Flexible circuit board, wire harness isolation plate, and battery module

Abstract

The present application provides a flexible circuit board, a wire harness isolation plate, and a battery module. The flexible circuit board comprises a circuit board body and a cushioning part; the circuit board body is connected to the cushioning part; the cushioning part comprises a first sub-cushioning part and a second sub-cushioning part; one end of the first sub-cushioning part is electrically connected to the circuit board body, one end of the second sub-cushioning part is connected to the circuit board body, and the other end of the second sub-cushioning part is connected to the first sub-cushioning part.

Description

Flexible circuit boards, wiring harness isolation boards and battery modules

[0001] This application claims priority to Chinese patent applications filed on June 30, 2023, with application numbers 202310800827.X, 202321712667.5, and 202321712645.9. The entire contents of the above applications are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of batteries, and specifically to a flexible circuit board, a wiring harness isolation board and a battery module. Background Art

[0003] Existing power battery modules often use flexible printed circuit boards (FPCBs) to isolate the battery cells from the low-voltage sampling harness, effectively isolating the sampling harness and the battery cells. However, the stress generated when welding the FPCB's buffer to the tabs can easily cause the buffer to warp. SUMMARY OF THE INVENTION

[0004] The flexible circuit board, wiring harness isolation plate and battery module provided in some embodiments of the present application are intended to solve the problem of short-circuit protection of power battery modules.

[0005] The present application provides a flexible circuit board, comprising: a circuit board body and a buffer portion, wherein the circuit board body is connected to the buffer portion, and the buffer portion comprises a first sub-buffer portion and a second sub-buffer portion, wherein one end of the first sub-buffer portion is electrically connected to the circuit board body, one end of the second sub-buffer portion is connected to the circuit board body, and the other end of the second sub-buffer portion is connected to the first sub-buffer portion.

[0006] The present application provides a wiring harness isolation plate, comprising: an isolation plate and a flexible circuit board, wherein the flexible circuit board is arranged on the isolation plate, the flexible circuit board comprises a first metal layer, and the thickness of the first metal layer ranges from 60 microns to 80 microns; the first metal layer comprises a collection line, and the collection line comprises a first connecting segment, a fuse, and a second connecting segment, wherein one end of the fuse is electrically connected to the first connecting segment, and the other end of the fuse is electrically connected to the second connecting segment.

[0007] The present application also provides a battery module, including a wiring harness isolation plate and a battery cell, wherein the wiring harness isolation plate is electrically connected to the battery cell, and the wiring harness isolation plate includes: an isolation plate and a flexible circuit board, wherein the flexible circuit board is arranged on the isolation plate, and the flexible circuit board includes a first metal layer, and the thickness of the first metal layer ranges from 60 microns to 80 microns; the first metal layer includes a collection line, and the collection line includes a first connecting segment, a fuse and a second connecting segment, one end of the fuse is electrically connected to the first connecting segment, and the other end of the fuse is electrically connected to the second connecting segment. Beneficial effects

[0008] In the flexible circuit board, wiring harness isolation plate and battery module provided by the present application, a second sub-buffer portion is provided so that the buffer portion of the flexible circuit board can move and expand and contract appropriately under the action of stress, thereby improving the problem of the buffer portion of the flexible circuit board being warped due to the stress generated when the buffer portion of the flexible circuit board is welded to the tab. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG1 is a schematic structural diagram of a flexible circuit board provided in some embodiments of the present application;

[0010] FIG2 is one of the enlarged views of the AA portion of FIG1 ;

[0011] FIG3 is a second enlarged view of the AA portion of FIG1 ;

[0012] FIG4 is an exploded view of a wiring harness isolation plate provided by some embodiments of the present application;

[0013] FIG5 is a schematic diagram of a circuit of the first metal layer in the wiring harness isolation plate provided in FIG4 ;

[0014] FIG6 is a cross-sectional view of the flexible circuit board in the wiring harness isolation plate provided in FIG4 ;

[0015] FIG7 is a schematic structural diagram of a flexible circuit board in a wiring harness isolation plate provided by some embodiments of the present application;

[0016] FIG8 is an enlarged view of the AA portion of FIG7 ;

[0017] FIG9 is a cross-sectional view of a first sub-buffer portion in a buffer portion provided by some embodiments of the present application;

[0018] FIG10 is a top view of a wiring harness isolation plate provided by some embodiments of the present application;

[0019] FIG11 is an enlarged view of the BB portion of FIG10 ;

[0020] FIG12 is a schematic structural diagram of a wiring harness isolation plate provided in some embodiments of the present application;

[0021] FIG13 is an enlarged view of CC in FIG12;

[0022] FIG14 is an enlarged view of the portion DD in FIG12 ;

[0023] FIG15 is an enlarged view of the EE portion of FIG12;

[0024] FIG16 is an enlarged view of the FF portion of FIG12 . Modes for Carrying Out the Invention

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application and are not used to limit the present application. In this application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0026] As shown in Figures 1 and 2, an embodiment of the present invention provides a flexible circuit board 10, comprising a circuit board body 201 and a buffer portion 202, wherein the circuit board body 201 is connected to the buffer portion 202. The buffer portion 202 includes a first sub-buffer portion 2021 and a second sub-buffer portion 2023. One end of the first sub-buffer portion 2021 is electrically connected to the circuit board body 201, one end of the second sub-buffer portion 2023 is connected to the circuit board body 201, and the other end of the second sub-buffer portion 2023 is connected to the first sub-buffer portion 2021.

[0027] The flexible circuit board provided by the embodiment of the present invention is provided with a second sub-buffer portion, so that when stress is generated by welding the first sub-buffer portion 2021 and the tab, the second sub-buffer portion 2023 can move and expand and contract appropriately to prevent the first sub-buffer portion 2021 from warping. In addition, the second sub-buffer portion 2023 is not electrically connected to the circuit board body. When the second sub-buffer portion 2023 is displaced and stretched, it is not easy to cause damage to the collection circuit.

[0028] In some embodiments of the present application, the buffer portion 202 further includes a buffer groove 2022 . The buffer groove 2022 is disposed between the circuit board body 201 and the first sub-buffer portion 2021 and extends along the length direction X of the circuit board body 201 .

[0029] In some embodiments of the present application, the flexible circuit board 10 includes a plurality of buffer portions 202 , which are disposed on opposite sides of the circuit board body 201 in the width direction Y and are spaced apart along the length direction X of the circuit board body 201 .

[0030] As shown in FIG3 , the second sub-buffer 2023 includes a first buffer member 2023a and a second buffer member 2023b. One end of the first buffer member 2023a is connected to the circuit board body 201, the other end of the first buffer member 2023a is connected to one end of the second buffer member 2023b, and the other end of the second buffer member 2023b is connected to the first sub-buffer 2021. The first buffer member 2023a and the second buffer member 2023b are mirror-symmetrical along the length direction X of the circuit board body 201.

[0031] In some embodiments of the present application, the cross-sectional shapes of the first buffer 2023 a and the second buffer 2023 b along the length direction X of the circuit board body 201 are both triangular or trapezoidal.

[0032] As shown in Figures 4 and 5 , some embodiments of the present application provide a wiring harness isolation plate, comprising: an isolation plate 10 and a flexible circuit board 20. The flexible circuit board 20 is disposed on the isolation plate 10 and includes a first metal layer 21 having a thickness ranging from 60 microns to 80 microns. The first metal layer 21 includes a plurality of collection lines 211, each of which includes a first connecting segment 2111, a fuse 2112, and a second connecting segment 2113. One end of the fuse 2112 is electrically connected to the first connecting segment 2111, and the other end of the fuse 2112 is electrically connected to the second connecting segment 2113.

[0033] The thickness of existing flexible circuit boards is mostly 35 microns. When a flexible circuit board of this thickness is welded to an aluminum busbar (bar sheet), due to the thinness of the flexible circuit board, a nickel sheet needs to be used as an intermediate welding sheet when welding the flexible circuit board to the aluminum busbar, and a multi-layer polyimide film needs to be set after welding to protect the solder joints. If a wiring harness is used alone (the function is the same as that of a flexible circuit board, but it belongs to two collection structures), a fuse cannot be set. Therefore, the wiring harness isolation plate provided in this application uses a flexible circuit board of 60 to 80 microns, which can not only etch a fuse in the flexible circuit board to solve the short-circuit protection problem, but also reduce the use of nickel sheets and simplify the polyimide film coating protection process.

[0034] In some embodiments of the present application, the fuse 2112 is made by etching.

[0035] In some embodiments of the present application, the material of the first metal layer 21 includes copper. The thickness of the first metal layer 21 can be 60 microns, 61 microns, 62 microns, 63 microns, 64 microns, 65 microns, 66 microns, 67 microns, 68 microns, 69 microns, 70 microns, 71 microns, 72 microns, 73 microns, 74 microns, 75 microns, 76 microns, 77 microns, 78 microns, 79 microns, or 80 microns. Preferably, the thickness of the first metal layer 21 is 70 microns to improve the reliability of the fuse 2112.

[0036] As shown in FIG6 , the flexible circuit board 20 further includes a first insulating layer 22 and a second insulating layer 23 . The first insulating layer 22 is disposed on a side of the first metal layer 21 away from the isolation plate 10 , and the second insulating layer 23 is disposed on a side of the first metal layer 21 close to the isolation plate 10 .

[0037] In some embodiments of the present application, the thickness of the first insulating layer 22 and the second insulating layer 23 ranges from 20 microns to 30 microns. That is, the thickness of the first insulating layer 22 and the second insulating layer 23 can be 20 microns, 21 microns, 22 microns, 23 microns, 24 microns, 25 microns, 26 microns, 27 microns, 28 microns, 29 microns, or 30 microns. Preferably, the thickness of the first insulating layer 22 and the second insulating layer 23 is both 25 microns.

[0038] In some embodiments of the present application, the materials of the first insulating layer 22 and the second insulating layer 23 both include polyimide.

[0039] As shown in FIG. 6 , the flexible circuit board 20 further includes a first adhesive layer 24 and a second adhesive layer 25 . The first adhesive layer 24 is disposed between the first metal layer 21 and the first insulating layer 22 , and the second adhesive layer 25 is disposed between the first metal layer 21 and the second insulating layer 23 .

[0040] In some embodiments of the present application, the thickness of the first adhesive layer 24 and the second adhesive layer 25 ranges from 20 microns to 30 microns. That is, the thickness of the first adhesive layer 24 and the second adhesive layer 25 can be 20 microns, 21 microns, 22 microns, 23 microns, 24 microns, 25 microns, 26 microns, 27 microns, 28 microns, 29 microns, or 30 microns. Preferably, the thickness of the first adhesive layer 24 and the second adhesive layer 25 is both 25 microns.

[0041] In some embodiments of the present application, the thicknesses of the first insulating layer 22 , the second insulating layer 23 , the first adhesive layer 24 , and the second adhesive layer 25 are all equal.

[0042] In some embodiments of the present application, the materials of the first adhesive layer 24 and the second adhesive layer 25 are both thermosetting plastics such as phenolic resin or polyester resin.

[0043] As shown in FIG7 , the flexible printed circuit board 20 includes a circuit board body 201 and a plurality of buffer portions 202. The buffer portions 202 are disposed on opposite sides of the circuit board body 201 in the width direction Y. The buffer portions 202 are spaced apart along the length direction X of the circuit board body 201, and the circuit board body 201 is connected to the buffer portions 202. The first connecting section 2111 and the fuse 2112 shown in FIG5 are disposed in the circuit board body 201 shown in FIG7 , and the second connecting section 2113 shown in FIG5 is disposed in the buffer portion 202 shown in FIG7 . The fuse 2112 extends in the same direction as the length direction X of the circuit board body 201.

[0044] As shown in Figures 8 and 9, the buffer portion 202 includes a first sub-buffer portion 2021, one end of which is electrically connected to the circuit board body 201. Specifically, a second connecting segment 2113 is disposed within the first sub-buffer portion 2021, one end of which is electrically connected to the fuse 2112. The other end of the first sub-buffer portion 2021 includes a welding area A, which is provided with a second metal layer 26 and a third metal layer 27. The second metal layer 26 is disposed on the side of the first metal layer 21 closer to the isolation plate, while the third metal layer 27 is disposed on the side of the first metal layer 21 farther from the isolation plate. Specifically, the other end of the second connecting segment 2113 is located in the welding area.

[0045] In some embodiments of the present application, the materials of the second metal layer 26 and the third metal layer 27 are both nickel or gold. Alternatively, the material of one of the second metal layer 26 and the third metal layer 27 is nickel, and the material of the other of the second metal layer 26 and the third metal layer 27 is gold. This prevents electrochemical reaction between the first metal layer 21 and the aluminum-containing structure when welding.

[0046] In some embodiments of the present application, the buffer portion 202 further includes a buffer groove 2022 . The buffer groove 2022 is disposed between the circuit board body 201 and the first sub-buffer portion 2021 and extends along the length direction X of the circuit board body 201 .

[0047] As shown in Figure 10, the wiring harness isolation plate also includes multiple tabs 30. Multiple mounting slots 11 are provided on opposite sides of the isolation plate 10 in the width direction Y. These slots 11 are spaced apart along the length direction X of the isolation plate 10, and the tabs 30 are positioned within these slots 11. The flexible printed circuit board 20 is positioned between the two rows of tabs 30. The second metal layer is welded to the tabs 30. Specifically, the tabs 30 are aluminum bars, and the welding of the tabs 30 and the second metal layer forms a pressure point.

[0048] In some embodiments of the present application, the cross-section of the tab 30 along the longitudinal direction X of the circuit board body 201 is trapezoidal. The tab 30 includes two sub-tabs 31 that are mirror-symmetrical. The sub-tab 31 includes a first portion 311 and a second portion 312, and the first portion 311 is provided on a side of the second portion 312 that is close to the circuit board body 201. The cross-sectional width of the first portion 311 along the longitudinal direction X of the circuit board body 201 is smaller than the cross-sectional width of the second portion 312 along the longitudinal direction X of the circuit board body 201. The first portion 311 of one of the sub-tabs 31 is welded to the second metal layer 26. Specifically, the orthographic projection of the second metal layer 26 covers the first portion 311 of the sub-tab 31. Furthermore, the cross-sectional width of one end of the first sub-buffer portion 2021 connected to the second metal layer 26 along the length direction X of the circuit board body 201 is greater than or equal to the cross-sectional width of the first part 311 of the sub-bar 31 along the length direction X of the circuit board body 201, thereby solving the problem of insufficient pad area resulting in too small a pull-out force when the first sub-buffer portion 2021 is welded to the aluminum bar.

[0049] In some embodiments of the present application, the cross-sectional width of the first sub-buffer portion 2021 along the length direction X of the circuit board body 201 is equal to the cross-sectional width of the side of the tab 30 close to the circuit board body 201 along the length direction X of the circuit board body 201 .

[0050] As shown in FIG11 , glue is applied around the welding area A to form a glue layer 27 to reinforce, insulate, and protect the pressure point from corrosion. The buffer portion includes a first sub-buffer portion 2021 and a second sub-buffer portion 2023 .

[0051] As shown in Figure 12, the circuit board body 201 is provided with a first through-hole 2011 and a connecting assembly 2012. The connecting assembly 2012 is disposed within the first through-hole 2011, and one end of the connecting assembly 2012 is electrically connected to the circuit board body 201. The wiring harness isolation plate also includes a temperature acquisition assembly (not shown). The temperature acquisition assembly is electrically connected to the other end of the connecting assembly 2012 and is used to acquire the temperature of the battery cell. The isolation plate 10 is provided with a second through-hole corresponding to the first through-hole 2011. The temperature acquisition assembly passes through the second through-hole and is attached to the upper surface of the battery cell. The temperature acquisition assembly includes a thermistor.

[0052] In some embodiments of the present application, the region of the isolation plate 10 corresponding to the circuit board body 201 is provided with a plurality of second through holes spaced apart along the length direction X of the isolation plate 10, wherein the orthographic projection of the circuit board body 201 overlaps at least a portion of the orthographic projection of the second through holes. By increasing the thickness of the first metal layer and the cross-sectional width of the circuit board body 201, the resistance of the acquisition line 211 in the circuit board body 201 is reduced.

[0053] As shown in FIG. 13 , the buffer portion 202 includes a second sub-buffer portion 2023 . One end of the second sub-buffer portion 2023 is connected to the circuit board body 201 , and the other end of the second sub-buffer portion 2023 is connected to the first sub-buffer portion 2021 .

[0054] In some embodiments of the present application, the second sub-buffer 2023 includes a first triangular block 2023a and a second triangular block 2023b. The first triangular block 2023a is connected to the second triangular block 2023b, and the first triangular block 2023a and the second triangular block 2023b are mirror-symmetrical. Specifically, the bottom edge of the first triangular block 2023a is connected to the circuit board body 201, the bottom edge of the second triangular block 2023b is connected to the first sub-buffer 2021, and the top of the first triangular block 2023a is connected to the top of the second triangular block 2023b.

[0055] In some embodiments of the present application, the second sub-buffer portion 2023 is arranged on the side of the first sub-buffer portion 2021 close to the welding area A to prevent the stress generated when the first sub-buffer portion 2021 and the bar 30 are welded, causing the first sub-buffer portion 2021 to warp, while ensuring that the first sub-buffer portion 2021 is extended by the displacement of the second sub-buffer portion 2023 when the first sub-buffer portion 2021 expands.

[0056] In some embodiments of the present application, the second sub-buffer 2023 is a single-layer structure, and the material of the second sub-buffer 2023 includes polyimide. Preferably, the second sub-buffer is a polyimide film, so that when stress is generated by welding the first sub-buffer 2021 and the tab 30, the second sub-buffer 2023 can appropriately move and stretch, preventing the first sub-buffer 2021 from warping. Furthermore, the second sub-buffer 2023 is not electrically connected to the circuit board body, so displacement and stretching of the second sub-buffer 2023 are less likely to damage the acquisition circuits.

[0057] As shown in Figure 14, output composite bars 28 are provided at both ends of the separator 10 in the longitudinal direction X, each with a clearance hole 281. The output composite bars 28 include a positive output composite bar 28 and a negative output composite bar 28. The output composite bars 28 include a tab 30 and a copper bar 282. The copper bar 282 is fixed above the tab 30. The clearance hole 281 is provided on the side of the copper bar 282 near the circuit board body 201 to expose the copper bar 282 below the clearance hole 281, thereby ensuring assembly speed and soldering feasibility.

[0058] In some embodiments of the present application, a buckle 111 is provided on the edge of the placement groove 11, and the buckle 111 is engaged with the output composite bar 28 through the avoidance hole 281. That is, the buckle 111 is provided on the edge of the placement groove 11 near the avoidance hole 281, and the buckle 111 corresponds to the avoidance hole 281. The buckle 111 is engaged with the copper busbar 282 of the output composite bar 28 located below the avoidance hole 281 through the avoidance hole 281, thereby solving the problem that the output composite bar 28 is easily detached.

[0059] In some embodiments of the present application, a boss 12 is provided on the placement groove 11. The height of the boss 12 is greater than the height of the stack formed by welding the first metal layer 21 and the tab 30. The boss 12 is provided on one side of the stack.

[0060] As shown in Figure 15, the boss 12 is arranged between two adjacent tabs 30, and the cross-sectional width of the boss 12 along the width direction Y of the circuit board body 201 is greater than or equal to the cross-sectional width of the first part 311 of the sub-tab 31 along the width direction Y of the circuit board body 201.

[0061] In some embodiments of the present application, the height of the boss 12 is greater than the height of the stack formed by welding the first metal layer 21 and the bar 30, and is less than or equal to the overall height of the isolation plate 10, ensuring that the pressure point does not rub against the upper cover after glue dispensing, and preventing friction between the upper cover and the glue dispensing layer when the upper cover is subjected to force, causing the pressure point to tear.

[0062] In some embodiments of the present application, a first bone portion 13 is provided on the edge of the groove between two adjacent tabs 30 in the placement groove 11. The height of the first bone portion 13 is greater than the height of the stack formed by welding the first metal layer 21 and the tab 30, further ensuring that the pressure point does not rub against the upper cover after glue dispensing, preventing friction between the upper cover and the glue dispensing layer when the upper cover is subjected to force, causing the pressure point to tear.

[0063] In some embodiments of the present application, only the boss 12 or only the first bone portion 13 may be provided.

[0064] In some embodiments of the present application, the first bone portion 13 includes a first sub-bone portion 131 and a second sub-bone portion 132. The first sub-bone portion 131 extends along the width direction Y of the isolation plate 10, and the second sub-bone portion 132 extends along the length direction X of the isolation plate 10. The first sub-bone portion 131 intersects the second sub-bone portion 132. Preferably, the first bone portion 13 includes the first sub-bone portion 131 and at least two second sub-bone portions 132, wherein the first sub-bone portion 131 and the second sub-bone portion 132 are perpendicular to each other.

[0065] In some embodiments of the present application, one end of the first sub-bone portion 131 is connected to the boss 12 , and the other end of the first sub-bone portion 131 is connected to the outer side wall of the isolation plate 10 .

[0066] As shown in FIG16 , the isolation plate 10 further includes a second sub-bone portion 14 , which is disposed on a side of the boss 12 . The height of the first bone portion 13 is equal to that of the second sub-bone portion 14 .

[0067] In some embodiments of the present application, the main body of the isolation plate 10 and at least a portion of the buckle 111 , the boss 12 , the first bone portion 13 and the second sub-bone portion 14 are integrally formed.

[0068] On the other hand, an embodiment of the present application further provides a battery module, comprising the above-mentioned wiring harness isolation plate and battery cells, wherein the wiring harness isolation plate is electrically connected to the battery cells.

[0069] Referring to Figures 1 to 16 , the wiring harness isolation plate includes an isolation plate 10, a flexible printed circuit board 20, and a tab 30. The flexible printed circuit board 20 is disposed on the isolation plate 10 and includes a first metal layer 21 having a thickness ranging from 60 to 80 microns. The first metal layer 21 includes a plurality of collection lines 211, each of which includes a first connecting segment 2111, a fuse 2112, and a second connecting segment 2113. One end of the fuse 2112 is electrically connected to the first connecting segment 2111, and the other end of the fuse 2112 is electrically connected to the second connecting segment 2113.

[0070] In some embodiments of the present application, the material of the first metal layer 21 includes copper. Preferably, the thickness of the first metal layer 21 is 70 micrometers to improve the reliability of the fuse 2112.

[0071] In some embodiments of the present application, the tabs 30 are used to connect cells in series or in parallel. Specifically, the cells may be cylindrical cells or square cells.

[0072] In some embodiments of the present application, a plurality of mounting slots 11 are provided on opposite sides of the isolation plate 10 in the width direction Y. The mounting slots 11 are spaced apart along the length direction X of the isolation plate 10, and a plurality of tabs 30 are disposed within the mounting slots 11. The flexible circuit board 20 is disposed between two rows of tabs 30. The second metal layer 26 is welded to the tabs 30. Specifically, the tabs 30 are aluminum bars, and the tabs 30 and the second metal layer 26 are welded to form pressure points.

[0073] In some embodiments of the present application, the cross-section of the tab 30 along the longitudinal direction X of the circuit board body 201 is trapezoidal. The tab 30 includes two sub-tabs 31 that are mirror-symmetrical. The sub-tab 31 includes a first portion 311 and a second portion 312, and the first portion 311 is provided on a side of the second portion 312 that is close to the circuit board body 201. The cross-sectional width of the first portion 311 along the longitudinal direction X of the circuit board body 201 is smaller than the cross-sectional width of the second portion 312 along the longitudinal direction X of the circuit board body 201. The first portion 311 of one of the sub-tabs 31 is welded to the second metal layer 26. Specifically, the orthographic projection of the second metal layer 26 covers the first portion 311 of the sub-tab 31. Furthermore, the cross-sectional width of one end of the first sub-buffer portion 2021 connected to the second metal layer 26 along the length direction X of the circuit board body 201 is greater than or equal to the cross-sectional width of the first part 311 of the sub-bar 31 along the length direction X of the circuit board body 201, thereby solving the problem of insufficient pad area resulting in too small a pull-out force when the first sub-buffer portion 2021 is welded to the aluminum bar.

[0074] In some embodiments of the present application, the materials of the second metal layer 26 and the third metal layer 27 are both nickel or gold. Alternatively, the material of one of the second metal layer 26 and the third metal layer 27 is nickel, and the material of the other of the second metal layer 26 and the third metal layer 27 is gold. This prevents electrochemical reaction between the first metal layer 21 and the aluminum-containing structure when welding.

[0075] In some embodiments of the present application, glue is dispensed around the welding area A to form a glue layer 27 to reinforce, insulate and protect the pressure point from corrosion.

[0076] In some embodiments of the present application, the buffer portion 202 includes a second sub-buffer portion 2023 , one end of the second sub-buffer portion 2023 is connected to the circuit board body 201 , and the other end of the second sub-buffer portion 2023 is connected to the first sub-buffer portion 2021 .

[0077] In some embodiments of the present application, the second sub-buffer 2023 includes a first triangular block 2023a and a second triangular block 2023b. The first triangular block 2023a is connected to the second triangular block 2023b, and the first triangular block 2023a and the second triangular block 2023b are mirror-symmetrical.

[0078] In some embodiments of the present application, output composite bars 28 are provided at both ends of the separator 10 in the longitudinal direction X, each of which is provided with a clearance hole 281. The output composite bars 28 include a positive output composite bar 28 and a negative output composite bar 28. The output composite bars 28 include a tab 30 and a copper bar 282. The copper bar 282 is fixed above the tab 30. The clearance hole 281 is provided on the side of the copper bar 282 near the circuit board body 201 to expose the copper bar 282 below the clearance hole 281, thereby ensuring assembly speed and welding feasibility.

[0079] In some embodiments of the present application, a buckle 111 is provided on the edge of the placement groove 11 , and the buckle 111 is engaged with the output composite row 28 through the avoidance hole 281 .

[0080] In some embodiments of the present application, a boss 12 is provided on one side of the placement groove 11 close to the first sub-buffer portion 2021 , and the height of the boss 12 is greater than the height of the stack formed by welding the first metal layer 21 and the tab 30 .

[0081] In some embodiments of the present application, a first bone portion 13 is provided on the edge of the groove between two adjacent tabs 30 in the placement groove 11. The height of the first bone portion 13 is greater than the height of the stack formed by welding the first metal layer 21 and the tab 30, further ensuring that the pressure point does not rub against the upper cover after glue dispensing, preventing friction between the upper cover and the glue dispensing layer when the upper cover is subjected to force, causing the pressure point to tear.

[0082] In some embodiments of the present application, the first bone portion 13 includes a first sub-bone portion 131 and a second sub-bone portion 132. The first sub-bone portion 131 extends along the width direction Y of the isolation plate 10, and the second sub-bone portion 132 extends along the length direction X of the isolation plate 10. The first sub-bone portion 131 intersects the second sub-bone portion 132. Preferably, the first bone portion 13 includes the first sub-bone portion 131 and at least two second sub-bone portions 132, wherein the first sub-bone portion 131 and the second sub-bone portion 132 are perpendicular to each other.

[0083] In some embodiments of the present application, one end of the first sub-bone portion 131 is connected to the boss 12 , and the other end of the first sub-bone portion 131 is connected to the outer side wall of the isolation plate 10 .

[0084] In some embodiments of the present application, the isolation plate 10 further includes a second sub-bone portion 14 , which is disposed on a side of the boss 12 , wherein the height of the first bone portion 13 is equal to that of the second sub-bone portion 14 .

[0085] The wiring harness isolation plate provided in some embodiments of the present application solves the problem of short-circuit protection of the power battery module by adopting a flexible circuit board having a first metal layer with a thickness of 60 to 80 microns and providing a fuse on the first metal layer.

[0086] In addition, the wiring harness isolation plate provided in some embodiments of the present application solves the welding problem between the second metal layer and the bar sheet, realizes nickel-free welding, reduces the use of nickel sheets, simplifies the manufacturing process, solves the problem of insufficient pad area when welding the first sub-buffer part to the aluminum busbar resulting in too small a pull-out force, and solves the problem of increased impedance value caused by electrochemical reaction due to direct welding of the flexible circuit board to the aluminum busbar.

[0087] At the same time, the wiring harness isolation plate provided in some embodiments of the present application also solves the problem of warping of the flexible circuit board caused by stress generated by welding the bar and the first sub-buffer portion by setting a second sub-buffer portion.

[0088] In addition, the wiring harness isolation plate provided in some embodiments of the present application solves the problem that the output composite row is easy to fall out by providing a buckle on the isolation plate and an avoidance hole on the output composite row.

[0089] In addition, the pressure points are supported by setting bosses or bone positions, which solves the problem of the pressure points being torn due to friction between the glue at the pressure points and the upper cover.

[0090] The above describes in detail a display panel driving method and a display device provided in some embodiments of the present application. The description of the above embodiments is only used to help understand the core idea of ​​the present application, and the above description should not be understood as limiting the scope of protection of the present application.

Claims

1. A flexible circuit board, characterized in that: include: Circuit board body; A buffer portion, the circuit board body is connected to the buffer portion, the buffer portion includes a first sub-buffer portion and a second sub-buffer portion, one end of the first sub-buffer portion is electrically connected to the circuit board body, one end of the second sub-buffer portion is connected to the circuit board body, and the other end of the second sub-buffer portion is connected to the first sub-buffer portion.

2. The flexible circuit board according to claim 1, characterized in that: The second sub-buffer portion includes a first buffer and a second buffer, one end of the first buffer is connected to the circuit board body, the other end of the first buffer is connected to one end of the second buffer, and the other end of the second buffer is connected to the first sub-buffer portion.

3. The flexible circuit board according to claim 2, characterized in that: The first buffer component and the second buffer component are mirror-symmetrical along the length direction of the circuit board body, and the cross-sectional shapes of the first buffer component and the second buffer component along the length direction of the circuit board body are both triangles or trapezoids.

4. The flexible circuit board according to claim 2, characterized in that: The first sub-buffer portion includes a first partition and a second partition, the first partition is located on a side of the second partition close to the circuit board body, the circuit board body and the first sub-buffer portion located in the first partition both include a first metal layer, a first insulating layer and a second insulating layer, the first insulating layer and the second insulating layer are respectively arranged on the upper and lower sides of the first metal layer; The second sub-buffer portion is integrally formed with the first insulating layer, or the second sub-buffer portion is integrally formed with the second insulating layer.

5. The flexible circuit board according to claim 4, characterized in that: The thickness of the first metal layer ranges from 60 microns to 80 microns. The first metal layer includes a collection line, and the collection line includes a first connection segment, a fuse, and a second connection segment. One end of the fuse is electrically connected to the first connection segment, and the other end of the fuse is electrically connected to the second connection segment. The first connecting section and the fuse are arranged in the circuit board body, the second connecting section is arranged in the first sub-buffer portion, and the extending direction of the fuse is the same as the length direction of the circuit board body.

6. The flexible circuit board according to claim 4, characterized in that: The portion of the first sub-buffer located in the second partition includes a welding area, and the welding area is provided with the first metal layer, the second metal layer and the third metal layer, the second metal layer is provided at the lower side of the first metal layer, and the third metal layer is provided at the upper side of the first metal layer.

7. A wiring harness isolation plate, comprising: Isolation panels; A flexible circuit board, the flexible circuit board is arranged on the isolation board, the flexible circuit board comprises a first metal layer, and the thickness of the first metal layer ranges from 60 micrometers to 80 micrometers; The first metal layer includes a collection line, and the collection line includes a first connection segment, a fuse, and a second connection segment. One end of the fuse is electrically connected to the first connection segment, and the other end of the fuse is electrically connected to the second connection segment.

8. The wire harness isolating plate according to claim 7, wherein: The flexible circuit board includes a circuit board body and a plurality of buffer parts, the plurality of buffer parts are arranged on opposite sides of the width direction of the circuit board body, the plurality of buffer parts are arranged at intervals along the length direction of the circuit board body, and the circuit board body is connected to the plurality of buffer parts; The first connecting section and the fuse are arranged in the circuit board body, the second connecting section is arranged in the buffer part, and the extending direction of the fuse is the same as the length direction of the circuit board body.

9. The wire harness isolating plate according to claim 7, wherein: The buffer portion includes a first sub-buffer portion, one end of which is electrically connected to the circuit board body; The other end of the first sub-buffer portion includes a welding area, and the welding area is provided with a second metal layer and a third metal layer. The second metal layer is provided on a side of the first metal layer close to the isolation plate, and the third metal layer is provided on a side of the first metal layer away from the isolation plate.

10. The wire harness isolation plate according to claim 9, wherein: The buffer portion includes a second sub-buffer portion, one end of the second sub-buffer portion is connected to the circuit board body, and the other end of the second sub-buffer portion is connected to the first sub-buffer portion.

11. The wire harness isolating plate according to claim 10, wherein: The second sub-buffer portion includes a first triangular block and a second triangular block, the first triangular block is connected to the second triangular block, and the first triangular block and the second triangular block are mirror-symmetrical.

12. The wire harness isolating plate according to claim 11, wherein: The first bone portion includes a first sub-bone portion and a second sub-bone portion. The first sub-bone portion extends along the width direction of the isolation plate, and the second sub-bone portion extends along the length direction of the isolation plate. The first sub-bone portion intersects with the second sub-bone portion.

13. The wire harness isolation plate according to claim 9, wherein: The wiring harness isolation plate further comprises a plurality of tabs, and a plurality of placement grooves are respectively provided on opposite sides of the isolation plate in the width direction, and the plurality of placement grooves are respectively arranged at intervals along the length direction of the isolation plate, and the plurality of tabs are respectively arranged in the plurality of placement grooves; the flexible circuit board is arranged between two rows of tabs; Wherein, the second metal layer is welded to the bar piece.

14. The wire harness isolating plate according to claim 13, wherein: Output composite rows are respectively provided at both ends of the isolation plate in the length direction, and avoidance holes are provided on the output composite rows; A buckle is provided on the groove edge of the placement groove, and the buckle is connected with the output composite row through the avoidance hole.

15. The wire harness isolation plate according to claim 13, wherein: The placement groove is provided with a boss, the height of the boss is greater than the height of the stack formed by welding the first metal layer and the bar sheet, and the boss is provided on one side of the stack; and / or, A first bone portion is provided on the groove edge between two adjacent tabs in the placement groove, and the height of the first bone portion is greater than the height of a stacked layer formed by welding the first metal layer and the tabs.

16. The wire harness isolation plate according to claim 13, wherein: The bar piece includes two sub-bar pieces that are mirror-symmetrical; The sub-bar includes a first part and a second part, the first part is arranged on a side of the second part close to the circuit board body, the cross-sectional width of the first part along the length direction of the circuit board body is smaller than the cross-sectional width of the second part along the length direction of the circuit board body, and the first part is welded to the second metal layer.

17. The wire harness isolating plate according to claim 16, wherein: A cross-sectional width of one end of the first sub-buffer portion connected to the second metal layer along the length direction of the circuit board body is greater than or equal to a cross-sectional width of the first portion along the length direction of the circuit board body.

18. A battery module, comprising a wiring harness isolation plate and a battery cell, wherein the wiring harness isolation plate is electrically connected to the battery cell, and the wiring harness isolation plate comprises: Isolation panels; A flexible circuit board, the flexible circuit board is arranged on the isolation board, the flexible circuit board comprises a first metal layer, and the thickness of the first metal layer ranges from 60 micrometers to 80 micrometers; The first metal layer includes a collection line, and the collection line includes a first connection segment, a fuse, and a second connection segment. One end of the fuse is electrically connected to the first connection segment, and the other end of the fuse is electrically connected to the second connection segment.

19. The battery module according to claim 18, wherein: The flexible circuit board includes a circuit board body and a plurality of buffer parts, the plurality of buffer parts are arranged on opposite sides of the width direction of the circuit board body, the plurality of buffer parts are arranged at intervals along the length direction of the circuit board body, and the circuit board body is connected to the plurality of buffer parts; The first connecting section and the fuse are arranged in the circuit board body, the second connecting section is arranged in the buffer part, and the extending direction of the fuse is the same as the length direction of the circuit board body.

20. The battery module according to claim 18, wherein: The buffer portion includes a first sub-buffer portion, one end of which is electrically connected to the circuit board body; The other end of the first sub-buffer portion includes a welding area, and the welding area is provided with a second metal layer and a third metal layer. The second metal layer is provided on a side of the first metal layer close to the isolation plate, and the third metal layer is provided on a side of the first metal layer away from the isolation plate.

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