Ranging sensor and electronic device

Abstract

Provided in the present application are a ranging sensor and an electronic device. The ranging sensor comprises a substrate, a packaging housing, a first chip and a second chip. The packaging housing covers the substrate, and encloses a packaging space with the substrate, the packaging housing being provided with a light inlet and a light outlet. The first chip and the second chip are respectively a photosensitive chip and a light-emitting chip, and are both located in the packaging space and electrically connected to the substrate, the first chip being arranged on the substrate, and the second chip being arranged above the first chip. A photosensitive area of the photosensitive chip and a light-emitting area of the light-emitting chip are spaced apart along a surface of the first chip, the photosensitive area and the light inlet being arranged opposite to each other, and the light-emitting area and the light outlet being arranged opposite to each other.

Description

Distance measuring sensors and electronics

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 25, 2023, with application number 202310756894.6 and invention name “Ranging Sensor and Electronic Device”, the entire contents of which are incorporated by reference into the application. Technical Field

[0002] The present application relates to the field of sensor technology, and in particular to a distance measuring sensor and electronic equipment. Background Art

[0003] A TOF sensor, or time-of-flight (TOF) sensor, measures distance based on the time / phase difference between pulse emission and reception. It consists of two chips: a VCSEL (Very High-Definition Laser) light-emitting chip and an ASIC (Integrated Circuit) photosensitive chip. The VCSEL emits a circular array of laser pulses into the scene; upon reaching the target, they are reflected to the ASIC's photosensitive area, the SPAD. The ASIC contains signal processing circuitry that processes the received signal and outputs distance information. In a TOF sensor, both the photosensitive chip and the light-emitting chip are typically affixed to a substrate and encapsulated in a housing. This limits the product's package size primarily to the mounting position and size of the two chips, resulting in a larger package. Technical issues

[0004] The main purpose of this application is to provide a ranging sensor and an electronic device, aiming to reduce the package size of the ranging sensor. Technical Solutions

[0005] To achieve the above objectives, the present application proposes a ranging sensor comprising:

[0006] substrate;

[0007] A packaging shell, the packaging shell covers the substrate and forms a packaging space with the substrate, and the packaging shell is provided with a light inlet and a light outlet; and

[0008] A first chip and a second chip, wherein the first chip and the second chip are respectively a photosensitive chip and a light-emitting chip, and both are located in the packaging space and electrically connected to the substrate, the first chip is arranged on the substrate, and the second chip is arranged above the first chip;

[0009] The photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are spaced apart along the surface of the first chip, the photosensitive area is arranged opposite to the light inlet, and the light-emitting area is arranged opposite to the light outlet.

[0010] In an embodiment of the present application, the second chip and the first chip are spaced apart from each other in a height direction.

[0011] In one embodiment of the present application, the distance measuring sensor further includes a bracket, the bracket is disposed on the substrate, and the second chip is fixed to the bracket to be disposed above the first chip.

[0012] In one embodiment of the present application, the bracket is a circuit board and is electrically connected to the substrate, and the second chip is electrically connected to the bracket to be electrically connected to the substrate.

[0013] In one embodiment of the present application, the bracket includes a carrying portion and two supporting portions provided at both ends of the carrying portion, the carrying portion is arranged across the first chip, the second chip is fixed to the carrying portion, and the two supporting portions are supported on the substrate.

[0014] In one embodiment of the present application, the first chip is a photosensitive chip, the photosensitive area of ​​the first chip is provided with a first photosensitive part, the second chip is a light-emitting chip, and is arranged along the surface of the first chip at an interval from the first photosensitive part, and the first photosensitive part is used to sense reflected light.

[0015] In one embodiment of the present application, a retaining wall is provided in the packaging space, and the retaining wall is located between the second chip and the first photosensitive portion to separate the packaging space into a light entrance space connected to the light entrance and a light emitting space connected to the light exit, the second chip is located in the light emitting space, and the first photosensitive portion is located in the light entrance space.

[0016] In one embodiment of the present application, the photosensitive area is further provided with a second photosensitive portion, which is located between the first photosensitive portion and the second chip along the surface of the first chip, and the second photosensitive portion is used to sense the outgoing light of the second chip to detect the luminous state of the second chip.

[0017] In an embodiment of the present application, the retaining wall is fixedly connected to the packaging shell, and the retaining wall is bonded to the first chip by a sealant.

[0018] In one embodiment of the present application, the distance measuring sensor further includes a first filter, and the first filter is covered on the light entrance;

[0019] And / or, the distance measuring sensor further comprises a second filter, and the second filter is covered on the light outlet;

[0020] And / or, the inner surface of the packaging shell is black.

[0021] The present application further provides an electronic device, comprising the distance measuring sensor as described in any one of the above items, wherein the distance measuring sensor comprises:

[0022] substrate;

[0023] A packaging shell, the packaging shell covers the substrate and forms a packaging space with the substrate, and the packaging shell is provided with a light inlet and a light outlet; and

[0024] A first chip and a second chip, wherein the first chip and the second chip are respectively a photosensitive chip and a light-emitting chip, and both are located in the packaging space and electrically connected to the substrate, the first chip is arranged on the substrate, and the second chip is arranged above the first chip;

[0025] The photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are spaced apart along the surface of the first chip, the photosensitive area is arranged opposite to the light inlet, and the light-emitting area is arranged opposite to the light outlet. Beneficial effects

[0026] The technical solution of the present application enables the first chip and the second chip in the ranging sensor to be stacked in the height direction, and the space above the first chip is used to place the second chip, thereby avoiding placing the first chip and the second chip side by side on the surface of the substrate, improving the space utilization of the cavity above the first chip, reducing the size of the packaged ranging sensor, and being applicable to applications in more environments, thereby increasing the application value of the product; in this case, the photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are spaced apart along the surface of the first chip, avoiding the second chip blocking the light path of the first chip, thereby allowing the ranging sensor to emit light outward through the light outlet, and reflected light can also normally irradiate the photosensitive area from the light inlet, so that the ranging sensor can normally measure distance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0028] FIG1 is a cross-sectional view of an embodiment of a distance measuring sensor of the present application;

[0029] FIG2 is a structural diagram of an embodiment of a distance measuring sensor of the present application with the packaging shell removed.

[0030] Description of Figure Numbers:

[0031] Reference numerals Reference numerals 100 distance measuring sensor 31 photosensitive area 10 substrate 33 first photosensitive portion 20 packaging shell 35 second photosensitive portion 21 packaging space 40 second chip 211 light incident space 50 bracket 213 light emitting space 51 bearing portion 23 light incident port 53 supporting portion 25 light exit port 60 sealant 27 retaining wall 70 first filter 30 first chip 80 second filter

[0032] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. Modes for Carrying Out the Invention

[0033] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In this application, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0037] This application proposes a distance measurement sensor 100 .

[0038] With reference to FIG1 and FIG2 , in some embodiments of the present application, the distance measuring sensor 100 includes:

[0039] substrate 10;

[0040] A packaging shell 20 , the packaging shell 20 covers the substrate 10 and forms a packaging space 21 with the substrate 10 , and the packaging shell 20 is provided with a light inlet 23 and a light outlet 25 ; and

[0041] A first chip 30 and a second chip 40, wherein the first chip 30 and the second chip 40 are respectively a photosensitive chip and a light-emitting chip, and are both located in the packaging space 21 and electrically connected to the substrate 10, the first chip 30 being disposed on the substrate 10, and the second chip 40 being disposed above the first chip 30;

[0042] The photosensitive area 31 of the photosensitive chip and the light-emitting area of ​​the light-emitting chip are spaced apart along the surface of the first chip 30 . The photosensitive area 31 is opposite to the light inlet 23 , and the light-emitting area is opposite to the light outlet 25 .

[0043] The distance measuring sensor 100 proposed in this application refers to a TOF (Time of Flight) sensor, i.e., a time-of-flight distance measuring sensor 100, which is a sensor that measures distance based on the time / phase difference between pulse emission and reception. The sensor comprises a substrate 10 and a packaging shell 20, as well as a VCSEL light-emitting chip and an ASIC photosensitive chip that are electrically connected to the substrate 10 and are arranged in the packaging shell 20. A signal processing circuit is also provided in the ASIC chip. The substrate 10 and the packaging shell 20 enclose a packaging space 21, which can reduce the mixing of external light with the light emitted by the light-emitting chip or avoid the influence of external light on the sensitivity of the photosensitive chip to perceive light. , and can protect the light-emitting chip and the photosensitive chip; at the same time, a light inlet 23 and a light outlet 25 are provided on the packaging shell 20. With this arrangement, the light-emitting chip can emit a circular array of laser pulses into the scene through the light outlet 25; after reaching the target, the light is reflected and passes through the light inlet 23 into the packaging space 21 to the photosensitive area 31 of the photosensitive chip, and then the photosensitive chip can process the received signal and output the distance information; when the ranging sensor 100 is used, the substrate 10 can establish an electrical connection with the external circuit, can receive electrical energy and transmit signals.

[0044] In this embodiment, the first chip 30 can be either a photosensitive chip or a light-emitting chip, and the corresponding second chip 40 is either a light-emitting chip or a photosensitive chip. The second chip 40 is stacked above the second chip 40, meaning the light-emitting chip can be placed above the photosensitive chip, or the photosensitive chip can be placed above the light-emitting chip. The photosensitive area 31 and the light-emitting area need only be spaced apart along the surface of the first chip 30. This prevents the second chip 40 from blocking the photosensitive area 31 or the light-emitting area on the first chip 30, thereby preventing the second chip 40 from blocking the optical path of the first chip 30, causing the first chip 30 to be unable to sense light or to emit light. This arrangement utilizes the space above the first chip 30 for the second chip 40, preventing the first chip 30 and the second chip 40 from being placed side by side on the substrate 10, which would occupy a large space and result in a larger package size for the ranging sensor 100.

[0045] In addition, the second chip 40 is disposed above the first chip 30 by being fixed to the first chip 30, or by being fixed to the top inner wall of the package shell 20, or by being fixed by providing a bracket 50 as in the following embodiment so that the second chip 40 is located above the first chip 30, which is not limited here. Secondly, the electrical connection between the first chip 30 and the substrate 10 can be by fixing the first chip 30 to the substrate 10 and electrically connecting it to the substrate 10 by wire bonding, or by fixing the first chip 30 to the substrate 10 and electrically connecting it to the substrate 10 by a chip mounting method such as welding or bonding. The electrical connection between the second chip 40 and the substrate 10 can be by electrically connecting the second chip 40 to the substrate 10 by wire bonding, or by electrically connecting the second chip 40 to a bracket 50 formed by a circuit board as in the following embodiment, and then electrically connecting the bracket 50 to the substrate 10, thereby electrically connecting the second chip 40 to the substrate 10 and placing the second chip 40 above the first chip 30.

[0046] Therefore, the technical solution of the present application enables the first chip 30 and the second chip 40 in the ranging sensor 100 to be stacked in the height direction, and the second chip 40 is placed in the space above the first chip 30, thereby avoiding placing the first chip 30 and the second chip 40 side by side on the surface of the substrate 10, thereby improving the space utilization of the cavity above the first chip 30, reducing the size of the packaged ranging sensor 100, and being suitable for applications in more environments, thereby increasing the application value of the product; at this time, the photosensitive area 31 of the photosensitive chip and the light-emitting area of ​​the light-emitting chip are spaced apart along the surface of the first chip 30, thereby avoiding the second chip 40 blocking the light path of the first chip 30, thereby allowing the ranging sensor 100 to emit light outward through the light outlet 25, and the reflected light can also be normally irradiated from the light inlet 23 to the photosensitive area 31, so that the ranging sensor 100 can normally measure distance.

[0047] Referring to FIG. 1 , in some embodiments of the present application, the second chip 40 and the first chip 30 are spaced apart from each other in a height direction.

[0048] In this embodiment, the second chip 40 is disposed above the first chip 30 and spaced apart from the first chip 30 in the height direction. This prevents the second chip 40 from pressing on the first chip 30 and preventing mutual wear between the first chip 30 and the second chip 40, thereby improving the safety of the ranging sensor 100 packaging process and the product packaging yield. The second chip 40 can be made taller than the first chip 30 by fixing it to the top inner wall of the packaging shell 20 and then electrically connecting it to the substrate 10, or by providing a bracket 50 to fix the second chip 40 as in the following embodiment, which is not limited here.

[0049] 1 and 2 , in some embodiments of the present application, the distance measuring sensor 100 further includes a bracket 50 , which is disposed on the substrate 10 , and the second chip 40 is fixed to the bracket 50 to be disposed above the first chip 30 .

[0050] In this embodiment, a bracket 50 is provided in the distance measuring sensor 100. The bracket 50 is provided on the substrate 10 and is used to support and fix the second chip 40 so that the second chip 40 is provided above the first chip 30. In this case, the bracket 50 can be a column extending upward from the substrate 10, so that the side of the second chip 40 is connected to the column; it can also be a beam extending from the top of the column above the first chip 30, so that the second chip 40 is fixed to the beam; or it can be configured as a bridge-like structure spanning above the first chip 30 in the following embodiment, which is not limited here. Fixing the second chip 40 by the bracket 50 can prevent the first chip 30 from directly supporting the second chip 40, which may cause the first chip 30 and the second chip 40 to wear each other, thereby improving the safety of the packaging process. In addition, compared with fixing the second chip 40 to the packaging shell 20, fixing the second chip 40 to the bracket 50 provided on the substrate 10 facilitates the electrical connection between the second chip 40 and the substrate 10.

[0051] In some embodiments of the present application, the bracket 50 is a circuit board and is electrically connected to the substrate 10 , and the second chip 40 is electrically connected to the bracket 50 to be electrically connected to the substrate 10 .

[0052] In this embodiment, the bracket 50 is a circuit board, so that the second chip 40 is fixed on the bracket 50 and electrically connected to the circuit in the bracket 50. Then, when the bracket 50 is fixed to the substrate 10, the bracket 50 and the substrate 10 are electrically connected and fixed by welding or conductive adhesive bonding, so that the second chip 40 and the substrate 10 are electrically connected through the bracket 50; the electrical connection method between the second chip 40 and the bracket 50 can be to fix the second chip 40 to the bracket 50 and electrically connect it to the bracket 50 by wire bonding, or to set a solder pad on the bracket 50, and fix the second chip 40 to the bracket 50 and electrically connect it to the bracket 50 by chip mounting methods such as welding or conductive adhesive bonding; such a setting can avoid the problem of the wire being too long and easy to break when the wire bonding method is used between the second chip 40 and the substrate 10, thereby improving the fixing strength of the second chip 40 and the stability of the electrical connection between the second chip 40 and the substrate 10.

[0053] Please refer to Figure 1. In some embodiments of the present application, the bracket 50 includes a carrying portion 51 and two supporting portions 53 provided at both ends of the carrying portion 51. The carrying portion 51 is arranged across the first chip 30, the second chip 40 is fixed to the carrying portion 51, and the two supporting portions 53 are supported on the substrate 10.

[0054] In this embodiment, the bracket 50 is roughly in the form of a bridge structure, including a supporting portion 51 spanning above the first chip 30 and supporting portions 53 provided at both ends of the supporting portion 51 for fixed connection with the substrate 10. This arrangement allows the bracket 50 to be stably fixed on the substrate 10 through the two supporting portions 53, thereby improving the connection strength between the bracket 50 and the substrate 10, and allows the second chip 40 to be stably arranged above the first chip 30, thereby improving the stability of the overall structure.

[0055] Please refer to Figure 2. In some embodiments of the present application, the first chip 30 is a photosensitive chip, and the photosensitive area 31 of the first chip 30 is provided with a first photosensitive part 33. The second chip 40 is a light-emitting chip and is spaced apart from the first photosensitive part 33 along the surface of the first chip 30. The first photosensitive part 33 is used to sense reflected light.

[0056] In this embodiment, the first chip 30 is a photosensitive chip, and a first photosensitive portion 33 for sensing reflected light is provided on the photosensitive area 31 of the first chip 30. The second chip 40 is a light-emitting chip. This arrangement is such that the light-emitting area is located near the top of the packaging shell 20 and is higher than the first photosensitive portion 33. This arrangement avoids the situation where when the light-emitting area is lower than the first photosensitive portion 33, the light directly emitted from the light-emitting area passes through the height position of the first photosensitive portion 33 and is sensed by the first photosensitive portion 33, thereby affecting the measurement result. The light-emitting area is higher than the first photosensitive portion 33, which is beneficial to improving the measurement accuracy of the ranging sensor 100.

[0057] Please refer to Figure 1. In some embodiments of the present application, a retaining wall 27 is provided in the packaging space 21. The retaining wall 27 is located between the second chip 40 and the first photosensitive portion 33 to separate the packaging space 21 into a light entrance space 211 connected to the light entrance 23 and a light-emitting space 213 connected to the light exit 25. The second chip 40 is located in the light-emitting space 213, and the first photosensitive portion 33 is located in the light entrance space 211.

[0058] In this embodiment, a retaining wall 27 is provided in the packaging space 21. The retaining wall 27 is provided between the second chip 40 and the first photosensitive part 33, and is respectively connected to the packaging shell 20 and the first chip 30, thereby dividing the packaging space 21 into a light incident space 211 and a light emitting space 213. The light emitting space 213 is connected to the light outlet 25 and accommodates the second chip 40. The light incident space 211 is connected to the light outlet 23 and the first photosensitive part 33 is located in the light incident space 211. In this arrangement, the retaining wall 27 is used to separate the first photosensitive part 33 and the second chip 40, so as to prevent the light directly emitted by the second chip 40 from being sensed by the first photosensitive part 33 and affecting the measurement effect, and to prevent the light emitted by the ranging sensor 100 and the reflected light reflected to the ranging sensor 100 from interfering with each other, thereby improving the measurement accuracy of the ranging sensor 100.

[0059] In some embodiments, the photosensitive area 31 of the first chip 30 is further provided with a second photosensitive portion 35 for detecting the luminous state of the second chip 40. The second photosensitive portion 35 senses the light emitted by the second chip 40 to judge the luminous state of the second chip 40. At this time, the second photosensitive portion 35 is also located in the luminous space 213 to avoid the reflected light being sensed by the second photosensitive portion 35 and affecting the correct judgment of the luminous state of the second chip 40.

[0060] Please refer to Figure 2. In some embodiments of the present application, the photosensitive area 31 is further provided with a second photosensitive portion 35. The second photosensitive portion 35 is located between the first photosensitive portion 33 and the second chip 40 along the surface of the first chip 30. The second photosensitive portion 35 is used to sense the outgoing light of the second chip 40 to detect the luminous state of the second chip 40.

[0061] In this embodiment, a second photosensitive portion 35 is provided on the photosensitive area 31 of the first chip 30, and the second photosensitive portion 35 is closer to the second chip 40 than the first photosensitive portion 33. The second photosensitive portion 35 is used to sense the light intensity of the output light of the second chip 40, thereby judging the luminous state of the second chip 40 and performing feedback adjustment. If the light intensity is weak, the input power of the second chip 40 is increased to improve the luminous intensity of the second chip 40. If the light intensity is strong, the input power is adaptively reduced or other parameters are adjusted to ensure the stability of the luminescence of the second chip 40 and the measurement accuracy of the ranging sensor 100. In addition, the second photosensitive portion 35 is moved away from the area where the first sensing portion is located and close to the area where the second chip 40 is located, so as to minimize the influence of the reflected light incident on the first sensing portion on the photosensitive effect of the second photosensitive portion 35, so as to avoid affecting the correct judgment of the luminous state of the second chip 40; in some embodiments, the second chip 40 and the second photosensitive portion 35 can be isolated from the first photosensitive portion 33 by setting a retaining wall 27, thereby effectively avoiding mutual interference between the light emitted by the ranging sensor 100 and the reflected light reflected to the ranging sensor 100, so that both the first sensing portion and the second photosensitive portion 35 can accurately sense the target light, thereby improving the judgment and detection accuracy.

[0062] Referring to FIG. 1 , in some embodiments of the present application, the retaining wall 27 is fixedly connected to the packaging shell 20 , and the retaining wall 27 is bonded to the first chip 30 via a sealant 60 .

[0063] In this embodiment, the retaining wall 27 is arranged on the inner side of the packaging shell 20, and can be integrally arranged with the packaging shell 20 or fixedly connected to the packaging shell 20 by welding, bonding, etc., and the edge of the retaining wall 27 facing the surface of the first chip 30 is bonded and fixed to the first chip 30 by the sealant 60, so that the light-emitting space 213 and the light-entering space 211 are effectively isolated and sealed, avoiding the mutual transmission of light between the light-emitting space 213 and the light-entering space 211, which causes the emitted light and the reflected light to affect each other.

[0064] Referring to FIG. 1 , in some embodiments of the present application, the distance measuring sensor 100 further includes a first filter 70 , and the first filter 70 is disposed over the light entrance 23 ;

[0065] And / or, the distance measuring sensor 100 further includes a second filter 80 , and the second filter 80 is covered on the light outlet 25 .

[0066] In this embodiment, a first filter 70 is provided at the light inlet 23. The first filter 70 primarily serves to filter light and prevent contamination by foreign matter. The first filter 70 only passes laser light of the desired wavelength and does not allow light of other wavelengths to pass through. This ensures that the light incident on the packaging space 21 and sensed by the photosensitive chip is only the desired wavelength, thereby effectively reducing crosstalk of the optical signal received by the photosensitive chip, improving the perception accuracy of the photosensitive chip and the measurement accuracy of the ranging sensor 100. Furthermore, the light inlet 23 can be shielded to prevent foreign matter from entering the packaging space 21 through the light inlet 23 and affecting the transmission of light or causing damage to the substrate 10, the first chip 30, and the second chip 40 within the packaging space 21, thereby improving safety in use. In some embodiments, the first filter 70 is provided on the inner wall of the packaging shell 20 to protect the first filter 70.

[0067] Similarly, a second filter 80 is provided at the light outlet 25. The second filter 80 plays the role of filtering and preventing foreign matter from contaminating. The second filter 80 only passes the laser of the required wavelength band and does not allow the light of other wavelength bands to pass through. Therefore, among the light emitted by the light-emitting chip, only the light of the required wavelength band can pass through the second filter 80 and illuminate the target measurement object for reflection, thereby avoiding the presence of light of other wavelength bands in the reflected light, effectively reducing the crosstalk of the optical signal received by the photosensitive chip, improving the perception accuracy of the photosensitive chip and the measurement accuracy of the ranging sensor 100, and can also block the light outlet 25 to prevent foreign matter from entering the packaging space 21 from the light outlet 25 to affect the transmission of light or cause damage to the substrate 10, the first chip 30 and the second chip 40 in the packaging space 21, thereby improving the safety of use. In addition, in some embodiments, the second filter 80 is arranged on the inner wall of the packaging shell 20, which can protect the second filter 80, and in some embodiments, the photosensitive area 31 of the photosensitive chip is also provided with a second photosensitive portion 35 for detecting the luminous state of the light-emitting chip. The second photosensitive portion 35 senses the light emitted by the light-emitting chip to determine the luminous state of the second chip 40. At this time, the light emitted by the light-emitting chip can be reflected by the second filter 80 to the second photosensitive portion 35 and sensed by the second photosensitive portion 35, so that the second photosensitive portion 35 can determine the luminous state of the light-emitting chip.

[0068] In some embodiments of the present application, the inner surface of the packaging shell 20 is black.

[0069] In this embodiment, the inner surface of the packaging shell 20 is black. The packaging shell 20 can be made of a black material as a whole, such as a black resin material, or a black coating can be provided on at least the inner surface of the packaging shell 20 to reduce the reflective effect of the inner surface of the packaging shell 20, so as to prevent the light emitted by the light-emitting chip from being reflected by the inner surface of the packaging shell 20 in the packaging space 21 and irradiating the photosensitive area 31 of the photosensitive chip, thereby affecting the measurement effect.

[0070] This application also provides an electronic device including a distance measuring sensor 100 as described in any of the aforementioned embodiments. The specific structure of the distance measuring sensor 100 is referenced in any of the aforementioned embodiments and is not described in detail here. Since the electronic device provided in this application applies all the technical solutions of all of the aforementioned embodiments, it at least has all the beneficial effects brought about by all of the aforementioned technical solutions, which are not described in detail here.

[0071] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the contents of the present application specification and drawings under the application concept of the present application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A distance measuring sensor, wherein: The distance measuring sensor comprises: substrate; A packaging shell, the packaging shell covers the substrate and is enclosed with the substrate to form a packaging space, and the packaging shell is provided with a light inlet and a light outlet; and A first chip and a second chip, wherein the first chip and the second chip are a photosensitive chip and a light-emitting chip respectively, and are both located in the packaging space and electrically connected to the substrate, the first chip is arranged on the substrate, and the second chip is arranged above the first chip; The photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are arranged at intervals along the surface of the first chip, the photosensitive area is arranged opposite to the light inlet, and the light-emitting area is arranged opposite to the light outlet.

2. The distance measuring sensor according to claim 1, wherein: The second chip is spaced apart from the first chip along a height direction.

3. The distance measuring sensor according to claim 2, wherein: The distance measuring sensor further includes a bracket, the bracket is arranged on the substrate, and the second chip is fixed to the bracket to be arranged above the first chip.

4. The distance measuring sensor according to claim 3, wherein: The support is a circuit board and is electrically connected to the substrate, and the second chip is electrically connected to the support to be electrically connected to the substrate.

5. The distance measuring sensor according to claim 3, wherein: The bracket includes a bearing portion and two supporting portions arranged at two ends of the bearing portion, the bearing portion is arranged across the first chip, the second chip is fixed to the bearing portion, and the two supporting portions are supported on the substrate.

6. The distance measuring sensor according to claim 1, wherein: The first chip is a photosensitive chip, a photosensitive area of ​​the first chip is provided with a first photosensitive part, the second chip is a light-emitting chip, and is spaced apart from the first photosensitive part along the surface of the first chip, and the first photosensitive part is used to sense reflected light.

7. The distance measuring sensor according to claim 6, wherein: A retaining wall is provided in the packaging space, and the retaining wall is located between the second chip and the first photosensitive part to separate the packaging space into a light entrance space connected to the light entrance and a light emitting space connected to the light exit, the second chip is located in the light emitting space, and the first photosensitive part is located in the light entrance space.

8. The distance measuring sensor according to claim 6, wherein: The photosensitive area is further provided with a second photosensitive portion, which is located between the first photosensitive portion and the second chip along the surface of the first chip, and the second photosensitive portion is used to sense the emitted light of the second chip to detect the luminous state of the second chip.

9. The distance measuring sensor according to claim 7, wherein: The retaining wall is fixedly connected to the packaging shell, and the retaining wall is bonded to the first chip by a sealant.

10. The distance measuring sensor according to any one of claims 1 to 9, wherein: The distance measuring sensor further comprises a first filter, and the first filter is covered on the light entrance; And / or, the distance measuring sensor further comprises a second filter, and the second filter is covered on the light outlet; And / or, the inner surface of the packaging shell is black.

11. An electronic device, wherein: The electronic device comprises the distance measuring sensor as claimed in any one of claims 1 to 10.

Images