Heating structure and electric heating product

Abstract

A heating structure and an electric heating product, the heating structure comprising a packaging body and a heater packaged therein, wherein the packaging body comprises a packaging main part and a packaging combining part, the packaging main part being composed of a multi-layer structure of packaging materials, said multi-layer structure comprising at least a barrier layer composed of a metal material and a connecting layer located on the inner side of the barrier layer, and the packaging combining part being formed by combining the connecting layer of different parts of the packaging main part. The heating structure has excellent water and oxygen blocking capabilities, mechanical damage resistance, flame retardant and insulating properties, and structural stability at high temperatures, effectively prolonging the service life of the heater and being relatively safer during use.

Description

Heating structure and electric heating product Technical Field

[0001] The invention relates to a heating structure and an electric heating product. Background Art

[0002] Heating elements, with their advantages of high heating efficiency and low energy consumption, have been applied in various industries. However, in areas requiring high energy efficiency and heating under harsh environments, even higher performance requirements are placed on heating elements. Applications such as heating lithium battery packs, heating outdoor power distribution cabinets, and heating for de-icing dam gates are crucial. To ensure the long-term, safe, and efficient operation of heating elements, they must be encapsulated to block moisture and oxygen.

[0003] Currently, a common method is to bond plastic film to the upper and lower surfaces of the heating element using adhesives. Plastic film itself has poor barrier properties against water and oxygen, which can easily penetrate the plastic surface and penetrate into the heating element, causing power loss or damage. Furthermore, conventional adhesives have poor bonding strength to the heating element, and are prone to delamination at high temperatures, exposing the heating element.

[0004] Summary of the Invention

[0005] The purpose of the present invention is to provide a heating structure that has the ability to block water and oxygen, the ability to resist mechanical damage, and better safety in use and structural stability.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] A heating structure includes a packaging body and a heating element encapsulated in the packaging body, wherein the packaging body includes a packaging main body and a packaging joint part, the packaging main body is composed of a packaging material with a multi-layer structure, the multi-layer structure includes at least a barrier layer composed of a metal material and a connection layer located on the inner side of the barrier layer, and the packaging joint part is formed by combining the connection layers at different parts of the packaging main body.

[0008] In some embodiments, the barrier layer is composed of a metal foil, and the connecting layer is a polymer film layer bonded to or formed on the metal foil, and the polymer film layer is composed of an adhesive material. The material constituting the connecting layer is a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material. Specifically, the thermoplastic adhesive material can be formed directly on the metal foil by coating or casting, or it can be formed by forming a film alone by casting and then hot-pressing with the metal foil; the thermosetting adhesive material can be formed by coating a liquid adhesive material on the metal foil or attaching a solid adhesive material to the metal foil after pre-bonding and then curing at room temperature, high temperature, or hot pressing; the pressure-sensitive adhesive material can be formed by coating and drying or directly attaching it to the metal foil surface and then compounding it with a roller.

[0009] In other embodiments, the connecting layer is a polymer film layer formed of a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material, and the barrier layer is a metal coating formed on the polymer film layer. Specifically, the metal coating can be formed by evaporation or sputtering.

[0010] Preferably, the multilayer structure further comprises an intermediate layer located between the barrier layer and the tie layer and connected to the barrier layer and the tie layer respectively.

[0011] Preferably, the intermediate layer is bonded to the connecting layer, and the heating structure further meets one of the following conditions:

[0012] (a) The barrier layer is composed of a metal foil, and the intermediate layer is a polymer film layer bonded to or formed on the metal foil, the polymer film layer is bonded to the tie layer, and the polymer film layer is composed of a modified or unmodified polyolefin film, an aliphatic polyether film, a polyurethane film, a polyimide film, a polyvinyl acetal film, or an epoxy resin film, or the polymer film layer is formed of a polyimide adhesive, a polyacrylic adhesive, a polyurethane adhesive, a polyester adhesive, a semi-vulcanized silicone rubber, an epoxy adhesive, or a polyolefin adhesive;

[0013] (b) The intermediate layer is a modified or unmodified polyolefin film, aliphatic polyether film, polyurethane film, polyimide film, polyvinyl acetal film, epoxy resin film, or a polymer film layer formed by polyimide adhesive, polyacrylic adhesive, polyurethane adhesive, polyester adhesive, semi-vulcanized silicone rubber, epoxy adhesive or polyolefin adhesive, and the barrier layer is a metal plating layer formed on the polymer film layer.

[0014] According to some embodiments, the metal material is aluminum, copper, nickel, tin, copper or an alloy thereof.

[0015] According to some embodiments, the polymer material constituting the connection layer is a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material, and the materials of the connection layers at different locations of the package body are the same or different.

[0016] Further preferably, the thermoplastic adhesive is a modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester, or aromatic heterocyclic polymer with a melting point of 60-300°C; the thermosetting adhesive is a modified or unmodified polyolefin resin, phenolic resin, epoxy resin, amino resin, polyurethane resin, unsaturated polyester, acrylic resin, or natural or synthetic rubber resin containing a crosslinking agent; and the pressure-sensitive adhesive is a silicone pressure-sensitive adhesive or a fluorine-modified hydrophobic pressure-sensitive adhesive. Modifications include conventional modifications in the art such as metallophilic modification and acid modification, and the specific modification method or no modification can be selected according to actual needs.

[0017] Preferably, the thickness of the barrier layer is 0.1 to 1000 μm, more preferably 10 to 100 μm, further preferably 10 to 50 μm, and even more preferably 10 to 30 μm, for example, 10 μm, 20 μm, or 30 μm.

[0018] Preferably, the thickness of the heating element is 0.1 to 5000 μm, for example, 0.1 μm, 0.5 μm, 1 μm, 5 μm, 10 μm, 50 μm, 100 μm, 500 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, 3500 μm, 4000 μm, 4500 μm, or 5000 μm.

[0019] Preferably, the thickness of the connecting layer is 0.1 to 1000 μm, more preferably 10 to 500 μm, and even more preferably 30 to 100 μm, for example, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm.

[0020] Preferably, the packaging joint extends along the length direction and / or width direction of the heating element.

[0021] According to some embodiments, the packaging main body includes a first packaging main body and a second packaging main body respectively bonded or adhered to the front and back surfaces of the heating element, and the packaging joint is formed by combining the connecting layer of the first packaging main body and the connecting layer of the second packaging main body together along the circumferential direction.

[0022] Preferably, the heating structure further comprises a conductive connector connecting the barrier layer of the first package body portion and the barrier layer of the second package body portion.

[0023] Preferably, the heating element has a communication channel, a connector is provided in the communication channel, and the connector is integrally connected to the connection layers of the packaging bodies corresponding to the front and back sides of the heating element.

[0024] Further preferably, the communication channel includes a communication hole opened on the heating element and / or a gap formed on the heating element.

[0025] Still more preferably, there are multiple communicating holes, and the diameter of each hole is 0.5 to 20 mm, for example, 0.5 mm, 1 mm, 2 mm, 2.5 mm, 5 mm, 7.5 mm, 10 mm, 12.5 mm, 15 mm, and 20 mm.

[0026] Specifically, there is no particular requirement for the distribution of the plurality of communicating holes on the heating element, and they can be evenly spaced and aligned, or staggered. In some embodiments, the communicating holes are straight holes.

[0027] Still further preferably, there are one or more slits, and the width of each slit is 0.5 to 20 mm, for example, 0.5 mm, 1 mm, 2 mm, 2.5 mm, 5 mm, 7.5 mm, 10 mm, 12.5 mm, 15 mm, or 20 mm.

[0028] Still further preferably, the gaps are arranged in a circuitous or parallel shape.

[0029] Further preferably, the material of the connector is a modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester, or aromatic heterocyclic polymer with a melting point of 60-300°C; or a modified or unmodified polyolefin resin, phenolic resin, epoxy resin, amino resin, polyurethane resin, unsaturated polyester, acrylic resin, or natural or synthetic rubber resin with the addition of a crosslinking agent; or a silicone pressure-sensitive adhesive or a fluorine-modified hydrophobic pressure-sensitive adhesive. The material of the connector can be the same as or different from that of the connecting layer.

[0030] Preferably, the heating structure further includes a functional layer arranged on the outside of the package body, and the functional layer is one or more layers selected from a backing layer, a thermal insulation layer, a temperature uniforming layer, a flame retardant layer, an insulating layer, a buffer layer, a wear-resistant layer or an anti-puncture layer.

[0031] The present invention also provides a method for preparing the above-mentioned heating structure, comprising: covering the outer surface of the heating element with the packaging material, and using hot pressing to adhere the packaging material to the heating element to form the packaging body, thereby obtaining the heating structure; or covering and adhering the packaging material to the outer surface of the heating element by hot bonding to form the packaging body, thereby obtaining the heating structure.

[0032] Specifically, the preparation method of the packaging material is: bonding a polymer film on one side surface of the metal foil, or coating a polymer material on the metal foil and curing it to form the polymer film layer, or evaporating or sputtering a metal material on the polymer film to form a metal coating.

[0033] Specifically, the hot pressing temperature is 60-180° C., and the pressure is 0.1-15 MPa.

[0034] Specifically, the hot pressing adopts a continuous hot roller method or a direct hot pressing method.

[0035] Specifically, the temperature of the thermal bonding is 60-180° C., and the pressure is 0.1-1 MPa.

[0036] The present invention also provides a heating structure, including a heating body, a first adhesive layer and a second adhesive layer respectively covering and bonding to the front and back sides of the heating body, and a first metal material layer and a second metal material layer respectively covering and connected to the first adhesive layer and the second adhesive layer. The first adhesive layer and the second adhesive layer have an extension portion extending beyond the surface of the heating body. The extension portion of the first adhesive layer and the extension portion of the second adhesive layer are combined with each other to form a bonding portion to achieve the encapsulation of the heating body.

[0037] Preferably, the first adhesive layer is composed of a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material, the first metal material layer is a metal plating layer formed on the first adhesive layer, or the first metal material layer is composed of a metal foil.

[0038] Preferably, the second adhesive layer is composed of a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material, and the second metal material layer is a metal plating layer formed on the second adhesive layer, or the second metal material layer is composed of a metal foil.

[0039] Specifically, the thermoplastic adhesive material can be formed directly on the metal foil by coating or casting, or formed by casting a separate film and then hot-pressing the metal foil. The thermosetting adhesive material can be formed by coating a liquid adhesive material on the metal foil or attaching a solid adhesive material to the metal foil after pre-bonding and then curing at room temperature, high temperature, or hot pressing. The pressure-sensitive adhesive material can be formed by coating and drying or directly attaching it to the metal foil surface and then rolling it. The metal coating can be formed by evaporation or sputtering.

[0040] Preferably, the materials of the first and second adhesive layers are respectively modified or unmodified polyolefins, polyamides, celluloses, polyethers, polyesters, or aromatic heterocyclic polymers with a melting point of 60-300°C; or modified or unmodified polyolefin resins, phenolic resins, epoxy resins, amino resins, polyurethane resins, unsaturated polyesters, acrylic resins, or natural and synthetic rubber resins with the addition of a crosslinking agent; or silicone pressure-sensitive adhesives or fluorine-modified hydrophobic pressure-sensitive adhesives. The materials of the first and second adhesive layers may be the same or different. Modifications include metallophilic modification, acid modification, and other conventional modifications in the art. A specific modification method or no modification may be selected based on actual needs.

[0041] Preferably, the materials of the first metal material layer and the second metal material layer are respectively aluminum, copper, nickel, tin, copper or their alloys, the materials of the first metal material layer and the second metal material layer are the same or different, and the first metal material layer and the second metal material layer completely cover or partially cover the first bonding layer and the second bonding layer respectively.

[0042] Preferably, the heating structure further includes a first intermediate layer located between the first bonding layer and the first metal material layer, and the first metal material layer is a metal plating layer formed on the first intermediate layer or a metal foil bonded to the first intermediate layer.

[0043] Preferably, the heating structure further includes a second intermediate layer located between the second adhesive layer and the second metal material layer, and the second metal material layer is a metal plating layer formed on the second intermediate layer or a metal foil bonded to the second intermediate layer.

[0044] Further preferably, the first intermediate layer and the second intermediate layer are respectively a modified or unmodified polyolefin film, an aliphatic polyether film, a polyurethane film, a polyimide film, a polyvinyl acetal film, an epoxy resin film, a polyimide adhesive layer, a polyacrylic adhesive layer, a polyurethane adhesive layer, a polyester adhesive layer, a semi-vulcanized silicone rubber layer, an epoxy adhesive layer, or a polyolefin adhesive layer. The first intermediate layer and the second intermediate layer may be made of the same or different materials, and the first intermediate layer may also be bonded to the first adhesive layer, and the second intermediate layer may also be bonded to the second adhesive layer.

[0045] Preferably, the thickness of the first adhesive layer and the second adhesive layer is 0.1 to 1000 μm, more preferably 10 to 500 μm, and even more preferably 30 to 100 μm, for example, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, and the thickness of the first adhesive layer and the second adhesive layer are the same or different.

[0046] Preferably, the thickness of the heating element is 0.1 to 5000 μm, for example, 0.1 μm, 0.5 μm, 1 μm, 5 μm, 10 μm, 50 μm, 100 μm, 500 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, 3500 μm, 4000 μm, 4500 μm, or 5000 μm.

[0047] Preferably, the thickness of the first metal material layer and the second metal material layer are 0.1 to 1000 μm, more preferably 10 to 100 μm, further preferably 10 to 50 μm, and further preferably 10 to 30 μm, for example 10 μm, 20 μm, 30 μm, and the thickness of the first metal material layer and the second metal material layer are the same or different.

[0048] Preferably, the heating structure also includes a functional layer arranged on the outside of the first metal material layer and / or the second metal material layer, and the functional layer is one or more layers selected from a backing layer, a thermal insulation layer, a temperature uniforming layer, a flame retardant layer, an insulating layer, a buffer layer, a wear-resistant layer or an anti-puncture layer.

[0049] Preferably, the heating structure further includes a conductive connector connecting the first metal material layer and the second metal material layer.

[0050] In some embodiments, the conductive connector is disposed through the extension portions of the first adhesive layer and the second adhesive layer.

[0051] In some other embodiments, the conductive connection is located outside the first metal layer and the second metal layer.

[0052] Preferably, the heating element has a connecting channel, a connecting body is provided in the connecting channel, and the connecting body is integrally connected to the first adhesive layer and the second adhesive layer corresponding to the front and back sides of the heating element.

[0053] Further preferably, the communication channel includes a communication hole opened on the heating element and / or a gap formed on the heating element.

[0054] Still further preferably, the diameter of the communicating hole is 0.5 to 20 mm, for example, 0.5 mm, 1 mm, 2 mm, 2.5 mm, 5 mm, 7.5 mm, 10 mm, 12.5 mm, 15 mm, or 20 mm.

[0055] There is no special requirement for the distribution of the plurality of communication holes on the heating element. The plurality of communication holes may be arranged in an evenly spaced and aligned manner, or may be arranged in a staggered manner.

[0056] Still more preferably, the width of the gap is 0.5 to 20 mm, for example, 0.5 mm, 1 mm, 2 mm, 2.5 mm, 5 mm, 7.5 mm, 10 mm, 12.5 mm, 15 mm, or 20 mm.

[0057] Further preferably, the material of the connector is a modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester, or aromatic heterocyclic polymer with a melting point of 60-300°C; or a modified or unmodified polyolefin resin, phenolic resin, epoxy resin, amino resin, polyurethane resin, unsaturated polyester, acrylic resin, or natural or synthetic rubber resin with the addition of a crosslinking agent; or a silicone pressure-sensitive adhesive or a fluorine-modified hydrophobic pressure-sensitive adhesive. Modifications include conventional modifications in the art such as metallophilic modification and acid modification, and the specific modification method or no modification can be selected according to actual needs.

[0058] The heating element in the present invention is preferably a planar heating element, which can be any existing heating element with a planar structure without special requirements and restrictions. Specifically, it can be a conductive heating film with a planar substrate on one side or both sides or without a planar substrate.

[0059] Preferably, the heating element includes a conductive material and a selective substrate, the conductive material is a metal wire, an etched metal foil, or a conductive carbon film, and the material of the substrate is modified or unmodified, or coated with a pre-coating to increase the coating adhesion, polyimide (PI), polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), epoxy resin, phenolic resin or silicone rubber.

[0060] In the present invention, the conductive carbon film refers to a conductive film primarily composed of sp2-hybridized carbon as the conductive material. The conductive carbon film is formed by directly depositing a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene via CVD, or by melt blending with polymers and other additives, including phase change materials, or by dispersed blending with polymer solutions, phase change materials, leveling agents, defoaming agents, and the like, followed by film formation and drying, or by breaking up synthetic fibers or natural fibers using a "papermaking" process. The conductive carbon film can be self-supporting and independently formed, or can be attached to a single-sided planar substrate or encapsulated within a double-sided planar substrate.

[0061] The present invention also provides a preparation method for the above-mentioned heating structure, which is: providing a first packaging body containing the first adhesive layer and the first metal material layer, and a second packaging body containing the second adhesive layer and the second metal material layer, covering the first packaging body on the front side of the heating body, and covering the second packaging body on the back side of the heating body, and respectively attaching the first packaging body and the second packaging body to the heating body through hot pressing to form the joining part to obtain the heating structure, or using a heat bonding method to attach the first packaging body to the front side of the heating body and attach the second packaging body to the back side of the heating body, and at the same time form the joining part to obtain the heating structure.

[0062] Specifically, the preparation method of the first package body and the second package body is: bonding a polymer film on one side surface of the metal foil, or coating a polymer material on the metal foil and curing it to form the polymer film layer, or evaporating or sputtering a metal material on the polymer film to form a metal coating layer.

[0063] Specifically, the hot pressing temperature is 60-180° C., and the pressure is 0.1-15 MPa.

[0064] Specifically, the hot pressing adopts a continuous hot roller method or a direct hot pressing method.

[0065] Specifically, the temperature of the thermal bonding is 60-180° C., and the pressure is 0.1-1 MPa.

[0066] Specifically, the preparation method of the heating element is: first, combining or forming a patterned electrode on a substrate, and then depositing a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene on the substrate by CVD to form a conductive film covering the patterned electrode, or a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene and an additive by melt blending or dispersion blending and then drying the film to form a conductive film covering the patterned electrode, or a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene and fibers are broken up and then a conductive film covering the patterned electrode is prepared by a papermaking process.

[0067] Specifically, a communication channel is opened on the heating element by punching with a die-cutting machine or by laser punching.

[0068] According to some specific and preferred embodiments, the preparation method specifically comprises the following steps:

[0069] (1) preparing a heating element and selectively opening a connecting channel thereon;

[0070] (2) preparing a first package body and a second package body, and cutting them according to the size of the heating element;

[0071] (3) hot pressing or covering the cut first and second packaging bodies onto the front and back sides of the heating element in step (1) and combining them to form a joint portion, thereby achieving the packaging of the heating element;

[0072] (4) A conductive connector is selectively provided to connect the first metal material layer and the second metal material layer, and other functional layers are selectively bonded or formed on the front and back surfaces of the heating structure.

[0073] The present invention also provides an electric heating product comprising any one of the above-mentioned heating structures.

[0074] Specifically, the electric heating product also includes conductive components, such as electrodes, conductors, and connecting harnesses. These components connect to a power source to supply power to the heating element. The conductive components may be partially encapsulated within the package and partially located outside the package. The outer periphery of the conductive components may be affixed with a connecting material consistent with the connecting layer material, or other sealing insulating material capable of stable thermal fusion or cross-linking bonding with the connecting layer.

[0075] Specifically, the electric heating products are electric heating films (such as industrial electric heating films), electric floor heating, battery pack heating devices (such as battery pack heating films / sheets), distribution box heating and demisting devices, dam gate heating and deicing devices, aircraft wing heating and deicing devices (such as airplane wing heating and deicing devices), wind turbines and other heating and deicing devices, and hot air or heating devices for household appliances.

[0076] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0077] The heating structure of the present invention has excellent water and oxygen barrier capabilities, mechanical damage resistance, flame retardancy and insulation properties, and structural stability at high temperatures, which can effectively extend the service life of the heating element and is relatively safer during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] FIG1 is a schematic diagram of the structural decomposition of the heating structure of Example 1 before hot pressing;

[0079] FIG2 is a schematic cross-sectional view of the heating structure of Example 1;

[0080] FIG3 is a schematic diagram of the structural decomposition of the heating structure of Example 2 before hot pressing;

[0081] FIG4 is a schematic cross-sectional view of the heating structure of Example 2;

[0082] FIG5 is a schematic diagram of the structural decomposition of the heating structure of Example 3 before hot pressing;

[0083] FIG6 is a schematic cross-sectional view of the heating structure of Example 3;

[0084] FIG7 is a schematic diagram of the structural decomposition of the heating structure of Example 4 before hot pressing;

[0085] FIG8 is a schematic cross-sectional view of the heating structure of Example 4;

[0086] Among them, 1. heating element layer; 21. first adhesive layer; 22. second adhesive layer; 31. first metal material layer; 32. second metal material layer; 41. first functional layer; 42. second functional layer; 51. first intermediate layer; 52. second intermediate layer; 6. metal rivets. DETAILED DESCRIPTION

[0087] The present invention proposes a heating structure, which completely encapsulates the heating element in the packaging body, fully preventing the heating element from contacting the outside world. The packaging body includes a packaging main body and a packaging joint. The packaging main body is composed of a packaging material with a multi-layer structure. The multi-layer structure at least includes a barrier layer composed of a metal material and a connection layer located on the inner side of the barrier layer. The packaging joint is formed by combining the connection layers at different parts of the packaging main body. The barrier layer can effectively block water and oxygen and provide resistance to mechanical damage, thereby extending the service life of the heating element; the bonding strength of the packaging joint is higher than the bonding strength of the direct bonding of the adhesive and the heating element, thereby effectively reducing the risk of high-temperature stratification.

[0088] In the present invention, preferably, the metal material constituting the barrier layer is aluminum, copper, nickel, tin, copper or an alloy thereof.

[0089] Furthermore, the metal foil can be any one of aluminum foil, copper foil, stainless steel foil, nickel foil, tin foil, and nickel-plated copper foil, preferably copper foil or aluminum foil.

[0090] In the present invention, preferably, the material constituting the connection layer is a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material. The materials of the connection layers at different locations of the package body can be the same or different, as long as they can be combined to form an integral body.

[0091] Furthermore, the thermoplastic adhesive material can be a modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester, or aromatic heterocyclic polymer with a melting point of 60-300°C. Thermosetting adhesive materials can be modified or unmodified polyolefin resins containing a crosslinking agent, phenolic resins, epoxy resins, amino resins, polyurethane resins, unsaturated polyesters, acrylic resins, or natural and synthetic rubber resins. The pressure-sensitive adhesive material can be a silicone pressure-sensitive adhesive or a fluorine-modified hydrophobic pressure-sensitive adhesive. The specific choice can be based on actual needs.

[0092] In some embodiments, the barrier layer is composed of a metal foil, and the connecting layer is a polymer film layer bonded to or formed on the metal foil, and the polymer film layer is composed of a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material.

[0093] Specifically, thermoplastic adhesives can be formed directly on metal foil via coating or casting, or by forming a film using casting alone and then hot-pressing the film onto the metal foil. Thermosetting adhesives can be formed by coating a liquid adhesive onto the metal foil, or by laminating a solid adhesive onto the foil after pre-bonding and then curing at room temperature, at high temperature, or by hot pressing. Pressure-sensitive adhesives can be formed by coating and drying the foil or by directly laminating the foil onto the foil surface and then laminating it with a roller.

[0094] After forming the connection layer on the metal foil, a release film can be attached to the surface of the connection layer and removed before packaging.

[0095] In other embodiments, the connecting layer of the encapsulation material is a polymer film layer formed from a thermoplastic adhesive material, a thermosetting adhesive material, or a pressure-sensitive adhesive material, and the barrier layer is a metal coating formed on the polymer film layer. Specifically, the metal coating can be formed on the connecting layer using an evaporation or sputtering process. The metal material evaporated or sputtered on the connecting layer can be aluminum, copper, nickel, tin, copper, or alloys thereof. The metal coating can completely or partially cover the connecting layer.

[0096] In the present invention, preferably, the thickness of the barrier layer is controlled to be 0.1 to 1000 μm; the thickness of the connecting layer is controlled to be 0.1 to 1000 μm.

[0097] In the present invention, an intermediate layer is preferably provided between the barrier layer and the tie layer of the encapsulation material, connected to the barrier layer and the tie layer, respectively. The intermediate layer can enhance the bonding strength between the barrier layer and the tie layer. The intermediate layer can be a film layer or an adhesive layer, as long as it enhances the bonding strength and insulation performance between the barrier layer and the tie layer, and there are no particular limitations or strict requirements.

[0098] Specifically, the intermediate layer can be a modified or unmodified polyolefin film, an aliphatic polyether film, a polyurethane film, a polyimide film, a polyvinyl acetal film, an epoxy resin film, a polyimide adhesive layer, a polyacrylic adhesive layer, a polyurethane adhesive layer, a polyester adhesive layer, a semi-vulcanized silicone rubber layer, an epoxy adhesive layer or a polyolefin adhesive layer.

[0099] In some embodiments, the intermediate layer and the connecting layer may be formed on the metal foil by co-extrusion casting.

[0100] In the present invention, preferably, the package joint portion is formed by combining connection layers at different locations of the package main body portion.

[0101] In the present invention, preferably, the packaging joint portion extends along the length direction and / or width direction of the heating element.

[0102] In some embodiments, the heating element is completely surrounded by the encapsulation joint.

[0103] In the present invention, preferably, the packaging main body includes a first packaging main body and a second packaging main body respectively bonded or adhered to the front and back surfaces of the heating element, and the packaging joint is formed by combining the connecting layer of the first packaging main body and the connecting layer of the second packaging main body together along the circumferential direction.

[0104] In some embodiments, the first packaging body and the second packaging body are first attached to the front and back sides of the heating element, sandwiching the heating element in the middle, and the outer edges of the first packaging body and the second packaging body are controlled to extend beyond a portion of the outer edge of the heating element, and then hot pressing is performed using continuous hot rollers. The connecting layer portions of the first packaging body and the second packaging body located around the heating element will be connected as one through hot melting or cross-linking reaction, and the connecting layer portions corresponding to the front and back sides of the heating element will be tightly fitted or bonded to the heating element, respectively.

[0105] In other embodiments, the first packaging body and the second packaging body are first attached to the front and back sides of the heating element, sandwiching the heating element in the middle, and the outer edges of the first packaging body and the second packaging body are controlled to extend beyond a portion of the outer edges of the heating element, and then the first packaging body and the second packaging body are hot-melt or cross-linked to form a pocket-shaped structure with an opening reserved, and then a vacuum hot press is used to evacuate the reserved opening and seal it with hot pressing.

[0106] Furthermore, the heating structure also includes a conductive connector connecting the barrier layer of the first package body and the barrier layer of the second package body to ensure that no induced current is generated between the barrier layer of the first package body and the barrier layer of the second package body.

[0107] In some embodiments, the conductive connector is provided through the package joint, and the conductive connector is a metal connector, including but not limited to a metal rivet. The metal connector should be located at the package joint and not in contact with the heating element.

[0108] In other embodiments, the conductive connector is located outside the first package body and the second package body, and the conductive connector is a metal connector, such as a metal wire.

[0109] In the present invention, preferably, the heating element has a communication channel, a connector is provided in the communication channel, and the connector is integrally connected to the connection layers of the packaging body corresponding to the front and back sides of the heating element.

[0110] Specifically, the communication channel includes a communication hole and / or a slit formed on the heating element. There are multiple communication holes, each with a diameter of preferably 0.5 to 5 mm, and one or more slits, each with a width of preferably 0.5 to 5 mm.

[0111] Specifically, the material of the connector can be the same as or different from the material of the connection layer of the corresponding package, and can be integrally connected to the connection layer of the corresponding package by chemical reaction or heat melting. Preferably, the material of the connector is consistent with the material of the connection layer of the corresponding package.

[0112] Furthermore, the material of the connector can be modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester or aromatic heterocyclic polymer with a melting point of 60 to 300°C; or modified or unmodified polyolefin resin, phenolic resin, epoxy resin, amino resin, polyurethane resin, unsaturated polyester, acrylic resin or natural and synthetic rubber resin with the addition of a cross-linking agent; or silicone pressure-sensitive adhesive or fluorine-modified hydrophobic pressure-sensitive adhesive.

[0113] In some embodiments, the connector is formed by combining the connection layers of the packaging bodies corresponding to the front and back sides of the heating element in the hole through heat melting or cross-linking reaction.

[0114] In the present invention, a communication channel can be opened on the heating element by punching with a die-cutting machine or laser punching. When opening the communication channel, it is important to avoid the electrodes on the heating element.

[0115] In the present invention, the heating element can be a heating element conventionally used in the art, without special restrictions or strict requirements. Specifically, the heating element includes a conductive material and a selective substrate, the conductive material is a metal wire, an etched metal foil, or a conductive carbon film, and the substrate is made of a material such as polyimide (PI), polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), epoxy resin, phenolic resin or silicone rubber, which is modified or unmodified or coated with a pre-coating to increase the adhesion of the coating.

[0116] Conductive carbon film is a conductive film formed by directly depositing a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene through CVD, or by melt blending with polymers and other additives including phase change materials, or by dispersed blending with polymer solutions, phase change materials, leveling agents, defoaming agents, etc. and drying the film, or by breaking up with artificial synthetic fibers or natural fibers using a "papermaking" process to prepare a conductive carbon film.

[0117] In some specific and preferred embodiments, the heating structure includes a heating body, a first adhesive layer and a second adhesive layer respectively covering and bonding the front and back sides of the heating body, and a first metal material layer and a second metal material layer respectively covering and connected to the first adhesive layer and the second adhesive layer. The first adhesive layer and the second adhesive layer have an extension portion extending beyond the surface of the heating body. The extension portion of the first adhesive layer and the extension portion of the second adhesive layer are hot-melt bonded to form a bonding portion to achieve the encapsulation of the heating body.

[0118] Furthermore, a first intermediate layer connected to the first bonding layer and the first metal material layer respectively can be selectively provided between the first bonding layer and the first metal material layer; a second intermediate layer connected to the second bonding layer and the second metal material layer respectively can be selectively provided between the second bonding layer and the second metal material layer.

[0119] Furthermore, a functional layer can be selectively arranged on the outside of the first metal material layer and / or the second metal material layer. The functional layer is one or more layers and can be a backing layer, a thermal insulation layer, a heat conductive layer, a flame retardant layer, an insulating layer, a buffer layer, a wear-resistant layer or a puncture-proof layer.

[0120] Furthermore, to improve the bonding strength, a connecting channel can be provided on the heating element, specifically including a connecting hole provided on the heating element and / or a slit formed on the heating element. The connecting channel contains a connector capable of integrally connecting the first adhesive layer and the second adhesive layer at its two ends. In some embodiments, the connector is formed by combining the first adhesive layer and the second adhesive layer through a cross-linking reaction or by hot-melt bonding. During hot pressing, the molten first adhesive layer and the second adhesive layer material will enter the hole and connect into one piece.

[0121] Furthermore, in order to avoid the generation of induced current between the first metal material layer and the second metal material layer, a conductive connector can be used to connect the first metal material layer and the second metal material layer. In some embodiments, the conductive connector can be a metal connector that penetrates the joint, such as a metal rivet. In other embodiments, the conductive connector is a metal connector that connects the first metal material layer and the second metal material layer from the outside, such as a metal wire. The metal wire can be connected to the outer surface of the first metal material layer and the second metal material layer respectively through a micro-welding process.

[0122] The above-mentioned heating structure can be used for electric heating films (such as industrial electric heating films), electric floor heating, battery pack heating devices (such as battery pack heating films / sheets), distribution box heating and demisting devices, dam gate heating and deicing devices, aircraft wing heating and deicing devices (such as aircraft wing heating and deicing devices), wind turbines and other heating and deicing devices, and hot air or heating devices for household appliances.

[0123] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, any embodiments obtained by ordinary skill in the art are all within the scope of protection of the present invention.

[0124] In the present invention, directional descriptions such as "upper" and "lower" are based on the positional relationship in Figure 1. The above directional terms are used only to facilitate the description of the embodiments of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed or operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present invention.

[0125] In the present invention, the front side of the heating element refers to the upper surface of the heating element in each figure, and the back side of the heating element refers to the lower surface of the heating element in each figure.

[0126] The compounds used in the following examples are all commercially available products, and the processes involved are conventional processes in the art.

[0127] Example 1

[0128] This embodiment provides a heating structure, which includes an encapsulation body and a heating element encapsulated within the encapsulation body. As shown in Figures 1 and 2, the heating structure specifically includes a heating element layer 1, a first adhesive layer 21 covering and bonded to the front surface of the heating element layer 1, a first metal material layer 31 covering and connected to the first adhesive layer 21, a second adhesive layer 22 covering and bonded to the back surface of the heating element layer 1, and a second metal material layer 32 covering and connected to the second adhesive layer 22.

[0129] The heating element constitutes the heating element layer 1. The heating element is a planar heating element, including a polyimide film (PI film) and a carbon film formed on the PI film. The carbon film is made of a mixed slurry of graphite, carbon black, carbon nanotubes, and graphene. The thickness of the planar heating element is about 100 μm. The planar heating element is provided with a plurality of connecting holes extending through the thickness thereof. The diameter of each hole is about 5 mm, and the distance between two adjacent holes is about 20 mm.

[0130] The first adhesive layer 21 and the first metal material layer 31 form an upper package body, and the second adhesive layer 22 and the second metal material layer 32 form a lower package body, which are formed by thermocompression bonding.

[0131] The first metal material layer 31 and the second metal material layer 32 are both aluminum foils, and both have a thickness of 20 μm.

[0132] The first adhesive layer 21 and the second adhesive layer 22 are metal-philic modified polypropylene films formed by cast on the first metal material layer 31 and the second metal material layer 32, respectively, and the thickness of each is 50μm. The first adhesive layer 21 and the second adhesive layer 22 completely overlap with the first metal material layer 31 and the second metal material layer 32, respectively. The first adhesive layer 21 and the second adhesive layer 22 respectively have an extension portion extending outward relative to the planar heating element to extend beyond the surface of the planar heating element, and the four edges of the first adhesive layer 21 and the second adhesive layer 22 respectively extend beyond the planar heating element by about 10cm. The extension portions of the first adhesive layer 21 and the second adhesive layer 22 are hot-melt-bonded to form a bonding portion. The bonding portion extends along the length and width directions of the planar heating element and surrounds the planar heating element. The front side of the planar heating element is bonded to the portion of the first adhesive layer 21 where no bonding portion is formed, and the back side of the planar heating element is bonded to the portion of the second adhesive layer 22 where no bonding portion is formed. At the same time, a connector connected to the first adhesive layer 21 and the second adhesive layer 22 is formed in each connecting hole. The connector is formed by hot-melting the first adhesive layer 21 at the upper end opening and the vicinity of the hole and the second adhesive layer 22 at the lower end opening and the vicinity into the hole.

[0133] In this embodiment, a metal rivet is provided in the area where the joint is located. The metal rivet passes through the first metal material layer 31, the first adhesive layer 21, the second adhesive layer 22 and the third metal material layer 32, connecting the two layers of aluminum foil to avoid the generation of induced current between the two layers of aluminum foil.

[0134] The preparation method of the heating structure of this embodiment is as follows:

[0135] (1) A patterned acid-resistant ink was screen-printed on a PI composite aluminum film with a total thickness of 68 μm, and a patterned electrode was formed after spray etching with ferric chloride acid solution. The dispersant BYK-2015 was dissolved in an appropriate amount of purified water, and then graphite, carbon black, carbon nanotubes, and graphene were added and dispersed evenly by a sand mill to form a dispersion. The acrylic resin PUST-8010 was added to the above dispersion and stirred to mix evenly. The leveling agent BYK-346 and the defoaming agent BYK-1724 were added respectively, stirred evenly, and filtered to prepare a carbon wet slurry. The composition of the carbon wet slurry was as follows: dispersant 0.8%, graphite 0.3%, carbon black 1.77%, carbon nanotubes 0.32%, graphene 0.31%, acrylic resin 24%, leveling agent 0.5%, defoaming agent 0.5%, and the balance water. The wet carbon slurry was extruded through a slit onto the PI aluminum electrode and dried and solidified to form a carbon film approximately 50 μm thick. The finished product was a planar heating element. A flat die-cutting process was used to punch multiple interconnecting holes through the thickness of the planar heating element. Each hole had a diameter of approximately 5 mm, and the distance between adjacent holes was approximately 20 mm.

[0136] (2) Pre-cast a metal-modified polypropylene onto a 20 μm thick aluminum foil surface and solidify it to form a cast polypropylene aluminum composite film with a total thickness of 70 μm. Based on the size of the heating element, cut the cast polypropylene aluminum composite film into two sheets, each slightly longer than the planar heating element by 10 cm on all sides, and set aside.

[0137] (3) The upper and lower surfaces of the above-mentioned heating element are respectively covered with cut cast polypropylene aluminum composite films, and the four edges of the cast polypropylene aluminum composite film extend beyond the heating element by about 10 cm, wherein the metal-philic modified polypropylene layer is respectively attached to the heating element, and then hot pressed at 170°C and 0.3Mpa to form a packaging structure.

[0138] (4) On one side of the packaging structure, 5 mm away from the edge of the heating element, nickel-plated copper male and female terminals are set along the up and down directions to penetrate the packaging structure and connect the two layers of aluminum foil to obtain the above-mentioned heating element structure.

[0139] Example 2

[0140] This embodiment provides a heating structure, as shown in Figures 3 and 4. The heating structure is basically the same as that of Example 1, with the only difference being that the metal rivets are replaced with metal wires located outside the first metal material layer 31 and the second metal material layer 32 and connecting the first metal material layer 31 and the second metal material layer 32; the first functional layer 41 is covered and connected on the first metal material layer 31, and the second functional layer 42 is covered and connected on the second metal material layer 32. The first adhesive layer 21, the first metal material layer 31, and the first functional layer 41 constitute an upper package, and the second adhesive layer 22, the second metal material layer 32, and the second functional layer 42 constitute a lower package. The first functional layer 41 is thermal insulation PU cotton, and the first functional layer 41 and the first metal material layer 31 are bonded by adhesive. The second functional layer 42 is 3M's 9495LE 300LSE double-sided tape.

[0141] The heating element structure of this embodiment can be obtained by directly modifying the packaging structure of Example 1. The method is as follows: soldering a metal wire to the packaging structure of Example 1, with one end of the metal wire connected to the aluminum foil on one side of the packaging structure and the other end connected to the aluminum foil on the other side of the packaging structure. A pre-coated PU film is attached to the aluminum foil surface on one side of the packaging structure, and a pre-coated 3M 9495LE 300LSE double-sided tape is attached to the aluminum foil surface of the composite on the other side to obtain the heating element structure of this embodiment.

[0142] Example 3

[0143] This embodiment provides a heating structure, as shown in Figures 5 and 6. This heating structure is basically the same as that of Example 2, except that a first intermediate layer 51 is provided between the first adhesive layer 21 and the first metal material layer 31, respectively connected thereto, and a second intermediate layer 52 is provided between the second adhesive layer 22 and the second metal material layer 32, respectively connected thereto. The first adhesive layer 21, the first intermediate layer 51, the first metal material layer 31, and the first functional layer 41 constitute an upper package, while the second adhesive layer 22, the second intermediate layer 52, the second metal material layer 32, and the second functional layer 42 constitute a lower package.

[0144] In this embodiment, the first intermediate layer 51 and the second intermediate layer 52 are acid-modified polypropylene films, each with a thickness of 10 μm.

[0145] The preparation method of the heating structure of this embodiment is basically the same as that of Example 2, differing only in the preparation method of the composite film. In this embodiment, acid-modified polypropylene and metal-philic modified polypropylene are co-extruded onto the surface of a 20 μm thick aluminum foil and cured to form a polypropylene-aluminum composite film with a total thickness of 70 μm.

[0146] Example 4

[0147] This embodiment provides a heating structure, as shown in Figures 7 and 8. This heating structure is essentially the same as that of Example 3, differing only in that the planar heating element lacks a connecting hole. The portion of the first adhesive layer 21 not forming a joint is completely bonded to the front surface of the planar heating element, and the portion of the second adhesive layer 22 not forming a joint is completely bonded to the back surface of the planar heating element.

[0148] The heating structures of the above embodiments were tested as follows, and the test results are shown in Table 1.

[0149] Table 1

[0150] The peel strength test method is as follows: the heating structure sample used for the test is a long strip sample with a length of 200mm and a width of 25mm.

[0151] Before hot pressing, select one wide edge of the first and second adhesive layers 21, 22 as the test side. Pre-embed a 1cm piece of polytetrafluoroethylene paper. Ensure that the bonding area between the first and second adhesive layers 21, 22 on the test side extends 2cm beyond the heating element, with the polytetrafluoroethylene paper occupying an area 1cm inward from the edge. Remove the polytetrafluoroethylene paper after hot pressing. Use a peel tester to clamp the unadhered portions of the upper and lower packages on the test side and peel them off at a speed of 100mm / min in a 180° direction to test the peel strength.

[0152] The flame retardancy test was conducted according to the UL94 evaluation method. When the flame retardancy test was conducted on Examples 2-4, the first functional layer 41 and the second functional layer 42 were not provided.

[0153] The dual 85°C / 85% RH aging test method involves aging the package structure of this embodiment for 1000 hours at 85°C / 85% RH. Observe whether the change in the resistance of the heating film exceeds 10% after aging. If delamination, warping, or cracking of the composite film is observed, the test will be considered a failure.

[0154] The heating structure of the above embodiment can be used as the final electric heating film product after riveting the wire bundle at the position of the electrode tab of the planar heating element and using silicone as the joint insulation.

[0155] The heating structure of the above embodiment has the following advantages:

[0156] 1. The metal material layer can make the heating structure resistant to mechanical damage, and can effectively avoid the power attenuation and shortened service life of the heating element caused by water and oxygen.

[0157] 2. The first adhesive layer 21 and the second adhesive layer 22 are hot-melt-bonded to form an integrated structure, thereby sealing and encapsulating the heating element. This provides excellent peeling force, making the heating structure less likely to delaminate and achieving good structural stability. At the same time, it effectively blocks the heating element from contacting the outside world or the metal material layer, thereby improving insulation and ensuring the safety of the heating film.

[0158] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A heating structure, characterized in that: It includes a packaging body and a heating element encapsulated in the packaging body, the packaging body includes a packaging main body and a packaging joint part, the packaging main body is composed of a packaging material with a multi-layer structure, the multi-layer structure at least includes a barrier layer composed of a metal material and a connection layer located on the inner side of the barrier layer, and the packaging joint part is formed by connecting layers at different parts of the packaging main body combined with each other.

2. The heating structure according to claim 1, characterized in that: The barrier layer is composed of a metal foil, the connecting layer is a polymer film layer bonded to or formed on the metal foil, and the polymer film layer is composed of a bonding material; Alternatively, the connecting layer is a polymer film layer formed by an adhesive material, and the barrier layer is a metal plating layer formed on the polymer film layer.

3. The heating structure according to claim 1, characterized in that: The multi-layer structure further includes an intermediate layer located between the barrier layer and the connecting layer and connected to the barrier layer and the connecting layer respectively.

4. The heating structure according to claim 3, characterized in that: The intermediate layer is bonded to the connecting layer, and the heating structure also meets one of the following conditions: (a) the barrier layer is composed of a metal foil, the intermediate layer is a polymer film layer bonded to or formed on the metal foil, the polymer film layer is bonded to the connecting layer, and the polymer film layer is composed of a modified or unmodified polyolefin film, an aliphatic polyether film, a polyurethane film, a polyimide film, a polyvinyl acetal film or an epoxy resin film, or the polymer film layer is formed of a polyimide adhesive, a polyacrylic adhesive, a polyurethane adhesive, a polyester adhesive, a semi-vulcanized silicone rubber, an epoxy adhesive or a polyolefin adhesive; (b) The intermediate layer is a modified or unmodified polyolefin film, aliphatic polyether film, polyurethane film, polyimide film, polyvinyl acetal film, epoxy resin film, or a polymer film layer formed by polyimide adhesive, polyacrylic adhesive, polyurethane adhesive, polyester adhesive, semi-vulcanized silicone rubber, epoxy adhesive or polyolefin adhesive, and the barrier layer is a metal coating formed on the polymer film layer.

5. The heating structure according to any one of claims 1 to 4, characterized in that: The metal material is aluminum, copper, nickel, tin, copper or their alloys; and / or the material constituting the connecting layer is a thermoplastic adhesive material, a thermosetting adhesive material or a pressure-sensitive adhesive material, and the materials of the connecting layers at different parts of the packaging main body are the same or different.

6. The heating structure according to claim 5, characterized in that: The thermoplastic adhesive material is a modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester or aromatic heterocyclic polymer with a melting point of 60 to 300°C; the thermosetting adhesive material is a modified or unmodified polyolefin resin, phenolic resin, epoxy resin, amino resin, polyurethane resin, unsaturated polyester, acrylic resin or natural and synthetic rubber resin containing a cross-linking agent; the pressure-sensitive adhesive material is a silicone pressure-sensitive adhesive or a fluorine-modified hydrophobic pressure-sensitive adhesive.

7. The heating structure according to any one of claims 1 to 4, characterized in that: The thickness of the barrier layer is 0.1 to 1000 μm; and / or the thickness of the heating element is 0.1 to 5000 μm; and / or the thickness of the connecting layer is 0.1 to 1000 μm.

8. The heating structure according to claim 1, characterized in that: The packaging joint extends along the length direction and / or the width direction of the heating element.

9. The heating structure according to claim 1, characterized in that: The packaging body portion includes a first packaging body portion and a second packaging body portion respectively bonded or adhered to the front and back surfaces of the heating element, and the packaging joint portion is formed by combining the connection layer of the first packaging body portion and the connection layer of the second packaging body portion together along the circumferential direction.

10. The heating structure according to any one of claims 1 to 4, 8 to 9, characterized in that: The packaging joint part is formed by hot melting or chemical reaction bonding of connection layers at different parts of the packaging main body part.

11. The heating structure according to claim 9, characterized in that: The heat generating structure further includes a conductive connector connecting the barrier layer of the first package body portion and the barrier layer of the second package body portion.

12. The heating structure according to claim 1, characterized in that: The heating element has a connecting channel, a connecting body is provided in the connecting channel, and the connecting body is integrally connected with the connecting layers of the packaging bodies corresponding to the front and back sides of the heating element.

13. The heating structure according to claim 12, characterized in that: The connecting channel includes a connecting hole opened on the heating element and / or a gap formed on the heating element; and / or the material of the connecting body is a modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester or aromatic heterocyclic polymer with a melting point of 60 to 300°C; or a modified or unmodified polyolefin resin, phenolic resin, epoxy resin, amino resin, polyurethane resin, unsaturated polyester, acrylic resin or natural and synthetic rubber resin with a cross-linking agent added; or a silicone pressure-sensitive adhesive or a fluorine-modified hydrophobic pressure-sensitive adhesive, and the material of the connecting body is the same as or different from the material of the connecting layer.

14. The heating structure according to claim 13, characterized in that: There are multiple communicating holes, and the diameter of each hole is 0.5-20 mm; and / or there are one or more slits, and the width of each slit is 0.5-20 mm.

15. The heating structure according to any one of claims 1 to 4, characterized in that: The multilayer structure further comprises a functional layer arranged outside the barrier layer, wherein the functional layer is one or more layers selected from a back adhesive layer, a thermal insulation layer, a temperature equalizing layer, a flame retardant layer, an insulating layer, a buffer layer, a wear-resistant layer or an anti-puncture layer.

16. A heating structure, characterized in that: It includes a heating element, a first adhesive layer and a second adhesive layer respectively covering and adhering to the front and back sides of the heating element, and a first metal material layer and a second metal material layer respectively covering and connected to the first adhesive layer and the second adhesive layer. The first adhesive layer and the second adhesive layer have extension portions extending beyond the surface of the heating element. The extension portions of the first adhesive layer and the second adhesive layer are combined with each other to form a combination portion to achieve the encapsulation of the heating element.

17. The heating structure according to claim 16, characterized in that: The extending portion of the first adhesive layer and the extending portion of the second adhesive layer are thermally melt-bonded to form the bonding portion.

18. The heating structure according to claim 16, characterized in that: The first bonding layer is composed of a thermoplastic bonding material, a thermosetting bonding material, or a pressure-sensitive bonding material, the first metal material layer is a metal plating layer formed on the first bonding layer, or the first metal material layer is composed of a metal foil; and / or, the second bonding layer is composed of a thermoplastic bonding material, a thermosetting bonding material, or a pressure-sensitive bonding material, the second metal material layer is a metal plating layer formed on the second bonding layer, or the second metal material layer is composed of a metal foil.

19. The heating structure according to claim 18, characterized in that: The materials of the first bonding layer and the second bonding layer are respectively modified or unmodified polyolefins, polyamides, cellulose, polyethers, polyesters or aromatic heterocyclic polymers with a melting point of 60 to 300°C; or modified or unmodified polyolefin resins, phenolic resins, epoxy resins, amino resins, polyurethane resins, unsaturated polyesters, acrylic resins or natural and synthetic rubber resins with the addition of cross-linking agents; or silicone pressure-sensitive adhesives or fluorine-modified hydrophobic pressure-sensitive adhesives, and the materials of the first bonding layer and the second bonding layer are the same or different; and / or, the materials of the first metal material layer and the second metal material layer are respectively aluminum, copper, nickel, tin, copper or their alloys, and the materials of the first metal material layer and the second metal material layer are the same or different; and / or, the first metal material layer and the second metal material layer completely or partially cover the first bonding layer and the second bonding layer respectively.

20. The heating structure according to claim 16, characterized in that: The heating structure also includes a first intermediate layer located between the first bonding layer and the first metal material layer, the first metal material layer is a metal plating layer formed on the first intermediate layer or a metal foil bonded to the first intermediate layer, the heating structure also includes a second intermediate layer located between the second bonding layer and the second metal material layer, the second metal material layer is a metal plating layer formed on the second intermediate layer or a metal foil bonded to the second intermediate layer, the first intermediate layer and the second intermediate layer are respectively modified or unmodified polyolefin film, aliphatic polyether film, polyurethane film, polyimide film, polyvinyl acetal film, epoxy resin film, polyimide adhesive layer, polyacrylic adhesive layer, polyurethane adhesive layer, polyester adhesive layer, semi-vulcanized silicone rubber layer, epoxy adhesive layer or polyolefin adhesive layer, the materials of the first intermediate layer and the second intermediate layer are the same or different, the first intermediate layer is also bonded to the first bonding layer, and the second intermediate layer is also bonded to the second bonding layer.

21. The heating structure according to claim 16, characterized in that: The thickness of the first adhesive layer and the second adhesive layer is 0.1 to 1000 μm respectively, and the thickness of the first adhesive layer and the second adhesive layer are the same or different; and / or the heating element is a planar heating element, and / or the thickness of the heating element is 0.1 to 5000 μm; and / or the thickness of the first metal material layer and the second metal material layer is 0.1 to 1000 μm respectively, and the thickness of the first metal material layer and the second metal material layer are the same or different; and / or the heating structure also includes a functional layer arranged on the outside of the first metal material layer and / or the second metal material layer, and the functional layer is one or more layers selected from a backing layer, a thermal insulation layer, a temperature equalizing layer, a flame retardant layer, an insulating layer, a buffer layer, a wear-resistant layer or an anti-puncture layer.

22. The heating structure according to claim 16, characterized in that: The heat generating structure further includes a conductive connecting member connecting the first metal material layer and the second metal material layer.

23. The heating structure according to claim 22, characterized in that: The conductive connecting member is disposed through the extension portions of the first bonding layer and the second bonding layer, or is located outside the first metal material layer and the second metal material layer.

24. The heating structure according to claim 16, characterized in that: The heating element has a connecting channel, a connecting body is provided in the connecting channel, and the connecting body is integrally connected with the first adhesive layer and the second adhesive layer corresponding to the front and back sides of the heating element.

25. The heating structure according to claim 24, characterized in that: The connecting channel includes a connecting hole opened on the heating element and / or a gap formed on the heating element; and / or the material of the connecting body is a modified or unmodified polyolefin, polyamide, cellulose, polyether, polyester or aromatic heterocyclic polymer with a melting point of 60 to 300°C; or a modified or unmodified polyolefin resin, phenolic resin, epoxy resin, amino resin, polyurethane resin, unsaturated polyester, acrylic resin or natural and synthetic rubber resin with a cross-linking agent added; or a silicone pressure-sensitive adhesive or a fluorine-modified hydrophobic pressure-sensitive adhesive.

26. The heating structure according to claim 25, characterized in that: There are multiple communicating holes, and the diameter of each hole is 0.5-20 mm; and / or there are one or more slits, and the width of each slit is 0.5-20 mm.

27. The heating structure according to claim 1 or 16, characterized in that: The heating element includes a conductive material and a selective substrate, wherein the conductive material is a metal wire, an etched metal foil, or a conductive carbon film, and the substrate is made of modified or unmodified polyimide, polyethylene terephthalate, polypropylene, polyethylene, polyvinyl chloride, epoxy resin, phenolic resin, or silicone rubber, or is coated with a pre-coating to increase the bonding strength of the coating.

28. An electric heating product, characterized in that: It comprises the heating structure as described in any one of claims 1-27.

29. The electric heating product according to claim 28, characterized in that: The electric heating products are electric heating films, electric floor heating, battery pack heating devices, distribution box heating and demisting devices, dam gate heating and deicing devices, aircraft wing heating and deicing devices, wind turbine heating and deicing devices, and hot air or heating devices for household appliances.

30. A method for preparing a heating structure according to any one of claims 1 to 15, characterized in that: The packaging material is covered on the outer surface of the heating element, and the packaging material is adhered to the heating element by hot pressing to form the packaging body, thereby obtaining the heating structure; or the packaging material is covered and adhered to the outer surface of the heating element by hot bonding to form the packaging body, thereby obtaining the heating structure.

31. The preparation method according to claim 30, characterized in that: The preparation method of the packaging material is: bonding a polymer film on one side surface of a metal foil, or coating a polymer material on the metal foil and curing it to form the polymer film layer, or evaporating or sputtering a metal material on the polymer film to form a metal coating.

32. A method for preparing a heating structure according to any one of claims 16 to 26, characterized in that: Provide a first packaging body containing the first adhesive layer and the first metal material layer, and a second packaging body containing the second adhesive layer and the second metal material layer. Cover the first packaging body on the front side of the heating element, and cover the second packaging body on the back side of the heating element. Adhere the first packaging body and the second packaging body to the heating element respectively by hot pressing to form the joining portion, so as to obtain the heating structure. Alternatively, use a heat bonding method to bond the first packaging body to the front side of the heating element, and bond the second packaging body to the back side of the heating element, and simultaneously form the joining portion, so as to obtain the heating structure.

33. The preparation method according to claim 32, characterized in that: The preparation method of the first package and the second package is: bonding a polymer film on one side surface of the metal foil, or coating a polymer material on the metal foil and curing it to form a polymer film layer, or evaporating or sputtering a metal material on the polymer film to form a metal coating.

34. The preparation method according to claim 30 or 32, characterized in that: The temperature of the hot pressing is 60-180° C., and the pressure is 0.1-15 MPa; and / or, the hot pressing adopts a continuous hot roller method or a direct hot pressing method; the temperature of the thermal bonding is 60-180° C., and the pressure is 0.1-1 MPa.

35. The preparation method according to claim 30 or 32, characterized in that: The preparation method of the heating element is as follows: firstly combining or forming a patterned electrode on a substrate, and then depositing a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene on the substrate by CVD to form a conductive film covering the patterned electrode, or melt blending or dispersion blending of a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene with an auxiliary agent and then drying the mixture to form a conductive film covering the patterned electrode, or breaking up a mixture of one or more of graphite, conductive carbon black, carbon nanotubes, and graphene with fibers and then preparing a conductive film covering the patterned electrode by a papermaking process; and / or, opening a connecting channel on the heating element by punching with a die cutter or laser punching.

36. The preparation method according to claim 32, characterized in that: The preparation method specifically comprises the following steps: (1) preparing a heating element and selectively opening a connecting channel thereon; (2) preparing a first package body and a second package body, and cutting them according to the size of the heating element; (3) hot pressing or covering and hot bonding the cut first packaging body and the second packaging body to the front and back sides of the heating element in step (1) and combining them to form a joint portion, thereby achieving packaging of the heating element; (4) A conductive connection member is selectively provided to connect the first metal material layer and the second metal material layer, and other functional layers are selectively bonded or formed on the outer surfaces of the first package body and the second package body.

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