Method for measuring rotation center of stage

Abstract

Provided is a method for measuring the rotation center of a stage (20) used in a three-dimensional mounting device (12) and capable of rotating while in a state of supporting a mounting substrate (1), the method including: rotating a stage (20), on which a jig substrate (1) is supported, to each of a plurality of angles; detecting the position of a portion of the surface of the jig substrate (1) at each of the plurality of angles; and calculating the position of the rotation center of the stage (20) with respect to the origin of a mechanical coordinate system (Xm, Ym, Zm) defined in the three-dimensional mounting device (12) on the basis of the result of detecting the positions of the portion.

Description

How to measure the center of rotation of a stage

[0001] The present disclosure relates to a method for measuring the center of rotation of a stage used in a three-dimensional mounting device.

[0002] 2. Description of the Related Art In the technical field of mounting devices, a three-dimensional mounting device that mounts components on a three-dimensional substrate, such as that disclosed in Patent Document 1, is known.

[0003] International Publication No. 2018 / 207313

[0004] The three-dimensional mounting device has a swingable stage (swing unit). The three-dimensional mounting device mounts components by tilting the three-dimensional substrate (mounting substrate) on the stage so that the component mounting position on the surface of the substrate is kept horizontal. To mount components, the mounting head is moved to an XYZ position that takes into account the rotation angle of the stage. Therefore, the XYZ movement amount of the mounting position is calculated from the rotation angle of the stage, and this is added to the XYZ position of the mounting position for correction. However, if the position of the center of rotation of the stage is calculated as the design position, there is a possibility that the XYZ position will contain errors, making it impossible to determine the accurate mounting position. Therefore, a means is needed to accurately determine the position of the center of rotation of the stage.

[0005] The present disclosure aims to accurately measure the position of the center of rotation of a stage used in a three-dimensional mounting device.

[0006] According to the method for measuring the rotation center of a stage disclosed herein, there is provided a method for measuring the rotation center of a stage used in a three-dimensional mounting device and capable of rotating while supporting a mounting substrate, the method including rotating the stage supporting the jig substrate at each of a plurality of angles, detecting the position of a portion of the surface of the jig substrate at each of the plurality of angles, and calculating the position of the rotation center of the stage relative to the origin of a mechanical coordinate system defined in the three-dimensional mounting device based on the detection results of the position of the portion.

[0007] According to the present disclosure, the position of the rotation center of the stage in a three-dimensional mounting device can be accurately determined.

[0008] FIG. 1 is a perspective view showing a substrate and a component according to the first embodiment. FIG. 2 is a perspective view showing a pallet that holds a substrate according to the first embodiment. FIG. 3 is an exploded perspective view showing a substrate and a pallet according to the first embodiment. FIG. 4 is a diagram schematically showing an electronic device production system according to the first embodiment. FIG. 5 is a plan view schematically showing a mounting apparatus according to the first embodiment. FIG. 6 is a perspective view showing a pallet and a stage according to the first embodiment. FIG. 7 is an exploded perspective view showing a pallet and a stage according to the first embodiment. FIG. 8 is a diagram schematically showing a mounting head according to the first embodiment. FIG. 9 is a diagram for explaining substrate data and NC data according to the first embodiment. FIG. 10 is a diagram for explaining substrate data and NC data according to the first embodiment. FIG. 11 is a diagram for explaining a method for measuring the rotation center of a stage according to the first embodiment. FIG. 12 is a block diagram showing a processing device 16 used to measure the rotation center of a stage according to the first embodiment. FIG. 13 is a diagram showing the operation of the mounting apparatus when measuring the rotation center of a stage according to the first embodiment. FIG. 14 is a diagram showing the operation of the mounting apparatus when measuring the rotation center of a stage according to the first embodiment. FIG. 15 is a diagram showing the operation of the mounting apparatus when measuring the rotation center of a stage according to the first embodiment. FIG. 16 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. FIG. 17 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. FIG. 18 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. FIG. 19 is a diagram for explaining a method for measuring the center of rotation of a stage according to the second embodiment. FIG. 20 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the second embodiment. FIG. 21 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the second embodiment. FIG. 22 is a diagram showing the coordinates of a first portion and a second portion according to the second embodiment. FIG. 23 is a diagram for explaining a method for measuring the center of rotation of a stage according to the third embodiment.

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ Cartesian coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis of the predetermined plane, which is perpendicular to the X axis, is defined as the Y-axis direction. The direction parallel to the Z axis, which is perpendicular to the predetermined plane, is defined as the Z-axis direction. The direction of rotation or tilt around the X-axis direction is defined as the θX direction. The direction of rotation or tilt around the Y axis direction is defined as the θY direction. The direction of rotation or tilt around the Z axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the −Z side is the lower side. Note that the predetermined plane may be inclined with respect to the horizontal plane. Furthermore, in the embodiments, the predetermined plane including the X axis and the Y axis is referred to as the XY plane as appropriate.

[0010] First Embodiment A first embodiment will be described.

[0011] <Substrate> Fig. 1 is a perspective view showing a substrate 1 and a component 2 according to the first embodiment. The substrate 1 is a mounting substrate on which the component 2 is mounted. In the first embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In the first embodiment, the substrate 1 is formed by in-mold molding technology. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may be a chip-type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0014] <Pallet> Fig. 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to the first embodiment. Fig. 3 is an exploded perspective view showing the substrate 1 and pallet 3 according to the first embodiment. The pallet 3 holds the substrate 1. In the first embodiment, the substrate 1 is handled while held by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1 and a clamp mechanism 5 that fixes the substrate 1.

[0015] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0016] The base portion 4A is formed in a plate shape with a plurality of openings. Two holes 4D are formed in the base portion 4A. The holes 4D penetrate the top and bottom surfaces of the base portion 4A.

[0017] The guard portion 4B is formed to extend in the X-axis direction. A pair of guard portions 4B is provided. The pair of guard portions 4B are spaced apart in the Y-axis direction. One guard portion 4B is arranged to protrude toward the +Z side from the +Y side end of the upper surface of the base portion 4A. The other guard portion 4B is arranged to protrude toward the +Z side from the -Y side end of the upper surface of the base portion 4A.

[0018] Each of the multiple pin portions 4C is arranged so as to protrude from the upper surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the +Y side of the substrate 1. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the -Y side of the substrate 1.

[0019] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support parts 5A that support the end of the substrate 1 on the -X side, and a movable part 5B that supports the end of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, thereby sandwiching the substrate 1 between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0020] <Production System> Fig. 4 is a diagram schematically illustrating an electronic device production system 10 according to the first embodiment. As shown in Fig. 4, the production system 10 includes a mounting device 12, a preheating device 13, and a laser irradiation device 14. The mounting device 12, the preheating device 13, and the laser irradiation device 14 form an electronic device production line.

[0021] The mounting device 12 mounts the components 2 on the substrate 1. At least one mounting device 12 is provided in the production line. However, a plurality of mounting devices 12 may be provided.

[0022] 5 is a plan view schematically illustrating the mounting apparatus 12 according to the first embodiment. The mounting apparatus 12 includes a base member 18, a transport device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a board camera 25, a height sensor 26, a head moving device 27, and a chamber 29.

[0023] The base member 18 supports the transport device 19 , the stage 20 , the stage moving device 21 , the component supply device 22 , the mounting head 24 , and the head moving device 27 .

[0024] The transport device 19 transports the pallet 3 holding the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 to a processing position of the mounting device 12. The processing position is defined by the transport path of the transport device 19.

[0025] The conveying device 19 has a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

[0026] The guide member 19B is formed to extend in the X-axis direction. A pair of guide members 19B is provided. The pair of guide members 19B are spaced apart from each other in the Y-axis direction. One guide member 19B is disposed on the +Y side of the pallet 3. The other guide member 19B is disposed on the -Y side of the pallet 3.

[0027] The conveyor belt 19A is formed in a ring shape. A pair of conveyor belts 19A is provided. The conveyor belts 19A are supported by guide members 19B via a drive pulley and a driven pulley. The conveyor belts 19A are looped around the drive pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0028] Of the pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the underside of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the underside of the pallet 3. The drive pulley is rotated by a drive motor (not shown), thereby conveying the pallet 3 in the X-axis direction.

[0029] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

[0030] Fig. 6 is a perspective view showing the pallet 3 and the stage 20 according to the embodiment. Fig. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0031] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 from the -Z side when it is transported to the processing position. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into the holes 4D of the pallet 3. The stage 20 and the pallet 3 are positioned by inserting the positioning members 20A into the holes 4D from the -Z side of the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hooked onto the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hooked onto the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0032] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0033] After the pallet 3 is transported to the processing position by the transport device 19, the +Y side guide member 19B moves in the +Y direction away from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. When the +Y side guide member 19B moves in the Y axis direction away from the other guide member 19B, support of the pallet 3 by the transport belt 19A is released. When support of the pallet 3 by the transport belt 19A is released and the stage 20 moves in the +Z direction, the pallet 3 is transferred from the transport device 19 to the stage 20. With the pallet 3 supported on the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is centered between the two guide members 19B, making it possible to move the stage 20 in each of the Z axis direction, the θX direction, and the θY direction.

[0034] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 is on the transport belt 19A, and the guide member 19B on the +Y side moves in the -Y side until the other side of the pallet 3 is on the transport belt 19A. After the hook provided at the upper end of the positioning member 20A is released from fixation, the stage 20 moves in the -Z direction by the stage movement device 21. As a result, support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transport belt 19A.

[0035] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supply device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supply device 22 is disposed on the -Y side of the conveying device 19. Note that the component supply devices 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0036] The mounting head 24 mounts components 2 on the board 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0037] The head moving device 27 moves the mounting head 24. In this embodiment, the head moving device 27 moves the mounting head 24 in both the X-axis direction and the Y-axis direction. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. Operation of the X-axis moving device 27X causes the mounting head 24 to move in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. Operation of the Y-axis moving device 27Y causes the X-axis moving device 27X to move in the Y-axis direction, thereby moving the mounting head 24 in the Y-axis direction.

[0038] FIG. 8 is a schematic diagram showing a mounting head 24 according to the first embodiment. As shown in FIG. 8 , the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is formed at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 in contact with the component 2, a suction operation is performed through the opening provided at the lower end of the nozzle 23, thereby suction-holding the component 2 at the lower end of the nozzle 23. When the suction operation through the opening is released, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that clamps and holds the component 2.

[0039] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in both the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to the plurality of shafts 23A, respectively. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to the plurality of shafts 23A, respectively. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0040] The nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by the head moving device 27 and the nozzle moving device 28. By moving the nozzle 23, the component 2 held by the nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0041] The board camera 25 images the board 1. In the first embodiment, the board camera 25 images the surface of the board 1 from the +Z side of the board 1. The board camera 25 is provided on the mounting head 24. The board camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The board camera 25 can image alignment marks provided on the surface of the board 1.

[0042] The height sensor 26 detects a height indicating the position of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is provided on the mounting head 24. The height sensor 26 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. In the embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 can detect the distance from the mounting head 24 to the substrate 1 by irradiating the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receiving the laser light reflected by the surface of the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0043] The chamber 29 forms an internal space that accommodates the base member 18, the transport device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, and the nozzle moving device 28.

[0044] In the first embodiment, the mounting device 12 has a dispenser 34 that applies cream solder to the board 1. The dispenser 34 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the transport device 19. The dispenser 34 and the mounting head 24 are movable separately. After the cream solder is applied to the surface of the board 1 by the dispenser 34, the components 2 are mounted on the board 1 by the mounting head 24. The board 1 on which the components 2 have been mounted by the mounting device 12 is transported to the preheating device 13 while being fixed to the pallet 3.

[0045] The preheating device 13 reduces the liquid component of the cream solder applied to the substrate 1. The cream solder contains flux and metallic solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the cream solder by activating the flux and vaporizing at least a portion of the liquid component.

[0046] The preheating device 13 includes a base member 35 , a transport device 36 for transporting the pallet 3 , a heater 37 for heating the substrate 1 , and a chamber 38 .

[0047] The base member 35 supports a conveying device 36. The conveying device 36 conveys the pallet 3 supporting the substrate 1 in the X-axis direction. The conveying device 36 has a conveying belt 36A that conveys the pallet 3 and a guide member 36B that guides the pallet 3.

[0048] The heater 37 heats the substrate 1 so that at least a part of the liquid component of the flux of the cream solder is vaporized.

[0049] The chamber 38 forms an internal space in which the base member 35, the transport device 36, and the heater 37 are housed.

[0050] Preheating device 13 heats substrate 1 held on pallet 3 so as to reduce the liquid component of the cream solder. Preheating device 13 heats substrate 1 at a temperature lower than the melting point of the cream solder. Preheating device 13 heats substrate 1 for 10 minutes, for example, at a temperature of 80°C or higher and 100°C or lower. Substrate 1 preheated by preheating device 13 is transported to laser irradiation device 14 while fixed to pallet 3.

[0051] The laser irradiation device 14 irradiates the cream solder with laser light so as to melt the cream solder. The laser irradiation device 14 includes a base member 39, a transport device 40 that transports the pallet 3, a stage 41 that supports the pallet 3, a stage moving device 42 that moves the stage 41, a laser head 43 that emits laser light, and a chamber 44.

[0052] The base member 39 supports the transport device 40 , the stage 41 , the stage moving device 42 , and the laser head 43 .

[0053] The conveying device 40 conveys the pallet 3 supporting the substrate 1 in the X-axis direction. The conveying device 40 has a conveying belt 40A that conveys the pallet 3 and a guide member 40B that guides the pallet 3. The structure and function of the conveying device 40 are substantially the same as the structure and function of the conveying device 19.

[0054] The stage 41 supports the pallet 3 from the -Z side. The stage movement device 42 moves the stage 41 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the stage 41 are substantially the same as the structure and function of the stage 20.

[0055] The laser head 43 irradiates the cream solder with laser light to melt the cream solder. The laser head 43 moves in the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the conveying device 40.

[0056] The chamber 44 forms an internal space in which the base member 39, the transport device 40, the stage 41, the stage moving device 42, and the laser head 43 are housed.

[0057] In the laser irradiation device 14, the cream solder is irradiated with laser light emitted from the laser head 43. The cream solder is heated by the laser light and melts. The melted cream solder is cooled, thereby soldering the component 2 to the board 1. In this embodiment, the cream solder is irradiated with laser light after the liquid component of the cream solder is reduced in the preheating device 13. Because the cream solder is irradiated with laser light in a state in which the liquid component of the cream solder has been reduced, solder balls caused by bumping of the cream solder are suppressed.

[0058] 9 and 10 are diagrams illustrating the board data and NC data according to the first embodiment. The board data includes the mounting position Pp (xp, yp, zp) of the component 2 on the surface of the board 1, the normal vector (u, v, w) of the surface of the board 1 at the mounting position Pp, surface data for the surface of the board 1, and texture data for the circuit pattern on the surface data. The board data is expressed in a board coordinate system (Xp, Yp, Zp) with the board coordinate reference point Pr fixed to the board 1 or the pallet 3 as its origin. In addition to the above, the board data also includes the component number to be mounted, the position of the land where the cream solder is to be applied, the preheating temperature, the preheating time, the laser power, the laser irradiation time, and the like, and is used by each device on the production line.

[0059] The stage 20 is used in the mounting device 12. The mounting device 12 is a three-dimensional mounting device. The stage 20 is rotatable while supporting the substrate 1. The stage 20 can rotate in the θX direction around the rotation axis Xt. The stage 20 can rotate in the θY direction around the rotation axis Yt. The stage 20 supports the substrate 1 via a pallet 3. When the stage 20 rotates in the θX direction and the θY direction around the rotation axis Xt and the rotation axis Yt and the substrate 1 tilts, the mounting position Pp rotates around the rotation axis Xt and the rotation axis Yt. The rotation axis Xt and the rotation axis Yt are perpendicular to each other.

[0060] The machine coordinate system (Xm, Ym, Zm) is defined on the mounting device 12. The machine coordinate system (Xm, Ym, Zm) is a coordinate system fixed to the mounting device 12 and serves as a reference when the mounting head 24 moves. The origin of the machine coordinate system may be located anywhere on the mounting device 12. When the stage 20 rotates in the θX and θY directions around the rotation axes Xt and Yt and the board 1 tilts, the mounting position Pp rotates around the rotation axes Xt and Yt. A mounting position Pm (xm, ym, zm) in the machine coordinate system of the rotated mounting position Pp is calculated, and the board camera 25, height sensor 26, and nozzle 23 of the mounting head 24 move using this mounting position Pm (xm, ym, zm). The mounting position Pm (xm, ym, zm) in the machine coordinate system and the rotation angle of the stage 20 are stored as NC data and used as command positions for the drive motors when the mounting device 12 is operating. NC data is similarly created and used in each device on the production line other than the mounting device 12. The NC data is calculated based on mechanism parameters such as the positions of the rotation axis Xt and rotation axis Yt of the stage 20, and therefore the NC data differs for each device.

[0061] It is necessary to find the center of rotation of the stage 20 in the machine coordinate system (Xm, Ym, Zm). The position of the center of rotation of the stage 20 is the position of the rotation axis Xt and the position of the rotation axis Yt. If the position of the center of rotation of the stage 20 is calculated as the design position, there is a possibility that an accurate mounting position cannot be determined due to errors in the XYZ positions.

[0062] In the first embodiment, the position of the rotation center (rotation axis Xt, Yt) of the stage 20 relative to the origin of the machine coordinate system (Xm, Ym, Zm) is determined accurately by measurement. In the following description, the position in the Xm-axis direction of the machine coordinate system will be appropriately referred to as the X position, the position in the Ym-axis direction will be appropriately referred to as the Y position, and the position in the Zm-axis direction will be appropriately referred to as the Z position.

[0063] <Method for Measuring the Center of Rotation of the Stage> Fig. 11 is a diagram for explaining a method for measuring the center of rotation of the stage 20 according to the first embodiment. Fig. 11 shows a method for measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system. The rotation axis Yt is the center of rotation of the stage 20. Measuring the center of rotation of the stage 20 includes measuring the position of the rotation axis Yt relative to the origin of the machine coordinate system. When measuring the position of the rotation axis Yt relative to the origin of the machine coordinate system, the board camera 25 and the height sensor 26 are used. Furthermore, when measuring the position of the rotation axis Yt, the stage 20 is rotated only in the θY direction.

[0064] The stage movement device 21 has a θX motor that generates power to rotate the stage 20 about the rotation axis Xt, and a θY motor that generates power to rotate the stage 20 about the rotation axis Yt. The stage movement device 21 also has a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, and a Z-axis motor that generates power to move the stage 20 in the Z-axis direction. The stage 20 is rotatable while supporting the substrate 1.

[0065] When measuring the position of the rotation axis Yt of the stage 20, the stage 20 is rotated only in the θY direction. That is, when measuring the position of the rotation axis Yt of the stage 20, only the θY motor of the stage moving device 21 is driven, and the other motors (θX motor, Y-axis motor, Z-axis motor) are stopped.

[0066] When measuring the rotation center of the stage 20, the jig substrate 100 is supported on the stage 20 via the pallet 3. The stage 20 supports the pallet 3, which holds the jig substrate 100. The surface of the jig substrate 100 is flat. The jig substrate 100 is a parallel plate. A mark 70 is provided on a portion of the surface of the jig substrate 100. The position of the mark 70 in the machine coordinate system is detected while changing the angle of the jig substrate 100 in the θY direction. The position of the mark 70 is a position on a predetermined plane perpendicular to the rotation axis Yt. When the rotation axis Yt and the Ym axis of the machine coordinate system are parallel, the predetermined plane perpendicular to the rotation axis Yt is the XmZm plane including the Xm axis and the Zm axis. The board camera 25 can detect the X and Y positions of the mark 70 in the machine coordinate system by capturing an image of the mark 70. The height sensor 26 can detect the Z position of the mark 70 in the machine coordinate system by detecting the height of the mark 70. The position of the mark 70 is calculated based on the detection data from the substrate camera 25 and the height sensor 26 .

[0067] 11 , when measuring the position of the rotation axis Yt, the X and Z positions of the mark 70 are detected at each of at least three mutually different angles of the jig substrate 100. When the jig substrate 100 is at a first angle, the X position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a second angle, the X position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a third angle, the X position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26.

[0068] That is, the positions (X position and Z position) of the three marks 70 on the XmZm plane are detected. Based on the positions of the three marks 70, the position of the rotation axis Yt on the XmZm plane is calculated as the center of rotation. The X position and Z position of the rotation axis Yt are calculated from a circle that passes through the three marks 70 on the XmZm plane. That is, the coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are calculated from the circle that passes through the three marks 70. From the above, the position of the rotation axis Yt in the machine coordinate system is calculated as the center of rotation of the stage 20.

[0069] Although not shown in the figure, when measuring the position of the rotation axis Xt of the stage 20, the stage 20 is rotated only in the θX direction. That is, when measuring the position of the rotation axis Xt of the stage 20, only the θX motor of the stage moving device 21 is driven, and the other motors (θY motor, Y-axis motor, Z-axis motor) are stopped.

[0070] When measuring the position of the rotation axis Xt, the Y position and Z position of the mark 70 are detected at each of at least three mutually different angles of the jig substrate 100. When the jig substrate 100 is at a first angle, the Y position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a second angle, the Y position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a third angle, the Y position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26.

[0071] That is, the three positions (Y position and Z position) of the mark 70 on the YmZm plane are detected. The Y position and Z position of the rotation axis Xt are obtained from a circle that passes through the three marks 70 on the YmZm plane. That is, the coordinates (y0, z0) of the rotation axis Xt on the YmZm plane are calculated from the circle that passes through the three marks 70. In this way, the position of the rotation axis Xt in the machine coordinate system is calculated.

[0072] <Processing Device> FIG. 12 is a block diagram showing the processing device 16 used to measure the center of rotation of the stage 20 according to the first embodiment. The processing device 16 includes a computer system. The processing device 16 has at least one processor 47, a main memory 48, a storage device 49, and an interface 50. The processor 47 is a central processing unit (CPU). The main memory 48 includes a nonvolatile memory such as a read-only memory (ROM) and a volatile memory such as a random-access memory (RAM). Examples of the storage device 49 include a hard disk drive (HDD), a solid-state drive (SSD), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM. The interface 50 includes an input / output circuit. The functions of the processor 47 are stored as a program in the storage device 49. The processor 47 reads the program from the storage device 49, loads it into the main memory 48, and executes processing according to the program. The program may be distributed to the processing device 16 via a network.

[0073] 13 to 18 are diagrams showing the operation of the mounting device 12 when measuring the rotation center of the stage 20 according to the first embodiment. Each of Fig. 13 to 18 shows the operation of the mounting device 12 when measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system.

[0074] 13, the jig substrate 100 is supported on the stage 20 via the pallet 3. The stage 20 supports the pallet 3 which holds the jig substrate 100. A mark 70 is provided on the surface of the jig substrate 100.

[0075] As shown in FIG. 13 , the processing device 16 controls the stage 20 so that the jig substrate 100 is at a first angle in the rotation direction around the rotation axis Yt. The processing device 16 detects the X position of the mark 70 with the substrate camera 25 when the jig substrate 100 is at the first angle. The processing device 16 can calculate the X position (x1) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the substrate camera 25. Also, as shown in FIG. 14 , the processing device 16 detects the Z position of the mark 70 with the height sensor 26 when the jig substrate 100 is at the first angle. The processing device 16 can calculate the Z position (z1) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the height sensor 26.

[0076] Next, as shown in FIG. 15 , the processing device 16 controls the stage 20 so that the jig substrate 100 is at a second angle in the rotation direction around the rotation axis Yt. The processing device 16 detects the X position of the mark 70 with the substrate camera 25 when the jig substrate 100 is at the second angle. Based on the detection data from the substrate camera 25, the processing device 16 can calculate the X position (x2) of the mark 70 relative to the origin of the machine coordinate system. Also, as shown in FIG. 16 , the processing device 16 detects the Z position of the mark 70 with the height sensor 26 when the jig substrate 100 is at the second angle. Based on the detection data from the height sensor 26, the processing device 16 can calculate the Z position (z2) of the mark 70 relative to the origin of the machine coordinate system.

[0077] Next, as shown in FIG. 17 , the processing device 16 controls the stage 20 so that the jig substrate 100 is at a third angle in the rotation direction around the rotation axis Yt. The processing device 16 detects the X position of the mark 70 with the substrate camera 25 when the jig substrate 100 is at the third angle. The processing device 16 can calculate the X position (x3) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the substrate camera 25. Also, as shown in FIG. 18 , the processing device 16 detects the Z position of the mark 70 with the height sensor 26 when the jig substrate 100 is at the third angle. The processing device 16 can calculate the Z position (z3) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the height sensor 26.

[0078] The X position (x1, x2, x3) of the mark 70 indicates the distance in the horizontal direction (Xm axis direction) from the origin of the machine coordinate system. The Z position (z1, z2, z3) of the mark 70 indicates the distance in the vertical direction (Zm axis direction) from the origin of the machine coordinate system.

[0079] From the above, the first position (x1, z1), second position (x2, z2), and third position (x3, z3) of the mark 70 on the XmZm plane are detected. The X and Z positions of the rotation axis Yt are determined from a circle that passes through the marks 70 at the three positions on the XmZm plane. In other words, the coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are calculated from the circle that passes through the marks 70 at the three positions. From the above, the position of the rotation axis Yt in the machine coordinate system is calculated.

[0080] Although not shown in the drawings, the processing device 16 can calculate the position of the rotation axis Xt from the three positions of the mark 70 on the YmZm plane.

[0081] Second Embodiment A second embodiment will be described below. In the following description, the same or equivalent components as those in the first embodiment will be denoted by the same reference numerals, and the description of those components will be simplified or omitted.

[0082] <Method for measuring the center of rotation of the stage> Fig. 19 is a diagram for explaining a method for measuring the center of rotation of the stage 20 according to the second embodiment. Fig. 19 shows a method for measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system. In the second embodiment, when measuring the position of the rotation axis Yt relative to the origin of the machine coordinate system, the height sensor 26 is used. In the second embodiment, the board camera 25 is not used. Furthermore, when measuring the position of the rotation axis Yt, the stage 20 is rotated only in the θY direction.

[0083] When measuring the rotation center of the stage 20, the jig substrate 100 is supported on the stage 20 via the pallet 3. The stage 20 supports the pallet 3, which holds the jig substrate 100. In the second embodiment, no mark 70 is provided on the jig substrate 100. The position of the surface of the jig substrate 100 in the machine coordinate system is detected while changing the angle of the jig substrate 100 in the θY direction. The height sensor 26 detects the Z position of the surface of the jig substrate 100 in the machine coordinate system.

[0084] 19 , when measuring the position of the rotation axis Yt, the Z positions of two portions on the surface of the jig substrate 100 are detected at each of at least two mutually different angles of the jig substrate 100. When the jig substrate 100 is at a first angle, the Z positions of a first portion 81 and a second portion 82 on the surface of the jig substrate 100 are detected by the height sensor 26. When the jig substrate 100 is at a second angle, the Z positions of the first portion 81 and the second portion 82 on the surface of the jig substrate 100 are detected by the height sensor 26.

[0085] That is, the positions (Z positions) of two parts of the jig substrate 100 on the XmZm plane are detected at each of at least two mutually different angles of the jig substrate 100. Based on the positions of the four parts, the position of the rotation axis Yt on the XmZm plane is calculated as the rotation center.

[0086] In the XmZm plane, a first triangle 83 is defined by a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a first angle, a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a second angle, and a line connecting the first portion 81 when the jig substrate 100 is at the first angle and the first portion 81 when the jig substrate 100 is at the second angle.

[0087] In the XmZm plane, a second triangle 84 is defined by a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a first angle, a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a second angle, and a line connecting the second portion 82 when the jig substrate 100 is at the first angle and the second portion 82 when the jig substrate 100 is at the second angle.

[0088] The first triangle 83 and the second triangle 84 are similar figures. The X and Z positions of the rotation axis Yt can be determined from the first triangle 83 and the second triangle 84. That is, the coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are calculated from the first triangle 83 and the second triangle 84. In this way, the position of the rotation axis Yt in the machine coordinate system is calculated.

[0089] Although not shown, when measuring the position of the rotation axis Xt of the stage 20, the stage 20 is rotated only in the θX direction. At each of at least two mutually different angles of the jig substrate 100, the positions (Z positions) of two parts of the jig substrate 100 in the YmZm plane are detected. A first triangle 83 and a second triangle 84 are defined in the YmZm plane. The Y and Z positions of the rotation axis Xt are determined from the first triangle 83 and the second triangle 84. That is, the coordinates (y0, z0) of the rotation axis Xt in the YmZm plane are calculated from the first triangle 83 and the second triangle 84. As a result, the position of the rotation axis Xt in the machine coordinate system is calculated.

[0090] 20 and 21 are diagrams showing the operation of the mounting device 12 when measuring the rotation center of the stage 20 according to the second embodiment. 20 and 21 show the operation of the mounting device 12 when measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system.

[0091] 20, the jig substrate 100 is supported on the stage 20 via the pallet 3. The stage 20 supports the pallet 3 which holds the jig substrate 100. No marks 70 are provided on the jig substrate 100.

[0092] As shown in FIG. 20 , the processing device 16 controls the stage 20 so that the jig substrate 100 is at a first angle in the rotation direction about the rotation axis Yt. The processing device 16 detects the Z position of a first portion 81 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at a first angle -θ relative to a horizontal plane. The distance between the origin of the machine coordinate system and the first portion 81 in the Xm-axis direction is x1. In other words, the Xm coordinate of the first portion 81 is x1. Based on the detection data of the height sensor 26, the processing device 16 can calculate the X position (x1) and Z position (z11) of the first portion 81 relative to the origin of the machine coordinate system when the jig substrate 100 is at the first angle.

[0093] Furthermore, the processing device 16 detects the Z position of the second portion 82 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at the first angle -θ. The distance between the origin of the machine coordinate system and the second portion 82 in the Xm-axis direction is x2. In other words, the Xm coordinate of the second portion 82 is x2. Based on the detection data of the height sensor 26, the processing device 16 can calculate the X position (x2) and Z position (z21) of the second portion 82 relative to the origin of the machine coordinate system when the jig substrate 100 is at the first angle -θ.

[0094] Next, as shown in FIG. 21 , the processing device 16 controls the stage 20 so that the jig substrate 100 is at a second angle θ relative to the horizontal plane in the rotation direction around the rotation axis Yt. The processing device 16 detects the Z position of the first portion 81 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at the second angle θ. The distance between the origin of the machine coordinate system and the first portion 81 in the Xm-axis direction is x1. In other words, the Xm coordinate of the first portion 81 is x1. Based on the detection data of the height sensor 26, the processing device 16 can calculate the X position (x1) and Z position (z12) of the first portion 81 relative to the origin of the machine coordinate system when the jig substrate 100 is at the second angle.

[0095] Furthermore, the processing device 16 detects the Z position of the second portion 82 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at the second angle θ. The distance between the origin of the machine coordinate system and the second portion 82 in the Xm-axis direction is x2. In other words, the Xm coordinate of the second portion 82 is x2. Based on the detection data of the height sensor 26, the processing device 16 can calculate the X position (x2) and Z position (z22) of the second portion 82 relative to the origin of the machine coordinate system when the jig substrate 100 is at the second angle.

[0096] Figure 22 is a diagram showing the coordinates of a first portion 81 and the coordinates of a second portion 82 according to the second embodiment. The Z position (z3) when the jig substrate 100 is parallel to the horizontal plane is assumed to be acquired in advance. As described with reference to Figure 19, a first triangle 83 and a second triangle 84, which are in a similar relationship, are defined. The coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are expressed by the following equations (1), (2), and (3).

[0097]

[0098] In this way, the X and Z positions of the rotation axis Yt in the machine coordinate system are determined. That is, the coordinates (x0, z0) of the rotation axis Yt in the XmZm plane are calculated.

[0099] Although not shown in the drawings, the processing device 16 can calculate the Y position and Z position of the rotation axis Xt from the first triangle 83 and the second triangle 84 on the YmZm plane.

[0100] Third Embodiment A third embodiment will be described below. In the following description, components that are the same as or equivalent to those in the first or second embodiment will be denoted by the same reference numerals, and descriptions of those components will be simplified or omitted.

[0101] 23 is a diagram for explaining a method for measuring the rotation center of the stage 20 according to the third embodiment. As shown in Fig. 23, when taking into consideration the tilt of the rotation axes Xt and Yt of the stage 20 with respect to the Xm and Ym axes of the machine coordinate system, the rotation centers may be found at two locations on the stage 20, and the line connecting the two locations may be used as the rotation center of the stage 20.

[0102] 23 , by rotating the stage 20 in a rotational direction about the Xm axis, the center of rotation e is determined from positions a and b on the stage 20, and the center of rotation f is determined from positions c and d on the stage 20. A rotational center line Lx of the stage 20 in the Xm axis direction is determined from the rotational centers e and f. Similarly, by rotating the stage 20 in a rotational direction about the Ym axis, the center of rotation g is determined from positions a and c on the stage 20, and the center of rotation h is determined from positions b and d on the stage 20. A rotational center line Ly of the stage 20 in the Ym axis direction is determined from the rotational centers g and h.

[0103] [Modifications of the Embodiment] In the first and second embodiments, the center of rotation of the stage 20 is measured using a mark 70 provided on a portion of the surface of the jig substrate 100 supported on the stage 20 via the pallet 3 or on a portion of the jig substrate 100. However, the center of rotation of the stage 20 may be measured using a portion of the surface of the stage 20 or a mark provided on a portion of the stage 20 instead of the jig substrate 100. The portion of the surface of the stage 20 used to measure the center of rotation may be a flat surface. Furthermore, the center of rotation of the stage 20 may be measured using a portion of the surface of the pallet 3 supported on the stage 20 or a mark provided on a portion of the pallet 3. The portion of the surface of the pallet 3 used to measure the center of rotation may be a flat surface.

[0104] When measuring the center of rotation using the mark 70 as in the first embodiment, the surface of the jig substrate 100 does not have to be flat. Therefore, even if the jig substrate 100 is not used, if a mark is provided on the substrate 1 (three-dimensional substrate, mounting substrate), the center of rotation of the stage 20 may be measured using the mark on the substrate 1.

[0105] When the rotation axis Xt and the rotation axis Yt intersect, that is, when the jig substrate 100 is rotated and the mark 70 on the jig substrate 100 moves on a sphere centered on the intersection point where the rotation axis Xt and the rotation axis Yt intersect, it is possible to detect any four positions on the three-dimensional coordinate of the mark 70 rather than sequentially determining the rotation centers Xt and Yt. In this case, the position of the rotation center can also be determined from the equation of a sphere that passes through the four points.

[0106] This application appropriately incorporates the contents disclosed in Japanese Patent Application No. 2023-108828 filed on June 30, 2023.

[0107] 1...Substrate (mounting substrate), 1A...Base material, 1B...Film, 2...Component, 3...Pallet, 4...Support member, 4A...Base portion, 4B...Guard portion, 4C...Pin portion, 4D...Hole, 5...Clamp mechanism, 5A...Support portion, 5B...Moveable portion, 10...Production system, 12...Mounting device, 13...Preheating device, 14...Laser irradiation device, 16...Processing device, 18...Base member, 19...Conveying device, 19A...Conveyor belt, 19B...Guide member, 20...Stage, 20A...Positioning member, 21...Stage moving device, 22...Component supply device, 23...Nozzle, 23A...Shaft, 24...Mounting head, 25...Substrate camera, 26...Height sensor, 27...Head moving device 27X...X-axis moving device, 27Y...Y-axis moving device, 28...nozzle moving device, 29...chamber, 34...dispenser, 35...base member, 36...conveying device, 36A...conveying belt, 36B...guide member, 37...heater, 38...chamber, 39...base member, 40...conveying device, 40A...conveying belt, 40B...guide member, 41...stage, 42...stage moving device, 43...laser head, 44...chamber, 47...processor, 48...main memory, 49...storage, 50...interface, 70...mark, 81...first part, 82...second part, 100...jig board, Pp...mounting position, Xt...rotation axis, Yt...rotation axis.

Claims

1. A method for measuring the center of rotation of a stage used in a three-dimensional mounting device and capable of rotating while supporting a mounting board, comprising: rotating the stage supporting a fixture board through each of a plurality of angles; detecting the position of a portion of the surface of the fixture board at each of the plurality of angles; and calculating the position of the center of rotation of the stage relative to the origin of a machine coordinate system defined in the three-dimensional mounting device based on the detection results of the position of the portion.

2. A method for measuring the center of rotation of a stage as described in claim 1, wherein the stage is rotatable around a rotation axis, and detecting the position of the part comprises detecting the position of the part on a specified plane perpendicular to the rotation axis.

3. A method for measuring the center of rotation of a stage as described in claim 2, wherein the position of the part includes a lateral position indicating the lateral distance from the origin of the machine coordinate system, and a height position indicating the height distance from the origin.

4. A method for measuring the center of rotation of a stage as described in claim 3, wherein a mark is provided on the portion, the three-dimensional mounting device has a board camera that images the mark and a height sensor that detects the height of the mark, and the position of the portion is calculated based on the detection data of the board camera and the height sensor, respectively.

5. A method for measuring the rotation center of a stage as described in claim 4, wherein the mark is detected at each of at least three mutually different angles of the jig substrate, and the position of the rotation axis on the specified plane is calculated as the rotation center based on the positions of the three marks.

6. The method for measuring the center of rotation of a stage according to claim 3, wherein the three-dimensional mounting device has a height sensor that detects the height of the part, and the position of the part is calculated based on detection data from the height sensor.

7. A method for measuring the rotation center of a stage as described in claim 6, wherein a first portion and a second portion of the surface of the fixture substrate are detected at each of at least two mutually different angles of the fixture substrate, and the position of the rotation axis on the specified plane is calculated as the rotation center based on the positions of the four portions.

8. A method for measuring the center of rotation of a stage used in a three-dimensional mounting device and rotatable while supporting a mounting substrate, comprising: rotating the stage through each of a plurality of angles; detecting the position of a portion of the surface of the stage at each of the plurality of angles; and calculating the position of the center of rotation of the stage relative to the origin of a machine coordinate system defined in the three-dimensional mounting device based on the detection results of the position of the portion.

9. The method for measuring the center of rotation of a stage as described in claim 8, wherein the stage is rotatable around a rotation axis, and detecting the position of the part comprises detecting the position of the part in a specified plane perpendicular to the rotation axis.

10. A method for measuring the center of rotation of a stage as described in claim 9, wherein the position of the part includes a lateral position indicating the lateral distance from the origin of the machine coordinate system, and a height position indicating the height distance from the origin.

11. A method for measuring the center of rotation of a stage as described in claim 10, wherein a mark is provided on the portion, the three-dimensional mounting device has a board camera that images the mark and a height sensor that detects the height of the mark, and the position of the portion is calculated based on the detection data of the board camera and the height sensor, respectively.

12. A method for measuring the rotation center of a stage as described in claim 11, wherein the mark is detected at each of at least three mutually different angles of the stage, and the position of the rotation axis on the specified plane is calculated as the rotation center based on the positions of the three marks.

13. The method for measuring the center of rotation of a stage according to claim 10, wherein the three-dimensional mounting device has a height sensor that detects the height of the part, and the position of the part is calculated based on detection data from the height sensor.

14. A method for measuring the rotation center of a stage as described in claim 13, wherein a first portion and a second portion of the surface of the stage are detected at each of at least two mutually different angles of the stage, and the position of the rotation axis on the specified plane is calculated as the rotation center based on the positions of the four portions.

15. A method for measuring the center of rotation of a stage used in a three-dimensional mounting device and capable of rotating while supporting a mounting board, comprising: rotating the stage, on which a pallet that holds the mounting board or jig board is supported, through each of a plurality of angles; detecting the position of a portion of the surface of the pallet at each of the plurality of angles; and calculating the position of the center of rotation of the stage relative to the origin of a machine coordinate system defined in the three-dimensional mounting device based on the detection results of the position of the portion.

16. The method for measuring the center of rotation of a stage as described in claim 15, wherein the stage is rotatable around a rotation axis, and detecting the position of the part comprises detecting the position of the part in a specified plane perpendicular to the rotation axis.

17. A method for measuring the center of rotation of a stage as described in claim 16, wherein the position of the part includes a lateral position indicating the lateral distance from the origin of the machine coordinate system, and a height position indicating the height distance from the origin.

18. A method for measuring the center of rotation of a stage as described in claim 17, wherein a mark is provided on the portion, the three-dimensional mounting device has a board camera that images the mark and a height sensor that detects the height of the mark, and the position of the portion is calculated based on the detection data of the board camera and the height sensor, respectively.

19. A method for measuring the rotation center of a stage as described in claim 18, wherein the mark is detected at each of at least three mutually different angles of the stage, and the position of the rotation axis on the specified plane is calculated as the rotation center based on the positions of the three marks.

20. The method for measuring the center of rotation of a stage according to claim 17, wherein the three-dimensional mounting device has a height sensor that detects the height of the part, and the position of the part is calculated based on detection data from the height sensor.

21. A method for measuring the rotation center of a stage as described in claim 20, wherein a first portion and a second portion of the surface of the pallet are detected at each of at least two mutually different angles of the stage, and the position of the rotation axis on the specified plane is calculated as the rotation center based on the positions of the four portions.

Images