Light-emitting assembly, display panel, and preparation method for light-emitting assembly

Abstract

A light-emitting assembly, a display panel, and a preparation method for a light-emitting assembly. The light-emitting assembly comprises: a light-emitting unit, a driving unit and a plurality of pins, wherein the light-emitting unit comprises a first electrode, a second electrode and a light-emitting portion; the driving unit comprises a third electrode, a fourth electrode and a driving portion, the third electrode and the fourth electrode are both located on the side of the driving unit that faces the light-emitting unit, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode; the plurality of pins are all located on the side of the driving unit that faces away from the light-emitting unit, and are electrically connected to the driving circuit; a first filling portion, a second filling portion and a third filling portion are comprised between the light-emitting unit and the driving unit; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the thickness of the third filling portion; the second filling portion comes into contact with the first electrode and the third electrode, respectively; and the third filling portion comes into contact with the second electrode and the fourth electrode, respectively.

Description

Light-emitting component, display panel, and method for preparing light-emitting component

[0001] This application claims priority to the Chinese patent application No. 202310667117.4 filed with the China Patent Office on June 6, 2023, the contents of which should be understood as incorporated by reference into this application. Technical Field

[0002] The embodiments of the present disclosure relate to, but are not limited to, the display field, and in particular to a light-emitting component, a display panel, and a method for manufacturing the light-emitting component. Background Art

[0003] Micro LED (Micro Light Emitting Diode) display panels consist of a driver unit integrated into a display backplane and a light-emitting chip bonded to the driver unit. The driver unit is located within the display backplane and integrated with the display backplane through semiconductor processing. However, due to individual defects in the driver unit and the difficulty in repairing them, the production yield of the display backplane is low, resulting in a high number of bad pixels on the display panel.

[0004] Summary of the Invention

[0005] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0006] Embodiments of the present disclosure provide a light-emitting component, a display panel, and a method for manufacturing a light-emitting component, comprising: a light-emitting unit, the light-emitting unit comprising a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode, respectively; a driving unit, the driving unit comprising a third electrode, a fourth electrode, and a driving portion, the third electrode and the fourth electrode both being located on a side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode being electrically connected to a driving circuit in the driving portion, the third electrode being electrically connected to the first electrode, and the fourth electrode being electrically connected to the second electrode, respectively; and a plurality of pins, the plurality of pins being located on a side of the driving unit facing away from the light-emitting unit and electrically connected to the driving circuit, wherein a first filling portion, a second filling portion, and a third filling portion are provided between the light-emitting unit and the driving unit; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the thickness of the third filling portion, respectively; the second filling portion is located between the first electrode and the third electrode and is in contact with the first electrode and the third electrode, respectively; and the third filling portion is located between the second electrode and the fourth electrode and is in contact with the second electrode and the fourth electrode, respectively.

[0007] In some embodiments, at least one of the multiple pins includes a first metal layer and a second metal layer stacked together, and the first metal layer is located between the second metal layer and the driving unit; wherein the material of the first metal layer includes nickel, and the material of the second metal layer includes gold.

[0008] In some embodiments, the first filling portion is insulating, the second filling portion is conductive, and the third filling portion is conductive; the first filling portion is in direct contact with the second filling portion; the first filling portion is in direct contact with the third filling portion; and a portion of the first filling portion is located between the second filling portion and the third filling portion.

[0009] In some embodiments, the density of the first filling portion is less than the density of the second filling portion; and the density of the first filling portion is less than the density of the third filling portion.

[0010] In some embodiments, the light-emitting component includes a transparent substrate, which is located on a side of the light-emitting unit away from the driving unit; and an orthographic projection of the first filling portion on a plane where the transparent substrate is located is located within the transparent substrate.

[0011] In some embodiments, an outer contour of an orthographic projection of the first filling portion on a plane where the transparent substrate is located coincides with an outer contour of the transparent substrate.

[0012] In some embodiments, the light-emitting component includes a transparent substrate, which is located on a side of the light-emitting unit away from the driving unit; the light-emitting unit includes a light-emitting part, which includes: a raised electrode, a first insulating layer, and a second doped layer, a multi-quantum well layer, and a first doped layer stacked in sequence away from the transparent substrate; wherein, the second electrode is located on a side of the first doped layer away from the multi-quantum well layer, and the first doped layer is electrically connected to the second electrode; the raised electrode is located between the second doped layer and the first electrode, and is electrically connected to the second doped layer and the first electrode, respectively; the first insulating layer is located on a side of the first doped layer away from the transparent substrate, and is arranged in contact with the first doped layer.

[0013] In some embodiments, the first filling portion includes a first sub-filling portion and a second sub-filling portion; the orthographic projection of the first sub-filling portion on the plane where the transparent substrate is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate is located; wherein, the second sub-filling portion is at least partially located between the raised electrode and the multi-quantum well layer, and the first sub-filling portion is arranged as a whole around the raised electrode, the multi-quantum well layer, and the second sub-filling portion.

[0014] In some embodiments, the thickness of the first sub-filling portion is greater than or equal to the distance between the first insulating layer and the driving portion; the thickness of the second sub-filling portion is equal to the maximum distance between the first insulating layer and the driving portion.

[0015] In some embodiments, the first sub-filling portion includes at least a portion located between the transparent substrate and the driving portion; the relationship between the thickness T1 of the first sub-filling portion located between the transparent substrate and the driving portion and the thickness T2 of the second sub-filling portion satisfies: 0.5T1 <T2<0.95T1。

[0016] In some embodiments, the light-emitting component includes a plurality of light-emitting units and the driving unit corresponding to the plurality of light-emitting units; the plurality of light-emitting units include a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit, wherein the first color emitted by the first color light-emitting unit, the second color emitted by the second color light-emitting unit and the third color emitted by the third color light-emitting unit are different from each other; the light-emitting unit includes a color filter layer, a color conversion layer and a light-emitting part stacked in sequence in a direction away from the transparent substrate; the light-emitting color of the light-emitting part is blue; wherein the light-emitting part includes a first light-emitting part, a second light-emitting part and a third light-emitting part, the first light-emitting part is located in the first color light-emitting unit, the second light-emitting part is located in the second color light-emitting unit, and the third light-emitting part is located in the third color light-emitting unit.

[0017] In some embodiments, the driving unit further includes a substrate and a connecting structure, the substrate having a connecting via, the connecting structure being located within the connecting via, and the driving circuit being located on a side of the substrate close to the light-emitting unit; the pin being located on a side of the substrate away from the driving circuit, and the pin being in contact with the connecting structure, and the pin and the driving circuit being connected through the connecting structure.

[0018] In some embodiments, the driving circuit includes one or more thin film transistors, each of which includes a gate, a source, and a drain; one of the multiple pins is connected to the source of the thin film transistor, and is used to provide the driving circuit with a data driving signal transmitted from the display backplane in the display panel.

[0019] In some embodiments, the driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain layer and a planar layer located on one side of the substrate and stacked in sequence; the third electrode and the fourth electrode are located on the side of the planar layer away from the substrate; the active layer includes one or more active patterns corresponding to the one or more thin film transistors, and the active pattern includes a source region, a drain region and a channel region; the source and the drain of the thin film transistor are located in the source-drain layer, the source of the thin film transistor is connected to the source region, and the drain of the thin film transistor is connected to the drain region; the first gate layer includes one or more gate patterns corresponding to the one or more thin film transistors, and the channel region is the overlapping area of ​​the positive projection of the gate pattern on the substrate and the positive projection of the active pattern on the substrate.

[0020] In some embodiments, the area of ​​the orthographic projection of the pin on the substrate is larger than the area of ​​the orthographic projection of the connection structure on the substrate, and the orthographic projection of the pin on the substrate covers the orthographic projection of the connection structure on the substrate.

[0021] On the other hand, an embodiment of the present disclosure proposes a display panel, which includes a display backplane, and a plurality of light-emitting components described in any embodiment of the present disclosure, which are located on one side of the display backplane and arranged in an array; wherein the display backplane is used to provide a driving signal to a driving unit through a plurality of pins in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light.

[0022] On the other hand, an embodiment of the present disclosure proposes a method for preparing a light-emitting component, which is used to prepare the light-emitting component provided by any embodiment of the present disclosure, including: pressing the anisotropic conductive adhesive film to be compressed, the light-emitting unit and the driving unit to obtain a bonded light-emitting component, wherein the pressed anisotropic conductive adhesive film includes: a first filling part, a second filling part and a third filling part; the first filling part surrounds the second filling part and the third filling part, and the thickness of the first filling part is greater than the thickness of the second filling part and the thickness of the third filling part; the second filling part is located between the first electrode of the light-emitting unit and the third electrode of the driving unit, and is respectively in contact with the first electrode and the third electrode; the third filling part is located between the second electrode of the light-emitting unit and the fourth electrode of the driving unit, and is respectively in contact with the second electrode and the fourth electrode; the bonded light-emitting component is placed in a target solution for electroplating or chemical plating process to obtain a light-emitting component with multiple pins on the driving unit.

[0023] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description.

[0024] Summary of the Figures

[0025] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0026] FIG1 is a schematic cross-sectional view of a light-emitting assembly according to an embodiment of the present disclosure;

[0027] FIG2 is a schematic cross-sectional view of a light-emitting assembly without a first filling portion provided in an embodiment of the present disclosure;

[0028] FIG3 is a schematic diagram of a first filling portion surrounding a light-emitting unit according to an embodiment of the present disclosure;

[0029] FIG4 is a process flow chart of preparing a light-emitting component according to an embodiment of the present disclosure;

[0030] FIG5A is a schematic cross-sectional view of a light-emitting assembly according to an embodiment of the present disclosure;

[0031] FIG5B is a partial schematic diagram of FIG5A;

[0032] FIG6 is a schematic cross-sectional view of a driving circuit according to an embodiment of the present disclosure;

[0033] FIG7 is a flow chart of a method for preparing a light-emitting component provided in an embodiment of the present disclosure.

[0034] Details

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0036] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0037] As used in this disclosure, "A and B are disposed in the same layer" means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer refers to the dimension of the film layer in a direction perpendicular to the display device. In exemplary embodiments of this disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A contains the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or that the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0038] In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of known functions and known components.

[0039] The present disclosure provides a light emitting assembly, the cross-sectional structure of which is shown in FIG1 , including:

[0040] A light-emitting unit, comprising a first electrode 1, a second electrode 2, and a light-emitting portion 5 electrically connected to the first electrode 1 and the second electrode 2;

[0041] A driving unit, the driving unit comprising a third electrode 3, a fourth electrode 4, and a driving portion 6. The third electrode 3 and the fourth electrode 4 are both located on a side of the driving unit facing the light-emitting unit. The third electrode 3 and the fourth electrode 4 are respectively electrically connected to a driving circuit 63 (see FIG. 5 ) in the driving portion 6. The third electrode 3 is electrically connected to the first electrode 1, and the fourth electrode 4 is electrically connected to the second electrode 2.

[0042] Multiple pins 7, each of which is located on a side of the driving unit away from the light-emitting unit and is electrically connected to the driving circuit 63;

[0043] Among them, a first filling part 10, a second filling part 8 and a third filling part 9 are included between the light-emitting unit and the driving unit. The first filling part surrounds the second filling part and the third filling part, and the thickness of the first filling part 10 is greater than the thickness of the second filling part 8 and the thickness of the third filling part 9; the second filling part 8 is located between the first electrode 1 and the third electrode 3, and is respectively in contact with the first electrode 1 and the third electrode 3; the third filling part 9 is located between the second electrode 2 and the fourth electrode 4, and is respectively in contact with the second electrode 2 and the fourth electrode 4.

[0044] Related technology When preparing a Micro LED display panel, in order to achieve color display, it is necessary to transfer and bond light-emitting chips of different colors to a display backplane integrated with a driving unit, and light-emitting chips of the same color are transferred at the same time, and light-emitting chips of different colors are transferred in batches. That is, the number of transfers is the number of colors of the light-emitting chip. Exemplarily, the light-emitting chip includes light-emitting chips of three colors, for example, a red (R) light-emitting chip, a green (G) light-emitting chip, and a blue (B) light-emitting chip, and three transfers are required. This solution requires more transfers when preparing a Micro LED display panel, and the process is more complicated.

[0045] Furthermore, to reduce the manufacturing cost of Micro LED display panels, the display backplane cannot be designed too large. If the size is too large, if some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped, resulting in high costs. Therefore, if this solution needs to achieve a large-scale display, it can only be achieved through splicing, which results in poor display quality.

[0046] The embodiment of the present disclosure bonds the display chip and the driving unit separately. For the red, green and blue micro display chip (RGB Micro LED), it can be bonded to the driving unit to form a new active-matrix light-emitting diode (AM-LED) chip with its own driving circuit 63. The AM-LED chip includes light-emitting chips of three colors, red, green and blue, and a driving unit for the light-emitting chip. Therefore, depending on the size of the display panel to be prepared, a corresponding number of AM-LED chips are used to perform one-time transfer bonding with the display backplane to realize the preparation of a glass-based color light-emitting diode (LED) display panel. Moreover, this solution only requires one transfer process, and the process is relatively simple. Moreover, large-size display can be achieved without splicing, which can improve the glass utilization rate of the display backplane, thereby reducing costs.

[0047] Furthermore, the AM-LED chip can be tested both electrically and optically through testing technology, selecting chips that meet both optical and driving performance requirements. This improves the yield of chips on the display panel and facilitates the repair and replacement of defective chips, compared to solutions that integrate the driver circuit 63 onto the display backplane to form a display panel.

[0048] Before bonding the AM-LED chip to the display backplane, a bump 7 (bonding pin) must be fabricated on the AM-LED chip. This bump is typically prepared using electroplating or chemical plating. During this process, the AM-LED chip must be placed in a specific solution. Contact between the electrodes bonded to the AM-LED chip and the driver unit and the solution can cause short circuits, open circuits, or device failure. The cross-sectional structure of the aforementioned light-emitting assembly without the first filler 10 can be as shown in Figure 2. The gaps between the bumps allow the plating solution to seep into the pins 7 during electroplating.

[0049] However, in the embodiment of the present disclosure, the first filling part 10 is filled in the gap between the electrical connection part of the light-emitting unit and the driving unit, and the thickness of the first filling part 10 is respectively greater than the thickness of the second filling part 8 and the third filling part 9, thereby at least protecting the second filling part 8 and the third filling part 9 from being corroded during the electroplating process of the pin 7. By controlling the set thickness of the first filling part 10, it can be ensured that the second filling part 8, the third filling part 9, and even the electrode of the light-emitting component are not corroded by the electroplating solution, and the light-emitting component will not have short circuit or device failure problems, thereby further improving product performance.

[0050] In actual implementation, the thicker the thickness of the first filling portion 10 is, the less the first electrode 1 and the second electrode 2 are exposed, and in the subsequent process of electroplating the pin 7, the less the first electrode 1 and the second electrode 2 are corroded by the plating solution. In an optional embodiment, the thickness of the first filling portion 10 is set to be greater than the sum of the thickness of the first electrode 1, the thickness of the third electrode 3 and the thickness of the second filling portion 8; since the thickness of the second electrode 2 is the same as the thickness of the first electrode 1, the thickness of the fourth electrode 4 is the same as the thickness of the third electrode 3, and the thickness of the third filling portion 9 is the same as the thickness of the second filling portion 8, the thickness of the above-mentioned first filling portion 10 can also be greater than the sum of the thickness of the second electrode 2, the thickness of the fourth electrode 4 and the thickness of the third filling portion 9.

[0051] In some embodiments, the thickness of the first filling portion 10 is greater than the sum of the thickness of the first electrode 1, the thickness of the third electrode 3, and the thickness of the second filling portion 8. Referring to FIG1 , the first filling portion 10 has at least a first thickness portion and a second thickness portion, wherein the thickness of the first thickness portion is a first thickness, and the thickness of the second thickness portion is a second thickness. The first thickness is greater than the distance between the first surface of the light-emitting portion 5 and the first surface of the driver portion 6, and is less than or equal to the distance between the second surface of the light-emitting portion 5 and the first surface of the driver portion 6; the second thickness is less than or equal to the distance between the first surface of the light-emitting portion 5 and the first surface of the driver portion 6. The second surface of the light-emitting portion 5 is the surface of the light-emitting portion 5 away from the driver portion 6, and the first surface of the driver portion 6 and the first surface of the light-emitting portion 5 are arranged opposite each other.

[0052] In some embodiments, the first filling portion 10 is arranged to surround the light-emitting unit, and the light-emitting unit includes a plurality of electrodes connected to the driving unit, and the plurality of electrodes include a first electrode 1 and a second electrode 2. Referring to Figure 3, the number of electrodes is, for example, 4, including 3 first electrodes 1 and 1 second electrode 2, wherein the 3 first electrodes 1 correspond to the red, green and blue sub-pixels of the light-emitting unit, respectively, and provide driving signals for the 3 sub-pixels respectively; 1 second electrode 2 is electrically connected to the red, green and blue sub-pixels, respectively, as a common electrode; correspondingly, the driving unit also has 4 electrodes, which are electrically connected to the 4 electrodes of the light-emitting unit respectively. For example, the first electrode 1 can be the anode of the light-emitting unit, and the second electrode 2 can be the cathode of the light-emitting unit. For example, the first electrode 1 can be the cathode of the light-emitting unit, and the second electrode 2 can be the anode of the light-emitting unit. For example, in order to ensure that the first filling portion 10 has a better protection effect, referring to FIG3 , the first filling portion 10 has a first thickness portion and a second thickness portion, the thickness of the first thickness portion is the first thickness, and the thickness of the second thickness portion is the second thickness, wherein the first thickness portion 101 is arranged around the second thickness portion 102, and the first thickness portion 101 and the second thickness portion 102 are arranged in contact, wherein the minimum distance n between the inner boundary and the outer boundary of the first thickness portion 101 is greater than or equal to 20 microns. In one embodiment, the orthographic projection of the inner boundary of the first thickness portion 101 on the plane where the driver 6 is located coincides with the orthographic projection of the light-emitting portion 5 on the plane where the driver 6 is located. It should be noted that the plane where the driver 6 is located can be understood as a plane perpendicular to the stacking direction of the film layer of the driver 6.

[0053] In some embodiments, the first filling portion 10 is in direct contact with the second filling portion 8, and the first filling portion 10 is also in direct contact with the third filling portion 9. A portion of the first filling portion 10 is located between the second filling portion 8 and the third filling portion 9, that is, the gap between the anode and cathode of the light-emitting unit due to the lack of contact (that is, the gap in the middle of Figure 2) will also be filled by the first filling portion 10. The first filling portion 10 surrounds the second filling portion 8 and the third filling portion 9, completely surrounding the second filling portion 8 and completely surrounding the third filling portion 9.

[0054] To ensure that the basic functions of the light-emitting component are not impaired, the first filling portion 10 should be insulating, the second filling portion 8 should be conductive, and the third filling portion 9 should also be conductive. The first filling portion 10, the second filling portion 8, and the third filling portion 9 can be made of different materials, or they can be made of the same material. If the first filling portion 10, the second filling portion 8, and the third filling portion 9 are made of different materials, the preparation of the first filling portion 10 will be additionally required compared to using the same materials.

[0055] Since the first filling portion 10, the second filling portion 8, and the third filling portion 9 have different electrical conductivities, when selecting the same material for preparation, it is necessary to consider that the material should have different conductivities in different states. In the embodiment of the present disclosure, anisotropic conductive film (ACF) is selected as an example. The anisotropic conductive film is insulating in a normal state or when not compressed to a certain proportion, and begins to be conductive after being compressed to a certain proportion.

[0056] In some embodiments, the process flow for preparing a light-emitting component using anisotropic conductive adhesive can be as shown in Figure 4. First, an independent driving unit, a light-emitting unit and anisotropic conductive adhesive film are prepared, and then the light-emitting unit and the driving unit are bonded according to a predetermined processing technology to compress the anisotropic conductive adhesive film between the first electrode 1 and the third electrode 3 into a second filling part 8, and compress the anisotropic conductive adhesive film between the second electrode 2 and the fourth electrode 4 into a third filling part 9. The other anisotropic conductive adhesive films constitute the first filling part 10. Subsequently, the glass substrate on the lower side of the driving unit is removed, and a pin 7 connected to the driving unit electrode is prepared on the surface after the glass substrate is removed, and then connected to the data line through the pin 7 to receive the control signal.

[0057] In order to ensure that the first filling part 10 can play a sufficient protective role, the density of the first filling part 10 can be lower than the density of the second filling part 8, and the density of the first filling part 10 can be lower than the density of the third filling part 9, so that the first filling part 10 can be tightly wrapped around the outside of the second filling part 8 and the outside of the third filling part 9, avoiding corrosion from the plating solution during the electroplating process.

[0058] In some embodiments, the second thickness portion 102, the second filling portion 8, and the third filling portion 9 are formed by compression of an anisotropic conductive film; the relationship between the thickness M1 of the second thickness portion 102 before compression and the second thickness M2 satisfies: 0.5M1 < M2 < 0.95M1. Here, M2 being less than 95% of M1 can prevent defects such as bubbles and delamination caused by insufficient filling of the second sub-filling portion 12 in the thickness direction; moreover, M2 being greater than 50% of M1 can prevent the second sub-filling portion 12 from overflowing due to the excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thus causing poor conductivity. For example, the second thickness can be determined as follows: M2 ≥ k*d + l, where k is the upper limit of the compression ratio that enables the conductive particles in the ACF conductive adhesive to have good conductivity, d is the average particle size of the conductive particles in the compression direction before compression, and l is the sum of the distance between the surface of the first electrode 1 close to the second filling portion 8 and the surface of the light-emitting portion 5 close to the first electrode 1, and the distance between the surface of the third electrode 3 close to the second filling portion 8 and the surface of the driving portion 6 close to the third electrode 3, that is, l is the sum of the thickness (or height) of the first electrode 1 and the thickness of the third electrode 3, or l can be the sum of the thickness of the second electrode 2 and the thickness of the fourth electrode 4. Therefore, k*d is the minimum compression degree that enables the conductive particles to have conductivity in the compression direction. For example, M2 = k*d + l. For example, M2 > k*d + l. For example, if the average particle size in the compression direction is 2 microns and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 microns and k is taken as 80%. Thus, it can guide how to design the second thickness M2.

[0059] Since the embodiments of the present disclosure involve the first electrode 1 and the second electrode 2 of the light-emitting unit, and the third electrode 3 and the fourth electrode 4 of the driving unit, the main structures of its light-emitting portion 5 and driving portion 6 are only shown schematically in FIG. 1. The structures of the light-emitting unit and the driving unit do not limit the embodiments of the present disclosure. As long as the first electrode 1 and the third electrode 3 are electrically connected, the second electrode 2 and the fourth electrode 4 are electrically connected, and there is a gap around the two electrically connected portions after connection, the solutions provided by the embodiments of the present disclosure are applicable.

[0060] The embodiment of the present disclosure provides a light-emitting component, which bonds a light-emitting unit to a driving unit to form a new chip with a built-in driving circuit 63. The light-emitting component and the display backplane only need a one-time transfer bonding, the process is simple, and the product yield is improved. The first filling part 10 is filled in the interval gap between the electrical connection part of the light-emitting unit and the driving unit. The thickness of the first filling part 10 is respectively greater than the thickness of the second filling part 8 and the thickness of the third filling part 9, thereby at least protecting the second filling part 8 and the third filling part 9 from corrosion during the electroplating process of the pin 7. By controlling the set thickness of the first filling part 10, it can be ensured that the second filling part 8, the third filling part 9, and even the electrode of the light-emitting component are not corroded by the electroplating solution, the light-emitting component will not have short circuit or device failure problems, and the product performance is improved.

[0061] The pins 7 of the disclosed embodiment are formed by electroplating. At least one of the multiple pins 7 includes a first metal layer and a second metal layer stacked together, with the first metal layer positioned between the second metal layer and the driver unit. The first metal layer may be made of nickel, and the second metal layer may be made of gold. Subsequently, soldering can be used to securely connect the pins 7 to the pads on the display backplane.

[0062] As shown in FIG4 , the light-emitting assembly of the present embodiment includes a transparent substrate 57, which is located on a side of the light-emitting unit away from the driving unit. The transparent substrate 57 is, for example, a glass substrate. As shown in FIG4 , in an optional embodiment, the orthographic projection of the first filling portion 10 on the plane where the transparent substrate 57 is located is located within the transparent substrate 57. For example, the outer contour of the orthographic projection of the first filling portion 10 on the plane where the transparent substrate 57 is located coincides with the outer contour of the transparent substrate 57.

[0063] In some embodiments, the structure of the light-emitting portion 5 of the light-emitting unit can be as shown in Figure 5A, where the light-emitting portion 5 includes: a raised electrode 51, a first insulating layer 58, and a second doped layer 54, a multi-quantum well layer 53, and a first doped layer 52 stacked in sequence away from the transparent substrate 57; wherein the second electrode 2 is located on the side of the first doped layer 52 away from the multi-quantum well layer 53, and the first doped layer 52 is electrically connected to the second electrode 2; the raised electrode 51 is located between the second doped layer 54 and the first electrode 1, and is electrically connected to the second doped layer 54 and the first electrode 1, respectively; the first insulating layer 58 is located on the side of the first doped layer 52 away from the transparent substrate 57, and is arranged in contact with the first doped layer 52.

[0064] The orthographic projection of the raised electrode 51 on the transparent substrate 57 is located inside the orthographic projection of the second doped layer 54 on the transparent substrate 57; the orthographic projection of the first doped layer 52 on the transparent substrate 57 is located inside the orthographic projection of the second doped layer 54 on the transparent substrate 57. As shown in FIG5B , the first insulating layer 58 includes a first portion 581, a second portion 582, and a third portion 583. The first portion 581 is provided with a first via hole, which is filled with a portion of the first electrode 1. The first portion 581 and the portion of the first electrode 1 jointly wrap the raised electrode 51. The second portion 582 is provided with a second via hole, which is filled with a portion of the second electrode 2. The second portion 582 and the portion of the second electrode 2 jointly wrap the first doped layer 52 and the multi-quantum well layer 53. The third portion 583 is disposed in contact with the first portion 581 and the second portion 582, respectively, to form a continuous film layer. For example, the distance between the third portion 583 and the driving portion 6 is greater than the distance between the first portion 581 and the driving portion 6; the distance between the third portion 583 and the driving portion 6 is greater than the distance between the second portion 582 and the driving portion 6. For example, the third portion 583 may directly contact the second doping layer 54.

[0065] For example, the first doping layer 52 is n-type doped, and the second doping layer 54 is p-type doped. For another example, the first doping layer 52 is p-type doped, and the second doping layer 54 is n-type doped.

[0066] In some embodiments, the first filling portion 10 is further described based on Figure 5, and the above-mentioned first filling portion 10 includes a first sub-filling portion 11 and a second sub-filling portion 12; wherein, the orthographic projection of the first sub-filling portion 11 on the plane where the transparent substrate 57 is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate 57 is located; the second sub-filling portion 12 is at least partially located between the padding electrode 51 and the multi-quantum well layer 53, and the first sub-filling portion 11 is arranged as a whole around the padding electrode 51, the multi-quantum well layer 53, and the second sub-filling portion 12.

[0067] For example, to ensure that the first filling portion 10 has a better protection effect, the first sub-filling portion 11 and the second sub-filling portion 12 are arranged in contact, wherein the minimum distance n between the inner boundary and the outer boundary of the first sub-filling portion 11 is greater than or equal to 20 microns.

[0068] For example, the thickness of the first sub-filling portion 11 is greater than or equal to the distance between the first insulating layer 58 and the driving portion 6; the thickness of the second sub-filling portion 12 is equal to the maximum distance between the first insulating layer 58 and the driving portion 6. Thus, the first sub-filling portion 11 protects the electrodes it surrounds due to its greater thickness compared to the second sub-filling portion 12, and the second sub-filling portion 12 exactly fills the gap between the first insulating layer 58 and the driving portion 6, preventing the solution from contacting the electrodes through the gap during electroplating or electroless plating operations, thereby ensuring the reliability of the device. In some embodiments, the gaps in the internal space surrounded by the first sub-filling portion 11, the light-emitting portion 5, and the driving portion 6 are all filled with the second sub-filling portion 12, so that the solution erosion can be better isolated.

[0069] In some embodiments, the second sub-filling portion 12, the second filling portion 8, and the third filling portion 9 are formed by compressing an anisotropic conductive film; the relationship between the thickness H1 of the second sub-filling portion 12 before compression and the thickness H2 of the second sub-filling portion 12 satisfies: 0.5H1 < H2 < 0.95H1. Among them, H2 being less than 95% of H1 can avoid defects such as bubbles and delamination caused by insufficient filling of the second sub-filling portion 12 in the thickness direction; moreover, H2 being greater than 50% of H1 can avoid the second sub-filling portion 12 overflowing due to the excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thereby causing poor conductivity. For example, the thickness of the second sub-filling portion 12 can be determined in the following way: H2 ≥ k*d + l, where k is the upper limit of the compression ratio that makes the conductive particles have good conductivity in the ACF conductive adhesive, d is the average particle diameter of the conductive particles in the compression direction before compression, and l is the sum of the thicknesses of the first electrode 1 and the third electrode 3. Therefore, k*d is the minimum compression degree that makes the conductive particles conductive in the compression direction. For example, H2 = k*d + l. For example, H2 > k*d + l. For example, the average particle diameter in the compression direction is 2 microns, and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 microns and k is taken as 80%. Thus, it can guide how to design the thickness H2 of the second sub-filling portion 12.

[0070] In some embodiments, the second sub-filling portion 12, the second filling portion 8, and the third filling portion 9 are formed by compressing an anisotropic conductive film; the first sub-filling portion 11 at least includes a portion located between the transparent substrate 57 and the driving portion 6, and the relationship between the thickness T1 of the first sub-filling portion 11 located between the transparent substrate 57 and the driving portion 6 and the thickness T2 of the second sub-filling portion 12 satisfies: 0.5T1 < T2 < 0.95T1. Among them, the portion of the first sub-filling portion 11 located between the transparent substrate 57 and the driving portion 6 can be slightly compressed (still in an insulating state), or can be uncompressed. The thickness T2 of the second sub-filling portion 12 being less than 95% of the thickness T1 of the first sub-filling portion 11 can avoid defects such as bubbles and delamination caused by insufficient filling in the thickness direction of the second sub-filling portion 12; and, the thickness T2 of the second sub-filling portion 12 being greater than 50% of the thickness T1 of the first sub-filling portion 11 can avoid the second sub-filling portion 12 overflowing due to the excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thereby causing poor conductivity. For example, the thickness of the second sub-filling portion 12 can be determined by the following method: T2 ≥ k*d + l, where k is the upper limit of the compression ratio that makes the conductive particles have good conductivity in the ACF conductive adhesive, d is the average particle size of the conductive particles in the compression direction before compression, and l is the sum of the thicknesses of the first electrode 1 and the third electrode 3. Therefore, k*d is the minimum compression degree that makes the conductive particles conductive in the compression direction. For example, T2 = k*d + l. For example, T2 > k*d + l. For example, if the average particle size in the compression direction is 2 microns and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 microns and k is taken as 80%. In this way, it can guide how to design the thickness T2 of the second sub-filling portion 12.

[0071] For example, the first sub-filling portion 11 can all be located between the transparent substrate 57 and the driving portion 6; for another example, a part of the first sub-filling portion 11 is located between the transparent substrate 57 and the driving portion 6, and another part protrudes from the transparent substrate 57, that is, the orthographic projection of the first sub-filling portion 11 on the plane where the transparent substrate 57 is located does not overlap with the transparent substrate.

[0072] Since the light-emitting component includes a plurality of light-emitting units and driving units corresponding to the plurality of light-emitting units, the plurality of light-emitting units include a first color light-emitting unit, a second color light-emitting unit, and a third color light-emitting unit, wherein the first color emitted by the first color light-emitting unit, the second color emitted by the second color light-emitting unit, and the third color emitted by the third color light-emitting unit are different from each other, and the three colors can generally be red, green, and blue. In order to be able to emit light of different colors to the screen, the light-emitting unit needs to include a color filter layer 56, a color conversion layer 55, and the light-emitting portion 5 in the above embodiment stacked in sequence in a direction away from the transparent substrate 57; the light-emitting color of the light-emitting portion 5 is blue. The light-emitting portion 5 includes a first light-emitting portion, a second light-emitting portion, and a third light-emitting portion, wherein the first light-emitting portion is located in the first color light-emitting unit, the second light-emitting portion is located in the second color light-emitting unit, and the third light-emitting portion is located in the third color light-emitting unit. Since the light to be emitted is red, blue and green, but the light-emitting portion 5 only emits blue light, a color conversion layer 55 is required to convert the blue light, that is, to convert the blue light into green and red light, so that green and red light can be emitted. For the color conversion layer 55 of the blue light part, since color conversion is not required, a transparent material can be used, and then displayed through the color filter layer 56.

[0073] The configuration of each layer of the driving unit can be customized based on actual needs. As shown in FIG5 , the driving unit includes a driving portion 6, a third electrode 3, and a fourth electrode 4. The third and fourth electrodes 3 and 4 are located on the side of the driving portion 6 that is closest to the light-emitting unit. The driving portion 6 includes a substrate 61, a connecting structure 64, a driving circuit 63, and a planar layer 62. The substrate 61 has a connecting via, the connecting structure 64 is located within the connecting via, the driving circuit 63 is located on the side of the substrate 61 that is closest to the light-emitting unit, and the planar layer 62 is located on the side of the driving circuit 63 that is closest to the light-emitting unit. The planar layer 62 is provided with a via, and the third and fourth electrodes 3 and 4 are electrically connected to the driving circuit 63 through the via. For example, at least a portion of the third and fourth electrodes 3 and 4 are located on the side of the driving unit that is closest to the light-emitting unit and protrude from the planar layer 62. The pin 7 is located on the side of the substrate 61 that is away from the driving circuit 63, and the pin 7 contacts the connecting structure 64. The pin 7 and the driving circuit 63 are connected via the connecting structure 64. For example, the orthographic projection area of ​​the pin 7 on the substrate 61 is larger than the orthographic projection area of ​​the connection structure 64 on the substrate 61 , and the orthographic projection of the pin 7 on the substrate 61 covers the orthographic projection of the connection structure 64 on the substrate 61 .

[0074] As shown in Figure 6, the driving circuit 63 includes one or more thin-film transistors, each of which includes a gate m4, a source m7, and a drain m7. One of the multiple pins 7 is connected to the source m7 of the thin-film transistor, and is used to provide the driving circuit 63 with a data drive signal transmitted from the display backplane of the display panel. In the figure, pin 7 is connected to the gate connection portion m41 via a connection structure 71, and the gate connection portion m41 is connected to the source m7. Exemplarily, the driving circuit 63 may include multiple thin-film transistors and at least one storage capacitor.

[0075] The driving circuit 63 may include a buffer layer m1, an active layer m2, a first gate insulating layer m3, a first gate layer m4, a second gate insulating layer m5, a second gate layer, an interlayer dielectric layer m6, a source and drain layer m7 and a flat layer (62 in Figure 5A is m8 in Figure 6, and in some embodiments, the flat layer 62 and m8 may exist at the same time, and 62 may be located above m8) located on one side of the substrate 61; the third electrode 3 and the fourth electrode 4 are located on the side of the flat layer 62 / m8 away from the substrate 61; optionally, the second gate layer may also be located on the side of the active layer m2 away from the first gate layer m4.

[0076] The active layer m2 includes one or more active patterns corresponding to one or more thin film transistors, each active pattern includes a source region m21, a drain region m22 and a channel region m23; the source and drain of the thin film transistor are located in the source-drain layer, the source of the thin film transistor is connected to the source region m21, and the drain of the thin film transistor is connected to the drain region m22; the first gate layer m4 includes one or more gate patterns corresponding to one or more thin film transistors, and the channel region m23 is the overlapping area of ​​the orthographic projection of the gate pattern on the substrate 61 and the orthographic projection of the active pattern on the substrate 61.

[0077] Exemplarily, the buffer layer m1 , the first gate insulating layer m3 , the second gate insulating layer m5 and the interlayer dielectric layer m6 may be made of silicon oxide, silicon nitride, silicon oxynitride or the like.

[0078] For example, the active layer m2 is made of low-temperature polysilicon material, in which case the drive unit 102 may also be referred to as an LTPS (Low Temperature Poly-Silicon) drive unit. Alternatively, the active layer m2 is made of low-temperature polysilicon material and a metal oxide semiconductor material such as IGZO (Indium Gallium Zinc Oxide), in which case the drive unit 102 may also be referred to as an LTPO (Low Temperature Polycrystalline Oxide) drive unit.

[0079] In some examples, the first gate layer m4 and the second gate layer may be made of a single metal layer, such as molybdenum, copper, aluminum, etc. In other examples, the first gate layer m4 and the second gate layer may also include multiple metal layers stacked in sequence, such as titanium, aluminum, titanium, etc. stacked in sequence.

[0080] Exemplarily, the planarization layer 62 / m8 is made of an organic insulating material, such as resin.

[0081] For example, as shown in the figure, the first gate layer m4 also includes a gate connection portion m41 connected to the connection structure 71. The gate connection portion m41 is used to connect to the connection structure 71 and the source of the data write transistor. To connect the connection structure 71 and the gate connection portion m41, the buffer layer m1 and the first gate insulation layer m3 can also include connection vias. Furthermore, the connection structure 71 is located not only in the connection via of the substrate 61, but also in the connection vias of the buffer layer m1 and the first gate insulation layer m3.

[0082] The present disclosure also provides a display panel comprising at least a display backplane and a plurality of the aforementioned light-emitting components arranged in an array on one side of the display backplane. The display backplane is configured to provide a driving signal to a driving unit via a plurality of pins 7 in the light-emitting components, thereby causing the driving unit to drive the light-emitting units to emit light. The structure of the aforementioned light-emitting components will not be further described herein.

[0083] The disclosed embodiment separates the complex driving circuit 63 from the display substrate (including multiple light-emitting units). The driving substrate (including multiple driving units) only needs to be provided with basic data lines, and no complex wiring of the driving circuit 63 is required. The wiring structure on the driving substrate is very simple, and the wiring difficulty of the driving substrate is reduced exponentially, which also reduces the difficulty of processing and manufacturing, and is beneficial to industrial development.

[0084] The present disclosure also provides a method for preparing a light-emitting component, which is used to prepare the light-emitting component. The process is shown in FIG7 and includes steps S601 to S602:

[0085] S601, pressing the anisotropic conductive adhesive film to be compressed, the light-emitting unit, and the driving unit to obtain a bonded light-emitting assembly, wherein the pressed anisotropic conductive adhesive film includes: a first filling portion 10, a second filling portion 8, and a third filling portion 9; the first filling portion 10 surrounds the second filling portion 8 and the third filling portion 9, and the thickness of the first filling portion 10 is greater than the thickness of the second filling portion 8 and the thickness of the third filling portion 9; the second filling portion 8 is located between the first electrode 1 of the light-emitting unit and the third electrode 3 of the driving unit, and is respectively in contact with the first electrode 1 and the third electrode 3; the third filling portion 9 is located between the second electrode 2 of the light-emitting unit and the fourth electrode 4 of the driving unit, and is respectively in contact with the second electrode 2 and the fourth electrode 4;

[0086] S602 , placing the bonded light-emitting components in a target solution (eg, electroplating solution) to perform an electroplating process (or chemical plating process) to obtain a light-emitting component having a plurality of pins 7 on the driving unit.

[0087] In the process of bonding the light-emitting unit and the driving unit in the embodiment of the present disclosure, an anisotropic conductive film bonding method is used. The anisotropic conductive film can play two roles: (1) the pressing position serves as a circuit connection between the LED and the backplane; (2) the anisotropic conductive film at the non-pressing position is non-conductive and serves as a packaging isolation, preventing the plating solution from penetrating between the light-emitting unit and the driving unit during the electroplating process for preparing the pin 7, thereby playing an anti-corrosion role.

[0088] Furthermore, although exemplary embodiments have been described herein, the scope includes any and all embodiments based on the present disclosure with equivalent elements, modifications, omissions, combinations (e.g., solutions that intersect various embodiments), adaptations, or changes. The elements in the claims are to be interpreted broadly based on the language employed in the claims and are not limited to the examples described in this specification or during the prosecution of this application, which examples are to be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered as examples only, with the true scope and spirit being indicated by the following claims and the full scope of their equivalents.

[0089] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more schemes thereof) can be used in combination with each other. For example, a person of ordinary skill in the art may use other embodiments when reading the above description. In addition, in the above embodiments, various features can be grouped together to simplify the present disclosure. This should not be interpreted as an intention that a disclosed feature that is not claimed for protection is necessary for any claim. On the contrary, the subject matter of the present disclosure may be less than all the features of a particular disclosed embodiment. Thus, the following claims are incorporated into the embodiments as examples or embodiments, wherein each claim is independently a separate embodiment, and it is considered that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present disclosure should be determined with reference to the appended claims and the full scope of equivalents to which these claims are entitled.

[0090] The above describes in detail several embodiments of the present disclosure, but the present disclosure is not limited to these embodiments. Those skilled in the art can make various variations and modifications to the embodiments based on the concepts of the present disclosure, and these variations and modifications should all fall within the scope of protection claimed by the present disclosure.

Claims

1. A light-emitting component, comprising: A light-emitting unit, the light-emitting unit comprising a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; A driving unit, the driving unit comprising a third electrode, a fourth electrode and a driving part, the third electrode and the fourth electrode are both located on a side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode are electrically connected to a driving circuit in the driving part, respectively, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode; as well as A plurality of pins, each of which is located at a side of the driving unit away from the light-emitting unit and is electrically connected to the driving circuit; Among them, a first filling portion, a second filling portion and a third filling portion are included between the light-emitting unit and the driving unit; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is respectively greater than the thickness of the second filling portion and the thickness of the third filling portion; the second filling portion is located between the first electrode and the third electrode, and is respectively in contact with the first electrode and the third electrode; the third filling portion is located between the second electrode and the fourth electrode, and is respectively in contact with the second electrode and the fourth electrode.

2. The light emitting assembly according to claim 1, wherein: At least one of the plurality of pins comprises a first metal layer and a second metal layer which are stacked, wherein the first metal layer is located between the second metal layer and the driving unit; The material of the first metal layer includes nickel, and the material of the second metal layer includes gold.

3. The light emitting assembly according to claim 1, wherein: The first filling portion is insulating, the second filling portion is conductive, and the third filling portion is conductive; The first filling portion is in direct contact with the second filling portion; The first filling part is in direct contact with the third filling part; A portion of the first filling portion is located between the second filling portion and the third filling portion.

4. The light emitting assembly according to claim 1, wherein: The density of the first filling part is less than the density of the second filling part; The density of the first filling part is lower than the density of the third filling part.

5. The light emitting assembly according to claim 1, wherein: The light-emitting component comprises a transparent substrate, and the transparent substrate is located at a side of the light-emitting unit away from the driving unit; The orthographic projection of the first filling portion on the plane where the transparent substrate is located is located inside the transparent substrate.

6. The light emitting assembly according to claim 5, wherein: An outer contour of an orthographic projection of the first filling portion on a plane where the transparent substrate is located coincides with an outer contour of the transparent substrate.

7. The light emitting assembly according to claim 1, wherein: The light-emitting component comprises a transparent substrate, and the transparent substrate is located at a side of the light-emitting unit away from the driving unit; The light emitting unit includes a light emitting portion, and the light emitting portion includes: A pad electrode, a first insulating layer, and a second doped layer, a multi-quantum well layer, and a first doped layer are sequentially stacked in a direction away from the transparent substrate; Wherein, the second electrode is located on a side of the first doped layer away from the multi-quantum well layer, and the first doped layer is electrically connected to the second electrode; The pad electrode is located between the second doping layer and the first electrode, and is electrically connected to the second doping layer and the first electrode respectively; The first insulating layer is located on a side of the first doping layer away from the transparent substrate, and is disposed in contact with the first doping layer.

8. The light emitting assembly according to claim 7, wherein: The first filling portion includes a first sub-filling portion and a second sub-filling portion; The orthographic projection of the first sub-filling portion on the plane where the transparent substrate is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate is located; The second sub-filling portion is at least partially located between the padding electrode and the multi-quantum well layer, and the first sub-filling portion is integrally arranged around the padding electrode, the multi-quantum well layer, and the second sub-filling portion.

9. The light emitting assembly according to claim 8, wherein: The thickness of the first sub-filling portion is greater than or equal to the distance between the first insulating layer and the driving portion; The thickness of the second sub-filling portion is equal to a maximum distance between the first insulating layer and the driving portion.

10. The light emitting assembly according to claim 9, wherein: The first sub-filling portion at least includes a portion located between the transparent substrate and the driving portion; The relationship between the thickness T1 of the first sub-filling portion and the thickness T2 of the second sub-filling portion between the transparent substrate and the driving portion satisfies: 0.5T1 <T2<0.95T1。 11. The light emitting assembly according to any one of claims 5 to 10, wherein: The light-emitting component comprises a plurality of light-emitting units and the driving unit corresponding to the plurality of light-emitting units; the plurality of light-emitting units comprises a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit, wherein the first color emitted by the first color light-emitting unit, the second color emitted by the second color light-emitting unit and the third color emitted by the third color light-emitting unit are different from each other; The light-emitting unit comprises a color filter layer, a color conversion layer and a light-emitting portion which are sequentially stacked in a direction away from the transparent substrate; the light-emitting color of the light-emitting portion is blue; Among them, the light-emitting part includes a first light-emitting part, a second light-emitting part and a third light-emitting part, the first light-emitting part is located in the first color light-emitting unit, the second light-emitting part is located in the second color light-emitting unit, and the third light-emitting part is located in the third color light-emitting unit.

12. The light emitting assembly according to any one of claims 1 to 10, wherein: The driving unit further comprises a substrate and a connection structure, wherein the substrate has a connection via hole, the connection structure is located in the connection via hole, and the driving circuit is located on a side of the substrate close to the light-emitting unit; The pin is located at a side of the substrate away from the driving circuit, and the pin is in contact with the connection structure, and the pin and the driving circuit are connected through the connection structure.

13. The light emitting assembly according to claim 12, wherein: The driving circuit includes one or more thin film transistors, and the thin film transistor includes a gate, a source and a drain; One of the plurality of pins is connected to a source electrode of the thin film transistor and is used for providing the driving circuit with a data driving signal transmitted from a display backplane in the display panel.

14. The light emitting assembly according to claim 13, wherein: The driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain electrode layer and a planar layer which are stacked in sequence and are located on one side of the substrate; the third electrode and the fourth electrode are located on a side of the planar layer away from the substrate; The active layer includes one or more active patterns corresponding to the one or more thin film transistors, and the active patterns include a source region, a drain region and a channel region; The source electrode and the drain electrode of the thin film transistor are located in the source-drain electrode layer, the source electrode of the thin film transistor is connected to the source region, and the drain electrode of the thin film transistor is connected to the drain region; The first gate layer includes one or more gate patterns corresponding to the one or more thin film transistors, and the channel region is an overlapping region of an orthographic projection of the gate pattern on the substrate and an orthographic projection of the active pattern on the substrate.

15. The light emitting assembly according to claim 12, wherein: The area of ​​the orthographic projection of the pin on the substrate is larger than the area of ​​the orthographic projection of the connection structure on the substrate, and the orthographic projection of the pin on the substrate covers the orthographic projection of the connection structure on the substrate.

16. A display panel, wherein: The display panel comprises a display backplane, and a plurality of light-emitting components according to any one of claims 1 to 15 arranged in an array and located on one side of the display backplane; The display backplane is used to provide a driving signal to a driving unit through a plurality of pins in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light.

17. A method for preparing a light-emitting component, for preparing the light-emitting component according to any one of claims 1 to 15, wherein: include: The anisotropic conductive adhesive film to be compressed, the light-emitting unit and the driving unit are pressed together to obtain a bonded light-emitting component, wherein the pressed anisotropic conductive adhesive film includes: a first filling portion, a second filling portion and a third filling portion; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is respectively greater than the thickness of the second filling portion and the thickness of the third filling portion; the second filling portion is located between the first electrode of the light-emitting unit and the third electrode of the driving unit, and is respectively in contact with the first electrode and the third electrode; the third filling portion is located between the second electrode of the light-emitting unit and the fourth electrode of the driving unit, and is respectively in contact with the second electrode and the fourth electrode; The bonded light-emitting components are placed in a target solution for electroplating or chemical plating to obtain a light-emitting component with a plurality of pins on the driving unit.

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