessed in the guide body and receiving the first socket arm, and a slot (4124) formed through the socket receiving portion and capable of receiving at least a portion of the frame.

[0161] In one embodiment, the frame (420) may include a frame body (421) supported by the tray guide, and a frame arm (425) protruding from the frame body and capable of passing through the tray guide and being hooked to the second socket arm.

[0162] According to one embodiment, an electronic device is an electronic device including a housing and a SIM assembly that can be inserted into the housing while supporting a SIM card, wherein the SIM assembly (400) includes a tray (410) that includes a tray body (411) that is inserted into the housing, a pair of tray guides (412) extending from the tray body, and a tray elastic body (417) that surrounds the tray body and is in close contact with the housing, a frame (420) that can support the SIM card, is mounted on the pair of tray guides, and is provided to be slidable along a longitudinal direction of the tray guides, and a socket (430) that includes a first socket arm (431) that is provided inside the housing and can be hooked to the tray, and a second socket arm (432) that is provided at a position spaced from the first socket arm and can be hooked to the frame, wherein the first socket arm (431) and the second socket arm (432) are independently elastically deformable, and the frame (420) is fixed to the socket (430). While the tray (410) is fixed in position in the mounted state, it is movable with respect to the socket (430).

Claims

1. In an electronic device (401) including a housing (490) and a SIM assembly (400) that can be inserted into the interior of the housing (490) while supporting a SIM card (460), The above core assembly (400) is A tray (410) including a tray body (411) inserted into the housing, a pair of tray guides (412) extending from the tray body, and a tray elastic body (417) surrounding the tray body and in close contact with the housing; A frame (420) capable of supporting the SIM card, mounted on the pair of tray guides, and slidably arranged along the length direction of the tray guides; and An electronic device (401) comprising a socket (430) including a first socket arm (431) that can be hooked onto the tray, and a second socket arm (432) that is provided at a position spaced from the first socket arm (431) and can be hooked onto the frame.

2. In paragraph 1, An electronic device wherein the first socket arm (431) and the second socket arm (432) are independently elastically deformable.

3. In paragraph 1 or 2, An electronic device, wherein the thickness of the first socket arm (431) is smaller than the thickness of the second socket arm (432) in a direction perpendicular to the longitudinal direction of the tray guide.

4. In any one of paragraphs 1 to 3, The above tray guide (412) is A guide body (4121) covering the side of the above frame; A guide rib (4122a, 4122b) protruding from the above guide body and supporting the frame; A socket receiving portion (4123) formed sunken into the above guide body and receiving the first socket arm; and An electronic device comprising a slot (4124) formed through the socket receiving portion and capable of accommodating at least a portion of the frame.

5. In any one of paragraphs 1 to 4, The above slot (4124) is an electronic device that sets a slidable area of ​​the frame.

6. In any one of paragraphs 1 to 5, The above tray (410) is An electronic device further comprising a tray arm (415) protruding from the socket receiving portion and capable of being hooked onto the first socket arm.

7. In any one of paragraphs 1 to 6, An electronic device in which the above guide ribs (4122a, 4122b) are provided as a pair, and the pair of guide ribs are provided on opposite sides with respect to the frame.

8. In any one of paragraphs 1 to 7, The above frame (420) is A frame body (421) supported by the above guide ribs; and An electronic device comprising a frame arm (425) protruding from the frame body and received by the slot, and capable of being hooked onto the second socket arm.

9. In any one of paragraphs 1 to 8, The above frame (420) is A frame rib (427) formed by protruding from the above frame body (421); and An electronic device further comprising a pressure member (429) extending from the frame rib (427).

10. In any one of paragraphs 1 to 9, The above frame arm (425) is an electronic device that can be caught on the tray guide.

11. In any one of paragraphs 1 to 10, An electronic device wherein, based on a direction perpendicular to the longitudinal direction of the tray guide, the thickness of the frame arm is greater than the thickness of the tray arm.

12. In any one of paragraphs 1 to 11, The above frame (420) is An electronic device further comprising a frame protrusion (428) formed protruding from the frame body and inserted into the guide body.

13. In any one of paragraphs 1 to 12, An electronic device in which the tray arm and the frame arm are arranged to overlap each other in a direction perpendicular to the longitudinal direction of the tray guide (412) while the frame protrusion (428) is inserted into the guide body.

14. In any one of paragraphs 1 to 13, An electronic device in which the tray (410) is movable relative to the socket while the frame (420) is fixed in position while being mounted on the socket.

15. In any one of paragraphs 1 to 14, An electronic device in which each end of the above pair of tray guides (412) can be deformed to move away from each other by an external force.

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