Ultrasonic sensor, manufacturing method therefor and ultrasonic detection device

Abstract

An ultrasonic sensor, a manufacturing method therefor and an ultrasonic detection device. The ultrasonic sensor comprises piezoelectric units, first contact electrodes, second contact electrodes, first bending wires, first outward connecting structures, second bending wires, second outward connecting structures and a flexible packaging body. The first contact electrodes are connected to first surfaces of the corresponding piezoelectric units, and the second contact electrodes are connected to second surfaces of the corresponding piezoelectric units. The flexible packaging body coats the piezoelectric units, the first contact electrodes and the second contact electrodes. The first contact electrodes are electrically connected to the first outward connecting structures by means of the first bending wires, the first outward connecting structures being at least partially exposed out of the flexible packaging body. The second contact electrodes are electrically connected to the second outward connecting structures by means of the second bending wires, the second outward connecting structures being at least partially exposed out of the flexible packaging body. Thus, the ultrasonic sensor can have better flexibility, facilitating expanding the application scenarios of ultrasonic sensors.

Description

Ultrasonic sensor and manufacturing method thereof, and ultrasonic detection equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 25, 2023, with application number 202310758388.0 and application name “Ultrasonic sensor, manufacturing method thereof, and ultrasonic detection equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of ultrasonic detection technology, and in particular to an ultrasonic sensor and a manufacturing method thereof, and ultrasonic detection equipment. Background Art

[0003] Ultrasonic testing can be applied to fields such as medicine and industrial flaw detection. For example, in medicine, ultrasonic testing is an effective means of detecting chronic diseases such as cardiovascular disease. During ultrasonic testing, ultrasonic sensors in ultrasonic testing equipment are used to transmit and receive ultrasonic waves.

[0004] In the related art, an ultrasonic sensor may include a piezoelectric module, which may include multiple piezoelectric units and multiple carriers corresponding to the piezoelectric units and distributed in rows and columns. The piezoelectric units can be used to transmit and receive ultrasonic waves. The carrier has an installation groove, and the piezoelectric units are fixedly installed in the installation groove of the corresponding carrier. A wiring disk is provided at the end of each row of carriers and the end of each column of carriers. The wiring disk is connected to the adjacent carriers through a serpentine connection structure, and the two adjacent carriers are connected through a serpentine connection structure. The serpentine connection structure includes a serpentine plane carrier made of polyimide and copper foils respectively attached to both sides of the serpentine plane carrier. The piezoelectric units installed on each row of carriers are electrically connected to the wiring disk at the end of the row through the serpentine connection structure, and the piezoelectric units installed on each column of carriers are electrically connected to the wiring disk at the end of the column through the serpentine connection structure. The spacing between the wiring disk and the carrier and between the two adjacent carriers can be changed by setting the serpentine connection structure, so that the ultrasonic sensor can be stretched.

[0005] However, in related technologies, ultrasonic sensors have poor flexibility and their application scenarios are greatly limited.

[0006] Summary of the Invention

[0007] An embodiment of the present application provides an ultrasonic sensor and an ultrasonic detection device, which uses a flexible packaging body to carry a piezoelectric unit and a connecting component connected to the piezoelectric unit, and connects the external structure of the connecting component to the contact electrode connected to the piezoelectric unit through a bent wire. This can make the ultrasonic sensor more flexible and help broaden the application scenarios of the ultrasonic sensor.

[0008] On one hand, the present application provides an ultrasonic sensor, comprising a piezoelectric module, a first connecting assembly, a second connecting assembly, and a flexible encapsulation. The piezoelectric module comprises a piezoelectric unit and a first contact electrode and a second contact electrode corresponding to the piezoelectric unit. The piezoelectric unit comprises a first surface and a second surface opposite to each other in its thickness direction. The first contact electrode is fixedly connected to the first surface of the corresponding piezoelectric unit and electrically connected to the first surface of the corresponding piezoelectric unit. The second contact electrode is fixedly connected to the second surface of the corresponding piezoelectric unit and electrically connected to the second surface of the corresponding piezoelectric unit. The flexible encapsulation covers the piezoelectric unit, the first contact electrode, and the second contact electrode. The first connecting assembly is spaced apart from the second connecting assembly. The first connecting assembly comprises a first zigzag conductor and a first external connection structure. One end of the first zigzag conductor is connected to the first contact electrode and the other end is connected to the first external connection structure, such that the first contact electrode is electrically connected to the first external connection structure via the first zigzag conductor. At least a portion of the first zigzag conductor is covered by the flexible encapsulation, and the first external connection structure is at least partially exposed from the flexible encapsulation. The second connecting component includes a second bent wire and a second external structure, one end of the second bent wire is connected to the second contact electrode, and the other end is connected to the second external structure, so that the second contact electrode is electrically connected to the second external structure through the second bent wire, at least a portion of the second bent wire is covered by the flexible packaging body, and the second external structure is at least partially exposed from the flexible packaging body.

[0009] In the ultrasonic sensor of the embodiments of the present application, the piezoelectric unit, the first connecting assembly, and the second connecting assembly can all be supported by a flexible package, eliminating the need for additional supporting structures for the piezoelectric unit, the first connecting assembly, and the second connecting assembly. The flexible package has good bending performance in its normal direction. The first contact electrode and the first external structure are electrically connected via a first zigzag conductor, and the second contact electrode and the second external structure are electrically connected via a second zigzag conductor. The first zigzag conductor and the second zigzag conductor can be stretched and bent. The electrical connection between the first contact electrode and the first external structure, and the electrical connection between the second contact electrode and the second external structure, have little effect on the flexibility of the flexible package. The ultrasonic sensor has fewer inflexible components and a smaller inflexible area, resulting in better flexibility of the ultrasonic sensor. This allows the ultrasonic sensor to be attached to complex curved surfaces for extended periods of time, broadening the application scenarios of the ultrasonic sensor. In addition, the flexible package can provide a moisture-proof barrier for the enclosed electrical structures, such as the piezoelectric unit, the first contact electrode, and the second contact electrode, thereby protecting the piezoelectric unit, the first contact electrode, the second contact electrode, and the other electrical structures enclosed by the flexible package.

[0010] In one possible embodiment, the piezoelectric module includes a plurality of spaced-apart piezoelectric units. A first connection assembly includes a plurality of first zigzag conductive lines corresponding to the piezoelectric units and spaced apart from each other. A first external connection structure includes a plurality of first pin electrodes corresponding to the piezoelectric units and spaced apart from each other, the first pin electrodes at least partially exposed from the flexible package, and a first contact electrode electrically connected to each piezoelectric unit is electrically connected to the corresponding first pin electrode via a corresponding first zigzag conductive line. A second external connection structure includes a second pin electrode, the second pin electrode at least partially exposed from the flexible package, and all second contact electrodes are electrically connected to the same second pin electrode via a second zigzag conductive line.

[0011] In one possible embodiment, the ultrasonic sensor further includes a third meandering conductor, the third meandering conductor being spaced apart from the first connecting assembly. All of the second contact electrodes are electrically connected to one another via the third meandering conductor, one of the second contact electrodes is electrically connected to the second pin electrode via the second meandering conductor, such that all of the second contact electrodes are electrically connected to the same second pin electrode via the second meandering conductor, and the flexible package encapsulates the third meandering conductor.

[0012] In a possible implementation manner, an orthographic projection of the first connecting component in the thickness direction of the ultrasonic sensor and an orthographic projection of the second connecting component in the thickness direction of the ultrasonic sensor are spaced apart.

[0013] In one possible embodiment, the piezoelectric module includes a first piezoelectric cell row and a second piezoelectric cell row arranged in parallel. The first piezoelectric cell row includes a plurality of piezoelectric cells spaced apart along its extension direction, and the second piezoelectric cell row includes a plurality of piezoelectric cells spaced apart along its extension direction. Along the extension direction of the first piezoelectric cell row, the piezoelectric cells of the first piezoelectric cell row and the piezoelectric cells of the second piezoelectric cell row are arranged alternately.

[0014] In one possible embodiment, the piezoelectric module further includes a first electrical connection unit and a second electrical connection unit corresponding to the piezoelectric unit. The first electrical connection unit and the first contact electrode are sequentially stacked on the first surface of the corresponding piezoelectric unit, and the first surface of the piezoelectric unit is fixedly bonded to the corresponding first contact electrode via the corresponding first electrical connection unit, so that the first surface of the piezoelectric unit is electrically connected to the corresponding first contact electrode via the corresponding first electrical connection unit. The second electrical connection unit and the second contact electrode are sequentially stacked on the second surface of the corresponding piezoelectric unit, and the second surface of the piezoelectric unit is fixedly bonded to the corresponding second contact electrode via the corresponding second electrical connection unit, so that the second surface of the piezoelectric unit is electrically connected to the corresponding second contact electrode via the corresponding second electrical connection unit.

[0015] In a possible implementation, a flexible adhesive layer is provided on at least one surface of the flexible package in a thickness direction thereof.

[0016] In one possible embodiment, the flexible adhesive layer is formed of hydrogel.

[0017] In a possible implementation, the flexible adhesive layer is formed of a water-loss resistant material.

[0018] In a possible implementation, the acoustic impedance of the flexible adhesive layer is smaller than the acoustic impedance of the flexible package.

[0019] In a possible implementation manner, the flexible adhesive layer covers the flexible package.

[0020] In a possible implementation, at least one side surface of the ultrasonic sensor in the thickness direction is oblique to the thickness direction of the at least one piezoelectric unit.

[0021] On the other hand, the present application provides an ultrasonic detection device, including an excitation device and an ultrasonic sensor in any of the above embodiments, wherein the first external structure and the second external structure of the ultrasonic sensor are electrically connected to the excitation device.

[0022] In another aspect, the present application provides a method for manufacturing an ultrasonic sensor, comprising the steps of:

[0023] A first flexible encapsulation layer and a second flexible encapsulation layer are prepared respectively, wherein the first flexible encapsulation layer includes a first bonding surface, and the second flexible encapsulation layer includes a second bonding surface.

[0024] A first conductive layer is provided on the first bonding surface, and the first conductive layer is processed to form a first conductive pattern on the first bonding surface, wherein the first conductive pattern includes a first contact electrode, a first bent wire and a first external structure, the first contact electrode is connected to the first external structure through the first bent wire, and the first contact electrode corresponds to the piezoelectric unit.

[0025] A second conductive layer is provided on the second bonding surface, and the second conductive layer is processed to form a second conductive pattern on the second bonding surface, wherein the second conductive pattern includes a second contact electrode, a second bent wire and a second external structure, the second contact electrode is connected to the second external structure through the second bent wire, and the second contact electrode corresponds to the piezoelectric unit.

[0026] The piezoelectric unit is docked onto the corresponding first contact electrode.

[0027] After the piezoelectric unit is docked on the corresponding first contact electrode, the first bonding surface is joined to the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit is docked with the corresponding second contact electrode and a first flexible packaging structure is formed, wherein the first flexible packaging structure includes a first flexible packaging body, a first conductive pattern, a second conductive pattern and a piezoelectric unit, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern and the piezoelectric unit.

[0028] At least a portion of the first external connection structure and at least a portion of the second external connection structure are exposed outside the first flexible package.

[0029] In a possible implementation, docking the piezoelectric unit onto the corresponding first contact electrode specifically includes:

[0030] A first electrical connection unit is provided on the first contact electrode.

[0031] After the first electrical connection unit is arranged on the first contact electrode, the piezoelectric unit is docked on the first electrical connection unit corresponding to the first contact electrode, so that the piezoelectric unit and the corresponding first contact electrode are docked via the first electrical connection unit therebetween.

[0032] The method further comprises the steps of:

[0033] A second electrical connection unit is provided on the second contact electrode.

[0034] The first bonding surface and the second bonding surface are bonded to form a first flexible package body, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a first flexible package structure is formed, specifically comprising:

[0035] After the second electrical connection unit is set on the second contact electrode, the first bonding surface is joined to the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit is docked on the second electrical connection unit where the corresponding second contact electrode is set, so that the piezoelectric unit and the corresponding second contact electrode are docked through the second electrical connection unit between the two, and a first flexible packaging structure is formed, wherein the first flexible packaging structure includes a first flexible packaging body, a first conductive pattern, a second conductive pattern, a first electrical connection unit, a second electrical connection unit and a piezoelectric unit, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern, the first electrical connection unit, the second electrical connection unit and the piezoelectric unit.

[0036] In one possible implementation, the first bonding surface and the second bonding surface are bonded to form a first flexible package body, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a first flexible package structure is formed, specifically including:

[0037] The first bonding surface is joined to the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a second flexible packaging structure is formed, wherein the second flexible packaging structure includes a first flexible packaging body, a first conductive pattern, a second conductive pattern and a piezoelectric unit, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern and the piezoelectric unit.

[0038] The second flexible packaging structure is placed on a mold whose supporting surface is a bent surface for secondary packaging to form a first flexible packaging structure, so that at least one side surface of the first flexible packaging structure in its thickness direction is oblique to the thickness direction of at least one piezoelectric unit. The first flexible packaging structure includes a second flexible packaging structure and a second flexible packaging body covering the second flexible packaging structure.

[0039] In a possible implementation, after forming the first flexible packaging structure, the method further includes the steps of:

[0040] A flexible adhesive layer is formed on the surface of the first flexible packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG1 is a connection diagram of an ultrasonic detection device provided in an embodiment of the present application;

[0042] FIG2 is a perspective view of one side of an ultrasonic sensor provided by an embodiment of the present application in its thickness direction;

[0043] FIG3 is a cross-sectional view of a piezoelectric unit of another ultrasonic sensor provided by an embodiment of the present application;

[0044] FIG4 is a schematic diagram showing the connection between the first contact electrode and the first connecting assembly of the ultrasonic sensor in FIG2 ;

[0045] FIG5 is a schematic diagram showing the connection between the second contact electrode and the second connecting assembly of the ultrasonic sensor in FIG2 ;

[0046] FIG6 is a perspective view of one side of another ultrasonic sensor provided by an embodiment of the present application in its thickness direction;

[0047] FIG7 is a schematic diagram showing the connection between the first contact electrode and the first connecting assembly of the ultrasonic sensor in FIG6 ;

[0048] FIG8 is a schematic diagram showing the connection between the second contact electrode and the second connecting assembly of the ultrasonic sensor in FIG6 ;

[0049] FIG9 is a perspective view of another ultrasonic sensor provided in an embodiment of the present application;

[0050] FIG10 is a schematic diagram of a method for manufacturing an ultrasonic sensor provided in an embodiment of the present application;

[0051] FIG11 is a schematic diagram of another method for manufacturing an ultrasonic sensor provided in an embodiment of the present application.

[0052] Explanation of the accompanying drawings: 1. Ultrasonic sensor; 2. Excitation device; 3. Processor; 4. Circuit board; 5. Cable; 6. Connector; 100. Piezoelectric module; 110. Piezoelectric unit; 111. First surface; 112. Second surface; 120. First contact electrode; 130. Second contact electrode; 140. First electrical connection unit; 150. Second electrical connection unit; 160. First piezoelectric unit row; 170. Second piezoelectric unit row; 200. First connecting component; 210. First bent wire; 220. First pin electrode; 300. Second connecting component; 310. Second bent wire; 320. Second pin electrode; 400. Flexible package; 500. Flexible adhesive layer; 600. Third bent wire. DETAILED DESCRIPTION

[0053] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0054] The ultrasonic detection equipment provided in the embodiments of the present application can be applied to fields such as medicine and industrial flaw detection.

[0055] FIG1 is a connection diagram of an ultrasonic detection device provided in an embodiment of the present application.

[0056] As shown in Figure 1, in an embodiment of the present application, the ultrasonic detection equipment may include an excitation device 2 and an ultrasonic sensor 1. The ultrasonic sensor 1 may include a piezoelectric module 100. The piezoelectric module 100 may include a piezoelectric unit 110. The excitation device 2 is used to be electrically connected to the piezoelectric unit 110. The excitation device 2 is used to input an excitation voltage to the piezoelectric unit 110 so that the piezoelectric unit 110 generates ultrasonic waves.

[0057] In an embodiment of the present application, the ultrasonic detection equipment may further include a processor 3, the piezoelectric unit 110 may be electrically connected to the processor 3, and the piezoelectric unit 110 is also used to receive the echo reflected by the ultrasonic wave. The piezoelectric unit 110 may transmit the received echo data to the processor 3 for processing.

[0058] In an embodiment of the present application, the excitation device 2 and the processor 3 can both be arranged on the circuit board 4 and electrically connected to the circuit board 4, and the piezoelectric unit 110 can be electrically connected to the circuit board 4 through a cable 5, so that the excitation device 2 and the processor 3 are electrically connected to the piezoelectric unit 110.

[0059] In the related art, the piezoelectric module of the ultrasonic sensor may include multiple piezoelectric units and multiple carriers corresponding to the piezoelectric units and distributed in rows and columns. The carriers have mounting grooves, and the piezoelectric units are fixedly mounted in the mounting grooves of the corresponding carriers. A wiring disk is provided at the end of each row of carriers and the end of each column of carriers. The wiring disk is connected to the adjacent carriers through a serpentine connection structure, and the two adjacent carriers are connected through a serpentine connection structure. The serpentine connection structure includes a serpentine plane carrier made of polyimide and copper foils respectively attached to both sides of the serpentine plane carrier. The piezoelectric units installed on each row of carriers are electrically connected to the wiring disk at the end of the row through the serpentine connection structure, and the piezoelectric units installed on each column of carriers are electrically connected to the wiring disk at the end of the column through the serpentine connection structure. The wiring disk can be used to electrically connect to the circuit board through a cable so that the piezoelectric unit is electrically connected to the excitation device and processor on the circuit board. The serpentine connection structure can be used to change the spacing between the wiring disk and the carrier and between the two adjacent carriers, so that the ultrasonic sensor can be stretched.

[0060] However, in related technologies, the piezoelectric unit requires a corresponding carrier plate for support, and the copper foil of the serpentine connection structure needs to be supported by a serpentine plane carrier. The carrier plate and the serpentine plane carrier have poor bending performance in the normal direction of both, resulting in poor flexibility of the formed ultrasonic sensor, which is not conducive to attaching the ultrasonic sensor to a more complex curved surface for a long time, and the application scenarios of the ultrasonic sensor are greatly limited.

[0061] Figure 2 is a perspective view of one side of an ultrasonic sensor provided in an embodiment of the present application in its thickness direction, Figure 3 is a cross-sectional view of another ultrasonic sensor provided in an embodiment of the present application at the piezoelectric unit, Figure 4 is a schematic diagram of the connection between the first contact electrode and the first connecting component of the ultrasonic sensor in Figure 2, and Figure 5 is a schematic diagram of the connection between the second contact electrode and the second connecting component of the ultrasonic sensor in Figure 2.

[0062] As shown in Figures 2 to 4 and with reference to Figure 1 , in the embodiment of the present application, the piezoelectric module 100 further includes a first contact electrode 120 and a second contact electrode 130 corresponding to the piezoelectric unit 110. The piezoelectric unit 110 includes a first surface 111 and a second surface 112 that are opposite to each other in the thickness direction thereof. The first contact electrode 120 is fixedly connected to the first surface 111 of the corresponding piezoelectric unit 110 and is electrically connected to the first surface 111 of the corresponding piezoelectric unit 110. The second contact electrode 130 is fixedly connected to the second surface 112 of the corresponding piezoelectric unit 110 and is electrically connected to the second surface 112 of the corresponding piezoelectric unit 110.

[0063] It is understood that the orthographic projection of the first contact electrode 120 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the first surface 111 of the corresponding piezoelectric unit 110. The orthographic projection of the second contact electrode 130 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the second surface 112 of the corresponding piezoelectric unit 110, so that the provision of the first contact electrode 120 and the second contact electrode 130 does not affect the area of ​​the inflexible region of the ultrasonic sensor 1.

[0064] For example, the edge of the orthographic projection of the first contact electrode 120 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the first surface 111 of the corresponding piezoelectric unit 110. The edge of the orthographic projection of the second contact electrode 130 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the second surface 112 of the corresponding piezoelectric unit 110.

[0065] Exemplarily, the piezoelectric unit 110 may be made of a material having piezoelectric properties, such as piezoelectric ceramics, piezoelectric polymers, etc. For example, the piezoelectric unit 110 may be made of lead zirconate titanate piezoelectric ceramics (PZT) or polyvinylidene difluoride (PVDF).

[0066] For example, the first contact electrode 120 and the second contact electrode 130 may be made of a conductive material such as copper, silver, or aluminum.

[0067] For example, the first surface 111 of the piezoelectric unit 110 and the corresponding first contact electrode 120 can be fixed by soldering or bonding with a conductive adhesive, so that the first surface 111 of the piezoelectric unit 110 is electrically connected to the corresponding first contact electrode 120. The second surface 112 of the piezoelectric unit 110 and the corresponding second contact electrode 130 can be fixed by soldering or bonding with a conductive adhesive, so that the second surface 112 of the piezoelectric unit 110 and the corresponding second contact electrode 130 are electrically connected.

[0068] For example, the piezoelectric unit 110 may have a cylindrical or square structure.

[0069] In the embodiment of the present application, the ultrasonic sensor 1 further includes a flexible package 400 , which covers the piezoelectric unit 110 , the first contact electrode 120 , and the second contact electrode 130 .

[0070] It can be understood that the flexible package 400 is flexible, that is, the flexible package 400 can be bent in its normal direction.

[0071] For example, the flexible package body 400 may be formed of a flexible material such as polydimethylsiloxane (PDMS) or hydrogenated styrene-butadiene block copolymer (SEBS).

[0072] In the embodiment of the present application, the ultrasonic sensor 1 further includes a first connecting assembly 200 and a second connecting assembly 300, which are spaced apart from each other. The first connecting assembly 200 includes a first zigzag conductive wire 210 and a first external connection structure. One end of the first zigzag conductive wire 210 is connected to the first contact electrode 120, and the other end is connected to the first external connection structure, so that the first contact electrode 120 is electrically connected to the first external connection structure via the first zigzag conductive wire 210. At least a portion of the first zigzag conductive wire 210 is enclosed by the flexible package 400, and the first external connection structure is at least partially exposed from the flexible package 400. The second connecting assembly 300 includes a second zigzag conductive wire 310 and a second external connection structure. One end of the second zigzag conductive wire 310 is connected to the second contact electrode 130, and the other end is connected to the second external connection structure, so that the second contact electrode 130 is electrically connected to the second external connection structure via the second zigzag conductive wire 310. At least a portion of the second zigzag conductive wire 310 is enclosed by the flexible package 400, and the second external connection structure is at least partially exposed from the flexible package 400.

[0073] It can be understood that the first meandering conductor 210, the second meandering conductor 310 and the second external structure are all spaced apart, and the second meandering conductor 310, the first meandering conductor 210 and the first external structure are all spaced apart.

[0074] It is understandable that the first meandering conductive line 210 and the second meandering conductive line 310 may include but are not limited to a serpentine structure, an arc structure, a folded line structure, and the like.

[0075] For example, the first meandering conductive line 210 , the second meandering conductive line 310 , the first external connection structure, and the second external connection structure may be made of conductive materials such as copper, silver, and aluminum.

[0076] In this way, the piezoelectric unit 110, the first connecting component 200, and the second connecting component 300 can all be carried by the flexible package 400, and there is no need to set up other supporting structures for carrying the piezoelectric unit 110, the first connecting component 200, and the second connecting component 300. The flexible package 400 has good bending performance in its normal direction. The first contact electrode 120 is electrically connected to the first external structure through the first meandering wire 210, and the second contact electrode 130 is electrically connected to the second external structure through the second meandering wire 310. The first meandering wire 210 and the second meandering wire 310 can be stretched and bent. The electrical connection between the first contact electrode 120 and the first external structure and the electrical connection between the second contact electrode 130 and the second external structure have little effect on the flexibility of the flexible package 400. The ultrasonic sensor 1 has fewer inflexible components and a smaller inflexible area, which can make the ultrasonic sensor 1 have good flexibility, allowing the ultrasonic sensor 1 to be attached to a more complex curved surface for a long time, which is conducive to broadening the application scenarios of the ultrasonic sensor 1. In addition, the flexible package 400 can also provide a moisture-proof barrier for the piezoelectric unit 110, the first contact electrode 120, the second contact electrode 130 and other electrical structures it encloses, thereby protecting the piezoelectric unit 110, the first contact electrode 120, the second contact electrode 130 and other electrical structures enclosed by the flexible package 400.

[0077] It is understood that the first and second external structures of the ultrasonic sensor 1 can be used to electrically connect to the connector 6, which is electrically connected to the circuit board 4 via the cable 5. The first and second external structures can be electrically connected to the excitation device 2 and the processor 3 via the connector 6, the cable 5, and the circuit board 4, so that the piezoelectric unit 110 can be electrically connected to the excitation device 2 and the processor 3. Exemplarily, the connection between the first and second external structures and the connector 6 can be encapsulated by a packaging structure to ensure a stable electrical connection between the connector 6 and the first and second external structures. In addition, the packaging structure can also provide a moisture-proof barrier for the connection between the first and second external structures and the connector 6, thereby protecting the first and second external structures.

[0078] It is understood that the first external structure can be completely exposed from the flexible package 400. In this case, the first meandering conductor 210 can be partially covered by the flexible package 400 and partially exposed from the flexible package 400. The first meandering conductor 210 can be completely covered by the flexible package 400. In this case, the first external structure can be partially covered by the flexible package 400 and partially exposed from the flexible package 400. The second external structure can be completely exposed from the flexible package 400. In this case, the second meandering conductor 310 can be partially covered by the flexible package 400 and partially exposed from the flexible package 400. The second meandering conductor 310 can be completely covered by the flexible package 400. In this case, the second external structure can be partially covered by the flexible package 400 and partially exposed from the flexible package 400.

[0079] The ultrasonic detection equipment provided in the embodiment of the present application can be a wearable device that can be worn on a biological body such as a smart watch, a smart bracelet, a smart belt, smart glasses, or smart leg guards. When the ultrasonic detection equipment is a wearable device, one side surface of the ultrasonic sensor 1 in the thickness direction can be attached to the surface of the object to be tested.

[0080] The ultrasonic detection device provided in the embodiment of the present application can also be a non-wearable device such as an ultrasonic detector. When the ultrasonic detection device is a non-wearable device, the ultrasonic detection device can also include a rigid probe. The ultrasonic sensor 1 can be attached to the surface of the probe on one side of its thickness direction to cover the probe. The probe with the ultrasonic sensor 1 attached can be inserted into the area to be detected for detection. In this way, the structure used to contact the object to be detected is flexible, which can reduce damage to the object to be detected caused by impact on the object to be detected. For example, when it is necessary to detect the human throat, the probe with the ultrasonic sensor 1 attached can be inserted into the human throat. The structure used to contact the human throat is flexible, which can reduce stimulation to the human throat and reduce damage to the human throat.

[0081] In some examples, the first meandering conductor 210 and the second meandering conductor 310 both have a serpentine linear structure, so that the first meandering conductor 210 and the second meandering conductor 310 can be stretched and bent to a greater extent, which is beneficial to the stretching and contraction of the ultrasonic sensor 1 .

[0082] In some examples, the first contact electrode 120, the first meandering conductive line 210, and the first external connection structure can be made of the same material. The first contact electrode 120, the first meandering conductive line 210, and the first external connection structure are integrally formed, making them easier to form. Furthermore, current transmission between the first contact electrode 120, the first meandering conductive line 210, and the first external connection structure is more stable. For example, the first contact electrode 120, the first meandering conductive line 210, and the first external connection structure can be formed by laser cutting from a single piece of copper foil.

[0083] In some examples, the second contact electrode 130, the second meandering conductive line 310, and the second external connection structure can be made of the same material. The second contact electrode 130, the second meandering conductive line 310, and the second external connection structure are integrally formed, making the second contact electrode 130, the second meandering conductive line 310, and the second external connection structure easier to form. Furthermore, current transmission between the second contact electrode 130, the second meandering conductive line 310, and the second external connection structure is relatively stable. For example, the second contact electrode 130, the second meandering conductive line 310, and the second external connection structure can be formed by laser cutting from the same sheet of copper foil.

[0084] In the embodiment of the present application, the piezoelectric module 100 includes a plurality of piezoelectric units 110 distributed at intervals.

[0085] This helps improve the resolution of ultrasonic detection by the ultrasonic sensor 1. Furthermore, different piezoelectric units 110 can be used to generate ultrasonic waves and receive reflected echoes, which helps reduce the impact of ultrasonic ghost echoes on ultrasonic detection, narrowing detection blind spots and improving the near-surface detection capability of the ultrasonic sensor 1.

[0086] It is understandable that when the piezoelectric module 100 includes multiple piezoelectric units 110, the thickness direction of all piezoelectric units 110 can be the same as the thickness direction of the ultrasonic sensor 1, or the thickness direction of some or all piezoelectric units 110 can be oblique to the thickness direction of the ultrasonic sensor 1.

[0087] In some embodiments where the piezoelectric module 100 includes a plurality of spaced-apart piezoelectric cells 110, the first connection assembly 200 includes a plurality of first meandering conductive lines 210 corresponding to the piezoelectric cells 110 and spaced apart from one another. The first external connection structure includes a plurality of first pin electrodes 220 corresponding to the piezoelectric cells 110 and spaced apart from one another. The first pin electrodes 220 at least partially expose the flexible package 400. The first contact electrode 120 electrically connected to each piezoelectric cell 110 is electrically connected to the corresponding first pin electrode 220 via the corresponding first meandering conductive line 210. The second connection assembly 300 includes a plurality of second meandering conductive lines 310 corresponding to the piezoelectric cells 110 and spaced apart from one another. The second external connection structure includes a plurality of second pin electrodes 320 corresponding to the piezoelectric cells 110 and spaced apart from one another. The second pin electrodes 320 at least partially expose the flexible package 400. The second contact electrode 130 electrically connected to each piezoelectric cell 110 is electrically connected to the corresponding second pin electrode 320 via the corresponding second meandering conductive line 310.

[0088] In some embodiments where the piezoelectric module 100 includes a plurality of piezoelectric units 110 spaced apart from each other, the piezoelectric module 100 includes a plurality of spaced apart piezoelectric units 110. The first connection assembly 200 includes a plurality of first meandering conductive lines 210 corresponding to the piezoelectric units 110 and spaced apart from each other. The first external connection structure includes a plurality of first pin electrodes 220 corresponding to the piezoelectric units 110 and spaced apart from each other. The first pin electrodes 220 are at least partially exposed from the flexible package 400. The first contact electrodes 120 electrically connected to each piezoelectric unit 110 are electrically connected to the corresponding first pin electrodes 220 via the corresponding first meandering conductive lines 210. In other words, the first contact electrodes 120 of each piezoelectric unit 110 are independent of each other and are independently electrically connected to the corresponding first pin electrodes 220. The second external connection structure includes a second pin electrode 320 , which is at least partially exposed from the flexible package 400 . All second contact electrodes 130 are electrically connected to the same second pin electrode 320 via the second meandering conductor 310 . That is, all second contact electrodes 130 are conductively connected to the same second pin electrode 320 .

[0089] In this way, when multiple piezoelectric units 110 need to be excited, an excitation voltage only needs to be input to the corresponding multiple first pin electrodes 220 and one second pin electrode 320. This makes it easier to excite multiple piezoelectric units 110 and allows for more flexible control of the piezoelectric units 110. Furthermore, this helps reduce the number of second meandering conductors 310 and second pin electrodes 320, thereby improving the integration of the ultrasonic sensor 1 and reducing its size.

[0090] It is understood that applying an excitation voltage to the same second pin electrode 320 to which all second contact electrodes 130 are electrically connected, and to the first pin electrode 220 corresponding to the piezoelectric cell 110 to be excited, can excite the piezoelectric cell 110 to be excited. For example, to excite a single piezoelectric cell 110, applying an excitation voltage to the first pin electrode 220 corresponding to the piezoelectric cell 110 and to the same second pin electrode 320 to which all second contact electrodes 130 are electrically connected, can excite the piezoelectric cell 110. To excite three piezoelectric cells 110, applying an excitation voltage to the three first pin electrodes 220 corresponding to the three piezoelectric cells 110 and to the same second pin electrode 320 to which all second contact electrodes 130 are electrically connected, can excite the three piezoelectric cells 110. The three piezoelectric cells 110 can be arbitrarily distributed.

[0091] It is understood that the second pin electrode 320 can be used for grounding and can be electrically connected to a ground terminal of the connector 6 .

[0092] In some implementations where all second contact electrodes 130 are electrically connected to the same second pin electrode 320 via second meandering conductors 310 , the first connection assembly 200 may include a plurality of second meandering conductors 310 corresponding to the piezoelectric units 110 , and the second contact electrodes 130 electrically connected to each piezoelectric unit 110 are electrically connected to the same second pin electrode 320 via corresponding second meandering conductors 310 .

[0093] In some other implementations where all of the second contact electrodes 130 are electrically connected to the same second pin electrode 320 via the second meandering conductive wire 310, the ultrasonic sensor 1 further includes a third meandering conductive wire 600, which is spaced apart from the first connecting assembly 200. All of the second contact electrodes 130 are electrically connected to each other via the third meandering conductive wire 600, with one of the second contact electrodes 130 being electrically connected to the second pin electrode 320 via the second meandering conductive wire 310. Consequently, all of the second contact electrodes 130 are electrically connected to the same second pin electrode 320 via the second meandering conductive wire 310. The flexible package 400 covers the third meandering conductive wire 600.

[0094] In this way, the electrical connection between the plurality of second contact electrodes 130 and the same second pin electrode 320 is relatively simple, and wiring on the flexible package 400 is relatively easy, which is beneficial to improving the integration of the ultrasonic sensor 1 and reducing the size of the ultrasonic sensor 1.

[0095] It can be understood that the third meandering conductive line 600 is spaced apart from the first meandering conductive line 210 and the first pin electrode 220 .

[0096] It is understandable that the third meandering conductive line 600 may include but is not limited to a serpentine structure, an arc structure, a folded line structure, etc.

[0097] Exemplarily, the third meandering conductive line 600 may be made of conductive materials such as copper, silver, and aluminum.

[0098] In some examples, the second contact electrode 130, the second meandering conductive line 310, the third meandering conductive line 600, and the second external structure can be made of the same material. The second contact electrode 130, the second meandering conductive line 310, the third meandering conductive line 600, and the second external structure are integrally formed, making the second contact electrode 130, the second meandering conductive line 310, the third meandering conductive line 600, and the second external structure easier to form. Furthermore, current transmission between the second contact electrode 130, the second meandering conductive line 310, the third meandering conductive line 600, and the second external structure is relatively stable. For example, the second contact electrode 130, the second meandering conductive line 310, the third meandering conductive line 600, and the second external structure can be formed by laser cutting from the same sheet of copper foil.

[0099] In the implementation of the present application, the orthographic projection of the first connecting component 200 in the thickness direction of the ultrasonic sensor 1 and the orthographic projection of the second connecting component 300 in the thickness direction of the ultrasonic sensor 1 are spaced apart.

[0100] In this way, it is beneficial to keep the first connecting component 200 and the second connecting component 300 apart, so that parts of the first connecting component 200 and the second connecting component 300 can be located in the same layer in the thickness direction of the ultrasonic sensor 1, making it easier for the flexible package body 400 to package electrical structures such as the piezoelectric unit 110.

[0101] It can be understood that the flexible packaging body 400 can be formed by joining the first flexible packaging layer and the second flexible packaging layer, the surface of the first flexible packaging layer for joining with the second flexible packaging layer is provided with a first connecting component 200 and a first contact electrode 120, and the surface of the second flexible packaging layer for joining with the first flexible packaging layer is provided with a second connecting component 300 and a second contact electrode 130, and the orthographic projection of the first connecting component 200 in the thickness direction of the ultrasonic sensor 1 and the orthographic projection of the second connecting component 300 in the thickness direction of the ultrasonic sensor 1 are spaced apart, which is conducive to forming a flexible packaging body 400 for encapsulating electrical structures such as the piezoelectric unit 110 by joining the first flexible packaging layer and the second flexible packaging layer, and spacing the first connecting component 200 and the second connecting component 300.

[0102] It is understood that both sides of the portion of the first connection component 200 covered by the flexible package 400 in the thickness direction can be used to contact the flexible package 400. Both sides of the portion of the second connection component 300 covered by the flexible package 400 in the thickness direction can be used to contact the flexible package 400.

[0103] In the embodiment of the present application, the piezoelectric module 100 further includes a first electrical connection unit 140 corresponding to the piezoelectric unit 110. The first electrical connection unit 140 and the first contact electrode 120 are sequentially stacked on the first surface 111 of the corresponding piezoelectric unit 110. The first surface 111 of the piezoelectric unit 110 is bonded and fixed to the corresponding first contact electrode 120 via the corresponding first electrical connection unit 140, so that the first surface 111 of the piezoelectric unit 110 is electrically connected to the corresponding first contact electrode 120 via the corresponding first electrical connection unit 140.

[0104] For example, the first electrical connection unit 140 may be formed of solder paste or silver paste coated on the first surface 111 of the corresponding piezoelectric unit 110 .

[0105] In this way, the first contact electrode 120 is easily fixed on the first surface 111 of the corresponding piezoelectric unit 110 and electrically connected to the first surface 111 of the corresponding piezoelectric unit 110 . The electrical connection between the first contact electrode 120 and the first surface 111 of the corresponding piezoelectric unit 110 is relatively stable.

[0106] In the implementation of the present application, the piezoelectric module 100 also includes a second electrical connection unit 150 corresponding to the piezoelectric unit 110. The second electrical connection unit 150 and the second contact electrode 130 are sequentially stacked on the second surface 112 of the corresponding piezoelectric unit 110. The second surface 112 of the piezoelectric unit 110 is bonded and fixed to the corresponding second contact electrode 130 through the corresponding second electrical connection unit 150, so that the second surface 112 of the piezoelectric unit 110 is electrically connected to the corresponding second contact electrode 130 through the corresponding second electrical connection unit 150.

[0107] For example, the second electrical connection unit 150 may be formed of solder paste or silver paste coated on the second surface 112 of the corresponding piezoelectric unit 110 .

[0108] In this way, the second contact electrode 130 is easily fixed on the second surface 112 of the corresponding piezoelectric unit 110 and electrically connected to the second surface 112 of the corresponding piezoelectric unit 110 . The electrical connection between the second contact electrode 130 and the second surface 112 of the corresponding piezoelectric unit 110 is relatively stable.

[0109] It is understood that the orthographic projection of the first electrical connection unit 140 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the first surface 111 of the corresponding piezoelectric unit 110. The orthographic projection of the second electrical connection unit 150 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the second surface 112 of the corresponding piezoelectric unit 110, so that the provision of the first electrical connection unit 140 and the second electrical connection unit 150 does not affect the area of ​​the inflexible region of the ultrasonic sensor 1.

[0110] For example, the edge of the orthographic projection of the first electrical connection unit 140 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the first surface 111 of the corresponding piezoelectric unit 110. The edge of the orthographic projection of the first electrical connection unit 140 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the second surface 112 of the corresponding piezoelectric unit 110.

[0111] In the implementation of the present application, a flexible adhesive layer 500 is provided on at least one surface of the flexible package body 400 in the thickness direction thereof. The flexible adhesive layer 500 can be used to be attached to the surface of the object to be measured or the probe.

[0112] In this way, it is convenient to attach the ultrasonic sensor 1 to the surface of the object to be measured or the probe, and it is convenient to fix the ultrasonic sensor 1, which is conducive to closely attaching the ultrasonic sensor 1 to a relatively complex curved surface such as the surface of a biological body for a long time.

[0113] It is understood that the flexible adhesive layer 500 may be provided on one surface of the flexible package body 400 in the thickness direction. Alternatively, the flexible adhesive layer 500 may be provided on both surfaces of the flexible package body 400 in the thickness direction.

[0114] In the embodiment of the present application, the flexible adhesive layer 500 is formed of hydrogel.

[0115] In this way, the hydrogel has strong biocompatibility, and the flexible adhesive layer 500 formed by the hydrogel is easy to fit tightly with the surface of the organism. In addition, when the flexible adhesive layer 500 is attached to the surface of the organism, the hydrogel can absorb excess moisture on the surface of the organism, which has little impact on the aerobic respiration of the surface of the organism, is not easy to breed bacteria, and is conducive to improving the wearing comfort when the organism sweats. In addition, when the surface of the organism is dry, the hydrogel can also allow the moisture inside to adhere to the surface of the organism, which is conducive to improving the wearing comfort when the surface of the organism is dry. Furthermore, the hydrogel can absorb the surrounding moisture to act as an ultrasonic coupling agent, and there is no need to apply an ultrasonic coupling agent on the surface of the object to be measured before attaching the ultrasonic sensor 1 to the surface of the object to be measured, which facilitates ultrasonic detection.

[0116] In the embodiment of the present application, the flexible adhesive layer 500 is formed of a material that resists water loss.

[0117] In this way, the attachment area of ​​the flexible adhesive layer 500 can remain moist for a long time, and the moist flexible adhesive layer 500 can serve as an ultrasonic coupling agent for a long time, which is beneficial for long-term ultrasonic monitoring of the object to be measured.

[0118] It is understood that the anti-water loss material has the properties of locking in moisture and retaining moisture. As needed, an anti-water loss material that can maintain hydration for 1 week, 1 month, 2 months, etc. at room temperature can be selected to form the flexible adhesive layer 500. For example, the anti-water loss material can be a material that can maintain hydration for at least 6 months at room temperature.

[0119] Exemplarily, the anti-water loss material is a material having a water-locking substance, and the water-locking substance may include but is not limited to at least one of glycerol, ethylene glycol, ionic liquid, and the like.

[0120] In the embodiment of the present application, the flexible adhesive layer 500 may be formed of an anti-dehydration hydrogel. For example, the anti-dehydration hydrogel may be a glycerol gel, which may be made by partially replacing water in a polyacrylamide hydrogel with glycerol.

[0121] In this way, the anti-dehydration hydrogel can absorb the surrounding moisture to keep its surface moist for a longer period of time. When the ultrasonic sensor 1 is attached to the object to be measured through the flexible adhesive layer 500, the ultrasonic sensor 1 can operate continuously without coating an ultrasonic coupling agent between the ultrasonic sensor 1 and the object to be measured, which is conducive to long-term ultrasonic monitoring of the object to be measured.

[0122] In the embodiment of the present application, the acoustic impedance of the flexible adhesive layer 500 is smaller than the acoustic impedance of the flexible package body 400 .

[0123] In this way, the interface between the flexible adhesive layer 500 and the flexible package body 400 has little effect on the transmission of the echo reflected from the ultrasonic wave generated by the piezoelectric unit 110 , which is beneficial for the piezoelectric unit 110 to receive the echo.

[0124] It is understood that the acoustic impedance of the flexible adhesive layer 500 is greater than the acoustic impedance of the surface of the object to be measured with which it contacts. In other words, the acoustic impedance of the flexible adhesive layer 500 is between the acoustic impedance of the surface of the object to be measured with which it contacts and the acoustic impedance of the flexible package 400. For example, when the flexible adhesive layer 500 is adhered to human skin, the acoustic impedance of the flexible adhesive layer 500 is between the acoustic impedance of human skin and the acoustic impedance of the flexible package 400.

[0125] In the embodiment of the present application, the flexible adhesive layer 500 covers the flexible package body 400 .

[0126] In this way, the flexible adhesive layer 500 is easily formed on the surface of the flexible package 400. In addition, both sides of the ultrasonic sensor 1 in the thickness direction can be used to be attached to the surface of the object to be measured or the probe, making the ultrasonic sensor 1 more convenient to use.

[0127] It is understood that when the ultrasonic sensor 1 is attached to the object to be measured, the ultrasonic sensor 1 can be attached to the surface of the object to be measured via the flexible adhesive layer 500 on either side of the ultrasonic sensor 1 in the thickness direction. When the ultrasonic sensor 1 is attached to the probe, the ultrasonic sensor 1 can be attached to the surface of the probe via the flexible adhesive layer 500 on either side of the ultrasonic sensor 1 in the thickness direction.

[0128] In the embodiment of the present application, the thickness of the portion of the flexible package 400 facing the first surface 111 of the piezoelectric unit 110 is equal to an odd multiple of one quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 propagating within the flexible package 400. In this way, the interference caused by the transmission of the ultrasonic wave between the first surface 111 and the object to be measured is small, and the surface of the ultrasonic sensor 1 facing the first surface 111 can be attached to the object to be measured.

[0129] In the embodiment of the present application, the thickness of the portion of the flexible package 400 facing the second surface 112 of the piezoelectric unit 110 is equal to an odd multiple of one quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 propagating within the flexible package 400. In this way, the interference caused by the transmission of the ultrasonic wave between the second surface 112 and the object to be measured is relatively small, and the surface of the ultrasonic sensor 1 facing the second surface 112 can be attached to the object to be measured.

[0130] In some embodiments of the present application, the piezoelectric module 100 includes two rows of piezoelectric units arranged in parallel, each row of piezoelectric units includes a plurality of piezoelectric units 110 arranged at intervals along its extension direction, and the piezoelectric units 110 of the two rows of piezoelectric units are arranged opposite each other.

[0131] FIG6 is a perspective view of one side of another ultrasonic sensor provided in an embodiment of the present application in its thickness direction. FIG7 is a schematic diagram of the connection between the first contact electrode and the first connecting component of the ultrasonic sensor in FIG6 . FIG8 is a schematic diagram of the connection between the second contact electrode and the second connecting component of the ultrasonic sensor in FIG6 .

[0132] As shown in Figures 6-8, in some other embodiments of the present application, the piezoelectric module 100 includes a first piezoelectric cell row 160 and a second piezoelectric cell row 170 arranged in parallel. The first piezoelectric cell row 160 includes a plurality of piezoelectric cells 110 spaced apart along its extension direction, and the second piezoelectric cell row 170 includes a plurality of piezoelectric cells 110 spaced apart along its extension direction. Along the extension direction of the first piezoelectric cell row 160, the piezoelectric cells 110 of the first piezoelectric cell row 160 and the piezoelectric cells 110 of the second piezoelectric cell row 170 are arranged in an alternating pattern.

[0133] In this way, the piezoelectric units 110 are densely arranged in the extension direction of the first piezoelectric unit row 160, which is beneficial to improving the resolution of the ultrasonic sensor 1 in the extension direction of the first piezoelectric unit row 160 and facilitating more accurate positioning when performing ultrasonic detection on blood vessels.

[0134] Fig. 9 is a perspective view of another ultrasonic sensor provided by an embodiment of the present application. In the figure, x1, x2 and x3 are the thickness directions of three different piezoelectric units 110.

[0135] In the embodiment of the present application, at least one side surface of the ultrasonic sensor 1 in the thickness direction thereof is oblique to the thickness direction of the at least one piezoelectric unit 110 .

[0136] In this way, the ultrasonic wave generated by at least one piezoelectric unit 110 can be transmitted out of at least one side surface of the ultrasonic sensor 1 in its thickness direction along a certain angle, so that the ultrasonic wave generated by at least one piezoelectric unit 110 can have a certain angle with the object to be detected, which is beneficial for the application of the ultrasonic sensor 1 in scenarios such as blood flow ultrasonic detection that require ultrasonic waves to be emitted into the surface of the object to be detected at a certain angle.

[0137] It is understood that when the flexible package 400 has a flexible adhesive layer 500 on its surface, the surface of the ultrasonic sensor 1 may be the surface of the flexible adhesive layer 500. When the flexible package 400 does not have a flexible adhesive layer 500 on its surface, the surface of the ultrasonic sensor 1 may be the surface of the flexible package 400.

[0138] FIG10 is a schematic diagram of a method for manufacturing an ultrasonic sensor provided in an embodiment of the present application.

[0139] As shown in FIG10 , and referring to FIG2 to FIG8 , the manufacturing method of the ultrasonic sensor 1 provided in the embodiment of the present application includes the following steps:

[0140] S100: preparing a first flexible encapsulation layer, wherein the first flexible encapsulation layer includes a first bonding surface.

[0141] It is understood that the first flexible encapsulation layer may be formed of a flexible material such as polydimethylsiloxane (PDMS) or hydrogenated styrene-butadiene block copolymer (SEBS).

[0142] Specifically, step S100 may include:

[0143] A layer of release agent is sprayed on the surface of the first substrate.

[0144] A flexible material is coated on the surface of the first substrate sprayed with the release agent to form a first flexible packaging layer, and the surface of the first flexible packaging layer facing away from the first substrate is a first bonding surface.

[0145] It can be understood that the thickness of the first flexible encapsulation layer may be equal to an odd multiple of one quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 propagating in the first flexible encapsulation layer.

[0146] S200: preparing a second flexible encapsulation layer, wherein the second flexible encapsulation layer includes a second bonding surface.

[0147] It is understood that the second flexible encapsulation layer may be formed of a flexible material such as polydimethylsiloxane (PDMS) or hydrogenated styrene-butadiene block copolymer (SEBS).

[0148] Specifically, step S200 may include:

[0149] A transparent carrier is fixedly connected to the surface of the second substrate, wherein the transparent carrier may be a polyimide plate.

[0150] A flexible material is coated on the surface of the transparent carrier to form a second flexible packaging layer, and the surface of the second flexible packaging layer facing away from the second substrate is a second bonding surface.

[0151] It is understood that the thickness of the second flexible encapsulation layer may be equal to an odd multiple of one quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 propagating in the second flexible encapsulation layer.

[0152] S300: A first conductive layer is provided on the first bonding surface, and the first conductive layer is processed to form a first conductive pattern on the first bonding surface, wherein the first conductive pattern includes a first contact electrode 120, a first bent conductor 210 and a first external structure, the first contact electrode 120 is connected to the first external structure through the first bent conductor 210, and the first contact electrode 120 corresponds to the piezoelectric unit 110.

[0153] Specifically, step S300 may include:

[0154] A conductive foil is laid on the first bonding surface to form a first conductive layer, wherein the conductive foil laid on the first bonding surface can be silver foil, copper foil, aluminum foil, etc.

[0155] The first conductive layer is laser cut to form a first conductive pattern on the first bonding surface.

[0156] S400: A second conductive layer is provided on the second bonding surface, and the second conductive layer is processed to form a second conductive pattern on the second bonding surface, wherein the second conductive pattern includes a second contact electrode 130, a second bent conductor 310, and a second external structure, the second contact electrode 130 is connected to the second external structure through the second bent conductor 310, and the second contact electrode 130 corresponds to the piezoelectric unit 110.

[0157] Specifically, step S400 may include:

[0158] A conductive foil is laid on the second bonding surface to form a second conductive layer, wherein the conductive foil laid on the second bonding surface can be silver foil, copper foil, aluminum foil, etc.

[0159] The second conductive layer is laser cut to form a second conductive pattern on the first bonding surface.

[0160] S500 : docking the piezoelectric unit 110 onto the corresponding first contact electrode 120 .

[0161] Step S500 specifically includes:

[0162] S510 : disposing a first electrical connection unit 140 on the first contact electrode 120 .

[0163] Specifically, step S510 may include:

[0164] The first printing module is laid on the first bonding surface formed with the first conductive pattern, wherein the first printing module has mesh holes corresponding to the first contact electrodes 120 .

[0165] A conductive coating is printed on the first contact electrode 120 by a first printing module, wherein the conductive coating may be solder paste, silver paste, or the like.

[0166] The first printing module is removed, so that the conductive coating on the first contact electrode 120 forms the first electrical connection unit 140 .

[0167] S520 : After step S510 is completed, the piezoelectric unit 110 is docked onto the first electrical connection unit 140 provided on the corresponding first contact electrode 120 , so that the piezoelectric unit 110 and the corresponding first contact electrode 120 are docked via the first electrical connection unit 140 therebetween.

[0168] Specifically, step S520 includes:

[0169] The mounting module is laid on the first joint surface where the first electrical connection unit 140 is formed, wherein the mounting module has meshes corresponding to the first electrical connection unit 140 .

[0170] The piezoelectric unit 110 is disposed in the mesh of the mounting module, so that the piezoelectric unit 110 is docked with the first electrical connection unit 140 provided with the corresponding first contact electrode 120 .

[0171] Remove the installed module.

[0172] S600 : disposing a second electrical connection unit 150 on the second contact electrode 130 .

[0173] Specifically, step S600 includes:

[0174] A second printing module is laid on the second bonding surface formed with the second conductive pattern, wherein the second printing module has mesh holes corresponding to the second contact electrodes 130 .

[0175] A conductive coating is printed on the second contact electrode 130 by a second printing module, wherein the conductive coating may be solder paste, silver paste, or the like.

[0176] The second printing module is removed, so that the conductive paint on the second contact electrode 130 forms the second electrical connection unit 150 .

[0177] S700: After S500 and S600 are completed, the first bonding surface is joined to the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit 110 is docked with the corresponding second contact electrode 130, and a first flexible packaging structure is formed, wherein the first flexible packaging structure includes a first flexible packaging body, a first conductive pattern, a second conductive pattern and the piezoelectric unit 110, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern and the piezoelectric unit 110.

[0178] Step S700 specifically includes:

[0179] S710: After S500 and S600 are completed, the first bonding surface is joined to the second bonding surface to form a first flexible package body, so that the piezoelectric unit 110 is docked on the second electrical connection unit 150 set on the corresponding second contact electrode 130, so that the piezoelectric unit 110 and the corresponding second contact electrode 130 are docked through the second electrical connection unit 150 therebetween, and a first flexible package structure is formed, wherein the first flexible package structure includes a first flexible package body, a first conductive pattern, a second conductive pattern, a first electrical connection unit 140, a second electrical connection unit 150 and a piezoelectric unit 110, and the first flexible package body covers the first conductive pattern, the second conductive pattern, the first electrical connection unit 140, the second electrical connection unit 150 and the piezoelectric unit 110.

[0180] Specifically, step S710 includes:

[0181] After S500 and S600 are completed, the first substrate and the second substrate are removed.

[0182] The second bonding surface is covered on the first bonding surface through a transparent carrier, so that the first bonding surface and the second bonding surface are joined to form a first flexible packaging body, so that the piezoelectric unit 110 is docked on the second electrical connection unit 150 set with the corresponding second contact electrode 130, so that the piezoelectric unit 110 and the corresponding second contact electrode 130 are docked through the second electrical connection unit 150 between the two, and a first flexible packaging structure is formed.

[0183] Remove the transparent carrier plate.

[0184] S800: Exposing at least a portion of the first external structure and at least a portion of the second external structure to the outside of the first flexible package.

[0185] It can be understood that a window can be opened on at least one of the first packaging layer and the second packaging layer before the first bonding surface is joined with the second bonding surface to form the first flexible packaging body, so that at least part of the first external structure and at least part of the second external structure are exposed to the first flexible packaging body through the window after the first bonding surface is joined with the second bonding surface to form the first flexible packaging body.

[0186] It is understandable that after the first bonding surface and the second bonding surface are bonded to form the first flexible package, a window may be opened on the first flexible package to expose at least part of the first external connection structure and at least part of the second external connection structure.

[0187] S900 : After step S700 is completed, a flexible adhesive layer 500 is formed on the surface of the first flexible packaging structure.

[0188] It is understandable that the flexible adhesive layer 500 may be formed on the surface of the first flexible packaging structure by chemical grafting.

[0189] Specifically, step S900 may include:

[0190] A nitrogen flow is used to dry the surface of the first flexible packaging structure to activate the surface of the first flexible packaging structure.

[0191] The first flexible packaging structure dried by nitrogen flow is immersed in a hydrophobic initiator for a predetermined time.

[0192] The first flexible packaging structure immersed in the hydrophobic initiator for a preset time is immersed in an aqueous solution of a hydrogel monomer containing a hydrophilic initiator and glycerol, and irradiated with ultraviolet light to graft the glycerol gel onto the surface of the first flexible packaging structure.

[0193] In this way, the process of preparing an ultrasonic sensor 1 with good flexibility is simple, efficient, and has a low manufacturing cost, which facilitates the preparation of an ultrasonic sensor 1 with a large-area piezoelectric unit 110 array.

[0194] FIG11 is a schematic diagram of another method for manufacturing an ultrasonic sensor provided in an embodiment of the present application.

[0195] As shown in FIG. 11 and referring to FIG. 9 , in some embodiments of the present application, to form an ultrasonic sensor 1 in which at least one side surface of the ultrasonic sensor 1 in the thickness direction is oblique to the thickness direction of at least one piezoelectric unit 110, step S700 may specifically include:

[0196] S720: Join the first bonding surface and the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit 110 is docked with the corresponding second contact electrode 130, and a second flexible packaging structure is formed, wherein the second flexible packaging structure includes a first flexible packaging body, a first conductive pattern, a second conductive pattern and the piezoelectric unit 110, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern and the piezoelectric unit 110.

[0197] Specifically, the first bonding surface is joined to the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit 110 is docked on the second electrical connection unit 150 set on the corresponding second contact electrode 130, so that the piezoelectric unit 110 and the corresponding second contact electrode 130 are docked through the second electrical connection unit 150 therebetween, and a second flexible packaging structure is formed, wherein the second flexible packaging structure includes a first flexible packaging body, a first conductive pattern, a second conductive pattern, a first electrical connection unit 140, a second electrical connection unit 150 and the piezoelectric unit 110, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern, the first electrical connection unit 140, the second electrical connection unit 150 and the piezoelectric unit 110.

[0198] S730: Place the second flexible packaging structure on a mold whose supporting surface is a bent surface for secondary packaging to form a first flexible packaging structure, so that at least one side surface of the first flexible packaging structure in its thickness direction is oblique to the thickness direction of at least one piezoelectric unit 110, and the first flexible packaging structure includes a second flexible packaging structure and a second flexible packaging body covering the second flexible packaging structure.

[0199] It can be understood that the first flexible package and the second flexible package can be made of the same material, so as to facilitate the bonding of the second flexible package to the surface of the first flexible package.

[0200] It is understood that when the second flexible packaging structure is not repackaged, the flexible packaging body 400 of the ultrasonic sensor 1 includes the first flexible packaging body. After the second flexible packaging structure is repackaged, the flexible packaging body 400 of the ultrasonic sensor 1 includes the first flexible packaging body and the second flexible packaging body.

[0201] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0202] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0203] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An ultrasonic sensor, characterized in that: It includes a piezoelectric module, a first connecting component, a second connecting component and a flexible packaging body; The piezoelectric module includes a piezoelectric unit and a first contact electrode and a second contact electrode corresponding to the piezoelectric unit; The piezoelectric unit includes a first surface and a second surface opposite to each other in a thickness direction thereof, the first contact electrode is fixedly connected to the first surface of the corresponding piezoelectric unit, the first contact electrode is electrically connected to the first surface of the corresponding piezoelectric unit, the second contact electrode is fixedly connected to the second surface of the corresponding piezoelectric unit, the second contact electrode is electrically connected to the second surface of the corresponding piezoelectric unit, and the flexible package covers the piezoelectric unit, the first contact electrode and the second contact electrode; The first connecting component and the second connecting component are arranged at intervals; The first connection component includes a first meandering conductor and a first external connection structure, one end of the first meandering conductor is connected to the first contact electrode, and the other end is connected to the first external connection structure, so that the first contact electrode is electrically connected to the first external connection structure through the first meandering conductor, at least a portion of the first meandering conductor is covered by the flexible packaging body, and the first external connection structure is at least partially exposed from the flexible packaging body; The second connecting component includes a second bent wire and a second external structure, one end of the second bent wire is connected to the second contact electrode, and the other end is connected to the second external structure, so that the second contact electrode is electrically connected to the second external structure through the second bent wire, at least a portion of the second bent wire is covered by the flexible packaging body, and the second external structure at least partially exposes the flexible packaging body.

2. The ultrasonic sensor according to claim 1, characterized in that: The piezoelectric module includes a plurality of piezoelectric units distributed at intervals; The first connection component includes a plurality of first bent wires corresponding to the piezoelectric units and spaced from each other, the first external connection structure includes a plurality of first pin electrodes corresponding to the piezoelectric units and spaced from each other, the first pin electrodes at least partially exposed from the flexible package, and the first contact electrodes electrically connected to each piezoelectric unit are respectively electrically connected to the corresponding first pin electrodes through the corresponding first bent wires; The second external connection structure includes a second pin electrode, the second pin electrode at least partially exposes the flexible package body, and all the second contact electrodes are electrically connected to the same second pin electrode through the second bent wire.

3. The ultrasonic sensor according to claim 2, characterized in that: It also includes a third bent wire, wherein the third bent wire is spaced apart from the first connecting component; All the second contact electrodes are electrically connected to each other through the third meandering wire, and one of the second contact electrodes is electrically connected to the second pin electrode through the second meandering wire, so that all the second contact electrodes are electrically connected to the same second pin electrode through the second meandering wire, and the flexible packaging body covers the third meandering wire.

4. The ultrasonic sensor according to any one of claims 1 to 3, characterized in that: The orthographic projection of the first connecting component in the thickness direction of the ultrasonic sensor and the orthographic projection of the second connecting component in the thickness direction of the ultrasonic sensor are distributed at intervals.

5. The ultrasonic sensor according to any one of claims 1 to 4, characterized in that: The piezoelectric module includes a first piezoelectric unit row and a second piezoelectric unit row arranged in parallel; The first piezoelectric unit row includes a plurality of piezoelectric units spaced apart along the extension direction thereof, and the second piezoelectric unit row includes a plurality of piezoelectric units spaced apart along the extension direction thereof; Along an extension direction of the first piezoelectric unit row, the piezoelectric units of the first piezoelectric unit row and the piezoelectric units of the second piezoelectric unit row are arranged alternately.

6. The ultrasonic sensor according to any one of claims 1 to 5, characterized in that: The piezoelectric module further includes a first electrical connection unit and a second electrical connection unit corresponding to the piezoelectric unit; The first electrical connection unit and the first contact electrode are sequentially stacked on the first surface of the corresponding piezoelectric unit, and the first surface of the piezoelectric unit is fixedly connected to the corresponding first contact electrode through the corresponding first electrical connection unit, so that the first surface of the piezoelectric unit is electrically connected to the corresponding first contact electrode through the corresponding first electrical connection unit; The second electrical connection unit and the second contact electrode are sequentially stacked on the second surface of the corresponding piezoelectric unit, and the second surface of the piezoelectric unit is joined and fixed to the corresponding second contact electrode through the corresponding second electrical connection unit, so that the second surface of the piezoelectric unit is electrically connected to the corresponding second contact electrode through the corresponding second electrical connection unit.

7. The ultrasonic sensor according to any one of claims 1 to 6, characterized in that: The flexible packaging body is provided with a flexible adhesive layer on at least one surface in the thickness direction thereof.

8. The ultrasonic sensor according to claim 7, characterized in that: The flexible adhesive layer is formed of hydrogel.

9. The ultrasonic sensor according to claim 7 or 8, characterized in that: The flexible adhesive layer is formed of a material that resists water loss.

10. The ultrasonic sensor according to any one of claims 7 to 9, characterized in that: The acoustic impedance of the flexible adhesive layer is smaller than the acoustic impedance of the flexible packaging body.

11. The ultrasonic sensor according to any one of claims 7 to 10, characterized in that: The flexible adhesive layer covers the flexible packaging body.

12. The ultrasonic sensor according to any one of claims 1 to 11, characterized in that: At least one side surface of the ultrasonic sensor in the thickness direction is oblique to the thickness direction of at least one of the piezoelectric units.

13. An ultrasonic testing device, characterized in that: The ultrasonic sensor comprises an excitation device and any one of claims 1 to 12, wherein the first external structure and the second external structure of the ultrasonic sensor are electrically connected to the excitation device.

14. A method for manufacturing an ultrasonic sensor, characterized in that: Includes steps: Prepare a first flexible encapsulation layer and a second flexible encapsulation layer respectively, wherein the first flexible encapsulation layer comprises a first bonding surface, and the second flexible encapsulation layer comprises a second bonding surface; A first conductive layer is provided on the first bonding surface, and the first conductive layer is processed to form a first conductive pattern on the first bonding surface, wherein the first conductive pattern includes a first contact electrode, a first meandering wire and a first external connection structure, the first contact electrode is connected to the first external connection structure through the first meandering wire, and the first contact electrode corresponds to the piezoelectric unit; A second conductive layer is provided on the second bonding surface, and the second conductive layer is processed to form a second conductive pattern on the second bonding surface, wherein the second conductive pattern includes a second contact electrode, a second bent wire, and a second external connection structure, the second contact electrode is connected to the second external connection structure through the second bent wire, and the second contact electrode corresponds to the piezoelectric unit; docking the piezoelectric unit onto the corresponding first contact electrode; After the piezoelectric unit is docked on the corresponding first contact electrode, the first bonding surface is joined with the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a first flexible packaging structure is formed, wherein the first flexible packaging structure includes a first flexible packaging body, the first conductive pattern, the second conductive pattern and the piezoelectric unit, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern and the piezoelectric unit; At least a portion of the first external structure and at least a portion of the second external structure are exposed outside the first flexible packaging body.

15. The method according to claim 14, characterized in that The first bonding surface is bonded with the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit is docked with the corresponding second contact electrode and a first flexible packaging structure is formed, which specifically includes: The first bonding surface is bonded to the second bonding surface to form a first flexible packaging body, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a second flexible packaging structure is formed, wherein the second flexible packaging structure includes the first flexible packaging body, the first conductive pattern, the second conductive pattern and the piezoelectric unit, and the first flexible packaging body covers the first conductive pattern, the second conductive pattern and the piezoelectric unit; The second flexible packaging structure is placed on a mold whose bearing surface is a bending surface for secondary packaging to form the first flexible packaging structure, so that at least one side surface of the first flexible packaging structure in its thickness direction is oblique to the thickness direction of at least one piezoelectric unit, and the first flexible packaging structure includes the second flexible packaging structure and a second flexible packaging body covering the second flexible packaging structure.

16. The method according to claim 14 or 15, characterized in that After forming the first flexible packaging structure, the method further comprises the steps of: A flexible adhesive layer is formed on the surface of the first flexible packaging structure.

Images