Coaxial test socket for ultra-high rate of 224 gbps

Abstract

A coaxial test socket for an ultra-high rate of 224 Gbps, comprising a test socket body made of a metal and a test socket cover plate (3). A mounting hole (4) is provided in the test socket body; a first polymer positioning member (5) matching the mounting hole (4) is provided in the mounting hole (4); a first insertion hole and a second insertion hole are provided in the first polymer positioning member (5); test probes (7) are respectively inserted into the first insertion hole and the second insertion hole; a second polymer positioning member (6) is fixedly provided in the test socket cover plate (3); the second polymer positioning member (6) is provided with a first positioning hole (8) matching the first polymer positioning member (5), and second positioning holes (9) communicated with the first positioning hole (8) and matching end portions of the test probes (7); and the height of the first polymer positioning member (5) is less than the length of the test probes (7). A large dynamic bandwidth and a high isolation degree of a coaxial test socket for an ultra-high speed test frequency are implemented.

Description

A coaxial test socket for 224Gbps ultra-high-speed Technical Field

[0001] The present application relates to the field of chip test sockets, and in particular to a coaxial test socket for 224Gbps ultra-high-speed testing. Background Art

[0002] With the promotion and application of silicon photonic chips and next-generation PCIE (Express) electrical interfaces, the market demand for coaxial test sockets is increasing, and at the same time, higher bandwidth requirements are being placed on coaxial test sockets. The previous 45G or 50G bandwidth is clearly not suitable for ultra-high-speed PAM4 testing requirements such as 224Gbps.

[0003] Currently, there are two main methods for manufacturing coaxial test sockets on the market, using different technical approaches. The first involves injecting glue into the socket body and then processing it to achieve signal impedance matching and power supply insulation. The second method involves wrapping a Teflon ring around the center of the probe to achieve the required insulation and impedance matching. Examples include the "Coaxial Semiconductor Test Device" disclosed in CN 203606461 U and the "Semiconductor Chip Test Coaxial Socket with Impedance Matching Structure and Its Preparation Method" disclosed in CN 110726918 B.

[0004] However, the above-mentioned existing coaxial solutions all have the following problems: First, they are all completed through a single-hole design, and then the differential impedance matching is calculated by combining the impedance of the two pins. Therefore, because the probe is tightly wrapped by the surrounding electromagnetic field, the physical size of the probe is compressed to a relatively small size in order to achieve impedance matching. This situation is not obvious when the pin pitch is 0.8 mm. When the chip pin pitch changes to 0.4 mm or 0.35 mm, this size change becomes extremely significant. Secondly, the dielectric constant of the glue used in the glue filling process is relatively large, and it is also unstable at high frequencies, which causes the corresponding test socket to drift in the final test performance. Finally, whether secondary processing or plugging the probe with a ring will seriously interfere with the assembly accuracy and processing difficulty, thereby increasing the manufacturing cost and related yield of the product.

[0005] Summary of the Invention

[0006] The main purpose of this application is to provide a 224Gbps ultra-high-speed coaxial test socket, which can achieve large dynamic bandwidth and high isolation for the ultra-high-speed test frequency coaxial test socket.

[0007] In order to achieve the above-mentioned objectives, in the first aspect, the present application provides a 224Gbps ultra-high-speed coaxial test socket, comprising a test socket body made of metal and a test socket cover, the test socket body being provided with a mounting hole, the mounting hole being provided with a first polymer positioning piece cooperating therewith, the first polymer positioning piece being provided with a first socket and a second socket, the first socket and the second socket being respectively inserted with test probes, a second polymer positioning piece being fixedly provided in the test socket cover, the second polymer positioning piece being provided with a first positioning hole cooperating with the first polymer positioning piece, a second positioning hole connected to the first positioning hole and cooperating with the end of the test probe, and the height of the first polymer positioning piece being less than the length of the test probe.

[0008] A further improvement is that the first polymer positioning piece is formed by injection molding or extrusion.

[0009] A further improvement is that the first polymer positioning member is connected to the test socket body by stamping, plugging or physical snapping.

[0010] A further improvement is that the second polymer positioning member is fixedly connected to the first positioning hole by rolling, embossing, glue pouring and hole filling in sequence.

[0011] A further improvement is that the glue used in the glue pouring comprises epoxy resin doped with Teflon particles and / or air particles.

[0012] A further improvement is that the mounting hole, the first polymer positioning piece and the first positioning hole are waist-shaped.

[0013] A further improvement is that the second positioning hole is a cylindrical stepped hole.

[0014] A further improvement is that the test socket body and the test socket cover are fixedly connected by fasteners.

[0015] A further improvement is that the test socket body includes a first body and a second body, the first body is fixed to the end of the test pin and is provided with a chip solder ball, the second body is fixedly connected to the first body, and the first mounting hole is opened on the second body.

[0016] A further improvement is that the first polymer positioning member is an impedance matching polymer, and the second polymer positioning member is an insulating polymer.

[0017] Compared with existing technologies, this technology offers the following advantages: First, it achieves coupling and matching between the differential signal probes, the metal socket body, and the two probes themselves, resulting in higher bandwidth and larger mechanical dimensions. The high-frequency bandwidth (-1dB) exceeds 110GHz, and the return loss is less than -20dB at 80GHz, supporting digital data rates of 224Gbps.

[0018] Second, using a dielectric with a lower dielectric constant (2.1 to 2.2), such as Teflon (but not limited to Teflon), increases the freedom of mechanical design.

[0019] Third, more insulating material provides strong mechanical support, which greatly improves the mechanical stability of the entire socket and increases its actual service life. At the same time, the probe is more stable in the card slot.

[0020] Fourth, the dielectric constant of the mixed Teflon particles and / or air particles can reach (between 2.4 and 2.8). BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings that constitute part of this application are used to provide a further understanding of this application and make other features, objects and advantages of this application more apparent. The illustrative embodiment drawings of this application and their descriptions are used to explain this application and do not constitute an improper limitation of this application. In the drawings:

[0022] Figure 1 is a schematic diagram of the present invention;

[0023] FIG2 is a cross-sectional view of the present invention.

[0024] Among them: 1. First body; 2. Second body; 3. Test socket cover; 4. Mounting hole; 5. First polymer positioning piece; 6. Second polymer positioning piece; 7. Test probe; 8. First positioning hole; 9. Second positioning hole. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0028] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0029] Additionally, the term "plurality" shall mean two or more.

[0030] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0031] As shown in Figures 1 and 2, a 224Gbps ultra-high-speed coaxial test socket includes a test socket body made of metal and a test socket cover 3. The test socket body is provided with a mounting hole 4, and a first polymer positioning member 5 is provided in the mounting hole 4 to cooperate with it. The first polymer positioning member 5 is provided with a first socket and a second socket, and a test probe 7 is respectively inserted into the first socket and the second socket. A second polymer positioning member 6 is fixedly provided in the test socket cover 3, and the second polymer positioning member 6 is provided with a first positioning hole 8 to cooperate with the first polymer positioning member 5, and a second positioning hole 9 connected with the first positioning hole 8 and coordinated with the end of the test probe 7. The height of the first polymer positioning member 5 is less than the length of the test probe 7.

[0032] Preferably, the first polymer positioning member 5 is an impedance matching polymer, and the second polymer positioning member 6 is an insulating polymer.

[0033] Two pinholes of the same shape are used, namely the first jack and the second jack, and two identical test probes 7 are installed respectively. An impedance matching polymer positioning piece, namely the first polymer positioning piece 5, is placed between the two pinholes. The two pinholes are treated as a whole and are surrounded by a conductive metal ground. The two pinholes are coupled with each other to form a shield for external signals. Therefore, no grounding metal is set between the two differential signal transmission probes, and only an insulator is designed for isolation, thereby maximizing the coupling transmission between the differential signals and enhancing the accuracy of signal transmission.

[0034] From the perspective of the transmission line structure, the present invention achieves impedance continuity at the connection point, with the metal test socket body serving as the high-frequency signal return path. The dual-needle, dual-hole design increases the probe diameter and achieves higher test bandwidth, lower insertion and return loss, and better return and insertion loss than conventional coaxial sockets. Consequently, circuit signal loss is minimized and the overall structure is miniaturized. The dielectric component is excited in the TM mode, and in the TM mode resonator, the electric field is oriented toward the long side of the dielectric component, making coupling with the transmission line easy.

[0035] The first polymer locator 5 is formed by injection molding or extrusion and connected to the test socket body via embossing, plugging, or physical snap-fitting, providing strong mechanical support. This significantly improves the overall mechanical stability of the socket and extends its service life. The probe is also more stable in the slot, and the dual-acting needle design combined with the dual-hole and dual-cavity design provides even greater mechanical stability.

[0036] Preferably, the second polymer positioning member 6 and the first positioning hole 8 are fixedly connected by rolling, embossing, glue pouring and hole filling in sequence. The glue used for the glue pouring includes epoxy resin doped with Teflon particles or air particles, and the corresponding electrolyte constant is adjusted to (between 2.2 and 3.5).

[0037] As shown in Figure 1, in order to better position and obtain mechanical stability, in this embodiment, preferably, the mounting hole 4, the first polymer positioning part 5 and the first positioning hole 8 are waist-shaped, the second positioning hole 9 is a cylindrical step hole, and the two probes installed in the impedance-matching polymer positioning part transmit differential pair signals, and the single probe installed in the insulating polymer positioning part transmits single-ended signals.

[0038] Preferably, in this embodiment, the test socket body and the test socket cover plate 3 are fixedly connected by fasteners, and the fasteners can be bolts, screws, etc.

[0039] As shown in Figures 1 and 2, in this embodiment, preferably, the test socket body includes a first body 1 and a second body 2, the first body 1 is fixed to the end of the test pin and is provided with a chip solder ball, the second body 2 is fixedly connected to the first body 1, and the first mounting hole 4 is opened on the second body 2.

[0040] Traditional coaxial test sockets are single-hole designs, combining two single holes to generate differential signals. This invention utilizes a dual-hole design to create a coaxial socket, enabling mutual coupling between differential signals, resulting in improved bandwidth and transmission rates. This allows the positive and negative differential signals to reference each other. Furthermore, the impedance-matching polymer and insulating polymer in the dual-hole design provide a more stable mechanical structure for the socket.

[0041] To highlight the advantages of dual-position coaxial sockets, CN110726918A discloses a semiconductor chip test coaxial socket with an impedance-matching structure and its preparation method. This document introduces a single-position socket using an impedance-matching polymer and an insulating polymer. Experiments have shown that this test socket can achieve an insertion loss of -1dB / 40GHz and a return loss of -10dB / 40GHz. Using the dual-position coaxial socket in this embodiment, the return loss is less than -20dB at 80GHz, significantly improving upon the return loss of a single-position, single-pin structure.

[0042] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A 224Gbps ultra-high-speed coaxial test socket, characterized in that: The invention comprises a test socket body and a test socket cover plate (3) made of metal, wherein the test socket body is provided with a mounting hole (4), wherein a first polymer positioning piece (5) cooperating with the test socket body is arranged in the mounting hole (4), wherein the first polymer positioning piece (5) is provided with a first plug hole and a second plug hole, wherein a test probe (7) is respectively inserted into the first plug hole and the second plug hole, wherein a second polymer positioning piece (6) is fixedly arranged in the test socket cover plate (3), wherein the second polymer positioning piece (6) is provided with a first positioning hole (8) cooperating with the first polymer positioning piece (5), and a second positioning hole (9) connected with the first positioning hole (8) and cooperating with the end of the test probe (7), wherein the height of the first polymer positioning piece (5) is less than the length of the test probe (7).

2. A 224 Gbps ultra-high rate coaxial test socket as claimed in claim 1, characterized in that: The first polymer positioning element (5) is formed by injection molding or extrusion molding.

3. A 224 Gbps ultra-high rate coaxial test socket as claimed in claim 2, characterized in that: The first polymer positioning member (5) is connected to the test socket body by means of stamping, plugging or physical snapping.

4. The 224 Gbps ultra-high rate coaxial test socket according to claim 1, characterized in that: The second polymer positioning member (6) is fixedly connected to the first positioning hole (8) by rolling, embossing, glue pouring and hole filling in sequence.

5. The 224 Gbps ultra-high rate coaxial test socket as claimed in claim 4, characterized in that: The glue used in the glue pouring includes epoxy resin doped with Teflon particles and / or air particles.

6. The 224 Gbps ultra-high rate coaxial test socket according to claim 1, characterized in that: The mounting hole (4), the first polymer positioning member (5) and the first positioning hole (8) are waist-shaped.

7. A 224 Gbps ultra-high rate coaxial test socket as claimed in claim 6, characterized in that: The second positioning hole (9) is a cylindrical stepped hole.

8. The 224 Gbps ultra-high rate coaxial test socket according to claim 1, characterized in that the test socket body and the test socket cover (3) are fixedly connected by fasteners.

9. The 224 Gbps ultra-high rate coaxial test socket according to claim 1, characterized in that: The test socket body comprises a first body (1) and a second body (2); the first body (1) is fixed to the end of the test pin and is provided with a chip solder ball; the second body (2) is fixedly connected to the first body (1), and the first mounting hole (4) is opened on the second body (2).

10. The chip cooling system according to claim 1, characterized in that: The first polymer positioning member (5) is an impedance matching polymer, and the second polymer positioning member (6) is an insulating polymer.

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