Ink-repellent compound and photosensitive composition containing same

Abstract

The provided photosensitive composition containing an ink-repellent compound so as to have a low surface tension, according to the present invention, can control defects such as coffee-rings during the manufacture of a light-emitting device and a color filter through a solution process, and thus has a reduced minimum size of patterns on a substrate, has an excellent pattern resolution, leaves no residue and has a higher contact angle.

Description

Ink-repellent compound and photosensitive composition containing the same

[0001] The present invention relates to an ink-repellent compound and a photosensitive composition comprising the same.

[0002] In the manufacture of optical devices such as organic EL (Electro-Luminescence) devices, quantum dot displays, TFT (Thin Film Transistor) arrays, and thin film solar cells, the inkjet (IJ) method, which forms organic layers such as light-emitting layers into dots using an inkjet head, has been used as one of the methods for implementing patterns.

[0003] The inkjet method has the advantage of reducing material costs because it uses only the necessary amount of material for the necessary area, and in particular, it has the advantage of being able to form color filters, light-emitting layers, etc. of organic EL (Electro-Luminescence) devices or quantum dot displays by turning quantum dot materials, which are difficult to deposit, into ink.

[0004] This inkjet method is a method of forming dots in a desired pattern by injecting ink containing quantum dot material or organic layer material into a compartment surrounded by a partition wall and drying and / or heating the ink.

[0005] When printing a pattern using an inkjet method, the partitions formed along the outline of the dot need to have ink repellency to prevent mixing of ink between adjacent dots and to ensure uniform application of ink when forming dots.

[0006] To this end, a process for forming partition walls corresponding to the dot pattern by photolithography using a photosensitive composition exhibiting ink repellency is being developed, and there is a need for the development of a photosensitive composition with excellent ink repellency, developability, and good adhesion.

[0007] One embodiment of the present invention provides a photosensitive resin composition capable of controlling defects such as the coffee-ring phenomenon when manufacturing a light-emitting element and a color filter using a solution process by providing an ink-repellent compound and a photosensitive composition having low surface tension including the same.

[0008] Another embodiment provides a photosensitive composition comprising the ink-repellent compound, a pattern or film formed of the photosensitive composition, and an organic light-emitting display device comprising the pattern or film.

[0009] Another embodiment is to provide an electronic device including the organic light-emitting display device.

[0010] The ink-repellent compound according to the present invention is preferably represented by the following chemical formula 1.

[0011] [Chemical Formula 1]

[0012]

[0013] In the above chemical formula 1,

[0014] 1) Z is C1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 C2~C containing at least one heteroatom among arylene group, O, N, S, Si and P 30 Heterocyclic group of; C1~C 30 Selected from the group consisting of alkoxylene groups or combinations thereof,

[0015] 2) X 1 is -O-; -S-; -NHCOO-; -O-SiR'R''-; or -NR'''-,

[0016] 3) R', R'' and R''' are independently hydrogen; deuterium; C1~C 30 Alkyl group or C6~C 30 is an aryl group,

[0017] 4) R 1 and R2 is hydrogen; deuterium; C1~C 30 alkyl group; or C6~C 30 is an aryl group,

[0018] 5) L 1 and L 2 are independently of each other, single bond, C1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 Arylene group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C1~C 30 Alkyl group of; C1~C 30- selected from the group consisting of an alkoxy group; an amide group; a urethane group; or a combination thereof,

[0019] L 3 and L 4 are independently of each other single bonds; C-1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 is selected from the group consisting of an arylene group; an amide group; a urethane group; or a combination thereof,

[0020] 6) n1 is an integer from 0 to 10,

[0021] 7) n2 is an integer from 1 to 3,

[0022] 8) n3 and n4 are independent integers from 0 to 15; however, the sum of n3 and n4 is from 1 to 15.

[0023] 9) Y is hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 An aryl group of formula 2; or a combination thereof; provided that X 1 If this is -O-SiR'R''-, Y is hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 is selected from the group consisting of aryl groups or combinations thereof,

[0024] [Chemical Formula 2]

[0025]

[0026] In the above chemical formula 2,

[0027] 10) X 2 is -CF3; C1~C 30 Alkyl group of; C3~C 30 Cycloalkyl group of; or C6~C 30 is an aryl group,

[0028] 11) n5 and n6 are integers from 0 to 15, but the sum of n5 and n6 is from 1 to 15.

[0029] 12) The above Z, R', R'', R''', R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y are independently deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30and combinations thereof, and adjacent substituents may form a ring.

[0030] The ink-repellent compound represented by the chemical formula 1 according to the present invention is more preferably represented by the chemical formula 1-1 or the chemical formula 1-2.

[0031] [Chemical Formula 1-1]

[0032]

[0033] [Chemical Formula 1-2]

[0034]

[0035] In the above chemical formulas 1-1 and 1-2,

[0036] 1) R 3 Silver hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 aryl group; or a combination thereof,

[0037] 2) Z, R', R'', R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y are the same as defined in the above chemical formula 1,

[0038] 3) In the above chemical formulas 1-1 and 1-2, each of Z, R', R'', and R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y are equal or different,

[0039] 4) The above Z, R', R'', R 1 Inland R 3 , L 1 Inland L 4 , X 2 and Y are independently deuterium; halogen; C1~C30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0040] As another specific example of the present invention, it is preferable that the photosensitive composition according to the present invention comprises (A) an ink-repellent compound represented by the above chemical formula 1; (B) an alkali-soluble resin; (C) a reactive unsaturated compound; (D) a photoinitiator; and (E) a solvent.

[0041] It is preferable that the above ink-repellent compound is included in an amount of 1 to 10 wt% based on the total amount of the photosensitive composition.

[0042] It is preferable that the above alkaline-soluble resin includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0043] It is more preferable that the above alkaline soluble resin includes a resin including a repeating unit of the following [chemical formula 3].

[0044] [Chemical Formula 3]

[0045]

[0046] 1) * indicates the part where the combination is connected as a repeating unit,

[0047] 2) n represents the number of repeating units from 2 to 200,000,

[0048] 3) R 21 and R 22 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0049] 4) R 21 and R 22 Each adjacent tile can form a ring,

[0050] 5) I and j are integers from 0 to 4, independently of each other.

[0051] 6) X 21 is a single bond, O, CO, SO2, CR'R”, SiR'R”, [chemical formula 4] or [chemical formula 5],

[0052] 7) X 22 is C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0053] 8) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0054] 9) R' and R" can each form adjacent tile rings,

[0055] 10) A 21 and A 22 are independently [chemical formula 6] or [chemical formula 7],

[0056] 11) The ratio of [chemical formula 6] and [chemical formula 7] in the polymer chain of the resin containing the repeating unit represented by [chemical formula 3] satisfies 1:9 to 9:1,

[0057] [Chemical Formula 4]

[0058]

[0059] [Chemical Formula 5]

[0060]

[0061] In the above [chemical formula 4] and [chemical formula 5],

[0062] 12-1) * indicates the binding position,

[0063] 12-2) X23 is O, S, SO2 or NR',

[0064] 12-3) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0065] 12-4) R 23 ~R 26 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0066] 12-5) R 23 ~R 26 Each adjacent tile can form a ring,

[0067] 12-6) k~n are integers from 0 to 4, independently of each other.

[0068] [Chemical Formula 6]

[0069]

[0070] [Chemical Formula 7]

[0071]

[0072] In the above [chemical formula 6] and [chemical formula 7],

[0073] 13-1) * indicates the binding position,

[0074] 13-2) R 27 ~R 30 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0075] 13-3) Y 21 and Y 22 are independently of each other [chemical formula 8],

[0076] [Chemical Formula 8]

[0077]

[0078] In the above [chemical formula 8],

[0079] 14-1) * indicates the binding position,

[0080] 14-2) R 31 is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0081] 14-3) L 21 is a single bond, C1~C 30 alkylene, C6~C 30 Arylene or C2~C 30 is a heterocycle,

[0082] 15) The above R 21 ~R 31 , R', R", X 21 ~X 23 and L 21 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30and combinations thereof, and adjacent substituents may form a ring.

[0083] It is preferable that the weight average molecular weight of the above alkali-soluble resin is 1,000 to 100,000 g / mol.

[0084] It is preferable that the alkali-soluble resin is included in an amount of 1 to 50 wt% based on the total amount of the photosensitive composition.

[0085] It is preferable that the above reactive unsaturated compound is included in an amount of 1 to 40 wt% based on the total amount of the photosensitive composition.

[0086] It is preferable that the above reactive unsaturated compound includes a compound represented by the following [chemical formula 9].

[0087] [Chemical Formula 9]

[0088]

[0089] In the above [chemical formula 9], two or more of Z1 to Z4 independently have the structure of the following [chemical formula 10]; the remaining Z1 to Z4 independently represent hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6 to C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0090] [Chemical Formula 10]

[0091]

[0092] In the above [chemical formula 10],

[0093] 1) t is an integer from 1 to 20,

[0094] 2) L4 is a single bond, C1~C 30 Substituted or unsubstituted alkylene; C6~C 30 substituted or unsubstituted arylene; or C2~C 30 is a substituted or unsubstituted heterocycle,

[0095] 3) Y3 is [Chemical Formula 11] or [Chemical Formula 12] below,

[0096] [Chemical Formula 11]

[0097]

[0098] [Chemical Formula 12]

[0099]

[0100] In the above [chemical formula 11], R 14 Silver hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group.

[0101] It is preferable that the photoinitiator is included in an amount of 0.01 to 10 wt% based on the total amount of the photosensitive composition.

[0102] It is preferable that the above photoinitiator includes a compound represented by the following [chemical formula 13].

[0103] [Chemical Formula 13]

[0104]

[0105] In the above [chemical formula 13],

[0106] 1) u1~u3 are integers of 0 or 1 independently,

[0107] 2) L5 and L8 are [chemical formula 14] below,

[0108] 3) L6, L7 and L9 are independently C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C3~C 30 Aliphatic ring C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; C1~C 20 Alkoxycarbonyl of; C1~C 30 alkylene; C6~C 30 arylene; [Formula 15]; [Formula 16]; [Formula 17]; or [Formula 18]; or a combination thereof,

[0109] [Chemical Formula 14]

[0110]

[0111] In the above [chemical formula 14], R 15 Silver hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0112] [Chemical Formula 15]

[0113]

[0114] [Chemical Formula 16]

[0115]

[0116] [Chemical Formula 17]

[0117]

[0118] [Chemical Formula 18]

[0119]

[0120] [Chemical Formula 19]

[0121]

[0122] In the above [chemical formula 17] to [chemical formula 19],

[0123] 1) A is hydrogen; O; S; silane group; siloxane group; boron group; germanium group; cyano group; nitro group; nitrile group; C1~C 30 Alkyl group of C6~C 30 Aryl group or C2~C 30 An amino group substituted or unsubstituted with a heterocyclic group; C1~C 30 Alkylthio group of; C1~C 30 Alkyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 arylalkenyl group; or a combination thereof,

[0124] 2) T is S, O or Se.

[0125] 3) R 16 ~R 19 are independently hydrogen; deuterium; halogen; or, independently substituted or unsubstituted, C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group.

[0126] It is preferable that the above photosensitive composition further contains a coloring agent.

[0127] It is preferable that the above coloring agent includes at least one of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment.

[0128] It is preferable that the above colorant is included in an amount of 1 to 40 wt% based on the total amount of the photosensitive composition.

[0129] It is preferable that the above colorant be pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0130] It is preferable that the average particle diameter of the above colorant is 20 nm to 110 nm.

[0131] As another specific example, the present invention provides a pattern or film formed from the photosensitive resin composition.

[0132] As another specific example, the present invention provides an organic light-emitting display device including the pattern or film.

[0133] It is preferable that the above organic light-emitting display device includes at least one of a flat layer, an organic light-emitting element layer, a sealing layer, a touch panel, and a color filter including the pattern or film.

[0134] As another specific example, the present invention provides an electronic device including the display device and a control unit for driving the display device.

[0135] By providing a photosensitive composition having a low surface tension including an ink-repellent compound according to the present invention, it is possible to control defects such as the coffee-ring phenomenon when manufacturing a light-emitting element and a color filter using a solution process, thereby reducing the minimum pattern size on a substrate, providing excellent pattern resolution, eliminating residue, and providing a higher contact angle.

[0136] The ink-repellent compound according to the present invention is preferably represented by the following chemical formula 1.

[0137] [Chemical Formula 1]

[0138]

[0139] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. When assigning reference numerals to components in each drawing, identical components may be assigned the same numerals, as much as possible, even if they are shown in different drawings.

[0140] When describing the present invention, detailed descriptions of related known components or functions may be omitted if they are deemed to obscure the gist of the present invention. When "includes," "has," and "consists of" are used in this specification, other parts may be added, unless "only" is used. When a component is expressed in the singular, it may also include plurals, unless otherwise explicitly stated.

[0141] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of the present invention. These terms are only intended to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0142] In a description of the positional relationship of components, when it is described that two or more components are "connected," "combined," or "connected," it should be understood that the two or more components may be directly "connected," "combined," or "connected," but that the two or more components may also be further "interposed" with another component to be "connected," "combined," or "connected." Here, the other component may be included in one or more of the two or more components that are "connected," "combined," or "connected" to each other.

[0143] Furthermore, when a component such as a layer, membrane, region, or plate is said to be "on" or "over" another component, it should be understood that this includes not only the case where it is "directly on" the other component, but also the case where there are other components in between. Conversely, when a component is said to be "directly on" another part, it should be understood that there are no other components in between.

[0144] In the description of the temporal flow relationship related to components, operation methods, or manufacturing methods, for example, when the temporal or flow relationship is described as “after”, “following”, “next to”, “before”, etc., it may also include cases where it is not continuous, unless “immediately” or “directly” is used.

[0145] Meanwhile, when numerical values ​​or corresponding information for components are mentioned, even without separate explicit description, the numerical values ​​or corresponding information may be interpreted as including an error range that may occur due to various factors (e.g., process factors, internal or external impact, noise, etc.).

[0146] The terms used in this specification and the appended claims have the following meanings, unless otherwise stated, without departing from the spirit of the present invention.

[0147] The term “halo” or “halogen” as used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I) unless otherwise stated.

[0148] The term "alkyl" or "alkyl group" as used in this application, unless otherwise stated, means a radical of a saturated aliphatic functional group having 1 to 60 carbon atoms connected by a single bond, including a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

[0149] The term “haloalkyl group” or “halogenalkyl group” as used in this application means an alkyl group substituted with a halogen, unless otherwise stated.

[0150] The term "alkenyl" or "alkynyl" as used in this application, unless otherwise stated, refers to a group having a double bond or a triple bond, including a straight or branched chain group, and having 2 to 60 carbon atoms, but is not limited thereto.

[0151] The term "cycloalkyl" as used in this application, unless otherwise stated, means, but is not limited to, an alkyl group forming a ring having 3 to 60 carbon atoms.

[0152] The term “alkoxy group” or “alkyloxy group” used in this application means an alkyl group to which an oxygen radical is bonded, and unless otherwise stated, has 1 to 60 carbon atoms, but is not limited thereto.

[0153] The term “alkenoxyl group,” “alkenoxy group,” “alkenyloxy group,” or “alkenyloxy group” as used in this application means an alkenyl group having an oxygen radical attached thereto, and unless otherwise stated, has from 2 to 60 carbon atoms, but is not limited thereto.

[0154] The terms "aryl group" and "arylene group" used in this application, unless otherwise stated, each have 6 to 60 carbon atoms, but are not limited thereto. The aryl group or arylene group in this application includes a single ring, a ring aggregate, a fused multiple ring compound, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, a substituted fluorenyl group, and the arylene group may include a fluorenylene group, a substituted fluorenylene group.

[0155] The term "ring assemblies" as used herein means two or more ring systems (single ring or fused ring systems) directly connected to each other via single or double bonds, wherein the number of such direct links between rings is one less than the total number of ring systems in the compound. Ring assemblies may be formed by the same or different ring systems being directly connected to each other via single or double bonds.

[0156] In the present application, since the aryl group includes a ring aggregate, the aryl group includes biphenyl and terphenyl in which a single aromatic ring, a benzene ring, is connected by a single bond. In addition, the aryl group also includes a compound in which an aromatic single ring and an aromatic ring system fused together are connected by a single bond, and thus, for example, the aryl group also includes a compound in which an aromatic single ring, a benzene ring, and an aromatic ring system fused together, a fluorene ring, are connected by a single bond.

[0157] The term "fused multiple ring system" as used in this application means a fused ring structure sharing at least two atoms, and includes a structure in which two or more hydrocarbon ring systems are fused, and a structure in which at least one heterocyclic system containing at least one heteroatom is fused, etc. Such fused multiple ring systems may be aromatic rings, heteroaromatic rings, aliphatic rings, or a combination of these rings. For example, in the case of an aryl group, it may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0158] The term "spiro compound" used in this application has a "spiro union," which means a connection formed by two rings sharing only one atom. In this case, the atom shared between the two rings is called a "spiro atom," and depending on the number of spiro atoms contained in a compound, these are called "monospiro-," "dicepiro-," and "trispiro-" compounds, respectively.

[0159] As used herein, the terms "fluorenyl group", "fluorenylene group", and "fluorenetriyl group" mean, unless otherwise stated, a monovalent, divalent, or trivalent functional group in which R, R', R", and R'" in the following structures are all hydrogen, and a "substituted fluorenyl group", a "substituted fluorenylene group", or a "substituted fluorenetriyl group" means that at least one of the substituents R, R', R", and R'" is a substituent other than hydrogen, and includes a case where R and R' are bonded to each other to form a spiro compound together with the carbon to which they are bonded. In the present specification, regardless of the valence such as monovalent, divalent, or trivalent, a fluorenyl group, a fluorenylene group, and a fluorenetriyl group may all be referred to as a fluorene group.

[0160]

[0161] In addition, the R, R', R" and R'" can each independently be an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms, for example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclic group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be a monovalent functional group or a divalent functional group of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0162] The term "heterocyclic group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group" but also non-aromatic rings, and unless otherwise stated means a ring having 2 to 60 carbon atoms each containing one or more heteroatoms, but is not limited thereto. The term "heteroatom" used in this application represents N, O, S, P or Si unless otherwise stated, and the heterocyclic group means a monocyclic ring, ring aggregate, fused multiple ring system, spiro compound, etc. containing a heteroatom.

[0163] For example, “heterocyclic group” may also include compounds that contain heteroatom groups such as SO2, P=O, etc. instead of ring-forming carbon, such as the compounds below.

[0164]

[0165] The term "ring" as used in this application includes monocyclic and polycyclic rings, and includes hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom, and includes aromatic and non-aromatic rings.

[0166] The term "polycyclic" as used in this application includes ring assemblies such as biphenyls, terphenyls, etc., fused multiple ring systems and spiro compounds, including aromatic as well as non-aromatic, and including hydrocarbon rings as well as heterocycles containing at least one heteroatom.

[0167] The term "aliphatic ring" used in this application refers to a cyclic hydrocarbon other than an aromatic hydrocarbon, and includes a single ring, a ring aggregate, a fused multiple ring system, a spiro compound, etc., and unless otherwise specified, refers to a ring having 3 to 60 carbon atoms, but is not limited thereto. For example, even if an aromatic ring, benzene, and a non-aromatic ring, cyclohexane, are fused, it is considered an aliphatic ring.

[0168] Also, when prefixes are named consecutively, it means that the substituents are listed in the order they were first written. For example, in the case of an arylalkoxy group, it means an alkoxy group substituted with an aryl group, in the case of an alkoxycarbonyl group, it means a carbonyl group substituted with an alkoxy group, and in the case of an arylcarbonylalkenyl group, it means an alkenyl group substituted with an arylcarbonyl group, where the arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0169] Also, unless explicitly stated otherwise, the term "substituted" in the term "substituted or unsubstituted" used in this application means deuterium, halogen, amino group, nitrile group, nitro group, C1~C 30 Alkyl group of C1~C 30 Alkoxy group, C1~C 30 Alkylamine group of C1~C 30 Alkylthiophene group, C6~C 30 Arylthiophene group, C2~C 30 Alkenyl group, C2~C 30 Alkyne group, C3~C 30 Cycloalkyl group, C6~C 30 Aryl group of C6~C substituted with deuterium 30 Aryl group of C8~C 30 C2~C containing at least one heteroatom selected from the group consisting of arylalkenyl group, silane group, boron group, germanium group, and O, N, S, Si and P 30 It means that it is substituted with one or more substituents selected from the group consisting of heterocyclic groups, but is not limited to these substituents.

[0170] In this application, the 'functional group name' corresponding to the aryl group, arylene group, heterocyclic group, etc., which are exemplified as examples of each symbol and its substituent, may be described as the 'name of the functional group reflecting the valence', but may also be described as the 'name of the parent compound'. For example, in the case of 'phenanthrene', which is a type of aryl group, the name of the group may be described by distinguishing the valence, such as 'phenanthryl (group)' for the monovalent 'group' and 'phenantrylene (group)' for the divalent group, but the name of the parent compound, 'phenanthrene', may also be described regardless of the valence.

[0171] Similarly, in the case of pyrimidine, regardless of the valence, it can be written as 'pyrimidine', or in the case of monovalent, it can be written as pyrimidinyl (group), in the case of divalent, it can be written as the 'group name' of the corresponding valence, such as pyrimidinylene (group). Accordingly, in the present application, when the type of substituent is written as the name of the parent compound, it can mean an n-valent 'group' formed by the elimination of a hydrogen atom bonded to a carbon atom and / or heteroatom of the parent compound.

[0172] In addition, in this specification, numbers or alphabets indicating positions may be omitted when describing compound names or substituent names. For example, pyrido[4,3-d]pyrimidine may be described as pyridopyrimidine, benzofuro[2,3-d]pyrimidine as benzofuropyrimidine, 9,9-dimethyl-9H-fluorene as dimethylfluorene, etc. Accordingly, both benzo[g]quinoxaline and benzo[f]quinoxaline may be described as benzoquinoxaline.

[0173] Additionally, unless explicitly stated otherwise, the chemical formulas used in this application are applied in the same manner as the substituent definitions by the index definitions of the chemical formulas below.

[0174]

[0175] Here, if a is an integer of 0, the substituent R 1means that it is absent, that is, when a is 0, it means that all the carbons forming the benzene ring are bonded with hydrogen, and in this case, the indication of hydrogen bonded to carbon can be omitted and the chemical formula or compound can be described. In addition, when a is an integer of 1, one substituent R 1 It binds to one of the carbons forming the benzene ring, and when a is an integer of 2 or 3, it can bind as follows, for example, and when a is an integer of 4 to 6, it binds to the carbon of the benzene ring in a similar manner, and when a is an integer of 2 or more, R 1 may be the same or different.

[0176]

[0177] Unless otherwise stated in this application, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused multiple ring, and the single ring and the formed fused multiple ring include a hydrocarbon ring as well as a heterocycle containing at least one heteroatom, and may include aromatic and non-aromatic rings.

[0178] Additionally, unless otherwise stated herein, when indicating a condensed ring, the number in the expression "number-condensed ring" indicates the number of condensed rings. For example, a form in which three rings are condensed together, such as anthracene, phenanthrene, and benzoquinazoline, can be expressed as a 3-condensed ring.

[0179] Meanwhile, the term "bridged bicyclic compound" used in this application, unless otherwise specified, refers to a compound in which two rings share three or more atoms to form a ring. The shared atoms may include carbon or heteroatoms.

[0180] In the present application, the liquid-repellent treatment step may be a step of treating with a gas containing a halogen atom, and additionally containing one or more of an inert gas, a hydrocarbon, oxygen, or carbon dioxide. Liquid-repellent properties are imparted to the film-forming surface through deposition of the gas applied in this step. The deposition of the applied gas may utilize a plasma method, and the inert gas can stabilize the plasma state of the gas, thereby more uniformly imparting liquid-repellent properties to the film-forming surface.

[0181] In the present application, the organic electric element may mean a component(s) between an anode and a cathode, or may mean an organic light-emitting diode including an anode and a cathode and a component(s) positioned therebetween.

[0182] In addition, in some cases, the display device in the present application may mean an organic electroluminescent element, an organic light-emitting diode, and a panel including the same, or may mean an electronic device including a panel and a circuit. Here, for example, the electronic device may include a lighting device, a solar cell, a portable or mobile terminal (e.g., a smart phone, a tablet, a PDA, an electronic dictionary, a PMP, etc.), a navigation terminal, a game machine, various TVs, various computer monitors, etc., and is not limited thereto, and may be any type of device as long as it includes the above-mentioned component(s).

[0183] Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention. The present invention is defined solely by the scope of the claims set forth below.

[0184] A composition comprising a colorant according to one embodiment of the present invention can be used to manufacture a red pattern, a green pattern, a blue pattern, or a black matrix, a pixel definition layer (PDL).

[0185] A black pixel definition layer (PDL) according to one embodiment of the present invention may further include an organic black pigment or black dye as an additional coloring agent other than the coloring agent included in the aforementioned coloring agent. For example, an organic pigment may be used alone, or an organic pigment and a coloring pigment may be mixed and used. In this case, since a coloring pigment with insufficient light-blocking properties is mixed, there is an advantage in that the strength of the film (layer) or the adhesion to the substrate is not reduced even if the amount of the coloring agent is relatively increased. A negative pixel definition layer (PDL) according to one embodiment of the present invention may include a black pigment or black dye as an additional coloring agent instead of the coloring agent included in the aforementioned coloring agent.

[0186] Each component is described in detail below.

[0187] 1. The manufacturing process of the negative pixel definition layer is as follows.

[0188] (1) Application and coating stage

[0189] The photosensitive composition is a low-viscosity liquid sample, and a spin coater or slit coater is used to coat the substrate to a certain thickness after application. The spin coater has the advantage of reducing the thickness as the rotation speed increases, but the flatness deviation in the area is reduced, and a slit coater is preferable to a spin coater for coating a large-area substrate. The solvent remaining after coating causes the surface to be fluid, which has the disadvantage of deteriorating flatness. To overcome this, VCD (vacuum chamber dry) is used to remove some of the solvent, thereby reducing the fluidity on the surface.

[0190] (2) Prebaking stage

[0191] This process involves heating the coated substrate at a specified temperature and time using a hot plate or oven to remove some of the solvent contained in the coating film. If the surface or deep portion of the coating film does not dry, photomask contamination may occur during exposure in the next process, and curing may not occur properly in the exposed area when exposed to UV light. Due to this lack of curing, the pattern is not formed and is removed during the development process.

[0192] (3) Exposure stage

[0193] After the above pre-baking process is completed, this is the process of curing the formed film by irradiating the photomask with an active line (ultraviolet rays) on which a pattern has been formed. The types of lamps that generate the active line include LED lamps and metal (mercury) lamps, and the wavelengths include g-line (436 nm), h-line (405 nm), i-line (365 nm), and deep UV (<260 nm), and they can be used individually or in combination.

[0194] (4) Phenomenon stage

[0195] In the above exposure step, when the active line is irradiated, the exposed part and the non-exposed part are divided by the photomask. In the case of the positive type, the exposed part is dissolved by the developer, and the non-exposed part resists the developer and a pattern remains. In the case of the negative type, the exposed part is hardened and has resistance to the developer, and the non-exposed part is developed. The black pixel definition layer (Black PDL) manufactured with the composition including the coloring agent of the present invention is divided into an exposed part (hardened) and a non-exposed part (developed) in the negative type, and a pattern is formed.

[0196] 2. The composition forming a negative pixel definition layer including a coloring agent is as follows.

[0197] (1) Ink-repellent compound

[0198] The ink-like compound of the present invention has a structure represented by the following chemical formula 1.

[0199] [Chemical Formula 1]

[0200]

[0201] In the above chemical formula 1,

[0202] 1) Z is C1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 C2~C containing at least one heteroatom among arylene group, O, N, S, Si and P 30 Heterocyclic group of; C1~C 30 Selected from the group consisting of alkoxylene groups or combinations thereof,

[0203] 2) X 1 is -O-; -S-; -NHCOO-; -O-SiR'R''-; or -NR'''-,

[0204] 3) R', R'' and R''' are independently hydrogen; deuterium; C1~C 30 Alkyl group or C6~C 30 is an aryl group,

[0205] 4) R 1 and R 2 is hydrogen; deuterium; C1~C 30 alkyl group; or C6~C 30 is an aryl group,

[0206] 5) L 1 and L 2 are independently of each other, single bond, C1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 Arylene group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C1~C 30 Alkyl group of; C1~C 30- selected from the group consisting of an alkoxy group; an amide group; a urethane group; or a combination thereof,

[0207] L 3 and L 4 are independently of each other single bonds; C-1~C30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 is selected from the group consisting of an arylene group; an amide group; a urethane group; or a combination thereof,

[0208] 6) n1 is an integer from 0 to 10,

[0209] 7) n2 is an integer from 1 to 3,

[0210] 8) n3 and n4 are independent integers from 0 to 15; however, the sum of n3 and n4 is from 1 to 15.

[0211] 9) Y is hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 An aryl group of formula 2; or a combination thereof; provided that X 1 If this is -O-SiR'R''-, Y is hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 is selected from the group consisting of aryl groups or combinations thereof,

[0212] [Chemical Formula 2]

[0213]

[0214] In the above chemical formula 2,

[0215] 10) X 2 is -CF3; C1~C 30 Alkyl group of; C3~C 30 Cycloalkyl group of; or C6~C 30 is an aryl group,

[0216] 11) n5 and n6 are integers from 0 to 15, but the sum of n5 and n6 is from 1 to 15.

[0217] 12) The above Z, R', R'', R''', R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2and Y are independently deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0218]

[0219] In addition, it is more preferable that the ink-repellent compound represented by the above chemical formula 1 includes the following chemical formula 1-1 or chemical formula 1-2.

[0220] [Chemical Formula 1-1]

[0221]

[0222] [Chemical Formula 1-2]

[0223]

[0224] In the above chemical formulas 1-1 and 1-2,

[0225] 1) R 3 Silver hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30aryl group; or a combination thereof,

[0226] 2) Z, R', R'', R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y are the same as defined in the above chemical formula 1,

[0227] 3) In the above chemical formulas 1-1 and 1-2, each of Z, R', R'', and R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y are equal or different,

[0228] 4) The above Z, R', R'', R 1 Inland R 3 , L 1 Inland L 4 , X 2 and Y are independently deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30and combinations thereof, and adjacent substituents may form a ring.

[0229] The above R 1 ~R 2 , R', R", R''', Y and X 2 In this case, aryl group is preferably C6~C 30 Aryl group of, more preferably C6~C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0230] The above Z and L 1 ~L 4 In this case, it is preferably C2~C 30 A heterocyclic group, more preferably C2~C 18 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0231] The above Z and L 1 ~L 4 In the case of this arylene group, preferably C6~C 30 Arylene group, more preferably C6~C 18 It may be an arylene group, such as phenyl, biphenyl, naphthyl, terphenyl, etc.

[0232] The above R 1 ~R 2 , R', R", R''', Y and X 2 In this case, it is preferably C1~C 10 It can be an alkyl group, for example, methyl, t-butyl, etc.

[0233] The above Z, R', R'', R 1 Inland R 3 , L 1 Inland L 4 , X 2 And the ring formed by the adjacent groups of Y bonding to each other is C6~C 60Aromatic ring group; Fluorenyl group; C2~C containing at least one heteroatom among O, N, S, Si and P 60 Heterocyclic group of; or C3~C 60 It may be an aliphatic ring group, for example, when adjacent groups are bonded to each other to form an aromatic ring, preferably C6~C 20 An aromatic ring, more preferably C6~C 14 It can form aromatic rings such as benzene, naphthalene, phenanthrene, etc.

[0234] It is preferable that the above ink-repellent compound is included in an amount of 1 to 10 wt% based on the total amount of the photosensitive composition.

[0235] (2) Alkali-soluble resin resin

[0236] The patterning resin according to one embodiment of the present invention may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0237] The above acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0238] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The first ethylenically unsaturated monomer may be included in an amount of 5 wt% to 50 wt%, for example, 10 wt% to 40 wt%, based on the total amount of the acrylic binder resin.

[0239] The second ethylenically unsaturated monomer is an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzylmethylether, etc.; an unsaturated carboxylic acid ester compound such as methyl(meth)acrylate, ethyl(meth)acrylate, butyl(meth)acrylate, 2-hydroxyethyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, benzyl(meth)acrylate, cyclohexyl(meth)acrylate, phenyl(meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl(meth)acrylate, 2-dimethylaminoethyl(meth)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate, etc.; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl(meth)acrylate, etc. Examples include cyanide vinyl compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; etc., and these may be used alone or in combination of two or more.

[0240] Specific examples of the acrylic binder resin include, but are not limited to, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc. These may be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, for example, 20,000 g / mol to 30,000 g / mol.

[0241] An alkali-soluble resin according to one embodiment of the present invention includes a resin including a repeating unit having a structure as shown in [Chemical Formula 3] below.

[0242] [Chemical Formula 3]

[0243]

[0244] 1) * indicates the part where the combination is connected as a repeating unit,

[0245] 2) n represents the number of repeating units from 2 to 200,000,

[0246] 3) R 21 and R 22 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0247] 4) R 21 and R 22 Each adjacent tile can form a ring,

[0248] 5) i and j are integers from 0 to 4, independently of each other.

[0249] 6) X 21 is a single bond, O, CO, SO2, CR'R”, SiR'R”, [chemical formula 4] or [chemical formula 5],

[0250] 7) X 22 is C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C20 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0251] 8) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0252] 9) R' and R" can each form adjacent tile rings,

[0253] Examples of R' and R'' combining to form a ring are as follows.

[0254]

[0255] 10) A 21 and A 22 are independently [chemical formula 6] or [chemical formula 7],

[0256] 11) The ratio of [chemical formula 6] and [chemical formula 7] in the polymer chain of the resin containing the repeating unit represented by [chemical formula 3] satisfies 1:9 to 9:1,

[0257] [Chemical Formula 4]

[0258]

[0259] [Chemical Formula 5]

[0260]

[0261] In the above [chemical formula 4] and [chemical formula 5],

[0262] 12-1) * indicates the binding position,

[0263] 12-2) X 23 is O, S, SO2 or NR',

[0264] 12-3) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0265] 12-4) R 23 ~R 26 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0266] 12-5) R 23 ~R 26 Each adjacent tile can form a ring,

[0267] 12-6) k~n are integers from 0 to 4, independently of each other.

[0268] [Chemical Formula 6]

[0269]

[0270] [Chemical Formula 7]

[0271]

[0272] In the above [chemical formula 6] and [chemical formula 7],

[0273] 13-1) * indicates the binding position,

[0274] 13-2) R 27 ~R 30 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0275] 13-3) Y 21 and Y 22 are independently of each other [chemical formula 8],

[0276] [Chemical Formula 8]

[0277]

[0278] In the above [chemical formula 8],

[0279] 14-1) * indicates the binding position,

[0280] 14-2) R 31 is hydrogen; deuterium; halogen; C6~C 30Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0281] 14-3) L 21 is a single bond, C1~C 30 alkylene, C6~C 30 Arylene or C2~C 30 is a heterocycle,

[0282] 15) The above R 21 ~R 31 , R', R", X 21 ~X 23 and L 21 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0283] The above R 21 ~R 31 , R', R" and X 22 If it is an aryl group, preferably C6~C 30 Aryl group of, more preferably C6~C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0284] The above R 21 ~R 31 , R', R", X 22 and L 21 In this case, it is preferably C2~C 30 A heterocyclic group, more preferably C2~C 18 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0285] Above X 22 and L 21 If it is an arylene group, preferably C6~C 30 Arylene group, more preferably C6~C 18 It may be an arylene group, such as phenyl, biphenyl, naphthyl, terphenyl, etc.

[0286] The above R 21 ~R 31 , R', R" and X 22 If it is an alkyl group, preferably C1~C 10 It can be an alkyl group, for example, methyl, t-butyl, etc.

[0287] The above R 21 ~R 31 , R', R" and X 22 If it is an alkoxyl group, preferably C1~C 20Alkoxyl group of, more preferably C1~C 10 It may be an alkoxyl group, such as methoxy, t-butoxy, etc.

[0288] The above R 21 ~R 31 , R', R", X 21 ~X 23 and L 21 The ring formed by the bonding of adjacent groups is C6~C 60 Aromatic ring group; Fluorenyl group; C2~C containing at least one heteroatom among O, N, S, Si and P 60 Heterocyclic group of; or C3~C 60 It may be an aliphatic ring group, for example, when adjacent groups are bonded to each other to form an aromatic ring, preferably C6~C 20 An aromatic ring, more preferably C6~C 14 It can form aromatic rings such as benzene, naphthalene, phenanthrene, etc.

[0289] The alkali-soluble resin may be, for example, a fluorene-containing compound such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, benzophenonetetracarboxylic acid dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic acid dianhydride, perylenetetracarboxylic acid dianhydride, tetrahydrofurantetracarboxylic acid dianhydride, and tetrahydrophthalic acid anhydride; a glycol compound such as ethylene glycol, propylene glycol, and polyethylene glycol; an alcohol compound such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; a solvent compound such as propylene glycol methyl ethyl acetate, and N-methylpyrrolidone; a phosphorus compound such as triphenylphosphine; And it can be prepared by mixing two or more of amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride.

[0290] The ratio of the structure represented by [Chemical Formula 6] and the structure represented by [Chemical Formula 7] within the polymer chain of the resin including the repeating unit represented by [Chemical Formula 3] is preferably 1:9 to 9:1, and most preferably 8:2 to 2:8. In the case of a resin in which the structure represented by [Chemical Formula 6] and the structure represented by [Chemical Formula 7] are mixed within the polymer chain at the above ratio, compatibility with other components within the photosensitive composition is improved, so that when forming a pattern, the generation of residue is less and the resolution is excellent compared to when using a resin including only the structure represented by [Chemical Formula 6] or a resin including only the structure represented by [Chemical Formula 7].

[0291] The weight average molecular weight of the resin including the repeating unit represented by the above [chemical formula 3] may be 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, more preferably 1,000 to 30,000 g / mol. When the weight average molecular weight of the resin is within the above range, a pattern is formed well without residue during pattern layer production, and there is no loss of film thickness during development, and a good pattern can be obtained.

[0292] The resin including the repeating unit represented by the above [chemical formula 3] may be included in an amount of 1 to 50 wt%, more preferably 5 to 45 wt%, based on the total amount of the photosensitive composition. When the resin is included within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

[0293] The sum of the resin including the repeating unit represented by the above [Chemical Formula 3] and the acrylic resin may be included in an amount of 1 to 50 wt%, more preferably 5 to 45 wt%, based on the total amount of the photosensitive composition. When the sum of the resin including the repeating unit represented by the above [Chemical Formula 3] and the acrylic resin is included within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

[0294] (3) Reactive unsaturated compounds

[0295] A photosensitive composition according to one embodiment of the present invention may include a reactive unsaturated compound having a structure as represented by the following [chemical formula 9].

[0296] [Chemical Formula 9]

[0297]

[0298] In the above [chemical formula 9], two or more of Z1 to Z4 independently have the structure of the following [chemical formula 10]; the remaining Z1 to Z4 independently represent hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6 to C 30Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0299] [Chemical Formula 10]

[0300]

[0301] In the above [chemical formula 10],

[0302] 1) t is an integer from 1 to 20,

[0303] 2) L4 is a single bond, C1~C 30 Substituted or unsubstituted alkylene; C6~C 30 substituted or unsubstituted arylene; or C2~C 30 is a substituted or unsubstituted heterocycle,

[0304] 3) Y3 is [Chemical Formula 11] or [Chemical Formula 12] below,

[0305] [Chemical Formula 11]

[0306]

[0307] [Chemical Formula 12]

[0308]

[0309] In the above [chemical formula 11], R 14 Silver hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group.

[0310] The multi-acrylic compound having a structure such as the above [chemical formula 9] may be used alone or in combination of two or more. As an example, a multifunctional ester of (meth)acrylic acid having at least two ethylenically unsaturated double bonds may be used.

[0311] In this specification, “(meth)acrylic acid” may refer to methacrylic acid, acrylic acid, or a mixture of methacrylic acid and acrylic acid.

[0312] The above reactive unsaturated compound has the above ethylenically unsaturated double bond, and thus can sufficiently polymerize upon exposure to light in the pattern forming process to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0313] Specific examples of the above reactive unsaturated compound include, but are not limited to, one or more selected from ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxyacrylate, ethylene glycol monomethyl ether acrylate, and trimethylolpropane triacrylate.

[0314] Examples of commercially available products of the above reactive unsaturated compounds are as follows.

[0315] Examples of the bifunctional ester of the above (meth)acrylic acid include Aronix M-210, M-240, M-6200 from Toagosei Chemical Industry Co., Ltd., KAYARAD HDDA, HX-220, R-604 from Nihon Kayaku Co., Ltd., and V-260, V-312, V-335 HP from Osaka Yuki Chemical Industry Co., Ltd.

[0316] Examples of the trifunctional ester of the above (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060 from Toagosei Chemical Industry Co., Ltd., KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120 from Nihon Kayaku Industry Co., Ltd., and V-295, V-300, V-360 from Osaka Yuki Kayaku Industry Co., Ltd.

[0317] The above products can be used alone or in combination of two or more.

[0318] The above reactive unsaturated compound may be used after being treated with an acid anhydride to provide better developability. The above reactive unsaturated compound may be included in an amount of 1 to 40 wt%, preferably 1 to 20 wt%, based on the total amount of the photosensitive composition. When the above reactive unsaturated compound is included within the above range, sufficient curing occurs upon exposure in the pattern formation process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, and also excellent resolution and adhesion.

[0319] (4) Photoinitiator

[0320] To implement a negative pattern using photolithography, a photoradical initiator must be used. The photoinitiator has a molar absorption coefficient of 10,000 (L / mol·cm) or more in the range of 330 to 380 nm, and a 5 wt% weight loss occurs at 200°C or less. Here, the molar absorption coefficient can be calculated by the Beer-Lambert Law. In addition, the weight loss was measured using a TGA in a nitrogen atmosphere while heating at a rate of 5°C / min up to 300°C.

[0321] A photosensitive composition according to one embodiment of the present invention includes a photoinitiator having a structure represented by the following [Chemical Formula 13].

[0322] [Chemical Formula 13]

[0323]

[0324] In the above [chemical formula 13],

[0325] 1) u1~u3 are integers of 0 or 1 independently,

[0326] 2) L5 and L8 are [chemical formula 14] below,

[0327] 3) L6, L7 and L9 are independently C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C3~C 30 Aliphatic ring C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; C1~C 20 Alkoxycarbonyl of; C1~C 30 alkylene; C6~C 30arylene; [Formula 15]; [Formula 16]; [Formula 17]; or [Formula 18]; or a combination thereof,

[0328] [Chemical Formula 14]

[0329]

[0330] In the above [chemical formula 14], R 15 Silver hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0331] [Chemical Formula 15]

[0332]

[0333] [Chemical Formula 16]

[0334]

[0335] [Chemical Formula 17]

[0336]

[0337] [Chemical Formula 18]

[0338]

[0339] [Chemical Formula 19]

[0340]

[0341] In the above [chemical formula 17] to [chemical formula 19],

[0342] 1) A is hydrogen; O; S; silane group; siloxane group; boron group; germanium group; cyano group; nitro group; nitrile group; C1~C 30 Alkyl group of C6~C 30 Aryl group or C2~C 30 An amino group substituted or unsubstituted with a heterocyclic group; C1~C 30 Alkylthio group of; C1~C 30 Alkyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 arylalkenyl group; or a combination thereof,

[0343] 2) T is S, O or Se.

[0344] 3) R 16 ~R 19 are independently hydrogen; deuterium; halogen; or, independently substituted or unsubstituted, C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group.

[0345] The photosensitive composition according to one embodiment of the present invention may use the oxime ester compound of [chemical formula 13] alone or in combination of two or more thereof.

[0346] The above photopolymerization initiator is an initiator generally used in a photosensitive resin composition, and examples thereof include acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, and triazine-based compounds.

[0347] Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0348] Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0349] Examples of the above thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone, etc.

[0350] Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, etc.

[0351] Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-s(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, and 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine.

[0352] In addition to the above compound, the above photoinitiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, etc.

[0353] The above photoinitiator may be a radical polymerization initiator, such as a peroxide-based compound or an azobis-based compound.

[0354] Examples of the above peroxide compounds include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; Examples thereof include dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-bis(t-butyloxyisopropyl)benzene, and t-butylperoxyvaleric acid n-butyl ester; alkyl peresters such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, and di-t-butyl peroxytrimethyl adipate; and percarbonates such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-butylcyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butyl peroxyarylcarbonate.

[0355] Examples of the above azobis compounds include 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2, -azobis(methylisobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutylnitrile), and 4,4'-azobis(4-cyanovaleic acid).

[0356] The above photoinitiator may also be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0357] The photoinitiator may be included in an amount of 0.01 to 10 wt%, for example, 0.1 to 5 wt%, based on the total amount of the photosensitive composition. When the photoinitiator is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, thereby obtaining excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

[0358] (5) Colorant

[0359] Both organic pigments and inorganic pigments and dyes can be used as the above colorants.

[0360] As the above coloring agent, red pigment, green pigment, blue pigment, yellow pigment, black pigment, etc. can be used.

[0361] Examples of the above red pigments include CI Red Pigment 254, CI Red Pigment 255, CI Red Pigment 264, CI Red Pigment 270, CI Red Pigment 272, CI Red Pigment 177, CI Red Pigment 89, etc.

[0362] Examples of the above green pigments include halogen-substituted copper phthalocyanine pigments such as CI Green Pigment 36, CI Green Pigment 7, etc.

[0363] Examples of the above blue pigments include copper phthalocyanine pigments such as CI Blue Pigment 15:6, CI Blue Pigment 15, CI Blue Pigment 15:1, CI Blue Pigment 15:2, CI Blue Pigment 15:3, CI Blue Pigment 15:4, CI Blue Pigment 15:5, CI Blue Pigment 16, and the like.

[0364] Examples of the above yellow pigments include isoindoline pigments such as CI Yellow Pigment 139, quinophthalone pigments such as CI Yellow Pigment 138, and nickel complex pigments such as CI Yellow Pigment 150.

[0365] Examples of the above black pigments include lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0366] Additionally, the colorant in the photosensitive resin composition according to the embodiment may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine-based compound.

[0367] The above pigments and dyes may be used alone or in combination of two or more thereof, and are not limited to these examples.

[0368] Among these, the black pigment may be used to effectively block light in the light-blocking layer. When using the black pigment, it may also be used together with a color corrector such as an anthraquinone pigment, a perylene pigment, a phthalocyanine pigment, or an azo pigment.

[0369] A dispersant may be used together with the photosensitive resin composition to disperse the pigment. Specifically, the pigment may be used by pre-surface-treating it with a dispersant, or the dispersant may be added together with the pigment during the preparation of the photosensitive resin composition.

[0370] Nonionic dispersants, anionic dispersants, cationic dispersants, etc. can be used as the above dispersant. Specific examples of the above dispersant include polyalkylene glycol and its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, alkylamide alkylene oxide adducts, alkylamines, etc., and these can be used alone or in combination of two or more.

[0371] Examples of commercially available products of the above dispersant include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001 from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450 from EFKA Chemical; Zeneka's Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; or Ajinomoto's PB711, PB821, etc.

[0372] The dispersant may be included in an amount of 0.1 to 15 wt% based on the total weight of the photosensitive resin composition. When the dispersant is included within the above range, the composition has excellent dispersibility, resulting in excellent stability, developability, and patternability during the manufacture of the light-shielding layer.

[0373] The above pigment may be used after pretreatment using a water-soluble inorganic salt and a wetting agent. When the pigment is used after the above pretreatment, the average particle size of the pigment can be refined.

[0374] The above pretreatment can be performed through a step of kneading the pigment together with a water-soluble inorganic salt and a wetting agent, and a step of filtering and washing the pigment obtained in the kneading step.

[0375] The above-mentioned kneading can be performed at a temperature of 40°C to 100°C, and the above-mentioned filtration and washing can be performed by washing away the inorganic salt using water or the like and then filtering.

[0376] Examples of the above water-soluble inorganic salts include, but are not limited to, sodium chloride and potassium chloride.

[0377] The above wetting agent acts as a medium that allows the pigment and the water-soluble inorganic salt to be uniformly mixed and the pigment to be easily pulverized, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol; and these may be used alone or in combination of two or more.

[0378] The pigment that has undergone the above-described kneading step may have an average particle diameter of 20 nm to 110 nm. When the average particle diameter of the pigment is within the above range, it can effectively form fine patterns while exhibiting excellent heat and light resistance.

[0379] The above pigment may be included in an amount of 1 to 40 wt%, more specifically 2 to 30 wt%, based on the total amount of the photosensitive resin composition. When the pigment is included within the above range, the color reproducibility is excellent, and the pattern has excellent curability and adhesion.

[0380] (6) Solvent

[0381] The solvent may be a material that is compatible with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, but does not react with them.

[0382] Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate;2-oxy-2-methyl propionic acid esters such as methyl 2-oxy-2-methyl propionic acid, ethyl 2-oxy-2-methyl propionic acid, etc.; monooxy monocarboxylic acid alkyl esters of 2-alkoxy-2-methyl propionic acid alkyls such as methyl 2-methoxy-2-methyl propionic acid, ethyl 2-ethoxy-2-methyl propionic acid; esters such as ethyl 2-hydroxypropionic acid, ethyl 2-hydroxy-2-methyl propionic acid, ethyl hydroxyacetate, methyl 2-hydroxy-3-methyl butanoate; ketone acid esters such as ethyl pyruvate, etc.;

[0383] In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can also be used.

[0384] Among the above solvents, taking compatibility and reactivity into consideration, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as 2-hydroxypropionate ethyl; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0385] The solvent may be included as a remainder based on the total amount of the photosensitive resin composition, and specifically, may be included at 40 to 90 wt%. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability in the manufacture of a pattern layer.

[0386] (7) Other additives

[0387] The above photosensitive composition may further include additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or a (meth)acryloxy group; a leveling agent; a fluorinated surfactant; a silicone surfactant; and a radical polymerization initiator to prevent stains or spots during application, improve leveling performance, and prevent the formation of residues due to non-development.

[0388] For example, the photosensitive resin composition may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate, etc.

[0389] Examples of the above silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryl oxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ-isocyanate propyl triethoxysilane, γ-glycidoxy propyl trimethoxy silane, β-epoxy cyclohexyl ethyl trimethoxysilane, etc., and these may be used alone or in combination of two or more.

[0390] The above silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, adhesion, storability, etc. are excellent.

[0391] In addition, the photosensitive resin composition may further include a surfactant, such as a fluorinated surfactant or a silicone surfactant, to improve coating properties and prevent defects, if necessary.

[0392] As the above fluorinated surfactant, BM Chemie's BM-1000 ® , BM-1100 ® Mecha Pack F 142D by Dai Nippon Inki Kagaku Kogyo Co., Ltd. ® , East F 172 ®, East F 173 ® , East F 183 ® Back; Prorad FC-135 from Sumitomo 3M Co., Ltd. ® , East FC-170C ® , East FC-430 ® , East FC-431 ® Saffron S-112 from Asahi Glass Co., Ltd. ® , East S-113 ® , East S-131 ® , East S-141 ® , East S145 ® SH-28PA from Toray Silicone Co., Ltd. ® , East-190 ® , East-193 ® , SZ-6032 ® , SF-8428 ® Fluorinated surfactants sold under the names of etc. can be used.

[0393] As the above silicone surfactant, BASF's EFKA ® 3030, EFKA ® 3034, EFKA ® 3886, etc.; 3030, 3085, 3236 from AFCONA; BYK-379, BYK-3550, BYK-3751, BYK-3754 from BYK can be used.

[0394] The above surfactant may be used in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the surfactant is included within the above range, coating uniformity is ensured, staining does not occur, and wetting on a glass substrate is excellent. In addition, other additives such as antioxidants and stabilizers may be added in a certain amount to the photosensitive resin composition within a range that does not impair the physical properties.

[0395] Another embodiment can be patterning of a pixel separation portion of an organic light-emitting element electrode using the photosensitive resin composition described above.

[0396] Hereinafter, synthetic examples and examples according to the present invention are specifically described, but the synthetic examples and examples of the present invention are not limited thereto.

[0397] Synthesis Example 1 (Preparation of ink-repellent compound 1)

[0398] A 250 ml 3-neck round-bottom flask was equipped with a stirrer, a nitrogen injection device, a dropping funnel, a temperature controller, and a condenser, and nitrogen was filled. 10 g of (5-hydroxy-1,3-phenylene)dimethanol, 8.97 g of potassium carbonate, and 80.01 g of dimethylformamide were added, and the mixture was stirred and maintained at 100°C. 24.27 g of 1,1,1,2,2,3,3,4,4-nonafluoro-6-iodohexane was added through the dropping funnel over the course of 1 hour, and stirring was maintained for 4 hours. After cooling to room temperature, the mixture was purified using a mobile phase containing a mixture of 60 wt% of hexane and 40 wt% of ethyl acetate in a column tube filled with silica gel, and then concentrated to obtain an intermediate having a purity of 100%. 23.99 g of the obtained intermediate was dissolved in 106.75 g of propylene glycol methyl ether acetate, 0.02 g of dibutyltin dilaurylate was added, and the temperature was raised to 50°C. After the temperature was raised, 21.74 g of Karenz® BEI (Karenz) was added, and the mixture was stirred and maintained at 75°C for 6 hours to obtain ink-repellent compound 1.

[0399] Synthesis Example 2 (Preparation of ink-repellent compound 4)

[0400] In the same manner, 1,1,1,2,2,3,3,4,4-nonafluoro-6-iodohexane of Synthesis Example 1 was changed to 2-(5-tertbutyl)-1,1,3,3,5,5-hexamethyltrisiloxanyloxypropane-1,3-diol, and the resulting synthesis was performed to obtain ink-repellent compound 4.

[0401] <Ink-repellent compound 1>

[0402]

[0403] <Ink-repellent compound 2 (LINC-3A, Kyoeisha)>

[0404]

[0405] <Ink-repellent compound 3 (2,2,3,3,3-pentafluoropropyl acrylate, Sigma-Aldrich)>

[0406]

[0407] <Ink-repellent compound 4>

[0408]

[0409] Synthesis Example 3 (Preparation of Compound 1-1)

[0410] 20 g of 9,9'-bisphenol fluorene (Sigma Aldrich), 8.67 g of glycidyl chloride (Sigma Aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were placed in a 300 ml 3-neck round-bottom flask equipped with a distillation column, heated to 80°C, and reacted for 4 hours. The temperature was lowered to 25°C, the reaction solution was filtered, and the filtrate was added dropwise to 1000 ml of water with stirring. The precipitated powder was filtered, washed with water, and dried under reduced pressure at 40°C to obtain compound 1-1 (25 g). The obtained powder showed a purity of 98% as a result of HPLC purity analysis.

[0411] Compound 1-1

[0412]

[0413] Synthesis Example 4 (Preparation of Alkali-Soluble Resin)

[0414] 25 g (54 mmol) of compound 1-1 obtained in Synthesis Example 3, 8 g of acrylic acid (Daejung Chemicals & Metals Co., Ltd.), 0.2 g of benzyl triethyl ammonium chloride (Daejung Chemicals & Metals Co., Ltd.), and 0.2 g of hydroquinone (Daejung Chemicals & Metals Co., Ltd.) were placed together with 52 g of propylene glycol methyl ether acetate (Sigma Aldrich Co., Ltd.) in a 300 ml 3-necked round-bottom flask equipped with a distillation column, and stirred at 110°C for 6 hours. After completion of the reaction, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich Co., Ltd.) were added, and stirred again at 110°C for 6 hours. After completion of the reaction, the reaction solution was recovered, and the result of analysis showed that an alkali-soluble binder resin having a molecular weight of 4,580 and a solid content of 45% was obtained.

[0415] Manufacturing Example (Manufacturing of the composition of the present invention and the comparative composition)

[0416] Compositions 1 to 6 comprising the ink-repellent compound of the present invention and the alkali-soluble resin of the present invention were prepared with the composition (weight %) as shown in Table 1 below.

[0417] Manufacturing Example 1 (Composition 1) Manufacturing Example 2 (Composition 2) Manufacturing Example 3 (Composition 3) Manufacturing Example 4 (Composition 4) Manufacturing Example 5 (Composition 5) Manufacturing Example 6 (Composition 6) Ink-repellent compound 1234--Ink-repellent compound 2 (Kyoeisha)---3-Ink-repellent compound 3 (Sigma-aldrich)----3Ink-repellent compound 43OXE-02 (BASF)333333M600 (Miwon Specialty)131211121212Alkali-soluble resin121212121212Propylene glycol methyl ether acetate (Daicel)707070707070

[0418] The method for manufacturing a pattern using the composition of Table 1 above is as follows. (Photolithography step) (1) Application and film formation step

[0419] Each composition in Table 1 is applied to a washed 10 cm x 10 cm glass substrate with a thickness of 2 μm using a spin coater, and then heated at a temperature of 100°C for 1 minute to remove the solvent, thereby forming a coating film.

[0420] (2) Exposure stage

[0421] After inserting an open mask of a predetermined shape to form the required pattern on the obtained film, an active line of 190 nm to 500 nm was irradiated. MA-6 was used as the exposure device and the exposure dose was 100 mJ / cm 2 was investigated.

[0422] (3) Phenomenon stage

[0423] Following the above exposure step, the film was developed by dipping in AZEM AX 300 MIF developer at 25°C for 1 minute, and then washed with water.

[0424] (4) Post-heat treatment stage

[0425] The film obtained by the above phenomenon was heat-treated in an oven at 200°C for 60 minutes, and then a pattern formed with the composition of Table 1 was obtained.

[0426] Example (Evaluation of pattern resolution, contact angle, and surface tension)

[0427] The resolution, contact angle, and surface tension of the composition pattern of Table 1 manufactured by the above photolithography step were evaluated by the following methods.

[0428] [Example 1]

[0429] The resolution, contact angle, and surface tension of the pattern formed with the above composition 1 were evaluated using the following method, and the results are shown in Table 2 below.

[0430] 1. Resolution evaluation (measuring the minimum pattern size on the substrate)

[0431] The minimum pattern size of the pattern of the composition 1 obtained through the above photolithography step was measured on the substrate using an optical microscope (ECLIPSE LV100POL Model, Nikon).

[0432] 2. Contact angle evaluation

[0433] In the exposure step of the above photolithography step, a film of the above composition 1 was formed using a mask capable of full-face exposure, and after dropping a water droplet on the film, the contact angle with the water droplet was measured using a contact angle measuring device (DSA25, KRUSS).

[0434] 3. Surface tension evaluation

[0435] The surface tension of the above composition 1 was measured in a liquid state using a surface tension meter (DSA25, KRUSS).

[0436] [Examples 2 to 4]

[0437] In the above example, a pattern was formed in the same manner as in Example 1 using Compositions 2 to 3 and Composition 6 instead of Composition 1. The resolution, contact angle and surface tension of the formed pattern were evaluated in the same manner as in Example 1, and the results are shown in Table 2 below.

[0438] [Comparative Examples 1 and 2]

[0439] In the above example, a pattern was formed in the same manner as in Example 1 using Compositions 4 to 5 instead of Composition 1. The resolution, contact angle, and surface tension of the formed pattern were evaluated in the same manner as in Example 1, and the results are shown in Table 2 below.

[0440] Pattern CompositionBase Minimum Pattern Size (㎛)Contact Angle (°)Surface Tension (mN / m)Residue Example 1 Composition 13.899.020.3None Example 2 Composition 24.199.519.7None Example 3 Composition 34.399.919.5None Example 4 Composition 64.095.222.4None Comparative Example 1 Composition 46.3103.818.6Yes Comparative Example 2 Composition 58.770.535.2No

[0441] From the above Table 2, it can be confirmed that in the case of Examples 1 to 4 including the ink-repellent compound of the present invention, the minimum pattern size on the substrate is smaller than in Comparative Example 1 using the commonly used ink-repellent compound 2 (LINC-3A, Kyoeisha), resulting in excellent pattern resolution and no residue. In addition, from the above Table 2, it can be confirmed that in the case of Examples 1 to 4 including the ink-repellent compound of the present invention, the minimum pattern size on the substrate is smaller than in Comparative Example 2 using the ink-repellent compound 3 having one acrylic group at the end, resulting in excellent pattern resolution and a higher contact angle.

[0442] The above description is merely an example of the present invention, and those skilled in the art will appreciate that various modifications may be made without departing from the essential characteristics of the present invention.

[0443] Accordingly, the embodiments disclosed herein are intended to illustrate, rather than limit, the present invention, and the spirit and scope of the present invention are not limited by these embodiments. The scope of protection of the present invention should be interpreted by the claims, and all techniques within the scope equivalent thereto should be interpreted as being included within the scope of the present invention.

[0444] The present invention relates to an ink-repellent compound and a photosensitive composition comprising the same.

Claims

1. An ink-repellent compound represented by the following chemical formula 1: [Chemical Formula 1] In the above chemical formula 1, 1) Z is C1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 C2~C containing at least one heteroatom among arylene group, O, N, S, Si and P 30 Heterocyclic group of; C1~C 30 Selected from the group consisting of alkoxylene groups or combinations thereof, 2) X 1 is -O-; -S-; -NHCOO-; -O-SiR'R''-; or -NR'''-, 3) R', R'' and R''' are independently hydrogen; deuterium; C1~C 30 Alkyl group or C6~C 30 is an aryl group, 4) R 1 and R 2 is hydrogen; deuterium; C1~C 30 alkyl group of; or C6~C 30 is an aryl group, 5) L 1 and L 2 are independently of each other, single bond, C1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 Arylene group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C1~C 30 Alkyl group of; C1~C 30- selected from the group consisting of an alkoxy group; an amide group; a urethane group; or a combination thereof, L 3 and L 4 are independently a single bond; C-1~C 30 alkylene group; C3~C 30 Cycloalkylene group of; C6~C 30 is selected from the group consisting of an arylene group; an amide group; a urethane group; or a combination thereof, 6) n1 is an integer from 0 to 10, 7) n2 is an integer from 1 to 3, 8) n3 and n4 are independent integers from 0 to 15; however, the sum of n3 and n4 is from 1 to 15. 9) Y is hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 An aryl group of formula 2; or a combination thereof; provided that X 1 If this is -O-SiR'R''-, Y is hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 is selected from the group consisting of aryl groups or combinations thereof, [Chemical Formula 2] In the above chemical formula 2, 10) X 2 is -CF3; C1~C 30 Alkyl group of; C3~C 30 Cycloalkyl group of; or C6~C 30 is an aryl group, 11) n5 and n6 are integers from 0 to 15, but the sum of n5 and n6 is from 1 to 15. 12) The above Z, R', R'', R''', R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y are independently deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

2. In the first paragraph, the ink-repellent compound represented by the chemical formula 1 is an ink-repellent compound represented by the chemical formula 1-1 or chemical formula 1-2: [Chemical Formula 1-1] [Chemical Formula 1-2] In the above chemical formulas 1-1 and 1-2, 1) R 3 Silver hydrogen; deuterium; C1~C 30 Alkyl group of; C6~C 30 aryl group; or a combination thereof, 2) Z, R', R'', R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y is the same as defined in the chemical formula 1 of the first paragraph above, 3) In the above chemical formulas 1-1 and 1-2, each of Z, R', R'', and R 1 , R 2 , L 1 Inland L 4 , X 1 , X 2 and Y are equal or different, 4) The above Z, R', R'', R 1 Inland R 3 , L 1 Inland L 4 , X 2 and Y are independently deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and adjacent substituents may form a ring. 3.(A) An ink-repellent compound represented by the chemical formula 1 of paragraph 1; (B) Alkali-soluble resin; (C) reactive unsaturated compounds; (D) photoinitiator; and (E) A photosensitive composition comprising a solvent.

4. A photosensitive composition according to claim 3, characterized in that the ink-repellent compound is contained in an amount of 1 to 10 wt% based on the total amount of the photosensitive composition.

5. A photosensitive composition according to claim 3, characterized in that the alkali-soluble resin comprises an acrylic binder resin, a cardo binder resin, or a combination thereof.

6. A photosensitive composition according to claim 3, characterized in that the alkali-soluble resin comprises a resin containing a repeating unit of the following [chemical formula 3]: [Chemical Formula 3] 1) * indicates the part where the combination is connected as a repeating unit, 2) n represents the number of repeating units from 2 to 200,000, 3) R 21 and R 22 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 4) R 21 and R 22 Each adjacent tile can form a ring, 5) I and j are integers from 0 to 4, independently of each other. 6) X 21 is a single bond, O, CO, SO2, CR'R”, SiR'R”, [chemical formula 4] or [chemical formula 5], 7) X 22 is C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof, 8) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 9) R' and R" can each form adjacent tile rings, 10) A 21 and A 22 are independently [chemical formula 6] or [chemical formula 7], 11) The ratio of [chemical formula 6] and [chemical formula 7] in the polymer chain of the resin containing the repeating unit represented by [chemical formula 3] satisfies 1:9 to 9:1, [Chemical Formula 4] [Chemical Formula 5] In the above [chemical formula 4] and [chemical formula 5], 12-1) * indicates the binding position, 12-2) X 23 is O, S, SO2 or NR', 12-3) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 12-4) R 23 ~R 26 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 12-5) R 23 ~R 26 Each adjacent tile can form a ring, 12-6) k~n are integers from 0 to 4, independently of each other. [Chemical Formula 6] [Chemical Formula 7] In the above [chemical formula 6] and [chemical formula 7], 13-1) * indicates the binding position, 13-2) R 27 ~R 30 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 13-3) Y 21 and Y 22 are independently of each other [chemical formula 8], [Chemical Formula 8] In the above [chemical formula 8], 14-1) * indicates the binding position, 14-2) R 31 is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, 14-3) L 21 is a single bond, C1~C 30 alkylene, C6~C 30 Arylene or C2~C 30 is a heterocycle, 15) The above R 21 ~R 31 , R', R", X 21 ~X 23 and L 21 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

7. A photosensitive composition according to claim 3, characterized in that the weight average molecular weight of the alkali-soluble resin is 1,000 to 100,000 g / mol.

8. A photosensitive composition according to claim 3, characterized in that the alkali-soluble resin is contained in an amount of 1 to 50 wt% based on the total amount of the photosensitive composition.

9. A photosensitive composition according to claim 3, characterized in that the reactive unsaturated compound is contained in an amount of 1 to 40 wt% based on the total amount of the photosensitive composition.

10. A photosensitive composition according to claim 3, characterized in that the reactive unsaturated compound comprises a compound represented by the following [chemical formula 9]: [Chemical Formula 9] In the above [chemical formula 9], two or more of Z1 to Z4 independently have the structure of the following [chemical formula 10]; the remaining Z1 to Z4 independently represent hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6 to C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, [Chemical Formula 10] In the above [chemical formula 10], 1) t is an integer from 1 to 20, 2) L4 is a single bond, C1~C 30 Substituted or unsubstituted alkylene; C6~C 30 substituted or unsubstituted arylene; or C2~C 30 is a substituted or unsubstituted heterocycle, 3) Y3 is [Chemical Formula 11] or [Chemical Formula 12] below, [Chemical Formula 11] [Chemical Formula 12] In the above [chemical formula 11], R 14 Silver hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group.

11. A photosensitive composition according to claim 3, characterized in that the photoinitiator is contained in an amount of 0.01 to 10 wt% based on the total amount of the photosensitive composition.

12. A photosensitive composition according to claim 3, characterized in that the photoinitiator comprises a compound represented by the following [chemical formula 13]: [Chemical Formula 13] In the above [chemical formula 13], 1) u1~u3 are integers of 0 or 1 independently, 2) L5 and L8 are [chemical formula 14] below, 3) L6, L7 and L9 are independently C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C3~C 30 Aliphatic ring C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; C1~C 20 Alkoxycarbonyl of; C1~C 30 alkylene; C6~C 30 arylene; [Formula 15]; [Formula 16]; [Formula 17]; or [Formula 18]; or a combination thereof, [Chemical Formula 14] In the above [chemical formula 14], R 15 Silver hydrogen, deuterium, halogen, methyl group, ethyl group; methyl hydroxy group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group, [Chemical Formula 15] [Chemical Formula 16] [Chemical Formula 17] [Chemical Formula 18] [Chemical Formula 19] In the above [chemical formula 17] to [chemical formula 19], 1) A is hydrogen; O; S; silane group; siloxane group; boron group; germanium group; cyano group; nitro group; nitrile group; C1~C 30 Alkyl group of C6~C 30 Aryl group or C2~C 30 An amino group substituted or unsubstituted with a heterocyclic group; C1~C 30 Alkylthio group of; C1~C 30 Alkyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 arylalkenyl group; or a combination thereof, 2) T is S, O or Se. 3) R 16 ~R 19 are independently hydrogen; deuterium; halogen; or, independently substituted or unsubstituted, C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group of; C2~C 20 Alkenyl group of; C2~C 20 Alkynyl group of; C1~C 20 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group.

13. A photosensitive composition according to claim 3, characterized in that the photosensitive composition further comprises a coloring agent.

14. A photosensitive composition according to claim 13, characterized in that the colorant comprises at least one of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment.

15. A photosensitive composition according to claim 13, characterized in that the colorant is contained in an amount of 1 to 40 wt% based on the total amount of the photosensitive composition.

16. A photosensitive composition according to claim 13, characterized in that the colorant is pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

17. A pattern or film formed with a photosensitive composition according to paragraph 3.

18. An organic light-emitting display device comprising a pattern or film according to Article 17.

19. An organic light-emitting display device according to claim 18, characterized in that at least one of a flat layer, an organic light-emitting element layer, a sealing layer, a touch panel, and a color filter includes the pattern or film.

20. An electronic device including a display device of Article 18 and a control unit for driving the display device.

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