Support and chip assembly

Abstract

The present invention relates to the technical field of chip assemblies, and provides in particular a support and a chip assembly. The present application aims to solve the problem that, between a chip and a heat sink, high thermal resistance causes the heat dissipation effect of the chip to be poor. For this purpose, the support of the present application comprises a support body and a plurality of support legs. A portion of the support body is recessed to form a protruding enclosure, and the plurality of support legs are arranged on the support body and extend along the support body to the outside of the support body. The height at which the lowest point of the support legs is located is higher than the height at which the lowest point of the protruding enclosure is located, so that the support is connected to a heat dissipation structure in a chip assembly. The protruding enclosure may be in contact with a circuit board which is arranged between the support and the heat dissipation structure, enabling a chip which is arranged between the circuit board and the heat dissipation structure to tightly adhere to the heat dissipation structure, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure, improving the heat dissipation effect of the chip, and solving the current problem that, between the chip and the heat dissipation structure, high thermal resistance causes the heat dissipation effect of the chip to be poor.

Description

Bracket and chip components

[0001] This application claims priority to Chinese patent application CN202310884728.4, filed on July 18, 2023, with the invention name “Standard and Chip Assembly”. The entire contents of the above Chinese patent application are incorporated into this application by reference. Technical Field

[0002] The present invention relates to the field of chip components, and specifically provides a bracket and a chip component. Background Art

[0003] With the advancement of technology, electronic products are becoming increasingly intelligent and complex, and electronic components are becoming increasingly smaller and smaller, with component density per unit area increasing. Vehicle controllers, on the other hand, rely on multiple chips to operate, generating significant heat. Cooling is essential to ensure proper operation.

[0004] In the prior art, chip assemblies include a circuit board and a heat sink in addition to the chip. The chip is positioned between the heat sink and the circuit board. The heat sink dissipates heat from the chip. However, due to the high thermal resistance between the chip and the heat sink, the heat dissipation effect is poor, making the chip prone to downtime during use.

[0005] Therefore, this field needs a new technical solution to solve the above problems.

[0006] Summary of the Invention

[0007] In order to solve at least one problem in the prior art, namely, to solve the problem of poor heat dissipation effect of the chip due to large thermal resistance between the chip and the heat sink, the present application provides a bracket, which includes:

[0008] a bracket body, wherein a portion of the bracket body is recessed to form a convex hull;

[0009] Multiple supporting legs are arranged on the bracket body and extend out of the bracket body along the bracket body; a first connecting structure is arranged on the supporting legs, and the height of the lowest point of the supporting legs is higher than the height of the lowest point of the convex hull.

[0010] In a preferred technical solution of the above-mentioned bracket, a hole is opened on the bracket body, and the circumferential edge of the hole is recessed to form the convex bump.

[0011] In a preferred technical solution of the above-mentioned bracket, there are multiple convex hulls, and the multiple convex hulls are distributed at intervals along the circumferential edge of the hole.

[0012] In the preferred technical solution of the above-mentioned bracket, the support leg includes a first connecting leg and a second connecting leg, the first connecting leg extends along the bracket body in an inclined direction away from the bulge, the second connecting leg extends along the first connecting leg in a direction away from the bracket body, and the first connecting structure is provided on the second connecting leg.

[0013] In a preferred technical solution of the above-mentioned bracket, a first angle is formed between the first connecting leg and the bracket body, and the first angle is greater than 90° and less than 180°.

[0014] In a preferred technical solution of the above-mentioned bracket, a second angle is defined between the first connecting leg and the second connecting leg, and the second angle is greater than or equal to the first angle.

[0015] In a preferred technical solution of the above bracket, the first connecting structure is a mounting hole.

[0016] In a preferred technical solution of the above-mentioned bracket, the mounting hole extends to the edge of the support leg to form a notch, and the opening of the notch is arranged away from the bracket body.

[0017] In a preferred technical solution of the above-mentioned bracket, the plurality of legs are arranged on the bracket body in a centrally symmetrical manner.

[0018] In a preferred technical solution of the above bracket, when the first connecting structure is a mounting hole, the mounting holes arranged diagonally are grouped together, and the aperture of at least one group of the mounting holes is smaller than the apertures of the mounting holes in other groups.

[0019] In a preferred technical solution of the above-mentioned bracket, the bracket body and the supporting legs are integrally formed.

[0020] In the preferred technical solution of the above-mentioned bracket, the bracket body is made of high carbon steel; and / or

[0021] The material of the supporting legs is high carbon steel.

[0022] Those skilled in the art can understand that the bracket of the present application includes a bracket body and multiple legs, a part of the bracket body is recessed to form a convex bulge, and the multiple legs are arranged on the bracket body and extend out of the bracket body along the bracket body, and the height of the lowest point of the legs is higher than the height of the lowest point of the bulge, so that after the bracket is connected to the heat dissipation structure in the chip assembly, the bulge can abut against the circuit board arranged between the bracket and the heat dissipation structure, so that the chip arranged between the circuit board and the heat dissipation structure and the heat dissipation structure can be tightly fitted, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure, increasing the heat dissipation effect of the chip, and solving the problem of poor heat dissipation effect of the chip due to large thermal resistance between the chip and the heat dissipation structure.

[0023] Furthermore, by opening a hole on the bracket body and forming a plurality of convex humps on the circumferential edge of the hole, and the plurality of convex humps are distributed at intervals along the circumferential edge of the hole, the force exerted by the convex humps on the circuit board can be made more uniform, thereby making the force between the chip and the heat dissipation structure more uniform, thereby improving the heat dissipation effect of the chip.

[0024] Furthermore, by tilting the first connecting pin, it is helpful to adjust the magnitude of the force exerted by the convex bump on the circuit board, and then adjust the fitting force between the chip and the heat dissipation structure, thereby helping to reduce the thermal resistance between the chip and the heat dissipation structure and improve the heat dissipation effect of the chip.

[0025] Furthermore, by arranging the second connecting leg obliquely relative to the first connecting leg, the fastener can be in surface contact with the first connecting structure, thereby facilitating increasing the uniformity of the force exerted by the bump on the circuit board.

[0026] Furthermore, by configuring the first connecting structure as a notch structure, the strength of the supporting leg can be reduced, thereby making it easier for the fastener to make surface contact with the first connecting structure.

[0027] Furthermore, by making the aperture of at least one group of mounting holes smaller than the apertures of the other groups of mounting holes, the group of mounting holes with smaller apertures can be used for positioning, which is beneficial for the installation of the bracket and the heat dissipation structure.

[0028] Furthermore, by limiting the material of the bracket body and / or the bracket legs to high carbon steel, the yield strength and reliability of the bracket can be improved, and at the same time, the bracket can be reused.

[0029] The present application also provides a chip assembly, which includes a circuit board, a heat dissipation structure, a chip, and a bracket according to any of the above preferred technologies;

[0030] The bracket and the chip are arranged on different sides of the circuit board, and the heat dissipation structure is arranged on a side of the chip away from the bracket;

[0031] The heat dissipation structure is provided with a second connection structure, and the second connection structure is configured to be connected to the first connection structure through a connector, so that the chip and the heat dissipation structure can be tightly fitted under the action of the convex bump.

[0032] In a preferred technical solution of the above bracket, the second connection structure is a boss, the boss is provided on a side of the heat dissipation structure close to the chip, and an area surrounded by a plurality of the bosses on the heat dissipation structure is in contact with the chip;

[0033] A connecting groove is formed on the boss, and the connecting groove and the first connecting structure can be connected via the connecting piece.

[0034] In a preferred technical solution of the above-mentioned bracket, an insulating film is provided between the convex bump and the circuit board.

[0035] Those skilled in the art can understand that the chip assembly of the present application includes a circuit board, a heat dissipation structure, a chip and a bracket. The bracket and the chip are arranged on different sides of the circuit board, and the heat dissipation structure is arranged on the side of the chip away from the bracket. The second connecting structure on the heat dissipation structure can be connected to the first connecting structure on the bracket through a connecting member, so that after the bracket is connected to the heat dissipation structure, the bulge can abut against the circuit board in the chip assembly, so that the chip and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure, increasing the heat dissipation effect of the chip, and solving the problem of poor heat dissipation effect of the chip due to large thermal resistance between the chip and the heat dissipation structure.

[0036] Furthermore, by fitting the chip to the area surrounded by the plurality of bosses on the heat dissipation structure, the force exerted by the bosses on the circuit board can act on the chip, thereby reducing the strain on the circuit board.

[0037] Furthermore, by providing an insulating film between the convex bump and the circuit board, the insulating film can, on the one hand, play an insulating role to prevent a short circuit between the convex bump and the circuit board, and on the other hand, can also make the force applied by the bracket on the circuit board more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

[0039] FIG1 is a structural diagram of a stent according to the present invention;

[0040] FIG2 is a top view of the bracket of the present invention;

[0041] FIG3 is a front view of the bracket of the present invention;

[0042] FIG4 is a structural diagram of a chip assembly of the present invention;

[0043] FIG5 is a cross-sectional view of the chip assembly of the present invention.

[0044] List of reference numerals: 1. bracket; 11. bracket body; 111. convex bump; 112. hole; 12. leg; 121. first connecting leg; 122. second connecting leg; 1221. notch; 2. circuit board; 3. water cooling plate; 31. boss; 311. connecting groove; 4. chip; 5. connector. DETAILED DESCRIPTION

[0045] The preferred embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. For example, although this embodiment is introduced in conjunction with the application to a vehicle controller, this is not intended to limit the scope of protection of the present application. Without departing from the principles of the present application, those skilled in the art can apply the present application to other application scenarios. For example, the bracket of the present application can obviously also be applied to other types of controllers, such as air-conditioning controllers, etc.

[0046] It should be noted that, in the description of this application, terms such as "upper", "lower", "inner", "bottom", "end" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on this application.

[0047] In addition, it should be noted that in the description of this application, unless otherwise specified, stipulated, or limited, the terms "disposed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0048] First, the bracket of the present application is described with reference to Figures 1 to 3 , wherein Figure 1 is a structural diagram of the bracket of the present invention, Figure 2 is a top view of the bracket of the present invention, and Figure 3 is a front view of the bracket of the present invention.

[0049] In the prior art, the chip assembly includes a chip 4, a circuit board 2 and a heat dissipation structure, wherein the chip 4 is arranged between the heat dissipation structure and the circuit board 2, but the thermal resistance between the chip 4 and the radiator is relatively large, resulting in poor heat dissipation effect of the chip 4. In order to solve the problem of poor heat dissipation effect of the chip 4 due to the large thermal resistance between the chip 4 and the radiator, the bracket 1 of the present application includes a bracket body 11 and a plurality of legs 12. Part of the bracket body 11 is recessed to form a convex 111. The plurality of legs 12 are arranged on the bracket body 11 and extend along the bracket body 11 to the outside of the bracket body 11. A first connecting structure is provided on the leg 12, and the height of the lowest point of the leg 12 is higher than the height of the lowest point of the convex 111.

[0050] In this application, the bracket 1 and the chip 4 are arranged on different sides of the circuit board 2, and the heat dissipation structure is arranged on the side of the chip 4 away from the bracket 1. The bracket 1 is configured to be connected to the heat dissipation structure through a first connecting structure, so that after the bracket 1 is connected to the heat dissipation structure, the convex bump 111 can abut against the circuit board 2 in the chip assembly, so that the chip 4 and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip 4 and the heat dissipation structure, increasing the heat dissipation effect of the chip 4, and solving the current problem of poor heat dissipation effect of the chip 4 due to large thermal resistance between the chip 4 and the heat dissipation structure.

[0051] 1-3 , a preferred embodiment of the bracket 1 of the present application is described below. Those skilled in the art will appreciate that the embodiments described below are merely intended to illustrate the principles of the present application and are not intended to limit the scope of protection of the present application. On the premise that the bracket 1 includes at least a bracket body 11 and a plurality of legs 12, those skilled in the art may adjust the following configuration so that the present application can be applied to more specific application scenarios.

[0052] 1-3 , the bracket body 11 is a sheet metal stamping part made of high carbon steel with a carbon content of 0.6. The bracket body 11 made of this material has a high yield strength. The bracket body 11 is rectangular in shape, with a hole 112 in the middle. The hole 112 is a rounded rectangular hole. The edges of the rounded rectangular hole are recessed in the direction of the circuit board (the rear side as shown in FIG2 ) to form a convex bump 111, and the convex surfaces of the four convex bumps 111 are all flat, and the flat surface is a rounded rectangle. The planes of the four convex bumps 111 are all on the same plane, so that the four convex bumps 111 can abut against the circuit board 2. The convex bumps 111 on both sides of the length direction of the bracket body 11 (the left and right sides as shown in FIG1 ) are symmetrically arranged, and the convex bumps 111 on both sides of the width direction (the upper and lower sides as shown in FIG1 ) are symmetrically arranged.

[0053] Of course, the material and shape of the bracket body 11 are not fixed in this application, and those skilled in the art may adjust them according to the specific application scenario. For example, the bracket body 11 may be made of high-carbon steel with other carbon contents, such as high-carbon steel with a carbon content of 0.7, 0.8, or other values. Also / or, the shape of the bracket body 11 may be circular, triangular, pentagonal, or other shapes.

[0054] In addition, the shape of the hole 112 is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the shape of the hole 112 can also be circular, triangular, pentagonal, or other shapes. It should be noted that the shape of the hole 112 can be the same as the shape of the bracket body 11, such as the shape of the hole 112 and the shape of the bracket body 11 can both be rectangular. Alternatively, the shape of the hole 112 can also be different from the shape of the bracket 1, such as the shape of the hole 112 can be circular and the shape of the bracket body 11 can be rectangular.

[0055] In addition, the number and shape of the convex hulls 111 are not fixed in this application, and those skilled in the art can adjust them as needed. For example, the number of convex hulls 111 can also be 1, 8, 12 or other numbers. And / or, the plane of the convex hull 111 can be circular, arc-shaped or other shapes. When the number of convex hulls 111 is 1, the convex hull 111 is arranged circumferentially along the circumferential edge of the hole 112. In this case, the convex hull 111 is an circumferential convex hull 111. When the number of convex hulls 111 is 8, two convex hulls 111 can be arranged on both sides of the hole 112 along its length direction and on both sides of its width direction.

[0056] It should also be noted that in other preferred embodiments, the provision of hole 112 is not required and can be selected by those skilled in the art as needed. When the bracket body 11 does not have hole 112, the number of bumps 111 can be one or more. When there is only one bump 111, it is located in the middle of the bracket body 11, and the flat surface area of ​​the bump 111 is relatively large. When there are multiple bumps 111, the bumps 111 can be evenly spaced along the outer circumference of the bracket body 11.

[0057] Referring now to Figures 1-3, the four corners of the bracket body 11 are each provided with a support leg 12, and the four support legs 12 all extend along the bracket body 11 in a direction away from the bracket body 11, and the bracket body 11 is connected to the support legs 12 by an arc chamfer. The four support legs 12 are of a centrally symmetrical structure, so that there are two groups of diagonally arranged support legs 12 in the four corners. The end of the support legs 12 away from the bracket body 11 is provided with a mounting hole, and the mounting hole extends to the edge of the support leg 12 to form a U-shaped notch 1221. The opening of the U-shaped notch 1221 is set away from the bracket body 11, that is, the U-shaped notch 1221 on the four support legs 12 is also said to be centrally symmetrically arranged. The aperture of one group of diagonally arranged mounting holes is smaller than the aperture of the other group of diagonally arranged mounting holes. The group of mounting holes with a smaller aperture can be used for positioning. That is, after the group of mounting holes with a smaller aperture is preferentially mounted to the heat dissipation structure by screws, the connection stability between the bracket 1 and the heat dissipation structure is good, which can facilitate the connection of mounting holes with other apertures to the heat dissipation structure by screws.

[0058] Of course, the present application does not have a fixed arrangement for the support legs 12 on the bracket body 11, and those skilled in the art can adjust it as needed. For example, the four support legs 12 can also be an axisymmetric structure. In addition, the present application does not have fixed arrangement positions and arrangement numbers for the support legs 12, and those skilled in the art can adjust it as needed. For example, in addition to the support legs 12 being arranged at the four corners of the bracket body 11, one, two, or other number of support legs 12 can also be arranged on both sides of the length direction and both sides of the width direction of the bracket body 11. Alternatively, one, two, or other number of support legs 12 can also be arranged on both sides of the length direction and both sides of the width direction of the bracket body 11. Among them, when one support leg 12 can also be arranged on both sides of the length direction and both sides of the width direction of the bracket body 11, the support legs 12 on both sides of the length direction of the bracket body 11 are symmetrically arranged, and the support legs 12 on both sides of the width direction are symmetrically arranged.

[0059] It should be noted that, in addition to being able to connect the support leg 12 and the bracket body 11 with a circular chamfer, they can also be connected with a straight chamfer, or the support leg 12 can be directly connected to the bracket body 11. In addition, the shape of the notch 1221 is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the shape of the notch 1221 can be vase-shaped.

[0060] 1-3 , the support leg 12 includes a first connecting leg 121 and a second connecting leg 122. The first connecting leg 121 is arranged obliquely upward along the bracket body 11, and the second connecting leg 122 is arranged obliquely upward along the first connecting leg 121 toward the end away from the bracket body 11. A first angle is defined between the first connecting leg 121 and the main body of the support leg 12, wherein the first angle is greater than 90° and less than 180°. A second angle is defined between the first connecting leg 121 and the second connecting leg 122, wherein the second angle is greater than the angle between the first connecting leg 121 and the bracket body 11. This allows the nut of the screw to contact the surface of the second connecting leg 122 when the bracket 1 is connected to the heat dissipation structure via screws, so that the force applied to the circuit board 2 is more uniform when the bracket 1 is connected to the heat dissipation structure.

[0061] Of course, the second angle is not fixed in this application, and those skilled in the art can adjust it according to specific application scenarios. For example, the second angle can be equal to the first angle.

[0062] 1-3, the first connecting leg 121 and the second connecting leg 122 are integrally formed to form the support leg 12, and the support leg 12 is integrally formed with the bracket body 11. The support leg 12 and the bracket body 11 are made of the same material, high carbon steel with a carbon content of 0.6.

[0063] Of course, the connection method between the first connecting leg 121 and the second connecting leg 122 and the first connecting leg 121 and the bracket body 11 is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the first connecting leg 121 and the second connecting leg 122 can be connected by welding. And / or, the first connecting leg 121 and the bracket body 11 can be connected by welding. In addition, the material of the support leg 12 and the bracket body 11 can be different. For example, the material of the support leg 12 is iron or other metal. And / or, the bracket body 11 can be high carbon steel with a carbon content of 0.6 or other values.

[0064] Next, the chip assembly of the present application will be introduced with reference to Figures 4 and 5. Figure 4 is a structural diagram of the chip assembly of the present invention, and Figure 5 is a cross-sectional view of the chip assembly of the present invention.

[0065] As shown in Figures 4 and 5, the chip assembly of the present application includes a circuit board 2, a heat dissipation structure, a chip 4, and a bracket 1 in any of the above-mentioned specific embodiments. The bracket 1 and the chip 4 are arranged on different sides of the circuit board 2, and the heat dissipation structure is arranged on the side of the chip 4 away from the bracket 1. A second connecting structure is provided on the heat dissipation structure, and the second connecting structure is configured to be connected to the first connecting structure via a connector 5, so that the chip 4 and the heat dissipation structure can be tightly fitted together under the action of the bump 111.

[0066] In the present application, the second connecting structure on the heat dissipation structure can be connected to the first connecting structure on the bracket 1 through the connecting member 5, so that after the bracket 1 is connected to the heat dissipation structure, the convex bump 111 can abut against the circuit board 2 in the chip assembly, so that the chip 4 and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip 4 and the heat dissipation structure, increasing the heat dissipation effect of the chip 4, and solving the current problem of poor heat dissipation effect of the chip 4 due to the large thermal resistance between the chip 4 and the heat dissipation structure.

[0067] Next, referring to Figures 4 and 5, bosses 31 are provided on the heat dissipation structure, and the number of bosses 31 is the same as and corresponds to the number of mounting holes on the bracket 1. The bosses 31 are provided on the side of the heat dissipation structure close to the chip 4, and the area surrounded by multiple bosses 31 on the heat dissipation structure fits the chip 4, so that the force applied by the bosses 31 on the circuit board 2 can act on the chip 4, avoiding strain on the circuit board 2. A connecting groove 311 is provided on the boss 31, and the connecting groove 311 and the mounting hole can be connected by screws. A connecting hole corresponding to the mounting hole is provided on the circuit board 2, so that the nut of the screw rests on the second connecting foot 122, and the rod of the screw passes through the mounting hole, the connecting hole and the connecting groove 311 in sequence for threaded connection, thereby connecting the bracket 1 to the heat dissipation structure. Since the circuit board 2 and the chip 4 are arranged between the bracket 1 and the heat dissipation structure, when the bracket 1 is connected to the heat dissipation structure, the chip 4 can be tightly fitted with the heat dissipation structure, and as the tightening force of the screw continues to increase, the force exerted by the boss 31 on the circuit board 2 also increases, and the force between the chip 4 and the heat dissipation structure also increases. Therefore, as the distance between the second leg 12 and the circuit board 2 gradually decreases, the contact thermal resistance between the chip 4 and the heat dissipation structure becomes smaller, thereby making the heat dissipation effect of the chip 4 better.

[0068] Of course, the second connection structure on the heat dissipation structure is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the second connection structure can also be a connection groove 311 provided on the heat dissipation structure. In addition, this application does not limit the specific form of the heat dissipation structure, as long as the heat dissipation structure contacts the chip 4 and can dissipate heat from the chip 4. For example, the heat dissipation structure can be a water cooling plate 3.

[0069] It should be noted that the connecting member 5 can be a screw as well as a snap-fitting member that can be disassembled and assembled. The snap-fitting member can pass through the mounting hole, the connecting hole and the connecting groove 311 on the heat dissipation structure to form a snap connection, thereby achieving the connection between the bracket 1 and the heat dissipation structure.

[0070] Next, referring to Figure 5, a 4 mm thick Mylar film (not marked in Figure 5) is provided between the convex bump 111 and the circuit board 2. On the one hand, the Mylar film can play an insulating role to prevent a short circuit between the convex bump 111 and the circuit board 2. On the other hand, it can also make the force applied by the bracket 1 on the circuit board 2 more uniform.

[0071] Of course, the specific form of the insulating film is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the insulating film can also be a rubber gasket. In addition, the thickness of the insulating film is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the thickness of the insulating film can also be 3mm, 5mm, or other thickness values.

[0072] Of course, the above-mentioned replaceable implementations, as well as the replaceable implementations and the preferred implementations, can be used in a cross-functional manner to combine new implementations to suit more specific application scenarios.

[0073] Those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims of this application, any of the claimed embodiments may be used in any combination.

[0074] Thus far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present application.

Claims

1. A bracket, characterized in that: The support comprises: A support body, wherein a portion of the support body is recessed to form a convex bulge; A plurality of legs are arranged on the bracket body and extend out of the bracket body along the bracket body; a first connecting structure is arranged on the legs, and the height of the lowest point of the legs is higher than the height of the lowest point of the convex bulge.

2. The bracket according to claim 1, characterized in that: The bracket body is provided with a hole, and the circumferential edge of the hole is recessed to form the convex bump.

3. The bracket according to claim 2, characterized in that: There are multiple convex hulls, and the multiple convex hulls are distributed at intervals along the circumferential edge of the hole.

4. The bracket according to claim 1, characterized in that: The support leg includes a first connecting leg and a second connecting leg. The first connecting leg extends along the bracket body in a direction away from the bulge, and the second connecting leg extends along the first connecting leg in a direction away from the bracket body. The first connecting structure is arranged on the second connecting leg.

5. The bracket according to claim 4, characterized in that: A first angle is formed between the first connecting leg and the bracket body, and the first angle is greater than 90° and less than 180°.

6. The bracket according to claim 5, characterized in that: A second angle is formed between the first connecting leg and the second connecting leg, and the second angle is greater than or equal to the first angle.

7. The bracket according to any one of claims 1 to 6, characterized in that: The first connection structure is a mounting hole.

8. The bracket according to claim 7, characterized in that: The mounting hole extends to the edge of the supporting leg to form a notch, and the opening of the notch is arranged away from the bracket body.

9. The bracket according to claim 1, characterized in that: The plurality of legs are arranged on the bracket body in a centrally symmetrical manner.

10. The bracket according to claim 9, characterized in that: When the first connection structure is a mounting hole, the mounting holes arranged diagonally are grouped together, and the hole diameter of at least one group of the mounting holes is smaller than the hole diameters of the mounting holes in other groups.

11. The bracket according to claim 1, characterized in that: The support body and the support legs are integrally formed.

12. The bracket according to claim 1, characterized in that: The material of the bracket body is high carbon steel; and / or The material of the supporting feet is high carbon steel.

13. A chip assembly, characterized in that: The chip assembly comprises a circuit board, a heat dissipation structure, a chip and a bracket according to any one of claims 1 to 12; The bracket and the chip are arranged on different sides of the circuit board, and the heat dissipation structure is arranged on a side of the chip away from the bracket; The heat dissipation structure is provided with a second connection structure, and the second connection structure is configured to be connectable to the first connection structure via a connection member, so that the chip and the heat dissipation structure can be closely fitted under the action of the convex bump.

14. The chip assembly according to claim 13, characterized in that: The second connection structure is a boss, the boss is arranged on a side of the heat dissipation structure close to the chip, and an area surrounded by a plurality of the bosses on the heat dissipation structure is in contact with the chip; A connecting groove is formed on the boss, and the connecting groove and the first connecting structure can be connected via the connecting piece.

15. The chip assembly according to claim 13, characterized in that: An insulating film is arranged between the convex bump and the circuit board.

Images