Upper electrode apparatus and semiconductor process device

Abstract

The present application discloses an upper electrode apparatus and a semiconductor process device. The upper electrode apparatus comprises: a gas inlet structure which is arranged to run through a chamber cover plate, is movably and sealedly connected to the chamber cover plate, and is used for introducing a process gas into a process chamber; a first adjustment mechanism comprising at least one first displacement guide assembly, the first displacement guide assembly being connected to the end of the gas inlet structure located outside a chamber body and used for guiding the gas inlet structure when the gas inlet structure moves in a first horizontal direction; and a second adjustment mechanism comprising at least one second displacement guide assembly, the second displacement guide assembly being connected the end of the gas inlet structure located outside the chamber body and used for guiding the gas inlet structure when the gas inlet structure moves in a second horizontal direction, wherein the first horizontal direction intersects with the second horizontal direction. The present application can improve the controllability and convenience of coaxiality adjustment between an upper electrode gas inlet structure and a wafer.

Description

Upper electrode device and semiconductor process equipment Technical Field

[0001] The present application belongs to the field of semiconductor equipment, and more specifically, relates to an upper electrode device and semiconductor process equipment. Background Art

[0002] In the manufacturing process of IC (integrated circuit), edge etcher is an indispensable equipment, because during the deposition and etching process of the wafer, polymers of different compositions and thicknesses will be produced at its edge. If these polymers are not removed in time, defects in the integrated circuit will be easily generated in the subsequent process, especially at the edge of the wafer. This is one of the main reasons for reducing the yield of equipment products. With the continuous development of high-end processes, it is particularly important to use edge etcher to improve product yield. Among them, the upper electrode structure of the machine is particularly critical, because only the edge of the wafer needs to be etched, and the coaxiality of the wafer and the center position of the upper gas outlet plate needs to be controllable. In this way, the purpose of selecting different etching areas can be achieved by adjusting the center position, and finally the uniformity of edge etching is achieved to prevent excessive etching of the wafer.

[0003] However, the current method for adjusting the coaxiality between the wafer and the gas outlet plate has problems such as poor controllability and complex operation.

[0004] Summary of the Invention

[0005] The purpose of this application is to propose an upper electrode device and semiconductor process equipment to improve the controllability and convenience of coaxiality adjustment between the upper electrode air intake structure and the wafer.

[0006] To achieve the above objectives, in a first aspect, the present application proposes an upper electrode device for use in a process chamber of a semiconductor process equipment, wherein the process chamber includes a chamber body and a chamber cover disposed on the chamber body, and the upper electrode device includes:

[0007] an air inlet structure, which is arranged through the chamber cover plate and is movably and sealingly connected to the chamber cover plate, and is used to introduce process gas into the process chamber;

[0008] a first adjustment mechanism comprising at least one first displacement guide assembly connected to an end of the air intake structure located outside the chamber body, for guiding the air intake structure when the air intake structure moves along a first horizontal direction;

[0009] The second adjustment mechanism includes at least one second displacement guide assembly, which is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects with the second horizontal direction.

[0010] In some embodiments, the chamber further comprises a movable bracket, wherein the movable bracket is disposed above the chamber cover, and the air intake structure is disposed on the movable bracket;

[0011] The first displacement guide assembly and the second displacement guide assembly are arranged on the movable bracket and are respectively located on two adjacent sides of the air intake structure.

[0012] In some embodiments, the first displacement guide assembly and the second displacement guide assembly are guide assemblies with the same structure;

[0013] The guide assembly includes a fixing member and a connecting member, the air intake structure includes a guide structure, the fixing member is arranged on the movable bracket, one end of the connecting member is slidably connected to the fixing member, and the other end is guided and matched with the guide structure.

[0014] In some embodiments, the fixing member includes a sliding bearing seat, and the connecting member includes a sliding shaft and a guide seat;

[0015] The sliding bearing seat is fixed to the movable bracket, and the sliding shaft is passed through the sliding bearing seat and is slidably connected to the sliding bearing seat;

[0016] One end of the guide seat is fixedly connected to the sliding shaft, and the other end of the guide seat is in guiding cooperation with the guide structure;

[0017] When the air intake structure moves along the first horizontal direction, the sliding shaft in the second displacement guide assembly slides along the first horizontal direction;

[0018] When the air intake structure moves along the second horizontal direction, the sliding shaft in the first displacement guide assembly slides along the second horizontal direction.

[0019] In some embodiments, the guide assembly further includes an adjusting screw, and a first threaded hole is provided at the top end of the sliding bearing seat, and the adjusting screw can cooperate with the first threaded hole to lock the sliding shaft.

[0020] In some embodiments, the one end of the guide seat is provided with a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion are respectively provided on both sides of the sliding bearing seat, the first connecting portion is connected to one end of the sliding shaft, and the second connecting portion is connected to the other end of the sliding shaft;

[0021] The distance between the first connecting portion and the second connecting portion is greater than the width of the sliding bearing seat.

[0022] In some embodiments, the air intake structure includes a backing plate, which is disposed on the movable bracket and detachably connected to the movable bracket;

[0023] The guide structure includes a blind hole opened on the side of the pad and a guide sleeve arranged in the blind hole. One end of the blind hole is provided with an annular groove, and a retaining spring is provided in the annular groove. The guide sleeve is fixed in the blind hole by the retaining spring, and the other end of the guide seat is inserted into the guide sleeve.

[0024] In some embodiments, the first adjustment mechanism further includes a first displacement adjustment component, and the second adjustment mechanism further includes a second displacement adjustment component, and the first displacement adjustment component and the second displacement adjustment component are disposed on the movable bracket;

[0025] The first displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the first horizontal direction;

[0026] The second displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the second horizontal direction.

[0027] In some embodiments, the first displacement adjustment component and the second displacement adjustment component are the same displacement adjustment member;

[0028] The displacement adjustment member includes a limit support and an adjustment rod;

[0029] The limiting support is fixedly connected to the movable bracket, and one end of the adjusting rod passes through the limiting support and is threadedly connected to the air intake structure;

[0030] The axial direction of the adjusting rod in the first displacement adjusting assembly is parallel to the first horizontal direction, and the limiting support is provided with a sliding groove extending along the second horizontal direction. The axial direction of the adjusting rod in the second displacement adjusting assembly is parallel to the second horizontal direction, and the limiting support is provided with a sliding groove extending along the first horizontal direction.

[0031] In some embodiments, a first displacement guide assembly is provided on both sides of the first displacement adjustment assembly, and a second displacement guide assembly is provided on both sides of the second displacement adjustment assembly.

[0032] In some embodiments, further comprising a first horizontal displacement measuring member and a second horizontal displacement measuring member;

[0033] The first horizontal displacement measuring member is disposed opposite to the first displacement guide assembly, and the second horizontal displacement measuring member is disposed opposite to the second displacement guide assembly;

[0034] The first horizontal displacement measuring member is used to monitor the displacement of the air intake structure in the first horizontal direction in real time;

[0035] The second horizontal displacement measuring element is used to monitor the displacement of the air intake structure in the second horizontal direction in real time.

[0036] In some embodiments, both the first horizontal displacement measuring element and the second horizontal displacement measuring element are laser displacement sensors.

[0037] In the second aspect, the present application proposes a semiconductor process equipment, comprising: a process chamber and an upper electrode device as described in any one of the first aspects, wherein a base for supporting a wafer is provided inside the process chamber, and a lifting drive mechanism is provided above the process chamber, and the lifting drive mechanism is used to drive the air intake structure to rise and fall.

[0038] The beneficial effects of this application are:

[0039] The upper electrode device of the present application realizes guidance of the horizontal displacement adjustment of the air intake junction through a first adjustment mechanism and a second adjustment mechanism, wherein the first adjustment mechanism includes at least one first displacement guide component, and the second adjustment mechanism includes at least one second displacement guide component. The first displacement guide component is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along the first horizontal direction. The second displacement guide component is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along the second horizontal direction. The first adjustment mechanism and the second adjustment mechanism can guide the air intake structure when the air intake structure moves horizontally, thereby ensuring that the air intake structure can accurately move in the first horizontal direction or the second horizontal direction, avoiding the rotation of the air intake structure along its axial direction, resulting in uncontrollable displacement adjustment, and thus accurately adjusting the coaxiality between the air intake structure and the wafer.

[0040] The system of the present application has other features and advantages, which will be apparent from the drawings and subsequent detailed descriptions incorporated herein, or will be described in detail in the drawings and subsequent detailed descriptions incorporated herein, which together serve to explain the specific principles of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and other objects, features and advantages of the present application will become more apparent through a more detailed description of exemplary embodiments of the present application in conjunction with the accompanying drawings, in which the same reference numerals generally represent the same components.

[0042] FIG. 1 shows a top view of an upper electrode of an edge etching chamber in the related art.

[0043] FIG2 shows a top view of a semiconductor process chamber according to embodiment 1 of the present application.

[0044] FIG. 3 shows a longitudinal sectional view along line BB in FIG. 2 .

[0045] FIG4 shows a partially enlarged view of the guide member in a top view.

[0046] FIG. 5 shows a longitudinal cross-sectional view along the AA direction in FIG. 4 .

[0047] FIG6 shows an enlarged view of a horizontal displacement adjustment member in a semiconductor process chamber according to Example 1 of the present application. DETAILED DESCRIPTION

[0048] The upper electrode structure of the edge etcher in the related art is shown in FIG1 , which includes a height gauge 4, an air intake structure, a movable bracket 7, and a connecting assembly 14. Among them, the air intake structure includes a pad, a horizontal adjustment plate 6, an air path connecting tube, and an air outlet plate. The pad is located below the horizontal adjustment plate 6 and is fixed to the horizontal adjustment plate 6 through the connecting assembly 14. The pad is fixed to the movable bracket 7 by a fastening screw 5. The movable bracket 7 drives the air intake structure to rise and fall through the pad. Due to errors in processing accuracy and installation, it is basically impossible for the wafer (base or lower electrode) in the process chamber to be coaxial with the air outlet plate in the initial state. Therefore, it is necessary to adjust the horizontal adjustment plate 6 through the first coaxial adjustment mechanism 17 and the second coaxial adjustment mechanism 18, thereby driving the air inlet and outlet plates to move in the horizontal direction.

[0049] The first coaxial adjustment mechanism 17 and the second coaxial adjustment mechanism 18 both include an adjustment knob and a limit support. The adjustment knob is connected to the pad by a thread. The limit support can limit the movement of the adjustment knob in the front and rear directions, but the adjustment knob can move in the left and right directions. Since the front and rear movement of the adjustment knob is limited, rotating the adjustment knob can drive the pad to move back and forth through the thread. The adjustment amount in the corresponding direction can be obtained by the change in the reading of the altimeter 4 fixed on the movable bracket 7 in the corresponding direction (the altimeter 4 has a retractable reading head, and the movement of the pad will press the reading head to retract. The altimeter is fixed on the movable bracket 7, and the reading head is in contact with the pad). Since the horizontal adjustment plate 6 and the pad are fastened together by the connecting assembly 14, the air outlet disk also undergoes the same displacement.

[0050] The coaxial adjustment mechanism of the related art has the following problems:

[0051] 1. The pad is a ring-shaped part, which is naturally placed on the movable bracket 7. Due to the lack of installation positioning guide reference of the pad and the gap between the thread transmission, the adjustment knobs in the X and Y directions are not perpendicular to each other. When adjusting the displacement, the pad may rotate around the Z direction (i.e., the axial direction of the air outlet disk), resulting in uncontrollable changes.

[0052] 2. When adjusting the displacement in the X direction, the displacement in the Y direction will also change due to the gap between the thread transmissions. In this case, the change in the Y direction needs to be restored. Unnecessary repeated actions prolong the maintenance time.

[0053] 3. During normal operation of the machine, the actual position of the gas outlet plate is constantly changing due to vibration and other reasons. However, the existing structure cannot monitor the status of the gas outlet plate in real time. When the cumulative change reaches a certain level, the etching uniformity will not meet the requirements, but it cannot be discovered and handled in time.

[0054] The present application provides a semiconductor processing chamber and semiconductor processing equipment that adds two horizontal guidance functions to the coaxial adjustment mechanism, improving the controllability of the displacement direction and preventing the gas outlet plate from rotating along its axial direction (Z direction). Furthermore, a real-time monitoring function for the gas outlet plate's center position is added to record the position change between the gas outlet plate and the wafer in real time.

[0055] The present application will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0056] Example 1

[0057] As shown in FIG2 and FIG3, an upper electrode device is applied to a process chamber of a semiconductor process equipment, wherein the process chamber includes a chamber body and a chamber cover 101 provided on the chamber body. The upper electrode device includes:

[0058] An air inlet structure is provided through the chamber cover plate 101 and is movably and sealedly connected to the chamber cover plate 101, for introducing process gas into the process chamber;

[0059] The first adjustment mechanism includes at least one first displacement guide assembly 201, which is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along the first horizontal direction;

[0060] The second adjustment mechanism includes at least one second displacement guide component 202, which is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects with the second horizontal direction.

[0061] Referring to Figure 3 , in this embodiment, the upper electrode assembly further comprises a movable support 102, which is positioned above the chamber cover 101. The air intake structure is mounted on the movable support 102. A first displacement guide assembly 201 and a second displacement guide assembly 202 are mounted on the movable support 102, positioned on adjacent sides of the air intake structure. The air intake structure comprises a backing plate 103, which is mounted on the movable support 102 and detachably connected thereto.

[0062] Specifically, a movable support 102 is positioned above the process chamber 101 and is used to drive the air intake structure upward and downward. The top of the movable support 102 comprises a support surface. A ring-shaped backing plate 103 is positioned on the support surface. A first displacement guide assembly 201 and a second displacement guide assembly 202 are both positioned on the support surface and are located on adjacent sides of the air intake structure. Preferably, the first horizontal direction is perpendicular to the second horizontal direction.

[0063] In this embodiment, the air intake structure also includes a horizontal adjustment plate 105, an air path connecting tube 106, an air outlet plate 107 and a bellows 108; the top edge of the horizontal adjustment plate 105 is provided with an annular connecting portion, the bottom surface of the annular connecting portion is overlapped and fixed with the top surface of the pad 103, and the horizontal adjustment plate 105 is coaxially arranged with the pad 103; as shown in Figure 2, the horizontal adjustment plate 105 and the pad 103 are fixedly connected by a connecting component 113.

[0064] The bottom of the gas outlet plate 107 extends into the chamber body, the top of the gas path connecting tube 106 is fixedly connected to the bottom end of the horizontal adjustment plate 105, and the bottom end of the gas path connecting tube 106 passes through the top wall of the process chamber 101 and is fixedly connected to the top of the gas outlet plate 107; the pad 103, the horizontal adjustment plate 105, the gas path connecting tube 106 and the gas outlet plate 107 are coaxially arranged; an air inlet 111 is provided in the center of the horizontal adjustment plate 105, a gas passage is provided in the gas path connecting tube 106, and an air duct is provided in the gas outlet plate 107, and the air inlet 111, the gas passage and the air duct are connected in sequence; the air duct includes an air inlet hole located in the top center of the gas outlet plate 107 and an air outlet hole located at the bottom edge of the gas outlet plate 107; the bellows 108 is arranged on the outside of the gas path connecting tube 106, the top of the bellows 108 is sealedly connected to the bottom end of the horizontal adjustment plate 105, and the bottom end of the bellows 108 is sealedly connected to the top wall of the process chamber 101.

[0065] A base 110 for supporting the wafer is provided inside the chamber body. The base 110 is located directly below the gas outlet plate 107 . A gas outlet 112 is provided at the bottom of the chamber body.

[0066] In this embodiment, the first displacement guide assembly 201 and the second displacement guide assembly 202 are guide assemblies with the same structure; the guide assembly includes a fixing part and a connecting part, the air intake structure includes a guide structure, the fixing part is arranged on the movable bracket 102, one end of the connecting part is slidably connected to the fixing part, and the other end is guided and cooperated with the guide structure.

[0067] Specifically, as shown in Figures 4 and 5, the guide assembly includes a fixing part and a connecting part, wherein the fixing part includes a sliding bearing seat 401, and the connecting part includes a sliding shaft 403 and a guide seat 402; the sliding bearing seat 401 is fixed to the support surface at the top of the movable bracket 102, and the sliding shaft 403 is passed through the sliding bearing seat 401 and is slidably connected to the sliding bearing seat 401; one end of the guide seat 402 is fixedly connected to the sliding shaft 403, and the other end of the guide seat 402 is guided by the guide structure on the side of the pad 103; when the air intake structure moves along the first horizontal direction, the sliding shaft 403 in the second displacement guide assembly slides along the first horizontal direction; when the air intake structure moves along the second horizontal direction, the sliding shaft 403 in the first displacement guide assembly slides along the second horizontal direction.

[0068] Preferably, a first connection portion and a second connection portion are provided at one end of the guide seat 402. The first connection portion and the second connection portion are respectively provided on either side of the sliding bearing seat 401. The first connection portion is connected to one end of the sliding shaft 403, and the second connection portion is connected to the other end of the sliding shaft 403. The distance between the first connection portion and the second connection portion is greater than the width of the sliding bearing seat 401. Compared to a single-end connection, the connection between the first and second connection portions can prevent shaking of the guide seat and improve the stability of the guiding process.

[0069] The air intake structure includes a blind hole opened on the side of the backing plate 103 and a guide sleeve 404 arranged in the blind hole. An annular groove is provided at one end of the blind hole, and a retaining spring 405 is provided in the annular groove. The guide sleeve 404 is fixed in the blind hole by the retaining spring 405.

[0070] A guide column is provided at the other end of the guide seat 402, and the axial direction of the guide column is perpendicular to the sliding shaft 403; a blind hole corresponding to the guide column is provided on the side of the pad 103, and the guide sleeve 404 is fixed in the circular hole by a retaining ring 405, and the guide column is inserted into the guide sleeve 404.

[0071] The axial direction of the guide column in the first displacement guide assembly 201 is parallel to the first direction, and the sliding shaft 403 in the first displacement guide assembly 201 can slide along the second horizontal direction in the sliding bearing seat 401; the axial direction of the guide column in the second displacement guide assembly 202 is parallel to the second direction, and the sliding shaft 403 in the second displacement guide assembly 202 can slide along the first horizontal direction in the sliding bearing seat 401.

[0072] The horizontal displacement guide member adopts a guide sleeve 404 to cooperate with the guide column on the guide seat 402, and there can be a very small fitting gap between the two; at the same time, a sliding shaft 403 is slidably matched with the sliding bearing seat 401, and there can also be a very small fitting gap between the two, thereby improving the installation accuracy of the moving parts and reducing the friction loss inside the coaxial adjustment structure.

[0073] Preferably, the first adjustment mechanism in this embodiment includes two first displacement guide assemblies 201 disposed on the same side of the mobile bracket, and the second adjustment mechanism includes two second displacement guide assemblies 202 disposed on the other side of the mobile bracket adjacent to the first adjustment mechanism. Using two horizontal displacement guides on each side can improve the support stability of the pad 103 during translational sliding.

[0074] As shown in FIG. 5 , in this embodiment, the guide assembly further includes an adjusting screw 406 . A first threaded hole is provided at the top of the sliding bearing seat 401 . The adjusting screw 406 can cooperate with the first threaded hole to lock the sliding shaft 403 .

[0075] For example, when adjusting the displacement of the air outlet plate 107 in the first horizontal direction, the adjustment screws 406 of the two first displacement guide components 201 can be tightened first to lock the sliding shaft 403 of the first displacement guide component 201, thereby preventing the guide seat 402 from sliding relative to the sliding bearing seat 401 in the second horizontal direction, and then the adjustment screws 406 of the two second displacement guide components 202 are loosened, and then the knob of the first horizontal displacement adjustment member 301 located on the first side is rotated, so that the guide seats 402 in the two first displacement guide components 201 can be guided along the first direction, and the guide seats 402 and sliding shafts 403 of the two second displacement guide components 202 slide on the sliding bearing seat 401, and the maximum sliding distance is twice that of a shown in Figure 4.

[0076] In this embodiment, the first adjustment mechanism also includes a first displacement adjustment component 301, and the second adjustment mechanism also includes a second displacement adjustment component 302. The first displacement adjustment component 301 and the second displacement adjustment component 302 are arranged on the movable bracket 102; the first displacement adjustment component 301 is connected to the air intake structure and is used to drive the air intake structure to move along the first horizontal direction; the second displacement adjustment component 302 is connected to the air intake structure and is used to drive the air intake structure to move along the second horizontal direction.

[0077] As shown in Figure 6, in this embodiment, the first displacement adjustment component 301 and the second displacement adjustment component 302 are the same displacement adjustment parts; the displacement adjustment parts include a limit support 501 and an adjustment rod 502; the limit support 501 is fixedly connected to the movable bracket 102, and one end of the adjustment rod 502 passes through the limit support 501 and is threadedly connected to the intake structure; the axial direction of the adjustment rod 502 in the first displacement adjustment component 301 is parallel to the first horizontal direction, and the limit support 501 is provided with a slide groove extending along the second horizontal direction; the axial direction of the adjustment rod 502 in the second displacement adjustment component 302 is parallel to the second horizontal direction, and the limit support 501 is provided with a slide groove extending along the first horizontal direction.

[0078] Specifically, the limiting support 501 is fixed to the support surface of the movable bracket 102. A sliding groove is provided within the limiting support 501. An annular protrusion is provided in the center of the adjustment rod 502, which is disposed within the sliding groove. A handle is provided at one end of the adjustment rod 502, and a thread is provided at the other end of the adjustment rod 502. A corresponding threaded hole is provided on the side of the backing plate 103. The adjusting rod 502 is threadedly connected to the backing plate 103 via the thread of the adjusting rod 502 and the threaded hole. The backing plate 103 can be adjusted in the horizontal displacement direction by rotating the adjusting rod 502. The axial direction of the adjustment rod 502 in the first displacement adjustment member 301 is parallel to the first horizontal direction, the sliding groove in the limiting support 501 extends along the second horizontal direction, the axial direction of the adjustment rod 502 in the second displacement adjustment member 302 is parallel to the second horizontal direction, and the sliding groove in the limiting support 501 extends along the first horizontal direction. When the adjusting rod 502 in the first displacement adjusting member 301 is rotated, the air intake structure moves along the first horizontal direction, and at this time the adjusting rod 502 in the second displacement adjusting member 302 can slide along the first horizontal direction in the sliding groove of the limiting support 501; when the adjusting rod 502 in the second displacement adjusting member 302 is rotated, the air intake structure moves along the second horizontal direction, and at this time the adjusting rod 502 in the first displacement adjusting member 301 can slide along the first horizontal direction in the sliding groove of the limiting support 501.

[0079] In other embodiments, the displacement adjustment member can also be implemented in other ways, for example, a slide groove is set on the support surface, the limit support 501 is set in the slide groove, and a bearing is set in the limit support 501, and the adjustment rod 502 is passed through the bearing, that is, the adjustment rod 502 can rotate in the limit support 501, and the limit support 501 can slide on the support surface along the axial direction perpendicular to the adjustment rod 501.

[0080] Preferably, in this embodiment, a first displacement guide assembly 201 is provided on both sides of the first displacement adjustment assembly 301 , and a second displacement guide assembly 202 is provided on both sides of the second displacement adjustment assembly 302 .

[0081] In this embodiment, the upper electrode assembly further includes a first horizontal displacement measuring member 303 and a second horizontal displacement measuring member 304. The first horizontal displacement measuring member 303 is disposed opposite the first displacement guide assembly 201, and the second horizontal displacement measuring member 304 is disposed opposite the second displacement guide assembly 202. The first horizontal displacement measuring member 303 is used to monitor the displacement of the air intake structure in a first horizontal direction in real time; the second horizontal displacement measuring member 304 is used to monitor the displacement of the air intake structure in a second horizontal direction in real time. Preferably, both the first horizontal displacement measuring member 303 and the second horizontal displacement measuring member 304 are laser displacement sensors.

[0082] Specifically, the laser displacement sensor can be connected to the host computer. By using two laser sensors to collect the movement of the horizontal adjustment plate 105 in the first horizontal direction and the second horizontal direction in real time and uploading it to the host computer, the center position of the air outlet disk 107 can be dynamically understood by calculating and reading the displacement change during the adjustment process, or recording the calculated change during monitoring.

[0083] Compared to displacement measurement methods used in related arts, replacing the altimeter with a laser displacement sensor, similarly fixed to mobile bracket 102, allows real-time acquisition of displacement data in the first and second horizontal directions. The displacement change during adjustment can also be calculated and read, or the calculated change can be recorded during monitoring, thereby dynamically determining the center position of air outlet disk 107. It should be noted that the specific location of the laser displacement sensor is not limited in this embodiment of the present application; as long as it can detect displacement changes, it will suffice.

[0084] Taking the etcher as an example, during the process debugging stage, the machine will initially etch a wafer, and obtain the offset of the gas outlet plate 107 by calculating the edge etching morphology data. After changing the position of the gas outlet plate 107, the latest process results are used to determine whether the relative positions of the gas outlet plate 107 and the wafer on the base 110 are coaxial. The real-time monitoring function of the center position of the gas outlet plate 107 is added, and the relative position change of the two can be recorded in real time.

[0085] In summary, the upper electrode device of this embodiment has the following advantages:

[0086] 1. Adding a guide mechanism to the coaxial adjustment mechanism makes the unidirectional adjustment more stable and avoids other rotational movements except the linear displacement in the first and second horizontal directions;

[0087] 2. Improve the installation accuracy of the coaxial adjustment mechanism and reduce internal friction loss;

[0088] 3. Added the real-time monitoring function of the center position of the gas outlet plate 107, so as to timely understand the coaxiality of the gas outlet plate 107 and the wafer and avoid over-engraving of products.

[0089] 4. One-way adjustment is more stable and effectively reduces the maintenance time of coaxial adjustment.

[0090] Example 2

[0091] 3 , this embodiment provides a semiconductor process equipment, including: a process chamber and the upper electrode device described in Example 1. A base for supporting a wafer is provided inside the process chamber, and a lifting drive mechanism is provided above the process chamber. The lifting drive mechanism is used to drive the air intake structure to rise and fall.

[0092] Specifically, the lifting drive mechanism drives the air intake structure to lift and lower through the movable bracket 102. The power input of the lifting drive can be transmitted by the screw structure. The specific lifting drive can include a support fixed on the top surface of the chamber cover 101. The lower end of the support is fixed with a screw, so that the screw can only perform rotational motion. The screw nut is fixed on the movable bracket 102, thereby finally realizing the lifting and lowering of the air intake structure.

[0093] While various embodiments of the present application have been described above, the above description is intended to be illustrative, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. An upper electrode device, applied to a process chamber of a semiconductor process equipment, wherein: The process chamber comprises a chamber body and a chamber cover plate disposed on the chamber body, wherein the upper electrode device comprises: An air inlet structure, which is arranged through the chamber cover plate and is movably and hermetically connected to the chamber cover plate, and is used to introduce process gas into the process chamber; A first adjustment mechanism includes at least one first displacement guide assembly, wherein the first displacement guide assembly is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along a first horizontal direction; The second adjustment mechanism includes at least one second displacement guide component, which is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects with the second horizontal direction.

2. The upper electrode device according to claim 1, characterized in that: It also includes a movable bracket, which is arranged above the chamber cover plate, and the air intake structure is arranged on the movable bracket; The first displacement guide assembly and the second displacement guide assembly are arranged on the movable bracket and are respectively located on two adjacent sides of the air intake structure.

3. The upper electrode device according to claim 2, characterized in that: The first displacement guide assembly and the second displacement guide assembly are guide assemblies with the same structure; The guide assembly includes a fixing member and a connecting member, the air intake structure includes a guide structure, the fixing member is arranged on the movable bracket, one end of the connecting member is slidably connected to the fixing member, and the other end is guided and matched with the guide structure.

4. The upper electrode device according to claim 3, characterized in that: The fixing member includes a sliding bearing seat, and the connecting member includes a sliding shaft and a guide seat; The sliding bearing seat is fixed to the movable bracket, and the sliding shaft is inserted into the sliding bearing seat and is slidably connected to the sliding bearing seat; One end of the guide seat is fixedly connected to the sliding shaft, and the other end of the guide seat is in guiding cooperation with the guide structure; When the air intake structure moves along the first horizontal direction, the sliding shaft in the second displacement guide assembly slides along the first horizontal direction; When the air intake structure moves along the second horizontal direction, the sliding shaft in the first displacement guide assembly slides along the second horizontal direction.

5. The upper electrode device according to claim 4, characterized in that: The guide assembly also includes an adjusting top screw. The top end of the sliding bearing seat is provided with a first threaded hole. The adjusting top screw can cooperate with the first threaded hole to lock the sliding shaft.

6. The upper electrode device according to claim 4, characterized in that: The one end of the guide seat is provided with a first connection part and a second connection part, the first connection part and the second connection part are respectively arranged on both sides of the sliding bearing seat, the first connection part is connected to one end of the sliding shaft, and the second connection part is connected to the other end of the sliding shaft; The distance between the first connecting portion and the second connecting portion is greater than the width of the sliding bearing seat.

7. The upper electrode device according to claim 4, characterized in that: The air intake structure comprises a pad, which is arranged on the movable bracket and is detachably connected to the movable bracket; The guide structure comprises a blind hole opened on the side of the backing plate and a guide sleeve arranged in the blind hole, one end of the blind hole is provided with an annular groove, a retaining spring is arranged in the annular groove, the guide sleeve is fixed in the blind hole by the retaining spring, and the other end of the guide seat is inserted into the In the guide bushing.

8. The upper electrode device according to claim 2, characterized in that: The first adjustment mechanism further includes a first displacement adjustment component, and the second adjustment mechanism further includes a second displacement adjustment component, and the first displacement adjustment component and the second displacement adjustment component are arranged on the movable bracket; The first displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the first horizontal direction; The second displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the second horizontal direction.

9. The upper electrode device according to claim 8, characterized in that: The first displacement adjustment component and the second displacement adjustment component are the same displacement adjustment member; The displacement adjustment member includes a limit support and an adjustment rod; The limit support is fixedly connected to the movable bracket, and one end of the adjustment rod passes through the limit support and is threadedly connected to the air intake structure; The axial direction of the adjusting rod in the first displacement adjusting assembly is parallel to the first horizontal direction, and the limiting support is provided with a sliding groove extending along the second horizontal direction. The axial direction of the adjusting rod in the second displacement adjusting assembly is parallel to the second horizontal direction, and the limiting support is provided with a sliding groove extending along the first horizontal direction.

10. The upper electrode device according to claim 8, characterized in that: A first displacement guide assembly is respectively provided on both sides of the first displacement adjustment assembly, and a second displacement guide assembly is respectively provided on both sides of the second displacement adjustment assembly.

11. The upper electrode device according to claim 1, characterized in that: Also included is a first horizontal displacement measuring member and a second horizontal displacement measuring member; The first horizontal displacement measuring member is arranged opposite to the first displacement guiding assembly, and the second The horizontal displacement measuring member is arranged opposite to the second displacement guiding assembly; The first horizontal displacement measuring member is used to monitor the displacement of the air intake structure in the first horizontal direction in real time; The second horizontal displacement measuring device is used to monitor the displacement of the air intake structure in the second horizontal direction in real time.

12. The upper electrode device according to claim 11, characterized in that: The first horizontal displacement measuring element and the second horizontal displacement measuring element are both laser displacement sensors.

13. A semiconductor process equipment, characterized in that: include: A process chamber and an upper electrode device as described in any one of claims 1-12, wherein a base for supporting a wafer is provided inside the process chamber, and a lifting drive mechanism is provided above the process chamber, and the lifting drive mechanism is used to drive the air intake structure to rise and fall.

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