Heat dissipation device and communication apparatus

Abstract

The present application relates to the fields of heat dissipation and communication. Disclosed are a heat dissipation device and a communication apparatus. The heat dissipation device comprises a first heat dissipation assembly and a connecting pipeline, wherein the first heat dissipation assembly comprises at least one first heat conducting member; the first heat conducting member is provided with a medium channel; the connecting pipeline is in communication with the medium channel; the first heat conducting member comprises a heat conducting face; and the heat conducting face is configured to be in contact with a device to be subjected to heat dissipation. The communication apparatus comprises the heat dissipation device.

Description

Heat dissipation devices and communication equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on June 12, 2023, with application number 202310694165.2 and invention name “Heat Dissipation Device and Communication Equipment”. The entire contents of the Chinese patent application are incorporated herein by reference. Technical Field

[0003] The present application belongs to the field of heat dissipation and communication technology, and specifically relates to a heat dissipation device and communication equipment. Background Art

[0004] With the development of 5G, the domestic market is experiencing significant demand for specialized optical modules for 5G base stations. The construction of big data centers will also drive demand for these modules. In data centers, optical modules, as a key component, primarily perform photoelectric conversion, enabling the interconnection of everything. To ensure network data can meet the demands of faster speeds and lower latency, optical modules, as core components of optical communications, face a critical challenge: rapid heat dissipation.

[0005] In related technologies, double-layer optical modules mainly rely on air cooling and heat conduction for heat dissipation. As the heat flux density of the optical module increases, air cooling and heat dissipation also reach a bottleneck, which is prone to poor heat dissipation, thus affecting the operation of the optical module. In addition, excessively high temperatures will accelerate the life loss of the optical module components, thereby shortening the service life of the optical module and affecting the output rate of converting electrical signals into optical signals.

[0006] Summary of the Invention

[0007] An embodiment of the present application provides a heat dissipation device, comprising: a first heat dissipation component and a connecting pipeline; the first heat dissipation component includes at least one first heat conductive part, the first heat conductive part is provided with a medium channel, and the connecting pipeline is connected to the medium channel; the first heat conductive part includes a heat conductive surface, and the heat conductive surface is used to contact the device to be cooled.

[0008] An embodiment of the present application also provides a communication device, including the above-mentioned heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG1 is a schematic structural diagram of a heat dissipation device and a device to be cooled according to an embodiment of the present application;

[0010] FIG2 is a first structural schematic diagram of a first heat dissipation assembly and a device to be dissipated heat disclosed in an embodiment of the present application;

[0011] FIG3 is a second structural diagram of the first heat dissipation assembly and the device to be dissipated heat disclosed in an embodiment of the present application;

[0012] FIG4 is a schematic structural diagram of a device to be dissipated heat according to an embodiment of the present application;

[0013] FIG5 is a schematic structural diagram of a squirrel cage disclosed in an embodiment of the present application;

[0014] FIG6 is a cross-sectional schematic diagram of a squirrel cage and two first heat conducting members disclosed in an embodiment of the present application;

[0015] FIG7 is a schematic structural diagram of a first water separator disclosed in an embodiment of the present application;

[0016] FIG8 is a schematic structural diagram of the first water collector disclosed in an embodiment of the present application;

[0017] FIG9 is a schematic diagram of a heat dissipation process of a heat dissipation device disclosed in an embodiment of the present application;

[0018] FIG10 is a schematic structural diagram of another heat dissipation device and a device to be dissipated heat disclosed in an embodiment of the present application;

[0019] FIG11 is a schematic structural diagram of a second water separator disclosed in an embodiment of the present application;

[0020] FIG12 is a schematic structural diagram of a second water collector disclosed in an embodiment of the present application;

[0021] FIG13 is a schematic diagram of a heat dissipation process of another heat dissipation device disclosed in an embodiment of the present application.

[0022] Explanation of Reference Numerals: 100 - first heat dissipation assembly; 110 - first heat conducting member; 111 - medium channel; 112 - heat conducting surface; 113 - boss structure; 114 - support structure; 120 - first accommodation space; 200 - connecting pipeline; 210 - input main line; 220 - output main line; 230 - first input branch; 240 - first output branch; 250 - second input branch; 260 - second output branch; 300 - second heat dissipation assembly; 310 - second heat conducting member; 400 - device to be dissipated; 410 - cage; 411 - first mounting portion; 412 - second mounting portion; 413 - connecting portion; 414 - second accommodation space; 415 - avoidance hole; 416 - spring structure; 420 - optical module; 500 - water distributor; 510 - first shell; 511 - first inlet; 512 - first outlet; 520 - first quick-connector; 600 - water collector; 610 - second shell; 611 - second inlet; 612 - second outlet; 620 - second quick-connector. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0025] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0026] With reference to Figures 1 to 13 , embodiments of the present application disclose a heat dissipation device for dissipating heat from a device 400 to be dissipated. Device 400 to be dissipated may be a photoelectric conversion device, such as an optical module 420. Device 400 to be dissipated may also be other types of devices, without specific limitation. The disclosed heat dissipation device includes a first heat dissipation assembly 100 and a connecting pipe 200.

[0027] The first heat dissipation assembly 100 functions as a heat sink, dissipating heat from the device to be dissipated 400. The connecting pipe 200 is used to transport a cooling medium, allowing the cooling medium to be input into and output from the first heat dissipation assembly 100. For example, the first heat dissipation assembly 100 can be connected to the connecting pipe 200, allowing high-temperature cooling medium to be input into the first heat dissipation assembly 100 through the connecting pipe 200, and low-temperature cooling medium to be output from the first heat dissipation assembly 100 after heat exchange, thereby removing heat absorbed by the first heat dissipation assembly 100 from the device to be dissipated 400 through the cooling medium.

[0028] In the embodiments of the present application, the cooling medium may be a fluorinated liquid, deionized water, or an alcohol-based solution. Other cooling media may also be used, and are not specifically limited herein. Furthermore, the connecting pipe 200 may be a plastic hose, a rubber hose, a stainless steel bellows, or other types of pipes. Other types of pipes may also be used, and are not specifically limited herein.

[0029] The first heat dissipation assembly 100 includes at least one first heat conducting member 110. When the number of components 400 to be cooled is small, or when the amount of heat generated is relatively small, the number of first heat conducting members 110 can be one. In this case, one first heat conducting member 110 can meet the heat dissipation requirements of the components 400 to be cooled. When the number of components 400 to be cooled is large, or when the amount of heat generated is relatively large, the number of first heat conducting members 110 can be two, three, four, or more. This can increase the contact area between the first heat conducting member 110 and the components 400 to be cooled, thereby improving heat dissipation efficiency.

[0030] In order to achieve good contact between the first heat conductor 110 and the device to be cooled 400 to ensure good heat transfer, the first heat conductor 110 may include a heat conducting surface 112, which is used to contact the device to be cooled 400. In this way, the heat emitted from the device to be cooled 400 can be absorbed by the heat conducting surface 112.

[0031] In some embodiments, the first heat conducting member 110 may include a heat conducting surface 112. In this case, one side of the device 400 to be cooled can be brought into contact with the heat conducting surface 112, thereby transferring heat from the device 400 to be cooled to the first heat conducting member 110 via the heat conducting surface 112. In addition, when the device 400 to be cooled is relatively small, the area in contact with the heat conducting surface 112 is also relatively small. In this case, multiple devices 400 to be cooled can be brought into contact with the same heat conducting surface 112. That is, multiple devices 400 to be cooled share one first heat conducting member 110. This ensures a good heat dissipation effect while reducing the number of first heat conducting members 110, thereby reducing costs while ensuring a good heat dissipation effect.

[0032] In other embodiments, the first heat-conducting member 110 may include multiple heat-conducting surfaces 112, and the multiple heat-conducting surfaces 112 may be distributed according to actual working conditions, and specifically may include: a preset angle may be formed between two adjacent heat-conducting surfaces 112, and this distribution form may be applicable to multiple heat-dissipating devices 400 distributed at an angle; or, two of the multiple heat-conducting surfaces 112 may be arranged back to back, and this distribution form may be applicable to multiple heat-dissipating devices 400 arranged at intervals; of course, other distribution forms may also be applicable, as long as they can be applicable to the distribution form of the heat-dissipating devices 400.

[0033] In order to enable the cooling medium to flow through the first heat conductor 110, in an embodiment of the present application, the first heat conductor 110 may be provided with a medium channel 111, which is connected to the connecting pipe 200. In this way, the cooling medium transported by the connecting pipe 200 can flow into the medium channel 111, absorb the heat transferred from the heat dissipation device 400 to the first heat conductor 110, and allow the heat to flow back to the connecting pipe 200 again as the cooling medium flows out of the medium channel 111, or be directly discharged to the outside, thereby achieving a heat dissipation effect on the heat dissipation device 400.

[0034] Exemplarily, the medium channel 111 can be located inside the first heat conductor 110, that is, the medium channel 111 is formed when the first heat conductor 110 is manufactured. This method can improve the manufacturing efficiency of the first heat conductor 110 and ensure the sealing of the medium channel 111; or, the first heat conductor 110 is manufactured first, and then the medium channel 111 is formed inside the first heat conductor 110 by machining; of course, it is also possible that after the first heat conductor 110 is manufactured, an additional medium channel 111 is provided on the outside of the first heat conductor 110.

[0035] In some embodiments, the first heat conducting member 110 may be a plate, such as a long strip, square, or circular plate, and the specific shape may be determined based on actual needs. The medium channels 111 may be provided at both ends of the plate, with one end for inputting the cooling medium and the other end for outputting the cooling medium. Furthermore, the medium channels 111 may be distributed throughout or partially throughout the entire coverage area of ​​the plate, thereby increasing the contact area between the cooling medium and the plate, thereby improving heat dissipation efficiency.

[0036] Optionally, the medium channel 111 can be a linear channel to facilitate the smooth flow of the cooling medium; the medium channel 111 can also be a serpentine channel, a spiral channel, etc., to increase the cooling area; of course, it can also be other shapes, and the specific shape can be set according to actual needs.

[0037] In an embodiment of the present application, a cooling medium can be introduced into at least one first heat-conducting member 110 of the first heat-dissipating assembly 100 through the connecting pipe 200, so that the cooling medium flows through the medium channel 111 of the first heat-conducting member 110, and the heat-conducting surface 112 of the first heat-conducting member 110 is also in contact with the device to be cooled 400. In this way, when the cooling medium flows in the medium channel 111, the heat transferred from the device to be cooled 400 to the heat-conducting surface 112 is absorbed, so that the heat flows out of the medium channel 111 as the cooling medium flows into the connecting pipe 200 or is discharged externally.

[0038] Based on the above process, the heat dissipation effect of the heat dissipation device 400 can be achieved to alleviate the problem of overheating caused by heat accumulation in the heat dissipation device 400, thereby reducing the loss of the life of the heat dissipation device 400 due to excessive temperature, and to a certain extent, the service life of the heat dissipation device 400 can be improved. In addition, the impact of excessive temperature on the working efficiency of the heat dissipation device 400 can also be reduced.

[0039] In some embodiments, the first heat dissipation assembly 100 may include multiple first heat conducting members 110 , each of which may be in contact with at least one device 400 to be cooled, thereby simultaneously cooling multiple devices 400 to be cooled, thereby improving cooling efficiency.

[0040] The plurality of first heat conducting members 110 may be stacked. For example, the first heat conducting member 110 may be a plate. In this case, the plurality of first heat conducting members 110 may be stacked along their respective thickness directions.

[0041] A first accommodating space 120 is formed between two adjacent first heat conducting members 110. That is, the two adjacent first heat conducting members 110 are spaced a certain distance apart from each other so that the heat dissipation device 400 can be accommodated in the first accommodating space 120. It should be noted that each heat dissipation device 400 can be located entirely within the first accommodating space 120. Of course, each heat dissipation device 400 can also be located partially within the first accommodating space 120.

[0042] Furthermore, the heat conducting surface 112 is disposed toward the first accommodating space 120 and is configured to contact the heat dissipation component 400 in the first accommodating space 120. Based on the above configuration, heat generated by the heat dissipation component 400 in the first accommodating space 120 during operation can be transferred to the heat conducting surface 112 in contact therewith, and then removed by the cooling medium in the medium channel 111 of the first heat conducting member 110, thereby achieving a heat dissipation effect on the heat dissipation component 400.

[0043] In some embodiments, the heat dissipation device 400 may include a cage 410 and multiple optical modules 420. The cage 410 may include multiple spaced mounting portions for mounting the optical modules 420, and a connecting portion 413 connecting the multiple mounting portions. Two adjacent mounting portions and the connecting portion 413 define a second receiving space 414, with at least a portion of each optical module 420 extending into the interior of the corresponding mounting portion. This arrangement allows the multiple optical modules 420 to be mounted separately using the multiple mounting portions, ensuring the stability of each optical module 420.

[0044] Furthermore, since the first heat dissipation assembly 100 includes a plurality of stacked first heat conducting members 110 , each of the plurality of first heat conducting members 110 can pass through the corresponding second accommodation space 414 , and the optical module 420 also contacts the heat conducting surface 112 of the corresponding first heat conducting member 110 .

[0045] Based on the above configuration, the plurality of first heat conducting members 110 can conduct heat to the corresponding optical modules 420 respectively, so as to achieve a heat dissipation effect for each optical module 420 .

[0046] For example, multiple mounting portions can be arranged in parallel, with the connecting portion 413 connected to the same end of the multiple connecting portions 413. Furthermore, the multiple mounting portions and the connecting portion 413 can be integrally arranged to ensure the overall strength of the cage 410. Of course, the multiple mounting portions and the connecting portion 413 can also be separate structures, connected by assembly or fixing.

[0047] To install the optical module 420 , each mounting portion may be provided with a slot structure. At least a portion of the optical module 420 extends into the slot structure and is engaged to ensure that the optical module 420 can be securely mounted to the cage 410 .

[0048] In addition, the heat conducting surface 112 of the first heat conducting member 110 located in each second accommodation space 414 may contact the optical module 420 on at least one side of the first heat conducting member 110 , so as to provide a better heat dissipation effect for the optical module 420 .

[0049] 2 and 3 , the first heat dissipation component 100 may include two first heat conducting members 110 stacked and spaced apart from each other, and a first accommodating space 120 is formed between the two first heat conducting members 110. The first accommodating space 120 may accommodate a first layer of devices to be dissipated 400. The first layer of devices to be dissipated 400 may include at least one device to be dissipated 400, and one side surface of the first layer of devices to be dissipated 400 may be in contact with a heat conducting surface 112 of one of the first heat conducting members 110, so that a heat dissipation effect on the first layer of devices to be dissipated 400 may be achieved through one of the first heat conducting members 110.

[0050] Moreover, the heat-conducting surface 112 of another first heat-conducting member 110 can face another first accommodating space 120 and away from the above-mentioned first accommodating space 120, and one side surface of the second-layer device to be cooled 400 is in contact with the heat-conducting surface 112 of another first heat-conducting member 110, so that the heat dissipation effect of the second-layer device to be cooled 400 can be achieved through another first heat-conducting member 110.

[0051] It should be noted here that the first heat dissipation component 100 can be arranged on a PCB board or a tray. In this case, another first heat conductive member 110 is also stacked and spaced apart with the PCB board or the tray to form a first accommodating space 120, and the second layer of heat dissipation device 400 is located in the first accommodating space 120 to dissipate heat through another first heat conductive member 110.

[0052] In other embodiments, the heat-conducting surfaces 112 of the two first heat-conducting members 110 can be arranged relative to each other, that is, the two heat-conducting surfaces 112 are arranged facing the same first accommodating space 120. In this case, the opposite sides of the first layer of heat-dissipating devices 400 can respectively contact the heat-conducting surfaces 112 of the two first heat-conducting members 110, so as to dissipate heat for the first layer of heat-dissipating devices 400 at the same time through the two first heat-conducting members 110.

[0053] In addition, the first heat-conducting member 110 may also include two heat-conducting surfaces 112 arranged in opposite directions. At this time, the two layers of heat-dissipating devices 400 may be respectively located on opposite sides of the first heat-conducting member 110 and respectively contact the two heat-conducting surfaces 112, so as to dissipate heat for the two layers of heat-dissipating devices 400 through the same first heat-conducting member 110.

[0054] In other embodiments, the heat-conducting surfaces 112 of the two first heat-conducting members 110 are arranged opposite to each other, that is, the two heat-conducting surfaces 112 are arranged facing the same first accommodating space 120. At this time, the first layer of devices to be cooled 400 and the second layer of devices to be cooled 400 are stacked in the same first accommodating space 120, and the first layer of devices to be cooled 400 are in contact with the heat-conducting surface 112 of one of the first heat-conducting members 110, and the second layer of devices to be cooled 400 are in contact with the heat-conducting surface 112 of the other first heat-conducting member 110, so as to dissipate heat for the two layers of devices to be cooled 400 respectively through the two first heat-conducting members 110.

[0055] In addition to the above-mentioned method, the first heat dissipation component 100 may also include more first heat-conducting members 110 stacked and spaced apart from each other, such as three, four, five, etc. Correspondingly, a first accommodating space 120 is formed between each two adjacent first heat-conducting members 110. In addition, a first heat-conducting member 110 located at the edge can be connected to a PCB board or a tray, and a first accommodating space 120 can also be formed, so that at least one layer of devices 400 to be dissipated can be accommodated through each first accommodating space 120, and each layer of devices 400 to be dissipated can be in contact with the heat-conducting surface 112 of the corresponding first heat-conducting member 110. It should be noted here that the form of contact between the devices 400 to be dissipated and the heat-conducting surface 112 of the first heat-conducting member 110 can refer to the case of the two first heat-conducting members 110 mentioned above, and will not be repeated here.

[0056] In addition, when there is only one first heat-conducting member 110, it can include a heat-conducting surface 112, which can dissipate heat for a layer of devices 400 to be cooled; of course, the first heat-conducting member 110 can also include two heat-conducting surfaces 112 arranged back to back, which can dissipate heat for two layers of devices 400 to be cooled arranged at intervals at the same time.

[0057] In the embodiment of the present application, the device to be dissipated heat 400 may include a cage 410 and an optical module 420, as shown in Figures 4 and 5. The cage 410 includes a first mounting portion 411 and a second mounting portion 412 for mounting the optical module 420, respectively, and a connecting portion 413. The first mounting portion 411 and the second mounting portion 412 are spaced apart and connected by the connecting portion 413. Thus, the first mounting portion 411, the second mounting portion 412, and the connecting portion 413 collectively form a second accommodation space 414.

[0058] For example, the first mounting portion 411 and the second mounting portion 412 can be arranged in parallel, and the connecting portion 413 is connected to one end of the first mounting portion 411 and the same end of the second mounting portion 412. In this way, the first mounting portion 411, the connecting portion 413, and the second mounting portion 412 can form a U-shaped structure, and the space enclosed within the U-shaped structure is the second accommodation space 414. Of course, the cage 410 can also have other shapes, which are not specifically limited here.

[0059] The first mounting portion 411, the second mounting portion 412 and the connecting portion 413 may also be an integrated structure to ensure the overall strength and stability of the cage 410. Of course, the first mounting portion 411, the second mounting portion 412 and the connecting portion 413 may also be separate structures, and the cage 410 may be formed by assembly, fixing, etc.

[0060] The optical module 420 is mounted to the first mounting portion 411 and the second mounting portion 412, respectively. For example, each of the first mounting portion 411 and the second mounting portion 412 may be provided with a slot structure, with at least a portion of the optical module 420 mounted within the slot structure to ensure stability and secure installation between the optical module 420 and the cage 410. The slot structure may include multiple elastic strips that can elastically squeeze against the sidewalls of the optical module 420 to prevent the optical module 420 from escaping the cage 410.

[0061] In addition, the first mounting portion 411 may include one or more slot structures, and the second mounting portion 412 may include one or more slot structures, so that the first mounting portion 411 and the second mounting portion 412 can respectively install at least one optical module 420 .

[0062] The first heat dissipation assembly 100 may include two stacked first heat conducting members 110 , wherein one of the first heat conducting members 110 is disposed through the second accommodation space 414 , so that the first mounting portion 411 and the second mounting portion 412 are respectively located on opposite sides of one of the first heat conducting members 110 .

[0063] To ensure contact between the first heat-conducting member 110 and the corresponding optical module 420, at least a portion of the optical module 420 can extend into the interior of the cage 410. The optical module 420 mounted on the first mounting portion 411 contacts the heat-conducting surface 112 of one of the first heat-conducting members 110, while the optical module 420 mounted on the second mounting portion 412 contacts the heat-conducting surface 112 of the other first heat-conducting member 110. Based on this arrangement, the two first heat-conducting members 110 can dissipate heat from the optical modules 420 mounted on the first mounting portion 411 and the second mounting portion 412, respectively.

[0064] In a more specific embodiment, two first heat conducting members 110 can be spaced apart in the vertical direction to form an upper first accommodating space 120, and the lower first heat conducting member 110 is connected to a PCB board or a tray to form a lower first accommodating space 120. The first mounting portion 411 and the optical module 420 mounted thereon are located in the upper first accommodating space 120, and the optical module 420 contacts the heat conducting surface 112 (i.e., the lower surface) of the upper first heat conducting member 110 for heat transfer. The second mounting portion 412 and the optical module 420 mounted thereon are located in the lower first accommodating space 120, and the optical module 420 contacts the heat conducting surface 112 (i.e., the lower surface) of the lower first heat conducting member 110 for heat transfer. This contact method allows the two first heat conducting members 110 to contact the two layers of optical modules 420, respectively, to increase the heat transfer area and thus improve heat dissipation efficiency.

[0065] In other embodiments, the first mounting portion 411 and the optical module 420 mounted thereon are located in the upper first accommodating space 120, and the optical module 420 contacts the heat-conducting surface 112 (i.e., the upper surface) of the lower first heat-conducting member 110 for heat transfer; the second mounting portion 412 and the optical module 420 mounted thereon are located in the lower first accommodating space 120, and the optical module 420 contacts the heat-conducting surface 112 (i.e., the lower surface) of the lower first heat-conducting member 110 for heat transfer. In this way, the heat-conducting surfaces 112 on opposite sides of the same first heat-conducting member 110 can contact the two layers of optical modules 420, respectively, to facilitate simultaneous heat transfer. This contact method can achieve simultaneous heat dissipation for more components 400 to be cooled.

[0066] To facilitate contact between the first heat conducting member 110 and the corresponding heat dissipation device 400, the first heat conducting member 110 may be provided with a boss structure 113. As shown in FIG6 , the boss structure 113 is located on the heat conducting surface 112 and protrudes from the heat conducting surface 112, and is configured to contact the heat dissipation device 400. By providing the boss structure 113, the distance between the first heat conducting member 110 and the heat dissipation device 400 can be shortened, thereby making it easier for the first heat conducting member 110 to contact the heat dissipation device 400 and improving the contact quality.

[0067] Exemplarily, the heat-conducting surface 112 of each first heat-conducting member 110 can contact multiple heat-dissipating devices 400, so that the heat-conducting surface 112 of each first heat-conducting member 110 can be provided with multiple boss structures 113, and the multiple boss structures 113 are arranged on the heat-conducting surface 112 according to preset rules, such as a straight line form, a circular arrangement form, a polygonal array form, etc., to meet the contact requirements in various situations.

[0068] In some embodiments, the heat dissipation device 400 may include a mating cage 410 and an optical module 420, with the optical module 420 at least partially extending into the interior of the cage 410. For details, please refer to the above-mentioned relevant content regarding the arrangement relationship between the cage 410 and the optical module 420, which will not be repeated here.

[0069] Considering that in some cases, the cage 410 partially blocks the optical film block, making it difficult for the heat-conducting surface 112 of the first heat-conducting member 110 to contact the optical module 420. Based on this situation, in the embodiment of the present application, a position-avoiding hole 415 can be provided on the side of the cage 410 facing the heat-conducting surface 112. As shown in Figures 4 and 5, the boss structure 113 extends from the position-avoiding hole 415 to the interior of the cage 410 and contacts the optical module 420. In this way, good contact between the first heat-conducting member 110 and the optical module 420 can be ensured, thereby achieving a good heat dissipation effect for the optical module 420 through the first heat-conducting member 110; at the same time, through the cooperation between the boss structure 113 and the position-avoiding hole 415, a position-limiting effect can be played on the heat-dissipating device 400 to prevent the heat-dissipating device 400 from being separated from the first heat-dissipating assembly 100.

[0070] To improve contact between the boss structure 113 and the optical module 420, the cage 410 may be provided with a spring structure 416. As shown in FIG6 , the spring structure 416 is disposed on the side wall of the cage 410 opposite the avoidance hole 415. Thus, when the optical module 420 is mounted in the cage 410, the spring structure 416 exerts an elastic force on the optical module 420, causing the optical module 420 to move toward the boss structure 113. This ensures good contact between the optical module 420 and the boss structure 113, thereby ensuring good heat dissipation.

[0071] In other embodiments, the spring structure 416 may be replaced by other elastic structures, and the specific form is not limited, as long as it can apply elastic force to the optical module 420 toward the boss structure 113 .

[0072] Taking into account that the heat-conducting surface 112 of the first heat-conducting member 110 needs to be in contact with the device 400 to be cooled, in order to enable the side where the heat-conducting surface 112 is located to form a space for accommodating the device 400 to be cooled, in an embodiment of the present application, the first heat-conducting member 110 may be provided with a support structure 114. As shown in FIG6 , the support structure 114 extends from the heat-conducting surface 112 in a direction away from the heat-conducting surface 112. Through this arrangement, a space for accommodating the device 400 to be cooled can be enclosed by the support structure 114 and the heat-conducting surface 112.

[0073] Under actual working conditions, the first heat dissipation component 100 can be connected to a PCB board or a tray. At this time, the support structure 114 of the first heat-conducting member 110 located at the bottom is supported on the PCB board or the tray. In this way, the support structure 114, the heat-conducting surface 112 and the surface of the PCB board or the tray together form a first accommodating space 120. The heat-dissipating device 400 can be placed in the first accommodating space 120 and contact the heat-conducting surface 112.

[0074] When the first heat dissipation component 100 includes multiple first heat conductive members 110, two adjacent first heat conductive members 110 can also be supported by the support structure 114. Specifically, among the two adjacent first heat conductive members 110, the support structure 114 of one first heat conductive member 110 is supported on the surface of the other first heat conductive member 110 that is away from its own support structure 114, thereby effectively preventing the two adjacent first heat conductive members 110 from squeezing the device 400 to be cooled located therebetween, thereby ensuring that the device 400 to be cooled will not be damaged due to squeezing.

[0075] To ensure that two adjacent first heat conducting members 110 do not move relative to each other, the two can be directly connected through a support structure 114. Specifically, the support structure 114 of one can be fixedly connected to the other, such as by welding, bonding, riveting, etc., to ensure the firmness and stability of the connection. Alternatively, the support structure 114 of one can be detachably connected to the other to facilitate disassembly and assembly, and to facilitate the removal and placement of the heat dissipation device 400.

[0076] In other embodiments, additional fasteners may be provided, specifically including fastening pins, fastening screws, fastening bolts, etc. In this case, the two adjacent first heat conducting members 110 are supported by the support structure 114, and the two adjacent first heat conducting members 110 are fastened together by fasteners, thereby ensuring the firmness and stability between the two and preventing arbitrary movement.

[0077] Illustratively, the areas of the heat-conducting surface 112 located at both ends of the first heat-conducting member 110 are respectively provided with support structures 114 to support both ends of the first heat-conducting member 110; of course, the support structures 114 can also be distributed in other areas of the heat-conducting surface 112, as long as they can play a supporting role and do not hinder the accommodation of the heat-dissipating device 400.

[0078] In the embodiment of the present application, the support structure 114 may extend along the edge of the first heat conducting member 110 , and both ends of the support structure 114 in the extension direction may be aligned with the edge of the first heat conducting member 110 .

[0079] In addition, the support structure 114 and the first heat-conducting member 110 can be integrally arranged, that is, the support structure 114 is formed together during the process of manufacturing the first heat-conducting member 110. This method can improve the strength of the entire first heat-conducting member 110 and shorten the manufacturing cycle; of course, the support structure 114 can also be connected to the first heat-conducting member 110, such as by welding, bonding, riveting, etc. This method can reduce the manufacturing difficulty.

[0080] In some embodiments, the support structure 114 can be a solid structure that primarily serves as a support. In other embodiments, the support structure 114 can be a hollow structure, the hollow inner cavity of which can serve as a medium channel 111 to facilitate the transmission of a cooling medium and dissipate heat from the first heat-conducting member 110. This configuration eliminates the need for an additional medium channel 111 in the first heat-conducting member 110, thereby reducing the manufacturing difficulty of the first heat-conducting member 110 and, to a certain extent, improving the strength of the first heat-conducting member 110.

[0081] In the embodiment of the present application, the device to be cooled 400 may include multiple parts, and the first heat dissipation assembly 100 may dissipate heat for a portion of the device, while the second heat dissipation assembly 300 may dissipate heat for the remaining parts. The device to be cooled 400 may include an optical module 420 requiring heat dissipation, and may also include chips requiring heat dissipation. The first heat dissipation assembly 100 may primarily dissipate heat for the optical module 420, while the heat dissipation device may further include a second heat dissipation assembly 300 to dissipate heat for the chips, as shown in FIG1 .

[0082] The second heat dissipation component 300 is connected to the connecting pipe 200 so that a cooling medium is delivered to the second heat dissipation component 300 through the connecting pipe 200 , thereby transferring the heat absorbed by the second heat dissipation component 300 away through the cooling medium to achieve a heat dissipation effect.

[0083] To ensure sufficient cooling capacity, the second heat dissipation component 300 and the first heat dissipation component 100 can be connected in parallel in the connecting pipe 200. In this way, the cooling medium of the same temperature can be respectively transported to the first heat dissipation component 100 and the second heat dissipation component 300 through the connecting pipe 200, thereby ensuring that the second heat dissipation component 300 can also have sufficient cooling capacity to achieve the heat dissipation effect on the chip.

[0084] To distribute the cooling medium in the connecting pipe 200 to the first heat dissipation assembly 100 and the second heat dissipation assembly 300, the heat dissipation device may further include a water divider 500. The water divider 500 can divide the cooling medium into multiple branches, such as two branches, to facilitate the delivery of the cooling medium to the first heat dissipation assembly 100 and the second heat dissipation assembly 300. It should be noted that the working principle of the water divider 500 can be referred to in related art and will not be elaborated on here.

[0085] The cooling medium after heat exchange between the first heat dissipation component 100 and the second heat dissipation component 300 can also be transported away through the connecting pipe 200. In this case, the heat dissipation device can further include a water collector 600. As shown in FIG1 , the cooling medium after heat exchange output by the first heat dissipation component 100 and the second heat dissipation component 300 can be collected together through the water collector 600 and returned to the connecting pipe 200 for transport through the connecting pipe 200. It should be noted that the working principle of the water collector 600 can be referred to in related art and will not be elaborated on here.

[0086] Referring to Figure 1, the connecting pipeline 200 may include an input main line 210, an output main line 220, a first input branch 230, a first output branch 240, a second input branch 250 and a second output branch 260, wherein the input main line 210 is connected to the water divider 500, the first input branch 230 connects the water divider 500 and the first heat dissipation component 100, the first output branch 240 connects the first heat dissipation component 100 and the water collector 600, the second input branch 250 connects the water divider 500 and the second heat dissipation component 300, the second output branch 260 connects the second heat dissipation component 300 and the water collector 600, and the output main line 220 is connected to the water collector 600.

[0087] Based on the above configuration, the cooling medium flows into the water divider 500 via the input main path 210. The water divider 500 divides the cooling medium into at least two streams. One stream of cooling medium flows into the first heat dissipation component 100 via the first input branch 230, undergoes heat exchange in the first heat dissipation component 100, and then flows into the first output branch 240 after heat exchange, and then flows into the water collector 600 via the first output branch 240. The other stream of cooling medium flows into the second heat dissipation component 300 via the second input branch 250, undergoes heat exchange in the second heat dissipation component 300, and then flows into the second output branch 260 after heat exchange, and then flows into the water collector 600 via the second output branch 260. Of course, other streams of cooling medium can also flow into other structures that need to dissipate heat. After heat exchange, the at least two streams of cooling medium converge in the water collector 600 and eventually flow into the output main path 220, where they are transported away.

[0088] The embodiment of the present application realizes the segmentation of the cooling medium, so that multiple structures that need heat dissipation can be cooled at the same time, and the cooling medium can also be collected for easy transmission.

[0089] Of course, in other embodiments, the cooling medium can be directly transmitted by directly connecting multiple branches to the main line, and the water distributor 500 and the water collector 600 can be omitted. This method can also simultaneously transmit the cooling medium to multiple structures that need heat dissipation, thereby achieving synchronous heat dissipation.

[0090] The embodiment of the present application also provides another implementation method. As shown in Figure 10, the heat dissipation device includes a second heat dissipation component 300, which is connected to the connecting pipe 200, and the second heat dissipation component 300 is connected in parallel with a part of the first heat conducting member 110 of the first heat dissipation component 100, and in series with another part of the first heat conducting member 110.

[0091] It should be noted that the first heat dissipation assembly 100 may include a plurality of first heat conductive members 110, wherein a portion of the first heat conductive members 110 is connected in parallel with the second heat dissipation assembly 300, and the parallel portion is connected in series with another portion of the first heat conductive members 110. For example, the first heat dissipation assembly 100 may include two stacked first heat conductive members 110, in which case one of the first heat conductive members 110 is connected in parallel with the second heat dissipation assembly, and the parallel portion is connected in series with the other first heat conductive member 110; of course, the first heat dissipation assembly 100 may also include other numbers of first heat conductive members 110, and the number of first heat conductive members 110 connected in series with the second heat dissipation assembly 300 may be allocated according to actual working conditions.

[0092] In this embodiment, the heat dissipation component may also include a water separator 500 and a water collector 600, and the connecting pipeline 200 includes an input main line 210, an output main line 220, a first input branch 230, a first output branch 240, a second input branch 250 and a second output branch 260, wherein the input main line 210 is respectively connected to the water separator 500 and another part of the first heat conductor 110, the first input branch 230 connects the water separator 500 and one part of the first heat conductor 110, the first output branch 240 connects one part of the first heat conductor 110 and the water collector 600, the second input branch 250 connects the water separator 500 and the second heat dissipation component 300, the second output branch 260 connects the second heat dissipation component 300 and the water collector 600, and the output branch is respectively connected to the water collector 600 and another part of the first heat conductor 110.

[0093] Based on the above arrangement, the cooling medium flows into the water divider 500 and the other part of the first heat conducting member 110 respectively through the input main path 210, so that one cooling medium flows directly into the other part of the first heat conducting member 110, performs heat exchange in the other part of the first heat conducting member 110, and flows into the output main path 220 after heat exchange, and is transported away through the output main path 220; another cooling medium flows into the water divider 500, and the water divider 500 divides the cooling medium into at least two streams, and the first cooling medium flows into one of the first heat conducting members 110 through the first input branch 230. The first heat conducting member 110 is divided into two sections, wherein heat exchange occurs in a portion of the first heat conducting member 110. After heat exchange, the first heat conducting member 110 flows into the first output branch 240 and then flows into the manifold 600 via the first output branch 240. The second cooling medium flows into the second heat dissipation assembly 300 via the second input branch 250, undergoes heat exchange in the second heat dissipation assembly 300, and then flows into the second output branch 260 and then flows into the manifold 600 via the second output branch 260. Of course, other cooling mediums can also flow into other structures requiring heat dissipation. After heat exchange, at least two cooling mediums converge in the manifold 600 and ultimately flow into the main output path 220, where they are transported away.

[0094] For example, the medium channel 111 of the other part of the first heat conducting member 110 can be directly set on the input main path 210 and the output main path 220, and the end of the input main path 210 is connected to the water distributor 500, and the end of the output main path 220 is connected to the water collector 600. Through this arrangement, a portion of the cooling medium can flow directly into the other part of the first heat conducting member 110, thereby ensuring that the flow rate of this portion of the cooling medium is large enough to ensure a better heat dissipation effect for the other part of the first heat conducting member 110. It should be noted here that in some cases, the other part of the first heat conducting member 110 absorbs relatively more heat, and directly connecting it to the input main path 210 and the output main path 220 can ensure that it has sufficient cooling capacity.

[0095] Taking into account that the device 400 to be cooled may include more structures that need to dissipate heat, such as multiple optical modules 420 and multiple chips, the second heat dissipation component 300 in the embodiment of the present application may include multiple second heat conducting members 310, and the multiple second heat conducting members 310 are arranged in series and / or in parallel in the connecting pipe 200, as shown in Figures 1 and 10.

[0096] Specifically, the second heat dissipation component 300 may include two heat dissipation paths respectively connected between the water distributor 500 and the water collector 600, and each heat dissipation path is provided with at least one second heat conductive member 310, and each second heat conductive member 310 can be in contact with the corresponding chip, so that multiple chips can be cooled at the same time.

[0097] Illustratively, the second heat conducting member 310 may be a heat conducting seat, a heat conducting block, or a heat conducting plate, etc. The specific shape is not limited as long as it can maintain good contact with the chip.

[0098] To facilitate assembly and disassembly, the water manifold 500 may include a first housing 510 and a first quick-connect connector 520. As shown in Figures 7 and 11, the first housing 510 has a first inlet 511 and a first outlet 512. The first inlet 511 is configured to communicate with the main input line 210 to deliver cooling medium to the water manifold 500 through the main input line 210. The first outlet 512 is configured to communicate with the first input branch line 230 or the second input branch line 250 to output cooling medium. For example, the first housing 510 may have multiple first outlets 512 to facilitate communication with the first input branch line 230 and the second input branch line 250, respectively.

[0099] In order to connect the input main line 210 to the first inlet 511, in an embodiment of the present application, the first quick-connector 520 is connected to the first inlet 511, and the input main line 210 can be detachably connected to the first quick-connector 520. In this way, it is convenient to disassemble and assemble the water divider 500 and the input main line 210, which is convenient for replacement or maintenance. Similarly, the first quick-connector 520 can also be connected to the first outlet 512, and the first input branch 230 or the second input branch 250 can be detachably connected to the first quick-connector 520, so as to facilitate the disassembly and assembly of the water divider 500 and the first input branch 230 or the second input branch 250, which is convenient for replacement or maintenance. It should be noted here that the number of first quick-connectors 520 is equal to the sum of the number of first inlets 511 and the number of first outlets 512, so as to ensure that each port can be detachably connected to the pipeline.

[0100] To facilitate assembly and disassembly, the manifold 600 may include a second housing 610 and a second quick-connect connector 620. As shown in Figures 8 and 12, the second housing 610 is provided with a second inlet 611 and a second outlet 612. The second inlet 611 is used to communicate with the first output branch 240 or the second output branch 260 to receive the cooling medium, and the second outlet 612 is connected to the output main path 220 to output the cooling medium. For example, the second housing 610 may be provided with multiple second inlets 611 to facilitate communication with the first output branch 240 and the second output branch 260, respectively.

[0101] In order to connect the output main line 220 to the second outlet 612, in an embodiment of the present application, the second quick-connector 620 is connected to the second outlet 612, and the output main line 220 can be detachably connected to the second quick-connector 620. In this way, it is convenient to disassemble and assemble the water collector 600 and the output main line 220, which is convenient for replacement or maintenance. Similarly, the second quick-connector 620 can also be connected to the second inlet 611, and the first output branch 240 or the second output branch 260 can be detachably connected to the second quick-connector 620, so as to facilitate the disassembly and assembly of the water distributor 500 and the first output branch 240 or the second output branch 260, which is convenient for replacement or maintenance. It should be noted here that the number of second quick-connectors 620 is equal to the sum of the number of second inlets 611 and the number of second outlets 612, so as to ensure that each port can be detachably connected to the pipeline.

[0102] For example, the water distributor 500 can adopt a one-to-two form, a one-to-three form, a one-to-four form, etc., which can be selected according to the actual working conditions; similarly, the water collector 600 can adopt a one-to-two form, a one-to-three form, a one-to-four form, etc. that are compatible with the water distributor 500, which can be selected according to the actual working conditions.

[0103] In a first more specific embodiment, when the first heat dissipation component 100 includes a first heat conducting member 110 and the second heat dissipation component 300 includes a heat dissipation path, the water divider 500 and the water collector 600 can both be divided into two.

[0104] In a second more specific embodiment, when the first heat dissipation component 100 includes a first heat conductor 110 and the second heat dissipation component 300 includes N heat dissipation paths, the water divider 500 and the water collector 600 can both adopt a one-division (N+1) form.

[0105] In a third more specific embodiment, when the first heat dissipation assembly 100 includes M first heat conducting members 110 and the second heat dissipation assembly 300 includes N heat dissipation paths, the water divider 500 and the water collector 600 may both adopt a one-dividing (M+N) form.

[0106] In a fourth more specific embodiment, the first heat dissipation component 100 includes M first heat conductive members 110, wherein A first heat conductive members 110 are connected to the input main path 210 and the output main path 220, and the remaining (MA) first heat conductive members 110 are respectively connected to the water divider 500 and the water collector 600; when the second heat dissipation component 300 includes one heat dissipation path, the water divider 500 and the water collector 600 can both adopt a one-point (M-A+1) form.

[0107] In a fifth more specific embodiment, the first heat dissipation component 100 includes M first heat conductive members 110, wherein A first heat conductive members 110 are connected to the input main path 210 and the output main path 220, and the remaining (MA) first heat conductive members 110 are respectively connected to the water divider 500 and the water collector 600; when the second heat dissipation component 300 includes N heat dissipation paths, the water divider 500 and the water collector 600 can both adopt a one-point (M-A+N) form.

[0108] Based on the above heat dissipation device, the embodiment of the present application further discloses a communication device, which includes the above heat dissipation device. The communication device can be a switch, etc., or other devices, which are not specifically limited here.

[0109] In summary, the present application effectively solves the liquid cooling problem of the optical module 420 and the switch main chip, and adopts a compact optical module 420 layout, which meets the heat dissipation requirements of the optical module 420 that cannot be met by air cooling. Moreover, the above-mentioned liquid cooling form can increase the heat flux density of the optical module 420, thereby solving the bottleneck problem of air cooling; in addition, the use of liquid cooling can also improve the overall heat dissipation efficiency and achieve energy saving and emission reduction effects.

[0110] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A heat dissipation device, comprising: A first heat dissipation component (100) and a connecting pipeline (200); The first heat dissipation component (100) comprises at least one first heat conducting member (110), the first heat conducting member (110) being provided with a medium channel (111), and the connecting pipeline (200) being in communication with the medium channel (111); The first heat conducting member (110) comprises a heat conducting surface (112), and the heat conducting surface (112) is used for contacting the device (400) to be cooled.

2. The heat dissipation device according to claim 1, wherein: The first heat dissipation component (100) comprises a plurality of first heat conducting members (110) arranged in a stacked manner, and a first accommodation space (120) for accommodating the device to be dissipated (400) is formed between two adjacent first heat conducting members (110); The heat-conducting surface (112) is arranged toward the first accommodating space (120) and is used for contacting the device to be cooled (400) in the first accommodating space (120).

3. The heat dissipation device according to claim 2, wherein: The heat dissipation device (400) comprises a cage (410) and a plurality of optical modules (420), the cage (410) comprising a plurality of installation portions respectively used to install the optical modules (420) and arranged at intervals, and a connecting portion (413) connecting the plurality of installation portions, two adjacent installation portions and the connecting portion (413) enclosing a second accommodation space (414), and at least a portion of each optical module (420) extends into the interior of the corresponding installation portion; Each of the plurality of first heat-conducting members (110) passes through the corresponding second accommodation space (414), and the optical module (420) is in contact with the heat-conducting surface (112) of the corresponding first heat-conducting member (110).

4. The heat dissipation device according to claim 3, wherein: The plurality of mounting portions include a first mounting portion (411) and a second mounting portion (412), and the first mounting portion (411), the second mounting portion (412) and the connecting portion (413) enclose the second accommodation space (414); The first heat dissipation component (100) comprises two first heat conducting members (110) stacked together, wherein one of the first heat conducting members (110) passes through the second accommodation space (414); The first mounting portion (411) and the second mounting portion (412) are respectively located on opposite sides of one of the first heat-conducting components (110), and the optical module (420) mounted on the first mounting portion (411) contacts the heat-conducting surface (112) of one of the first heat-conducting components (110), while the optical module (420) mounted on the second mounting portion (412) contacts the heat-conducting surface (112) of another of the first heat-conducting components (110).

5. The heat dissipation device according to any one of claims 1 to 4, wherein: The first heat conducting member (110) is provided with a boss structure (113) located on the heat conducting surface (112); the boss structure (113) protrudes from the heat conducting surface (112) and is used for contacting the device (400) to be cooled.

6. The heat dissipation device according to claim 5, wherein: The heat dissipation device (400) comprises a matched cage (410) and an optical module (420), wherein the optical module (420) at least partially extends into the interior of the cage (410); A side of the cage (410) facing the heat conducting surface (112) is provided with an avoidance hole (415), and the boss structure (113) extends from the avoidance hole (415) to the inside of the cage (410) and contacts the optical module (420).

7. The heat dissipation device according to claim 6, wherein: The squirrel cage (410) is provided with a spring sheet structure (416), and the spring sheet structure (416) is arranged on a side wall of the squirrel cage (410) opposite to the avoidance hole (415).

8. The heat dissipation device according to claim 1, wherein: The first heat conducting component (110) is provided with a supporting structure (114), and the supporting structure (114) extends from the heat conducting surface (112) in a direction away from the heat conducting surface (112).

9. The heat dissipation device according to claim 1, wherein: The heat dissipation device also includes a second heat dissipation component (300); The second heat dissipation component (300) is in communication with the connection pipeline (200) and is connected in parallel with the first heat dissipation component (100).

10. The heat dissipation device according to claim 9, wherein: The heat dissipation device further comprises a water distributor (500) and a water collector (600); The connecting pipeline (200) comprises an input main path (210), an output main path (220), a first input branch (230), a first output branch (240), a second input branch (250) and a second output branch (260); the input main path (210) is connected to the water divider (500); the first input branch (230) is connected to the water divider (500) and the first heat dissipation component (100); the first output branch (240) is connected to the first heat dissipation component (100) and the water collector (600); the second input branch (250) is connected to the water divider (500) and the second heat dissipation component (300); the second output branch (260) is connected to the second heat dissipation component (300) and the water collector (600); and the output main path (220) is connected to the water collector (600).

11. The heat dissipation device according to claim 2, wherein: The heat dissipation device also includes a second heat dissipation component (300); The second heat dissipation component (300) is in communication with the connecting pipeline (200), and the second heat dissipation component (300) is connected in parallel with a portion of the first heat conducting component (110) of the first heat dissipation component (100), and is connected in series with another portion of the first heat conducting component (110).

12. The heat dissipation device according to claim 11, wherein: The heat dissipation device further comprises a water distributor (500) and a water collector (600); The connecting pipeline (200) comprises an input main line (210), an output main line (220), a first input branch line (230), a first output branch line (240), a second input branch line (250) and a second output branch line Road (260), The input main path (210) is connected to the water divider (500) and another part of the first heat-conducting member (110) respectively; the first input branch (230) is connected to the water divider (500) and one part of the first heat-conducting member (110); the first output branch (240) is connected to one part of the first heat-conducting member (110) and the water collector (600); the second input branch (250) is connected to the water divider (500) and the second heat dissipation component (300); the second output branch (260) is connected to the second heat dissipation component (300) and the water collector (600); and the output main path (220) is connected to the water collector (600) and another part of the first heat-conducting member (110) respectively.

13. The heat dissipation device according to any one of claims 9 to 12, wherein: The second heat dissipation component (300) comprises a plurality of second heat-conducting members (310), and the plurality of second heat-conducting members (310) are arranged in series and / or in parallel on the connecting pipeline (200).

14. The heat dissipation device according to claim 10 or 12, wherein: The water distributor (500) comprises a first shell (510) and a first quick-connect connector (520), wherein the first shell (510) is provided with a first inlet (511) and a first outlet (512), and the first quick-connect connector (520) is connected to the first inlet (511) or the first outlet (512); And / or, the water collector (600) includes a second shell (610) and a second quick-connect connector (620), the second shell (610) is provided with a second inlet (611) and a second outlet (612), and the second quick-connect connector (620) is connected to the second inlet (611) or the second outlet (612).

15. A communication device, comprising the heat dissipation device according to any one of claims 1 to 14.

Images