Plug, package for housing electronic component comprising same, and electronic module

Abstract

This plug comprises a metal body, an insulator, and a conductor pin. The metal body has a first surface, a second surface on the opposite side from the first surface, and a first through-hole penetrating from the first surface to the second surface. The insulator is located in the first through-hole. The insulator has a third surface positioned on the first surface side, a fourth surface on the opposite side from the third surface, and a second through-hole penetrating from the third surface to the fourth surface. The conductor pin is positioned in the second through-hole and protrudes from at least the third surface. The metal body further has a first groove portion that is positioned on the first surface. The first groove portion is positioned with a gap between the first groove portion and a first outer edge of the metal body.

Description

Plug, electronic component storage package including same, and electronic module

[0001] The present disclosure relates to a plug, and an electronic component storage package and an electronic module equipped with the plug.

[0002] A prior art coaxial connector is described, for example, in US Pat. No. 6,249,999.

[0003] Japanese Patent Application Laid-Open No. 2004-320067

[0004] In one embodiment (1), the plug includes a metal body, an insulator, and a conductive pin. The metal body has a first surface, a second surface opposite the first surface, and a first through hole penetrating from the first surface to the second surface. The insulator is located in the first through hole. The insulator has a third surface located on the first surface side, a fourth surface opposite the third surface, and a second through hole penetrating from the third surface to the fourth surface. The conductive pin is located in the second through hole and protrudes from at least the third surface. The metal body further has a first groove portion located in the first surface. The first groove portion is located with a gap between it and a first outer edge of the metal body.

[0005] (2) In the plug described in (1) above, the first groove portion is located along the first outer edge.

[0006] (3) In the plug described in (1) or (2) above, in a plan view, the distance L1 from the insulator to the first outer edge of the metal body is greater than the distance L2 from the conductive pin to the second outer edge of the insulator.

[0007] (4) In the plug described in (1) to (3) above, the first groove portion is ring-shaped in plan view.

[0008] (5) In the plug described in (1) to (4) above, the metal body has a side surface and an inclined surface. The side surface connects the first surface and the second surface. The inclined surface is inclined from the second surface to the side surface.

[0009] (6) In the plug described in (1) to (5) above, when the direction in which the conductor pin extends is defined as a first direction, the dimension by which the conductor pin protrudes from the third surface in the first direction is equal to or greater than the dimension by which the conductor pin protrudes from the fourth surface in the first direction.

[0010] (7) In the plug described in (1) to (6) above, the metal body has a disk shape in a plan view.

[0011] (8) In the plug described in (1) to (7) above, the width of the first groove portion decreases from the first surface toward the second surface in a cross-sectional view.

[0012] (9) In the plug described in (3) to (8) above, in plan view, a distance L3 from the first groove to the first outer edge is smaller than a distance L4 from the second outer edge to the first groove.

[0013] (10) In the plug described in (1) to (9) above, the third surface is recessed inward.

[0014] (11) In the plug described in (4) above, the metal body has one or more second grooves spaced apart from the first grooves.

[0015] (12) In one embodiment, an electronic component storage package includes the plug according to any one of (1) to (11) above, and a box. The box has a first recess in which the plug is located, and a third through-hole connected to the first recess and through which the conductor pin passes. The first recess has a first bottom surface in contact with the second surface.

[0016] (13) In the electronic component storage package described in (12), the box further includes a second recess located on the first bottom surface, the second recess being spaced apart from the insulator, and the diameter of the second recess being smaller than the diameter of the first recess and larger than the diameter of the insulator and the diameter of the third through hole.

[0017] (14) In the electronic component storage package according to (12) or (13), the box further includes a third recess that is continuous with the first recess and is located on the opposite side of the third through-hole. The third recess has a second bottom surface where the first recess is located. The third recess is larger than the first recess. The first surface is located outward from the second bottom surface in a plan view.

[0018] (15) The electronic component storage package according to (14) further includes a bonding material positioned between the box body and the plug. The box body further includes a step portion that connects the third recess and the first recess and is positioned on the second bottom surface. The bonding material is positioned from between the first recess and the plug to the step portion.

[0019] (16) The electronic component storage package according to any one of (12) to (15) above further comprises a receptacle that engages with the conductive pin and contacts the first surface.

[0020] (17) In one embodiment, an electronic module includes an electronic component storage package according to any one of (12) to (16) above, an electronic component housed in a box, and a lid located on the box.

[0021] 6 is a perspective view of a plug according to an embodiment. FIG. 7 is a perspective view of a plug according to an embodiment, seen from another angle. FIG. 8 is an exploded perspective view of an electronic component storage package and an electronic module according to an embodiment. FIG. 9 is a plan view of a plug and an electronic component storage package according to an embodiment. FIG. 10 is a view in which the plug is omitted from the view shown in FIG. 4. FIG. 11 is a view in which the electronic component mounting package shown in FIG. 4 is cut along line VI-VI. FIG. 12 is an enlarged view of a main part A shown in FIG. 6. FIG. 13 is a perspective view of a plug according to another embodiment.

[0022] In the invention described in Patent Document 1, in order to reduce impedance fluctuations, it is required to press the coaxial cable and the cylindrical fixing member (which may be collectively referred to as a receptacle) against the coaxial connector (also referred to as a plug) to bring them into contact, thereby reducing the gap between the coaxial connector. For this reason, there is a need for a plug that can reduce the possibility of breakage even when pressed against the receptacle.

[0023] <Configuration of Plug> Several exemplary embodiments will be described below with reference to the drawings. Note that although either direction of the plug may be considered to be up or down, for convenience, a Cartesian coordinate system xyz is defined, with the positive side of the z direction being considered to be up. In addition, in this disclosure, the concept of planar view includes planar perspective view.

[0024] 1 and 2, the plug 10 includes a metal body 1, an insulator 2, and a conductor pin 3. In the present disclosure, the plug 10 may also be referred to as, for example, a coaxial connector or a launcher, and refers to a component that is mated with a receptacle 6 described below.

[0025] The metal body 1 has a first surface 11s, a second surface 12s opposite the first surface 11s, and a first through-hole 1o penetrating from the first surface 11s to the second surface 12s. In a plan view, the metal body 1 may be rectangular or disk-shaped. Here, the first surface 11s can be defined as the surface that comes into contact with a receptacle 6 (described later). The second surface 12s can be defined as the surface that faces a wall body 46 (described later).

[0026] The disk shape referred to here may be any shape in which the first outer edge 11e is circular, including an elliptical shape, and is not necessarily limited to a shape in which the first outer edge 11e is a perfect circle. If the metal body 1 is circular, the metal body 1 can be easily manufactured by, for example, cutting. Furthermore, the receptacle 6 can press the metal body 1, thereby reducing the force applied to the metal body 1.

[0027] In one embodiment, the shape of the first through hole 1o is circular in a plan view, but the shape of the first through hole 1o may be polygonal, for example. When the shape of the first through hole 1o is circular, it is easy to manufacture the first through hole 1o by processing the metal body 1.

[0028] In one embodiment, the first through hole 1o may at least partially overlap with the central portion of the metal body 1. With this configuration, it is possible to easily manufacture the first through hole 1o by processing the metal body 1.

[0029] When the metal body 1 is disk-shaped, the diameter of the metal body 1 is, for example, 1.0 mm or more and 5.0 mm or less. The height of the metal body 1 (i.e., the dimension in the x-direction) may be, for example, 0.5 mm or more and 3.0 mm or less. When the shape of the first through hole 1o is circular in a plan view, the diameter of the first through hole 1o is, for example, 0.25 mm or more and 1.5 mm or less.

[0030] Examples of materials for the metal body 1 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, as well as alloys containing these metal materials. The metal body 1 may also be a single metal plate or a laminate of multiple metal plates. When the metal body 1 is made of any of the above metal materials, a plating layer of nickel, gold, or the like may be formed on the surface of the metal body 1 using electroplating or electroless plating to reduce oxidation corrosion. The metal body 1 may also be referred to as a component commonly called a flange.

[0031] The insulator 2 is located in the first through hole 1o. The insulator 2 has a third surface 23s located on the first surface 11s side, a fourth surface 24s opposite the third surface 23s, and a second through hole 2o penetrating from the third surface 23s to the fourth surface 24s. Here, the second through hole 2o may be formed by inserting a conductor pin 3 (described later) into the insulator 2 before hardening.

[0032] The material of the insulator 2 may be, for example, silica glass containing silicon dioxide (SiO2) as its main component. Here, the term "main component" in this disclosure refers to the component with the highest content, for example, a mass percent concentration of 50% or more. The insulator 2 may be so-called high-melting-point glass or low-melting-point glass. Specifically, low-melting-point glass is amorphous or crystalline glass that softens, deforms, and flows at temperatures between 200°C and 600°C. Crystallizable glass refers to a composite of amorphous glass and crystalline glass. Examples of low-melting point glass that can be used include borosilicate glass, barium borosilicate glass, zinc borate glass, barium borate glass, high silicate glass, aluminophosphate glass, phosphate glass, zinc phosphate glass, alkali glass, bismuth silicate glass, bismuth borosilicate glass, bismuth zinc borate glass, lead borosilicate glass, lead borate glass, potassium lead glass, and crystalline lead glass.

[0033] The conductor pin 3 is located in the second through hole 2o and protrudes from at least the third surface 23s. In other words, the conductor pin 3 does not necessarily have to protrude from the fourth surface 24s. If the conductor pin 3 does not protrude from the fourth surface 24s, it can be electrically connected to the circuit board 5 (described later) with a bonding wire or brazing material. Furthermore, the conductor pin 3 may be located at the center of the first through hole 1o and the center of the second through hole 2o.

[0034] The material of the conductor pin 3 may be any material that is electrically conductive, such as metal materials such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or alloys containing these metal materials. Alternatively, the conductor pin 3 may have a central portion made of copper, the periphery of which may be covered with another metal material (e.g., nickel).

[0035] When the conductor pin 3 has a circular shape in a plan view, the diameter of the conductor pin 3 may be, for example, not less than 0.1 mm and not more than 0.5 mm.

[0036] The metal body 1 further has a first groove 11K located on the first surface 11s. The first groove 11K is located away from the first outer edge 11e. With this configuration, when the metal body 1 is pressed by the receptacle 6, deformation of the metal body 1 in the portion outside the first groove 11K (i.e., in the direction toward the first outer edge 11e) is reduced, and the stress applied to the metal body 1 can be dispersed. This reduces the possibility of damage to the plug 10. In one embodiment, the metal body 1 may have multiple first grooves 11K.

[0037] Furthermore, with the above configuration, the bonding material 7 described below can be accumulated in the first groove portion 11K, thereby reducing the possibility that the bonding material 7 will spread more than necessary on the first surface 11s.

[0038] 4, in the present disclosure, the distance L3 from the first groove portion 11K to the first outer edge 11e may be constant or may vary along the way. When the distance L3 from the first groove portion 11K to the first outer edge 11e is constant, the first groove portion 11K can be easily formed by cutting.

[0039] In a plan view, the width W of the first groove 11K may be constant. With this configuration, the stress applied to the metal body 1 can be distributed relatively uniformly, further reducing the possibility of damage to the plug 10. The width W of the first groove 11K may be, for example, 0.05 mm or more and 0.3 mm or less. Furthermore, the depth of the first groove 11K may be, for example, 0.01 mm or more and 0.25 mm or less. Here, the depth of the first groove 11K may be rephrased as the distance from the first surface 11s to the bottom of the first groove 11K in a cross-sectional view.

[0040] The first groove 11K may be located along the first outer edge 11e. With this configuration, the first groove 11K can be easily formed in the metal body 1 by cutting or the like. Furthermore, with this configuration, stress acting on the metal body 1 outside the first groove 11K can be dispersed relatively uniformly, thereby reducing the possibility of deformation of the metal body 1.

[0041] In the present disclosure, the phrase "the first groove 11K is located along the first outer edge 11 e" may be rephrased as "the shape of the first groove 11K is similar to the shape of the first outer edge 11 e." Furthermore, when the metal body 1 has a circular shape, the phrase "the first groove 11K is located along the first outer edge 11 e" may be rephrased as "the distance L3 from the first groove 11K to the first outer edge 11 e is constant."

[0042] As shown in FIG. 4 , in a plan view, the distance L1 from the insulator 2 to the first outer edge 11e of the metal body 1 is greater than the distance L2 from the conductor pin 3 to the second outer edge 23e of the insulator 2. This configuration can be rephrased as the thickness (dimension in the y or z direction) of the metal body 1 being greater than the thickness (dimension in the y or z direction) of the insulator 2. This configuration increases the contact area between the metal body 1 and the conductive portion 62 of the receptacle 6 (described below). This reduces the stress applied to the entire metal body 1 compared to when the distance L1 from the insulator 2 to the first outer edge 11e of the metal body 1 is smaller than the distance L2 from the conductor pin 3 to the second outer edge 23e of the insulator 2. This reduces the possibility of the metal body 1 being deformed and the insulator 2 being detached from the metal body 1. This also reduces the possibility of the insulator 2 and the conductor pin 3 being deformed or damaged due to deformation of the metal body 1.

[0043] In plan view, the first groove 11K may be ring-shaped. In other words, the first groove 11K does not have to be interrupted. When the plug 10 is joined to the wall body 46 using the joining material 7 described below, the possibility that the joining material 7 will accumulate in the first groove 11K and spread more than necessary on the first surface 11s can be reduced. Furthermore, with the above configuration, the stress applied to the metal body 1 can be dispersed relatively uniformly, further reducing the possibility of damage to the plug 10.

[0044] In a plan view, the distance L3 from the first groove 11K to the first outer edge 11e may be smaller than the distance L4 from the second outer edge 23e to the first groove 11K. This configuration may also be described as the first groove 11K being located closer to the first outer edge 11e than the second outer edge 23e. The first groove 11K only needs to be located closer to the first outer edge 11e than the point where the first surface 11s of the metal body 1 contacts the conductive portion 62. In other words, the first groove 11K does not need to contact the conductive portion 62. This configuration reduces the possibility that the bonding material 7 will spread to the contact point between the first surface 11s and the conductive portion 62. Therefore, stable contact between the receptacle 6 and the first surface 11s of the plug 10 can be achieved. If the bonding material 7 spreads to the position where the conductive portion 62 of the receptacle 6 contacts the first surface 11s, a gap may form at the contact point between the receptacle 6 and the first surface 11s, potentially causing impedance fluctuations, but the configuration described above allows the conductive portion 62 of the receptacle 6 to be more accurately mated with the plug 10. This reduces the possibility of impedance fluctuations occurring due to misalignment between the receptacle 6 and the plug 10.

[0045] More specifically, the distance L4 from the second outer edge 23e to the first groove portion 11K may be 1.2 to 3 times the distance L3 from the first groove portion 11K to the first outer edge 11e.

[0046] The metal body 1 may have a side surface 13s and an inclined surface 14s. Here, the side surface 13s connects the first surface 11s and the second surface 12s. The inclined surface 14s may be inclined from the second surface 12s to the side surface 13s. In other words, the metal body 1 may have a fillet shape on the second surface 12s side. With this configuration, when the metal body 1 is pressed by the receptacle 6, the metal body 1 may collide with a first recess 41 (described below), reducing the possibility of damage to the metal body 1 and / or the wall 46. The side surface 13s can be defined as the surface facing the inner wall surface of the first recess 41 when the plug 10 is positioned in the first recess 41.

[0047] 7 , the bonding material 7 can be accumulated between the first recess 41 and the inclined surface 14s, thereby improving the bonding strength between the plug 10 and the wall 46. In one embodiment, the inclined surface 14s is linear in cross section, but may also have a curved shape. More specifically, the inclined surface 14s may have a convex shape in the direction away from the insulator 2.

[0048] As shown in FIGS. 1 and 2 , when the direction in which the conductor pin 3 extends is defined as a first direction, the dimension Lx3 by which the conductor pin 3 protrudes from the third surface 23s in the first direction may be equal to or greater than the dimension Lx4 by which the conductor pin 3 protrudes from the fourth surface 24s in the first direction. Here, the first direction is, for example, the x-direction in the drawings. With the above configuration, when the receptacle 6 is attached, the contact area between the third surface 23s and the conductive portion 62 of the receptacle 6 is increased, thereby reducing the possibility of the receptacle 6 and the plug 10 becoming detached. Furthermore, by making the dimension Lx4 by which the conductor pin 3 protrudes from the fourth surface 24s in the first direction shorter than the dimension Lx3 by which the conductor pin 3 protrudes from the third surface 23s in the first direction, the amount by which the conductor pin 3 protrudes into the box 4 can be reduced. This allows for a larger space within the box 4 for accommodating the electronic component 9.

[0049] When the dimension Lx3 by which the conductor pin 3 protrudes from the third surface 23s in the first direction is equal to the dimension Lx4 by which the conductor pin 3 protrudes from the fourth surface 24s in the first direction, the amount of protrusion of the conductor pin 3 from the plug is equal, and therefore the weight of the plug 10 can be balanced equally between the first surface 11s side and the second surface 12s side, thereby reducing the possibility of the plug 10 tilting when the plug 10 is positioned in the first recess 41 described below.

[0050] Furthermore, by increasing the dimension Lx4 of the protrusion from the fourth surface 24s, the area of ​​electrical connection between the conductor pin 3 and the wiring conductor 52 described below can be increased, thereby stabilizing conduction.

[0051] As shown in Fig. 7 , in a cross-sectional view, the width W of the first groove 11K may decrease from the first surface 11s toward the second surface 12s. In other words, in a cross-sectional view, the first groove 11K may have a tapered shape. With this configuration, when the metal body 1 is pressed by the receptacle 6, the stress applied to the metal body 1 can be efficiently dispersed. Note that, in a cross-sectional view, the shape of the first groove 11K is not limited to a triangular shape as shown in Fig. 7 , and may be, for example, a shape with one or two curved sides.

[0052] Furthermore, the tip of the first groove 11K does not necessarily have to be sharp, and may be rounded or flat. In other words, the shape of the first groove 11K may be trapezoidal in cross section. Here, the "tip of the first groove 11K" refers to the portion closest to the second surface 12s.

[0053] As shown in FIG. 7 , the third surface 23s may be recessed inward. This configuration reduces the possibility of the third surface 23s contacting the receptacle 6 compared to when the third surface 23s protrudes outward. This allows the first surface 11s and the receptacle 6 to contact each other with precision. In this disclosure, the "inner side" can be defined as the direction from the third surface 23s toward the fourth surface 24s (e.g., the negative x-axis direction in the drawings). The "inner side" can also be defined as the direction toward the area surrounded by the box 4 in the electronic component storage package 100 described below. The "outer side" can also be defined as the direction from the fourth surface 24s toward the third surface 23s (e.g., the positive x-axis direction in the drawings). The "outer side" can also be defined as the direction away from the area surrounded by the box 4 in the electronic component storage package 100 described below.

[0054] As shown in Fig. 8, the metal body 1 may have one or more second grooves 12K spaced apart from the first grooves 11K. This configuration can more effectively reduce the possibility of the bonding material 7 spreading on the first surface 11s. In plan view, the second grooves 12K may be ring-shaped or may be partially interrupted. There may also be multiple second grooves 12K.

[0055] (Electronic Component Storage Package) As shown in FIG. 3 , in one embodiment, an electronic component storage package 100 includes the plug 10 and a box 4 .

[0056] 5, the box 4 has a first recess 41 in which the plug 10 is positioned and a third through-hole 4o that is connected to the first recess 41 and through which the conductor pin 3 passes. The first recess 41 has a first bottom surface 41b that contacts the second surface 12s. This configuration allows the plug 10 to be stably fixed to the box 4.

[0057] The first recess 41 may have a shape that follows the outer shape of the metal body 1 in a plan view. With this configuration, the metal body 1 can be stably positioned in the first recess 41.

[0058] The third through hole 4o extends to the spatial region surrounded by the box body 4. The third through hole 4o has a circular shape in a plan view, but may have, for example, a rectangular shape. When the third through hole 4o has a circular shape in a plan view and the conductor pin 3 has a cylindrical shape, the distance between the inner wall surface of the third through hole 4o and the conductor pin 3 can be made nearly constant, thereby reducing fluctuations in impedance.

[0059] 3, in one embodiment, the box 4 may have a wall 46, a frame 45, a terminal portion 47, and a substrate 48. In this case, the wall 46 may have the first recess 41 and the third through-hole 4o described above.

[0060] The material of the frame 45 may be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing any of these metal materials. The material of the frame 45 may also be an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0061] The frame 45 may have a light-transmitting portion 45o penetrating the frame 45 from the inside to the outside. If the electronic component 9 is an optical semiconductor element such as a semiconductor laser (LD: Laser Diode) or a photodiode (PD: Photo Diode), light can be received and emitted through the light-transmitting portion 45o. The light-transmitting portion 45o may be located on a surface facing the wall 46 on which the plug 10 is located.

[0062] The material of the wall 46 may be the same as or different from the material of the frame 45. The material of the substrate 48 may be the same as or different from the materials of the frame 45 and the wall 46.

[0063] The terminal portion 47 serves to provide electrical continuity between the inside and outside of the box body 4. The terminal portion 47 may be, for example, a member in which a conductor is formed on ceramic.

[0064] A circuit board 5 may be located inside the box body 4. The circuit board 5 may have an insulating substrate 51 and a wiring conductor 52 located on the insulating substrate 51. In this case, the conductor pin 3 protruding from the third through hole 4o may be electrically connected to the wiring conductor 52.

[0065] 7 , the box 4 may further include a second recess 42 located on the first bottom surface 41b. The second recess 42 may be located with a gap between it and the insulator 2. The diameter of the second recess 42 may be smaller than the diameter of the first recess 41 and larger than the diameter of the insulator 2 and the diameter of the third through hole 4o. More specifically, the second recess 42 may not be in contact with the insulator 2. With this configuration, for example, even if the fourth surface 24s has an inwardly protruding shape due to a manufacturing error, the second surface 12s and the first bottom surface 41b can be in stable contact with each other, reducing the possibility of the plug 10 tilting or shifting.

[0066] As shown in FIGS. 5 to 7 , the box 4 may further include a third recess 43 that is continuous with the first recess 41 and is located on the opposite side from the third through-hole 4o. The third recess 43 may have a second bottom surface 43b where the first recess 41 is located. Furthermore, in a plan view, the third recess 43 may be larger than the first recess 41. The third recess 43 may be a space for holding a receptacle 6 (described later). In this case, the third recess 43 and the case 61 of the receptacle 6 may be formed with thread grooves that engage with each other, and the receptacle 6 may be fitted into the third recess 43. Here, the third recess 43 being larger than the first recess 41 in a cross-sectional view refers to a spatially larger recess. More specifically, as shown in FIG. 5 , if the third recess 43 is circular in a plan view, the diameter of the third recess 43 may be larger than the diameter of the first recess 41.

[0067] The first surface 11s may be located outward (in the x direction in the drawings) from the second bottom surface 43b in a cross-sectional view. This configuration allows the conductive portion 62 of the receptacle 6 to stably contact the first surface 11s. This reduces the possibility that the impedance value will deviate from the desired value.

[0068] The housing 4 may further include a bonding material 7 positioned between the box body 4 and the plug 10. The box body 4 may further include a step portion 423 that connects the third recess 43 and the first recess 41 and is positioned on the second bottom surface 43b. The bonding material 7 may be positioned from between the first recess 41 and the plug 10 to the step portion 423. This configuration increases the amount of bonding material 7 positioned between the metal body 1 and the box body 4, thereby improving the bonding strength between the plug 10 and the box body 4. Furthermore, as shown in FIG. 7 , the bonding material 7 can be positioned from the step portion 423 to the first groove portion 11K, thereby further improving the bonding strength between the plug 10 and the box body 4.

[0069] The material of the bonding material 7 may be any material that can airtightly seal the inside and outside of the box body 4, such as gold-tin, silver epoxy resin, solder, silver paste, etc. If the surface of the metal body 1 is gold-plated, the bonding material 7 may be any material that has a melting point lower than that of gold. This configuration reduces the possibility of the gold plating on the surface of the metal body 1 melting.

[0070] 3, 6, and 7, electronic component storage package 100 further includes a receptacle 6 that engages with conductive pin 3 and contacts first surface 11s. Receptacle 6 may include a conductive portion 62 that engages with conductive pin 3 and a case 61 that surrounds conductive portion 62.

[0071] (Electronic Module) As shown in FIG. 3 , the electronic module 101 includes the electronic component storage package 100 , an electronic component 9 housed in a box 4 , and a lid 8 located on the box 4 .

[0072] The electronic component 9 may be a component that performs signal processing, such as converting a radio signal or an optical signal into an electrical signal, or converting an electrical signal into an optical signal or a radio signal. In one embodiment, the electronic component 9 may be located directly on the substrate 48, or may be located indirectly on the substrate 48 via a heat dissipation member. The electronic component 9 may also be located on the circuit board 5, for example.

[0073] Examples of the electronic component 9 include optical semiconductor elements such as semiconductor lasers (LDs) or photodiodes (PDs), semiconductor integrated circuit elements, sensor elements such as optical sensors, and power amplifier ICs. The electronic component 9 can be formed from a semiconductor material such as gallium arsenide or gallium nitride. When the electronic component 9 is an optical semiconductor element, the electronic module 101 can be used as an optical communication module.

[0074] The lid body 8 is positioned on the frame body 45. The lid body 8 protects the electronic components 9 together with the frame body 45. Examples of materials for the lid body 8 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, and tungsten, and alloys made by combining a plurality of these metal materials.

[0075] The electronic module 101 may further include a seal ring located between the lid body 8 and the frame body 45. The seal ring may be located on the frame body 45 and surround the electronic components 9 in a plan view. When no seal ring is provided on the frame body 45, the lid body 8 may be bonded to the frame body 45 via an adhesive such as solder, brazing material, glass, or a resin adhesive.

[0076] It should be noted that various combinations of the embodiments and modifications are not limited to the examples of the embodiments described above, and combinations of the embodiments and modifications can also be made.

[0077] The present disclosure can be used as a plug, and an electronic component storage package and an electronic module that include the plug.

[0078] REFERENCE SIGNS LIST 1 Metal body 11s First surface 11e First outer edge 12s Second surface 13s Side surface 14s Inclined surface 1o First through hole 11K First groove portion 12K Second groove portion 2 Insulator 23s Third surface 24s Fourth surface 23e Second outer edge 2o Second through hole 3 Conductor pin 4 Box body 41 First recess 41b First bottom surface 42 Second recess 43 Third recess 43b Second bottom surface 423 Step portion 4o Third through hole 45 Frame body 45o Light-transmitting portion 46 Wall body 47 Terminal portion 48 Substrate 5 Circuit board 51 Insulating substrate 52 Wiring conductor 6 Receptacle 61 Case 62 Conductive portion 7 Bonding material 8 Lid body 9 Electronic component 10 Plug 100 Electronic component storage package 101 Electronic module

Claims

1. A plug comprising: a metal body having a first surface, a second surface opposite the first surface, and a first through hole penetrating from the first surface to the second surface; an insulator having a third surface located at the first through hole and located on the first surface side, a fourth surface opposite the third surface, and a second through hole penetrating from the third surface to the fourth surface; and a conductor pin located in the second through hole and protruding from at least the third surface, wherein the metal body further has a first groove portion located at the first surface, and the first groove portion is located with a space from a first outer edge of the metal body.

2. The plug of claim 1, wherein said first groove is located along said first outer edge.

3. A plug as described in claim 1 or 2, wherein, in a plan view, a minimum distance L1 from the insulator to the first outer edge is greater than a minimum distance L2 from the conductor pin to the second outer edge of the insulator.

4. A plug according to any one of claims 1 to 3, wherein the first groove portion is ring-shaped in a plan view.

5. A plug according to any one of claims 1 to 4, wherein the metal body has a side surface connecting the first surface and the second surface, and has an inclined surface that slopes from the second surface to the side surface.

6. A plug as described in any one of claims 1 to 5, wherein, when the direction in which the conductor pin extends is defined as a first direction, the dimension by which the conductor pin protrudes from the third surface in the first direction is equal to or greater than the dimension by which the conductor pin protrudes from the fourth surface in the first direction.

7. The plug according to any one of claims 1 to 6, wherein the metal body is disk-shaped in a plan view.

8. A plug according to any one of claims 1 to 7, wherein, in a cross-sectional view, the width of said first groove portion decreases from said first surface toward said second surface.

9. A plug as described in claim 3 or any one of claims 4 to 8 which cite claim 3, wherein in a plan view, a minimum distance L3 from the first groove portion to the first outer edge is smaller than a minimum distance L4 from the second outer edge to the first groove portion.

10. A plug as claimed in any one of claims 1 to 9, wherein the third surface is concave towards the inward side.

11. The plug according to claim 4, wherein said metal body has one or more second grooves spaced apart from said first grooves.

12. A package for storing electronic components, comprising: a plug according to any one of claims 1 to 11; and a box having a first recess in which the plug is located, and a third through hole connected to the first recess and through which the conductor pin passes, wherein the first recess has a first bottom surface in contact with the second surface.

13. The package for storing electronic components as described in claim 12, wherein the box further has a second recess located on the first bottom surface, the second recess is located with a space between the box and the insulator, and the diameter of the second recess is smaller than the diameter of the first recess and larger than the diameter of the insulator and the diameter of the third through hole.

14. The package for storing electronic components as described in claim 12 or 13, wherein the box body further has a third recess that is continuous with the first recess and is located on the opposite side from the third through hole, the third recess has a second bottom surface on which the first recess is located and is larger than the first recess in a planar view, and the first surface is located outward from the second bottom surface in a cross-sectional view.

15. The package for storing electronic components as described in claim 14, further comprising an adhesive material located between the box body and the plug, the box body further having a step portion connecting the third recess and the first recess and located on the second bottom surface, and the adhesive material being located from between the first recess and the plug to the step portion.

16. The package for storing electronic components according to any one of claims 12 to 15, further comprising a receptacle that engages with said conductive pin and contacts said first surface.

17. An electronic module comprising: a package for storing electronic components according to any one of claims 12 to 16; an electronic component housed in said box; and a lid located on said box.

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