Grounding structure and grounding apparatus

Abstract

The present invention provides a grounding structure and a grounding apparatus. The grounding structure comprises a chamber portion and an exhaust port portion; and when the grounding structure is clamped between a component to be grounded and a grounding end, the exhaust port portion may switch from a closed state to an open state, so as to release gas in the chamber portion outwards by means of the exhaust port portion, thereby reducing or counteracting a reaction force exerted by the chamber portion on the component to be grounded or the grounding end.

Description

Grounding structure and grounding device

[0001] Cross-references

[0002] The present invention claims priority to the Chinese patent application filed with the Patent Office of China on July 20, 2023, with application number 202310901166.X and invention name “Grounding Structure and Grounding Device”. The entire contents of the application are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the technical field of terminal equipment, and in particular to a grounding structure and a grounding device. Background Art

[0004] Functional modules in electronic devices (such as the backlight module of a display) typically require electrical connection to a housing or frame to ground the module. However, the grounding structure used in related art typically consists of conductive foam or conductive springs. This type of grounding structure can easily damage the module during assembly or use due to the reaction force of the grounding structure.

[0005] Summary of the Invention

[0006] Embodiments of the present disclosure provide a grounding structure and a grounding device.

[0007] In a first aspect, an embodiment of the present disclosure provides a grounding structure, which includes a chamber portion and an exhaust port portion; wherein, when the grounding structure is clamped between the element to be grounded and the grounding end, the exhaust port portion can be switched from a closed state to an open state to release the gas in the chamber portion to the outside through the exhaust port portion.

[0008] In a second aspect, an embodiment of the present disclosure further provides a grounding device, comprising: an element to be grounded; a grounding terminal; and a grounding structure as described in any one of the above items, electrically connecting the element to be grounded and the grounding terminal.

[0009] In a third aspect, an embodiment of the present disclosure further provides an electronic device, comprising the grounding device as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] FIG1 is a schematic structural diagram of a grounding device provided in one embodiment of the present disclosure;

[0012] FIG2 is a schematic structural diagram of a grounding structure provided in an embodiment of the present disclosure;

[0013] FIG3 is a schematic structural diagram of a grounding structure provided in an embodiment of the present disclosure;

[0014] FIG4 is a schematic diagram of gas exhaust from a grounding structure provided in one embodiment of the present disclosure;

[0015] FIG5 is a schematic structural diagram of a grounding structure provided at an angle according to an embodiment of the present disclosure;

[0016] FIG6 is a schematic structural diagram of a grounding structure provided by an embodiment of the present disclosure from another angle;

[0017] FIG7 is a schematic structural diagram of a grounding structure provided in an embodiment of the present disclosure;

[0018] FIG8 is a schematic diagram of a partial structure of a grounding device provided at an angle according to an embodiment of the present disclosure;

[0019] FIG9 is a schematic diagram of a partial structure of a grounding device provided by an embodiment of the present disclosure from another angle.

[0020] Explanation of reference numerals: 100, grounding structure; 10, chamber portion; 20, exhaust port portion; 21, opening sub-portion; 22, sealing member; 30, deformable component; 40, conductive layer; 200, element to be grounded; 300, grounding terminal. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0022] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present disclosure. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present disclosure, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0023] It should also be understood that the terms used in this disclosure are for the purpose of describing particular embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0024] It should be further understood that the term "and / or" used in this disclosure and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0025] In the related art, conductive foam is usually used to electrically connect the grounded component to the grounding end to achieve grounding of the grounded component. However, this grounding method requires that the conductive foam needs to be compressed to a certain pre-load in order to achieve reliable grounding of the grounded component, but the conductive foam will exert a rebound force on the grounded component, causing the grounded component to be easily damaged during use or assembly. For example, the grounded component includes an LCD display screen. If conductive foam is attached to the back of the LCD display screen, the rebound force of the conductive foam will easily damage the backlight film material of the display screen and cause the appearance of white lumps. For another example, the grounded component includes an OLED display screen. If conductive foam is attached to the back of the OLED display screen, the rebound force of the conductive foam will cause the display screen to be subjected to uneven stress, causing the OLED screen glass to easily break when it falls. For another example, for flexible display screens, the conductive foam has a large compression amount, and the local pressure stress on the OLED screen body is large, which may cause local protrusion deformation of the screen body, and the deformation on the screen can be seen when there is no display.

[0026] To this end, this embodiment provides a grounding structure and a grounding device to solve the problem in the related art that a grounded component is easily damaged due to the reaction force of the grounding structure.

[0027] The following describes some embodiments of the present disclosure in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0028] 1 , this embodiment provides a grounding structure 100 , which can be used in electronic devices, such as mobile phones, watches, or tablet computers.

[0029] In some embodiments, the grounded element 200 comprises a functional module of an electronic device. Exemplarily, the grounded element 200 comprises a functional module on the electronic device that requires grounding, and this functional module is used to implement the electronic device's preset functions. For example, if the electronic device is a mobile phone, the grounded element 200 may comprise at least one of the following: a display screen, a sensor, a circuit board, a speaker, etc. The display screen may comprise an LCD screen, an OLED screen, or other types of displays. Exemplarily, the grounded element 200 comprises the display screen's backlight module.

[0030] During actual use, the grounded component 200 is susceptible to electromagnetic interference and often requires grounding. Grounding the grounded component 200 is typically accomplished by electrically connecting the grounded component 200 to a ground terminal 300 (GND). To achieve grounding of the grounded component 200, a grounding structure 100 is interposed between the grounded component 200 and the ground terminal 300 to electrically connect the grounded component 200 and the ground terminal 300. Exemplarily, the ground terminal 300 comprises a frame or housing. For example, in the case of a mobile phone, the ground terminal 300 is typically the housing or frame of the mobile phone.

[0031] Referring to Figure 2, in some embodiments, the grounding structure 100 includes a chamber portion 10 and an exhaust port portion 20; wherein, when the grounding structure 100 is sandwiched between the grounded element 200 and the grounding end 300, the exhaust port portion 20 can be switched from a closed state to an open state to release the gas in the chamber portion 10 to the outside through the exhaust port portion 20.

[0032] In the grounding structure 100 of the above-described embodiment, when the grounding structure 100 is sandwiched between the grounded component 200 and the grounding terminal 300, the exhaust port 20 can be switched from a closed state to an open state, allowing the gas within the chamber 10 to be released outward through the exhaust port 20. This reduces or offsets the reaction force applied by the chamber 10 to the grounded component 200 or the grounding terminal 300, thereby alleviating or preventing damage to the grounded component 200 or the grounding terminal 300. For example, this can reduce or prevent problems such as white spots, easy breakage of the grounded component 200, or local deformation of the grounded component 200 caused by the reaction force of the grounding structure 100. Therefore, the grounding structure 100 can not only achieve a reliable electrical connection between the grounded component 200 and the grounding terminal 300, but also improve the safety and reliability of the grounded component 200 during assembly or use, thereby enhancing the functional effectiveness of the grounded component 200 and the quality of the entire device. The grounding structure 100 has a simple structure.

[0033] In some embodiments, the exhaust port portion 20 can be switched from a closed state to an open state under force to release the gas in the chamber portion 10 outward through the exhaust port portion 20, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the grounded element 200 or the grounding end 300.

[0034] Exemplarily, the force exerted on the exhaust port portion 20 may come from a component or object outside the chamber portion 10 , for example, a puncture component may puncture the exhaust port portion 20 , so that the exhaust port portion 20 switches from a closed state to an open state.

[0035] For example, the force exerted on the exhaust port portion 20 may come from the gas pressure in the chamber portion 10 . When the gas pressure in the chamber portion 10 increases to a preset threshold, the exhaust port portion 20 may be switched from a closed state to an open state.

[0036] In some embodiments, the exhaust port 20 can switch from a closed state to an open state when the chamber portion 10 is squeezed. It is understood that when the chamber portion 10 is squeezed and the exhaust port 20 is in a closed state, the volume of the chamber portion 10 decreases, causing the gas pressure inside the chamber portion 10 to increase, and the opening pressure of the exhaust port 20 also increases accordingly. When the opening pressure of the exhaust port 20 reaches a preset threshold, the exhaust port 20 switches from a closed state to an open state, thereby releasing the gas within the chamber portion 10 outward through the exhaust port 20. For example, when the grounding structure 100 is sandwiched between the grounded element 200 and the grounding terminal 300, the grounded element 200 and the grounding terminal 300 can squeeze the grounding structure 100, and the gas within the chamber portion 10 of the grounding structure 100 can be released outward through the exhaust port 20, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the grounded element 200 or the grounding terminal 300.

[0037] For example, before being assembled with the grounded component 200, the exhaust port 20 of the grounding structure 100 is in a closed state. During the assembly process, the grounding structure 100 is sandwiched between the grounded component 200 and the grounding terminal 300. When the grounding structure 100 is squeezed by the grounded component 200 or the grounding terminal 300, the volume of the chamber 10 decreases, causing the gas pressure within the chamber 10 to increase. When the gas pressure within the chamber 10 increases to a level sufficient to open the exhaust port 200, the gas within the chamber 10 can be released outward from the exhaust port 20, reducing or relieving the compressive force on the grounding structure 100. This ensures that the grounding structure 100 is both reliably electrically connected to the grounded component 200 and the grounding terminal 300 and reduces or offsets the reaction force exerted by the grounding structure 100 on the grounded component 200 or the grounding terminal 300.

[0038] It can be understood that when the exhaust port portion 20 is switched to the open state, as the gas in the chamber portion 10 is released outward through the exhaust port portion 20, the gas in the chamber portion 10 decreases and the gas pressure in the chamber portion 10 decreases; after the gas pressure in the chamber portion 10 decreases to a certain level, the exhaust port portion 20 can be switched from the open state to the closed state. At this time, the grounding structure 100 can be reliably electrically connected to the grounded element 200 and the grounding terminal 300, and the reaction force applied by the grounding structure 100 to the grounded element 200 or the grounding terminal 300 is zero. For example, please refer to Figure 2. The exhaust port portion 20 includes an opening sub-portion 21 and a sealing member 22. The sealing member 22 is used to seal the opening sub-portion 21. When the opening sub-portion 21 is opened, as the gas in the chamber portion 10 is released outward through the opening sub-portion 21, the gas in the chamber portion 10 decreases, and the gas pressure in the chamber portion 10 decreases. After the gas pressure in the chamber portion 10 decreases to a certain extent, the sealing member 22 can be sealed and connected to the wall of the opening sub-portion 21 to close the opening sub-portion 21. At this time, the grounding structure 100 can be reliably electrically connected to the element to be grounded 200 and the grounding terminal 300, and the reaction force applied by the grounding structure 100 to the element to be grounded 200 or the grounding terminal 300 is zero.

[0039] In some embodiments, after assembly, the grounding structure 100 can reliably electrically connect the grounded element 200 and the grounding end 200 , the reaction force applied by the grounding structure 100 to the grounded element 200 or the grounding end 300 is zero, and the grounded element 200 is safe and reliable during use.

[0040] It is understood that the thickness of the exhaust port portion 20 along the predetermined direction is less than or equal to the thickness of the chamber portion 10 along the predetermined direction. Exemplarily, the thickness of the exhaust port portion 20 along the predetermined direction is 0.1 mm, 0.8 mm, or any other suitable value between 0.1 mm and 0.8 mm. Exemplarily, the predetermined direction is the direction in which the grounded element 200 and the grounding terminal 300 clamp the grounding structure 100.

[0041] Referring to FIG. 2 , in some embodiments, the exhaust port portion 20 includes an opening sub-portion 21 and a sealing member 22. The sealing member 22 is disposed on the opening sub-portion 21 and is used to seal the opening sub-portion 21. The sealing member 22 can open the opening sub-portion 21 when a predetermined condition is met to release the gas within the chamber portion 10 outward through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the grounded component 200 or the grounding terminal 300.

[0042] In some embodiments, the preset conditions include at least one of the following: the pressure within the chamber portion 10 reaches a preset pressure; the ambient temperature of the sealing member 22 reaches a preset temperature. Exemplarily, the sealing member 22 comprises a rubber sealant. When the grounding structure 100 or the chamber portion 10 is not subjected to a compressive force, the sealing member 22 is sealedly connected to the wall of the opening sub-portion 21, sealing the opening sub-portion 21. When the grounding structure 100 is sandwiched between the grounded element 200 and the grounding terminal 300, as the chamber portion 10 is squeezed, the pressure within the chamber portion 10 increases. When the pressure within the chamber portion 10 reaches the preset pressure, the sealing connection between the sealing member 22 and the wall of the opening sub-portion 21 is broken, the opening sub-portion 21 opens, and the gas within the chamber portion 10 can be released outward through the opening sub-portion 21.

[0043] Exemplarily, the seal 22 includes a sealing rubber member. When the ambient temperature of the seal 22 is lower than a preset temperature, the wall of the opening sub-portion 21 is sealed and connected to the seal 22. When the ambient temperature of the seal 22 is greater than or equal to the preset temperature, the wall of the opening sub-portion 21 and the seal 22 are disconnected from the sealing connection, the opening sub-portion 21 opens, and the gas in the chamber portion 10 can be released outward through the opening sub-portion 21.

[0044] It is understandable that the opening degree of the opening sub-portion 21 can include one, two or more, which is not limited here. When the opening degree of the opening sub-portion 21 includes multiple degrees, the amount of gas discharged from the opening sub-portion 21 per unit time is different for opening sub-portions 21 with different opening degrees.

[0045] Exemplarily, the thickness of the sealing member 22 along a preset direction is 0.03 mm, 1 mm or any other suitable value between 0.03 mm and 1 mm, so as to ensure that the sealing member 22 can reliably seal the opening sub-portion 21 when the grounding structure 100 is not squeezed; when the grounding structure 100 is clamped between the element to be grounded 200 and the grounding end 300, the opening sub-portion 21 can be opened to release the gas in the chamber portion 10 outward through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the element to be grounded 200 or the grounding end 300.

[0046] Exemplarily, the width of the seal 22 along the gas discharge direction is 0.5 mm, 1 mm or any other suitable value between 0.5 mm and 1 mm to ensure that the seal 22 can reliably seal the opening sub-portion 21 when the grounding structure 100 is not squeezed; when the grounding structure 100 is clamped between the element to be grounded 200 and the grounding end 300, the opening sub-portion 21 can be opened to release the gas in the chamber portion 10 outward through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the element to be grounded 200 or the grounding end 300.

[0047] It is understandable that the number of seals 22 can be set according to actual needs, such as one, two, three or more. Referring to Figures 2 and 3, in some embodiments, the number of seals 22 includes multiple, and multiple seals 22 are arranged at intervals along the gas discharge direction. In this structure, multiple seals 22 need to be separated from the sealing connection with the wall of the opening sub-section 21 in turn, and the gas in the chamber section 10 can be slowly released outward through the opening sub-section 21, thereby improving the smoothness of the gas discharge outward from the chamber section 10; in addition, when the opening sub-section 21 is closed, the provision of multiple seals 22 can improve the sealing reliability of the chamber section 10, and prevent the opening sub-section 21 from being easily opened and affecting the functional effect of the grounding structure 100. Each opening sub-section 21 can be provided with one, two or more seals 22. For example, each opening sub-portion 21 is provided with 1-5 sealing members 22 to ensure that the sealing member 22 can reliably seal the opening sub-portion 21 when the grounding structure 100 is not squeezed; when the grounding structure 100 is sandwiched between the element to be grounded 200 and the grounding end 300, the opening sub-portion 21 can be opened to release the gas in the chamber portion 10 outward through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the element to be grounded 200 or the grounding end 300.

[0048] 4 , illustratively, under the gas pressure of the chamber 10 , the wall of the opening sub-section 21 is disconnected from the sealing member 22 and the opening sub-section 21 is opened. It is understood that the dotted arrows in FIG4 indicate the direction of gas discharge.

[0049] Please refer to FIG. 2 . In some embodiments, the number of the exhaust port 20 is one. This makes the structure simple and the processing convenient.

[0050] 5 and 6 , in some embodiments, there are at least two exhaust openings 20 , and each exhaust opening 20 is provided with at least one sealing member 22 , thereby accelerating the release of gas from the chamber 10 .

[0051] For example, the connection method between the grounding structure 100 and the element to be grounded 200 includes: adhesive connection, etc. Compared with welding the grounding spring to the element to be grounded 200, this embodiment reduces environmental pollution caused by welding.

[0052] For example, the connection method between the grounding structure 100 and the grounding terminal 300 includes: adhesive connection, etc. Compared with welding the grounding spring to the grounding terminal 300, this embodiment reduces environmental pollution caused by welding.

[0053] Please refer to Figure 7. In some embodiments, the grounding structure 100 includes a deformable member 30 and a conductive layer 40. The deformable member 30 is formed with a chamber portion 10 and an exhaust port portion 20. The conductive layer 40 is arranged on the side of the deformable member 30 away from the chamber portion 10. The conductive layer 40 is used to conductively connect the grounded element 200 and the grounding end 300.

[0054] For example, the deformable member 30 may include a flexible film or an airbag, etc. The thickness of the deformable member 30 may be set according to actual needs, such as 0.01 mm, 0.2 mm, or any other suitable value between 0.01 mm and 0.2 mm.

[0055] Exemplarily, the conductive layer 40 includes at least one of the following: a silver conductive layer 40 , a copper conductive layer 40 , and the like.

[0056] It is understood that one, two, three, four, or more grounding structures 100 may be disposed between the grounded element 200 and the grounding end 300. Referring to Figures 1, 8, and 9, illustratively, at least two grounding structures 100 may be disposed between the grounding end 300 and a grounded element 200. Multiple grounding structures 100 are spaced apart to provide deformation space for the grounding structure 100. For example, the dashed line in Figure 1 represents one of the deformation states of the grounding structure 100 after being squeezed by the grounded element 200 or the grounding end 300.

[0057] This embodiment further provides a grounding device, comprising a grounded element 200 , a grounding terminal 300 , and a grounding structure 100 according to any one of the above embodiments. The grounding structure 100 is electrically connected to the grounded element 200 and the grounding terminal 300 .

[0058] In the grounding device of the above embodiment, when the grounding structure 100 is sandwiched between the grounded component 200 and the grounding terminal 300, the exhaust port 20 can be switched from a closed state to an open state, allowing the gas within the chamber 10 to be released outward through the exhaust port 20. This reduces or offsets the reaction force applied by the chamber 10 to the grounded component 200 or the grounding terminal 300, thereby alleviating or preventing damage to the grounded component 200 or the grounding terminal 300. For example, this can reduce or prevent problems such as white spots, breakage, or local deformation of the grounded component 200 caused by the reaction force of the grounding structure 100. Therefore, the grounding structure 100 not only ensures a reliable electrical connection between the grounded component 200 and the grounding terminal 300, but also improves the safety and reliability of the grounded component 200 during assembly or use, enhancing the functional effectiveness of the grounded component 200 and the overall quality of the device. The grounding structure 100 is simple in structure.

[0059] In some embodiments, the element to be grounded 200 includes a functional module of an electronic device, and the grounding terminal 300 includes a frame or a housing.

[0060] Exemplarily, the element to be grounded 200 includes the element to be grounded 200 of any one of the above embodiments. The grounding terminal 300 includes the grounding terminal 300 of any one of the above embodiments.

[0061] This embodiment further provides an electronic device, comprising the grounding device of any one of the above embodiments.

[0062] In the electronic device of the above embodiment, when the grounding structure 100 is sandwiched between the grounded component 200 and the grounding terminal 300, the exhaust port 20 can be switched from a closed state to an open state to release the gas within the chamber 10 outward through the exhaust port 20, thereby reducing or offsetting the reaction force applied by the chamber 10 to the grounded component 200 or the grounding terminal 300, thereby alleviating or preventing damage to the grounded component 200 or the grounding terminal 300. For example, the reaction force of the grounding structure 100 on the grounded component 200 can be reduced or avoided, resulting in white spots, easy breakage of the grounded component 200, or local deformation of the grounded component 200. Therefore, the grounding structure 100 can not only achieve a reliable electrical connection between the grounded component 200 and the grounding terminal 300, but also improve the safety and reliability of the grounded component 200 during assembly or use, thereby enhancing the functional effectiveness of the grounded component 200 and the quality of the entire device. The grounding structure 100 has a simple structure.

[0063] Illustratively, the electronic device includes the electronic device of any one of the above embodiments.

[0064] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "mechanically coupled", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. The mechanical coupling or coupling of two components includes direct coupling and indirect coupling, for example, direct fixed connection, connection through a transmission mechanism, etc. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0065] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0066] The disclosure above provides many different embodiments or examples for realizing different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present disclosure provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0067] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific method steps, features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific method steps, features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0068] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present disclosure, and such modifications or substitutions should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A grounding structure, wherein: The grounding structure includes a chamber portion and an exhaust port portion; wherein, when the grounding structure is sandwiched between the element to be grounded and the grounding end, the exhaust port portion can be switched from a closed state to an open state to release the gas in the chamber portion to the outside through the exhaust port portion.

2. The grounding structure according to claim 1, wherein: The exhaust port portion can be switched from the closed state to the open state when a force is applied.

3. The grounding structure according to claim 2, wherein: The exhaust port portion can be switched from the closed state to the open state when the chamber portion is pressed.

4. The grounding structure according to claim 1, wherein: The exhaust port portion comprises: an opening sub-portion, communicating with the chamber portion; A sealing member is provided at the opening sub-portion and is used for sealing the opening sub-portion; the sealing member can open the opening sub-portion when a preset condition is met.

5. The grounding structure according to claim 4, wherein: The preset condition includes at least one of the following: the pressure in the chamber reaches a preset pressure; the ambient temperature of the sealing element reaches a preset temperature.

6. The grounding structure according to claim 4, wherein: The number of the sealing members includes a plurality, and the plurality of sealing members are arranged at intervals along the gas discharge direction.

7. The grounding structure according to claim 4, wherein: The number of the exhaust port portion includes one; or, The number of the exhaust openings includes at least two, and each exhaust opening is correspondingly provided with the sealing member.

8. The grounding structure according to claim 1, wherein: The grounding structure comprises: a deformable member, formed with the chamber portion and the exhaust port portion; The conductive layer is arranged on a side of the deformable member away from the chamber portion, and is used for conductively connecting the element to be grounded and the grounding terminal.

9. A grounding device, wherein: include: Components to be grounded; Ground terminal; as well as The grounding structure according to any one of claims 1 to 8, electrically connected to the element to be grounded and the grounding terminal.

10. The grounding device according to claim 9, wherein: The element to be grounded includes a functional module of an electronic device, and the grounding end includes a frame or a housing.

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