Brush for cleaning wafer

Abstract

This brush for cleaning a wafer comprises: a brush including therein a hollow in which a cleaning solution is discharged, and having a plurality of protrusions formed on the outer surface thereof; and a film disposed so as to surround the outer surface of the brush, wherein the film includes a plurality of holes through which the plurality of protrusions pass.

Description

Wafer cleaning brush

[0001] The present invention relates to a brush for cleaning a wafer.

[0002] In general, the semiconductor wafer process consists of a number of processes, such as an ion implantation process, a film deposition process, a diffusion process, a photo process, a surface polishing process, and a cleaning process, to form semiconductor elements in multilayers on the surface of a wafer whose main material is silicon.

[0003] Among these semiconductor wafer processing processes, there is a wafer surface polishing process that polishes the surface while rotating the wafer at high speed using chemical mechanical polishing equipment (CMP; Chemical Mechanical Polishing equipment).

[0004] Additionally, wafer surface polishing processes, etc., necessarily include a wafer cleaning process to remove foreign substances or particles that have occurred.

[0005] Here, the wafer cleaning process is carried out in various ways by applying various types of semiconductor wafer cleaning equipment as disclosed in Patent Publication No. 10-2005-82323.

[0006] For example, a wafer cleaning device includes a pair of cleaning brushes made of a moisture-absorbing sponge material that pressurize and clean the wafer while rotating in contact with the front and back surfaces of the wafer, which are rotated by a guide roller.

[0007] However, brushes in cleaning equipment according to the prior art have a problem in that the brush surface is not fixed when rotating through a roller due to the soft material properties, or the brush surface becomes deformed during use.

[0008] In addition, since contaminants are also absorbed onto the brush surface due to contact between the brush surface and the wafer surface, there is a problem that the cleaning effect of the wafer is reduced when the brush is reused.

[0009] The problem to be solved by the present invention is to provide a wafer cleaning brush capable of improving durability and cleaning effect.

[0010] According to one aspect of the present invention for achieving the above object, a wafer cleaning brush comprises: a brush having a hollow portion through which a cleaning liquid is discharged, and a plurality of protrusions formed on an outer surface; and a film arranged to wrap the outer surface of the brush, wherein the film includes a plurality of holes through which the plurality of protrusions pass.

[0011] This embodiment has the advantage of enhancing the strength of the brush through the film, thereby improving the rotation stability and durability of the brush.

[0012] In addition, there is an advantage in that the cleaning liquid can be guided to be discharged to the protrusion-forming area of ​​the brush, and contaminants can be prevented from being absorbed on the brush surface.

[0013] Fig. 1 is a perspective view showing the appearance of a wafer cleaning brush according to an embodiment of the present invention.

[0014] Figure 2 is a plan view of a wafer cleaning brush and a film wrapping the exterior according to an embodiment of the present invention.

[0015] Figure 3 is a cross-sectional view of a film according to an embodiment of the present invention.

[0016] Figure 4 is a plan view of a film according to an embodiment of the present invention.

[0017] Fig. 5 is a cross-sectional view showing a modified example of the combined structure of a film and a brush according to an embodiment of the present invention.

[0018] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0019] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0020] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0021] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0022] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0023] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0024] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0025] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0026] FIG. 1 is a perspective view showing the appearance of a wafer cleaning brush according to an embodiment of the present invention, FIG. 2 is a plan view of a wafer cleaning brush and a film according to an embodiment of the present invention, FIG. 3 is a cross-sectional view of a film according to an embodiment of the present invention, and FIG. 4 is a plan view of a film according to an embodiment of the present invention.

[0027] Referring to FIGS. 1 to 4, a wafer cleaning brush (10) according to an embodiment of the present invention may include a brush (100) and a film (200) covering the outer surface thereof.

[0028] The brush (100) may be formed in a cylindrical shape. The brush (100) may have a ring-shaped cross-section. A hollow space (120) may be formed in the center of the brush (100). The hollow space (120) may be formed to penetrate from one surface of the brush (100) to the other surface. A rotational shaft (not shown) may be coupled to the hollow space (120). The rotational shaft is rotated by the operation of an actuator (not shown), and accordingly, the brush (100) may be rotated together.

[0029] A wafer cleaning device according to the present embodiment includes a plurality of wafer cleaning brushes (10), and a wafer can be cleaned by being placed between the plurality of wafer cleaning brushes (10).

[0030] The brush (100) may be made of a material that allows fluid to pass through. For example, the material of the brush (100) may be a plastic material, which is a variety of polymer compounds. A cleaning solution discharge unit (not shown) that discharges a cleaning solution in the radial direction of the brush (100) may be provided in the hollow space (120), and the cleaning solution discharged from the cleaning solution discharge unit may pass from the inner surface to the outer surface of the brush (100) and be provided to the wafer.

[0031] The brush (100) may include a plurality of protrusions (110). The plurality of protrusions (110) may be shaped to protrude outward from the outer surface of the brush (100) more than other regions. The plurality of protrusions (110) may come into contact with the surface of the wafer during the wafer cleaning process. The plurality of protrusions (110) may each have a circular cross-sectional shape and various other shapes. The plurality of protrusions (110) may be arranged to be spaced apart from each other along the longitudinal direction of the brush (100). The plurality of protrusions (110) may be arranged to be spaced apart from each other along the circumferential direction of the brush (100). Any one of the plurality of protrusions (110) may be arranged to overlap with a region between two protrusions (110) that are arranged adjacently based on the circumferential direction.

[0032] The above wafer cleaning brush (10) may include a film (200) that wraps around the outer surface. The film (200) has a predetermined thickness and may be arranged to wrap around the outer surface of the brush (100). The material of the film (200) may be various materials such as PET (polyethylene terephthalate) or PVC (polyvinyl chloride).

[0033] The thickness of the above film (200) may vary from 0.1 mm to 0.5 mm.

[0034] The above film (200) is arranged to wrap around the outer surface of the brush (100), thereby preventing foreign substances from being absorbed onto the outer surface of the brush (100) during the wafer cleaning process.

[0035] The film (200) may include a plurality of holes (210). The plurality of holes (210) may have a shape that penetrates from the outer surface to the inner surface of the film (200). The plurality of holes (210) may be arranged to correspond to the arrangement area of ​​the protrusions (110) of the brush (100) in the film (200). The plurality of holes (210) may have a circular cross-sectional shape and various other shapes. The diameter of each of the plurality of holes (210) may be larger than the diameter of the protrusion (110). The cross-sectional area of ​​each of the plurality of holes (210) may be formed to be larger than the cross-sectional area of ​​the protrusion (110).

[0036] When the film (200) is coupled to the brush (100), the protrusion (110) may be positioned to penetrate the hole (210). Accordingly, the cleaning liquid provided from the hollow (120) within the brush (100) may be discharged to the outside through the area where the protrusion (110) is formed on the outer surface of the brush (100). In other words, the cleaning liquid may be discharged to the outside through the hole (210) of the film (200). Accordingly, there is an advantage in that the cleaning liquid may be discharged more uniformly and accurately onto the surface of the wafer.

[0037] Meanwhile, as illustrated in FIGS. 3 and 4, a guide (220) having a shape that protrudes inwardly more than other areas may be formed on the inner surface of the film (200) facing the outer surface of the brush (100). The guide (220) may have a bar shape having a longitudinal direction in the longitudinal direction of the brush (100) or the film (220). The guides (220) may be provided in plurality and may be arranged to be spaced apart from each other along the circumferential direction of the film (200). Through the guides (220), the inner surface of the film (200) and the outer surface of the brush (100) may have an area spaced apart from each other by a predetermined distance in the radial direction, and accordingly, the discharge of the cleaning solution may be guided to the hole (220) formation area of ​​the film (220). In addition, the cleaning solution can be prevented from stagnating between the inner surface of the film (200) and the outer surface of the brush (100) through the separation space provided by the guide (220).

[0038] Meanwhile, although not shown, a filter (not shown) may be provided on the outer or inner surface of the film (200). The filter may be formed in the form of a film so as to be attached to the outer or inner surface of the film (200). The filter may be a non-woven fabric. Accordingly, contamination of the surface of the film (200) or the surface of the brush (100) through the filter may be prevented.

[0039] In addition, although not shown, a plurality of protrusions (not shown) that guide the flow of cleaning liquid discharged from an area other than the protrusions (110) may be formed on the outer surface of the brush (100) or the inner surface of the film (200), and the protrusions may form a flow path for the cleaning liquid between adjacent protrusions, thereby guiding the cleaning liquid to be discharged to the hole (210) forming area of ​​the film (200).

[0040] Fig. 5 is a cross-sectional view showing a modified example of the combined structure of a film and a brush according to an embodiment of the present invention.

[0041] Referring to FIG. 5, the film (200) may include an inclined surface (250). The inclined surface (250) may be positioned outside a hole (210) forming area where the protrusion (110) of the brush (100) is coupled. The inclined surface (250) may be formed in a shape such that the closer it is to the hole (210), the farther the radial length to the outer surface of the brush (100). The cleaning solution provided from the brush (100) may be easily discharged to the outside through the hole (210) by the inclined surface (250).

[0042] According to the above structure, there is an advantage in that the strength of the brush can be reinforced through the film, thereby improving the rotation stability and durability of the brush.

[0043] In addition, there is an advantage in that the cleaning liquid can be guided to be discharged to the protrusion-forming area of ​​the brush, and contaminants can be prevented from being absorbed on the brush surface.

[0044] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0045] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

[0046] According to the wafer cleaning brush according to embodiments of the present invention, the strength of the brush can be reinforced through a film arranged to cover the outer surface of the brush, thereby improving the rotation stability and durability of the brush, and the cleaning liquid can be guided to be discharged through a plurality of protrusions formed on the outer surface of the brush, and contaminants can be prevented from being absorbed on the brush surface, so that it has industrial applicability.

Claims

1. A brush having a hollow interior through which a cleaning solution is discharged and having a number of protrusions formed on the exterior surface; and A film is included that is arranged to wrap the outer surface of the brush, A wafer cleaning brush having a plurality of holes through which the plurality of protrusions penetrate, wherein the film is a wafer cleaning brush.

2. In paragraph 1, The material of the above film is a wafer cleaning brush containing various materials such as PET (polyethylene terephthalate) or PVC (polyvinyl chloride).

3. In paragraph 1, A wafer cleaning brush having a cross-sectional area of ​​the above protrusion smaller than the cross-sectional area of ​​the above hole.

4. In paragraph 1, A wafer cleaning brush in which a guide having a shape that protrudes inwardly more than other areas is arranged on the inner surface of the film facing the outer surface of the brush.

5. In paragraph 1, A wafer cleaning brush comprising a nonwoven fabric disposed on the surface or inside of the above film.

6. In paragraph 1, The above film comprises a slope, The above inclined surface is a wafer cleaning brush placed on the outside of the hole.

7. In paragraph 6, A wafer cleaning brush having a shape in which the distance to the outer surface of the brush increases as the inclined surface gets closer to the hole.

8. In paragraph 1, A wafer cleaning brush in which a flow path for guiding the flow of a cleaning liquid is formed on the outer surface of the brush or the inner surface of the film.

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