Photovoltaic optimizer and photovoltaic power generation system

Abstract

The present application provides a photovoltaic optimizer and a photovoltaic power generation system. The photovoltaic optimizer comprises a housing, a printed circuit board module, and a cover part. The cover part is used for covering the housing to form an accommodating cavity, and the accommodating cavity is used for accommodating the printed circuit board module. The housing comprises a lug, a heat dissipation plate, and a connecting plate; the printed circuit board module is arranged on the surface of the heat dissipation plate close to the cover part; the connecting plate is used for connecting the lug and the heat dissipation plate; and the lug and the heat dissipation plate are respectively located at two opposite ends of the connecting plate, so that the heat dissipation plate and the lug are not located on a same plane. The lug for mounting the photovoltaic optimizer and a heat dissipation part in the photovoltaic optimizer are integrally designed, thereby simplifying the structure and assembly of the photovoltaic optimizer, and reducing the cost. Furthermore, the cost of the photovoltaic power generation system is reduced.

Description

Photovoltaic optimizer and photovoltaic power generation system

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on July 31, 2023, with application number 202310960324.9 and application name “Photovoltaic Optimizer and Photovoltaic Power Generation System”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of photovoltaic technology, and specifically to a photovoltaic optimizer and a photovoltaic power generation system. Background Art

[0003] In photovoltaic power generation systems, photovoltaic optimizers enable maximum power tracking and rapid shutdown of photovoltaic modules. Existing photovoltaic optimizers utilize a separate heat sink and mounting plate. After vertically inserting a plastic module into the heat sink, the sheet metal mounting plate is pushed into the heat sink's grooves to install the photovoltaic optimizer. However, this photovoltaic optimizer is complex, difficult to assemble, and expensive.

[0004] Summary of the Invention

[0005] This application provides a photovoltaic optimizer and photovoltaic power generation system. The mounting lugs for the photovoltaic optimizer and the heat sink within the photovoltaic optimizer are both disposed on the photovoltaic optimizer's housing. This results in a simple structure, easy assembly, and low cost for the photovoltaic optimizer. Consequently, the cost of the photovoltaic power generation system is also low.

[0006] In a first aspect, a photovoltaic optimizer is provided, comprising a housing, a printed circuit board module and a cover; the cover is used to cover the housing to form a housing cavity, and the housing cavity is used to accommodate the printed circuit board module; the housing comprises a hanging ear, a heat sink and a connecting plate, the printed circuit board module is arranged on the surface of the heat sink close to the cover, the connecting plate is used to connect the hanging ear and the heat sink, and the hanging ear and the heat sink are respectively located at two opposite ends of the connecting plate, so that the heat sink and the hanging ear are not located in the same plane.

[0007] The photovoltaic optimizer provided in the embodiments of the present application integrates mounting brackets and heat dissipation plates into a single unit, reducing the number of components, simplifying the structure and assembly process, improving production efficiency, and reducing the cost of the photovoltaic optimizer. As a whole, the brackets and connecting plates also function as heat dissipation, thereby increasing the heat dissipation area and improving the heat dissipation efficiency of the photovoltaic optimizer.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the distance between a side of the heat sink close to the cover and a side of the hanging ear away from the heat sink is greater than or equal to the distance between a side of the heat sink close to the cover and a side of the cover away from the heat sink.

[0009] In the present application, the distance between the side of the heat sink close to the cover and the side of the lug away from the heat sink is greater than or equal to the distance between the side of the heat sink close to the cover and the side of the cover away from the heat sink, which can ensure that the surface of the cover away from the heat sink will not protrude beyond the surface of the lug away from the heat sink, and when installing the photovoltaic optimizer, avoid the cover from hitting the surface of the photovoltaic module, thereby ensuring that the cover will not affect the installation of the photovoltaic optimizer.

[0010] In combination with the first aspect, in some implementations of the first aspect, the distance between the side of the heat sink close to the cover and the side of the cover away from the heat sink includes: the maximum distance between the side of the heat sink close to the cover and the side of the cover away from the heat sink.

[0011] In the present application, the side of the cover away from the heat sink is not necessarily a plane. The above distance can be the distance between the point on the side of the cover away from the heat sink that is the longest distance from the heat sink and the side of the heat sink close to the cover.

[0012] In combination with the first aspect, in certain implementations of the first aspect, the plane where the hanging ears are located is perpendicular to the plane where the connecting plates are located.

[0013] The plane where the hanging ears are located is perpendicular to the plane where the connecting plate is located. When the distance between the hanging ears and the heat sink is constant, the length of the connecting plate can be minimized, thereby reducing the material used for the connecting plate and lowering the cost.

[0014] In combination with the first aspect, in certain implementations of the first aspect, the plane where the heat dissipation plate is located is perpendicular to the plane where the connecting plate is located.

[0015] When the heat sink plane is perpendicular to the connecting plate plane, the connecting plate length can be minimized for a given distance between the mounting lug and the heat sink, reducing material usage and lowering costs. In particular, when both the heat sink plane and the mounting lug plane are perpendicular to the connecting plate plane, material usage is minimized.

[0016] In combination with the first aspect, in some implementations of the first aspect, the connecting plate includes a first connecting end and a second connecting end that are arranged opposite to each other, the first connecting end is connected to the hanging ear with an arc bend, and the second connecting end is connected to the heat dissipation plate at a right angle.

[0017] The first connection end is connected to the hanging ear with an arc bend to prevent workers from being injured by touching the first connection end during installation, thereby improving safety during installation. The second connection end is connected to the heat sink at a right angle to ensure that when the cover covers the outer shell, the cover can be in close contact with the heat sink, thereby improving stability during installation.

[0018] In combination with the first aspect, in certain implementations of the first aspect, the cover is used to cover the outer shell to form an accommodating cavity, including: the cover includes side walls and a top, the side walls are arranged around the top, and the side walls extend along the top in a direction close to the heat sink, so that the cover and the heat sink form an accommodating cavity.

[0019] In the present application, the cover is in the shape of a hood. When the cover covers the outer shell to form a accommodating cavity, the heat dissipation plate is one surface of the accommodating cavity, which is used to place the printed circuit board module. The cover wraps the printed circuit board module to isolate the printed circuit board module from the external environment, thereby avoiding the influence of static electricity, dust, etc. in the external environment on the printed circuit board module, and improving the reliability of the photovoltaic optimizer.

[0020] In combination with the first aspect, in certain implementations of the first aspect, the heat dissipation plate is used to be disposed on one side of the printed circuit board module without side walls being disposed around the four sides.

[0021] It should be understood that in this application, the phrase "no sidewalls on one side of the heat sink used to mount the printed circuit board module" refers to the fact that the heat sink has no sidewalls on that side, excluding the connecting plate. In this application, the connecting plate, heat sink, and mounting lugs are unified on the same housing, functionally partitioning the same housing and being located at different locations within the housing. The heat sink does not include the connecting plate, meaning that the connecting plate is not a sidewall of the heat sink. Therefore, the fact that the heat sink surface is not surrounded by sidewalls does not conflict with the fact that the heat sink and connecting plate are connected.

[0022] In combination with the first aspect, in certain implementations of the first aspect, the housing further includes at least one through hole, or the cover further includes at least one through hole, or the housing includes at least one first groove and the cover includes at least one second groove, and when the cover covers the housing, the at least one first groove and the at least one second groove constitute at least one through hole; the photovoltaic optimizer further includes a cable, and the cable passes through the at least one through hole and is connected to the printed circuit board module.

[0023] In this application, the through hole for the cable can be located in the housing, the cover, or both. Located in either the housing or the cover facilitates processing; located in both the housing and the cover, the housing and the cover can be separated during installation, and the cable can then be connected to the printed circuit board module, facilitating installation.

[0024] In combination with the first aspect, in certain implementations of the first aspect, a fin-type heat dissipation structure is provided on a surface of the heat dissipation plate away from the printed circuit board module.

[0025] Exemplarily, the fin-type heat dissipation structure includes heat dissipation teeth.

[0026] The use of a fin-type heat dissipation structure can increase the heat dissipation area of ​​the photovoltaic optimizer, thereby improving the heat dissipation efficiency of the photovoltaic optimizer.

[0027] In combination with the first aspect, in some implementations of the first aspect, the mounting ear includes at least one mounting hole, and the at least one mounting hole is used to connect to the target structure.

[0028] In combination with the first aspect, in certain implementations of the first aspect, the cover includes a glue overflow groove, the opening of the glue overflow groove is located on the side of the cover away from the printed circuit board module, and at least one glue overflow hole is provided at the bottom of the glue overflow groove, and the at least one glue overflow hole connects the accommodating cavity and the glue overflow groove, and the depth of the glue overflow groove is greater than or equal to the vertical distance between the highest point of the accommodating cavity and the bottom of the glue overflow groove.

[0029] Specifically, if potting glue appears in the overflow glue groove, it means that the potting glue fills the gap between the inner wall of the cover and the printed circuit board module; if no potting glue appears in the overflow glue groove, it means that the potting glue does not fill the gap between the inner wall of the cover and the printed circuit board module.

[0030] In the present application, the glue overflow groove is provided on the cover to replace the glue overflow cup, eliminating the glue filling process and manufacturing the glue overflow cup, thereby reducing costs.

[0031] In combination with the first aspect, in certain implementations of the first aspect, the cover further includes a glue filling hole, and the glue filling hole is used to fill the potting glue into the accommodating cavity.

[0032] The potting compound fills the gap between the inner wall of the cover and the PCB module. This seals the PCB module within the housing, isolating it and achieving insulation. Furthermore, the potting compound transfers heat generated by components on the PCB to the housing and, subsequently, to the surrounding air outside the housing, enhancing the heat dissipation capability of the PV optimizer. The potting compound also provides a waterproof seal for the PCB module within the housing.

[0033] In combination with the first aspect, in certain implementations of the first aspect, an insulating layer is provided between the heat dissipation plate and the printed circuit board.

[0034] Providing an insulating layer between the heat sink and the printed circuit board can increase creepage distance, improve the safety and reliability of the photovoltaic optimizer, and enable the photovoltaic optimizer to better meet safety regulations. For example, the insulating layer can be insulating tape.

[0035] In combination with the first aspect, in certain implementations of the first aspect, a heat conducting layer is provided between the heat dissipation plate and the printed circuit board.

[0036] The thermal conductive layer can fill the gap between the heat sink and the printed circuit board, thereby improving the heat dissipation efficiency. The thermal conductive layer is made of a material with high thermal conductivity, such as silicone.

[0037] In a second aspect, a photovoltaic power generation system is provided. The photovoltaic power generation system includes the photovoltaic optimizer according to the first aspect and any possible implementation of the first aspect, and a photovoltaic module. The photovoltaic optimizer is mounted on the photovoltaic module via its mounting lugs, with the heat dissipation plate of the photovoltaic optimizer facing away from the photovoltaic module, and the output end of the photovoltaic optimizer cable is connected to the photovoltaic module.

[0038] In combination with the second aspect, in certain implementations of the second aspect, the distance between a side of the heat sink close to the cover and a side of the hanging ear away from the heat sink is a first distance, the distance between a side of the hanging ear away from the heat sink and a side of the photovoltaic module close to the photovoltaic optimizer is a second distance, the distance between a side of the heat sink close to the cover and a side of the cover away from the heat sink is a third distance, and the sum of the first distance and the second distance is greater than or equal to the third distance.

[0039] The technical effects of the second aspect mentioned above can be referred to the corresponding description in the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG1 is a schematic diagram of a photovoltaic power generation system provided in an embodiment of the present application.

[0041] FIG2 is an exploded schematic diagram of a photovoltaic optimizer provided in an embodiment of the present application.

[0042] FIG3 is a schematic diagram of a photovoltaic optimizer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0044] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships can exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0045] In the embodiments of the present application, prefixes such as "first", "second", "third", "fourth", and "fifth" are used only to distinguish different description objects and have no limiting effect on the position, order, priority, quantity, or content of the described objects. In the embodiments of the present application, the use of prefixes such as ordinal numbers to distinguish description objects does not constitute a limitation on the described objects. For the statement of the described objects, please refer to the description in the context of the claims or embodiments, and the use of such prefixes should not constitute an unnecessary limitation. In addition, in the description of this embodiment, unless otherwise specified, the meaning of "multiple" is two or more.

[0046] References to "some embodiments" and the like in this specification mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in some embodiments" and the like that appear in different places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0047] The term "equal" in this application does not mean being equal in a strict sense, but being within an allowable error range. The term "flush" does not mean being tangent in a strict sense, but being within an allowable error range.

[0048] In the embodiments of this application, the same reference numerals represent the same component or part. In the embodiments of this application, for multiple identical parts, only one of the parts may be labeled with a reference numeral in the drawings as an example. The same reference numerals apply to other identical parts or components. In addition, the sizes and dimensions of the parts shown in the drawings are for illustrative purposes only.

[0049] In photovoltaic power generation systems, photovoltaic optimizers can achieve maximum power tracking and rapid shutdown of photovoltaic modules. Conventional photovoltaic optimizers house printed circuit boards within a plastic housing. Furthermore, a heat spreader and heat sink are required within the plastic housing to dissipate heat during operation. However, these photovoltaic optimizers are complex and difficult to assemble.

[0050] In view of this, embodiments of the present application provide a photovoltaic optimizer and a photovoltaic power generation system. The printed circuit board in the photovoltaic optimizer is disposed in a housing formed by an open, hollow metal housing and end caps, and the cables are connected to the printed circuit board via through-holes in the end caps. Thus, during operation of the photovoltaic optimizer, the heat generated by the components mounted on the printed circuit board is dissipated outside the metal housing through the metal housing. Furthermore, the photovoltaic optimizer not only ensures good heat dissipation, but also has a simple structure and is easy to assemble. Accordingly, the cost of the photovoltaic power generation system is also low.

[0051] The photovoltaic power generation system provided in the embodiment of the present application will be described in detail below with reference to FIG1 .

[0052] FIG1 is a schematic diagram of a photovoltaic power generation system provided in an embodiment of the present application.

[0053] As shown in Figure 1, a photovoltaic power generation system 1 provided in an embodiment of the present application includes one or more photovoltaic modules 10, one or more photovoltaic optimizers 20, a photovoltaic inverter 30, a transformer 40, a three-phase AC power grid 50, a first DC cable 60, a second DC cable 70, a first AC cable 80, and a second AC cable 90. One or more photovoltaic modules 10 are connected to the photovoltaic optimizer 20 via the first DC cable 60, and the connection between the photovoltaic modules 10 and the photovoltaic optimizer 20 can be a one-to-one connection. One or more photovoltaic optimizers 20 are connected to the photovoltaic inverter 30 via the second DC cable 70. The photovoltaic inverter 30 converts DC power into AC power, and the AC side of the photovoltaic inverter 30 is connected to the transformer 40 via the first AC cable 80. The transformer 40 is connected to the three-phase AC power grid 50 via the second AC cable 90. Thus, the AC power output by the photovoltaic inverter 30 flows through the transformer 40 and then into the three-phase AC power grid 50. The components of the photovoltaic power generation system 1 are described in detail below.

[0054] The photovoltaic power generation system is a power generation system that converts solar radiation energy into electrical energy by utilizing the photovoltaic effect of semiconductor materials. The photovoltaic power generation system provided in the embodiment of the present application can enable electric vehicles. The electric vehicles include pure electric vehicles (pure electric vehicle / battery electric vehicle, pure EV / battery EV), hybrid electric vehicles (hybrid electric vehicle, HEV), range extended electric vehicles (REEV), plug-in hybrid electric vehicles (PHEV) or new energy vehicles (NEV), etc.

[0055] The photovoltaic assembly 10, also known as a photovoltaic array, includes multiple photovoltaic (PV) strings. Each PV string includes multiple photovoltaic panels connected in series. PV panels are used to convert light energy into electrical energy. The electrical energy generated by the PV panels is direct current (DC). The voltage across the PV string is equal to the sum of the voltages generated by the multiple PV panels. The output power of a PV assembly can be expressed as the amount of electrical energy output per unit time.

[0056] The photovoltaic optimizer 20, also known as a photovoltaic power optimizer, improves the power generation of the photovoltaic power generation system 1 by continuously tracking the maximum power point of each photovoltaic module 10. It also provides module-level shutdown and monitoring functions, and supports long string designs to capture the maximum power point. The photovoltaic optimizer 20 can be installed on the photovoltaic module 10. For example, the photovoltaic optimizer 20 can be mounted on the profile frame of the photovoltaic module 10 via a connecting plate.

[0057] The photovoltaic inverter 30 is used to convert the input direct current into alternating current (AC), that is, to perform DC-AC conversion. The photovoltaic inverter 30 can also be called a DC-AC converter.

[0058] The transformer 40 can be used to convert the voltage of the AC power to adjust the voltage value of the input AC voltage. It should be understood that the input and output of the transformer 40 are both AC power. The transformer 40 can boost the AC power output by one or more photovoltaic inverters 30.

[0059] In photovoltaic power generation system 1, the area of ​​each photovoltaic module 10 is generally fixed. When the light intensity remains constant, the larger the angle between the light incident on photovoltaic module 10 and the plane on which photovoltaic module 10 is located, that is, the smaller the angle of incidence of the light on photovoltaic module 10, the more electrical energy the photovoltaic module 10 outputs. When the light incident on photovoltaic module 10 is perpendicular, that is, the angle between the light and the plane on which photovoltaic module 10 is located is 90°, reaching its maximum value, the power output of photovoltaic module 10 reaches its maximum.

[0060] When the photovoltaic power generation system 1 includes multiple photovoltaic optimizers 20, the photovoltaic power generation system 1 also includes a junction box, which is used to converge the direct current generated by the multiple photovoltaic components 10, and input the converged output into the photovoltaic inverter 30 after passing through a circuit breaker and lightning protection treatment.

[0061] The photovoltaic optimizer 20 provided in the embodiment of the present application is described in detail below with reference to FIG. 2 .

[0062] Figure 2 is an exploded view of a photovoltaic optimizer provided in an embodiment of the present application. As shown in Figure 2, the photovoltaic optimizer includes a housing 210, a printed circuit board module 220, and a cover 230. Cover 230 is used to cover housing 210 to form a housing cavity for accommodating printed circuit board module 220. Printed circuit board module 220 includes a printed circuit board (PCB) and at least one component mounted thereon. The PCB is provided with a power tracking circuit.

[0063] The housing 210 includes a heat sink 2101, a hanging ear 2102 and a connecting plate 2103, wherein the connecting plate is used to connect the hanging ear and the heat sink. The heat sink 2101, the hanging ear 2102 and the connecting plate 2103 present a Z-shaped structure. The hanging ear 2102 and the heat sink 2101 are respectively located at two opposite ends of the connecting plate 2103, so that the heat sink 2101 and the hanging ear 2102 are not located in the same plane.

[0064] One possible way is to produce the heat sink 2101, the hanging ear 2102 and the connecting plate 2103 as a whole; another possible way is to produce at least one of the heat sink 2101, the hanging ear 2102 and the connecting plate 2103 as a separate individual and fix them together with other components by welding, wherein welding is only an example of a fixing method, and it can also be bonding, riveting, or screw connection, which is not limited in this application.

[0065] In Figure 2 , both heat sink 2101 and mounting lug 2102 are sheet-like structures. Heat sink 2101 and mounting lug 2102 are parallel, and connecting plate 2103 is perpendicular to heat sink 2101 and mounting lug 2102, respectively. The structure of housing 210 in Figure 2 is merely illustrative; heat sink 2101 and mounting lug 2102 may not be completely parallel and may have a certain angle offset between them. Accordingly, connecting plate 2103 may not be completely perpendicular to heat sink 2101 and mounting lug 2102 and may have a certain angle offset between them.

[0066] It should be understood that, considering the current actual installation requirements, the distance between the side of the heat sink 2101 close to the cover 230 and the side of the ear 2102 away from the heat sink 2101 is greater than or equal to the distance between the side of the heat sink 2101 close to the cover 230 and the side of the cover 230 away from the heat sink 2101, so as to meet the installation requirement that the cover will not protrude from the plane where the side of the ear 2102 away from the heat sink 2101 is located.

[0067] In the present application, the side of the cover away from the heat sink is not necessarily a plane. The distance between the side of the heat sink close to the cover and the side of the cover away from the heat sink can be the distance between the point on the side of the cover away from the heat sink that is the longest distance from the heat sink and the side of the heat sink close to the cover.

[0068] It should be noted that if the actual installation requirements change, the restriction will also be adjusted accordingly. For example, if the cover of the photovoltaic optimizer can protrude from the plane where the side of the ear 2102 is away from the heat sink 2101, then the distance between the side of the heat sink 2101 close to the cover 230 and the side of the ear 2102 away from the heat sink 2101 is not limited relative to the distance between the side of the heat sink 2101 close to the cover 230 and the side of the cover 230 away from the heat sink 2101.

[0069] In the present application, a printed circuit board module is disposed on the surface of the heat sink near the cover and dissipates heat and distributes heat evenly to at least one device on the printed circuit board module 220. It should be understood that the surface of the heat sink near the cover and the printed circuit board module may or may not be in direct contact. For example, a mounting bracket may be disposed on the surface of the heat sink near the cover, and the printed circuit board module may be placed on the mounting bracket.

[0070] The printed circuit board and the heat sink 2101 in FIG2 can be fixed by bolts. The use of bolts to fix can improve the stability of the photovoltaic optimizer and improve the safety.

[0071] It should be understood that bolting is only one example of a method for securing the printed circuit board to the heat sink 2101. For example, the printed circuit board and the heat sink 2101 can also be secured via adhesive bonding. Compared to bolting, this eliminates the need to consider safety distances with circuits on the printed circuit board or avoidance of pressure-sensitive components, thereby reducing the size of the printed circuit board.

[0072] In FIG2 , the surface of the heat sink 2101 away from the printed circuit board module 220 is provided with a fin-type heat dissipation structure, such as heat dissipation teeth. As shown in FIG2 , the heat sink 2101 has a flat surface on one side for fixing the printed circuit board, and a serrated surface on the other side, with a sheet-like structure perpendicular to the plane for fixing the printed circuit board. The use of a fin-type heat dissipation structure can increase the heat dissipation area and improve the heat dissipation efficiency. It should be understood that the fin-type heat dissipation structure is only an example of the heat sink 2101, and the heat sink 2101 in this application can be other structures that can achieve the heat dissipation function. For example, the heat sink 2101 can have no fins, and heat is dissipated through the plane of the shell, and this is not limited to this.

[0073] The heat sink 2101 may be made of metal and may be formed by sheet metal forming and welding or by profile forming and cutting.

[0074] In one possible embodiment, the heat dissipation plate 2101 is made of aluminum.

[0075] It should be understood that among metals of the same unit volume, aluminum is lighter and cheaper, which can reduce the weight of the photovoltaic optimizer while reducing costs.

[0076] It should be noted that aluminum is only an example of a material for the heat sink 2101. For example, the heat sink 2101 may also be made of an aluminum alloy. Other metals, such as copper with high thermal conductivity and high strength, are also within the scope of protection of this application.

[0077] It should also be understood that the material of the heat sink 2101 can also be a non-metal with high thermal conductivity. For example, the material of the heat sink 2101 can include graphite, and can also include polycarbonate material PC plastic. If a non-metal material is used, the heat sink 2101 can be processed by injection molding.

[0078] In one possible implementation, a thermally conductive layer can be added between heat sink 2101 and printed circuit board module 220. The thermally conductive layer can fill the thermally conductive gap between the heat-generating device and the heat sink bottom surface, thereby improving heat dissipation efficiency. For example, the thermally conductive layer can be a thermally conductive gel or a thermally conductive pad. Furthermore, the material of the thermally conductive layer can be silicone grease, which is not limited in this application.

[0079] In one possible implementation, an insulating layer may be added between the heat sink 2101 and the printed circuit board module 220. The insulating layer may increase the creepage distance and improve the safety of the photovoltaic optimizer. For example, the insulating layer may be an insulating tape.

[0080] The hanging ear 2102 is used to install the photovoltaic optimizer on the photovoltaic module. The hanging ear 2102 includes at least one mounting hole. During installation, the photovoltaic optimizer is fixed to the profile frame of the photovoltaic module using a clip or screw through the at least one mounting hole. For example, the photovoltaic module may include a photovoltaic power generation panel.

[0081] The shape of the mounting hole in FIG2 is only an example. The shape of the mounting hole can be adjusted according to actual installation requirements and is not limited in this application.

[0082] The material of the hanging ear 2102 refers to the material of the heat sink 2101 and is not described here in detail.

[0083] The connecting plate 2103 is used to connect the heat sink 2101 and the hanging ear 2102 into a whole. The material of the connecting plate 2103 refers to the material of the heat sink 2101 and is not described here in detail.

[0084] In one possible implementation, connecting plate 2103 includes a first connecting end and a second connecting end positioned opposite each other. The first connecting end is connected to mounting lug 2102 in an arcuate manner, while the second connecting end is connected at a right angle to heat sink 2101. The arcuate connection to mounting lug 2102 prevents workers from being scratched at the junction between connecting plate 2103 and mounting lug 2102 during installation. The right-angle connection to heat sink 2101 ensures close contact between heat sink 2101 and cover 230 when cover 230 covers housing 210.

[0085] It should be understood that heat sink 2101, mounting lugs 2102, and connecting plate 2103 can be manufactured as a single unit, thereby reducing the number of components in the photovoltaic optimizer and improving production efficiency. When used as a single unit, mounting lugs 2102 and connecting plate 2103 can also function as a heat sink, increasing the heat dissipation area and improving heat dissipation efficiency. Heat can be transferred from heat sink 2101 to mounting lugs 2102, and then to the photovoltaic module profile frame.

[0086] In this application, when the heat sink 2101, the hanging ear 2102 and the connecting plate 2103 are formed as a whole and made of metal, the heat sink 2101, the hanging ear 2102 and the connecting plate 2103 can be made to have the same potential, thereby solving the grounding problem of the shell.

[0087] The printed circuit board module 220 is accommodated in the accommodation cavity formed by the housing 210 and the cover 230 . The printed circuit board module 220 includes a printed circuit board and at least one device mounted on the printed circuit board.

[0088] For example, devices mounted on a printed circuit board include a programmable logic controller (PLC), a metal-oxide-semiconductor field-effect transistor (MOSFET), and the like.

[0089] Furthermore, at least one device mounted on the printed circuit board can be a surface-mount power device with simple assembly and lower parasitic parameters, which can be directly attached to the shell with heat dissipation material. Exemplarily, at least one device mounted on the printed circuit board can be a gallium nitride (GaN) power tube or a silicon carbide (SiC) power tube. Third-generation semiconductors represented by GaN and SiC have higher breakdown electric field strength, higher switching frequency and on-resistance, faster switching speed, lower loss, and are conducive to the evolution towards miniaturization.

[0090] In the embodiment of the present application, the printed circuit board module 220 may also be referred to as a printed circuit board assembly (PCBA).

[0091] In some embodiments, in addition to including a printed circuit board and at least one device mounted on the printed circuit board, the printed circuit board module 220 also has a carrier for supporting the printed circuit board module 220 so that the printed circuit board module 220 is not in direct contact with the housing 210.

[0092] The cover 230 is used to cover the shell 210 to form a receiving cavity. The cover 230 includes side walls and a top. The side walls are arranged around the top. The side walls extend along the top in a direction close to the heat sink 2101 to form a receiving cavity with the cover and the heat sink.

[0093] In order to facilitate the cover 230 to cover the outer shell 210, no side walls are set around the surface of the heat sink 2101 close to the printed circuit board module 220. It should be noted that in this application, the heat sink 2101, the hanging ear 2102 and the connecting plate 2103 are all structurally part of the outer shell 210, but the connecting plate 2103 is not a component of the heat sink 2101. Therefore, whether the heat sink 2101 close to the printed circuit board module 220 is provided with side walls is not considered with respect to the connecting plate 2103, that is, the fact that the heat sink 2101 close to the printed circuit board module 220 does not have side walls does not conflict with the connecting plate 2103.

[0094] The cover portion 230 includes a potting hole 2301 , which is used to inject potting glue into the accommodating cavity. For example, the potting glue injected into the accommodating cavity may be silicon.

[0095] The cover 230 in Figure 2 also includes a glue overflow groove 2302. The opening of the glue overflow groove 2302 is located on the side of the cover 230 away from the printed circuit board module 220. At least one glue overflow hole is provided at the bottom of the glue overflow groove 2302. The at least one glue overflow hole connects the accommodating cavity and the glue overflow groove 2302. The depth of the glue overflow groove 2302 is greater than or equal to the vertical distance between the highest point of the accommodating cavity and the bottom of the glue overflow groove 2302.

[0096] The overflowing glue groove 2302 is used to determine whether the potting glue has completely filled the entire receiving cavity. Specifically, the overflowing glue groove 2302 is a structure protruding from the receiving cavity. If potting glue is observed in the overflowing glue groove 2302, it indicates that the potting glue has completely filled the entire receiving cavity.

[0097] The cover 230 is provided with a glue overflow groove, which can save the glue overflow cup in the process of injecting the potting glue and reduce the cost.

[0098] The overflow groove provided on the cover 230 in FIG2 is only an example. The overflow groove may also be omitted on the cover 230. For example, a through hole is opened on the cover 230. During the process of injecting the potting glue, an overflow cup is used on the through hole. If potting glue appears in the overflow cup, it indicates that the potting glue has completely filled the entire accommodating cavity.

[0099] The cover 230 may be made of a material having good formability and wear resistance, such as plastic.

[0100] The photovoltaic optimizer also includes a cable 240, the input end of which passes through at least one through-hole and connects to the printed circuit board. In Figure 2, the heat sink 2101 includes a support platform. The surface of the support platform that contacts the cable 240 is provided with at least one first groove 2104. The surface of the cover 230 that contacts the cable 240 is provided with at least one second groove 2103. When the cover 230 covers the housing 210, the at least one first groove 2104 and the at least one second groove 2103 form at least one through-hole for the input end of the cable 240 to pass through and connect to the printed circuit board.

[0101] It should be understood that the position of the through hole through which the cable 240 passes in FIG. 2 is merely an example, and the through hole through which the cable 240 passes may be located only on the housing 210 or only on the cover 230 , and this application does not limit this.

[0102] The cable 240 is connected to the printed circuit board through at least one through hole formed by the cover 230 covering the housing 210. The connection method of the cable 240 and the printed circuit board is not limited.

[0103] In a possible implementation, the cable 240 is electrically connected to the printed circuit board by welding.

[0104] In a possible implementation, a socket is provided on the printed circuit board, and the cable 240 can be directly inserted into the socket to be electrically connected to the printed circuit board.

[0105] The photovoltaic optimizer in this application adopts a sandwich structure of a housing, a cover and a printed circuit board module, which simplifies the structure of the photovoltaic optimizer, reduces the number of production line processes and production equipment, and reduces costs.

[0106] In one embodiment, the assembly sequence of the photovoltaic optimizer is: fasten the printed circuit board module 220 to the housing 210 , then connect the cable 240 to the printed circuit board module 220 , and finally fasten the cover 230 to the housing 210 .

[0107] The assembled photovoltaic optimizer is shown in FIG3 , which is a schematic diagram of the photovoltaic optimizer provided in an embodiment of the present application. The printed circuit board module is not shown in FIG3 because it is installed in the accommodating cavity formed by the housing and the cover.

[0108] In FIG3 , the cover is fastened to the housing via a connecting structure.

[0109] In one embodiment, the connection structure includes colloid, and the cover can be fastened to the housing by bonding the colloid.

[0110] For example, the colloid is a gel formed by a gelling process, or for another example, the colloid is a cured glue formed by a curing process.

[0111] In one embodiment, the connection structure includes screws. The cover can be fastened to the housing by screw connection. The screws are self-locking screws.

[0112] In the present application, when the photovoltaic optimizer is installed on the photovoltaic module, the distance between the side of the photovoltaic optimizer's heat sink close to the photovoltaic optimizer's cover and the side of the photovoltaic optimizer's hanging ear away from the photovoltaic optimizer's heat sink is a first distance, the distance between the side of the photovoltaic optimizer's hanging ear away from the photovoltaic optimizer's heat sink and the side of the photovoltaic module of the photovoltaic optimizer close to the photovoltaic optimizer is a second distance, the distance between the side of the photovoltaic optimizer's heat sink close to the photovoltaic optimizer's cover and the side of the photovoltaic optimizer's cover away from the photovoltaic optimizer's heat sink is a third distance, and the sum of the first distance and the second distance is greater than or equal to the third distance, so as to ensure that a certain distance is maintained between the photovoltaic optimizer and the photovoltaic module, so that the installation of the photovoltaic optimizer will not conflict with the photovoltaic module.

[0113] The photovoltaic optimizer in this application is simple to assemble, easy to detect and repair, and can improve production efficiency.

[0114] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A photovoltaic optimizer, characterized in that: It includes a housing, a printed circuit board module and a cover; The cover is used to cover the housing to form a receiving cavity, and the receiving cavity is used to receive the printed circuit board module; The shell includes a hanging ear, a heat sink and a connecting plate. The printed circuit board module is arranged on the surface of the heat sink close to the cover. The connecting plate is used to connect the hanging ear and the heat sink. The hanging ear and the heat sink are respectively located at two opposite ends of the connecting plate, so that the heat sink and the hanging ear are not located in the same plane.

2. The photovoltaic optimizer according to claim 1, characterized in that: The distance between a side of the heat sink close to the cover and a side of the hanging ear away from the heat sink is greater than or equal to the distance between a side of the heat sink close to the cover and a side of the cover away from the heat sink.

3. The photovoltaic optimizer according to claim 2, characterized in that: The distance between a side of the heat sink close to the cover and a side of the cover away from the heat sink includes: The maximum distance between a surface of the heat dissipation plate close to the cover and a surface of the cover far from the heat dissipation plate.

4. The photovoltaic optimizer according to any one of claims 1 to 3, characterized in that: The plane where the hanging ears are located is perpendicular to the plane where the connecting plate is located.

5. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: The plane where the heat dissipation plate is located is perpendicular to the plane where the connecting plate is located.

6. The photovoltaic optimizer according to any one of claims 1 to 5, characterized in that: The connecting plate includes a first connecting end and a second connecting end which are arranged opposite to each other. The first connecting end is connected to the hanging ear in an arc-shaped bend, and the second connecting end is connected to the heat dissipation plate at a right angle.

7. The photovoltaic optimizer according to any one of claims 1 to 6, characterized in that: The cover portion is used to cover the housing to form a receiving cavity and includes: The cover portion includes a side wall and a top portion, wherein the side wall is arranged around the top portion, and the side wall extends along the top portion in a direction close to the heat dissipation plate, so that the cover portion and the heat dissipation plate form a receiving cavity.

8. The photovoltaic optimizer according to any one of claims 1 to 7, characterized in that: The heat dissipation plate is used to be arranged on one side of the printed circuit board module without side walls being arranged around it.

9. The photovoltaic optimizer according to any one of claims 1 to 8, characterized in that: The shell further comprises at least one through hole, or the cover further comprises at least one through hole, or the shell comprises at least one first groove, and the cover comprises at least one second groove, and when the cover covers the shell, the at least one first groove and the at least one second groove constitute at least one through hole; The photovoltaic optimizer also includes a cable, and the cable passes through the at least one through hole and is connected to the printed circuit board module.

10. The photovoltaic optimizer according to any one of claims 1 to 9, characterized in that: A fin-type heat dissipation structure is arranged on a surface of the heat dissipation plate away from the printed circuit board module.

11. The photovoltaic optimizer according to any one of claims 1 to 10, characterized in that: The mounting ear includes at least one mounting hole, and the at least one mounting hole is used to connect to the target structure.

12. The photovoltaic optimizer according to any one of claims 1 to 11, characterized in that: The cover portion includes a glue overflow groove, the opening of which is located on a side of the cover portion away from the printed circuit board module, and at least one glue overflow hole is provided at the bottom of the glue overflow groove, the at least one glue overflow hole connects the accommodating cavity and the glue overflow groove, and the depth of the glue overflow groove is greater than or equal to the vertical distance between the highest point of the accommodating cavity and the bottom of the glue overflow groove.

13. The photovoltaic optimizer according to any one of claims 1 to 12, characterized in that: The cover also includes a glue injection hole, and the glue injection hole is used to fill the potting glue into the accommodating cavity.

14. A photovoltaic power generation system, characterized in that: It comprises a photovoltaic optimizer and a photovoltaic module as described in any one of claims 1 to 13, wherein the photovoltaic optimizer is installed on the photovoltaic module through the hanging ear of the photovoltaic optimizer, and the heat dissipation plate of the photovoltaic optimizer is away from the photovoltaic module, and the output end of the cable of the photovoltaic optimizer is connected to the photovoltaic module.

15. The photovoltaic power generation system according to claim 14, characterized in that: The distance between the side of the heat sink close to the cover of the photovoltaic optimizer and the side of the hanging ear away from the heat sink is a first distance, the distance between the side of the hanging ear away from the heat sink and the side of the photovoltaic component close to the photovoltaic optimizer is a second distance, the distance between the side of the heat sink close to the cover of the photovoltaic optimizer and the side of the cover of the photovoltaic optimizer away from the heat sink is a third distance, and the sum of the first distance and the second distance is greater than or equal to the third distance.

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