Antenna structure and electronic device comprising same

Abstract

According to an embodiment of the present disclosure, an electronic device may comprise a housing, a circuit board, an antenna module, or a conductive support member. The housing may include a ground area. The antenna module may be disposed in the housing. The antenna module may be electrically connected to the circuit board. The antenna module may include a substrate or an antenna array. The antenna array may be disposed on the substrate. The conductive support member may be configured to support the antenna module. The conductive support member may include a bracket or a contact portion. The bracket may surround at least a part of the substrate. The contact portion may protrude from the bracket. The contact portion may be electrically connected to the ground area. Various other embodiments may also be possible.

Description

Antenna structure and electronic device including the same

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, to antenna structures and electronic devices including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device may include a housing, a circuit board, an antenna module, or a conductive support member. The housing may include a ground region. The circuit board may be disposed within the housing. The antenna module may be disposed within the housing. The antenna module may be electrically connected to the circuit board. The antenna module may include a substrate or an antenna array. The antenna array may be disposed on the substrate. The conductive support member may be configured to support the antenna module. The conductive support member may include a bracket or a contact portion. The bracket may surround at least a portion of the substrate. The contact portion may protrude from the bracket. The contact portion may contact the ground region. The contact portion may be electrically connected to the ground region.

[0006] According to one embodiment of the present disclosure, an electronic device may include a housing, a circuit board, an antenna module, a conductive support member, or a shielding member. The housing may include a ground region. The circuit board may be disposed within the housing. The antenna module may be disposed within the housing. The antenna module may be electrically connected to the circuit board. The antenna module may include a substrate or an antenna array. The antenna array may be disposed on the substrate. The conductive support member may be configured to support the antenna module. The conductive support member may include a bracket or a contact portion. The bracket may surround at least a portion of the substrate. The contact portion may protrude from the bracket. The contact portion may contact the ground region. The contact portion may be electrically connected to the ground region. The shielding member may be disposed between the bracket and the substrate. The shielding member may be electrically connected to the bracket or the substrate.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 6 is a front view of an electronic device including an antenna module according to one embodiment of the present disclosure.

[0013] FIG. 7 is an enlarged view of portion “A” of FIG. 6 according to one embodiment of the present disclosure.

[0014] FIG. 8 is a perspective view of an electronic device including an antenna module according to one embodiment of the present disclosure.

[0015] FIG. 9 is a perspective view of an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0016] FIG. 10 is a perspective view of an antenna module according to one embodiment of the present disclosure.

[0017] FIG. 11 is a perspective view of an antenna module according to one embodiment of the present disclosure.

[0018] FIG. 12 is a perspective view of a conductive support member according to one embodiment of the present disclosure.

[0019] FIG. 13 is a cross-sectional view of an electronic device along line BB' of FIG. 7, according to one embodiment of the present disclosure.

[0020] FIG. 14 is a cross-sectional view of an electronic device taken along line BB' of FIG. 7 according to one embodiment of the present disclosure.

[0021] FIG. 15 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 16A is a plan view showing a second-first support portion of a conductive support member according to one embodiment of the present disclosure.

[0023] FIG. 16b is a cross-sectional view taken along line CC' of FIG. 16a according to one embodiment of the present disclosure.

[0024] FIG. 17a is a plan view showing a second-first support portion of a conductive support member according to one embodiment of the present disclosure.

[0025] FIG. 17b is a cross-sectional view taken along line DD' of FIG. 17a according to one embodiment of the present disclosure.

[0026] FIG. 18a is a plan view showing a second-1 support portion and a contact portion of a support member according to one embodiment of the present disclosure.

[0027] FIG. 18b is a cross-sectional view taken along line EE' of FIG. 18a according to one embodiment of the present disclosure.

[0028] FIG. 19 is a rear view of an electronic device including an antenna module according to one embodiment of the present disclosure.

[0029] FIG. 20 is a cross-sectional view of an electronic device taken along line FF' of FIG. 19 according to one embodiment of the present disclosure.

[0030] FIG. 21 is a perspective view of a conductive support member according to one embodiment of the present disclosure.

[0031] FIG. 22 is a perspective view of a conductive support member according to one embodiment of the present disclosure.

[0032] FIG. 23 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 24 is a perspective view showing an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0034] FIG. 25 is a perspective view showing an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0035] FIG. 26 is a perspective view showing an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0036] FIG. 27 is a perspective view illustrating an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0037] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0038] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0061] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0062] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0063] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0064] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0065] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0066] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0067] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0068] Hereinafter, for convenience of explanation of FIGS. 2 to 27, FIGS. 2 to 27 illustrate an orthogonal coordinate system defined and / or interpreted with an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. Hereinafter, for convenience of explanation, the X-axis direction may be defined and interpreted as the width direction of the electronic device or components, the Y-axis direction may be defined and interpreted as the length direction of the electronic device or components, and the Z-axis direction may be defined and interpreted as the height direction (or thickness direction) of the electronic device or components.

[0069] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 27.

[0070] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0071] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0072] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0073] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0074] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0075] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0076] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0077] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0078] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0079] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0080] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (472) that can accommodate a connector (e.g., an earphone jack) (209) for transmitting and receiving audio signals with an external electronic device.

[0081] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0082] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0083] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 27.

[0084] Referring to FIGS. 3 and 4, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (341, 343), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (341, 343), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (345). For example, the printed circuit boards (341, 343) can include a first circuit board (341) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (343) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (345) can electrically connect the first circuit board (341) and the second circuit board (343).

[0085] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 3, and any redundant description will be omitted below.

[0086] According to one embodiment, the first support member (311) may be provided in at least one portion in a flat shape. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is at least partially formed of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (341, 343) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (341, 343). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0087] In one embodiment, the first support member (311) and the side structure (310) may be combined to be referred to as a front case or housing (301). In one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (341, 343) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). In one embodiment, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 2 or the second surface (210B) of FIG. 3. In one embodiment, the first support member (311) is positioned between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the back plate (380) (e.g., the second side (210B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (341, 343) or a camera assembly (307).

[0088] According to one embodiment, the side structure (310) may include at least one side wall (3101, 3102, 3103, 3104). The at least one side wall (3101, 3102, 3103, 3104) may include a first side wall (3101), a second side wall (3102), a third side wall (3103), or a fourth side wall (3104). The at least one side wall (3101, 3102, 3103, 3104) may be defined and / or referred to as at least one side.

[0089] According to one embodiment, the first side wall (3101) may be defined and / or referred to as a lower wall of the electronic device (101).

[0090] In one embodiment, the second side wall (3102) may extend from the first side wall (3101) and be positioned substantially perpendicular to the first side wall (3101). For example, the second side wall (3102) may extend from one end of the first side wall (3101) (e.g., the end facing the -X direction in FIGS. 4 and 5 ).

[0091] According to one embodiment, the third side wall (3103) may extend from the first side wall (3101) and may be arranged substantially perpendicular to the first side wall (3101). For example, the third side wall (3103) may extend from the other end of the first side wall (3101) (e.g., the end facing the +X direction of FIGS. 4 and 5). The third side wall (3103) may be arranged substantially parallel to the second side wall (3102).

[0092] According to one embodiment, the fourth side wall (3104) may be defined and / or referred to as an upper wall of the electronic device (101).

[0093] According to one embodiment, the fourth side wall (3104) may extend from one end of the second side wall (3102) (e.g., the end facing the +Y direction of FIGS. 4 to 5). The fourth side wall (3104) may extend from one end of the second side wall (3102) (e.g., the end facing the +Y direction of FIGS. 4 to 5).

[0094] In one embodiment, the fourth side wall (3104) may be arranged substantially perpendicular to the second side wall (3102) and / or the third side wall (3103). Additionally, the fourth side wall (3104) may be arranged substantially parallel to the first side wall (3101).

[0095] According to one embodiment, the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104) may each include an inner surface facing the inside of the electronic device (101) and an outer surface facing the outside of the electronic device (101).

[0096] According to one embodiment, the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104) may be formed integrally. According to one embodiment, the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104) may each be manufactured as separate members and assembled into a single side structure (310).

[0097] According to one embodiment, the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104) may each be formed of a metallic material and / or a non-metallic material (e.g., a polymer).

[0098] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0099] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0100] According to one embodiment, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (341, 343) (e.g., the first circuit board (341)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (341) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (343) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (341, 343), and according to an embodiment, the printed circuit boards (341, 343) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be placed to surround the additional printed circuit board together with another part of the first support member (311). A speaker module or interface arranged on an additional printed circuit board or lower support member (360b) not shown may be arranged corresponding to the audio module (207) or connector hole (208, 209) of FIG. 2.

[0101] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (341, 343). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0102] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0103] In one embodiment, the camera assembly (307) may include at least one camera module. Inside the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a location adjacent to the printed circuit board (341, 343). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (312, 313, 319) and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0104] FIG. 6 is a front view of an electronic device including an antenna module according to one embodiment of the present disclosure.

[0105] FIG. 7 is an enlarged view of portion “A” of FIG. 6 according to one embodiment of the present disclosure.

[0106] FIG. 8 is a perspective view of an electronic device including an antenna module according to one embodiment of the present disclosure.

[0107] FIG. 9 is a perspective view of an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0108] FIG. 10 is a perspective view of an antenna module according to one embodiment of the present disclosure.

[0109] FIG. 11 is a perspective view of an antenna module according to one embodiment of the present disclosure.

[0110] FIG. 12 is a perspective view of a conductive support member according to one embodiment of the present disclosure.

[0111] The embodiments of FIGS. 6 to 12 may be combined with the embodiments of FIGS. 1 to 5, or the embodiments of FIGS. 13 to 27.

[0112] Referring to FIGS. 6 to 12, an electronic device (101) (e.g., the electronic device (101) of FIGS. 1 to 5) may include a housing (301), a side structure (310), a first support member (311), an antenna module (401), a conductive support member (403), a shield member (450), a conductive connection member (470), or a reinforcing member (480). The housing (301) may include the first support member (311), or the side structure (310). The side structure (310) may include a second side wall (3102), a third side wall (3103), or a fourth side wall (3104).

[0113] The configuration of the housing (301), the side structure (310), the first support member (311), the second side wall (3102), the third side wall (3103), or the fourth side wall (3104) of FIGS. 6 to 8 may be partially or entirely the same as the configuration of the housing (301), the side structure (310), the first support member (311), the second side wall (3102), the third side wall (3103), or the fourth side wall (3104) of FIGS. 4 to 5.

[0114] According to one embodiment, the electronic device (101) may include at least one antenna structure (391). The at least one antenna structure (391) may form at least a portion of the housing (301). For example, the at least one antenna structure (391) may form at least a portion of the side structure (310). According to the illustrated embodiment, the at least one antenna structure (391) may be formed or positioned on at least a portion of the third side wall (3103), but is not limited thereto, and may be formed or positioned on another portion of the housing (301). The antenna structure (391) may be defined and / or referred to as a metal antenna, a metal housing antenna, or a segmentation antenna.

[0115] According to one embodiment, at least one antenna structure (391) may be formed of a metallic material. The at least one antenna structure (391) may be defined and / or interpreted as at least a portion of the third side wall (3103). The at least one antenna structure (391) may not be electrically connected to other portions of the third side wall (3103) by a non-conductive portion (392a, 392b). The non-conductive portion (392a, 392b) may be provided as a pair of non-conductive portions (392a, 392b) connected to opposite ends of the at least one antenna structure (391), but is not limited thereto. The non-conductive portion (392a, 392b) may be formed of a non-metallic material (e.g., a polymer). The above non-conductive portion (392a, 392b) can be combined with at least one antenna structure (391) through an injection molding process.

[0116] According to one embodiment, at least a portion of the housing (301) of the electronic device (101) may be formed of a non-metallic material (e.g., a polymer). For example, at least a portion of the side structure (310) may include a non-metallic region (393) formed of a non-metallic material. The non-metallic region (393) may form at least a portion of the side structure (310), and the remainder of the side structure (310) may be provided as a metal region formed of a metal material. At least a portion of the non-metallic region (393) may be positioned between the third side wall (3103) and the antenna module (401). The non-conductive portions (392a, 392b) may be defined and / or interpreted as a portion of the non-metallic region (393).

[0117] According to one embodiment, at least one antenna structure (391) may be separated from other metal portions of the third side wall (3103) by the non-conductive portion. The at least one antenna structure (391) may be defined and / or referred to as a segmentation antenna, a side wall antenna, a metal antenna, or a metal housing antenna. The at least one antenna structure (391) may be configured to transmit and / or receive a radio frequency (RF) signal of a designated frequency band with an external electronic device (101). The frequency band of the RF signal of the at least one antenna structure (391) may be different from, but is not limited to, the frequency band of the RF signal of the antenna module (401).

[0118] According to one embodiment, the electronic device (101) may further include a feeding portion or a ground portion. The feeding portion may include a conductive path (e.g., a coaxial cable or a flexible printed circuit board (FPCB)), and the conductive path of the feeding portion may be electrically connected to a communication module (e.g., the communication module (190) of FIG. 1) mounted (or arranged) on a first circuit board (e.g., the first circuit board (341) of FIGS. 4 and 5). The feeding portion may include a connecting member (e.g., a c-clip) that electrically connects the conductive path and the at least one antenna structure (391). The ground portion may include a conductive path (e.g., a coaxial cable or a flexible printed circuit board (FPCB)), and the conductive path of the ground portion may be electrically connected to a ground plane of a first circuit board (e.g., the first circuit board (341) of FIGS. 4 and 5). The ground portion may include a connecting member (e.g., a c-clip) that electrically connects the conductive path and the at least one antenna structure (391). The feeding portion may be configured to provide a feeding signal to at least one metal antenna, and the ground portion may be configured to provide a ground to at least one antenna structure (391).

[0119] In one embodiment, the antenna module (401) can be disposed within the housing (301). The antenna module (401) can be disposed, for example, at least partially adjacent to the side structure (310). The antenna module (401) can be disposed to form a beam toward the exterior of the housing (301). The antenna module (401) can include an antenna array (414) and can be configured to radiate an RF signal toward a direction in which the antenna array (414) faces. In the illustrated embodiment, the antenna module (401) is disposed or positioned adjacent to the third side wall (3103), but the position of the antenna module (401) is not limited thereto and can have various positions. The antenna module (401) and / or the antenna array (414) of the antenna module (401) can be disposed to face at least one antenna structure (391).

[0120] According to one embodiment, the antenna array (414) of the antenna module (401) may be arranged to face the outside of the housing (301). According to the illustrated embodiment, the antenna array (414) of the antenna module (401) may be arranged to face the direction in which the third side wall (3103) faces (e.g., the +X direction of FIGS. 6 to 7), but is not limited thereto, and may be arranged to face the rear plate of the housing (301) (e.g., the rear plate (380) of FIGS. 4 to 5).

[0121] According to one embodiment, the antenna module (401) may overlap with at least one antenna structure (391) in the width direction of the electronic device (101) (e.g., the X-axis direction of FIGS. 6 to 7). The antenna module (401) may be electrically connected to a first circuit board (e.g., the first circuit board (341) of FIGS. 4 to 5) through a conductive connecting member (470).

[0122] Referring to FIGS. 10 and 11, the antenna module (401) may include a substrate (410) or an antenna array (414) disposed on a first surface of the substrate (410). The antenna array (414) may include a plurality of antenna elements (414A, 414B, 414C, 414D, 414E) disposed on the first surface of the substrate (410). The plurality of antenna elements (414A, 414B, 414C, 414D, 414E) may be defined and / or referred to as a plurality of radiating patches. According to the illustrated embodiment, the plurality of antenna elements (414A, 414B, 414C, 414D, 414E) are illustrated as five, but are not limited thereto and may be provided in various numbers.

[0123] According to one embodiment, the substrate (410) may be defined and / or referred to as an antenna substrate (410). The substrate (410) may include at least one of a printed circuit board (PCB) (410), a flexible printed circuit board (FPCB) (410), or a rigid-flexible PCB (RF-PCB).

[0124] According to one embodiment, an antenna array (414) may be arranged or mounted on one side of the substrate (410) (e.g., a side facing the +X direction of FIGS. 6 to 12). At least one electrical component may be arranged or mounted on another side of the substrate (410) facing the opposite direction (e.g., a side facing the -X direction of FIGS. 6 to 12). The at least one electrical component may include a radio frequency integrated circuit (RFIC) electrically connected to the antenna array (414). The RFIC may be defined and / or referred to as a communication circuit.

[0125] According to one embodiment, the antenna module (401) may be configured to transmit and / or receive an RF signal to and from an external electronic device (101) via an antenna array (414). The frequency band of the RF signal of the antenna module (401) may be different from the frequency band of the RF signal of at least one antenna structure (391), but is not limited thereto. The RF signal provided by the antenna module (401) may have a frequency band of the mmWave (millimeter wave) band, but is not limited thereto.

[0126] Referring to FIG. 10, the substrate (410) may include a first substrate (410a) or a second substrate (410b). The first substrate (410a) may be provided as a plurality of first substrates (410a). An antenna array (414) may be arranged or mounted on the first substrate (410a). One surface of the first substrate (410a) on which the antenna array (414) is mounted may be defined and / or referred to as the first surface of the substrate (410). A communication circuit may be arranged or mounted on the second substrate (410b). The second substrate (410b) may be laminated on the first substrate (410a). The second substrate (410b) may be electrically connected to the first substrate (410a). One side of the second substrate (410b) may be defined and / or referred to as the second side of the substrate (410). The communication circuit may be arranged or mounted on the second side of the substrate (410). The second side of the substrate (410) or the second substrate (410b) may face a rear support portion of the conductive support member (403) (e.g., the second support portion (432)). The second side of the substrate (410) may face the opposite direction to the first side of the substrate (410). At least a portion of the second side of the substrate (410) may be covered by a shielding member (450). The substrate (410) may include a first connector (412) arranged on the second side of the substrate (410). The first connector (412) may include a board-to-board connector (B2B connector) and may be physically and / or electrically connected to the second connector (472) of the conductive connecting member (470). According to one embodiment, the substrate (410) may be provided as a plurality of substrates (410a, 410b), but is not limited thereto and may be provided as a single substrate (410) as shown in FIG. 11.

[0127] Referring to FIG. 11, an antenna array (414) may be arranged or mounted on one surface of a substrate (410) (e.g., a surface facing the +X direction of FIG. 11), and the one surface of the substrate (410) may be defined and / or referred to as a first surface of the substrate (410). A communication circuit may be arranged or mounted on the other surface of the substrate (410) (e.g., a surface facing the -X direction of FIG. 11), and the other surface of the substrate (410) may be defined and / or referred to as a second surface of the substrate (410). At least a portion of the second surface of the substrate (410) may be covered by a shielding member (450). The substrate (410) may include a first connector (412) arranged on the second surface of the substrate (410). The first connector (412) may include a board-to-board connector (B2B connector) and may be physically and / or electrically connected to a second connector (472) of a conductive connection member (470). The substrate (410) may include a first connector (412) disposed on a second surface of the substrate (410). The first connector (412) may include a board-to-board connector (B2B connector) and may be physically and / or electrically connected to a second connector (472) of a conductive connection member (470).

[0128] According to one embodiment, a reinforcing member (480) may be laminated on one surface of a conductive connecting member (470). The reinforcing member (480) may reduce or limit the transmission of an impact applied from the outside of the electronic device (101) to the conductive connecting member (470). For example, the reinforcing member (480) may include a stiffener configured to limit or prevent excessive deformation of the conductive connecting member (470).

[0129] Hereinafter, the antenna module (401) of the present disclosure will be described using the substrate (410) of FIG. 11 as an example, but the description thereof can be applied and / or understood in the same and / or similar manner even when the substrate (410) is provided as a plurality of substrates (410a, 410b) as in FIG. 10.

[0130] According to one embodiment, the electronic device (101) and / or the housing (301) may include a ground region (e.g., ground region (3113) of FIG. 13). For example, the first support member (311) may include a ground region that is electrically connected to a contact portion (440) of the conductive support member (403).

[0131] According to one embodiment, the electronic device (101) may include a shielding member (450) coupled to at least a portion of a second surface of the antenna module (401). The shielding member (450) may be electrically connected to a ground area of ​​the electronic device (101) (e.g., the ground area (3113) of FIG. 13). The shielding member (450) may receive a ground plane from the ground area. The shielding member (450) may be coupled to or disposed on a second surface of the substrate (410) (e.g., a surface facing the -X direction of FIGS. 6 to 12).

[0132] According to one embodiment, the shielding member (450) can block or reduce electromagnetic interference of other adjacent electrical / electronic components within the electronic device (101) with respect to the communication circuit. For example, electromagnetic waves generated from surrounding electrical / electronic components can act as noise to the communication circuit or the antenna module (401). In addition, electromagnetic waves generated from the communication circuit and / or the antenna module (401) can act as noise to surrounding electrical / electronic components. The shielding member (450) can guide electromagnetic waves to the ground region by being electrically connected to the ground region of the electronic device (101). Accordingly, the shielding member (450) can provide a shielding function by blocking electromagnetic interference between the antenna module (401) and / or the communication circuit and surrounding electrical / electronic components. The shielding member (450) can be formed of a metallic material. For example, the shielding member (450) may include a metal plate, a metal film, and / or a conductive sheet. The shielding member (450) may be defined and / or referred to as a shield-can.

[0133] According to one embodiment, the shielding member (450) can be electrically connected to a ground region of the electronic device (101) via the conductive support member (403).

[0134] According to one embodiment, the electronic device (101) may further include a conductive connection member (470). The conductive connection member (470) may include a second connector (472) configured to be physically and / or electrically connected to the first connector (412) of the substrate (410) of the antenna module (401). The second connector (472) may include a B2B connector. The conductive connection member (470) may be electrically connected to a main circuit board (e.g., the first circuit board (341) of FIGS. 4 and 5) and / or the antenna module (401).

[0135] According to one embodiment, the conductive connecting member (470) may be electrically connected to a main circuit board (e.g., the first circuit board (341) of FIGS. 4 and 5) of the electronic device (101). The conductive connecting member (470) may include at least one of a coaxial cable and a flexible printed circuit board (FPCB) (410).

[0136] Hereinafter, for the convenience of describing the configurations of the antenna module (401), the conductive support member (403), and / or the shielding member (450) of FIGS. 6 to 15, among the directions of the illustrated rectangular coordinate system, the +X direction may be defined and / or referred to as the front direction of the antenna module (401), the conductive support member (403), and / or the shielding member (450). The front direction may be the direction in which the antenna array (414) is directed. The -X direction may be defined and / or referred to as the rear direction of the antenna module (401), the conductive support member (403), and / or the shielding member (450). The +Z direction may be defined and / or referred to as the upward-facing side direction among the side surfaces of the antenna module (401), the conductive support member (403), and / or the shielding member (450). The -Z direction may be defined and / or referred to as a downward lateral direction among the side surfaces of the antenna module (401), the conductive support member (403), and / or the shielding member (450). The +Y direction may be defined and / or referred to as a leftward lateral direction among the side surfaces of the antenna module (401), the conductive support member (403), and / or the shielding member (450). The -Y direction may be defined and / or referred to as a rightward lateral direction among the side surfaces of the antenna module (401), the conductive support member (403), and / or the shielding member (450). It should be noted that the above directions are based on the rectangular coordinate system described in the drawings for the sake of brevity of explanation, and that the description of these directions or components does not limit the embodiments of the present disclosure. For example, the aforementioned directions may be interpreted differently depending on the user's gripping habits or the direction in which the antenna array is oriented.

[0137] According to one embodiment, the electronic device (101) may further include a conductive support member (403). The conductive support member (403) may support at least a portion of the antenna module (401). The conductive support member (403) may surround at least a portion of the antenna module (401) and may fix a position of the antenna module (401) within the electronic device (101). The conductive support member (403) may be fixed to at least a portion of the housing (301). The conductive support member (403) may be formed of a conductive material capable of conducting electricity or a metallic material.

[0138] According to one embodiment, at least a portion of the conductive support member (403) may be electrically connected to a ground region of the electronic device (101) (e.g., ground region (3113) of FIG. 13). The conductive support member (403) may be electrically connected to at least a portion of the shielding member (450). For example, the conductive support member (403) may provide a conductive path that electrically connects the shielding member (450) and the ground region.

[0139] According to one embodiment, the conductive support member (403) may be formed to cover at least a portion of the antenna module (401). The conductive support member (403) may have a shape such that one surface of the substrate (410) on which the antenna array (414) of the antenna module (401) is formed is open. For example, the conductive support member (403) may be provided in a shape that does not cover one surface of the substrate (410) on which the antenna array (414) of the antenna module (401) is formed.

[0140] In one embodiment, the conductive support member (403) may include a bracket (430) or a contact portion (440). In one embodiment, the contact portion (440) may be formed integrally with the bracket (430).

[0141] In one embodiment, the bracket (430) may be configured to support the antenna module (401) and / or the shielding member (450). The bracket (430) may surround at least a portion of the substrate (410). For example, the bracket (430) may be connected or coupled to at least a portion of the antenna module (401) and / or at least a portion of the shielding member (450). The bracket (430) may couple or secure the antenna module (401) and / or the shielding member (450) to the housing (301).

[0142] According to one embodiment, the bracket (430) can surround at least one side of the substrate (e.g., a side facing the -X direction, +Y direction, -Y direction, +Z direction, or -Z direction of FIGS. 6 to 12) that faces a different direction than the direction in which the first side of the substrate (e.g., the side facing the +X direction of FIGS. 6 to 12) faces.

[0143] According to one embodiment, the bracket (430) may include a plurality of support portions (431, 432, 433, 434, 435) configured to support faces of the substrate (410) that face in a direction different from the direction in which the first face of the substrate (410) faces (e.g., the +X direction of FIGS. 6 to 12) faces (e.g., the -X direction, the +Y direction, the -Y direction, the +Z direction, and the -Z direction of FIGS. 6 to 12). The faces of the substrate (410) may be defined and / or referred to as outer surfaces of the substrate (410) that face in a direction different from the first face.

[0144] According to one embodiment, the plurality of support portions (431, 432, 433, 434, 435) may include a first support portion (431), a second support portion (432), a third support portion (433), a fourth support portion (434), a fifth support portion (435), or a connecting portion (436). The first support portion (431), the second support portion (432), the third support portion (433), the fourth support portion (434), the fifth support portion (435), and the connecting portion (436) may be formed integrally, but are not limited thereto. The support portion(s) (431, 432, 433, 434, 435) may be defined and / or referred to as support panel(s), support plate(s), support area(s), or cover portion(s).

[0145] According to one embodiment, the first support portion (431) may be configured to contact or be connected to a downwardly facing side of the substrate (410) of the antenna module (401) (e.g., a side facing the -Z direction of FIGS. 6 to 12) and support the side. The first support portion (431) may be connected or coupled to a second support portion (432), a third support portion (433), or a fourth support portion (434). The first support portion (431) may be defined and / or referred to as a base support portion or a lower support portion.

[0146] According to one embodiment, the second support portion (432) may extend upward from the first support portion (431). The second support portion (432) may contact or be connected to a rear surface of the substrate (410) of the antenna module (401) (e.g., a surface facing the -X direction of FIGS. 6 to 12 , or a second surface) and / or a rear surface of the shielding member (450) (e.g., a surface facing the -X direction of FIGS. 6 to 12 ), and may be configured to support the rear surface of the substrate (410) and / or the rear surface of the shielding member (450). The second support portion (432) may be connected to the first support portion (431) and the fifth support portion (435).

[0147] According to one embodiment, the second support portion (432) may be provided in a bent shape relative to the first support portion (431), but is not limited thereto.

[0148] According to one embodiment, the second support portion (432) may include a second-first support portion (4321) and a second-second support portion (4322) spaced apart from the second-first support portion (4321). At least a portion of a conductive connecting member (470) may be positioned between the second-first support portion (4321) and the second-second support portion (4322).

[0149] According to one embodiment, the second-first support portion (4321) may be connected or coupled to the first support portion (431) and the fifth-first support portion (4351). The second-second support portion (4322) may be connected or coupled to the first support portion (431) and the connection portion (436).

[0150] According to one embodiment, the third support portion (433) may extend upward from the first support portion (431). The third support portion (433) may contact or be connected to a right-facing side of the substrate (410) of the antenna module (401) (e.g., a side facing the -Y direction in FIGS. 6 to 12 ) and / or a right-facing side of the shielding member (450) (e.g., a side facing the -Y direction in FIGS. 6 to 12 ). The third support portion (433) may be configured to support the right-facing side of the antenna module (401) and the right-facing side of the shielding member (450). The third support portion (433) may be connected to the first support portion (431). The third support portion (433) may be spaced apart from the fourth support portion (434) and may face the fourth support portion (434). One side of the third support part (433) facing the fourth support part (434) may be parallel to one side of the fourth support part (434) facing the third support part (433).

[0151] According to one embodiment, the third support portion (433) may be provided in a bent shape relative to the first support portion (431), but is not limited thereto.

[0152] According to one embodiment, the fourth support portion (434) may extend upward from the first support portion (431). The fourth support portion (434) may contact or be connected to a left-facing side of the substrate (410) of the antenna module (401) (e.g., a side facing the +Y direction of FIGS. 6 to 12) and / or a left-facing side of the shielding member (450) (e.g., a side facing the +Y direction of FIGS. 6 to 12). The fourth support portion (434) may be configured to support the left-facing side of the antenna module (401) and the left-facing side of the shielding member (450). The fourth support portion (434) may be connected to the first support portion (431) and the 5-2 support portion (4352). The fourth support portion (434) may be spaced apart from the third support portion (433) and may face the third support portion (433). One side of the fourth support portion (434) facing the third support portion (433) may be parallel to one side of the third support portion (433) facing the fourth support portion (434).

[0153] According to one embodiment, the third support portion (433) may be provided in a bent shape relative to the first support portion (431), but is not limited thereto.

[0154] According to one embodiment, the fifth support portion (435) may extend forward from the second support portion (432), or may extend from the fourth support portion (434) toward the third support portion (433). The fifth support portion (435) may contact or be connected to an upwardly facing side of the substrate (410) of the antenna module (401) (e.g., a side facing the +Z direction of FIGS. 6 to 12 ) and / or an upwardly facing side of the shielding member (450) (e.g., a side facing the +Z direction of FIGS. 6 to 12 ), and may be configured to support the upwardly facing side of the substrate (410) and / or the upwardly facing side of the shielding member (450).

[0155] According to one embodiment, the fifth support portion (435) may include a fifth-first support portion (4351) and a fifth-second support portion (4352) spaced apart from the fifth-first support portion (4351).

[0156] According to one embodiment, the 5-1 support portion (4351) may be connected or coupled to the 2-1 support portion (4321). The 5-1 support portion (4351) may be provided in a bent shape relative to the 2-1 support portion (4321), but is not limited thereto. The 5-2 support portion (4352) may be connected or coupled to the 4th support portion (434). The 5-1 support portion (4351) may be provided in a bent shape relative to the 2-1 support portion (4321), but is not limited thereto. The 5-2 support portion (4352) may be provided in a bent shape relative to the 4th support portion (434), but is not limited thereto.

[0157] According to one embodiment, the connecting portion (436) may extend rearward from the second-second support portion (4322). For example, the connecting portion (436) may be provided in a bent shape with respect to the second-second support portion (4322), but is not limited thereto. The connecting portion (436) may be fixed to at least a portion of the housing (301). The connecting portion (436) may include a connecting hole (4361) formed through at least a portion of the connecting portion (436). A fastening member (e.g., a bolt, a screw, or a pin) may be inserted into the connecting hole (4361), and the connecting portion (436) may be fixed to at least a portion of the housing (301) through the fastening member. According to the illustrated embodiment, one connecting portion (436) is provided, but the conductive support member (403) may also include a plurality of connecting portions (436).

[0158] According to one embodiment, the contact portion (440) may be formed integrally with the bracket (430). The contact portion (440) may protrude outwardly from at least a portion of the bracket (430). The contact portion (440) may be electrically connected to a ground area of ​​the electronic device (101) (e.g., the ground area (3113) of FIG. 13). The contact portion (440) may contact the ground area. The contact portion (440) may be formed by bending at least a portion of the bracket (430).

[0159] According to one embodiment, the contact portion (440) may be formed on at least one of a plurality of support portions (431, 432, 433, 434, 435).

[0160] In one embodiment, the contact portion (440) and the conductive support member (403) including the contact portion (440) can provide a conductive path to the shielding member (450). For example, the shielding member (450) can be electrically connected to a ground area of ​​the electronic device (101) through the contact portion (440) and the conductive support member (403). The ground area of ​​the electronic device (101) can provide a ground surface to the shielding member (450).

[0161] According to one embodiment, the first support member (311) of the housing (301) may include a planar support portion (3111) (e.g., the planar support portion (3111) of FIGS. 13-14) arranged parallel to the display (e.g., the display (330) of FIGS. 4-5) and / or the back plate (e.g., the back plate (380) of FIGS. 4-5) of the electronic device (101). The first support member (311) may include a vertical support portion (e.g., the vertical support portion (3112) of FIGS. 13-14) extending from the planar support portion (3111) toward the display (330) and / or the back plate (380). The vertical support portion (e.g., the vertical support portion (3112) of FIGS. 13 to 14) may support at least a portion of the second support portion (432) of the bracket (430) of the conductive support member (403). At least a portion of the first support member (311) may be physically connected to the contact portion (440) of the conductive support member (403) and electrically connected to the contact portion (440) of the conductive support member (403). The contact portion (440) may be located in the second support portion (432). For example, the contact portion (440) may be formed on at least a portion of the second-first support portion (4321). The above contact portion (440) may extend at least partially from at least a portion of the second-first support portion (4321) toward the top of the conductive support member (403) (e.g., the +Z direction of FIGS. 6 to 12), but is not limited thereto and may extend at least partially in various directions.

[0162] FIG. 13 is a cross-sectional view of an electronic device along line BB' of FIG. 7, according to one embodiment of the present disclosure.

[0163] FIG. 14 is a cross-sectional view of an electronic device taken along line BB' of FIG. 7 according to one embodiment of the present disclosure.

[0164] FIG. 15 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0165] The embodiments of FIGS. 13 to 15 may be combined with the embodiments of FIGS. 1 to 14, or the embodiments of FIGS. 16a to 27.

[0166] Referring to FIGS. 13 to 15, the electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a first support member (311), a flat support portion (3111), at least one antenna structure (391), a non-metallic region (393), an antenna module (401), a substrate (410), a conductive support member (403), a bracket (430), a second-first support portion (4321), a contact portion (440), or a shielding member (450).

[0167] The configuration of the first support member (311), the planar support portion (3111), at least one antenna structure (391), the non-metallic region (393), the antenna module (401), the substrate (410), the conductive support member (403), the bracket (430), the second-first support portion (4321), the contact portion (440), or the shielding member (450) of FIGS. 13 to 15 may be partially or entirely the same as the configuration of the first support member (311), the planar support portion (3111), at least one antenna structure (391), the non-metallic region (393), the antenna module (401), the substrate (410), the conductive support member (403), the bracket (430), the second-first support portion (4321), the contact portion (440), or the shielding member (450) of FIGS. 6 to 12.

[0168] According to one embodiment, the electronic device (101) may further include a first adhesive member (490) that adheres the shielding member (450) and the conductive support member (403). The first adhesive member (490) may include a conductive double-sided tape that electrically connects the shielding member (450) and the conductive support member (403). One side of the first adhesive member (490) may be adhered to the rear surface of the shielding member (450), and the other side of the first adhesive member (490), which faces in the opposite direction to the one side, may be adhered to the 2-1 support portion (4321) of the bracket (430) of the conductive support member (403).

[0169] In one embodiment, the first adhesive member (490) can provide a conductive path that electrically connects the shielding member (450) and the conductive support member (403).

[0170] According to one embodiment, the planar support portion (3111) may include a seating portion (3111a) on which at least a portion of the conductive support member (403) is seated. The seating portion (3111a) may be configured to support at least a portion of the conductive support member (403).

[0171] According to one embodiment, the electronic device (101) may further include a second adhesive member (492) that adheres the mounting portion (3111a) and the conductive support member (403). The second adhesive member (492) may include a conductive double-sided tape that electrically connects the mounting portion (3111a) and the conductive support member (403). One side of the second adhesive member (492) may be adhered to the mounting portion (3111a), and the other side of the second adhesive member (492), which faces in the opposite direction to the one side, may be adhered to the first support part (431) of the bracket (430) of the conductive support member (403).

[0172] According to one embodiment, the substrate (410) of the antenna module (401) may include a first surface (411a) and a second surface (411b) facing in an opposite direction to the first surface (411a). The first surface (411a) of the substrate (410) may be defined and / or referred to as the front surface of the substrate (410), and an antenna array (414) may be arranged or mounted on the first surface (411a) of the substrate (410). The second surface (411b) of the substrate (410) may be defined and / or referred to as the back surface of the substrate (410), and a communication circuit may be arranged or mounted on the second surface (411b) of the substrate (410).

[0173] According to one embodiment, the first side (411a) of the substrate (410) may be arranged to face the exterior of the electronic device (101). For example, the antenna array (414) arranged on the first side (411a) may face the exterior of the electronic device (101). The first side (411a) of the substrate (410) may face the non-metallic region (393) and / or at least one antenna structure (391).

[0174] In one embodiment, the bracket (430) may be inserted in a force-fit manner between the non-metallic region (393) and the vertical support portion (3112). As the bracket (430) is inserted in a force-fit manner between the non-metallic region (393) and the vertical support portion (3112), the contact portion (440) may be at least partially elastically deformed when in close contact with the ground region (3113). In one embodiment, the contact portion (440) may be defined and / or referred to as a protruding portion.

[0175] According to one embodiment, the first surface (411a) of the substrate (410) may be spaced apart from the non-metal region (393). For example, the first surface (411a) of the substrate (410) may be spaced apart from the non-metal region (393) by a first distance (g) based on the width direction of the electronic device (101) (e.g., the X-axis direction of FIG. 13). The first distance (g) may be about 0.45 mm to about 0.55 mm. For example, the first distance (g) may be about 0.5 mm.

[0176] According to one embodiment, the shielding member (450) can be coupled to the second surface (411b) of the substrate (410) and can provide a shielding function to prevent external electromagnetic interference from affecting at least one electrical component (e.g., a communication circuit) mounted on the second surface (411b) of the substrate (410).

[0177] According to one embodiment, the electronic device (101) may include a ground area (3113). In the illustrated embodiments, a portion of the first support member (311) is depicted as serving as the ground area (3113), but at least a portion of the main circuit board (e.g., the first circuit board (341) of FIGS. 4 and 5) may also serve as the ground area.

[0178] According to one embodiment, the ground region (3113) may be formed by at least a portion of the vertical support portion (3112). If the outer surface of the vertical support portion (3112) is anodized to provide non-conductive properties, the ground region (3113) may be provided by a portion of the vertical support portion (3112) from which at least a portion of the metal film formed by the anodizing process is removed (e.g., a conductive portion).

[0179] According to one embodiment, the ground region (3113) can provide a ground surface for the shielding member (450). The ground region (3113) can be provided as at least a portion of the vertical support portion (3112) of the first support member (311), but is not limited thereto. The ground region (3113) can be electrically connected to the shielding member (450) through the contact portion (440), the bracket (430), and the first adhesive member (490).

[0180] In one embodiment, the contact portion (440) may protrude rearwardly from the second-first support portion (4321) of the bracket (430). For example, the contact portion (440) may protrude at least partially from the second-first support portion (4321) and contact at least a portion of the ground area (3113).

[0181] According to the illustrated embodiment, the contact portion (440) may be provided in a clip shape that is bent at least once from the second-first support portion (4321), but is not limited thereto. The contact portion (440) may be elastically deformed at least partially when in contact with the ground area (3113). For example, the illustrated reference number 440a may be an area that overlaps with the ground area (3113) when the contact portion (440) is in contact with the ground area (3113), and the contact portion (440) may be elastically deformed toward the antenna module (401) by the overlapping area of ​​the reference number 440a.

[0182] According to one embodiment, the contact portion (440) can be elastically deformed and at least partially compressed, and can pressurize the ground area (3113) by the elastic restoring force. Accordingly, even if an external impact is applied to the electronic device (101), the connection state between the contact portion (440) and the ground area (3113) can be maintained.

[0183] According to one embodiment, the shielding member (450) and / or the conductive support member (403) may be electrically connected to the second side (411b) of the substrate (410), or may be electrically connected to at least one of the side surfaces of the substrate (410). The shielding member (450) and / or the conductive support member (403) may be electrically connected to a metal portion (or a conductive portion) of the substrate (410).

[0184] According to one embodiment, at least one antenna structure (391) may be disposed adjacent to a substrate (410) of an antenna module (401). A metal portion (or conductive portion) of the substrate (410) may form a parasitic resonance (or parasitic component) that reduces frequency efficiency (or antenna gain) in a specific frequency band of an RF signal of the at least one antenna structure (391).

[0185] According to one embodiment, the metal portion of the substrate (410) can be electrically connected to the ground area (3113) of the electronic device (101) through the shielding member (450), the conductive support member (403), and the contact portion (440). Accordingly, the metal portion of the substrate (410) can be electrically connected to the ground plane provided from the ground area (3113), and the occurrence of parasitic resonance from the metal portion of the substrate (410) can be limited or reduced. Accordingly, the antenna radiation efficiency of at least one antenna structure (391) can be improved.

[0186] Referring to FIGS. 14 and 15, the third side wall (3103) may include a bezel region (31031, 31032) forming at least a portion of the side structure (310). The bezel region (31031, 31032) may be formed of a metal material. The bezel region (31031, 31032) may include a first bezel region (31031) and a second bezel region (31032). The first bezel region (31031) may be connected to at least one antenna structure (391), a non-metal region (393), and a display (330). The second bezel region (31032) may be connected to at least one antenna structure (391), a non-metal region (393), and a back plate (380).

[0187] Referring to FIG. 14, the antenna module (401) and / or the conductive support member (403) may be positioned between the display (330) (e.g., the display (330) of FIGS. 4 to 5) and the rear plate (380) (e.g., the rear plate (380) of FIGS. 4 to 5). The antenna module (401) and / or the conductive support member (403) may be positioned on the mounting portion (3111a). The mounting portion (3111a) may be positioned between the first support portion (431) and the rear plate (380). For example, the antenna module (401) and / or the conductive support member (403) may be moved downward while being aligned with the upper side (e.g., the +Z direction of FIG. 14) of the mounting portion (3111a) and may be positioned on the mounting portion (3111a).

[0188] Referring to FIG. 15, the antenna module (401) and / or the conductive support member (403) may be positioned between the display (330) (e.g., the display (330) of FIGS. 4 to 5) and the rear plate (380) (e.g., the rear plate (380) of FIGS. 4 to 5). The antenna module (401) and / or the conductive support member (403) may be positioned on a mounting portion (3111b) (e.g., the mounting portion (3111a) of FIGS. 13 to 13). The mounting portion (3111b) may be positioned between the first supporting portion (431) and the display (330). For example, the antenna module (401) and / or the conductive support member (403) may be moved upward while aligned with the lower side (e.g., the -Z direction of FIG. 15) of the mounting portion (3111b) and mounted on the mounting portion (3111b).

[0189] FIG. 16A is a plan view showing a second-first support portion of a conductive support member according to one embodiment of the present disclosure.

[0190] FIG. 16b is a cross-sectional view taken along line CC' of FIG. 16a according to one embodiment of the present disclosure.

[0191] FIG. 17a is a plan view showing a second-first support portion of a conductive support member according to one embodiment of the present disclosure.

[0192] FIG. 17b is a cross-sectional view taken along line DD' of FIG. 17a according to one embodiment of the present disclosure.

[0193] FIG. 18a is a plan view showing a second-1 support portion and a contact portion of a support member according to one embodiment of the present disclosure.

[0194] FIG. 18b is a cross-sectional view taken along line EE' of FIG. 18a according to one embodiment of the present disclosure.

[0195] The embodiments of FIGS. 16a to 18b may be combined with the embodiments of FIGS. 1 to 15, or the embodiments of FIGS. 19 to 27.

[0196] The configuration of the second-1 support portion (4321) or the contact portion (440) of FIGS. 16a to 18b may be partially or entirely identical to the configuration of the second-1 support portion (4321) or the contact portion (440) of FIGS. 6 to 15.

[0197] Hereinafter, a manufacturing process of the contact portion (440) will be described with reference to FIGS. 16A to 18B as examples. A bracket (e.g., bracket (430) of FIGS. 6 to 15) may include a second-first support portion (4321). The second-first support portion (4321) may be formed of a metal plate. Referring to FIGS. 16A to 17B, the manufacturing process may include a process of forming a penetration portion (4323) in the second-first support portion (4321). The penetration portion (4323) may include an opening formed through at least a portion of the second-first support portion (4321). The opening may have a shape that surrounds at least a portion (4321a) of the second-first support portion (4321) for forming the contact portion (440). Referring to FIGS. 17A to 18B, the manufacturing process may include a process of bending at least a portion (4321a) of the 2-1 support portion (4321) at least once. At least a portion (4321a) of the 2-1 support portion (4321) may be bent at least once to form a contact portion (440). The contact portion (440) may be formed by processing at least a portion of the 2-1 support portion (4321). The contact portion (440) may be arranged to protrude from one surface of the 2-1 support portion (4321) (e.g., a surface facing the -X direction in FIG. 18B). For example, the distance by which the contact portion (440) protrudes from one surface of the 2-1 support portion (4321) may be defined and / or referred to as a second distance (t). The second distance (t) may be a distance in a vertical direction (e.g., the X-axis direction of FIG. 18b) with respect to one surface of the second-1 support portion (4321). The second distance (t) may be greater than the first distance between the first surface of the substrate and the non-metal region (e.g., the first distance (g) of FIG. 13). The second distance (t) may be from about 0.9 mm to about 0.165 mm. For example, the second distance (t) may be about 0.It may be from 1 mm to about 0.15 mm. The contact portion (440) may be at least partially elastically deformed when the second-first support portion (4321) is in close contact with the vertical support portion (3112) of the first support member (311).

[0198] FIG. 19 is a rear view of an electronic device including an antenna module according to one embodiment of the present disclosure.

[0199] FIG. 20 is a cross-sectional view of an electronic device taken along line FF' of FIG. 19 according to one embodiment of the present disclosure.

[0200] The embodiments of FIGS. 19 to 20 may be combined with the embodiments of FIGS. 1 to 18b, or the embodiments of FIGS. 21 to 27.

[0201] Referring to FIGS. 19 and 20, the electronic device (101) may include a housing (301), a side structure (310), a first support member (311), a second side wall (3102), a third side wall (3103), a fourth side wall (3104), a first circuit board (341), an antenna module (401), a substrate (410), a conductive support member (403), a bracket (430), a contact portion (4401), a shielding member (450), a first adhesive member (490), at least one antenna structure (391), or a non-metallic region (393). The first support member (311) may include a planar support portion (3111) or a vertical support portion (3112).

[0202] The configuration of the housing (301), the side structure (310), the first support member (311), the second side wall (3102), the third side wall (3103), or the fourth side wall (3104) of FIGS. 19 to 20 may be partially or entirely the same as the configuration of the housing (301), the side structure (310), the first support member (311), the second side wall (3102), the third side wall (3103), or the fourth side wall (3104) of FIGS. 4 to 6. The configuration of the first circuit board (341) of FIGS. 19 to 20 may be partially or entirely the same as the configuration of the first circuit board (341) of FIG. 4. The configuration of the antenna module (401), the substrate (410), the conductive support member (403), the bracket (430), the contact portion (4401), the shielding member (450), the first adhesive member (490), the at least one antenna structure (391), or the non-metallic region (393) of FIGS. 19 to 20 may be partially or entirely the same as the configuration of the antenna module (401), the substrate (410), the conductive support member (403), the bracket (430), the contact portion (440), the shielding member (450), the first adhesive member (490), the at least one antenna structure (391), or the non-metallic region (393) of FIGS. 6 to 15. The configuration of the flat support portion (3111) or the vertical support portion (3112) of FIGS. 19 to 20 may be partially or entirely identical to the configuration of the flat support portion (3111) or the vertical support portion (3112) of FIGS. 13 to 15.

[0203] According to one embodiment, the conductive support member (403) may include a bracket (430), or a contact portion (4401).

[0204] According to one embodiment, the first surface (411a) of the substrate (410) of the antenna module (401) may be arranged to face a rear plate (e.g., the rear plate (380) of FIGS. 4 to 5) of the electronic device (101). The antenna array (e.g., the antenna array (414) of FIGS. 10 to 11) arranged on the first surface may be arranged to face the rear plate of the electronic device (101). For example, the antenna array of the antenna module (401) may form a beam directed toward the rear direction of the electronic device (101).

[0205] According to one embodiment, the conductive support member (403) may include a contact portion (440). The contact portion (440) may be electrically connected to a ground region (3113a) (e.g., the ground region (3113) of FIGS. 13 to 15) formed on a mounting portion (3111a) of the first support member (311) (e.g., the mounting portion (3111a) of FIGS. 13 to 14 or the mounting portion (3111b) of FIG. 15). The contact portion (440) and the conductive support member (403) may provide a conductive path between the ground region (3113a) and the shielding member (450).

[0206] The illustrated reference number 4401a may be an area overlapping with the ground area (3113a) when the contact portion (4401) is in contact with the ground area (3113a), and the contact portion (4401) may be elastically deformed toward the antenna module (401) by the overlapping area of ​​the reference number 4401a.

[0207] FIG. 21 is a perspective view of a conductive support member according to one embodiment of the present disclosure.

[0208] FIG. 22 is a perspective view of a conductive support member according to one embodiment of the present disclosure.

[0209] FIG. 23 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0210] The embodiments of FIGS. 21 to 23 may be combined with the embodiments of FIGS. 1 to 20, or the embodiments of FIGS. 24 to 27.

[0211] Referring to FIGS. 21 to 23, the electronic device (101) may include a first support member (311), an antenna module (401), a substrate (410), a conductive support member (403), a bracket (430), a contact portion (4402), a shielding member (450), a first adhesive member (490), at least one antenna structure (391), or a non-metallic region (393). The bracket (430) may include a first support portion (431), a second support portion (432), a second-first support portion (4321), a second-second support portion (4322), a third support portion (433), a fourth support portion (434), a fifth support portion (435), a fifth-first support portion (4351), a fifth-second support portion (4352), or a connection portion (436). The first support member (311) may include a flat support portion (3111) or a vertical support portion (3112).

[0212] The configuration of the first support member (311), the antenna module (401), the substrate (410), the conductive support member (403), the bracket (430), the contact portion (4402), the shielding member (450), the first adhesive member (490), the at least one antenna structure (391), or the non-metallic region (393) of FIGS. 21 to 23 may be partially or entirely the same as the configuration of the antenna module (401), the substrate (410), the conductive support member (403), the bracket (430), the contact portion (440), the shielding member (450), the first adhesive member (490), the second adhesive member (492), the at least one antenna structure (391), or the non-metallic region (393) of FIGS. 6 to 15. The configuration of the flat support portion (3111) or the vertical support portion (3112) of FIGS. 21 to 23 may be partially or entirely identical to the configuration of the flat support portion (3111) or the vertical support portion (3112) of FIGS. 13 to 15.

[0213] According to one embodiment, the contact portion (4402) may be manufactured as a separate member from the bracket (430) and assembled to the bracket (430). The contact portion (4402) may be formed of a metal material and may be welded or screw-joined to at least a portion of the bracket (430). The contact portion (4402) may be coupled to the second-first support portion (4321) of the bracket (430), but is not limited thereto. The contact portion (4402) may be attached to at least a portion of the bracket (430) (e.g., the second-first support portion (4321)).

[0214] In one embodiment, the contact portion (4402) may be made of the same material as the bracket (430) or a different material and may be attached to the bracket (430). For example, the contact portion (4403) may include a conductive gasket. For example, the contact portion (4402) may include a conductive foam gasket, and the outer covering of the conductive foam gasket may include a conductive fiber, a metal foil, and / or a metal thin film. For example, the contact portion (4402) may be attached to the bracket (430) using a conductive double-sided tape. In one embodiment, the contact portion (4402) may include a flexible printed circuit board (FPCB) or a coaxial cable.

[0215] According to one embodiment, the contact portion (4402) may be provided as one contact portion (4402), as illustrated in FIG. 21, or as multiple contact portions (4402, 4402'), as illustrated in FIG. 22.

[0216] According to one embodiment, the contact portion (4402) can be electrically connected to a ground area (3113) formed on a vertical support portion (3112) of the first support member (311) (e.g., the ground area (3113) of FIGS. 13 to 15). The contact portion (4402) and the conductive support member (403) can provide a conductive path between the ground area (3113) and the shielding member (450).

[0217] The illustrated reference number 4402a may be an area overlapping with the ground area (3113) when the contact portion (4402) comes into contact with the ground area (3113), and the contact portion (4402) may be elastically deformed toward the antenna module (401) by the overlapping area of ​​the reference number 4401a.

[0218] FIG. 24 is a perspective view showing an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0219] FIG. 25 is a perspective view illustrating an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0220] FIG. 26 is a perspective view illustrating an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0221] FIG. 27 is a perspective view illustrating an antenna module and a conductive support member according to one embodiment of the present disclosure.

[0222] The embodiments of FIGS. 24 to 27 may be combined with the embodiments of FIGS. 1 to 23.

[0223] Referring to FIGS. 24 to 27, the electronic device (101) may include an antenna module (401), a substrate (410), a first substrate (410a), a second substrate (410b), a first connector (412), an antenna array (414), a conductive support member (403), a first support portion (431), a second support portion (432), a second-first support portion (4321), a second-second support portion (4322), a third support portion (433), a fourth support portion (434), a fifth support portion (435), a fifth-first support portion (4351), a fifth-second support portion (4352), a connection portion (436), contact portions (4403, 4404, 4405, 4406), or a shielding member (450).

[0224] The configuration of the antenna module (401), the substrate (410), the first substrate (410a), the second substrate (410b), the first connector (412), the antenna array (414), the conductive support member (403), the first support portion (431), the second support portion (432), the second-first support portion (4321), the second-second support portion (4322), the third support portion (433), the fourth support portion (434), the fifth support portion (435), the fifth-first support portion (4351), the fifth-second support portion (4352), the connection portion (436), the contact portions (4403, 4404, 4405, 4406), or the shielding member (450) of FIGS. 6 to 12 is The configuration of the substrate (410b), the first connector (412), the antenna array (414), the conductive support member (403), the first support portion (431), the second support portion (432), the second-first support portion (4321), the second-second support portion (4322), the third support portion (433), the fourth support portion (434), the fifth support portion (435), the fifth-first support portion (4351), the fifth-second support portion (4352), the connection portion (436), the contact portion (440), or the shielding member (450) may be partially or entirely the same.

[0225] Referring to FIG. 24, the contact portion (4403) may be formed on the fourth support portion (434) covering the left-facing side of the side of the antenna module (401). The contact portion (4403) may be formed integrally with the fourth support portion (434), or may be formed as a separate member from the fourth support portion (434) and assembled to the fourth support portion (434). The contact portion (4403) may be electrically connected to a ground area of ​​the electronic device (101) (e.g., the ground area (3113) of FIGS. 13 to 15). The contact portion (4403) may provide a conductive path between the ground area and the shielding member (450).

[0226] Referring to FIG. 25, the contact portion (4404) may be formed on the third support portion (433) covering the right-facing side of the side of the antenna module (401). The contact portion (4404) may be formed integrally with the third support portion (433), or may be formed as a separate member from the third support portion (433) and assembled to the third support portion (433). The contact portion (4404) may be electrically connected to a ground area of ​​the electronic device (101) (e.g., the ground area (3113) of FIGS. 13 to 15). The contact portion (4404) may provide a conductive path between the ground area and the shielding member (450).

[0227] Referring to FIG. 26, a contact portion (4405) may be formed on a fifth support portion (435) that covers an upwardly facing side of a side surface of an antenna module (401). The contact portion (4405) may be formed on at least a portion of a fifth-second support portion (4352). The contact portion (4405) may be formed integrally with the fifth-second support portion (4352), or may be formed as a separate member from the fifth-second support portion (4352) and assembled to the fifth-second support portion (4352). The contact portion (4405) may be electrically connected to a ground area of ​​the electronic device (101) (e.g., the ground area (3113) of FIGS. 13 to 15). The contact portion (440) may provide a conductive path between the ground area and the shielding member (450).

[0228] Referring to FIG. 27, the contact portion (4406) may be formed on the first support portion (431) covering the downward-facing side of the side of the antenna module (401). The contact portion (4406) may be formed integrally with the first support portion (431), or may be formed as a separate member from the first support portion (431) and assembled to the first support portion (431). The contact portion (4406) may be electrically connected to a ground area of ​​the electronic device (101) (e.g., the ground area (3113) of FIGS. 13 to 15). The contact portion (440) may provide a conductive path between the ground area and the shielding member (450).

[0229] An electronic device may include at least one antenna radiator for transmitting and / or receiving radio frequency (RF) signals across various frequency bands. As an example, the electronic device may include an antenna formed as part of a metal frame forming the exterior of the electronic device, or an antenna positioned within an internal space of the electronic device.

[0230] With the trend toward miniaturization and / or thinning of electronic devices, the space for mounting or accommodating the antennas and at least one electrical / electronic component is gradually decreasing. Accordingly, the antennas and at least one electrical / electronic component are designed to be positioned adjacent to each other, and thus, electromagnetic waves generated from each may act as noise to surrounding antennas or surrounding components. Furthermore, as antennas supporting wireless communications in different frequency bands are positioned adjacent to each other, when one antenna operates, parasitic resonance may occur in the other antenna, which may reduce the antenna radiation efficiency (or antenna gain).

[0231] According to one embodiment of the present disclosure, an electronic device having a stable operating environment can be provided by including a conductive support member.

[0232] According to one embodiment of the present disclosure, a conductive support member is connected to a ground region of an electronic device, thereby limiting or reducing parasitic resonance occurring in a substrate of an antenna module.

[0233] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0234] According to one embodiment of the present disclosure, by forcibly fitting the conductive support member into the interior of the housing, the maintenance of the connection state between the contact portion of the conductive support member and the ground region can be improved.

[0235] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0236] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (301, 311), a circuit board (341), an antenna module (401), or a conductive support member (403). The housing may include a ground region (3113). The circuit board may be disposed within the housing. The antenna module may be disposed within the housing. The antenna module may be electrically connected to the circuit board. The antenna module may include a substrate (410) or an antenna array (414). The antenna array may be disposed on the substrate. The conductive support member may be configured to support the antenna module. The conductive support member may include a bracket (430) or a contact portion (440). The bracket may surround at least a portion of the substrate. The contact portion may protrude from the bracket. The above contact portion can contact the ground area. The above contact portion can be electrically connected to the ground area.

[0237] According to one embodiment, the contact portion may be configured to be at least partially elastically deformable.

[0238] According to one embodiment, the antenna array may include a plurality of antenna elements (414A, 414B, 414C, 414D, 414E). The plurality of antenna elements may be arranged on a first surface (411a) of the substrate. The bracket may surround at least one surface of the substrate facing in a direction different from the direction in which the first surface of the substrate faces.

[0239] According to one embodiment, the electronic device may further include a shielding member (450). The shielding member may be disposed on the second surface (411b) of the substrate. The shielding member may be electrically connected to the bracket.

[0240] In one embodiment, the second side may face in an opposite direction to the first side. The shielding member may be electrically connected to the second side.

[0241] According to one embodiment, the bracket and the contact portion may be formed integrally.

[0242] In one embodiment, the contact portion may be formed by bending at least a portion of the bracket.

[0243] According to one embodiment, the contact portion (4402) may be attached to at least a portion of the bracket.

[0244] According to one embodiment, the electronic device may further include a conductive connecting member (470). The conductive connecting member may be electrically connected to the circuit board or the antenna module.

[0245] In one embodiment, the conductive connecting member may include at least one of a flexible printed circuit board or a coaxial cable.

[0246] In one embodiment, the substrate may include a first surface (411a) or a second surface (411b). The antenna array may be arranged on the first surface. The second surface may face in an opposite direction to the first surface. The bracket may include a first support portion (431) or a second support portion (432). The first support portion may be configured to support one of a plurality of side surfaces of the substrate connected to the first surface and the second surface. The second support portion may extend from the first support portion. The second support portion may be configured to support the second surface.

[0247] According to one embodiment, the contact portion may be located on the second support portion.

[0248] According to one embodiment, the electronic device may further include at least one antenna structure (391). The antenna module may be oriented toward the at least one antenna structure.

[0249] According to one embodiment, the housing may further include a non-metallic region (393). The non-metallic region may be positioned between the at least one antenna structure and the antenna module.

[0250] In one embodiment, the substrate, or the antenna array, may be spaced apart from the non-metallic region.

[0251] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (301, 311), a circuit board (341), an antenna module (401), a conductive support member (403), or a shielding member (450). The housing may include a ground region (3113). The circuit board may be disposed within the housing. The antenna module may be disposed within the housing. The antenna module may be electrically connected to the circuit board. The antenna module may include a substrate (410) or an antenna array (414). The antenna array may be disposed on the substrate. The conductive support member may be configured to support the antenna module. The conductive support member may include a bracket (430) or a contact portion (440). The bracket may surround at least a portion of the substrate. The contact portion may protrude from the bracket. The contact portion may contact the ground area. The contact portion may be electrically connected to the ground area. The shielding member may be disposed between the bracket and the substrate. The shielding member may be electrically connected to the bracket or the substrate.

[0252] According to one embodiment, the electronic device may further include a conductive adhesive member (490). The conductive adhesive member may be positioned between the shielding member and the bracket.

[0253] According to one embodiment, the antenna array may be arranged on a first surface (411a) of the substrate. The bracket may include a plurality of support portions (431, 432, 433, 434, 435). The plurality of support portions may be configured to support a plurality of side surfaces of the substrate that face in a direction different from the direction in which the first surface faces.

[0254] According to one embodiment, the contact portion (440, 4401, 4402, 4403, 4404, 4405, 4406) may be formed on one of the plurality of support portions.

[0255] In one embodiment, the contact portion and the bracket may be configured to provide a conductive path that electrically connects the ground region and the shielding member.

[0256] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), A housing (301, 311) including a ground area (3113); A circuit board (341) placed within the above housing; An antenna module (401) disposed within the housing and electrically connected to the circuit board, the antenna module including a substrate (410) and an antenna array (414) disposed on the substrate; and It comprises a conductive support member (403) configured to support the above antenna module, The absence of the above challenging support, A bracket (430) surrounding at least a portion of the substrate; and An electronic device including a contact portion (440) protruding from the bracket, which contacts the ground area and is electrically connected to the ground area.

2. In paragraph 1, The above contact part is, An electronic device configured to be at least partially elastically deformable.

3. In any one of paragraphs 1 and 2, The above antenna array includes a plurality of antenna elements (414A, 414B, 414C, 414D, 414E) arranged on a first surface (411a) of the substrate, An electronic device in which the bracket surrounds at least one side of the substrate facing in a direction different from the direction in which the first side of the substrate faces.

4. In any one of paragraphs 1 to 3, An electronic device further comprising a shielding member (450) disposed on a second surface (411b) of the substrate, the shielding member being electrically connected to the bracket.

5. In any one of paragraphs 1 to 4, The second side faces in the opposite direction to the first side, The above shielding member is an electronic device electrically connected to the second surface.

6. In any one of paragraphs 1 to 5, An electronic device in which the above bracket and the above contact portion are formed integrally.

7. In any one of paragraphs 1 to 6, The above contact portion is an electronic device formed by bending at least a portion of the bracket.

8. In any one of paragraphs 1 to 5, The above contact portion (4402) is an electronic device attached to at least a portion of the bracket.

9. In any one of paragraphs 1 to 8, An electronic device further comprising a conductive connecting member (470) electrically connected to the circuit board and the antenna module.

10. In any one of paragraphs 1 to 9, The above conductive connecting member is an electronic device including at least one of a flexible printed circuit board and a coaxial cable.

11. In any one of paragraphs 1 to 10, The above substrate is, As a first surface (411a), a first surface on which the antenna array is arranged; and Including a second side (411b) facing in the opposite direction to the first side, The above brackets are, A first support portion (431) configured to support one of a plurality of side surfaces of the substrate connected to the first side and the second side; and An electronic device including a second support portion (432) extending from the first support portion and configured to support the second surface.

12. In any one of paragraphs 1 to 11, The above contact portion is an electronic device located on the second support portion.

13. In any one of paragraphs 1 to 12, further comprising at least one antenna structure (391), The above antenna module is an electronic device directed towards at least one antenna structure.

14. In any one of paragraphs 1 to 13, An electronic device wherein the housing further includes a non-metallic region (393) disposed between the at least one antenna structure and the antenna module.

15. In any one of paragraphs 1 to 14, The substrate and the antenna array are electronic devices spaced apart from the non-metallic region.

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