Electronic device including waterproofing structure

Abstract

According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include: a housing including a first through-hole; a first conductive pin including a first portion at least partially disposed in the first through-hole and a second portion extending from the first portion to the inside of the housing; a pin bracket spaced apart from the housing and including an accommodation hole in which a portion of the second portion of the first conductive pin is disposed; a circuit board disposed on one side of the pin bracket and electrically connected to the first conductive pin; and a waterproof member. At least a portion of the waterproof member may be disposed between a coupling portion between the accommodation hole of the pin bracket and the second portion of the conductive pin and one surface of the housing facing the coupling portion. The second portion of the first conductive pin may include a recess formed in at least a portion of the second portion such that a portion of the waterproof member is seated therein.

Description

Electronic devices including waterproof structures

[0001] Examples disclosed in this document relate to electronic devices including waterproof structures.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a first through hole, a first conductive pin including a first portion at least partially disposed in the first through hole and a second portion extending from the first portion into the interior of the housing, a pin bracket including a receiving hole spaced apart from the housing and in which a portion of the second portion of the first conductive pin is disposed, a circuit board disposed on one side of the pin bracket and electrically connected to the first conductive pin, and a waterproof member. At least a portion of the waterproof member may be disposed between a coupling portion of the receiving hole of the pin bracket and the second portion of the conductive pin and a surface of the housing facing the coupling portion. The second portion of the first conductive pin may include a recess formed in at least a portion of the second portion such that a portion of the waterproof member is seated therein.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a first through hole, a first conductive pin including a first portion at least partially disposed in the first through hole and a second portion extending from the first portion into the interior of the housing, a pin bracket including a receiving hole spaced apart from the housing and in which a portion of the second portion of the first conductive pin is disposed, a circuit board disposed on one side of the pin bracket and electrically connected to the first conductive pin, and a waterproof member. The second portion of the first conductive pin may further include a first connection structure formed on one surface of the second portion facing a surface of the receiving hole, and the pin bracket may further include a second connection structure formed to be engaged with the first connection structure on the surface of the receiving hole.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a plan view of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a partial perspective view of an electronic device according to an embodiment of the present disclosure according to portion P of FIG. 3.

[0012] FIG. 6 is a partial perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 7 is a partial cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 8 is a perspective view of a conductive pin assembly according to one embodiment of the present disclosure.

[0015] FIG. 9 is an exploded perspective view of a conductive pin assembly according to one embodiment of the present disclosure.

[0016] FIG. 10 is a cross-sectional side view of a conductive pin assembly according to one embodiment of the present disclosure, taken along line A-A' of FIG. 8.

[0017] FIG. 11 is a cross-sectional side view illustrating a conductive pin assembly according to one embodiment of the present disclosure.

[0018] FIG. 12 is a cross-sectional side view illustrating a conductive pin assembly according to one embodiment of the present disclosure.

[0019] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0020] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0021] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0022] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0023] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0025] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit one embodiment of the present disclosure. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0047] FIG. 2 is a plan view of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0048] The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0049] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (201) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (201) may also refer to a structure forming a portion of the first side (210A) of FIG. 2 , the second side (210B) of FIG. 3 , and the side surface (210C). The electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 4 ) may include a housing (201), and according to one embodiment, the first side (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) at least partially transparent. The front plate (202) may be referred to as, for example, a display (e.g., a display (220) of FIG. 4), a window and / or a window plate (e.g., a window plate (221) of FIG. 4), and may form an exterior of the electronic device (101) together with the housing (201). In one embodiment, the front plate (202) may be a glass plate or a polymer plate, at least a portion of which is substantially transparent, and may include various coating layers. In one embodiment, a display panel (e.g., a display panel (223) of FIG. 4) may be disposed on an inner surface of the front plate (202), and, depending on the embodiment, the front plate (202) itself and / or the front plate (202) and the display panel (223) in combination may be referred to as a 'display'.

[0050] According to one embodiment, the second side (or back) (210B) of the electronic device (101) may be formed by a back plate (211a) provided as part of the housing (201) (e.g., the back plate (211a) of FIG. 4). The back plate (211a) may be formed by a substantially opaque material, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0051] In one embodiment, the side surface (210C) of the electronic device (101) may be formed by a side surface structure (211b) (or “bezel structure”) that at least partially surrounds a space between the front plate (202) and the back plate (211a). For example, the front plate (202) may be coupled to the side surface structure (211b) so as to face the back plate (211a) with a predetermined gap therebetween. In one embodiment, the side surface structure (211b) may be provided as a separate component from the back plate (211a) and may be coupled to the back plate (211a) through a separate assembly process to form the housing (201). In one embodiment, the side surface structure (211b) may be manufactured or formed integrally with the back plate (211a) and may include the same material (e.g., a metal material such as aluminum). In one embodiment, the back plate (211a) and / or the side structures (211b) may comprise at least partially an electrically conductive material, a metallic material, and / or a polymeric material. When the back plate (211a) and / or the side structures (211b) comprise an electrically conductive material, the housing (201) may function at least partially as an antenna for transmitting and receiving wireless signals, and / or may function as a ground or electromagnetic shielding structure for the electronic device (101).

[0052] In the illustrated embodiment, the front plate (202) and / or the rear plate (211a) are substantially flat plate-shaped, but it should be noted that the embodiments disclosed herein are not limited thereto. For example, the front plate (202) and / or the rear plate (211a) may have a generally flat plate-shaped shape, but at least a portion of an edge may have a curved shape, and a side structure (211b) connecting the edge of the front plate (202) and the rear plate (211a) may have a curved shape. In one embodiment, the thickness of the electronic device (101) at the center of the front plate (202), for example, the thickness measured along the Z-axis direction, may be greater than the thickness measured at the edge of the front plate (202). For example, the thickness of the electronic device (101) may gradually decrease as it approaches the edge on the first surface (210A). When the front plate (202), the rear plate (211a) and / or the side structure (211b) of the electronic device (101) have a curved shape, a comfortable grip can be provided to the user.

[0053] According to one embodiment, the electronic device (101) may include a display (e.g., the display (220) of FIG. 4), an audio module (e.g., the audio module (170) of FIG. 1), and / or a key input device (218), and may include at least one of a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (e.g., the camera module (180) of FIG. 1), a light-emitting element, and a connector hole (e.g., the connection terminal (178) of FIG. 1), which are not illustrated. In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (218) or the light-emitting element) or may additionally include other components.

[0054] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0055] According to one embodiment, the display (220) may include a display panel (e.g., display panel (223) of FIG. 4) disposed, for example, inside the front plate (202) or the window plate (221) of FIG. 4, and may output visual information such as characters, images, and / or videos through a substantial portion of the front plate (202) and / or the window plate (221). In one embodiment, substantially the entire area of ​​the front plate (202) may be set as an area for outputting a screen. The area for outputting a screen may be formed to have a shape substantially identical to the edge of the front plate (202). In one embodiment (not shown), the gap between the area for outputting a screen and the outer edge of the front plate (202) may be formed to be substantially identical, thereby increasing the ratio of the area provided by the front plate (202) to the area for outputting a screen.

[0056] In one embodiment, the display (220) may form a recess or opening in a portion of the screen display area, and may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element aligned with the recess or opening. In one embodiment, the electronic device (101) may include at least one of an audio module, a sensor module, a camera module, a fingerprint sensor, and a light-emitting element arranged to face in a direction opposite to the screen output direction of the display (220). In one embodiment, the electronic device may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element arranged inside the screen display area of ​​the display (220) while facing in the same direction as the screen output direction. For example, the camera module may be arranged to overlap the screen display area, and may not be visually exposed to the outside, and may include a hidden under-display camera (UDC).

[0057] In one embodiment, the display (220) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one embodiment, at least a portion of the sensor module and / or at least a portion of the key input device may be disposed inside the display.

[0058] In one embodiment, the display (220) may include a display (e.g., a flexible display) that is arranged to slide on the housing (201) to provide a screen (e.g., a screen display area). For example, the screen display area of ​​the electronic device (101) is an area that is visually exposed and capable of outputting an image, and the electronic device (101) may reduce or expand the screen display area according to the movement of a sliding plate (not shown) or the movement of the display (220). For example, the electronic device (101) may include a rollable electronic device in which at least a portion (e.g., the housing) is configured to slide at least partially to selectively expand the screen display area. For example, the display (220) may also be referred to as a slide-out display or an expandable display.

[0059] According to one embodiment, the audio module may include a microphone hole and a speaker hole. The microphone hole may have a microphone positioned inside to capture external sounds, and in one embodiment, multiple microphones may be positioned to detect the direction of the sounds. The speaker hole may include an external speaker hole and a receiver hole for calls. In one embodiment, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezo speaker). In the illustrated embodiment, the audio module is illustrated in the form of a hole (213) penetrating a side surface (210C) of the electronic device (101), for example, a side structure (211b) (e.g., the side structure (211b) of FIG. 4), but it should be noted that the embodiment disclosed in this document is not limited thereto. For example, when providing a voice call function, the electronic device (101) may further include an audio module (not illustrated) in the form of a hole penetrating the front plate (202). The number and location of audio modules may be varied in consideration of the shape, function and / or actual usage environment of the electronic device (101).

[0060] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include sensors that detect the operating environment of the electronic device (101), such as a proximity sensor, an illuminance sensor, and a temperature / barometric pressure sensor, and may include sensors that obtain a user's biometric information, such as a fingerprint sensor or an HRM sensor. In addition, various other types of sensors, such as a gesture sensor, a gyro sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, or a humidity sensor, may be mounted on the electronic device (101). The arrangement of these sensor modules may be appropriately selected in consideration of the actual usage environment of the electronic device and the functions mounted on the electronic device.

[0061] According to one embodiment, a camera module (not shown) that is not illustrated may be disposed on at least one of the first side (210A) and the rear second side (210B) of the electronic device (101), and, depending on the embodiment, a plurality of camera modules may be disposed to face the same direction. In one embodiment, the camera module may include a flash that provides illumination toward a subject. The camera module may include, for example, one or more lenses, an image sensor, and / or an image signal processor. The flash may include, for example, a light-emitting diode or a xenon lamp.

[0062] According to one embodiment, the key input device (218) may be disposed on a side surface (210C) of the electronic device (101) and / or the housing (201). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (218), and the key input devices (218) that are not included may be implemented in other forms, such as soft keys, on the display (220). The number or location of the key input devices (218) is not limited to the illustrated embodiment, and may be additionally installed on the first side (210A) or the second side (210B) of the electronic device and / or on a side surface (210C) that is not illustrated. In one embodiment, some of the key input devices (218) indicated in FIG. 2 may be replaced with slots or connector holes. For example, the electronic device (101) can accommodate a user identification module card or a memory card through a slot formed to penetrate the side structure (211b), and can transmit and receive power, sound signals, and / or data to and from an external electronic device through a connector hole.

[0063] According to one embodiment, a light-emitting element (not shown) may be disposed on a first side (210A) and / or a second side (210B) of an electronic device (101). The light-emitting element may, for example, provide status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element may, for example, provide a light source that is linked to the operation of a camera module. The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0064] FIG. 4 is an exploded perspective view of an electronic device (101) (e.g., the electronic device (101) of FIG. 2 and / or FIG. 3) according to one embodiment of the present disclosure.

[0065] Referring to FIG. 4, the electronic device (101) may include a housing (201) (e.g., the housing (201) of FIG. 2 and / or FIG. 3), a display (220), a printed circuit board (203) (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (204), and an antenna (253). In one embodiment, the electronic device (101) may omit at least one of the components or additionally include another component (e.g., a bracket that supports or protects the display (220).

[0066] According to one embodiment, the electronic device (101) may have a structure in which housings (201, 205) divided into a plurality of regions are folded, including at least one hinge structure (240). For example, the state of a display operatively connected to the housings (201, 205) may change depending on a change in the state of the hinge structure (240) (e.g., a folded state, an intermediate state, or an unfolded state). For example, a foldable display device (e.g., a foldable display) may be arranged along the surfaces of the first housing (201) and the second housing (205) that face each other in the folded state. For example, a display device (e.g., a display) or an input device (e.g., a touchpad or a keyboard) may be arranged on the surfaces of the first housing (201) and the second housing (205) that face each other in the folded state, respectively. For example, the first display (220) disposed in the first housing (201) and the second display (231) disposed in the second housing (205) may be changed to face each other or form an angle depending on the rotation of the hinge structure (240). According to one embodiment, the second housing (205) may be fixedly coupled to the first housing (201) or detachably coupled to the hinge structure (240). According to one embodiment, at least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any overlapping descriptions will be omitted below.

[0067] According to one embodiment, the housing (201) may include a back plate (211a) (e.g., the back plate (211a) of FIG. 2) and a side structure (211b) (e.g., the side structure (211b) of FIG. 2) extending from the back plate (211a) in a thickness direction (e.g., the Z-axis direction). In one embodiment, the side structure (211b) may be manufactured as a separate component from the back plate (211a) and may be combined with the back plate (211a) to form the housing (201). In one embodiment, the side structure (211b) and the back plate (211a) may be manufactured and formed as an integral component. Although not shown, the housing (201) may further include a support member (not shown) that isolates the display (220) (e.g., display panel (223)) from the space housing the printed circuit board (203) or the battery (204), and the support member may be in the form of a flat plate formed integrally with the side structure (211b). In the embodiments described below, the rear plate (211a) of FIG. 4 and the rear plate (211a) of FIG. 3 may be interpreted as being substantially the same.

[0068] According to one embodiment, the back plate (211a) and / or the side structure (211b) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. For example, the housing (201) may at least partially include an electrically conductive material. In one embodiment, when the back plate (211a) includes an electrically conductive material, the housing (201) may be utilized as a structure that provides an electromagnetic shielding structure at least partially. In one embodiment, when the side structure (211b) includes an electrically conductive material, at least a portion of the side structure (211b) may be utilized as a radiating conductor that transmits and receives wireless radio waves. In one embodiment, when a support member (not shown) is disposed between the printed circuit board (203) and the display panel (223), and the support member includes an electrically conductive material, the support member may provide a ground conductor or an electromagnetic shielding structure of the electronic device (101).

[0069] According to one embodiment, a printed circuit board (203) disposed as a first circuit board or a main circuit board may have a processor, a memory, and / or an interface disposed thereon. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the processor or the communication module may be mounted on an electronic component (255), such as an integrated circuit chip, and disposed on the printed circuit board (203). For example, the electronic component (255) may be disposed on the printed circuit board (203) through a surface mounting process and may perform wireless communication using an antenna (253) and / or a portion of the side structure (211b). According to one embodiment, the electronic device (101) may include a storage device (e.g., memory), such as a hard disk drive (HDD) or a solid state drive (SSD).

[0070] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0071] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0072] According to one embodiment, the battery (204) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (204) may be disposed substantially on the same plane as, for example, the printed circuit board (203). The battery (204) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0073] According to one embodiment, the antenna (253) may be disposed adjacent to an edge, for example, a side structure (211b), within the housing (201). In one embodiment, a plurality of antennas (253) may be arranged at appropriate locations along the edge within the housing (201). In one embodiment, the illustrated antenna (253) may perform millimeter wave (mmWave) communication using a frequency of several tens of GHz or more. In one embodiment, although not illustrated, the electronic device (101) may further include a flat antenna disposed between the back plate (211a) and the battery (204). The flat antenna may include a wire or a printed circuit pattern arranged in a plane to form a loop structure and may function as, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the flat antenna may be capable of performing short-range communication with an external device or wirelessly transmitting and receiving power required for charging.

[0074] According to one embodiment, the display (220) may include a window plate (221) (e.g., the front plate (202) of FIG. 2 or FIG. 3) and a display panel (223). The display panel (223) is disposed on the inner surface of the window plate (221) and may output visual information by utilizing substantially the entire area of ​​the window plate (221).

[0075] According to one embodiment, the electronic device (101) may include a plurality of through holes (213, 217) formed to penetrate the side structure (211b). Among the plurality of through holes (213, 217), the first through hole (213)(s) may be utilized as a path for outputting sound. For example, the audio module of FIG. 2 or FIG. 3 may include the first through hole (213). In one embodiment, the electronic device (101) may include at least one speaker module (251) positioned at a position corresponding to the first through holes (213), and the speaker module (251) may output sound to the outside of the electronic device (101) through the first through hole (213)(s). Among the plurality of through holes (213, 217), the receiving hole (217)(s) may provide a space for installing an input device, for example, a key input device (218) of FIG. 2 or 3. In one embodiment, some of the plurality of through holes (213, 217) may be utilized as slots or connector holes for receiving a storage medium, and, depending on the embodiment, additional slots and / or connector holes may be formed to penetrate the side structure (211b).

[0076] FIG. 5 is a partial perspective view of an electronic device according to an embodiment of the present disclosure, taken along the P portion of FIG. 3. FIG. 6 is a partial perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 7 is a partial cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0077] Referring to FIGS. 5 to 7 , in one embodiment, an electronic device (101) may include a housing (301) and a conductive pin assembly (302) including conductive pin(s) (350) (e.g., pogo pins). In FIGS. 5 to 7 , the illustration of electrical / electronic component(s) of the electronic device (101), such as a display (e.g., display (220) of FIG. 4 ) disposed on the front surface (e.g., first surface (210A) of FIG. 2 ) of the electronic device (101) or a battery (e.g., battery (204) of FIG. 4 ) disposed inside the housing (301) may be omitted.

[0078] In one embodiment, the housing (301) may provide a mounting space for electrical / electronic components (e.g., a battery (304) of FIG. 4). According to one embodiment, the housing (301) may include a side structure (311b) forming a side surface (310C) of the electronic device (101) (e.g., a side structure (211b) of FIGS. 2 to 4). According to one embodiment, the housing (301) may include a back plate (311a) facing a second surface (or back surface) (310B) of the electronic device (101) (e.g., a back plate (211a) of FIG. 4). For example, the side structure (311b) and the back plate (311a) of the housing (301) may be formed or manufactured integrally or may be connected to each other. Referring to FIG. 7, according to one embodiment, a housing (301) may include a first region (301a) of conductive material (e.g., metal) and a second region (301b) of non-conductive material (e.g., polymer) that form at least a portion of the exterior of an electronic device (e.g., the electronic device (101) of FIGS. 2 to 4). For example, the first region (331) and the second region (332) may be manufactured or formed integrally or connected to each other by a process such as insert molding.

[0079] In one embodiment, the housing (301) may include a plurality (e.g., three) of first through holes (315). According to one embodiment, a portion of a conductive pin (350) (e.g., the first portion (351) of FIG. 7) may be received or arranged in each of the first through holes (315) of the housing (301). For example, the plurality of first through holes (315) may be spaced apart from each other and arranged in a single row or multiple rows. Referring to FIG. 5, according to one embodiment, the first through holes (315) may be formed in a side structure (311b) (or side frame) of the housing (301). In the present disclosure, the arrangement of the first through holes (315) formed in the housing (301) may be changed. Referring to FIG. 6, according to one embodiment, the first through hole (315) may be formed in the rear plate (311a) of the housing (301).

[0080] Referring to FIG. 7, in one embodiment, the conductive pin assembly (303) may include a first conductive pin (350), a pin bracket (360) supporting the first conductive pin (350), a circuit board (380) (e.g., a printed circuit board and / or a flexible printed circuit board) to which the first conductive pin (350) is electrically connected, and a waterproof member (370) (or a dustproof member) disposed around the first conductive pin (350).

[0081] According to one embodiment, the conductive pin assembly (303) may include a first side (350a) and a second side (350b) facing in an opposite direction to the first side (350a). For example, the first side (350a) of the first conductive pin (350) may be visually exposed to the outside of the electronic device (e.g., the electronic device (101) of FIGS. 2 to 5 ) or the housing (301) through the first through hole (315). For example, the second side (350b) of the first conductive pin (350) may face one side (e.g., the +Y direction side) of the circuit board (380). For example, the first conductive pin (350) may be electrically connected to the circuit board (380) through the second side (350b), for example, by making direct contact.

[0082] According to one embodiment, the first conductive pin (350) of the conductive pin assembly (303) may include a first portion (351) and a second portion (352). For example, the first portion (351) may have a first surface (350a) disposed thereon, and the second portion (352) may have a second surface (350b) disposed thereon. In the present disclosure, the first conductive pin (350) is described as being divided into the first portion (351) and the second portion (352) for convenience of description, but the first portion (351) and the second portion (352) may be formed or manufactured integrally with each other. At least a portion of the first portion (351) may be accommodated or disposed in the first through hole (315). For example, a portion of the first portion (351) may be disposed inside the housing (301). The second portion (352) or a majority of the second portion (352) may be disposed inside the housing (301). For example, a portion of the second portion (352) may be accommodated or disposed in the first through hole (315).

[0083] According to one embodiment, the second part (352) of the first conductive pin (350) may include a base part (352a) disposed on the pin bracket (360) and a recess (352b) (or undercut region) disposed between the base part (352a) and the first part (351). According to one embodiment, a portion of the waterproofing member (370) may be received or disposed in the recess (352b) of the first conductive pin (350). According to one embodiment, the recess (352b) of the first conductive pin (350) may have a recessed shape in which a portion of a side surface of the first conductive pin (350) extending between the first surface (350a) and the second surface (350b) is recessed. According to one embodiment, the width of the recess (352b) of the first conductive pin (350) (d2 in FIGS. 9 and 10) may be smaller than the width of the first portion (351) (d3 in FIG. 10) and / or the width of the base portion (352a) (d4 in FIG. 10). For example, according to the recess (352b) of the first conductive pin (350), the contact area between the first conductive pin (350) and the waterproof member (370) may be increased compared to a case where a recess for receiving a portion of the waterproof member (370) is not formed in the first conductive pin (350). For example, according to the recess (352b) of the first conductive pin (350), the degree of sealing or airtightness between the first conductive pin (350) and the housing (301) by the waterproof member (370) can be improved compared to a case where the recess for receiving a part of the waterproof member (370) is not formed in the first conductive pin (350). According to one embodiment, the first conductive pin (350) can include a first coupling structure (3521) formed in the base portion (352a). According to one embodiment, the first coupling structure (3521) can be formed to be engaged with the second coupling structure (3611) of the pin bracket (360).

[0084] In one embodiment, the pin bracket (360) of the conductive pin assembly (303) can support other components (e.g., the first conductive pin (350), the waterproof member (370), and / or the circuit board (380)) of the conductive pin assembly (303). In one embodiment, the pin bracket (360) can include a receiving hole (361) formed through a portion of the pin bracket (360) to receive a portion (e.g., the base portion (352a)) of a second portion (352) of the first conductive pin (350). In one embodiment, the pin bracket (360) can include a second coupling structure (3611) formed on a surface of the receiving hole (361). In one embodiment, the second coupling structure (3611) can be formed to engage with the first coupling structure (3521) of the first conductive pin (350). According to one embodiment, the first conductive pin (350) and the pin bracket (360) may include a first coupling structure (3521) and a second coupling structure (3611) formed on surfaces facing each other, respectively.

[0085] According to one embodiment, the first coupling structure (3521) of the first conductive pin (350) and the second coupling structure (3611) of the pin bracket (360) may include interlocking protrusions (e.g., protrusions and / or recesses). Referring to FIG. 7, the first coupling structure (3521) may include a recessed portion, and the second coupling structure (3611) may include a convex portion that engages the recessed portion. In the present disclosure, the shapes of the first coupling structure (3521) and the second coupling structure (3611) may be changed. For example, the first coupling structure (3521) may include a single convex portion, a plurality of recessed portions, and / or a plurality of convex portions. For example, the second coupling structure (3611) formed to be interlocked with the first coupling structure (3521) may include a single concave portion, a plurality of concave portions and / or a plurality of convex portions, depending on the embodiment. For example, according to the first coupling structure (3521) of the first conductive pin (350) and the second coupling structure (3611) of the pin bracket (360), the degree of sealing or airtightness of the coupling portion of the first conductive pin (350) and the pin bracket (360) may be improved compared to a case where a coupling structure in the form of a protrusion and / or a concave portion is not formed between the first conductive pin (350) and the pin bracket (360).

[0086] According to one embodiment, the waterproofing member (370) (or dustproofing member) of the conductive pin assembly (303) may be disposed between the housing (301) and the pin bracket (360) and / or between the housing (301) and the conductive pin (350). According to one embodiment, the waterproofing member (370) may be disposed to cover the joint portion of the pin bracket (360) (e.g., the receiving hole (361)) and the conductive pin (350) (e.g., the base portion (352a)). For example, when viewed in one axial direction (e.g., the Y-axis direction) that is the direction in which the first through hole (315) penetrates the housing (310) or the longitudinal direction of the first conductive pin (350), the waterproofing member (370) may overlap the joint portion of the pin bracket (360) (e.g., the receiving hole (361)) and the conductive pin (350) (e.g., the base portion (352a)). According to one embodiment, the waterproof member (370) of the conductive pin assembly (303) can prevent foreign substances such as moisture or dust that have penetrated through the gap between the housing (301) and the first conductive pin (350) from penetrating into the circuit board (380) through the joint gap between the pin bracket (360) and the first conductive pin (350). For example, the waterproof member (370) can provide a waterproof / dustproof environment to the circuit board (380) within the housing (301). For example, the waterproof member (370) can prevent foreign substances such as moisture or dust that have penetrated through the gap between the housing (301) and the first conductive pin (350) from penetrating into electric / electronic components such as a main circuit board (e.g., a printed circuit board (203) of FIG. 4) of an electronic device (e.g., an electronic device (101) of FIGS. 2 to 4) disposed within the housing (301).

[0087] According to one embodiment, a waterproof member (370) may be disposed on one side (e.g., the +Y direction side) of the pin bracket (360), and a circuit board (360) may be disposed on the opposite side (e.g., the -Y direction side). For example, the circuit board (380) may face the waterproof member (370) with the conductive pin (350) and / or the pin bracket (360) interposed therebetween.

[0088] FIG. 8 is a perspective view of a conductive pin assembly according to one embodiment of the present disclosure. FIG. 9 is an exploded perspective view of a conductive pin assembly according to one embodiment of the present disclosure. FIG. 10 is a cross-sectional side view of a conductive pin assembly according to one embodiment of the present disclosure taken along line A-A' of FIG. 8.

[0089] The conductive pin assembly (302) of FIGS. 8 to 10 may be referred to as the conductive pin assembly (302) of FIG. 7.

[0090] Referring to FIGS. 8 to 10 , the conductive pin assembly (302) may include a plurality (e.g., three) of first conductive pins (350) spaced apart from each other (e.g., the first conductive pins (350) of FIGS. 5 to 7 ). Referring to FIGS. 8 to 10 , according to one embodiment, the waterproof member (370) of the conductive pin assembly (302) (e.g., the waterproof member (370) of FIG. 7 ) may be integrated with the conductive pin (350).

[0091] Referring to FIG. 9, a pin bracket (360) (e.g., the pin bracket (360) of FIG. 7) may include a first bracket surface (360a) facing a side wall or inner surface (e.g., a -Y direction surface) of a housing (e.g., the housing (301) of FIG. 7) and a second bracket surface (360b) opposite the first bracket surface (360a). According to one embodiment, a waterproof member (370) may be disposed on the first bracket surface (360a) of the pin bracket (360), and a circuit board (380) may be disposed on the second bracket surface (360b) of the pin bracket (360). According to one embodiment, the pin bracket (360) may include a receiving hole (361). The receiving hole (361) may be formed penetrating from the first bracket face (360a) to the second bracket face (360b) of the pin bracket (360). The pin bracket (360) may include a plurality of receiving holes (361) spaced apart from each other. A portion of the first conductive pin (350) (e.g., the base portion (352a) of FIGS. 7 and 10) may be placed in the receiving hole (361) of the pin bracket (360). For example, the pin bracket (360) may be formed of a non-conductive material such as a polymer. For example, the pin bracket (360) may be formed or manufactured integrally with the first conductive pin (350), and may be manufactured by, for example, injection molding (e.g., insert molding).

[0092] Referring to FIGS. 8 and 9, in one embodiment, the waterproof member (370) of the conductive pin assembly (302) may include a pin hole (371), a mounting portion (372) around the pin hole (371), and a connecting portion (373). According to one embodiment, the pin hole (371) of the waterproof member (370) may be formed so that a first conductive pin (350) passes through the inside thereof. According to one embodiment, the pin hole (371)(s) of the waterproof member (370) may be formed to penetrate at a position corresponding to a position of the first conductive pin (350)(s). For example, the conductive pin assembly (302) may include a plurality of spaced apart first conductive pins (350), a plurality of pin holes (371) in which the first conductive pins (350) are received, and a plurality of mounting portions (372) around the pin holes (371).

[0093] In one embodiment, when the waterproof member (370) is connected, coupled, or integrated with the first conductive pin (350), the mounting portion (372) of the waterproof member (370) may surround a portion (e.g., the second portion (352)) of the first conductive pin (350). In one embodiment, the mounting portion (372) of the waterproof member (370) may be disposed on or around the recess (352b) of the first conductive pin (350). For example, the mounting portion (372) of the waterproof member (370) may be formed or manufactured to fit the shape of the recess (352b) of the first conductive pin (350), or may be deformed to fit the shape of the recess (352b) when the waterproof member (370) is connected, coupled, or integrated with the first conductive pin (350). According to one embodiment, the connecting portion (373) of the waterproof member (370) can connect two adjacent securing portions (372). For example, the height of the connecting portion (373) (e.g., the height in the Y-axis direction of FIG. 10) can be set to be less than or equal to the height of the securing portion (372) (e.g., the height in the Y-axis direction).

[0094] According to one embodiment, when the conductive pin assembly (302) is disposed within a housing (e.g., the housing (301) of FIG. 7), the waterproofing member (370) may be disposed between the second portion (352) of the first conductive pin (350) and the housing (301) or between the pin bracket (360) and the housing (301). In the present disclosure, the shape and arrangement of the waterproofing member (370) may be changed. For example, when the conductive pin assembly (302) is disposed within the housing (301), a portion of the waterproofing member (370) may also be disposed between the first portion (351) of the first conductive pin (350) and the first through hole (e.g., the first through hole (315) of FIGS. 7, 11, and 12) of the housing (301).

[0095] Referring to FIGS. 8 to 10, according to one embodiment, the waterproof member (370) may be connected, coupled, or integrated with the first conductive pin (350). According to one embodiment, the waterproof member (370) may be fitted into the first conductive pin (350) in the direction of the arrow in FIG. 9. Referring to FIG. 10, according to one embodiment, the width of the pin hole (371) of the waterproof member (370) (e.g., d1 in FIGS. 9 and 10) may be smaller than the width of the first portion (351) of the first conductive pin (350) (e.g., d3 in FIG. 10). According to one embodiment, the waterproof member (370) may be made or formed of a flexible and elastic material (e.g., a polymer or rubber). For example, the anchoring portion (372) of the waterproof member (370) can be elastically deformed when fitted into the first part (351) of the first conductive pin (350), and the anchoring portion (372) can be restored to its original shape while being anchored into the recess (352b) of the first conductive pin (350).

[0096] According to one embodiment, referring to FIG. 10, the width of the pin hole (371) of the waterproof member (370) (e.g., d1 in FIGS. 9 and 10) may be substantially the same as the width of the recess (352b) of the first conductive pin (350) (e.g., d2 in FIG. 10) or less than or equal to the width of the recess (352b) (e.g., d2 in FIG. 10). For example, if the waterproof member (370) is an elastic body, the width of the pin hole (371) (e.g., the X-axis direction width or d1 in FIGS. 9 and 10) may increase after the waterproof member (370) is coupled to the first conductive pin (350) compared to before the waterproof member (370) is coupled to the first conductive pin (350). For example, when the width of the pin hole (371) of the waterproof member (370) (e.g., d1 in FIGS. 9 and 10) is less than or equal to the width (d2) of the recess (352b), the bonding force and airtightness between the waterproof member (370) and the first conductive pin (350) can be ensured after the waterproof member (370) is coupled to the first conductive pin (350). For example, the width of the pin hole (371) of the waterproof member (370) (e.g., d1 in FIGS. 9 and 10) can be smaller than the width of the base (352a) of the first conductive pin (350) (e.g., d4 in FIG. 10).

[0097] In the present disclosure, the waterproof member (370) may be manufactured separately from the first conductive pin (350) as described above and connected to the first conductive pin (350), but may also be formed or manufactured integrally with the first conductive pin (350). For example, it may be formed by injection molding (e.g., insert molding) into the first conductive pin (350).

[0098] According to one embodiment, a circuit board (e.g., circuit board (380) of FIG. 7) of a conductive pin assembly (302) may include a printed circuit board (381) coupled to one side (e.g., second bracket side (360b)) of a pin bracket (360) and a flexible circuit board (382) electrically connected to a main circuit board (e.g., printed circuit board (204) of FIG. 4) of an electronic device (e.g., electronic device (101) of FIGS. 1 to 4)).

[0099] FIG. 11 is a side cross-sectional view illustrating a conductive pin assembly according to one embodiment of the present disclosure. FIG. 12 is a side cross-sectional view illustrating a conductive pin assembly according to one embodiment of the present disclosure.

[0100] All or part of the configuration of the conductive pin assembly (302) of FIGS. 11 and 12 may be identical to or similar to the configuration of the conductive pin assembly (302) of FIGS. 7 to 10. The pin bracket (360) and the circuit board (380) of the conductive pin assembly (302) of FIGS. 11 and 12 may be referred to as the pin bracket (360) and the circuit board (380) of FIGS. 7 to 10. The conductive pin assembly (302) of the embodiment of FIG. 11 may have a configuration of a waterproof member (370) that is partially different from that of the conductive pin assembly (302) of the embodiments of FIGS. 7 to 10. The conductive pin assembly (302) of the embodiment of Fig. 12 may differ from the conductive pin assembly (302) of the embodiments of Figs. 7 to 10 in the configuration of the waterproof member (370) and the first conductive pin (350). Hereinafter, the embodiments of Figs. 11 and 12 may be described mainly with respect to the differences from the embodiments of Figs. 7 to 10, and the above-described contents may not be described repeatedly.

[0101] Referring to FIG. 11, in one embodiment, when the conductive pin assembly (302) is disposed within the housing (301), the waterproofing member (370) may be disposed between the second portion (352) of the first conductive pin (350) and the housing (301) and / or between the pin bracket (360) and the housing (301). When the conductive pin assembly (302) is disposed within the housing (301), the waterproofing member (370) may be disposed between the first portion (351) of the first conductive pin (350) and the first through hole (315) of the housing (301). In other words, the waterproofing member (370) may be disposed to close an assembly gap between the first portion (351) of the first conductive pin (350) and the first through hole (315) of the housing (301). According to one embodiment, foreign substances such as moisture or dust that may penetrate from the outside of an electronic device (e.g., an electronic device (101) of FIGS. 1 to 4) into the gap between the first portion (351) and the surface of the first through hole (315) can be effectively blocked by a waterproof member (370) disposed in the gap.

[0102] Referring to FIG. 12, in one embodiment, the first conductive pin (350) may include a base portion (352a) and a plurality (e.g., two) of recesses (352c, 352d) formed in a second portion (352) (e.g., the second portion (352) of FIGS. 7, 9, and 10). According to one embodiment, the base portion (352a) of the first conductive pin (350) may be disposed in a pin bracket (360) (e.g., the receiving hole (361) of FIG. 9). According to one embodiment, the first conductive pin (350) may include a first recess (352c) and a second recess (352d) having a step with respect to each other. For example, the first recess (352c) and the second recess (352d) may be positioned between the first portion (351) and the base portion (352a) of the first conductive pin (350). For example, the second recess (352d) may be formed between the first recess (352c) and the first portion (351). For example, the width of the first recess (352c) (e.g., t1 in FIG. 12) may be smaller than the width of the second recess (352d) (e.g., t2 in FIG. 12). For example, the width of the first recess (352c) (e.g., t1 in FIG. 12) and the width of the second recess (352d) (e.g., t2 in FIG. 12) may be smaller than the width of the first portion (351) (e.g., d3 in FIG. 12).

[0103] According to one embodiment, when the first conductive pin (350) includes a first recess (352c) and a second recess (352d) having a step with respect to each other, the contact area with the waterproof member (370) and the receiving space of the waterproof member (370) can be expanded compared to the case where the first conductive pin (350) includes a recess formed without a step (e.g., the recess (352b) of FIG. 7), and accordingly, the degree of sealing or airtightness between the first conductive pin (350) and the housing (301) by the waterproof member (370) can be improved. However, in the present disclosure, the shapes of the first recess (352c) and the second recess (352d) of the first conductive pin (350) are not limited and may be changed. As an example, the width of the first recess (352c) (e.g., t1 in FIG. 12) may be greater than the width of the second recess (352d) (e.g., t2 in FIG. 12). For example, the first conductive pin (350) may further include an additional recess having a step from the first recess (352c) and the second recess (352d).

[0104] However, the challenges addressed by this disclosure are not limited to the aforementioned challenges, and may be determined in various ways without departing from the spirit and scope of this disclosure. The benefits achieved by this disclosure are not limited to the aforementioned benefits, and various benefits may be provided, directly or indirectly, through this document.

[0105] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (301) including a first through hole (315), a first conductive pin (350) including a first portion (351) at least partially disposed in the first through hole and a second portion (352) extending from the first portion into the interior of the housing, a pin bracket (360) spaced apart from the housing and including a receiving hole (361) in which a portion of the second portion of the first conductive pin is disposed, a circuit board (380) disposed on one side of the pin bracket and electrically connected to the first conductive pin, and a waterproof member (370). At least a portion of the waterproof member may be disposed between a coupling portion of the receiving hole of the pin bracket and the second portion of the conductive pin, and a surface of the housing facing the coupling portion. The second portion of the first conductive pin may include a recess (352b) formed in at least a portion of the second portion so that a portion of the waterproof member is secured thereto.

[0106] According to one embodiment, the second portion of the first conductive pin may further include a first connection structure (3521) formed on one surface of the second portion facing the surface of the receiving hole (361).

[0107] According to one embodiment, the second portion further includes a base portion (352a) disposed in the receiving hole, and a width (d2, t1, t2) of the recess may be smaller than a width (d4, t4) of the base portion and a width (d3, t3) of the first portion.

[0108] According to one embodiment, the pin bracket (360) may include a second connection structure (3611) formed to be engaged with the first connection structure (3521) of the first conductive pin on the surface of the receiving hole (361).

[0109] According to one embodiment, the first connecting structure and the second connecting structure may include at least one of a concave portion or a convex portion.

[0110] According to one embodiment, at least a portion of the waterproof member may be disposed between a joining portion of the first connecting structure of the first conductive pin and the second connecting structure of the pin bracket and a surface of the housing facing the joining portion.

[0111] According to one embodiment, the pin bracket may include a first bracket face (360a) on which the waterproof member is disposed and a second bracket face (360b) facing in the opposite direction from the first bracket face and on which the circuit board is disposed.

[0112] According to one embodiment, the receiving hole may be formed penetrating from the first bracket surface to the second bracket surface.

[0113] In one embodiment, a portion of the waterproof member may be disposed between the pin bracket and the housing or between the first conductive pin and the housing.

[0114] In one embodiment, a portion of the waterproof member may be disposed between a surface of the first through hole and a first portion of the first conductive pin.

[0115] According to one embodiment, the recess may include a first recess and a second recess positioned between the first recess and the first portion, wherein the second recess may be formed to have a step with respect to the first recess.

[0116] According to one embodiment, the conductive pin may be provided as a plurality of conductive pins spaced apart from each other. The waterproof member may include a plurality of pin holes in which the conductive pins are positioned.

[0117] According to one embodiment, the waterproof member may be formed of a material capable of elastic deformation.

[0118] According to one embodiment, the first conductive pin may include a first surface (250a) that is visually exposed to the outside of the electronic device through the first through hole, and a second surface (250b) that faces the circuit board and faces in an opposite direction to the first surface through the receiving hole.

[0119] According to one embodiment, the housing may further include a main circuit board disposed inside the housing and a flexible circuit board electrically connected to the circuit board and the main circuit board.

[0120] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (301) including a first through hole (315), a first conductive pin (350) including a first portion (351) at least partially disposed in the first through hole and a second portion (352) extending from the first portion into the interior of the housing, a pin bracket (360) spaced apart from the housing and including a receiving hole (361) in which a portion of the second portion of the first conductive pin is disposed, a circuit board (380) disposed on one side of the pin bracket and electrically connected to the first conductive pin, and a waterproof member (370). The second part of the first conductive pin may further include a first connection structure (3521) formed on one surface of the second part facing the surface of the receiving hole (361), and the pin bracket (360) may further include a second connection structure (3611) formed on the surface of the receiving hole (361) to be engaged with the first connection structure (3521).

[0121] According to one embodiment, the second portion of the first conductive pin may include a recess (352b) formed in at least a portion of the second portion to allow a portion of the waterproof member to be seated therein.

[0122] According to one embodiment, the second portion may further include a base portion (352a) disposed in the receiving hole. The width (d2, t1, t2) of the recess may be smaller than the width (d4, t4) of the base portion and the width (d3, t3) of the first portion.

[0123] According to one embodiment, at least a portion of the waterproof member may be disposed between a joining portion of the first connecting structure of the first conductive pin and the second connecting structure of the pin bracket and a surface of the housing facing the joining portion.

[0124] In one embodiment, a portion of the waterproof member may be disposed between a surface of the first through hole and a first portion of the first conductive pin.

[0125] The conductive pin assembly of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0126] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0127] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0128] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0129] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0130] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0131] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0132] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (301) including a first through hole (315); A first conductive pin (350) comprising a first portion (351) at least partially disposed in the first through hole and a second portion (352) extending from the first portion into the interior of the housing; A pin bracket (360) including a receiving hole (361) spaced apart from the housing and in which a part of the second portion of the first conductive pin is disposed; A circuit board (380) arranged on one side of the pin bracket and electrically connected to the first conductive pin; and As a waterproof member (370), at least a portion of the waterproof member is disposed between the receiving hole of the pin bracket and the joining portion of the second portion of the conductive pin and one side of the housing facing the joining portion, An electronic device, wherein the second portion of the first conductive pin includes a recess (352b) formed in at least a portion of the second portion so that a portion of the waterproof member is secured therein.

2. In paragraph 1, An electronic device, wherein the second part of the first conductive pin further includes a first connection structure (3521) formed on one surface of the second part facing the surface of the receiving hole (361).

3. In paragraph 2, An electronic device, wherein the second portion further includes a base portion (352a) arranged in the receiving hole, and the width (d2; t1; t2) of the recess is smaller than the width (d4; t4) of the base portion and the width (d3; t3) of the first portion.

4. In paragraph 2 or 3, An electronic device in which the pin bracket (360) includes a second connection structure (3611) formed to be engaged with the first connection structure (3521) of the first conductive pin on the surface of the receiving hole (361).

5. In paragraph 4, An electronic device, wherein the first connection structure and the second connection structure include at least one of a concave portion and a convex portion.

6. In paragraph 4 or 5, An electronic device, wherein at least a portion of the waterproof member is disposed between a joining portion of the first connecting structure of the first conductive pin and the second connecting structure of the pin bracket and a surface of the housing facing the joining portion.

7. In any one of paragraphs 1 to 6, An electronic device, wherein the pin bracket includes a first bracket face (360a) on which the waterproof member is arranged and a second bracket face (360b) facing in the opposite direction to the first bracket face and on which the circuit board is arranged.

8. In paragraph 7, An electronic device wherein the receiving hole is formed penetrating from the first bracket surface to the second bracket surface.

9. In any one of paragraphs 1 to 8, An electronic device, wherein a portion of the waterproof member is disposed between the pin bracket and the housing or between the first conductive pin and the housing.

10. In any one of paragraphs 1 to 9, An electronic device, wherein a portion of the waterproof member is disposed between a surface of the first through hole and a first portion of the first conductive pin.

11. In any one of paragraphs 1 to 10, An electronic device wherein the recess includes a first recess and a second recess positioned between the first recess and the first portion, the second recess being formed to have a step with respect to the first recess.

12. In any one of paragraphs 1 to 11, The above-mentioned conductive pin is provided as a plurality of conductive pins spaced apart from each other, An electronic device, wherein the waterproof member includes a plurality of pin holes in which the conductive pins are positioned.

13. In any one of paragraphs 1 to 12, An electronic device wherein the waterproof member is formed of a material capable of elastic deformation.

14. In any one of paragraphs 1 to 13, An electronic device, wherein the first conductive pin comprises a first surface (250a) that is visually exposed to the outside of the electronic device through the first through hole; and a second surface (250b) that faces the circuit board and is exposed to one side of the bracket through the receiving hole and faces the circuit board in a direction opposite to the first surface.

15. In any one of paragraphs 1 to 14, a main circuit board arranged inside the housing; and An electronic device further comprising a flexible circuit board electrically connected to the circuit board and the main circuit board.

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