Electronic device comprising antenna

Abstract

According to various embodiments, an electronic device may comprise: a housing; a dielectric structure which is disposed in an inner space of the housing, and includes a first surface and a second surface opposite to the first surface; a first antenna structure which is disposed in the dielectric structure; a second antenna structure which is arranged at the first surface to be spaced apart from at least a part of the first antenna structure, and includes a conductive layer; and at least one wireless communication circuit which is configured to transmit or receive a signal in at least one frequency band through the first antenna structure and / or the second antenna structure, wherein the first antenna structure comprises: a first conductive pattern which is arranged at the first surface to be spaced apart from the second antenna structure; and a second conductive pattern which is electrically connected to the first conductive pattern, and is arranged at the second surface to at least partially overlap the conductive layer when the first surface is seen from above.

Description

Electronic device including an antenna

[0001] Embodiments of the present disclosure relate to an electronic device including an antenna.

[0002] Electronic devices can communicate with external electronic devices using various wireless communication technologies. For example, the wireless communication technologies may include at least one of ultra-wideband (UWB) communication, wireless fidelity (Wi-Fi) communication, long term evolution (LTE) communication, 5G communication (or new radio (NR) communication), or Bluetooth communication. To support these wireless communication technologies, the electronic device may have multiple antenna structures (e.g., antennas or antenna modules) arranged therein. For example, an improved arrangement design for the multiple antenna structures may be considered to make the electronic device slimmer.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] The electronic device may include at least one antenna (e.g., an antenna structure or an antenna module). The at least one antenna may include a legacy antenna operating in a frequency band ranging from about 600 MHz to 6000 MHz, a 5G antenna operating in a frequency band ranging from about 3 GHz to 300 GHz, or an antenna for measuring the location of an external electronic device located in close proximity. For example, the antenna for measuring the location of an external electronic device located in close proximity may include an ultra wide band (UWB) antenna comprising at least two antenna elements operating in a frequency band ranging from about 6 GHz to 8.5 GHz.

[0005] An electronic device may include a plurality of antenna structures operating in the various frequency bands described above. These antenna structures may utilize a conductive portion (e.g., a conductive side bezel, a metal bezel, or a side frame) disposed on a portion of a side of the electronic device, may be patterned within an internal space of the electronic device, or may be disposed as a single antenna module via a separate substrate.

[0006] However, as the number of antenna structures increases to cover various frequency bands, it may be difficult to maintain sufficient mutual separation distance or sufficient separation distance from surrounding conductors to ensure isolation within the internal spaces of increasingly slimmer electronic devices. Moreover, antenna structures must have a larger area as the frequency band decreases, which may present challenges in layout design within the internal spaces of increasingly slimmer electronic devices.

[0007] Various embodiments of the present disclosure can provide an electronic device including an antenna having a layout structure that can help slim down the electronic device.

[0008] Various embodiments may provide an electronic device including an antenna that can help improve performance between antennas while minimizing an increase in the volume of the electronic device.

[0009] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0010] According to various embodiments, an electronic device may include a housing, a dielectric structure disposed in an interior space of the housing and including a first surface and a second surface facing in an opposite direction to the first surface, a first antenna structure disposed in the dielectric structure, a second antenna structure disposed on the first surface and spaced apart from at least a portion of the first antenna structure, the second antenna structure including a conductive layer, and at least one wireless communication circuit configured to transmit or receive a signal in at least one frequency band through the first antenna structure and / or the second antenna structure, wherein the first antenna structure may include a first conductive pattern disposed spaced apart from the second antenna structure on the first surface, and a second conductive pattern disposed on the second surface so as to at least partially overlap the conductive layer when the first surface is viewed from above, and a through hole disposed in a manner that penetrates from the first surface to the second surface and electrically connects the first conductive pattern and the second conductive pattern.

[0011] According to various embodiments, an electronic device includes a first housing, a second housing foldably connected to the first housing through a hinge device, a dielectric structure disposed in an inner space of the first housing and including a first side and a second side facing in an opposite direction to the first side, a first antenna structure disposed in the dielectric structure, a second antenna structure spaced apart from at least a portion of the first antenna structure on the first side and including a conductive layer, a third antenna structure including a conductive portion disposed on a portion of a side surface of the first housing, and at least one wireless communication circuit configured to transmit or receive a signal in at least one frequency band through the first antenna structure, the second antenna structure and / or the third antenna structure, wherein the first antenna structure comprises a first conductive pattern spaced apart from the second antenna structure on the first side and electrically connected to the first conductive pattern, and wherein the first side comprises: When shown from above, it may include a second conductive pattern disposed on the second surface so as to at least partially overlap the conductive layer.

[0012] An electronic device according to exemplary embodiments of the present disclosure includes a first conductive pattern disposed on a top surface of a dielectric structure and a second conductive pattern electrically connected to the first conductive pattern and disposed on a back surface, wherein the second conductive pattern is disposed to at least partially overlap with a conductive layer (e.g., a ground layer) of another antenna structure disposed on the top surface to form a field, thereby being set to operate in a relatively low frequency band compared to the area of ​​the antenna, thereby reducing degradation of radiation performance due to mutual interference with antenna structures and / or conductors disposed in the vicinity, and helping to slim down the electronic device.

[0013] In addition, various effects may be provided, either directly or indirectly, through this document.

[0014] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2A is a drawing showing the front and side views of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0018] FIG. 2b is a drawing illustrating the rear side of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0019] FIG. 3A is a diagram illustrating an electronic device viewed from various directions in a folded state according to various embodiments of the present disclosure.

[0020] FIG. 3b is a drawing illustrating one side of an electronic device in a folded state according to various embodiments of the present disclosure.

[0021] FIG. 4A is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0022] FIG. 4b is a block diagram of an electronic device according to various embodiments of the present disclosure.

[0023] FIG. 5A is a schematic diagram of a dielectric structure including a first antenna structure according to various embodiments of the present disclosure.

[0024] FIG. 5b is a configuration diagram of a second antenna structure according to various embodiments of the present disclosure.

[0025] FIG. 5c is a drawing illustrating a state in which a second antenna structure is arranged in a dielectric structure according to various embodiments of the present disclosure.

[0026] FIG. 6A is a schematic diagram showing the rear side of an electronic device according to various embodiments of the present disclosure.

[0027] FIG. 6b is a drawing showing a state in which a dielectric structure and a second antenna structure are arranged according to various embodiments of the present disclosure.

[0028] FIG. 7a is a cross-sectional view of a portion of an electronic device taken along line 7a-7a of FIG. 6b according to various embodiments of the present disclosure.

[0029] FIG. 7b is a cross-sectional view of a portion of an electronic device taken along line 7b-7b of FIG. 6b according to various embodiments of the present disclosure.

[0030] FIG. 8 is a drawing illustrating a layout relationship between a first antenna structure and a second antenna structure according to various embodiments of the present disclosure.

[0031] FIG. 9 is a graph comparing the radiation performance of the first antenna structure according to the amount of overlap of the second conductive pattern of FIG. 8 according to various embodiments of the present disclosure.

[0032] FIG. 10A is a drawing illustrating a layout relationship between a first antenna structure and a second antenna structure according to various embodiments of the present disclosure.

[0033] FIG. 10B is a cross-sectional view of a portion of an electronic device taken along line 10A-10A of FIG. 10A according to various embodiments of the present disclosure.

[0034] FIG. 11A is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0035] FIG. 11B is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0036] FIG. 12A is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0037] FIG. 12b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0038] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0039] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0040] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0041] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0042] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0043] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0044] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0045] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0046] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0047] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0048] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0049] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0051] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0053] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0055] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0057] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0058] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0059] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0060] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0061] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0062] FIG. 2A is a diagram illustrating the front and side views of an electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 2B is a diagram illustrating the rear view of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0063] FIG. 3A is a diagram illustrating an electronic device in a folded state according to various embodiments of the present disclosure, viewed from various directions. FIG. 3B is a diagram illustrating one side of the electronic device in a folded state according to various embodiments of the present disclosure.

[0064] Referring to FIGS. 2A to 3B, the electronic device (200) may include a first housing (210) (e.g., a first housing portion or a first housing structure) and a second housing (220) (e.g., a second housing portion or a second housing structure) that are rotatably coupled to each other about a folding axis (F) through at least one hinge module (not shown) (e.g., a hinge device or a hinge structure). In one embodiment, the first housing (210) and the second housing (220) may be configured as a housing (e.g., a foldable housing) of the electronic device (200). In one embodiment, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) that is arranged to be supported by being accommodated in the first housing and the second housing. In one embodiment, the electronic device (200) may include a second display (300) (e.g., a sub-display) arranged through a second housing (220). In one embodiment, the electronic device (200) may include a hinge housing (310) (e.g., a hinge cover) that is arranged so as to be invisible from the outside through the first housing (210) and the second housing (220) when unfolded, and that covers at least one hinge module so as to be invisible from the outside when folded or when folded. In this document, the surface on which the first display (230) is arranged may be defined as the front surface of the electronic device (200), and the surface opposite the front surface may be defined as the back surface of the electronic device (200). In addition, the surface surrounding the space between the front surface and the back surface may be defined as a side surface of the electronic device (200).

[0065] According to various embodiments, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (F), have an overall symmetrical shape with respect to the folding axis (F), and can be folded to match each other. According to some embodiments, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0066] According to various embodiments, the first housing (210) may include a first side (211) connected to at least one hinge module and arranged to face the front of the electronic device (200) when unfolded, a second side (212) facing in an opposite direction of the first side (211), and / or a first side member (213) surrounding at least a portion of a first space (2101) between the first side (211) and the second side (212). In one embodiment, the second housing (220) may be connected to at least one hinge module and may include a third side (221) arranged to face the front of the electronic device (200) in an unfolded state, a fourth side (222) facing in an opposite direction to the third side (221), and / or a second side member (223) surrounding at least a portion of a second space (2201) between the third side (221) and the fourth side (222). In one embodiment, the first side (211) may be at least partially facing the third side (221) in an unfolded state and facing the third side (221) in a folded state. In one embodiment, the electronic device (200) may also include a recess (201) formed to accommodate a first display (230) through a structural connection between the first housing (210) and the second housing (220). In one embodiment, the recess (201) may have substantially the same size as the first display (230). In one embodiment, the first housing (210) may include a first protective frame (213a) (e.g., a first decorative member) that is coupled to the first side member (213) and overlaps with an edge of the first display (230) when the first display (230) is viewed from above, thereby covering the edge of the first display (230) so that it is not visible from the outside. In one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).In one embodiment, the second housing (220) may include a second protective frame (223a) (e.g., a second decorative member) that is coupled to the second side member (223) and overlaps with the edge of the first display (230) when the first display (230) is viewed from above, thereby covering the edge of the first display (230) so that it is not visible from the outside. In one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). In some embodiments, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0067] According to various embodiments, the hinge housing (310) (e.g., hinge cover) may be disposed between the first housing (210) and the second housing (220) and may be disposed to cover at least a portion of one hinge module. In one embodiment, the hinge housing (310) may be covered by portions of the first housing (210) and the second housing (220) or exposed to the outside, depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state. For example, when the electronic device (200) is in an unfolded state, at least a portion of the hinge housing (310) may be disposed to be covered by the first housing (210) and the second housing (220) and substantially not visible from the outside. In one embodiment, when the electronic device (200) is in a folded state, at least a portion of the hinge housing (310) may be positioned so as to be visible from the outside between the first housing (210) and the second housing (220). In one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge housing (310) may be positioned so as to be at least partially visible from the outside of the electronic device (200) between the first housing (210) and the second housing (220). For example, the area of ​​the hinge housing (310) exposed to the outside may be less than that in a completely folded state. In one embodiment, the hinge housing (310) may include a curved surface.

[0068] According to various embodiments, the electronic device (200) may include at least one of a display (230, 300), an input device (215), an audio output device (227, 228), a sensor module (217a, 217b, 226), a camera module (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In some embodiments, the electronic device (200) may additionally include at least one other component. In some embodiments, at least one of the above-described components may be omitted.

[0069] According to various embodiments, at least one display (230, 300) may include a first display (230) (e.g., a flexible display) that is arranged to be supported by a third surface (221) of a second housing (220) from a first surface (211) of a first housing (210), and a second display (300) that is arranged to be at least partially visible from the outside through a fourth surface (222) in an internal space of the second housing (220). In some embodiments, the second display (300) may be arranged to be visible from the outside through the second surface (212) in an internal space of the first housing (210). In one embodiment, the first display (230) may be primarily used in an unfolded state of the electronic device (200), and the second display (300) may be primarily used in a folded state of the electronic device (200). In one embodiment, the electronic device (200) can control the first display (230) and / or the second display (300) to be usable based on the folding angles of the first housing (210) and the second housing (220) when in an intermediate state.

[0070] According to various embodiments, the first display (230) may be disposed in a receiving space formed by a pair of housings (210, 220). For example, the first display (200) may be disposed in a recess (201) formed by the pair of housings (210, 220), and may be disposed to occupy substantially most of the front surface of the electronic device (200) when unfolded. In one embodiment, the first display (230) may include a flexible display in which at least a portion of the display may be transformed into a flat or curved surface. In one embodiment, the first display (230) may include a first region (230a) corresponding to the first housing (210) and a second region (230b) corresponding to the second housing (220). In one embodiment, the first display (230) may include a folding area (230c) including a portion of the first region (230a) and a portion of the second region (230b) with respect to the folding axis (F). In one embodiment, at least a portion of the folding area (230c) may include an area corresponding to at least one hinge module. In one embodiment, the area division of the first display (230) is merely an exemplary division by a pair of housings (210, 220) and at least one hinge module, and the first display (230) may be displayed as a seamless, full screen substantially through a pair of housings (210, 220) and at least one hinge module. In one embodiment, the first region (230a) and the second region (230b) may have an overall symmetrical shape or a partially asymmetrical shape with respect to the folding region (230c) and / or the folding axis (F).

[0071] According to various embodiments, the electronic device (200) may include a first rear cover (240) disposed on a second surface (212) of the first housing (210) and a second rear cover (250) disposed on a fourth surface (222) of the second housing (220). In some embodiments, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In some embodiments, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223). In one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (240) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In one embodiment, the second rear cover (250) may be formed by a substantially transparent plate, such as, for example, glass or polymer. Accordingly, the second display (300) may be arranged so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220).

[0072] According to various embodiments, the input device (215) may include a microphone. In some embodiments, the input device (215) may include a plurality of microphones arranged to detect the direction of sound. In one embodiment, the audio output device (227, 228) may include speakers. In one embodiment, the audio output device (227, 228) may include a call receiver (227) arranged through the fourth side (222) of the second housing (220) and an external speaker (228) arranged through at least a portion of the second side member (223) of the second housing (220). In some embodiments, the input device (215), the audio output device (227, 228), and the connector (229) are disposed in spaces of the first housing (210) and / or the second housing (220) and can be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In some embodiments, the holes formed in the first housing (210) and / or the second housing (220) can be used in common for the input device (215) and the audio output device (227, 228). In some embodiments, the audio output device (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (210) and / or the second housing (220).

[0073] According to various embodiments, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first surface (211) of the first housing (210), a second camera module (216b) disposed on a second surface (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth surface (222) of the second housing (220). In one embodiment, the electronic device (200) may include a flash (218) disposed near the second camera module (216b). In one embodiment, the flash (218) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one of the camera modules (216a, 216b, 225) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on either side of the first housing (210) and / or the second housing (220).

[0074] According to various embodiments, the sensor modules (217a, 217b, 226) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (200) or an external environmental state. In one embodiment, the sensor modules (217a, 217b, 226) may include a first sensor module (217a) disposed on a first surface (211) of the first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220). In some embodiments, the sensor module (217a, 217b, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor).

[0075] According to various embodiments, the electronic device (200) may further include at least one sensor module not shown, for example, a pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. In some embodiments, the fingerprint recognition sensor may be disposed through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0076] According to various embodiments, the key input device (219) may be arranged to be exposed to the outside through the first side member (213) of the first housing (210). In some embodiments, the key input device (219) may also be arranged to be exposed to the outside through the second side member (223) of the second housing (220). In some embodiments, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 300). In one embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 300).

[0077] According to various embodiments, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In some embodiments, the connector port (229) may also perform a function for transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals.

[0078] According to various embodiments, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217a, 217b, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 300). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 300) in the interior space of at least one housing (210, 220), below an active area of ​​at least one display (230, 300), and may be arranged to be in contact with the external environment through an opening or transparent area perforated through a cover member (e.g., a window layer) and / or a second rear cover (250). In one embodiment, the area where at least one display (230, 300) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of the area displaying content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area overlapping with an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by an image sensor to create an image. For example, the transparent area of ​​at least one display (230, 300) may include an area where the pixel density is lower than the surrounding area. For example, the transparent area may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC).In one embodiment, some camera modules (216a, 225) or sensor modules (217a, 226) may be arranged to perform their functions without being visually exposed through the display. For example, an area facing a camera module (216a, 225) and / or a sensor module (217a, 226) arranged under a display (230, 300) (e.g., a display panel) may have an under-display camera (UDC) structure, eliminating the need for a perforated opening.

[0079] According to various embodiments, when the electronic device (200) is in an unfolded state (e.g., the state of FIGS. 2A and 2B), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may be arranged to form substantially the same plane and face the same direction (e.g., the z-axis direction). In one embodiment, when the electronic device (200) is in an unfolded state, the first housing (210) may be rotated at an angle of about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) face each other and may be folded in the opposite direction (out folding method).

[0080] According to various embodiments, when the electronic device (200) is in a folded state (e.g., the state of FIGS. 3A and 3B), the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) may be arranged to face each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 to about 10 degrees) with respect to each other through the folding region (230c). In one embodiment, the folding region (230c) may be deformed into a curved shape having at least a certain curvature. In one embodiment, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is greater than the folded state and less than the unfolded state, and the curvature of the folding region (230c) may be less than the folded state and greater than the unfolded state. In some embodiments, the first housing (210) and the second housing (220) may form an angle that can stop at a designated folding angle between the folded state and the unfolded state through at least one hinge module (free stop function). In some embodiments, the first housing (210) and the second housing (220) may be continuously operated while being pressed in the unfolding direction or the folding direction based on the designated inflection angle through at least one hinge module.

[0081] According to various embodiments, as illustrated in FIG. 2B, the electronic device (200) may include a first antenna structure (410) disposed in an internal space. In one embodiment, the first antenna structure (410) may be disposed in a first space (2101) of the first housing (210). In one embodiment, the first antenna structure (410) may be a laser direct structuring (LDS) pattern disposed on an outer surface of a dielectric structure of a polymer material (e.g., the dielectric structure (263) of FIG. 6B). In one embodiment, the dielectric structure (e.g., the dielectric structure (263) of FIG. 6B) may include an antenna carrier disposed in an internal space of the electronic device (200), a bracket, a support member extending from or coupled to the housing, or a portion of a rear case. In one embodiment, the first antenna structure (410) may be configured as a first antenna (A1) to transmit or receive a wireless signal in a first frequency band via a wireless communication circuit (e.g., the wireless communication circuit (192) of FIG. 1). For example, the first frequency band may be a legacy band. In one embodiment, the first antenna (A1) may be used in at least one band of, for example, a low band of about 600 MHz to 960 MHz, a mid band of about 1700 MHz to 2200 MHz, a high band of about 2300 MHz to 2800 MHz, a sub-6 band of about 5 GHz to 6 GHz, an UHB band of about 3.2 GHz to 4.5 GHz, BT (Bluetooth), GPS (Global Positioning System), or WIFI (Wireless Fidelity).

[0082] According to various embodiments, the electronic device (200) may include a second antenna structure (500) spaced apart from a first conductive pattern (e.g., the first conductive pattern (411) of FIG. 5A) of a first antenna structure (410) at a specified interval on a first surface (e.g., the first surface (2631) of FIG. 5A) of a dielectric structure (e.g., the dielectric structure (263) of FIG. 5A). In one embodiment, the second antenna structure (500) may be arranged to transmit or receive a wireless signal in a direction in which the first rear cover (240) faces (e.g., the −z axis direction of FIG. 2B). For example, the second antenna structure (500) may be configured as the second antenna (A2) to transmit or receive a wireless signal in a direction (e.g., the -z axis direction of FIG. 2B) toward the first rear cover (240) via a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). In one embodiment, the second antenna structure (500) may include a plurality of conductive patches (e.g., the conductive patches (510, 520, 530, 540) of FIG. 5B) configured to operate in a second frequency band different from the first frequency band. For example, the second frequency band may include a frequency band in a range of about 7.75 GHz to 8.25 GHz (e.g., Ch 9). In one embodiment, the second frequency band may also include a frequency band in a range of about 6.25 GHz to 6.75 GHz (e.g., Ch 5).

[0083] In various embodiments, the electronic device (200) may include a conductive portion (320) disposed on at least a portion of the first side member (213) and used as a third antenna structure. In one embodiment, the conductive portion (320) may be segmented through a first segment (321) (e.g., a first non-conductive portion) and a second segment (322) (e.g., a second non-conductive portion) that are spaced apart from each other in the conductive first side member (213). In one embodiment, the conductive portion (320) may be configured as a third antenna (A3) to transmit or receive a wireless signal in a third frequency band that is different from or the same as the first frequency band and / or the second frequency band via a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1 ). In one embodiment, the second antenna structure (500) may include an ultra wide band (UWB) antenna that is used to detect a distance to an external electronic device or a location of an external electronic device (e.g., angle of arrival (AoA) positioning technique) through a phase difference of a received signal using a plurality of conductive patches (e.g., conductive patches (510, 520, 530, 540) of FIG. 5B) and / or a conductive portion (320) used as a third antenna structure. For example, at least a portion of the second antenna structure (500) and the conductive portion (320) may be configured to operate in diversity, thereby helping to improve the reception sensitivity of the UWB antenna. In one embodiment, at least a portion of the first antenna structure (410) may be disposed between the second antenna structure (500) and the conductive portion when the first rear cover (240) is viewed from above.

[0084] According to an exemplary embodiment of the present disclosure, the first antenna structure (410) is arranged in the thickness direction (e.g., z-axis direction) of the electronic device (200) such that at least a portion of the second conductive pattern (e.g., the second conductive pattern (412) of FIG. 5B) disposed on the second surface (e.g., the second surface (2632) of FIG. 5B) of the dielectric structure (e.g., the dielectric structure (263) of FIG. 5B) overlaps with the conductive layer (e.g., the conductive layer (G) of FIG. 5B) (e.g., the ground layer) of the second antenna structure (500), thereby reducing the arrangement space in the planar direction (e.g., x, y-axis direction) of the electronic device (200) and at the same time minimizing interference with the surrounding antenna structure (e.g., the second antenna structure (500) and / or the conductive portion (210)) and / or the conductor (e.g., the conductive first side member (213)), thereby improving the radiation performance. It can help you improve.

[0085] FIG. 4A is an exploded perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 4B is a schematic diagram of an electronic device according to various embodiments of the present disclosure.

[0086] FIG. 4b is a drawing showing an assembled state of an electronic device with the flexible display omitted.

[0087] Referring to FIGS. 4A and 4B, the electronic device (200) may include a first display (230) (e.g., a flexible display), a second display (300), a pair of support members (261, 262), at least one substrate (270) (e.g., a printed circuit board (PCB)), a first housing (210), a second housing (220), a first rear cover (240), and / or a second rear cover (250).

[0088] According to various embodiments, the second display (300) may be positioned in a space between the second housing (220) and the second rear cover (250) (e.g., the second space (2201) of FIG. 4B). In one embodiment, the second display (300) may be positioned in the space between the second housing (220) and the second rear cover (250) so as to be visible from the outside through substantially the entire area of ​​the second rear cover (250).

[0089] According to various embodiments, at least a portion of the first support member (261) may be foldably coupled to the second support member (262) via at least one hinge module (not shown). In one embodiment, the electronic device (200) may include at least one wiring member (273) (e.g., a flexible printed circuit board (FPCB)) arranged from at least a portion of the first support member (261) across at least one hinge module to a portion of the second support member (262). In one embodiment, the first support member (261) may be arranged in a manner that extends from the first side member (213) or is structurally coupled with the first side member (213). In one embodiment, the electronic device (200) may include a first space (2101) provided through the first support member (261) and the first rear cover (240). In one embodiment, the first housing (210) (e.g., the first housing structure) may be configured through a combination of a first side member (213), a first support member (261), and a first rear cover (240). In one embodiment, the second support member (262) may be arranged in a manner that extends from the second side member (223) or is structurally coupled with the second side member (223). In one embodiment, the electronic device (200) may include a second space (2201) provided through the second support member (262) and the second rear cover (250). In one embodiment, the second housing (220) (e.g., the second housing structure) may be configured through a combination of the second side member (223), the second support member (262), and the second rear cover (250). In one embodiment, at least one wiring member (273) and / or at least a portion of at least one hinge module may be arranged to be supported by at least a portion of a pair of support members (261, 262). In one embodiment, at least one wiring member (273) may be arranged to extend from the first support member (261) across the folding axis (e.g., the folding axis (F) of FIG. 2A) to the second support member (262).In one embodiment, at least one wiring member (273) may be arranged to have a length in a direction substantially perpendicular to the folding axis (F) (e.g., in the x-axis direction).

[0090] According to various embodiments, at least one substrate (270) may include a first substrate (271) disposed in a first space (2101) and a second substrate (272) disposed in a second space (2201). In one embodiment, the first substrate (271) and the second substrate (272) may include a plurality of electronic components disposed to implement various functions of the electronic device (200). In one embodiment, the first substrate (271) and the second substrate (272) may be electrically connected through at least one wiring member (273).

[0091] According to various embodiments, the electronic device (200) may include at least one battery (291, 292). In one embodiment, the at least one battery (291, 292) may include a first battery (291) disposed in a first space (2101) of a first housing (210) and electrically connected to a first substrate (271), and a second battery (292) disposed in a second space (2201) of a second housing (220) and electrically connected to a second substrate (272). In one embodiment, the first support member (261) and the second support member (262) may further include at least one swelling hole for the first battery (291) and the second battery (292).

[0092] According to various embodiments, the first housing (210) may include a first rotation support surface (214), and the second housing (220) may include a second rotation support surface (224) corresponding to the first rotation support surface (214). In one embodiment, the first rotation support surface (214) and the second rotation support surface (224) may include curved surfaces corresponding to (naturally connected to) the curved outer surface of the hinge housing (310). In one embodiment, the first rotation support surface (214) and the second rotation support surface (224) may cover the hinge housing (310) when the electronic device (200) is in an unfolded state, thereby not exposing the hinge housing (310) to the rear surface of the electronic device (200) or exposing only a portion of the hinge housing (310). In one embodiment, the first rotational support surface (214) and the second rotational support surface (224) can rotate along the outer surface of the curve of the hinge housing (310) when the electronic device (200) is in a folded state, thereby exposing at least a portion of the hinge housing (310) to the rear surface of the electronic device (200).

[0093] According to various embodiments, the electronic device (200) may include at least one antenna (not shown) disposed in the first space (2201). In one embodiment, the at least one antenna may be disposed in the first space (2201), on the first battery (291) and the first rear cover (240). In one embodiment, the at least one antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. In one embodiment, the at least one antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In some embodiments, the antenna structure may be formed by at least a portion of the first side member (213) or the second side member (223) and / or a portion of the first support member (261) and the second support member (262), or a combination thereof.

[0094] According to various embodiments, the electronic device (200) may further include at least one electronic component assembly (274, 275) and / or additional support members (263, 264) disposed in a first space (e.g., the first space (2101) of FIG. 1A) and / or a second space (e.g., the second space (2201) of FIG. 1A). For example, the at least one electronic component assembly (274, 275) may include an interface connector port assembly (274) or a speaker assembly (275). In one embodiment, the additional support member (263) disposed in the first space may include a dielectric structure of a polymer material disposed to support the first antenna structure (e.g., the first antenna structure (410) of FIG. 2A) and the second antenna structure (500) according to an exemplary embodiment of the present disclosure. In one embodiment, the second antenna structure (500) may be positioned between the first support member (261) and the first rear cover (240) to form a directional beam through the first rear cover (240).

[0095] According to various embodiments, the electronic device (200) may include a first waterproof member (WP1) disposed between the first display (230) and the first support member (261) and a second waterproof member (WP2) disposed between the first display (230) and the second support member (262). In one embodiment, the first waterproof member (WP1) may provide at least one first waterproof space between the back surface of the first display (230) and the first support member (261). In one embodiment, the at least one first waterproof space may accommodate an area corresponding to at least one electronic component (e.g., a camera module or a sensor module) disposed to be supported by the first support member (261). In one embodiment, the second waterproof member (WP2) may provide a second waterproof space between the back surface of the first display (230) and the second support member (262). In one embodiment, the second waterproof space can accommodate at least a portion of the bending portion that folds toward the back of the first display (230). For example, the second waterproof space can be arranged to extend from the first display (230) and surround at least a portion of the bending portion (e.g., a chip on plastic (COP) structure) that folds toward the back. Accordingly, the control circuit (e.g., a display driver IC (DDI)) and / or a plurality of electrical components) arranged in the bending portion can be protected from external moisture and / or foreign substances by being arranged in the second waterproof space.

[0096] According to various embodiments, the electronic device may include at least one hinge module, and a first hinge plate (311) and a second hinge plate (312) connecting the first housing and the second housing. In one embodiment, the first hinge plate (311) and the second hinge plate (312) may form the same plane as at least a portion of the first housing (210) (e.g., the first support member (261)) and at least a portion of the second housing (220) (e.g., the second support member (262)) when in an unfolded state.

[0097] FIG. 5A is a schematic diagram of a dielectric structure including a first antenna structure according to various embodiments of the present disclosure.

[0098] Referring to FIG. 5A, an electronic device (e.g., an electronic device (200) of FIG. 4A) may include a dielectric structure (263) (e.g., an additional support member (263) of FIG. 4A, a rear case, or a rear bracket) disposed in a first space (e.g., a first space (2101) of FIG. 4B) of a first housing (e.g., a first housing (210) of FIG. 4A). In one embodiment, the dielectric structure (263) may be formed of a polymer material (e.g., an injection-molded material) and may be disposed between a first rear cover (e.g., a first rear cover (240) of FIG. 4A) and a first substrate (e.g., a first substrate (271) of FIG. 4A) (e.g., a printed circuit board). In one embodiment, the dielectric structure (263) can include a first surface (2631) facing (e.g., facing in the -z-axis direction) toward the first back cover (e.g., the first back cover (240) of FIG. 4A) and a second surface (2632) facing in an opposite direction (e.g., in the z-axis direction) from the first surface and facing the first substrate (e.g., the first substrate (271) of FIG. 4A). In one embodiment, the dielectric structure (263) can be arranged such that the first surface (2631) overlaps at least a portion of the first substrate (e.g., the first substrate (271) of FIG. 4A) when viewed from above. In one embodiment, the dielectric structure (263) can be secured to a first support member (e.g., the first support member (261) of FIG. 4A) of a first housing (e.g., the first housing (210) of FIG. 4A) via a fastening member, such as a screw. In some embodiments, the fastening member may be secured by simultaneously penetrating the dielectric structure (263) and the first substrate (e.g., the first substrate (271) of FIG. 4A) disposed thereunder, and then fastening to the first support member (e.g., the first support member (261) of FIG. 4A).

[0099] According to various embodiments, an electronic device (e.g., electronic device (200) of FIG. 4A) may include a first antenna structure (410) disposed on an outer surface of a dielectric structure (263). In one embodiment, the first antenna structure (410) may include an LDS pattern formed on an outer surface of the dielectric structure (263). In one embodiment, the first antenna structure (410) may include a first conductive pattern (411) disposed on a first surface (2631) of the dielectric structure (263) and a second conductive pattern (412) disposed in such a manner that at least a portion of the first conductive pattern (411) extends through a through hole (413) formed from the first surface (2631) of the dielectric structure (263) to a second surface (2632). In some embodiments, the first conductive pattern (411) and the second conductive pattern (412) may be individually disposed on the first surface (2631) and the second surface (2632), respectively, and may be electrically connected through conductive vias as electrical connection members that are filled through the through-hole (413) or applied to the inner surface of the through-hole (413). In one embodiment, the first conductive pattern (411) may be disposed so as not to overlap the second conductive pattern (412) when the first surface (2631) is viewed from above, except for the through-hole (413). In some embodiments, the first conductive pattern (411) may be disposed so as to at least partially overlap the first surface (2631) when the first surface (2631) is viewed from above. In some embodiments, the first conductive pattern (411) and the second conductive pattern (412) may be electrically connected via an electrical connection structure (e.g., a third conductive pattern) that extends in a bypass manner toward the side of the dielectric structure (263). In some embodiments, the first antenna structure (410) may include a flexible printed circuit board (FPCB) having a metal plate or conductive patterns (411, 412) formed thereon, which are arranged in a manner attached to the outer surface of the dielectric structure (263).In some embodiments, at least one of the first conductive pattern (411) or the second conductive pattern (412) may be disposed in a manner that is at least partially embedded in a dielectric structure (263) formed of a polymer material (e.g., an injection molded product). In such a case, at least one of the first conductive pattern (411) or the second conductive pattern (412) may be disposed in the dielectric structure (263) through injection molding. In one embodiment, the first antenna structure (410) may be operated as a first antenna (A1) configured to transmit or receive a wireless signal in a first frequency band (e.g., a legacy band) through a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1).

[0100] FIG. 5b is a configuration diagram of a second antenna structure according to various embodiments of the present disclosure.

[0101] Referring to FIG. 5B, the second antenna structure (500) (e.g., antenna module or antenna) may include a first substrate surface (5901) facing the first rear cover (e.g., facing the -z-axis direction) and a second substrate surface (5902) facing the opposite direction (e.g., facing the z-axis direction) to the first substrate surface (5901), and may include a dielectric substrate (590) (e.g., substrate) formed in a manner in which a plurality of insulating layers are laminated. In one embodiment, the dielectric substrate (590) may be a flexible substrate (e.g., FPCB, flexible printed circuit board). In one embodiment, the dielectric substrate (590) may be a rigid substrate (e.g., PCB, printed circuit board). In one embodiment, the second antenna structure (500) may include a conductive layer (G) (ground layer or ground plane) disposed on a first insulating layer among the plurality of insulating layers. For example, the conductive layer (G) may be a conductive pattern disposed on at least a portion of the second antenna structure (500). In some embodiments, the conductive layer (G) may include a ground pattern disposed on at least a portion of the second antenna structure (500). In one embodiment, the second antenna structure (500) may include a plurality of conductive patches (510, 520, 530, 540) disposed at a specified interval on a second insulating layer different from the first insulating layer among the plurality of insulating layers. In one embodiment, a plurality of conductive patches (510, 520, 530, 540) may be disposed in a space between the conductive layer (G) and the first substrate surface (5901) or on the first substrate surface (5901). In one embodiment, the conductive layer (G) may be formed to have a size that overlaps the plurality of conductive patches (510, 520, 530, 540) when the first substrate surface (5901) is viewed from above, so as to form a field with the plurality of conductive patches (510, 520, 530, 540).In one embodiment, the plurality of conductive patches (510, 520, 530, 540) may be configured to operate as a second antenna (A2) (e.g., a UWB antenna) configured to transmit or receive a wireless signal in a second frequency band (e.g., Ch5 (a frequency band ranging from about 7.75 GHz to 8.25 GHz) or Ch9 (a frequency band ranging from about 6.25 GHz to 6.75 GHz)) different from the first frequency band via a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). In one embodiment, the second antenna (A2) may include an array antenna operating with circular polarization (CP).

[0102] According to various embodiments, the plurality of conductive patches may include a first patch (510), a second patch (520), a third patch (530), and / or a fourth patch (540). In some embodiments, the fourth patch (540) may be omitted. In one embodiment, the first patch (510) may be electrically connected to the connector portion (C) via a first wiring (511) (e.g., a first electrical path or a first wiring structure) disposed on a dielectric substrate (590). In one embodiment, the second patch (520) may be electrically connected to the connector portion (C) via a second wiring (521) (e.g., a second electrical path or a second wiring structure) disposed on a dielectric substrate (590). In one embodiment, the third patch (530) may be electrically connected to the connector portion (C) via a third wiring (531) (e.g., a third electrical path or a third wiring structure) disposed on the dielectric substrate (590). In one embodiment, the fourth patch (540) may be electrically connected to the connector portion (C) via a fourth wiring (541) (e.g., a fourth electrical path or a fourth wiring structure) disposed on the dielectric substrate (590). In one embodiment, when the second antenna structure (500) is placed in the first housing (e.g., the first housing (210) of FIG. 4a), the connector portion (C) is connected to the first substrate (e.g., the first substrate (271) of FIG. 4a) placed in the first housing (e.g., the first housing (210) of FIG. 4a), thereby being electrically connected to the wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) of the first substrate (e.g., the first substrate (271) of FIG. 4).

[0103] FIG. 5c is a drawing illustrating a state in which a second antenna structure is arranged in a dielectric structure according to various embodiments of the present disclosure.

[0104] Referring to FIG. 5C, the second antenna structure (500) may be arranged in such a manner that it faces at least a portion of the first surface (2631) of the dielectric structure (263). In one embodiment, the second antenna structure (500) may be arranged in such a manner that the second substrate surface (5902) of the dielectric substrate (590) and the first surface (2631) of the dielectric structure (263) face each other. In some embodiments, the second antenna structure (500) may be arranged in such a manner that it is attached to at least a portion of the first surface (2631) of the dielectric structure (263). In this case, the dielectric substrate (590) of the second antenna structure (500) may be attached to the first surface (2631) of the dielectric structure (263) by taping, bonding, or fusion. In one embodiment, the second antenna structure (500) may be arranged to overlap at least a portion of the dielectric structure (263) when the first surface (2631) is viewed from above. In one embodiment, the dielectric substrate (590) of the second antenna structure (500) may be arranged side by side with the first conductive pattern (411) of the first antenna structure (410) at a specified distance. In one embodiment, the dielectric substrate (590) of the second antenna structure (500) may be arranged to be spaced apart from the first conductive pattern (411) of the first antenna structure (410) by about 3 mm to about 4 mm or less. In one embodiment, the dielectric substrate (590) of the second antenna structure (500) may be arranged to overlap at least a portion of the second conductive pattern (412) of the first antenna structure (410) disposed on the second surface (2632) of the dielectric structure (263) when the first surface (2631) is viewed from above. For example, at least a portion of the second conductive pattern (412) may be arranged to overlap the conductive layer (G) of the second antenna structure (500) when the first surface (2631) is viewed from above.

[0105] FIG. 6A is a schematic diagram illustrating the rear surface of an electronic device according to various embodiments of the present disclosure. FIG. 6B is a diagram illustrating a state in which a dielectric structure and a second antenna structure are arranged according to various embodiments of the present disclosure.

[0106] FIGS. 6A and 6B are drawings showing the rear side of an electronic device in an unfolded state with the first rear cover omitted.

[0107] Referring to FIGS. 6A and 6B, the electronic device (200) may include a first substrate (271) (e.g., a printed circuit board) disposed in a first space (2101) of a first housing (210), a dielectric structure (263) (e.g., an additional support member (263) of FIG. 4A) including a first antenna structure (410) disposed in a manner of being laminated on at least a portion of the first substrate (271), and a second antenna structure (500) disposed in a manner of being laminated on at least a portion of the dielectric structure (263). In one embodiment, the second antenna structure (500) may be attached onto the dielectric structure (263) and then fixed in a manner of being laminated on the first substrate (271). In one embodiment, the second antenna structure (500) may be arranged to form a beam pattern in a direction toward the first rear cover (e.g., the first rear cover (240) of FIG. 4a) through a plurality of conductive patterns (e.g., conductive patterns (510, 520, 530, 540) of FIG. 5b).

[0108] According to various embodiments, the electronic device (200) may include a conductive portion (320) disposed on at least a portion of the first side member (213) and used as a third antenna structure. In one embodiment, the conductive portion (320) may be disposed on a side of the electronic device (200) so as to be at least partially exposed so as to be visible from the outside. In one embodiment, the conductive portion (320) may be segmented through a first segment (321) (e.g., a first non-conductive portion) and a second segment (322) (e.g., a second non-conductive portion) formed of a non-conductive material spaced apart from the first side member (213). In one embodiment, the conductive portion (320) may be configured to operate as a third antenna (A3) configured to transmit or receive a wireless signal in a frequency band that is the same as or different from that of the first antenna structure (410) operating as the first antenna (A1) and / or the second antenna structure (500) operating as the second antenna (A2) via a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). In one embodiment, the first conductive pattern (411) of the first antenna structure (410) disposed on the first surface (2631) of the dielectric structure (263) may be arranged such that the first surface (2631) of the dielectric structure (263) has a specified gap at least partially between the second antenna structure (500) and the conductive portion (320) when the first surface (2631) of the dielectric structure (263) is viewed from above. In one embodiment, the second conductive pattern (412) of the first antenna structure (410) disposed on the second side (2632) of the dielectric structure (263) may be disposed so as to at least partially overlap the conductive layer (G) of the second antenna structure (500) when the first side (2631) of the dielectric structure (263) is viewed from above.

[0109] According to various embodiments, the second antenna structure (500) and the conductive portion (320) used as the third antenna structure must be arranged to have a mutually designated separation distance in order to secure isolation characteristics. For example, if the first antenna structure (410) is additionally arranged between the second antenna structure (500) and the conductive portion (320), the isolation characteristics between the respective antennas (A1, A2, A3) may deteriorate. In particular, the first antenna structure (410) may lack space to secure desired resonance characteristics, and there may be difficulties in increasing the size of the electronic device (200) or redesigning the surrounding structures in order to secure such resonance characteristics.

[0110] The first antenna structure (410) according to exemplary embodiments of the present disclosure has an efficient arrangement structure and secures desired resonance characteristics through conductive patterns (e.g., first conductive pattern (411) and second conductive pattern (412)) arranged in a divided manner on opposite outer surfaces (e.g., first surface (2631) and second surface (2632)) of a dielectric structure (263), thereby helping to secure the performance of the antenna (A1) and slim down the electronic device (200).

[0111] FIG. 7A is a cross-sectional view of a portion of an electronic device taken along line 7A-7A of FIG. 6B according to various embodiments of the present disclosure. FIG. 7B is a cross-sectional view of a portion of an electronic device taken along line 7B-7B of FIG. 6B according to various embodiments of the present disclosure.

[0112] Referring to FIGS. 7A and 7B , the electronic device (200) may include a flexible display (230) arranged to be supported by a first support member (261) extending from at least a portion of a first side member (213) to a first space (2101). According to one embodiment, the electronic device (200) may include a first rear cover (240) coupled with the first side member (213) in a direction opposite to the flexible display (230) (e.g., in the -z axis direction). In one embodiment, the first housing (210) may have a housing structure formed by coupling the first side member (213) and the first rear cover (240) and having a first space (2101). In one embodiment, the electronic device (200) may include a first substrate (271) (e.g., a printed circuit board) disposed between a first support member (261) and a first rear cover (240) in a first space (2101) of a first housing (210), a dielectric structure (263) disposed between the first substrate (271) and the first rear cover (240), a first antenna structure (410) formed on an outer surface (e.g., a first surface (2631) and a second surface (2632)) of the dielectric structure (263), and a second antenna structure (500) disposed spaced apart from the first antenna structure (410) and disposed on an outer surface (e.g., the first surface (2631)) of the dielectric structure (263). In one embodiment, the dielectric structure (263) may be disposed in a manner of partially contacting or being in proximity to the first substrate (271).

[0113] According to various embodiments, the first antenna structure (410) may include a first conductive pattern (411) disposed on a first surface (2631) of the dielectric structure (263) and a second conductive pattern (412) disposed on a second surface (2632) of the dielectric structure (263). In one embodiment, the second conductive pattern (412) may be disposed in such a manner that the first conductive pattern (411) extends through a through hole (413) formed from the first surface (2631) of the dielectric structure (263) to the second surface (2632). In one embodiment, at least a portion of the second conductive pattern (412) may be arranged to overlap the conductive layer (G) of the second antenna structure (500) when the first surface (2631) is viewed from above, such that a portion of the second conductive pattern (412) may be induced to form a field for antenna operation through the conductive layer (G).

[0114] According to various embodiments, the first substrate (271) (e.g., a printed circuit board) may include a feed portion (FP) for electrically connecting to a second conductive pattern (412) disposed on a second surface (2632) of the dielectric structure (263). In one embodiment, the feed portion (FP) may be electrically connected to a wireless communication circuit (e.g., a communication circuit or a communication module) (e.g., a wireless communication module (192) of FIG. 1) disposed on the first substrate (271). In one embodiment, the electronic device (200) may include an electrical connection member (EF) for electrically connecting the second conductive pattern (412) and the feed portion (FP) of the first substrate (271). In one embodiment, the electrical connection member (EF) may include a conductive contact (e.g., a C-clip) or a conductive tape. In one embodiment, the feed portion (FP) may be arranged at a position that does not overlap with the conductive layer (G) of the second antenna structure (500) when the first surface (2631) is viewed from above. This may mean that the electrical connection portion of the second conductive pattern (412) that is electrically connected to the feed portion (FP) through the electrical connection member (EF) is also arranged so as not to overlap with the conductive layer (G). This arrangement structure may help reduce the phenomenon in which the radiation performance of the first antenna (A1) is deteriorated due to interference of the feed portion (FP) with the conductive layer (G). In some embodiments, the feed portion (FP) may be arranged at a position that at least partially overlaps the conductive layer (G) when the first surface (2631) is viewed from above.

[0115] FIG. 8 is a diagram illustrating the arrangement relationship of a first antenna structure and a second antenna structure according to various embodiments of the present disclosure. FIG. 9 is a graph comparing the radiation performance of the first antenna structure according to the amount of overlap of the second conductive pattern of FIG. 8 according to various embodiments of the present disclosure.

[0116] Referring to FIGS. 8 and 9, the radiation characteristics of the first antenna (A1) operating through the first antenna structure (410) can be determined by the amount and / or the overlapping length of the second conductive pattern (412) and the conductive layer (G) of the second antenna structure (500). For example, the first antenna (A1) can have a relatively higher gain in a specified frequency band (e.g., about 4 GHz to 5 GHz) when the second conductive pattern (412) and the conductive layer (G) overlap with a first overlapping amount having a first overlapping length (d1) (e.g., graph 9001), but when the first antenna (A1) has a second overlapping length (d2) that is longer than the first overlapping length (d1) and has a second overlapping amount greater than the first overlapping amount (e.g., graph 9002). In one embodiment, the first antenna (A1) may have a relatively higher gain in a specified frequency band (e.g., about 4 GHz to 5 GHz) when the second conductive pattern (412) and the conductive layer (G) overlap with a second overlapping amount having a second overlapping length (d2) (e.g., graph 9002), but when the third overlapping amount has a third overlapping length (d3) that is longer than the second overlapping length (d2) and is greater than the second overlapping amount (e.g., graph 9003). This may mean that when the second conductive pattern (412) secures a sufficient overlapping length and / or overlapping amount with the conductive layer (G) of the second antenna structure (500), it may help improve the radiation performance of the first antenna (A1).

[0117] FIG. 10A is a diagram illustrating the arrangement relationship between a first antenna structure and a second antenna structure according to various embodiments of the present disclosure. FIG. 10B is a cross-sectional view of a portion of an electronic device taken along line 10A-10A of FIG. 10A according to various embodiments of the present disclosure.

[0118] In describing the electronic device (200) of FIGS. 10a and 10b, the same reference numerals are given to components that are substantially the same as those of the electronic device (200) of FIGS. 6b and 7a, and a detailed description thereof may be omitted.

[0119] Referring to FIGS. 10A and 10B, the electronic device (200) may include a first antenna structure (420) disposed on an outer surface of a dielectric structure (263). In one embodiment, the first antenna structure (420) may include a conductive pattern disposed on a second surface (2632) of the dielectric structure (263). In one embodiment, the first antenna structure (420) may include an LDS pattern disposed on the second surface (2632) of the dielectric structure (263). In one embodiment, at least a portion of the first antenna structure (420) may be disposed to overlap a conductive layer (G) of the second antenna structure (500) when the first surface (2631) is viewed from above. In one embodiment, at least a portion of the first antenna structure (420) may be electrically connected to the feed portion (FP) of the first substrate (271) through an electrical connection member (EF), in an area that does not overlap the conductive layer (G) when the first surface (2631) is viewed from above. In one embodiment, the first antenna structure (420) may be induced to form a field for antenna operation through the conductive layer (G) in a portion that overlaps the conductive layer (G).

[0120] FIG. 11A is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 11B is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0121] Referring to FIGS. 11A and 11B , the electronic device (600) may include a housing (610) (e.g., a first housing or a base housing) and a slide structure (660) (e.g., a second housing or a slide housing) that is at least partially movably coupled from the housing (610) and supports at least a portion of the flexible display (630). In one embodiment, the slide structure (660) may include a bendable member (not shown) (e.g., a multi-joint hinge or a multi-bar assembly) that is coupled to one end and supports at least a portion of the flexible display (630). For example, when the slide structure (660) performs a sliding motion in the housing (610), the bendable member may be at least partially retracted into the interior space of the housing (610) while supporting the flexible display (630). In one embodiment, the electronic device (600) may include a housing (610) (e.g., a housing structure) that includes a front surface (610a) facing a first direction (e.g., the Z-axis direction), a back surface (610b) facing a second direction opposite to the first direction (- the Z-axis direction), and a side surface (610c) that surrounds a space between the front surface (610a) and the back surface (610b) and is at least partially exposed to the outside. In one embodiment, the back surface (610b) may be formed by a back cover (621) coupled to the housing (610). In one embodiment, the back cover (621) may be formed by a polymer, a coated or colored glass, a ceramic, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In some embodiments, the back cover (621) may be formed integrally with the housing (610). In one embodiment, at least a portion of the side (610c) may be positioned to be exposed externally through the housing (610).

[0122] According to various embodiments, the side member (640) may include a first side (641) having a first length, a second side (642) extending in a direction perpendicular to the first side (641) to have a second length longer than the first length, a third side (643) extending from the second side (642) parallel to the first side (641) and having the first length, and a fourth side (644) extending from the third side (643) parallel to the second side (642) and having the second length. In one embodiment, the slide structure (660) supports the flexible display (630) and can expand the display area of ​​the flexible display (630) by being pulled out from the second side (642) toward the fourth side (644) (e.g., in the X-axis direction), or can reduce the display area of ​​the flexible display (630) by being pulled in from the fourth side (644) toward the second side (642) (e.g., in the X-axis direction). In one embodiment, the electronic device (600) can include a first side cover (640a) and a second side cover (640b) for covering the first side (641) and the third side (643). In one embodiment, the first side (641) and the third side (643) may be positioned so as not to be exposed to the outside through the first side cover (640a) and the second side cover (640b).

[0123] According to various embodiments, the electronic device (600) may include a flexible display (630) arranged to be supported by a slide structure (660). In one embodiment, the flexible display (630) may include a first portion (630a) (e.g., a flat portion) supported by the slide structure (660) and a second portion (630b) (e.g., a bendable portion or a bendable portion) extending from the first portion (630a) and at least partially supported by a bendable member. In one embodiment, at least a portion of the second portion (630b) may be arranged to be inserted into the internal space of the housing (610) and not exposed to the outside when the electronic device (600) is in a slide-in state (e.g., at least a portion of the slide structure (660) is inserted into the housing (610), and may be at least partially exposed to the outside when the electronic device (600) is in a slide-out state (e.g., at least a portion of the slide structure (660) is pulled out from the housing (610)) so as to extend from the first portion (630a) while being supported by at least a portion of the bendable member. Accordingly, the electronic device (600) may include a rollable type or slidable type electronic device in which the display area of ​​the flexible display (630) changes according to the movement of the slide structure (660) from the housing (610).

[0124] According to various embodiments, the slide structure (660) may be movably coupled to slide in or out at least partially from the housing (610). For example, the flexible display (630) may be configured to have a display area corresponding to a first width (W1) from the second side (642) to the fourth side (644) in the retracted state. In one embodiment, the flexible display (630) may be deformed to have a display area corresponding to a third width (W3) larger than the first width (W1) by moving at least a portion of the bendable member retracted into the interior of the housing (610) outwardly of the electronic device to additionally have a second width (W2) in the retracted state of the slide structure (660). Accordingly, the flexible display (630) may have a display area that varies in accordance with the width of the electronic device that varies according to the sliding motion of the slide structure (660).

[0125] According to various embodiments, the electronic device (600) may include at least one of an input module (603), an audio output module (606, 607), a sensor module (604, 617), a camera module (605, 616), a connector port (608), a key input module (not shown), or an indicator (not shown). In other embodiments, the electronic device (600) may omit at least one of the above-described components or may additionally include other components.

[0126] In various embodiments, the input module (603) may include a microphone. In some embodiments, the input module (603) may include multiple microphones arranged to detect the direction of sound. The audio output module (606, 607) may include speakers. The audio output module (606, 607) may include an external speaker (606) and a call receiver (607). In other embodiments, the audio output module (606, 607) may include a speaker (e.g., a piezo speaker) that operates without a separate speaker hole.

[0127] According to various embodiments, the sensor modules (604, 617) may generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device (600) or the external environmental state. The sensor modules (604, 617) may include, for example, a first sensor module (604) (e.g., a proximity sensor or an illuminance sensor) disposed on the front (610a) of the electronic device (600) and / or a second sensor module (617) (e.g., an HRM sensor) disposed on the rear (610b) of the electronic device (600). In one embodiment, the first sensor module (604) may be disposed on the front (610a) of the electronic device (600), below the flexible display (630). In one embodiment, the first sensor module (604) may further include at least one of a proximity sensor, an ambient light sensor, a time of flight (TOF) sensor, an ultrasonic sensor, a fingerprint recognition sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, or a humidity sensor.

[0128] According to various embodiments, the camera modules (605, 616) may include a first camera module (605) disposed on the front (610a) of the electronic device (600), and a second camera module (616) disposed on the back (610b). In one embodiment, the electronic device (600) may include a flash (618) positioned near the second camera module (616). In one embodiment, the camera modules (605, 616) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, the first camera module (605) may be disposed under the flexible display (630) and configured to capture an object through a portion of an active area of ​​the flexible display (630). In one embodiment, the flash (618) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (600).

[0129] According to various embodiments, the electronic device (600) may include a first antenna structure (410) disposed in an interior space of the housing (610) in a direction facing the rear surface (610b) (e.g., in the -z-axis direction) and operating as a first antenna (A1), and a second antenna structure (500) disposed spaced apart from the first antenna structure (410) and operating as a second antenna (A2). In one embodiment, the electronic device (600) may include a conductive portion (650) disposed through two spaced-apart segments (651, 652) on at least a portion of the third side (643) and used as a third antenna structure. In one embodiment, the conductive portion (650) may operate as a third antenna (A3). In one embodiment, the first antenna structure (410) may be disposed at least partially between the second antenna structure (500) and the conductive portion (650) when the rear cover (621) is viewed from above. In one embodiment, the first antenna structure (410) and the second antenna structure (500) may be substantially identical to the arrangement structure of the first antenna structure (410) and the second antenna structure (500) of FIGS. 6A to 7B.

[0130] FIG. 12A is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 12B is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0131] Referring to FIGS. 12A and 12B , an electronic device (900) may include a housing (910) that includes a first side (or front side) (910A), a second side (or back side) (910B), and a side surface (910C) that encloses a space between the first side (910A) and the second side (910B). In another embodiment (not shown), the housing (910) may refer to a structure that forms a portion of the first side (910A), the second side (910B), and the side surface (910C) of FIG. 12A . In one embodiment, the first side (910A) may be formed by a front plate (902) that is at least partially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (910B) may be formed by a substantially opaque back plate (911). The rear plate (911) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (910C) may be formed by a side bezel structure (or “side member”) (918) that is coupled to the front plate (902) and the rear plate (911) and comprises a metal and / or polymer. In some embodiments, the rear plate (911) and the side bezel structure (918) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0132] In the illustrated embodiment, the front plate (902) may include a first region (910D) extending seamlessly from the first side (910A) toward the rear plate, at both ends of a long edge of the front plate (902). In the illustrated embodiment (see FIG. 12B), the rear plate (911) may include a second region (910E) extending seamlessly from the second side (910B) toward the front plate (902), at both ends of a long edge. In some embodiments, the front plate (902) or the rear plate (911) may include only one of the first region (910D) or the second region (910E). In some embodiments, the front plate (902) may not include the first region and the second region, but may only include a flat surface that is arranged parallel to the second side (910B). In these embodiments, when viewed from the side of the electronic device (900), the side bezel structure (918) may have a first thickness (or width) on the side that does not include the first region (910D) or the second region (910E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (910D) or the second region (910E).

[0133] According to one embodiment, the electronic device (900) may include at least one of a display (901) (e.g., a first display), an input device (903), an audio output device (907, 914), a sensor module (904, 919), a camera module (905, 912, 913), a key input device (917), an indicator (not shown), and a connector (908, 909). In some embodiments, the electronic device (900) may omit at least one of the components (e.g., the key input device (917) or the indicator) or may additionally include other components.

[0134] The display (901) may be exposed, for example, through a substantial portion of the front plate (902). In some embodiments, at least a portion of the display (901) may be exposed through the front plate (902), which forms the first side (910A) and the first region (910D) of the side surface (910C). For example, the display (901) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic stylus pen. In some embodiments, at least a portion of the sensor modules (904, 919), and / or at least a portion of the key input device (917), may be disposed in the first region (910D), and / or the second region (910E).

[0135] In one embodiment, the input device (903) may include a microphone. In some embodiments, the input device (903) may include multiple microphones arranged to detect the direction of sound. The audio output device (907, 914) may include speakers. The audio output device (907, 914) may include an external speaker (907) and a call receiver (914). In some embodiments, the input device (903), the audio output device (907, 914), and the connectors (908, 909) may be arranged in the space of the electronic device (900) and may be exposed to the external environment through at least one hole formed in the housing (910). In some embodiments, the hole formed in the housing (910) may be used jointly for the input device (903) and the audio output device (907, 914). In some embodiments, the audio output device (907, 914) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (910).

[0136] According to one embodiment, the sensor modules (904, 919) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (900) or an external environmental state. The sensor modules (904, 919) may include, for example, a first sensor module (904) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (910A) of the housing (910), and / or a third sensor module (919) (e.g., an HRM sensor) disposed on a second surface (910B) of the housing (910). The fingerprint sensor may be disposed on the first surface (910A) of the housing (910). The fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (901) on the first surface (910A). The electronic device (900) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (904).

[0137] In one embodiment, the camera modules (905, 912, 913) may include a first camera module (905) disposed on a first side (910A) of the electronic device (900), and / or a second camera module (912) disposed on a second side (910B), and / or a flash (913). The camera modules (905, 912) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (913) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle and a telephoto lens) and image sensors may be disposed on one side of the electronic device (900).

[0138] In one embodiment, the key input device (917) may be positioned on a side surface (910C) of the housing (910). In another embodiment, the electronic device (900) may not include some or all of the key input devices (917), and the key input devices (917) that are not included may be implemented in another form, such as soft keys, on the display (901). In another embodiment, the key input device (917) may be implemented using a pressure sensor included in the display (901).

[0139] The indicator may be disposed, for example, on the first side (910A) of the housing (910). The indicator may provide, for example, status information of the electronic device (900) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (905). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0140] According to one embodiment, the connector holes (908, 909) may include a first connector hole (908) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (909) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0141] In one embodiment, some of the camera modules (905, 912), some of the sensor modules (904, 919), or indicators may be arranged to be exposed through the display (901). For example, the camera module (905), the sensor module (904), or the indicator may be arranged to be in contact with the external environment through an opening perforated from the internal space of the electronic device (900) to the front plate (902) of the display (901). In another embodiment, some of the sensor modules (904) may be arranged to perform their functions without being visually exposed through the front plate (902) in the internal space of the electronic device. For example, in this case, an area of ​​the display (901) facing the sensor modules may not require a perforated opening.

[0142] According to various embodiments, the electronic device (900) may include a first antenna structure (410) disposed in an interior space of the housing (910) in a direction facing the rear surface (911) (e.g., in the -z-axis direction) and operating as a first antenna (A1), and a second antenna structure (500) disposed spaced apart from the first antenna structure (410) and operating as a second antenna (A2). In one embodiment, the electronic device (600) may include a conductive portion (950) disposed through two spaced-apart segments (951, 952) on at least a portion of a side surface (910C) and used as a third antenna structure. In one embodiment, the conductive portion (950) may operate as a third antenna (A3). In one embodiment, the first antenna structure (410) may be disposed at least partially between the second antenna structure (500) and the conductive portion (950) when the rear cover (911) is viewed from above. In one embodiment, the first antenna structure (410) and the second antenna structure (500) may be substantially identical to the arrangement structure of the first antenna structure (410) and the second antenna structure (500) of FIGS. 6A to 7B.

[0143] The arrangement structure of antenna structures (e.g., the first antenna structure (410), the second antenna structure (500), and the conductive portion (320) of FIGS. 6A to 7B) according to exemplary embodiments of the present disclosure may also be applied to tablet PCs, notebook PCs, or other electronic devices having wireless communication functions.

[0144] According to various embodiments, an electronic device includes a housing (e.g., a first housing (210) of FIG. 4a), a dielectric structure (e.g., a dielectric structure (263) of FIG. 5c) disposed in an internal space of the housing (e.g., a first space (2101) of FIG. 4b) and including a first surface (e.g., a first surface (2631) of FIG. 5c) and a second surface (e.g., a second surface (2632) of FIG. 5c) facing in an opposite direction to the first surface, a first antenna structure (e.g., a first antenna structure (410) of FIG. 5c) disposed in the dielectric structure, a second antenna structure (e.g., a second antenna structure (500) of FIG. 5c) disposed on the first surface and spaced apart from at least a portion of the first antenna structure and including a conductive layer (e.g., a conductive layer (G) of FIG. 5b), and the first antenna structure and / or At least one wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) configured to transmit or receive a signal in at least one frequency band through the second antenna structure may be included, and the first antenna structure may include, on the first surface, a first conductive pattern (e.g., first conductive pattern (411) of FIG. 5c) spaced apart from the second antenna structure, and a second conductive pattern (e.g., second conductive pattern (412) of FIG. 5c) electrically connected to the first conductive pattern and disposed on the second surface so as to at least partially overlap the conductive layer when the first surface is viewed from above.

[0145] According to various embodiments, the first antenna structure may be configured to have an operating frequency band determined based on an overlapping area of ​​the second conductive pattern and the conductive layer.

[0146] According to various embodiments, the internal space includes a printed circuit board (e.g., the first substrate (271) of FIG. 7A) disposed at a position corresponding to the second surface of the dielectric structure and including the at least one wireless communication circuit, the printed circuit board includes a feed portion (e.g., the feed portion (FP) of FIG. 7A) electrically connected to the at least one wireless communication circuit, and at least a portion of the second conductive pattern can be electrically connected to the at least one wireless communication circuit through the feed portion.

[0147] According to various embodiments, the power supply unit may be positioned at a position that does not overlap the conductive layer when the first surface is viewed from above.

[0148] According to various embodiments, the power supply unit may be electrically connected to the second conductive pattern via an electrical connection member (e.g., the electrical connection member (EF) of FIG. 7a).

[0149] According to various embodiments, the electrical connecting member may comprise at least one of a C-clip or a conductive tape.

[0150] According to various embodiments, the housing may include a conductive portion (e.g., conductive portion (320) of FIG. 6B) forming at least a portion of a side surface of the electronic device, wherein the conductive portion may be configured to operate as a third antenna structure by being electrically connected to the at least one wireless communication circuit.

[0151] According to various embodiments, the first antenna structure may be disposed at least partially between the second antenna structure and the conductive portion when the first side is viewed from above.

[0152] According to various embodiments, the dielectric structure is formed of a polymer material, the first antenna structure includes a laser direct structuring (LDS) pattern formed on the first surface and the second surface of the dielectric structure, and the at least one wireless communication circuit can be configured to operate in a first frequency band via the LDS pattern.

[0153] According to various embodiments, the second antenna structure includes a dielectric substrate (e.g., the dielectric substrate (590) of FIG. 7B) including a first substrate surface (e.g., the first substrate surface (5901) of FIG. 7B), a second substrate surface (e.g., the second substrate surface (5902) of FIG. 7B) positioned closer to the first substrate surface than the first substrate surface, and the conductive layer disposed in a space between the first substrate surface and the second substrate surface, and a plurality of conductive patches (e.g., the conductive patches (510, 520, 530, 540) of FIG. 5B) disposed between the conductive layer and the first substrate surface in the dielectric substrate, wherein the at least one wireless communication circuit can be configured to operate in a second frequency band different from the first frequency band via the plurality of conductive patches.

[0154] According to various embodiments, the dielectric substrate may include a flexible printed circuit board (FPCB) attached to the first surface of the dielectric structure.

[0155] According to various embodiments, the housing includes a first housing (e.g., the first housing (210) of FIG. 4a) and a second housing (e.g., the second housing (220) of FIG. 4a) foldably coupled to the first housing via a hinge device, and includes a flexible display (e.g., the flexible display (230) of FIG. 4a) arranged to be supported by at least a portion of the first housing and at least a portion of the second housing, and the dielectric structure can be arranged in an internal space of the first housing.

[0156] According to various embodiments, the first housing includes a rear cover (e.g., the first rear cover (240) of FIG. 4A) arranged in an opposite direction to the flexible display, and the dielectric structure may be arranged such that the first surface faces the rear cover.

[0157] According to various embodiments, the housing (e.g., housing (910) of FIG. 12a) includes a front cover (e.g., front cover (902) of FIG. 12a), a rear cover (e.g., rear cover (911) of FIG. 12b) facing in an opposite direction to the front cover, and a side member (e.g., side member (918) of FIG. 12a) arranged to surround the internal space between the front cover and the rear cover, and the dielectric structure may be arranged such that the first surface faces the rear cover in the internal space.

[0158] According to various embodiments, the internal space may include a display (e.g., display (901) of FIG. 12A) arranged to be visible from the outside of the electronic device through at least a portion of the front cover.

[0159] According to various embodiments, an electronic device includes a first housing (e.g., a first housing (210) of FIG. 4a), a second housing (e.g., a second housing (220) of FIG. 4a) foldably connected to the first housing through a hinge device (e.g., at least one hinge module of FIG. 4a), a dielectric structure (e.g., a dielectric structure (263) of FIG. 5c) disposed in an internal space of the first housing (e.g., a first space (2101) of FIG. 4b) and including a first surface (e.g., a first surface (2631) of FIG. 5c) and a second surface (e.g., a second surface (2632) of FIG. 5c) facing in an opposite direction to the first surface, a first antenna structure (e.g., a first antenna structure (410) of FIG. 5c) disposed in the dielectric structure, and a first antenna structure disposed in the first surface. A second antenna structure (e.g., the second antenna structure (500) of FIG. 5c) including a conductive layer (e.g., the conductive layer (G) of FIG. 5b) disposed at least partially apart from the first housing, and a third antenna structure including a conductive portion (e.g., the conductive portion (320) of FIG. 6b) disposed on a portion of a side surface of the first housing, and at least one wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) configured to transmit or receive a signal in at least one frequency band through the first antenna structure, the second antenna structure and / or the third antenna structure, wherein the first antenna structure comprises a first conductive pattern (e.g., the first conductive pattern (411) of FIG. 5c) disposed at least partially apart from the second antenna structure and the first conductive pattern, and when the first surface is viewed from above, the conductive layer and It may include a second conductive pattern (e.g., the second conductive pattern (412) of FIG. 5c) arranged on the second surface so as to overlap.

[0160] According to various embodiments, the first antenna structure may be disposed at least partially between the second antenna structure and the third antenna structure when the first side is viewed from above.

[0161] According to various embodiments, the flexible display may further include a flexible display (e.g., the flexible display (230) of FIG. 4A) arranged to be supported by at least a portion of the first housing and at least a portion of the second housing.

[0162] According to various embodiments, the first housing includes a rear cover (e.g., rear cover (240) of FIG. 4A) arranged in an opposite direction to the flexible display, and the dielectric structure may be arranged in the internal space such that the first surface faces the rear cover.

[0163] According to various embodiments, the second antenna structure includes a dielectric substrate (e.g., the dielectric substrate (590) of FIG. 5c) including a first substrate surface (e.g., the first substrate surface (5901) of FIG. 5c), a second substrate surface (e.g., the second substrate surface (5902) of FIG. 5c) positioned closer to the first substrate surface than the first substrate surface, and the conductive layer (e.g., the conductive layer (G) of FIG. 5b) disposed in a space between the first substrate surface and the second substrate surface, and a plurality of conductive patches (e.g., the conductive patches (510, 520, 530, 540) of FIG. 5c) disposed between the conductive layer and the first substrate surface in the dielectric substrate, wherein the at least one wireless communication circuit can be configured to transmit or receive the signal through the plurality of conductive patches.

[0164] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, Housing (210); A dielectric structure (263) disposed in the housing and including a first surface (2631) and a second surface (2632) facing in the opposite direction to the first surface; A first antenna structure (410) arranged in the above genetic structure; In the first surface, a second antenna structure (500) spaced apart from at least a portion of the first antenna structure and including a conductive layer (G); and At least one wireless communication circuit (192) configured to transmit or receive a signal through the first antenna structure and / or the second antenna structure, The above first antenna structure is, On the first surface, a first conductive pattern (411) spaced apart from the second antenna structure; and An electronic device comprising a second conductive pattern (412) electrically connected to the first conductive pattern and arranged on the second surface so as to at least partially overlap the conductive layer when the first surface is viewed from above.

2. In paragraph 1, An electronic device in which the first antenna structure is set to have an operating frequency band determined based on an overlapping area of ​​the second conductive pattern and the conductive layer.

3. In paragraph 1 or 2, In the above internal space, a printed circuit board (271) is disposed at a position corresponding to the second surface of the genetic structure and includes at least one wireless communication circuit, The printed circuit board includes a power supply (FP) electrically connected to the at least one wireless communication circuit, An electronic device in which at least a portion of the second challenge pattern is electrically connected to the at least one wireless communication circuit through the power supply.

4. In paragraph 3, The above-mentioned power supply unit is an electronic device arranged at a position that does not overlap the above-mentioned conductive layer when the above-mentioned first surface is viewed from above.

5. In paragraph 3 or 4, The above-mentioned power supply unit is an electronic device electrically connected to the second conductive pattern through an electrical connecting member (EF).

6. In paragraph 5, An electronic device wherein said electrical connecting member comprises at least one of a C-clip or a conductive tape.

7. In any one of paragraphs 1 to 6, The housing comprises a conductive portion (320) forming at least a portion of a side surface of the electronic device; An electronic device wherein the conductive portion is configured to operate as a third antenna structure by being electrically connected to at least one wireless communication circuit.

8. In paragraph 7, An electronic device wherein the first antenna structure is at least partially disposed between the second antenna structure and the conductive portion when the first side is viewed from above.

9. In any one of paragraphs 1 to 8, The above genetic structure is formed of a polymer material, The first antenna structure includes an LDS (laser direct structuring) pattern formed on the first surface and the second surface of the dielectric structure, An electronic device wherein said at least one wireless communication circuit is configured to operate in a first frequency band via said LDS pattern.

10. In any one of paragraphs 1 to 9, The above second antenna structure is, A dielectric substrate (590) including a first substrate surface (5901), a second substrate surface (5902) positioned closer to the first surface than the first substrate surface, and the conductive layer disposed in the space between the first substrate surface and the second substrate surface; and In the above dielectric substrate, a plurality of conductive patches (510, 520, 530, 540) are disposed between the conductive layer and the first substrate surface, An electronic device wherein said at least one wireless communication circuit is configured to operate in a second frequency band different from said first frequency band via said plurality of conductive patches.

11. In paragraph 10, An electronic device including a flexible printed circuit board (FPCB) attached to the first surface of the dielectric structure, wherein the dielectric substrate is 12. In any one of paragraphs 1 to 11, The above housing, First housing (210); and A second housing (220) is foldably connected to the first housing through a hinge device (400, 400-1, 400-2), A flexible display (230) is included, which is arranged to be supported by at least a portion of the first housing and at least a portion of the second housing. The above genetic structure is an electronic device arranged in the internal space of the first housing.

13. In paragraph 12, The above first housing includes a rear cover (240) arranged in an opposite direction to the flexible display, An electronic device wherein the above genetic structure is arranged such that the first surface faces the rear cover.

14. In any one of paragraphs 1 to 11, The above housing (910) is, Front cover (902); A rear cover (911) facing in the opposite direction to the front cover; and Including a side member (918) arranged to surround the space between the front cover and the rear cover, An electronic device in which the above-mentioned genetic structure is arranged so that the first surface faces the rear cover in the above-mentioned space.

15. In paragraph 14, An electronic device including a display (901) positioned so as to be visible from the outside of the electronic device through at least a portion of the front cover in the above space.

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