Method for manufacturing a framed solar module or a framed solar array, frame module and framed solar module or framed solar array

Abstract

The invention relates to a method for manufacturing a framed solar module composed of solar cells or a framed solar array composed of solar modules. The method comprises: providing a layer stack; providing a frame module; and producing the framed solar module or solar array from the layer stack and the frame module, wherein the layer stack and the frame module are joined together and a frame is produced. In the process, electrically conductive contacting contacts of the frame module penetrate the layer stack at least up to electrically conductive contact faces of at least two strings of solar cells or solar modules and electrically contact these contact faces. As a result, electrical contact is formed between the at least two strings and an electrical circuit contained in the frame module. The invention also relates to a frame module for manufacturing a framed solar module or a framed solar array.

Description

[0001] Method for producing a framed solar module or a framed solar array, frame module and framed solar module or framed solar array

[0002] The invention relates to a method for producing a framed solar module or a framed solar array, a framed module and a framed solar module or a framed solar array.

[0003] With the increasing scarcity of fossil fuels, the demand for technologies for the use of renewable energy, such as photovoltaic systems, also known as photovoltaic solar systems or solar systems for short, is increasing. Solar modules typically comprise a large number of solar cells, while solar systems have a large number of solar modules that can be arranged in a solar array. The production of solar modules and systems is time-consuming and labor-intensive. In particular, encapsulation and electrical contacting must be carefully executed to achieve high weather resistance and dielectric strength, thus ensuring a long service life of the solar modules and solar systems.

[0004] A solar module typically contains several solar cells electrically connected in series or parallel to form so-called solar cell strings. These solar cell strings can be equipped with current collectors, also called cross-connectors or interconnectors, at the beginning and end of each solar cell string, via which several of the solar cell strings can be electrically connected or interconnected to form a solar module. Similar to solar cells, solar modules can also be electrically connected in parallel or in series to form so-called module strings, and several such module strings can be electrically connected or interconnected to form solar arrays via end-side current collectors.

[0005] A junction box is provided for the external electrical connection of solar modules or solar arrays. This junction box is usually located on the back of the solar module or array to avoid shading. During the manufacture of the solar module or array, the interconnected strings are electrically connected to the junction box via contact conductors. However, connecting the junction box is very complex and usually only possible manually.

[0006] Before encapsulation and / or glazing of the solar module or array, the contact conductors must be routed to a connection location on the rear of the junction box. After encapsulation and / or glazing, this connection location must be located on the rear of the solar module or array, and the solar module or array must be opened at the connection location. The contact conductors must then be routed through the created opening and electrically connected to the contacts of the junction box.

[0007] DE 102009 034 656 A1 discloses an assembly aid that facilitates the passage of the contacting conductors through the encapsulation layer and the backside layer. However, this requires several steps, particularly positioning processes. The encapsulation layer and the backside layer of the solar module or array must be prefabricated with openings at the connection position. The assembly aid must be correctly positioned on the contacting conductors before encapsulation or glazing. The encapsulation layer and the backside layer must then be positioned with their openings over the assembly aid, the contacting conductors must be guided through the openings using the assembly aid, and the lamination process must be carried out. To use the assembly aid, the openings must have a larger cross-section than the contacting conductors.Therefore, after the contact conductors have been inserted, the openings must also be sealed in a separate step to ensure the contact conductors are secured and strain-relieved, as well as to protect them from the elements. While the installation aid can automate the connection of the junction box, it is still very time-consuming and error-prone.

[0008] The object of the invention is therefore to overcome the disadvantages of the prior art and to provide a method with which framed solar modules or arrays can be efficiently manufactured, particularly with regard to electrical contacting, framing, or sealing. The invention further relates to a frame module for the production of a framed solar module or a framed solar array, as well as to a framed solar module or a framed solar array.

[0009] According to the invention, the object is achieved by a method according to claim 1 and a frame module according to claim 14. Advantageous embodiments of the invention are specified in the dependent claims.

[0010] The process can be used to manufacture solar modules from solar cells or solar arrays from solar modules. Solar cells can be, for example, silicon-based solar cells, gallium arsenide solar cells, cadmium telluride solar cells, CIS or CIGS solar cells, or even organic solar cells. If the process is used to manufacture solar arrays to create a solar array from several solar modules and thus a solar system, the solar modules can be constructed from the aforementioned solar cells, for example.

[0011] In the method for producing a framed solar module from solar cells or a framed solar array from solar modules, a laminated layer stack is provided comprising a front-side layer, a first encapsulation layer, at least two strings of solar cells or at least two strings of solar modules, a second encapsulation layer, and a back-side layer. The solar cells or solar modules are each electrically connected in series or electrically parallel to one another in the at least two strings by an electrically conductive conductor structure, hereinafter referred to as the conductor structure. On each of the at least two strings, an electrically conductive contact surface, hereinafter referred to as the contact surfaces, is formed at the end of the conductor structure.The laminated layer stack is also laminated such that the at least two strings and the conductor structures are surrounded, i.e. encapsulated, by the first encapsulation layer and the second encapsulation layer in the region in which they electrically connect the solar cells or solar modules to one another. The conductor structures at the ends of the at least two strings and the contact surfaces can be surrounded by the first encapsulation layer and the second encapsulation layer or can be arranged at least partially outside the first and second encapsulation layers, for example at outer edges, i.e. at edge regions, of the first encapsulation layer and the second encapsulation layer, in particular in touching contact with the first and second encapsulation layers.

[0012] Furthermore, a frame module is provided, which contains a circuit carrier with an electrical circuit and electrically conductive contact contacts, hereinafter referred to as contact contacts. Subsequently, the framed solar module or framed solar array is produced by assembling the layer stack and the frame module, wherein the framed solar module or framed solar array contains a frame. In other words, the frame is produced, which is connected to the layer stack and in which the circuit carrier is integrated.

[0013] The frame module can already be a frame preform, which can, for example, consist of several parts. The frame preform is a component that is formed into the frame of the framed solar module or the framed solar array through subsequent steps of the method, or whose parts are joined together to form the frame. The frame preform itself can be designed as the circuit carrier, on or in which the electrical circuit and on whose surface the contacting contacts are formed. Alternatively or additionally, the frame preform can also contain an intermediate substrate as the circuit carrier, on or in which the electrical circuit and on whose surface the contacting contacts are formed. Such an intermediate substrate can also consist of several parts and can, for example, be a circuit board, a film, or any other suitable substrate that enables the functionality of the electrical circuit.A frame preform can, for example, consist of a first frame shell and a second frame shell, wherein the electrical circuit and the contacting contacts are integrated directly into the material of the frame preform, for example into one of the two frame shells or into both frame shells, or wherein the intermediate substrate is integrated into one of the two or both frame shells.

[0014] In other embodiments, the frame module consists only of the circuit carrier, which is a separate substrate that can also consist of multiple sections. Although the separate substrate is later part of the produced frame, the frame cannot be produced from the separate substrate carrier itself. Such a substrate can be, for example, a printed circuit board, a film, or any other suitable substrate that enables the functionality of the electrical circuit.

[0015] According to the invention, the contacting contacts are designed such that, during the frame production, they penetrate the laminated layer stack, at least up to the contact surfaces, and each electrically contact at least one contact surface. This creates an electrical contact between the at least two strings and the electrical circuit of the circuit carrier during the frame production. Thus, the use of assembly aids for passing through contacting conductors is no longer necessary, and the time-consuming soldering of contacting conductors is eliminated. The process can therefore be carried out without great effort and can also be easily automated.

[0016] For the purposes of the application, penetration of the layer stack means that the contacting contacts penetrate at least one of the following layers: the front-side layer, the first encapsulation layer, the contact area, the second encapsulation layer, and the back-side layer. In any case, however, all layers that cover the respective contact area on one of their surfaces before the frame is created are penetrated. For example, if the contact area on a surface in the region of the electrical contact to be created to a contacting contact is covered only by the first encapsulation layer, but not by the front-side layer, only the first encapsulation layer is penetrated on this side of the contact area.In another example, if the contact area on a surface in the region of the electrical contact to be created with a contacting contact is covered by the second encapsulation layer and the backside layer, the backside layer and the second encapsulation layer are penetrated on this side of the contact area. Furthermore, the contacting contacts can also penetrate into or penetrate the respective contact area. If the contacting contacts penetrate the contact area, they can also penetrate into or penetrate a layer of the layer stack that is present on the other surface of the contact area. The other surface of the contact area here is the surface that was not opposite the contacting contact at the beginning of the assembly of the layer stack and the frame module.In addition, it is also possible for a contact surface to be contacted on both of its surfaces by at least one contacting contact, wherein the corresponding contacting contact then penetrates the layers existing on the corresponding surface of the contact surface before the frame is created.

[0017] In embodiments, the laminated layer stack can be provided by providing a front layer, a first encapsulation layer, at least two strings of solar cells or at least two strings of solar modules, a second encapsulation layer, and a back layer in the order mentioned or in reverse, and by laminating the first encapsulation layer and the second encapsulation layer together to form a laminated layer stack. During lamination, the at least two strings of solar cells or solar modules are encapsulated with the first encapsulation layer and the second encapsulation layer, i.e., enclosed by the encapsulation layers, wherein the conductor structures and contact surfaces at the ends of the at least two strings can also be enclosed by the first encapsulation layer and the second encapsulation layer, or can be unencapsulated, i.e.,can be arranged outside the first encapsulation layer and the second encapsulation layer. Furthermore, lamination causes the front-side layer and the back-side layer to adhere to the encapsulation layers, thus forming the laminated layer stack.

[0018] The encapsulation layers can comprise or consist of elastomers, such as ethylene-vinyl acetate, polyurethane casting resins, polyacrylate casting resins, or two-component silicones, or thermoplastics, such as polyvinyl butyral, thermoplastic polyurethane, ionoplasts, or modified polyolefins. Lamination can therefore be understood as a thermally, chemically, or radiation-induced material-to-material bonding of the encapsulation layers.

[0019] In embodiments, the first and / or the second encapsulation layer may also contain integrated conductor structures which serve for the electrical connection of the solar cells or solar modules in the at least two strings in series or electrically parallel to one another and for the electrical connection of the at least two strings to the contact surfaces arranged at the respective ends.

[0020] The front layer can consist of one or more plastic layers and / or a glass layer. The back layer can consist, for example, of one or more plastic layers or a composite material, which can include, for example, metallic layers or a metallic core. Furthermore, functional intermediate layers, for example for anti-reflective coating or adhesion promotion, can be provided in the respective layer stack.

[0021] A string of solar cells or solar modules can be formed, for example, by arranging the solar cells or solar modules on the first or second encapsulation layer, preferably in a row, and electrically connecting them in series or parallel to one another with the conductor structure. To electrically contact the solar cells or solar modules to form a string, the conductor structure on the front and / or back of the solar cells or solar modules can be electrically connected to them, e.g., soldered, welded, or attached with an electrically conductive adhesive. The strings can advantageously be formed from back-contact solar cells of the MWT (Metal Wrap Through), EWT (Emitter Wrap Through), or IBC (Interdigitated Back Contact) type in order to avoid shading on one side by the conductor structures.

[0022] In embodiments, the solar cells or solar modules can be arranged obliquely to the plane of the laminated layer stack and overlap each other for electrical contact to form a string, so that only at the ends of the strings is a conductor structure attached to the solar cells or solar modules for electrical contact. The method can therefore also be applied to so-called gapless strings.

[0023] The at least two strings can be arranged parallel to the outer edges of the laminated layer stack and / or in parallel rows, wherein the solar cells or solar modules can be arranged in a matrix. In the matrix, i.e., an arrangement of rows and / or lines, the solar cells or modules can be evenly spaced from one another.

[0024] The conductor structure with which the solar cells or solar modules are or will be connected to form strings can be formed from a wire or wires, in particular from wires arranged parallel to one another, which can be evenly spaced from one another. The contact surfaces at the ends of the strings can be or will be formed by flattening, in particular by pressing, the ends of the conductor structure. In this case, for example, several wires of a conductor structure of a string can be connected to one another to form a contact surface. Alternatively, contact surfaces can be formed by depositing metals or gluing contact pads with an electrically conductive adhesive. The contact surfaces can typically be arranged at the beginning and end of a string. In embodiments, conductor structures of several strings and / or contact surfaces of several strings can also be or will be connected to one another to form current collectors.

[0025] In embodiments, the frame of the framed solar module or framed solar array is created by a primary forming process after the circuit carrier and the layer stack have been placed in a mold. The circuit carrier is integrated into the resulting frame. Such a primary forming process is, for example, an injection molding process or a compression molding process, in which a primary mold is first created from a powdered material, which is then solidified by heat exposure.

[0026] In other embodiments of the method, the frame module contains a first frame shell and a second frame shell, wherein the circuit carrier is integrated into the first frame shell and / or the second frame shell. To form the frame, the laminated layer stack is arranged between the first frame shell and the second frame shell, and the first frame shell and the second frame shell are joined together to form a frame. The first frame shell is understood to be the frame shell which, after the frame shells have been joined, encloses the front layer of the laminated layer stack at its outer edge. The joining of the first frame shell and the second frame shell to form a frame can preferably be carried out by form-fitting and / or force-fitting joining, e.g. by pressure joining, pressing, forming, screwing, or clamping. Alternatively or additionally, a material-fit joining is also possible, e.g.This can be achieved by welding, soldering, or gluing the frame shells. For clamping, detachable connecting elements, such as clip fasteners or locking lugs and locking grooves, can be provided on the first and / or second frame shell, as is known from the prior art.

[0027] The first frame shell and the second frame shell can advantageously be designed as self-contained frame shells, in particular as rectangular frame shells. Particularly preferably, the first frame shell and / or the second frame shell are designed as monolithic frame shells, i.e., they consist of a single piece. This eliminates complex process steps, such as the assembly of individual components into a frame shell, and accelerates the production of framed solar modules or arrays.

[0028] In embodiments, the laminated layer stack for joining the first and second frame shells to form a frame can be inserted, in particular, into the first frame shell or into the second frame shell. Inserting means that the laminated layer stack is arranged or placed with at least one of the following layers on at least one support surface of the first or second frame shell, which is preferably formed in a recess in the first or second frame shell: with the front layer, the first encapsulation layer, the second encapsulation layer, and the back layer.

[0029] The laminated layer stack can, for example, be arranged with the front layer and / or the first encapsulation layer on a respective support surface in the first frame shell, wherein the support surface or support surfaces are formed around a through opening in the recess of the first frame shell. The second frame shell can then be arranged on the first frame shell and the laminated layer stack. The back layer can be arranged on a support surface of the second frame shell. This support surface can be formed on or in a recess of the second frame shell, wherein the recess can be formed with a closed bottom, which corresponds to a frame shell closed at the rear, or for better temperature control and rear ventilation of the laminated layer stack as a through opening or with a through opening, which corresponds to a frame shell open at the rear.Alternatively, the laminated layer stack can be arranged with the backing layer on the support surface of the second frame shell, and the first frame shell can be arranged on top of the laminated layer stack and the second frame shell. With this embodiment of the method, very few positioning steps are required, which are facilitated by the fact that the frame shells provide guidance for the positioning and alignment of the laminated layer stack. This, in turn, enables straightforward automation of the process.

[0030] Advantageously, the recess in which the laminated layer stack is arranged for joining the first and second frame shells can be shaped at least partially congruent to the laminated layer stack. In particular, an inner contour of the recess of the first and / or second frame shells can be shaped congruent to an outer contour of the laminated layer stack in the plane of the layer stack.

[0031] In embodiments, it can be provided that the outer edges, and thus the edge regions, of the backside layer, the first encapsulation layer, the second encapsulation layer, and / or the frontside layer are each offset parallel to one another in the plane of the laminated layer stack, so that the outer edges, and thus the edge regions, of the respective layers are arranged on mutually offset support surfaces of the first and / or second frame shell when the first and second frame shells are joined together. Multiple support surfaces significantly facilitate the positioning of the laminated layer stack in the frame shells.

[0032] In embodiments, for example, the first encapsulation layer and the front-side layer can have outer edges or edge regions offset parallel to one another in the plane of the laminated layer stack, and the first and second frame shells can be designed such that, when the first and second frame shells are joined together, at least one outer edge or edge region of the front-side layer is arranged on a first support surface of the first frame shell, and at least one outer edge or edge region of the first encapsulation layer is arranged on a second support surface of the first frame shell. Of course, a formation of the laminated layer stack in the described form is also possible using a primary forming process to produce the frame.

[0033] In further embodiments, it can be provided that the backside layer is designed in particular such that it projects beyond the outer edges of the first encapsulation layer, the second encapsulation layer, the contact surfaces, and the frontside layer. In the event that frame shells are used to produce the frame, the first and second frame shells can be designed such that, when the first and second frame shells are joined together, at least one outer edge or edge region of the frontside layer is arranged on a first support surface of the first frame shell, and at least one outer edge or edge region of the backside layer is arranged on a third support surface of the second frame shell.

[0034] For joining the first and second frame shells to form a frame, joining surfaces can be provided on the first frame shell and the second frame shell, which are arranged in contact with each other when the frame shells are joined. Advantageously, the joining surfaces are formed circumferentially, in particular parallel to at least one support surface, around the recess in the first frame shell and around the recess or around a through opening in the second frame shell.

[0035] For electrical contacting when joining the frame shells, the contacting contacts can preferably be arranged on bearing surfaces of the first or second frame shell, against which the laminated layer stack is arranged or rests in touching contact after the frame shells have been joined with at least one of the front layer, the first encapsulation layer, the second encapsulation layer or the back layer. In the method, the contact surfaces can preferably be formed in edge regions of the laminated layer stack, which are arranged or rest on bearing surfaces of the first or second frame shell when the first and second frame shells are joined, wherein the edge regions are designed to be self-electrically insulating. The contact surfaces are in the laminated layer stack, in particular between the first and second encapsulation layer and / oror on outer edges of the first and second encapsulation layer, although they are always covered by at least one of the following layers: the front side layer, the first encapsulation layer, the second encapsulation layer and the back side layer. Contact surfaces can preferably be arranged parallel to outer edges of the first and second encapsulation layer. By arranging the contact surfaces in regions of the layer stack which bear against or rest on support surfaces of the frame shells, bending of the laminated layer stack during electrical contact is prevented or at least reduced because the respective support surface offers a counterforce to the contact pressure. In addition, the contact surfaces are concealed from the outside by the support surfaces, so that on the one hand a more uniform appearance of the solar modules or-arrays is achieved and, on the other hand, heat protection is achieved by shading the contact surfaces.

[0036] The contacting contacts can preferably be designed as terminals or cutting contacts, in particular as cutting plates or contacting pins. The cutting plates can be designed with a wedge-shaped cutting edge. The contacting pins can be designed with a conically tapered tip. Cutting contacts penetrate the contact surfaces completely or at least partially, i.e. they penetrate the contact surfaces and form a positive contact with them. Terminals, on the other hand, do not penetrate the contact surfaces but only rest on them, with contact being created by the contact force of the frame. Preferably, the laminated layer stack is only opened by the contacting contacts as far as the diameter of the contacting contacts, so that the contacting contacts are only separated by the surrounding layer stack, e.g.by the encapsulation layer being penetrated, sealing the laminate and ensuring tensile strength of the connection. Alternatively, the contact surfaces may be completely or partially uncovered by the first or second encapsulation layer, as described above.

[0037] The contacting contacts are made of a suitable, electrically conductive material, preferably brass, stainless steel, tinned steel or other metals or compounds or mixtures or layer structures.

[0038] The contacting contacts can penetrate the laminated layer stack essentially perpendicular to the plane of the laminated layer stack, at least up to the contact surfaces, and contact the contact surfaces essentially perpendicularly. In this context, essentially perpendicular means at an angle between 0° and 45°, preferably 0° and 30°, to the surface normal of the laminated layer stack or to the surface normal of the contact surfaces.

[0039] In some embodiments, the contacting contacts can also penetrate the contact surfaces. This can, on the one hand, provide additional positional fixation of the laminated layer stack in the frame, but on the other hand, it can also contact contact surfaces that are vertically offset from one another with respect to the plane of the laminated layer stack.

[0040] A vertical offset of the contact surfaces can arise, for example, if the contact surfaces are formed on solar cells or solar modules of different heights or on overlapping solar cells or solar modules arranged at an angle to the plane of the encapsulation layers. An offset between the contact surfaces can also typically arise if contact surfaces at the ends of adjacent strings are formed in one string on or with conductor structures on the front of the solar cell or solar module, and in the other string on or with conductor structures on the back of the solar cell or solar module. With the method according to the invention, deviations in the vertical position of the contact surfaces can be compensated for without further positioning processes during contacting.

[0041] In embodiments of the method, the contacting contacts can be heated, e.g., by induction heating, before, during, or after the frame is created, e.g., by joining the first and second frame shells. The temperature of the heated contacting contacts can, in particular, be higher than the melting temperature of the respective layers penetrated by the contacting contacts during contacting. This allows the layers to melt to contact the contact surfaces and, upon cooling, form an additional seal around the contacting contacts.

[0042] The electrical circuit of the frame module can be designed for the method according to the invention in order to electrically connect the at least two strings of solar cells or solar modules in series or parallel to one another.

[0043] The invention further relates to a frame module for producing a framed solar module or a framed solar array from a laminated layer stack which has a front layer, a first encapsulation layer, at least two strings of solar cells or solar modules, a second encapsulation layer and a back layer, wherein the solar cells or solar modules in the at least two strings are each electrically connected in series or electrically parallel to one another by an electrically conductive conductor structure, hereinafter referred to as conductor structure, and an electrically conductive contact surface, hereinafter referred to as contact surface, is formed on the conductor structure at each end of the at least two strings.

[0044] The frame module contains a circuit carrier with an electrical circuit and electrically conductive contacting contacts, so that when the frame is created, the electrically conductive contacting contacts penetrate the laminated layer stack, at least up to the electrically conductive contact surfaces, and each electrically contact at least one electrically conductive contact surface and form an electrical contact between the at least two strings and the electrical circuit.

[0045] In embodiments, the frame module comprises a first frame shell and a second frame shell, which can be joined together to form the frame and are configured such that the laminated layer stack can be arranged between the first frame shell and the second frame shell. The circuit carrier is integrated into the first frame shell and / or the second frame shell, i.e., the first and / or second frame shell comprise an electrical circuit and electrically conductive contact contacts, which are referred to below as contact contacts.The contacting contacts are designed such that when the first frame shell and the second frame shell are joined together to form the frame, they penetrate the laminated layer stack, at least up to the contact surfaces, and in each case electrically contact at least one contact surface of the at least two strings, so that an electrical contact is formed between the at least two strings and the electrical circuit.

[0046] Preferably, the first frame shell and the second frame shell can be designed as self-contained frame shells. Self-contained means that the first frame shell and the second frame shell are designed to enclose the laminated layer stack all the way around its outer circumference or an outer edge, or at least to touch it. For this purpose, the first frame shell can have a recess with a through-opening. The opening dimensions typically correspond at least to the dimensions of the arrangement of the at least two strings of solar cells or solar modules, so that sunlight can fall through the opening onto the solar cells or solar modules for the operation of the solar cells or solar modules.

[0047] For framing rectangular laminated layer stacks, the first frame shell and the second frame shell can be designed, in particular, as rectangular frame shells. The first and / or second frame shell can have a rectangular recess for the laminated layer stack. Particularly advantageously, the first frame shell and the second frame shell can each be designed as monolithic components, i.e., they can consist of a single piece, in particular, they can be manufactured or cast in a single piece.

[0048] In embodiments, the first frame shell can have a recess for easy positioning of the laminated layer stack, which recess is shaped substantially congruently to the laminated layer stack. The recess can, for example, have a first support surface for the front layer and a second support surface for the first encapsulation layer. The first support surface and the second support surface can be offset from one another by the layer thickness of the front layer vertically to the plane of the laminated layer stack. Furthermore, the second frame shell can have a third support surface, against which an outer edge, and thus an edge region, of the back layer rests or is arranged after the first and second frame shells have been joined together.The third support surface can be formed flush with a joining surface of the second frame shell, on which the first frame shell and the second frame shell are arranged in contact with each other after joining.

[0049] The distance of the second support surface to a joining surface of the first frame shell, on which the first frame shell and the second frame shell are arranged in touching contact with one another after being joined, can correspond to the sum of the layer thicknesses of the back layer and the first and second encapsulation layers, so that when the laminated layer stack is inserted into the first frame shell, the back layer has a surface that is flush with the first frame shell or the joining surface to the second frame shell. In alternative embodiments, it can also be provided that the distance of the second support surface to the joining surface of the first frame shell is less than the sum of the layer thicknesses of the back layer and the first and second encapsulation layers, so that when the laminated layer stack is inserted into the first frame shell, the back layer has a surface that is flush with the first frame shell or the joining surface to the second frame shell.The second frame shell can then have a recess that is congruent with the backing layer and accommodates the protruding backing layer when the frame shells are joined together.

[0050] The support surfaces can preferably be circumferential support surfaces. In this context, circumferential means that the support surface is formed as a preferably continuous, in particular planar, surface on an inner circumference of the recess in the respective frame shell. As an alternative to continuous support surfaces, support surfaces with interruptions or recesses in the support surface can also be provided. The support surfaces can, for example, be provided only on two opposite inner sides of the recess in the first or second frame shell. In further embodiments, at least one support surface can be formed with a surface profile that is congruent with a profile on outer edges of the respective layer that rests on the support surface when the frame shells are joined together.The support surface can, for example, have step-like, corrugated, or triangular recesses that engage a crenellated, wave-like, or jagged edge region of the laminated layer stack when the first and second frame shells are joined, thus facilitating the positioning of the laminated layer stack. For example, if the conductor structure and / or contact surfaces are arranged at the ends of the strings outside the first and second encapsulation layers, the step-like recesses in the support surface can also be formed such that vertical height differences of the steps correspond to a vertical offset of the conductor structure and / or the contact surfaces with respect to the plane of the laminated layer stack.

[0051] The width of the support surfaces can be selected such that an edge region of the laminated layer stack in which no solar cells or solar modules are arranged rests on the support surfaces after the first frame shell and the second frame shell have been joined together, ie is covered by them.

[0052] In embodiments, the side surfaces of the recess in the first and / or second frame shell, into which the laminated layer stack is inserted or arranged, can be designed such that, after the first and second frame shells have been joined together, they have a gap to the edge regions of the backside layer, the first encapsulation layer, the second encapsulation layer and / or the frontside layer. This eliminates the need for precisely cutting the laminated layer stack for producing the solar module or array, and simplifies the process. Side surfaces of the recess are understood to mean inner surfaces, i.e. surfaces on the inner circumference, of the recess which, after the frame shells have been joined together, are arranged vertically to the plane of the layer stack.

[0053] The recess in the first frame shell can, in particular, be designed such that, after joining the first and second frame shells, a larger gap is formed between the side surfaces of the recess and the laminated layer stack in the region of the first encapsulation layer and the second encapsulation layer than in the regions of the backside layer and the frontside layer. The increased gap in the region of the first encapsulation layer and the second encapsulation layer can compensate for material displacements of the encapsulation layers when contacting the contact surfaces or during temperature fluctuations.

[0054] In further embodiments, the gap between the back layer and the side surfaces of the support surface, on which the back layer is arranged or rests after the frame shells have been joined, and / or the gap between the front layer and the side surfaces of the support surface, on which the front layer is arranged or rests after the frame shells have been joined, can be smaller than the width of the contact surfaces. This allows the contacting contacts to still contact the contact surfaces when the frame shells are joined, even if the laminated layer stack shifts in the frame shell.

[0055] For electrically contacting the contact surfaces, the contacting contacts can preferably be arranged on the support surfaces of the first or second frame shell, on which the laminated layer stack is arranged in contact after joining the first and second frame shells with the first encapsulation layer or the backside layer. The contacting contacts can be arranged essentially perpendicular to the support surfaces, so that they penetrate the laminated layer stack essentially perpendicularly for electrical contacting and contact the contact surfaces essentially perpendicularly.

[0056] The contacting contacts can, for example, be arranged on the second frame shell and penetrate the back layer and / or the second encapsulation layer when the first and second frame shells are joined together. Alternatively or additionally, contacting contacts can be arranged on the first frame shell and penetrate the first encapsulation layer and / or the front layer when the first and second frame shells are joined together.

[0057] The contacting contacts can preferably be designed as insulation displacement terminals or insulation displacement contacts, in particular as cutting plates or contact pins. The cutting plates can be designed with a wedge-shaped cutting edge. The contact pins can be designed with a conically tapered tip. The length of a cutting edge can correspond to the length of a contact surface of a string or a current collector. The length of a contact surface is understood to be the maximum extension of the contact surface parallel to the plane of the laminated layer stack.

[0058] The respective length of the contact contacts, with which the contact contacts penetrate the laminated layer stack, can be at least the distance between a contact surface that is contacted by the respective contact contact during the creation of the frame and the surface of the laminated layer stack at which the laminated layer stack is penetrated by the respective contact contact during the creation of the frame. If the laminated layer stack is penetrated, for example, at the backside layer, the length of the contact contacts can be at least the distance between the outer surface of the backside layer and the respective contact surfaces.The length of the contacting contacts can, in particular, be greater than the specified distance, so that the contacting contacts are not only brought into contact with the respective contact surface, but also penetrate into it or even completely penetrate it, thereby providing additional positional fixation of the laminated layer stack in the frame. The maximum length of the contacting contacts can typically be selected such that the contacting contacts do not completely penetrate the laminated layer stack, in particular such that the contacting contacts completely penetrate only one of the encapsulation layers.

[0059] In particular, in embodiments, the length of all contacting contacts Q, with which the contacting contacts penetrate the laminated layer stack, can be at least equal to the maximum distance between the contact surfaces and the surface of the laminated layer stack at which the laminated layer stack is penetrated by the contacting contacts for electrically contacting the contact surfaces during the creation of the frame. Because all contacting contacts can penetrate at least the maximum distance between the contact surfaces and the surface of the laminated layer stack, all contact surfaces can be electrically contacted, even if they are vertically offset from one another in the laminated layer stack, and deviations in the vertical position of the contact surfaces can be easily compensated for using the method.

[0060] In embodiments, the contacting contacts can be configured to contact a plurality of contact surfaces arranged vertically one above the other with respect to the plane of the laminated layer stack. The contact surfaces can, for example, be contact surfaces, in particular overlapping contact surfaces, of different, in particular adjacently arranged, strings, solar cells, or solar modules. This allows the frame module to be used to form three-dimensional interconnections between solar cells or solar modules, or strings of solar cells or solar modules.

[0061] For simple production of framed solar modules or arrays, the first frame shell and / or the second frame shell can preferably be designed as circuit-integrated circuit carriers. Circuit-integrated means that the electrical circuit is arranged in a surface and / or on a surface of the first and / or second frame shell, wherein the surface is electrically insulating. A circuit is understood to be an electrical combination of electrical or electromechanical components. The electrical circuit can, for example, be embedded or cast in the first and / or second frame shell and / or deposited or printed onto them. The frame shell or shells thus represent the circuit board for the electrical circuit, so that no additional circuit boards need to be used.The contact contacts can also be attached to or in an electrically insulating surface of the first and / or second frame shell, e.g., embedded, cast, glued, or screwed. Electrically insulating means that the surface has an electrical resistance of at least 5x10. 4 Q, preferably at least 10 9 Q„ particularly preferably at least 5x10 11 Q, has.

[0062] In embodiments, the circuit carrier of the frame module and / or the first frame shell and / or the second frame shell can advantageously be made of an electrically insulating material, such as plastic, in particular a thermoplastic. Frame shells made of plastic can be produced, for example, using a hot-pressing process or a plastic molding process. Preferably, the first frame shell and / or the second frame shell can be produced using a multi-component injection molding process, in particular using a printed circuit board Kollmorgen process (PCK process) or a Sankyo-Kasei wiring board process (SKW process). The electrical circuit and contact contacts can be embedded or molded into the respective frame shell.Compared to conventional junction boxes, which consist of a housing and separate circuit boards, such M ID (Molded Interconnect Device) frame shells can reduce the number of parts and different materials. This significantly reduces assembly effort in the production of framed solar modules or arrays, while also improving the recyclability and dielectric strength of the solar modules or arrays.

[0063] In further embodiments, the first frame shell and / or the second frame shell can consist of a composite material or of metal, in particular of aluminum. Frame shells made of metal can in particular be produced using a deep-drawing process or a metal casting process. The electrical circuit and / or contacting contacts can be embedded in the first and / or second frame shell, for example glued, cast, pressed or screwed into recesses. In this case, the electrical circuit and / or the contacting contacts in the case of frame shells made of metal can be arranged on an electrically insulating circuit board for electrical insulation or can be attached to or in a surface of the frame shell using an electrically insulating adhesive or an electrically insulating potting compound.In the case of frame shells made of a composite material, it can be provided that the surface of the composite material, to and / or in which the electrical circuit and / or the contact contacts are attached, is made of an electrically insulating material, e.g., plastic. In embodiments, the first and second frame shells can, in particular, also be made of different materials, e.g., one frame shell made of plastic and the other of metal or composite.

[0064] The electrical circuit of the frame module can be configured to electrically connect the at least two strings in series or parallel to one another. For this purpose, the contacting contacts can be arranged at a distance from one another that corresponds to the distance between the contact surfaces in the laminated layer stack. For interconnecting the strings in the first or second frame shell, the contacting contacts can be electrically connected to one another and / or to components of the electrical circuit, e.g., via wires or busbars.

[0065] For a series connection, for example, the strings can be arranged with opposite polarity to each other, so that the oppositely polarized contact surfaces of the strings are arranged next to each other and can be interconnected via the contacting contacts and an electrical connection between the contacting contacts in the electrical circuit of the circuit carrier. For a parallel connection of the strings, the strings can be arranged with the same polarity to each other, so that the same-polarized contact surfaces of the strings are arranged next to each other and can be interconnected via the contacting contacts and an electrical connection between the contacting contacts in the electrical circuit of the circuit carrier.

[0066] In embodiments, the electrical circuit of the frame module may include bypass diodes and / or blocking diodes to prevent overheating due to shading. Bypass diodes may be connected in parallel to a string and / or in parallel to individual solar cells or solar modules. Blocking diodes may each be connected in series to a string.

[0067] The electrical circuit of the frame module can also include at least one inverter for converting direct current from the at least two strings into alternating current, a sensor system for controlling the operation of the solar module or solar array, at least one accumulator for energy storage, and / or a charge controller for the at least one accumulator in the electrical circuit or for an external accumulator. Furthermore, the electrical circuit can include a maximum power point tracker (MPP tracker). The MPP tracker can be integrated, in particular, into the at least one inverter or into a charge controller.

[0068] If the frame module contains frame shells, further recesses or cavities can be provided in the first frame shell and / or the second frame shell in embodiments for integrating components of the electrical circuit, in particular the inverter, the sensors, the accumulator or the charge controller, for integrating further components for operating the solar module or array, for cable routing or also for weight reduction. The first frame shell and / or the second frame shell can in particular be designed as hollow profiles. The further recesses can advantageously be formed on a joining surface between the first and second frame shell so that they are accessible when the frame module is opened.

[0069] In embodiments, the frame module, particularly if it comprises frame shells, can have a first sealing element for sealing the produced frame, in particular the first frame shell, against the front layer and / or a second sealing element for sealing the produced frame, in particular the second frame shell, against the back layer and / or a third sealing element for sealing the first frame shell against the second frame shell. The sealing elements can in particular be sealing cords, each of which is or will be inserted into a preferably circumferential groove in the frame shells or the laminated layer stack. As an alternative to sealing cords, a sealing compound can also be used as a sealing element.

[0070] The seal between the first frame shell and the front layer can be provided, for example, on the first bearing surface of the first frame shell, on which the front layer is in contact with the first frame shell after the first and second frame shells have been joined together. The seal between the first frame shell and the second frame shell can be provided on the joining surface between the first and second frame shells, on which the frame shells are in contact with one another after they have been joined together. The seal between the second frame shell and the back layer can be provided on the third bearing surface of the second frame shell, on which the back layer is in contact with the second frame shell after the first and second frame shells have been joined together. The seals can prevent further gluing or sealing of the framed solar module orThis eliminates the need for additional frame shells, even when using two frame shells, and further simplifies the production of framed solar modules or arrays. Seals with sealing cords, in particular, allow for a detachable connection between the first and second frame shells, thus improving the repairability of the solar module or solar array.

[0071] For a detachable connection of the frame shells, detachable connecting elements, such as clip fasteners or locking lugs and locking grooves, can be provided on the first and / or second frame shell. These can be particularly advantageously implemented on plastic frame shells, in particular on injection-molded integrated circuit carriers.

[0072] In further embodiments, the first frame shell and / or the second frame shell can have a flattened upper edge or a flattened lower edge on an outer circumference for stacking the first and second frame shells on top of one another.

[0073] The frame module according to the invention can be used for the production of a framed solar module or a framed solar array. In particular, the described method can be carried out with the described frame module, i.e., the described frame module is suitable for carrying out the described method and can have the features described in the method.

[0074] Furthermore, the invention relates to a framed solar module or a framed solar array comprising a frame module according to the invention.

[0075] Embodiments of the invention are illustrated in the drawings and are explained below with reference to Figures 1 to 6. The representation of individual features in a specific combination of features does not exclude further combinations of the features, ie the features can be combined with one another, provided the features do not exclude one another or a specific combination of features is not explicitly excluded.

[0076] The pictures show:

[0077] Fig. 1: schematically shows an example of the method according to the invention for producing a framed solar module or a framed solar array, wherein the frame module has two frame shells, Fig. 2a: schematically shows a cross section of an example of a frame module having two frame shells,

[0078] Fig. 2b: schematically shows part of a cross-section of a framed solar module produced using the frame module of Fig. 2a,

[0079] Fig. 3a: schematically a cross-section of an example of a frame module comprising a foil as a circuit carrier,

[0080] Fig. 3b: schematic plan view of the frame module of Fig. 3a,

[0081] Fig. 3c: schematically shows part of a cross-section of a frame module of Fig.

[0082] 3a produced framed solar module,

[0083] Fig. 4: schematically an example of a frame module and an electrical series connection of strings with solar cells or modules connected in series,

[0084] Fig. 5: schematically an example of a frame module and an electrical parallel connection of strings with solar cells or modules connected in series,

[0085] Fig. 6: schematically an example of a frame module and an electrical series connection of strings with parallel connected solar cells or modules, and

[0086] Fig. 7: schematically an example of a frame module and an electrical parallel connection of strings with parallel connected solar cells or modules.

[0087] Figure 1 schematically illustrates an example of the method according to the invention for producing a framed solar module or a framed solar array. In this example, a frame module used comprises two frame shells, with special features of the frame shells being illustrated in Figures 2a and 2b.

[0088] In the method, as shown in step e) of Figure 1, a laminated layer stack 7 is provided comprising a front-side layer 1, a first encapsulation layer 2, at least two strings 3 of solar cells 4 or at least two strings 3 of solar modules 4, a second encapsulation layer 5, and a back-side layer 6. In this laminated layer stack 7, the solar cells 4 or solar modules 4 in the at least two strings 3 are each electrically connected to one another by a conductor structure 8. Figure 1 shows, by way of example, a series connection of the solar cells 4 or solar modules 4 in each of the strings 3, but parallel connections of the solar cells 4 or solar modules 4 in the strings 3 are also possible. Furthermore, in the laminated layer stack 7, a contact surface 9 is formed on the conductor structure 8 of the string 3 at the end of each of the at least two strings 3.

[0089] The laminated layer stack 7 is laminated such that the at least two strings 3 and the conductor structures 8 are surrounded by the first encapsulation layer 2 and the second encapsulation layer 5. The contact surfaces 9 can also be surrounded by the first encapsulation layer 2 and the second encapsulation layer 5, as shown in Fig. 2b, or can be arranged outside the encapsulation layers 2, 5, e.g., at outer edges, i.e., at edge regions, of the first encapsulation layer 2 and the second encapsulation layer 5, in particular in contact with them, as shown in Fig. 1. In any case, however, the contact surfaces 9 are covered by at least one of the following layers: the front-side layer 1, the first encapsulation layer 2, the second encapsulation layer 5, and the back-side layer 6. In the case shown in Fig. 1, only the back-side layer 6 covers the contact surfaces 9.

[0090] A laminated layer stack 7 can, for example, be produced, as schematically depicted in steps a) to d) of Figure 1, by arranging the first encapsulation layer 2 on the front-side layer 1, on which the at least two strings 3 of solar cells 4 or solar modules 4 are formed. The second encapsulation layer 5 is arranged on the first encapsulation layer 2 and the strings 3, and the back-side layer 6 is arranged thereon. However, the layer stack can also be formed in the reverse order of the layers. The layer stack is then laminated, whereby the first encapsulation layer 2 and the second encapsulation layer 5 adhere to one another, but also the first encapsulation layer 2 adheres to the front-side layer 1 and the second encapsulation layer 5 adheres to the back-side layer 6, so that a coherent layer stack, referred to as a laminated layer stack 7, is formed.

[0091] A string 3 of solar cells 4 or solar modules 4 can be formed, for example, by arranging the solar cells 4 or solar modules 4 on the first encapsulation layer 2 or the second encapsulation layer 5 and electrically connecting them in series or parallel to one another with the conductor structure. The at least two strings 3 can, for example, be formed parallel to outer edges of the laminated layer stack 7 and in parallel rows in a matrix, as shown in step c) of Figure 1. However, other arrangements are also possible.

[0092] For the electrical contacting of the solar cells 4 or solar modules 4 to form a string 3, the conductor structure 8 on the front and / or back of the solar cells 4 or solar modules 4 can be electrically connected to them, e.g. soldered or fastened with an electrically conductive adhesive. Advantageously, the strings 3 can also be formed from back-contact solar cells of the MWT (Metal Wrap Through), EWT (Emitter Wrap Through) or IBC (Interdigitated Back Contact) type. The conductor structure 8, with which the solar cells 4 or solar modules 4 are or will be connected to form strings 3, can consist of one or more wires, e.g. copper wires, which can be evenly spaced from one another. The contact surfaces 9 at the ends of the strings 3 can be or will be formed by flattening, in particular by pressing, the ends of the respective conductor structure 8 at the end of a string 3.For example, several wires of a conductor structure 8 of a string 3 can be connected to one another to form a contact surface 9. Alternatively, the contact surfaces 9 can be formed by depositing metals or bonding contact pads with an adhesive, and the conductor structure 8 can be connected to them.

[0093] The front layer 1 can, for example, consist of glass with a thickness in the range of 1 mm to 4 mm or of a 0.5 mm to 4 mm thick plastic layer made of, for example, glass fiber reinforced plastic. The first encapsulation layer 2 and the second encapsulation layer 5 can, for example, consist of POE (polyolefin elastomer), TPO (thermoplastic polyolefin), EVA (ethylene vinyl acetate), PVB (polyvinyl butyral), EPE (EVA / polyester multi-layer), which has a thickness in the range of 10 μm to 1 mm after lamination. The back layer 6 can, for example, consist of glass with a thickness in the range of 1 mm to 4 mm or of one or more plastic or metal-plastic films with a respective thickness in the range of 20 μm to 800 μm.Common materials for such a backing layer made of plastic film include PET (polyethylene terephthalate), PVF (polyvinyl fluoride), PVDF (polyvinylidene fluoride), PA (polyamide), FEVE (fluoroethylene vinyl ether), PEVA (polyethylene vinyl acetate) and PTFE (polytetrafluoroethylene) or combinations of one or more of these materials.

[0094] After the laminated layer stack 7 has been provided, the laminated layer stack 7 is arranged between a first frame shell 101 and a second frame shell 102 of a frame module 10. This can be carried out, for example, as in steps f) to h) of Figure 1. First, the frame module 10 is provided, wherein in step f) initially only the first frame shell 101 is visible. In step g), the laminated layer stack 7 is inserted into this so that the laminated layer stack 7, in particular with the front layer 1, is in touching contact with at least one bearing surface of the first frame shell 101. Subsequently, in step h), the second frame shell 102 is arranged on the first frame shell 101 and the laminated layer stack 7.Alternatively, the laminated layer stack 7 can also be arranged on a support surface of the second frame shell 102, and the first frame shell 101 can be arranged on the laminated layer stack 7 and the second frame shell 102. The support surfaces of the frame shells 101, 102 are explained in more detail with reference to Figs. 2a and 2b.

[0095] The at least one support surface for inserting the laminated layer stack into the first frame shell 101 or second frame shell 102 can preferably be formed in a recess in the first frame shell 101 or second frame shell 102. The recess can be shaped at least partially congruent to the laminated layer stack. In particular, an inner contour of the recess in the first frame shell 101 or the second frame shells 102 can be shaped congruent to an outer contour of the laminated layer stack 7 in the plane of the layer stack. In Figure 1, the frame shells 101, 102 are designed, for example, as rectangular frame shells in order to frame a rectangular laminated layer stack 7. However, the method can also be carried out on non-rectangular laminated layer stacks.

[0096] To simplify the method, the first frame shell 101 and the second frame shell 102 are preferably designed as self-contained frame shells, as shown in Figure 1. This eliminates the need to assemble individual components into a frame shell, and the production of framed solar modules or arrays can be accelerated. For improved stability, the frame shells 101, 102 can also be monolithic, i.e., consist of one piece, as in the example in Figure 1. In particular, they can be manufactured in one piece, preferably cast.

[0097] The first frame shell 101 typically has a through-opening 110 in the recess through which sunlight can fall onto the solar cells 4 or modules 4 for the operation of the solar module or array. The opening dimensions of the opening 110 can correspond at least to the dimensions of the arrangement of the at least two strings 3 in the plane of the laminated layer stack 7. The second frame shell 102 can, as shown in Fig. 1 and Figs. 2a and 2b, also be formed with a through-opening 111. In embodiments, however, it can also be closed at the back, i.e., it can have no through-opening but optionally a recess.

[0098] To frame the solar modules or arrays, the first frame shell 101 and the second frame shell 102 are joined together to form a frame 100. Joining surfaces can be provided on the first frame shell 101 and the second frame shell 102 for this purpose, which are arranged in contact with one another during joining. The joining surfaces are advantageously formed circumferentially, preferably parallel to at least one support surface for the laminated layer stack 7, around the recess in the first frame shell 101 and the recess and / or a through opening 111 in the second frame shell 102.

[0099] The joining of the first frame shell 101 and the second frame shell 102 to form the frame 100 is preferably carried out in a form-fitting and / or force-fitting manner, e.g., by pressure joining, pressing, forming, screwing, or clamping. Alternatively or additionally, a material-fit joining is also possible, e.g., by welding, soldering, or gluing the frame shells 101, 102. For clamping, in particular, detachable connecting elements, such as clip closures or locking lugs and locking grooves, can be provided on the first and / or second frame shell 101, 102.

[0100] To seal the frame shells 101, 102, sealing elements can be provided on the contact surfaces between the laminated layer stack 7 and the first or second frame shell 101, 102 and / or on the joining surfaces between the frame shells 101, 102. In the exemplary embodiment of Figure 1, these sealing elements are indicated by dashed lines in steps f) and g).

[0101] When the frame shells 101, 102 are joined together to form the frame 100, the method according to the invention simultaneously electrically contacts the at least two strings 3 or solar cells 4 or solar modules 4, so that further work steps for electrical contact are omitted. For this purpose, the first frame shell 101 and / or the second frame shell 102 are designed as circuit carriers 11. This means that the first frame shell 101 and / or the second frame shell 102 has / have an electrical circuit 12 and contacting contacts 13. In the examples shown in Figs. 1 and 2a and 2b, the second frame shell 102 is designed as a circuit carrier 11.The contacting contacts 13 are designed such that when the frame 100 is produced, in this case when the first frame shell 101 and the second frame shell 102 are joined together, they penetrate the laminated layer stack 7 at least as far as the contact surfaces 9 and electrically contact the contact surfaces 9, so that an electrical contact is formed between the at least two strings 3 and the electrical circuit 12. The electrical circuit 12 of the first frame shell 101 and / or the second frame shell 102 can advantageously be designed to electrically connect the at least two strings 3 made up of solar cells 4 or solar modules 4 in series or in parallel. Possible exemplary embodiments for electrical circuits are shown schematically in Figures 4 to 7. For electrical contacting, the contacting contacts 13 can preferably be provided on support surfaces of the first frame shell 101 and / oror second frame shell 102, on which the laminated layer stack 7 is arranged in touching contact after the frame shells 101, 102 have been joined together with the front layer 1, the first encapsulation layer 2, the second encapsulation layer 5 or the back layer 6. The contact surfaces 9 can accordingly be arranged in edge regions of the laminated layer stack 7, which are arranged or bear against these support surfaces of the first or second frame shell 101, 102 when the first and second frame shells 101, 102 are joined together, wherein the edge regions are designed to be electrically insulating. The contact surfaces 9 can, for example, be arranged in edge regions of the first and second encapsulation layers 1, 5, parallel to outer edges of the first and second encapsulation layers 1, 5, as shown in step c) of Figure 1.

[0102] To allow the contacting contacts 13 to more easily penetrate the layer stack 7, in particular the encapsulation layers 2, 5 and / or the backside layer 6, the contacting contacts 13 can also be heated for joining the frame shells 101, 102 and contacting the contact surfaces 9. The temperature can, in particular, be higher than the melting temperature of the layers penetrated for contacting.

[0103] The method can be carried out, for example, with the frame module 10 of the exemplary embodiment shown in Figures 2a and 2b. This means that the first frame shell 101 and the second frame shell 102 can have features of the frame module 10 of the exemplary embodiment shown in Figures 2a and 2b.

[0104] Figures 2a and 2b schematically illustrate an embodiment of a frame module 10 according to the invention, which contains two frame shells 101, 102. Fig. 2a shows the frame module 10 during preparation, and Fig. 2b shows a framed solar module after the first frame shell 101 and the second frame shell 102 have been joined together to form the frame 100 in a side sectional view, with only a portion of the framed solar module being illustrated in Fig. 2b.

[0105] The frame module 10 comprises the first frame shell 101 and the second frame shell 102, which can be joined together to form the frame 100 and are designed such that the laminated layer stack 7 can be arranged between the first frame shell 101 and the second frame shell 102. In the example shown, the second frame shell 102 is designed as a circuit carrier 11, i.e., it comprises an electrical circuit 12 and contacting contacts 13. The contacting contacts 13 are designed such that, when the first frame shell 101 and the second frame shell 102 are joined together to form the frame 100, they penetrate the laminated layer stack 7, at least up to the contact surfaces 9 of the laminated layer stack 7, and electrically contact the contact surfaces 9 of the at least two strings 3, forming an electrical contact between the at least two strings 3 and the electrical circuit 12.

[0106] For easy positioning of the laminated layer stack 7, the first frame shell 101 is formed with a recess that is shaped substantially congruently to the laminated layer stack 7. The recess has a first support surface 103 for the front-side layer 1 and a second support surface 104 for the first encapsulation layer 2. The first support surface 103 and the second support surface 104 are offset vertically from one another by the layer thickness of the front-side layer 1 with respect to the plane of the laminated layer stack 7.

[0107] Furthermore, a third support surface 105 is formed on the second frame shell 102, on which an outer edge, and thus an edge region of the backing layer 6, is arranged after the frame shells 101, 102 have been joined together. In the frame module 10 of the exemplary embodiment in Figures 2a and 2b, the third support surface 105 is formed flush with a joining surface 113 of the second frame shell 102. The first frame shell 101 also has a joining surface 112, so that the frame shells 101, 102 are arranged in contact with one another at the joining surfaces 112, 113 after being joined together. However, in further embodiments, one of the joining surfaces 112, 113 can also be arranged entirely or partially in a recess in the corresponding frame shell 101 or 102. The backside layer 6 projects beyond the first encapsulation layer 2, the second encapsulation layer 5, the contact surfaces 9 and the frontside layer 1 at their outer edges or.Edge areas horizontal to the plane of the laminated layer stack 7.

[0108] In the exemplary embodiment of Figures 2a and 2b, the distance between the second support surface 104 and the joining surface 112 corresponds to the sum of the layer thicknesses of the back layer 6 and the first and second encapsulation layers 2, 5, so that the back layer 6 of the laminated layer stack 7 is flush with its surface with the first frame shell 101, or its joining surface 112 to the second frame shell 102. In embodiments in which the third support surface 105 is arranged in a recess in the second frame shell 102, it can also be provided that the distance between the second support surface 104 and the joining surface 112 is less than the sum of the layer thicknesses of the back layer 6 and the first and second encapsulation layers 2, 5, so that the laminated layer stack 7 protrudes beyond the first frame shell 101 when inserted into the first frame shell 101 and is received by the recess of the second frame shell 102 when the frame shells 101, 102 are joined together.

[0109] In the exemplary embodiment of Figures 2a and 2b, the support surfaces 103, 104, 105 are circumferential support surfaces. They are each formed as a continuous, planar surface on an inner circumference of the recess of the first frame shell 101 and at the opening 111 in the second frame shell 102. As an alternative to circumferential support surfaces, however, support surfaces with interrupted surfaces or recesses in the surface of the support surface can also be provided. The support surfaces can, for example, be provided only on two opposing inner sides of the recess. In further embodiments, at least one support surface can be formed with a surface profile that is congruent with a profile of an outer edge of the laminated layer stack 7.The support surface can, for example, have step-like, corrugated, or triangular recesses that engage a crenellated, wave-like, or jagged edge region of the laminated layer stack 7 when the first and second frame shells 101, 102 are joined together, thus facilitating the positioning of the laminated layer stack 7. However, the step-like recesses in the support surface can also be designed such that vertical height differences of the steps correspond to a vertical offset of the conductor structure 8 and / or the contact surfaces 9 with respect to the plane of the laminated layer stack 7.

[0110] In the exemplary embodiment of Figures 2a and 2b, the width of the first and second support surfaces 103, 104 corresponds at least to the width of the edge region of the first and second encapsulation layers 2, 5 in which no solar cells 4 or solar modules 4 are arranged, so that after the first frame shell 101 and the second frame shell 102 have been joined together, this edge region is covered outwards by the first and second support surfaces 103, 104, i.e. towards the front of the frame onto which sunlight falls during operation. In the exemplary embodiment of Figures 2a and 2b, in particular the contact surfaces 9 are also covered outwards by the first and second support surfaces 103, 104, so that they are protected from direct sunlight.

[0111] The recess in the first frame shell 101 is further formed in the embodiment of Figures 2a and 2b such that after joining the first and second frame shells 101, 102, a larger gap is formed between respective side surfaces 106 of the recess and the laminated layer stack 7 in the region of the first encapsulation layer 2 and the second encapsulation layer 5 than in regions of the backside layer 6 and the frontside layer 1. The gap between the backside layer 6 and the side surfaces 106 of the second support surface 104, against which the backside layer 6 in the first frame shell 101 rests after joining the frame shells 101, 102, and the gap between the frontside layer 1 and the side surfaces 106 of the first support surface 103, against which the frontside layer 1 rests after joining the frame shells 101, 102, is smaller than the width b of the contact surfaces 9.As a result, the contact surfaces 9 can be contacted even in the event of lateral displacements of the laminated layer stack 7 in the first frame shell 101 without a correction of the position of the laminated layer stack 7.

[0112] In the exemplary embodiment of Figures 2a and 2b, the frame module 10 has a first sealing element 107 for sealing the first frame shell 101 against the front side layer 1, a second sealing element 108 for sealing the second frame shell 102 against the back side layer 6, and a third sealing element 109 for sealing the first frame shell 101 against the second frame shell 102. The first sealing element 107 is arranged on the first support surface 103 of the first frame shell 101, on which the front side layer 1 is in contact with the first frame shell 101 after the first and second frame shells 101, 102 have been joined together. The second sealing element 108 is arranged on the third support surface 105 on the second frame shell 102, on which the back layer 6 is in contact with the second frame shell 102 after the first and second frame shells 101, 102 have been joined together.The third sealing element 109 is arranged on a joining surface 112 of the first frame shell 101, at which the frame shells 101, 102 are in contact with one another after being joined together. For a detachable connection of the frame shells 101, 102, the sealing elements 107, 108, 109 in the exemplary embodiment of Figure 2b are designed as sealing cords that are inserted into circumferential grooves in the recess and / or at the opening 110, 111 in the respective frame shell 101, 102. Alternatively, however, a sealing compound can also be used as the sealing element. This can be applied, in particular sprayed, to the respective support or joining surface, in particular into circumferential grooves on these surfaces, in particular before the frame shells 101, 102 are joined together.

[0113] For the electrical contacting of the strings 3, the contacting contacts 13 in the embodiment of Figures 2a and 2b are formed on the third support surface 105 on the second frame shell 102, so that the contacting contacts 13 penetrate at least the back layer 6 and the second encapsulation layer 5 when the first and second frame shells 101, 102 are joined together. Alternatively or additionally, contacting contacts can also be arranged on support surfaces of the first frame shell 101, on which the laminated layer stack 7 is arranged in touching contact with the front layer 1 or the first encapsulation layer 2 after the first and second frame shells 101, 102 have been joined together, so that these are penetrated by the contacting contacts when the first and second frame shells 101, 102 are joined together.

[0114] The contacting contacts 13 are arranged substantially perpendicular to the support surfaces 103, 104, and 105, respectively, so that they penetrate the laminated layer stack 7 substantially perpendicularly for electrical contacting and contact the contact surface 9 substantially perpendicularly. For easy contacting, the contacting contacts 13 are spaced from each other at the same distance as the contact surfaces 9 in the plane of the laminated layer stack 7.

[0115] In the embodiment of Figures 2a and 2b, the contacting contacts 13 are advantageously designed as cutting contacts, but they can also be designed as terminals. The contacting contacts 13 can be designed as cutting plates or as contacting pins. The cutting plates can, in particular, be designed with a wedge-shaped cutting edge, and the contacting pins with a conically tapered tip.

[0116] The respective length of the contacting contacts 13, with which the contacting contacts 13 penetrate the laminated layer stack 7, can be at least the distance between a contact surface 9, which is contacted by the respective contacting contacts 13 when the frame shells 101, 102 are joined together, and the respective surface of the laminated layer stack 7, at which the laminated layer stack 7 is penetrated by the respective contacting contact 13 when the frame shells 101, 102 are joined together. If the laminated layer stack is penetrated at the rear layer 6, as in the example in Figure 2b, the length of a contacting contact 13 can be at least the distance between the outer surface of the rear layer 6 and the respective contact surface 9.

[0117] In the exemplary embodiment of Figure 2b, the length of all contacting contacts 13, with which the contacting contacts 13 penetrate the laminated layer stack 7, corresponds at least to the maximum distance between the contact surfaces 9 and the surface of the laminated layer stack 7, at which the laminated layer stack 7 is penetrated by the contacting contacts 13 for electrically contacting the contact surfaces 9 when joining the frame shells 101, 102. Because all contacting contacts 13 can penetrate at least the maximum distance between the contact surfaces 9 and the surface of the laminated layer stack 7, all contact surfaces 9 can be electrically contacted, even if they are vertically offset from one another in the laminated layer stack 7, and deviations in the vertical position of the contact surfaces 9 relative to one another can be easily compensated.Depending on the distance, the contacting contacts 13 can not only be brought into contact with the contact surface 9, but can also penetrate it, thereby providing additional positional fixation of the laminated layer stack 7.

[0118] In the exemplary embodiment of Figure 2, the contacting contacts 13 are particularly designed to contact a plurality of contact surfaces 9 (not shown) arranged vertically one above the other with respect to the plane of the laminated layer stack 7. The contact surfaces 9 arranged one above the other can, for example, be contact surfaces 9 of different, in particular adjacent, strings 3, solar cells 4, or solar modules 4. As a result, three-dimensional interconnections between solar cells 4 or solar modules 4, or strings 3 composed of solar cells 4 or solar modules 4, can be formed with the frame module.

[0119] For simple production of framed solar modules or arrays, the first frame shell 101 and / or the second frame shell 102 of the exemplary embodiment in Figures 2a and 2b are preferably designed as circuit-integrated circuit carriers 11. For this purpose, the electrical circuit 12 is arranged in a surface and / or on a surface of the first and / or second frame shell 101, 102, wherein the surface is electrically insulating. The electrical circuit 12 can, for example, be embedded or cast into the first frame shell 101 and / or second frame shell 102 and / or deposited or printed thereon, so that the respective frame shell 101, 102 represents a printed circuit board for the electrical circuit 12. The contacting contacts 13 can be fastened to or in an electrically insulating surface of the first and / or second frame shell 101, 102, e.g. cast, glued or screwed.Further examples of circuit-integrated circuit carriers 11 are shown in Figures 3 to 6.

[0120] The first frame shell 101 and / or the second frame shell 102 are advantageously made of an electrically insulating material for improved dielectric strength. In the exemplary embodiment in Figures 2a and 2b, the first frame shell 101 and / or the second frame shell 102 are made of electrically insulating plastic, in particular a thermoplastic. The frame shells 101, 102 are produced using a hot-pressing process or a plastics casting process, preferably a multi-component injection molding process, in particular a PCK process or an SKW process. Alternatively, the first frame shell 101 and / or the second frame shell 102 can also be made of a composite material or of metal, in particular aluminum. Frame shells 101, 102 made of metal can be produced in particular using a deep-drawing process or a metal casting process. The electrical circuit 12 and / or contacting contacts 13 can orcan be embedded in the first and / or second frame shell 101, 102, for example glued, cast, pressed or screwed into recesses. In this case, the electrical circuit 12 and / or the contacting contacts 13 in the case of frame shells 101, 102 made of metal can be arranged on an electrically insulating circuit board for electrical insulation or can be fastened to or in a surface of the frame shell with an electrically insulating adhesive or an electrically insulating potting compound. In the case of frame shells 101, 102 made of a composite material, it can be provided that surfaces of the composite material to and / or in which the electrical circuit 12 and / or the contacting contacts 13 are fastened are made of an electrically insulating material, e.g. plastic.

[0121] The electrical circuit 12 of the first frame shell 101 and / or the second frame shell 102 is designed to electrically connect the at least two strings 3 in series or parallel to one another. In addition to an electrical connection for connecting the strings 3, such as wires or busbars, the electrical circuit also comprises bypass diodes and / or blocking diodes to prevent overheating due to shading. The bypass diodes are connected in parallel to strings 3 and / or in parallel to individual solar cells 4 or solar modules 4. The blocking diodes are each connected in series with the strings 3.

[0122] In addition, at least one further component can be integrated into the frame shells 101, 102 as part of the electrical circuit 12, selected from the following: an inverter for converting a direct current of the at least two strings 3 into alternating current, a sensor system for regulating the operation of the solar module or the solar array, at least one accumulator for energy storage and a maximum power point tracker (MPP tracker). The MPP tracker can be integrated into the at least one inverter or into a charge controller for the accumulator of the electrical circuit or an external accumulator. For the integration of components of the electrical circuit 12, in particular the inverter, the sensor system, the accumulator or the charge controller, for the integration of further components for operating the solar module or array, for cable routing or also for weight reduction,or the second frame shell 102, further recesses or cavities (not shown) may also be provided. The first frame shell 101 and / or the second frame shell 102 can be designed, in particular, as hollow profiles. The further recesses can advantageously be formed on one of the joining surfaces 112, 113 of the first and second frame shells 101, 102, so that they are accessible when the frame module is opened.

[0123] With reference to Figures 3a to 3c, another embodiment of the frame module is explained, in which a frame module 10' does not contain frame shells or other frame preforms, but rather a circuit carrier 11', from which alone no frame of the framed solar module can be produced. In other words: Such a frame module 10' must still be encased with a material in order to create a frame, wherein the laminated layer stack 7 is simultaneously encased or enclosed during the encasing process. Such an encasing process can be produced, for example, by back-molding the circuit carrier 1T and the edge region of the layer stack 7 with a plastic. The circuit carrier 1T can, for example, be a plastic film to which a circuit 12 and contact contacts 13 are applied. Fig. 3a schematically shows a cross-section through such a frame module 1T, while Fig. 3b schematically shows a top view of the frame module 1T.Fig. 3C shows schematically a part of a cross-section of a framed solar module produced using the frame module 1T.

[0124] As can be seen in Fig. 3b, the circuit carrier 1T can be designed such that it contains the contacting contacts 13, which contact the contact surfaces at both ends of the strings of the laminated layer stack, and interconnects them via the circuit 12. Of course, the circuit carrier 1T can also consist of several subcarriers, each of which contains only contacting contacts 13 for the contact surfaces at one end of the string and which are interconnected in another way, for example, outside the frame to be produced.

[0125] Fig. 3c shows part of a framed solar module in which the frame 100' contains an injection molding compound 114 that encloses the edge of the laminated layer stack 7 and the circuit carrier 1T. Since the injection molding compound 114 lies tightly against the surfaces of the laminated layer stack 7, additional sealing elements can be omitted in this case. In other embodiments, however, additional sealing elements can also be provided during the production of the frame and inserted into the frame. During the encapsulation of the laminated layer stack 7 and the circuit carrier 1T arranged correspondingly thereto, e.g., in an injection molding machine, the circuit carrier 11' is pressed against the layer stack 7 such that the contacting contacts 13 penetrate the layer stack 7, here the backside layer 6 and the second encapsulation layer 5, and electrically contact the contact surfaces 9.In the illustrated case, the contacting contacts 13 do not penetrate the contact surfaces 9. Of course, the contacting contacts 13 can also penetrate the contact surfaces 9, similar to what is shown in Fig. 2b.

[0126] The statements regarding the arrangement, width and length of the contacting contacts 13 within the circuit carrier 11 as well as regarding components of the electrical circuit 12, which were made with reference to Figures 2a and 2b, can also apply to the circuit carrier 11'.

[0127] Figures 4 to 7 each show a schematic, not-to-scale plan view of exemplary embodiments of electrical circuits 12 of frame modules according to the invention, such as the frame module 10 in Figures 2a and 2b. For better illustration, internal electrical connections and components of the electrical circuits 12, which would be hidden in a plan view of, for example, the first frame shell 101, are also shown. The electrical connections between the contacting contacts 13 and / or components of the electrical circuit 12 can be, for example, wires, cables or busbars. The electrical connections and components of the electrical circuit 12 can, for example, be arranged in or on at least one side surface, support surface and / or joining surface of the first and / or second frame shell 101, 102. Components of the electrical circuit 12 can, for example,Bypass diodes 121, blocking diodes 122 or further components 123 for the operation of the solar module or array. Such further components 123 can be, for example, at least one inverter for converting a direct current of the at least two strings 3 into alternating current, a sensor system for regulating the operation of the solar module or array, at least one accumulator for energy storage and / or a maximum power point tracker (MPP tracker). The MPP tracker can be integrated into the at least one inverter or into a charge controller for the accumulator of the electrical circuit or for an external accumulator. Figure 4 schematically shows an embodiment of a series connection of strings 3 in a front plan view of a framed solar module or array.For a series connection of the strings 3, they are each arranged with opposite polarity to one another, so that opposite polarity contact surfaces 9 of the strings 3 are arranged next to one another in an edge region parallel to an outer edge of the laminated layer stack 7 and are interconnected via the contacting contacts 13 and an electrical connection between the contacting contacts 13 in the frame module 10. In the strings 3, the solar cells 4 or modules 4 are each electrically connected in series in this example. Furthermore, in the example in Figure 4, bypass diodes 121 are connected in parallel to the strings 3. Alternatively or additionally, bypass diodes can also be connected in parallel to individual solar cells 4 or solar modules 4.

[0128] Figure 5 schematically shows an embodiment of a parallel connection of strings 3 in a front view of a framed solar module or array. For the parallel connection of the strings 3, they are each arranged with the same polarity to one another, so that contact surfaces 9 of the strings 3, each with the same polarity, are arranged next to one another in an edge region parallel to an outer edge of the laminated layer stack 7 and are interconnected via the contact contacts 13 and an electrical connection between the contact contacts 13 in the frame module 10. In the strings 3, the solar cells 4 or modules 4 are each electrically connected in series in this example. Furthermore, in the example in Figure 5, blocking diodes 122 are each connected in series with the strings 3; alternatively or additionally, blocking diodes can also be connected in parallel with individual solar cells 4 or solar modules 4.

[0129] Figure 6 schematically shows an embodiment of a series connection of strings 3 in a front view of a framed solar module or array. In contrast to the example in Figure 4, the solar cells 4 or modules 4 in the strings 3 are electrically connected in parallel to one another. The strings 3 are arranged with the same polarity, with opposite-polar contact surfaces 9 of the strings 3 being arranged next to one another in an edge region parallel to an outer edge of the laminated layer stack 7 and being interconnected via the contacting contacts 13 and an electrical connection between the contacting contacts 13 in the frame module 10. Furthermore, in the example in Figure 6, bypass diodes 121 are connected in parallel to the strings 3. Alternatively or additionally, blocking diodes can also be connected in series with individual solar cells 4 or solar modules 4.Figure 7 schematically shows an embodiment of a parallel connection of strings 3 in a front view of a framed solar module or array. In contrast to the example in Figure 5, the solar cells 4 or modules 4 in the strings 3 are electrically connected in parallel to one another. The strings 3 are arranged with the same polarity, with contact surfaces 9 of the strings 3, each with the same polarity, being arranged next to one another in an edge region parallel to an outer edge of the laminated layer stack 7 and being interconnected by the contacting contacts 13 and an electrical connection between the contacting contacts 13 in the frame module 10. Furthermore, in the example in Figure 7, blocking diodes 122 are each connected in series with the strings 3. Alternatively or additionally, blocking diodes can also be connected in series with individual solar cells 4 or solar modules 4.

[0130] List of reference symbols

Claims

Patent claims 1. A method for producing a framed solar module from solar cells or a framed solar array from solar modules, comprising the steps: a) providing a layer stack (7) comprising a front layer (1), a first encapsulation layer (2), at least two strings (3) of solar cells (4) or solar modules (4), a second encapsulation layer (5) and a back layer (6), wherein the solar cells (4) or solar modules (4') in the at least two strings (3) are each electrically connected in series or electrically parallel to one another by an electrically conductive conductor structure (8), an electrically conductive contact surface (9) is formed on the electrically conductive conductor structure (8) at each end of the at least two strings (3), the layer stack is laminated in such a way thatthat by laminating the first encapsulation layer (2) and the second encapsulation layer (5), the at least two strings (3) are surrounded by the first encapsulation layer (2) and the second encapsulation layer (5), b) providing a frame module (10, 10') which contains a circuit carrier (11, 11') with an electrical circuit (12) and electrically conductive contact contacts (13), and c) producing a framed solar module or framed solar array from the layer stack (7) and the frame module (10, 10'), wherein the layer stack (7) and the frame module (10, 10') are joined together and a frame (100, 100') is produced, so that the framed solar module or the framed solar array contains the frame (100, 100') in which the circuit carrier (11, 11') is integrated, wherein Producing the frame (100, 100') in step c) the electrically conductive contacting contacts (13) the layer stack (7),at least up to the electrically conductive contact surfaces (9), and electrically contact at least one electrically conductive contact surface (9) in each case, so that an electrical contact is formed between the at least two strings (3) and the electrical circuit (12).

2. Method according to claim 1, characterized in that the electrically conductive contacting contacts (13) each penetrate at least the rear side layer (6) and / or the second encapsulation layer (5) or the front side layer (1) and / or the first encapsulation layer (2).

3. Method according to one of the preceding claims, characterized in that the circuit carrier (11') and the layer stack (7) are placed in a mold and the frame (100') is produced by a primary molding process, wherein the circuit carrier (11') is integrated into the frame (100').

4. Method according to one of claims 1 or 2, characterized in that the frame module (10) contains a first frame shell (101) and a second frame shell (102), wherein the circuit carrier (11) is integrated into the first frame shell (101) and / or into the second frame shell (102); the layer stack (7) is arranged between the first frame shell (101) and the second frame shell (102), and the frame (100) is produced by joining the first frame shell (101) and the second frame shell (102).

5. Method according to claim 4, characterized in that the first frame shell (101) and the second frame shell (102) are each designed as self-contained frame shells, in particular monolithic frame shells.

6. Method according to one of claims 4 or 5, characterized in that the layer stack (7) for joining the first frame shell (101) and the second frame shell (102) is inserted into a recess in the first frame shell (101) or in the second frame shell (102).

7. Method according to one of claims 4 to 6, characterized in that outer edges of the front layer (1) and the first encapsulation layer (2) are offset from one another with respect to the plane of the laminated layer stack (7), so that the outer edges of the respective layers are each arranged on mutually offset support surfaces of the first frame shells (101) when the first frame shells (101) and the second frame shells (102) are joined together.

8. Method according to one of the preceding claims, characterized in that the electrically conductive contacting contacts (13) are designed as terminals or as cutting contacts, in particular as cutting plates or contacting pins.

9. Frame module (10, 10') for producing a framed solar module or a framed solar array with a frame (100, 100') and a laminated layer stack (7), comprising a front layer (1), a first encapsulation layer (2), at least two strings (3) of solar cells (4) or solar modules (4), a second encapsulation layer (5) and a backside layer (6), wherein the solar cells (4) or solar modules (4') in the at least two strings (3) are each electrically connected in series or electrically parallel to one another by means of an electrically conductive conductor structure (8), an electrically conductive contact surface (9) is formed on the electrically conductive conductor structure (8) at each end of the at least two strings (3), characterized in that the frame module (10, 10') contains a circuit carrier (11, 11') with an electrical circuit (12) and electrically conductive contacting contacts (13), so that when the frame (100, 100') is produced, the electrically conductive contacting contacts (13) contact the laminated layer stack (7), at least up to the electrically conductive contact surfaces (9),penetrate and electrically contact at least one electrically conductive contact surface (9) and form an electrical contact between the at least two strings (3) and the electrical circuit (12).

10. Frame module according to claim 9, characterized in that the frame module (10) has a first frame shell (101) and a second frame shell (102) which can be joined together to form the frame (100) and are designed such that the laminated layer stack (7) can be arranged between the first frame shell (101) and the second frame shell (102), and the circuit carrier (11) is designed to be integrated in the first frame shell (101) and / or the second frame shell (102) such that when the first frame shell (101) and the second frame shell (102) are joined together, the electrically conductive contacting contacts (13) penetrate the laminated layer stack (7), at least as far as the electrically conductive contact surfaces (9), and each electrically contact at least one electrically conductive contact surface (9) and form an electrical contact between the at least two strings (3) and the electrical circuit (12).

11. Frame module according to claim 10, characterized in that the first frame shell (101) and the second frame shell (102) are designed as self-contained frame shells, in particular monolithic frame shells.

12. Frame module according to claim 10 or 11, characterized in that the first frame shell (101) has a recess which is substantially congruent with the laminated layer stack (7), wherein the recess has at least one support surface (103, 104).

13. Frame module according to one of claims 9 to 12, characterized in that the electrically conductive contacting contacts (13) are designed as insulation displacement terminals or as cutting contacts, in particular as cutting plates or contacting pins.

14. Frame module according to one of claims 9 to 13, characterized in that the first frame shell (101) and / or the second frame shell (102) consist of an electrically insulating material, in particular plastic.

15. Use of a frame module (10) according to one of claims 9 to 14 for producing a framed solar module or a framed solar array.

16. Solar array or solar module comprising a frame (100, 100') produced from a frame module (10, 10') according to one of claims 9 to 14.

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